User's Guide

LE940B6 HW User Guide
Rev. 2.02
Page 92 of 111 2020-01-10
The PCB must be able to resist the higher temperatures, which occur during the lead-free
process. This issue should be discussed with the PCB-supplier. Generally, the wettability
of tin-lead solder paste on the described surface plating is better compared to lead-free
solder paste.
Solder Paste
We recommend using only “no clean” solder paste to avoid the cleaning of the modules
after assembly.
10.7.1. Solder Reflow
Figure 29 shows the recommended solder reflow profile.
Figure 29: Solder Reflow Profile
Provided to Dekra under NDA
Distribution is Prohibited except for
Dekra employees with a Need to know