User's Guide

LE920A4 HW User Guide Mounting the Module on Your
Board
Doc#: 1VV0301261 Recommended Foot Print for the Application
Rev. 4.7.1 Page 98 of 124 2019-11-21
Recommended Foot Print for the Application
Figure 25 shows the recommended footprint for the application board (dimensions are in
mm).
To facilitate replacing the module if necessary, it is suggested to design the application
board with a 1.5 mm placement inhibit area around the module.
It is also suggested, as a common rule for an SMT component, to avoid having a
mechanical part of the application board in direct contact with the module.
NOTE:
In the customer application, the 5 crowns marked as INHIBIT in Figure 25
must be clear of signal wiring or ground polygons.
The 5 crown pads should not exist on the customer application board.
Figure 25: Recommended Footprint (Top View)