Datasheet

24 23 22 21 20
7 8 9 10 11
1
2
3
4
5
6
18
17
16
15
14
13
19
12
DAT2A
GND
DAT3A
CMDA
V
CCA
DAT0A
DAT0
B0
VCC
B1
DAT1
B0
DAT1
B1
DAT0
B1
CLK
B1
SEL
DAT2
B0
DAT3
B0
VCC
B0
CMD
B0
CLK
B0
DAT1A
DAT2
B1
CLKA
DAT3
B1
GND
CMD
B1
Exposed
Center Pad
For RTW, if the exposed
center pad is used, it must
be connected to ground
or electrically open.
RTW PACKAGE
(TOP VIEW)
D
E
A
1
2
3
4 5
B
C
ZQS PACKAGE
(TOP VIEW)
TXS02612
www.ti.com
SCES682C DECEMBER 2008REVISED FEBRUARY 2009
SDIO PORT EXPANDER WITH VOLTAGE-LEVEL TRANSLATION
1
FEATURES
6-to-12 Demultiplexer/Multiplexer Allows SDIO Latch-Up Performance Exceeds 100 mA Per
Port Expansion JESD 78, Class II
Built-in Level Translator Eliminates Voltage ESD Performance A Port
Mismatch Between Baseband and SD Card or
2000-V Human-Body Model (A114-B)
SDIO Peripheral
100-V Machine Model (A115-A)
V
CCA
, V
CCB0
, and V
CCB1
Each Operate Over Full
1500-V Charged-Device Model (C101)
1.1-V to 3.6-V Range
±8-kV Contact Discharge IEC 61000-4-2 ESD
Performance (B Port)
DESCRIPTION/ORDERING INFORMATION
The TXS02612 is designed to interface the cell phone baseband with external SDIO peripherals. The device
includes a 6-channel SPDT switch with voltage-level translation capability. This allows a single SDIO port to be
interfaced with two SDIO peripherals. The TXS02612 has three separate supply rails that operate over the full
range of 1.1 V to 3.6 V. This allows the baseband and SDIO peripherals to operate at different supply voltages if
required.
The select (SEL) input is used to choose between the B0 port and B1 port. When SEL = Low, B0 port is
selected; when SEL = High, B1 port is selected. SEL is referenced to V
CCA
. For the unselected B port, the clock
output is held low, whereas the data and command I/Os are pulled high to their respective V
CCB
through a 70-k
resistor (±30% tolerance).
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
MicroStar Junior™ BGA
Reel of 3000 TXS02612ZQSR YJ612
(VFBGA) – ZQS
–40°C to 85°C
QFN – RTW Reel of 3000 TXS02612RTWR YJ612
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Table 1. ZQS PACKAGE TERMINAL
ASSIGNMENTS
1 2 3 4 5
A DAT2A SEL DAT3
B0
CMD
B0
CLK
B0
B DAT3A DAT2
B0
V
CCB0
DAT0
B0
C CMDA V
CCA
GND V
CC B1
DAT1
B0
D DAT0A CLKA GND DAT1
B1
DAT0
B1
E DAT1A DAT2
B1
DAT3
B1
CMD
B1
CLK
B1
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008–2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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