User's Guide

LE940B6 HW User Guide
Rev. 2.02
Page 8 of 111 2020-01-10
8.5.1. Analog Audio .................................................................................................. 82
8.5.2. Digital Audio ................................................................................................... 82
General Purpose I/O ....................................................................................... 83
8.6.1. Using a GPIO Pad as Input ............................................................................ 84
8.6.2. Using a GPIO Pad as Output .......................................................................... 84
9. MISCELLANEOUS FUNCTIONS ................................................................... 85
Indication of Network Service Availability ....................................................... 85
RTC – Real Time Clock .................................................................................. 85
VAUX Power Output ....................................................................................... 86
ADC Converter ............................................................................................... 86
9.4.1. Description ...................................................................................................... 86
9.4.2. Using the ADC Converter ............................................................................... 86
Using the Temperature Monitor Function ....................................................... 86
Fuel Gauge (TBD) .......................................................................................... 87
eFuse .............................................................................................................. 87
10. MOUNTING THE MODULE ON YOUR BOARD............................................ 88
General ........................................................................................................... 88
Finishing & Dimensions .................................................................................. 88
Recommended Footprint for the Application .................................................. 89
Stencil ............................................................................................................. 90
PCB Pad Design ............................................................................................. 90
Recommendations for PCB Pad Dimensions (mm) ........................................ 91
Solder Paste ................................................................................................... 92
10.7.1. Solder Reflow ................................................................................................. 92
11. APPLICATION GUIDE ................................................................................... 94
Debug of the LE940B6 Module in Production ................................................. 94
Bypass Capacitor on Power Supplies ............................................................. 95
SIM Interface .................................................................................................. 96
11.3.1. SIM Schematic Example................................................................................. 96
EMC Recommendations ................................................................................. 97
Download and Debug Port.............................................................................. 97
Antenna Detection .......................................................................................... 98
12. PACKING SYSTEM ....................................................................................... 99
Tray Drawing ................................................................................................ 101
Moisture Sensitivity ....................................................................................... 101
13. CONFORMITY ASSESSMENT ISSUES ...................................................... 102
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