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UCC27511

UCC27512

www.ti.com

SLUSAW9E –FEBRUARY 2012–REVISED DECEMBER 2013

Single-Channel High-Speed Low-Side Gate Driver

(with 4-A Peak Source and 8-A Peak Sink)

Check for Samples: UCC27511, UCC27512

FEATURES

APPLICATIONS

• Low-Cost Gate-Driver Device Offering Superior • Switch-Mode Power Supplies

Replacement of NPN and PNP Discrete

• DC-to-DC Converters

Solutions

• Companion Gate-Driver Devices for Digital

• 4-A Peak Source and 8-A Peak Sink

Power Controllers

Asymmetrical Drive

• Solar Power, Motor Control, UPS

• Strong Sink Current Offers Enhanced

• Gate Driver for Emerging Wide Band-Gap

Immunity Against Miller Turnon

Power Devices (such as GaN)

• Split Output Configuration (allows easy and

independent adjustment of turnon and turnoff

DESCRIPTION

speeds) in the UCC27511

The UCC27511 and UCC27512 single-channel high-

• Fast Propagation Delays (13-ns typical)

speed low-side gate-driver device is capable of

effectively driving MOSFET and IGBT power

• Fast Rise and Fall Times (9-ns and 7-ns

switches. Using a design that inherently minimizes

typical)

shoot-through current, UCC27511 and UCC27512

• 4.5 to 18-V Single Supply Range

are capable of sourcing and sinking high peak-current

• Outputs Held Low During VDD UVLO (ensures

pulses into capacitive loads offering rail-to-rail drive

capability and extremely small propagation delay

glitch-free operation at power up and power

typically 13 ns.

down)

• TTL and CMOS Compatible Input-Logic

The UCC27511 and UCC27512 provides 4-A source,

8-A sink (asymmetrical drive) peak-drive current

Threshold, (independent of supply voltage)

capability. Strong sink capability in asymmetrical drive

• Hysteretic-Logic Thresholds for High-Noise

boosts immunity against parasitic, Miller turnon effect.

Immunity

The UCC27511 device also features a unique split

• Dual-Input Design (choice of an inverting (IN-

output configuration where the gate-drive current is

pin) or non-inverting (IN+ pin) driver

sourced through OUTH pin and sunk through OUTL

configuration)

pin. This unique pin arrangement allows the user to

apply independent turnon and turnoff resistors to the

– Unused Input Pin can be Used for Enable

OUTH and OUTL pins respectively and easily control

or Disable Function

the switching slew rates.

• Output Held Low when Input Pins are Floating

UCC27511 and UCC27512 are designed to operate

• Input Pin Absolute Maximum Voltage Levels

over a wide VDD range of 4.5 to 18 V and wide

Not Restricted by VDD Pin Bias Supply

temperature range of –40°C to +140°C. Internal

Voltage

Undervoltage Lockout (UVLO) circuitry on VDD pin

• Operating Temperature Range of –40°C to

holds output low outside VDD operating range. The

+140°C

capability to operate at low voltage levels such as

below 5 V, along with best-in-class switching

• 6-Pin DBV (SOT-23) and 6-Pin DRS (3mm × 3

characteristics, is especially suited for driving

mm WSON with exposed thermal pad)

emerging wide band-gap power-switching devices

Package Options

such as GaN power-semiconductor devices.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (33 pages)

PAGE 1
UCC27511 UCC27512 www.ti.
PAGE 2
UCC27511 UCC27512 SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 www.ti.com TYPICAL APPLICATION DIAGRAMS Non-Inverting Input V+ Non-Inverting Input VSOURCE VSOURCE C2 4.5 V to 18 V L1 L1 UCC27511 UCC27512 D1 IN+ 6 IN+ VDD D1 1 VOUT IN+ 1 IN+ IN- 6 VOUT Q1 Q1 R1 5 IN- OUTH 2 + 4 GND OUTL 2 GND GND 5 3 VDD OUT 4 + 4.5 V to 18 V C1 R2 C1 R3 3 V+ C2 Inverting Input Inverting Input V+ VSOURCE VSOURCE C2 4.
PAGE 3
UCC27511 UCC27512 www.ti.com SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
PAGE 4
UCC27511 UCC27512 SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) (2) (3) over operating free-air temperature range (unless otherwise noted) Supply voltage range VDD OUTH voltage, (UCC27511) MIN MAX -0.3 20 -0.3 VDD + 0.3 DC OUTL voltage, (UCC27511) Repetitive pulse less than 200 ns (4) DC OUT voltage, (UCC27512) -0.3 20 -2 20 -2 VDD + 0.3 Output continuous current (OUTH source current and OUTL sink current) 0.3 IOUT_DC (sink) 0.
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UCC27511 UCC27512 www.ti.com SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN TYP Supply voltage range, VDD 4.5 12 18 V Operating junction temperature range -40 140 °C 0 18 V Input voltage, IN+ and IN- MAX UNIT THERMAL INFORMATION UCC27511 THERMAL METRIC SOT-23 (DBV) 6 PINS UCC27512 (1) WSON 6 PINS θJA Junction-to-ambient thermal resistance (2) 217.8 85.
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UCC27511 UCC27512 SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 www.ti.com ELECTRICAL CHARACTERISTICS VDD = 12 V, TA = TJ = -40°C to 140°C, 1-µF capacitor from VDD to GND. Currents are positive into, negative out of the specified terminal. PARAMETER TEST CONDITION MIN TYP MAX IN+ = VDD, IN- = GND 40 100 160 IN+ = IN- = GND or IN+ = IN- = VDD 25 75 145 IN+ = GND, IN- = VDD 20 60 115 TA = 25°C 3.91 4.20 4.5 TA = -40°C to 140°C 3.70 4.20 4.
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UCC27511 UCC27512 www.ti.com SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 ELECTRICAL CHARACTERISTICS (continued) VDD = 12 V, TA = TJ = -40°C to 140°C, 1-µF capacitor from VDD to GND. Currents are positive into, negative out of the specified terminal. PARAMETER TEST CONDITION MIN TYP MAX 8 12 16 22 VDD = 12 V CLOAD = 1.8 nF, connected to OUTH and OUTL pins tied together 7 11 VDD=4.5V CLOAD = 1.8 nF 7 11 UNITS Switching Time tR Rise time (3) VDD = 12 V CLOAD = 1.
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UCC27511 UCC27512 SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 www.ti.com High INPUT (IN- pin) Low High IN+ pin Low 90% OUTPUT 10% tD2 tf tD2 tr Figure 2. Inverting Configuration (PWM Input to IN- Pin (IN+ Pin Tied To VDD), Output Represents OUTH And OUTL Pins Tied Together In The UCC27511) High INPUT (IN- pin) Low High ENABLE (IN+ pin) Low 90% OUTPUT 10% tD1 tr tD1 tf Figure 3.
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UCC27511 UCC27512 www.ti.
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UCC27511 UCC27512 SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 www.ti.com Table 3. UCC27511 TERMINAL FUNCTIONS TERMINAL I/O FUNCTION PIN NUMBER NAME 1 VDD I Bias supply input. 2 OUTH O Sourcing current output of driver. Connect resistor between OUTH and Gate of power-switching device to adjust turnon speed. 3 OUTL O Sinking current output of driver. Connect resistor between OUTL and Gate of power-switching device to adjust turnoff speed.
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UCC27511 UCC27512 www.ti.com SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 TYPICAL CHARACTERISTICS START-UP CURRENT vs TEMPERATURE OPERATING SUPPLY CURRENT vs TEMPERATURE (Output Switching) 0.12 4 IN+=Low,IN−=Low IN+=High, IN−=Low 3.5 0.1 IDD (mA) Startup Current (mA) 0.11 0.09 0.08 0.07 VDD = 3.4 V 0.05 −50 0 50 Temperature (°C) 100 2 −50 150 0 G001 50 Temperature (°C) 100 150 G013 Figure 5. Figure 6.
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UCC27511 UCC27512 SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) OUTPUT PULL-DOWN RESISTANCE vs TEMPERATURE RISE TIME vs TEMPERATURE 8 VDD = 12 V CLoad = 1.8 nF ROL 0.7 7 Rise Time (ns) Output Pull−Down Resistance (Ω) 0.8 0.5 0.3 5 VDD = 12 V Iout = 10 mA 0.
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UCC27511 UCC27512 www.ti.com SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 TYPICAL CHARACTERISTICS (continued) RISE TIME vs SUPPLY VOLTAGE FALL TIME vs SUPPLY VOLTAGE 20 10 Fall Time (ns) Rise Time (ns) 8 15 10 6 4 5 0 4 8 12 Supply Voltage (V) 16 20 2 0 G008 Figure 17. 4 8 12 Supply Voltage (V) 16 20 G009 Figure 18. APPLICATION INFORMATION Introduction High-current gate-driver devices are required in switching-power applications for a variety of reasons.
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UCC27511 UCC27512 SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 www.ti.com UCC2751x Product Family The UCC2751x family of gate-driver products (Table 6) represent Texas Instruments’ latest generation of singlechannel low-side high-speed gate-driver devices featuring high-source/sink current capability, industry best-inclass switching characteristics and a host of other features (Table 7) all of which combine to ensure efficient, robust and reliable operation in high-frequency switching power circuits.
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UCC27511 UCC27512 www.ti.com SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 Typical Application Diagram Typical application diagrams of UCC27511 and UCC27512 devices are shown below illustrating use in noninverting and inverting driver configurations. The UCC27511 device features a unique split output configuration where the gate-drive current is sourced through OUTH pin and sunk through OUTL pin.
PAGE 16
UCC27511 UCC27512 SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 www.ti.com VDD and Undervoltage Lockout The UCC2751X devices have internal Undervoltage LockOut (UVLO) protection feature on the VDD pin supply circuit blocks. Whenever the driver is in UVLO condition (for example when VDD voltage less than VON during power up and when VDD voltage is less than VOFF during power down), this circuit holds all outputs LOW, regardless of the status of the inputs. The UVLO is typically 4.
PAGE 17
UCC27511 UCC27512 www.ti.com SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 Input Stage The input pins of the UCC27511 and UCC27512 devices are based on a TTL/CMOS compatible input-threshold logic that is independent of the VDD supply voltage. With typically high threshold = 2.2 V and typically low threshold = 1.2 V, the logic-level thresholds can be conveniently driven with PWM control signals derived from 3.3-V and 5-V digital-power controllers.
PAGE 18
UCC27511 UCC27512 SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 www.ti.com Enable Function As mentioned earlier, an enable/disable function is easily implemented in UCC27511 and UCC27512 using the unused input pin. When IN+ is pulled down to GND or IN- is pulled down to VDD, the output is disabled. Thus IN+ pin can be used like an enable pin that is based on active-high logic, while IN- can be used like an enable pin that is based on active-low logic.
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UCC27511 UCC27512 www.ti.com SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 VDS VIN Miller Turn-On Spike in VGS CGD Gate Driver RG COSS ISNK OUTL VTH VGS of MOSFET ON OFF CGS VIN ROL VDS of MOSFET Figure 24. Very Low Pull-Down Impedance In UCC27511, 4-A/8-A Asymmetrical Drive (Output Stage Mitigates Miller Turnon Effect) Figure 25 and Figure 26 illustrate typical switching characteristics of UCC27511. Figure 25. Typical Turnon Waveform (VDD = 10 V, CL = 1 nF) Figure 26.
PAGE 20
UCC27511 UCC27512 SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 www.ti.com Power Dissipation Power dissipation of the gate driver has two portions as shown in Equation 1. PDISS = PDC + PSW (1) The DC portion of the power dissipation is PDC = IQ x VDD where IQ is the quiescent current for the driver.
PAGE 21
UCC27511 UCC27512 www.ti.com SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 Low Propagation Delays The UCC27511 and UCC27512 driver devices feature best-in-class input-to-output propagation delay of 13 ns (typ) at VDD = 12 V, which promises the lowest level of pulse transmission distortion available from industrystandard gate-driver devices for high-frequency switching applications.
PAGE 22
UCC27511 UCC27512 SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 www.ti.com PCB Layout Proper PCB layout is extremely important in a high-current fast-switching circuit to provide appropriate device operation and design robustness. The UCC27511 and UCC27512 gate driver incorporates short-propagation delays and powerful output stages capable of delivering large current peaks with very fast rise and fall times at the gate of power switch to facilitate voltage transitions very quickly.
PAGE 23
UCC27511 UCC27512 www.ti.com SLUSAW9E – FEBRUARY 2012 – REVISED DECEMBER 2013 REVISION HISTORY Changes from Revision D (May 2013) to Revision E • Page Changed OUTL in the ABS Max Ratings table to show DC and Repetitive pulse values ................................................... 4 Changes from Revision C (June 2012) to Revision D • Page Added 0.05 to PSW equation in the Power Dissipation section. ..........................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 16-Oct-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
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PACKAGE MATERIALS INFORMATION www.ti.com 16-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ UCC27511DBVR SOT-23 3000 179.0 DBV 6 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) 8.4 3.2 3.2 1.4 4.0 W Pin1 (mm) Quadrant 8.0 Q3 UCC27511DBVT SOT-23 DBV 6 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 UCC27512DRSR SON DRS 6 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 16-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC27511DBVR SOT-23 DBV 6 3000 203.0 203.0 35.0 UCC27511DBVT SOT-23 DBV 6 250 203.0 203.0 35.0 UCC27512DRSR SON DRS 6 3000 367.0 367.0 35.0 UCC27512DRST SON DRS 6 250 210.0 185.0 35.
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