Datasheet

UCD7230
(QFN -
RGW)
(5x5, 0.65)
4
2
3
10
15
14
13
12
3V3
AGND
DLY
ILIM
SRE
OUT1
BST
PVDD
19 18 17 16
1
7 8 9
CS+ CSBIAS
SW
PGND
NEG
A0
POS
VDD
11 OUT2
6
I0
5CLF
IN
20
UCD7230
SLUS741D –NOVEMBER 2006–REVISED JANUARY 2010 www.ti.com
CONNECTION DIAGRAMS
ORDERING INFORMATION
(1) (2)
PACKAGED DEVICES
TEMPERATURE RANGE
PowerPAD™ HTSSOP-20 (PWP) QFN-20 (RGW)
-40°C to + 125°C UCD7230PWP UCD7230RGW
(1) These products are packaged in Pb-Free and green lead finish of Pd-Ni-Au which is compatible with MSL level 1 at 255-260°C peak
reflow temperature to be compatible with either lead free or Sn/Pb soldering operations.
(2) QFN-20 (RGW) package is available taped and reeled. Add T suffix to device type (e.g. UCD7230RGW) to order quantities of 1,000
devices per reel.
4 Copyright © 2006–2010, Texas Instruments Incorporated
Product Folder Link(s): UCD7230