User's Guide

LE940B6 HW User Guide
Rev. 2.02
Page 90 of 111 2020-01-10
Stencil
Stencil’s apertures layout can be the same as the recommended footprint (1:1). The
suggested thickness of stencil foil is greater than 120 µm.
PCB Pad Design
The solder pads on the PCB are recommended to be of the Non Solder Mask Defined
(NSMD) type.
Figure 26: PCB Pad Design
Provided to Dekra under NDA
Distribution is Prohibited except for
Dekra employees with a Need to know