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XTR300

CurrentCopy

OPA

GAIN

COPY

DRV

IN+

IN-

Load

DRV

OUT

SET

IMON

V-

DGND

V+XTR300

Digital

Control

Error

Flags

(Optional)

InputSignal

REF

1kW

SET

GND1

GND3

IMON

1kW

GND2

XTR300

www.ti.com

SBOS336C –JUNE 2005– REVISED JUNE 2011

Industrial Analog Current/Voltage

OUTPUT DRIVER

Check for Samples: XTR300

FEATURES

APPLICATIONS

• USER-SELECTABLE: Voltage or Current

• PLC OUTPUT PROGRAMMABLE DRIVER

Output

• INDUSTRIAL CROSS-CONNECTORS

• +40V SUPPLY VOLTAGE

• INDUSTRIAL HIGH-VOLTAGE I/O

• V

OUT

: ±10V (up to ±17.5V at ±20V supply)

• 3-WIRE-SENSOR CURRENT OR VOLTAGE

• I

OUT

: ±20mA (linear up to ±24mA)

OUTPUT

• SHORT- OR OPEN-CIRCUIT FAULT

• ±10V 2- AND 4-WIRE VOLTAGE OUTPUT

INDICATOR PIN

U.S. Patent Nos. 7,427,898, 7,425,848, and

• NO CURRENT SHUNT REQUIRED

7,449,873

• OUTPUT DISABLE FOR SINGLE INPUT MODE

Other Patents Pending

• THERMAL PROTECTION

space

• OVERCURRENT PROTECTION

space

• SEPARATE DRIVER AND RECEIVER

DESCRIPTION

CHANNELS

The XTR300 is a complete output driver for industrial

• DESIGNED FOR TESTABILITY

and process control applications. The output can be

configured as current or voltage by the digital I/V

select pin. No external shunt resistor is required. Only

external gain-setting resistors and a loop

compensation capacitor are required.

The separate driver and receiver channels provide

flexibility. The Instrumentation Amplifier (IA) can be

used for remote voltage sense or as a high-voltage,

high-impedance measurement channel. In voltage

output mode, a copy of the output current is provided,

allowing calculation of load resistance.

The digital output selection capability, together with

the error flags and monitor pins, make remote

configuration and troubleshooting possible. Fault

conditions on the output and on the IA input as well

as over-temperature conditions are indicated by the

error flags. The monitoring pins provide continuous

feedback about load power or impedance. For

additional protection, the maximum output current is

limited and thermal protection is provided.

The XTR300 is specified over the −40°C to +85°C

Figure 1. XTR300 Basic Diagram

industrial temperature range and for supply voltages

up to 40V.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (38 pages)

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XT XTR300 R3 00 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com Industrial Analog Current/Voltage OUTPUT DRIVER Check for Samples: XTR300 FEATURES 1 • 2 • • • • • • • • • • USER-SELECTABLE: Voltage or Current Output +40V SUPPLY VOLTAGE VOUT: ±10V (up to ±17.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS: VOLTAGE OUTPUT MODE Boldface limits apply over the specified temperature range: TA = –40°C to +85°C. All specifications at TA = +25°C, VS = ±20V, RLOAD = 800Ω, RSET = 2kΩ, ROS = 2kΩ, VREF = 4V, RGAIN = 10kΩ, Input Signal Span 0V to 4V, and CC = 100pF, unless otherwise noted. XTR300 PARAMETER CONDITIONS MIN TYP MAX UNIT OFFSET VOLTAGE VOS ±0.4 ±1.9 mV vs Temperature dVOS/dT ±1.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS: CURRENT OUTPUT MODE Boldface limits apply over the specified temperature range: TA = –40°C to +85°C. All specifications at TA = +25°C, VS = ±20V, RLOAD = 800Ω, RSET = 2kΩ, ROS = 2kΩ, VREF = 4V, Input Signal Span 0 to 4V, and CC = 100pF, unless otherwise noted. XTR300 PARAMETER CONDITIONS MIN TYP MAX UNIT ±0.4 ±1.8 mV ±1.5 ±6 μV/°C ±0.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS: OPERATIONAL AMPLIFIER (OPA) Boldface limits apply over the specified temperature range: TA = –40°C to +85°C. All specifications at TA = +25°C, VS = ±20V, and RLOAD = 800Ω, unless otherwise noted. XTR300 PARAMETER CONDITIONS MIN TYP MAX ±0.4 ±1.8 UNIT OFFSET VOLTAGE Offset Voltage, RTI Drift vs Power Supply VOS IDRV = 0A ±1.5 dVOS/dT PSRR VS = ±5V to ±22V ±0.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS: INSTRUMENTATION AMPLIFIER (IA) Boldface limits apply over the specified temperature range: TA = –40°C to +85°C. All specifications at TA = +25°C, VS = ±20V, RIA = 2kΩ, and RGAIN = 2kΩ, unless otherwise noted. See Figure 4. XTR300 PARAMETER CONDITIONS MIN TYP MAX UNIT ±0.7 ±2.7 mV ±2.4 ±10 μV/°C ±0.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS: CURRENT MONITOR Boldface limits apply over the specified temperature range: TA = –40°C to +85°C. All specifications at TA = +25°C and VS = ±20V, unless otherwise noted. See Figure 4. XTR300 PARAMETER CONDITIONS MIN TYP MAX ±30 ±100 UNIT OUTPUT Offset Current Drift vs Power Supply IOS IDRV = 0A ±0.05 dIOS/dT VS = ±5V to ±22V PSRR Monitor Output Swing to the Rail IMON = ±2.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com FUNCTIONAL BLOCK DIAGRAMS CC XTR300 V- V+ Current Copy IMON RIMON 1kW Input Signal VIN = 0V to 4.0V GND3 ICOPY IDRV VIN DRV OPA SET IAIN+ ROS RSET IIA RG1 IA RG2 VREF = 4.0V L L M2 VOUT = Load RGAIN 2 ( VIN RSET + VIN - VREF ROS ) EFCM OD M1 RGAIN IAIN- IAOUT H Transfer Function: Digital Control EFLD Error Flags EFOT DGND DVGND GND2 GND1 Figure 2.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com Feedback Network XTR300 V- V+ Current Copy IMON ICOPY IDRV GND3 VIN Input Signal OPA SET DRV IAIN+ RSET IIA RG1 IA RG2 GND1 IAIN- IAOUT H M1 M2 GND3 EFCM OD RIA RGAIN Digital Control Error Flags EFLD EFOT DGND Figure 4.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com PIN CONFIGURATIONS IMON 5 Pad EFOT EFLD EFCM DGND 16 Exposed Thermal Die Pad on Underside (must be connected to V-) 6 7 8 9 10 RG2 SET 4 17 RG1 VIN 3 18 IAIN+ M1 2 19 IAIN- 1 20 IAOUT M2 OD RGW PACKAGE QFN-20 (TOP VIEW) 15 V+ 14 NC 13 DRV 12 NC 11 V- PIN ASSIGNMENTS 10 PIN NO.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS At TA = +25°C and V+ = ±20V, unless otherwise noted. QUIESCENT CURRENT vs TEMPERATURE QUIESCENT CURRENT vs SUPPLY VOLTAGE 1.90 3.0 1.88 2.5 1.86 1.84 IQ (mA) IQ (mA) 2.0 1.5 1.0 1.82 1.80 1.78 1.76 1.74 0.5 1.72 0 -50 1.70 0 -25 25 50 75 100 10 125 15 20 25 Figure 5. 40 45 OPA OUTPUT SWING TO RAIL vs TEMPERATURE 0 2.2 IDRV = +24mA IDRV = -24mA -5 ½VS - VOUT½ (V) 2.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C and V+ = ±20V, unless otherwise noted. IA CMRR AND PSRR vs FREQUENCY 140 140 120 120 CMRR, PSRR (dB) 100 PSRR80 60 PSRR+ 40 CMRR 40 0 10 100 1k 10k 1 100k 10 100 1k 10k Frequency (Hz) Frequency (Hz) Figure 11. Figure 12. SMALL−SIGNAL STEP RESPONSE CURRENT MODE LARGE−SIGNAL STEP RESPONSE CURRENT MODE IOUT = ±200mA G=8 CL = 100nF || RL = 800W CC = 4.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C and V+ = ±20V, unless otherwise noted. INPUT−REFERRED NOISE SPECTRUM VOLTAGE OUTPUT MODE INPUT−REFERRED 0.1Hz to 10Hz NOISE VOLTAGE OUTPUT MODE 1M G=5 10k 1mV/div Noise (nV/ÖHz) 100k 1k 100 10 1 1 10 100 1k 10k 1s/div 100k Frequency (Hz) Figure 17. Figure 18. INPUT−REFERRED NOISE SPECTRUM CURRENT OUTPUT MODE INPUT−REFERRED 0.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C and V+ = ±20V, unless otherwise noted. OPA OFFSET VOLTAGE DISTRIBUTION IA OFFSET VOLTAGE DISTRIBUTION 18 30 Percent of Population (%) 14 12 10 8 6 4 2 0 25 20 15 10 5 Offset Voltage (mV) OPA OFFSET VOLTAGE DRIFT DISTRIBUTION 3.0 2.4 1.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C and V+ = ±20V, unless otherwise noted. CURRENT MODE NONLINEARITY DISTRIBUTION 60 50 50 Percent of Population (%) 40 30 20 10 40 30 20 10 Figure 29. 1000 800 600 400 Figure 30. VOLTAGE MODE GAIN ERROR DRIFT DISTRIBUTION CURRENT MODE GAIN ERROR DRIFT DISTRIBUTION 70 60 10 8 6 4 -10 1.0 0.8 0.6 0.4 0.2 0 -0.2 -0.4 0 -0.6 0 -0.8 10 -1.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C and V+ = ±20V, unless otherwise noted. POSITIVE CURRENT LIMIT vs TEMPERATURE NEGATIVE CURRENT LIMIT vs TEMPERATURE 36 -16 34 -18 32 30 -22 ILIMIT (mA) ILIMIT (mA) Voltage Mode -20 Current Mode 28 26 24 Voltage Mode 22 -24 -26 -28 -30 20 -32 18 -34 16 Current Mode -36 -50 0 -25 25 50 75 100 125 -50 -25 Temperature (°C) 75 100 Figure 35. Figure 36.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com APPLICATION INFORMATION V- V+ GND C2 100nF C3 100nF CC 47nF GND1 XTR300 ICOPY R3 1kW IDRV VIN SIN ROS 2kW OPA RC 15W DRV GND1 IAIN+ RSET 2kW IIA SG RGAIN 10kW IA IAO RG2 M2 RLOAD R7 2.2kW GND2 EFCM OD M1 C5 10nF IAIN- IAOUT RIA 1kW R6 2.2kW CLOAD RG1 GND1 External Load C4 100nF SET OS RIMON 1kW Thermal Pad (2) Current Copy IMON IMON V- V+ Digital Control Error Flags EFLD DGND GND3 Logic Supply (+2.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com The XTR300 can be used with asymmetric supply voltages; however, the minimum negative supply voltage should be equal to or more negative than −3V (typically −5V). This supply value ensures proper control of 0V and 0mA with wire resistance, ground offsets, and noise added to the output. For positive output signals, the current requirement from this negative voltage source is less than 5mA.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com CC XTR300 Current Copy IMON ICOPY RIMON GND3 Input Signal V- V+ IDRV VIN OPA SET DRV IAIN+ RSET IIA RG1 IA RG2 GND1 EFCM OD L M1 M2 Load IAIN- IAOUT L RGAIN Digital Control Error Flags EFLD GND2 EFOT DGND Figure 40. Simplified Voltage Output Mode Configuration Applications not requiring the remote sense feature can use the OPA in stand-alone operation (M1 = high).
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com CURRENT OUTPUT MODE The XTR300 does not require a shunt resistor for current control because it uses a precise current mirror arrangement. In current output mode (M1 connected low, or left unconnected and M2 connected high) a precise copy of 1/10th of the output is internally routed back to the summing junction of the OPA through a multiplexer, closing the control loop for the output current.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com INPUT SIGNAL CONNECTION It is possible to drive the XTR300 with a unidirectional input signal and still get a bidirectional output by adding an additional resistor, ROS, and an offset voltage signal, VREF. It can be a mid-point voltage or a signal to shift the output voltage to a desired value. This design is illustrated in Figure 42a, Figure 42b, and Figure 42c.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com EXTERNALLY-CONFIGURED MODE: OPA AND IA It is possible to use the precision of the operational amplifier (OPA) and instrumentation amplifier (IA) independently from each other by configuring the digital control pins (M1 high). In this mode, the IA output current is routed to IAOUT and the copy of the OPA output current is routed to IMON, as shown in Figure 4. This mode allows external configuration of the analog signal routing and feedback loop.
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XTR300 www.ti.com SBOS336C – JUNE 2005 – REVISED JUNE 2011 DRIVING CAPACITIVE LOADS AND LOOP COMPENSATION For normal operation, the driver OPA and the IA are connected in a closed loop for voltage output. In current output mode, the current copy closes the loop directly. In current output mode, loop compensation is not critical, even for large capacitive loads.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com IA STRUCTURE, VOLTAGE MONITOR The instrumentation amplifier has high-impedance NPN transistor inputs that do not load the output signal, which is especially important in current output mode. The output signal is a controlled current that is multiplexed either to the SET pin (to close the voltage output loop) or to IAOUT (for external access). The principal circuit is shown in Figure 43.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com ERROR FLAGS The XTR300 is designed for testability of its proper function and allows observation of the conditions at the load connection without disrupting service. If the output signal is not in accordance to the transfer function, an error flag is activated (limited by the dynamic response capabilities).
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com OUTPUT PROTECTION The XTR300 is intended to operate in a harsh industrial environment. Therefore, a robust semiconductor process was chosen for this design. However, some external protection is still required. The instrumentation amplifier inputs can be protected by external resistors that limit current into the protection cell behind the IC-pins, as shown in Figure 44.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com POWER ON/OFF GLITCH When power is turned on or off, most analog amplifiers generate some glitching of the output because of internal circuit thresholds and capacitive charges. Characteristics of the supply voltage, as well as its rise and fall time, directly influence output glitches. Load resistance and capacitive load also affect the amplitude.
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com LAYOUT CONSIDERATIONS Supply bypass capacitors should be close to the package and connected with low-impedance conductors. Avoid noise coupled into RGAIN, and observe wiring resistance. For thermal management, see the Package and Heat Sinking section. Layout for the XTR300 is not critical; however, its internal current chopping works best with good (low dynamic impedance) supply decoupling.
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XTR300 www.ti.com SBOS336C – JUNE 2005 – REVISED JUNE 2011 POWER DISSIPATION Power dissipation depends on power supply, signal, and load conditions. It is dominated by the power dissipation of the output transistors of the OPA. For dc signals, power dissipation is equal to the product of output current, IOUT and the output voltage across the conducting output transistor (VS – VOUT).
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XTR300 SBOS336C – JUNE 2005 – REVISED JUNE 2011 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (March, 2006) to Revision C Page • Updated document format to current standards ................................................................................................................... 1 • Deleted information regarding HART digital communication throughout document .................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant XTR300AIRGWR VQFN RGW 20 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 XTR300AIRGWT VQFN RGW 20 250 180.0 12.4 5.3 5.3 1.5 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) XTR300AIRGWR VQFN RGW 20 3000 367.0 367.0 35.0 XTR300AIRGWT VQFN RGW 20 250 210.0 185.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.