Toshiba Personal Computer QOSMIO F10 Maintenance Manual TOSHIBA CORPORATION File Number 960-498
Copyright © 2004 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein. Toshiba QOSMIO F10 Maintenance Manual First edition October 2004 Disclaimer The information presented in this manual has been reviewed and validated for accuracy.
Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer QOSMIO F10. NOTE: Each model of QOSMIO F10 has a different configuration. For each model’s configuration, refer to the parts list dedicated to it. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the QOSMIO F10 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Table of Contents Chapter 1 Hardware Overview 1.1 Features ...................................................................................................................... 1-1 1.2 System Block Diagram .............................................................................................. 1-5 1.3 2.5-inch Hard Disk Drive......................................................................................... 1-10 1.4 Optical Drive.........................................................
Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ................................................................................... 3-4 3.3 Setting of the hardware configuration........................................................................ 3-8 3.4 Heatrun Test.......................................................................................
Chapter 4 Replacement Procedures 4.1 Overview.................................................................................................................... 4-1 4.2 Battery pack/PC card/Bridge Media .......................................................................... 4-8 4.3 HDD......................................................................................................................... 4-12 4.4 Memory module.....................................................................
Appendices Appendix A Handling the LCD Module ........................................................................ A-1 Appendix B Board Layout ............................................................................................. B-1 Appendix C Pin Assignment .......................................................................................... C-1 Appendix D Keyboard Scan/Character Codes ............................................................... D-1 Appendix E Key Layout.......
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Chapter 1 Hardware Overview
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1 Hardware Overview Chapter 1 Contents 1.1 Features ...................................................................................................................... 1-1 1.2 System Block Diagram .............................................................................................. 1-5 1.3 2.5-inch Hard Disk Drive......................................................................................... 1-10 1.4 Optical Drive...............................................................
1 Hardware Overview Figures Figure 1-1 Front of the computer and the system units configuration ............................ 1-4 Figure 1-2 System block diagram.................................................................................... 1-5 Figure 1-3 2.5-inch HDD............................................................................................... 1-10 Figure 1-4 DVD Super Muti drive.................................................................................
1 Hardware Overview 1 1.1 Features Features 1.1 Features The QOSMIO F10 series are high performance all-in-one PCs running a Pentium-M processor. The features are listed below. ❑ Microprocessor Microprocessor that is used depends on the model. Mobile Intel ® Pentium ®-M Pentium-M 1.50GHz (Processor Number ; 715) 1.60GHz (Processor Number ; 725) 1.70GHz (Processor Number ; 735) 1.80GHz (Processor Number ; 745) 2.00GHz (Processor Number ; 755) 2.
1.1 Features 1 Hardware Overview ❑ Display LCD Built-in 15.4-inch, XGA (1,280 x 800 dots), 262,144 colors, amorphous silicon TFT color display. Clear Super View LCD. CRT Supported via a RGB connector. TV-out S-VIDEO/Composite out port is supported. (Supporting NTSC, PAL and SECAM) D-VIDEO out port is supported. ❑ Monitor-IN port This port can be used as AV input port (for composite video data) and also as line-in port which enables connection of a stereo device for audio input.
1 Hardware Overview 1.1 Features ❑ Battery The RTC battery is mounted inside the computer. The main battery is a detachable lithium ion battery (4,400mAh:Li-Ion, 6-cell). ❑ USB (Universal Serial Bus) Four USB ports are provided. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported. ❑ PC card slot PC card slot accepts one Type II (5mm thick) card. The slot is equipped with an ejector. Supports ToPIC-100 (3.3V/CardBus).
1.1 Features 1 Hardware Overview Figure 1-1 shows the front of the computer and the system units configuration.
1 Hardware Overview 1.2 1.2 System Block Diagram System Block Diagram Figure 1-2 shows the system block diagram.
1.2 System Block Diagram 1 Hardware Overview The PC contains the following components. ❑ CPU Mobile Intel ® Pentium ®-M Pentium-M 1.50GHz (Processor Number ; 715) 1.60GHz (Processor Number ; 725) 1.70GHz (Processor Number ; 735) 1.80GHz (Processor Number ; 745) 2.00GHz (Processor Number ; 755) 2.10GHz (Processor Number ; 765) L1 cache : 64KB (32KB + 32KB) L2 cache : 2MB Bus : 400Hz Core voltage : 1.340 to 0.
1 Hardware Overview 1.2 System Block Diagram ❑ Chipset This gate array has the following elements and functions. • North Bridge (Intel 855PME (MCH-M, B-step)) − − − − − • Pentium-M processor System Bus support DRAM Controller : DDR333/DDR266/DDR200 support AGP Interface (AGP R2.0, AGP x 4 modes) Hub Link Interface 593-ball 37.5mmx37.5mm FC-BGA Package South Bridge (Intel 82801DBM (ICH4-M)) − − − − − − − − − − − − − − − PCI slot IDE controller DMA controller USB host interface USB 2.
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1 Hardware Overview 1.2 System Block Diagram ❑ LAN (Intel-made ED82562 (Kinnereth) x 1) Controls LAN. Supports 100Base-TX and 10Base-T. ❑ MODEM (Askey-made 1456VQL4 x 1) Supported by MDC. Uses secondary AC97 line. Data and FAX transmission is available. Supports ITU-TV.90 or .92. The transfer speed of data receiving is 56kbps, of data sending is 33.6kbps and of FAX is 14.4kbps. Actual speed depends on the quality of the line used. Connected to telephone line through RJ11 MODEM jack.
1.3 2.5-inch Hard Disk Drive 1.3 1 Hardware Overview 2.5-inch Hard Disk Drive A compact, high-capacity HDD with a height of 9.5mm. Contains a 2.5-inch magnetic disk and magnetic heads. Figure 1-3 shows a view of the 2.5-inch HDD and Tables 1-1 and 1-2 list the specifications. Figure 1-3 2.5-inch HDD Table 1-1 2.
1 Hardware Overview 1.3 2.5-inch Hard Disk Drive Table 1-1 2.5-inch HDD dimensions (2/2) Standard value Parameter FUJITSU G8BC00019610 FUJITSU G8BC0001C610 Width (mm) 70 Outline Height (mm) 9.5 dimensions Depth (mm) 100.
1.3 2.5-inch Hard Disk Drive 1 Hardware Overview Table 1-2 2.5-inch HDD specifications (1/2) Specification (TOSHIBA) Parameter HDD2189B Storage size (formatted) HDD2194B HDD2188B 60GB HDD2191V HDD2A02B 80GB HDD2D08B 100GB Speed (RPM) 4,200 5,400 4,200 5,400 4,200 5,400 Data transfer speed (Mbits/s) 175.0341.7 258.0394.0 175.0341.7 154.3298.0 170-373 230.6445.
1 Hardware Overview 1.3 2.5-inch Hard Disk Drive Table 1-2 2.5-inch HDD specifications (2/2) Specification (FUJITSU) Parameter G8BC00019610 Storage size (formatted) G8BC0001C610 G8BC0001HA10 60GB 100GB Speed (RPM) 4,200 5,400 4,200 Data transfer speed (Mbits/s) 330.4 554 443.2 Interface transfer rate (MB/s) 100 (Ultra DMA mode) Storage density (Kbpi) - Track density (Ktpi) - Average random seek time (read) (ms) Average random seek time (write) (ms) Motor startup time (ms) 12 3.
1.4 Optical Drive 1.4 1 Hardware Overview Optical Drive This model equipped with the DVD super multi drive as the optical drive. Some drives support double layer specification. The DVD Super Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD, CD-R/RW and DVD. It is a high-performance drive that reads DVD-ROM at maximum 8speed and CD at maximum 24-speed (3,600 KB per second). Writing speed depends on the drive.
1 Hardware Overview 1.4 Optical Drive Table 1-4 DVD Super Multi drive specifications (1/4) Drive Specification Parameter Data transfer speed Access time (ms) MATSUSHITA (G8CC0001S610) Read(KB/s) DVD-ROM MAX 8X CAV CD-ROM MAX 24X CAV Write CD-R 16x (Zone CLV) CD-RW 4X (CLV) High Speed CD-RW 8X (CLV) DVD-R 4x (Zone CLV) DVD-RW 2x (CLV) DVD+R 2.4x (CLV) DVD+RW 2.4x (CLV) DVD-RAM 2x (ZCLV) (4.7GB) ATAPI interface (MB/s) PIO mode 16.6 MB/s (PIO MODE4 supported) DMA mode 16.
1.4 Optical Drive 1 Hardware Overview Table 1-4 DVD Super Multi drive specifications (2/4) Drive Specification Parameter Data transfer speed Access time (ms) Matsushita (G8CC00021610) Read(KB/s) DVD-ROM MAX 8X CAV CD-ROM MAX 24X CAV Write CD-R MAX 24x (Zone CLV) CD-RW 4X (CLV) HSRW MAX 10X (CLV) USRW 10X (CLV) DVD-R MAX 8x (Zone CLV) DVD-RW MAX 4x (Zone CLV) DVD+R MAX 8x (Zone CLV) DVD+RW MAX 4x (Zone CLV) DVD-RAM 3x (ZCLV) (4.7GB) ATAPI interface (MB/s) PIO mode 16.
1 Hardware Overview 1.4 Optical Drive Table 1-4 DVD Super Multi drive specifications (3/4) Drive Specification Parameter Data transfer speed Access time (ms) Matsushita (G8CC00021611) Supporting Double Layer Read(KB/s) DVD-ROM MAX 8X CAV CD-ROM MAX 24X CAV Write CD-R MAX 24x (Zone CLV) CD-RW 4X (CLV) HSRW MAX 10X (CLV) USRW 10X (CLV) DVD-R MAX 8x (Zone CLV) DVD-RW MAX 4x (Zone CLV) DVD+R MAX 8x (Zone CLV) DVD+RW MAX 4x (Zone CLV) DVD-RAM 3x (ZCLV) (4.7GB) DVD+R DL 2.
1.4 Optical Drive 1 Hardware Overview Table 1-4 DVD Super Multi drive specifications (4/4) Drive Specification Parameter Data transfer speed Access time (ms) TEAC (G8CC00024611) Supporting Double Layer Read(KB/s) DVD-ROM MAX 8X CAV CD-ROM MAX 24X CAV Write CD-R MAX 24x (Zone CLV) CD-RW 4X (CLV) HSRW MAX 10X (CLV) USRW 10X (CLV) DVD-R MAX 8x (Zone CLV) DVD-RW MAX 4x (Zone CLV) DVD+R MAX 8x (Zone CLV) DVD+RW MAX 4x (Zone CLV) DVD-RAM 3x (ZCLV) (4.7GB) DVD+R DL 2.
1 Hardware Overview 1.5 1.5 Keyboard Keyboard A keyboard which consists of 85(US)/86(UK) keys is mounted on the system unit. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-5 is a view of the keyboard. Figure 1-5 Keyboard See Appendix E for details of the keyboard layout.
1.6 TFT Color Display 1.6 1 Hardware Overview TFT Color Display The TFT color display is 15.4 inch and consists of LCD module and FL inverter boards. 1.6.1 LCD Module The LCD module used for the TFT color display uses two backlights as the light source and can display a maximum of 262,144 colors with 1,280 x 800 resolution. Figure 1-6 shows a view of the LCD module and Table 1-5 lists the specifications.
1 Hardware Overview 1.6 TFT Color Display 1.6.2 FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module FL. Table 1-6 lists the FL inverter board specifications.
1.7 Power Supply 1.7 1 Hardware Overview Power Supply The power supply supplies twenty-five different voltages to the system board. The power supply microcontroller has the following functions. 1. 2. 3. 4. 5. 6. 7. 8. Judges if the DC power supply (AC adapter) is connected to the computer. Detects DC output and circuit malfunctions. Controls the battery icon, and DC IN icon. Turns the battery charging system on and off and detects a fully charged battery. Turns the power supply on and off.
1 Hardware Overview 1.7 Power Supply Table 1-7 Power supply output rating (2/2) Name Voltage [V] Power supplied Power OFF Suspend mode （Yes/No） Power OFF Boot mode Use No Battery USB0PS-E5V 5 Yes No No USB USB1PS-E5V 5 Yes No No USB SND-P5V 5 No No No AN12941 A4R7-P4V 4.7 No No No AD1981B, AN12941 MCV 5 Yes Yes No PSC P3V 3.
1.8 Batteries 1.8 1 Hardware Overview Batteries The PC has the following two batteries. ❑ Main battery ❑ Real time clock (RTC) battery Table 1-8 lists the specifications for these two batteries. Table 1-8 Battery specifications Battery Name Battery Element Output Voltage Capacity Lithium ion 10.8V 4,400 mAh Nickel hydrogen 2.4V 15 mAh G71C0004H210 G71C0004H610 Main battery G71C0004H110 G71C0004H510 Real time clock (RTC) battery P71035009115 1.8.
1 Hardware Overview 1.8 Batteries 1.8.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and detects a full charge when the AC adaptor and battery are connected to the computer. ❑ Battery Charge When the AC adapter is connected, normal charging is used while the system is turned on and quick charge is used while the system is turned off.
1.8 Batteries 1 Hardware Overview 1.8.3 RTC Battery The RTC battery provides the power supply to maintain the date, time, and other system information in memory. Table 1-11 lists the Time required for charges of RTC battery and data preservation time.
1 Hardware Overview 1.9 1.9 AC Adapter AC Adapter The AC adapter is used to charge the battery. Table 1-12 lists the AC adapter specifications. Table 1-12 AC adapter specifications Parameter Specification (G71C00024410) Power 90W (Peak 105W) Input voltage AC 100 to 240V Input frequency 50Hz/60Hz Input voltage 1.3A or less Output voltage DC 15V Output current 6.
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Chapter 2 Troubleshooting Procedures
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2 Troubleshooting Procedures Chapter 2 Contents 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart........................................................................................ 2-2 2.3 Power Supply Troubleshooting.................................................................................. 2-6 2.4 2.5 2.6 2.7 2.8 Procedure 1 Power Status Check ...........................
2 Troubleshooting Procedures 2.9 2.10 2.11 2.12 2.13 2.14 2.15 Display Troubleshooting.......................................................................................... 2-47 Procedure 1 External Monitor Check....................................................... 2-47 Procedure 2 Diagnostic Test Program Execution Check ......................... 2-47 Procedure 3 Connector Check and Cable Check ..................................... 2-48 Procedure 4 Replacement Check .....................
2 Troubleshooting Procedures Figures Figure 2-1 Troubleshooting flowchart............................................................................. 2-3 Figure 2-2 A set of tool for debug port test ................................................................... 2-19 Tables Table 2-1 Battery icon.................................................................................................... 2-6 Table 2-2 DC IN icon.............................................................................
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2 Troubleshooting Procedures 2.1 Troubleshooting 2 2.1 Troubleshooting Chapter 2 describes how to determine which Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. (The “FRU” means the replaceable unit in the field.) The FRUs covered are: 1. Power supply 6. Touch pad 11. Wireless LAN 2. System Board 7. Display 12. Sound 3. 3.5” USB FDD 8. Optical Drive 13. TV Tuner 4. 2.5” HDD 9. Modem 5. Keyboard 10. LAN The Test Program operations are described in Chapter 3.
2.2 Troubleshooting Flowchart 2.2 2 Troubleshooting Procedures Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which troubleshooting procedures to execute. Before going through the flowchart steps, verify the following: Ask the user if a password is registered and, if it is, ask him or her to enter the password. Verify with the customer that Toshiba Windows XP Home Edition or Windows XP Media Center Edition is installed on the hard disk.
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2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart If the diagnostics program cannot detect an error, the problem may be intermittent. The Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error(s), and perform the appropriate troubleshooting procedures as follows: 1.
2.3 Power Supply Troubleshooting 2.3 2 Troubleshooting Procedures Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Table 2-2 DC IN icon DC IN icon Power supply status Lights green DC power is being supplied from the AC adapter. Blinks orange Power supply malfunction*1 Doesn’t light Any condition other than those above. *1 When the power supply controller detects a malfunction, the DC IN icon blinks orange. It shows an error code. When the icon is blinking, perform the following procedure. 1. Remove the battery pack and the AC adapter. 2.
2.3 Power Supply Troubleshooting Procedure 2 2 Troubleshooting Procedures Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below. Start Off for 2 seconds Error code (8 bit) “1” On for one second “0” On for half second Interval between data bits Off for half second The error code begins with the least significant digit. Example: Error code 11h (Error codes are given in hexadecimal format.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Table 2-3 Error code Error code Where error occurs 1*h DC Power (AC Adapter) 2*h Main battery 3:h 2nd battery 4*h S3V output 5*h 1R5-C1V output (P61) 6*h 1R5-C1V output (P62) 7*h PPV output 8*h PTV output 9*h E5V output A*h E3V output B*h 2R5-P2V output C*h PGV output D*h 1R25-B1V output E*h 2R5-B2V output DC power supply (AC adapter) Error code Meaning 10h AC Adapter output voltage is over 16.5V.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Main Battery Error code Meaning 21h Main battery charge current is over 12.0A. 22h Main battery discharge current is over 0.5A when there is no load. 23h Main battery charge current is over 3.9A when AC adapter is not connected. 24h Abnormal current has been sensed. 25h Main battery charge current is over 0.3A when the charging is off. Second Battery Error code Meaning 31h Second battery charge current is over 12.0A.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting 1R5-C1V output Error code Meaning 60h 1R5-C1V voltage is over 2.16V when the computer is powered on/off. 61h 1R5-C1V voltage is 1.275V or less when the computer is powered on. 62h 1R5-C1V voltage is 1.275V or less when the computer is booting up. 63h 1R5-C1V voltage is 1.275V or less while the computer is suspended. 64h 1R5-C1V voltage is abnormal while the computer is shutdown. (CV support) 65h 1R5-C1V voltage is 1.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures E3V output Error code Meaning A0h E3V voltage is over 3.96V when the computer is powered on/off. A1h E3V voltage is 2.81V or less when the computer is powered on. A2h E3V voltage is 2.81V or less when the computer is booting up. A3h E3V voltage is 2.81V or more when the computer is powered off. A4h E3V voltage is 2.81V or less when the computer is suspended. 2R5-P2V output Error code Meaning B0h 2R5-P2V voltage is over 3.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting 2R5-B2V output Error code Meaning E0h 2R5-B2V voltage is over 3.00V when the computer is powered on/off. E1h 2R5-B2V voltage is 2.125V or less when the computer is powered on. E2h 2R5-B2V voltage is 2.125V or less when the computer is booting up. E3h 2R5-B2V voltage is 2.125V or more when the computer is powered off. E4h 2R5-B2V voltage is 2.125V or less while the computer is suspended.
2.3 Power Supply Troubleshooting Procedure 3 2 Troubleshooting Procedures Connection Check The wiring diagram related to the power supply is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Make sure the AC adapter and the AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet. If these cables are connected correctly, go to Check 2. Check 2 Replace the AC adapter and the AC power cord with new ones.
2 Troubleshooting Procedures Procedure 5 2.3 Power Supply Troubleshooting Replacement Check The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4, Replacement Procedures. Check 1 Replace the AC adapter with a new one. If the AC adapter is still not functioning properly, perform Check 2. Check 2 Replace the system board with a new one.
2.4 System Board Troubleshooting 2.4 2 Troubleshooting Procedures System Board Troubleshooting This section describes how to determine if the system board is defective. Start with Procedure 1 and continue with the other procedures as instructed.
2 Troubleshooting Procedures Procedure 1 2.4 System Board Troubleshooting Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it. If an error message is shown on the display, perform Check 1. If there is no error message, go to Procedure 2. If MS-DOS, Windows XP Home Edition or Windows XP Media Center Edition is properly loaded, go to Procedure 4.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures If any other error message displays, perform Check 3. Check 3 The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (22) or (23) is displayed, go to Procedure 4. If error message (18) is displayed, go to the Keyboard Troubleshooting Procedures in Section 2.7. If error message (19), (20) or (21) is displayed, go to the 2.
2 Troubleshooting Procedures Procedure 2 2.4 System Board Troubleshooting Debug Port Check Check the D port status by a debug port test. The tool for debug port test is shown below. Figure 2-2 A set of tool for debug port test The test procedures are follows: 1. Connect the debug test cable to the connector CN3400 of the system board. For disassembling to connect the test cable, refer to Chapter 4. 2. Connect the debug port test cable and RS-232C cross-cable to the test board. 3.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Debug port (Boot mode) error status (2/9) D port status F004h/F005h Inspection items Details Saving key scan code Setting TASK_1ms_TSC Controlling fan Initializing sound items (for BEEP) Enabling system speaker Releasing mute Making the volume max.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Debug port (Boot mode) error status (3/9) D port status (F100h) Inspection items Initialization of H/W (before DRAM recognition) Details Initialization of MCHM Initialization of ICH4M.D31.Func0 Initialization of ICH4M.D31.Func1 Initialization of USB.Func0,1,2,7 Initialization of ICH4M.D31.Func3 Initialization of ICH4M.D31.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Debug port (Suspend mode) error status (1/3) D port status Inspection items Details Sets the parallel port to D0 state (for models supporting printer) F12Fh Release resources used for fingerprint authentication. (For models supporting fingerprint authentication) F130h When powering-off request from OS is required, waits for the completion of dividing process because waiting in SUSPEND of Runtime returns the process to OS.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-5 Debug port (Suspend mode) error status (2/3) LED Status (F133h) Test item Contents Storing CPU register Permission of system area and memory cache (for high-speed operation) Suspending of HDD Storing KBC,SCC and MOUSE Storing of PCI device Storing of PIT Starts sequence for storing display system.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Debug port (Suspend mode) error status (3/3) LED Status (F13Ah) Test item Contents Power LED control during suspending Isolates built-in LAN Makes the power of sound off F13Bh F13Ch Makes the power of Dock off (for models supporting Dock) Model-unique processing just before suspending Waiting for completion of dividing for suspending Stops dividing of extension command for power off.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-6 Debug port (Resume mode) error status (1/4) LED Status Test item F100h Refer to IRT F101h Refer to IRT F102h Refer to IRT F103h Refer to IRT Contents Clears flag for SMI control. Update of Resume counter F121h Checks the WakeUp factors.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-6 Debug port (Resume mode) error status (2/4) LED Status (F122h) Test item Initialization of devices necessary for initialization before initializing PCI bus 2 Contents AC'97 control Initializing of temperature control information Initializing of KBC VGA display-off and Reset control Starting recovery of VGA Initializing of sound Acquires the multi-box status.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-6 Debug port (Resume mode) error status (4/4) LED status Test item (F12Ah) Contents Process related to CPU Setting of CPU clock to SETUP designation Waiting for motor-off of disabled HDD Final decision of USB FDD information Post-process of PRE_BOOT_SETUP Clears PWRBTN_STS. Enables Power Button.
2.4 System Board Troubleshooting Procedure 3 2 Troubleshooting Procedures Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test 6. Printer test 7. Async test 8. Hard Disk test 9. Real Timer test 10. NDP test 11. Expansion test 12.
2 Troubleshooting Procedures 2.5 USB 3.5” FDD Troubleshooting 2 2.5 USB 3.5” FDD Troubleshooting This section describes how to determine if the USB 3.5” FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.5 USB 3.5” FDD Troubleshooting Procedure 2 2 Troubleshooting Procedures Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the FDD connected to the computer, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled. Floppy disk drive test error codes and their status names are listed in Table 2-7.
2 Troubleshooting Procedures Procedure 3 2.5 USB 3.5” FDD Troubleshooting Connector Check and Replacement Check The USB FDD connector may be disconnected from the system board or SD board. Check visually that the connector is connected to one of them firmly. Check 1 Make sure the following cables and connectors are firmly connected to the system board or SD board. The USB FDD can be connected to any of four USB ports. (Three ports are installed on the system board and one is on SD board.
2.6 2.5” HDD Troubleshooting 2.6 2 Troubleshooting Procedures 2.5” HDD Troubleshooting This section describes how to determine if the 2.5” HDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.6 2.5” HDD Troubleshooting Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen. Turn on the computer and check the message on the screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with Check 1 below and perform the other checks as instructed.
2.6 2.5” HDD Troubleshooting Procedure 3 2 Troubleshooting Procedures Format Check The computer’s HDD is formatted using the MS-DOS FORMAT program or the physical format program of the test program. To format the HDD, start with Check 1 below and perform the other steps as required. Refer to the MS-DOS Manual for the operation of MS-DOS. For the format by the test program, refer to the Chapter 3. Check 1 Format the 2.5” HDD using MS-DOS FORMAT command. Type as FORMAT C:/S/U. If the 2.
2 Troubleshooting Procedures Procedure 4 2.6 2.5” HDD Troubleshooting Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. The error codes and statuses are described in Table 2-8.
2.6 2.5” HDD Troubleshooting Procedure 5 2 Troubleshooting Procedures Connector Check and Replacement Check The HDD is connected to the connector of the system board. The connecting portion may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks to check the connecting portion: Check 1 Make sure the HDD and system board is firmly connected. If their connection is loose, reconnect firmly and repeat Procedure 1.
2 Troubleshooting Procedures 2.7 2.7 Keyboard Troubleshooting Keyboard Troubleshooting To determine if the computer’s keyboard is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the test for keyboard of ONLY ONE test in the Diagnostic Program.
2.8 Touch Pad Troubleshooting 2.8 2 Troubleshooting Procedures Touch Pad Troubleshooting To determine if the computer’s touch pad is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the test for touch pad of ONLY ONE test in the Diagnostic Program.
2 Troubleshooting Procedures 2.9 2.9 Display Troubleshooting Display Troubleshooting This section describes how to determine if the computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed.
2.9 Display Troubleshooting Procedure 3 2 Troubleshooting Procedures Connector Check and Cable Check The LCD module is connected to the system board by an LCD/FL cable. The FL inverter board is also connected to the system board by an LCD/FL cable. And the FL is connected to the FL inverter board by the HV cable. The connectors may be disconnected from the system board or the FL inverter, or they may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures.
2 Troubleshooting Procedures Procedure 4 2.9 Display Troubleshooting Replacement Check The FL lamp, FL inverter, LCD module, system board and LCD/FL cable are connected to display circuits. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: If the FL lamp does not light, perform Check 1. If characters or graphics on the internal display are not displayed clearly, perform Check 4.
2.10 Optical Drive Troubleshooting 2 Troubleshooting Procedures 2.10 Optical Drive Troubleshooting To check if the optical drive is defective or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Prepare the tools before the test. (Refer to tools for implementing the Diagnostics procedures on page 2-1.
2 Troubleshooting Procedures 2.11 Modem Troubleshooting 2.11 Modem Troubleshooting To check if the modem is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Modem Test in the Diagnostic Program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
2.11 Modem Troubleshooting 2 Troubleshooting Procedures Check 5 The cable between the SD board and system board may be faulty. Replace it with a new one following the instructions in Chapter 4. If the problem still occurs, perform Check 6. Check 6 The system board may be faulty. Replace it with a new one following the instruction in Chapter 4.
2 Troubleshooting Procedures 2.12 LAN Troubleshooting 2.12 LAN Troubleshooting To check if the computer’s LAN is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the LAN/Modem/Bluettoth/IEEE1394 Test in the Diagnostic Program.
2.13 Wireless LAN Troubleshooting 2 Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting This section describes how to determine if the computer's Wireless LAN is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.13 Wireless LAN Troubleshooting Antennas' Connection Check The wireless LAN function-wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and check the followings: Check 1 Make sure the wireless communication switch is “On”. If the switch is “Off”, turn it “On”. If there is still an error, perform Check 2.
2.13 Wireless LAN Troubleshooting Procedure 3 2 Troubleshooting Procedures Replacement Check The wireless LAN board, wireless LAN antennas or the system board may be damaged. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then check the followings: Check 1 The wireless LAN board may be defective or damaged. Replace the wireless LAN board with a new one following the instructions in Chapter 4, Replacement Procedures.
2 Troubleshooting Procedures 2.14 Sound Troubleshooting 2.14 Sound Troubleshooting To check if the sound function is defective or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Sound Test in the Diagnostic Program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
2.14 Sound Troubleshooting Procedure 3 2 Troubleshooting Procedures Replacement Check Check 1 When the headphone does not work properly, it may be faulty. Replace it with a new one. If the problem still occurs, perform Check 5. Check 2 When the external microphone does not work properly, it may be faulty. Replace it with a new one. If the problem still occurs, perform Check 5. Check 3 When the internal microphone does not work properly, it may be faulty.
2 Troubleshooting Procedures 2.15 TV Tuner Troubleshooting 2.15 TV Tuner Troubleshooting To check if the TV tuner is defective or not, follow the troubleshooting procedures below as instructed. Procedure 1: Connector Check and Replacement Check Procedure 1 Connector Check and Replacement Check The TV antenna, TV tuner module, SD board or System board may be disconnected or faulty.
2.
Chapter 3 Tests and Diagnostics
3-ii QOSMIO F10 Maintenance Manual (960-498)
Chapter 3 Contents 3.1 3.2 The Diagnostic Test ................................................................................................... 3-1 3.1.1 Diagnostics menu ................................................................................. 3-1 3.1.2 H/W(Hardware) initial information setting tool................................... 3-3 3.1.3 Heatrun test program............................................................................ 3-3 Executing the Diagnostic Test ...............
3.21.2 3.22 3.23 3.24 3.25 Operations .......................................................................................... 3-47 Log Utilities ............................................................................................................. 3-48 3.22.1 Function Description .......................................................................... 3-48 3.22.2 Operations .......................................................................................... 3-49 Running Test......
Tables Table 3-1 Subtest names............................................................................................... 3-12 Table 3-2 Error codes and error status names .............................................................. 3-35 Table 3-3 Hard disk controller status register contents................................................ 3-38 Table 3-4 Error register contents.................................................................................. 3-39 Table 3-5 Error message......
3-vi QOSMIO F10 Maintenance Manual (960-498)
3 Tests and Diagnostics 3.1 The Diagnostic Test 3 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
3.1 The Diagnostic Test 3 Tests and Diagnostics NDP TEST EXPANSION TEST CD-ROM/DVD-ROM TEST Other tests are: Wireless LAN TEST (Wireless LAN TEST disk) LAN/Modem/Bluetooth/IEEE1394 TEST (LAN/Modem/Bluetooth/IEEE1394 TEST disk) Sound TEST (Sound TEST disk) You will need the following equipment to perform some of the Diagnostic test programs.
3 Tests and Diagnostics 3.1 The Diagnostic Test 3.1.2 H/W (Hardware) initial information setting tool The H/W initial information setting tool consists of the following programs. Initial configuration Region write System configuration display E2PROM test (MAC/GUID/DMI) You will need the following equipment to perform some of the programs. The Diagnostics Disk (Main T&D) 3.1.3 Heatrun test program The heatrun test starts automatically after the selection.
3.2 Executing the Diagnostic Test 3.2 3 Tests and Diagnostics Executing the Diagnostic Test To start the DIAGNOSTIC PROGRAM, follow these steps: 1. Insert the Diagnostics disk in the floppy disk drive. 2. Release the lock of the power switch and turn on the computer with pressing the F12. Select the FDD in the display for selecting booting unit. Then, press Enter and the following menu appears. Microsoft Windows XX Startup Menu --------------------------------------------------------1.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test NOTE: To exit the DIAGNOSTIC TEST MENU, press Esc. If a test program is in progress, press Ctrl + Break to exit the test program. If a test program is in progress, press Ctrl + C to stop the test program. Set the highlight bar to 1, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Select the option you want to execute and press Enter. When you select 1- SYSTEM TEST, the following message will appear: SYSTEM TEST NAME SUB-TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXXXXX xxxxxxx DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Selecting YES of ERROR STOP stops the test program when an error is found and displays the operation guide on the right side of the display screen as shown below: ERROR STATUS NAME [[ HALT OPERATION ]] 1: Test end 2: Continue 3: Retry These three selections have the following functions respectively: 1. Terminates the test program and exits to the subtest menu. 2. Continues the test. 3. Restarts the test from the error.
3.3 Setting of the hardware configuration 3.3 3 Tests and Diagnostics Setting of the hardware configuration To execute this program, select 2-Repair initial config set in the startup menu, press Enter and follow the directions on the screen. The H/W initial information setting tool consists of following subtests. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Initial configuration This subtest executes the following items and shows their contents in the display.
3 Tests and Diagnostics • • • • 3.3 Setting of the hardware configuration Setting of the HWSC Setting of the UUID Display of the DMI information (including UUID) Setting of DVD region code (Yes/No) After completion of the above settings, H/W configuration & DMI information are appeared in order. Check the contents and press Enter. Subtest 02 Region write This subtest sets the region code for DVD drive based on the destination of the machine.
3.3 Setting of the hardware configuration Subtest 08 3 Tests and Diagnostics System configuration display This subtest displays the information of the system configuration. When the following message appears, confirm the contents and press Enter. Press [Enter] key For more details on the system configuration information, refer to "3.25 System configuration". Subtest 09 E2PROM test (MAC/GUID/DMI) It checks automatically whether the MAC address, GUID of IEEE1394 and DMI information are written.
3 Tests and Diagnostics 3.4 3.4 Heatrun Test Heatrun Test To execute this program, select 3-Repair heatrun in the startup menu and press Enter. After selecting this test, the same subtests as 3.23 Running Test are executed successively. For more details on the procedure and test content, refer to Running Test. When the heatrun test ends, following message appears in the display.
3.5 Subtest Names 3.5 3 Tests and Diagnostics Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No. 3-12 Test Name Subtest No.
3 Tests and Diagnostics 3.5 Subtest Names Table 3-1 Subtest names (2/2) No. Test Name Subtest No.
3.6 System Test 3.6 3 Tests and Diagnostics System Test To execute the System Test, select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM Checksum This subtest executes a checksum test of the BIOS ROM (range: F0000h to FFFFFh, 64KB) on the System Board. Subtest 02 Fan ON/OFF This subtest turns on/off the fan motor by force with Fan ON/OFF commands.
3 Tests and Diagnostics 3.6 System Test If the CPU supports Gerserville (SpeedStep), this Subtest checks that the CPU operating clock speed can be changed. Subtest 04 Quick Charge This subtest checks the status for the quick charge. Subtest 05 DMI read This subtest displays the information in the Flash-ROM in the following format. *** DMI Data Display Ver X.
3.7 Memory Test 3.7 3 Tests and Diagnostics Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Conventional memory This subtest writes a constant data to conventional memory (0 to 640 KB), then reads the new data and compares the result with the original data. Subtest 02 Protected Mode NOTE: The CONFIG.
3 Tests and Diagnostics 3.8 3.8 Keyboard Test Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed key code display When a key is pressed, the scan code, character code, and key top name are displayed on the screen in the format shown below.
3.9 Display Test 3.9 3 Tests and Diagnostics Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM read/write for VGA This subtest writes the constant data (AAh and 55h) to the video RAM. The data is read and compared to the original data.
3 Tests and Diagnostics Subtest 04 3.9 Display Test Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode 12] 13] 3] 111 112 114 115 117 118 640*480 640*480 800*600 800*600 1024*768 1024*768 64K] 16M] 64K] 16M] 64K] 16M] The display below appears on the screen when this subtest is executed.
3.9 Display Test Subtest 06 3 Tests and Diagnostics “H” Pattern Display This subtest displays a full screen of “H” patterns.
3 Tests and Diagnostics 3.10 Floppy Disk Test 3.10 Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD because the contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. 1. The following message will appear. Select the media mode and start track to be tested and press Enter.
3.10 Floppy Disk Test 3 Tests and Diagnostics Select the number of the subtest you want to execute and press Enter. The following message will appear during the floppy disk test. FLOPPY DISK SUB-TEST PASS COUNT WRITE DATA ADDRESS IN PROGRESS : : : : XX XXXXX XX XXXXXX XXXXXXX xxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] : test end [Ctrl]+[C] : key stop ERROR COUNT READ DATA STATUS : XXXXX : XX : XXX When the subtest 04 or 05 is selected, the following messages will appear on the screen.
3 Tests and Diagnostics 3.11 Printer Test 3.11 Printer Test CAUTION: Printer Test is not supported for this model. To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. NOTE: An IBM compatible printer must be connected to the system to execute this test. Also, printer port wraparound connector must be connected.
3.11 Printer Test Subtest 02 3 Tests and Diagnostics Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wraparound NOTE: To execute this subtest, a printer wraparound connector must be connected to the computer’s printer port.
3 Tests and Diagnostics 3.12 Async Test 3.12 Async Test CAUTION: Async Test is not supported for this model. To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
3.13 Hard Disk Test 3 Tests and Diagnostics 3.13 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. CAUTION: The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 08 or 09 is executed. Before running the test, the customer should transfer the contents of the hard disk to floppy disk or another hard disk. If the customer has not or cannot perform the back-up, create back-up disks as described below.
3 Tests and Diagnostics 3.13 Hard Disk Test 3. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest. HARD DISK TEST XXXXXXX SUB TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXX DIAGNOSTIC TEST VX.
3.13 Hard Disk Test Subtest 04 3 Tests and Diagnostics Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder and then reads the data while moving from cylinder to cylinder.
3 Tests and Diagnostics 3.14 Real Timer Test 3 3.14 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real time A new date and time can be input during this subtest. To execute the real time subtest, follow these steps: 1.
3.14 Real Timer Test Subtest 03 3 Tests and Diagnostics Real time carry CAUTION: When this subtest is executed, the current date and time are erased. This subtest checks the real time clock increments.
3 Tests and Diagnostics 3.15 NDP Test 3.15 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen.
3.16 Expansion Test 3 Tests and Diagnostics 3.16 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wraparound NOTE:: PCMCIA wraparound test is not supported for this model. NOTE: To execute this subtest, the PC card wraparound connector is required.
3 Tests and Diagnostics Subtest 02 3.16 Expansion Test RGB monitor ID NOTE: To execute this subtest, an external monitor with monitor ID function is required. Connect the external monitor to the PC for the test of ID acquisition. The judgment of acquisition is based on the panel data. In simultaneous display mode or internal display mode, in which the panel data is acquired, this subtest will fail. Therefore, make sure only the external display is selected when executing this subtest.
3.17 CD-ROM/DVD-ROM Test 3 Tests and Diagnostics 3.17 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM test, select 13 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1. For the subtest 04, use a CD-RW on the market.
3 Tests and Diagnostics 3.18 Error Code and Error Status Names 3.18 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test.
3.
3 Tests and Diagnostics 3.
3.19 Hard Disk Test Detail Status 3 Tests and Diagnostics 3.19 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eightdigit number. The first four digits represent the hard disk controller (HDC) error status number and the last four digits are not used.
3 Tests and Diagnostics 3.19 Hard Disk Test Detail Status Table 3-4 Error register contents Bit Name Description 7 BBK (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error. “1” … Uncorrectable data error has been detected. 5 —— Not used 4 IDN (Identification) “0” … Not used “1” … There is no ID field in the requested sector.
3.20 ONLY ONE TEST 3.20 3 Tests and Diagnostics ONLY ONE TEST 3.20.1 Program Description This program tests the unique functions of this model. 3.20.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter. The following menu appears in the display. ################################################################# ######## ONLY ONE TEST Menu (XXXXXXXXX) ####### ################################################################# * * * 1 ............ Pressed Key Display * * 2 ............
3 Tests and Diagnostics Subtest 01 3.20 ONLY ONE TEST Pressed key display When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed. Holding a key down enables the auto-repeat function which causes the key’s display character to blink. Press Del + Enter to end the test.
3.20 ONLY ONE TEST Subtest 02 3 Tests and Diagnostics Touch Pad This subtest checks the functions of the touch pad as shown below. A) Direction and parameter B) Switching function check. This test displays the response from the touch pad and touch pad switch. When moving your finger on the touch pad towards the upper left, the display changes according to the following illustration. If a touch pad switch is pressed, the displays appear on the right side one by one.
3 Tests and Diagnostics Subtest 03 3.20 ONLY ONE TEST GP Button This subtest checks if the AV buttons (10 buttons) work properly. The following message appears in the display. Press button [0] Press the AV button from the left (the AV button nearest to power button). The name of AV buttons in the message is described as number (0-9) from the left side. (Refer to the following picture.
3.20 ONLY ONE TEST 3 Tests and Diagnostics Slide the switch to OFF position. Then, the following message appears in the display. KILL SWITCH ON !! Slide the switch to ON position. Then, the following message appears in the display. KILL SWITCH OFF !! After Sliding the switch to OFF position, the screen returns to the ONLY ONE TEST menu automatically. Subtest 05 USB NOTE: When executing this subtest, USB test module and USB cable must be connected. This subtest checks if USB ports work properly.
3 Tests and Diagnostics Subtest 06 3.20 ONLY ONE TEST Touch Pad (Scroll Button) This subtest checks if the scroll button of touch pad works properly. The following message appears in the display. ****** Scroll button TEST (VX.XX) ****** Press Scroll button Up Button xxx Down Button xxx Press [ESC] key to EXIT Check the message “xxx” changes to ON while pressing UP or DOWN button of scroll button and changes to OFF when releasing the buttons. Press ESC and return to ONLY ONE TESST menu.
3.20 ONLY ONE TEST 3 Tests and Diagnostics Press Enter and following message appears in the display. Check [PowerSW-LED]= Green Check if the Power Switch LED lights in the following order. (Green -> Orange -> Blue -> OFF) Press any key and the following message appears in the display. Check [DC-IN]&[Power]&[Main Battery]LED= Green/Orange Check if the each LED lights in the same color shown in the display (Message switches Green <-> Orange). Press Enter to return to the ONLY ONE TEST menu.
3 Tests and Diagnostics 3.21 3.21 Head Cleaning Head Cleaning 3.21.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.21.2 Operations 1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS - FLOPPY DISK HEAD CLEANING : VX.XX Mount cleaning disk(s) on drive(s). Press any key when ready. 2.
3.22 Log Utilities 3.22 3 Tests and Diagnostics Log Utilities 3.22.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk, or output the data to a printer or the display. The error information is displayed in the following order: 1. Error count (CNT) 2. Test name, Subtest number (TS-No) 3. Pass count (PASS) 4. Error status (STS) 5. FDD/HDD or memory address (ADDR) 6. Write data (WD) 7.
3 Tests and Diagnostics 3.22 Log Utilities 3.22.2 Operations 1.
3.23 Running Test 3.23 3 Tests and Diagnostics Running Test 3.23.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02, 06) 3. Display test (subtest 01) 4. Real timer test (subtest 02) 5. HDD test (subtests 01) The system automatically detects the number of floppy disk drives connected to the computer for the FDD test. 3.23.2 Operations 1.
3 Tests and Diagnostics 3.24 3.24 Floppy Disk Drive Utilities Floppy Disk Drive Utilities 3.24.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE: This program is only for testing a floppy disk drive. It is different from the Toshiba MS-DOS FORMAT command.
3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3.24.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 2 3 4 9 – - FORMAT COPY DUMP HDD-ID READ EXIT TO DIAGNOSTICS MENU 2. FORMAT program (a) Selecting FORMAT displays the following message: DIAGNOSTICS - FLOPPY DISK FORMAT : VX.
3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below: Insert source disk into drive A: Press any key when ready. (c) Remove the Diagnostics Disk from the FDD, insert the source disk and press any key. The following message will appear, indicating the program has started.
3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If 2:HDD is selected, the display will go to step (h). If 1:FDD is selected, the following message will appear: Select drive number (1:A, 2:B) ? (c) Select a drive number and the following message will be displayed.
3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? 5. HDD ID READ program Selecting HDD ID displays the following HDD ID configuration: [HDD ID Read (VX.XX)] [Drive #1] Model No. = XXXXXXX Press Enter to return to the FDD UTILITIES MENU.
3.25 System Configuration 3 Tests and Diagnostics 3 3.25 System Configuration 3.25.1 Function Description NOTE: To display the system configuration, the write protect tab should be OFF position. If the tab is ON position, move the tab to OFF position and restart the test. Otherwise the correct information cannot be acquired. The System Configuration program contains the following configuration information for the computer: 1. Processor Type [Code/L2 cache] 2. Chip set [VRAM] 3.
3 Tests and Diagnostics 3.25 System Configuration 3.25.2 Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display. System Configuration Display : Ver X.XX [Machine Name ???] * * * * * * * * * * * * * * * - Processor Type - Chip set - BIOS-ROM Version - BOOT-ROM Version - EC Total Version - PS Micon Version - SVP Par.
3.26 Wireless LAN Test Program (Intel-made b/g) 3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Intel-made b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade Calexico 802.11b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS.
3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Intel-made b/g) When a defective is detected in the test, following typical cause is considered. • Bad connection of wireless LAN card • Using a wrong wireless LAN card (Using unspecified card) • Defective wireless LAN card Check the connection and execute the subtest again. Subtest02 MAC Address Check This subtest displays the MAC address. When selecting this subtest, following message will appear in the display.
3.26 Wireless LAN Test Program (Intel-made b/g) Subtest03 3 Tests and Diagnostics Antenna check & communication test of 11b mode Caution: To execute subtest 03-05, use another computer (with Calexico wireless LAN card) that can communicate by the wireless LAN as a responder machine. Access points are also required. (Access point for 802.11b and 802.11g) Be sure to turn the wireless communication switch ON before executing wireless LAN communication test. (The wireless communication LED lights orange.
3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Intel-made b/g) Check the connection and condition, and execute the subtest again. Subtest04 Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. After finishing the test, OK message will appear in the display. Press any key to return to the test menu. When a defective is found during the test, NG message will appear in the display.
3.27 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade Calexico 802.11a/b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g) If a defective is found during the test, NG message will appear in the display. Press any key and following message will appear in the display. ************************************************************* * * * SKU NG !! * * * * Other Card or Module not found * * * ************************************************************* Press any key to continue… Press any key to return to the test menu.
3.27 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics Press any key to return to the test menu. When a defective is detected in the test, following typical cause is considered. • Bad connection of wireless LAN card • Defective wireless LAN card • Disappearance of MAC address data Check the connection and execute the subtest again.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g) Press any key to return to the test menu. When a defective is detected in the test, following typical cause is considered. • Bad connection of wireless LAN card • Bad connection of wireless LAN antenna cable (Main/Aux) • Bad environment for wireless LAN communication (Interference/ obstruction) • Defective wireless LAN card Check the connection and condition, and execute the subtest again.
3.27 Wireless LAN Test Program (Intel-made a/b/g) Subtest05 3 Tests and Diagnostics Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. For more details on procedure and contents of this subtest, refer to Subtest04 Communication test of 11a mode. Subtest06 All the tests of Calexico 11a/b/g Card This subtest checks SKU information, MAC address of Calexico 802.11a/b/g card, antenna connection and communication test of Calexico 802.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Askey-made) 3.28 Wireless LAN Test Program (Askey-made) This section describes how to perform the wireless LAN transmitting-receiving test (Askeymade Atheros b/g, a/b/g). Caution: To execute subtest 03-07, use another computer (with Atheros wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform those tests. Another wireless communication tool with 2.4GHz like Bluetooth is interfering with the test.
3.28 Wireless LAN Test Program (Askey-made) 3 Tests and Diagnostics 4. When the program disk 2 starts, following menu will appear in the display. To execute the subtest, press test number and Enter.
3 Tests and Diagnostics Subtest02 3.28 Wireless LAN Test Program (Askey-made) MAC Address Check This subtest reads out the MAC address of the card installed and confirms if it is valid. When the MAC address is valid one, following message will appear in the display. ************************************************************* * * * MAC Address Check : OK !! * * * ************************************************************* Press any key to return to the test menu.
3.28 Wireless LAN Test Program (Askey-made) 3 Tests and Diagnostics Moreover, following typical cause is considered. • Bad connection of wireless LAN card • Bad connection of wireless LAN antenna cable (Main/Aux) • Environment for wireless LAN communication (Interference/ obstruction) • Defective wireless LAN card Check the connection and condition, and execute the subtest again.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the test program. Insert the test program disk for LAN/Modem/Bluetooth/IEEE1394 test in FDD and turn on the power. The following message will appear: Microsoft Windows XX Startup Menu ---------------------------------1. LAN 2. Modem 3. Bluetooth 4.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest01 3 Tests and Diagnostics (i82562 + ICHx) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip.
3 Tests and Diagnostics Subtest02 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program (GbE) CAUTION: Gigabit Ethernet (GbE) test is not supported for this model. This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. Select 2 to execute and press Enter. The following message will appear: Testing adaptor...hit to abort. * External Loopback Test...PASSED Testing completed.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.2 3 Tests and Diagnostics Modem test For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Electric Manufacture Co.,Ltd)” for the tests. To execute Modem test, press 2 and Enter. Following message will appear: [Modem loopback test !] ICHx MDC Test Program with Modem Sound (Line Test) Version X.
3 Tests and Diagnostics 3.29.3 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Bluetooth test CAUTION: Bluetooth test is not supported for this model. To execute this test, input 3 and press Enter. Note: Use another computer that can communicate by the Bluetooth as a reference machine to perform this test. Insert a floppy disk containing the test program into the target machine and turn on the target machine.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest01 3 Tests and Diagnostics BD_ADDR check This subtest checks the BD_ADDR functions. When the Bluetooth test menu is displayed, press 1 to select the test and press Enter. The following message will appear: ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program If the target machine has any problem, it displays Error messasge. The following message is displayed. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-6 Error code for Bluetooth test (BD_ADDR) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection. Hardware Failure.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Table 3-6 Error code for Bluetooth test (BD_ADDR) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If any problem is detected during the test, the massage FAIL is displayed on the tester machine with the error code as shown below. The error code begins with the least significant digit.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.4 3 Tests and Diagnostics IEEE1394 test To execute this test, input 4 and press Enter. NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a responder machine to perform this test. The following menu will appear: ******************************************************************** ******** IEEE1394[XXXXX] Diagnostics program ************** ******************************************************************** * * * 1 ....
3.30 Sound Test program 3 3 Tests and Diagnostics Tests and Diagnostics 3.30 Sound Test program This section describes how to perform the Sound test. To execute the sound test, refer to the following description. Insert the test program disk for Sound test in the floppy disk drive and turn on the power.
3.30 Sound Test program 3 Tests and Diagnostics To return to the Sound test menu, Press 9 and Enter. Then following message will appear in the display. *********************************** ******** May I Restart ? ******* *********************************** Press any key to continue… After pressing any key, the machine starts rebooting and sound test menu will appear in the display. Subtest01 Microphone recording & play This subtest checks the function of the CODEC A/D, D/A converter.
3 Tests and Diagnostics Subtest02 3.30 Sound Test program Sine Wave This subtest is executed by loading the COM file (ADSIN.COM). The program expands sine wave data table from 16KB to 64KB, and creates the play data. Then it transfers the data between the DMA and the CODEC to play the sine wave. (It sounds like a continuous beep). By using wave measurable devices such as an oscilloscope, the data can be measured as a sine wave.
3.30 Sound Test program 3 Tests and Diagnostics 3.30.3 CD Sound (Standard) test To execute the CD Sound (Standard) test, press 3 and Enter. Insert the test media (TOSHIBA TEST CD-ROM or ABEX TEST CD-ROM) or music CD on the market (if the test media can not be prepared). The menu appears in the display. For details on use of test media, refer to (1) Test media (Toshiba-made test media). For details on use of audio CD on the market, refer to (2) Audio CD.
3 Tests and Diagnostics Subtest02 3.30 Sound Test program English Narration When selecting this subtest, narration in English starts. For more details on the procedure, refer to the subtest01. Subtest03 Test Tone A Caution: Before starting subtest03, be sure to set the sound at proper volume. This subtest plays sine wave while changing its table from 100Hz to 20Hz. The test returns to the CD Sound (Standard) menu after the test ends.
3.30 Sound Test program 3 Tests and Diagnostics (2) Audio CD Insert an audio CD and the following menu appears in the display. CD/DVD TEST IN PROGRESS XXXXXXXX SUB-TEST PASS COUNT WRITE DATA ADDRESS XX XXXXX XX XXXXXX : : : : xxxxxxx DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.31 SETUP 3.31 SETUP 3.31.1 Function Description This program displays the current system setup information as listed below: 1. Memory 2. System Date/Time 3. Battery 4. Password 5. Boot Priority (a) Boot Priority (b) Network Boot Protocol 6. Display (a) Power On Display (b) LCD Display Stretch (c) TV Type 7. Others (a) (b) (c) (d) (e) (f) (g) (h) CPU Cache Level 2 Cache Dynamic CPU Frequency Mode Auto Power On Start Up Logo Sound Logo Power Button Lamp Language During Bootup 8.
3.31 SETUP 3 Tests and Diagnostics 3.31.2 Accessing the SETUP Program While pressing ESC, turn on the power. Then press F1. The following display appears. NOTE: *1 This message appears only on the model for TCL (Canada).
3 Tests and Diagnostics 3.31 SETUP Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press ↑ and ↓ to move between items in a column. Press Fn+↑ (PgUp) and Fn + ↓ (PgDn) to move between the two pages. 2. Press either the Space bar or Back Space to change the value. Accepting Changes and Exiting the SETUP Window 1. Press End to accept the changes you made.
3.31 SETUP 3 Tests and Diagnostics SETUP Options The SETUP screen is divided into 13 functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s memory. This field displays the total amount of memory installed and is automatically calculated by the computer. You cannot change this value. 2. System Date/Time You can set the date and time. To set the date and time, press Space bar or Back Space.
3 Tests and Diagnostics 3.31 SETUP NOTE: Display of the LCD Brightness will be changed in the condition below: (*1) Operating the battery (*2) Using the AC adapter User Setting Use this option to set the battery save parameters on the sub-window, BATTERY SAVE OPTIONS. Battery Save Options Processing Speed This feature changes the CPU processing speed. High CPU operates at 1.50/1.60/1.70/1.80/2.00/2.10GHz (Default in Full Power Mode) Low CPU operates at half processing speed.
3.31 SETUP 3 Tests and Diagnostics HDD Auto Off Use this option to set the duration of the HDD automatic power off function. xx Min. Automatically turns off the power to the hard disk drive if it is not used for the duration set. The duration xx can be set to 1, 3, 5, 10, 15, 20 or 30 minutes. LCD Brightness Use this option to set the level of LCD brightness. Super-Bright Full brightness for maximum visibility. Bright Full brightness for high visibility.
3 Tests and Diagnostics 3.31 SETUP 4. Password This option sets or resets the user password for power on and instant security (Fn+F1). Registered The user password has been registered. Not registered The user password has not been registered. For details on setting the user password, refer to the User’s Manual. 5. Boot Priority (a) Boot Priority Use this option to set the priority for booting of the computer and the priority for the HDD for booting.
3.31 SETUP 3 Tests and Diagnostics This option is used to select the display when booting up. Auto-Selected Selects an external monitor if one is connected. Otherwise it selects the internal LCD. (Default) LCD+AnalogRGB Selects both the internal LCD and the external monitor for simultaneous display. NOTE: When starting the computer in Standby or hibernation mode, the last configuration is remembered.
3 Tests and Diagnostics 3.31 SETUP 7. Others Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use. (a) CPU Cache Use this option to enable or disable the CPU cache. Enabled Enables the CPU cache. (Default) Disabled Disables the CPU cache. (b) Level 2 Cache Use this option to enable or disable the level 2 cache. When "CPU Cache" is set to "Disabled", this option is not displayed. Enabled Enables the level 2 cache.
3.31 SETUP 3 Tests and Diagnostics Set the parameters for the Auto Power On (automatic power on) function in the “OPTIONS” window. To set the time, use Space bar or BackSpace. Press ↓ to move the cursor to the right and ↑ to move the cursor to the left when you set the date and time. For the Alarm Time, set the time to turn on the power automatically. The “second” cannot be set. When it is set to “Disabled”, the time to turn on automatically is not set.
3 Tests and Diagnostics 3.31 SETUP Mode 2 Sets to Mode 2. Glows blue (Power ON) / Alternately flashes green and orange (Standby) / Alternately flashes green and blue (Power OFF/Hibernation) Mode 3 Sets to Mode 3. Flashes in order of green, orange and blue (Power ON) / Glows yellow (Standby) / Glows orange (Power OFF /Hibernation) (h) Language During Bootup This option selects the language during bootup. This message appears only on the model for TCL (Canada).
3.31 SETUP 3 Tests and Diagnostics 11. Peripheral Use this option to select the peripheral's mode. (a) Internal Pointing Device This option enables or disables the touch pad Enabled Enables the touch pad. (Default) Disabled Disables the touch pad. (b) Hard Disk Mode Use this option to select the hard disk mode. Enhanced IDE (normal) Select this mode when the HDD is used for MS-DOS, Windows 95/98/2000/XP, or OS/2.
3 Tests and Diagnostics 3.31 SETUP 13. PCI LAN This option sets the Enable / Disable of the built-in LAN functions. Enabled Enables built-in LAN functions. (Default) Disabled Disables built-in LAN functions.
3.
Chapter 4 Replacement Procedures
4 Replacement Procedures 4 4-ii QOSMIO F10 Maintenance Manual (960-498)
4 Replacement Procedures Chapter 4 4.1 Contents Overview.................................................................................................................... 4-1 Safety Precautions................................................................................................ 4-2 Before You Begin ................................................................................................ 4-3 Disassembly Procedure..........................................................................
4 Replacement Procedures 4.14.2 Guide ..................................................................................................... 4-42 4.15 Heat sink/CPU ......................................................................................................... 4-44 4.16 VGA Heat sink......................................................................................................... 4-47 4.17 PC card cover.....................................................................................
4 Replacement Procedures Figures Figure 4-1 Removing the battery pack................................................................................. 4-8 Figure 4-2 Removing the PC card ..................................................................................... 4-10 Figure 4-3 Removing the bridge media ............................................................................. 4-11 Figure 4-4 Removing the HDD assembly..........................................................................
4 Replacement Procedures Figure 4-30 Applying silicon grease.................................................................................... 4-46 Figure 4-31 Removing the VGA heat sink .......................................................................... 4-47 Figure 4-32 Removing the PC card cover............................................................................ 4-48 Figure 4-33 Removing the speakers ....................................................................................
4 Replacement Procedures 4.1 Overview 4 4.1 Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual. In all cases when removing an FRU, the battery pack must also be removed.
4.1 Overview 4 Replacement Procedures Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. DANGER: 1. In the case of the battery, always use authentic parts or equivalent parts approved by Toshiba. Other batteries may have different specifications that are incompatible with the computer and may result in fire or explosion.
4 Replacement Procedures 4.1 Overview Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2.1 Battery Pack”. 1. Do not disassemble the computer unless it is operating abnormally. 2. Use the designated tools. 3. Ensure that the environment for working on and storing parts does not contain any of the following.
4.1 Overview 4 Replacement Procedures Disassembly Procedure Three main types of cable connector are used. • Pressure plate connector • Spring connector • Normal pin connector When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cable out from the connector. When reconnecting a cable to a pressure plate connector, lift up the pressure plate to a suitable height and insert the cable into the connector.
4 Replacement Procedures 4.1 Overview Assembly Procedure After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. • Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems. • Check that all cables and connectors are securely connected.
4.1 Overview 4 Replacement Procedures Screw Tightening Torque Use the following torque when tightening screws. CAUTION: Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage. NOTE: To tighten screws quickly and accurately, an electric screwdriver is recommended. • M2 (2mm) 0.167 N·m (1.7 kgf·cm) • M2.5 (2.5mm) 0.294 N·m(3.0 kgf·cm) • M3.0 (3mm) 0.549 N･m (5.
4 Replacement Procedures 4.1 Overview Screw Notation To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body. Format: Screw shape + Screw length (mm) Screw shape B: Bind screw F: Thin head screw S: Super thin head screw T: Tapping screw U: Other screws (Unique screws: pan head, stud, etc.
4.2 Battery pack/PC card/Bridge Media 4.2 4 Replacement Procedures Battery pack/PC card/Bridge Media 4.2.1 Battery pack Removing the battery pack The following describes the procedure for removing the battery pack (See Figure 4-1). CAUTION: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack. 1. Turn off the power of the computer. 2.
4 Replacement Procedures 4.2 Battery pack/PC card/Bridge Media NOTE: Dispose of the used battery pack in accordance with the laws and ordinances of your local authority. Installing the battery pack The following describes the procedure for reinstalling the battery pack (See Figure 4-1). CAUTION: The lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly. Dispose always the used battery pack in accordance with the laws and ordinances of your local authority.
4.2 Battery pack/PC card/Bridge Media 4 Replacement Procedures 4.2.2 PC card Removing the PC card The following describes the procedure for removing the PC card (See Figure 4-2). CAUTION: Insert or remove the PC card in accordance with any instructions in the PC card manual or the manuals of the computer system you are using. 1. Push the eject button. It will pop out when you release it. Then press once more the eject button to eject the PC card. 2. Grasp the PC card and remove it.
4 Replacement Procedures 4.2 Battery pack/PC card/Bridge Media 4.2.3 Bridge Media (SD Card / Memory Stick / xDPicture Card/Multi Media Card) Removing the Bridge media The following describes the procedure for removing the bridge media (See Figure 4-3). CAUTION: Insert or remove the Bridge Media in accordance with any instructions in the each Bridge Media manual or the manuals of the computer system you are using. 1. Push a Bridge media. It will pop out partly when you release, so pull out the card.
4.3 HDD 4.3 4 Replacement Procedures HDD Removing the HDD The following describes the procedure for removing the HDD (See Figure 4-4 and 4-5). CAUTION: Be careful not to drop or leave screws in the PC. Take care not to press on the top or bottom of the HDD. Pressure may cause data loss or damage to the device. 1. Turn the computer upside down. 2. Remove the following screw fixing the HDD slot cover and remove the HDD slot cover. • M2.5×10B FLAT BIND screw x1 3.
4 Replacement Procedures 4.3 HDD 4. Remove the following screws fixing the HDD assembly. • F3×4S FLAT BIND screw x4 5. Detach the HDD holder from the HDD. 6. Pull out the laminate cover to the arrow direction and detach it from the HDD.
4.3 HDD 4 Replacement Procedures Installing the HDD The following describes the procedure for installing an HDD (See Figure 4-4 and 4-5). 1. Attach the laminate cover to the HDD. 2. Install the HDD to the HDD holder and secure them with the following screws. • F3×4S FLAT BIND screw x4 NOTE: Although they are 3mm head screws, screw torque must be set in 0.294 N·m (3.0kgf·cm) for four screws securing the HDD holder. 3.
4 Replacement Procedures 4.4 4.4 Memory module Memory module CAUTION: The power of the computer must be turned off when you remove the memory module. Removing a memory module with the power on risks damaging the module or the computer itself. Do not touch the memory module terminals. Any dirt on the terminals may cause memory access problems. Never press hard or bend the memory module. Removing the memory module To remove a memory module, confirm that the computer is in boot mode.
4.4 Memory module 4 Replacement Procedures Installing the memory module To install the memory module, confirm that the computer is in boot mode. Then perform the following procedure (See Figure 4-6). 1. Insert the memory module into the connector of the computer slantwise (terminal side first) and press it to connect firmly. CAUTION: The power must be turned off when you insert the memory module. Inserting a memory module with the power on might damage the module or the computer itself.
4 Replacement Procedures 4.5 4.5 Keyboard/Bluetooth Keyboard/Bluetooth 4.5.1 Keyboard Removing the keyboard The following describes the procedure for removing the keyboard (See Figure 4-7 to 4-9). CAUTION: As the keytop may fall out, when handling the keyboard always hold it by the frame and do not touch the keytop. 1. Open the display. 2. Insert your finger into the spaces between the keyboard brace and the computer. Then, lift up the keyboard brace to unlatch and remove it. 3.
4.5 Keyboard/Bluetooth 4 Replacement Procedures 5. Remove the following screws fixing the keyboard • M2.5×2.8B FLAT BIND screw x2 M2.5x2.8B FLAT BIND Figure 4-8 Removing the keyboard 6. Lift the upper side of the keyboard and turn it face down on the palm rest.
4 Replacement Procedures 4.5 Keyboard/Bluetooth 7. Remove the following screws fixing the keyboard support plate. • M2.5×2.8B FLAT BIND screw x2 8. Remove the keyboard support plate. Slit M2.5×2.8B FLAT BIND Keyboard support plate CN3230 Keyboard Keyboard flexible cable Figure 4-9 Removing the keyboard support plate 9. Pull out the keyboard flexible cable from the slit and disconnect it from the connector CN3230 on the system board. 10. Remove the keyboard.
4.5 Keyboard/Bluetooth 4 Replacement Procedures Installing the keyboard The following describes the procedure for installing the keyboard (See Figure 4-7 to 4-9). 1. Turn the keyboard upside down and place it on the palm rest as its face down. Connect the keyboard flexible cable to the connector CN3230 on the system board. NOTE: After connecting the keyboard flexible cable, put the cable into the slit of the computer. 2.
4 Replacement Procedures 4.5 Keyboard/Bluetooth 4.5.2 Bluetooth Removing the Bluetooth The following describes the procedure for removing the bluetooth (See Figure 4-10). 1. Disconnect the bluetooth flat cable from the connector CN4400 on the system board. 2. Turn up the insulator to take out the bluetooth module from the guide of the display assembly. 3. Disconnect the bluetooth antenna cable (black cable with marking) from the bluetooth module. 4.
4.6 Switch membrane 4.6 4 Replacement Procedures Switch membrane Removing the switch membrane The following describes the procedure for removing the switch membrane (See Figure 4-11). 1. Remove the following screw and remove the LCD CON holder. • M2.5×6B FLAT BIND screw x1 2. Disconnect the switch membrane from the connector CN9650 on the system board. 3. Remove the following screw fixing the membrane switch. • M2.5×2.8B FLAT BIND screw x1 4.
4 Replacement Procedures 4.6 Switch membrane Installing the switch membrane The following describes the procedure for installing the switch membrane (See Figure 4-11). 1. Connect the switch membrane to the connector CN9650 on the system board. 2. Slide the switch membrane to install and secure it with the following screw. • M2.5×2.8B FLAT BIND screw x1 3. Install the LCD CON holder and secure it with the following screw. • M2.
4.7 Optical drive 4.7 4 Replacement Procedures Optical drive NOTE: Do not apply excessive force to the top of an optical drive. Do not touch the shaded portion of the figure below, when you remove or install the drive. Removing the optical drive The following describes the procedure for removing the optical drive (See Figure 4-12 and 413). 1. Turn over the computer and remove the following screws securing the optical drive assembly. • M2.5×4B FLAT BIND screw x2 2.
4 Replacement Procedures 4.7 Optical drive 3. Remove the following screws to remove the side bracket from the optical drive. • M2×3C SUPER THIN HEAD screw x2 • M2×3.2 Stepping screw x1 Side bracket Stepping screw M2×3C SUPER THIN HEAD Figure 4-13 Disassembling the side bracket Installing the optical drive The following describes the procedure for installing the optical drive (See Figure 4-12 and 4-13). 1. Attach the side bracket to the optical drive and secure it with the following screws.
4.8 Display assembly 4.8 4 Replacement Procedures Display assembly Removing the display assembly The following describes the procedure for removing the display assembly (See Figure 4-14 to 4-18). 1. Close the display and turn the computer upside down. 2. Remove the following screws from the bottom of the computer. • M2.5×10B FLAT BIND screw x12 (“10” in the figure) • M2.5×10B FLAT BIND screw (Locktight) x2 (“10+L” in the figure) • M2.
4 Replacement Procedures 4.8 Display assembly 3. Tun over the computer and open the display. 4. Remove the following screws and remove the harness cover. • M2.5×6B FLAT BIND screw x2 • M2.5×10B FLAT BIND screw x1 M2.5 × 10B FLAT BIND Harness cover M2.
4.8 Display assembly 4 Replacement Procedures 5. Disconnect the LCD harness from the connector PJ5600 on the system board. 6. Unlock the connector CN3201 and disconnect the touch pad cable from the connector on the system board. 7. Unlock the connector CN9550 and disconnect the SJ board flat cable from the connector on the sound board. 8. Take out the wireless LAN antenna cables under the insulators and pull out it from the upper side of the slot.
4 Replacement Procedures 4.8 Display assembly 9. Lift up the display assembly from the Optical drive side first to unhook the latches. 10. Remove the display assembly from the base assembly and place it next to the base assembly. 11. Remove the following screws and remove the wireless LAN cover on the base assembly.
4.8 Display assembly 4 Replacement Procedures 12. Disconnect the wireless LAN antenna cables from the wireless LAN board.
4 Replacement Procedures 4.8 Display assembly Installing the display assembly The following describes the procedure for installing the display assembly (See Figure 4-14 to 4-18). 1. Connect the wireless LAN antenna cables (Main (white cable) and Aux (black cable)) to the connectors on the wireless LAN board. 2. Install the wireless LAN cover and fix it with the following screw. Pass the wireless LAN cables inside the guide of the wireless LAN cover. • M2×4Z BIND screw x1 3.
4.9 SD board/MDC 4.9 4 Replacement Procedures SD board/MDC 4.9.1 SD board Removing the SD board The following describes the procedure for removing the SD board (See Figure 4-19). 1. Disconnect the SD board flat cable from the connector CN9510 on the SD board. 2. Disconnect the SVP harness from the connector CN9615 on the SD board. 3. Disconnect the TV tuner cable from the connector CN9614 on the SD board. 4. Disconnect the TV tuner coaxial cable from the CN2410 on the SD board. 5.
4 Replacement Procedures 4.9 SD board/MDC SD board flat cable M2.5x4B FLAT BIND SVP harness M2.5x4B FLAT BIND TV tuner coaxial cable CN2410 TV tuner cable CN9614 Speaker cable L RJ11 connector Core CN9510 CN9615 PJ6002 PJ6003 USB harness Speaker cable R CN4620 Figure 4-19 Removing the SD board Installing the SD board The following describes the procedure for installing the SD board (See Figure 4-19). 1. Install the RJ11 connector and its core to each slot of the base assembly. 2.
4.9 SD board/MDC 4 Replacement Procedures 4.9.2 MDC Removing the MDC The following describes the procedure for removing the MDC (See Figure 4-20). 1. Turn over the SD board. 2. Remove the following screws fixing the MDC and pull the MDC straight up from the connector CN3000 on the SD board. • M2×4Z BIND screw x2 3. Remove the RJ11 harness from the MDC.
4 Replacement Procedures 4.10 Fan 4 4.10 Fan Removing the fan The following describes the procedure for removing the fan (See Figure 4-21). 1. Disconnect the fan cable from the CN8770 on the system board. 2. Remove the following screws and remove the fan. • M2.5×4B FLAT BIND screw x2 M2.5x4B FLAT BIND Fan cable CN8770 Space Figure 4-21 Removing the fan Installing the fan The following describes the procedure for installing the fan (See Figure 4-21). 1.
4.11 Wireless LAN board 4.11 4 Replacement Procedures Wireless LAN board Removing the wireless LAN board The following describes the procedure for removing the wireless LAN board (See Figure 422). 1. Open the left and right latches holding the wireless LAN board and remove it. Latches Figure 4-22 Removing the wireless LAN board Installing the wireless LAN board The following describes the procedure for installing the wireless LAN board (See Figure 422). 1.
4 Replacement Procedures 4.12 4.12 System board System board CAUTION: 1. When handling the system board, always hold by the edges. Do not touch the printed circuit face. 2. If replacing with a new system board, execute the subtest01 Initial configuration in section 3.3 “Setting of the hardware configuration”. Also update with the latest BIOS as described in Appendix G “BIOS Rewrite Procedures”.
4.12 System board 4 Replacement Procedures SD board flat cable BATT CONN cover M2.5x4B FLAT BIND DC-IN jack USB harness Insulator SVP harness M2.
4 Replacement Procedures 4.12 System board Installing the system board The following describes the procedure for installing the system board (See Figure 4-23 and 4-24). 1. Connect the DC-IN jack, SD board flat cable and SVP harness to the system board. 2. Install the BATT CONN cover with fitting to the slot of the base assembly. 3. Install the DC-IN jack to the base assembly. 4. Install the system board.
4.13 RTC battery 4.13 4 Replacement Procedures RTC battery Removing the RTC battery The following describes the procedure for removing the RTC battery (See Figure 4-25). 1. Disconnect the RTC battery harness from the connector CN8490 on the system board. 2. Pull out the RTC battery harness from the guide and remove the RTC battery.
4 Replacement Procedures 4.14 TV tuner module/Guide 4.14 TV tuner module/Guide 4.14.1 TV tuner module Removing the TV tuner module The following describes the procedure for removing the TV tuner module (See Figure 4-26). 1. Disconnect the TV tuner harness from the connector on the TV tuner module. 2. Disconnect the TV tuner coaxial cable from the connector on the TV tuner module. 3. Remove the following screws securing the TV tuner module. • M2×4Z BIND screw x2 4.
4.14 TV tuner module/Guide 4 Replacement Procedures Installing the TV tuner module The following describes the procedure for installing the TV tuner module (See Figure 4-26). 1. Insert the TV tuner module terminals slantwise into the connector on the system board and secure it with the following screws. • M2×4Z BIND screw x2 2. Connect the TV tuner coaxial cable to the connector on the TV tuner module. 3. Connect the TV tuner harness to the connector on the TV tuner module. 4.14.
4 Replacement Procedures 4.14 TV tuner module/Guide USB harness CN9501 TV tuner harness M2x4 BIND Guide TV tuner coaxial cable Figure 4-27 Removing the guide Installing the guide The following describes the procedure for installing the guide (See Figure 4-27). 1. Install the guide on the system board and secure it with the following screw. • M2×4Z BIND screw x1 2. Pass the USB harness along the guide and connect it to the connector CN4612 on the system board.
4.15 Heat sink/CPU 4 Replacement Procedures 4.15 Heat sink/CPU Removing the heat sink/CPU The following describes the procedure for removing the heat sink and CPU (See Figure 4-28 and 4-29). 1. After Removing the following screws, remove the heat sink holder and heat sink.
4 Replacement Procedures 4.15 Heat sink/CPU 2. Unlock the CPU by rotating the cam on the CPU socket 180 degrees to the counterclockwise with a flat-blade screwdriver. 3. Remove the CPU. Cam Figure 4-29 Removing the CPU Installing the heat sink/CPU The following describes the procedure for installing the heat sink and CPU (See Figure 4-28 to 4-30). 1. Check that the mark of cam is in the unlocking position. 2. Attach the CPU to the correct position in the CPU socket. 3.
4.15 Heat sink/CPU 4 Replacement Procedures NOTE: Apply the silicon grease enough to cover the chip surface using the special applicator. Figure 4-30 Applying silicon grease 5. Install the heat sink and heat sink holder and secure them with the following screws in the order of numbers marked on the heat sink holder.
4 Replacement Procedures 4.16 VGA Heat sink 4.16 VGA Heat sink Removing the VGA heat sink The following describes the procedure for removing the VGA heat sink (See Figure 4-31). 1. After removing the following screws, remove the VGA heat sink. • M2×4Z BIND screw x3 VGA heat sink M2x4Z BIND Figure 4-31 Removing the VGA heat sink Installing the VGA heat sink The following describes the procedure for installing the VGA heat sink (See Figure 4-30 and 4-31). 1.
4.17 PC card cover 4 Replacement Procedures 4.17 PC card cover Removing the PC card cover The following describes the procedure for removing the PC card cover (See Figure 4-32). 1. Remove the following screws securing the PC card cover. • M2×3Z BIND screw x2 2. Open the PC card cover toward the outside to unlatch it from hooks and pull up the PC card cover. NOTE: Since the PC card cover is deformed when removing it, you cannot reuse it.
4 Replacement Procedures 4.18 Speaker/VGA fan 4.18 Speaker/VGA fan Removing the Speaker/VGA fan The following describes the procedure for removing the speaker and VGA fan (See Figure 433). 1. Pull out the speaker cable L (red cable) under the insulator and the glass tapes. 2. Remove the speaker L from the guide of base assembly. 3. Remove the speaker R from the guide of base assembly. 4. Remove the following screws securing the VGA EARTH SPRINGs and remove them. • M2×3C SUPER THIN HEAD screw x2 5.
4.18 Speaker/VGA fan 4 Replacement Procedures Installing the Speaker/VGA fan The following describes the procedure for installing the speaker and VGA fan (See Figure 433). NOTE: When installing speakers, make sure they are fit to the guides closely by pressing them from the top. Pass the VGA fan cable first on the base assembly so that the speaker (L) cable passes on the cable. 1. Install the VGA fan according to screw holes on the base assembly and secure it with the following screws.
4 Replacement Procedures 4.19 4.19 Battery latch Battery latch Removing the battery latch The following describes the procedure for removing the battery latch (See Figure 4-34 and 335). 1. Remove the following screws fixing the battery latch assembly. • M2×4Z FLAT BIND screw x2 2. Slide the battery lock to the arrow direction and push up the battery latch assembly from the bottom side to remove it from the base assembly.
4.19 Battery latch 4 Replacement Procedures Installing the battery latch The following describes the procedure for installing the battery latch (See Figure 4-34 and 435). 1. Install the battery lock button. 2. Set the spring on the battery latch and install the battery latch on the battery latch assembly. Make sure the spring is not set over the stopper. 3. Install the battery assembly to the base assembly from the HDD side and secure it with the following screws. • M2×4Z FLAT BIND screw x2 4.
4 Replacement Procedures 4.20 4.20 Touch pad Touch pad Removing the touch pad The following describes the procedure for removing the touch pad (See Figure 4-36). 1. Remove the glass tape fixing the touch pad flexible cable. 2. Disconnect the touch pad flat cable from the touch pad. 3. Remove the following screws fixing the touch pad plate and remove the touch pad plate. • M2.5×2.8B FLAT BIND screw x4 4. Remove the following screws securing the touch pad. • M2.5×2.8B FLAT BIND screw x2 5.
4.20 Touch pad 4 Replacement Procedures Installing the touch pad The following describes the procedure for installing the touch pad (See Figure 4-36). NOTE: Do not reuse the touch pad so that it can not be used after peeling off from the computer. Be sure to stick a new touch pad. 1. Stick the touch pad and secure it with the following screws. • M2.5×2.8B FLAT BIND screw x2 2. Install the touch pad plate and secure it with the following screws. • M2.5×2.8B FLAT BIND screw x4 3.
4 Replacement Procedures 4.21 4.21 SJ board SJ board Removing the SJ board The following describes the procedure for removing the SJ board (See Figure 4-37). 1. Disconnect the microphone cable from the connector CN6000 on the SJ board. 2. Unlock the connector CN9560 on the SJ board and disconnect the SJ board flat cable from it. 3. Remove the following screw fixing the SJ board and remove the SJ board. • M2×4Z BIND screw x1 4.
4.21 SJ board 4 Replacement Procedures Installing the SJ board The following describes the procedure for installing the SJ board (See Figure 4-37). 1. Pass through the SJ board flat cable into the slit of the middle frame and arrange it along the guide on the insulator. Secure the SJ board flat cable with a glass tape. 2. Install the SJ board and secure it with the following screw. • M2×4Z BIND screw x1 3. Connect the SJ board flat cable to the connector CN9560 on the SJ board. 4.
4 Replacement Procedures 4.22 Microphone 4.22 Microphone Removing the microphone The following describes the procedure for removing the microphone (See Figure 4-38). 1. Remove the following screw to remove the microphone hold guide from the base assembly. • M2×4Z BIND screw x1 2. Detach the microphone from the microphone hold guide. 3. Detach the microphone cover from the microphone.
4.23 LCD unit/FL inverter 4 Replacement Procedures 4.23 LCD unit/FL inverter Removing the LCD unit/FL inverter The following describes the procedure for removing the LCD unit and FL inverter (See Figure 4-39 to 4-42). 1. Open widely the display panel and pull up both the hinge caps to remove by slightly pressing them toward the display. 2. Peel off two mask tapes and remove the following screws securing the display mask. • M2.5×6B FLAT BIND screw x2 3.
4 Replacement Procedures 4.23 LCD unit/FL inverter 4. Remove the following screw fixing the FL inverter. • M2x4Z SUPER THIN HEAD screw x1 5. (for model with wireless LAN or Bluetooth) Pull out one insulator and peel off the other one adhered to the FL inverter. 6. Disconnect the LCD harnesses from the connectors CN1 and CN2 on the FL inverter. 7. Disconnect the HV harnesses from the connectors CN3 and CN4 on the FL inverter. 8. Remove the FL inverter while peeling off the double-sided tape.
4.23 LCD unit/FL inverter 4 Replacement Procedures 9. Remove the following screws fixing the LCD unit. • M2x4Z SUPER THIN HEAD screw x4 10. With the bottom edge of the LCD unit on the display cover, lift only the top edge of the LCD unit. After peeling off the aluminum tape, disconnect the LCD harness from the connector on the back of the LCD unit. Remove the LCD unit.
4 Replacement Procedures 4.23 LCD unit/FL inverter 11. Remove the following screws to remove the right and left LCD supports from the LCD unit.
4.23 LCD unit/FL inverter 4 Replacement Procedures Installing the LCD unit/FL Inverter The following describes the procedure for installing the LCD unit and FL inverter (See Figure 4-39 to 4-42). 1. Secure the LCD supports (left and right) to the LCD unit with the following screws. • M2×3C SUPER THIN HEAD screw x4 2. Stand the LCD unit on the display cover and connect the LCD harness to the connector on the back of LCD. 3. Stick the aluminum tape on the connector of LCD harness. 4.
4 Replacement Procedures 4.24 4.24 Wireless antennas/ LCD harness Wireless antennas/ LCD harness 4.24.1 Wireless antennas Removing the wireless antennas The following describes the procedure for removing the wireless antennas (See Figure 4-44 and 4-44). 1. Make sure the wireless LAN antenna cables are pulled on the middle frame. (Refer to 4.8 Display assembly.) 2. Turn up the insulators and pull out the bluetooth antenna cable from the guide of middle frame.
4.24 Wireless antennas/ LCD harness 4 Replacement Procedures 3. Peel off the glass tapes fixing the wireless LAN antenna cables and bluetooth antenna cable and peel off the wireless LAN antennas and bluetooth antenna from the display cover.
4 Replacement Procedures 4.24 Wireless antennas/ LCD harness 4.24.2 LCD harness Removing the LCD harness The following describes the procedure for removing LCD harness (See Figure 4-45 and 4-46). 1. Remove the following screw securing the LCD harness holder and remove the LCD harness holder (display cover side). • M2.5×4B FLAT BIND screw x1 M2.
4.24 Wireless antennas/ LCD harness 4 Replacement Procedures 2. Remove the following screw securing the LCD harness holder and remove the LCD harness holder (middle frame side). • M2.5×2.8B FLAT BIND screw x1 3. Remove the LCD harness from the guide. M2.5x2.8B FLAT BIND LCD harness holder LCD harness Figure 4-46 Removing the LCD harness holder (middle frame side) Installing the LCD harness The following describes the procedure for installing the LCD harness (See Figure 4-45 and 446). 1.
4 Replacement Procedures 4.25 Hinge 4.25 Hinge Removing the Hinge The following describes the procedure for removing hinge (See Figure 4-47 to 4-49). 1. Remove the following screws securing the display cover and detach the display cover. • M2.5×6 PSP TIGHT screw x4 M2.
4.25 Hinge 4 Replacement Procedures 2. Remove the following screws and remove the hinges (display cover side). • M2.5×6B FLAT BIND screw (Locktight) x2 Hinges (display cover side) M2.5x6B FLAT BIND (Locktight) Figure 4-48 Removing the hinge (display cover side) 3. Remove the following screws and remove the hinges (middle frame side). • M2.5×4B FLAT BIND screw x2 M2.
4 Replacement Procedures 4.25 Hinge Installing the Hinge The following describes the procedure for installing the hinge (See Figure 4-47 to 4-49). 1. Install the hinges (middle frame side) on the back side of the middle frame and secure them with the following screws. • M2.5×4B FLAT BIND screw x2 2. Install the hinges (display cover side) and secure them with the following screws after applying the locktight. NOTE: Be sure to apply the locktight to the screws specified in the figure. • M2.
Appendices
Appendices App-ii QOSMIO F10 Maintenance Manual (960-498)
Appendices Appendix Contents Appendix A Handling the LCD Module......................................................................... A-1 Appendix B Board Layout............................................................................................... B-1 B.1 System Board Front View............................................................................. B-1 B.2 System Board Back View ............................................................................. B-3 B.
Appendix A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4. If water or other liquid is left on the panel’s surface for a long period, it can change the screen’s tint or stain it.
Appendix A Handling the LCD Module 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
Appendix A Handling the LCD Module 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxide). These materials can release gas that can damage the panel’s polarization.
Appendix A Handling the LCD Module A-6 QOSMIO F10 Maintenance Manual (960-498)
Appendices C.18 CN4200 1394 I/F connector (4-pin) .......................................................... C-10 C.19 IS2101 C.20 CN1400 Memory connector A (200-pin) .................................................. C-11 C.21 CN1401 Memory connector B (200-pin)................................................... C-14 C.22 CN2200 Mini PCI I/F connector (124-pin) ............................................... C-17 C.23 CN2400 WW Tuner I/F connector (124-pin) ......................................
Appendices Appendix D Keyboard Scan/Character Codes .............................................................. D-1 Appendix E Key Layout .................................................................................................. E-1 E.1 Keyboard Layout ...........................................................................................E-1 Appendix F Wiring Diagrams..........................................................................................F-1 F.1 LAN Loopbak Connector ....
Appendices Figures Figure B-1 System board layout (front) .......................................................................... B-1 Figure B-2 System board layout (back) .......................................................................... B-3 Figure B-3 SD board layout (front)................................................................................. B-5 Figure B-4 SD board layout (back) .................................................................................
Appendices Table C-10 USB connector 0 (port 0) (4-pin).................................................................. C-6 Table C-11 USB I/F Relay connector (8-pin).................................................................. C-7 Table C-12 USB connector 1 (port 2) (4-pin).................................................................. C-7 Table C-13 USB connector 2 (port 3) (4-pin).................................................................. C-7 Table C-14 DC IN connector (4-pin)...
Appendices Table C-42 TV-tuner connector (12-pin)....................................................................... C-29 Table C-43 SVP connector (14-pin) .............................................................................. C-29 Table C-44 Internal Microphone I/F connector (2-pin) ................................................. C-30 Table C-45 External Microphone I/F connector (6-pin)................................................ C-30 Table C-46 Headphone connector (8-pin) ......
Appendix B Appendix B Board Layout B.
B.
Appendix B Board Layout B.2 B.
B.
Appendix B Board Layout B.3 B.
B.4 SD Board Back View B.
Appendix B Board Layout B.5 B.
B.6 SJ Board Back View B.
Appendix C Appendix C Pin Assignment System Board (FCLSY*) C.1 CN1800 HDD I/F connector (44-pin) Table C-1 HDD I/F connector (44-pin) PIN No. Signal name I/O PIN No.
C.2 CN1820 ODD I/F connector (50-pin) Appendix C Pin Assignment C.2 CN1820 ODD I/F connector (50-pin) Table C-2 ODD I/F connector (50-pin) C-2 PIN No. Signal name I/O PIN No. Signal name I/O 1 CDAUDL-PXP I 2 CDAUDRPXP I 3 CD-GND I 4 N.
Appendix C Pin Assignment C.3 CN2110 PC card I/F connector (70-pin) C.3 CN2110 PC card I/F connector (70-pin) Table C-3 PC card I/F connector (70-pin) (1/2) PIN No. Signal name I/O PIN No.
C.4 CN3230 Keyboard I/F connector (34-pin) Appendix C Pin Assignment Table C-3 PC card I/F connector (70-pin) (2/2) PIN No. Signal name I/O PIN No.
Appendix C Pin Assignment C.5 CN4400 Bluetooth I/F connector (20-pin) C.5 CN4400 Bluetooth I/F connector (20-pin) Table C-5 Bluetooth I/F connector (20-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 GND - 2 N.C. - 3 BTMDL-P3N O 4 N.C. - 5 N.C. - 6 N.C. - 7 N.C. - 8 BTRST-S3N I 9 N.C. - 10 N.C. - 11 GND - 12 N.C. - 13 GND - 14 WCHCLKP3P O 15 N.C. - 16 USBP5-S3P I/O 17 USBP5-S3N I/O 18 WCHDATP3P I 19 N.C. - 20 BT-P3V I C.
C.8 CN8770 FAN connector (3-pin) Appendix C Pin Assignment C.8 CN8770 FAN connector (3-pin) Table C-8 FAN connector (3-pin) PIN No. Signal name I/O PIN No. 2 1 FAN VCC I 3 FANG0-P3P I Signal name GND I/O - C.9 CN8780 FAN connector (for VGA) (3-pin) Table C-9 FAN connector (for VGA) (3-pin) PIN No. Signal name I/O PIN No. 2 1 FAN VCC (VGA) I 3 FANG1-P3P I Signal name GND I/O - C.10 CN4611 USB connector 0 (port 0) (4-pin) Table C-10 PIN No.
Appendix C Pin Assignment C.11 CN4612 USB I/F Relay connector (8-pin) C.11 CN4612 USB I/F Relay connector (8-pin) Table C-11 PIN No. Signal name USB I/F Relay connector (8-pin) I/O PIN No. Signal name I 2 USB1PS-E5V I/O 4 USBP4-S3P I/O 1 USB1PS-E5V I 3 USBP4-S3N 5 GND - 6 GND - 7 GND - 8 N.C. - I/O C.12 CN4630 USB connector 1 (port 2) (4-pin) Table C-12 PIN No. Signal name 1 USB0PS-E5V 3 USBP2-S3P USB connector 1 (port 2) (4-pin) I/O PIN No.
C.15 CN9500 Sound board I/F connector (50-pin) Appendix C Pin Assignment C.15 CN9500 Sound board I/F connector (50-pin) Table C-15 PIN No. C-8 Signal name Sound board I/F connector (50-pin) I/O PIN No.
Appendix C Pin Assignment C.16 CN9650 SWITCH I/F connector (20-pin) C.16 CN9650 SWITCH I/F connector (20-pin) Table C-16 PIN No. Signal name SWITCH I/F connector (20-pin) I/O PIN No.
C.18 CN4200 1394 I/F connector (4-pin) Appendix C Pin Assignment C.18 CN4200 1394 I/F connector (4-pin) Table C-18 PIN No. Signal name 1394 I/F connector (4-pin) I/O PIN No. Signal name I/O 1 TPB0-E3N I/O 2 TPB0-E3P I/O 3 TPA0-E3N I/O 4 TPA0-E3P I/O C.19 IS2101 MEDIA BRIDGE I/F connector (42-pin) Table C-19 PIN No. C-10 Signal name MEDIA BRIDGE I/F connector (42-pin) I/O PIN No.
Appendix C Pin Assignment C.20 C.20 CN1400 Memory connector A (200-pin) CN1400 Memory connector A (200-pin) Table C-20 PIN No. Signal name Memory connector A (200-pin) (1/3) I/O PIN No.
C.20 CN1400 Memory connector A (200-pin) Table C-20 PIN No. C-12 Signal name Appendix C Pin Assignment Memory connector A (200-pin) (2/3) I/O PIN No.
Appendix C Pin Assignment Table C-20 PIN No. Signal name C.20 CN1400 Memory connector A (200-pin) Memory connector A (200-pin) (3/3) I/O PIN No.
C.21 CN1401 Memory connector B (200-pin) Appendix C Pin Assignment C.21 CN1401 Memory connector B (200-pin) Table C-21 PIN No. C-14 Signal name Memory connector B (200-pin) (1/3) I/O PIN No.
Appendix C Pin Assignment Table C-21 PIN No. Signal name C.21 CN1401 Memory connector B (200-pin) Memory connector B (200-pin) (2/3) I/O PIN No.
C.21 CN1401 Memory connector B (200-pin) Appendix C Pin Assignment Table C-21 Memory connector B (200-pin) (3/3) PIN No. C-16 Signal name I/O PIN No.
Appendix C Pin Assignment C.22 CN2200 Mini PCI I/F connector (124-pin) C.22 CN2200 Mini PCI I/F connector (124-pin) Table C-22 PIN No. Signal name Mini PCI I/F connector (124-pin) (1/2) I/O PIN No. Signal name I/O 1 N.C. - 2 N.C. - 3 N.C. - 4 N.C. - 5 N.C. - 6 N.C. - 7 N.C. - 8 N.C. - 9 N.C. - 10 N.C. - 11 N.C. - 12 N.C. - 13 WLON-S5N I 14 N.C. - 15 GND - 16 N.C. - 17 PIRQD-P3N I 18 P5V - 19 P3V - 20 PIRQA-P3N O 21 N.C. - 22 N.C.
C.22 CN2200 Mini PCI I/F connector (124-pin) Appendix C Pin Assignment Table C-22 Mini PCI I/F connector (124-pin)(2/2) PIN No. C-18 Signal name I/O PIN No.
Appendix C Pin Assignment C.23 CN2400 WW Tuner I/F connector (124-pin) C.23 CN2400 WW Tuner I/F connector (124-pin) Table C-23 PIN No. Signal name WW Tuner I/F connector (124-pin) (1/2) I/O PIN No. Signal name I/O 1 N.C. - 2 N.C. - 3 N.C. - 4 N.C. - 5 N.C. - 6 N.C. - 7 N.C. - 8 N.C. - 9 GND - 10 GND - 11 N.C. - 12 N.C. - 13 N.C. - 14 N.C. - 15 GND - 16 N.C. - 17 N.C. - 18 T-P5V - 19 P3V - 20 PIRQD-P3N O 21 N.C. - 22 N.C.
C.23 CN2400 WW Tuner I/F connector (124-pin) Table C-23 PIN No. C-20 Signal name Appendix C Pin Assignment WW Tuner I/F connector (124-pin)(2/2) I/O PIN No.
Appendix C Pin Assignment C.24 CN3201 PAD I/F connector (4-pin) C.24 CN3201 PAD I/F connector (4-pin) Table C-24 PIN No. Signal name 1 GND 3 IPDDAT-P5P PAD I/F connector (4-pin) I/O PIN No. Signal name - 2 IPDCLK-P5P I/O 4 GND I/O I/O - C.25 PJ5600 LCD I/F connector (41-pin) Table C-25 PIN No. Signal name LCD I/F connector (41-pin) I/O PIN No. Signal name I/O 1 BRT0-P5P O 2 BRT1-P5P O 3 BRT2DA-S3P O 4 GND - 5 N.C.
C.26 CN5080 CRT I/F connector (15-pin) Appendix C Pin Assignment C.26 CN5080 CRT I/F connector (15-pin) Table C-26 CRT I/F connector (15-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 CRTRED-PXP I 2 CRTGRNPXP I 3 CRTBLU-PXP I 4 N.C - 5 GND - 6 GND - 7 GND - 8 GND - 9 DDC-P5V I 10 GND - 11 N.C - 12 NVDSDA-P5P I/O 13 (AHSYNCP3P) O 14 (AVSYNCP3P) I/O 15 NVDSCL-P5P I/O C.27 CN5501 S-video I/F connector (4-pin) Table C-27 PIN No.
Appendix C Pin Assignment C.29 CN5502 D-video I/F connector (14-pin) C.29 CN5502 D-video I/F connector (14-pin) Table C-29 PIN No. Signal name D-video I/F connector (14-pin) I/O PIN No. Signal name I/O 1 HDTVY-PXP I 2 GND - 3 HDTVPB-PXP I 4 GND - 5 HDTVPR-PXP I 6 GND - 7 LINOTL-PXP I 8 (LINE1) 9 (LINE2) I/O 10 LINOTR-PXP I 11 (LINE3) I/O 12 GND - 13 LINOT-GND I 14 P5V - I/O C.30 CN5801 TV Input connector (14-pin) Table C-30 PIN No.
C.31 CN3000 MDC I/F connector (30-pin) Appendix C Pin Assignment SD Board (FCLSD*) C.31 CN3000 MDC I/F connector (30-pin) Table C-31 PIN No. Signal name MDC I/F connector (30-pin) I/O PIN No. Signal name I/O 1 N.C - 2 GND - 3 GND - 4 N.C - 5 N.C - 6 N.C - 7 N.C - 8 GND - 9 N.C - 10 N.C - 11 N.C - 12 N.C - 13 N.C - 14 N.C - 15 GND - 16 E3V - 17 E3V - 18 N.C - 19 GND - 20 GND - 21 N.C - 22 M97SY2-P3P I 23 M97OT2-P3P I 24 N.
Appendix C Pin Assignment C.33 CN4621 USB I/F connector (port 4) (4-pin) C.33 CN4621 USB I/F connector (port 4) (4-pin) Table C-33 PIN No. Signal name 1 (USBV) 3 (D+0) USB I/F connector (port 4) (4-pin) I/O PIN No. Signal name I/O - 2 (D-0) I/O I/O 4 GND - C.34 CN6002 Speaker (left) connector (3-pin) Table C-34 PIN No. Signal name Speaker (left) connector (3-pin) I/O PIN No. 2 1 SPOTR-PXN O 3 SPOTL-PXP O Signal name SPOTR-PXP I/O O C.
C.36 CN9550 Sound jack board I/F connector (21-pin) Appendix C Pin Assignment C.36 CN9550 Sound jack board I/F connector (21-pin) Table C-36 PIN No. C-26 Signal name Sound jack board I/F connector (21-pin) I/O PIN No.
Appendix C Pin Assignment C.37 CN9510 System board I/F connector (50-pin) C.37 CN9510 System board I/F connector (50-pin) Table C-37 PIN No. Signal name System board I/F connector (50-pin) I/O PIN No.
C.38 J2410 TV Antenna connector (4-pin) Appendix C Pin Assignment C.38 J2410 TV Antenna connector (4-pin) Table C-38 PIN No. Signal name TV antenna connector (4-pin) I/O PIN No. Signal name I/O 1 (CN9611-3) I/O 2 (CN9611-1) I/O 3 (CN9611-2) I/O 4 (CN9611-4) I/O C.39 CN2410 Coaxial connector (4-pin) Table C-39 PIN No. Signal name Coaxial connector (4-pin) I/O PIN No. Signal name I/O 1 (CN9610-2) I/O 2 (CN9610-3) I/O 3 (CN9610-1) I/O 4 (CN9610-4) I/O C.
Appendix C Pin Assignment C.42 CN9614 TV-tuner connector (12-pin) C.42 CN9614 TV-tuner connector (12-pin) Table C-42 PIN No. Signal name TV-tuner connector (12-pin) I/O PIN No. Signal name I/O 1 TV-GND - 2 LINL-PXP I 3 TV-GND - 4 LINR-PXP I 5 TV-GND - 6 COMP01-PXP I 7 TV-GND - 8 LUMA01-PXP I 9 TV-GND - 10 CROM01-PXP I 11 TV-GND - 12 TV-GND - C.43 CN9615 SVP connector (14-pin) Table C-43 PIN No. Signal name SVP connector (14-pin) I/O PIN No.
C.44 CN6000 Internal Microphone I/F connector (2-pin) Appendix C Pin Assignment SJ board (FCLSJ*) C.44 CN6000 Internal Microphone I/F connector (2-pin) Table C-44 Internal Microphone I/F connector (2-pin) PIN No. Signal name I/O PIN No. 1 (VREF1-P2V) I 2 Signal name I/O A-GND - C.45 J6001 External Microphone I/F connector (6-pin) Table C-45 PIN No. External Microphone I/F connector (6-pin) Signal name I/O PIN No. Signal name I/O 1 A-GND - 2 (MICIN-PXP) O 3 (BIAS) O 4 N.C.
Appendix C Pin Assignment C.47 CN9560 Sound board I/F connector (21-pin) C.47 CN9560 Sound board I/F connector (21-pin) Table C-47 PIN No. Signal name Sound board I/F connector (21-pin) I/O PIN No.
C.
Appendix D Keyboard Scan/Character Codes Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap No.
Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) D-2 Cap No.
Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (3/4) Cap No.
Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap No. Keytop Code set 1 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 126 Pause *7 *7 *7 *7 *7 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Make Code set 2 Break Make Note Break Notes: 1. 2. 3. 4. 5. 6. 7. D-4 * * * * * * * Scan codes differ by mode.
Appendix D Keyboard Scan/Character Codes Table D-2 Scan codes with left Shift key Cap Key Code set 1 No.
Appendix D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
Appendix D Keyboard Scan/Character Codes Table D-5 Scan codes in overlay mode Cap No.
Appendix D Keyboard Scan/Character Codes Table D-7 No.126 key scan code Key top Pause Shift Code set 1 Code set 2 Make Make Common* E1 1D 45 E1 Ctrl* E0 C6 E0 46 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E 14 F0 77 *: This key generates only make codes.
Appendix E Key Layout Appendix E E.
E.
Appendix F Appendix F F.
F.
Appendix G Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk Rewriting the BIOS NOTE: 1. Connect the AC adapter to the computer when you rewrite the BIOS. 2. Do not turn off the power while you are rewriting the BIOS. If the rewrite fails, it might be impossible to start up the computer. 3.
Appendix G BIOS Rewrite Procedures G-2 QOSMIO F10 Maintenance Manual (960-498)
Appendix H Appendix H EC/KBC Rewrite Procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. Tools To rewrite the EC/KBC, you need the following tool: EC/KBC rewriting disk for the computer Rewriting the EC/KBC NOTE: 1. Rewrite the EC/KBS only when instructed by a diagnostic disk release notice. 2. Connect the AC adapter to the computer when you rewrite the EC/KBC. 3. Do not turn off the power while you are rewriting the EC/KBC.
Appendix H EC/KBC Rewrite Procedures H-2 QOSMIO F10 Maintenance Manual (960-498)
Appendix I Reliability Appendix I Reliability The following table shows MTBF (Mean Time Between Failures) in maximum configuration.
Appendix I Reliability I-2 QOSMIO F10 Maintenance Manual (960-498)
