User's Manual

User's Guide
SWRU382November 2014
WL1837MODCOM8I WLAN MIMO and Bluetooth
®
Module
Evaluation Board for TI Sitara™ Platform
The WL1837MODCOM8I is a Wi-Fi
®
dual-band, Bluetooth, and BLE module evaluation board (EVB) with
the TI WL1837 module (WL1837MOD). The WL1837MOD is a certified WiLink™ 8 module from TI that
offers high throughput and extended range along with Wi-Fi and Bluetooth coexistence in a power-
optimized design. The WL1837MOD offers A 2.4- and 5-GHz module solution with two antennas
supporting industrial temperature grade. The module is FCC, IC, ETSI/CE, and TELEC certified for AP
(with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux
®
,
Android™, WinCE, and RTOS.TI.
Contents
1 Overview ...................................................................................................................... 3
1.1 General Features ................................................................................................... 3
1.2 Key Benefits ......................................................................................................... 3
1.3 Applications.......................................................................................................... 4
2 Board Pin Assignment ...................................................................................................... 4
2.1 Pin Description ...................................................................................................... 5
2.2 Jumper Connections ............................................................................................... 7
3 Electrical Characteristics.................................................................................................... 7
4 Antenna Characteristics..................................................................................................... 8
4.1 VSWR ................................................................................................................ 8
4.2 Efficiency............................................................................................................. 8
4.3 Radio Pattern........................................................................................................ 9
5 Circuit Design ................................................................................................................ 9
5.1 EVB Reference Schematics....................................................................................... 9
5.2 Bill of Materials (BOM)............................................................................................ 10
6 Layout Guidelines .......................................................................................................... 11
6.1 Board Layout....................................................................................................... 11
7 Ordering Information ....................................................................................................... 16
List of Figures
1 WL1837MODCOM8I EVB (Top View) .................................................................................... 3
2 EVB Top View................................................................................................................ 4
3 EVB (Bottom View) .......................................................................................................... 5
4 Antenna VSWR Characteristics............................................................................................ 8
5 Antenna Efficiency........................................................................................................... 8
6 EVB Reference Schematics................................................................................................ 9
7 WL1837MODCOM8I Layer 1 Layout .................................................................................... 11
8 WL1837MODCOM8I Layer 2 Layout .................................................................................... 11
9 WL1837MODCOM8I Layer 3 Layout .................................................................................... 12
10 WL1837MODCOM8I Layer 4 Layout .................................................................................... 12
11 Module Layout Guidelines (Top Layer).................................................................................. 13
Sitara, WiLink are trademarks of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
Android is a trademark of Google, Inc.
Linux is a registered trademark of Linus Torvalds.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
1
SWRU382November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth
®
Module Evaluation Board
for TI Sitara™ Platform
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Summary of content (20 pages)