Product Data Sheet

Version : 1.1
-
14
-
10/08/2018
Product Data Sheet
BM026
The module can be unsoldered from the host board. Use of a hot air rework tool should be
programmable and the solder joint and module should not exceed the maximum peak reflow
temperature of 250°C.
If temperature ramps exceed the reflow temperature profile, module and component
damage may occur due to thermal shock. Avoid overheating. Never attempt a rework on the
module itself, (e.g. replacing individual components).
7.3 Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the
module cannot be easily removed with any cleaning process. Use of “No Clean” soldering
paste is strongly recommended, as it does not require cleaning after the soldering process.