Datasheet

1
FEATURES
ZXY PACKAGE
(BOTTOM VIEW)
A
B
C
D
21 3 4 5
19
18
17
16
15
14
12
13
1
2
3
4
5
6
7
9
8
10 11
20
B1
B2
B4
B6
B8
V
B3
B5
B7
A1
A2
A4
A6
A8
V
CCA
A3
A5
A7
OE GND
19
18
17
16
15
14
12
13
1
2
3
4
5
6
7
9
8
10 11
20
A1
B1
A2
A4
A6
A8
V
CCA
A3
A5
A7
B2
B4
B6
B8
V
CCB
B3
B5
B7
OE
GND
Exposed
Center
Pad
TXS0108E
www.ti.com
..................................................................................................................................... SCES642B DECEMBER 2007 REVISED SEPTEMBER 2008
8-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS
No Direction-Control Signal Needed IEC 61000-4-2 ESD (B Port)
Max Data Rates ± 8-kV Contact Discharge
60 Mbps (Push Pull) ± 6-kV Air-Gap Discharge
2 Mbps (Open Drain)
1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on
B Port (V
CCA
V
CCB
)
No Power-Supply Sequencing Required
Either V
CCA
or V
CCB
Can Be Ramped First
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22 (A Port)
2000-V Human-Body Model (A114-B)
150-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
TERMINAL ASSIGNMENTS
1 2 3 4 5
D V
CCB
B2 B4 B6 B8
C B1 B3 B5 B7 GND
B A1 A3 A5 A7 OE
A V
CCA
A2 A4 A6 A8
PW PACKAGE RGY PACKAGE
(TOP VIEW) (TOP VIEW)
The exposed center pad, if used, must be
connected as a secondary ground or left
electrically open.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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