Maintenance Manual

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[CONFIDENTIAL]

Toshiba Personal Computer

TECRA M10

Maintenance Manual

First edition July 2008

TOSHIBA CORPORATION

File Number 960-685

Summary of content (474 pages)

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Toshiba Personal Computer TECRA M10 Maintenance Manual First edition July 2008 TOSHIBA CORPORATION File Number 960-685 [CONFIDENTIAL]
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Copyright © 2008 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein. Toshiba Personal Computer TECRA M10 Maintenance Manual First edition July 2008 Disclaimer The information presented in this manual has been reviewed and validated for accuracy.
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Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer TECRA M10 The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field. SAFETY PRECAUTIONS Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.
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The manual is divided into the following parts: Chapter 1 Hardware Overview describes the TTECRA M10 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
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Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
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Table of Contents Chapter 1 Hardware Overview 1.1 Features ...................................................................................................................... 1-1 1.2 System Unit Block Diagram ...................................................................................... 1-9 1.3 3.5-inch Floppy Disk Drive (USB External) ........................................................... 1-15 1.4 2.5-inch Hard Disk Drive.............................................................
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Chapter 2 Troubleshooting Procedures 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart........................................................................................ 2-3 2.3 Power Supply Troubleshooting.................................................................................. 2-8 2.4 System Board Troubleshooting...............................................................
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Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ................................................................................... 3-4 3.3 Setting of the hardware configuration ....................................................................... 3-9 3.4 Heatrun Test.......................................................................................
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3.31 SETUP ..................................................................................................................... 3-79 Chapter 4 Replacement Procedures 4.1 Overview.................................................................................................................... 4-1 4.2 Battery pack ............................................................................................................. 4-12 4.3 SIM card...........................................................
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4.30 Smart card unit......................................................................................................... 4-92 4.31 LCD unit/FL inverter ............................................................................................... 4-94 4.32 Camera module/Wireless LAN antenna/3G antenna ............................................. 4-101 4.33 LCD harness........................................................................................................... 4-114 4.
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Chapter 1 Hardware Overview [CONFIDENTIAL]
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1 Hardware Overview 1-ii [CONFIDENTIAL] TECRA M10 Maintenance Manual (960-685)
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1 Hardware Overview Chapter 1 Contents 1.1 Features.......................................................................................................................1-1 1.2 System Unit Block Diagram.......................................................................................1-9 1.3 3.5-inch Floppy Disk Drive (USB External)............................................................1-15 1.4 2.5-inch Hard Disk Drive .....................................................................
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1 Hardware Overview Figures Figure 1-1 Front of the computer ....................................................................................1- 7 Figure 1-2 System unit configuration..............................................................................1- 8 Figure 1-3 System unit block diagram ............................................................................1- 9 Figure 1-4 3.5-inch FDD (USB External) .....................................................................
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1.1 Features 1.1 1 Hardware Overview Features The Toshiba TECRA M10 Personal Computer uses extensive Large Scale Integration (LSI), and Complementary Metal-Oxide Semiconductor (CMOS) technology extensively to provide compact size, minimum weight, low power usage and high reliability. This computer incorporates the following features. There some models and options. Refer to the Parts List for the configuration of each model and options.
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1 Hardware Overview 1.1 Features HDD The computer has a 2.5-inch SATA HDD. The following capacities are available. • 80/120/160/200/250 GB SSD Some models are equipped with a "Solid State Drive (SSD)" instead of a hard disk drive. • 64GB,128GB USB FDD A 3.5-inch USB FDD accommodates 2HD (1.44MB) or 2DD (720KB) disks. Optical Drive A DVD-ROM drive, DVD-ROM&CD-R/RW drive or DVD Super Multi drive (double layer) can be installed.
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1.1 Features 1 Hardware Overview Batteries The computer has two batteries: a rechargeable Lithium-Ion main battery pack and RTC battery (that backs up the Real Time Clock and CMOS memory. Universal Serial Bus (USB2.0) Three USB ports are provided. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported. eSATA/USB combo One eSATA/USB combo port, which complies to. The USB 2.0 standard is provided.
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1 Hardware Overview 1.1 Features ExpressCard slot(Not used) The internal ExpressCard slot is a Universal slot. This slot supports ExpressCard/54 and ExpressCard/34 modules. SmartCard Slot This computer (Some models) supports ISO7816-3 asynchronous cards (support protocols are T=0 and T=1) with a working voltage of 5V. Fingerprint sensor(Some models) The computer is equipped with a fingerprint sensor and fingerprint authentication utility.
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1.1 Features 1 Hardware Overview Internal modem The computer contains a MDC, enabling data and fax communication. It supports ITU-T V.90 (V.92). The transfer rates are 56 Kbps for data reception, 33.6 Kbps for data transmission, and 14,400 bps for fax transmission. However, the actual speed depends on the line quality. The RJ11 modem jack is used to accommodate a telephone line. Both of V.90 and V.92 are supported only in USA, Canada and Australia. Only V.90 is available in other regions.
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1 Hardware Overview 1.1 Features TOSHIBA Presentation button This button switches the display between internal display, external display, simultaneous display and multi-monitor display. TOSHIBA Assist button When this button is pressed during power-on, the PC is connected to "Toshiba Assist". When this button is pressed during power-off, the PC is turned on and connected to "Toshiba Assist".
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1.1 Features 1 Hardware Overview The front of the computer is shown in figure 1-1.
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1 Hardware Overview 1.1 Features The system unit configuration is shown in figure 1-2.
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1.2 System Unit Block Diagram 1.2 1 Hardware Overview System Unit Block Diagram Figure 1-3 is a block diagram of the system unit.
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1 Hardware Overview 1.2 System Unit Block Diagram The system unit is composed of the following major components: Microprocessor The TOSHIBA TECRA M10 computer is equipped with an Intel® CoreTM 2 Duo Processor. These processors incorporate a math co-processor, a 3MB or 6MB L2 cache memory. The PC comes in with one of the following speeds: Intel® CoreTM 2 Duo Processor (Penryn) • T9600 (2.80GHz) /T9400 (2.53GHz) In the case of Processor which built in 6MB L2 cache memory • P8600 (2.40GHz)/ P8400 (2.
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1.2 System Unit Block Diagram 1 Hardware Overview • North Bridge (Intel GM45/GL40-Cantiga (G) MCH) Meorom Processor System Bus Supports PCI Express Based Graphics Interface System Memory supports :DDR2-667／DDR2-800, 4GB max. DMI(Direct Media Interface: x4/x2, ASPM L0s, L1 states support) Power management control (DPST 4.0) • South Bridge (Intel ICH9M) -PCI Local Bus Specification, Revision 2.
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1 Hardware Overview 1.2 System Unit Block Diagram -Package 676 pin BGA (31 x 31mm) Card controller (R5C847) • - PCI Interface • - IEEE1394 Controller • - SD/MMC, Memory Stick, xD card Controller VGA controller The PC comes in with one of the following two types: • The internal graphics controller in North Bridge is used. • nVIDIA NB9M is used.
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1.2 System Unit Block Diagram 1 Hardware Overview Internal LAN Controller • Intel made only GigaBit Ether is used. • This controller has the following functions: – PCI-Ex connection – Controller ： 10/100 PC82562V, Gigabit Intel PC82566MC/MM(AMT) – Supports Gigabit Ethernet – One RJ45 port – WOL support – Magic Packet support – LED support Wireless LAN • One PCI Express Mini Card slot1 802.11b/g: Askey Atheros Latest W-LAN 802.11a/b/g/n: Intel Shirley Peak 802.
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1 Hardware Overview 1.2 System Unit Block Diagram EC/KBC (Embedded Controller/Keyboard Controller) • One Mitsubishi M306KAFCLPR micon chip functions as both EC and KBC. PSC (Power Supply Controller) • One TMP86FS49AUG chip is used. • This controller controls the power sources. Clock Generator • IDT 9LPR501 is used. • This device generates the system clock. Sensor 1-14 • Thermal Sensor: One ADM1032ARMZ chip is used.
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1.3 3.5-inch Floppy Disk Drive (USB External) 1.3 1 Hardware Overview 3.5-inch Floppy Disk Drive (USB External) The 3.5-inch FDD is a thin, high-performance reliable drive that supports 720KB (formatted) 2DD and 1.44MB (formatted) 2HD disks. The FDD is shown in figure 1-4. The specifications for the FDD are listed in Table 1-1. Figure 1-4 3.5-inch FDD (USB External) Table 1-1 3.
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1 Hardware Overview 1.4 1.4 2.5-inch Hard Disk Drive 2.5-inch Hard Disk Drive The removable HDD is a random access non-volatile storage device. It has a non-removable 2.5-inch magnetic disk and mini-Winchester type magnetic heads. The computer supports a 80GB, 120GB, 160GB, 200GB or 250GB. The HDD is shown in figure 1-5. Specifications are listed in Table 1-2. Figure 1-5 2.5-inch HDD Table 1-2 2.
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1.4 2.5-inch Hard Disk Drive 1 Hardware Overview Table 1-2 2.5-inch HDD specifications Specifications Items Outline Width (mm) Dimensio ns Height (mm) HGST HGST HGST HGST HGST G8BC00051 080 G8BC00051 120 G8BC00051 160 G8BC00046 200 G8BC0005 1250 100.2±0.25 9.5±0.2 Depth (mm) 69.85±0.
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1 Hardware Overview 1.5 1.5 Optical Drive (ODD) Optical Drive (ODD) 1.5.1 DVD-ROM Drive The DVD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) DVD-ROM. The specifications of the DVD-ROM are described in Table 1-3. Table 1-3 DVD-ROM drive specifications Specifications Item TEAC DV-28S-VT4 (G8CC00045590) Outline dimensions Width (mm) 128 (excluding projections) Height (mm) 12.7(excluding projections) Depth (mm) 129.
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1.5 Optical Drive (ODD) 1 Hardware Overview 1.5.2 DVD-ROM & CD-R/RW Drive The DVD-ROM & CD-R/RW drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15inch) CD-ROM, DVD-ROM and CD-R/RW. The specifications of the DVD-ROM & CD-R/RW drive are described in Table 1-4. Table 1-4 DVD-ROM & CD-R/RW drive specifications Specifications Item TEAC DW-224S-VT4 (G8CC00046520) Outline dimensions Width (mm) 128 (excluding projections) Height (mm) 12.7 (excluding projections) Depth (mm) 129.
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1 Hardware Overview 1.5 Optical Drive (ODD) 1.5.3 DVD-Super Multi Drive The DVD Super Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD-ROM, DVD-ROM, CD-R, CD-RW, DVD-R, DVD+R, DVD-RW, DVD+RW, DVDRAM, DVD-R DL and DVD+R DL. The specifications are listed in Table 1-5.
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1.5 Optical Drive (ODD) 1 Hardware Overview Table 1-5 DVD Super Multi drive outline dimensions Item Specifications TEAC DV-W28S* (G8CC0004712L/120) Outline dimensions Width (mm) 128 (excluding projections) Height (mm) 12.7 (excluding projections) Depth (mm) 129.4 (excluding projections) Mass (g) 180 or less Data transfer speed (Read) DVD-ROM CD-ROM Data transfer speed (Write) CD-R CD-RW DVD-R DVD-RW DVD-R DL DVD+R DVD+R DL DVD+RW DVD-RAM Max. 8x CAV Max. 24x CAV Max. 24x ZCLV Max.
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1 Hardware Overview 1.6 1.6 Keyboard Keyboard The keyboard is mounted 85(US)/87(UK) keys that consist of character key and control key, and in conformity with JIS. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-7 is a view of the keyboard. See Appendix E about a layout of the keyboard.
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1.7 TFT Color Display 1.7 1 Hardware Overview TFT Color Display The TFT color display consists of 15.4-inch or 14.1-inch WXGA/WXGA+ LCD module and FL inverter board. 1.7.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 16M colors with 1,280 x 800 or 1,680x1050 resolution. The Intel Crestline-GM can control internal and external WXGA or WXGA+ support displays simultaneously.
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1 Hardware Overview 1.7 TFT Color Display Table 1-6 LCD module specifications Specifications Item 14.1-inch WXGA TFT LG (G33C0004Q110) Number of Dots 1,280 (W) x 800 (H) Dot spacing (mm) Display range (mm) 0.2373(H)×0.2373(V) 303.74(W) × 189.84(H) Table 1-6 LCD module specifications Specifications Item 14.1-inch WXGA+ TFT Samsung (G33C00043110) 1440(W) × 900(H) Number of Dots 1-24 Dot spacing (mm) 0.2109(H)×0.2109(V) Display range (mm) 303.
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1.7 TFT Color Display 1.7.2 1 Hardware Overview FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module. Table 1-7 lists the FL inverter board specifications. Table 1-7 FL inverter board specifications Item Specifications G71C0006AAT0 Input Output Voltage (V) DC 5 Power (W) 7 Voltage (V) 750rms Current (mA) 5.
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1 Hardware Overview 1.8 1.8 Power Supply Power Supply The power supply supplies many different voltages to the system board and performs the following functions: 1. Judges that the DC power supply (AC adapter) is connected to the computer. 2. Detects DC output and circuit malfunctions. 3. Controls the battery icon, and DC IN icon. 4. Turns the battery charging system on and off and detects a fully charged battery. 5. Turns the power supply on and off. 6.
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1.8 Power Supply 1 Hardware Overview Table 1-8 Power supply output rating ACPI state M state Wakeup Powe r line name P S3/S4/S5 M1 - S3 Moff WOL S3 Moff No WOL S4/S5 Moff WOL S4/S5 Moff No WOL G3 Voltage [V] Name * * 1.05 PPV IGD-PGV 1R05-P1V × × × × × × × × × × × × × × × × × × 1.50 1R5-P1V × × × × × × 1.80 1R8-P1V × × × × × × 3.3 5.
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1 Hardware Overview 1.9 1.9 Batteries Batteries The computer has three types of batteries as follows: Main battery pack RTC battery The battery specifications are listed in Table 1-9. Table 1-9 Battery specifications Battery name Main battery Material Capacity battery G71C00083110/210 Lithium-Ion 10.8 V 4,000 mAh battery G71C00084910/A10 Lithium-Ion 10.8 V 5,100 mAh Extended Capacity battery G71C0006B110/210 Lithium-Ion 10.8 V Lithium-Ion 10.8 V NiMH 2.
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1.9 Batteries 1.9.2 1 Hardware Overview Battery Charging Control Battery charging is controlled by a power supply microprocessor. The microprocessor controls whether the charge is on or off and detects a full charge when the AC adaptor and battery are attached to the computer. The system charges the battery. Battery Charge When the AC adaptor is attached, there are two types of charge: When the system is powered off and when the system is powered on.
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1 Hardware Overview 1.9 Batteries Data preservation time When turning off the power in being charged fully, the preservation time is as following Table 1-11. Table 1-11 Data preservation time Condition 1.9.
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1.10 AC Adapter 1 Hardware Overview 1.10 AC Adapter The AC adapter is also used to charge the battery. Table 1-13 lists the AC adapter specifications. Table 1-13 AC adapter specifications Parameter Specification G71C0006Q210 (2-pin) Power Input voltage Input frequency Input current B Output voltage Output current TECRA M10 Maintenance Manual (960-685) G71C0006R210 (3-pin) 75W (Peak 90W) 100V/240V 50Hz to 60Hz 1.
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1 Hardware Overview 1-32 1.
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Chapter 2 Troubleshooting Procedures [CONFIDENTIAL]
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2 Troubleshooting Procedures 2 2-ii [CONFIDENTIAL] TECRA M10 Maintenance Manual (960-685)
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2 Troubleshooting Procedures Chapter 2 Contents 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart........................................................................................ 2-3 2.3 Power Supply Troubleshooting.................................................................................. 2-8 2.4 2.5 2.6 2.7 2.8 Procedure 1 Power Status Check ...........................
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2 Troubleshooting Procedures 2.9 2.10 2.11 2.12 2.13 2.14 2.15 2.16 2.17 2-iv Display Troubleshooting.......................................................................................... 2-46 Procedure 1 External Monitor Check....................................................... 2-46 Procedure 2 Diagnostic Test Program Execution Check ......................... 2-46 Procedure 3 Connector and Cable Check.................................................
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2 Troubleshooting Procedures 2.18 2.19 2.20 Fingerprint sensor .................................................................................................... 2-63 Procedure 1 Setting Windows Log-ON password ................................... 2-64 Procedure 2 Registration of fingerprint.................................................... 2-64 Procedure 3 Authentication of fingerprint ............................................... 2-65 Procedure 4 Connector Check and Replacement Check......
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2 Troubleshooting Procedures 2-vi [CONFIDENTIAL] TECRA M10 Maintenance Manual (960-685)
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2.1 Troubleshooting 2 Troubleshooting Procedures 2 2.1 Troubleshooting Chapter 2 describes how to determine which Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. (The “FRU” means the replaceable unit in the field.) The FRUs covered are: 1. Power supply 2. System Board 3. USB FDD 4. 2.5” HDD 5. Keyboard 6. Touch pad 7. Display 8. 9. 10. 11. 12. 13. 14. Optical Disk Drive Modem LAN Wireless LAN Bluetooth Sound Bridge Media slot 15. 16. 17. 18.
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2 Troubleshooting Procedures 2.1 Troubleshooting There are following two types of connections in the figure of board and module connection in and after 2.3 Power Supply Troubleshooting. (1) Cable connection is described in the figure as line. (2) Pin connection is described in the figure as arrow.
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2.2 Troubleshooting Flowchart 2.2 2 Troubleshooting Procedures Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which troubleshooting procedures to execute. Before going through the flowchart steps, verify the following: Ask him or her to enter the password if a password is registered. Verify with the customer that Toshiba Windows is installed on the hard disk. NonWindows operating systems can cause the computer to malfunction.
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2 Troubleshooting Procedures 2.
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2.
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2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart If the diagnostics program cannot detect an error, the problem may be intermittent. The Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error(s), then perform the appropriate troubleshooting procedures as follows: 1.
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2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures 15. If a malfunction is detected on the fingerprint sensor, perform the Fingerprint Sensor Troubleshooting Procedures in Section 2.18. 16. If a malfunction is detected on the Web camera, perform the Web camera Troubleshooting Procedures in Section 2.19. 17. If a malfunction is detected on the Intel Turbo Memory, perform the Intel Turbo Memory Troubleshooting Procedures in Section 2.20.
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2 Troubleshooting Procedures 2.3 2.3 Power Supply Troubleshooting Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
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2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Table 2-2 DC IN icon DC IN icon Power supply status Lights blue DC power is being supplied from the AC adapter. Blinks orange Power supply malfunction*1 Doesn’t light Any condition other than those above. *1 When the power supply controller detects a malfunction, the DC IN icon blinks orange. It shows an error code. When the icon is blinking, perform the following procedure. 1. Remove the battery pack and the AC adapter. 2.
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2 Troubleshooting Procedures Procedure 2 2.3 Power Supply Troubleshooting Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below. Start Off for 2 seconds Error code (8 bit) “1” On for one second “0” On for half second Interval between data bits Off for half second The error code begins with the least significant digit. Example: Error code 11h (Error codes are given in hexadecimal format.
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2.3 Power Supply Troubleshooting Check 1 2 Troubleshooting Procedures Convert the DC IN icon blink pattern into the hexadecimal error code and compare it to the tables below. Then go to Check 2.
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2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Main Battery Error code Meaning 22h Main battery discharge current is over 0.5A. 23h Main battery charge current is over 4.3A. 24h The compensation value of [0A] is not within the limits from design data (± 400mA). 25h Main battery charge current is over 0.3A when the charging is off. 2nd Battery Error code Meaning 32h Second battery discharge current is over 0.5A. 33h Second battery charge current is over 2.7A.
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2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures E3V output Error code Meaning 60h E3V voltage is over 3.96V. 61h E3V voltage is under 2.81V when the computer is powered on. 62h E3V voltage is under 2.81V when the computer is booting up. 64h E3V voltage is under 2.81V when EV power is maintained. 1R8-E1V output Error code Meaning 70h 1R8-E1V voltage is over 2.16V. 71h 1R8-E1V voltage is under 1.53V when the computer is powered on. 72h 1R8-E1V voltage is under 1.
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2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting 1R05M-E1V output Error code Meaning A0h 1R05M-E1V voltage is over 1.26V. A1h 1R05M-E1V voltage is under 0.89V when the computer is powered on. A2h 1R05M-E1V voltage is under 0.89V when the computer is booting up. 1R8-E1V output Error code Meaning B0h 1R8-E1V voltage is over 2.16V. B1h 1R8-E1V voltage is under 1.53V when the computer is powered on. B2h 1R8-E1V voltage is under 1.53V when the computer is booting up.
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2.3 Power Supply Troubleshooting Check 2 2 Troubleshooting Procedures In the case of error code 10h or 12h: Make sure the AC adapter and AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet. If the cables are connected firmly, go to the following step. Connect a new AC adapter and AC power cord. If the problem still occurs, go to Procedure 5. Check 3 In the case of error code 21h: Go to Procedure 3. Check 4 For any other errors, go to Procedure 5.
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2 Troubleshooting Procedures Procedure 3 2.3 Power Supply Troubleshooting Connection Check The wiring diagram related to the power supply is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Make sure the AC adapter and the AC power cord are firmly plugged into the DC IN jack and wall outlet. If these cables are connected firmly, go to Check 2. Check 2 Replace the AC adapter and the AC power cord with new ones.
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2.3 Power Supply Troubleshooting Procedure 5 2 Troubleshooting Procedures Replacement Check The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4, Replacement Procedures. When AC adapter is connected: Check 1 AC adapter may be faulty. Replace the AC adapter with a new one. If the problem still occurs, perform Check 2.
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2 Troubleshooting Procedures 2.4 2.4 System Board Troubleshooting System Board Troubleshooting This section describes how to determine if the system board is malfunctioning or not. Start with Procedure 1 and continue with the other procedures as instructed.
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2.4 System Board Troubleshooting Procedure 1 2 Troubleshooting Procedures Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it. If an error message is shown on the display, perform Check 1. If there is no error message, go to Procedure 2. If MS-DOS or Windows OS is properly loaded, go to Procedure 4.
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2 Troubleshooting Procedures Check 3 2.4 System Board Troubleshooting The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (23) or (24) is displayed, go to Procedure 4. If error message (18) is displayed, go to the Keyboard Troubleshooting Procedures. If error message (19), (20) or (21) is displayed, go to the HDD Troubleshooting Procedures.
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2.4 System Board Troubleshooting Procedure 2 2 Troubleshooting Procedures Serial Port Check or Debugging Port Check Check the D port status by a debug port test. The tool for serial port or debug port test is shown below. Serial Port model (W3270 short) Not a Serial Port model Figure 2-2 A set of tool for debug port test 1. Serial Port model should make " W3270 " of Swich board is made to short-circuit with a wire. As for theposition of W3270 is refer to Appendix B. 2.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting 4. Boot the computer in MS-DOS mode. 5. Execute GETDPORT.COM in the text menu in CPU REAL mode. (Insert the FD for starting D port into FDD and input “FD starting drive:>dport”.) The D port status is displayed in the following form; 6. When the D port status is FFFFh (normal status), go to Procedure 4. 7. When the D port status falls into any status in Table 2-4, execute Check 1.
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Debug port error status (1/8) System BIOS Boot block processing CPU setup MCH initialization ICH initialization EC access check setup of PIT Initialization of ICH and Super I/O BIOS ROM check F000 Problematic to BIOS ROM data.
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2 Troubleshooting Procedures 2.
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2.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-7 Debug port error status (4/8) F113 Display check ICH(CMOS) IC1600 (ICH) Display setup ICH(CMOS) VGA IC1200 (VGA) IC5000 (VGA(nVIDA)) IC1600 (ICH) ICH(CMOS) RAM CN1400 (RAM Conn.) CN1410 (RAM Conn.) IC1600 (ICH) CPU RAM IS1050 (CPU Socket) CN1400 (RAM Conn.) CN1410 (RAM Conn.) ICH(CMOS) RAM CN1400 (RAM Conn.) CN1410 (RAM Conn.
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2.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-9 Debug port error status (6/8) System BIOS SUSPEND processing Suspension processing F139 start Preparation before F13A EC/KBC(EC) suspension processing CPU setup F13B It branches to Resume CPU (F13C)/Boot (F141).
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2.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-11 Debug port error status (8/8) F131 EC/KBC(EC) VGA ICH(USB controller) RAM ICH(DMAC) ICH(CMOS,MEM I/OS,PIT controller PIC controller) EC/KBC(EC,KBC) RAM BIOSROM CPU IC3200 (EC/KBC) IC1600 (ICH) CN1400 (RAM Conn.) CN1410 (RAM Conn.
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures NOTE: Status outputted by the test means the last error detected in the debug port test. Check 1 If the D port is status F11Eh or F120h is displayed, go to “HDD Trouble shooting Procedure in Section 2.6. Check 2 If any other D port status error code is displayed, perform Procedure 3.
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2 Troubleshooting Procedures Procedure 3 2.4 System Board Troubleshooting Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test 6. Printer test [It is not supported] 7. Async test 8. Hard Disk test 9. Real Timer test 10. NDP test 11.
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2.5 USB FDD Troubleshooting 2.5 2 Troubleshooting Procedures USB FDD Troubleshooting To check if the USB FDD is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: FDD Head Cleaning Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector Check and Replacement Check Procedure 1 FDD Head Cleaning Check FDD head cleaning is one option available in the Diagnostic Program.
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2 Troubleshooting Procedures Procedure 2 2.5 USB FDD Troubleshooting Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled. Floppy disk drive test error codes and their status names are listed in Table 2-7.
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2.5 USB FDD Troubleshooting Procedure 3 2 Troubleshooting Procedures Connector Check and Replacement Check USB FDD is connected to USB port on system board. The connection of the cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks. USB FDD can be connected to the following 4 ports.
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2 Troubleshooting Procedures 2.5 USB FDD Troubleshooting Check 2 Connect USB FDD to other USB port and check if it works properly. If it does not work properly, perform Check 3 Check 3 USB FDD may be faulty. Replace it with a new one. If the problem still occurs, perform Check 4 Check 4 System board and USB / MDC board may be faulty. Replace it with a new one following the steps in Chapter 4, Replacement Procedures.
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2.6 2.5” HDD Troubleshooting 2.6 2 Troubleshooting Procedures 2.5” HDD Troubleshooting To check if the 2.5” HDD is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Partition Check Procedure 2: Message Check Procedure 3: Format Check Procedure 4: Diagnostic Test Program Execution Check Procedure 5: Connector Check and Replacement Check CAUTION: The contents of the hard disk will be erased when the 2.5”HDD troubleshooting procedures are executed.
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2 Troubleshooting Procedures Procedure 2 2.6 2.5” HDD Troubleshooting Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen. Make sure no floppy disk is in the FDD. Turn on the computer and check the message on the screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with Check 1 below and perform the other checks as instructed.
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2.6 2.5” HDD Troubleshooting Procedure 3 2 Troubleshooting Procedures Format Check The computer’s HDD is formatted using the DOS FORMAT program or the physical format program of the test program. To format the HDD, start with Check 1 below and perform the other steps as required. Refer to the DOS Manual for the operation of DOS. For the format by the test program, refer to the Chapter 3. Check 1 Format the 2.5” HDD using DOS FORMAT command. Type as FORMAT C: /S/U. If the 2.
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2 Troubleshooting Procedures Procedure 4 2.6 2.5” HDD Troubleshooting Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. The error codes and statuses are described in Table 2-8.
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2.6 2.5” HDD Troubleshooting Procedure 5 2 Troubleshooting Procedures Connector Check and Replacement Check The SATA HDD may be disconnected, or the SATA HDD, HDD cable or system board may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: Check 1 Make sure the SATA HDD is firmly connected to CN1900 on the system board. If any of the connections are loose, reconnect firmly and repeat Procedure 1.
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2 Troubleshooting Procedures 2.7 2.7 Keyboard Troubleshooting Keyboard Troubleshooting To check if the computer’s keyboard is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test (DIAGNOSTIC TEST) and Pressed key display test (ONLY ONE TEST) in the Diagnostic Program.
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2.7 Keyboard Troubleshooting Procedure 2 2 Troubleshooting Procedures Connector Check and Replacement Check The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure keyboard cable is firmly connected to system board. If the connection is loose, reconnect firmly and repeat Procedure 1. If the problem still occurs, go to Check 2.
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2 Troubleshooting Procedures 2.8 2.8 Touch pad Troubleshooting Touch pad Troubleshooting To check if the computer’s touch pad is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Touch pad test (ONLY ONE TEST) in the Diagnostic Program.
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2.8 Touch pad Troubleshooting Procedure 2 2 Troubleshooting Procedures Connector Check and Replacement Check The connection of the cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the cables are firmly connected to the Finger/pad button board and system board. If the connection is loose, reconnect firmly and repeat Procedure 1.
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2 Troubleshooting Procedures 2.9 2.9 Display Troubleshooting Display Troubleshooting To check if the computer’s display is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: External Monitor Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector and Cable Check Procedure 4: Replacement Check Procedure 1 External Monitor Check Connect an external monitor to the computer’s external monitor port, then boot the computer.
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2.9 Display Troubleshooting Procedure 3 2 Troubleshooting Procedures Connector and Cable Check LCD Module is connected to system board by an LCD/FL cable. FL inverter board is also connected to system board by an LCD/FL cable. In addition, fluorescent lamp is connected to FL inverter board by HV cable. Their cables may be disconnected from system board or FL inverter board. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures.
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2 Troubleshooting Procedures Procedure 4 2.9 Display Troubleshooting Replacement Check Fluorescent lamp, FL inverter, LCD module, HV cable and LCD/FL cable are connected to display circuits. Any of these components may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: If fluorescent lamp does not light, perform Check 1.
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2.10 Optical Disk Drive Troubleshooting 2 Troubleshooting Procedures 2.10 Optical Disk Drive Troubleshooting To check if optical disk drive is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the CD-ROM/DVD-ROM Test in the Diagnostic Program.
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2 Troubleshooting Procedures 2.10 Optical Disk Drive Troubleshooting Check 2 The SATA ODD may be damaged. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures and check the operation. If the problem still exists, perform Check 3. Check 3 The ODD FPC may be damaged. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still exists, perform Check 4. Check 4 System board may be faulty.
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2.11 Modem Troubleshooting 2 Troubleshooting Procedures 2.11 Modem Troubleshooting To check if modem is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute Modem test in the LAN/Modem/Bluetooth/IEEE1394 test program.
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2 Troubleshooting Procedures 2.11 Modem Troubleshooting Check 2 Modem cable or MDC cable may be faulty. Replace it with a new one. If the problem still occurs, perform Check 3. Check 3 MDC may be faulty. Replace it with a new one following the steps in Chapter 4, Replacement Procedure. If the problem still occurs, perform Check 4. Check 4 USB/MDC board or the cable may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures.
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2.12 LAN Troubleshooting 2 Troubleshooting Procedures 2.12 LAN Troubleshooting To check if the computer’s LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute LAN test in the LAN/Modem/Bluettoth/IEEE1394 test program.
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2 Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting 2.13 Wireless LAN Troubleshooting To check if the computer’s Wireless LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting-Receiving Check Procedure 2: Antennas’ Connection Check Procedure 3: Replacement Check Procedure 1 Transmitting-Receiving Check Before starting the test, make sure the wireless communication switch is set in the ON position.
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2.13 Wireless LAN Troubleshooting Procedure 2 2 Troubleshooting Procedures Antennas' Connection Check The wireless LAN function-wiring diagram is shown below: Any of the connections may be defective. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless communication switch is “On”. If the switch is “Off”, turn it “On”. If the problem still occurs, perform Check 2.
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2 Troubleshooting Procedures Procedure 3 2.13 Wireless LAN Troubleshooting Replacement Check Wireless LAN card, wireless LAN antenna or system board may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 Wireless LAN antenna may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 2.
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2.14 Bluetooth Troubleshooting 2 Troubleshooting Procedures 2.14 Bluetooth Troubleshooting To check if the Bluetooth is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connection Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Make sure the wireless switch on the left side of the computer is turned “On”.
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2 Troubleshooting Procedures 2.14 Bluetooth Troubleshooting Check 2 The Bluetooth module may be damaged. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures and check the operation. If the problem still exists, perform Check 3. Check 3 The Bluetooth cable may be damaged. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still exists, perform Check 4. Check 4 The system board may be damaged.
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2 Troubleshooting Procedures 2.15 Sound Troubleshooting 2.15 Sound Troubleshooting To check if the sound function is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Sound test in Sound Test program disk.
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2 Troubleshooting Procedures Procedure 3 2.15 Sound Troubleshooting Replacement Check If headphone does not work properly, perform check 1. If external microphone does not work properly, perform check 2. If internal microphone does not work properly, perform check 3. If Speaker Right does not work properly, perform check 5. If Speaker Left does not work properly, perform check 6. Check 1 Headphone may be faulty.
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2 Troubleshooting Procedures 2.16 Bridge media Slot Troubleshooting 2.16 Bridge media Slot Troubleshooting This section describes how to determine if the computer's Bridge media functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
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2 Troubleshooting Procedures 2.17 PCI ExpressCard Slot Troubleshooting 2.17 PCI ExpressCard Slot Troubleshooting This section describes how to check PCI ExpressCard slot by inspecting a card with PCI Express interface and a card with USB 2.0 interface. 1. Gigabit Ether ExpressCard 2. USB2.0 5in1 ExpressCard 1. Gigabit Ether ExpressCard (1) Insert the Gigabit Ether ExpressCard into the ExpressCard slot. (2) On Windows, open System Property → Hardware → Device Manager window.
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2 Troubleshooting Procedures 2.18 Fingerprint sensor Troubleshooting 2.18 Fingerprint sensor Troubleshooting CAUTION: To delete the account for confirming the fingerprint operation, it is necessary to log on by the account with the management authority. If the password has been set to log on, ask the Log-ON password to the user. To check if the Fingerprint sensor works correctly or not, follow the troubleshooting procedures below as instructed.
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2 Troubleshooting Procedures Procedure 1 2.18 Fingerprint sensor Troubleshooting Setting Windows Log-ON password 1. Open [User Account] from [Control Panel]. 2. Click [User Account]. 3. Click the icon of the account (user’s name) that you want to set the password. 4. Click “Create Account”. 5. Type a password in “Type a new password”. 6. Press Tab key. 7. Type the password again. 8. Click “Create Password” button. 9.
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2 Troubleshooting Procedures 2.18 Fingerprint sensor Troubleshooting 7. When the Store to Sensor screen is displayed, check Store fingerprint to Sensor. Click Finish to complete fingerprint registration. Procedure 3 Authentication of fingerprint 1. Turn on the computer to start up Windows. 2. In the Windows logon window, put lightly the first joint of your finger registered and slide your finger sideways. When authenticated, [Success] is displayed in the fingerprint authentication display.
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2 Troubleshooting Procedures Procedure 4 2.18 Fingerprint sensor Troubleshooting Connector Check and Replacement Check The connection of the cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the cables are firmly connected to the Finger/pad board and system board. If the connection is loose, reconnect firmly and repeat Procedure 1.
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2 Troubleshooting Procedures 2.19 Web camera Troubleshooting 2.19 Web camera Troubleshooting To check if the computer’s web camera is malfunctioning or not, follow the troubleshooting procedures below as instructed.
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2 Troubleshooting Procedures 2.19 Web camera Troubleshooting Check 2 If web camera does not work properly(the image from a web camera cannot be displayed. ), web camera may be faulty. Replace it with a new one following the steps in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 3 Check 3 System board may be faulty. Replace it with a new one following the step in Chapter 4 Replacement Procedures.
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2 Troubleshooting Procedures 2.20 Intel Turbo Memory Troubleshooting 2.20 Intel Turbo Memory Troubleshooting To check if Intel Turbo Memory is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Check on Windows OS Procedure 2: Connector Check and Replacement Check Procedure 1 Check on Windows OS Use the software, Intel Turbo Memory Console, which is originally prepared in the computer to check if the Intel Turbo Memory is operating without problems.
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2 Troubleshooting Procedures 2.20 Intel Turbo Memory Troubleshooting If any problems are found, perform the Procedure 2. Procedure 2 Connector Check and Replacement Check The connection of Intel Turbo Memory card may be faulty or the card may be defective. Disassemble the computer following the steps described in Chapter 4 and perform the following checks. Check 1 Check the following connection. To disassemble the computer for the check, follow the steps described in Chapter 4.
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Chapter 3 Tests and Diagnostics [CONFIDENTIAL]
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3 Tests and Diagnostics 3 3-ii [CONFIDENTIAL] TECRA M10 Maintenance Manual (960-685))
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3 Tests and Diagnostics Chapter 3 3.1 3.2 Contents The Diagnostic Test ................................................................................................... 3-1 3.1.1 Diagnostics menu ................................................................................. 3-1 3.1.2 H/W (Hardware) initial information setting tool.................................. 3-2 3.1.3 Heatrun test program............................................................................
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3 Tests and Diagnostics 3.20 3.21 3.22 3.23 3.24 3.25 ONLY ONE TEST................................................................................................... 3-40 3.21.1 Program Description .......................................................................... 3-40 3.21.2 Operations .......................................................................................... 3-40 Head Cleaning...............................................................................................
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3 Tests and Diagnostics Tables Table 3-1 Subtest names .................................................................................................... 3-11 Table 3-2 Error codes and error status names .................................................................... 3-35 Table 3-3 Hard disk controller status register contents...................................................... 3-38 Table 3-4 HDC Error register contents ..............................................................................
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3 Tests and Diagnostics 3-vi [CONFIDENTIAL] TECRA M10 Maintenance Manual (960-685))
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3.1 The Diagnostic Test 3 Tests and Diagnostics 3 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
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3 Tests and Diagnostics REAL TIMER TEST NDP TEST EXPANSION TEST CD-ROM/DVD-ROM TEST ERROR RETRY COUNT SET 3.1 The Diagnostic Test [FDD & HDD] Other tests are: Wireless LAN TEST (Wireless LAN TEST disk) LAN/Modem/Bluetooth/IEEE1394 TEST (LAN/Modem/Bluetooth/IEEE1394 TEST disk) Sound TEST (Sound TEST disk) You will need the following equipment to perform some of the Diagnostic test programs.
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3.1 The Diagnostic Test 3 Tests and Diagnostics The Diagnostics Disk (Main T&D) 3.1.3 Heatrun test program The heatrun test starts automatically after the selection. You will need the following equipment to perform this program.
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3 Tests and Diagnostics 3.2 3.2 Executing the Diagnostic Test Executing the Diagnostic Test To start the Repair test program, follow these steps: 1. Insert the Repair test program disk in the USB floppy disk drive or Optical disk drive. 2. Turn on the computer while pressing U key. The following menu appears. NOTE: The following menu is an example when Repair test program is performed from the floppy disk. Repair test program V*.** 1. DMI Entry utirity 2. Repair Heatrun (T&D) 3.
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3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 3.2.1 Diagnostics menu (T&D) Set the highlight bar to 3, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp. 20XX DIAGNOSTICS MENU : 1 2 3 4 5 6 7 8 9 – - DIAGNOSTIC TEST ONLY ONE TEST HEAD CLEANING LOG UTILITIES RUNNING TEST FDD UTILITIES SYSTEM CONFIGURATION EXIT TO MS-DOS NOTE: To exit the DIAGNOSTIC TEST MENU, press the Esc key.
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3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Set the highlight bar to 1, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp.
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3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Select the option you want to execute and press Enter. When you select 1SYSTEM TEST, the following message will appear: SYSTEM TEST NAME SUB-TEST PASS COUNT WRITE DATA ADDRESS : : : : XXXXXX XX XXXXX XX XXXXXX xxxxxxx DIAGNOSTIC TEST VX.
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3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Use the up and down arrow keys to move the cursor to “ERROR STOP”. Use the right and left arrow keys to move the cursor to the desired option and press Enter.
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3.3 Setting of the hardware configuration 3.3 3 Tests and Diagnostics Setting of the hardware configuration To execute this program, input 1 in the startup menu. Then press Enter to select the (2)Initial config set. The H/W initial information setting tool consists of four subtests. Input the number you want to execute and press Enter. NOTE: Connect USB FDD, when you perform the Repair test program from the CDROM. DMI information on the subtest 02 is written in floppy disk.
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3 Tests and Diagnostics 3.3 Setting of the hardware configuration 7. “Create DMIINFO TXT (Y/N)?” is displayed. Press Y, then the DMI information (text data) is written to the Floppy disk, etc. Setting of the HWSC Setting of the UUID Display of the DMI information (including UUID) After completion of the above settings, H/W configuration & DMI information are appeared in order. Check the contents and press Enter.
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3.4 Heatrun Test 3.4 3 Tests and Diagnostics Heatrun Test To execute this program, press 2, Repair Heatrun and press Enter in the startup menu, press Enter. After selecting this test, the same subtests as 3.23 RUNNING TEST is executed successively. For more details on the procedure and test content, refer to RUNNING TEST. When the heatrun test ends, following message appears in the display.
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3 Tests and Diagnostics 3.5 3.5 Subtest Names Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No. 3-12 Test Name Subtest No.
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3.5 Subtest Names 3 Tests and Diagnostics Table 3-1 Subtest names (2/2) No. Test Name Subtest No.
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3 Tests and Diagnostics 3.6 3.6 System Test System Test To execute the System Test select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM checksum This subtest executes a checksum test of the BIOS ROM (range: F0000h to FFFFFh, 64KB) on the System Board. Subtest 02 Fan ON/OFF This subtest turns on/off the fan motor by force with Fan ON/OFF commands.
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3.6 System Test 3 Tests and Diagnostics If the CPU supports Gerserville (SpeedStep), this Subtest checks that the CPU operating clock speed can be changed. If the CPU does not support Gerserville (SpeedStep), the following message is displayed and the test is ended. This chip is not supported Subtest 04 Quick Charge This subtest checks the status for the quick charge. Subtest 05 DMI read This subtest displays the information in the Flash-ROM in the following format. *** DMI Data Display Ver X.
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3 Tests and Diagnostics 3.7 3.7 Memory Test Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Conventional memory This subtest writes a constant data to conventional memory (0 to 640 KB), then reads the new data and compares the result with the original data. Subtest 02 Protected Mode NOTE: The CONFIG.
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3.8 Keyboard Test 3.8 3 Tests and Diagnostics Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed key code display When a key is pressed, the scan code, character code, and key top name are displayed on the screen in the format shown below.
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3 Tests and Diagnostics 3.9 3.9 Display Test Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM read/write for VGA This subtest writes the constant data (AAAAh and 5555h) to the video RAM. The data is read and compared to the original data.
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3.9 Display Test Subtest 04 3 Tests and Diagnostics Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode 12] 13] 3] 111 112 114 115 117 118 640*480 640*480 800*600 800*600 1024*768 1024*768 64K] 16M] 64K] 16M] 64K] 16M] The display below appears on the screen when this subtest is executed.
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3 Tests and Diagnostics Subtest 06 3.9 Display Test “H” Pattern Display This subtest displays a full screen of “H” patterns.
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3.10 Floppy Disk Test 3 Tests and Diagnostics 3.10 Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. The contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. 1. The following message will appear. Select the media mode and start track to be tested, then press Enter.
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3 Tests and Diagnostics 3.10 Floppy Disk Test Select the number of the subtest you want to execute and press Enter. The following message will appear during the floppy disk test. FLOPPY DISK SUB-TEST PASS COUNT WRITE DATA ADDRESS IN PROGRESS : : : : XX XXXXX XX XXXXXX XXXXXXX xxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] : test end [Ctrl]+[C] : key stop ERROR COUNT READ DATA STATUS : XXXXX : XX : XXX When the subtest 04 or 05 is selected, the following messages will appear on the screen.
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3.11 Printer Test 3 Tests and Diagnostics 3.11 Printer Test CAUTION: Printer Test is not supported for this model. To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. NOTE: An IBM compatible printer must be connected to the system to execute this test. Also, printer port wraparound connector must be connected.
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3 Tests and Diagnostics Subtest 02 3.11 Printer Test Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wraparound NOTE: To execute this subtest, a printer wraparound connector must be connected to the computer’s printer port.
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3.12 Async Test 3 Tests and Diagnostics 3.12 Async Test To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
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3 Tests and Diagnostics 3.13 Hard Disk Test 3.13 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. CAUTION: The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 08 or 09 is executed. Before running the test, the customer should transfer the contents of the hard disk to floppy disk or another hard disk. If the customer has not or cannot perform the back-up, create back-up disks as described below.
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3.13 Hard Disk Test 3 Tests and Diagnostics 4. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest. HARD DISK TEST XXXXXXX SUB TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXX DIAGNOSTIC TEST VX.
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3 Tests and Diagnostics Subtest 04 3.13 Hard Disk Test Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder.
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3.14 Real Timer Test 3 Tests and Diagnostics 3.14 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real time A new date and time can be input during this subtest. To execute the real time subtest, follow these steps: 1.
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3 Tests and Diagnostics Subtest 03 3.14 Real Timer Test Real time carry CAUTION: When this subtest is executed, the current date and time are erased.
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3.15 NDP Test 3 Tests and Diagnostics 3.15 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. CAUTION: Judge the existence of high-speed operation processor by 1bit of the composition byte. If exists, the bit is “1”. Test only when the high-speed operation processor exists.
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3 Tests and Diagnostics 3.16 Expansion Test 3.16 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wraparound [It is not supported] CAUTION: PCMCIA wraparound test is not supported for this model. NOTE: To execute this subtest, the PC card wraparound connector is required.
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3.16 Expansion Test Subtest 02 3 Tests and Diagnostics RGB monitor ID NOTE: To execute this subtest, monitor supporting EDID (Extended Display Identification Data) is required. Connect a wraparound connector to CRT monitor for the test of ID acquisition. This subtest is executed by using VESA command. CAUTION: It becomes NG because the priority is given to the internal monitor in a simultaneous display mode.
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3 Tests and Diagnostics 3.17 CD-ROM/DVD-ROM Test 3.17 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM test, select 12 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1. For the subtest 04, use a CD-RW on the market.
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3.18 Error Code and Error Status Names 3 Tests and Diagnostics 3.18 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test.
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3 Tests and Diagnostics 3.
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3.
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3 Tests and Diagnostics 3.19 Hard Disk Test Detail Status 3.19 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eight-digit number. The first four digits represent the hard disk controller (HDC) error status number and the last four digits are not used.
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3.19 Hard Disk Test Detail Status 3 Tests and Diagnostics Tables 3-4 HDC Error register contents Bit Name Description 7 BBK (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error. “1” … Uncorrectable data error has been detected. 5 —— Not used 4 IDN (Identification) “0” … Not used “1” … There is no ID field in the requested sector.
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3 Tests and Diagnostics 3.20 3.20 ONLY ONE TEST ONLY ONE TEST 3.20.1 Program Description This program tests the unique functions of this model. 3.20.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter. The following menu appears in the display. ################################################################ ######## ONLY ONE TEST Menu (QOSMIO G20) ######## ################################################################ * * * * 1 ............ Pressed Key Display * 2 ............
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3.20 ONLY ONE TEST Subtest 01 3 Tests and Diagnostics Pressed Key Display (Main key) When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed. Holding a key down enables the auto-repeat function that causes the key’s display character to blink. Press Del + Enter to end the test.
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3 Tests and Diagnostics Subtest 02 3.20 ONLY ONE TEST Touch Pad This subtest checks the functions of the touch pad as shown below. A) Direction and parameter B) Switching function check. This test displays the response from the touch pad and touch pad switch. When moving your finger on the touch pad towards the upper left, the display changes according to the following illustration. If a touch pad switch is pressed, the displays appear on the right side one by one.
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3.20 ONLY ONE TEST Subtest 03 3 Tests and Diagnostics Wireless communication Switch This subtest checks if the Wireless communication switch works properly. If the test is started with the switch ON, following message appears in the display. Wireless communication Switch position (OFF) is set to a start Slide the switch to OFF position. Then, following message appears in the display. Wireless communication Switch ON !! Slide the switch to ON position. Then, following message appears in the display.
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3 Tests and Diagnostics 3.20 ONLY ONE TEST NG message appears in the display if a defective is found during the test. Confirm the connection of cable, then execute the test again. Press 9 and return to ONLY ONE TESST menu. Subtest 05 LED This subtest checks if each LED lights properly. The following message appears in the display in order. Follow the instructions in the display to execute the test. [HDD Access LED test] Confirm the LED of HDD status blinks properly.
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3.20 ONLY ONE TEST Subtest 06 3 Tests and Diagnostics Button This subtest checks the moving of the of the front operation panel button. Press the Toshiba Assist button after the following message appears. Step 1 X 1 2 * * *. Press Function button (Assist button ) OK message appears in the display if the test ends without an error. Press any key return to each Steps if NG! or Press any key message apprears. Press the Toshiba Presentation button after the following message appears.
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3 Tests and Diagnostics Subtest 7 3.20 ONLY ONE TEST Acceleration sensor This subtest detects and corrects the each axis (X, Y, Z). NOTE: Make sure that this subtest is executed on the following condition: 1. Flat desk with vertical plane to get the stability of machine. 2. The vertical wall or plane is necessary. 3. Prevent the machine from shake or shock.
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3.20 ONLY ONE TEST 3 Tests and Diagnostics When this subtest is selected, the following message appears in the display. The heaven surface establishes in the upper direction Press [Enter] key NOTE: Be sure to execute the test with the display panel opened. Set the machine on the flat desk. Then press Enter to detect the data on this setting of machine. The following message appears in the display.
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3 Tests and Diagnostics 3.20 ONLY ONE TEST Rev B Subtest 8 Docker Dock/Undock This subtest is executed with an Slim Port Replicator II. installed. Press Enter while pushing the eject button of the Slim Port Replicator II. the following message appears. Pushing Eject-SW, and press [Enter] Key Press Enter without pushing the eject button of the Slim Port Replicator II. after the following message appears.
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3.21 Head Cleaning 3.21 3 Tests and Diagnostics Head Cleaning 3.21.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.21.2 Operations 1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS - FLOPPY DISK HEAD CLEANING : VX.XX Mount cleaning disk(s) on drive(s). Press any key when ready. 2.
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3 Tests and Diagnostics 3.22 3.22 Log Utilities Log Utilities 3.22.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or output the data to a printer. NOTE: Connect USB FDD, when you perform the DIAGNOSTIC PROGRAM from the DVD-ROM. The data is stored in floppy disk. The error information is displayed in the following order: 1. Error count (CNT) 2.
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3.22 Log Utilities 3 Tests and Diagnostics 3.22.2 Operations 1. Select 5 and press Enter in the DIAGNOSTIC MENU, logs error information into RAM or onto a floppy disk.
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3 Tests and Diagnostics 3.23 3.23 Running Test Running Test 3.23.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02) 3. Display test (subtest 01) 4. Real timer test (subtest 02) 5. HDD test (subtest 01) 6. FDD test (subtest 02) The system automatically detects the number of floppy disk drives connected to the computer for the FDD test. 3.23.2 Operations 1.
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3.24 Floppy Disk Drive Utilities 3.24 3 Tests and Diagnostics Floppy Disk Drive Utilities 3.24.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE: This program is only for testing a floppy disk drive. The option is different from the Toshiba MS-DOS FORMAT command.
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3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 3.24.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 2 3 4 9 – - FORMAT COPY DUMP HDD-ID READ EXIT TO DIAGNOSTICS MENU 2. FORMAT program (a) Selecting FORMAT displays the following message: DIAGNOSTICS - FLOPPY DISK FORMAT : VX.
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3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below: Insert source disk into drive A: Press any key when ready. (c) Remove the Diagnostics Disk from the FDD, insert the source disk and press any key. The following message will appear, indicating the program has started.
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3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If 2:HDD is selected, the display will go to step (h). If 1:FDD is selected, the following message will appear: Select drive number (1:A, 2:B) ? (c) Select a drive number and the following message will be displayed.
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3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? 5. HDD ID READ program Selecting HDD ID displays the following HDD ID configuration: [HDD ID Read (VX.XX)] [Drive #1] Model No.
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3 Tests and Diagnostics 3.25 System Configuration 3.25 System Configuration 3.25.1 Function Description The System Configuration program contains the following configuration information for the computer: 1. Processor Type [Code/L2 cache] 2. Chip set [VRAM] 3. BIOS ROM version [1st ID, 2nd ID] 4. Boot ROM version 5. EC/KBC version 6. PS Microprocessor version 7. SVP parameter version [Panel/Manufacture code/Product code] 8. Micro code revision [Processor number] 9.
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3.25 System Configuration 3 Tests and Diagnostics 3.25.2 Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display. System Configuration Display: Ver X.XX [Machine Name???] * * * * * * * * * * * * * * * * * * * - Processor Type = XXXXXX-XXXXXMHz Code = XX L2 Cache = XXXXXKB Chip set = XXXXXX VGA Chip = XXXXXX BIOS ROM Version = VX.XX 1st ID = XXH, 2nd ID = XXH BOOT ROM Version = VX.XX = VX.XX EC/KBC Version PS Micon Version = VX.
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3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Atheros) 3.26 Wireless LAN Test Program (Atheros) Since there is no test program for Atheros-made wireless LAN cards, check the wireless LAN card type of the computer and the antenna connection by using Windows programs. Check of the wireless LAN card type 1. Slide the wireless communication switch to “ON” position. 2.
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3.26 Wireless LAN Test Program (Atheros) 3 Tests and Diagnostics Check of the antenna connection 1. Confirm that the icon for wireless LAN appears at the lower right of the screen under the circumstances the wireless LAN communication is available. (It is no problem if a cross is shown on the icon.) 2. Double-click the icon. If the computer finds any AP (Access Point), the antenna marks like as follows will appear. It shows the antenna cables are surely connected to the wireless LAN card. 3.
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3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g/n Setting up of REF PC) 3.27 Wireless LAN Test Program (Intel-made a/b/g/n Setting up of REF PC) For the test of Intel-made wireless LAN cards, configure the test environment as shown below with the following equipment. ・ AP （which can operate on Windows XP and is corresponding to access point 11a, 11b and 11g） NOTE: Set the SSID of AP as follows. (Note that upper case and lower case characters are recognized as different characters.
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3.27 Wireless LAN Test Program (Intel-made a/b/g/n Setting up of REF PC)3 Tests and Diagnostics Open “My Computer” window and click “My Network places” on the left column. • Click “View network connections” on the left column. • The “Network Connections” window appears. Double-click “Local Area Connection”.
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3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g/n Setting up of REF PC) • Click “Install…” button on the “Local Area Connection Properties” window. Local Area Connection Properties window • Select “Protocol” on the “Select Network Component Type” window and click “Add…” button. Select Network Component Type window • Click “Have Disk…” button on the “Select Network Protocol” window.
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3.27 Wireless LAN Test Program (Intel-made a/b/g/n Setting up of REF PC)3 Tests and Diagnostics • When “Install From Disk” window appears, click “Browse…” and specify the created “Clx_Res” folder. Then Click “OK”. (For the test, “PACKET.INF” file is used.) Install From Disk window • The “Select Network Protocol” window appears again. In the “Network Protocol”, “DDK PACKET Protocol” will appear. Then click “OK” to start the installation.
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3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g/n Setting up of REF PC) After the completion of REF PC setup, restart the WINDOWS. Then perform the Responder test program for Windows (WTWINSVR.EXE) in the Clx_Res folder. ・WTWINSVR.EXE Function : Transmitting/receiving of data to/from DUT via AP OS available : Windows XP only How to start : Double-click WTWINSVR icon. How to start 1. Double-click wtwinsvr icon. The following screen will appear. Startup screen of wtwinsvr program 2.
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3.28 Wireless LAN Test Program on DUT PC (Intel-made) 3 Tests and Diagnostics 3.28 Wireless LAN Test Program on DUT PC (Intel-made) 3.28.1 Wireless LAN Test Program (Intel-made : Shirley Peak) on DUT PC This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade 802.11 a/b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Insert the Diagnostics disk for wireless LAN test into the Floppy Disk Drive. Turn on the power while pressing U.
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3 Tests and Diagnostics 3.28 Wireless LAN Test Program on DUT PC (Intel-made) To execute the subtest, input the subtest number and press Enter. Subtest01 Communication test of 11a mode for 5100/5150 module (Two antenna type) This subtest execute transmitting/receiving test in 802.11a mode using the main antenna. If a defective is not found during the test, OK message will appear in the display. Press any key and return to the test menu.
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3.28 Wireless LAN Test Program on DUT PC (Intel-made) Subtest03 3 Tests and Diagnostics Communication test of 11g mode for 5100/5150 module (Two antenna type) This subtest execute transmitting/receiving test in 802.11g mode using the main antenna. If a defective is not found during the test, OK message will appear in the display. Press any key and return to the test menu. If a defective is found during the test, NG message will appear in the display.
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3 Tests and Diagnostics Subtest06 3.28 Wireless LAN Test Program on DUT PC (Intel-made) Communication test of 11b mode for 5100/5150 module (Three antenna type) This subtest execute transmitting/receiving test in 802.11b mode using the main antenna. If a defective is not found during the test, OK message will appear in the display. Press any key and return to the test menu. If a defective is found during the test, NG message will appear in the display.
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3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the test program. Insert the test program disk for LAN/Modem/Bluetooth/IEEE1394 test in FDD and turn on the power. The following message will appear: Microsoft Windows XX Startup Menu ---------------------------------1. LAN 2. Modem 3. Bluetooth 4.
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3 Tests and Diagnostics Subtest01 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program (i82562 + ICHx) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip.
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3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest02 3 Tests and Diagnostics (GbE) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. Select 2 to execute and press Enter. The following message will appear: Testing adaptor...hit to abort. * External Loopback Test...PASSED Testing completed.
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3 Tests and Diagnostics 3.29.2 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Modem test For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Denki Seisakusyo)” for the tests. ################################################################## ###### AC97' Modem Controller Diagnostics program ####### ################################################################## * * * * 1 ............
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3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.3 3 Tests and Diagnostics Bluetooth test Preparation ・ For the test of Bluetooth function, use the Windows program installed on the target computer (computer to be tested). A responder device (device for transmitting/receiving data) is also needed. (A mobile phone with the Bluetooth function is also available.) ・ A Bluetooth card should be installed on the target computer.
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3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 5. Select “Diagnostics” tab and click “Run”. 6. Check the “Log” to confirm the test result. BT address of test computer BT address of responder device 7. When the BT (Bluetooth) address of the responder device appears, the Bluetooth card and antenna connection are OK.
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3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.4 3 Tests and Diagnostics IEEE1394 test To execute this test, input 4 and press Enter. NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test. The following menu will appear: ******************************************************************** ******** IEEE1394[XXXXX] Diagnostics program ************** ******************************************************************** * * * 1 ....
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3 Tests and Diagnostics 3.29 Sound Test program 3.29 Sound Test program Sound TEST disk cannot be used in TECRA M10. Therefore, please test the sound on Windows OS. 1) Play a music file. 2) click TOSHIBA-> utility -> "PC diagnostic tool." to test the sound Please check operation of speakers by one of methods. 3.30 3G Test program Therefore, please test the sound on Windows OS. All the programs included in EU870 test CD are install. A procedure should look at ToshibaTestTools_ReleaseNotes.txt.
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3.31 SETUP 3 Tests and Diagnostics 3.31 SETUP 3.31.1 Function Description This program displays the current system setup information as listed below: 1. Memory 2. System Date/Time 4. Password (a) User Password (b) Supervisor Password 3. HDD Password (a) (b) (c) (d) HDD HDD Password Mode User Password Master Password 5. Boot Priority (a) Boot Priority (b) HDD Priority 6.
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3 Tests and Diagnostics 3.31 SETUP 10. Drives I/O (a) Built-in HDD (b) ODD (c) SATA Controller Mode 11. PCI Bus 12. Display (a) LCD Display Stretch 13. Peripheral (a) Internal Pointing Device 14. Legacy Emulation (a) USB KB/Mouse Legacy Emulation (b) USB-FDD Legacy Emulation (c) USB Memory BIOS Support Type 15. PCI LAN (a) Built-in LAN 16. Security Controller (a) TPM (b) Hide TPM 17.
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3.31 SETUP 3 Tests and Diagnostics 3.31.2 Accessing the SETUP Program While pressing ESC, turn on the power. Then press F1. The following display appears.
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3 Tests and Diagnostics 3-82 [CONFIDENTIAL] 3.
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3.31 SETUP 3 Tests and Diagnostics Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press ↑ and ↓ to move between items in a column. Press Fn+↑ (PgUp) and Fn + ↓ (PgDn) to move between the two pages. 2. Press either the Space bar or Back Space to change the value. Accepting Changes and Exiting the SETUP Window 1. Press End to accept the changes you made.
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3 Tests and Diagnostics 3.31 SETUP SETUP Options The SETUP screen is divided into 14 functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s memory. This field displays the total amount of memory installed and is automatically calculated by the computer. You cannot change this value. 2. System Date/Time Sets the date and time. System Date Sets date. System Time Sets time. 3.
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3.31 SETUP 3 Tests and Diagnostics (b) HDD Password Mode This item registers HDD password and can be selected only for registering HDD password. To change HDD Password Mode when HDD password is registered, delete the registered HDD password first, and then register new password. User Only Sets only User HDD Password (Default) Master+User Sets Master HDD Password and User HDD Password (c) User Password This item sets User password. For details on setting user password, refer to the User’s Manual.
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3 Tests and Diagnostics 3.31 SETUP NOTE: CD-ROM refers to a DVD-ROM&CD-R/RW drive or DVD Super Multi drive. (b) HDD Priority Use this option to set the booting priority from HDD or USB. Built-in HDD→ USB (Default) USB →Built-in HDD 5. Others Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use. (a) Core-Multi Processing *Core2 model only The Core Multi-Processing sets the CPU operating mode.
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3.31 SETUP 3 Tests and Diagnostics (c) Execute-Disable Bit Capability This option set the Execute-Disable Bit function of CPU to the operation system. Execute-Disable Bit gives higher security function preventing the PC from the computer viruses and buffer overflow problem on unauthorized access. Available Enable the Execute-Disable Bit function. Not Available Disable the Execute-Disable Bit function.
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3 Tests and Diagnostics 3.31 SETUP (f) Auto Power On Use this option to set a time and date for automatic power on and enable or disable the ring indicator feature. Alarm Date Option appears only when Alarm Time is enabled. OPTIONS Alarm Time = Disabled Wake-up on LAN on Battery Critical Battery Wake-up = Disabled = Disabled = Enabled Set the parameters for the Auto Power On (automatic power on) function and the Wake-up on LAN in the “OPTIONS” window. To set the time, use Space or BackSpace.
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3.31 SETUP 3 Tests and Diagnostics Critical Battery Wake-up Configures what action is taken when the remaining battery power is close to running out while the system is in Sleep Mode. This setting is only available when the Critical battery action in Windows is set to Hibernate (Default). To access it, Start -> Control Panel -> System and Maintenance -> Power Options -> Edit Plan Settings -> Change advanced power settings -> Battery. The operation of this function is dependent upon battery status.
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3 Tests and Diagnostics 3.31 SETUP 6. Configuration This option lets you set the device configuration. NOTE: 1. All Devices BIOS sets all devices. Setup by OS Initializes devices, which is needed to load an operating system. Operating system initializes other devices. (Default) When using installed OS, selecting “Setup by OS” is recommended. 2. When executing test programs, be sure to select “ALL Device”. And after the test end, select “Setup by OS”. 7.
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3.31 SETUP 3 Tests and Diagnostics Battery Save Options Processing Speed This feature changes the CPU processing speed. High Low CPU operates at high speed. (Default in Full Power Mode) CPU operates at low speed. (Default in Low Power Mode) CPU Sleep Mode Use this option to enable or disable the CPU sleep function. Enabled Enables sleep mode. (Default) Disabled Disables sleep mode. LCD Brightness Use this option to set the level of LCD brightness.
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3 Tests and Diagnostics 3.31 SETUP (b) PCI Express Link ASPM This option set the power-saving function of PCI Express on the following conditions. Auto PCI Express devices are not used while battery operation. (Default) Disabled Disable the Power-saving function and drive with maximum performance. Enabled PCI Express devices are not used. (c) Enhanced C-States *Core2 model only This option set the power-saving function of Enhanced C-States on the following conditions.
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3.31 SETUP 3 Tests and Diagnostics 9. Drives I/O This option displays the address and interrupts level for hard disk drive and optical disk drive. It is for information only and cannot be changed. (a) Built-in HDD This item displays the Serial ATA Port Number. It is for information only and cannot be changed. Serial ATA Port0 (b) ODD This item displays the Serial ATA Port Number. It is for information only and cannot be changed. Serial ATA Port1 (c) eSATA This item displays the Serial ATA Port Number.
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3 Tests and Diagnostics 3.31 SETUP LCD+AnalogRGB Selects both the internal LCD and the external monitor for simultaneous display. NOTE: Pressing Fn+F5 changes the display setting in the order of internal LCD to simultaneous to external monitor. 12. Peripheral Use this option to select the peripheral’s mode. (a) Internal Pointing Device This option enables or disables the touch pad Enabled Enables the touch pad. (Default) Disabled Disables the touch pad. 13.
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3.31 SETUP 3 Tests and Diagnostics (c) USB Memory BIOS Support Type A setup about the USB flash memory used for a startup of a computer. HDD FDD The priority as HDD turns into ranking of HDD in "BootPriority" in a USB flash memory. The priority with other HDD can be set up by "HDD Priority." (Default). A USB flash memory is treated as FDD. The priority as a drive to start turns into ranking of FDD in "Boot Priority." 14. PCI LAN This option sets the Enable / Disable of the built-in LAN functions.
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3 Tests and Diagnostics 3-96 [CONFIDENTIAL] 3.
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Chapter 4 Replacement Procedures [CONFIDENTIAL]
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4 Replacement Procedures 4-ii [CONFIDENTIAL] TECRA M10 Maintenance Manual (960-685)
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4 Replacement Procedures Chapter 4 Contents 4.1 Overview.................................................................................................................... 4-1 4.2 Battery pack ............................................................................................................. 4-11 4.3 SIM card .................................................................................................................. 4-13 4.4 PC card/Bridge media/Smart card ........................
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4 Replacement Procedures 4.27 Touch pad/Fingerprint sensor board ........................................................................ 4-78 4.28 Bluetooth module..................................................................................................... 4-83 4.29 Smart card unit......................................................................................................... 4-84 4.30 LCD unit/FL inverter ............................................................................
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4 Replacement Procedures Figures Figure 4-1 Removing the battery pack .......................................................................... 4-11 Figure 4-2 Removing the SIM card (1) ........................................................................ 4-13 Figure 4-3 Removing the SIM card (2) ........................................................................ 4-14 Figure 4-4 Removing the PC card .................................................................................
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4 Replacement Procedures Figure 4-31 Removing the MDC modem........................................................................ 4-50 Figure 4-32 Removing the USB board ............................................................................ 4-51 Figure 4-33 Removing the RGB harness......................................................................... 4-53 Figure 4-34 Removing the RJ45 harness.........................................................................
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4 Replacement Procedures Figure 4-63 Removing the LCD harness (2) ................................................................. 4-103 Figure 4-64 Removing the LCD mask (1)..................................................................... 4-104 Figure 4-65 Removing the LCD mask (2)..................................................................... 4-105 Figure 4-66 Removing the hinge (1) .............................................................................
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4 Replacement Procedures 4-viii [CONFIDENTIAL] TECRA M10 Maintenance Manual (960-685)
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4.1 Overview 4 4 Replacement Procedures Replacement Procedures 4.1 Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual.
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4 Replacement Procedures 4.1 Overview Please prepare required parts in advance, when replacing the following items. ITEM COVER ASSY ITEM LCD COVER ASSY Parts List ITEM No 50 64,64-A Parts List ITEM No 51 75 46, 47 PART NAME Quantity COVER ASSY TOUCH PAD 1 1 PART NAME Quantity LCD COVER ASSY CAMERA MODULE 2.4/5.2GHZ ANTENNA 1 1 1 Parts which can not be reused are (1) Touch pad, (2) Camera module, (3) Wireless LAN antenna (2.4/5.2GHZ ANTENNA) and (4) 3G antenna.
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4.1 Overview 4 Replacement Procedures The main parts in this manual are indicated in the part list by the following names.
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4 Replacement Procedures 4.1 Overview Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. DANGER: 1) Always use the genuine battery that is authorized by Toshiba or compatible with the unit. Since other battery packs have different specifications, they may be incompatible with the unit, and may burst or explode.
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4.1 Overview 4 Replacement Procedures Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2. Battery Pack”. 1. Do not disassemble the computer unless it is operating abnormally. 2. Use the designated tools. 3. Ensure that the environment for working on and storing parts does not contain any of the following.
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4 Replacement Procedures 4.1 Overview Disassembly Procedure Four main types of cable connector are used. • Pressure plate connector • Spring connector • Back flip connector • Normal pin connector For pressure plate connectors, slide the pressure plate holding tags on both sides of the plastic pressure plate on the connector and pull the cable out from the connector.
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4.1 Overview 4 Replacement Procedures Assembly Procedures After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. • Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems. • Check that all cables and connectors are securely connected.
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4 Replacement Procedures 4.1 Overview Screw Tightening Torque When you fasten screws, be sure to follow the torque list below. CAUTION: Overtightening can damage components and screws; undertightening can result in electrical shorts or other damage if screws or components come loose. NOTE: Toshiba recommends that you use an electric screw driver for quick and easy operations. • M2 • M2.5 (2.5mm) 0.294 N·m (3.0 kgf·cm) • M3 0.549 N·m (5.6 kgf·cm) (2mm) (3mm) 0.167 N·m (1.
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4.1 Overview 4 Replacement Procedures Grip Color Some screws have a colored grip area to help you determine the length of the screw.
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4 Replacement Procedures 4.1 Overview Screw Notation To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body. Format: Screw type + Screw length (mm) Screw shape B: Bind screw F: Flat head screw S: Super thin head screw T: Tapping screw U: Other screws (Unique screws: pan head, stud, etc.) Example: B6 ...
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4.2 Battery pack 4.2 4 Replacement Procedures Battery pack Removing the Battery pack To remove the battery pack, follow the steps below and refer to Figure 4-1. CAUTION: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC adapter and other external devices from the computer. 3. Turn the computer face down. 4.
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4 Replacement Procedures 4.2 Battery pack Installing the Battery pack To install the battery pack, follow the steps below and refer to Figure 4-1. CAUTION: There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly. Dispose always the used battery pack in accordance with the laws and ordinances of your local authority. Use only the batteries approved by Toshiba. NOTE: Check the battery’s terminals visually.
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4.3 SIM card 4.3 4 Replacement Procedures SIM card Removing the SIM card To remove the SIM card, follow the steps below and refer to Figure 4-2 and 4-3. 1. Slide the SIM card release latch in the direction as shown in the figure below. 2. Turn up the SIM card holder in the direction as shown in the figure below.
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4 Replacement Procedures 4.3 SIM card 3. Remove the SIM card from the SIM card holder. SIM card Figure 4-3 Removing the SIM card (2) Installing the SIM card To install the SIM card, follow the steps below and refer to Figure 4-2 and 4-3. 1. Set the SIM card into the SIM card holder. 2. Lay the SIM card holder down and lock the SIM card release latch while sliding it in the opposite direction as shown in the figure 4-2.
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4.4 PC card/Bridge media/Smart card 4.4 4 Replacement Procedures PC card/Bridge media/Smart card 4.4.1 PC card Removing the PC card To remove the PC card, follow the steps below and refer to Figure 4-4. CAUTION: Insert or remove a PC card in accordance with any instructions in their manual or the manuals of the computer system you are using. 1. Press the eject button for the PC card to extend the button. 2. Press the extended eject button to pop the PC card out. 3. Grasp the PC card and pull it out.
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4 Replacement Procedures 4.4 PC card/Bridge media/Smart card 4.4.2 Bridge media (SD Card/Memory Stick/xD Picture Card/MultiMedia card) Removing the Bridge media To remove the Bridge media, follow the steps below and refer to Figure 4-5. CAUTION: Insert or remove a Bridge media in accordance with any instructions in each Bridge Media manual or the manuals of the computer system you are using. 1. Push the Bridge media. It will pop out partly when you release, so pull out the card.
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4.4 PC card/Bridge media/Smart card 4 Replacement Procedures 4.4.3 Smart card Removing the Smart card To remove the Smart card, follow the steps below and refer to Figure 4-6. CAUTION: Insert or remove a Smart card in accordance with any instructions in the Smart card manual or the manuals of the computer system you are using. 1. Pull out the Smart card from the card slot.
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4 Replacement Procedures 4.5 4.5 Memory module Memory module Removing the Memory module To remove the memory module, confirm that the computer is shut down. Then follow the steps below and refer to Figure 4-7 and 4-8. CAUTION: When removing the memory module, make sure the computer is powered off. Removing a memory module with the power on might damage the module or the computer itself. Do not touch the connectors on the memory module or on the computer.
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4.5 Memory module 4 Replacement Procedures 4. Open the left and right latches outside and remove the memory module(s).
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4 Replacement Procedures 4.5 Memory module Installing the Memory module To install the memory module, confirm that the computer is shut down. Then follow the steps below and refer to Figure 4-7 and 4-8. CAUTION: When installing the memory module, make sure the computer is powered off. Inserting a memory module with the power on might damage the module or the computer itself. Never press hard or bend a memory module. 1.
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4.6 Fin cover 4.6 4 Replacement Procedures Fin cover NOTE: When repairing the PC, clean the cooling fin with a vacuum cleaner. Do not use cotton sticks and tweezers to remove dusts. It may cause the cooling module problem or dusts stuffed. Removing the Fin cover To remove the Fin cover, follow the steps below and refer to Figure 4-9. 1. Push down the hook and remove the fin cover while sliding it in the direction in the figure below.
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4 Replacement Procedures 4.7 4.7 HDD HDD Removing the HDD To remove the HDD, follow the steps below and refer to Figure 4-10 and 4-11. CAUTION: Take care not to press on the top or bottom of a HDD. Pressure may cause the data loss or damage to the device. 1. Remove the following screw securing the HDD cover. • M2.5×5B FLAT HEAD screw ×1 2. Insert your finger into the slot and lift the HDD cover to remove. 3.
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4.7 HDD 4 Replacement Procedures 4. Remove the following screws and separate the HDD and HDD holder. • M3.0×4C FLAT HEAD screw ×4 HDD M3.0×4C FLAT HEAD M3.0×4C FLAT HEAD M3.0×4C FLAT HEAD HDD Holder M3.
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4 Replacement Procedures 4.7 HDD Installing the HDD To install the HDD, follow the steps below and refer to Figure 4-10 and 4-11. 1. Set the HDD to the HDD Holder and secure them with the following screws. • M3.0×4C FLAT HEAD screw ×4 2. Set the connector of the HDD harness upward and connect the HDD assembly to the connector of the HDD harness. Lay the HDD assembly down into the slot. 3. Set the HDD cover and secure it with the following screw. • 4-24 M2.
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4.8 Optical disk drive (DVD-ROM/DVD-Super Multi drive) 4.8 4 Replacement Procedures Optical disk drive (DVD-ROM/DVD-Super Multi drive) Removing the Optical disk drive To remove the optical disk drive, follow the steps below and refer to Figure 4-12 to 4-13. CAUTION: When the optical disk inside the optical disk drive can not be ejected because of some failure, open the disc tray by inserting a slender object (about 15 mm) such as a straightened paper clip into the eject hole near the eject button. 1.
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4 Replacement Procedures 4.8 Optical disk drive (DVD-ROM/DVD-Super Multi drive) 3. Remove the following screws and ODD rear bracket. • M2.0×2.7C Unique screw ×2 4. Remove the following screw and ODD side bracket. • M2.0×3C S-THIN HEAD screw ×1 Optical disk drive ODD side bracket ODD rear bracket M2.0×3C S-THIN HEAD M2.0×2.
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4.9 Keyboard 4.9 4 Replacement Procedures Keyboard Removing the Keyboard To remove the keyboard, follow the steps below and refer to Figure 4-14 to 4-17. CAUTION: As the keytop may fall out, when handling the keyboard always hold it by the frame and do not touch the keytop. 1. Turn over the computer. 2. Insert your fingers into the slits and release both sides of latches of the KB holder at the rear.
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4 Replacement Procedures 4.9 Keyboard 3. Open the display and make it flat. 4. Insert your finger into the slot on left side and remove the KB holder.
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4.9 Keyboard 4 Replacement Procedures 5. Remove the following screws securing the keyboard. • M2.5×4B FLAT HEAD screw ×2 6. Lift the top edge of the keyboard while releasing the latches and turn the keyboard face down on the palm rest. M2.5×4B FLAT HEAD M2.
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4 Replacement Procedures 7. 4.9 Keyboard Remove the following screw and slide the KB support plate in the direction as shown in the figure below to remove. • M2.5×10B FLAT HEAD screw ×1 8. Disconnect the keyboard flexible cable from the connector CN3230 on the system board and remove the keyboard. M2.
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4.9 Keyboard 4 Replacement Procedures Installing the Keyboard To install the keyboard, follow the steps below and refer to Figure 4-14 to 4-17. 1. Place the keyboard face down on the palm rest and connect the keyboard flexible cable to the connector CN3230 on the system board. 2. Set the KB support plate and slide it. 3. Secure the KB support plate with the following screw. • M2.5×10B FLAT HEAD screw ×1 CAUTION: Do not put the keyboard flexible cable on the KB support plate.
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4 Replacement Procedures 4.10 SW board 4.10 SW board Removing the SW board To remove the SW board, follow the steps below and refer to Figure 4-18 to 4-20. 1. Disconnect the SW board FFC from the connector CN9600 on the SW board. 2. Push down the hook and slide the SW board in the direction as shown in the figure below to remove it.
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4.10 SW board 4 Replacement Procedures 3. Peel off the insulator (COVER UP INSULATOR).
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4 Replacement Procedures 4.10 SW board 4. Disconnect the SW board FFC from the connector CN9500 on the system board. SW board FFC CN9500 Figure 4-20 Removing the SW board FFC Installing the SW board To install the SW board, follow the steps below and refer to Figure 4-18 to 4-20. 1. Connect the SW board FFC to the connector CN9600 on the SW board. CAUTION: Make sure that the SW board FFC is connected securely to the connector on the SW board. The connector of the SW board is not a lock type. 2.
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4.11 SIM board 4 Replacement Procedures 4.11 SIM board Removing the SIM board To remove the SIM board, follow the steps below and refer to Figure 4-21. 1. Disconnect the SIM board FFC from the connector CN9570 on the system board. 2. Remove the SIM board from the slot while peeling the double-sided tapes. 3. Disconnect the SIM board FFC from the connector CN9670 on the back of the SIM board.
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4 Replacement Procedures 4.11 SIM board Installing the SIM board To install the SIM board, follow the steps below and refer to Figure 4-21. 1. Connect the SIM board FFC to the connector CN9670 on the back of the SIM board. 2. Set the SIM board to the slot with the holes into the guides. NOTE: When installing a new SIM board, peel off three separators of the double-sided tapes on the SIM board. 3. Connect the SIM board FFC to the connector CN9570 on the system board.
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4.12 Wireless LAN card 4 Replacement Procedures 4.12 Wireless LAN card Removing the Wireless LAN card To remove the wireless LAN card, follow the steps below and refer to Figure 4-22. 1. Disconnect the wireless LAN antenna cables from the wireless LAN card (white cable from Main and black cable from Aux) using an antenna coaxial cable disconnector. 2. Remove the following screws securing the wireless LAN card. • M2.0×4B BIND screw ×2 3.
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4 Replacement Procedures 4.12 Wireless LAN card Installing the Wireless LAN card To install the wireless LAN card, follow the steps below and refer to Figure 4-22. 1. Insert the wireless LAN card to the connector on the system board slantwise and press it to connect firmly. 2. Push down the wireless LAN card and secure it with the following screws. • M2.0×4B BIND ×2 3. Connect the wireless LAN antenna cables to the connectors (white cable to Main and black cable to Aux) on the wireless LAN card.
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4.13 3G card 4 Replacement Procedures 4.13 3G card Removing the 3G card To remove the 3G card, follow the steps below and refer to Figure 4-23. 1. Disconnect the 3G antenna cables from the 3G card using an antenna coaxial cable disconnector. 2. Remove the following screws securing the 3G card. • ×2 M2.0×4B BIND screw 3. Disconnect the 3G card from the connector on the system board. M2.
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4 Replacement Procedures 4.13 3G card Installing the 3G card To install the 3G card, follow the steps below and refer to Figure 4-23. 1. Insert the 3G card to the connector on the system board slantwise and press it to connect firmly. 2. Push down the 3G card and secure it with the following screws. • M2.0×4B BIND ×2 3. Connect the 3G antenna cables to the connectors on the 3G card and arrange the antenna cables through the slit.
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4.14 Robson card 4 Replacement Procedures 4.14 Robson card Removing the Robson card To remove the Robson card, follow the steps below and refer to Figure 4-24. 1. Remove the following screws securing the Robson card. • M2.0×4B BIND screw ×2 2. Disconnect the Robson card from the connector on the system board. M2.
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4 Replacement Procedures 4.14 Robson card Installing the Robson card To install the Robson card, follow the steps below and refer to Figure 4-24. 1. Insert the Robson card to the connector on the system board slantwise and press it to connect firmly. 2. Push down the Robson card and secure it with the following screws. • 4-42 M2.
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4.15 Speaker 4 Replacement Procedures 4.15 Speaker Removing the Speaker To remove the speaker, follow the steps below and refer to Figure 4-25 to 4-27. 1. Disconnect the speaker harness from the connector CN6150 on the system board.
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4 Replacement Procedures 4.15 Speaker 2. Peel off the two insulators (SQUARE INSULATOR) and turn up the insulators.
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4.15 Speaker 4 Replacement Procedures 3. Remove the speakers (left and right) from the speaker slots while pushing the guides and speaker harness from the slot. Speaker (blue&black harness) Speaker (red&white harness) Speaker harness Guide Guide Figure 4-27 Removing the speaker (2) Installing the Speaker To install the speaker, follow the steps below and refer to Figure 4-25 to 4-27. 1. Install the speakers (left and right) to the speaker slots. 2.
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4 Replacement Procedures 4 4.16 Cover assembly and Base assembly Replacement Procedures 4.16 Cover assembly and Base assembly Removing the Cover assembly and Base assembly To remove the cover assembly and base assembly, follow the steps below and refer to Figure 4-28 to 4-30. 1. Close the display and turn over the computer. 2. Remove the following screws. • M2.5×16B FLAT HEAD screw ×3 (“16” in the figure below) • M2.5×10B FLAT HEAD screw ×8 (“10” in the figure below) • M2.
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4.16 Cover assembly and Base assembly 4 Replacement Procedures 3. Turn over the computer and open the display. 4. Disconnect the touch pad FFC, Bluetooth harness, camera harness and LCD harness from the connector CN9550, CN4440, CN9540 and CN5000 on the system board. 5. Peel off the acetate tape on the Smart card FFC. 6. Disconnect the Smart card FFC from the connector CN2170 on the system board and remove the core from the Smart card FFC. 7. Remove the following screws. • M2.5×10B FLAT HEAD screw M2.
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4 Replacement Procedures 4.16 Cover assembly and Base assembly 8. Separate the cover assembly and base assembly while releasing the latches.
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4.16 Cover assembly and Base assembly 4 Replacement Procedures Installing the Cover assembly and Base assembly To install the cover assembly and base assembly, follow the steps below and refer to Figure 4-28 to 4-30. 1. Place the cover assembly on the base assembly and secure them with the following screws. • M2.5×10B ×4 FLAT HEAD screw 2. Insert the core to the Smart card FFC and connect the Smart card FFC to the connector CN2170 on the system board. Stick the acetate tape in place.
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4 Replacement Procedures 4.17 MDC modem/USB board 4.17 MDC modem/USB board Removing the MDC modem/USB board To remove the MDC modem/USB board, follow the steps below and refer to Figure 4-31 and 4-32. 1. Remove the following screws securing the MDC modem. • M2.0×4B BIND screw ×2 2. Take out the RJ11 harness from the slot and lift the MDC modem straight above to remove it from the connector CN3010 on the USB board. 3. Disconnect the RJ11 harness from the connector on the MDC modem. M2.
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4.17 MDC modem/USB board 4 Replacement Procedures 4. Disconnect the USB harness from the connector CN9560 on the system board and connector CN9660 on the USB board. 5. Remove the USB board from the slot of the base assembly while pushing the latches in the direction as shown in the figure below.
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4 Replacement Procedures 4.17 MDC modem/USB board Installing the MDC modem/USB board To install the MDC modem/USB board, follow the steps below and refer to Figure 4-31 and 4-32. 1. Set the USB board to the slot of the base assembly while engaging the latches. 2. Connect the USB harness to the connector CN9560 on the system board and connector CN9660 on the USB board. 3. Connect the RJ11 harness to the connector on the MDC modem. 4.
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4.18 RGB harness/RJ45 harness 4 Replacement Procedures 4.18 RGB harness/RJ45 harness Removing the RGB harness/RJ45 harness To remove the RGB harness/RJ45 harness, follow the steps below and refer to Figure 4-33 and 4-34. 1. Turn up the insulator and disconnect the RGB harness from the connector CN9510 on the system board. 2. Remove the following screw and take out the RGB harness from the slot of the base assembly. • M2.5×6C Tapping screw ×1 M2.
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4 Replacement Procedures 4.18 RGB harness/RJ45 harness 3. Disconnect the RJ45 harness from the connector CN4100 on the system board and remove the RJ45 harness from the slot of the base assembly.
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4.18 RGB harness/RJ45 harness 4 Replacement Procedures Installing the RGB harness/RJ45 harness To install the RGB harness/RJ45 harness, follow the steps below and refer to Figure 4-33 and 4-34. 1. Turn up the insulator and connect the RJ45 harness to the connector CN4100 on the system board. 2. Set the RJ45 harness into the slot of the base assembly and arrange it to the guides. 3. Connect the RGB harness to the connector CN9510 on the system board. 4.
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4 Replacement Procedures 4.19 Serial board 4.19 Serial board Removing the Serial board To remove the serial board, follow the steps below and refer to Figure 4-35. 1. Disconnect the serial board FFC from the connector CN9520 on the system board. 2. Push the hook to release and remove the serial board from the slot of the base assembly. 3. Disconnect the serial board FFC from the connector CN9620 on the back of the serial board.
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4.19 Serial board 4 Replacement Procedures Installing the Serial board To install the serial board, follow the steps below and refer to Figure 4-35. 1. Connect the serial board FFC to the connector CN9620 on the back of the serial board. 2. Set the serial board into the slot of the base assembly while engaging it to the hook. 3. Connect the serial board FFC to the connector CN9520 on the system board.
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4 Replacement Procedures 4.20 System board 4.20 System board CAUTION: When replacing with a new system board, the following procedures must be executed. (1) Before replacing the system board, execute subtest02 “DMI ggginformation save” in 3.3 Setting of the hardware configuration of gggChapter 3 Test program in order to save the DMI information from gggsystem board to floppy disk.
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4.20 System board • 4 Replacement Procedures M2.5×6C Tapping screw ×1 Sound board FFC DC-IN jack M2.
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4 Replacement Procedures 4.20 System board 4. Disconnect the DC-IN harness and HDD harness from the connector CN8800 and CN1900 on the back of the system board.
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4.20 System board 4 Replacement Procedures Installing the System board To install the system board, follow the steps below and refer to Figure 4-36 to 4-37. 1. Connect the DC-IN harness and HDD harness to the connector CN8800 and CN1900 on the back of the system board. 2. Set the system board in place and secure it with the following screw(s). • M2.5×6C Tapping screw ×1 3. Set the DC-IN jack into the slot. 4.
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4 Replacement Procedures 4.21 GFX board/GFX fin 4.21 GFX board/GFX fin Removing the GFX board/GFX fin To remove the GFX board/GFX fin, follow the steps below and refer to Figure 4-38 and 4-39. 1. Remove the following screws and disconnect the GFX board (with the GFX fin) from the connector CN5900 on the system board. • M2.0×4B BIND screw ×2 M2.
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4.21 GFX board/GFX fin 4 Replacement Procedures 2. Remove the following screws and separate the GFX fin and GFX board. • M2.0×3C ×4 S-THIN HEAD screw M2.0x3C S-THIN HEAD M2.
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4 Replacement Procedures 4.21 GFX board/GFX fin Installing the GFX board/GFX fin To install the GFX board/GFX fin, follow the steps below and refer to Figure 4-38 and 4-39. 1. If there is already cool sheet on the GFX board or GFX fin, remove the cool sheet. Stick a new cool sheet on the GFX board in place. NOTE: Do not reuse the cool sheet. Be sure to use a new cool sheet. 2. Set the GFX fin to the GFX board and secure them with the following screws. • M2.
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4.22 CPU/CPU fin/DC fan 4 Replacement Procedures 4.22 CPU/CPU fin/DC fan Removing the CPU/CPU fin/DC fan To remove the CPU/CPU fin/DC fan, follow the steps below and refer to Figure 4-40 to 4-42. 1. Disconnect the fan harness from the connector CN8771 on the system board. 2. Remove the following screws and heat sink plate. • M2.0×4B ×4 BIND screw 3. Remove the following screws and CPU fin (with the DC fan). • M2.
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4 Replacement Procedures 4.22 CPU/CPU fin/DC fan 4. Remove the following screws and separate the DC fan and CPU fin. • M2.5×4B FLAT HEAD screw ×2 M2.
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4.22 CPU/CPU fin/DC fan 4 Replacement Procedures 5. Unlock the CPU by turning the cam counterclockwise on the CPU socket by 180 degrees with a flat-blade screwdriver. 6. Remove the CPU. Figure 4-42 Removing the CPU CAUTION: When removing the CPU, lift it up right above. Otherwise, pins of the CPU may be damaged.
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4 Replacement Procedures 4.22 CPU/CPU fin/DC fan Installing the CPU/CPU fin/DC fan To install the CPU/CPU fin/DC fan, follow the steps below and refer to Figure 4-40 to 4-44. 1. Make sure that the cam of the CPU socket is in the unlock (OPEN) position. 2. Set the CPU to the correct position in the CPU socket. Make sure the position of the CPU (triangle mark) is correct to avoid damaging pins on the CPU. 3.
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4.22 CPU/CPU fin/DC fan 4 Replacement Procedures 4. When silicon grease is already applied to the CPU or CPU fin, wipe them off with a cloth in advance. 5. Apply new grease (DENKA GFC-F1) on the CPU using a special syringe as shown in the following figure. Apply quarter of scale (0.25ml) of grease evenly on the CPU chip. Grease CPU Figure 4-44 Applying new grease 6. If there is already cool sheet on the North bridge or CPU fin, remove the cool sheet. Stick a new cool sheet on the North bridge in place.
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4 Replacement Procedures 4.23 PC card unit 4.23 PC card unit Removing the PC card unit To remove the PC card unit, follow the steps below and refer to Figure 4-45. 1. Remove the following screws securing the PC card unit. • M2.0×3C Tapping screw ×2 • M2.0×8C Tapping screw ×2 2. Remove the PC card unit while releasing the latches. Latch PC card unit M2.0x8C Tapping M2.0x3C Tapping M2.0x3C Tapping M2.
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4.23 PC card unit 4 Replacement Procedures Installing the PC card unit To install the PC card unit, follow the steps below and refer to Figure 4-45. 1. Set the PC card unit while engaging the latches and secure it with the following screws. • M2.0×3C Tapping screw ×2 • M2.
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4 Replacement Procedures 4.24 RTC battery 4.24 RTC battery CAUTION: Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the laws and ordinances of your local authority. Removing the RTC battery To remove the RTC battery, follow the steps below and refer to Figure 4-46. 1. Peel off the glass tape and disconnect the RTC battery harness from the connector CN9300 on the sound board. 2. Remove the insulator (RTC BATT INSULATOR) from the slot. 3.
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4.24 RTC battery 4 Replacement Procedures Installing the RTC battery To install the RTC battery, follow the steps below and refer to Figure 4-46. 1. Set the RTC battery into the insulator (RTC BATT INSULATOR). 2. Set the insulator (RTC BATT INSULATOR) to the slot. 3. Connect the RTC battery harness to the connector CN9300 on the sound board and stick the glass tape in place.
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4 Replacement Procedures 4.25 Sound board/Microphone harness 4.25 Sound board/Microphone harness Removing the Sound board/Microphone harness To remove the sound board/microphone harness, follow the steps below and refer to Figure 4-47. 1. Peel off the glass tape. 2. Remove the following screws and sound board/microphone harness from the slot. • M2.5×4B ×2 FLAT HEAD screw 3. Disconnect the microphone harness from the connector CN6050 on the sound board. 4.
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4.25 Sound board/Microphone harness 4 Replacement Procedures Installing the Sound board/Microphone harness To install the sound board/microphone harness, follow the steps below and refer to Figure 447. 1. Connect the sound board FFC to the connector CN9630 on the sound board. 2. Connect the microphone harness to the connector CN6050 on the sound board. 3. Set the sound board/microphone harness to the slot and secure it with the following screws. • M2.5×4B FLAT HEAD screw ×2 4.
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4 Replacement Procedures 4.26 Battery lock 4.26 Battery lock Removing the Battery lock To remove the battery lock, follow the steps below and refer to Figure 4-48. 1. Remove the battery lock button L while pushing latches inside to release them. 2. Turn up the insulator (BATT LOCK L INSULATOR) and remove the battery lock L from the slot. 3. Remove the battery lock button R while pushing latches inside to release them. 4. Remove the battery lock R from the slot.
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4.26 Battery lock 4 Replacement Procedures Installing the Battery lock To install the battery lock, follow the steps below and refer to Figure 4-48. 1. Insert the sticks of the battery lock L and battery lock R into the springs. 2. Turn up the insulator (BATT LOCK L INSULATOR) and set the battery lock L to the slot. 3. Set (push) the battery lock button L to the battery lock L until the latches are engaged. 4. Set the battery lock R to the slot. 5.
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4 Replacement Procedures 4 4.27 Touch pad/Fingerprint sensor board Replacement Procedures 4.27 Touch pad/Fingerprint sensor board Removing the Touch pad/Fingerprint sensor board To remove the touch pad/fingerprint sensor board, follow the steps below and refer to Figure 4-49 to 4-52. 1. Turn up the insulator (TPAD PLT INSULATOR) and remove the following screws. • M2.5×4B ×4 FLAT HEAD screw 2. Peel off the insulator (SQUARE INSULATOR). Insulator (SQUARE INSULATOR) M2.5x4B FLAT HEAD M2.
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4.27 Touch pad/Fingerprint sensor board 4 Replacement Procedures 3. Disconnect the touch pad FFC, touch pad button FFC and dual button FFC from the connector CN9650 and CN3240 on the fingerprint sensor board and connector on the touch pad. NOTE: In models without a dual button, there is no dual button FFC. 4. Remove the unit dual pad (with the fingerprint sensor board).
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4 Replacement Procedures 4.27 Touch pad/Fingerprint sensor board 5. Remove the following screws and separate the fingerprint sensor board and unit dual pad. • M2.0×3C S-THIN HEAD screw ×2 M2.
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4.27 Touch pad/Fingerprint sensor board 4 Replacement Procedures 6. Disconnect the touch pad button FFC from the connector on the touch pad and peel off the touch pad. NOTE: Do not reuse the removed touch pad. Be sure to use a new touch pad. Touch pad COVER ASSY Connector Touch pad button FFC Figure 4-52 Removing the touch pad/fingerprint sensor board (4) Please prepare required parts in advance, when replacing the following item.
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4 Replacement Procedures 4.27 Touch pad/Fingerprint sensor board Installing the Touch pad/Fingerprint sensor board To install the touch pad/fingerprint sensor board, follow the steps below and refer to Figure 4-49 to 4-52. 1. Connect the touch pad button FFC to the connector on a new touch pad and stick the touch pad in place. 2. Set the fingerprint sensor board to the unit dual pad and secure them with the following screws. • M2.0×3C S-THIN HEAD screw ×2 3.
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4.28 Bluetooth module 4 Replacement Procedures 4.28 Bluetooth module Removing the Bluetooth module To remove the Bluetooth module, follow the steps below and refer to Figure 4-53. 1. Lift up the hook and slide the Bluetooth holder in the direction in the figure below to remove it from the guides. 2. Remove the Bluetooth module from the guides.
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4 Replacement Procedures 4.29 Smart card unit 4.29 Smart card unit Removing the Smart card unit To remove the Smart card unit, follow the steps below and refer to Figure 4-54 1. Peel off the insulator fixing the Smart card FPC. 2. Pull the Smart card FPC from the hole 1 out, then pull the Smart card FPC from the hole 2 out. 3. Lift up the hook of the Smart card unit in the direction as shown in the figure below to remove the Smart card unit from the guides.
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4.29 Smart card unit 4 Replacement Procedures Installing the Smart card unit To install the Smart card unit, follow the steps below and refer to Figure 4-54. 1. Pass the Smart card FPC through the hole2 and slide the Smart card unit under the guides until the hook is engaged. 2. Arrange the Smart card FPC while passing through the hole1. 3. Stick the insulator in place.
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4 Replacement Procedures 4.30 LCD unit/FL inverter 4.30 LCD unit/FL inverter Removing the LCD unit/FL inverter To remove the LCD unit/FL inverter, follow the steps below and refer to Figure 4-55 to 4-59. 1. Remove the wireless LAN antenna cables and camera harness from the slot.
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4.30 LCD unit/FL inverter 4 Replacement Procedures 2. Peel off the LCD mask seals and remove the following screws. • M2.5×5B FLAT HEAD screw ×2 3. Separate the LCD cover and cover assembly while releasing the latches. LCD mask seal M2.5x5B FLAT HEAD Slit LCD cover M2.
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4 Replacement Procedures 4.30 LCD unit/FL inverter 4. Peel off the glass tape. 5. Disconnect the LCD harness and HV harness from the connectors on the both sides of the FL inverter and remove the FL inverter.
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4.30 LCD unit/FL inverter 4 Replacement Procedures 6. Remove two glass tapes and disconnect the LCD harness from the connector on the LCD unit.
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4 Replacement Procedures 4.30 LCD unit/FL inverter 7. Remove the following screws and LCD unit. • M2.0×3C BIND screw ×4 M2.0x3C BIND LCD unit M2.
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4.30 LCD unit/FL inverter 4 Replacement Procedures Installing the LCD unit/FL inverter To install the LCD unit/FL inverter, follow the steps below and refer to Figure 4-55 to 4-59 1. Place the LCD unit in place and secure it with the following screws. • M2.0×3C BIND screw ×4 2. Connect the LCD harness to the connector on the LCD unit and stick two glass tapes in place. 3. Connect the LCD harness and HV harness to the connectors on the both sides of the FL inverter and set the FL inverter in place. 4.
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4 Replacement Procedures 4.31 Camera module/Wireless LAN antenna/3G antenna 4.31 Camera module/Wireless LAN antenna/3G antenna Removing the Camera module/Wireless LAN antenna/3G antenna To remove the camera module/wireless LAN antenna/3G antenna, follow the steps below and refer to Figure 4-60. 1. Turn up the insulators (ANTENA HLD INSULATOR) and peel off the acetate tapes securing the wireless LAN antenna cables, 3G antenna cables and camera harness. 2.
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4.31 Camera module/Wireless LAN antenna/3G antenna 4 Replacement Procedures Please prepare required parts in advance, when replacing the following item. ITEM LCD COVER ASSY Parts List ITEM No 51 75 46,47 TECRA M10 Maintenance Manual (960-685) PART NAME Quantity LCD COVER ASSY CAMERA MODULE 2.4/5.
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4 Replacement Procedures 4.31 Camera module/Wireless LAN antenna/3G antenna Installing the Camera module/Wireless LAN antenna/3G antenna To install the camera module/wireless LAN antenna/3G antenna, follow the steps below and refer to Figure 4-60. 1. Stick new wireless LAN antennas in place. 2. Arrange the wireless LAN antenna cables in place. 3. Stick new 3G antennas in place. 4. Arrange the 3G antenna cables in place. 5. Peel off a protection sheet from a new camera module. 6.
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4.
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4 Replacement Procedures 4.
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4.
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4 Replacement Procedures 4-98 [CONFIDENTIAL] 4.
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4.
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4 Replacement Procedures 4-100 [CONFIDENTIAL] 4.
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4.32 LCD harness 4 Replacement Procedures 4.32 LCD harness Removing the LCD harness To remove the LCD harness, follow the steps below and refer to Figure 4-61 to 4-63. 1. Turn up the insulator and release the LCD harness from the guide.
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4 Replacement Procedures 4.32 LCD harness 2. Turn over the cover assembly. 3. Lift up the hook of the harness holder L and slide the harness holder L to remove it from the holes of the guides.
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4.32 LCD harness 4 Replacement Procedures 4. Remove the LCD harness from the guides and pass the LCD harness through the hole of the hinge. Hole LCD harness Guide Guide Figure 4-63 Removing the LCD harness (2) Installing the LCD harness To install the LCD harness, follow the steps below and refer to Figure 4-61 to 4-63. 1. Pass the LCD harness through the hole of the hinge and arrange the LCD harness under the guides. 2.
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4 Replacement Procedures 4.33 LCD mask 4.33 LCD mask Removing the LCD mask To remove the LCD mask, follow the steps below and refer to Figure 4-64 to 4-65. 1. Remove the following screws and stand the LCD mask. CAUTION: When standing the LCD mask, hold the LCD mask with the hinge and stand them carefully. • M2.5×4B FLAT HEAD screw ×2 • M2.5×6C Tapping screw ×2 M2.5x6C Tapping M2.5x4B FLAT HEAD LCD mask M2.
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4.33 LCD mask 4 Replacement Procedures 2. Remove the LCD mask.
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4 Replacement Procedures 4.33 LCD mask Installing the LCD mask To install the LCD mask, follow the steps below and refer to Figure 4-64 to 4-65. 1. Set the LCD mask to the hinge standing. 2. Lay the LCD mask down and secure it with the following screws. CAUTION: When laying the LCD mask down, hold the LCD mask with the hinge and lay them down carefully. 4-106 • M2.5×4B FLAT HEAD screw ×2 • M2.
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4.34 Hinge 4 Replacement Procedures 4.34 Hinge Removing the Hinge To remove the hinge, follow the steps below and refer to Figure 4-66 and 4-67. 1. Remove the following screw securing the brake hinge L. • M2.5×6C ×1 Tapping screw 2. Release two hooks and remove the brake hinge L through the hole. M2.
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4 Replacement Procedures 4.34 Hinge 3. Remove the following screws securing the brake hinge R. • M2.5×6C Tapping screw ×2 4. Remove brake hinge R through the hole. M2.5x6C Tapping M2.
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4.34 Hinge 4 Replacement Procedures Installing the Hinge To install the hinge, follow the steps below and refer to Figure 4-66 and 4-67. 1. Set the brake hinge R in place and secure it with the following screws. • M2.5×6C Tapping screw ×2 2. Set the brake hinge L while engaging two hooks and secure it with the following screw. • M2.
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4 Replacement Procedures 4.35 Fluorescent Lamp 4 4.35 Fluorescent Lamp This system uses LCD modules from the following suppliers. The procedure for replacing the fluorescent lamp is different for each LCD module. Refer to the appropriate procedure. Type Part No. Supplier Section G33C0004Q110 LG 4.35.1 G33C0004T110 Samsung 4.35.2 14.1-inch (WXGA+) G33C00043110 LG 4.35.3 14.1-inch (WXGA-CSV) G33C00050110 LG 4.35.4 14.
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4.35 Fluorescent Lamp 4.35.1 4 Replacement Procedures Replacing the 14.1-inch WXGA LG Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel and backlight unit. Removing the fluorescent lamp To remove the 14.1-inch WXGA LG fluorescent lamp, follow the steps below and refer to figures 4-68 to 4-71. Disassembly of outside tape/Cover shield 1. Disassembly of Tape Adhesive2 used for Top case fixing.
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4 Replacement Procedures 4.35 Fluorescent Lamp Disassembly of Top Case 1. Disassembly of Top Case1. CAUTION: Pressure or stress should not be given on PCB and COF. Figure 4-69 Replacing 14.
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4.35 Fluorescent Lamp 4 Replacement Procedures Disassembly of Source PCB 1. Disassembly of Source PCB1. CAUTION: Pressure or stress should not be given on PCB and COF. Figure 4-70 Replacing 14.
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4 Replacement Procedures 4.35 Fluorescent Lamp Disassembly of Board Ass’y, Tape Adhesive, Sheets, Light guide, Cover Ass’y Bottom (L) 1. Disassembly of Board Ass’y1. CAUTION: This process should be made in Clean room with no scratch nor particle on Polarizer and B/L Ass’y. 2. Disassembly of Tape Adhesive2 used for Sheets fixing (4Points). 3. Disassembly of Sheets and Light guide3. CAUTION: No penetration of foreign body is indispensable with any scratch on the surface of each Sheet. 1.
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4.35 Fluorescent Lamp 4 Replacement Procedures Installing the fluorescent lamp To install the 14.1-inch WXGA LG fluorescent lamp, follow the steps below and refer to figures 4-72 to 4-75. Assembly of Cover Ass’y Bottom (L), Sheets, Light guide, Tape Adhesive and Board Ass’y 1. Detach a release paper from Double Tape at the Cover Ass’y Bottom (L)1. 2. Assembly of Cover Ass’y and Screw (2Points)2. CAUTION: Maximum value of torque with Screw should be below 2.5kgf. 3. Assembly of Light Guide and Sheets3.
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4 Replacement Procedures 4.35 Fluorescent Lamp Assembly of Source PCB 1. Assembly of Source PCB1. CAUTION: Stress should not be given on COF. Figure 4-73 Replacing 14.
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4.35 Fluorescent Lamp 4 Replacement Procedures Assembly of Top Case 1. Assembly of Top Case1. CAUTION: Pressure should not be given on PCB and COF. Figure 4-74 Replacing 14.
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4 Replacement Procedures 4.35 Fluorescent Lamp Assembly of outside tape/Cover shield 1. Assembly of Cover shield (S)1. CAUTION: Pressure or stress should not be given on Source PCB. Usage of gloves with anti-electric discharge coating is recommended to eliminate possible damage on circuits occurred by ESD. 2. Assembly of Tape Adhesive2 used for Top case fixing. CAUTION: Pressure or stress should not be given on Top case during this process. Figure 4-75 Replacing 14.
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4.35 Fluorescent Lamp 4 Replacement Procedures 4.35.2 Replacing the 14.1-inch WXGA Samsung Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel and backlight unit. Removing the fluorescent lamp To replace the 14.1-inch WXGA Samsung fluorescent lamp, follow the steps below and refer to figures 4-76 to 4-79. 1. Remove the PCB cover. CAUTION: Handle with care not to damage COF of S/D. PCB cover Figure 4-76 Replacing 14.
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4 Replacement Procedures 4.35 Fluorescent Lamp 2. Remove the yellow tapes, lamp-wire tape and bottom Al tape. Yellow tape (right) Yellow tape (left) Bottom Al tape Lamp-wire tape Figure 4-77 Replacing 14.1-inch Samsung fluorescent lamp (WXGA) (2) 3. Remove the top chassis from the molded frame. CAUTION: Remove in the order of bottom hook and side hooks. Figure 4-78 Replacing 14.
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4.35 Fluorescent Lamp 4 Replacement Procedures 4. Separate the panel assembly and backlight unit. CAUTION: Handle with care not to damage COF of S/D. Panel assembly Figure 4-79 Replacing 14.1-inch Samsung fluorescent lamp (WXGA) (4) Installing the fluorescent lamp The installing procedure of the 14.1-inch WXGA Samsung fluorescent lamp is the reverse of the above disassembly procedure. Refer to figures 4-76 to 4-79. 1. Install the panel assembly on the backlight unit. 2.
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4 Replacement Procedures 4.35 Fluorescent Lamp 4.35.3 Replacing the 14.1-inch WXGA+ LG Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel and backlight unit. Removing the fluorescent lamp To remove the 14.1-inch WXGA+ LG fluorescent lamp, follow the steps below and refer to figures 4-80 to 4-83. Disassembly of outside tape / Cover shield 1. Disassembly of Tape Adhesive1 used for B/L Wire fixing. 2.
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4.35 Fluorescent Lamp 4 Replacement Procedures Disassembly of Top Case 1. Disassembly of Top Case1. CAUTION: Pressure or stress should not be given on PCB and COF. Figure 4-81 Replacing 14.
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4 Replacement Procedures 4.35 Fluorescent Lamp Disassembly of Source PCB 1. Disassembly of Source PCB1. CAUTION: Pressure or stress should not be given on PCB and COF. Figure 4-82 Replacing 14.
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4.35 Fluorescent Lamp 4 Replacement Procedures Disassembly of Board Ass’y, Tape Adhesive, Sheets, Light guide, Cover Ass’y Bottom (L) 1. Disassembly of Board Ass’y1. CAUTION: This process should be made in Clean room with no scratch nor particle on Polarizer and B/L Ass’y. 2. Disassembly of Tape Adhesive2 used for Sheets fixing (4 Points). 3. Disassembly of Sheets and Light guide3. CAUTION: No penetration of foreign body is indispensable with any scratch on the surface of each Sheet. 4.
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4 Replacement Procedures 4.35 Fluorescent Lamp Installing the fluorescent lamp To install the 14.1-inch WXGA+ LG fluorescent lamp, follow the steps below and refer to figures 4-84 to 4-87. Assembly of Cover Ass’y Bottom (L), Sheets, Light guide, Tape Adhesive and Board Ass’y 1. Detach a release paper from Double Tape at the Cover Ass’y Bottom (L)1. 2. Assembly of Cover Ass’y Bottom (L)1 and Screw (2 Points)2. CAUTION: Maximum value of torque with Screw should be below 2.5kgf.cm. 3.
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4.35 Fluorescent Lamp 4 Replacement Procedures Assembly of Source PCB 1. Assembly of Source PCB1. CAUTION: Stress should not be given on COF. Figure 4-85 Replacing 14.
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4 Replacement Procedures 4.35 Fluorescent Lamp Assembly of Top Case 1. Assembly of Top Case1. CAUTION: Pressure should not be given on PCB and COF. Figure 4-86 Replacing 14.
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4.35 Fluorescent Lamp 4 Replacement Procedures Assembly of Source PCB 1. Assembly of Source PCB & Cover shield(S)1. CAUTION: Pressure or stress should not be given on Source COF & Source PCB. Usage of gloves with anti-electric discharge coating is recommended. To eliminate possible damage on circuits occurred by ESC. 2. Assembly of Cover shield (G)2. CAUTION: Pressure or stress should not be given on Gate COF. 3. Assembly of Tape Adhesive3 used for Top case fixing. 4.
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4 Replacement Procedures 4.35 Fluorescent Lamp 4.35.4 Replacing the 14.1-inch WXGA-CSV LG Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel and backlight unit. Removing the fluorescent lamp To remove the 14.1-inch WXGA-CSV LG fluorescent lamp, follow the steps below and refer to figures 4-88 to 4-91. Disassembly of outside tape/Cover shield 1. Disassembly of Tape Adhesive2 used for Top case fixing.
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4.35 Fluorescent Lamp 4 Replacement Procedures Disassembly of Top Case 1. Disassembly of Top Case1. CAUTION: Pressure or stress should not be given on PCB and COF. Figure 4-89 Replacing 14.
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4 Replacement Procedures 4.35 Fluorescent Lamp Disassembly of Source PCB 1. Disassembly of Source PCB1. CAUTION: Pressure or stress should not be given on PCB and COF. Figure 4-90 Replacing 14.
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4.35 Fluorescent Lamp 4 Replacement Procedures Disassembly of Board Ass’y, Tape Adhesive, Sheets, Light guide, Cover Ass’y Bottom (L) 1. Disassembly of Board Ass’y1. CAUTION: This process should be made in Clean room with no scratch nor particle on Polarizer and B/L Ass’y. 2. Disassembly of Tape Adhesive2 used for Sheets fixing (4Points). 3. Disassembly of Sheets and Light guide3. CAUTION: No penetration of foreign body is indispensable with any scratch on the surface of each Sheet. 4.
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4 Replacement Procedures 4.35 Fluorescent Lamp Installing the fluorescent lamp To install the 14.1-inch WXGA-CSV LG fluorescent lamp, follow the steps below and refer to figures 4-92 to 4-95. Assembly of Cover Ass’y, Sheets, Light guide, Tape Adhesive and Board Ass’y 1. Detach a release paper from Double Tape at the Cover Ass’y Bottom (L)1. 1. Assembly of Cover Ass’y Bottom (L) and Screw (2Points)2. CAUTION: Maximum value of torque with Screw should be below 2.5kgf. 2. Assembly of Light Guide and Sheets3.
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4.35 Fluorescent Lamp 4 Replacement Procedures Assembly of Source PCB 1. Assembly of Source PCB1. CAUTION: Stress should not be given on COF. Figure 4-93 Replacing 14.
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4 Replacement Procedures 4.35 Fluorescent Lamp Assembly of Top Case 1. Assembly of Top Case1. CAUTION: Pressure should not be given on PCB and COF. Figure 4-94 Replacing 14.
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4.35 Fluorescent Lamp 4 Replacement Procedures Assembly of outside tape/Cover shield 1. Assembly of Cover shield (S)1. CAUTION: Pressure or stress should not be given on Source PCB. Usage of gloves with anti-electric discharge coating is recommended to eliminate possible damage on circuits occurred by ESD. 2. Assembly of Tape Adhesive2 used for Top case fixing. CAUTION: Pressure or stress should not be given on Top case during this process. Figure 4-95 Replacing 14.
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4 Replacement Procedures 4-138 [CONFIDENTIAL] 4.
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Appendices [CONFIDENTIAL]
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Appendices App-ii [CONFIDENTIAL] TECRA M10 Maintenance Manual (960-685)
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Appendices Appendix Contents Appendix A Handling the LCD Module ...........................................................................A-1 Appendix B Board Layout .................................................................................................B-1 B.1 System board (FG6IN *) Front View.....................................................................B-1 B.2 System board (FG6IN *) Back View .....................................................................B-3 B.
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Appendices C.10 CN2610 PCI-E Mini(3G/ROBSON) CARD interface connector (52-pin) ........C-15 C.11 CN3230 Keyboard interface connector (34-pin) ................................................C-16 C.12 CN4100 LAN interface connector (14-pin)........................................................C-17 C.13 CN4230 1394 interface connector (4-pin) ..........................................................C-17 C.14 CN4440 Bluetooth2 interface connector (10-pin) ..........................................
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Appendices C.38 CN9620 System board interface connector (12-pin) ..........................................C-34 Sound board (FG6SN*/FGGSN*/FGASN*) C.39 CN6050 Int-Mic interface connector (2-pin)......................................................C-35 C.40 CN9300 RTCVCC interface connector (3-pin) ..................................................C-35 C.41 CN9630 System board interface connector (30-pin) ..........................................C-36 C.42 J6051 Microphone connector (6-pin) .....
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Appendices Appendix G BIOS rewrite Procedures ............................................................................ G-1 Appendix H EC/KBC rewrite Procedures....................................................................... H-1 Appendix I Reliability .........................................................................................................
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Appendices Figures Figure B-1 System board (FG6IN*) layout (front).........................................................B-1 Figure B-2 System board (FG6IN*) layout (back).........................................................B-3 Figure B-3 System board (FGGIN*) layout (front)........................................................B-5 Figure B-4 System board (FGGIN*) layout (back) ........................................................B-7 Figure B-5 System board (FGAIN*) layout (front).......
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Appendices Table B-11 Finger/Pad Button board (FGGFS*) connector (back) ..................................B-17 Table B-12 Pad Button board (FGGTP*) connector (back)..............................................B-18 Table B-13 SIM board (FGGSM*) connector (back) .......................................................B-19 Table B-14 GPU board (FGGNM*) connector (back)......................................................B-20 Table B-15 ODD FPC (FGGOD*) connector (front/back)..................................
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Appendices Table C-26 FGGUS* board interface connector (30-pin).................................................C-24 Table C-27 FGGSM* board interface connector (10-pin) ................................................C-24 Table C-28 MEDIA BRIDGE interface connector (46-pin) .............................................C-25 Table C-29 EXPRESS CARD interface connector (26-pin).............................................C-26 Table C-30 GFX interface connector (230-pin) ......................................
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Appendices Table C-49 System board interface connector (230-pin) ..................................................C-41 ODD FPC (FGGOD*) Table C-50 System board interface connector (13-pin) ....................................................C-45 Table C-51 ODD interface connector (13-pin) .................................................................C-45 Table D-1 Scan codes (set 1 and set 2) .............................................................................
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Appendix A Handling the LCD Module Appendices Appendix A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
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Appendices Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4.
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Appendix A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
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Appendices Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
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Appendix A Handling the LCD Module Appendices 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxide). These materials can release gas that can damage the panel’s polarization.
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Appendices A-6 Appendix A Handling the LCD Module [CONFIDENTIAL ] TECRA M10 Maintenance Manual (960-685)
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Appendix B Board Layout Appendices Appendix B Board Layout B.
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Appendices Appendix B Board Layout Table B-1 System board (FG6IN*) connectors and ICs (front) Number B-2 Name CN2110 PC CARD I/F connector CN2170 Smart Card I/F connector CN2600 PCI-E MINI CARD I/F connector CN2610 PCI-E MINI(3G/ROBSON) CARD I/F connector CN3110 It is debugging port for development only CN3230 KB I/F connector CN4100 LAN I/F connector CN4440 Bluetooth2 I/F connector CN5000 LCD I/F connector CN6150 Speaker I/F connector CN9500 FGGSW* board I/F connector CN9510 RGB
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Appendix B Board Layout B.
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Appendices Appendix B Board Layout Table B-2 System board (FG6IN*) connectors and ICs (back) Number B-4 Name CN1400 Memory A connector CN1410 Memory B connector CN1900 SATA HDD I/F connector CN1950 SATA ODD I/F connector CN1970 eSATA/USB I/F connector CN2300 DOCKING I/F connector CN4230 1394 I/F connector CN8771 FAN I/F connector CN8800 DC-IN connector CN8810 Battery connector IS1050 CPU IC1200 North Bridge Cantiga IS2140 MEDIA BRIDGE I/F connector [CONFIDENTIAL] TECRA M10 Ma
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Appendix B Board Layout B.3 System board (FGGIN*) Front View: Appendices It is used by a GPU model.
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Appendices Appendix B Board Layout Table B-3 System board (FGGIN*) connectors and ICs (front) Number B-6 Name CN2110 PC CARD I/F connector CN2170 Smart Card I/F connector CN2600 PCI-E MINI CARD I/F connector CN2610 PCI-E MINI(3G/ROBSON) CARD I/F connector CN3110 It is debugging port for development only CN3230 KB I/F connector CN4100 LAN I/F connector CN4440 Bluetooth2 I/F connector CN5000 LCD I/F connector CN6150 Speaker I/F connector CN9500 FGGSW* board I/F connector CN9510 RGB
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Appendix B Board Layout B.4 System board (FGGIN*) Back View: Appendices It is used by a GPU model.
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Appendices Appendix B Board Layout Table B-4 System board (FGGIN*) connectors and ICs (back) Number B-8 Name CN1400 Memory A connector CN1410 Memory B connector CN1900 SATA HDD I/F connector CN1950 SATA ODD I/F connector CN1970 eSATA/USB I/F connector CN2300 DOCKING I/F connector CN4230 1394 I/F connector CN5900 GFX I/F connector CN8771 FAN I/F connector CN8800 DC-IN connector CN8810 Battery connector IS1050 CPU IC1200 North Bridge Cantiga IC1600 South Bridge ICH9M IS2140 M
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Appendix B Board Layout B.
PAGE 396
Appendices Appendix B Board Layout Table B-5 System board (FGAIN*) connectors and ICs (front) Number B-10 Name CN2110 PC CARD I/F connector CN2170 Smart Card I/F connector CN2600 PCI-E MINI CARD I/F connector CN3110 It is debugging port for development only CN3230 KB I/F connector CN4100 LAN I/F connector CN4440 Bluetooth2 I/F connector CN5000 LCD I/F connector CN6150 Speaker I/F connector CN9500 FGGSW* board I/F connector CN9510 RGB I/F connector CN9530 FGGSN* board I/F connecto
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Appendix B Board Layout B.6 Appendices System board (FGAIN*) Back View : It is used by a Andalusia model.
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Appendices Appendix B Board Layout Table B-6 System board (FGAIN*) connectors and ICs (back) Number B-12 Name CN1400 Memory A connector CN1410 Memory B connector CN1900 SATA HDD I/F connector CN1950 SATA ODD I/F connector CN1970 eSATA/USB I/F connector CN2300 DOCKING I/F connector CN4230 1394 I/F connector CN8771 FAN I/F connector CN8800 DC-IN connector CN8810 Battery connector IS1050 CPU IC1200 North Bridge Cantiga IS2140 MEDIA BRIDGE I/F connector [CONFIDENTIAL] TECRA M10 M
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Appendix B Board Layout Appendices B.
PAGE 400
Appendices B.
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Appendix B Board Layout B.
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Appendices Appendix B Board Layout B.
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Appendix B Board Layout Appendices B.
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Appendices Appendix B Board Layout B.
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Appendix B Board Layout Appendices B.
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Appendices Appendix B Board Layout B.14 GPU board (FGGNM*) View: It is used by a GPU model.
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Appendix B Board Layout Appendices B.
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Appendices B-22 Appendix B Board Layout [CONFIDENTIAL] TECRA M10 Maintenance Manual (960-685)
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Appendix C Pin Assignments Appendices Appendix C Pin Assignments System board (FG6IN*/FGGIN*/FGAIN*) C.1 CN1400 Memory A connector(200-pin) Table C-1 Memory A connector (200-pin) (1/3) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments Table C-1 Memory A connector (200-pin) (2/3) C-2 Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices Table C-1 Memory A connector (200-pin) (3/3) Pin No. Signal Name Pin No.
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Appendices C.2 Appendix C Pin Assignments CN1410 Memory B connector (200-pin) Table C-2 Memory B connector (200-pin) (1/3) C-4 Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices Table C-2 Memory B connector (200-pin) (2/3) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments Table C-2 Memory B connector (200-pin) (3/3) C-6 Pin No. Signal Name Pin No.
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Appendix C Pin Assignments C.3 Appendices CN1900 SATA HDD interface connector (20-pin) Table C-3 SATA HDD interface connector (20-pin) C.4 Pin No. Signal Name Pin No.
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Appendices C.5 Appendix C Pin Assignments CN1970 eSATA/USB interface connector (20-pin) Table C-5 eSATA/USB interface connector (20-pin) C-8 Pin No. Signal Name Pin No.
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Appendix C Pin Assignments C.6 Appendices CN2110 PC CARD interface connector (70-pin) Table C-6 PC CARD interface connector (70-pin)(1/2) Pin No. Signal Name Pin No.
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Appendices C.7 Appendix C Pin Assignments CN2170 Smart Card interface connector (10-pin) Table C-7 Smart Card interface connector (10-pin) C-10 Pin No. Signal Name Pin No.
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Appendix C Pin Assignments C.8 Appendices CN2300 DOCKING interface connector (140-pin) Table C-8 DOCKING interface connector (140-pin) (1/3) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments Table C-8 DOCKING interface connector (140-pin) (2/3) C-12 Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices Table C-8 DOCKING interface connector (140-pin) (3/3) Pin No. Signal Name Pin No.
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Appendices C.9 Appendix C Pin Assignments CN2600 PCI-E Mini CARD interface connector (52-pin) Table C-9 PCI-E Mini CARD interface connector (52-pin) Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices C.10 CN2610 PCI-E Mini(3G/ROBSON) CARD interface connector (52-pin) Table C-10 PCI-E Mini(3G/ROBSON) CARD interface connector (52-pin) Pin No. Signal Name Pin No.
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Appendices C.11 Appendix C Pin Assignments CN3230 Keyboard interface connector (34-pin) Table C-11 Keyboard interface connector (34-pin) C-16 Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices C.12 CN4100 LAN interface connector (14-pin) Table C-12 LAN interface connector (14-pin) Pin No. Signal Name Pin No. Signal Name 1 ACT-E3N 2 LINK-E3N 3 E3V 4 E3V 5 NC 6 NC 7 ZBIDDN-EXN 8 ZBIDDP-EXP 9 10 11 ZBIDCN-EXN ZBIDAP-EXP 12 ZBIDCP-EXP ZBIDAN-EXN 13 ZBIDBP-EXP 14 ZBIDBN-EXN C.13 CN4230 1394 interface connector (4-pin) Table C-13 1394 interface connector (4-pin) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments C.15 CN5000 LCD interface connector (40-pin) Table C-15 LCD interface connector (40-pin) C-18 Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices C.16 CN6150 Speaker interface connector (4-pin) Table C-16 Speaker interface connector (4-pin) Pin No. Signal Name Pin No. Signal Name 1 SPOTL-PXN SPOTR-PXP 2 SPOTL-PXP SPOTR-PXN 3 4 C.17 CN8771 FAN interface connector (4-pin) Table C-17 FAN interface connector (4-pin) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments C.18 CN8800 DC-IN connector (4-pin) Table C-18 DC-IN connector (4-pin) Pin No. Signal Name Pin No. Signal Name 1 ADPDC 15V GND 2 ADPDC 15V GND 3 4 C.19 CN8810 Battery connector (10-pin) Table C-19 Battery connector (10-pin) C-20 Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices C.20 CN9500 FGGSW* board interface connector (8-pin) Table C-20 FGGSW* board interface connector (8-pin) Pin No. Signal Name Pin No. Signal Name 1 PWRSW-S3N 2 3 4 5 GPBTNB-S3N NC GPBTNA-S3N PNLOFF-S3N 6 S3V 7 SERDBG-P3N 8 GND 1T GND 2T GND C.21 CN9510 RGB interface connector (12-pin) Table C-21 RGB interface connector (12-pin) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments C.22 CN9520 FGGSR* board interface connector (12-pin) Table C-22 FGGSR* board interface connector (12-pin) Pin No. Signal Name Pin No. Signal Name 1 GND 2 3 4 5 P3V RING-P3N KRSSD-P3N DCD-P3N 6 DTR-P3N 7 CTS-P3N 8 GND 9 RTS-P3N 10 DSR-P3N 11 TXD-P3P 12 RXD-P3P 1T GND 2T GND C.23 CN9530 FGGSN* board interface connector (30-pin) Table C-23 FGGSN* board interface connector (30-pin) C-22 Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices C.24 CN9540 WebCam interface connector (6-pin) Table C-24 WebCam interface connector (6-pin) Pin No. Pin No. 1 Signal Name P5V 2 Signal Name ZUSBCM-E3N 3 ZUSBCM-E3P 4 GND 5 GND 6 CAMDET-P3N C.25 CN9550 FGGFS* board interface connector (14-pin) Table C-25 FGGFS* board interface connector (14-pin) Pin No. Signal Name Pin No.
PAGE 432
Appendices Appendix C Pin Assignments C.26 CN9560 FGGUS* board interface connector (30-pin) Table C-26 FGGUS* board interface connector (30-pin) Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices C.28 IS2140 MEDIA BRIDGE interface connector (46-pin) Table C-28 MEDIA BRIDGE interface connector (46-pin) Pin No. Signal Name Pin No.
PAGE 434
Appendices Appendix C Pin Assignments C.29 IS2520 EXPRESS CARD interface connector (26-pin) Table C-29 EXPRESS CARD interface connector (26-pin) C-26 Pin No. Signal Name Pin No.
PAGE 435
Appendix C Pin Assignments Appendices C.30 CN5900 GFX interface connector (230-pin) Table C-30 GFX interface connector (230-pin)(1/4) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments Table C-30 GFX interface connector (230-pin)(2/4) C-28 Pin No. Signal Name Pin No.
PAGE 437
Appendix C Pin Assignments Appendices Table C-30 GFX interface connector (230-pin)(3/4) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments Table C-30 GFX interface connector (230-pin)(4/4) C-30 Pin No. Signal Name Pin No.
PAGE 439
Appendix C Pin Assignments Appendices P-SW board (FG6SW*/FGGSW*/FGASW*) C.31 CN9500 System board interface connector (4-pin) Table C-31 System board interface connector (4-pin) Pin No. Signal Name Pin No.
PAGE 440
Appendices Appendix C Pin Assignments USB/MDC board (FG6US*/FGGUS*/FGAUS*) C.32 CN3010 MDC interface connector (12-pin) Table C-32 MDC interface connector (12-pin) C33 Pin No. Signal Name Pin No. Signal Name 1 GND 2 NC 3 AZSDO1-P3P 4 NC 5 GND 6 E3V 7 AZSYC1-P3P 8 GND 9 AZSDIM-P3P 10 GND 11 AZRST1-E3N 12 XAZBC1-P3P 1T GND 2T GND 3T GND 4T GND 5T GND 6T GND CN4610 USB interface connector (4-pin) Table C-33 USB interface connector (4-pin) C34 Pin No.
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Appendix C Pin Assignments Appendices C.35 CN4621 USB interface connector (4-pin) Table C-35 USB interface connector (4-pin) Pin No. Signal Name Pin No. Signal Name 1 USB1PS-E5V 2 ZUSBP0-E3N 3 ZUSBP0-E3P 4 GND 1T GND 2T GND 3T GND C.36 CN9660 System board interface connector (30-pin) Table C-36 System board interface connector (30-pin) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments Serial board (FG6SR*/FGGSR*) C.37 CN3420 Serial interface connector (9-pin) Table C-37 Serial interface connector (9-pin) Pin No. Signal Name Pin No. Signal Name 1 DCD-PYP 2 RXD-PYN 3 TXD-PYN 4 DTR-PYP 5 GND 6 DSR-PYP 7 RTS-PYP 8 CTS-PYP 9 RING-PYP 1T GND 2T GND C.38 CN9620 System board interface connector (12-pin) Table C-38 System board interface connector (12-pin) C-34 Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices Sound board (FG6SN*/FGGSN*/FGASN*) C.39 CN6050 Int-Mic interface connector (2-pin) Table C-39 Int-Mic interface connector (2-pin) Pin No. Signal Name Pin No. Signal Name 1 IMICIN-PXP 2 GND C.40 CN9300 RTCVCC interface connector (3-pin) Table C-40 RTCVCC interface connector (3-pin) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments C.41 CN9630 System board interface connector (30-pin) Table C-41 System board interface connector (30-pin) C-36 Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices C.42 J6051 Microphone connector (6-pin) Table C-42 Microphone connector (6-pin) Pin No. Signal Name Pin No. Signal Name 1 GND 2 EMICIN-PXP 3 EMICB-P2V 4 GND 5 DETCTA-P4N 6 EMICB-P2V C.43 J6310 Headphone connector (6-pin) Table C-43 Headphone connector (6-pin) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments Finger/Pad Button board (FGGFS*) C.44 CN3240 Dual point interface connector (12-pin) Table C-44 Dual point interface connector (12-pin) Pin No. Signal Name Pin No. Signal Name 1 GND 2 TPBTNL-P5N 3 TPBTNR-P5N 4 NC 5 SP-P5V 6 SPX-PXP 7 SPY-PXP 8 SP-GND 9 GND 10 IPDCLK-P5P 11 IPDDAT-P5P 12 P5V 1T GND 2T GND C.45 CN9650 System board interface connector (14-pin) Table C-45 System board interface connector (14-pin) C-38 Pin No.
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Appendix C Pin Assignments Appendices Pad Button board (FGGTP*) C.46 CN3240 Dual point interface connector (12-pin) Table C-46 Dual point interface connector (12-pin) Pin No. Signal Name Pin No. Signal Name 1 GND 2 TPBTNL-P5N 3 TPBTNR-P5N 4 NC 5 SP-P5V 6 SPX-PXP 7 SPY-PXP 8 SP-GND 9 GND 10 IPDCLK-P5P 11 IPDDAT-P5P 12 P5V 1T GND 2T GND C.47 CN9650 System board interface connector (14-pin) Table C-47 System board interface connector (14-pin) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments SIM board (FGGSM*) C.48 CN9670 System board interface connector (10-pin) Table C-48 System board interface connector (10-pin) C-40 Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices GPU board (FGGNM*) C.49 CN2451 System board interface connector (230-pin) Table C-49 System board interface connector (230-pin) (1/4) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments Table C-49 System board interface connector (230-pin) (2/4) C-42 Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices Table C-49 System board interface connector (230-pin) (3/4) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments Table C-49 System board interface connector (230-pin) (4/4) C-44 Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices ODD FPC (FGGOD*) C.50 CN1960 System board interface connector (13-pin) Table C-50 System board interface connector (13-pin) Pin No. Signal Name Pin No. Signal Name S1 GND S2 ZSTTOD-P1P S3 ZSTTOD-P1N S4 GND S5 ZSTROD-P1N S6 ZSTROD-P1P S7 GND P1 DVPRSN-P5N P2 P5V P3 P5V P4 NC P5 GND P6 GND 1T GND 2T GND 3T GND C.51 CN1961 ODD interface connector (13-pin) Table C-51 ODD interface connector (13-pin) Pin No. Signal Name Pin No.
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Appendices C-46 [CONFIDENTIAL] Appendix C Pin Assignments TECRA M10 Maintenance Manual (960-685)
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Appendix D Keyboard Scan/Character Codes Appendices Appendix. D Appendix D Keyboard Scan/Character Codes D.1 Scan Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap No.
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Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) D-2 Cap No.
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Appendix D Keyboard Scan/Character Codes Appendices Table D-1 Scan codes (set 1 and set 2) (3/4) Cap No.
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Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap No. Keytop Code set 1 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 126 Pause *7 *7 *7 *7 *7 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Make Code set 2 Break Make Note Break Notes: 1. 2. 3. 4. 5. 6. 7. D-4 * * * * * * * Scan codes differ by mode.
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Appendix D Keyboard Scan/Character Codes Appendices Table D-2 Scan codes with left Shift key Cap Key Code set 1 No.
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Appendices Appendix D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
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Appendix D Keyboard Scan/Character Codes Appendices Table D-5 Scan codes in overlay mode Cap No.
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Appendices Appendix D Keyboard Scan/Character Codes Table D-7 No.126 key scan code Key top Pause Shift Code set 1 Code set 2 Make Make Common* E1 1D 45 E1 Ctrl* E0 C6 E0 46 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E 14 F0 77 *: This key generates only make codes.
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Appendix E Key Layout Appendices 4 Appendix E E.1 Key Layout United Kingdom (UK) Keyboard Figure E-1 UK keyboard E.
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Appendices E-2 Appendix E Key Layout [CONFIDENTIAL] TECRA M10 Maintenance Manual (960-685)
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Appendix F Wiring diagrams Appendices 4 Appendix F F.1 Wiring diagrams RGB Monitor Loopback Connector Figure F-1 RGB Monitor Loopback Connector F.
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Appendices F.3 Appendix F Wiring diagrams RS-232C direct connection cable (9-pin to 9-pin) Figure F-3 RS-232C direct connection cable (9-pin to 9-pin) F.
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Appendix F Wiring diagrams F.
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Appendices F-4 Appendix F Wiring diagrams [CONFIDENTIAL] TECRA M10 Maintenance Manual (960-685)
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Appendix G BIOS rewrite procedures Appendices Appendix G Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk Rewriting the BIOS 1. Set the system to boot mode. 2. Turn off the power to the computer. 3. Remove the external cables and cards. 4. Connect an external FDD and insert the BIOS rewriting disk into the external FDD. 5.
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Appendices G-2 Appendix G BIOS rewrite procedures [CONFIDENTIAL] TECRA M10 Maintenance Manual (960-685)
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Appendix H EC/KBC rewrite procedures Appendices Appendix H Appendix H EC/KBC Rewrite Procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. It is necessary to rewrite the EC/KBC system program when the following changes are made. 1. Replacing of system board 2. Replacing of LCD Tools To rewrite the EC/KBC, you need the following tool: EC/KBC rewriting disk for the computer Rewriting the EC/KBC NOTE: 1.
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Appendices H-2 Appendix H EC/KBC rewrite procedures [CONFIDENTIAL] TECRA M10 Maintenance Manual (960-685)
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Appendix I Reliability Appendix I Appendices Reliability Appendix I Reliability The following table shows MTBF (Mean Time Between Failures) in maximum configuration.
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Appendices I-2 Appendix I Reliability [CONFIDENTIAL] TECRA M10 Maintenance Manual (960-685)