Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLogic ICsLogic IC - Transducer Converter, Bidirectional TSSOP 20

GXY OR ZXY PACKAGE

(BOTTOM VIEW)

21 3 4 5

PW PACKAGE

(TOP VIEW)

RGY PACKAGE

(TOP VIEW)

YZP PACKAGE

(BALL SIDE VIEW)

1 20

10 11

CCB

CCA

GND

CCB

GND

CCA

CCB

GND

CCA

DQS PACKAGE

(TOP VIEW)

B6 B8 A8 A6

GND B7 A7 OE

CCB

B5 A5 V

CCA

B4 B3 A3 A4

B2 B1 A1 A2

1 2 3 4

TXB0108

www.ti.com

SCES643E –NOVEMBER 2006–REVISED MAY 2012

8-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR

WITH AUTO-DIRECTION SENSING AND ±15-kV ESD PROTECTION

Check for Samples: TXB0108

FEATURES

APPLICATIONS

• 1.2 V to 3.6 V on A Port and 1.65 to 5.5 V on • Handset, Smartphone, Tablet, Desktop PC

B Port (V

CCA

≤ V

CCB

)

• V

Isolation Feature – If Either V

Input Is at

GND, All Outputs Are in the High-Impedance

State

• OE Input Circuit Referenced to V

CCA

• Low Power Consumption, 4-μA Max I

• I

off

Supports Partial-Power-Down Mode

Operation

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Protection Exceeds JESD 22

TERMINAL ASSIGNMENTS

– A Port

(20-Ball GXY/ZXY Package)

– 2000-V Human-Body Model (A114-B)

1 2 3 4 5

– 1000-V Charged-Device Model (C101)

D V

CCB

B2 B4 B6 B8

– B Port

C B1 B3 B5 B7 GND

– ±15-kV Human-Body Model (A114-B)

B A1 A3 A5 A7 OE

– ±8-kV Human-Body Model (A114-B)

A V

CCA

A2 A4 A6 A8

(YZP Package Only)

– 1000-V Charged-Device Model (C101)

Note: For the RGY package, the exposed center thermal pad must be connected to ground.

A. Pull up resistors are not required on both sides for Logic I/O.

B. If pull up or pull down resistors are needed, the resistor value must be over 50 kΩ.

C. 50 kΩ is a safe recommended value, if the customer can accept higher Vol or lower Voh, smaller pull up or pull down

resistor is allowed, the draft estimation is Vol = Vccout × 4.5k/(4.5k + Rpu) and Voh = Vccout × Rdw/(4.5k + Rdw).

D. If pull up resistors are needed, please refer to the TXS0108 or contact TI.

E. For detailed information, please refer to application note SCEA043.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (27 pages)

PAGE 1
TXB0108 www.ti.
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TXB0108 SCES643E – NOVEMBER 2006 – REVISED MAY 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DESCRIPTION/ORDERING INFORMATION This 8-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V.
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TXB0108 www.ti.com SCES643E – NOVEMBER 2006 – REVISED MAY 2012 TYPICAL OPERATING CIRCUIT 1.8 V 3.3 V VCCA VCCB OE TXB0108 1.8 -V System Controller Data A1 A2 B1 B2 A3 A4 A5 A6 A7 A8 B3 B4 B5 B6 B7 B8 3.3-V System Data Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCCA Supply voltage range –0.5 4.6 V VCCB Supply voltage range –0.5 6.5 V VI Input voltage range (2) –0.5 6.
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TXB0108 SCES643E – NOVEMBER 2006 – REVISED MAY 2012 www.ti.com Recommended Operating Conditions (1) (2) VCCA VCCA VCCB Supply voltage VIH High-level input voltage VIL Low-level input voltage Δt/Δv Input transition rise or fall rate TA (1) (2) (3) 4 VCCB Data inputs OE 1.2 V to 3.6 V Data inputs 1.2 V to 5.5 V OE 1.2 V to 3.6 V A-port inputs 1.2 V to 3.6 V B-port inputs 1.2 V to 3.6 V 1.65 V to 5.5 V 1.65 V to 5.5 V MIN MAX 1.2 3.6 1.65 5.5 VCCI x 0.65 (3) VCCI VCCA x 0.
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TXB0108 www.ti.com SCES643E – NOVEMBER 2006 – REVISED MAY 2012 Electrical Characteristics (1) (2) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCCA TA = 25°C VCCB MIN 1.2 V IOH = –20 μA VOLA IOL = 20 μA VOHB IOH = –20 μA 1.65 V to 5.5 V VOLB IOL = 20 μA 1.65 V to 5.5 V IOZ 1.4 V to 3.6 V VCCB – 0.4 V V μA 1.65 V to 5.5 V ±1 ±2 0 V to 5.5 V ±1 ±2 B port 0 V to 3.6 V 0V ±1 ±2 1.2 V to 3.6 V 1.65 V to 5.
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TXB0108 SCES643E – NOVEMBER 2006 – REVISED MAY 2012 www.ti.com Timing Requirements over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) VCCB = 1.8 V ± 0.15 V MIN MAX Data rate tw VCCB = 2.5 V ± 0.2 V MIN MAX 52 Pulse duration Data inputs VCCB = 3.3 V ± 0.3 V MIN MAX 60 19 VCCB = 5 V ± 0.5 V MIN 60 17 60 17 UNIT MAX 17 Mbps ns Timing Requirements over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.
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TXB0108 www.ti.com SCES643E – NOVEMBER 2006 – REVISED MAY 2012 Switching Characteristics over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 1.8 V ± 0.15 V VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V MIN MAX MIN MAX MIN B 1.4 12.9 1.2 10.1 A 0.9 14.2 0.7 12 VCCB = 5 V ± 0.5 V UNIT MAX MIN MAX 1.1 10 0.8 9.9 0.4 11.7 0.3 13.
PAGE 8
TXB0108 SCES643E – NOVEMBER 2006 – REVISED MAY 2012 www.ti.com Switching Characteristics over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V MIN MAX B 1.1 A 1 VCCB = 5 V ± 0.5 V UNIT MIN MAX MIN MAX 6.4 1 5.3 0.9 4.7 7 0.6 5.6 0.3 4.4 A 1 1 1 B 1 1 1 A 5 16.9 4.9 15 4.5 13.8 B 4.8 21.8 4.5 17.9 4.4 15.
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TXB0108 www.ti.com SCES643E – NOVEMBER 2006 – REVISED MAY 2012 Operating Characteristics TA = 25°C VCCA 1.2 V 1.2 V 1.5 V 1.8 V 2.5 V 2.5 V 3.3 V 2.5 V 5V 3.
PAGE 10
TXB0108 SCES643E – NOVEMBER 2006 – REVISED MAY 2012 www.ti.com PRINCIPLES OF OPERATION Applications The TXB0108 can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. Architecture The TXB0108 architecture (see Figure 1) does not require a direction-control signal to control the direction of data flow from A to B or from B to A.
PAGE 11
TXB0108 www.ti.com SCES643E – NOVEMBER 2006 – REVISED MAY 2012 IIN VT/4 kW VIN –(VD – VT)/4 kW A. VT is the input threshold voltage of the TXB0108 (typically VCCI/2). B. VD is the supply voltage of the external driver. Figure 2. Typical IIN vs VIN Curve Power Up During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not damage the device, so any power supply can be ramped up first.
PAGE 12
TXB0108 SCES643E – NOVEMBER 2006 – REVISED MAY 2012 www.ti.com PARAMETER MEASUREMENT INFORMATION 2 × VCCO From Output Under Test 50 kW From Output Under Test 15 pF 15 pF 1 MW Open 50 kW TEST tPZL/tPLZ tPHZ/tPZH LOAD CIRCUIT FOR ENABLE/DISABLE TIME MEASUREMENT LOAD CIRCUIT FOR MAX DATA RATE, PULSE DURATION PROPAGATION DELAY OUTPUT RISE AND FALL TIME MEASUREMENT S1 S1 2 × VCCO Open VCCI Input VCCI/2 VCCI/2 0V tPLH tPHL tw Output VCCO/2 0.9 y VCCO 0.
PAGE 13
TXB0108 www.ti.com SCES643E – NOVEMBER 2006 – REVISED MAY 2012 REVISION HISTORY Changes from Revision C (August 2011) to Revision D Page • Added ±8-kV Human-Body Model (A114-B) (YZP Package Only) to Features ................................................................... 1 • Added YZP TOP-SIDE MARKING. .......................................................................................................................................
PAGE 14
PACKAGE OPTION ADDENDUM www.ti.
PAGE 15
PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line.
PAGE 16
PACKAGE MATERIALS INFORMATION www.ti.com 23-Aug-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing TXB0108DQSR USON SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DQS 20 3000 177.8 12.4 2.21 4.22 0.81 4.0 12.0 Q1 TXB0108PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 TXB0108RGYR VQFN RGY 20 3000 330.0 12.4 3.8 4.8 1.6 8.0 12.
PAGE 17
PACKAGE MATERIALS INFORMATION www.ti.com 23-Aug-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TXB0108DQSR USON DQS 20 3000 202.0 201.0 28.0 TXB0108PWR TSSOP PW 20 2000 367.0 367.0 38.0 TXB0108RGYR VQFN RGY 20 3000 355.0 350.0 50.0 TXB0108RGYR VQFN RGY 20 3000 367.0 367.0 35.0 TXB0108YZPR DSBGA YZP 20 3000 182.0 182.0 17.0 TXB0108ZXYR BGA MICROSTAR JUNIOR ZXY 20 2500 338.1 338.1 20.
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D: Max = 2.418 mm, Min =2.358 mm E: Max = 1.918 mm, Min =1.
PAGE 27
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.