Product Card

Cinterion
®
MV31-W Hardware Interface Description
5.3 Thermal Design Guidelines
75
t MV31-W_HID_v01.009a 2022-04-27
Public / Preliminary
Page 47 of 76
Figure 21: Option 2 - Heat sink only on heat spot of stepped shielding and bottom of application PCB
Figure 22: Option 3 - Heat sink on top of stepped shielding and directly on bottom of M.2 card PCB
Figure 23: Option 4 - Heat pipe and small application housing
Application/ System PCB (typ. 1.6mm)
Heat sink
Heat sink
M.2 PCB (0.8mm)
M.2 CON
H2.3 S5
(Typ 2.25mm)
TIM (typ. 0.3mm)
RF PCB
IC
IC
IC
0.8mm M.2 PCB
+1.3mm Shield
+0.5mm Shield
2.6mm
total
height
Screw
CO N
IC
Shield
Heat spot of th e M.2 card is below
the lower shield. Allows internally
thinner TIM with lower Rth
Rec ommended to use GND
planes stiched with vias for
better thermal performance
Application/ System PCB (typ. 1.6mm)
Heat sink
M.2 PCB (0.8mm)
M.2 CON
H2.3 S5
(Typ 2.25mm)
RF PCB
IC
IC
IC
0.8mm M.2 PCB
+1.3mm Shield
+0.5mm Shield
2.6mm
total
height
Screw
CO N
IC
Shield
Stepped heat sink to allow
thinner TIM => better Rth
Heat spot of the M.2 card is below
the lower shield. Allows internally
thinner TIM with lower Rth
Heat sink
Application/ System PCB (typ. 1.6mm)
M.2 PCB (0.8mm)
Heat pipe
M.2 CON
H2.3 S5
(Typ 2.25mm)
TIM (typ. 0.3mm)
TIM
RF PCB
IC
IC
IC
0.8mm M.2 PCB
+1.3mm Shield
+0.5mm Shield
2.6mm
total
height
Screw
CO N
Rec omm ended to use GND
planes stiched with v ias for
better thermal performance
Heat pipe
IC
Shield
Heat spot of the M.2 card is below
the lower shield. Allows internally
thinner TIM with lo wer Rth
Housing