Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - gate drivers Inverting, Non-inverting High side, Low side, Sychronous SON 6 (2x2)

VDD

IN-

IN+

VREF

OUTH

OUTL

UCC27611

IN+

VOUT

VSOURCE

VREF

4.5 V to 18 V

Non-Inverting Input Inverting Input

VDD

IN-

IN+

VREF

OUTH

OUTL

UCC27611

VREF

VOUT

VSOURCE

VREF

4.5 V to 18 V

VDD

IN-

GND

UCC27611

www.ti.com

SLUSBA5B –DECEMBER 2012

4-A and 6-A High-Speed 5-V Drive, Optimized Single-Gate Driver

Check for Samples: UCC27611

FEATURES

APPLICATIONS

• Enhancement Mode Gallium Nitride FETs • Switch-Mode Power Supplies

(eGANFETs)

• DC-to-DC Converters

• 4.0-V to 18-V Single Supply Range VDD Range

• Synchronous Rectification

• Drive Voltage VREF Regulated to 5 V

• Solar Inverters, Motor Control, UPS

• 4-A Peak Source and 6-A Peak Sink Drive

• Envelope Tracking Power Supplies

Current

• 1-Ω and 0.35-Ω Pull-Up and Pull-Down DESCRIPTION

Resistance (maximize high slew-rate dV and dt

The UCC27611 is a single-channel, high-speed, gate

immunity)

driver optimized for 5-V drive, specifically addressing

enhancement mode GaN FETs. The drive voltage

• Split Output Configuration (allows turn-on and

VREF is precisely controlled by internal linear

off optimization for individual FETs)

regulator to 5 V. The UCC27611 offers asymmetrical

• Fast Propagation Delays (14-ns typical)

rail-to-rail peak current drive capability with 4-A

• Fast Rise and Fall Times (9-ns and 4-ns

source and 6-A sink. Split output configuration allows

individual turn-on and off time optimization depending

typical)

on FET. Package and pinout with minimum parasitic

• TTL and CMOS Compatible Inputs

inductances reduce the rise and fall time and limit the

(independent of supply voltage allow easy

ringing. Additionally, the short propagation delay with

interface to digital and analog controllers)

minimized tolerances and variations allows efficient

• Dual Input Design offering Drive Flexibility

operation at high frequencies. The 2-Ω and 0.3-Ω

(both inverting and non-inverting

pull-up and pull-down resistance boosts immunity to

hard switching with high slew rate dV and dt.

configurations)

• Output Held Low when Inputs are Floating

The independence from VDD input signal thresholds

ensure TTL and CMOS low-voltage logic

• VDD Under Voltage Lockout (UVLO)

compatibility. For safety reason when the input pins

• Optimized Pinout Compatible with eGANFET

are in a floating condition, the internal input pull-up

Footprint for Easy Layout

and down resistors hold the output LOW. Internal

• 2 mm x 2 mm WSON-6 Package with Exposed

circuitry on VREF pin provides an under voltage

Thermal and Ground Pad, (minimized parasitic

lockout function that holds output LOW until VREF

supply voltage is within operating range. UCC27611

inductances to reduce gate ringing)

is offered in a small 2 mm x 2 mm WSON-6 package

• Operating Temperature Range of -40°C to

(DRV) with exposed thermal and ground pad which

140°C

improves the package power handling capability. The

UCC27611 operates over wide temperature range

from -40°C to 140°C.

Typical Application Diagram

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (28 pages)

PAGE 1
UCC27611 www.ti.com SLUSBA5B – DECEMBER 2012 4-A and 6-A High-Speed 5-V Drive, Optimized Single-Gate Driver Check for Samples: UCC27611 FEATURES APPLICATIONS • • • • • • 1 • • • • • • • • • • • • • • Enhancement Mode Gallium Nitride FETs (eGANFETs) 4.0-V to 18-V Single Supply Range VDD Range Drive Voltage VREF Regulated to 5 V 4-A Peak Source and 6-A Peak Sink Drive Current 1-Ω and 0.
PAGE 2
UCC27611 SLUSBA5B – DECEMBER 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
PAGE 3
UCC27611 www.ti.com SLUSBA5B – DECEMBER 2012 RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN NOM 12 VDD Supply voltage range, 4.0 TJ Operating junction temperature range -40 MAX IN+, IN- resistance range IN Input voltage 0 UNIT 18 V +140 °C 100 kΩ 18 V THERMAL INFORMATION UCC27611 THERMAL METRIC (1) DRV UNITS 6 PINS Junction-to-ambient thermal resistance (2) θJA 80.
PAGE 4
UCC27611 SLUSBA5B – DECEMBER 2012 www.ti.com ELECTRICAL CHARACTERISTICS VDD = 12 V, TA = TJ = -40°C to 140°C, 2-µF capacitor from VDD to GND and from VREF to GND. Currents are positive into, negative out of the specified terminal. OUTH and OUTL are tied together. (unless otherwise noted) (1) PARAMETER CONDITION MIN TYP MAX UNITS Bias Current IDD(off) VDD = 3.0, IN+ = VDD, IN- = GND Startup current 100 180 75 160 3.55 3.8 4.15 3.3 3.55 3.
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UCC27611 www.ti.com SLUSBA5B – DECEMBER 2012 Timing Diagrams (OUTH tied to OUTL) High Input Low 90% 10% 90% Output 10% t D1 tR tF t D2 Figure 1. Non-Inverting Configuration (input = IN+ and output = OUT (IN- = GND)) High Input Low 90% 10% 90% Output 10% t D1 tF t D2 tR Figure 2.
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UCC27611 SLUSBA5B – DECEMBER 2012 www.ti.com Typical Timing Waveforms Figure 3. Output Rising (Ch1 = IN+, Ch2 = OUTPUT) Figure 4.
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UCC27611 www.ti.com SLUSBA5B – DECEMBER 2012 DEVICE INFORMATION Block Diagram IN+ VREF 3 VDD IN- 2 6 VREF 5 OUTH 4 OUTL VDD VDD 1 VREF VREF LDO UVLO 7 GND DRV Package (Top view) VDD 1 IN- 2 IN+ 3 GND PAD Pin 7 6 VREF 5 OUTH 4 OUTL Figure 5.
PAGE 8
UCC27611 SLUSBA5B – DECEMBER 2012 www.ti.com TERMINAL FUNCTIONS TERMINAL NAME NO. I/O DESCRIPTION VDD 1 I Bias supply input. Connect a 2-µf ceramic capacitor minimum from this pin to the GND pin as close as possible to the device with the shortest trace lengths possible. IN- 2 I Inverting input. Pull IN+ to VDD in order to enable Output, when using the driver device in Inverting configuration. IN+ 3 I Non-inverting input.
PAGE 9
UCC27611 www.ti.com SLUSBA5B – DECEMBER 2012 TYPICAL CHARACTERISTICS 18 IN+ Propagation Delay (ns) VREF (V) 5 4.9 Turn−On Turn−Off 16 14 12 10 VDD = 12 V 4.8 −50 0 50 Temperature (°C) 100 8 −50 150 0 G001 Figure 6. Reference Voltage vs. Temperature 100 150 G001 Figure 7. IN+ Propagation Delay 0.4 20 Turn−On Turn−Off UVLO Hysterisis 18 UVLO Hystersis (V) IN− Propagation Delay (ns) 50 Temperature (°C) 16 14 0.3 12 VDD = 12 V 10 −50 0 50 Temperature (°C) 100 0.
PAGE 10
UCC27611 SLUSBA5B – DECEMBER 2012 www.ti.com APPLICATION INFORMATION Introduction High-current gate driver devices are required in switching power applications for a variety of reasons. In order to effect fast switching of power devices and reduce associated switching power losses, a powerful gate driver can be employed between the PWM output of controllers and the gates of the power semiconductor devices.
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UCC27611 www.ti.com SLUSBA5B – DECEMBER 2012 4.5 V to 18 V VREF VSOURCE VDD C3 C2 L1 UCC27611 D1 VDD 1 VREF 6 VOUT Q1 R1 2 IN- OUTH 5 + C1 R2 IN+ 3 OUTL IN+ 4 Figure 12. Power Up (non-inverting drive) 4.5 V to 18 V VREF VSOURCE VDD C3 C2 L1 UCC27611 D1 1 VDD VREF 6 VOUT Q1 R1 IN- 2 IN- OUTH 5 + R2 VREF 3 IN+ OUTL C1 4 Figure 13.
PAGE 12
UCC27611 SLUSBA5B – DECEMBER 2012 www.ti.com Operating Supply Current The UCC27611 feature very low quiescent IDD current. The total supply current is the sum of the quiescent IDD current, the average IOUT current due to switching and finally any current related to pull-up resistors on the unused input pin. For example when the inverting input pin is pulled low additional current is drawn from VDD supply through the pull-up resistors (refer to DEVICE INFORMATION for the device Block Diagram).
PAGE 13
UCC27611 www.ti.com SLUSBA5B – DECEMBER 2012 Enable Function As mentioned earlier, an enable and disable function can be easily implemented in UCC27611 using the unused input pin. When IN+ is pulled down to GND or IN- is pulled down to VDD, the output is disabled. Thus IN+ pin can be used like an enable pin that is based on active high logic, while IN- can be used like an enable pin that is based on active low logic. Output Stage The output stage of the UCC27611 device is illustrated in Figure 14.
PAGE 14
UCC27611 SLUSBA5B – DECEMBER 2012 www.ti.com An example of a situation where Miller turn on is a concern is synchronous rectification (SR). In SR application, the dV and dt occurs on MOSFET drain when the MOSFET is already held in off state by the gate driver. The current discharging the CGD Miller capacitance during this dV and dt is shunted by the pull-down stage of the driver.
PAGE 15
UCC27611 www.ti.com SLUSBA5B – DECEMBER 2012 Power Dissipation Power dissipation of the gate driver has two portions as shown in equation below: PDISS ´ PDC + PSW (1) The DC portion of the power dissipation is PDC = IQ x VDD where IQ is the quiescent current for the driver.
PAGE 16
UCC27611 SLUSBA5B – DECEMBER 2012 www.ti.com Low Propagation Delays The UCC27611 driver devices feature best-in-class input-to-output propagation delay of 13 ns (typ) at VDD = 12 V. This promises the lowest level of pulse transmission distortion available from industry standard gate driver devices for high-frequency switching applications.
PAGE 17
UCC27611 www.ti.com SLUSBA5B – DECEMBER 2012 The alternate method would be to add a loading resistor to VREF to bleed off the charge. This method eliminates the additional voltage drop from the diode but, reduces the current available for additional circuits or gate drive if too small a value of resistor is used. C1 R2 UCC27611 1 VDD VREF 6 2 IN- OUTH 5 3 IN+ OUTL 4 Q1 R1 PWRPAD 7 Figure 17.
PAGE 18
UCC27611 SLUSBA5B – DECEMBER 2012 www.ti.com 5 5.5 5.4 VREF (V) VREF (V) 5.3 5.2 5.1 4.9 5 4.9 4.8 5 10 15 20 VIN (V) 25 30 4.8 35 5 15 25 G001 Figure 19. Reference Voltage vs. Input Voltage (VREF(cap) Charging) 35 VIN (V) 45 55 65 G001 Figure 20. Reference Voltage vs. Input Voltage (VREF(cap) not charging, Schottky diode on OUTH) 12 VREF Load (mA) 10 8 6 4 2 0 15 25 35 45 VIN (V) 55 65 G001 Figure 21. Reference Voltage Load Current vs.
PAGE 19
UCC27611 www.ti.com SLUSBA5B – DECEMBER 2012 Thermal Information The useful range of a driver is greatly affected by the drive power requirements of the load and the thermal characteristics of the package. In order for a gate driver to be useful over a particular temperature range the package must allow for the efficient removal of the heat produced while keeping the junction temperature within rated limits.
PAGE 20
UCC27611 SLUSBA5B – DECEMBER 2012 www.ti.com PCB Layout Recommendation Proper PCB layout is extremely important in a high-current, fast-switching circuit to provide appropriate device operation and design robustness. The UCC27611 gate driver incorporates short-propagation delays and powerful output stages capable of delivering large current peaks with very fast rise and fall times at the gate of power switch to facilitate voltage transitions very quickly.
PAGE 21
UCC27611 www.ti.com SLUSBA5B – DECEMBER 2012 REVISION HISTORY Changes from Original (December 2012) to Revision A • Page Changed marketing status from Product Preview to Production Data. ................................................................................ 1 Changes from Revision A (December, 2012) to Revision B • Page Added ELECTRICAL CHARACTERISTICS Inputs (IN+, IN-) section values. .....................................................................
PAGE 22
PACKAGE OPTION ADDENDUM www.ti.
PAGE 23
PACKAGE MATERIALS INFORMATION www.ti.com 7-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant UCC27611DRVR SON DRV 6 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 UCC27611DRVT SON DRV 6 250 180.0 8.4 2.3 2.3 1.15 4.0 8.
PAGE 24
PACKAGE MATERIALS INFORMATION www.ti.com 7-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC27611DRVR SON DRV 6 3000 210.0 185.0 35.0 UCC27611DRVT SON DRV 6 250 210.0 185.0 35.
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