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Table Of Contents
Cinterion
®
MV31-W Hardware Interface Description
0 Document History
10
t MV31-W_HID_v01.009a 2022-04-27
Public / Preliminary
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Preceding document: Cinterion
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MV31-W Hardware Interface Description, Version 01.009
New document: Cinterion
®
MV31-W Hardware Interface Description, Version
01.009a
Preceding document: Cinterion
®
MV31-W Hardware Interface Description, Version 00.058c
New document: Cinterion
®
MV31-W Hardware Interface Description, Version 01.009
Preceding document: Cinterion
®
MV31-W Hardware Interface Description, Version 00.058b
New document: Cinterion
®
MV31-W Hardware Interface Description, Version 00.058c
Chapter What is new
2.3 Revised Figure 7 showing H2.3-S5 dimensions.
3.1 Updated electrical characteristics for FULL_CARD_POWER_OFF# (Table 3).
3.2.7 Updated Figure 13 to include second PCIe interface lane.
3.2.8.1 Revised Figure 15 to update enhanced ESD protection for SIM interface
3.2.9 New Section eUICC Interface.
4.1 Added notes regarding usage of antenna interfaces.
5.3 Revised thermal design guidelines.
Chapter What is new
2.1 Revised supported 5G bands with DSS.
Revised SIM feature description (DSSS -> DSSA).
2.3 Added 2.3 bottom shield dimensions.
5.2 Added thermal resistance value to Table 17.
5.9 Updated complete approval section.
6 New Appendix with label, packaging and conformance information.
Chapter What is new
2.1 Revised PCIe features.
Revised 5G/4G category features.
2.2 Revised Figure 3 to add optional UIM card holder.
3.1 Updated some electrical descriptions in Table 3.
3.2.2.3 Added note recommending >30s pause between powering off and on again.
4.1 Revised Table 13, Table 14, and Table 15.
5.4 Added remark regarding recommended power reserve for peak current consumption.
6 Removed Appendix with tables showing supported CA and EN-DC configurations.
These configurations are now listed in a dedicated User Guide (see [2]).