Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Transducer Converter, Bidirectional TSSOP 14

D OR PW PACKAGE

(TOP VIEW)

GND

CCA

CCB

RGY PACKAGE

Exposed

Center

Pad

(TOP VIEW)

1 14

7 8

CCB

GND

CCA

CCB

RUT PACKAGE

(TOP VIEW)

CCA

GND

GXU/ZXU PACKAGE

(TOP VIEW)

A B C

TXB0104

www.ti.com

SCES650F –APRIL 2006–REVISED MAY 2012

4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR

WITH AUTOMATIC DIRECTION SENSING AND ±15-kV ESD PROTECTION

Check for Samples: TXB0104

FEATURES

• 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on

• Latch-Up Performance Exceeds 100 mA Per

B Port (V

CCA

≤ V

CCB

) JESD 78, Class II

• V

Isolation Feature – If Either V

Input Is at • ESD Protection Exceeds JESD 22

GND, All Outputs Are in the High-Impedance

– A Port

State

– 2500-V Human-Body Model (A114-B)

• OE Input Circuit Referenced to V

CCA

– 1500-V Charged-Device Model (C101)

• Low Power Consumption, 5-μA Max I

– B Port

• I

off

Supports Partial-Power-Down Mode

– ±15-kV Human-Body Model (A114-B)

Operation

– 1500-V Charged-Device Model (C101)

TERMINAL ASSIGNMENTS

(GXU/ZXU Package)

A B C

4 A4 GND B4

3 A3 OE B3

2 A2 V

CCA

1 A1 V

CCB

A. N.C. − No internal connection

B. For RGY, if the exposed center pad is used, it must only be connected as a secondary ground or left electrically open.

C. Pull up resistors are not required on both sides for Logic I/O.

D. If pull up or pull down resistors are needed, the resistor value must be over 50 kΩ.

E. 50 kΩ is a safe recommended value, if the customer can accept higher Vol or lower Voh, smaller pull up or pull down

resistor is allowed, the draft estimation is Vol = Vccout × 4.5k/(4.5k + Rpu) and Voh = Vccout × Rdw/(4.5k + Rdw).

F. If pull up resistors are needed, please refer to the TXS0104 or contact TI.

G. For detailed information, please refer to application note SCEA043.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (30 pages)

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TXB0104 www.ti.com SCES650F – APRIL 2006 – REVISED MAY 2012 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTOMATIC DIRECTION SENSING AND ±15-kV ESD PROTECTION Check for Samples: TXB0104 FEATURES 1 • 2 • • • • • 1.2 V to 3.6 V on A Port and 1.65 V to 5.
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TXB0104 SCES650F – APRIL 2006 – REVISED MAY 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
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TXB0104 www.ti.com SCES650F – APRIL 2006 – REVISED MAY 2012 PIN DESCRIPTION PIN NO. BALL NO. NAME FUNCTION D, PW, OR RGY RUT GXU/ ZXU YZT 1 1 B2 B2 VCCA 2 2 A1 A3 A1 Input/output 1. Referenced to VCCA. 3 3 A2 B3 A2 Input/output 2. Referenced to VCCA. 4 4 A3 C3 A3 Input/output 3. Referenced to VCCA. 5 5 A4 D3 A4 Input/output 4. Referenced to VCCA. 6 – – – NC No connection. Not internally connected. 7 6 B4 D2 GND 8 12 B3 C2 OE 3-state output-mode enable.
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TXB0104 SCES650F – APRIL 2006 – REVISED MAY 2012 www.ti.com THERMAL IMPEDANCE RATINGS UNIT D package (1) θJA (1) (2) Package thermal impedance 113 (2) °C/W 47 RUT package TBD YZT package 90 (2) VCCA VCCB VCCB Supply voltage MIN MAX 1.2 3.6 1.65 5.5 Data inputs 1.2 V to 3.6 V 1.65 V to 5.5 V VCCI × 0.65 (3) VCCI OE 1.2 V to 3.6 V 1.65 V to 5.5 V VCCA × 0.65 5.5 Data inputs 1.2 V to 5.5 V 1.65 V to 5.5 V 0 VCCI × 0.35 (3) OE 1.2 V to 3.6 V 1.65 V to 5.5 V 0 VCCA × 0.
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TXB0104 www.ti.com SCES650F – APRIL 2006 – REVISED MAY 2012 ELECTRICAL CHARACTERISTICS (1) (2) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCCA VCCB 1.2 V IOH = –20 μA VOLA IOL = 20 μA VOHB IOH = –20 μA 1.65 V to 5.5 V VOLB IOL = 20 μA 1.65 V to 5.5 V Ioff IOZ MIN –40°C to 85°C TYP MAX MIN MAX 1.1 VOHA II TA = 25°C 1.4 V to 3.6 V V VCCA – 0.4 1.2 V 0.9 1.4 V to 3.6 V 0.4 VCCB – 0.4 V V μA VI = VCCI or GND 1.
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TXB0104 SCES650F – APRIL 2006 – REVISED MAY 2012 www.ti.com TIMING REQUIREMENTS TA = 25°C, VCCA = 1.2 V Data rate tw Pulse duration Data inputs VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V TYP TYP TYP TYP 20 20 20 20 Mbps 50 50 50 50 ns UNIT TIMING REQUIREMENTS over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted) VCCB = 1.8 V ± 0.15 V MIN Data rate tw Pulse duration VCCB = 2.5 V ± 0.2 V MAX MIN MAX 40 Data inputs VCCB = 3.
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TXB0104 www.ti.com SCES650F – APRIL 2006 – REVISED MAY 2012 SWITCHING CHARACTERISTICS TA = 25°C, VCCA = 1.2 V FROM (INPUT) TO (OUTPUT) VCCB = 1.8 V VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V TYP TYP TYP TYP A B 6.9 5.7 5.3 5.5 B A 7.4 6.4 6 5.8 A 1 1 1 1 B 1 1 1 1 A 18 15 14 14 B 20 17 16 16 trA, tfA A-port rise and fall times 4.2 4.2 4.2 4.2 ns trB, tfB B-port rise and fall times 2.1 1.5 1.2 1.1 ns tSK(O) Channel-to-channel skew 0.4 0.5 0.5 1.
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TXB0104 SCES650F – APRIL 2006 – REVISED MAY 2012 www.ti.com SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V MIN MAX B 1.1 A 1.2 VCCB = 5 V ± 0.5 V UNIT MIN MAX MIN MAX 6.3 1 5.2 0.9 4.7 6.6 1.1 5.1 0.9 4.4 A 1 1 1 B 1 1 1 A 5.1 21.3 4.6 15.2 4.6 13.2 B 4.4 20.8 3.8 16 3.9 13.
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TXB0104 www.ti.com SCES650F – APRIL 2006 – REVISED MAY 2012 OPERATING CHARACTERISTICS TA = 25°C VCCA 1.2 V 1.2 V 1.5 V 1.8 V 2.5 V 2.5 V 3.3 V 2.5 V 5V 3.
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TXB0104 SCES650F – APRIL 2006 – REVISED MAY 2012 www.ti.com PRINCIPLES OF OPERATION Applications The TXB0104 can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. Architecture The TXB0104 architecture (see Figure 1) does not require a direction-control signal to control the direction of data flow from A to B or from B to A.
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TXB0104 www.ti.com SCES650F – APRIL 2006 – REVISED MAY 2012 IIN VT/4 kW VIN –(VD – VT)/4 kW A. VT is the input threshold voltage of the TXB0104 (typically VCCI/2). B. VD is the supply voltage of the external driver. Figure 2. Typical IIN vs VIN Curve Power Up During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not damage the device, so any power supply can be ramped up first.
PAGE 12
TXB0104 SCES650F – APRIL 2006 – REVISED MAY 2012 www.ti.com PARAMETER MEASUREMENT INFORMATION 2 × VCCO From Output Under Test 50 kW From Output Under Test 15 pF 15 pF 1 MW Open 50 kW TEST tPZL/tPLZ tPHZ/tPZH LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT LOAD CIRCUIT FOR MAX DATA RATE, PULSE DURATION PROPAGATION DELAY OUTPUT RISE AND FALL TIME MEASUREMENT S1 S1 2 × VCCO Open VCCI Input VCCI/2 VCCI/2 0V tPLH tPHL tw Output VCCO/2 0.9 y VCCO 0.
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TXB0104 www.ti.com SCES650F – APRIL 2006 – REVISED MAY 2012 REVISION HISTORY Changes from Revision E (February 2010) to Revision F • Page Added notes to pin out graphics. ..........................................................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 26-Oct-2013 TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
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PACKAGE MATERIALS INFORMATION www.ti.com 23-Nov-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device TXB0104DR Package Package Pins Type Drawing SOIC TXB0104GXUR BGA MI CROSTA R JUNI OR SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 GXU 12 2500 330.0 8.4 2.3 2.8 1.0 4.0 8.0 Q2 TXB0104PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 23-Nov-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TXB0104DR SOIC D 14 2500 367.0 367.0 38.0 TXB0104GXUR BGA MICROSTAR JUNIOR GXU 12 2500 338.1 338.1 20.6 TXB0104PWR TSSOP PW 14 2000 367.0 367.0 35.0 TXB0104RGYR VQFN RGY 14 3000 367.0 367.0 35.0 TXB0104RUTR UQFN RUT 12 3000 202.0 201.0 28.0 TXB0104YZTR DSBGA YZT 12 3000 182.0 182.0 17.
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D: Max = 1.89 mm, Min = 1.83 mm E: Max = 1.39 mm, Min = 1.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.