Product Card
Table Of Contents
- Contents
- Tables
- Figures
- 0 Document History
- 1 Introduction
- 2 Product Concept
- 3 Application Connector Interface
- 3.1 Pin Assignments and Electrical Description
- 3.2 Characteristics
- 3.2.1 Power Supply and Ground
- 3.2.2 Control Signals
- 3.2.3 Tunable Antenna Interface
- 3.2.4 WWAN/WiFi Coexistence Control
- 3.2.5 Dynamic Power Reduction
- 3.2.6 USB Interface
- 3.2.7 PCI Express® Interface
- 3.2.8 SIM/UICC Interface
- 3.2.9 eUICC Interface
- 3.2.10 GPIO Interface
- 3.2.11 Status
- 3.2.12 Add-in Card Configuration Pins
- 4 Antenna Interface
- 5 Operation
- 6 Appendix
Cinterion
®
MV31-W Hardware Interface Description
0 Document History
10
t MV31-W_HID_v01.009a 2022-04-27
Public / Preliminary
Page 8 of 76
Preceding document: Cinterion
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MV31-W Hardware Interface Description, Version 00.058a
New document: Cinterion
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MV31-W Hardware Interface Description, Version 00.058b
Preceding document: Cinterion
®
MV31-W Hardware Interface Description, Version 00.058
New document: Cinterion
®
MV31-W Hardware Interface Description, Version 00.058a
Preceding document: Cinterion
®
MV31-W Hardware Interface Description, Version 00.057a
New document: Cinterion
®
MV31-W Hardware Interface Description, Version 00.058
Preceding document: Cinterion
®
MV31-W Hardware Interface Description, Version 00.057
New document: Cinterion
®
MV31-W Hardware Interface Description, Version 00.057a
Chapter What is new
3.2.7.1 Revised description of PERST# signal
3.2.8 Added Figure 14 SIM Detection Circuit
Chapter What is new
-- Removed n40
2.1 Added Data Throughput and Bands supporting DSS
4.1 Revised Table 15 regarding 5G Sub6 TX
5.2 Added Thermal Throttling Thresholds in Table 17
5.3 Added Table 18 for 3 Level Throttling Mechanism
Chapter What is new
3.1 Changed Table 2 and Table 3 regarding to WAKE_ON_WWAN# signal
3.2.2.4 Revised chapter WAKE_ON_WWAN# signal is now supported
Chapter What is new
1.1 Revised Table 1 regarding eSIM information
2.1 Added PCB tolerance at maximum height and revised description of SIM and SIM inter-
face
2.2 Revised Figure 3 regarding 2nd SIM Interface
3.1 Revised Table 2 regarding UIM_1 and Table 3 regarding MIPI interface
3.2.2.1 Revised chapter regarding control circuit
3.2.3.2 Revised chapter
3.2.7 Revised Design Guidelines and Figure 13
3.2.8 Added information that 2nd interface is reserved for future use
3.2.8.1 Changed sample ESD protection component to
NUP4114 and added capacitors
5.5 Replaced baseband chip name by product name
5.8 Added Chapter for Mounting Advice