Data Sheet
K019-CW43-DW datasheet_V1.6_15042020.doc | Shawn Xiao
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Module Specifications L 0.7mm
The design for PCB Pad : L:0.8mm
We recommend the apertures for stencil L:0.5mm~0.6mm
In order to avoid highness impact caused solder paste thickness, the stencil open size can
be appropriately retracted