Datasheet

TVP5147M1
www.ti.com SLES140G –JULY 2005–REVISED FEBRUARY 2012
3.9 Thermal Specifications
PARAMETER TEST CONDITIONS
(1)
MIN TYP MAX UNIT
Junction-to-ambient thermal resistance,
θ
JA
Thermal pad soldered to 4-layer High-K PCB 19.04 °C/W
still air
Junction-to-case thermal resistance,
θ
JC
Thermal pad soldered to 4-layer High-K PCB 0.17 °C/W
still air
T
J(MAX
Maximum junction temperature for reliable
105 °C
)
operation
(1) The exposed thermal pad must be soldered to a High-K PCB with adequate ground plane.
Copyright © 2005–2012, Texas Instruments Incorporated Electrical Specifications 97
Submit Documentation Feedback
Product Folder Link(s): TVP5147M1