Third Party Verification Claim

BONDING PATH RESISTANCE TEST – [AFTER BONDING
CONDUCTOR TEST @ 200% of Rated Current] (Method B)
2014-03-18
UL2703 Sec. 13
METHOD
Using the same samples subject to the Bonding Conductor Test @ 200% of
current; this test was conducted in an ambient of 25 +/- 3°C. A direct
current supplied by an external source, was caused to flow through the
bonding junction. The current was increased from zero to the value specified
below (twice the series fuse rating for the module/module-component under
test, or 25-Amps, whichever is less) uniformly in approximately 5 s, and was
maintained at the level for 2 minutes at which time the measurement was
taken.
RESULTS
Bonding Junction
Tested
Sample
Assm. No.
Measured
Voltage Drop
Vdc
Test
Current A,
dc
Maximum Resistance,
Milliohms
Assembly #1:
Rail, Clamp, PV
Module Frame
1A, 1B
1A:0.377
1B:0.0577
25
1A:0.0161
1B:0.0023
Assembly #2:
Starter Bracket
(A) to Rail to
BF15T Lug (I)
2A, 2B
2A:0.315
2B:0.449
25
2A:0.0126
2B:0.0180
Assembly #3: Rail
to Brace
3A, 3B
3A:0.104
3B:0.134
25
3A:0.0042
3B:0.0054
Assembly #4: Roof
Anchor (feet)(E)
to Rail to
SolarLok ground
(H)
4A, 4B
4A:0.1822
4B:0.0675
25
4A:0.0073
4B:0.0027
Assembly #5:
Ground Lug (F) to
Rail to Washer
Ground (G)
5A, 5B
5A:0.0145
5B:0.0191
25
5A:0.0006
5B:0.0008
The current path [remained] [did not remain] intact. The calculated
resistances between the points of current application on the stated bonding
junction [exceeded] [did not exceed] 0.1 ohm.
NW 2014-04-24: Connection Point F & I will not be used for
certification at this time.
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