Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - gate drivers Inverting Low side PDIP 8

OUTA

N/C

2INA

3GND

N/C8

INVERTING

NON-INVERTING

OUTB

INVERTING

NON-INVERTING

INB

6 VDD

UCC27323, UCC27324, UCC27325

UCC37323, UCC37324, UCC37325

www.ti.com

SLUS492H –JUNE 2001–REVISED MAY 2013

Dual 4-A Peak High-Speed Low-Side Power-MOSFET Drivers

Check for Samples: UCC27323, UCC27324, UCC27325, UCC37323, UCC37324, UCC37325

FEATURES

APPLICATIONS

• Industry-Standard Pin-Out

• Switch-Mode Power Supplies

• High Current-Drive Capability of ±4 A at the • DC/DC Converters

Miller Plateau Region

• Motor Controllers

• Efficient Constant-Current Sourcing Even at

• Line Drivers

Low Supply Voltages

• Class D Switching Amplifiers

• TTL/CMOS Compatible Inputs Independent of

Supply Voltage

DESCRIPTION

• 20-ns Typical Rise and 15-ns Typical Fall

The UCC37323/4/5 family of high-speed dual-

Times with 1.8-nF Load

MOSFET drivers deliver large peak currents into

capacitive loads. Three standard logic options are

• Typical Propagation-Delay Times of 25 ns with

offered — dual-inverting, dual-noninverting, and one-

Input Falling and 35 ns with Input Rising

inverting and one-noninverting driver. The thermally

• 4.5-V to 15-V Supply Voltage

enhanced 8-pin PowerPAD MSOP package (DGN)

• Supply Current of 0.3 mA

drastically lowers the thermal resistance to improve

long-term reliability. UCC3732x is also offered in the

• Dual Outputs are Paralleled for Higher Drive

standard SOIC-8 (D) or PDIP-8 (P) packages.

Current

Using a design that inherently minimizes shoot-

• Available in Thermally Enhanced MSOP

through current, these drivers deliver 4-A of current

PowerPAD™ Package with 4.7°C/W θ

where it is needed most at the Miller plateau region

• Rated From –40°C to +125°C

during the MOSFET switching transition. A unique

• TrueDrive™ Output Architecture Using Bipolar

BiPolar and MOSFET hybrid output stage in parallel

and CMOS Transistors in Parallel

also allows efficient current sourcing and sinking at

low supply voltages.

BLOCK DIAGRAM

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2PowerPAD, TrueDrive are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (28 pages)

PAGE 1
UCC27323, UCC27324, UCC27325 UCC37323, UCC37324, UCC37325 www.ti.
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UCC27323, UCC27324, UCC27325 UCC37323, UCC37324, UCC37325 SLUS492H – JUNE 2001 – REVISED MAY 2013 www.ti.
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UCC27323, UCC27324, UCC27325 UCC37323, UCC37324, UCC37325 www.ti.com SLUS492H – JUNE 2001 – REVISED MAY 2013 ABSOLUTE MAXIMUM RATINGS (1) (2) over operating free-air temperature range (unless otherwise noted) Analog input voltage (INA, INB) MIN MAX –0.3 to VDD + 0.3 V not to exceed 16 Output body diode DC current (OUTA, OUTB) IOUT_DC Output current (OUTA, OUTB) IOUT_PULSE UNIT V 0.2 DC 0.2 Pulsed (0.5 µs) 4.5 A D Power dissipation at TA = 25°C D package 1.14 DGN package 2.
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UCC27323, UCC27324, UCC27325 UCC37323, UCC37324, UCC37325 SLUS492H – JUNE 2001 – REVISED MAY 2013 www.ti.com ELECTRICAL CHARACTERISTICS (continued) VDD = 4.
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UCC27323, UCC27324, UCC27325 UCC37323, UCC37324, UCC37325 www.ti.com SLUS492H – JUNE 2001 – REVISED MAY 2013 TERMINAL FUNCTIONS TERMINAL I/O FUNCTION NAME NO. GND 3 INA 2 I Input A: Input signal of the A driver which has logic compatible threshold and hysteresis. If not used, this input must be tied to either VDD or GND; it must not be left floating. INB 4 I Input B: Input signal of the A driver which has logic compatible threshold and hysteresis.
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UCC27323, UCC27324, UCC27325 UCC37323, UCC37324, UCC37325 SLUS492H – JUNE 2001 – REVISED MAY 2013 www.ti.com APPLICATION INFORMATION General Information High-frequency power supplies often require high-speed, high-current drivers such as the UCC37323/4/5 family. A leading application is the needed to provide a high-power buffer stage between the PWM output of the control IC and the gates of the primary power MOSFET or IGBT switching devices.
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UCC27323, UCC27324, UCC27325 UCC37323, UCC37324, UCC37325 www.ti.com SLUS492H – JUNE 2001 – REVISED MAY 2013 Source/Sink Capabilities During Miller Plateau Large power MOSFETs present a large load to the control circuitry. Proper drive is required for efficient, reliable operation. The UCC37323/4/5 drivers have been optimized to provide maximum drive to a power MOSFET during the Miller plateau region of the switching transition.
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UCC27323, UCC27324, UCC27325 UCC37323, UCC37324, UCC37325 SLUS492H – JUNE 2001 – REVISED MAY 2013 www.ti.com VDD 1 2 3 Signal Generator 4 UCC27323 ENBA ENBB INA GND INB 8 DSCHOTTKY OUTA 10 Ω 7 VDD OUTB C2 1 μF 6 5 C3 100 μF 4.5 V VSNS 250 ns 1 μF CER 100 μF AL EL RSNS 0.1 Ω Figure 3. Note that the current sink capability is slightly stronger than the current source capability at lower VDD.
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UCC27323, UCC27324, UCC27325 UCC37323, UCC37324, UCC37325 www.ti.com SLUS492H – JUNE 2001 – REVISED MAY 2013 Parallel Outputs The A and B drivers combine into a single driver by connecting the INA and INB inputs together and the OUTA and OUTB outputs together. Then, a single signal controls the paralleled combination as shown in Figure 4. VDD = 12 V UCC37323 INPUT 1 2 3 4 8 INA GND INB OUTA VDD OUTB 7 6 5 CLOAD 0.1 µF CER 2.2 µF Figure 4.
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UCC27323, UCC27324, UCC27325 UCC37323, UCC37324, UCC37325 SLUS492H – JUNE 2001 – REVISED MAY 2013 www.ti.com Operational Waveforms and Circuit Layout Figure 5 shows the circuit performance achievable with a single driver (half of the 8-pin IC) driving a 10-nF load. The input pulse width (not shown) is set to 300 ns to show both transitions in the output waveform.
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UCC27323, UCC27324, UCC27325 UCC37323, UCC37324, UCC37325 www.ti.com SLUS492H – JUNE 2001 – REVISED MAY 2013 VDD Although quiescent VDD current is very low, total supply current will be higher, depending on OUTA and OUTB current and the programmed oscillator frequency. Total VDD current is the sum of quiescent VDD current and the average OUT current. Knowing the operating frequency and the MOSFET gate charge (Qg), average OUT current is calculated from Equation 1.
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UCC27323, UCC27324, UCC27325 UCC37323, UCC37324, UCC37325 SLUS492H – JUNE 2001 – REVISED MAY 2013 www.ti.com The switching load presented by a power MOSFET converts to an equivalent capacitance by examining the gate charge required to switch the device. This gate charge includes the effects of the input capacitance plus the added charge needed to swing the drain of the device between the ON and OFF states.
PAGE 13
UCC27323, UCC27324, UCC27325 UCC37323, UCC37324, UCC37325 www.ti.com SLUS492H – JUNE 2001 – REVISED MAY 2013 THERMAL INFORMATION The useful range of a driver is greatly affected by the drive power requirements of the load and the thermal characteristics of the IC package. In order for a power driver to be useful over a particular temperature range, the package must allow for the efficient removal of the heat produced while keeping the junction temperature within rated limits.
PAGE 14
UCC27323, UCC27324, UCC27325 UCC37323, UCC37324, UCC37325 SLUS492H – JUNE 2001 – REVISED MAY 2013 www.ti.com REVISION HISTORY Changes from Revision G (March 2010) to Revision H Page • Changed DSCHOTTKY diode direction and voltage of zener diode from 5.5 to 4.5 V in Figure 3 ............................................ 8 • Added three paragraphs after first paragraph of Operational Waveforms and Circuit Layout section before Figure 5 .....
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
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PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device UCC27323DGNR Package Package Pins Type Drawing MSOPPower PAD SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 UCC27323DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC27324DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) 5.2 2.1 8.0 W Pin1 (mm) Quadrant Power PAD UCC37325DR SOIC D 8 2500 330.0 12.4 6.4 12.0 Q1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC27323DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0 UCC27323DR SOIC D 8 2500 340.5 338.1 20.
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