Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - gate drivers Non-inverting Low side MSOP 8 PowerPad

VDD

ENBL

AGND

VDD

OUT

PGND

D PACKAGE

(TOP VIEW)

DGN PACKAGE

(TOP VIEW)

VDD

OUT

PGND

VDD

ENBL

AGND

UCC27321-Q1, UCC27322-Q1

www.ti.com

SLUSA13C –FEBRUARY 2010–REVISED MARCH 2012

SINGLE 9-A HIGH-SPEED LOW-SIDE MOSFET DRIVER WITH ENABLE

Check for Samples: UCC27321-Q1, UCC27322-Q1

FEATURES

• Qualified for Automotive Applications

• Available in Thermally Enhanced MSOP

PowerPAD™ Package With 4.7°C/W θ

• Industry-Standard Pinout With Addition of

Enable Function • Rated From –40°C to 125°C

• High Peak-Current Drive Capability of ±9 A at • TrueDrive Output Architecture Using Bipolar

the Miller Plateau Region Using TrueDrive™ and CMOS Transistors in Parallel

Technology

APPLICATIONS

• Efficient Constant-Current Sourcing Using a

Unique Bipolar and CMOS Output Stage

• Switch-Mode Power Supplies

• TTL-/CMOS-Compatible Inputs Independent of

• DC/DC Converters

Supply Voltage

• Motor Controllers

• 20-ns Typical Rise and 15-ns Typical Fall

• Line Drivers

Times With 10-nF Load

• Class-D Switching Amplifiers

• Typical Propagation Delay Times of 25 ns With

• Pulse Transformer Driver

Input Falling and 35 ns With Input Rising

• 4-V to 15-V Supply Voltage

DESCRIPTION

The UCC37321/2 family of high-speed drivers delivers 9 A of peak drive current in an industry-standard pinout.

These drivers can drive the largest of MOSFETs for systems requiring extreme Miller current due to high dV/dt

transitions. This eliminates additional external circuits and can replace multiple components to reduce space,

design complexity, and assembly cost. Two standard logic options are offered, inverting (UCC37321) and

noninverting (UCC37322).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2TrueDrive, PowerPAD are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (27 pages)

PAGE 1
UCC27321-Q1, UCC27322-Q1 www.ti.
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UCC27321-Q1, UCC27322-Q1 SLUSA13C – FEBRUARY 2010 – REVISED MARCH 2012 VDD www.ti.
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UCC27321-Q1, UCC27322-Q1 www.ti.com SLUSA13C – FEBRUARY 2010 – REVISED MARCH 2012 ABSOLUTE MAXIMUM RATINGS (1) (2) over operating free-air temperature range (unless otherwise noted) VDD Supply voltage IO Output current, OUT VI –0.3 V to 16 V 0.6 A IN –5 V to 6 V or VDD + 0.3 V (whichever is larger) ENBL –5 V to 6 V or VDD + 0.
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UCC27321-Q1, UCC27322-Q1 SLUSA13C – FEBRUARY 2010 – REVISED MARCH 2012 www.ti.com INPUT (IN) ELECTRICAL CHARACTERISTICS VDD = 4.5 V to 15 V, TJ = TA = –40°C to 125°C (unless otherwise noted) PARAMETER VIH Logic 1 input threshold VIL Logic 0 input threshold TEST CONDITIONS TYP MAX 2 0 V ≤ VIN ≤ VDD Input current –10 Latch-up protection (1) (1) MIN UNIT V 0 1 V 10 µA 500 mA Specified by design OUTPUT (OUT) ELECTRICAL CHARACTERISTICS VDD = 4.
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UCC27321-Q1, UCC27322-Q1 www.ti.com SLUSA13C – FEBRUARY 2010 – REVISED MARCH 2012 (a) (b) 5V IN VTH 0V tD1 VTH IN VTH tD2 VTH tD1 tD2 tF VDD 80% 80% 80% tR OUT 80% tR OUT 20% tF 20% 0V A. The 20% and 80% thresholds depict the dynamics of the bipolar output devices that dominate the power MOSFET transition through the Miller regions of operation. Figure 1.
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UCC27321-Q1, UCC27322-Q1 SLUSA13C – FEBRUARY 2010 – REVISED MARCH 2012 www.ti.
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UCC27321-Q1, UCC27322-Q1 www.ti.com SLUSA13C – FEBRUARY 2010 – REVISED MARCH 2012 TYPICAL CHARACTERISTICS (continued) RISE TIME vs SUPPLY VOLTAGE 70 CLOAD = 10 nF CLOAD = 10 nF 60 tA = −40°C tR − Rise Time − ns 50 40 tA = 105°C tA = 25°C 30 20 tA = 0°C 10 0 4 6 8 10 12 14 16 VDD − Supply Voltage − V Figure 7. 0.1 1.0 Figure 9. Copyright © 2010–2012, Texas Instruments Incorporated Figure 8. 0.1 1.0 Figure 10.
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UCC27321-Q1, UCC27322-Q1 SLUSA13C – FEBRUARY 2010 – REVISED MARCH 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) tD1 DELAY TIME vs SUPPLY VOLTAGE tD2 DELAY TIME vs SUPPLY VOLTAGE 70 70 CLOAD = 10 nF CLOAD = 10 nF 60 tA = 105°C 60 tA = 25°C 50 50 tD2 − Delay Time − ns tD1 − Delay Time − ns tA = 105°C tA = 25°C 40 30 20 40 30 tA = 0°C 20 tA = −40°C tA = −40°C 10 10 tA = 0°C 0 0 4 6 8 10 12 14 16 4 10 12 Figure 11. Figure 12.
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UCC27321-Q1, UCC27322-Q1 www.ti.com SLUSA13C – FEBRUARY 2010 – REVISED MARCH 2012 TYPICAL CHARACTERISTICS (continued) PROPAGATION TIMES vs PEAK INPUT VOLTAGE 45 2.0 VDD = 15 V CLOAD = 10 nF TA = 25°C tD2 VON − Input Threshold Voltage − V 50 40 Propagation Time − ns tRISE 35 30 25 20 15 10 tFALL tD1 INPUT THRESHOLD vs TEMPERATURE 1.9 VDD = 15 V 1.8 1.7 1.6 1.5 VDD = 10 V VDD = 4.5 V 1.4 1.3 5 0 0 5 10 VIN(peak) − Peak Input Voltage − V 1.
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UCC27321-Q1, UCC27322-Q1 SLUSA13C – FEBRUARY 2010 – REVISED MARCH 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) OUTPUT BEHAVIOR vs VDD (UCC37321) OUTPUT BEHAVIOR vs VDD (UCC37321) IN = GND ENBL = VDD VDD − Input Voltage − V 1 V/div VDD − Input Voltage − V 1 V/div IN = GND ENBL = VDD VDD OUT OUT 0V 0V VDD 10 nF Between Output and GND 50 µs/div 10 nF Between Output and GND 50 µs/div Figure 19. Figure 20.
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UCC27321-Q1, UCC27322-Q1 www.ti.com SLUSA13C – FEBRUARY 2010 – REVISED MARCH 2012 TYPICAL CHARACTERISTICS (continued) OUTPUT BEHAVIOR vs VDD (UCC37322) OUTPUT BEHAVIOR vs VDD (UCC37322) IN = VDD ENBL = VDD VDD − Input Voltage − V 1 V/div VDD − Input Voltage − V 1 V/div IN = VDD ENBL = VDD VDD VDD OUT OUT 0V 0V 10 nF Between Output and GND 50 µs/div 10 nF Between Output and GND 50 µs/div Figure 23. Figure 24.
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UCC27321-Q1, UCC27322-Q1 SLUSA13C – FEBRUARY 2010 – REVISED MARCH 2012 www.ti.com APPLICATION INFORMATION General Information The UCC37321 and UCC37322 drivers serve as an interface between low-power controllers and power MOSFETs. They can also be used as an interface between DSPs and power MOSFETs. High-frequency power supplies often require high-speed, high-current drivers such as the UCC37321/2 family.
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UCC27321-Q1, UCC27322-Q1 www.ti.com SLUSA13C – FEBRUARY 2010 – REVISED MARCH 2012 Source/Sink Capabilities During Miller Plateau Large power MOSFETs present a large load to the control circuitry. Proper drive is required for efficient, reliable operation. The UCC27321/2 drivers have been optimized to provide maximum drive to a power MOSFET during the Miller plateau region of the switching transition.
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UCC27321-Q1, UCC27322-Q1 SLUSA13C – FEBRUARY 2010 – REVISED MARCH 2012 www.ti.com It should be noted that the current-sink capability is slightly stronger than the current source capability at lower VDD. This is due to the differences in the structure of the bipolar-MOSFET power output section, where the current source is a P-channel MOSFET and the current sink has an N-channel MOSFET.
PAGE 15
UCC27321-Q1, UCC27322-Q1 www.ti.com SLUSA13C – FEBRUARY 2010 – REVISED MARCH 2012 When a driver is tested with a discrete capacitive load, it is a fairly simple matter to calculate the power that is required from the bias supply. The energy that must be transferred from the bias supply to charge the capacitor is given by: E = ½CV2 where C is the load capacitor and V is the bias voltage feeding the driver. There is an equal amount of energy transferred to ground when the capacitor is discharged.
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UCC27321-Q1, UCC27322-Q1 SLUSA13C – FEBRUARY 2010 – REVISED MARCH 2012 www.ti.com Thermal Information The useful range of a driver is greatly affected by the drive-power requirements of the load and the thermal characteristics of the package. For a power driver to be useful over a particular temperature range, the package must allow for the efficient removal of the heat produced while keeping the junction temperature within rated limits.
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UCC27321-Q1, UCC27322-Q1 www.ti.com SLUSA13C – FEBRUARY 2010 – REVISED MARCH 2012 REVISION HISTORY Changes from Revision B (January 2011) to Revision C • Page Changed enable impedance from 135 kΩ to 145 kΩ ...........................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant UCC27321QDRQ1 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC27322QDGNRQ1 MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 UCC27322QDRQ1 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC27321QDRQ1 SOIC D 8 2500 367.0 367.0 35.0 UCC27322QDGNRQ1 MSOP-PowerPAD DGN 8 2500 367.0 367.0 35.0 UCC27322QDRQ1 SOIC D 8 2500 367.0 367.0 35.
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