Datasheet

TVP5160
www.ti.com SLES135E–FEBRUARY 2005–REVISED APRIL 2011
3 Internal Control Registers ................................................................................................... 38
3.1 Register Definitions ........................................................................................................ 43
3.2 VBUS Register Definitions ............................................................................................... 88
4 Typical Application Circuit .................................................................................................. 95
4.1 Typical Application Circuit ................................................................................................ 95
5 Typical Register Programming Sequence ............................................................................. 96
6 Electrical Specifications ..................................................................................................... 97
6.1 Absolute Maximum Ratings .............................................................................................. 97
6.2 Recommended Operating Conditions .................................................................................. 97
6.3 Crystal Specifications ..................................................................................................... 98
6.4 DC Electrical Characteristics ............................................................................................. 98
6.5 Analog Processing and A/D Converters ................................................................................ 99
6.6 Data Clock, Video Data, Sync Timing .................................................................................. 99
6.7 I
2
C Host Port Timing ..................................................................................................... 100
6.8 SDRAM Timing ........................................................................................................... 101
6.9 Example SDRAM Timing Alignment ................................................................................... 102
6.10 Memories Tested ......................................................................................................... 103
6.11 Thermal Specification ................................................................................................... 103
7 Designing With PowerPAD™ ............................................................................................. 104
8 Revision History .............................................................................................................. 106
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