Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - gate drivers Non-inverting Low side SOIC 8

OUTA

ENBA

2INA

3GND

ENBB8

INVERTING

NONINVERTING

OUTB

INVERTING

NONINVERTING

INB

6 VDD

VDD

UCC27423-Q1

UCC27424-Q1

UCC27425-Q1

www.ti.com

SGLS274F –SEPTEMBER 2008–REVISED SEPTEMBER 2012

DUAL 4-A HIGH-SPEED LOW-SIDE MOSFET DRIVERS WITH ENABLE

Check for Samples: UCC27423-Q1, UCC27424-Q1, UCC27425-Q1

FEATURES

• Typical Propagation Delay Times of 25 ns With

Input Falling and 35 ns With Input Rising

• Qualified for Automotive Applications

• 4-V to 15-V Supply Voltage

• Industry-Standard Pinout

• Dual Outputs Can Be Paralleled for Higher

• Enable Functions for Each Driver

Drive Current

• High Current Drive Capability of ±4 A

• Rated From –40°C to 125°C

• Unique Bipolar and CMOS True Drive Output

APPLICATIONS

Stage Provides High Current at MOSFET Miller

• Switch Mode Power Supplies

Thresholds

• DC/DC Converters

• TTL/CMOS Compatible Inputs Independent of

Supply Voltage • Motor Controllers

• 20-ns Typical Rise and 15-ns Typical Fall • Line Drivers

Times With 1.8-nF Load

• Class D Switching Amplifiers

DESCRIPTION

The UCC2742x-Q1 high-speed dual MOSFET drivers can deliver large peak currents into capacitive loads. Two

standard logic options are offered – dual inverting and dual noninverting drivers. They are offered in the standard

SOIC-8 (D) package.

Using a design that inherently minimizes shoot-through current, these drivers deliver 4-A current where it is

needed most, at the Miller plateau region, during the MOSFET switching transition. A unique bipolar and

MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.

The UCC2742x-Q1 provide enable (ENBL) functions to have better control of the operation of the driver

applications. ENBA and ENBB are implemented on pins 1 and 8, which were previously left unused in the

industry standard pinout. They are internally pulled up to V

for active-high logic and can be left open for

standard operation.

Figure 1. BLOCK DIAGRAM

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (29 pages)

PAGE 1
UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 www.ti.
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UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 SGLS274F – SEPTEMBER 2008 – REVISED SEPTEMBER 2012 www.ti.
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UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 www.ti.
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UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 SGLS274F – SEPTEMBER 2008 – REVISED SEPTEMBER 2012 www.ti.com ELECTRICAL CHARACTERISTICS VDD = 4.
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UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 www.ti.com SGLS274F – SEPTEMBER 2008 – REVISED SEPTEMBER 2012 ELECTRICAL CHARACTERISTICS (continued) VDD = 4.
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UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 SGLS274F – SEPTEMBER 2008 – REVISED SEPTEMBER 2012 www.ti.com (a) (b) +5V 90% 90% INPUT INPUT 10% 10% 0V td1 tf td2 tf tf tf 16V 90% 90% 90% td1 OUTPUT td2 OUTPUT 10% 10% 0V A. The 10% and 90% thresholds depict the dynamics of the bipolar output devices that dominate the power MOSFET transition through the Miller regions of operation. Figure 2.
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UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 www.ti.com SGLS274F – SEPTEMBER 2008 – REVISED SEPTEMBER 2012 TYPICAL CHARACTERISTICS SUPPLY CURRENT vs FREQUENCY (VDD = 8.0 V) 100 100 80 80 10 nF IDD − Supply Current − mA IDD − Supply Current − mA SUPPLY CURRENT vs FREQUENCY (VDD = 4.5 V) 60 4.7 nF 40 2.2 nF 20 10 nF 4.7 nF 60 40 2.2 nF 1 nF 20 1 nF 470 pF 0 470 pF 0 500 K 1M 1.5 M 0 2M 0 f - Frequency − Hz 500 K 1.5 M 2M f - Frequency − Hz Figure 4.

Figure 5.
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UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 SGLS274F – SEPTEMBER 2008 – REVISED SEPTEMBER 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) SUPPLY CURRENT vs SUPPLY VOLTAGE (CLOAD = 4.7 nF) SUPPLY CURRENT vs SUPPLY VOLTAGE (CLOAD = 2.2 nF) 90 160 80 140 2 MHz 70 IDD − Supply Current − mA IDD − Supply Current − mA 120 60 50 1 MHz 40 30 500 kHz 20 2 MHz 100 1 MHz 80 60 500 kHz 40 200 kHz 200 kHz 10 20 100/50 kHz 0 100 kHz 50/20 kHz 0 4 6 8 10 12 14 16 4 9 Figure 8.

Figure 9.
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UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 www.ti.com SGLS274F – SEPTEMBER 2008 – REVISED SEPTEMBER 2012 TYPICAL CHARACTERISTICS (continued) SUPPLY CURRENT vs SUPPLY VOLTAGE (UCC27425-Q1) 0.75 0.70 Input = VDD 0.60 0.55 ns IDD - Supply Current - mA 0.65 0.50 Input = 0 V 0.45 0.40 0.35 0.30 4 6 8 10 12 14 16 VDD - Supply Voltage - V Figure 13.

ns ns Figure 12. Figure 14.

Copyright © 2008–2012, Texas Instruments Incorporated Figure 15.
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UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 SGLS274F – SEPTEMBER 2008 – REVISED SEPTEMBER 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) DELAY TIME (tD2) vs SUPPLY VOLTAGE (UCC27423) DELAY TIME (tD1) vs SUPPLY VOLTAGE (UCC27423) 30 38 28 36 10 nF 34 10 nF 24 22 td2 − Delay Time − ns td1 − Delay Time − ns 26 4.7 nF 20 18 2.2 nF 16 32 4.7 nF 30 28 2.2 nF 26 470 pF 24 1 nF 470 pF 14 22 1 nF 12 20 4 6 8 10 12 14 4 16 6 8 VDD − Supply Voltage − V Figure 16.
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UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 www.ti.com SGLS274F – SEPTEMBER 2008 – REVISED SEPTEMBER 2012 TYPICAL CHARACTERISTICS (continued) OUTPUT BEHAVIOR vs SUPPLY VOLTAGE (INVERTING) OUTPUT BEHAVIOR vs SUPPLY VOLTAGE (INVERTING) IN = GND ENBL = VDD VDD − Supply Voltage − V 1 V/div VDD − Supply Voltage − V 1 V/div IN = GND ENBL = VDD VDD VDD OUT 0V 0V OUT 10 nF Between Output and GND 50 µs/div 10 nF Between Output and GND 50 µs/div Figure 20.

Figure 21.
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UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 SGLS274F – SEPTEMBER 2008 – REVISED SEPTEMBER 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) OUTPUT BEHAVIOR vs VDD (NONINVERTING) OUTPUT BEHAVIOR vs VDD (NONINVERTING) IN = VDD ENBL = VDD VDD − Supply Voltage − V 1 V/div VDD − Supply Voltage − V 1 V/div IN = VDD ENBL = VDD VDD VDD OUT OUT 0V 0V 10 nF Between Output and GND 50 µs/div 10 nF Between Output and GND 50 µs/div Figure 24.

Figure 25.
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UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 www.ti.com SGLS274F – SEPTEMBER 2008 – REVISED SEPTEMBER 2012 TYPICAL CHARACTERISTICS (continued) INPUT THRESHOLD vs TEMPERATURE VON − Input Threshold Voltage − V 2.0 1.9 VDD = 15 V 1.8 1.7 1.6 1.5 VDD = 10 V VDD = 4.5 V 1.4 1.3 1.2 −50 −25 0 25 50 75 100 125 TJ − Temperature − °C Figure 28.
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UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 SGLS274F – SEPTEMBER 2008 – REVISED SEPTEMBER 2012 www.ti.com APPLICATION INFORMATION General Information High frequency power supplies often require high-speed, high-current drivers such as the UCC27423Q1/UCC27424-Q1. A leading application is the need to provide a high power buffer stage between the PWM output of the control IC and the gates of the primary power MOSFET or IGBT switching devices.
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UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 www.ti.com SGLS274F – SEPTEMBER 2008 – REVISED SEPTEMBER 2012 Two circuits are used to test the current capabilities of the UCC27423-Q1 driver. In each case external circuitry is added to clamp the output near 5 V while the IC is sinking or sourcing current. An input pulse of 250 ns is applied at a frequency of 1 kHz in the proper polarity for the respective test.
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UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 SGLS274F – SEPTEMBER 2008 – REVISED SEPTEMBER 2012 www.ti.com In a large majority of applications it is advantageous that the turn-off capability of a driver is stronger than the turn-on capability. This helps to ensure that the MOSFET is held OFF during common power supply transients which may turn the device back ON. Parallel Outputs The A and B drivers may be combined into a single driver by connecting the INA/INB inputs together and the OUTA/OUTB outputs together.
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UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 www.ti.com SGLS274F – SEPTEMBER 2008 – REVISED SEPTEMBER 2012 In a power driver operating at high frequency, it is a significant challenge to get clean waveforms without much overshoot/undershoot and ringing. The low output impedance of these drivers produces waveforms with high di/dt. This tends to induce ringing in the parasitic inductances. Utmost care must be used in the circuit layout. It is advantageous to connect the driver IC as close as possible to the leads.
PAGE 18
UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 SGLS274F – SEPTEMBER 2008 – REVISED SEPTEMBER 2012 www.ti.com The switching load presented by a power MOSFET can be converted to an equivalent capacitance by examining the gate charge required to switch the device. This gate charge includes the effects of the input capacitance plus the added charge needed to swing the drain of the device between the ON and OFF states.
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UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 www.ti.com SGLS274F – SEPTEMBER 2008 – REVISED SEPTEMBER 2012 REVISION HISTORY Changes from Revision E (July, 2012) to Revision F Page • Removed the package column in the ordering information table ......................................................................................... 2 • Changed the word terminal to pin per new standards ..........................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Mar-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device UCC27423QDGNRQ1 Package Package Pins Type Drawing MSOPPower PAD SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 UCC27423QDRQ1 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC27424QDGNRQ1 MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Mar-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC27423QDGNRQ1 MSOP-PowerPAD DGN 8 2500 367.0 367.0 35.0 UCC27423QDRQ1 SOIC D 8 2500 340.5 338.1 20.6 UCC27424QDGNRQ1 MSOP-PowerPAD DGN 8 2500 367.0 367.0 35.0 UCC27424QDRQ1 SOIC D 8 2500 340.5 338.1 20.6 UCC27425QDRQ1 SOIC D 8 2500 340.5 338.1 20.
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