Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - gate drivers Non-inverting Low side PDIP 8

UDG-01063

OUTA

ENBA

2INA

3GND

ENBB8

INVERTING

NON-INVERTING

OUTB

INVERTING

NON-INVERTING

INB

6 VDD

VDD

UCC27423, UCC27424, UCC27425

www.ti.com

SLUS545D –NOVEMBER 2002–REVISED MAY 2013

Dual 4-A High Speed Low-Side MOSFET Drivers With Enable

Check for Samples: UCC27423, UCC27424, UCC27425

FEATURES

DESCRIPTION

The UCC27423/4/5 family of high-speed dual

• Industry-Standard Pin-Out

MOSFET drivers can deliver large peak currents into

• Enable Functions for Each Driver

capacitive loads. Three standard logic options are

• High Current Drive Capability of ±4A

offered – dual-inverting, dual-noninverting and one-

inverting and one-noninverting driver. The thermally

• Unique BiPolar and CMOS True Drive Output

enhanced 8-pin PowerPAD™ MSOP package (DGN)

Stage Provides High Current at MOSFET Miller

drastically lowers the thermal resistance to improve

Thresholds

long-term reliability. It is also offered in the standard

• TTL/CMOS Compatible Inputs Independent of

SOIC-8 (D) or PDIP-8 (P) packages.

Supply Voltage

Using a design that inherently minimizes shoot-

• 20ns Typical Rise and 15ns Typical Fall Times

through current, these drivers deliver 4A of current

with 1.8nF Load

where it is needed most at the Miller plateau region

• Typical Propagation Delay Times of 25ns with

during the MOSFET switching transition. A unique

BiPolar and MOSFET hybrid output stage in parallel

Input Falling and 35ns with Input Rising

also allows efficient current sourcing and sinking at

• 4V to 15V Supply Voltage

low supply voltages.

• Dual Outputs Can Be Paralleled for Higher

The UCC27423/4/5 provides enable (ENBL) functions

Drive Current

to have better control of the operation of the driver

• Available in Thermally Enhanced MSOP

applications. ENBA and ENBB are implemented on

PowerPAD™ Package with 4.7°C/W θ

pins 1 and 8 which were previously left unused in the

• Rated From –40°C to 125°C

industry standard pin-out. They are internally pulled

up to Vdd for active high logic and can be left open

for standard operation.

APPLICATIONS

• Switch Mode Power Supplies

BLOCK DIAGRAM

• DC/DC Converters

• Motor Controllers

• Line Drivers

• Class D Switching Amplifiers

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (30 pages)

PAGE 1
UCC27423, UCC27424, UCC27425 www.ti.com SLUS545D – NOVEMBER 2002 – REVISED MAY 2013 Dual 4-A High Speed Low-Side MOSFET Drivers With Enable Check for Samples: UCC27423, UCC27424, UCC27425 FEATURES DESCRIPTION • • • • The UCC27423/4/5 family of high-speed dual MOSFET drivers can deliver large peak currents into capacitive loads. Three standard logic options are offered – dual-inverting, dual-noninverting and oneinverting and one-noninverting driver.
PAGE 2
UCC27423, UCC27424, UCC27425 SLUS545D – NOVEMBER 2002 – REVISED MAY 2013 www.ti.
PAGE 3
UCC27423, UCC27424, UCC27425 www.ti.com SLUS545D – NOVEMBER 2002 – REVISED MAY 2013 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT VDD Supply voltage -0.3 to 16 V IOUT_DC Output current (OUTA, OUTB) DC 0.2 A IOUT_PULSED Pulsed, (0.5μs) 4.5 A VIN Input voltage (INA, INB) -5 to 6 or VDD+0.3 (whichever is larger) V Enable voltage (ENBA, ENBB) –0.3 V to 6 V or VDD+0.
PAGE 4
UCC27423, UCC27424, UCC27425 SLUS545D – NOVEMBER 2002 – REVISED MAY 2013 www.ti.com ELECTRICAL CHARACTERISTICS (Continued) VDD = 4.5V to 15 V, TA = –40°C to 125°C,TA = TJ (unless otherwise noted) PARAMETER (1) (2) TEST CONDITION MIN TYP MAX 2.9 UNITS ENABLE (ENBA, ENBB) VIN_H High-level input voltage LO to HI transition 1.7 2.4 VIN_L Low-level input voltage HI to LO transition 1.1 1.8 2.2 0.15 0.55 0.
PAGE 5
UCC27423, UCC27424, UCC27425 www.ti.com SLUS545D – NOVEMBER 2002 – REVISED MAY 2013 5V ENBx VIN_L VIN_H 0V tD3 tD4 VDD 90% 90% tR OUTx tF 10% 0V NOTE: The 10% and 90% thresholds depict the dynamics of the BiPolar output devices that dominate the power MOSFET transition through the Miller regions of operation. Figure 2. Switching Waveform for Enable to Output Terminal Functions TERMINAL I/O FUNCTION NO.
PAGE 6
UCC27423, UCC27424, UCC27425 SLUS545D – NOVEMBER 2002 – REVISED MAY 2013 www.ti.com APPLICATION INFORMATION General Information High frequency power supplies often require high-speed, high-current drivers such as the UCC27423/4/5 family. A leading application is the need to provide a high power buffer stage between the PWM output of the control IC and the gates of the primary power MOSFET or IGBT switching devices.
PAGE 7
UCC27423, UCC27424, UCC27425 www.ti.com SLUS545D – NOVEMBER 2002 – REVISED MAY 2013 Two circuits are used to test the current capabilities of the UCC27423 driver. In each case external circuitry is added to clamp the output near 5 V while the IC is sinking or sourcing current. An input pulse of 250 ns is applied at a frequency of 1 kHz in the proper polarity for the respective test. In each test there is a transient period where the current peaked up and then settled down to a steady-state value.
PAGE 8
UCC27423, UCC27424, UCC27425 SLUS545D – NOVEMBER 2002 – REVISED MAY 2013 www.ti.com VDD UCC27423 ENBA 1 ENBB 8 INPUT 2 OUTA INA OUTB INB 10Ω C2 1 µF VDD 6 3 GND 4 DSCHOTTKY 7 5 C3 100µF + DADJ 5.5 V VSNS 1 µF CER 100µF AL EL RSNS 0.1Ω UDG-01066 Figure 4. Operational Waveforms and Circuit Layout Figure 5 shows the circuit performance achievable with a single driver (1/2 of the 8-pin IC) driving a 10-nF load.
PAGE 9
UCC27423, UCC27424, UCC27425 www.ti.com SLUS545D – NOVEMBER 2002 – REVISED MAY 2013 Figure 6. In a power driver operating at high frequency, it is a significant challenge to get clean waveforms without much overshoot/undershoot and ringing. The low output impedance of these drivers produces waveforms with high di/dt. This tends to induce ringing in the parasitic inductances. Utmost care must be used in the circuit layout. It is advantageous to connect the driver IC as close as possible to the leads.
PAGE 10
UCC27423, UCC27424, UCC27425 SLUS545D – NOVEMBER 2002 – REVISED MAY 2013 www.ti.com There is an equal amount of energy transferred to ground when the capacitor is discharged. This leads to a power loss given by the following: P + 2 1 CV 2f , where f is the switching frequency. 2 This power is dissipated in the resistive elements of the circuit. Thus, with no external resistor between the driver and gate, this power is dissipated inside the driver.
PAGE 11
UCC27423, UCC27424, UCC27425 www.ti.com SLUS545D – NOVEMBER 2002 – REVISED MAY 2013 Thermal Information The useful range of a driver is greatly affected by the drive power requirements of the load and the thermal characteristics of the IC package. In order for a power driver to be useful over a particular temperature range the package must allow for the efficient removal of the heat produced while keeping the junction temperature within rated limits.
PAGE 12
UCC27423, UCC27424, UCC27425 SLUS545D – NOVEMBER 2002 – REVISED MAY 2013 www.ti.com TYPICAL CHARACTERISTICS SUPPLY CURRENT vs FREQUENCY (VDD = 8.0V) 100 100 80 80 10 nF IDD - Supply Current - mA IDD - Supply Current - mA SUPPLY CURRENT vs FREQUENCY (VDD = 4.5V) 60 40 4.7 nF 2.2 nF 20 10 nF 4.7 nF 60 40 2.2 nF 1 nF 20 1 nF 470 pF 470 pF 0 0 500 K 1M 1.5 M 0 2M 0 500 K f - Frequency - Hz Figure 7. 1M 1.5 M 2M f - Frequency - Hz Figure 8.
PAGE 13
UCC27423, UCC27424, UCC27425 www.ti.com SLUS545D – NOVEMBER 2002 – REVISED MAY 2013 TYPICAL CHARACTERISTICS (continued) SUPPLY CURRENT vs SUPPLY VOLTAGE (CLOAD = 2.2nF) SUPPLY CURRENT vs SUPPLY VOLTAGE (CLOAD = 4.
PAGE 14
UCC27423, UCC27424, UCC27425 SLUS545D – NOVEMBER 2002 – REVISED MAY 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) SUPPLY CURRENT vs SUPPLY VOLTAGE (UCC27425) RISE TIME/FALL TIME vs TEMPERATURE (UCC27423) 0.75 25 0.70 tr/tf - Rise/Fall Time - ms IDD - Supply Current - mA tr 20 0.65 Input = VDD 0.60 0.55 0.50 Input = 0 V 0.45 0.40 15 tf 10 5 0.35 0 0.30 4 6 8 10 12 VDD - Supply Voltage - V Figure 15. 14 14 16 -50 0 50 150 TJ - Temperature - °C Figure 16.
PAGE 15
UCC27423, UCC27424, UCC27425 www.ti.com SLUS545D – NOVEMBER 2002 – REVISED MAY 2013 TYPICAL CHARACTERISTICS (continued) DELAY TIME (fD1) vs SUPPLY VOLTAGE (UCC27423) 30 38 28 36 26 24 22 4.7 nF 20 18 2.2 nF 16 32 4.7 nF 30 28 2.2 nF 26 470 pF 24 1 nF 470 pF 14 12 10 nF 34 10 nF tD2 - Delay Time - ns tD1 - Delay Time - ns DELAY TIME (fD2) vs SUPPLY VOLTAGE (UCC27423) 22 1 nF 4 6 8 10 12 20 14 16 4 VDD - Supply Voltage - V Figure 19.
PAGE 16
UCC27423, UCC27424, UCC27425 SLUS545D – NOVEMBER 2002 – REVISED MAY 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) OUTPUT BEHAVIOR vs SUPPLY VOLTAGE (INVERTING) OUTPUT BEHAVIOR vs SUPPLY VOLTAGE (INVERTING) 50 ms/div Figure 23. 50 ms/div Figure 24. OUTPUT BEHAVIOR vs VDD (INVERTING) OUTPUT BEHAVIOR vs VDD (INVERTING) VDD - Supply Voltage - V 1 V/div IN = VDD ENBL = VDD VDD OUT 0V 50 ms/div Figure 25. 16 Submit Documentation Feedback 10 nF Between Output and GND 50 ms/div Figure 26.
PAGE 17
UCC27423, UCC27424, UCC27425 www.ti.com SLUS545D – NOVEMBER 2002 – REVISED MAY 2013 TYPICAL CHARACTERISTICS (continued) OUTPUT BEHAVIOR vs VDD (NON-INVERTING) OUTPUT BEHAVIOR vs VDD (NON-INVERTING) 50 ms/div Figure 27. Figure 28. OUTPUT BEHAVIOR vs VDD (NON-INVERTING) OUTPUT BEHAVIOR vs VDD (NON-INVERTING) 50 ms/div VDD - Supply Voltage - V 1 V/div IN = GND ENBL = VDD VDD OUT 0V 50 ms/div Figure 29. 10 nF Between Output and GND 50 ms/div Figure 30.
PAGE 18
UCC27423, UCC27424, UCC27425 SLUS545D – NOVEMBER 2002 – REVISED MAY 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) INPUT THRESHOLD vs TEMPERATURE 2.0 VON - Input Threshold Voltage - V 1.9 VDD = 15 V 1.8 1.7 1.6 1.5 VDD = 10 V VDD = 4.5 V 1.4 1.3 1.2 -50 -25 0 25 50 75 100 125 TJ - Temperature - °C Figure 31. REVISION HISTORY Changes from Revision B (November 2004) to Revision C Page • Changed temperature rating. .......................................................................
PAGE 19
PACKAGE OPTION ADDENDUM www.ti.
PAGE 20
PACKAGE OPTION ADDENDUM www.ti.
PAGE 21
PACKAGE OPTION ADDENDUM www.ti.com 16-May-2013 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PAGE 22
PACKAGE MATERIALS INFORMATION www.ti.com 16-May-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device UCC27423DGNR Package Package Pins Type Drawing MSOPPower PAD SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 UCC27423DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC27424DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.
PAGE 23
PACKAGE MATERIALS INFORMATION www.ti.com 16-May-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC27423DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0 UCC27423DR SOIC D 8 2500 340.5 338.1 20.6 UCC27424DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0 UCC27424DR SOIC D 8 2500 340.5 338.1 20.6 UCC27425DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0 UCC27425DR SOIC D 8 2500 340.5 338.1 20.
PAGE 24
PAGE 25
PAGE 26
PAGE 27
PAGE 28
PAGE 29
PAGE 30
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.