Datasheet

UYHGFRDESAZ
Advanced Engineering by Thermaltake
Advanced Engineering by Thermaltake
Unit: mm
REVISION A. 2005.12
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Fan Dimension : ∅ 90x90x25 mm
Heat Sink Dimension : 89.5x89.5x45 mm
Rated Voltage : 12V
Rated Current : 0.03 AMP
Fan Speed : 4200RPM
Air Flow : 71.79CFM (Duty cycle at 100%)
Static Pressure: 7.23 mm H
2
O (Duty cycle at 100%)
Max. Noise : 44 dB (Duty cycle at 100%)
Bearing Type : 1 Ball 1 Sleeve Bearing
Life Expectation : 40,000 hrs in 25℃
Connector : 4Pin PWM
Thermal Interface: TIC-1000A
Weight: 540g
Thermal Resistance: R=0.31 ℃/W
P/N : CL-P0326
Application for Intel LGA775 130W
Solution
SPECIFICATION
Back Plate
Spring screw
Al extrusion with Cu core
FEATURES:
-Application for Intel LGA775 130W Solution.
-Aluminum extrusion with Copper core inserted.
-The fourth fan pin has PWM (Pulse Width
Modulation) an speed control function: decrease
energy consumption, reduces acoustics noise and
increase fan performance.
-Plastic back plate & spring screw.
-TIC-1000A interface material perform well.
.
DIMENSION
THERMAL PERFORMANCE
9025 circle fan
0
5
10
15
20
25
30
0 10203040506070
HEAT DISSIPATED - WATTS
CHIP TEM PERATURE(Tc)
RISE ABOVE AMBIENT -
℃