Toshiba Personal Computer Satellite R20 / TECRA M7 Maintenance Manual TOSHIBA CORPORATION File Number 960-572 [CONFIDENTIAL]
Copyright © 2006 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed, with respect to the use of the information contained herein. Toshiba Satellite R20/TECRA M7 Maintenance Manual First edition June 2006 Disclaimer This manual has been validated and reviewed for accuracy.
Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer Satellite R20/TECRA M7, referred to as Satellite R20/TECRA M7 in this manual. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field. SAFETY PRECAUTIONS Four types of messages are used in this manual to bring important information to your attention.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the Satellite R20/TECRA M7 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Table of Contents Chapter 1 Hardware Overview 1.1 Features ...................................................................................................................... 1-1 1.2 System block diagram................................................................................................ 1-8 1.3 2.5-inch Hard Disk Drive......................................................................................... 1-14 1.4 Optical Drive........................................................
Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ................................................................................... 3-4 3.3 Setting of the hardware configuration........................................................................ 3-8 3.4 Heatrun Test.......................................................................................
Chapter 4 Replacement Procedures 4.1 Overview................................................................................................................... 4-1 4.2 Battery pack .............................................................................................................. 4-8 4.3 Reserve pen............................................................................................................. 4-10 4.4 Tablet PC pen...........................................................
4.32 Hinge assembly....................................................................................................... 4-79 4.33 Fluorescent Lamp.................................................................................................... 4-82 Appendices Appendix A Handling the LCD Module ....................................................................... A-1 Appendix B Board Layout ............................................................................................
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Chapter 1 Hardware Overview [CONFIDENTIAL]
1 Hardware Overview 1 1-ii Hardware Overview [CONFIDENTIAL] Satellite R20/TECRA M7 Maintenance Manual (960-572)
1 Hardware Overview Chapter 1 Contents 1.1 Features ...................................................................................................................... 1-1 1.2 System block diagram................................................................................................ 1-8 1.3 2.5-inch Hard Disk Drive......................................................................................... 1-14 1.4 Optical Drive..............................................................
1 Hardware Overview Figures Figure 1-1 Front of the computer..................................................................................... 1-6 Figure 1-2 System units configuration ............................................................................ 1-7 Figure 1-3 System block diagram.................................................................................... 1-8 Figure 1-4 2.5-inch HDD.............................................................................................
1.1 Features 1 1 Hardware Overview Features 1.1 Features The Satellite R20/TECRA M7 is an ultra thin and lightweight tablet PC realizing cable-less environment on a table by wireless function with an Intel® CoreTM Duo/Solo or Intel® Celeron® M processor realizing high performance. There some models and options. Refer to the Parts List for the configuration of each model and option. Microprocessor Microprocessor that is used will be different of the model.
1 Hardware Overview 1.1 Features Memory Two DDR2 SO-DIMM slots support DDR2 533 or DDR2 667. Memory modules can be installed to a maximum of 4GB (4,096MB). Memory modules of 256MB, 512MB, 1GB and 2GB sizes are available. HDD The computer has a 2.5-inch SATA HDD. The following capacities are available. • 40/60/80/100/120GB Optical disk drive DVD-ROM drive, DVD-ROM&CD-R/RW drive or DVD Super Multi drive (double layer) can be installed. USB FDD A 3.5 inch USB FDD supports 720KB/1.44MB formats.
1.1 Features 1 Hardware Overview Touch pad A touch pad is installed as a pointing device. Batteries The computer has three batteries: a rechargeable Lithium-Ion main battery pack, a rechargeable Lithium-Ion secondary battery pack (Provided with some models or option) and an RTC battery (that backs up the Real Time Clock and CMOS memory). USB (Universal Serial Bus) Four USB ports are usable. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.
1 Hardware Overview 1.1 Features Switch/Button The following switches and buttons are equipped.
1.1 Features 1 Hardware Overview Wireless LAN The computer is equipped with PCI Express Mini Card type wireless LAN card that supports 802.11 b/g or 802.11 a/b/g in the PCI Express MiniCard slot. This function can be switched on and off by a switch on the computer. i.LINK (IEEE1394) This port enables high-speed data transfer directly from external devices such as digital video cameras. Docking port TOSHIBA Express Port Replicator can be connected through docking port on the bottom.
1 Hardware Overview 1.1 Features Figure 1-1 shows the front of the computer and Figure 1-2 shows the system units configuration.
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1 Hardware Overview 1.2 1.2 System block diagram System block diagram Figure 1-3 shows the system block diagram.
1.2 System block diagram 1 Hardware Overview The PC contains the following components. Processor Intel® CoreTM Duo Processor (dual core) or Intel® CoreTM Solo Processor (single core) • Core speed: Dual core: 1.60GHz (T2050)/1.66GHz (T2300E)/1.66GHz (T2300)/ 1.73GHz(T2250)/1.83GHz (T2400)/2.00GHz (T2500)/ 2.16GHz(T2600)/ 2.33GHz (T2700) Single core: 1.66GHz (T1300)/1.83GHz (T1400)/1.86GHz (T1350) ( ): Processor Number – Processor bus speed: 533MHz/667MHz – Core voltage: 0.50 to 1.
1 Hardware Overview 1.2 System block diagram Memory Two memory slots capable of accepting DDR2-SDRAM 256MB, 512MB, 1024MB or 2048MB memory modules for a maximum of 4GB. • 200-pin Small Outline DIMM • 1.8V operation • PC2-4200(DDR2-533)/PC2-5300(DDR2-667) support BIOS ROM (Serial Peripheral Interface (SPI)) • • One STMicro M25PE80 is used. 8Mbits of flash memory are used.
1.2 System block diagram 1 Hardware Overview PCI chipset This gate array incorporates the following elements and functions. North Bridge (Intel 945GM (Satellite R20/TECRA M7)/945PM (TECRA M7)) - Yonah Processor System Bus Support System Memory Interface : supports DDR2-400/DDR2-533/DDR2-667 4GBmax. Internal Graphics Controller : Inter Generation 3.5 Integrated GFX Core (250MHz) DMI (Direct Media Interface) ICH Support 1,466-ball, 37.5×37.5×2.
1 Hardware Overview 1.2 System block diagram GPU controller (Internal graphic controller) • Graphics interface in North Bridge (Intel 945GM) is used.
1.2 System block diagram – Supports Magic Packet – Supports LED – Makes LAN to “Disable” in BIOS 1 Hardware Overview Wireless LAN • One Mini PCI Express Card slot − Supports 802.11b/g or 802.
1 Hardware Overview 1.3 1.3 2.5-inch Hard Disk Drive 2.5-inch Hard Disk Drive A compact, high-capacity SATA HDD with a height of 9.5mm contains a 2.5-inch magnetic disk and magnetic heads. Figure 1-4 shows a view of the 2.5-inch HDD and Tables 1-1 list the specifications. Figure 1-4 2.5-inch HDD Table 1-1 2.5-inch HDD Specifications (1/3) Specifications Items Outline dimensions FUJITSU FUJITSU FUJITSU FUJITSU G8BC0002W410 G8BC0002W610 G8BC0002W810 G8BC0002WA10 Width (mm) 70 Height (mm) 9.
1.3 2.5-inch Hard Disk Drive 1 Hardware Overview Table 1-1 2.5-inch HDD Specifications (2/3) Items Specifications TOSHIBA TOSHIBA TOSHIBA TOSHIBA HDD2D34BZK01 HDD2D35BZK01 HDD2D32BZK01 HDD2D30BZK01 Outline Width (mm) 69.85±0.25 dimensions Height (mm) 9.5±0.2 Depth (mm) Weight (g) 100±0.41 Storage size (formatted) 98 max. 102 max. 40GB 60GB Speed (RPM) 80GB 100GB 218-429 236.1-456.0 5,400 Data transfer rate (Mb/s) 218-429 244.7-474.
1 Hardware Overview 1.3 2.5-inch Hard Disk Drive Table 1-1 2.5-inch HDD Specifications (3/3) Specifications Items TOSHIBA HDD2D31BZK01 FUJITSU G8BC0002WC10 Outline Width (mm) 69.85±0.25 70 dimensions Height (mm) 9.5±0.2 9.5 Depth (mm) Weight (g) 100±0.41 102 max. 100 101 max. Storage size (formatted) 120GB Speed (RPM) 5,400 Data transfer rate To/From media To/From host (Gbps) 244.7-474.7 (Mb/s) - Data buffer size (MB) 8 Average seek time Read (ms) Motor startup time (s) 61.
1.4 Optical Drive 1.4 1 Hardware Overview Optical Drive 1.4.1 DVD-ROM Drive The DVD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD-ROM and DVD-ROM. The DVD-ROM drive is shown in Figure 1-5. The dimensions and specifications of the DVD-ROM drive are described in Table 1-2, Table 1-3.
1 Hardware Overview 1.4 Optical Drive Table 1-3 DVD-ROM drive specifications Item Specifications TEAC G8CC0002E520 Data transfer speed (Read) DVD-ROM CD-ROM Max. 8x CAV Max. 24x CAV ATAPI Burst (MB/s) PIO Mode DMA Mode Ultra DMA Mode 16.7 (PIO Mode 0 to 4) 16.7 (Multi Word Mode 0 to 2) 33.3 Access time (ms) CD-ROM DVD-ROM Data Buffer Capacity 1-18 120 typ. (Random) 130 typ.
1.4 Optical Drive 1 Hardware Overview 1.4.2 DVD-ROM & CD-R/RW Drive The DVD-ROM & CD-R/RW drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15inch) CD-ROM, DVD-ROM and CD-R/RW. The DVD-ROM & CD-R/RW drive is shown in Figure 1-6. The dimensions and specifications of the DVD-ROM & CD-R/RW drive are described in Table 1-4 and Table 1-5.
1 Hardware Overview 1.4 Optical Drive Table 1-5 DVD-ROM & CD-R/RW drive specifications (1/2) Item Specifications MATSUSHITA G8CC0002J520 Data transfer speed (Read) DVD-ROM CD-ROM Max. 8x CAV Max. 24x CAV Data transfer speed (Write) CD-R CD-RW High Speed CD-RW Ultra Speed CD-RW Max. 24x CAV Max. 4x CLV Max. 10x CLV Max. 24x CAV ATAPI Burst (MB/s) PIO Mode DMA Mode Ultra DMA Mode 16.6 (PIO MODE4) 16.6 (Multi Word Mode2) 33.
1.4 Optical Drive 1 Hardware Overview Table 1-5 DVD-ROM & CD-R/RW drive specifications (2/2) Specifications Item TEAC G8CC00032520 Data transfer speed (Read) DVD-ROM CD-ROM Max. 8x CAV Max. 24x CAV Data transfer speed (Write) CD-R CD-RW High Speed CD-RW Ultra Speed CD-RW Max. 24x CAV Max. 4x CLV Max. 10x CLV Max. 24x CAV ATAPI Burst (MB/s) PIO Mode DMA Mode Ultra DMA Mode 16.7 (Mode 0 to 4) 16.7 (Mode 0 to 2) 33.
1 Hardware Overview 1.4 Optical Drive 1.4.3 DVD Super Multi Drive (Double-layer) The DVD Super Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD/DVD-ROM, CD-R/RW, DVD±R/±RW (DL) and DVD-RAM. The DVD Super Multi drive is shown in Figure 1-7. The dimensions and specifications of the DVD Super Multi drive are described in Table 1-6 and Table 1-7.
1.4 Optical Drive 1 Hardware Overview Table 1-7 DVD Super Multi drive specifications (1/2) Specifications Item MATSUSHITA G8CC0002T520 Data transfer speed (Read) DVD-ROM CD-ROM Max. 8x CAV Max. 24x CAV Data transfer speed (Write) Max. 24x ZCLV Max. 4x CLV Max. 10x CLV Max. 10x CLV Max. 8x ZCLV Max. 2x CLV Max. 4x ZCLV Max. 8x ZCLV Max. 2.4x CLV Max. 4x ZCLV Max. 3-5x ZCLV (4.
1 Hardware Overview 1.4 Optical Drive Table 1-7 DVD Super Multi drive specifications (2/2) Item Specifications Pioneer G8CC0002U530 Data transfer speed (Read) DVD-ROM CD-ROM Max. 8x CAV Max. 24x CAV Data transfer speed (Write) CD-R CD-RW DVD-R DVD-R DL DVD-RW DVD+R DVD+R DL DVD+RW DVD-RAM Max. 24x ZCLV Max. 10x ZCLV Max. 8x ZCLV Max. 2x CLV Max. 4x ZCLV Max. 8x ZCLV Max. 2.4x CLV Max. 4x ZCLV Max. 5x ZCLV ATAPI Burst (MB/s) PIO Mode DMA Mode Ultra DMA Mode 16.6 (PIO MODE4) 16.
1.5 Keyboard 1.5 1 Hardware Overview Keyboard The keyboard is mounted 85(US)/87(UK) keys that consist of character key and control key. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure1-8 is a view of the keyboard. See Appendix E about a layout of the keyboard.
1 Hardware Overview 1.6 1.6 TFT Color Display TFT Color Display The TFT color display consists of a LCD module and FL inverter board. 1.6.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display images and characters of 16M colors with 1,440×900 (WXGA+) resolution. Figure 1-9 shows a view of the LCD module and Table 1-8 lists the specifications. Figure 1-9 LCD module Table 1-8 LCD module specifications (14.
1.6 TFT Color Display 1 Hardware Overview 1.6.2 FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module FL. Table 1-9 lists the FL inverter board specifications. Table 1-9 FL inverter board specifications Item Specifications G71C00011111 Input Output Voltage (V) 5 (DC) Power (W) 7 Voltage (V) 750 (r.m.s) Power (W/VA) 5/7 Current (mA) 6.00 (r.m.
1 Hardware Overview 1.7 1.7 Power Supply Power Supply The power supply supplies different voltages to the system board. The power supply microcontroller has the following functions. 1. Judges that the DC power supply (AC adapter) is connected to the computer. 2. Detects DC output and circuit malfunctions. 3. Controls the battery icon, and DC IN icon. 4. Turns the battery charging system on and off and detects a fully charged battery. 5. Turns the power supply on and off. 6.
1.7 Power Supply 1 Hardware Overview Table 1-10 lists the power supply output specifications. Table 1-10 Power supply output specifications (1/2) Power supply (Yes/No) Name Voltage [V] Power OFF (Suspend mode) Power OFF (Boot mode) No battery PPV 1.500 0.300 No No No CPU PTV 1.05 No No No CPU, MCH, GMCH, ICH7-M 1R5-P1V 1.5 No No No CPU, MCH, GMCH, ICH7-M, PCI-e Mini Card 1R8-B1V 1.8 Yes No No MCH, GMCH, DDR2-SDRAM 1R8-P1V 1.8 No No No GPU, VRAM 2R5-P2V 2.
1 Hardware Overview 1.7 Power Supply Table 1-10 Power supply output specifications (2/2) Power supply (Yes/No) Name Voltage [V] Power OFF (Suspend mode) Power OFF (Boot mode) No battery SND-P5V 5 No No No AN12941A A4R7-P4V 4.7 No No No ALC262, AN12941A R3V 2.0-3.
1.8 Batteries 1.8 1 Hardware Overview Batteries The PC has the following three batteries. Main battery Secondary battery (Provided with some models or option) Real time clock (RTC) battery Table 1-11 lists the specifications for these two batteries. Table 1-11 Battery specifications Battery Name Main battery G71C0004S510 Battery Element Output Voltage Capacity Lithium ion (6 cell) 10.8 V 4,700mAh Lithium ion (6 cell) 10.8 V 4,000mAh Nickel hydrogen 2.
1 Hardware Overview 1.8 Batteries 1.8.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and detects a full charge when the AC adapter and battery are connected to the computer. Quick Battery Charge When the AC adapter is connected, normal charging is used while the system is turned on and quick charge is used while the system is turned off or in standby mode. Table 1-12 lists the main battery charging time.
1.8 Batteries 1 Hardware Overview 1.8.3 RTC Battery The RTC battery provides the power supply to maintain the date, time, and other system information in memory. Table 1-14 lists the battery charging time and data preservation times.
1 Hardware Overview 1.9 1.9 AC Adapter AC Adapter The AC adapter is also used to charge the battery. Table 1-15 lists the AC adapter specifications. Table 1-15 AC adapter specifications Parameter Specification G71C00043310 (2-pin) Power G71C00049510 (3-pin) 75W (Peak 90W) Input voltage Input frequency Input current 100V/240V 50Hz to 60Hz 1.
Chapter 2 Troubleshooting [CONFIDENTIAL]
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2 Troubleshooting Chapter 2 Contents 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart........................................................................................ 2-2 2.3 Power Supply Troubleshooting.................................................................................. 2-6 2.4 2.5 2.6 2.7 Procedure 1 Power Supply Icon Check.......................................
2 Troubleshooting 2.8 2.9 2.10 2.11 2.12 2.13 2.14 2.15 2-iv Display Troubleshooting.......................................................................................... 2-41 Procedure 1 External Monitor Check....................................................... 2-41 Procedure 2 Diagnostic Test Program Execution Check ......................... 2-41 Procedure 3 Connector and Cable Check................................................. 2-42 Procedure 4 Replacement Check ...............
2 Troubleshooting 2.16 2.17 2.18 Tablet Pen Troubleshooting..................................................................................... 2-52 Procedure 1 Check on Windows XP Tablet PC Edition .......................... 2-52 Procedure 2 Tablet pen replacement Check............................................. 2-52 Procedure 3 Connector Check and Replacement Check.......................... 2-53 Wireless LAN Troubleshooting......................................................................
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2.1 Troubleshooting 2 Troubleshooting 2 2.1 Troubleshooting Chapter 2 describes how to determine which Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. (The “FRU” means the replaceable unit in the field.) The FRUs covered are: 1. 2. 3. 4. 5. 6. 7. 8. Power supply System board 3.5” USB FDD 2.5” HDD Keyboard Display Touch pad Optical drive 9. Modem 10. Bluetooth 11. LAN 12. Sound 13. Bridge media slot 14. Tablet pen 15. Wireless LAN 16.
2 Troubleshooting 2.2 2.2 Troubleshooting Flowchart Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which FRU malfunctions. Before going through the flowchart steps, check the following: Make sure that Toshiba Windows® XP Tablet PC Edition is installed on the hard disk. Other operating systems can cause the computer malfunction. Make sure all optional equipment is removed from the computer.
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2 Troubleshooting 2.
2.2 Troubleshooting Flowchart 2 Troubleshooting If the diagnostics program cannot detect an error, the problem may occur intermittently. The Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error(s), and perform the appropriate troubleshooting procedures as follows: 1.
2 Troubleshooting 2.3 2.3 Power Supply Troubleshooting Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2.3 Power Supply Troubleshooting Procedure 1 2 Troubleshooting Power Supply Icon Check The following two icons indicate the power supply status: Battery icon DC IN icon The power supply controller uses the power supply status with the Battery icon and the DC IN icon as listed in the tables below. Table 2-1 Battery icon Battery icon Power supply status Lights orange Battery is charged and the external DC is input. It has no relation with ON/OFF of the system power.
2 Troubleshooting 2.3 Power Supply Troubleshooting When icons are blinking, perform the following procedure. 1. Remove the battery pack and the AC adapter and cut off the power supply to the computer by force. 2. Re-attach the battery pack and the AC adapter. If icons are still blinking after the operation above, check the followings: Check 1 If the DC IN icon blinks orange, go to Procedure 2. Check 2 If the DC IN icon does not light, go to Procedure 3.
2.3 Power Supply Troubleshooting Procedure 2 2 Troubleshooting Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below. Start Error code (8 bit) “1” “0” Interval between data bits The error code begins with LSB (Least Significant bit) Example: Error code 11h (Error codes are given in hexadecimal format.
2 Troubleshooting 2.3 Power Supply Troubleshooting DC power supply (AC adapter) Error code Meaning 10h AC Adapter output voltage is over 16.5V. 11h TOSHIBA Express Port Replicator output voltage is over 16.5V. 12h Current from the DC power supply is over 7.0A. 13h Current from the DC power supply is over 0.5A in no load. 14h Abnormal current of 0[A] correction has been sensed. Main Battery Error code Meaning 22h Main battery discharge current is over 0.5A in no load.
2.3 Power Supply Troubleshooting 2 Troubleshooting E5V output Error code Meaning 50h E5V voltage is over 6.00V. 51h E5V voltage is under 4.50V when the computer is powered on. 52h E5V voltage is under 4.50V at booting up. 54h E5V voltage is under 4.50V when EV power is maintained and “OUTV1 power = EV power” is specified. E3V output Error code Meaning 60h E3V voltage is over 3.96V. 61h E3V voltage is under 2.81V when the computer is powered on. 62h E3V voltage is under 2.
2 Troubleshooting 2.3 Power Supply Troubleshooting PPV output Error code Meaning 90h PPV voltage is over 1.80V. 91h PPV voltage is under 0.32V when the computer is powered on. 92h PPV voltage is under 0.32V at booting up. PTV output Error code Meaning A0h PTV voltage is over 1.32V. A1h PTV voltage is under 0.85V when the computer is powered on. A2h PTV voltage is under 0.85V at booting up. 1R5-E1V output Error code Meaning B0h 1R5-E1V voltage is over 1.80V.
2.3 Power Supply Troubleshooting 2 Troubleshooting PPV output Error code Meaning D0h PPV voltage is over 1.80V. D1h PPV voltage is under 0.32V when the computer is powered on. D2h PPV voltage is under 0.32V at booting up. PTV (Intel 945GM model) or PGV (Intel 945PM model) Error code Meaning E0h PTV or PGV voltage is over 1.32V. E1h PTV or PGV voltage is under 0.85V when the computer is powered on. E2h PTV or PGV voltage is under 0.85V at booting up.
2 Troubleshooting Procedure 3 2.3 Power Supply Troubleshooting Connection Check The wiring diagram related to the power supply is shown below: Any of the connectors may be disconnected. Perform starting from Check 1. Check 1 Make sure the AC adapter and the AC power cord are firmly plugged into the DC IN jack and wall outlet. If these cables are connected correctly, go to Check 2. Check 2 Replace the AC adapter and the AC power cord with new ones.
2.3 Power Supply Troubleshooting Procedure 4 2 Troubleshooting Quick Charge Check Check if the power supply controller charges the battery pack properly. Perform the following procedures: Check 1 Make sure the AC adapter is firmly plugged into the DC IN socket. Check 2 Make sure the battery pack is properly installed to the PC. If the battery is properly installed, go to Check 3. Check 3 The battery pack may be completely discharged.
2 Troubleshooting 2.4 2.4 System board Troubleshooting System board Troubleshooting This section describes how to determine if the System board is defective. Start with Procedure 1 and continue with the other procedures as instructed.
2.4 System board Troubleshooting Procedure 1 2 Troubleshooting Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the System board and initializes it. If an error message is shown on the display, perform Check 1. If there is no error message, go to Procedure 2. If DOS or Windows XP Tablet PC Edition is properly loaded, go to Procedure 4.
2 Troubleshooting Check 3 2.4 System board Troubleshooting The IRT checks the System board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (15), (20) or (21) appears, go to Procedure 4. If the error message (16) appears, go to the Keyboard Troubleshooting Procedures in Section 2.7. If the error message (17) or (18) appears, go to the HDD Troubleshooting Procedures in Section 2.6.
2.4 System board Troubleshooting Procedure 2 2 Troubleshooting Debug Port (D port) Check on Boot Mode Check the D port status by a debug port test. The tool for debug port test is shown below. Figure 2-2 A set of tool for debug port test The test procedures are follows; 1. Connect the debug port test cable to the connector CN3400 of the system board. For disassembling the PC to connect the test cable, refer to Chapter 4. 2. Connect the debug port test cable and RS-232C cross-cable to the test board. 3.
2 Troubleshooting 2.4 System board Troubleshooting 5. Execute GETDPORT.COM in the text menu in CPU REAL mode. (Insert the FD for starting D port into FDD and input “FD starting drive:>dport”.) The D port status is displayed in the following form; 6. When the D port status is FFFFh (normal status), go to Procedure 3. 7. When the D port status falls into any status in Table 2-4, execute Check 1.
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2 Troubleshooting 2.
2.4 System board Troubleshooting 2 Troubleshooting Table 2-4 Debug port (Boot mode) error status (3/10) D port status (F100h) Inspection items Initialization of H/W (before DRAM recognition) Details Initialization of MCHM Initialization of ICH7M.D30.Func0 Initialization of ICH7M.D31.Func0 Initialization of ICH7M.D31.Func1/2 Initialization of USB controller Initialization of ICH7M.D31.
2 Troubleshooting 2.
2.4 System board Troubleshooting 2 Troubleshooting Table 2-4 Debug port (Boot mode) error status (5/10) D port status F106h Inspection items Initialization of devices which need initialization before PCI bus initialization Details PIT test (at Cold boot only) and initialization Setting of test pattern to channel 0 of PIT#0 Check whether the set test pattern can be read.
2 Troubleshooting 2.
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2 Troubleshooting 2.4 System board Troubleshooting Table 2-4 Debug port (Boot mode) error status (8/10) D port status Inspection items Details F11Ah INIT_DMAC (boot mode) Initialization of DMAC F11Bh CHECK_SIO (for models supporting SIO) Check of SIO F11Dh Diagnostic Test In Models supporting Diagnostic Mode, it is enabled.
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2 Troubleshooting 2.4 System board Troubleshooting Table 2-4 Debug port (Boot mode) error status (10/10) D port status Inspection items F122h Start of BIOS security check F123h End of BIOS security check F124h Clear of IRT status, renewal of check sum of Runtime side FFFFh End Details When error occurred, halts at D port=F166h Check 1 If the D port is status F11Eh or F120h is displayed, go to HDD Troubleshooting Procedure in Section 2.6.
2.4 System board Troubleshooting Procedure 3 2 Troubleshooting Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the System board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test 6. Printer test 7. ASYNC test 8. Hard Disk test 9. Real Timer test 10. NDP test 11. Expansion test 12. CD-ROM/DVD-ROM test 13.
Chapter 3 Tests and Diagnostics [CONFIDENTIAL]
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3 Tests and Diagnostics Chapter 3 Contents 3.1 3.2 The Diagnostic Test ................................................................................................... 3-1 3.1.1 Diagnostics menu ................................................................................. 3-1 3.1.2 H/W (Hardware) initial information setting tool.................................. 3-3 3.1.3 Heatrun test program............................................................................
3 Tests and Diagnostics 3.22 3.23 3.24 3.25 3.21.1 Function Description .......................................................................... 3-49 3.21.2 Operations .......................................................................................... 3-49 Log Utilities ............................................................................................................. 3-50 3.22.1 Function Description ..........................................................................
3 Tests and Diagnostics 3.31.1 Function Description .......................................................................... 3-96 3.31.2 Accessing the SETUP Program.......................................................... 3-98 Figures Figure 3-1 Name and positions of each side.................................................................. 3-46 Tables Table 3-1 Subtest names...............................................................................................
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2 Troubleshooting 2.5 USB 3.5” FDD Troubleshooting 2 2.5 USB 3.5” FDD Troubleshooting This section describes how to determine if the USB 3.5” FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.5 USB 3.5” FDD Troubleshooting Procedure 2 2 Troubleshooting Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled. Floppy disk drive test error codes and their status names are listed in Table 2-5.
2 Troubleshooting Procedure 3 2.5 USB 3.5” FDD Troubleshooting Connector Check The USB FDD connector may be disconnected from the connector on the system board or USB board. Check visually that the connector is connected firmly. Check 1 Make sure the USB FDD cable is firmly connected to the CN4610 (port 4/6), CN4612 (port 0) on the system board or CN4630 (port 7) on the USB board. If the connection is loose, reconnect firmly and repeat Procedure 2. If there is still an error, go to Check 2.
2.6 2.5” HDD Troubleshooting 2.6 2 Troubleshooting 2.5” HDD Troubleshooting This section describes how to determine if the 2.5” HDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Partition Check Procedure 2: Message Check Procedure 3: Format Check Procedure 4: Diagnostic Test Program Execution Check Procedure 5: Connector Check and Replacement Check CAUTION: The contents of the 2.
2 Troubleshooting Procedure 2 2.6 2.5” HDD Troubleshooting Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen. Make sure of no floppy disk in the FDD. Turn on the computer and check the message on the screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with Check 1 below and perform the other checks as instructed.
2.6 2.5” HDD Troubleshooting Procedure 3 2 Troubleshooting Format Check The computer’s 2.5” HDD is formatted using the DOS FORMAT program or the physical format program of the test program. To format the 2.5” HDD, start with Check 1 below and perform the other steps as required. Refer to the DOS Manual for the operation of DOS. For the format by the test program, refer to the Chapter 3. Check 1 Format the 2.5” HDD using DOS FORMAT command. Type as FORMAT C:/S/U. If the 2.
2 Troubleshooting Procedure 4 2.6 2.5” HDD Troubleshooting Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. The error codes and statuses are described in Table 2-6.
2.6 2.5” HDD Troubleshooting Procedure 5 2 Troubleshooting Connector Check and Replacement Check The HDD is connected to the system board with a HDD cable. The connecting portions may be loose. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks to check the connecting portions: Check 1 Make sure the HDD cable is firmly connected to the connector CN1850 on the system board and HDD.
2 Troubleshooting 2.7 2.7 Keyboard Troubleshooting Keyboard Troubleshooting To determine if the computer’s keyboard is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test in the Diagnostic Program.
2.8 Display Troubleshooting 2.8 2 Troubleshooting Display Troubleshooting This section describes how to determine if the computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed.
2 Troubleshooting Procedure 3 2.8 Display Troubleshooting Connector and Cable Check The LCD module is connected to the System board through the LCD/FL cable. Also, the FL inverter is connected the system board through the LCD/FL cable. The cable may be firmly disconnected the board or damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures. If the connection is loose, reconnect the cable firmly and repeat Procedure 2.
2.9 Touch pad Troubleshooting 2.9 2 Troubleshooting Touch pad Troubleshooting To determine whether the Touch pad is faulty or not, perform the following procedures: Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Cable Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the test for Touch pad in ONLY ONE test in the Diagnostic Program.
2 Troubleshooting 2.10 Optical drive Troubleshooting 2.10 Optical drive Troubleshooting To check if the optical drive is defective or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Prepare the tools before the test. (Refer to tools for implementing the Diagnostics procedures on Chapter 3.
2.11 Modem Troubleshooting 2 Troubleshooting 2.11 Modem Troubleshooting To check if the modem is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Insert the LAN/Modem/Bluetooth/IEEEE1394 test program in the USB floppy disk drive, turn on the computer and run the test.
2 Troubleshooting Procedure 2 2.11 Modem Troubleshooting Connector Check and Replacement Check The Modem jack (RJ11) is mounted on the system board and MDC is connected to the system board. If the modem malfunctions, the connections may be bad or the MDC or system board might be faulty. Disassemble the computer following the steps described in Chapter 4 and perform the following checks: Check 1 Make sure the MDC is firmly connected to the CN3010 on the system board.
2.12 Bluetooth Troubleshooting 2 Troubleshooting 2.12 Bluetooth Troubleshooting This section describes how to determine if the Bluetooth in the computer is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedure 2 2.12 Bluetooth Troubleshooting Connection Check The Bluetooth functional wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the Bluetooth cable is firmly connected to connector on the Bluetooth module CN4400 on the System board. If the connector is disconnected, connect it firmly and perform Procedure 1.
2.13 LAN Troubleshooting 2 Troubleshooting 2.13 LAN Troubleshooting To check if the computer’s LAN is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check To check the LAN function, execute the LAN/Modem/Bluetooth/IEEEE1394 test program. See Chapter 3 for information on how to perform the test.
2 Troubleshooting 2.14 Sound Troubleshooting 2.14 Sound Troubleshooting To check if the sound function is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check Insert the Sound test program in the USB floppy disk drive, turn on the computer and run the test.
2.15 Bridge media Slot Troubleshooting 2 Troubleshooting 2.15 Bridge media Slot Troubleshooting To check if the Bridge media slot is good or no good, follow the troubleshooting procedures below as instructed. Procedure 1: Check on Windows XP Tablet PC Edition Procedure 2: Connector Check and Replacement Check Procedure 1 Check on Windows XP Tablet PC Edition Insert a Bridge media (SD memory card/SDIO card/Memory stick/Memory stick Pro/ xD Picture card/Multimedia card) into the slot.
2 Troubleshooting 2.16 Tablet Pen Troubleshooting 2.16 Tablet Pen Troubleshooting To check if the Tablet Pen is defective or not, follow the troubleshooting procedures below as instructed. CAUTION: Use the Tablet Pen supplied to this model.
2.16 Tablet Pen Troubleshooting Procedure 3 2 Troubleshooting Connector Check and Replacement Check The Digitizer and LCD are connected to the system board as below. Check 1 The Digitizer may be disconnected. Make sure the Digitizer is connected to the CN9540 on the system board. If there is still an error, go to Check 2. Check 2 The Digitizer or the system board may be defective. Replace it with a new one following the steps in Chapter 4. Then check the tablet pen is working properly.
2 Troubleshooting 2.17 Wireless LAN Troubleshooting 2.17 Wireless LAN Troubleshooting To check if the Wireless LAN is defective or not, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting/Receiving Check Procedure 2: Check of Antenna connection Procedure 3: Replacement Check Procedure 1 Transmitting/Receiving Check Make sure the wireless communication switch on the computer is turned ON. If it is not, turn ON.
2.17 Wireless LAN Troubleshooting Procedure 2 2 Troubleshooting Check of Antenna connection The wireless LAN functional wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, and perform the following checks: Check 1 The wireless LAN card and the system board may be disconnected. Make sure the wireless LAN card is firmly connected to the CN2600 of the system board.
2 Troubleshooting 2.18 Fingerprint sensor Troubleshooting 2.18 Fingerprint sensor Troubleshooting CAUTION: To delete the account for confirming the fingerprint operation, it is necessary to log on by the account with the management authority. If the password has been set to log on, ask the Log-ON password to the user. To check if the Fingerprint sensor works correctly or not, follow the troubleshooting procedures below as instructed. When failed in Procedure 1 to Procedure 3, execute Procedure 4.
2.18 Fingerprint sensor Troubleshooting Procedure 1 2 Troubleshooting Setting Windows Log-ON password 1. Open [User Account] from [Control Panel]. 2. Click [User Account]. 3. Click the icon of the account (user’s name) that you want to set the password. 4. Click “Create Account”. 5. Type a password in “Type a new password”. 6. Press Tab key. 7. Type the password again. 8. Click “Create Password” button. 9.
2 Troubleshooting 2.18 Fingerprint sensor Troubleshooting [User's Passport] appears in “Enter your password”. Click [Next]. When the finger print has been enrolled, [User’s Password] appears. Slide your finger enrolled or type the password. Click [Next]. 4. Type the Windows logon password in “Enter your password” and click [Next]. [User’s Password] appears.
2.18 Fingerprint sensor Troubleshooting 2 Troubleshooting 5. Confirm that the box of [Run interactive tutorial] is checked (when proceeding wit seeing Tutorial) and click [Next]. 6. Watch the Video carefully, click [Next].
2 Troubleshooting 2.18 Fingerprint sensor Troubleshooting 7. Put lightly your finger on the fingerprint sensor at the bottom right side of the display and slide your finger toward the right. Slide your finger four times. Four boxes are filled with fingerprints. At this time, when you click the [Replay video], you can watch the video that you have watched in Procedure 6.
2.18 Fingerprint sensor Troubleshooting 2 Troubleshooting When you have failed in any time of four times reading and want to practice again, click [Try again]. When you have fully succeeded in four times of reading, the message of “Fully succeeded” appears. 8. Click [Next]. The display of [User’s Fingers] 9. Click the box you want to enroll.
2 Troubleshooting 2.18 Fingerprint sensor Troubleshooting Put lightly the first joint of your finger you want to enroll on the fingerprint sensor and slide your finger toward you. Enroll your finger three times. Every time your finger has been successfully enrolled, one box is checked. When your finger has been successfully enrolled three times, the message of “Succeeded” appears.
2.18 Fingerprint sensor Troubleshooting 2 Troubleshooting 13. Type a backup password two times in the following display. (This password is different from the password of Windows logon.) 14. Click [Next]. The [Finish] display appears. 15. Click [Finish], “Welcome” display appears.
2 Troubleshooting Procedure 3 2.18 Fingerprint sensor Troubleshooting Authentication of fingerprint 1. Turn on the computer to start up Windows. 2. In the Windows logon window, put lightly the first joint of your finger registered and slide your finger toward the right. When authenticated, [Success] is displayed in the fingerprint authentication display. When not authenticated well, warning message appears.
2.18 Fingerprint sensor Troubleshooting Procedure 4 2 Troubleshooting Connector Check and Replacement Check The Fingerprint sensor cable is connected to the connector CN9560 on the Fingerprint sensor board and connector CN9540 on the system board. Check 1 Check the Fingerprint sensor cable is firmly connected to the connector CN9560 on the Fingerprint sensor board and connector CN9540 on the system board. If not, connect it firmly.
2 Troubleshooting 2-66 [CONFIDENTIAL] 2.
3.1 The Diagnostic Test 3 Tests and Diagnostics 3 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
3 Tests and Diagnostics 3.1 The Diagnostic Test REAL TIMER TEST NDP TEST EXPANSION TEST CD-ROM/DVD-ROM TEST Other tests are: Wireless LAN TEST (Wireless LAN test disk) LAN/Modem/Bluetooth/IEEE1394 TEST (LAN/Modem/Bluetooth/IEEE1394 test disk) Sound TEST (Sound test disk) You will need the following equipment to perform some of the Diagnostic test programs.
3.1 The Diagnostic Test 3 Tests and Diagnostics 3.1.2 H/W (Hardware) initial information setting tool The H/W initial information setting tool consists of the following programs. Initial configuration DMI information save DMI information recovery System configuration display E2PROM test (MAC/GUID/DMI) You will need the following equipment to perform some of the programs. The Diagnostics Disk (Main T&D) 3.1.3 Heatrun test program The heatrun test starts automatically after the selection.
3 Tests and Diagnostics 3.2 3.2 Executing the Diagnostic Test Executing the Diagnostic Test To start the DIAGNOSTIC PROGRAM, follow these steps: 1. Insert the Diagnostics disk in the USB floppy disk drive. 2. Turn on the computer with pressing the U. Then, the following menu appears. Repair test program (XXXXXX/XXXXXXX) --------------------------------------------------------1. Repair Main (T&D) 2. Repair initial config set 3.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 3.2.1 Diagnostics menu (T&D) To execute this program, press 1, or select 1-Repair Main (T&D) in the startup menu and press Enter. The following menu appears. TOSHIBA personal computer Common DIAGNOSTICS Version X.XX (c) copyright TOSHIBA Corp.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Functions 1 through 12 are the Diagnostic Tests. Function 88 sets the floppy disk drive and hard disk drive error retry count (0-255). To exit the submenu of the Diagnostic Test and returns to the Diagnostics Menu, set the highlight bar to function 99 and press Enter. Select the option you want to execute and press Enter.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Use the up and down arrow keys to move the cursor to “ERROR STOP”. Use the right and left arrow keys to move the cursor to the desired option and press Enter.
3 Tests and Diagnostics 3.3 3.3 Setting of the hardware configuration Setting of the hardware configuration To execute this program, press 2 or select 2-Repair initial config set in the startup menu and press Enter and follow the directions on the screen. The H/W initial information setting tool consists of four subtests. Move the highlight bar to the subtest you want to execute and press Enter.
3.3 Setting of the hardware configuration 3 Tests and Diagnostics Setting of the HWSC Setting of the UUID Display of the DMI information (including UUID) Setting of DVD region code (Yes/No) After completion of the above settings, H/W configuration & DMI information are appeared in order. Check the contents and press Enter. Following message appears in the display. Press any key, then return to the H/W initial information setting tool menu.
3 Tests and Diagnostics Subtest 04 3.3 Setting of the hardware configuration System configuration display This subtest displays the information of the system configuration. Confirm the contents and press Enter. For more details on the system configuration information, refer to 3.25 “System configuration”. Subtest 05 E2PROM test (MAC/GUID/DMI) It checks whether the MAC address, GUID of IEEE1394 and DMI information are written.
3.4 Heatrun Test 3.4 3 Tests and Diagnostics Heatrun Test To execute this program, press 3 or select 3-Repair heatrun (T&D) in the startup menu and press Enter. After selecting the test, the same subtests as 3.23 RUNNING TEST are executed successively. For more details on the procedure and test content, refer to RUNNING TEST. When the heatrun test ends, following message appears in the display.
3 Tests and Diagnostics 3.5 3.5 Subtest Names Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No. 3-12 Test Name Subtest No.
3.5 Subtest Names 3 Tests and Diagnostics Table 3-1 Subtest names (2/2) No. 6 Test Name PRINTER [It is not supported] 7 ASYNC [It is not supported] Subtest No.
3 Tests and Diagnostics 3.6 3.6 System Test System Test To execute the System Test select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM checksum This subtest executes a checksum test of the BIOS ROM (range: F0000h to FFFFFh, 64KB) on the System board. Subtest 02 Fan ON/OFF This subtest turns on/off the fan motor by force with Fan ON/OFF commands.
3.6 System Test 3 Tests and Diagnostics This subtest checks the status for the quick charge. Subtest 05 DMI read This subtest displays the information in the Flash-ROM in the following format. *** DMI Data Display Ver X.
3 Tests and Diagnostics 3.7 3.7 Memory Test Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Conventional memory This subtest writes a constant data to conventional memory (0 to 640 KB), then reads the new data and compares the result with the original data. Subtest 02 Protected mode NOTE: The CONFIG.
3.8 Keyboard Test 3.8 3 Tests and Diagnostics Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed key code display When a key is pressed, the scan code, character code, and key top name are displayed on the screen in the format shown below.
3 Tests and Diagnostics 3.9 3.9 Display Test Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM read/write for VGA This subtest writes the constant data (AAh and 55h) to the video RAM. The data is read and compared to the original data.
3.9 Display Test Subtest 04 3 Tests and Diagnostics Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode 12] 13] 3] 111 112 114 115 117 118 640*480 640*480 800*600 800*600 1024*768 1024*768 64K] 16M] 64K] 16M] 64K] 16M] The display below appears on the screen when this subtest is executed.
3 Tests and Diagnostics Subtest 06 3.9 Display Test “H” pattern display This subtest displays a full screen of “H” patterns.
3.10 Floppy Disk Test 3 Tests and Diagnostics 3.10 Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. The contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. 1. The following message will appear. Select the media mode and start track to be tested, then press Enter.
3 Tests and Diagnostics 3.10 Floppy Disk Test Select the number of the subtest you want to execute and press Enter. The following message will appear during the floppy disk test. FLOPPY DISK IN PROGRESS SUB-TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXXXXXX XXX DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] : test end [Ctrl]+[C] : key stop ERROR COUNT READ DATA STATUS : XXXXX : XX : XXX When the subtest 04 or 05 is selected, the following messages will appear on the screen.
3.11 Printer Test 3 Tests and Diagnostics 3.11 Printer Test CAUTION: Printer Test is not supported for this model. To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. NOTE: An IBM compatible printer must be connected to the system to execute this test. Also, printer port wraparound connector must be connected.
3 Tests and Diagnostics Subtest 02 3.11 Printer Test Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wraparound NOTE: To execute this subtest, a printer wraparound connector must be connected to the computer’s printer port.
3.12 Async Test 3 Tests and Diagnostics 3.12 Async Test CAUTION: Async Test is not supported for this model. To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
3 Tests and Diagnostics 3.13 Hard Disk Test 3.13 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. CAUTION: 1. When executing subtest02, 03, 04, 06, 08 and 09, the message [The hard disk will be destroyed.] will be displayed. The contents of the hard disk will be erased when these tests are executed.
3.13 Hard Disk Test 3 Tests and Diagnostics 3. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest. Hard DISK TEST SUB TEST PASS COUNT WRITE DATA ADDRESS XXXXXXX : : : : XX XXXXX XX XXXXXX XXX DIAGNOSTIC TEST VX.
3 Tests and Diagnostics Subtest 04 3.13 Hard Disk Test Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder.
3.14 Real Timer Test 3 Tests and Diagnostics 3 3.14 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real time A new date and time can be input during this subtest. To execute the real time subtest, follow these steps: 1.
3 Tests and Diagnostics Subtest 03 3.14 Real Timer Test Real time carry CAUTION: When this subtest is executed, the current date and time are erased. This subtest checks the real time clock increments.
3.15 NDP Test 3 Tests and Diagnostics 3.15 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen.
3 Tests and Diagnostics 3.16 Expansion Test 3.16 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wraparound CAUTION: PCMCIA wraparound test is not supported for this model. NOTE: To execute this subtest, the PC card wraparound connector is required.
3.16 Expansion Test Subtest 02 3 Tests and Diagnostics RGB monitor ID NOTE: To execute this subtest, an external monitor with monitor ID function is required. Connect the external monitor to the PC for the test of ID acquisition. The judgment of acquisition is based on the panel data. In simultaneous display mode or internal display mode, in which the panel data is acquired, this subtest will fail. Therefore, make sure only the external display is selected when executing this subtest.
3 Tests and Diagnostics 3.17 CD-ROM/DVD-ROM Test 3.17 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM test, select 12 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1. For the subtest 04, use a CD-RW media on the market.
3.18 Error Code and Error Status Names 3 Tests and Diagnostics 3.18 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test.
3 Tests and Diagnostics 3.
3.
3 Tests and Diagnostics 3.19 Hard Disk Test Detail Status 3.19 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eightdigit number. The first four digits represent the hard disk controller (HDC) error status number and the last four digits are not used.
3.19 Hard Disk Test Detail Status 3 Tests and Diagnostics Table 3-4 Error register contents Bit Name Description 7 BBK (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error. “1” … Uncorrectable data error has been detected. 5 —— Not used 4 IDN (Identification) “0” … Not used “1” … There is no ID field in the requested sector.
3 Tests and Diagnostics 3.20 3.20 Only One Test Only One Test 3.20.1 Program Description This program tests the unique functions of this model. 3.20.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter. The following menu appears in the display.
3.20 Only One Test Subtest 01 3 Tests and Diagnostics Pressed Key Display When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed. Holding a key down enables the auto-repeat function which causes the key’s display character to blink. Press Del + Enter to end the test.
3 Tests and Diagnostics Subtest 02 3.20 Only One Test Touch Pad This subtest checks the functions of the touch pad as shown below. A) Touch Pad direction and parameter. B) Touch Pad switch function check. This test displays the response from the touch pad and touch pad switch. When moving your finger on the touch pad towards the upper left, the display changes according to the following illustration. If a touch pad switch is pressed, the displays appear on the right side one by one.
3.20 Only One Test Subtest 03 3 Tests and Diagnostics Wireless Communication Switch This subtest checks if the Wireless communication switch works properly. If the test is started with the switch ON, the following message appears in the display. Wireless communication switch is set to a start position (OFF) Slide the switch to OFF position. Then, the following message appears in the display. Wireless communication SWITCH ON !! Slide the switch to ON position.
3 Tests and Diagnostics 3.20 Only One Test NG message appears in the display if an error is found during the test. Confirm the connection of cable, and then execute the test again. Press 9 and Enter to return to Only One Test menu. Subtest 05 LED This subtest checks if each LED lights properly. The following message appears in the display in order. Follow the instructions in the display to execute the test. [HDD Access LED test] Confirm the LED of HDD status blinks properly.
3.20 Only One Test Subtest 06 3 Tests and Diagnostics Button This subtest checks if the buttons in the following figure work properly. Cross Function Button ESC/Rotation Button TOSHIBA Presentation button Windows Security Button TOSHIBA Assist button The following message appears in the display. “Press Function Button key” Press Cross Function button. Then the following message appears in the display. “Press Function Button key” Press Escape/Rotation button.
3 Tests and Diagnostics Subtest 07 3.20 Only One Test Acceleration sensor This subtest detects and corrects the each axis (X, Y, Z). NOTE: Make sure that this subtest is executed on the following condition: 1. Flat desk with vertical plane to get the stability of machine. 2. Prevent the machine from shake or shock. Set the machine against the vertical plane with the Front upward Vertical plane Flat desk The figure below shows the name and position of each side.
3.20 Only One Test 3 Tests and Diagnostics When this subtest is selected, the following message appears in the display. The revision data has written in Exit to [Enter] / Continue to [Space] key Then press Space to continue the test. The following message appears in the display. The heaven surface establishes in the upper direction Press [Enter] key NOTE: Be sure to execute the test with the display panel opened. Set the machine on the flat desk.
3 Tests and Diagnostics 3.20 Only One Test ** Setting OK! ** Press [Enter] key When a defective is found during the each check above, the following message appears in the display. The test is halted at the point when the defective is found. ** Setting ERROR! ** Press [Enter] key Press Enter and return to the Only One Test menu. Then execute the test again.
3.21 Head Cleaning 3.21 3 Tests and Diagnostics Head Cleaning 3.21.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.21.2 Operations 1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS - FLOPPY DISK HEAD CLEANING : VX.XX Mount cleaning disk(s) on drive(s). Press any key when ready. 2.
3 Tests and Diagnostics 3.22 3.22 Log Utilities Log Utilities 3.22.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk, or output the data to a printer or the display. The error information is displayed in the following order: 1. Error count (CNT) 2. Test name, Subtest number (TS-No) 3. Pass count (PASS) 4. Error status (STS) 5. FDD/HDD or memory address (ADDR) 6. Write data (WD) 7.
3.22 Log Utilities 3 Tests and Diagnostics 3.22.2 Operations 1.
3 Tests and Diagnostics 3.23 3.23 Running Test Running Test 3.23.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02, 06) 3. Display test (subtest 01) 4. Real timer test (subtest 02) 5. HDD test (subtests 01) The system automatically detects the number of floppy disk drives connected to the computer for the FDD test. 3.23.2 Operations 1.
3.24 Floppy Disk Drive Utilities 3.24 3 Tests and Diagnostics Floppy Disk Drive Utilities 3.24.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE: This program is only for testing a floppy disk drive. It is different from the Toshiba MS-DOS FORMAT command.
3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 3.24.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 2 3 4 9 – - FORMAT COPY DUMP HDD-ID READ EXIT TO DIAGNOSTICS MENU 2. FORMAT program (a) Selecting FORMAT displays the following message: DIAGNOSTICS - FLOPPY DISK FORMAT : VX.
3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below: Insert source disk into drive A: Press any key when ready. (c) Remove the Diagnostics Disk from the FDD, insert the source disk and press any key. The following message will appear, indicating the program has started.
3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If 2:HDD is selected, the display will go to step (h). If 1:FDD is selected, the following message will appear: Select drive number (1:A, 2:B) ? (c) Select a drive number and the following message will be displayed.
3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? 5. HDD ID READ program Selecting HDD ID displays the following HDD ID configuration: [HDD ID Read (VX.XX)] [Drive #1] [Drive #2] Model No. = = XXXXXXX YYYYYYY Press Enter to return to the FDD UTILITIES MENU.
3 Tests and Diagnostics 3.25 System Configuration 3 3.25 System Configuration 3.25.1 Function Description The System Configuration program contains the following configuration information for the computer: 1. Processor Type [Code/L2 cache] 2. Chip set [VRAM] 3. BIOS ROM version [1st ID, 2nd ID] 4. Boot ROM version 5. EC Total version 6. PS Microprocessor version 7. SVP parameter version [Panel/Manufacture code/Product code] 8. Microcode revision [Processor number] 9.
3.25 System Configuration 3 Tests and Diagnostics 3.25.2 Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display. System Configuration Display : Ver X.XX [Machine Name ???] * * * * * * * * * * * * * * * * * - * Processor Type = XXXXXX-XXXXXMHz Code = XX L2 Cache = XXXXXKB Chip set = XXXXXX VRAM = XXXXXXMB BIOS-ROM Version = VX.XX 1st ID = XXH, 2nd ID = XXH BOOT-ROM Version = VX.XX EC Total Version = VX.XX PS Micom Version = VX.
3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Intel-made b/g) 3.26 Wireless LAN Test Program (Intel-made b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade Calexico 802.11b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS.
3.26 Wireless LAN Test Program (Intel-made b/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Using a wrong wireless LAN card (Using unspecified card) • Defective wireless LAN card Checking the connection, execute the subtest again. Subtest02 MAC Address Check This subtest displays the MAC address. Selecting this subtest, following message will appear in the display.
3 Tests and Diagnostics Subtest03 3.26 Wireless LAN Test Program (Intel-made b/g) Antenna check & communication test of 11b mode CAUTION: 1. To execute subtest 03-05, use another computer (with Calexico wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform those tests. Access points are also required. (Access point for 802.11b and 802.11g) 2. Be sure to turn the wireless communication switch ON before executing wireless LAN communication test.
3.26 Wireless LAN Test Program (Intel-made b/g) Subtest04 3 Tests and Diagnostics Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. After finishing the test, OK message will appear in the display. Press any key and return to the test menu. When a defective is found during the test, NG message will appear in the display. Press any key and following message will appear in the display.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g) 3.27 Wireless LAN Test Program (Intel-made a/b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade Calexico 802.11a/b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS.
3.27 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics If a defective is found during the test, NG message will appear in the display. Press any key and following message will appear in the display. ************************************************************* * * * SKU NG !! * * * * Other Card or Module not found * * * ************************************************************* Press any key and return to the test menu.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g) When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Defective wireless LAN card • Disappearance of MAC address data Checking the connection, execute the subtest again. Subtest03 Antenna check & communication test of 11b mode CAUTION: 1.
3.27 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Connection of wireless LAN antenna cable (Main/Aux) • Condition of wireless LAN communication (Interference/obstruction) • Defective wireless LAN card Checking the connection and condition, execute the subtest again.
3 Tests and Diagnostics Subtest05 3.27 Wireless LAN Test Program (Intel-made a/b/g) Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. For more details on procedure and contents of this subtest, refer to Subtest04 Communication test of 11a mode. Subtest06 All the tests of Calexico 11a/ g Card This subtest checks SKU information, MAC address of Calexico 802.11a/b/g card, antenna connection and communication test of Calexico 802.
3.28 Wireless LAN Test Program (Atheros) 3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Atheros) This section describes how to perform the wireless LAN transmitting-receiving test with the test program. NOTE: Use another computer (with Atheros 11a/g(MB44ag)/Atheros 11a/g(MB62HL)) that can communicate by the wireless LAN as a responder machine to perform this test. The computer must be booted by the Responder T&D.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Atheros) 3.28.1 Setting the responder machine 1. MB44ag is installed 1) Boot the computer by MB4x Responder media. 2) The Responder T&D is automatically started. 2. MB6x is installed As the capacity of MB6x T&D is over the one of a FD, a RAM drive is used. 1) Boot the computer by MB6x Responder media. 2) After starting the OS, following message is displayed. Input m and press Enter.
3.28 Wireless LAN Test Program (Atheros) 3 Tests and Diagnostics 6) When the file copy is completed, the following test menu is displayed. Press r. The Responder T&D is started. ************************************************************ * * * Atheros MB6x DUT mode Maintenance T&D Menu * * * * d : DUT mode * * * * r : Responder mode * * * ************************************************************ SELECT MODE No.(d or r) : 3.28.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Atheros) 5) When the file copy is completed, the following test menu is displayed. Press d. The Responder T&D is started. ************************************************************ * * * Atheros MB6x DUT mode Maintenance T&D Menu * * * * d : DUT mode * * * * r : Responder mode * * * ************************************************************ SELECT MODE No.(d or r) : 6) The following test menu is displayed. Select the test number.
3.28 Wireless LAN Test Program (Atheros) 3 Tests and Diagnostics When an error (read error of EEPROM date) has detected, the following is displayed. ------------ERROR-----------file bac.txt cannot be opened 2. MAC Address Check The MAC address of the installed Wireless LAN card is checked. If it is not incorrect MAC address, the following is displayed. ************************************ * * * MAC Address Check : OK !! * * * ************************************ a.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Atheros) When an error has detected, the following is displayed. ************************************** * * * 11a Communication Test : NG !! * * * * Please refer to log.txt * * * ************************************** 4. Communication test of 11b mode The check of connection of 11b mode antenna and transmitting/receiving test are executed. When the test has been finished normally, the following is displayed.
3.28 Wireless LAN Test Program (Atheros) 3 Tests and Diagnostics 6. SKU & MAC Check 11a/b/g communication test All the test is executed in the order of SKU check of Module, MAC Address Check, Communication test of 11a mode, Communication test of 11b mode and Communication test of 11g mode. The check of connection of 11g mode antenna and transmitting/receiving test are executed.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the test program. Insert the test program disk for LAN/Modem/Bluetooth/IEEE1394 test in FDD and turn on the power. The following message will appear: Microsoft Windows XX Startup Menu ---------------------------------1. LAN 2. Modem 3. Bluetooth 4.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest01 3 Tests and Diagnostics (i82562 + ICHx) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip.
3 Tests and Diagnostics Subtest02 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program (GbE) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. Select 2 to execute and press Enter. The following message will appear: Testing adapter...hit to abort. * External Loopback Test...PASSED Testing completed.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.2 3 Tests and Diagnostics Modem test For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Denki Seisakusyo)” for the tests. To execute Modem test, press 2 and Enter. Following message will appear: [Modem loopback test !] ICHx MDC Test Program with Modem Sound (Line Test) Version X.
3 Tests and Diagnostics 3.29.3 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Bluetooth test To execute this test, input 3 and press Enter. NOTE: Use another computer that can communicate by the Bluetooth as a reference machine to perform this test. Insert a floppy disk containing the test program into the target machine and turn on the target machine.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest01 3 Tests and Diagnostics BD_ADDR check This subtest checks the BD_ADDR functions. When the Bluetooth test menu is displayed, press 1 to select the test and press Enter. The following message will appear: ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program If the target machine has any problem, it displays Error CODE. The following message is displayed. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-6 Error code for Bluetooth test (BD_ADDR) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection. Hardware Failure.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Table 3-6 Error code for Bluetooth test (BD_ADDR) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics When the Bluetooth test menu is displayed, press T to select the test and press Enter in the test machine. The following message will appear: ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program If the target machine has any problem, the following message “INCOMPLETE” is displayed with the Error Code. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.4 3 Tests and Diagnostics IEEE1394 test To execute this test, input 4 and press Enter. NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test. The following menu will appear: ******************************************************************** ******** IEEE1394[XXXXX] Diagnostics program ************** ******************************************************************** * * * 1 ....
3.30 Sound Test program 3 3 Tests and Diagnostics Tests and Diagnostics 3.30 Sound Test program This section describes how to perform the Sound test. To execute the sound test, refer to the following description. Insert the test program disk for Sound test in the floppy disk drive and turn on the power.
3.30 Sound Test program 3 Tests and Diagnostics To return to the Sound test menu, Press 9 and Enter. Then following message will appear in the display. *********************************** ******** May I Restart ? ******* *********************************** Press any key to continue… After pressing any key, the machine starts rebooting and sound test menu will appear in the display. Subtest01 Microphone recording & play This subtest checks the function of the CODEC A/D, D/A converter.
3 Tests and Diagnostics Subtest02 3.30 Sound Test program Sine Wave This subtest is executed by loading the COM file (ADSIN.COM). The program expands sine wave data table from 16KB to 64KB, and creates the play data. Then it transfers the data between the DMA and the CODEC to play the sine wave. (It sounds like a continuous beep). By using wave measurable devices such as an oscilloscope, the data can be measured as a sine wave.
3.30 Sound Test program 3 Tests and Diagnostics 3.30.3 CD Sound (Standard) To execute the CD Sound (Standard) test, press 3 and Enter. Insert the test media (TOSHIBA TEST CD-ROM or ABEX TEST CD-ROM) or music CD on the market (if the test media can not be prepared). Following menu appears in the display. For details on use of test media, refer to (1) Test media (Toshiba-made test media). For details on use of audio CD on the market, refer to (2) Audio CD.
3 Tests and Diagnostics Subtest02 3.30 Sound Test program English Narration Selected this subtest, narration in English starts. For more details on the procedure, refer to the subtest01. Subtest03 Test Tone A CAUTION: Before starting subtest03, be sure to set the sound at proper volume. This subtest plays sine wave while changing its table from 100Hz to 20Hz. Return to the CD Sound (Standard) menu after the test ends.
3.30 Sound Test program 3 Tests and Diagnostics (2) Audio CD Insert an audio CD and the following menu appears in the display. CD/DVD TEST IN PROGRESS XXXXXXXX SUB-TEST PASS COUNT WRITE DATA ADDRESS XX XXXXX XX XXXXXX : : : : xxxxxxx DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.31 SETUP 3.31 SETUP 3.31.1 Function Description This program displays the current system setup information as listed below: 1. Memory 2. System Date/Time 3. Battery (a) Battery Save Mode (b) PCI Express Link ASPM (c) Enhanced C-States 4. Password 5. HDD Password (a) (b) (c) (d) HDD HDD Password Mode User Password Master Password 6. Boot Priority (a) Boot Priority (b) HDD Priority (c) Network Boot Protocol 7.
3.31 SETUP 3 Tests and Diagnostics 11. Security Controller (a) TPM (b) Clear TPM Owner 12. Display (a) Power On Display (b) LCD Display Stretch (c) TV Type 13. Peripheral 14. LEGACY EMULATION (a) USB KB/Mouse Legacy Emulation (b) USB-FDD Legacy Emulation (c) USB Memory BIOS Support Type 15.
3 Tests and Diagnostics 3.31 SETUP 3.31.2 Accessing the SETUP Program Turn on the power while pressing ESC, the following menu appears. Check system. Then press [F1] key. Then press F1. The following display appears. *3 *4 *4 *4 *4 *1 *2 *5 NOTE: *1: Follow the HWSC about display / non-display of HDD Password window. *2: This appears in models for TCL (Canada). *3: This appears in models that have 10/100M Ether Net LAN. *4: This appears in models that have a CPU supporting this function.
3.31 SETUP 3 Tests and Diagnostics Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press ↑ and ↓ to move between items in a column. Press Fn+↑ (PgUp) and Fn + ↓ (PgDn) to move between the two pages. 2. Press either the Space bar or Back Space to change the value. Accepting Changes and Exiting the SETUP Window 1. Press End to accept the changes you made.
3 Tests and Diagnostics 3.31 SETUP SETUP Options The SETUP screen is divided into 15 functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s memory. This field displays the total amount of memory installed and is automatically calculated by the computer. You cannot change this value. 2. System Date/Time Sets the date and time. System Date Sets date. System Time Sets time. 3.
3.31 SETUP 3 Tests and Diagnostics NOTE: Display of the LCD Brightness will be changed in the condition below: (*1) Operating the battery (*2) Using the AC adapter User Setting Use this option to set the battery save parameters on the sub-window, BATTERY SAVE OPTIONS. Battery Save Options Processing Speed This feature changes the CPU processing speed. High CPU operates at 1 high speed. (Default in Full Power Mode) Low CPU operates at low speed.
3 Tests and Diagnostics 3.31 SETUP Cooling Method Maximum Performance If the CPU becomes too hot, the fan turns on automatically in a high speed to cool down the CPU. Performance If the CPU becomes too hot, the fan turns on automatically. When the CPU temperature falls to a normal range, the fan turns off. Battery optimized If the CPU becomes too hot, the processing speed is lowered. If the temperature is still too high, the fan turns on.
3.31 SETUP 3 Tests and Diagnostics 4. Password This option sets or resets the user password for power on. Registered The user password has been registered. Not registered The user password has not been registered. For details on setting the user password, refer to the User’s Manual. 5. HDD Password This option registers, resets or changes the HDD password. (a) HDD Hard disk for setting the password. Built-in HDD The password is set to Built-in HDD.
3 Tests and Diagnostics 3.31 SETUP 6. Boot Priority (a) Boot Priority This option sets the priority for booting the computer. Select from the following settings. FDD→HDD→CD-ROM→LAN: The computer looks for bootable files in the following order: FDD, HDD, CDROM and LAN HDD→CD-ROM→LAN→FDD: The computer looks for bootable files in the following order: HDD, CD-ROM, LAN and FDD. The computer looks for bootable files in the following order: FDD, CD-ROM, LAN and HDD.
3.31 SETUP 3 Tests and Diagnostics 7. Others Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use. (a) Core-Multi Processing NOTE: This is not displayed in PCs with a single core CPU. The Core Multi-Processing sets the CPU operating mode. Enabled Enables Core Multi-Processing functions. (Default) Disabled Disables Core Multi - Processing functions.
3 Tests and Diagnostics 3.31 SETUP (d) Virtualization Technology Virtualization Technology sets enable or disable of the Intel Virtualization Technology installed in the CPU. Intel Virtualization Technology is the technique that allows one machine to operate as multiple virtual machines. Enabled Enables Virtualization Technology. Disabled Disables Virtualization Technology. (Default) (e) Auto Power On This option displays setting for Auto Power On. Disabled Indicates auto power on is not set.
3.31 SETUP 3 Tests and Diagnostics NOTE: 1. Do not remove the AC adapter and battery pack at the same time when you use this feature. If you do so, data saved by the resume function will be lost. You must also reset this option. 2. If you have set a password and the computer boots by the Auto Power On function and Standby is on, the computer will start with the instant security function enabled. The password = message is not displayed; however, you must enter the password to use the computer. 3.
3 Tests and Diagnostics 3.31 SETUP This option displays the address and interrupt level for hard disk drive and optical disk drive. It is for information only and cannot be changed. Built-in HDD This item cannot be changed. CD-ROM This item cannot be changed. 10. PCI Bus This option displays the interrupt level for the Card Bus in the computer. It is for information only and cannot be changed. PCI BUS = IRQ10, IRQ11 11.
3.31 SETUP 3 Tests and Diagnostics 12. Display This group of options configures the computer’s display. (a) Power On Display This option is used to select the display when booting up. Auto-Selected Selects an external monitor if one is connected. Otherwise it selects the internal LCD. (Default) LCD +Analog RGB Selects both the internal LCD and the external CRT for simultaneous display. System LCD only Selects only internal LCD display even if the external monitor is connected. NOTE: 1.
3 Tests and Diagnostics 3.31 SETUP 13. Peripheral Use this option to select the peripheral’s mode. (a) Internal Pointing Device This option enables or disables the touch pad Enabled Enables the touch pad. (Default) Disabled Disables the touch pad. 14. LEGACY EMULATION (a) USB KB/Mouse Legacy Emulation This option sets the Legacy support condition of the USB keyboard and the USB mouse. Enabled Enables LEGACY support. (Default) USB keyboard/USB mouse are available without the driver.
Chapter 4 Replacement Procedures [CONFIDENTIAL]
4 Replacement Procedures 4 4-ii [CONFIDENTIAL] Satellite R20/TECRA M7 Maintenance Manual (960-572)
4 Replacement Procedures Chapter 4 4.1 Contents Overview................................................................................................................... 4-1 Safety Precautions ............................................................................................... 4-2 Before You Begin ............................................................................................... 4-3 Disassembly Procedure............................................................................
4 Replacement Procedures 4.21 GPU heat sink ......................................................................................................... 4-50 4.22 Fan/Heat sink/CPU ................................................................................................. 4-52 4.23 Sensor board............................................................................................................ 4-56 4.24 Speaker................................................................................
4 Replacement Procedures Figures Figure 4-1 Removing the battery pack................................................................................. 4-8 Figure 4-2 Removing the reserve pen................................................................................ 4-10 Figure 4-3 Removing the tablet PC pen............................................................................. 4-11 Figure 4-4 Removing the PC card ....................................................................................
4 Replacement Procedures Figure 4-32 Removing the system board ........................................................................... 4-48 Figure 4-33 Removing the GPU heat sink......................................................................... 4-50 Figure 4-34 Removing the fan/heat sink............................................................................ 4-52 Figure 4-35 separating the fan and heat sink .....................................................................
4.1 Overview 4 4 Replacement Procedures Replacement Procedures 4.1 Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual.
4 Replacement Procedures 4.1 Overview Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. DANGER: 1) Always use the genuine battery that is authorized by Toshiba or compatible with the unit. Since other battery packs have different specifications, they may be incompatible with the unit, and may burst or explode.
4.1 Overview 4 Replacement Procedures Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2. Battery Pack”. Do not disassemble the computer unless it is operating abnormally. Use the designated tools. Ensure that the environment for working on and storing parts does not contain any of the following.
4 Replacement Procedures 4.1 Overview Disassembly Procedure Four main types of cable connector are used. • Pressure plate connector • Spring connector • Back flip connector • Normal pin connector When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cable out from the connector.
4.1 Overview 4 Replacement Procedures Assembly Procedure After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. • Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems. • Check that all cables and connectors are securely connected.
4 Replacement Procedures 4.1 Overview Screw Tightening Torque Use the following torque when tightening screws. CAUTION: Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage. NOTE: To tighten screws quickly and accurately, an electric screwdriver is recommended. • M2 (2mm) 0.167 N•m (1.7 kgf •cm) • M2.5 (2.5mm) 0.294 N•m(3.0 kgf•cm) • M3 (3mm) 0.549 N•m(5.
4.1 Overview 4 Replacement Procedures Grip Color Some screws have a colored grip area to help you determine the length of the screw. Even numbered length screws: Brown Odd numbered length screws: White Special length screw: Blue “Special length screw” means screws whose length is indicated in an integral number to the first decimal places such as 2.5 mm, 2.6 mm and so on.
4 Replacement Procedures 4.2 4.2 Battery pack Battery pack Removing the battery pack The following describes the procedure for removing the battery pack. (See Figure 4-1.) CAUTION: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC adapter and all other external devices from the computer. 3. Turn the computer upside down. 4.
4.2 Battery pack 4 Replacement Procedures Installing the battery pack The following describes the procedure for installing the battery pack. (See Figure 4-1.) CAUTION: There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly. Dispose always the used batteries pack in accordance with the laws and ordinances of your local authority. Use only the batteries approved by Toshiba.
4 Replacement Procedures 4.3 4.3 Reserve pen Reserve pen Removing the reserve pen The following describes the procedure for removing the reserve pen. (See Figure 4-2.) 1. Remove the reserve pen from the pen holder. Reserve pen Figure 4-2 Removing the reserve pen Installing the reserve pen The following describes the procedure for installing the reserve pen. (See Figure 4-2.) 1. Install the reserve pen to the pen holder.
4.4 Tablet PC pen 4.4 4 Replacement Procedures Tablet PC pen Removing the tablet PC pen The following describes the procedure for removing the tablet PC pen. (See Figure 4-3.) 1. Gently push the tablet PC pen. The pen will then protrude slightly from the side. 2. Remove the tablet PC pen from the tablet PC pen slot. Tablet PC pen Figure 4-3 Removing the tablet PC pen Installing the tablet PC pen The following describes the procedure for installing the tablet PC pen. (See Figure 4-3.) 1.
4 Replacement Procedures 4.5 4.5 PC card/Bridge media PC card/Bridge media 4.5.1 PC card Removing the PC card The following describes the procedure for removing the PC card. (See Figure 4-4.) CAUTION: Insert or remove the PC card in accordance with any instructions in the PC card manual or the manuals of this computer. 1. Turn the computer upside down. 2. Push the ejection button. It will pop out. Then press the eject button again to eject the PC card. 3. Grasp the PC card and remove it.
4.5 PC card/Bridge media 4 Replacement Procedures 4.5.2 Bridge media Removing the Bridge media The following describes the procedure for removing the Bridge media. (See Figure 4-5.) CAUTION: Insert or remove the Bridge media in accordance with any instructions in the Bridge media manual or the manuals of this computer. 1. Push the Bridge media. It will pop out partly, so pull out the card. (For an instance, SD card is described in the figure 4-5.
4 Replacement Procedures 4.6 4.6 MDC/USIM card MDC/USIM card Removing the MDC/USIM card The following describes the procedure for removing the MDC/USIM card. (See Figure 4-6 and 4-7.) 1. Loosen the screw (with e-ring) and remove the MDC/USIM card cover. 2. Remove the following screws securing the USIM card and MDC. • M2×8B ×2 (For models with USIM card) BIND screw or • M2×4B ×2 (For models without USIM card) BIND screw 3.
4.6 MDC/USIM card 4 Replacement Procedures 5. Remove the MDC from the connector CN3010 on the system board. 6. Disconnect the MDC cable from the connector on the MDC. MDC cable MDC CN3010 Figure 4-7 Removing the MDC Installing the MDC/USIM card The following describes the procedure for installing the MDC/USIM card. (See Figure 4-6 and 4-7.) 1. Connect the MDC cable to the connector on the MDC. 2. Set the MDC and press it carefully to connect it to the connector CN3010 on the system board.
4 Replacement Procedures 4.7 4.7 HDD HDD Removing the HDD The following describes the procedure for removing the HDD. (See Figure 4-8 to 4-10.) CAUTION: Take care not to press on the top or bottom of the HDD. Pressure may cause data loss or damage to the device. 1. Turn the computer upside down. 2. Remove the following screws and HDD slot cover. • M2.5×16B FLAT HEAD screw ×2 M2.5×16B FLAT HEAD M2.
4.7 HDD 4 Replacement Procedures 3. Hold the tab to raise the HDD assembly and pull out the HDD assembly from the connector of the HDD cable. NOTE: When removing the HDD assembly, be careful not to tear the tab. If the tab is torn, replace the HDD holder with a new one.
4 Replacement Procedures 4.7 HDD 4. Place the HDD assembly on a flat surface and remove the following screws fixing the HDD holder. • M3×4S ×4 FLAT HEAD screw 5. Separate the HDD holder and HDD.
4.7 HDD 4 Replacement Procedures Installing the HDD The following describes the procedure for installing the HDD. (See Figure 4-8 to 4-10.) CAUTION: Do not hold the HDD by its top and bottom face. It may damage the HDD. 1. Seat the HDD in the HDD holder and secure them with the following screws. • M3×4S FLAT HEAD screw ×4 CAUTION: Do not apply pressure to the middle of the HDD assembly. It may damage the HDD assembly. Hold the HDD assembly by its corners. 2.
4 Replacement Procedures 4.8 4.8 Keyboard Keyboard Removing the keyboard The following describes the procedure for removing the keyboard. (See Figure 4-11 to 4-12.) 1. Turn the computer face up and open the display. 2. Insert your fingers into the slots on both sides and remove the keyboard holder A. 3. Remove the following screws securing the keyboard. • M2.5×3S S-THIN HEAD screw ×2 4. Remove the keyboard holder B while releasing latches. 5.
4.8 Keyboard 4 Replacement Procedures 6. Remove the following screw and keyboard support plate. • M2.5×8B FLAT HEAD screw ×1 7. Disconnect the keyboard cable from the connector CN3200 on the system board and remove the keyboard. Keyboard support plate M2.
4 Replacement Procedures 4.8 Keyboard Installing the keyboard The following describes the procedure for installing the keyboard. (See Figure 4-11 to 4-12.) 1. Place the keyboard face down on the palm rest. 2. Connect the keyboard cable to the connector CN3200 on the system board. 3. Install the keyboard support plate and secure it with the following screw. (Insert the guide of the keyboard support plate first) • M2.
4.9 Memory module 4.9 4 Replacement Procedures Memory module CAUTION: The power must be turned off when you remove the memory module. Removing the memory module with the power on risks damaging the module or the computer itself. Do not touch the memory module terminals. Any dirt on the terminals may cause memory access problems. Never press hard or bend the memory module. Removing the memory module To remove the memory module(s), make sure the computer is in boot mode and powered off.
4 Replacement Procedures 4.9 Memory module 2. Open the left and right latches outside and remove the memory module(s).
4.9 Memory module 4 Replacement Procedures Installing the memory module To install the memory module(s), make sure the computer is in boot mode and powered off. Then perform the following procedure. (See Figure 4-13 and 4-14.) 1. Insert the memory module(s) into the connector slantwise (the terminal side first) and press it to connect firmly. CAUTION: The power must be turned off when you insert the memory module.
4 Replacement Procedures 4.10 SW membrane 4.10 SW membrane Removing the SW membrane To remove the SW membrane, perform the following procedure. (See Figure 4-15.) 1. Remove the SW membrane cover while releasing latches. 2. Disconnect the SW membrane cable from the connector CN9600 on the system board. 3. Slide the SW membrane in the direction of the arrow in the figure to remove it.
4.10 SW membrane 4 Replacement Procedures Installing the SW membrane To install the SW membrane, perform the following procedure. (See Figure 4-15.) 1. Install the SW membrane to the slot while sliding it in the opposite direction at removing. 2. Connect the SW membrane cable to the connector CN9600 on the system board. 3. Install the SW membrane cover while engaging latches.
4 Replacement Procedures 4.11 Optical disk drive 4.11 Optical disk drive Removing the optical disk drive The following describes the procedure for removing the optical disk drive. (See Figure 4-16 and 4-17.) 1. Remove the following screw. • M2.5×8B FLAT HEAD screw ×1 2. Turn over the computer and remove the following screw. • M2.5×6B FLAT HEAD screw ×1 3. Turn the computer face up. While pushing the latch toward the arrow in the Figure 416, pull out the optical disk drive from the slot. M2.
4.11 Optical disk drive 4 Replacement Procedures 4. Remove the following screws and pushing plate from the optical drive assembly. • Stud screw ×2 5. Remove the following screw and mounting plate from the optical drive assembly.
4 Replacement Procedures 4.11 Optical disk drive Installing the optical disk drive The following describes the procedure for installing the optical drive. (See Figure 4-16 and 417.) 1. Install the mounting plate to the optical disk drive assembly and secure it with the following screw. • M2×3S S-THIN HEAD screw ×1 2. Install the pushing plate and connector to the optical disk drive assembly and secure it with the following screws. • ×2 Stud screw 3.
4.12 Cover assembly and Base assembly 4 Replacement Procedures 4.12 Cover assembly and Base assembly Removing the cover assembly and base assembly The following describes the procedure for removing the cover assembly and base assembly. (See Figure 4-18 to 4-20.) 1. Turn the display 90 degrees clockwise and remove the hinge rear cover. 2. Remove the following screws. Be careful not to forget removing these screws. • M2.5×6B FLAT HEAD screw ×2 3. Remove the following screw. • M2.
4 Replacement Procedures 4.12 Cover assembly and Base assembly 4. Turn the display 90 degrees counter clockwise. 5. Close the display and turn over the computer. 6. Remove the following screws. • M2.5×16B FLAT HEAD screw ×3 (“16” in the figure below) • M2.
4.12 Cover assembly and Base assembly 4 Replacement Procedures 7. Separate the base assembly and cover assembly.
4 Replacement Procedures 4.12 Cover assembly and Base assembly Installing the Cover assembly and Base assembly The following describes the procedure for installing the cover assembly and base assembly. (See Figure 4-18 to 4-20.) 1. Install the base assembly to the cover assembly. 2. Secure the cover assembly with the following screws. • M2.5×16B FLAT HEAD screw ×3 • M2.5×6B FLAT HEAD screw ×9 CAUTION: Securing the screws in the order shown in the following figure.
4.13 Base latch 4 Replacement Procedures 4.13 Base latch Removing the base latch The following describes the procedure for removing the base latch. (See Figure 4-21.) 1. Remove the base latch while releasing the latches of the back. Latch Base latch Figure 4-21 Removing the base latch Installing the base latch The following describes the procedure for installing the base latch (See Figure 4-21). 1. Install the base latch to the slot of the base assembly.
4 Replacement Procedures 4.14 Touch pen case/Battery lock 4.14 Touch pen case/Battery lock Removing the Touch pen case/Battery lock The following describes the procedure for removing the touch pen case/battery lock. (See Figure 4-22.) 1. Remove the touch pen case while releasing the latches. 2. Remove the battery lock.
4.15 Bluetooth module 4 4 Replacement Procedures Replacement Procedures 4.15 Bluetooth module Removing the Bluetooth module To remove the Bluetooth module, follow the steps below. (See Figure 4-23.) CAUTION: Do not try to remove the Bluetooth module with the computer turned on. You can damage the computer or Bluetooth module. Do not touch the connectors on the Bluetooth module on the computer. Debris on the connectors may cause Bluetooth access problems. 1. Peel off the glass tape. 2.
4 Replacement Procedures 4.15 Bluetooth module Installing the Bluetooth module To install the Bluetooth module, follow the steps below. (See Figure 4-23.) 1. Connect the Bluetooth cable to the connector on the Bluetooth module. 2. Connect the Bluetooth cable to the connector CN4400 on the system board and set the Bluetooth module to the slot in place. 3. Connect the Bluetooth antenna cable to the connector on the Bluetooth module. 4. Stick the glass tape in place.
4.16 Wireless LAN card 4 Replacement Procedures 4.16 Wireless LAN card Removing the Wireless LAN card To remove the Wireless LAN card, follow the steps below. (See Figure 4-24.) CAUTION: Do not try to remove the wireless LAN card with the computer turned on. The computer or the wireless LAN card can be damaged. Do not touch the connectors on the wireless LAN card on the computer. Debris on the connectors may cause the wireless LAN card access problems. 1.
4 Replacement Procedures 4.16 Wireless LAN card Installing the Wireless LAN card To install the Wireless LAN card, follow the steps below. (See Figure 4-24.) CAUTION: Be sure to switch the computer off before installing the wireless LAN card. Otherwise, the computer or the wireless LAN card may be damaged. 1. Insert the wireless LAN card to the connector on the system board slantwise and press it to connect firmly. 2.
4.17 Microphone/Front panel 4 Replacement Procedures 4.17 Microphone/Front panel Removing the Microphone/Front panel The following describes the procedure for removing the microphone/front panel. (See Figure 4-25 and 4-26.) 1. Disconnect the microphone cable from the connector CN6050 on the system board. 2. Lift the system board a little and remove the front panel (with the microphone) from the cover assembly.
4 Replacement Procedures 4.17 Microphone/Front panel 3. Remove the microphone cable from the guides of the front panel. 4. Remove the microphone hold plate and microphone from the front panel. Microphone hold plate Microphone Microphone cable Guide Figure 4-26 Removing the microphone Installing the Microphone/Front panel The following describes the procedure for installing the microphone/front panel. (See Figure 4-25 and 4-26.) 1. Install the microphone to the front panel. 2.
4.18 Modem jack/USB board/DC-IN jack 4 Replacement Procedures 4.18 Modem jack/USB board/DC-IN jack Removing the Modem jack/USB board/DC-IN jack The following describes the procedure for removing the modem jack/USB board/DC-IN jack. (See Figure 4-27 to 4-29.) 1. Peel off the glass tape and insulator and remove the modem jack from the slot.
4 Replacement Procedures 4.18 Modem jack/USB board/DC-IN jack 2. Disconnect the USB board cable from the connector CN4620 on the system board. 3. Remove the USB board from the slot. 4. Disconnect the USB board cable from the connector CN4631 on the USB board.
4.18 Modem jack/USB board/DC-IN jack 4 Replacement Procedures 5. Disconnect the DC-IN jack cable from the connector CN8800 on the system board. 6. Remove the DC-IN jack from the slot DC-IN jack DC-IN jack cable CN8800 Figure 4-29 Removing the DC-IN jack Installing the Modem jack/USB board/DC-IN jack The following describes the procedure for installing the modem jack/USB board/DC-IN jack. (See Figure 4-27 to 4-29.) 1.
4 Replacement Procedures 4.19 RTC battery 4.19 RTC battery Removing the RTC battery The following describes the procedure for removing the RTC battery. (See Figure 4-30 and 4-31.) 1. Disconnect the RTC battery cable from the connector CN9300 on the system board. 2. Remove the following screw and RTC battery holder. • M2.5×6B FLAT HEAD screw ×1 M2.
4.19 RTC battery 4 Replacement Procedures 3. Open the insulator and remove the RTC battery from the RTC battery holder. RTC battery Insulator Figure 4-31 Removing the RTC battery Installing the system board/RTC battery The following describes the procedure for installing the RTC battery. (See Figure 4-30 and 431.) 1. Install the RTC battery to the RTC battery holder and wrap it with the insulator. 2. Install the RTC battery holder and secure it with the following screw. • M2.
4 Replacement Procedures 4.20 System board 4.20 System board Removing the System board The following describes the procedure for removing the system board. (See Figure 4-32.) 1. Disconnect the sensor cable, digitizer cable, LCD cable and touch pad cable from the connector CN9500, CN9540, CN5000 and CN3201 on the system board. 2. Peel off the glass tape and disconnect the speaker cable from the connector CN6170 on the system board. 3. Remove the following screw and system board. • M2.
4.20 System board 4 Replacement Procedures Installing the system board The following describes the procedure for installing the system board. (See Figure 4-32.) 1. Install the system board to the cover assembly and secure it with the following screw. • M2.5×6B FLAT HEAD screw ×1 2. Connect the speaker cable to the connector CN6170 on the system board and stick the glass tape in place. 3.
4 Replacement Procedures 4.21 GPU heat sink 4.21 GPU heat sink Removing the GPU heat sink The following describes the procedure for removing the GPU heat sink. (See Figure 4-33.) 1. Peel of the insulator. 2. Remove the following screws and GPU heat sink.
4.21 GPU heat sink 4 Replacement Procedures Installing the GPU heat sink The following describes the procedure for installing the GPU heat sink. (See Figure 4-33.) 1. If there is already silicon grease on the GPU and GPU heat sink, clean it with a cloth. Using a special applicator, apply silicon grease so that the GPU chip on the GPU is completely covered. NOTE: For details on applying the silicon grease, refer to Installing the CPU. 2. Install the GPU heat sink and secure it with the following screws.
4 Replacement Procedures 4.22 Fan/Heat sink/CPU 4.22 Fan/Heat sink/CPU Removing the Fan/Heat sink/CPU The following describes the procedure for removing the fan/heat sink/CPU. (See Figure 4-34 to 4-36.) 1. Peel off the glass tape and disconnect the fan cable from the connector CN8771 on the system board. 2. Remove the following screws securing the CPU hold plate in the reverse order of the number marked (3 to 1) on the CPU hold plate and remove the CPU hold plate. • M2×4B BIND screw ×3 3.
4.22 Fan/Heat sink/CPU 4 Replacement Procedures 4. Remove the following screws and separate the fan and heat sink. • M2.5×4B FLAT HEAD screw M2.5x4B FLAT HEAD ×2 Fan Heat sink Figure 4-35 separating the fan and heat sink 5. Unlock the CPU by turning the cam counterclockwise on the CPU socket by 90 degrees with a flat-blade screwdriver.
4 Replacement Procedures 4.22 Fan/Heat sink/CPU 6. Remove the CPU from the CPU socket. CAUTION: When removing the CPU, lift it up right above. Otherwise, pins of CPU may be damaged. Installing the Fan/Heat sink/CPU The following describes the procedure for installing the fan/heat sink/CPU. (See Figure 4-34 to 4-38.) 1. Make sure the cam is in the open position. 2. Seat the CPU in the CPU socket. Make sure the direction and position of CPU is correct to avoid damaging pins on the CPU.
4.22 Fan/Heat sink/CPU 4 Replacement Procedures 4. Apply new grease on the CPU using a special syringe as shown in the following figure. Apply quarter of scale (0.25ml) of grease evenly on the CPU chip. When silicon grease is already applied to the CPU, wipe them off with a cloth in advance. Figure 4-38 Applying new grease 5. Install the fan to the heat sink and secure them with the following screws. • M2.5×4B FLAT HEAD screw ×2 6. Install the fan and heat sink. 7.
4 Replacement Procedures 4.23 Sensor board 4.23 Sensor board Removing the Sensor board The following describes the procedure for removing the sensor board. (See Figure 4-39.) 1. Remove the sensor board from the slot. 2. Disconnect the sensor cable from the connector CN9510 on the sensor board. CN9510 Sensor board Sensor cable Figure 4-39 Removing the sensor board Installing the Sensor board The following describes the procedure for installing the sensor board. (See Figure 4-39.) 1.
4.24 Speaker 4 Replacement Procedures 4.24 Speaker Removing the speaker The following describes the procedure for removing the speaker. (See Figure 4-40.) 1. Peel off the insulators and acetate tapes. 2. Remove the speaker covers while releasing latches. 3. Remove the speakers from the slots.
4 Replacement Procedures 4.24 Speaker Installing the speaker The following describes the procedure for installing the speaker. (See Figure 4-40.) 1. Install the speakers to the slots on both sides. 2. Install the speaker covers to the slots on both sides while hooking the latches. 3. Arrange the speaker cables in place. 4. Stick insulators and acetate tapes in place.
4.25 Touch pad 4 Replacement Procedures 4.25 Touch pad Removing the Touch pad The following describes the procedure for removing the touch pad. (See Figure 4-41 and 442.) 1. Remove the following screw. • M2.5×6B FLAT HEAD screw ×1 2. Remove the touch pad cover while releasing four latches. Touch pad cover M2.
4 Replacement Procedures 4.25 Touch pad 3. Remove the touch pad from the slot. 4. Disconnect the touch pad cable from the connector on the touch pad. Touch pad Touch pad cable Figure 4-42 Removing the touch pad Installing the Touch pad The following describes the procedure for installing the touch pad. (See Figure 4-41 to 4-42.) 1. Connect the touch pad cable to the connector on the touch pad. 2. Install the touch pad to the slot. 3.
4.26 LCD mask 4 Replacement Procedures 4.26 LCD mask Removing the LCD mask The following describes the procedure for removing the LCD mask. (See Figure 4-43.) 1. Peel off the mask seals (9 points) from the LCD mask and remove the following screws securing the LCD mask. • M2.5×6B FLAT HEAD screw ×9 2. Remove the LCD mask while releasing latches. M2.5x6B FLAT HEAD (with mask seal) LCD mask M2.5x6B FLAT HEAD (with mask seal) M2.5x6B FLAT HEAD (with mask seal) M2.
4 Replacement Procedures 4.26 LCD mask CAUTION: When removing the LCD mask, be sure to keep the following steps (order) referring to the figure below. 1. Release the latches on the top from the right to the left. 2. Release the latches on the right side from the top to the bottom. 3. Release the latches on the bottom from the right toward the left. 4. Release the latches of the left side.
4.26 LCD mask 4 Replacement Procedures Installing the LCD mask The following describes the procedure for installing the LCD mask. (See Figure 4-43.) 1. Install the LCD mask to the display cover while securing the latches. NOTE: When installing the LCD mask, wipe the LCD with a soft cloth and make the back of the LCD mask clean with an ionizer. 2. Secure the LCD mask with the following screws and stick the mask seals (9 points). • M2.
4 Replacement Procedures 4.26 LCD mask CAUTION: When installing the LCD mask, be sure to keep the following steps (order) referring to the figure below. 1. Engage the latches on the left side while fiting the LCD mask to the correct position. 2. Engage the latches on the top from the left to the right. 3. Engage the latches on the right side from the top to the bottom. 4. Engage the latches on the bottom from the right to the left.
4.27 Fingerprint sensor board 4 Replacement Procedures 4.27 Fingerprint sensor board Removing the Fingerprint sensor board The following describes the procedure for removing the fingerprint sensor board. (See Figure 4-44.) 1. Remove the following screw and fingerprint sensor board. • M2.5×6B FLAT HEAD screw ×1 2. Disconnect the fingerprint sensor cable from the connector CN9560 on the fingerprint sensor board. Fingerprint sensor board Fingerprint sensor cable M2.
4 Replacement Procedures 4.28 Switch board 4.28 Switch board Removing the Switch board The following describes the procedure for removing the switch board. (See Figure 4-45.) 1. Remove the following screw securing the switch board and pull up the switch board. • M2.5×6B FLAT HEAD screw ×1 2. Disconnect the switch cable from the connector CN9550 on the back of the switch board. Switch cable (Connected to CN9550) M2.
4.29 LCD unit/FL inverter 4 Replacement Procedures 4.29 LCD unit/FL inverter Removing the LCD unit/FL inverter The following describes the procedure for removing the LCD unit/FL inverter. (See Figure 446 to 4-48.) NOTE: When replacing the LCD unit, do not give the hinge portion a strong press. It may cause the breakage of the hinge assembly. Also, Use a stand or something under the LCD part to keep the LCD part level while replacing it. 1. Peel off one insulator from the FL inverter. 2.
4 Replacement Procedures 4.29 LCD unit/FL inverter 3. Remove the following screw securing the LCD unit. • M2.5×6B FLAT HEAD screw ×1 4. Carefully lift up the top of the LCD unit. NOTE: When lifting up the top of the LCD unit, hold the corners of the LCD unit. The top edge of LCD unit is sensitive area. 5. Peeling off two glass tapes and disconnect the LCD cable and digitizer cable from the connectors on the back of the LCD unit.
4.29 LCD unit/FL inverter 4 Replacement Procedures 7. Remove the following screws and two LCD supports from the LCD. • M2×3S S-THIN HEAD screw ×4 M2×3S S-THIN HEAD LCD LCD support M2×3S S-THIN HEAD Figure 4-48 Removing the LCD support NOTE: 1) Be careful not to apply pressure to the ICs along the edge of LCD unit. The ICs are easily damaged. 2) For environmental reasons, do not throw away a malfunctioning LCD unit (or FL). Please follow local ordinances or regulations for its disposal.
4 Replacement Procedures 4.29 LCD unit/FL inverter Installing the LCD unit/FL inverter The following describes the procedure for installing the LCD unit/FL inverter. (See Figure 446 to 4-48.) 1. Set two LCD supports to the LCD and secure them with the following screws. • M2×3S S-THIN HEAD screw ×4 2. Stand the LCD unit on the display cover and connect the digitizer cable and LCD cable on the back of the LCD unit. 3. Stick two glass tapes on each connector. 4.
4.30 Digitizer 4 Replacement Procedures 4.30 Digitizer CAUTION: Read following instructions before handling the Digitizer. Do not carry the LCD module by holding the FL cable in one’s hand because it may result to cut the FL cable, and cause display function failure or lighting failure. Be careful to handle the bezel guide. There is a portion where the bezel is sticking out because of the digitizer guide. Do not press and rub the portion with bare hands or it may cut your finger.
4 Replacement Procedures 4.30 Digitizer Do not make any scratches on the B/L and TAB by the edge of the digitizer when installing the digitizer because it may result to break the TAB or make scratches on the B/L and cause display function failure. Do not pull up the PCB hardly when installing the digitizer because it may result to give stress on the TAB or PCB and cause the display function failure. Make sure that three latches fit the digitizer securely.
4.30 Digitizer 4 Replacement Procedures Do not turn up the digitizer because it may result to give stress on the TAB or PCB and cause the display function failure. Do not turn up the digitizer to avoid wrap of the PCB. Do not put any instrument on the LCD module because it may result to make scratch on the cell, polarization sheet or B/L and break the TAB and may cause the display function failure.
4 Replacement Procedures 4.30 Digitizer Do not hold, press and rub the TAB because it may result to break the TAB and cause the display function failure. Make sure to put the LCD module on the flat place. If the LCD module is put on the uneven place, it may result to break the TAB, make scratch on the B/L or polarization sheet and cause the display function failure.
4.
4 Replacement Procedures 4.30 Digitizer Removing the Digitizer The following describes the procedure for removing the digitizer. (See Figure 4-49.) 1. Remove the following screws securing the digitizer. • M2×3S S-THIN HEAD screw ×3 2. Remove the digitizer from the LCD unit.
4.30 Digitizer 4 Replacement Procedures Installing the digitizer The following describes the procedure for installing the digitizer. (See Figure 4-49.) 1. Slide the digitizer into the back pocket of the LCD. CAUTION: When replacing the digitizer, fit the digitizer into the back of the LCD toward the arrow pointing. 2. Secure the digitizer with the following screws.
4 Replacement Procedures 4.31 LCD latch assembly 4.31 LCD latch assembly Removing the LCD latch assembly The following describes the procedure for removing the LCD latch assembly. (See Figure 450.) 1. Remove the LCD latch assembly from the slot as shown in the following figure. LCD latch assembly Figure 4-50 Removing the LCD latch assembly Installing the LCD latch assembly The following describes the procedure for installing the LCD latch assembly. (See Figure 450.) 1.
4.32 Hinge assembly 4 Replacement Procedures 4.32 Hinge assembly Removing the Hinge assembly The following describes the procedure for removing the hinge assembly. (See Figure 4-51 to 4-53.) 1. Peel off the insulator and acetate tape to release the wireless LAN antenna cable and Bluetooth antenna cable.
4 Replacement Procedures 4.32 Hinge assembly 2. Remove the following screws. • M3×4S FLAT HEAD screw ×2 3. Turn the display rear cover 90 degrees clockwise and remove the display rear cover from the cover assembly.
4.32 Hinge assembly 4 Replacement Procedures 4. Remove the following screws and hinge assembly by lifting it up. • M2.5×6S S-THIN HEAD screw ×2 M2.5×6S S-THIN HEAD Hinge assembly Figure 4-53 Removing the hinge assembly (3) Installing the Hinge assembly The following describes the procedure for installing the hinge assembly. (See Figure 4-51 to 4-53.) 1. Seat the hinge assembly in place and secure it with the following screws. • M2.5×6S S-THIN HEAD screw ×2 2.
4 Replacement Procedure 4.33 Fluorescent lamp 4 4.33 Fluorescent lamp This system uses LCD modules from the following suppliers. The procedure for replacing the fluorescent lamp is different for each LCD module. Refer to the appropriate procedure. Type 14.1-inch (WXGA+) Part No. G33C0003B110 Supplier CHIMEI Section 4.33.1 NOTE: - When working with a LCD module, always use a flat, grounded table. - Handle the backlight unit in the environment without dust, such as on the clean bench.
4.33 Fluorescent lamp 4.33.1 4 Replacement Procedure Replacing the 14.1 Inch CHIMEI Fluorescent lamp The following describes the procedure for replacing the fluorescent lamp (See Figure 4-54 to 4-59). Disassembling Fluorescent lamp 1. Tear off the AL tape (1) and PCBA protector film (2). Figure 4-54 Replacing 14.
4 Replacement Procedure 4.33 Fluorescent lamp 2. Tear off the CU tape (1) and unscrew the metal frame fixed screws (2). Figure 4-55 Replacing 14.
4.33 Fluorescent lamp 4 Replacement Procedure 3. To remove the metal frame hooks out of the backlight unit (1), first remove the hooks of the bottom side, left side and right side and then remove the metal frame (2). CAUTION: Be sure to take the frame off parallely in case of any deformation. Figure 4-56 Replacing 14.
4 Replacement Procedure 4.33 Fluorescent lamp 4. Take of the X-PCB oppositely. CAUTION: Be careful upon taking off the PCB in case of any twisting deformation to TCP. Panel unit B/L unit Figure 4-57 Replacing 14.
4.33 Fluorescent lamp 4 Replacement Procedure 5. Tear off the film tape (1) from the protector sheet. 6. Tear off the protector sheet (2), prism (3), LGP (4), LGP tape (5) and reflector (6) from the backlight unit in turn. CAUTION: Be careful upon taking off each sheet in case any damage. Housing Lamp ASS’Y Figure 4-58 Replacing 14.
4 Replacement Procedure 4.33 Fluorescent lamp 7. Unscrew the lamp ASS’Y fixed screws (1). Housing Lamp ASS’Y Figure 4-59 Replacing 14.
4.33 Fluorescent lamp 4 Replacement Procedure Assembling Fluorescent lamp Assembling is the opposite order of the disassembling.
4 Replacement Procedure 4-90 [CONFIDENTIAL] 4.
Appendices [CONFIDENTIAL]
Appendices App-ii [CONFIDENTIAL] SatelliteR20/TECRAM7 Maintenance Manual (960-572)
Appendices Appendix Contents Appendix A Handling the LCD Module......................................................................... A-1 Appendix B Board Layout................................................................................................B-1 B.1 System Board Front View..............................................................................B-1 B.2 System Board Back View ..............................................................................B-3 B.
Appendices C.16 CN4400 Bluetooth connector (20-pin) ...................................................... C-17 C.17 CN4610 USB connector (Port 6/４) (8-pin).............................................. C-18 C.18 CN4612 USB connector (Port 0) (6-pin) ................................................... C-18 C.19 CN4620 USB connector (Port 7) (8-pin) ................................................... C-18 C.20 CN5000 LCD connector (40-pin) ...........................................................
Appendices SW board (FCYSW*) C.40 CN9550 System board I/F connector (15-pin)........................................... C-29 Appendix D Keyboard Scan/Character Codes .............................................................. D-1 Appendix E Key Layout ...................................................................................................E-1 Appendix F Wiring Diagrams..........................................................................................
Appendices Figures Figure B-1 System board layout (front) ...........................................................................B-1 Figure B-2 System board layout (back) ...........................................................................B-3 Figure B-3 Fingerprint sensor board layout .....................................................................B-5 Figure B-4 Panel switch board layout ..............................................................................
Appendices Table C-5 PC card I/F connector (70-pin) ..................................................................... C-8 Table C-6 Bridge Media I/F connector (42-pin).......................................................... C-10 Table C-7 Docking I/F connector (140-pin) ................................................................ C-11 Table C-8 PCI-Express mini card (WLAN) I/F connector (52-pin)............................
Appendices Panel switch board (FCYPR*) Table C-36 System board I/F connector (3-pin) ............................................................ C-26 SIM board (FCYSM*) Table C-37 System board I/F connector (10-pin) .......................................................... C-27 USB board (FCYUS*) Table C-38 System board I/F connector (8-pin) ............................................................ C-28 Table C-39 USB connector (Port 5) (6-pin)...................................................
Appendix A Handling the LCD Module Appendices Appendix A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
Appendices Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a LCD cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. LCD 4.
Appendix A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
Appendices Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
Appendix A Handling the LCD Module Appendices 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxime). These materials can release gas that can damage the panel’s polarization.
Appendices A-6 Appendix A Handling the LCD Module [CONFIDENTIAL] SatelliteR20/TECRAM7 Maintenance Manual (960-572)
Appendix B Board Layout Appendices Appendix B Appendix B Board Layout B.
Appendices Appendix B Board Layout Table B-1 System board ICs and connectors (front) Number B-2 Part’s name IS2101 Bridge media connector CN1400 Memory connector (A) CN1410 Memory connector (B) CN9600 Switch board I/F connector CN3200 Keyboard connector CN3400 Debug port I/F connector CN2110 PC card I/F connector IC1600 ICH7-M IC3200 EC/KBC CN4200 IEEE 1394 port CN4612 USB port 0 [CONFIDENTIAL] SatelliteR20/TECRAM7 Maintenance Manual (960-572)
Appendix B Board Layout B.
Appendices Appendix B Board Layout Table B-2 System board ICs and connectors (back) Number Name CN5501 S-Video connector CN8800 DC-IN jack CN4620 USB board I/F connector CN2610 3G connector CN1820 Optical drive connector CN9520 SIM board I/F connector CN3201 Touch pad board I/F connector CN3010 MDC connector CN4400 Bluetooth I/F connector CN8810 Battery connector CN2600 Wireless LAN connector CN6170 Speaker connector CN6050 Internal microphone connector S3284 CN1850 B-4 Sound
Appendix B Board Layout B.
Appendices B.
Appendix B Board Layout B.
Appendices B.
Appendix B Board Layout B.
Appendices B.
Appendix. C Pin Assignment Appendix. C Appendices Pin Assignment Appendix C Pin Assignment System board (FAPNS*) C.1 CN1410 Memory B connector (200-pin) Table C-1 Memory B connector (200-pin) (1/3) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment Table C-1 Memory B connector (200-pin)(2/3) Pin No. C-2 Signal Name I/O Pin No. Signal Name I/O 58 BDQ19-B1P - 60 GND I/O 57 BDQ22-B1P I/O 59 GND 61 BDQ29-B1P I/O 62 BDQ25-B1P I/O 63 BDQ28-B1P I/O 64 BDQ24-B1P I/O 65 GND - 66 GND 67 BDM3-B1P I 68 BDQS3-B1N I/O 69 N.C.
Appendix. C Pin Assignment Appendices Table C-1 Memory B connector (200-pin) (3/3) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment C.2 CN1400 Memory A connector (200-pin) Table C-2 Memory A connector (200-pin) (1/3) C-4 Pin No. Signal Name I/O Pin No.
Appendix. C Pin Assignment Appendices Table C-2 Memory A connector (200-pin)(2/3) Pin No. Signal Name I/O Pin No. Signal Name I/O I/O 69 N.C. - 70 ADQS3-B1P 71 GND - 72 GND 73 ADQ30-B1P I/O 74 ADQ27-B1P I/O 75 ADQ26-B1P I/O 76 ADQ31-B1P I/O 77 GND - 78 GND - 79 MCKE0-B1P I 80 MCKE1-B1P I 81 1R8-B1V I 82 1R8-B1V I 83 N.C. - 84 N.C - 85 ABS2-B1P I 86 N.
Appendices Appendix. C Pin Assignment Table C-2 Memory A connector (200-pin )(3/3) Pin No. C-6 Signal Name I/O Pin No.
Appendix. C Pin Assignment Appendices C.3 CN1820 ODD I/F connector (50-pin) Table C-3 ODD I/F connector (50-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment C.4 CN1850 SATA I/F connector (10-pin) Table C-4 SATA I/F connector (10-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 ZSATT0-P1P O 2 ZSATT0-P1N O 3 GND - 4 ZSATR0-P1N I 5 ZSATR0-P1P I 6 GND - 7 P3V - 8 GND - 9 P5V - 10 GND - 1T GND - 2T GND - 3T GND - 4T GND - C.5 CN2110 PC card I/F connector (70-pin) Table C-5 PC card I/F connector (70-pin)) (1/2) Pin No. C-8 Signal Name I/O Pin No.
Appendix. C Pin Assignment Appendices Table C-5 PC card I/F connector (70-pin) (2/2) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment C.6 IS2101 Bridge Media I/F connector (42-pin) Table C-6 Bridge Media I/F connector (42-pin) Pin No. C-10 Signal Name I/O Pin No.
Appendix. C Pin Assignment Appendices C.7 CN2300 Docking I/F connector (140-pin) Table C-7 Docking I/F connector (140-pin) (1/2) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment Table C-7 Docking I/F connector (140-pin) (2/2) Pin No. C-12 Signal Name I/O Pin No.
Appendix. C Pin Assignment Appendices C.8 CN2600 PCI-Express mini card (WLAN) I/F connector (52-pin) Table C-8 PCI-Express mini card (WLAN) I/F connector (52-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment C.9 CN2610 PCI-Express mini card (3G) I/F connector (52-pin) Table C-9 PCI-Express mini card (3G) I/F connector (52-pin) C-14 Pin No. Signal Name I/O Pin No.
Appendix. C Pin Assignment Appendices C.10 CN3010 MDC I/F connector (12-pin) Table C-10 MDC I/F connector (12-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O - 2 NC - I/O 4 NC - 1 GND 3 ACZOT1-P3P 5 GND - 6 E3V - 7 ACZSY1-P3P O 8 GND - 9 ACZIN1-E3P I/O 10 GND - 11 ACZRS1-E3N O 12 XAZBC1-P3P O 1T GND - 2T GND - 3T GND - 4T GND - 5T GND - 6T GND - C.11 CN3200 Keyboard connector (34-pin) Table C-11 Keyboard connector (34-pin) Pin No.
Appendices Appendix. C Pin Assignment C.12 CN3201 PAD connector (8-pin) Table C-12 PAD connector (8-pin) Pin No. Signal Name I/O Pin No. Signal Name - 2 GND I/O 1 GND - 3 IPDCLK-P5P I/O 4 IPDCLK-P5P I/O 5 IPDDAT-P5P I/O 6 IPDDAT-P5P I/O 7 P5V - 8 P5V - C.13 CN3400 Debugging connector (4-pin) Table C-13 Debugging connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 P3V - 2 DBGRX-P3P I 3 DBGTX-P3P O 4 GND - C.
Appendix. C Pin Assignment Appendices C.15 CN4200 IEEE1394 connector (4-pin) Table C-15 IEEE1394 connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 ZTPB0-P3N I/O 2 ZTPB0-P3P I/O 3 ZTPA0-P3N I/O 4 ZTPA0-P3P I/O 1T GND - 2T GND - 3T GND - 4T GND - C.16 CN4400 Bluetooth connector (20-pin) Table C-16 Bluetooth connector (20-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment C.17 CN4610 USB connector (Port 6/4) (8-pin) Table C-17 USB connector (Port 6/4) (8-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 USB0PS-E3V - 2 ZUSBP6-E3N 3 ZUSBP6-E3P I/O 4 GND 5 USB0PS-E3V - 6 ZUSBP4-E3N 7 ZUSBP4-E3P I/O 8 GND - - 2T GND - 1T GND I/O I/O C.18 CN4612 USB connector (Port 0) (6-pin) Table C-18 USB connector (Port 0) (6-pin) Pin No. Signal Name I/O Pin No.
Appendix. C Pin Assignment Appendices C.20 CN5000 LCD connector (40-pin) Table C-20 LCD connector (40-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment C.22 CN5501 S-Video connector (4-pin) Table C-22 S-Video connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 AGND - 2 AGND - 3 LUMINA-PYP O 4 CHROMA-PYP O 1T GND - 2T GND - 3T GND - 4T GND - C.23 CN6050 Internal microphone connector (2-pin) Table C-23 Internal microphone connector (2-pin) Pin No. 1 Signal Name (IMICL-PXP) I/O Pin No. O 2 Signal Name A-GND I/O - C.
Appendix. C Pin Assignment Appendices C.26 J6310 Headphone connector (6-pin) Table C-26 Headphone connector (6-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 (A-GND) - 2 HEADL-PXP O 3 HEADR-PXP O 4 DETECTA-P4N I 5 A-GND - 6 N.C. - C.27 CN8800 DC-IN connector (4-pin) Table C-27 DC-IN connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 ADPDC I 2 ADPDC I 3 GND - 4 GND - C.
Appendices Appendix. C Pin Assignment C.30 CN8771 Fan connector (4-pin) Table C-30 Fan connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 P5V - 2 FANG-P3P I 3 GND - 4 (FPWM-S3P) O C.31 CN9500 PR board I/F connector (3-pin) Table C-31 PR board I/F connector (3-pin) Pin No. Signal Name I/O Pin No. 2 1 PNLOFF-S3N I 3 GND - Signal Name TPLOFF-S3V I/O I C.32 CN9520 SIM board I/F connector (10-pin) Table C-32 SIM board I/F connector (10-pin) Pin No.
Appendix. C Pin Assignment Appendices C.33 CN9540 Digitizer switch I/F connector (41-pin) Table C-33 Digitizer switch I/F connector (41-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment C.34 CN9600 SW board I/F connector (13-pin) Table C-34 SW board I/F connector (13-pin) Pin No. I/O Pin No.
Appendix. C Pin Assignment Appendices Fingerprint sensor board (FCYFS*) C.35 CN9560 System board I/F connector (6-pin) Table C-35 System board I/F connector (6-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment Panel switch board (FCYPR*) C.36 CN9510 System board I/F connector (3-pin) Table C-36 System board I/F connector (3-pin) C-26 Pin No. Signal Name I/O Pin No.
Appendix. C Pin Assignment Appendices SIM board (FCYSM*) C.37 CN9530 System board I/F connector (10-pin) Table C-37 System board I/F connector (10-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment USB board (FCYUS*) C.38 CN4631 System board I/F connector (8-pin) Table C-38 System board I/F connector (8-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 USB2PS-E5V - 2 USB2PS-E5V - 3 ZUSBP5-E3N I/O 4 ZUSBP5-E3P I/O 5 GND - 6 GND - 7 GND - 8 GND - C.39 CN4630 USB connector (Port 5) (6-pin) Table C-39 USB connector (Port 5) (6-pin) Pin No. C-28 Signal Name I/O Pin No.
Appendix. C Pin Assignment Appendices SW board (FCYSW*) C.40 CN9550 System board I/F connector (15-pin) Table C-40 System board I/F connector (15-pin) Pin No. Signal Name I/O Pin No.
Appendices C-30 Appendix.
Appendix D Keyboard Scan/Character Codes Appendices Appendix D Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) D-2 Cap No.
Appendix D Keyboard Scan/Character Codes Appendices Table D-1 Scan codes (set 1 and set 2) (3/4) Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap No. Keytop Code set 1 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc Refer to table 2-25 126 Pause Refer to table 2-25 202 Fn 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Make Code set 2 Break Make Note Break *5 Notes: 1. 2. 3. 4. 5. D-4 * * * * * Scan codes differ by overlay function.
Appendix D Keyboard Scan/Character Codes Appendices Table D-2 Scan codes with left Shift key Cap Key No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
Appendix D Keyboard Scan/Character Codes Appendices Table D-5 Scan codes in overlay mode Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-7 No.126 key scan code Key top Shift Code set 1 Code set 2 Make Make Pause Common * E1 1D 45 E1 Ctrl* E0 46 E0 C6 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E 14 F0 77 *: This key generates only make codes.
Appendix. E Key Layout Appendix.
Appendices E-2 Appendix.
Appendix F Wiring Diagrams Appendices Appendix F Appendix F Wiring Diagrams F.1 RGB Monitor Wraparound connector Figure F-1 RGB Monitor Wraparound connector F.
Appendices F-2 Appendix F Wiring Diagrams [CONFIDENTIAL] SatelliteR20/TECRAM7 Maintenance Manual (960-572)
Appendix G BIOS Rewrite Procedures Appendices Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS rewriting disk for the computer that has renewed BIOS data. Rewriting the BIOS Note: 1. Connect the AC adaptor to the computer when you rewrite the BIOS. 2. Do not turn off the power while you are rewriting the BIOS.
Appendices G-2 Appendix G BIOS Rewrite Procedures [CONFIDENTIAL] SatelliteR20/TECRAM7 Maintenance Manual (960-572)
Appendix H EC/KBC Rewrite Procedures Appendices Appendix H Appendix H EC/KBC Rewrite Procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. Tools To rewrite the EC/KBC, you need the following tool: EC/KBC rewriting disk for the computer Rewriting the EC/KBC NOTE: 1. Rewrite the EC/KBC only when instructed by a diagnostic disk release notice. 2. Be sure to connect both battery and AC adapter to the computer when you rewrite the EC/KBC. 3.
Appendices H-2 Appendix H EC/KBC Rewrite Procedures [CONFIDENTIAL] SatelliteR20/TECRAM7 Maintenance Manual (960-572)
Appendix I Reliability Appendices Appendix I Appendix I Reliability The following table shows MTBF (Mean Time between Failures). Table I-1 MTBF MTBF Time (hours) System (Satellite R20) 5943.86 System (TECRA M7 Intel 945GM model) 5931.18 System (TECRA M7 Intel 945PM model) 5864.
Appendices I-2 Appendix I Reliability [CONFIDENTIAL] SatelliteR20/TECRAM7 Maintenance Manual (960-572)
