Toshiba Personal Computer Satellite A10/TECRA A1/ Satellite Pro A10 (not released in U.S.
Copyright © 2003 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein. Toshiba Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual First edition May 2003 Disclaimer The information presented in this manual has been reviewed and validated for accuracy.
Photo CD is a trademark of Eastman Kodak Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (960-445) iii
Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer Satellite A10/TECRA A1/Satellite Pro A10. NOTE: This Satellite A10/TECRA A1/Satellite Pro A10 is a BTO-support personal computer. Each model of Satellite A10/TECRA A1/Satellite Pro A10 has a different configuration. For each model’s configuration, refer to the parts list dedicated to it.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the Satellite A10/TECRA A1/Satellite Pro A10 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Table of Contents Chapter 1 Hardware Overview 1.1 Features ...................................................................................................................... 1-1 1.2 System Block Diagram .............................................................................................. 1-5 1.3 3.5-inch Floppy Disk Drive ....................................................................................... 1-9 1.4 2.5-inch Hard Disk Drive..............................................
2.12 LAN Troubleshooting.............................................................................................. 2-53 2.13 Sound Troubleshooting............................................................................................ 2-54 2.14 Wireless LAN Troubleshooting............................................................................... 2-56 Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test .................................................................................
Chapter 4 Replacement Procedures 4.1 Overview.................................................................................................................... 4-1 4.2 Battery Pack/PC Card ............................................................................................... 4-8 4.3 Memory Module ...................................................................................................... 4-12 4.4 HDD...............................................................................
Appendices Appendix A Handling the LCD Module ........................................................................ A-1 Appendix B Board Layout ............................................................................................. B-1 Appendix C Pin Assignment .......................................................................................... C-1 Appendix D Display Codes ............................................................................................
Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (960-445) xi
Chapter 1 Hardware Overview
1 Hardware Overview 1 1-ii Hardware Overview Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (960-445)
1 Hardware Overview Chapter 1 Contents 1.1 Features ...................................................................................................................... 1-1 1.2 System Block Diagram .............................................................................................. 1-5 1.3 3.5-inch Floppy Disk Drive ....................................................................................... 1-9 1.4 2.5-inch Hard Disk Drive....................................................
1 Hardware Overview Figures Figure 1-1 Front of the computer and the system units configuration ............................ 1-4 Figure 1-2 System block diagram.................................................................................... 1-5 Figure 1-3 3.5-inch USB FDD......................................................................................... 1-9 Figure 1-4 2.5-inch HDD...............................................................................................
1.1 Features 1 1 Hardware Overview Features 1.1 Features The Satellite A10/TECRA A1/Satellite Pro A10 is a high performance all-in-one PC running a Pentium 4 or Celeron processor. There are five models of Satellite A10/TECRA A1/Satellite Pro A10 according to the combination of CPU and LCD. Table 1-1 lists the difference of each model.
1 Hardware Overview 1.1 Features Memory Two DDR266 SO-DIMM slots. Memory modules can be installed to provide a maximum of 1GB. Memory modules are available in 128MB, 256MB and 512MB sizes. VRAM The computer has VGA imbedded in North Bridge and VRAM in 16-64MB. HDD Single 20GB, 30GB, 40GB, or 60GB internal drive. 2.5 inch x 9.5mm height. USB FDD The three-mode 3.5-inch USB FDD supports 720KB, 1.2MB and 1.44MB formats. Display LCD Built-in 14.1- or 15.
1.1 Features 1 Hardware Overview Battery The RTC battery is mounted inside the computer. The main battery is a detachable lithium ion battery (3,600mAh: Li-Ion, 6cell or 4,400mAh: Li-Ion, 6cell). USB (Universal Serial Bus) The computer has two USB ports which support USB2.0. PC card slot The PC card slot accepts one Type II (5mm thick) card. The slot is equipped with an ejector and supports ToPIC-100 (3.3V/CardBus).
1 Hardware Overview 1.1 Features Figure 1-1 shows the front of the computer and the system units configuration.
1.2 System Block Diagram 1.2 1 Hardware Overview System Block Diagram Figure 1-2 shows the system block diagram. Exp.Memory 128/256/ 512MB Exp.
1 Hardware Overview 1.2 System Block Diagram The PC contains the following components. CPU Intel® Mobile Pentium®4-M model • • • 1.80/1.90/2.00/2.20GHz (Internal clock: 1.80/1.90/2.00/2.20GHz, Bus: 400MHz, Core voltage: 1.30/1.20V, Built-in NDP) Internal cache memory: 12KB (in CPU) Secondary cache memory: 512KB (in CPU) Intel Mobile Celeron model • • • 1.80/2.00/2.20GHz (Internal clock: 1.80/2.00/2.20GHz, Bus: 400MHz, Core voltage: 1.
1.2 System Block Diagram 1 Hardware Overview Chipset This gate array has the following elements and functions.
1 Hardware Overview 1.2 System Block Diagram VGA controller Imbedded in North Bridge Super I/O (SMSC-made LPC-47N259) • • FDC (765B FDC) Parallel port control (PS/2 bi-directional compatible, EPP compatible, IEEE1284 ECP) Other main system chips • • • • • EC/KBC (SMSC-made LPC microcontroller LPC47N259 x 1) PSC (Toshiba-made TMP87PM48U x 1) Thermal sensor (AnalogDevice-made ADM1032 x 1) Audio AMP (Mitsumi-made MM1517X x1) AC97-CODEC (AnalogDevice-made AD1981B x1) Mini PCI (802.
1.3 3.5-inch USB Floppy Disk Drive 1.3 1 Hardware Overview 3.5-inch USB Floppy Disk Drive This compact, lightweight and high-reliability FDD can be used with 720KB, 1.2MB and 1.44MB floppy disks. Figure 1-3 shows the 3.5-inch FDD. Table 1-2 lists the specifications. Figure 1-3 3.5-inch USB FDD Table 1-2 3.5-inch USB FDD specifications Item Disk used Specifications 2DD 2HD 2HD Unformatted capacity 1.0MB 1.6MB 2.0MB Formatted capacity 720KB 1.2MB 1.
1 Hardware Overview 1.4 1.4 2.5-inch Hard Disk Drive 2.5-inch Hard Disk Drive The computer has a compact, high-capacity HDD with a height of 9.5 mm. The HDD contains a 2.5-inch magnetic disk and magnetic heads. Figure 1-4 shows a view of the 2.5-inch HDD and Tables 1-3 and 1-4 list the dimensions and specifications. Figure 1-4 2.5-inch HDD Table 1-3 2.5-inch HDD dimensions (1/3) Standard Item TOSHIBA HDD2187B HDD2181B HDD2182B Width (mm) 69.85 Height (mm) 9.5 Depth (mm) 100.
1.4 2.5-inch Hard Disk Drive 1 Hardware Overview Table 1-3 2.5-inch HDD dimensions (3/3) Standard Item HITACHI G8BC0000F210 G8BC0000F310 G8BC0000F410 Width (mm) 70 Height (mm) 9.5 Depth (mm) 100.0 91 Weight (g) G8BC0000F610 95 Table 1-4 2.5-inch HDD Specifications (1/3) Specifications Item Storage size (formatted) TOSHIBA HDD2187B HDD2181B HDD2182B HDD2183B 20GB 30GB 40GB 60GB 4,200 Rotation speed (RPM) Data transfer rate (Mb/s) 164.6-257.1 154.3-298.
1 Hardware Overview 1.4 2.5-inch Hard Disk Drive Table 1-4 2.5-inch HDD Specifications (2/3) Specifications Item IBM G8BC0000Z310 G8BC0000Z410 G8BC0000Z610 30GB 40GB 60GB Storage size (formatted) 4,200 Rotation speed (RPM) - Data transfer rate (MB/s) 100 Interface transfer rate (MB/s) - Storage density (Kbpi) Track density (Ktpi) 63 Average random seek time (read) (ms) 12 Average random seek time (write) (ms) 14 Motor startup time (ms) 5.0 Table 1-4 2.
1.5 CD-ROM Drive 1.5 1 Hardware Overview CD-ROM Drive The CD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD. It is a high-performance drive that reads at maximum 24-speed (3,600 KB per second). The CD-ROM drive is shown in Figure 1-5. The specifications of the CD-ROM drive are described in Table 1-5. Figure 1-5 CD-ROM drive Table 1-5 CD-ROM drive specifications Item Data transfer rate (MB/s) Specifications TEAC G8CC00005810 16.7 (PIO Mode 0 to 4) 16.
1 Hardware Overview 1.6 1.6 DVD-ROM Drive DVD-ROM Drive The DVD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD, CDR/RW and DVD. It is a high-performance drive that reads DVD at maximum 8-speed, and reads CD at maximum 24-speed (3,600 KB per second). The DVD-ROM drive is shown in Figure 1-6. The specifications of the DVD-ROM drive are described in Table 1-6.
1.6 DVD-ROM Drive 1 Hardware Overview Table 1-6 DVD-ROM drive dimensions (1/2) Specifications Toshiba G8CC0000R810 Item DVD-ROM CD-ROM DVD-RAM 16.7 (PIO Mode 4) 16.7 (Multi-word DMA Mode 2) 33.
1 Hardware Overview 1.7 1.7 Combo Drive Combo Drive The Combo drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD, CDR/RW and DVD. It is a high-performance drive that reads DVD at maximum 8-speed, and reads CD at maximum 24-speed (3,600 KB per second). The Combo drive is shown in Figure 1-7. The specifications of the Combo drive are described in Table 1-7. Figure 1-7 Combo drive Table 1-7 Combo drive specifications (1/5) Specifications Item Toshiba SDR2412OAA 16.7 (PIO Mode 4) 16.
1.7 Combo Drive 1 Hardware Overview Table 1-7 Combo drive specifications (2/5) Specifications Item Transfer rate Average access time (ms) TEAC G8CC0000Q810 For read (CD-ROM) 1,545 to 3,600 KB/sec. For read (DVD-ROM) 4,469 to 10,816 KB/sec. CD-ROM 90 DVD-ROM 110 Data buffer capacity 2MB CD CD-DA, CD-ROM Mode1, Mode2, CD-ROM XA Mode 2 (Form 1, Form 2), Photo CD (single/multi-session), Enhanced CD, CD-TEXT DVD DVD-ROM, DVD-Video, DVD-R (General, Authoring) DVD-RAM (4.7GB, 2.
1 Hardware Overview 1.7 Combo Drive Table 1-7 Combo drive specifications (4/5) Specifications Item Transfer rate Average access time (ms) TEAC G8CC0001D810 For read (CD-ROM) 1,545 to 3,600KB/sec. For read (DVD-ROM) 4,469 to 10,816KB/sec. CD-ROM 90 DVD-ROM 110 Data buffer capacity 2MB CD CD-DA, CD-ROM Mode 1, CD-ROM XA Mode 2 (Form 1,Form 2), Multi-session Photo CD, CD-I, Video CD, DVD DVD-ROM, DVD-R,(General, Authoring), DVD-Video, DVD-RW, DVD-RAM(4.7GB, 2.
1.8 Combo+2 drive 1.8 1 Hardware Overview Combo+2 drive The Combo+2 drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD, CDR/RW and DVD. It is a high-performance drive that reads DVD at maximum 8-speed, writes DVD-R/-RW at 1-speed, and reads CD at maximum 24-speed (3,600 KB per second). The Combo+2 drive is shown in Figure 1-8. The specifications of the Combo+2 drive are described in Table 1-8.
1 Hardware Overview 1.9 1.9 DVD Multi drive DVD Multi drive The DVD Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD, CDR/RW and DVD. It is a high-performance drive that reads DVD at maximum 8-speed, writes DVD-R/-RW at 1-speed, and reads CD at maximum 24-speed (3,600 KB per second). The DVD Multi drive is shown in Figure 1-9. The specifications of the DVD Multi drive are described in Table 1-9.
1.10 Keyboard 1 Hardware Overview 1.10 Keyboard An 85(US)-/86(UK)- key (101 emulation) keyboard is mounted on the system unit. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-10 shows a view of the keyboard. See Appendix E for details of the keyboard layout.
1 Hardware Overview 1.11 TFT Color Display 1.11 TFT Color Display The TFT color display has a 14.1-inch (XGA) or 15.0-inch (XGA, SXGA+) LCD module and the FL inverter board. 1.11.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 262,144 colors with 1,024 x 768 or 1,400 x 1,050 resolution. North Bridge can control both internal and external XGA- or SXGA+- support displays simultaneously.
1.11 TFT Color Display 1 Hardware Overview Table 1-10 LCD module specifications (14.1-inch XGA TFT) (1/3) Specifications Item G33C00012210, G33C00013110, G33C00014110, VF2093P01, VF2058P01, VF2048P01, VF2062P01 Number of Dots 1,024(W) x 768(H) Dot spacing (mm) 0.279(H) x 0.279(V) Display range (mm) 285.696(H) x 214.272(V) Table 1-10 LCD module specifications (15.
1 Hardware Overview 1.11 TFT Color Display 1.11.2 FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module FL. Table 1-11 lists the FL inverter board specifications. Table 1-11 FL inverter board specifications Item Input Output Specifications Voltage (V) DC5 Power (W) 7 Voltage (V) 750 Current (mA) 6.
1.12 Power Supply 1 Hardware Overview 1.12 Power Supply The power supply supplies 28 different voltages to the system board. The power supply microcontroller has the following functions. 1. 2. 3. 4. 5. 6. 7. 8. Judges if the DC power supply (AC adapter) is connected to the computer. Detects DC output and circuit malfunctions. Controls the battery icon, and DC IN icon. Turns the battery charging system on and off and detects a fully charged battery. Turns the power supply on and off.
1 Hardware Overview 1.12 Power Supply Table 1-12 Power supply output rating Name Voltage [V] Name/Use 1R5-C1V 1.30 1.00 1.5 1R5-S1V 1.5 ICH4-M LAN1R5-E1V 1.5 ICH4-M (LAN) 1R5-P1V 1.5 Montara-GML, ICH4-M 1R2-P1V 1.2 Montara-GML 1R2VID-P1V 1.2 CPU 2R5-B2V 2.5 Montara-GML, Memory PPV CPU, Montara-GML, ICH4-M Power 1.5V&1.2V 2R5-P2V 2.5 Montara-GML 1R25-B1V 1.25 Memory MR1R25-B1V 1.25 Memory E3V 3.3 YEBISU3S-GA, Mini-PCI, MDC LAN-E3V 3.3 ICH4-M (LAN) B3V 3.
1.13 Batteries 1 Hardware Overview 1.13 Batteries The PC has the following two batteries. Main battery Real time clock (RTC) battery Table 1-13 lists the specifications for these two batteries. Table 1-13 Battery specifications Battery Name Battery Element Output Voltage Capacity lithium ion 10.8V 3,600mAh lithium ion 10.8V 4,400mAh Nickel metal hydride 3.0V 17mAh G71C0002N210 Main battery G71C0002N110 G71C0002P210 G71C0002P110 Real time clock (RTC) battery P71035017110 1.13.
1 Hardware Overview 1.13 Batteries 1.13.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and detects a full charge when the AC adaptor and battery are connected to the computer. Battery Charge When the AC adapter is connected, normal charging is used while the system is turned on, and quick charge is used while the system is turned off or in suspend mode.
1.13 Batteries 1 Hardware Overview 1.13.3 RTC Battery The RTC battery provides the power supply to maintain the date, time, and other system information in memory. Table 1-15 lists the Time required for charges of RTC battery.
1 Hardware Overview 1.14 AC Adapter 1.14 AC Adapter The AC adapter is used to charge the battery. Table 1-17 lists the AC adapter specifications. Table 1-17 AC adapter specifications Item G71C00002T G71C00002S AC100V/240V 100V/240V 50Hz/60Hz 50Hz/60Hz 0.5W or less 0.5W or less Output voltage 15.0V 15.0V Output current 5.0A 4.
Chapter 2 Troubleshooting Procedures
2 Troubleshooting Procedures 2 2-ii Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (960-445)
2 Troubleshooting Procedures Chapter 2 Contents 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart........................................................................................ 2-2 2.3 Power Supply Troubleshooting.................................................................................. 2-6 2.4 2.5 2.6 2.7 Procedure 1 Power Status Check ................................
2 Troubleshooting Procedures 2.8 2.9 2.10 2.11 2.12 2.13 2.14 2-iv Display Troubleshooting.......................................................................................... 2-48 Procedure 1 Diagnostic Test Program Execution Check ......................... 2-48 Procedure 2 Connector and Cable Check................................................. 2-48 Procedure 3 Replacement Check ............................................................. 2-49 Touch Pad Troubleshooting...............
2 Troubleshooting Procedures Figures Figure 2-1 Troubleshooting flowchart............................................................................. 2-3 Figure 2-2 Printer port LED .......................................................................................... 2-19 Figure 2-3 Printer port LED board ................................................................................ 2-19 Figure 2-4 Antenna Test cable............................................................................
2 Troubleshooting Procedures 2-vi Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (960-445)
2.1 Troubleshooting 2 Troubleshooting Procedures 2 2.1 Troubleshooting Chapter 2 describes how to determine which Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. (The “FRU” means the replaceable unit in the field.) The FRUs covered are: 1. Power supply 7. Touch pad 2. System Board 8. Optical Drive 3. 3.5” USB FDD 9. Modem 4. 2.5” HDD 10. LAN 5. Keyboard 11. Sound 6. Display 12. Wireless LAN The Test Program operations are described in Chapter 3.
2 Troubleshooting Procedures 2.2 2.2 Troubleshooting Flowchart Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which troubleshooting procedure is executed. Before going through the flowchart steps, check the following: Make sure that Toshiba Windows® 2000/XP-HE/XP-PRO is installed on the hard disk. Non-Toshiba operating systems can cause the computer malfunction. Make sure all optional equipment is removed from the computer.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures START Connect the AC adapter to the DC IN socket. Perform the Power Supply Troubleshooting Procedures in section 2.3. No Does the DC IN icon glow? Yes Does the Battery icon glow? No Perform the Power Supply Troubleshooting Procedures in section 2.3. Yes Turn the Power Switch on. Yes Perform the Power Supply Troubleshooting Procedures in section 2.3. Yes Perform the System Board Troubleshooting Procedures in section 2.4.
2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart 1 Do typed characters appear correctly? No Perform the Keyboard Troubleshooting Procedures in section 2.7. No Perform the 3.5”Floppy Disk Drive Troubleshooting Procedures in section 2.5. Yes Insert the diagnostic disk into FDD and run the diagnostics test program. (The reboot of the PC is needed.) Is the diagnostic test loaded? Yes Perform each test of the diagnostic test.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures If the diagnostics program cannot detect an error, the problem may be intermittent. The Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error(s), then perform the appropriate troubleshooting procedures as follows: 1.
2 Troubleshooting Procedures 2.3 2.3 Power Supply Troubleshooting Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Table 2-2 DC IN icon DC IN icon Power supply status Lights green DC power is being supplied from the AC adapter. Blinks orange Power supply malfunction*1 Doesn’t light Any condition other than those above. *1 When the power supply controller detects a malfunction, the DC IN icon blinks orange. It shows an error code. When the icon is blinking, perform the following procedure. 1. Remove the battery pack and the AC adapter. 2.
2 Troubleshooting Procedures Procedure 2 2.3 Power Supply Troubleshooting Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below. Start Off for 2 seconds Error code (8 bit) “1” ON for one second “0” ON for half second Interval between data bits Off for half second The error code begins with the least significant digit. Example: Error code 13h (Error codes are given in hexadecimal format.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Main Battery Error code Meaning 21h Main battery charge current is over 6.60A. 22h Main battery discharge current is over 0.5A when there is no load. 23h Main battery charge current is over 3.9A when AC adapter is not connected. 24h Abnormal current has been sensed. 25h Main battery charge current is over 0.3A. Second Battery Error code Meaning 31h Second battery charge current is over 6.60A.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting 1R5-C1V output (P62) Error code Meaning 60h 1R5-C1V voltage is over 1.80V when the computer is powered on/off. 61h 1R5-C1V voltage is 1.275V or less when the computer is powered on. 62h 1R5-C1V voltage is 1.275V or less when the computer is booting up. 63h 1R5-C1V voltage is 1.275V or less while the computer is suspended. 64h 1R5-C1V voltage is abnormal while the computer is shutdown. (CV support) 65h 1R5-C1V voltage is 1.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures E5V output Error code Meaning 90h E5V voltage is over 6.00V when the computer is powered on/off. 91h E5V voltage is 4.50V or less when the computer is powered on. 92h E5V voltage is 4.50V or less when the computer is booting up. 93h E5V voltage is 4.50V or more when the computer is powered off. 94h E5V voltage is 4.50V or less when the computer is suspended. E3V output Error code Meaning A0h E3V voltage is over 3.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting 1R25-B1V output Error code Meaning D0h 1R25-B1V voltage is over 1.50V when the computer is powered on/off. D1h 1R25-B1V voltage is 1.063V or less when the computer is powered on. D2h 1R25-B1V voltage is 1.063V or less when the computer is booting up. D3h 1R25-B1V voltage is 1.063V or more when the computer is powered off. D4h 1R25-B1V voltage is 1.063V or less when the computer is suspended.
2.3 Power Supply Troubleshooting Check 2 2 Troubleshooting Procedures In the case of error code 10h or 12h: Make sure the AC adapter and AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet. If the cables are connected correctly, go to the following step: Connect a new AC adapter and AC power cord. If the error still exists, go to Procedure 5. Check 3 In the case of error code 21h: Go to Procedure 3. Check 4 For any other errors, go to Procedure 5.
2 Troubleshooting Procedures Procedure 3 2.3 Power Supply Troubleshooting Connection Check The wiring diagram related to the power supply is shown below: Power Cord AC adapter System Board Battery pack Any of the connectors may be disconnected. Perform Check 1. Check 1 Make sure the AC adapter and the AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet. If these cables are connected correctly, go to Check 2.
2.3 Power Supply Troubleshooting Procedure 5 2 Troubleshooting Procedures Replacement Check The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4, Replacement Procedures. Check 1 Replace the AC adapter with a new one. If the AC adapter is still not functioning properly, perform Check 2. Check 2 Replace the system board with a new one.
2 Troubleshooting Procedures 2.4 2.4 System Board Troubleshooting System Board Troubleshooting This section describes how to determine if the system board is defective. Start with Procedure 1 and continue with the other procedures as instructed.
2.4 System Board Troubleshooting Procedure 1 2 Troubleshooting Procedures Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it. If an error message is shown on the display, perform Check 1. If there is no error message, go to Procedure 2. If MS-DOS or Windows 2000/XP-HE/ XP-PRO is properly loaded, go to Procedure 4.
2 Troubleshooting Procedures Check 3 2.4 System Board Troubleshooting The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (24) or (25) is displayed, go to Procedure 5. If error message (18) is displayed, go to the Keyboard Troubleshooting Procedures in Section 2.7. If error message (19), (20) or (21) is displayed, go to the 2.5” HDD Troubleshooting Procedures in Section 2.6.
2.4 System Board Troubleshooting Procedure 2 2 Troubleshooting Procedures Printer Port LED Check on Boot Mode The printer port LED displays the IRT status and test status by turning lights on and off as an eight-digit binary value for boot mode. Figure 2-2 shows the printer port LED. Figure 2-2 Printer port LED Figure 2-3 shows the function of the printer port LED board.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting To use the printer port LED, follow the steps below: System Board Printer Port LED 1. PJ3202 Turn on the computer’s power and set it to boot mode. 2. Turn off the computer’s power. 3. Plug the printer port LED into the parallel port. 4. While holding down the space bar, turn on the computer’s power. 5. Read the LED status from left to right. 6. Convert the status from binary to hexadecimal notation. 7.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-3 Printer port LED boot mode status (2/8) LED Status (B6H) Test item (BIOS rewrite) Contents Cancel of sound mute Setting of volume to max. Display of messages (EC/KBC UPDATE/DAMAGED, BIOS UPDATE/DAMAGED) Key input Prohibition of USB BEEP Waiting for Key input Reading of CHGBIOSA.EXE/CHGFIRMA.EXE FDC RESET Setting of parameters for 2HD (1.44MB) Reading of first sector, If it is the data of 1.44MB (2HD), the media type is definite.
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2 Troubleshooting Procedures 2.
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2 Troubleshooting Procedures 2.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-3 Printer port LED boot mode status (8/8) LED Status (1Ch) Test item (PRE_BOOT_SETUP) Contents Updating of table for DMI Copy of ACPI table to top of expansion memory Waiting for completion writing of PSC version to BIOS Waiting for clock generator setting completion (The system halts in LED = 1DH when an error is detected.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures NOTE: The printer port LED outputs the status of an item in which an error is occurred. If the printer port LED outputs “0Ch” and then halts, it indicates memory check of first 64KB is completed and an error occurred during initialization of vector. Check 1 If the following error codes are displayed, go to Procedure 5.
2 Troubleshooting Procedures Procedure 3 2.4 System Board Troubleshooting Printer Port LED Check on Suspend/Resume Mode The printer port LED displays the IRT status and error status by turning lights on and off as an eight-digit binary value after turning on of the power. To use the printer port LED, follow the steps below: 1. Turn on the computer’s power and set it to the resume mode. 2. Turn off the computer’s power. 3. Plug the printer port LED into the parallel port (printer port). 4.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Printer port LED suspend mode error status (1/3) LED Status Test item Contents Sets the parallel port to D0 state. 2Bh Release resources used for identification of fingerprint. 2Ch Prohibition of THERMAL DUTY (to prevent not generating of SMI).
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Printer port LED suspend mode error status (2/3) LED Status 2Fh Test item Contents Resume error check in suspend mode. Checks if in IRT. Checks if external cards are connected (If PNP OS exists, does not check.) Execution of driver for suspend Clearing of data for Remote Lockout Storing of FDD register (Models supporting built-in FDD) Storing of USB register Halt of HC.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Printer port LED suspend mode error status (3/3) LED Status 36h Test item Contents Prohibition of PCI arbiter Setting of Wakeup event Power-off of PC card Re-setting backup current Forced off of fan Checks whether off-process for resume is needed Power LED control during suspending Isolates built-in LAN. Makes the power of sound off. 37h Makes the power of Dock off.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Printer port LED resume mode error status (1/4) LED Status Test item 00h Refer to IRT printer LED error status. 01h Refer to IRT printer LED error status. 02h Refer to IRT printer LED error status. 03h Refer to IRT printer LED error status. Contents Clears flag for SMI control. Renewal of Resume counter 1F Checks the WakeUp factors.
2.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Printer port LED resume mode error status (3/4) LED status 25h Test item Contents Recovery of each device(3) Recovery of COM register Recovery of DMAC register PnP Resume processing 2 Turns the disabled HDD motor off.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-5 Printer port LED resume mode error status (4/4) LED status Test item Contents Waiting for the completion of recovery of VGA register Recovery of PIT register Recovery of PCI configuration register Recovery of PIC MASK Executing of driver for RESUME Waiting for the completion of recovery of FDD 27h (models supporting built-in FDD) Turns the power off if required during Hibernation.
2 Troubleshooting Procedures Procedure 4 2.4 System Board Troubleshooting Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test 6. Printer test 7. Async test 8. Hard Disk test 9. Real Timer test 10. NDP test 11. Expansion test 12.
2.5 3.5” FDD Troubleshooting 2 Troubleshooting Procedures 2 2.5 3.5” FDD Troubleshooting This section describes how to determine if the 3.5” FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.5 3.5” FDD Troubleshooting Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled. Floppy disk drive test error codes and their status names are listed in Table 2-6.
2.5 3.5” FDD Troubleshooting Procedure 3 2 Troubleshooting Procedures Connector Check and Replacement Check The USB connector may be disconnected from the system board. Check visually that the connector is connected firmly. Check 1 Make sure the following cable and connector are firmly connected to the system board. システム基板 System Board USB FDD PJ4600 If any of the connections are loose, reconnect firmly and repeat Procedure 2. If there is still an error, go to Check 2.
2 Troubleshooting Procedures 2.6 2.6 2.5” HDD Troubleshooting 2.5” HDD Troubleshooting This section describes how to determine if the 2.5” HDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.6 2.5” HDD Troubleshooting Procedure 2 2 Troubleshooting Procedures Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen. Make sure of no floppy disk in the FDD. Turn on the computer and check the message on the screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with Check 1 below and perform the other checks as instructed.
2 Troubleshooting Procedures Procedure 3 2.6 2.5” HDD Troubleshooting Format Check The computer’s HDD is formatted using the MS-DOS FORMAT program or the physical format program of the test program. To format the HDD, start with Check 1 below and perform the other steps as required. Refer to the MS-DOS Manual for the operation of MS-DOS. For the format by the test program, refer to the Chapter 3. Check 1 Format an 2.5” HDD using MS-DOS FORMAT command. Type as FORMAT C:/S/U. If the 2.
2.6 2.5” HDD Troubleshooting Procedure 4 2 Troubleshooting Procedures Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. The error codes and statuses are described in Table 2-7.
2 Troubleshooting Procedures Procedure 5 2.6 2.5” HDD Troubleshooting Connector Check and Replacement Check The HDD is connected to the connector of the system board. The connecting portion may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks to check the connecting portion: Check 1 Make sure the following connectors are firmly connected to the system board.
2.7 Keyboard Troubleshooting 2.7 2 Troubleshooting Procedures Keyboard Troubleshooting To determine if the computer’s keyboard is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test in the Diagnostic Program.
2 Troubleshooting Procedures 2.8 2.8 Display Troubleshooting Display Troubleshooting This section describes how to determine if the computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Cable Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check The Display Test program is stored on the Diagnostics disk.
2.8 Display Troubleshooting Procedure 3 2 Troubleshooting Procedures Replacement Check The display unit has an FL inverter board, Display module, System board, LCD harness and Display ON/OFF switch. Any of the components may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures、 then perform the following checks: If characters or graphics are not displayed on the internal display, perform Check 1.
2 Troubleshooting Procedures 2.9 2.9 Touch Pad Troubleshooting Touch Pad Troubleshooting To determine whether the Touch Pad is faulty or not, perform the following procedures: Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Cable Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Touch Pad Test in the Diagnostic Program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
2.10 Optical Drive Troubleshooting 2 Troubleshooting Procedures 2.10 Optical Drive Troubleshooting To check if the optical drive (CD-ROM, DVD-ROM, Combo, Combo+2 or DVD Multi drive) is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Diagnostic Test Program Execution Check Procedure 2 Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the CD-ROM/DVD-ROM Test in the Diagnostic Program.
2 Troubleshooting Procedures 2.11 Modem Troubleshooting 2.11 Modem Troubleshooting To check if the modem is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Diagnostic Test Program Execution Check Procedure 2 Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Modem Test in the Diagnostic Program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
2.12 LAN Troubleshooting 2 Troubleshooting Procedures 2.12 LAN Troubleshooting To check if the computer’s LAN is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Diagnostic Test Program Execution Check Procedure 2 Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the LAN Test in the Diagnostic Program.
2 Troubleshooting Procedures 2.13 Sound Troubleshooting 2.13 Sound Troubleshooting To check if the sound function is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Diagnostic Test Program Execution Check Procedure 2 Connector Check Procedure 3 Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Sound Test in the Diagnostic Program.
2.13 Sound Troubleshooting Procedure 3 2 Troubleshooting Procedures Replacement Check Check 1 The speaker may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem persists, perform Check 2. Check 2 The system board may be faulty. Replace it with a new one following the instructions in Chapter 4.
2 Troubleshooting Procedures 2.14 Wireless LAN Troubleshooting 2.14 Wireless LAN Troubleshooting This section describes how to determine if the computer's Wireless LAN is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.14 Wireless LAN Troubleshooting Procedure 2 2 Troubleshooting Procedures Antennas' Connection Check The wireless LAN function-wiring diagram is shown below: Wireless LAN Antenna (Right) Wireless LAN Antenna (Left) System Board Mini PCI PJ2200 Antenna Cable Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless communication switch is “On”.
2 Troubleshooting Procedures Procedure 3 Check 1 2.14 Wireless LAN Troubleshooting Antenna Check Use an antenna test cable to check the antennas' connection. Follow the steps below: 1. Remove the Mini PCI slot cover and lift it off. Refer to Chapter 4, Replacement Procedures, for detailed steps of disassembling. 2. Disconnect the wireless LAN antenna cables (white and black) from the Mini PCI card. 3. Connect the end of the antenna test cable to the multimeter. 4.
2.14 Wireless LAN Troubleshooting Procedure 4 2 Troubleshooting Procedures Replacement Check The Mini PCI card and the system board are connected. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 The Mini PCI card may be defective or damaged. Replace the Mini PCI card with a new one following the instructions in Chapter 4, Replacement Procedures.
2 Troubleshooting Procedures 2-60 2.
Chapter 3 Tests and Diagnostics
3 Tests and Diagnostics 3 3-ii Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (960-445)
3 Tests and Diagnostics Chapter 3 Contents 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ................................................................................... 3-3 3.3 Subtest Names............................................................................................................ 3-7 3.4 System Test................................................................
3 Tests and Diagnostics 3.24 3.25 3.26 3.27 Running Test............................................................................................................ 3-58 3.24.1 Function Description .......................................................................... 3-58 3.24.2 Operations .......................................................................................... 3-58 Floppy Disk Drive Utilities.....................................................................................
3.1 The Diagnostic Test 3 3 Tests and Diagnostics Tests and Diagnostics 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test program to test the functions of the computer’s hardware modules. The Diagnostic Programs are stored on the Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disks. NOTE: To start the diagnostics, follow these steps: 1. Check all cables for loose connections. 2.
3 Tests and Diagnostics 3.1 The Diagnostic Test You will need the following equipment to perform some of the Diagnostic test programs.
3.2 Executing the Diagnostic Test 3.2 3 Tests and Diagnostics Executing the Diagnostic Test To start the DIAGNOSTIC PROGRAM, follow these steps: 1. Turn off the computer and connect a USB FDD to the computer. Insert the Diagnostics disk (No.1) in the floppy disk drive. 2. Turn on the computer by pressing the power switch while pressing U. The following menu will appear: TOSHIBA Personal Computer XXXXXX DIAGNOSTICS version X.XX (C) Copyright TOSHIBA Corp.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test To execute the DIAGNOSTIC TEST MENU from the DIAGNOSTICS MENU, set the highlight bar to 1, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA Personal Computer XXXXXX DIAGNOSTICS version X.XX (C) Copyright TOSHIBA Corp.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 4. Select the option you want to execute and press Enter. When you select 1SYSTEM TEST, the following message will appear: SYSTEM TEST NAME SUB-TEST PASS COUNT WRITE DATA ADDRESS : : : : XXXXXXX XX XXXXX XX XXXXXX xxxxxxx DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Use the up and down arrow keys to move the cursor to “ERROR STOP”. Use the right and left arrow keys to move the cursor to the desired option and press Enter.
3.3 Subtest Names 3.3 3 Tests and Diagnostics Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No. Test Name Subtest No.
3 Tests and Diagnostics 3.3 Subtest Names Table 3-1 Subtest names (2/2) No. 3-8 Test Name Subtest No.
3.4 System Test 3.4 3 Tests and Diagnostics System Test To execute the System Test, select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM Checksum This subtest executes a checksum test of the BIOS ROM (range: F0000h to FFFFFh) on the System Board. Subtest 02 Geyserville This subtest confirms the CPU clock can be changed.
3 Tests and Diagnostics Subtest 07 3.4 System Test DMI read The information in the Flash-ROM is displayed in the following format. *** DMI Data Display Ver X.XX *** Model Name Version Number Serial Number Model Number PCN/BND Number UUID Number :XXXXXXXXX :XXXXXX-XXXXX :XXXXXXXXXX :XXXXXXXXXXXX :XXX :XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX Press [Enter] to EXIT To exit this subtest and return to the SYSTEM TEST menu, press Enter. Subtest 08 DMI write The following messages appear in order.
3.4 System Test Subtest 10 3 Tests and Diagnostics CPU Temperature This subtest checks the CPU temperature. When the subtest starts, the following message appears on the display. Enter the ambient Celsius temperature. EXT. TEMP = When the temperature is entered, test program turns off the screen message. After 15 minutes, it measures the CPU temperature and judges the test result (OK or NG) based on the gap between the ambient temperature and the measured temperature (threshold value).
3 Tests and Diagnostics 3.5 3.5 Memory Test Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Conventional Memory This subtest writes a 256-byte unit of constant data to conventional memory (0 to 640 KB). Then reads the new data and compares the result with the original data.
3.5 Memory Test Subtest 05 3 Tests and Diagnostics L2 Cache Memory To test the L2 cache memory, a pass-through write-read comparison of ‘5A’ data is run repeatedly to the test area (‘7000’:’Program’ size to ‘7000’:’7FFF’ (32 KB)) to check the hit-miss ratio (on/off status) for L2 cache memory.
3 Tests and Diagnostics 3.6 3.6 Keyboard Test Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The Keyboard test contains some subtests that test the computer’s keyboard and Touch pad actions. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed Key Display When you execute this subtest, the keyboard layout is drawn on the display as shown below.
3.6 Keyboard Test Subtest 03 3 Tests and Diagnostics PS/2 Mouse Connect Check NOTE: 1. The touch pad and the PS/2 mouse cannot be tested simultaneously. Select the PS/2 mouse in the SETUP setting. 2.To execute the PS/2 mouse connect check, a PS/2 mouse must be connected to the computer before the power is turned on. This subtest checks the operation of a PS/2 with a PS/2 mouse. If this test does not detect an error, it returns to the subtest menu.
3 Tests and Diagnostics 3.6 Keyboard Test ***** IPS TEST PROGRAMVx.xx) ( ***** ■■ ■■■■ ■■■■■■ ■■■■■■ ■■■■ ■■ STATUS:0000h X-RATE:0000h Y-RATE:0000h
3.6 Keyboard Test Subtest 06 3 Tests and Diagnostics USB ( Port2,Port3 ) test This subtest checks USB. The USB TEST Module (ZD0003P01) and USB Cable (ZD0003P02) must be connected to the computer. The following message will appear. Select a port to test and press Enter. Test port number select (1:Port2, 2:Port3, 0:Port2&3) ? If the test ends successfully, OK is displayed. If there is a problem with the USB port, an error message appears. Check the wraparound connection and repeat the test.
3 Tests and Diagnostics 3.7 3.7 Display Test Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The Display test contains subtests that test the display in various modes. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM Read/Write for VGA This subtest writes the constant data (AAh and 55h) and the address data to the video RAM. The data is read and compared to the original data.
3.7 Display Test Subtest 04 3 Tests and Diagnostics Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode 12] 13] 3] 111 112 114 115 117 118 640*480 64K] 640*480 16M] 800*600 64K] 800*600 16M] 1024*768 64K] 1024*768 16M] The display below appears on the screen when this subtest is executed.
3 Tests and Diagnostics Subtest 06 3.7 Display Test “H” Pattern Display This subtest displays a full screen of “H” patterns.
3.8 Floppy Disk Test 3.8 3 Tests and Diagnostics Floppy Disk Test NOTE: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. Otherwise, the contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter. 1. The following messages will appear. Select the drive type, the media type and the start track of the floppy disk drive to be tested.
3 Tests and Diagnostics Subtest 01 3.8 Floppy Disk Test Sequential read This subtest performs a Cyclic Redundancy Check (CRC) that continuously reads all the tracks (track: 0 to 39/0 to 79) on a floppy disk. The start track is specified at the start of the FDD test. Refer to 2 in this chapter. Subtest 02 Sequential read/write This subtest continuously writes data pattern B5ADADh to all the tracks (track: 0 to 39/0 to 79) on a floppy disk. The data is then read and compared to the original data.
3.9 Printer Test 3.9 3 Tests and Diagnostics Printer Test To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The Printer Test contains subtests that test the output of the printer connected to the computer. The following messages will appear after selecting the Printer Test from the DIAGNOSTIC TEST MENU. Move the highlight bar to the subtest you want to execute and press Enter.
3 Tests and Diagnostics Subtest 02 3.9 Printer Test Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wrap around NOTE: To execute this subtest, a printer wraparound connector must be connected to the computer’s printer port.
3.10 Async Test 3 Tests and Diagnostics 3.10 Async Test NOTE: This test can not be executed since the computer is not equipped with a serial port and FIR port. The FIR port will be equipped in a succeeding model of this computer. NOTE: The subtests 01 to 04 are not be supported since the computer has no serial port. To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen.
3 Tests and Diagnostics 3.10 Async Test NOTE: To execute this subtest, an RS-232C wraparound connector must be connected to the RS-232C port. The RS-232C wraparound connector wiring diagram is described in Appendix F. This subtest checks the data send/receive function through the wraparound connector.
3.10 Async Test Subtest 02 3 Tests and Diagnostics Point to point (Send) NOTE: To execute this subtest, two machines must be connected with an RS-232C direct cable. One machine should be set as “send”(subtest 02) and the other set as “receive” (subtest 03). The wiring diagram for the RS-232C direct cable is described in Appendix F. This subtest sends 20h through 7Eh data to the receive side, then receives the sent data and compares it to the original data.
3 Tests and Diagnostics 3.11 Hard Disk Test 3.11 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. The hard disk test contains subtests that test the hard disk drive functions. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 09 or 10 is executed.
3.11 Hard Disk Test 3 Tests and Diagnostics 4. Select the number of the subtest you want to execute and press Enter. The following message will appear. HARD DISK TEST SUB-TEST IN PROGRESS XXXXXXX :XX PASS COUNT:XXXXX WRITE DATA:XX ADDRESS :XXXXXXXX ERRORCOUNT READ DATA STATUS XXX DIAGNOSTIC TEST VX.
3 Tests and Diagnostics Subtest 04 3.11 Hard Disk Test Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder (to check the data interference in the neighbor track) to compare.
3.12 Real Timer Test 3 Tests and Diagnostics 3.12 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The real timer test contains subtests that test the computer’s real timer functions. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real time A new date and time can be input during this subtest.
3 Tests and Diagnostics Subtest 03 3.12 Real Timer Test Real time carry CAUTION: When this subtest is executed, the current date and time are erased. This subtest checks the real time clock increments. Make sure the date and time are displayed in the following format and they move forward correctly. Current date : Current time : 12-31-1999 23:59:58 PRESS [Enter] KEY TO EXIT TEST Press Enter to exit.
3.13 NDP Test 3 Tests and Diagnostics 3.13 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. The NDP test contains one subtest that tests the computer’s NDP functions. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 NDP This test checks the following functions of NDP: Control word Status word Bus Addition Multiplication Press Ctrl + Break to exit.
3 Tests and Diagnostics 3.14 Expansion Test 3.14 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: To execute this subtest, the PC card wraparound connector is required.
3.14 Expansion Test Subtest 03 3 Tests and Diagnostics RGB monitor ID test Connect a CRT monitor to the computer for the test of ID acquisition. To check whether the ID is acquired or not is judged by the data from the monitor. Therefore, this test will fail when it is performed in simultaneously display mode or panel display mode. Make sure the CRT used for this test is the one with ID and only the CRT is selected for display device before the test.
3 Tests and Diagnostics 3.15 CD-ROM/DVD-ROM Test 3.15 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM Test, select 13 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. The CD-ROM/DVD-ROM Test contains subtests that test the modem functions. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK (ZA1217P01/P000204190) for CD-ROM and DVD-ROM TEST DISK TSD-1 for DVDROM.
3.16 LAN Test 3 Tests and Diagnostics 3.16 LAN Test To execute the LAN test, select 14-LAN TEST from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 LAN MAC ADDRESS DISPLAY This subtest reads MAC ADDRESS and displays it. Press Enter to exit.
3 Tests and Diagnostics 3.17 Sound/LAN/Modem Test 3.17 Sound/LAN/Modem Test To execute the Sound/LAN/Modem Test, use the Diagnostics disk (No.2). Finish the tests of the Diagnostics disk (No.1) by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MSDOS. Insert the Diagnostics disk (No.2) in the floppy disk drive and turn on the power while pressing F or U (when the USB FDD is used).
3.17 Sound/LAN/Modem Test Subtest 01 3 Tests and Diagnostics Microphoned recording & play This subtest checks the function of the CODEC A/D D/A converter. Both the microphone and headphone terminals can be checked at the same time. Before executing this subtest, connect an external microphone to the computer. If necessary, connect a headphone to the computer to check whether the headphone jack of the computer is working properly. When the subtest is selected, the following message appears. ....
3 Tests and Diagnostics 3.17 Sound/LAN/Modem Test When the subtest is executed, the following message appears. ....Press test number[1-4] ? pause Press any key to continue... Press any key, and the following message appears. Then sin wave is expanded from 16KB to 64KB data and is played. ....Press test number[1-4] ? call sin Subtest 03 LAN Test This subtest checks the operation of mini-PCI I/F by the loopback in the chip. Select 3 to execute and press Enter.
3.17 Sound/LAN/Modem Test 3 Tests and Diagnostics Subtest 03 Modem Test For this subtest, connect the modem PCB and RJ11 connector with a harness. This subtest contains the following tests. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Denki Seisakusyo)” for the tests. Select 4 to execute and press Enter. The following message will appear: ICHx MDC Test Program with Modem Sound ( PCB Interface ) Version X.
3 Tests and Diagnostics 3.18 Wireless LAN Test (Agere) 3.18 Wireless LAN Test (Agere) This section describes how to perform the Agere wireless LAN transmitting-receiving test with the test program. NOTE: Use another computer (with Agere wireless LAN card) that can communicate by the wireless LAN as a reference machine to perform this test.
3.18 Wireless LAN Test (Agere) Subtest 01 3 Tests and Diagnostics Transmit & Receive test This sub test checks transmit and receive functions. Transmit test Press 1 to select the test and press Enter in the target machine as a responder. The following message will appear: ############################################################### #### Wireless LAN sub system repair test VX.
3 Tests and Diagnostics 3.18 Wireless LAN Test (Agere) When the machine has passed the test, “OK” message will appear in the test machine. Then press Enter in the target machine; the “OK” message will appear also in the target machine. Press Enter to return to the main menu. Receive test In receive test reverse the procedures of the transmit test.
3.18 Wireless LAN Test (Agere) 3 Tests and Diagnostics Press 0 to select the test and press Enter in the target machine. The following message will appear: ############################################################## #### Wireless LAN sub system repair test VX.
3 Tests and Diagnostics Subtest 02 3.18 Wireless LAN Test (Agere) Mac Address test This subtest reads MAC Address. If there is no problem, the “OK” message will appear. Subtest 03 Wireless LAN (WEP64/128) test This subtest reads the WEP of the wireless LAN card installed in the target machine.
3.19 Wireless LAN Test (Atheros) 3 Tests and Diagnostics 3.19 Wireless LAN Test (Atheros) This section describes how to perform the wireless LAN transmitting-receiving test with the test program. NOTE: Use another computer (with Atheros wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform this test. In this test, the following items are tested: * Test PC [Initiator] side (1) SKU (destination code) check (2) Mac Address check (3) Communication test (802.
3 Tests and Diagnostics 3.19 Wireless LAN Test (Atheros) Setting the responder machine NOTE: Release the write-protection of the floppy disk for the test. Insert a floppy disk containing the test program into the floppy disk drive of the responder machine and turn on the responder machine. The Wireless LAN test menu will appear. ############################################################### #### Atheros WLAN sub system repair test VX.
3.19 Wireless LAN Test (Atheros) 3 Tests and Diagnostics When the tester machine has passed the test, "OK" message will appear in the tester machine. Press Enter to return to the main menu. When the tester machine has not passed the test, "NG" message will appear in the tester machine. Pressing Enter on the screen shows the following message. ************************************************************* * * * 8.
3.20 Error Code and Error Status Names 3 3 and Diagnostics and Diagnostics 3.20 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test.
3.
3 and Diagnostics 3.
3.
3 and Diagnostics 3.21 Hard Disk Test Detail Status 3.21 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXX Detailed information about the hard disk test error is displayed on the screen by a four-digit number. The hard disk controller error status is composed of two bytes; the first byte displays the contents of the HDC error status register in hexadecimal form and the second byte displays the HDC error register.
3.21 Hard Disk Test Detail Status 3 and Diagnostics Table 3-4 Error register contents Bit Name Description 7 BBK (Bad block mark) “0” Not used “1” A bad block mark is detected. 6 UNC (Uncorrectable) “0” There is no uncorrectable data error. “1” Uncorrectable data error has been detected. 5 —— Not used 4 IDN (Identification) “0” Not used “1” There is no ID field in the requested sector. 3 —— Not used 2 ABT (Abort) “0” Not used “1” Illegal command error or a command abort error.
3 and Diagnostics 3.22 FDD Cleaning 3.22 FDD Cleaning 3.22.1 Function Description This function cleans the heads in the 3.5-inch FDD by executing a series of head load/seek and read operations. A cleaning disk is necessary to perform this program. 3.22.2 Operations 1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS – FLOPPY DISK HEAD CLEANING : VX.XX Mount cleaning disk(s) on drive(s). Press any key when ready. 2.
3.23 Log Utilities 3 and Diagnostics 3.23 Log Utilities 3.23.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or output the data to a display or a printer. If the power switch is turned off, the error information will be lost. The error information is displayed in the following order: 1. 2. 3. 4. 5. 6. 7. 8. 9.
3 and Diagnostics 3.23 Log Utilities 2. The error information displayed on the screen can be manipulated by the following number keys: The 1 key scrolls the display to the next page. The 2 key scrolls the display to the previous page. The 3 key returns to the Diagnostic Menu. The 4 key erases all error log information in RAM. The 5 key outputs the error log information to a printer. The 6 key reads the log information from a floppy disk. The 7 key writes the log information to a floppy disk. 3.
3.24 Running Test 3 and Diagnostics 3.24 Running Test 3.24.1 Function Description This function automatically executes the following tests in sequence: 1. 2. 3. 4. 5. 6. 7. System test (subtest 01) Memory test (subtests 01,02,04,06) Real timer test (subtest 02) Display test (subtest 01) FDD test (subtest 02) HDD test (subtests 01,05) Printer test (subtest 03) if selected The system automatically detects the number of floppy disk drives connected to the computer for the FDD test. 3.24.
3 and Diagnostics 3.24 Running Test 4. Select Yes or No and press Enter. The following message will appear: Mount the work disk(s) on the drive(s), then press [Enter] key. [Warning : The contents of the disk(s) will be destroyed] 5. This program is executed continuously. To terminate the program, press Ctrl + Break.
3.25 Floppy Disk Drive Utilities 3 and Diagnostics 3.25 Floppy Disk Drive Utilities 3.25.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE: This program is only for testing a floppy disk drive. The option is different from the MS-DOS FORMAT command. This program formats the floppy disk in the following formats. (a) 2DD: Double-sided, double-density, double-track, 96/135 TPI, MFM mode, 512 bytes, 9 sectors/track.
3 and Diagnostics 3.25 Floppy Disk Drive Utilities 3.25.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 2 3 4 9 - FORMAT COPY DUMP HDD-ID READ EXIT TO DIAGNOSTICS MENU 2. FORMAT program (a) Selecting FORMAT displays the following message: DIAGNOSTICS - FLOPPY DISK FORMAT : VX.
3.25 Floppy Disk Drive Utilities 3 and Diagnostics 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Select a drive type number. Selecting 3:2HD will display a message similar to the one below. Select a media type number. 2HD media mode (1:1.20MB, 2:1.44MB) (c) The following message will appear: Insert source disk into drive A: Press any key when ready.
3 and Diagnostics 3.25 Floppy Disk Drive Utilities 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type number. If 2:HDD is selected, the display will go to step (h). If 1:FDD is selected, the following message appears: Select drive number (1:A, 2:B) ? (c) Select a drive number and the following message will be displayed. Select a format type.
3.25 Floppy Disk Drive Utilities 3 and Diagnostics (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? 5. HDD-ID READ program Selecting HDD ID displays the following HDD ID configuration: [HDD ID Read (VX.XX)] [ ID code (h) No. of Cylinders Removable Cylinders No.
3 and Diagnostics 3.26 System Configuration 3.26 System Configuration 3.26.1 Function Description The System Configuration program contains the following configuration information for the computer: 1. Processor Type 2. VGA Controller 3. MS-DOS Version 4. BIOS ROM version (1st ID, 2nd ID) 5. BOOT ROM version 6. KBC version 7. PS Micon Version 8. Total Memory Size 9. Battery Code 10. Sound System 11. The number of printer ports 12. The number of ASYNC ports 13. The number of math co-processors 14.
3.26 System Configuration 3 and Diagnostics 3.26.2 Operations 1. Selecting 8 from the DIAGNOSTIC MENU and pressing Enter displays the following system configuration: System Configuration Display : Ver X.XX [Machine Name : XXXXXX] * ** * * * * * * * ** * * * * * * * * * - Processor Type VGA Controller MS-DOS Version BIOS-ROM Version BOOT-ROM Version KBC Version PS Micom Version Total Memory Size= Battery Code Sound System 1 Printer Adapter 0 ASYNC Adapter = XXXXXXXX = XXXXX = VX.XX = VX.
3 and Diagnostics 3.27 SETUP 3.27 SETUP 3.27.1 Function Description This program displays the current system setup information as listed below: 1. Memory (a) Total 2. System Date/Time 3. Battery 4. Password 5. Boot Priority (a) Boot Priority (b) HDD Priority (a) Network Boot Protocol 6. Display (b) Power On Display (c) TV Type 7. Others (a) (b) (c) (d) (e) Power-up Mode CPU Cache Level 2 Cache Dynamic CPU Frequency Mode Auto Power On 8. Configuration 9. I/O Ports (a) Parallel 10.
3.27 SETUP 3 and Diagnostics 14. LEGACY Emulation 15. PCI LAN 3.27.
3 and Diagnostics 3.27 SETUP SYSTEM SETUP (1/2) MEMORY = XXXXX KB (*1) Total Boot Priority =HDD→FDD→CD-ROM→LAN HDD Priority =Built-in HDD→PC Card Network Boot Protocol = PXE SYSTEM DATE/TIME Date(MM-DD-YY) Time(HH:MM:SS) ACPI BIOS version = X.
3.27 SETUP 3 and Diagnostics Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press ↑ and ↓ to move between items in a column. Press Fn+↑ (PgUp) and Fn + ↓ (PgDn) to move between the two pages. 2. Press either the Space bar or Back Space to change the value. Accepting Changes and Exiting the SETUP Window 1. Press End to accept the changes you made.
3 and Diagnostics 3.27 SETUP SETUP Options The SETUP screen is divided into 15 functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s memory. (a) Total This field displays the total amount of memory installed and is automatically calculated by the computer. You cannot change this value. 2. System Date/Time This option is used to set the date and the time of the computer. System Date Sets the date.
3.27 SETUP 3 and Diagnostics NOTE: In boot mode, the System Auto Off (*1) item does not appear. Display of the LCD Brightness will be changed in the condition below: (*2) Operating the battery (*3) Using the AC adapter User Setting Use this option to set the battery save parameters on the sub-window, BATTERY SAVE OPTIONS. For details, see Battery Save Options below. (a) Battery Save Options Processing Speed This feature changes the CPU processing speed. High Low CPU operates at 1.80/1.90/2.00/2.
3 and Diagnostics 3.27 SETUP HDD Auto Off Use this option to set the duration of the HDD automatic power off function. xx Min. Automatically turns off the power to the hard disk drive if it is not used for the duration set. The duration xx can be set to 1, 3, 5, 10, 15, 20 or 30 minutes. System Auto Off Use this option to disable or set the duration of the system automatic off function in Resume mode. In Boot mode, it is disabled. Disabled Disables system automatic power off. xx Min.
3.27 SETUP 3 and Diagnostics 4. Password This option sets or resets the user password for power on and instant security (Fn+F1). Registered The user password has been registered. Not registered The user password has not been registered. For details on setting the user password, refer to the User’s Manual. 5. Boot Priority (a) Boot Priority Use this option to set the priority for booting of the computer and the priority for the HDD for booting.
3 and Diagnostics 3.27 SETUP (c) Network Boot Protocol Use this option to set the starting method via a network. PXE Sets to PXE protocol. (Default) RPL Sets to RPL protocol. 6. Display This group of options configures the computer’s display. (a) Power On Display This option is used to select the display when booting up. Auto-Selected Selects an external monitor if one is connected. Otherwise it selects the internal LCD.
3.27 SETUP 3 and Diagnostics 7. Others Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use. (a) Power-up Mode Use this option to choose between resume and boot mode. This potion can also be set by hotkeys. Boot Turns on boot mode. (Default) Resume Turns on resume mode. (b) CPU Cache Use this option to enable or disable the CPU cache. Enabled Enables the CPU cache. (Default) Disabled Disables the CPU cache.
3 and Diagnostics 3.27 SETUP (e) Auto Power On This option shows the setting for the Auto Power On function and Wake-up LAN function. Disabled Parameters for the Auto Power On function and Wakeup LAN function are set. (Default) Enabled Parameters for the Auto Power On function and Wakeup LAN function are not set. (Default) When the “Enable” is selected, the following menu appears.
3.27 SETUP 3 and Diagnostics NOTE: 1. Do not remove the AC adaptor and battery pack at the same time when you use this feature. If you do so, data saved by the resume function will be lost. You must also reset this option. 2. If you have set a password and the computer boots by the Auto Power On function and Resume is on, the computer will start with the instant security function enabled. The password = message is not displayed; however, you must enter the password to use the computer. 3.
3 and Diagnostics 3.27 SETUP 9. I/O ports This option controls settings for the parallel port. NOTE: Do not assign the same interrupt request level and I/O address to the serial port and PC card. (a) Parallel This option sets the interrupt request level and I/O port base address for the parallel port. When the parallel port mode is set to Std.
3.27 SETUP 3 and Diagnostics 10. Drives I/O This option displays the address and interrupt level for the hard disk drive, CD/DVDROM drive and PC card. It is for information only and cannot be changed. Built-in HDD CD-ROM The setting for the built-in HDD is displayed. The setting for the built-in CD-ROM is displayed. PC Card This is displayed, when a PC card type HDD that can boot system is inserted to PC card slot. 11. PCI Bus This option displays the interrupt level for the Card Bus in the computer.
3 and Diagnostics 3.27 SETUP (b) Parallel Port Mode Use this option to set information of ECP and Standard Bi-directional. ECP Sets the port mode to Extended Capabilities Port (ECP). For most printers, the port should be set to ECP. (Default) Std. Bi-Direct. Sets the bi-directional setting. This setting should be used with some other parallel devices. NOTE: When the Windows is used, the setting in “Toshiba HW setup” has the priority. The setting in “Parallel Port Mode” is ignored.
3.27 SETUP 3 and Diagnostics (b) USB-FDD Legacy Emulation This option sets the Legacy support condition of the USB floppy disk drive. Enabled Enables LEGACY support. (Default) USB floppy disk is available without the driver. To start the computer by FD, set this option to "Enabled" Disabled Disables LEGACY support 15. PCI LAN This option sets the Enable / Disable of the built-in LAN functions. Enabled Enables built-in LAN functions. (Default) Disabled Disables built-in LAN functions.
Chapter 4 Replacement Procedures
4 Replacement Procedures 4 4-ii Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (960-445)
4 Replacement Procedures Chapter 4 4.1 Contents Overview.................................................................................................................... 4-1 Safety Precautions................................................................................................ 4-2 Before You Begin ................................................................................................ 4-3 Disassembly Procedures ........................................................................
4 Replacement Procedures 4.18 Fluorescent Lamp..................................................................................................... 4-64 4.18.1 Replacing the 14.1 Inch XGA TMD Fluorescent Lamp.......................................... 4-65 4.18.2 Replacing the 14.1 Inch XGA CHIMEI Fluorescent Lamp .................................... 4-77 4.18.3 Replacing the 14.1 Inch XGA Samsung Fluorescent Lamp (VF2058P01) ............. 4-81 4.18.4 Replacing the 14.
4 Replacement Procedures Figures Figure 4-1 Removing Battery Cover..................................................................................... 4-8 Figure 4-2 Removing Battery Pack....................................................................................... 4-9 Figure 4-3 Removing PC Card ........................................................................................... 4-11 Figure 4-4 Removing Memory Slot Cover ....................................................................
4 Replacement Procedures Figure 4-30 Removing FIR Dummy Cover ........................................................................ 4-44 Figure 4-31 Removing BAT LOCK ASSY ........................................................................ 4-46 Figure 4-32 Removing HDD UPPER ASSY...................................................................... 4-47 Figure 4-33 Removing Touch Pad Switch..........................................................................
4 Replacement Procedures Figure 4-153 to 4-177 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (1) to (25) ..............................................................................................................
4 Replacement Procedures 4-viii Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (960-445)
4.1 Overview 4 Replacement Procedures 4 4.1 Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual. In all cases when removing an FRU, the battery pack must also be removed.
4 Replacement Procedures 4.1 Overview Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. Danger: 1. In the case of the battery, always use authentic parts or equivalent parts approved by Toshiba. Other batteries may have different specifications that are incompatible with the computer and may result in fire or explosion.
4.1 Overview 4 Replacement Procedures Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2.1 Battery Pack”. 1. Do not disassemble the computer unless it is operating abnormally. 2. Use the designated tools. 3. Ensure that the environment for working on and storing parts does not contain any of the following.
4 Replacement Procedures 4.1 Overview Disassembly Procedures Three main types of cable connector are used. Pressure plate connector Spring connector Normal pin connector When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cable out from the connector. When reconnecting a cable to a pressure plate connector, lift up the pressure plate to a suitable height and insert the cable into the connector.
4.1 Overview 4 Replacement Procedures Assembly Procedure After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems. Check that all cables and connectors are securely connected.
4 Replacement Procedures 4.1 Overview Screw Tightening Torque Use the following torque when tightening screws. CAUTION: Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage. NOTE: To tighten screws quickly and accurately, an electric screwdriver is recommended. M2 (2mm) 0.167 N∙m (1.7 kgf∙cm) M2.5 (2.5mm) 0.294 N∙m(3.0 kgf∙cm) M3 (3mm) 0.549 N∙m(5.
4.1 Overview 4 Replacement Procedures Screw Notation To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body. Format: Screw shape + Screw length (mm) Screw shape B: Bind screw F: Thin head screw S: Super thin head screw T: Tapping screw U: Other screws (Unique screws: pan head, stud, etc.) Example: B6 ...
4 Replacement Procedures 4.2 4.2 Battery Pack/PC Card Battery Pack/PC Card 4.2.1 Battery Pack Removing the battery pack The following describes the procedure for removing the battery pack (See Figure 4-1, 4-2). CAUTION: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC adapter and all other external devices from the computer. 3.
4.2 Battery Pack/PC Card 4 Replacement Procedures 1. Push the latches on the back of the battery cover and remove the battery pack. NOTE: For environmental reasons, do not throw away a spent battery pack. Collect the spent battery packs.
4 Replacement Procedures 4.2 Battery Pack/PC Card Installing the battery pack The following describes the procedure for reinstalling the battery pack (See Figure 4-1, 4-2). CAUTION: There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly. Collect the spent battery packs. Use only the batteries approved by Toshiba. NOTE: Check visually the battery terminals and clean off any dirt with a dry cloth. 1. Turn off the power of the computer. 2.
4.2 Battery Pack/PC Card 4 Replacement Procedures 4.2.2 PC Card Removing the PC card The following describes the procedure for removing a PC card (See Figure 4-3). CAUTION: Insert or remove the PC card in accordance with any instructions in the PC card manual or the manuals of the computer system you are using. 1. Push the eject button. It will pop out when you release it. Then press once more the eject button to eject the PC card. 2. Grasp the PC card and remove it.
4 Replacement Procedures 4.3 4.3 Memory Module Memory Module CAUTION: The power of the computer must be turned off when you remove the memory module. Removing a memory module with the power on risks damaging the module or the computer itself. Do not touch the memory module terminals. Any dirt on the terminals may cause memory access problems. Never press hard or bend the memory module. Removing the memory module To remove a memory module, confirm that the computer is in boot mode.
4.3 Memory Module 4 Replacement Procedures 4. Open the left and right latches and remove the memory module. SLOT B: Expansion Memory Latch Latch SLOT A: Standard Memory Memory Module Figure 4-5 Removing Memory Module Installing the memory module To install the memory module, confirm that the computer is in boot mode. Then perform the following procedure (See Figure 4-4, 4-5). 1. Insert the memory module into the connector of the computer slantwise (terminal side first) and press it to connect firmly.
4 Replacement Procedures 4.4 4.4 HDD HDD Removing the HDD The following describes the procedure for removing an HDD (See Figure 4-6 to 4-8). CAUTION: Take care not to press on the top or bottom of the HDD. Pressure may cause data loss or damage to the device. 1. Turn the computer upside down. 2. Remove the following screws fixing the HDD slot cover and remove the cover by pressing it in the direction indicated by the arrow. • M2.5x16 THIN BIND screw x2 M2.
4.4 HDD 4 Replacement Procedures 3. Remove the following screw fixing the HDD ASSY. • M2.5x5 THIN BIND screw x1 4. Pull the tab of the HDD holder from the inside of the computer. 5. Hold the HDD tab and pull out the HDD ASSY in the direction indicated by the arrow. Tab HDD ASSY M2.
4 Replacement Procedures 4.4 HDD 6. Remove the following screws fixing the HDD. • M3x4 THIN BIND screw x4 7. Remove the HDD holder from the HDD.
4.4 HDD 4 Replacement Procedures Installing the HDD The following describes the procedure for installing an HDD (See Figure 4-6 to 4-8). 1. Install the HDD to the HDD holder with the following screws. • M3x4 THIN BIND screw x4 2. Insert the HDD ASSY into the HDD slot. 3. Fix the HDD ASSY with the following screw. • M2.5x5 THIN BIND screw x1 4. Install the HDD slot cover and secure it using the following screws. • M2.
4 Replacement Procedures 4.5 4.5 MDC Modem MDC Modem Removing the MDC Modem The following describes the procedure for removing an MDC modem (See Figure 4-9). CAUTION: The power must be turned off when you remove the MDC modem. Removing an MDC modem with the power on risks damaging the modem or the computer itself. 1. Turn the computer upside down. 2. Remove the screw fixing the MDC slot cover and remove the cover. (This screw is fixed to the MDC slot cover and can not be removed.) 3.
4.5 MDC Modem 4 Replacement Procedures Installing the MDC Modem The following describes the procedure for installing an MDC modem (See Figure 4-9). 1. Connect the MDC jack cable to JP1 on the MDC modem. 2. Set the MDC modem on the slot and connect the MDC modem to the connector PJ3000 on the system board by pressing it from the top. 3. Install the modular jack in the modular jack slot. 4. Fix the MDC modem using the following screws. • M2x4 BIND screw x2 5.
4 Replacement Procedures 4.6 4.6 Mini PCI Card Mini PCI Card CAUTION: (1) The power must be turned off when you remove a mini PCI card. Removing a mini PCI card with the power on risks damaging the card or the computer itself. (2) Never press hard or bend the mini PCI card. Removing the Mini PCI Card The following describes the procedure for removing the mini PCI card (See Figure 4-10, 411). The explanation in this section uses a model with wireless LAN as an example. 1. Turn the computer upside down.
4.6 Mini PCI Card 4 Replacement Procedures 3. Remove the glass tape and disconnect two wireless LAN cables from JP1 and JP2 on the mini PCI card. 4. Open the left and right latches holding the mini PCI card and remove the mini PCI card. Latches Wireless LAN Antenna Cable Mini PCI Card The position for connecting the wireless LAN cable (White, Black) is different from each model.
4 Replacement Procedures 4.7 4.7 Fan Module/Cooling Fin/CPU Fan Module/Cooling Fin/CPU NOTE: If silicon grease has already been applied to the CPU and fan module, wipe clean with a cloth and apply new silicon grease. The computer will not operate correctly if the CPU is not firmly in contact with the fan module. Removing the Fan Module/Cooling Fin/CPU The following describes the procedure for removing the fan module/cooling fin/CPU (See Figure 4-12 to 4-16). 1.
4.7 Fan Module/Cooling Fin/CPU 4 Replacement Procedures 2. Remove the following screws fixing the fan module. • M2.5x5 THIN BIND screw x2 3. Lift up the fan module and disconnect the fan module cable from the PJ8770 on the system board. M2.
4 Replacement Procedures 4.7 Fan Module/Cooling Fin/CPU 4. Remove the following screws securing the CPU holder in the opposite order of the marks (1 to 4) on the CPU holder.
4.7 Fan Module/Cooling Fin/CPU 4 Replacement Procedures 5. Lift up the cooling fin in the direction indicated by the arrow and remove the cooling fin. Cooling Fin Figure 4-15 Removing Cooling Fin 6. Unlock the CPU by rotating counterclockwise the cam on the CPU socket by 90 degrees with a flat-blade screwdriver (in the order shown in the figure below). 7. Remove the CPU.
4 Replacement Procedures 4.7 Fan Module/Cooling Fin/CPU Installing the Fan Module/Cooling Fin/CPU The following describes the procedure for installing the fan module/cooling fin/CPU (See Figure 4-12 to 4-18). 1. Check that the mark on the cam is in the unlocking position. 2. Attach the CPU to the correct position in the CPU socket. CAUTION: Place the CPU in such direction as shown below. (Pay attention to the position of the triangle mark on the CPU.) CPU Socket CPU Figure 4-17 Installing the CPU 3.
4.7 Fan Module/Cooling Fin/CPU 4 Replacement Procedures NOTE: Apply the silicon grease enough to cover the chip surface using the special applicator. When installing the fin, make sure the bottom of the fin covers the top of CPU. CPU Chip Figure 4-18 Applying Silicon Grease 5. Install the cooling fin. 6. Place the CPU holder on the cooling fin with its holes (small and large) attached to the bosses of the cooling fin.
4 Replacement Procedures 4.8 4.8 Keyboard Keyboard Removing the keyboard The following describes the procedure for removing the keyboard (See Figure 4-19 to 4-21). CAUTION: As the keytop may fall out, when handling the keyboard always hold it by the frame and do not touch the keytop. 1. Open the display. 2. Hold the both ends of the keyboard holder and lift it up to remove.
4.8 Keyboard 4 Replacement Procedures 3. Remove the following screws holding the keyboard. • M2.5×2.8 THIN BIND screw x2 4. Remove the following screw fixing the keyboard hold plate and remove the keyboard hold plate. • M2.5×2.8 THIN BIND screw x1 5. Lift the upper side of the keyboard out and turn it face down on the palm rest. M2.5×2.8 THIN BIND M2.5×2.
4 Replacement Procedures 4.8 Keyboard 6. Remove the following screw fixing the keyboard support plate underneath the keyboard. • M2.5x8 THIN BIND screw x1 7. Remove the keyboard support plate by lifting it up toward the left side. 8. Lift up the insulator and disconnect the keyboard flexible cable from PJ3200 on the system board. M2.
4.8 Keyboard 4 Replacement Procedures Installing the keyboard The following describes the procedure for installing the keyboard (See Figure 4-19 to 4-21). 1. Turn the keyboard upside down and place it on the palm rest as its face is down. Turn up the insulator and connect the keyboard flexible cable to PJ3200 on the system board. 2. Install the keyboard support plate on the insulator covering the keyboard flexible cable and secure it with the following screw. • M2.5x8 THIN BIND screw x1 3.
4 Replacement Procedures 4.9 Optical Drive 4 4.9 Optical Drive This section describes how to remove and install a CD-ROM drive as an example. The procedure for a DVD-ROM, Combo, Combo+2 or DVD-Multi drive is the same. NOTE: Do not apply excessive force to the top of an optical drive. Removing the Optical Drive The following describes the procedure for removing the Optical drive (See Figure 4-22, 4-23). 1. Turn the computer face down and remove the following screw securing the CD-ROM drive. • M2.
4.9 Optical Drive 4 Replacement Procedures 1. Remove the following screws fixing the CD-ROM holder from the CD-ROM drive assembly. • M2x1.7 STEP screw x2 2. Remove the following screw fixing the side bracket and remove the side bracket. • M2x3 SUPER THIN BIND screw x1 CD-ROM Drive Assembly Side Bracket CD-ROM Holder M2x1.
4 Replacement Procedures 4.9 Optical Drive Installing the Optical Drive The following describes the procedure for installing the optical drive (See Figure 4-22, 4-23). 1. Install the side bracket on the CD-ROM drive and fix it with the following screw. • M2x3 SUPER THIN BIND screw x1 2. Place the CD-ROM holder on the CD-ROM drive and fix it with the following screws. • M2x17 STEP screw x2 3. Insert the CD-ROM drive assembly into the slot to connect it to PJ1800 on the system board. 4.
4.10 Display Assembly 4 Replacement Procedures 4.10 Display Assembly Removing the Display Assembly The following describes the procedure for removing the display assembly (See Figure 4-24 to 4-26). 1. Open the display and disconnect the LCD cable from PJ5600 on the system board. 2. Pull out the insulator covering the speaker connectors from the chassis and turn up the insulator. Disconnect the speaker cables (Blue, Red) from PJ6000 and PJ6001 respectively.
4 Replacement Procedures 4.10 Display Assembly 3. Close the display and turn the computer face down. 4. Remove the following screws from the bottom and rear of the computer. • • M2.5x5 M2.
4.10 Display Assembly 4 Replacement Procedures 5. Lift the display assembly up and remove it from the base assembly. Display Assembly Base Assembly Figure 4-26 Removing Display Assembly (3) 6. (For wireless LAN models only) Pull the wireless LAN cables from the slot of the base assembly. NOTE: (For wireless LAN models only) When removing the display assembly, be careful not to cut the wireless LAN cables.
4 Replacement Procedures 4.10 Display Assembly Installing the Display Assembly The following describes the procedure for installing the display assembly (See Figure 4-24 to 4-26). 1. Close the display and install the display assembly on the base assembly from the rear of the computer. 2. (For wireless LAN models only) Pass the wireless LAN cables through the slot and hook the cables on the guides. 3. Secure the following screws to fix the bottom and rear of the computer. • M2.5x5 THIN BIND screw • M2.
4.11 Touch Pad 4 Replacement Procedures 4.11 Touch Pad Removing the Touch Pad The following describes the procedure for removing the touch pad (See Figure 4-27). 1. Disconnect the touch pad flexible cable from PJ3201 on the system board. 2. Remove the following screw securing the touch pad. • M2.5x5 THIN BIND screw x1 3. Remove the touch pad. Touch Pad Flexible Cable Touch Pad PJ3201 M2.
4 Replacement Procedures 4.11 Touch Pad Installing the Touch Pad The following describes the procedure for installing the touch pad (See Figure 4-27). 1. Place the touch pad from the right side according to the guide pins. 2. Connect the touch pad flexible cable to PJ3201 on the system board. 3. Secure the touch pad with the following screw. • 4-40 M2.
4.12 BAT CON Holder 4 Replacement Procedures 4.12 BAT CON Holder Removing the BAT CON Holder The following describes the procedure for removing the BAT CON holder (See Figure 4-28). 1. Remove the following screws fixing the BAT CON holder. • M2.5x8 THIN BIND screw x2 2. Remove the BAT CON holder from the system board. BAT CON Holder THIN BIND M2.
4 Replacement Procedures 4.13 System Board/DC-IN Jack/RTC Battery 4.13 System Board/DC-IN Jack/RTC Battery CAUTION: 1. When handling the system board, always hold by the edges. Do not touch the printed circuit face. 2. After replacing the system board with a new one, set the DMI information as described in section 3.4 “System test”. Also update with the latest BIOS as described in Appendix G “BIOS/KBC/EC Update”. 3. After replacing the system board, the DMI information must be updated.
4.13 System Board/DC-IN Jack/RTC Battery 4 Replacement Procedures RTC Battery DC-IN Jack Modem Jack M2.5x5 THIN BIND PJ8800 PJ8790 System Board M2.
4 Replacement Procedures 4.13 System Board/DC-IN Jack/RTC Battery 8. Remove the FIR dummy cover from the base assembly by pressing it outward while holding the base assembly. Be careful not to damage the FIR dummy cover or the base assembly.
4.13 System Board/DC-IN Jack/RTC Battery 4 Replacement Procedures Installing the System Board/DC-IN Jack/RTC Battery The following describes the procedure for installing the system board/DC-IN Jack/RTC Battery (See Figure 4-29, 4-30). 1. Attach the FIR dummy cover on the base assembly. Make sure the latches are setured. 2. Install the modem jack on the base assembly. 3. Connect the DC-IN jack cable to PJ8800 on the system board. 4. Connect the RTC battery cable to PJ8790 on the system board. 5.
4 Replacement Procedures 4.14 BAT LOCK ASSY/HDD UPPER ASSY 4.14 BAT LOCK ASSY/HDD UPPER ASSY Removing the BAT LOCK ASSY/HDD UPPER ASSY The following describes the procedure for removing the BAT LOCK ASSY/HDD UPPER ASSY (See Figure 4-31, 4-32). 1. Remove the following screws fixing the BAT LOCK ASSY. • M2.5x6 PSP TIGHT screw x2 2. Remove the BAT LOCK ASSY from the base assembly. M2.
4.14 BAT LOCK ASSY/HDD UPPER ASSY 4 Replacement Procedures 3. Remove the HDD UPPER ASSY from the base assembly by lifting it up.
4 Replacement Procedures 4.14 BAT LOCK ASSY/HDD UPPER ASSY Installing the BAT LOCK ASSY/HDD UPPER ASSY The following describes the procedure for installing the BAT LOCK ASSY/HDD UPPER ASSY (See Figure 4-31, 4-32). 1. Install the HDD UPPER ASSY on the base assembly. 2. Install the BAT LOCK ASSY on the base assembly. 3. Secure the BAT LOCK ASSY on the base assembly with the following screws. • 4-48 M2.
4.15 Touch Pad Switch 4 Replacement Procedures 4.15 Touch Pad Switch Removing the Touch Pad Switch The following describes the procedure for removing the touch pad switch (See Figure 4-33). 1. Remove the following screws fixing the touch pad switch. • M2.5x4 PSP TIGHT screw x2 2. Remove the touch pad switch. M2.
4 Replacement Procedures 4.16 LCD Unit/FL Inverter 4.16 LCD Unit/FL Inverter NOTE: The same part is used for the display hinge that holds the LCD unit, regardless of the LCD size. Removing the LCD Unit/FL Inverter The following describes the procedure for removing the LCD unit and FL inverter (See Figure 4-34 to 4-36). 1. Peel off two mask tapes from the front and remove the following screws. • M2.5x8 THIN BIND screw x2 2.
4.16 LCD Unit/FL Inverter 4 Replacement Procedures 3. Peel off the mask tapes from the sides of the display and remove the following screws fixing the LCD unit. • M2x4 SUPER THIN BIND screw x4 4. With the bottom edge of the LCD unit resting on the display cover, lift the top edge of the LCD unit. Peel off the glass tape and disconnect the LCD cable from the connector on the back of the LCD. 5. Remove the following screw fixing the FL inverter. • M2x4 SUPER THIN BIND screw x1 6.
4 Replacement Procedures 4.16 LCD Unit/FL Inverter 8. Remove the following screws securing the LCD brackets. Remove the LCD brackets from the LCD module.
4.16 LCD Unit/FL Inverter 4 Replacement Procedures Installing the FL Inverter/LCD Unit The following describes the procedure for installing the LCD unit/FL inverter (See Figure 434 to 4-36). 1. Secure the LCD brackets to the LCD module with the following screws. • M2x3 SUPER THIN BIND screw x4 2. Set the LCD module on the display cover. 3. Connect two cables to the connectors CN1 and CN2 on the FL inverter. Stick the insulator on the FL inverter and secure the FL inverter with the following screw.
4 Replacement Procedures 4.17 Wireless LAN Antenna/Display Cover/Speaker 4.17 Wireless LAN Antenna/Display Cover/Speaker Removing the Wireless LAN Antenna/Display Cover/Speaker The following describes the procedure for removing the wireless LAN antenna, display cover, and speaker (See Figure 4-37 to 4-44). 1. Remove the latch assembly from the display cover by pressing it outward.
4.17 Wireless LAN Antenna/Display Cover/Speaker 4 Replacement Procedures 2. Close the display and turn the display assembly face down. Peel off the glass tape securing the speaker cables. Unhook the speaker cables (Blue, Red) from the guides respectively.
4 Replacement Procedures 4.17 Wireless LAN Antenna/Display Cover/Speaker 3. (Wireless LAN models only) Open the display and peel off four acetate tapes securing the wireless LAN antenna cables. Remove the wireless LAN antennas. Then unhook the wireless LAN antenna cables from the guides on the chassis. Turn the display assembly face down and unhook the wireless LAN antenna cable from the guides. • M2.
4.17 Wireless LAN Antenna/Display Cover/Speaker 4 Replacement Procedures 4. Peel off the insulator covering the back side of the display assembly and remove the following screws securing the hinge cover. Then open the display, release two latches of the hinge cover and remove the hinge cover. • M2.5x4 PSP TIGHT screw x1 M2.
4 Replacement Procedures 4.17 Wireless LAN Antenna/Display Cover/Speaker 5. Remove the following screws securing the speakers (Left, Right) and remove the speakers. • M2.5x5 THIN BIND screw x5 (Left: 2, Right: 3) CAUTION: When removing the speakers, be careful not to touch the metal part of the speakers. It might damage the speakers. M2.5x5 THIN BIND M2.
4.17 Wireless LAN Antenna/Display Cover/Speaker 4 Replacement Procedures 6. Remove the following screw securing the LCD cable holder and remove the LCD cable holder. Then pull out the LCD cable from the bottom side of the display cover. • M2.5x4 PSP TIGHT screw x1 M2.
4 Replacement Procedures 4.17 Wireless LAN Antenna/Display Cover/Speaker 7. Peel off four mask seals from the both sides of the display cover and remove the following screws securing the hinges to the display cover. • M2.5x2.8 THIN BIND screw x2 8. Open the display and remove the following screws securing the hinges to the display cover. • M2.5x6 THIN BIND screw x2 9. Open the display at 45-degree slant and remove the following screws securing the hinges to the display cover. • M2.5x2.
4.17 Wireless LAN Antenna/Display Cover/Speaker 4 Replacement Procedures 11. Straighten the edges of the left and right speaker nets (at four point each) using a device such as a flatblade driver and remove the speaker nets. 12. Remove the following screws securing the hinges to the display assembly. Pull the hinge outward slightly, then remove it by rotating. • • M2.5x6 M2.5x6 PSP TIGHT screw THIN BIND screw x3 (Left: 2, Right: 1) x1 (Right) M2.5x6 PSP TIGHT M2.
4 Replacement Procedures 4.17 Wireless LAN Antenna/Display Cover/Speaker Installing the Wireless LAN Antenna/Display Cover/Speaker The following describes the procedure for installing the wireless LAN antenna, display cover, and display cable (See Figure 4-37 to 4-44). 1. Install the hinges to the display assembly and secure them with the following screws. • • M2.5x6 M2.5x5 PSP TIGHT screw THIN BIND screw x3 (Left: 2, Right:1) x1 (Right) 2.
4.17 Wireless LAN Antenna/Display Cover/Speaker 4 Replacement Procedures 10. Set the left and right speakers on the back of the display assembly and secure the speakers with the following screws. • M2.5x5 THIN BIND screw x5 (Left: 2, Right: 3) CAUTION: When installing the speakers, be careful not to touch the metal part of the speakers. It might damage the speakers. 11. Hook the right speaker cable (Red) on two guides and pass it around the hinge cover.
4 Replacement Procedures 4.18 Fluorescent Lamp 4 4.18 Fluorescent Lamp This system uses LCD modules from the following suppliers. The procedure for replacing the fluorescent lamp is different for each LCD module. Refer to the appropriate procedure. Type Part No. Supplier Section 14.1 inch G33C00012110 TMD 4.18.1 (XGA) G33C00013110 TMD 4.18.1 VF2093P01 CHIMEI 4.18.2 VF2058P01 Samsung 4.18.3 VF2048P01 Samsung 4.18.4 VF2062P01 LG.Philips 4.18.5 15.0 inch G33C0000G110 LG.Philips 4.
4.18 Fluorescent Lamp 4 Replacement Procedures 4.18.1 Replacing the TMD 14.1 Inch XGA Fluorescent Lamp Replace the Toshiba 14.1-inch XGA fluorescent lamp according to the following procedures and Figures 4-45 to 4-56. 4.18.1.1 Disassembling Fluorescent Lamp Peeling off the tapes and insulation sheets 1. Flip the module over and place it on a flat surface that is free of foreign objects. 2.
4 Replacement Procedures 4.18 Fluorescent Lamp Removing the screws 1. Spread out the insulation sheet without detaching it from the side of the bezel, as shown in Figure 4-46. 2. In the order (1) and (2) shown in Figure 4-46, remove the screws from the left- and right-hand sides of the module. CAUTION: To unfasten the screws, use an insert bit of point size 0 for Philips screwdrivers.
4.18 Fluorescent Lamp 4 Replacement Procedures Removing the bezel 1. Without removing the insulation tape, flip the module over again so that the display screen can face up. 2. Release the latches of the bezel and frame. (On the sides, there are five latches in the upper area and two latches in the lower area.) 3. Gently remove the double-sided tape from the cell at the reverse side of the bottom of the bezel and remove the bezel. 4.
4 Replacement Procedures 4.18 Fluorescent Lamp Opening the PCB 1. Spread out the PCB horizontally, as shown in Figure 4-48. CAUTION: Be careful not to damage the TAB. Open XPCBを裏面から開く. the X-PCB from the reverse side.
4.18 Fluorescent Lamp 4 Replacement Procedures Removing the PCB-assembly cell 1. Remove the cell of the PCB assembly from the backlight assembly, as indicated by (1) in Figure 4-49. Completely remove the double-sided tape remaining on the reverse side of the cell. CAUTION: On the cell, three areas are bonded to the frame with the double-sided tape (as shown in Figure 4-49, one area is at the top, and two areas are at the bottom of both sides). Remove the cell gently, taking care not to damage it.
4 Replacement Procedures 4.18 Fluorescent Lamp 4.18.1.2 Assembling Fluorescent Lamp Putting the double-sided tapes on the bezel ベゼル裏面 Reverse side of the bezel The end of tape must not go beyond the Requirements for attaching double–sided tape 両面テープ貼り規格 Tape must not go beyond the opening of the bezel. ベゼル開口部より テープのはみ出し無きこと Double-sided tape (4597, Sumitomo 3M) 両面テープ:4597(住友3M) The end of tape must not go テープ端がベゼル開口部より beyond the opening of bezel. 越えないこと +0 .
4.18 Fluorescent Lamp 4 Replacement Procedures Checking the backlight 1. Inspect the replacement backlight according to Figure 4-51. The frame must not be overlaid with the prism プリズムシート類がフレームに sheet, etc. 乗り上げていないこと。 he frame must not be verlaid with the prism プリズムシート類が heet,フレームに etc. 乗り上げていないこと。 The sheet must not be dislocated from the frame. シートがフレームからはずれていないこと。 Sheet retaining tape シート押えテープ Align the tape with the rib of frame. フレームのリブに突きあてて貼る The frame must not be overlaid.
4 Replacement Procedures 4.18 Fluorescent Lamp Assembling PCB-assembly cell 1. Remove the paper (coated with a mold release) from the double-sided tape in the three areas on the replacement backlight unit. The areas are at the top and on both sides. See Figure 4-52. 2. Turn the backlight on. 3. Check that the backlight is free of dust, foreign objects, or damage. Perform this check also for the reverse side of the cell. Then install the cell of the PCB assembly in the backlight unit.
4.18 Fluorescent Lamp 4 Replacement Procedures Folding down and temporary fixing of the TAB/PCB 1. Fold down the TAB (PCB) toward the reverse side of the backlight unit, as shown in Figure 4-53. CAUTION: Be careful not to damage the TAB. For the X-PCB toward the reverse side.
4 Replacement Procedures 4.18 Fluorescent Lamp Setting the bezel 1. Start installing the bezel in the upward direction until it stops at the top left corner. NOTE: The GND-CU and lamp reflector on the left-hand side must not go beyond the edges of the bezel. Be careful not to damage the cables and TAB. The bezel latches must be engaged (there are five latches on the top edge, and two latches on the bottom edge). 2 2 2 Next, fit the bezel’s edge close to the TAB. 次にたTAB側をはめる. 2 Close the five latches.
4.18 Fluorescent Lamp 4 Replacement Procedures Fasten screws of the PCB and bezel 1. Fasten four screws on the left edge in the order (5), (6), (7), and (8) shown in Figure 4-55. 2. Fasten four screws on the right edge in the order (1), (2), (3), and (4) shown in Figure 4-55. CAUTION: Fasten the screws in the orders shown in Figure 4-55. No loose fastening is allowed. The tightening torque must not exceed 0.147N・m (1.5kgf・cm) for all the eight screws.
4 Replacement Procedures 4.18 Fluorescent Lamp Attaching the tapes and insulation sheet 1. Attach the PCB insulation sheet (one point). 2. Attach the tape for the bezel to the bottom area close to the lamp (two points). 3. Attach the tape for fixing the FL tube cable (one point). CAUTION: When attaching tape and insulation sheet, be careful not to damage the TAB and lamp cable connections. Attaching the insulation 絶縁シート貼り付け sheet 1 1 Attach the sheet after removing slack.
4.18 Fluorescent Lamp 4 Replacement Procedures 4.18.2 Replacing the 14.1 Inch XGA CHIMEI Fluorescent Lamp The following describes the procedure for replacing the fluorescent lamp (See Figure 4-57 to Figure 4-63). 1. Remove the tapes, labels and films (1 to 8). Figure 4-57 Replacing 14.1 Inch CHIMEI fluorescent lamp (1) 2. Remove the latch. Figure 4-58 Replacing 14.
4 Replacement Procedures 4.18 Fluorescent Lamp 3. Remove the screw and PCB cover. Figure 4-59 Replacing 14.1 Inch CHIMEI fluorescent lamp (3) 4. Loosen the X-PCB connector and disconnect the FPC from the Y-PCB. 5. Remove the X-PCB and Y-PCB. Figure 4-60 Replacing 14.
4.18 Fluorescent Lamp 4 Replacement Procedures 6. Remove the spacer from the protector sheet. 7. Remove the sheets (2) to (5). Figure 4-61 Replacing 14.1 Inch CHIMEI fluorescent lamp (5) 8. Remove the LGP and reflection sheet. Figure 4-62 Replacing 14.
4 Replacement Procedures 4.18 Fluorescent Lamp 9. Remove the screw. Figure 4-63 Replacing 14.1 Inch CHIMEI fluorescent lamp (7) 10. The assembly procedure is the reverse of the above disassembly procedure.
4.18 Fluorescent Lamp 4 Replacement Procedures 4.18.3 Replacing the 14.1 Inch XGA Samsung Fluorescent Lamp (VF2058P01) The following describes the procedure for replacing the fluorescent lamp (See Figure 4-64 to Figure 4-71) 1. Remove the PCB cover and tapes from the LCD module. Be careful not to damage the PCB. Figure 4-64 Replacing 14.
4 Replacement Procedures 4.18 Fluorescent Lamp 2. Remove two screws fixing the PCB. Be careful not to damage the PCB. Screw Screw Figure 4-65 Replacing 14.
4.18 Fluorescent Lamp 4 Replacement Procedures 3. Remove the metal bezel from the plastic chassis by detaching the top hooks, side hooks and bottom hooks. Figure 4-66 Replacing 14.1 Inch Samsung fluorescent lamp (VF2058P01) (3) 4. Remove the panel from the backlight unit. Be careful not to damage the TCP. Panel Backlight Unit Figure 4-67 Replacing 14.
4 Replacement Procedures 4.18 Fluorescent Lamp 5. Remove two clips. Remove the sheets (lens sheet, diffusion sheet, light guide and reflection sheet). Figure 4-68 Replacing 14.1 Inch Samsung fluorescent lamp (VF2058P01) (5) 6. Remove two screws fixing the lamp cover and remove the lamp cover. Screw Screw Figure 4-69 Replacing 14.
4.18 Fluorescent Lamp 4 Replacement Procedures 7. Remove the GND cable of the FL lamp from the plastic chassis. GND Wire Hot Wire Figure 4-70 Replacing 14.
4 Replacement Procedures 4.18 Fluorescent Lamp 8. Remove the lamp unit from the plastic chassis and replace the lamp with a new one. Lamp ASSY Figure 4-71 Replacing 14.1 Inch Samsung fluorescent lamp (VF2058P01) (8) 9. The assembly procedure is the reverse of the above disassembly procedure.
4.18 Fluorescent Lamp 4 Replacement Procedures 4.18.4 Replacing the 14.1 Inch XGA Samsung Fluorescent Lamp (VF2048P01) The following describes the procedure for replacing the fluorescent lamp (See Figure 4-72 to Figure 4-81). 1. Remove the PCB cover (Cover-PCB), tape fixing the FL cable (Tape-Wire) and the aluminum tape (Tape-Al). 1) When removing the PCB cover, be careful not to damage the driver IC on the PCB. 2) Remove the aluminum tape. 3) Remove the tape fixing the FL cable.
4 Replacement Procedures 4.18 Fluorescent Lamp 11. Remove the top chassis 1) Release four hooks on the bottom side. Figure 4-74 Replacing 14.1 Inch Samsung fluorescent lamp (VF2048P01) (3) 2) Release the four hooks on the side. Figure 4-75 Replacing 14.1 Inch Samsung fluorescent lamp (VF2048P01) (4) 12. Remove the following five screws (VF2048P14:M2x1.7) from the source circuit board and one screw (VF2048P15:M2x2.5) from the gate circuit board.
4.18 Fluorescent Lamp 4 Replacement Procedures Figure 4-76 Replacing 14.1 Inch Samsung fluorescent lamp (VF2048P01) (5) 13. Remove the panel assembly from the backlight assembly. Be careful not to scratch the TAB (TCP) and other parts. Figure 4-77 Replacing 14.1 Inch Samsung fluorescent lamp (VF2048P01) (6) 14. Remove the sheets and clips fixing the sheet. 1) Remove the two clips fixing the sheet. 2) Remove the sheets (diffusion sheet, two lens sheets, diffusion sheet, light guide, and reflective sheet).
4 Replacement Procedures 4.18 Fluorescent Lamp Figure 4-78 Replacing 14.
4.18 Fluorescent Lamp 4 Replacement Procedures 15. Remove the lamp cover. 1) Remove the two screws (VF2048P15:M2x2.5) from the lamp cover. 2) Remove the lamp cover from the mold frame. Figure 4-79 Replacing 14.1 Inch Samsung fluorescent lamp (VF2048P01) (8) 16. Remove the FL cable GND wire (white) from the mold frame. Figure 4-80 Replacing 14.
4 Replacement Procedures 4.18 Fluorescent Lamp 17. Remove the lamp assembly (Lamp-Ass’y) fixed by the double-sided tape from the mold frame. Figure 4-81 Replacing 14.1 Inch Samsung fluorescent lamp (VF2048P01) (10) 18. The assembly procedure is the reverse of the above disassembly procedure.
4.18 Fluorescent Lamp 4 Replacement Procedures 4.18.5 Replacing the 14.1 Inch XGA LG.Philips Fluorescent Lamp The following describes the procedure for replacing the fluorescent lamp (See Figure 4-82 to Figure 4-89). Removing the tape and cover shield 1. Remove the adhesive tape fixing the B/L cable (1). Be careful not to apply excessive force to the B/L cable. 2. Remove the adhesive tape (Yupo paper) fixing the top case (2). 3. Remove the cover shield (C) (3).
4 Replacement Procedures 4.18 Fluorescent Lamp Removing the LCD controller, top case, and cover assembly 1. Disconnect the FPC cable from the LCD controller (Control PCB) (1). Be careful not to apply excessive force to the FPC cable. 2. Remove the LCD controller (2). Move the LCD controller to the left first. 3. Remove the top case (3). Be careful not to apply excessive force to the top case or gate TCP. 4. Remove the screws and cover assembly (Cover Ass’y) (4).
4.18 Fluorescent Lamp 4 Replacement Procedures Removing the source PCB and the gate PCB 1. Remove the source PCB (1). Be careful not to apply excessive force to the TCP or PCB when removing the adhesive tape. 2. Remove the gate PCB (2). Be careful not to apply excessive force to the TCP or PCB when removing the adhesive tape. Figure 4-84 Replacing 14.1 Inch LG.
4 Replacement Procedures 4.18 Fluorescent Lamp Removing the board assembly, tape pad, sheets, light guide, bottom cover (B), and lamp assembly 1. Remove the board assembly (Board Ass’y) (1). Perform this work in a clean room and be careful not to scratch or get dirt on the polarized plate and B/L assembly. 2. Remove the tape pad (Tape Pad) fixing the sheets (2). 3. Remove the sheets and light guide (Sheets&LGP) (3). Be careful not to scratch or get dirt on the sheets. 4.
4.18 Fluorescent Lamp 4 Replacement Procedures Installing the double-sided tape, lamp assembly, bottom cover (B), sheets, light guide, adhesive tape, and board assembly 1. Install the lamp assembly using the double-sided tape (install the lamp housing) (1). 2. Install the lamp assembly to the mold frame and connect the low voltage cable to the mold frame (2). Be careful not to apply excessive force to the cable. 3. Install the bottom cover (B) using the double-sided tape (for grounding) (3). 4.
4 Replacement Procedures 4.18 Fluorescent Lamp Installing the source PCB and the gate PCB 1. Install the source PCB (1). Be careful not to apply excessive force to the TCP. 2. Install the gate PCB (2). Be careful not to apply excessive force to the TCP. Figure 4-87 Replacing 14.1 Inch LG.
4.18 Fluorescent Lamp 4 Replacement Procedures Installing the bottom cover (A), screws, top case, LCD controller, and FPC 1. Install the bottom cover (A) and screws (1). Be careful not to apply excessive force to the source TCP. 2. Install the top case (3). Be careful not to apply excessive force to the gate TCP (2). 3. Install the LCD controller. When installing, slide the LCD controller to the right. 4. Connect the FPC cable to the LCD controller (4).
4 Replacement Procedures 4.18 Fluorescent Lamp Installing the tape and the cover shield 1. Stick the adhesive tape for fixing the B/L cable (1). Be careful not to apply excessive force to the B/L cable. 2. Stick the adhesive tape (Yupo paper) for fixing the top case (2). 3. Remove the cover shield (C) (3). Be careful not to apply excessive force to the LCD controller. Wear anti-static gloves as much as possible to prevent circuit damage caused by ESC. 4. Install the cover shield (G) (4).
4 Replacement Procedures 4.18 Fluorescent Lamp 4 4.18.6 Replacing the 15.0 Inch XGA LG.Philips Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module. Disassembling the 15.0 Inch XGA LG.Philips Fluorescent Lamp To disassemble the 15.0 inch XGA LG.Philips fluorescent lamp, follow the steps below and refer to figures 4-90 to 4-93. 1.
4.18 Fluorescent Lamp 4 Replacement Procedures Cover shield (C) Cover shield (G) Adhesive tape Adhesive tape Tape shield Figure 4-90 Replacing 15.0 Inch LG.Philips fluorescent lamp (XGA) (1) 2. Remove the top case. Be careful not to apply excessive force to the top case and gate TCP. Top case Figure 4-91 Replacing 15.0 Inch LG.
4 Replacement Procedures 4.18 Fluorescent Lamp 3. Remove the source PCB and gate PCB. 1) Remove the source PCB. Be careful not to apply excessive force to the PCB or TCP when removing the double-sided tape. 2) Remove the gate PCB. Be careful not to apply excessive force to the PCB or TCP when removing the double-sided tape. S ou rce P C B G a te P C B Figure 4-92 Replacing 15.0 Inch LG.Philips fluorescent lamp (XGA) (3) 4.
4.18 Fluorescent Lamp 4 Replacement Procedures Board assembly Adhesive tape Double-sided tape Adhesive tape Double-sided tape Double-sided tape Double-sided tape Adhesive tape Adhesive tape Sheets and LGP Screw Cover assembly bottom (L) Screw Figure 4-93 Replacing 15.0 Inch LG.
4 Replacement Procedures 4.18 Fluorescent Lamp Assembling the 15.0-inch XGA LG.Philips Fluorescent Lamp To assemble the 15.0-inch XGA LG.Philips fluorescent lamp, follow the steps below and refer to figures 4-94 to 4-97. 1. Install the cover assembly bottom (L), sheets, light guide, adhesive tape and board assembly. 1) Remove the protect film from the cover assembly bottom (L). 2) Secure the cover assembly bottom (L) with the two screws. NOTE: Maximum value of torque is 2.0kg•cm.
4.18 Fluorescent Lamp 4 Replacement Procedures 2. Install the source PCB and gate PCB. 1) Install the source PCB. Be careful not to apply excessive force to the TCP. 2) Install the gate PCB. Be careful not to apply excessive force to the TCP. Source PCB Gate PCB Figure 4-95 Replacing 15.0 Inch LG.Philips fluorescent lamp (XGA) (6) 3. Install the top case. Be careful not to apply excessive force to the gate TCP. Top case Figure 4-96 Replacing 15.0 Inch LG.
4 Replacement Procedures 4.18 Fluorescent Lamp 4. Stick the outside tape and install the cover shield. 1) Stick the tape shield and adhesive tape to fix the top case. NOTE: Be careful not to apply excessive force to the top case. 2) Install the cover shield (C). NOTE: Be careful not to apply excessive force to the control PCB. CAUTION: Wear anti-static gloves to prevent circuit damage to the source PCB. 3) Install the cover shield (G). NOTE: Be careful not to apply excessive force to the gate TCP.
4.18 Fluorescent Lamp 4 Replacement Procedures 4.18.7 Replacing the 15.0 Inch XGA Samsung Fluorescent Lamp Disassembling the 15.0 Inch XGA Samsung Fluorescent Lamp To disassemble the 15.0 inch XGA Samsung fluorescent lamp, follow the steps below and refer to figures4-98 to 4-106. 1. Remove the PCB cover. NOTE: When removing the PCB cover, be careful not to damage the COF. PCB cover Figure 4-98 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp 2. Remove the two screws. Screw Screw Figure 4-99 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (2) 3. Remove the four screws from the top chassis. Screw Screw Screw Screw Figure 4-100 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 4. Remove the four bottom hooks and four side hooks (left and right). Then remove the top chassis from the mold frame. S id e h o o k S id e h o o k B o t to m h o o k Figure 4-101 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (4) 5. Remove the panel assembly from the mold frame. NOTE: When removing the panel assembly, be careful not to damage the COF. P a nel a ssem b ly M old fram e Figure 4-102 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp 6. Remove the sheets and clips. 1) Remove the two clips fixing the sheets. 2) Remove the sheets (protection sheet, prism sheet (L, U), diffusion sheet, LGP and reflection sheet). C lip C lip S h eets Figure 4-103 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (6) 7. Remove the lamp back cover. 1) Remove the two screws from the lamp back cover. 2) Remove the lamp back cover. S crew L a m p ba ck cover S crew Figure 4-104 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 8. Remove the lamp wire from the wire guide of the mold frame. L am p w ire Figure 4-105 Replacing 15.0 Inch Samsung fluorescent lamp (XGA) (8) 9. Remove the lamp assembly from the mold frame. Lamp assembly Mold frame Figure 4-106 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp Assembling the 15.0-inch XGA Samsumg Fluorescent Lamp The assembly procedure of the 15.0-inch XGA Samsung fluorescent lamp is the reverse of the above disassembly procedure.
4.18 Fluorescent Lamp 4 Replacement Procedures 4 4.18.8 Replacing the 15.0 Inch XGA Sharp Fluorescent Lamp Disassembling the 15.0 Inch XGA Sharp Fluorescent Lamp To disassemble the 15.0-inch XGA Sharp fluorescent lamp, follow the steps below and refer to figures 4-107 to 4-116. 1. Turn the LCD module face down, and remove the protection cover S (A), protection cover G (B), fixing tape (C) and fixing tape for lead wire (C). NOTE: 1) Be careful not to damage the TCP or chips.
4 Replacement Procedures 4.18 Fluorescent Lamp 2. Remove the four screws on the sides. Screw loosening torque: 1.2kg•cm Screw Screw Screw Screw Figure 4-108 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (2) 3. Turn the LCD module face up and remove the bezel (E). (3) Release the hook of the bezel from the lamp cover. (E) Bezel < Side view > Hook (1) Release the bezel from the four latches of the lamp cover. (2) Release the two latches (left and right) on the P-chassis.
4.18 Fluorescent Lamp 4 Replacement Procedures 4. Turn the LCD module face down and remove the two screws fixing the board. Then open the bent portion of the TCP of the board and remove the backlight. Screw loosening torque: 1.2kg•cm Screw Screw Figure 4-110 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (4) Do not hold the edge. Do not hold the edge. Raise the board and make this condition. Figure 4-111 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp 5. Turn the LCD module face up and remove the LCD panel (I) from the backlight unit (H). CAUTION: Wear finger sacks or gloves during the work not to soil or scratch the LCD panel or backlight unit. (I) LCD panel (H) Back light unit Figure 4-112 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 6. Turn the backlight unit (H) removed face down and remove the two screws (D) and lamp cover (J). NOTE: Be careful not to scratch or soil the sheets. (H) Backlight unit Screw loosening torque: 1.2kg•cm (D) Screw (D) Screw (J) Lamp cover Figure 4-113 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp 7. Turn the backlight unit face up and remove the upper diffusion sheet (K), lens sheet (L) and light guide (M). NOTE: Be careful not to scratch or soil the removed sheets or light guide to reuse them. Do not remove the reflection sheet under the light guide. (K) Upper diffusion sheet (L) Lens sheet (M) Light guide Figure 4-114 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (8) 8. Remove the four double-sided tapes (N, O, P, Q).
4.18 Fluorescent Lamp 4 Replacement Procedures 9. Turn the backlight unit face down and remove the lamp unit (R) from the P-chassis. CAUTION: When removing the lamp unit, be careful not to break the lamp, or bend the reflection sheet. P-chassis Lamp unit Figure 4-116 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp Assembling the 15.0 Inch XGA Sharp Fluorescent Lamp To assemble the 15.0 Inch Sharp XGA fluorescent lamp, follow the steps below and refer to figures 4-117 to 4-129. 1. Stick the four double-sided tapes (N, O, P, Q) on the P-chassis. Standard for edge of P-chassis (P) Do not make the P-chassis over this line. (N) 0 to 1 mm (Q) (O) Figure 4-117 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 2. Turn the backlight unit face down and install a new lamp unit (R) on the P-chassis. NOTE: When install the lamp unit (R), be careful not to bend or damage the reflection sheet. P-chassis (R) Lamp unit Figure 4-118 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (12) Z Z Install the lamp unit without floating. Install the reflection sheet as it is placed inside the reflector. Install the lead wire into this groove.
4 Replacement Procedures 4.18 Fluorescent Lamp 3. Install the lamp cover (J) on the backlight unit and secure it with the two screws (D). (J) Lamp cover Screw tightening torque: 1.0kg•cm (D) Screw (D) Screw Figure 4-120 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (14) 4. Install the light guide (M) on the backlight unit. Insert the light guide straight not to deform the reflector. Backlight unit (M) Light guide Figure 4-121 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 5. Place the lens sheet (L) and upper diffusion sheet (K) on the backlight unit with light guide. (K) Upper diffusion sheet (L) Lens sheet (M) Light guide Make sure there is no dust or scratch. Do not make any sheet over the edge of P-chassis. Figure 4-122 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (16) 6. Place the LCD panel (I) on the backlight unit (H). NOTE: Make sure there is no dust between the LCD panel and backlight unit.
4 Replacement Procedures 4.18 Fluorescent Lamp 7. Bend the TCP attaching to the source board and secure it with the two screws. Do not hold the edge. Do not hold the edge. Figure 4-124 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (18) Screw Screw Figure 4-125 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 8. Install the bezel (E) on the lamp cover and hook the four latches on the lamp cover and two latches on the P-chassis. (E) Bezel (1) Hitch the hook of the bezel on the rib of the P-chassis. < Side view > Hook (Lamp cover side) (2) Lean the bezel on the lamp cover without interference with the TCP. Figure 4-126 Replacing 15.0 Inch Sharp fluorescent lamp (XGA) (20) Make sure of mating of the bezel and the rib of the P-chassis.
4 Replacement Procedures 4.18 Fluorescent Lamp 9. Secure the sides of the unit with the four screws. Screw Screw Screw Screw Figure 4-128 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 10. Stick the protection cover G (B), protection cover S (A), fixing tape (C) and fixing tape for lead wire (C). Fit the cover according to the outline of the screw. (A) (C) (C) 0 to 0.5 mm (B) 0 to 1 mm Do not make the tape over the top of the module. The tape MUST NOT appear on the display. Stick the tape according to the outline of the LCD module. Make sure the tape does not appear on the side of the module. Figure 4-129 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp 4.18.9 Replacing the 15.0 Inch XGA CHIMEI Fluorescent Lamp Disassembling the 15.0 Inch XGA CHIMEI Fluorescent Lamp To disassemble the 15.0 inch XGA CHIMEI fluorescent lamp, follow the steps below and refer to figures4-130 to 4-135. 1. Remove the CU tape, yellow tape and protector film X. Protector film X Tape CU tape Figure 4-130 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 2. Remove the two screws (B) fixing the X-PCB. Then remove the eight screws (C) fixing the metal frame. Release the two hooks (A). (B) Screw Screw (B) (A) hook (C) (C) (C) (C) Detail (A) (C) Screw (C) (C) (A) hook (C) Figure 4-131 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp 3. Release the latch. NOTE: Remove the metal frame parallel no to damage it. Latch Metal frame Backlight Figure 4-132 Replacing 15.0 Inch CHIMEI fluorescent lamp (XGA) (3) 4. Remove the X-PCB. When removing the X-PCB, be careful not to damage the TCP. X-PCB Panel Back light unit Figure 4-133 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 5. Remove the three spacers from the BEFIII-M diffuser sheet. Remove the DEFIII-M diffuser sheet, BEFIII-T diffuser sheet and two tapes from the backlight unit in order. When removing the sheets, be careful not to damage them. BEFIII-M diffuser sheet BEMIII-T diffuser sheet Spacer Diffuser sheet LGP Backlight unit Reflector sheet Tape Tape Figure 4-134 Replacing 15.0 Inch CHIMEI fluorescent lamp (XGA) (5) 6. Remove the two screws.
4 Replacement Procedures 4.18 Fluorescent Lamp Assembling the 15.0 Inch XGA CHIMEI fluorescent lamp To assemble procedure of the 15.0 inch XGA CHIMEI fluorescent lamp, follow the reverse steps of the disassembling steps above.
4.18 Fluorescent Lamp 4 Replacement Procedures 4 4.18.10 Replacing the 15.0 Inch SXGA+ LG.Philips Fluorescent Lamp CAUTION: When you replace the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD module. Be careful not to let dust or other foreign substances into the LCD module. Disassembling the 15.0 Inch SXGA+ LG.Philips Fluorescent Lamp To disassemble the 15.0 inch SXGA+ LG.Philips fluorescent lamp, follow the steps below and refer to figures 4-136 to 4-139. 1.
4 Replacement Procedures 4.18 Fluorescent Lamp 2. Remove the top case. Be careful not to apply excessive force to the top case or gate TCP. Top case Figure 4-137 Replacing 15.0 Inch LG.Philips fluorescent lamp (SXGA+) (2) 3. Remove the source PCB and gate PCB. 1) Remove the source PCB. Be careful not to apply excessive force to the PCB or TCP when removing double-sided tape. 2) Remove the gate PCB. Be careful not to apply excessive force to the PCB or TCP when removing double-sided tape.
4.18 Fluorescent Lamp 4 Replacement Procedures 4. Remove the board assembly, adhesive tape, light guide and cover assembly bottom (L). 1) Remove the board assembly. NOTE: This process should be made in a clean room to prevent scratch or particle on polarizer or B/L assembly. 2) Remove the adhesive tape fixing the sheets (four points). 3) Remove the sheets and light guide. NOTE: No penetration of foreign object is indispensable not to scratch on the surface of each sheet.
4 Replacement Procedures 4.18 Fluorescent Lamp Assembling the 15.0 Inch SXGA+ LG.Philips Fluorescent Lamp To assembling the 15.0 inch SXGA+ LG.Philips fluorescent lamp, follow the steps below and refer to figures 4-100 to 4-103. 1. Install the cover assembly bottom (L), sheets, light guide, adhesive tape and board assembly. 1) Remove the protect sheet from the cover assembly bottom (L). 2) Secure the cover assembly bottom (L) with the two screws. NOTE: Maximum value of torque is 2.0kg•cm.
4.18 Fluorescent Lamp 4 Replacement Procedures 2. Install the source PCB and gate PCB. 1) Install the source PCB. Be careful not to apply excessive force to the TCP. 2) Install the gate PCB. Be careful not to apply excessive force to the TCP. Source PCB Gate PCB Figure 4-141 Replacing 15.0 Inch LG.Philips fluorescent lamp (SXGA+) (6) 3. Install the top case. Be careful not to apply excessive force to the gate TCP. Top case Figure 4-142 Replacing 15.0 Inch LG.
4 Replacement Procedures 4.18 Fluorescent Lamp 4. Stick the out side tape and cover shield. 1) Install the tape shield and adhesive tape to fix the top case. Be careful not to apply excessive force to the top case. 2) Install the cover shield (C). Be careful not to apply excessive force to the control PCB. CAUTION: Wear anti-static gloves to prevent circuit damage caused by ESC. 3) Install the cover shield (G). Be careful not to apply excessive force to the gate TCP.
4.18 Fluorescent Lamp 4.18.11 4 Replacement Procedures Replacing the 15.0 Inch SXGA+ Samsung Fluorescent Lamp Disassembling the 15.0 Inch SXGA+ Samsung Fluorescent Lamp CAUTION: When you replace the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD module. Be careful not to let dust or other foreign substances into the LCD module. To disassemble the 15.0 inch SXGA+ Samsung fluorescent lamp, follow the steps below and refer to Figures 4-144 to 4-152. 1.
4 Replacement Procedures 4.18 Fluorescent Lamp 2. Remove the two screws securing the PCB. Screw Screw Figure 4-145 Replacing 15.0 Inch Samsung fluorescent lamp (SXGA+) (2) 3. Remove the four screws from the top side of the chassis. Screw Screw Screw Screw Figure 4-146 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 4. Remove the four bottom hooks and five hooks (left and right). Then remove the top chassis from the mold frame. CAUTION: When you release hooks on the top chassis, be careful not to apply excessive force to the FL. The FL can be damaged easily. Side hook Side hook Bottom hook Figure 4-147 Replacing 15.0 Inch Samsung fluorescent lamp (SXGA+) (4) 5. Remove the panel assembly from the mold frame. Panel assembly Mold frame Figure 4-148 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp 6. Remove the two clips. Then remove the five sheets (prism sheet (L, U), diffusion sheet, LGP and reflection sheet). Clip Sheets Clip Figure 4-149 Replacing 15.0 Inch Samsung fluorescent lamp (SXGA+) (6) 7. Remove the two screws securing the lamp back cover. Then remove the lamp back cover. Screw Lamp back cover Screw Figure 4-150 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 8. Remove the lamp wire from the wire guide of the mold frame. Lamp wire Figure 4-151 Replacing 15.0 Inch Samsung fluorescent lamp (SXGA+) (8) 9. Remove the lamp assembly from the mold frame. Lamp assembly Mold frame Figure 4-152 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp Assembling the 15.0 Inch SXGA+Samsung Fluorescent Lamp The assembly procedure is the reverse of the above disassembly procedure.
4.18 Fluorescent Lamp 4 Replacement Procedures 4 4.18.12 Replacing the 15.0 Inch SXGA+ Sharp Fluorescent Lamp CAUTION: When you replace the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD module. Be careful not to let dust or other foreign substances into the LCD module. Disassembling the 15.0-inch SXGA+ Sharp Fluorescent Lamp To disassemble the 15.0 inch SXGA+ Sharp fluorescent lamp, follow the steps below and refer to Figures 4-153 to 4-162. 1.
4 Replacement Procedures 4.18 Fluorescent Lamp 2. Remove the four screws on the sides. Screw loosening torque: 1.1kg•cm Screw Screw Screw Screw Figure 4-154 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (2) 3. Turn the LCD module face up and remove the bezel (E). (3) Release the hook of the bezel from the lamp cover. (E) Bezel < Side view > Hook (1) Release the bezel from the four latches of the lamp cover. (2) Release the two latches on the P-chassis. Figure 4-155 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 4. Turn the LCD module face down. Remove four screws fixing the board and remove the FPC (G). Open the bent portion of the TCP of the board and remove the backlight. Screw loosening torque: 0.9kg•cm Screw Screw Screw Open the cap of the connector and remove the FPC. (G) FPC Screw Figure 4-156 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (4) Do not hold the edge. Do not hold the edge. Raise the board and make this condition.
4 Replacement Procedures 4.18 Fluorescent Lamp 5. Turn the LCD module face up and remove the LCD panel (I) from the backlight unit (H). NOTE: Wear finger sacks or gloves during the work not to soil or scratch the LCD panel or backlight unit. (I) LCD panel (H) Backlight unit Figure 4-158 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (6) 6. Turn the backlight unit (H) removed face down and remove two screws (D) and lamp cover (J). NOTE: Be careful not to scratch or soil the sheets.
4.18 Fluorescent Lamp 4 Replacement Procedures 7. Turn the backlight unit face up and remove the upper diffusion sheet (K), lens sheet (L) and light guide (M). NOTE: The light guide and sheets are reused. Be careful not to scratch or soil them. Do not remove the reflection sheet under the light guide. (K) Upper diffusion sheet (L) Lens sheet (M) Light guide Figure 4-160 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (8) 8. Remove the four double-sided tapes (N, O, P, Q).
4 Replacement Procedures 4.18 Fluorescent Lamp 9. Turn the backlight unit face down and remove the lamp unit (R) from the P-chassis. CAUTION: When removing the lamp unit, be careful not to break the lamp, or bend the reflection sheet. P-chassis (R) Lamp unit Figure 4-162 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures Assembling the 15.0 Inch SXGA+ Sharp Fluorescent Lamp To assemble the 15.0 inch SXGA+ Sharp fluorescent lamp, follow the steps below and refer to Figures 4-163 to 4-177. 1. Stick four double-sided tapes (N, O, P, Q) on the P-chassis. Standard for edge of P-chassis (P) Do not make the P-chassis over this line. (N) 0 to 1 mm (Q) (O) Figure 4-163 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (11) 2.
4 Replacement Procedures 4.18 Fluorescent Lamp P-chassis (R) Lamp unit Figure 4-164 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (12) NOTE: When install the lamp unit, be careful not to bend or damage the reflection sheet. Z Z Install the lamp unit without floating. Install the reflection sheet as it is placed inside the reflector. Install the lead wire into this groove. Cross-section drawing of Z-Z Figure 4-165 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 3. Install the lamp cover (J) on the backlight unit and secure it with the two screws. (J) Lamp cover (D) Screw (D) Screw Screw tightening torque: 0.9kg•cm Figure 4-166 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp 4. Install the light guide (M) on the backlight unit. Insert the light guide straight not to deform the reflector. (M) Light guide Backlight unit Figure 4-167 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (15) 5. Place the lens sheet (L) and upper diffusion sheet (K) on the backlight unit with light guide. (K) Upper diffusion sheet (L) Lens sheet (M) Light guide Make sure there is no dust or scratch.
4.18 Fluorescent Lamp 4 Replacement Procedures 6. Place the LCD panel (I) on the backlight unit (H). NOTE: Make sure there is no dust between the LCD panel and backlight unit. If any dust is found, remove it with crepe tape or others which has no remaining of paste. (I) LCD panel (H) Backlight Guide rib Guide rib Guide rib Guide rib unit Make sure the LCD panel installed in the guide rib surely. is Figure 4-169 Replacing 15.
4 Replacement Procedures 4.18 Fluorescent Lamp 7. Bend the TCP attaching to the source board and secure it with two screws. Then bend the TCP attaching to the gate board with two screws and insert the FPC (G) into the connector of the source board. Do not hold the edge. Do not hold the edge. Figure 4-170 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (18) Check the condition after mating. *Check the condition of the concave portion of the FPC and the outline of the connector.
4.18 Fluorescent Lamp 4 Replacement Procedures 8. Install the bezel (E) on the lamp cover. Attach four latches on the lamp cover and two latches on the P-chassis. (E) Bezel (1) Hitch the hook of the bezel on the rib of the P-chassis. < Side view > Hook (Lamp cover side) (2) Lean the bezel on the lamp cover without interference with the TCP. Figure 4-172 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (20) Make sure of mating of the bezel and the rib of the P-chassis.
4 Replacement Procedures 4.18 Fluorescent Lamp 9. Secure the sides of the unit with the four screws. Screw Screw Screw Screw Figure 4-174 Replacing 15.0 Inch Sharp fluorescent lamp (SXGA+) (22) 10. Stick the protection cover G (B). Outline standard for the gate board (B) Protection cover G Figure 4-175 Replacing 15.
4.18 Fluorescent Lamp 4 Replacement Procedures 11. Stick the protection cover S (A), fixing tape (C), fixing tape for lead wire (D). Stick to the side of the bezel. Fit the cover according to the outline of the screw. Fit the cover according to the outline of the screw. (A) Make sure the lead wire is closely attached to the bezel. 0 to 1 mm (D) (C) Stick the fixing tape at the center of the module. Do not make the tape over the top of the module. 0 to 0.
4 Replacement Procedures 4.18 Fluorescent Lamp Make sure the edge of plastic resin is between ± 0.5. Edge of plastic resin 0 to 1 mm 0 to 1 mm Standard for the outline of board Standard for the outline of screw (left and right) Figure 4-177 Replacing 15.
Appendices
Appendices App-ii Satellite A10/TECRA A1/Satellite Pro A10 Maintenance Manual (960-445)
Appendices Appendix Contents Appendix A Handling the LCD Module......................................................................... A-1 Appendix B Board Layout................................................................................................B-1 B.1 System Board Front View..............................................................................B-1 B.2 System Board Back View ..............................................................................
Appendices C.22 PJ8790 RTC Battery Connector (3-pin) .................................................... C-21 C.23 PJ8770 FAN I/F Connector (3-pin) ........................................................... C-21 C.24 PJ8800 DC-IN Connector (4-pin).............................................................. C-21 Appendix D Display Codes .............................................................................................. D-1 D.1 Display Codes ..............................................
Appendices Figures Figure B-1 System board layout (front) ...........................................................................B-1 Figure B-2 System board layout (back) ...........................................................................B-3 Figure E-1 Keyboard layout.............................................................................................E-1 Figure F-1 Parallel port wraparound connector ...............................................................
Appendices Table C-19 Speaker connector pin assignment (Right) (2-pin) ......................................C-20 Table C-20 Headphone connector pin assignment (6-pin) .............................................C-20 Table C-21 1st Battery connector pin assignment (10-pin) ............................................C-20 Table C-22 RTC Battery connector pin assignment (3-pin) ...........................................C-21 Table C-23 FAN I/F connector pin assignment (3-pin)........................
Apx. A Handling the LCD Module Appendices Apx. A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
Appendices Apx. A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4.
Apx. A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
Appendices Apx. A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
Apx. A Handling the LCD Module Appendices 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxime). These materials can release gas that can damage the panel’s polarization.
Appendices A-6 Apx.
Apx. B Board Layout Appendices Apx. B Appendix B Board Layout B.
Appendices Apx.
Apx. B Board Layout B.
Appendices Apx.
Apx. C Pin Assignment Appendices Apx. C Appendix C Pin Assignment System Board C.1 PJ1420 Memory 0 Connector (200-pin) Table C-1 Memory 0 connector pin assignment (200-pin) (1/4) Pin No. Signal name I/O Pin No.
Appendices Apx. C Pin Assignment Table C-1 Memory 0 connector pin assignment (200-pin) (2/4) Pin No. C-2 Signal name I/O Pin No.
Apx. C Pin Assignment Appendices Table C-1 Memory 0 connector pin assignment (200-pin) (3/4) Pin No. Signal name I/O Pin No. Signal Name I/O 121 SCS0-B2N I 122 SCS1-B2N I 123 N.C. - 124 N.C.
Appendices Apx. C Pin Assignment Table C-1 Memory 0 connector pin assignment (200-pin) (4/4) Pin No. C-4 Signal name I/O Pin No. Signal Name I/O 187 SDQ59R-B2P I/O 188 SDQ58R-B2P I/O 189 SDQ63R-B2P I/O 190 SDQ62R-B2P I/O 191 2R5-B2V - 192 2R5-B2V - 193 SMBDAT-P3P I/O 194 GND - 195 SMBCLK-P3P I 196 GND - 197 P3V - 198 GND - 199 N.C. - 200 N.C.
Apx. C Pin Assignment C.2 Appendices PJ1440 Memory 1 Connector (200-pin) Table C-2 Memory 1 connector pin assignment (200-pin) (1/4) Pin No. Signal name I/O Pin No.
Appendices Apx. C Pin Assignment Table C-2 Memory 1 connector pin assignment (200-pin) (2/4) Pin No. C-6 Signal name I/O Pin No.
Apx. C Pin Assignment Appendices Table C-2 Memory 1 connector pin assignment (200-pin) (3/4) Pin No. Signal name I/O Pin No. Signal Name I/O 121 SCS2-B2N I 122 SCS3-B2N I 123 N.C. - 124 N.C.
Appendices Apx. C Pin Assignment Table C-2 Memory 1 connector pin assignment (200-pin) (4/4) Pin No. C-8 Signal name I/O Pin No. Signal Name I/O 187 SDQ59R-B2P I/O 188 SDQ58R-B2P I/O 189 SDQ63R-B2P I/O 190 SDQ62R-B2P I/O 191 2R5-B2V - 192 2R5-B2V - 193 SMBDAT-P3P I/O 194 P3V - 195 SMBCLK-P3P I 196 GND - 197 P3V - 198 GND - 199 N.C. - 200 N.C.
Apx. C Pin Assignment C.3 Appendices PJ1800 Optical Drive I/F Connector (50-pin) Table C-3 Optical drive I/F connector pin assignment (50-pin) Pin No. Signal name I/O Pin No. Signal Name I/O 1 CDAUDL-PXP I 2 CDAUDR-PXP I 3 CD-GND - 4 N.C.
Appendices C.4 Apx. C Pin Assignment PJ1801 HDD I/F Connector (44-pin) Table C-4 HDD I/F connector pin assignment (44-pin) Pin No. C-10 Signal name I/O Pin No.
Apx. C Pin Assignment C.5 Appendices PJ2001 PC Card I/F Connector (68-pin) Table C-5 PC card I/F connector pin assignment (68-pin) (1/2) Pin No. Signal name I/O Pin No.
Appendices Apx. C Pin Assignment Table C-5 PC Card slot connector pin assignment (68-pin)(2/2) Pin No. C-12 Signal name I/O Pin No.
Apx. C Pin Assignment C.6 Appendices PJ2200 Mini PCI I/F Connector (124-pin) Table C-6 Mini PCI I/F connector pin assignment (124-pin) (1/2) Pin No. Signal name I/O Pin No. Signal Name I/O 1 N.C.. - 2 N.C. - 3 N.C. - 4 N.C. - 5 N.C. - 6 N.C. - 7 N.C. - 8 N.C. - 9 N.C. - 10 N.C. - 11 N.C. - 12 N.C. - 13 WLON-S3N I 14 N.C. - 15 GND - 16 N.C. - 17 PIROG-P3N I/O 18 P5V - 19 P3V - 20 PIRQD-P3N 21 N.C. - 22 N.C.
Appendices Apx. C Pin Assignment Table C-5 Mini PCI I/F connector pin assignment (124-pin) (2/2) Pin No. C-14 Signal name I/O Pin No.
Apx. C Pin Assignment C.7 Appendices PJ3000 MDC I/F Connector (30-pin) Table C-7 MDC I/F connector pin assignment (30-pin) Pin No. C.8 Signal name I/O Pin No. Signal Name I/O 1 N.C. - 2 MDC-GND - 3 MDC-GND - 4 PHONE-BXN O 5 N.C. - 6 N.C. - 7 N.C. - 8 MDC-GND - 9 N.C. - 10 N.C. - 11 N.C. - 12 N.C. - 13 N.C. - 14 N.C. - 15 MDC-GND - 16 MDC-B3V I 17 B3V - 18 N.C. - 19 MDC-GND - 20 MDC-GND - 21 N.C.
Appendices C.9 Apx. C Pin Assignment PJ3333 Keyboard Connector (34-pin) Table C-9 Keyboard connector pin assignment (34-pin) Pin No. Signal name I/O Pin No.
Apx. C Pin Assignment Appendices C.11 PJ3202 Parallel I/F Connector (25-pin) Table C-11 Parallel I/F connector pin assignment (25-pin) Pin No. Signal name I/O Pin No.
Appendices Apx. C Pin Assignment C.13 PJ4600 USB I/F Connector (8-pin) Table C-13 USB I/F connector pin assignment (8-pin) Pin No. Signal name 1 USBOPS-E5V 3 USBP0-S3P 5 USBOPS-E5V 7 USBP1-S3P I/O Pin No. Signal Name - 2 USBP0-S3N I/O 4 GND - 6 USBP1-S3N I/O 8 GND I/O I/O I/O - C.14 PJ5600 LCD I/F Connector (40-pin) Table C-14 LCD I/F connector pin assignment (40-pin) Pin No. C-18 Signal name I/O Pin No.
Apx. C Pin Assignment Appendices C.15 PJ5620 CRT I/F Connector (15-pin) Table C-15 Pin No. CRT I/F connector pin assignment (15-pin) Signal name I/O Pin No. Signal Name I/O 1 RED-PXP I 2 GREEN-PXP I 3 BLUE-PXP I 4 N.C. - 5 GND - 6 GND - 7 GND - 8 GND - 9 DDC-P5V - 10 GND - 11 N.C. - 12 DDCADA-P3P I/O 13 CRTEN-B3N O 14 VSYNC-P3P I/O 15 DDCACK-P3P I/O C.16 PJ5640 TV Connector (4-pin) Table C-16 Pin No.
Appendices Apx. C Pin Assignment C.18 PJ6000 Speaker Connector (Left) (3-pin) Table C-18 Pin No. Speaker connector (left) pin assignment (3-pin) Signal name I/O Pin No. 2 1 SPOLP-PXP I 3 SPOLM-PXN I Signal Name I/O - N.C. C.19 PJ6001 Speaker Connector (Right) (2-pin) Table C-19 Pin No. 1 Speaker connector (right) pin assignment (2-pin) Signal name I/O Pin No. I 2 SPORP-PXP Signal Name I/O I SPORM-PXN C.20 PJ6004 Headphone Connector (6-pin) Table C-20 Pin No.
Apx. C Pin Assignment Appendices C.22 PJ8790 RTC Battery Connector (3-pin) Table C-22 Pin No. RTC Battery connector pin assignment (3-pin) Signal name I/O Pin No. 2 1 S3V - 3 GND - Signal Name I/O N.C. - C.23 PJ8770 FAN I/F Connector (3-pin) Table C-23 Pin No. FAN I/F connector pin assignment (3-pin) Signal name I/O Pin No. 2 1 P5V - 3 FANG-P3P O Signal Name GND I/O - C.24 PJ8800 DC-IN Connector (4-pin) Table C-24 Pin No.
Appendices C-22 Apx.
Apx. D Keyboard Scan/Character Codes Apx. D Appendices Keyboard Scan/Character Codes Appendix D Display Codes D.
Appendices D-2 Apx.
Apx. E Key Layout Apx. E Appendices Key Layout Appendix E E.
Appendices Apx.
Apx.
Appendices E-4 Apx.
Apx. F Wiring Diagrams Appendices Apx. F Appendix F F.
Appendices F.2 Apx.
Apx. G BIOS/KBC/EC Update Apx. G Appendices BIOS Rewrite Procedures Appendix G BIOS/KBC/EC Update To update the BIOS, KBC or EC, insert the FD for update into the FDD. Then turn on the power of the computer while pressing the following key until the power LED blinks. For BIOS update: ~ For KBC or EC update: Tab (tilde key) When the update is completed, the message will appear and the beep will sound. Then the power of the computer is turned off. Make sure of the update using the T&D.
Appendices G-2 Apx.
Apx. H Reliability Apx. H Appendices Reliability Appendix H Reliability The following table shows the MTBF (Mean Time Between Failures) of system.
Appendices H-2 Apx.