Data Sheet

K019-CW43-DW datasheet_V1.6_15042020.doc | Shawn Xiao

9. PCB Layout Solder Paste

 Module Specifications : W:0.65mm * L:0.95mm pitch 0.9 mm

 The proposed design W:0.65~0.75 mm * L:1.33mm. Consider not place other parts in the

peripheral area of 1 mm ~ 1.5 mm to facilitate additional amount of solder for PCB pad.

 We Suggest the thickness of Stencil between 0.12 mm ~0.15mm, the W between

0.6~0.65mm and the L between L1.5~1.6mm.

 If the thickness of the stencil is thinner, we suggest to adding more solder, to increase the

wetting ability. Depends on different production situation, if the stencil thickness is

0.08~0.1mm, and the module nearby area is no more space for expending soldering area,

we will suggest to increase the stencil thickness to increase the wetting ability.

 The major consideration parts of stencil design is to increase the solder paste wetting

ability.