PACKAGE OPTION ADDENDUM www.ti.
PACKAGE OPTION ADDENDUM www.ti.
PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant UC2875DWPTR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 UC3875DWPTR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UC2875DWPTR SOIC DW 28 1000 367.0 367.0 55.0 UC3875DWPTR SOIC DW 28 1000 367.0 367.0 55.
MECHANICAL DATA MPLC004A – OCTOBER 1994 FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER 20 PIN SHOWN Seating Plane 0.004 (0,10) 0.180 (4,57) MAX 0.120 (3,05) 0.090 (2,29) D D1 0.020 (0,51) MIN 3 1 19 0.032 (0,81) 0.026 (0,66) 4 E 18 D2 / E2 E1 D2 / E2 8 14 0.021 (0,53) 0.013 (0,33) 0.007 (0,18) M 0.050 (1,27) 9 13 0.008 (0,20) NOM D/E D2 / E2 D1 / E1 NO. OF PINS ** MIN MAX MIN MAX MIN MAX 20 0.385 (9,78) 0.395 (10,03) 0.350 (8,89) 0.356 (9,04) 0.141 (3,58) 0.169 (4,29) 28 0.
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