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SLUS168D – APRIL 1999 – REVISED AUGUST 2002

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D Dual Output Drive Stages in Push-Pull

Configuration

D 130-µA Typical Starting Current

D 1-mA Typical Run Current

D Operation to 1-MHz

D Internal Soft Start

D On Chip Error Amplifier With 2-MHz Gain

Bandwidth Product

D On Chip VDD Clamping

D Output Drive Stages Capable Of 500-mA

Peak Source Current, 1-A Peak Sink Current

description

The UCC3808 is a family of BiCMOS push-pull, high-speed, low-power, pulse-width modulators. The UCC3808

contains all of the control and drive circuitry required for off-line or dc-to-dc fixed frequency current-mode switching

power supplies with minimal external parts count.

The UCC3808 dual output drive stages are arranged in a push-pull configuration. Both outputs switch at half the

oscillator frequency using a toggle flip-flop. The dead time between the two outputs is typically 60 ns to 200 ns

depending on the values of the timing capacitor and resistors, thus limiting each output stage duty cycle to less than

50%. (continued)

block diagram

UDG-02116

312

OSCILLATOR

1.2R

0.5 V

PEAK CURRENT

COMPARATOR

VDD

VOLTAGE

REFERENCE

14 V

PWM

COMPARATOR

PWM

LATCH

SOFT START

0.5 V

VDD–1 V

0.75 V

2.2 V

2.0 V

FB COMP CS

VDD

OUTA

OUTB

GND

SLOPE = 1 V/ms

VDD OK

OVERCURRENT

COMPARATOR

22 k

Note: Pinout shown is for SOIC and PDIP packages. TSSOP pinout is different.

Ω

         

       

   

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

COMP

VDD

OUTA

OUTB

GND

D OR N PACKAGE

(TOP VIEW)

PW PACKAGE

(TOP VIEW)

OUTB

GND

OUTA

VDD

COMP

Summary of content (18 pages)

PAGE 1
SLUS168D – APRIL 1999 – REVISED AUGUST 2002 D Dual Output Drive Stages in Push-Pull D D D D D D D D OR N PACKAGE (TOP VIEW) Configuration 130-µA Typical Starting Current 1-mA Typical Run Current Operation to 1-MHz Internal Soft Start On Chip Error Amplifier With 2-MHz Gain Bandwidth Product On Chip VDD Clamping Output Drive Stages Capable Of 500-mA Peak Source Current, 1-A Peak Sink Current COMP FB CS RC 1 8 2 7 3 6 4 5
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SLUS168D – APRIL 1999 – REVISED AUGUST 2002 description (continued) The UCC3808 family offers a variety of package temperature range options, and choice of undervoltage lockout levels. The family has UVLO thresholds and hysteresis options for off-line and battery powered systems. Thresholds are shown in the table below. Table 1. Part Number Turn on Threshold Turn off Threshold UCCx808–1 12.5 V 8.3 V UCCx808–2 4.3 V 4.
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SLUS168D – APRIL 1999 – REVISED AUGUST 2002 electrical characteristics, TA = 0°C to 70°C for the UCC3808–x, –40°C to 85°C for the UCC2808–x and –55°C to 125°C for the UCC1808–x, VDD = 10 V (See Note 6), 1 µF capacitor from VDD to GND, R = 22 kΩ, C = 330 pF, TA = TJ, (unless otherwise specified) oscillator section PARAMETER TEST CONDITIONS Oscillator frequency Oscillator amplitude/VDD See Note 1 MIN TYP MAX UNITS 175 194
PAGE 4
SLUS168D – APRIL 1999 – REVISED AUGUST 2002 electrical characteristics, TA = 0°C to 70°C for the UCC3808–x, –40°C to 85°C for the UCC2808–x and –55°C to 125°C for the UCC1808–x, VDD = 10 V (See Note 6), 1 µF capacitor from VDD to GND, R = 22 kΩ, C = 330 pF, TA = TJ, (unless otherwise specified) output section PARAMETER TEST CONDITIONS OUT low level I = 100 mA OUT high level I = –50 mA, Rise time Fall time MIN TYP MAX UN
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SLUS168D – APRIL 1999 – REVISED AUGUST 2002 pin descriptions COMP: COMP is the output of the error amplifier and the input of the PWM comparator. The error amplifier in the UCC3808 is a true low-output impedance, 2-MHz operational amplifier. As such, the COMP pin can both source and sink current. However, the error amplifier is internally current limited, so that zero duty cycle can be externally forced by pulling COMP to GND.
PAGE 6
SLUS168D – APRIL 1999 – REVISED AUGUST 2002 pin descriptions (continued) UDG–97009 NOTE: The oscillator generates a sawtooth waveform on RC. During the RC rise time, the output stages alternate on time, but both stages are off during the RC fall time. The output stages switch a ½ the oscillator frequency, with guaranteed duty cycle of < 50% for both outputs. Figure 1.
PAGE 7
ER28 8:2 32CTQ030 NS1 NP1 NS2 EF25 7µH 680 µF 0.01 µF VIN 36 V TO 72 V – LOOP B + 4700 µF 0.47 µF 1000 pF – BYV 28–200 62 Ω 62 Ω BYV 28–200 1000 pF 200 Ω LOOP A COMP 51 kΩ 1/4 W 19.1 kΩ IRF640 IRF640 4700 pF 20 kΩ 12 10 Ω 2.2 Ω 470 pF DF02SGICT 2.2 Ω 1 mH 3 10 µF 0.1 µF 2 19.1 kΩ 2 kΩ 0.2 Ω 20 kΩ VDD 8 330 pF OUTA OUTB GND 7 6 PRIMARY GROUND 5 UCC3808D-1 1 2 COMP FB 3 CS 240 Ω 4 RC RC 4.99 kΩ 86.6 kΩ CURRENT SENSE 4.
PAGE 8
SLUS168D – APRIL 1999 – REVISED AUGUST 2002 APPLICATION INFORMATION FREQUENCY vs TIMING RESISTOR IDD vs OSCILLATOR FREQUENCY CS OFFSET vs TEMPERATURE 1.2 1000 14 C CT=100pF 10 100 IDD – mA Frequency – kHz CT=330pF CT=220pF IDD With 1 nF Load 8 6 0.6 4 IDD Without Load CT=560pF 2 0 0.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
PAGE 12
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant UCC2808DTR-1 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC2808DTR-2 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC3808DTR-1 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.
PAGE 13
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC2808DTR-1 SOIC D 8 2500 340.5 338.1 20.6 UCC2808DTR-2 SOIC D 8 2500 340.5 338.1 20.6 UCC3808DTR-1 SOIC D 8 2500 340.5 338.1 20.6 UCC3808DTR-2 SOIC D 8 2500 340.5 338.1 20.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.