Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - gate drivers Inverting Low side MSOP 8 PowerPad

UDG-- 01112

OUT

VDD

3ENBL

VDD8

INVERTING

NON--

INVERTING

PGND

6 OU T

4AGND

VDD

INVERTING

UCC37321

0 0 0

0 1 0

0 11

1 1 0

NON--

INVERTING

UCC37322

0 0 0

0 1 0

0 0

1 1 1

ENBL IN OUT

INPUT/OUTPUT TABLE

ENBL

100 kΩ

UCC27321 , UCC27322

UCC37321, UCC37322

www.ti.com

SLUS504G –SEPTEMBER 2002–REVISED MAY 2013

SINGLE 9-A HIGH SPEED LOW- SIDE MOSFET DRIVER WITH ENABLE

Check for Samples: UCC27321 , UCC27322, UCC37321, UCC37322

FEATURES

APPLICATIONS

• Industry-Standard Pin-Out With Addition of

• Switch Mode Power Supplies

Enable Funtion

• DC/DC Converters

• High-Peak Current Drive Capability of ±9 A at

• Motor Controllers

the Miller Plateau Region Using TrueDrive

• Class-D Switching Amplifiers

• Efficient Constant Current Sourcing Using a

• Line Drivers

Unique BiPolar & CMOS Output Stage

• Pulse Transformer Driver

• TTL/CMOS Compatible Inputs Independent

of Supply Voltage

DESCRIPTION

• 20-ns Typical Rise and Fall Times with 10-nF

The UCC37321/2 family of high-speed drivers deliver

Load

9 A of peak drive current in an industry standard

pinout. These drivers can drive the largest of

• Typical Propagation Delay Times of 25 ns

MOSFETs for systems requiring extreme Miller

With Input Falling and 35 ns with Input

current due to high dV/dt transitions. This eliminates

Rising

additional external circuits and can replace multiple

• 4-V to 15-V Supply Voltage

components to reduce space, design complexity and

• Available in Thermally Enhanced MSOP

assembly cost. Two standard logic options are

PowerPAD™ Package With 4.7°C/W θjc

offered, inverting (UCC37321) and noninverting

(UCC37322).

• Rated From –40°C to 105°C

• Pb-Free Finish (NiPdAu) on SOIC-8 and

PDIP-8 Packages

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2PowerPAD is a trademark of Texas Instruments, Incorporated.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (31 pages)

PAGE 1
UCC27321 , UCC27322 UCC37321, UCC37322 www.ti.
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UCC27321 , UCC27322 UCC37321, UCC37322 SLUS504G – SEPTEMBER 2002 – REVISED MAY 2013 www.ti.com DESCRIPTION (CONTINUED) Using a design that inherently minimizes shoot-through current, the outputs of these can provide high gate drive current where it is most needed at the Miller plateau region during the MOSFET switching transition. A unique hybrid output stage paralleling bipolar and MOSFET transistors (TrueDrive) allows efficient current delivery at low supply voltages.
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UCC27321 , UCC27322 UCC37321, UCC37322 www.ti.com SLUS504G – SEPTEMBER 2002 – REVISED MAY 2013 ELECTRICAL CHARACTERISTICS VDD = 4.
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UCC27321 , UCC27322 UCC37321, UCC37322 SLUS504G – SEPTEMBER 2002 – REVISED MAY 2013 www.ti.com (a) ( b) 5V IN VTH 0V tD1 VTH IN VTH tD2 VTH tD1 tD2 tF VDD 80% 80% 80% tR OUT 80% tR OUT 20% tF 20% 0V A. The 20% and 80% thresholds depict the dynamics of the BiPolar output devices that dominate the power MOSFET transition through the Miller regions of operation. Figure 1.
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UCC27321 , UCC27322 UCC37321, UCC37322 www.ti.com SLUS504G – SEPTEMBER 2002 – REVISED MAY 2013 PIN CONFIGURATIONS PDIP (P) PACKAGE (TOP VIEW) VDD IN ENBL AGND 1 8 2 7 3 6 4 5 SOIC (D) OR MSOP (DGN) PACKAGE (TOP VIEW) VDD OUT OUT PGND VDD IN ENBL AGND 1 8 2 7 3 6 4 5 VDD OUT OUT PGND POWER DISSIPATION RATING TABLE PACKAGE SUFFIX θjc (°C/W) θja (°C/W) Power Rating (mW) TA = 70°C (1) Derating Factor Above 70°C (mW/°C) (1) SOIC-8 D 42 84 – 160 (2) 344 – 655 (2) 6.25 – 11.
PAGE 6
UCC27321 , UCC27322 UCC37321, UCC37322 SLUS504G – SEPTEMBER 2002 – REVISED MAY 2013 www.ti.com APPLICATION INFORMATION General Information The UCC37321 and UCC37322 drivers serve as an interface between low-power controllers and power MOSFETs. They can also be used as an interface between DSPs and power MOSFETs. High-frequency power supplies often require high-speed, high-current drivers such as the UCC37321/2 family.
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UCC27321 , UCC27322 UCC37321, UCC37322 www.ti.com SLUS504G – SEPTEMBER 2002 – REVISED MAY 2013 Output Stage The TrueDrive output stage is capable of supplying ±9-A peak current pulses and swings to both VDD and GND and can encourage even themost stubborn MOSFETs to switch. The pull-up/pull-down circuits of the driver are constructed of bipolar and MOSFET transistors in parallel. The peak output current rating is the combined current from the bipolar and MOSFET transistors.
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UCC27321 , UCC27322 UCC37321, UCC37322 SLUS504G – SEPTEMBER 2002 – REVISED MAY 2013 www.ti.com The circuit in Figure 4 is utilized to test the current source capability with the output clamped to around 5 V with a string of Zener diodes. The UCC37321 is found to source 9 A at VDD = 15 V. VDD UCC37321 INPUT 1 VDD DD V IN OUT 8 DSCHOTTKY 2 7 C2 1μ F OUT 3 ENBL 4 AGND 6 C3 100 μF 4.5 V DADJ PGND 5 VSNS 1μ F CER 100 μF AL EL RSNS 0.1 Ω UDG-- 01114 Figure 4.
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UCC27321 , UCC27322 UCC37321, UCC37322 www.ti.com SLUS504G – SEPTEMBER 2002 – REVISED MAY 2013 VDD Although quiescent VDD current is very low, total supply current will be higher, depending on OUTA and OUTB current and the operating frequency. Total VDD current is the sum of quiescent VDD current and the average OUT current.
PAGE 10
UCC27321 , UCC27322 UCC37321, UCC37322 SLUS504G – SEPTEMBER 2002 – REVISED MAY 2013 www.ti.com The switching load presented by a power MOSFETcan be converted to an equivalent capacitance by examining the gate charge required to switch the device. This gate charge includes the effects of the input capacitance plus the added charge needed to swing the drain of the device between the ON and OFF states.
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UCC27321 , UCC27322 UCC37321, UCC37322 www.ti.com SLUS504G – SEPTEMBER 2002 – REVISED MAY 2013 THERMAL INFORMATION The useful range of a driver is greatly affected by the drive power requirements of the load and the thermal characteristics of the device package. In order for a power driver to be useful over a particular temperature range the package must allow for the efficient removal of the heat produced while keeping the junction temperature within rated limits.
PAGE 12
UCC27321 , UCC27322 UCC37321, UCC37322 SLUS504G – SEPTEMBER 2002 – REVISED MAY 2013 www.ti.
PAGE 13
UCC27321 , UCC27322 UCC37321, UCC37322 www.ti.com SLUS504G – SEPTEMBER 2002 – REVISED MAY 2013 TYPICAL CHARACTERICTICS (continued) RISE TIME vs SUPPLY VOLTAGE FALL TIME vs SUPPLY VOLTAGE 70 70 C LOAD = 10 nF CLOAD = 10 n F 60 60 tA = – 40°C 50 tR – Fall Time – ns tR – Rise Time – ns 50 40 tA = 105°C tA = 25°C 30 40 30 tA = 105°C tA = 25°C 20 20 tA = 0°C 10 10 tA = 0°C tA = –40°C 0 0 4 6 8 10 12 14 4 16 VDD – Supply Voltage – V Figure 9.
PAGE 14
UCC27321 , UCC27322 UCC37321, UCC37322 SLUS504G – SEPTEMBER 2002 – REVISED MAY 2013 www.ti.com TYPICAL CHARACTERICTICS (continued) tD1 DELAY TIME vs SUPPLY VOLTAGE tD2 DELAY TIME vs SUPPLY VOLTAGE 70 70 CLOAD = 10 n F CLOAD = 10 n F tA = 105°C 60 60 tA = 25°C 50 50 tD2 – Delay Time -- ns tD1 -– Delay Time -- ns tA = 105°C tA = 25°C 40 30 20 40 30 tA = 0°C 20 tA = –40°C tA = –40°C 10 10 tA = 0°C 0 0 4 6 8 10 12 14 16 4 VDD – Supply Voltage – V Figure 13.
PAGE 15
UCC27321 , UCC27322 UCC37321, UCC37322 www.ti.com SLUS504G – SEPTEMBER 2002 – REVISED MAY 2013 TYPICAL CHARACTERICTICS (continued) PROPAGATION TIMES vs PEAK INPUT VOLTAGE INPUT THRESHOLD vs TEMPERATURE 2.0 50 45 VDD = 15 V CLOAD = 10 n F TA = 25°C tD2 VON – Input Threshold Voltage – V 40 Propagation Time -- ns tRISE 35 30 25 20 15 10 tFALL tD1 1.9 1.8 1.7 1.6 1.5 VDD = 10 V VDD = 4. 5 V 1.4 1.3 5 0 0 5 10 VIN(peak) – Peak Input Voltage – V 1.2 --50 15 -- 25 0 25 50 75 Figure 17.
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UCC27321 , UCC27322 UCC37321, UCC37322 SLUS504G – SEPTEMBER 2002 – REVISED MAY 2013 www.ti.com TYPICAL CHARACTERICTICS (continued) OUTPUT BEHAVIOR vs VDD (UCC37321) OUTPUT BEHAVIOR vs VDD (UCC37321) IN = GND ENBL = VDD VDD – Input Voltage – V 1 V/div VDD – Input Voltage – V 1 V/div IN = GND ENBL = V DD VDD OUT OUT 0V 0V VDD 10 nF Between Output and GND 50 μs/div 10 nF Between Output and GND 50 μs/div Figure 21. Figure 22.
PAGE 17
UCC27321 , UCC27322 UCC37321, UCC37322 www.ti.com SLUS504G – SEPTEMBER 2002 – REVISED MAY 2013 TYPICAL CHARACTERICTICS (continued) OUTPUT BEHAVIOR vs VDD (UCC37322) OUTPUT BEHAVIOR vs VDD (UCC37322) IN = VDD ENBL = VDD VDD – Input Voltage – V 1 V/div VDD – Input Voltage – V 1 V/div IN = VDD ENBL = VDD VDD VDD OUT OUT 0V 0V 10 nF Between Output and GND 50 μs/div Figure 25. 10 nF Between Output and GND 50 μs/div Figure 26.
PAGE 18
UCC27321 , UCC27322 UCC37321, UCC37322 SLUS504G – SEPTEMBER 2002 – REVISED MAY 2013 www.ti.com REVISION HISTORY DATE OF CHANGE DESCRIPTION OF CHANGE January, 2010 Updated AGND pin description. Changes from Revision F (March 2012) to Revision G Page • Changed minimum value for input voltage from –5 to –0.3 V in the Absolute Maximum Ratings table. ............................. 2 • Added CLOAD = 10 nF to Fall Time vs Supply Voltage graph ..............................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 22-May-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PAGE 23
PACKAGE MATERIALS INFORMATION www.ti.com 29-May-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device UCC27321DGNR Package Package Pins Type Drawing MSOPPower PAD SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 UCC27321DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC27322DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.
PAGE 24
PACKAGE MATERIALS INFORMATION www.ti.com 29-May-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC27321DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0 UCC27321DR SOIC D 8 2500 367.0 367.0 35.0 UCC27322DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0 UCC27322DR SOIC D 8 2500 367.0 367.0 35.0 UCC37321DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0 UCC37321DR SOIC D 8 2500 367.0 367.0 35.
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