Datasheet

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UC1705

UC2705, UC3705

www.ti.com

SLUS370D –JULY 1995–REVISED MARCH 2012

HIGH SPEED POWER DRIVER

Check for Samples: UC1705, UC2705, UC3705

FEATURES

• 1.5 A Source/Sink Drive • Low Quiescent Current

• 100 nsec Delay • 5 V to 40 V Operation

• 40 nsec Rise Fall into 1000 pF • Thermal Shutdown Protection

• Inverting and Non-Inverting Inputs • Minidip and Power Packages

• Low Cross-Conduction Current Spike

DESCRIPTION

The UC1705 family of power drivers is made with a high sppeed Schottky process to interface between low-level

control functions and high-power switching devices - particularly power MOSFETs. These devices are also an

optimum choise for capacitive line drivers where up to 1.5 A may be switched in either direction. With both

inverting and non-inverting inputs available, logic signals of either polarity may be accepted, or one input can be

used to gate or strobe the other.

Supply voltages for both V

and V

can independently range from 5 V to 40 V. For additional application details,

see the UC1707/3707 data sheet (SLUS177).

The UC1705 is packaged in an 8-pin hermetically sealed CERDIP for -55°C to 125°C operation. The UC3705 is

specified for a temperature range of 0°C to 70°C and is available in either a plastic minidip or a 5-pin, power

TO-220 package.

TRUTH TABLE

(1)(2)

INV N.I OUT

H H L

L H H

H L L

L L L

(1) OUT = INV and N.I.

(2) OUT = INV and N.i.

BLOCK DIAGRAM

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (18 pages)

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UC1705 UC2705, UC3705 www.ti.com SLUS370D – JULY 1995 – REVISED MARCH 2012 HIGH SPEED POWER DRIVER Check for Samples: UC1705, UC2705, UC3705 FEATURES 1 • • • • • 1.
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UC1705 UC2705, UC3705 SLUS370D – JULY 1995 – REVISED MARCH 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. CONNECTION DIAGRAMS DIL-8 MINIDIP, SOIC-8 (TOP VIEW) N, JG OR D PACKAGE xxx VS 1 8 N.I. IN VC 2 7 INV. IN N/C 3 OUT 4 6 5-PIN TO-220 (TOP VIEW) T PACKAGE xxx 5 4 3 2 1 N.I. IN INV.
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UC1705 UC2705, UC3705 www.ti.com SLUS370D – JULY 1995 – REVISED MARCH 2012 ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT N-Pkg JG-Pkg T-Pkg Supply Voltage (VIN) 40 40 40 Collector Supply Voltage, VC 40 40 40 Steady-State ±500 ±500 ±1 A Peak Transient ±1.
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UC1705 UC2705, UC3705 SLUS370D – JULY 1995 – REVISED MARCH 2012 www.ti.com TYPICAL SWITCHING CHARACTERISTICS VIN = VC = 20 V, TA = 25°C. Delays measured to 10% output change. PARAMETER TEST CONDITIONS OUTPUT CL = From Inv. Input to Output UNIT open 1 2.
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UC1705 UC2705, UC3705 www.ti.com SLUS370D – JULY 1995 – REVISED MARCH 2012 APPLICATION INFORMATION D1, D2: UC3611 Schottky Diodes Figure 1. Power MOSFET Drive Circuit D1, D2: UC3611 Schottky Diodes Figure 3. Transformer Coupled MOSFET DRIVE Circuit D1 D2 D1, D2: UC3611 Schottky Diodes Figure 2. Power MOSFET Drive Circuit Using Negative Bias Voltage and Level Shifting to Ground Referenced PWMs D1 D2 Figure 4.
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UC1705 UC2705, UC3705 SLUS370D – JULY 1995 – REVISED MARCH 2012 www.ti.com REVISION HISTORY Changes from Revision C (December, 2011) to Revision D • 6 Page Deleted SN54BCT373 from title for FK package image .......................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device UC3705DTR Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.4 B0 (mm) K0 (mm) P1 (mm) 5.2 2.1 8.0 W Pin1 (mm) Quadrant 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UC3705DTR SOIC D 8 2500 367.0 367.0 35.
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MECHANICAL DATA MCER001A – JANUARY 1995 – REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0°–15° 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters).
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.