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Toshiba Personal Computer

Satellite M300

Satellite Pro M300

Maintenance Manual

TOSHIBA CORPORATION

File Number 960-Q08

Summary of content (242 pages)

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Toshiba Personal Computer Satellite M300 Satellite Pro M300 Maintenance Manual TOSHIBA CORPORATION File Number 960-Q08
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Copyright © 2003 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein. Toshiba Personal Computer Harrison 10S10SG Maintenance Manual First edition Feb 2008 Disclaimer The information presented in this manual has been reviewed and validated for accuracy.
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Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer Satellite M300 and Satellite Pro M300 Series. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field. SAFETY PRECAUTIONS Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.
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The manual is divided into the following parts: Chapter 1 Hardware Overview describes the Satellite M300 and Satellite Pro M300 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
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Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
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Table of Contents Chapter 1 Hardware Overview 1.1 Features ..........................................................................................................................1 1.2 System Block Diagram ..................................................................................................5 1.3 2.5-inch Hard Disk Drive...............................................................................................9 1.4 Optical Drive.....................................................
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2.4 2.5 2.6 2.7 2.8 System Board Troubleshooting................................................................................... 13 Procedure 1 Message Check ....................................................................... 14 Procedure 2 Debugging Port Check............................................................ 16 Procedure 3 Diagnostic Test Program Execution Check ............................ 21 Procedure 4 Replacement Check ......................................................
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2.9 2.10 2.11 2.12 2.13 2.14 2.15 2.17 Display Troubleshooting..............................................................................................35 Procedure 1 External Monitor Check...........................................................35 Procedure 2 Diagnostic Test Program Execution Check .............................35 Procedure 3 Connector and Cable Check ....................................................36 Procedure 4 Replacement Check ...................................
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3.4 System Test.............................................................................................................. 3-11 3.5 Memory Test............................................................................................................ 3-13 3.6 Keyboard Test.......................................................................................................... 3-16 3.7 Display Test ...................................................................................................
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3.21.4 ..... Test Stop Display……………………………………………………3-64 3.21. 5 How to enter data ……………………………………………………3-64 Chapter 4 4.1 Replacement Procedures Overview.................................................................................................................... 4-1 Safety Precautions................................................................................................ 4-2 Before You Begin ................................................................................................
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Appendices Appendix A Handling the LCD Module ........................................................................... A-1 Appendix B Board Layout ................................................................................................ B-1 Appendix C Pin Assignments............................................................................................ C-1 Appendix D Keyboard Scan/Character Codes ..................................................................
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Chapter 1 Hardware Overview Satellite M300 and Satellite Pro M300 Maintenance Manual(960-Q08)
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Chapter 1 Hardware Overview Chapter 1 Contents 1.1 Features ..........................................................................................................................1 1.2 System Block Diagram ..................................................................................................5 1.3 2.5-inch Hard Disk Drive...............................................................................................9 1.4 Optical Drive...................................................
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Hardware Overview Chapter 1 Figures Figure 1-1 Front of the computer.........................................................................................4 Figure 1-2 System block diagram........................................................................................5 Figure 1-3 2.5-inch HDD.....................................................................................................9 Figure 1-4 DVD-ROM & CD-R/RW drive ..............................................................
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Chapter 1 Hardware Overview Features 1.1 Features The Satellite M300 (Intel Platform) series are 2 spindle PCs running Intel® Celeron® Processor 540 or higher. Intel® Core™ 2 Duo Processor (667MHz) T5450 or higher. Intel® Core™ 2 Duo Processor (800MHz) T8100 or higher. The features are listed below. θ Microprocessor Microprocessor that is used will be different by the model. It supports processors as follows Intel Core 2 Duo FSB : 667 MHz T5450(1.67GHz) T5550(1.83GHz) T5750(2.
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Chapter 1 Hardware Overview Two DDRII SO-DIMM (667/800MHz specification compliant) up to 2GB for GL960 can be upgraded through Memory Module Slot. Maximum upgradeable system memory may depend on the model θ VRAM Shared with System RAM for Intel GM965/GL960 θ HDD 120GB, 160GB, 200GB, 250GB, 320GB internal drives. 2.5 inch x 9.5mm height. θ USB FDD (Option) Toshiba external USB FDD for option θ Display LCD (CCFL) 14.
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Chapter 1 Hardware Overview The main battery is a detachable lithium ion battery. 3 cell Li-Ion 10.8v/1800mAh 6 cell Li-Ion 10.8v/4800mAh 9 cell Li-Ion 10.8v/7200mAh θ USB (Universal Serial Bus) 3 USB ports are provided. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported. θ Sound system Internal stereo speaker, Internal MIC (Option) external monaural microphone connector, stereo headphone connector.
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Chapter 1 Hardware Overview Figure 1-1 Front of the computer Satellite M300 and Satellite Pro M300 Maintenance Manual (960-Q02) 4
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Chapter 1 Hardware Overview 1.2 System Block Diagram Figure 1-2 shows the system block diagram. 1.
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Chapter 1 Hardware Overview The PC contains the following components. θ CPU Intel Core 2 Duo FSB : 667 MHz T5450(1.67GHz) T5550(1.83GHz) T5750(2.0GHz) FSB: 800MHz T8100(2.1GHz) T8300(2.4GHz) T9300(2.5GHz) T9500(2.6GHz) Intel Celeron FSB : 533MHz M540 (1.86GHz) M550 (2.0GHz) M560(2.13GHz) θ Memory Two memory slots capable of accepting DDRII-SDRAM 512MB,1GB or 2GB memory modules for a maximum of 2GB for GL960 • • • 200-pin SO-DIMM 1.
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Chapter 1 Hardware Overview − − − − • Merom-M processor System Bus support DRAM Controller : DDRII 533/667 support DMI 1299-ball 35 x 35mm Mirco FC-BGA Package South Bridge (Intel 82801HBM ICH8-M) − − − − − − − − − − − − − − − − − Direct Media Interface (DMI) PCI Express Serial ATA (SATA) Controller PCI Interface IDE Interface Low Pin count (LPC) interface Serial Peripheral Interface (SPI) DMA controller Advanced Programmable Interrupt Controller (APIC) USB Controllers Gigabit Ethernet Controller RTC G
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Chapter 1 Hardware Overview • • • • • • EC/KBC –[W/CIR(Winbond WPCE775CA0DG)] –[WO/CIR(Winbond WPCE775LA0DG)] HD Audio (CONEXANT CX20561-12Z) Audio AMP (GMT G1441R51U) Card Reader controller (O2 OZ129TN) 10/100 LAN controller (Marvell 88E8040T-A0-NNC1C000) Giga LAN controller (Marvell 88E8072-B1-NNC1C000) θ Mini Card Wireless LAN card (BTO) 2.4 GHz DSSS/OFDM LAN card is equipped. Conformity with IEEE 802.11b/g and IEEE 802.11a/b/g.. Transfer speed maximum is 54Mbit/sec. supports 128bit WEP.
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Chapter 1 Hardware Overview 1.3 2.5-inch Hard Disk Drive A compact, high-capacity HDD with a height of 9.5mm. Contains a 2.5-inch magnetic disk and magnetic heads. Figure 1-3 shows a view of the 2.5-inch HDD and Tables 1-1 and 1-2 list the specifications. Figure 1-3 2.5-inch HDD Table 1-1 2.
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Chapter 1 Hardware Overview Standard value Parameter Outline Dimensions Hitachi HTS542512k9SA00 Width (mm) Height (mm) Depth (mm) Weight (g) Hitachi HTS542516k9SA00 Hitachi HTS542520K9SA00 Hitachi HTS542525k9SA00 69.85 +/- 0.25 9.5 +/- 0.2 100.2 +/- 0.25 95 max 102 max 102 max 102 max Table 1-2 2.
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Chapter 1 Hardware Overview (MB/s) Average random seek time (read) (ms) 12.0ms/14.0ms Power-on-to-ready 4.0s Specification Parameter storage size(formatted) Speed (RPM) Data transfer Rate - To/From Media T0/From Host bus transfer rate (MB/s) Average random seek time (read) (ms) Power-on-toready (sec) Hitachi HTS542516k9SA00 Hitachi HTS542520K9SA00 Hitachi HTS542525k9SA00 Hitachi HTS542525k9SA00 120GB 160GB 200GB 250GB 5400 665 (Mb/s), (max) 150 (MB/s 11 ms 3.
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Chapter 1 Hardware Overview 1.4 Optical Drive 1.4.1 DVD-ROM & CD-R/RW Drive The DVD-ROM & CD-R/RW drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15inch) CD/DVD-ROM and CD-R/RW. It is a high-performance drive that reads DVD at maximum 8-speed and CD at maximum 24-speed. The DVD-ROM & CD-R/RW drive is shown in Figure 1-4. The dimensions and specifications of the DVD-ROM & CD-R/RW drive are described in Table 1-3, Table 1-4.
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Chapter 1 Hardware Overview Table 1-4 DVD-ROM & CD-R/RW drive specifications (1/3) Parameter Drive Specification TEAC DW-224E-VT7 Read (KB/s) Write Data transfer speed Access time (ms) (Random) CD-R:24x CAV,16x CAV, 10x CLV, 4x CLV MS CDRW:4x CLV HS CD-RW:10x CAV, 10x CLV, 4x CLV US CDRW:24x CAV, 10x CLV US+ CD-RW:Not supported ATAPI interface (MB/s) Programmed I/O 16.7MB/sec max(Mode 0 to 4) Multi-word DMA 16.7MB/sec max(Mode 0 to 2) Ultra DMA 33.
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Chapter 1 Hardware Overview 1.4.2 DVD Super Multi Drive The DVD Super Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD/DVD-ROM, CD-R/RW, DVD±R/±RW and DVD-RAM. It is a high-performance drive that reads DVD-ROM at maximum 8-speed and CD at maximum 24-speed. Write speed of DVD±R/±RW and DVD-RAM is different depending on the drive. The DVD Super Multi drive is shown in Figure 1-5. The dimensions and specifications of the DVD Super Multi drive are described in Table 1-5, Table 1-8.
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Chapter 1 Hardware Overview Table 1-6 DVD Super Multi drive specifications (1/4) Drive Specification Parameter Read (KB/s) TST TST PNR PNR TS-L632H TS-L632P DVR-KD08TBT DVR-KD08TBL CD-ROM 3600 KB/s CD-R 3600 KB/s CD-RW 3600 KB/s DVD-ROM(L) 10800 KB/s DVD+/-R Dual8100KB/s DVD-RAM 6750 KB/s CD-ROM 3600 KB/s CD-R 3600 KB/s CD-RW 3600 KB/s DVD-ROM(SL) 10800 KB/s DVD+/-R Dual 8100 KB/s DVD-RAM 6750 KB/s CDInner 1,545 Outer 3,600 (10.
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Chapter 1 Hardware Overview Layer Disc is used) 2M Buffer memory 2M 2 Mbytes Layer Disc is use 2 Mbytes CD 650MB CDROMR(Rad Only) 80mm CD(Horizontal Mount only) 800/700/650 CDRecordable (Read & Write) 700/650 MB CD-Rewritable (Read & Write) 700/650MB High Speed CD-Rewritable (Read & Write) 700/650 MB Ultra Speed CD-Rewritable (Read & Write) Ultra+ Speed CD-Rewritable (Read Only) 650MB CDROMR(Read Only) 80mm CD(Horizontal Mount only) 800/700/650 CDRecordable (Read & Write) 700/650 MB CD-Rewritable (R
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Chapter 1 Hardware Overview 1.5 Keyboard The Harrison10S/10SG keyboard has two different kinds of placement, one is for JP style and the other is for US/UK style.
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Chapter 1 Hardware Overview See Appendix E for details of the keyboard layout.
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Chapter 1 Hardware Overview 1.6 TFT Color Display The Satellite M300 Panel has 1 model, CCFL backlight. 1.6.1 LCD Module with CCFL Backlight Figure 1-7 ~ 1-10 shows a view of the LCD module and Table 1-7 lists the specifications.
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Chapter 1 Hardware Overview Figure 1-8 AUO LCD Module Figure 1-9 Samsung LCD Module Satellite M300 and Satellite Pro M300 Maintenance Manual (960-Q02) 20
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Chapter 1 Hardware Overview Figure 1-10 CMO LCD Module Table 1-7 LCD module specifications Specifications(WXGA) Item Number of Dots Dot spacing (mm) LG LP141WX3TLN1 AUO B141EW04 V4 Samsung LTN141AT03401 1,280x 800 0.237(H)× 0.
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Chapter 1 Hardware Overview 1.6.2 CCFL Inverter Board Table 1-10 lists the FL inverter board specifications. Table 1-8 FL inverter board specifications Specifications Foxconn T18I095.00 Delta DAC-08N035 AF SUMIDA TWS-449-308 TDK TBD485NR Voltage (V) 8~20 8~20 8~20 8~20 Power (W) 7.5W 7.5W 7.5W 7.5W 612~945 612~945 612~945 612~945 Item Input Voltage (Vrms) Output Current (f=55KHz)(mArms) 2.3±0.4 ~ 6.5±0.
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Chapter 1 Hardware Overview 1.7 Power Rails Table 1-9 lists the power rail output specifications of Santa Rosa platform. Table 1-9 Santa Rosa Power supply output rating Power supply （Yes/No） Name Voltage [V] Power OFF Suspend mode Power OFF Boot mode No Battery +5VPCU 5 Yes Yes No +5V_S5 5 Yes No No +5V 5 No No No +5VSATA 5 No No No USBPWR 5 No No No +5V_TP 5 No No No VCCRTC 3.3 Yes Yes Yes TH_FAN_POWER 3.1~5 No No No +3VPCU 3.3 Yes Yes No +3V_S5 3.
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Chapter 1 Hardware Overview 1.8 Batteries The PC has the following two batteries. θ Main battery θ Real time clock (RTC) battery Table 1-10 lists the specifications for these two batteries. Table 1-10 Battery specifications Battery Name Battery Element Output Voltage Capacity 10.8v 1800mAh 10.8v 3700mAh 10.8v 4800mAh 10.8v 7200mAh 3V 16mAh Sanyo 3 cell Sanyo 6 Cells Main battery Sanyo Lithium ion 6 cells Sanyo 9 cell Real time clock (RTC) battery VARTA ML1220 Lithium ion 1.8.
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Chapter 1 Hardware Overview 1.8.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and detects a full charge when the AC adaptor and battery are connected to the computer. θ Battery Charge When the AC adapter is connected, normal charging is used while the system is turned on and quick charge is used while the system is turned off. Refer to the following Table 1-11.
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Chapter 1 Hardware Overview 1.8.3 RTC Battery The RTC battery provides the power supply to maintain the date, time, and other system information in memory. Table 1-13 lists the Time required for charges of RTC battery and data preservation time.
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Chapter 1 Hardware Overview 1.9 AC Adapter The AC adapter is used to charge the battery. Table 1-14 lists the AC adapter specifications. Table 1-14 AC adapter specifications Parameter With Led Power Input voltage Specification DELTA/ LITE-ON DELTA/ LITE-ON 90W 75W AC 100V/240V AC 100V/240V Input frequency Input current 50Hz/60Hz ≦ 1.5A Output voltage Output current ≦ 1.5A DC 19V 4.74A Satellite M300 and Satellite Pro M300 Maintenance Manual (960-Q02) 27 3.
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Chapter 2 Troubleshooting Procedures Satellite M300 and Satellite Pro M300 Maintenance Manual(960-Q08 2-1
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Chapter 2 Contents 2.1 Troubleshooting ............................................................................................................ 1 2.2 Troubleshooting Flowchart........................................................................................... 3 2.3 Power Supply Troubleshooting..................................................................................... 7 2.4 2.5 2.6 2.7 2.8 Procedure 1 Power Status Check ......................................................
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2.9 2.10 2.11 2.12 2.13 2.14 2.15 2.17 Display Troubleshooting............................................................................................. 35 Procedure 1 External Monitor Check.......................................................... 35 Procedure 2 Diagnostic Test Program Execution Check ............................ 35 Procedure 3 Connector and Cable Check.................................................... 36 Procedure 4 Replacement Check ...................................
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2 Troubleshooting Procedures 2 2.1 Troubleshooting Chapter 2 describes how to determine which Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. The FRUs covered are: 1. Power supply 6. Touch pad 11. Wireless LAN 2. System Board 7. Display 12. Sound 3. USB FDD 8. Optical Disk Drive 13, Finger Print Board 4. 2.5” HDD 9. Modem 14, Bluetooth 5. Keyboard 10. LAN The Test Program operations are described in Chapter 3.
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2 Troubleshooting Procedures There are following two types of connections in the figure of board and module connection in and after 2.3 Power Supply Troubleshooting. (1) Cable connection is described in the figure as line. (2) Pin connection is described in the figure as arrow.
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2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which troubleshooting procedures to execute. Before going through the flowchart steps, verify the following: Ask him or her to enter the password if a password is registered. Verify with the customer that Toshiba Windows is installed on the hard disk. NonWindows operating systems can cause the computer to malfunction. Make sure all optional equipment is removed from the computer.
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2 Troubleshooting Procedures Figure 2-1 Troubleshooting flowchart (1/2) Satellite M300 and Satellite Pro M300 Maintenance Manual (960-Q08) 4
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2 Troubleshooting Procedures Figure 2-1 Troubleshooting flowchart (2/2) Satellite M300 and Satellite Pro M300 Maintenance Manual (960-Q08) 5
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2 Troubleshooting Procedures If the diagnostics program cannot detect an error, the problem may be intermittent. The Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error(s), and then perform the appropriate troubleshooting procedures as follows: 1.
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2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
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2 Troubleshooting Procedures Table 2-2 DC IN icon DC IN icon Power supply status Lights blue or white DC power is being supplied from the AC adapter. Blinks orange Power supply malfunction*1 Doesn’t light Any condition other than those above. *1 when the power supply controller detects a malfunction, the DC IN icon blinks orange. It shows an error code. When the icon is blinking, perform the following procedure. 1. Remove the battery pack and the AC adapter. 2.
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2 Troubleshooting Procedures 40 80 ?? Seek Error Time Out Error Other Error HDD 1 2 4 5 7 9 0A 0B 10 11 20 40 80 AA Bad Command Error Bad Address Mark Error Record Not Found HDC Not Reset Error Drive Not Initialized DMA Boundary Error Bad Sector Bad Track Error ECC Error ECC Recover Enabled HDC Error Seek Error Time Out Error Drive Not Ready HDD BB CC E0 F0 ?? Undefined Error Write Fault Status Error No Sense Error Other Error Cache Memory 2 3 ?? Protect Mode Error Caching Error Other Error Multi
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2 Troubleshooting Procedures Procedure 3 Connection Check The wiring diagram related to the power supply is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Make sure the AC adapter and the AC power cord is firmly plugged into the DC IN connector PCN1 and wall outlet. If these cables are connected firmly, go to Check 2. Check 2 Replace the AC adapter and the AC power cord with new ones. • • Check 3 If the DC IN icon does not light, go to Procedure 5.
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2 Troubleshooting Procedures Check 5 Replace the battery pack with a new one. If the battery pack is still not charged, go to Procedure 5.
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2 Troubleshooting Procedures Procedure 5 Replacement Check The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4, Replacement Procedures. When AC adapter is connected; Check 1 AC adapter may be faulty. Replace the AC adapter with a new one. If the problem still occurs, perform Check 2. Check 2 System board may be faulty.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting This section describes how to determine whether the system board is malfunctioning or not. Start with Procedure 1 and continue with the other procedures as instructed.
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2 Troubleshooting Procedures Procedure 1 Message Check When the power is turned on, the system performs the Power On Self Test (POST) installed in the BIOS ROM. The POST tests each IC on the system board and initializes it. If an error message is shown on the display, perform Check 1. If there is no error message, go to Procedure 2. If MS-DOS or Windows XP is properly loaded, go to Procedure 4.
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2 Troubleshooting Procedures Check 3 The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (24) or (25) is displayed, go to Procedure 4. If error message (18) is displayed, go to the Keyboard Troubleshooting Procedures. If error message (19), (20) or (21) is displayed, go to the 2.5” HDD Troubleshooting Procedures.
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2 Troubleshooting Procedures Procedure 2 Debugging Port Check Check the MiniPCI Debug board. The tool for debug port test is shown below. Figure 2-2 A set of tool for debug port test The test procedures are follows: 1. Replace Mini PCI debug port with Wireless LAN card, check LED in the Mini PCI debug board The following is a list of the Test Point codes written to port 80h at the start of each routine, the beep codes issued for terminal errors, and a description of the POST routine.
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2 Troubleshooting Procedures Code Beeps POST Routine Description 14h Initialize keyboard controller 16h1-2-2-3 BIOS ROM checksum 17h Initialize cache before memory autosize 18h 8254 timer initialization 1Ah 8237 DMA controller initialization 1Ch Reset Programmable Interrupt Controller 20h1-3-1-1 Test DRAM refresh 22h1-3-1-3 Test 8742 Keyboard Controller 24h Set ES segment register to 4 GB 26h Enable A20 line 28h Autosize DRAM 29h Initialize POST Memory Manager 2Ah Clear 512 KB base RAM 2Ch1-3-4-1 RAM failu
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2 Troubleshooting Procedures 66h Configure advanced cache registers 67h Initialize Multi Processor APIC 68h Enable external and CPU caches 69h Setup System Management Mode (SMM) area 6Ah Display external L2 cache size 6Bh Load custom defaults (optional) 6Ch Display shadow-area message 6Eh Display possible high address for UMB recovery 70h Display error messages 72h Check for configuration errors 76h Check for keyboard errors 7Ch Set up hardware interrupt vectors 7Eh Initialize coprocessor if present 80h Di
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2 Troubleshooting Procedures AAh ACh AEh B0h B2h B4h B5h B6h B9h Bah BBh BCh BDh BEh BFh C0h C1h C2h C3h C4h C5h C6h C7h C8h C9h D2h Scan for F2 key stroke Enter SETUP Clear Boot flag Check for errors POST done - prepare to boot operating system One short beep before boot Terminate QuietBoot (optional) Check password (optional) Prepare Boot Initialize DMI parameters Initialize PnP Option ROMs Clear parity checkers Display MultiBoot menu Clear screen (optional) Check virus and backup reminders Try to boot
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2 Troubleshooting Procedures E1h E2h E3h E4h E5h E6h E7h E8h E9h EAh EBh ECh EDh EEh EFh F0h F1h F2h F3h F4h F5h F6h F7h Initialize the bridge Initialize the CPU Initialize system timer Initialize system I/O Check force recovery boot Checksum BIOS ROM Go to BIOS Set Huge Segment Initialize Multi Processor Initialize OEM special code Initialize PIC and DMA Initialize Memory type Initialize Memory size Shadow Boot Block System memory test Initialize interrupt vectors Initialize Run Time Clock Initialize vid
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2 Troubleshooting Procedures Procedure 3 Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test 6. VGA test 7. VGA Memory test 8. Hard Disk test 9. CPU Temperature test 10. Main Battery test 11. BIOS test 12. CD-ROM/DVD-ROM test 13.
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2 Troubleshooting Procedures 2.5 USB FDD Troubleshooting To check whether the USB FDD is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: FDD Head Cleaning Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector Check and Replacement Check Procedure 1 FDD Head Cleaning Check FDD head cleaning is one option available in the Diagnostic Program. After connecting USB FDD, insert the Diagnostics Disk in the floppy disk drive.
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2 Troubleshooting Procedures Procedure 2 Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled. Floppy disk drive test error codes and their status names are listed in Table 2-7.
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2 Troubleshooting Procedures Procedure 3 Connector Check and Replacement Check USB FDD is connected to USB port on system board and US board. US board is also connected to system board by cable. The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks. USB FDD can be connected to the following 4 ports on system board.
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2 Troubleshooting Procedures Check 2 USB FDD may be faulty. Replace it with a new one. If the problem still occurs, perform Check 3. Check 3 Connect USB FDD to each port embedded on system board. If it does not work properly when connected to CN12, CN19, CN20 or all ports, perform Check 4. Check 4 System board may be faulty. Replace it with a new one following the steps in Chapter 4, Replacement Procedures.
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2 Troubleshooting Procedures 2.6 2.5” HDD Troubleshooting To check if 2.5” HDD is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Partition Check Procedure 2: Message Check Procedure 3: Format Check Procedure 4: Diagnostic Test Program Execution Check Procedure 5: Connector Check and Replacement Check CAUTION: The contents of the hard disk will be erased when the 2.5” HDD troubleshooting procedures are executed.
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2 Troubleshooting Procedures Procedure 2 Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen. Make sure no floppy disk is in the FDD. Turn on the computer and check the message on the screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with Check 1 below and perform the other checks as instructed.
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2 Troubleshooting Procedures Procedure 3 Format Check The computer’s HDD is formatted using the MS-DOS FORMAT program or the physical format program of the test program. To format the HDD, start with Check 1 below and perform the other steps as required. Refer to the MS-DOS Manual for the operation of MS-DOS. For the format by the test program, refer to the Chapter 3. Check 1 Format an 2.5” HDD using MS-DOS FORMAT command. Type as FORMAT C:/S/U. If 2.5” HDD can not be formatted, perform Check 2.
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2 Troubleshooting Procedures Procedure 4 Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. The error codes and statuses are described in Table 2-8.
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2 Troubleshooting Procedures Procedure 5 Connector Check and Replacement Check HDD(s) is/are connected to the connector(s) on the system board. The connection of HDD(s) and board may be defective. Otherwise, they may be faulty. Disassemble the computer following instructions in Chapter 4, Replacement Procedures and perform the following checks. Check 1 Make sure HDD(s) is/are firmly connected to the connector(s) on the system board.
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2 Troubleshooting Procedures 2.7 Keyboard Troubleshooting To check if the computer’s keyboard is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test (DIAGNOSTIC TEST) and Pressed key display test (ONLY ONE TEST) in the Diagnostic Program.
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2 Troubleshooting Procedures Procedure 2 Connector and Replacement Check The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure keyboard cable is firmly connected to system board. If the connection is loose, reconnect firmly and repeat Procedure 1. If the problem still occurs, go to Check 2. Check 2 Keyboard may be faulty.
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2 Troubleshooting Procedures 2.8 Touch pad Troubleshooting To check if the computer’s touch pad is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Touch pad test (ONLY ONE TEST) in the Diagnostic Program. Refer to Chapter 3, Tests and Diagnostics, for more information on how to perform the test program.
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2 Troubleshooting Procedures Procedure 2 Connector and Replacement Check The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the cable is firmly connected to system board. If the connection is loose, reconnect firmly and repeat Procedure 1. If the problem still occurs, go to Check 2. Check 2 Touch Pad or the cable may be faulty.
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Troubleshooting Procedures 2.9 Display Troubleshooting To check if the computer’s display is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: External Monitor Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector and Cable Check Procedure 4: Replacement Check Procedure 1 External Monitor Check Connect an external monitor to the computer’s external monitor port, then boot the computer.
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Troubleshooting Procedures Procedure 3 Connector and Cable Check LCD Module is connected to system board by an LCD/FL cable. FL inverter board is also connected to system board by an LCD/FL cable. And, fluorescent lamp is connected to FL inverter board by HV cable. Their cables may be disconnected from system board or FL inverter board. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures. If the connection is loose, reconnect firmly and restart the computer.
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Troubleshooting Procedures Procedure 4 Replacement Check Fluorescent lamp, FL inverter, LCD module, HV cable and LCD/FL cable are connected to display circuits. Any of these components may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: If fluorescent lamp does not light, perform Check 1. If characters or graphics on the internal display are not displayed clearly, perform Check 4.
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Troubleshooting Procedures 2.10 Optical Disk Drive Troubleshooting To check if optical disk drive is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the CD-ROM/DVD-ROM Test in the Diagnostic Program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
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Troubleshooting Procedures 2.11 Modem Troubleshooting To check if modem is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute Modem test in the LAN/Modem/Bluetooth/IEEE1394 test program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
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Troubleshooting Procedures Check 1 Make sure the following connections are firmly connected. If any connector is disconnected, connect it firmly and return to Procedure 1. If the problem still occurs, perform Check 2.
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Troubleshooting Procedures Check 2 Modem cable may be faulty. Replace it with a new one. If the problem still occurs, perform Check 3. Check 3 MDC may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem still occurs, perform Check 4. Check 4 Cable between MDC and system board may be faulty. Replace it with a new one following the instructions in Chapter 4. If the problem still occurs, perform Check 5. Check 6 System board may be faulty.
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Troubleshooting Procedures 2.12 LAN Troubleshooting To check if the computer’s LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute LAN test in the LAN/Modem test program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
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Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting To check if the computer's Wireless LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting-Receiving Check Procedure 2: Antennas' Connection Check Procedure 3: Replacement Check Procedure 1 Transmitting-Receiving Check Before starting the test, make sure the wireless communication switch is set in the ON position.
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Troubleshooting Procedures Procedure 2 Antennas' Connection Check The wireless LAN function-wiring diagram is shown below: Any of the connections may be defective. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless communication switch is “On”. If the switch is “Off”, turn it “On”. If the problem still occurs, perform Check 2.
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Troubleshooting Procedures Procedure 3 Replacement Check Wireless LAN card, wireless LAN antenna or system board may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 Wireless LAN antenna may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 2. Check 2 Wireless LAN card may be faulty.
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Troubleshooting Procedures 2.14 Sound Troubleshooting To check if the sound function is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Connector Check Procedure 2: Procedure 1 Replacement Check Connector Check The connection of sound system is shown in the following figure. As the connection may be defective, disassemble the PC and check each connection. If the problem still occurs, go to Procedure 2.
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Troubleshooting Procedures Procedure 2 Replacement Check If External microphone/Headphone does not work properly, perform check 1. If Internal microphone /Speaker does not work properly, perform check 2. If HP out does not work properly, perform check 3. If Volume control does not work properly, perform check 4. Check 1 External microphone/Headphone may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem still occurs, perform Check 5.
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Troubleshooting Procedures 2.15 Fingerprint Troubleshooting To check if the computer’s Fingerprint is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute Fingerprint test in the test program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program. If any error is detected, perform Procedure 2.
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Troubleshooting Procedures 2.16 Bluetooth Troubleshooting To check if the computer’s Bluetooth is malfunctioning or not, follow the troubleshooting procedure below as instructed. Procedure 1: Connector Check and Replacement Check Procedure 1 Connector Check and Replacement Check The Bluetooth function is connected to system board. If Bluetooth malfunctions, its connection is defective or Bluetooth cable and system board may be faulty.
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Replacement Procedures Chapter 4 Replacement Procedures Satellite M300 and Satellite Pro M300 Maintenance Manual (960-Q08) 4-i
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Replacement Procedures Chapter 4 4.1 Contents Overview.................................................................................................................... 4-1 Safety Precautions ................................................................................................ 4-2 Before You Begin ................................................................................................ 4-3 Disassembly Procedure...........................................................................
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Replacement Procedures Figures Figure 4-1 Remove the battery pack.................................................................................... 4-8 Figure 4-2-1Remove a PC card............................................................................................ 4-10 Figure 4-2-2 Insert a PC card............................................................................................... 4-11 Figure 4-3 Remove the HDD assembly ...................................................................
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Replacement Procedures Figure 4-32 Remove the LCD unit ...................................................................................... 4-52 Figure 4-33 Removing the LCD supports............................................................................ 4-53 Figure 4-34 Thermal Pad on North bridge(Intel without VGA board)……………………4-55 Figure 4-35 Thermal Pad on North bridge(Intel with VGA board)…………………...…..4-56 Figure 4-36 Thermal Pad on VGA and V-RAM…………………………………………..
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Replacement Procedures 4 2 4.1 Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual. In all cases when removing an FRU, the battery pack must also be removed.
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Replacement Procedures Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. DANGER: 1. In the case of the battery, always use authentic parts or equivalent parts approved by Toshiba. Other batteries may have different specifications that are incompatible with the computer and may result in fire or explosion. Due to the risk of alkali fluid leaks, never attempt to heat or disassemble the battery.
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Replacement Procedures Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2.1 Battery Pack”. 1. Do not disassemble the computer unless it is operating abnormally. 2. Use the designated tools. 3. Ensure that the environment for working on and storing parts does not contain any of the following.
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Replacement Procedures Disassembly Procedure Three main types of cable connector are used. • Pressure plate connector • Spring connector • Normal pin connector When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cable out from the connector. When reconnecting a cable to a pressure plate connector, lift up the pressure plate to a suitable height and insert the cable into the connector.
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Replacement Procedures Assembly Procedure After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. • Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems. • Check that all cables and connectors are securely connected.
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Replacement Procedures Screw Tightening Torque Use the following torque when tightening screws. CAUTION: Over tightening may damage screws or parts. Under tightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage. NOTE: To tighten screws quickly and accurately, an electric screwdriver is recommended. • M2 (2mm) 0.167 N·m (1.7 kgf·cm) • M2.5 (2.5mm) 0.245 N·m(2.5 kgf·cm) • M2.5 (2.5mm) 0.392 N·m(4.0 kgf·cm) for Hinge support • M3.0 (3mm) 0.245 N･m (2.
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Replacement Procedures Screw Notation To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body. Format: Screw shape + Screw length (mm) Screw shape B: Bind screw F: Thin head screw S: Super thin head screw T: Tapping screw U: Other screws (Unique screws: pan head, stud, etc.
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Replacement Procedures 4.2 Battery pack Removing the battery pack The following describes the procedure of removing the battery pack (See Figure 4-1). CAUTION: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC adapter and all external devices from the computer. 3. Turn the computer upside down. 4.
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Replacement Procedures NOTE: Dispose of the used battery pack in accordance with the laws and ordinances of your local authority. Install the battery pack The following describes the procedure of installing the battery pack (See Figure 4-1-1). CAUTION: There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly. Dispose always the used battery pack in accordance with the laws and ordinances of your local authority.
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Replacement Procedures Lock1 Figure 4-2-1 Install the battery pack Satellite M300 and Satellite Pro M300 Maintenance Manual (960-Q08) 4-10
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Replacement Procedures 4.3 PC card Remove a PC card The following describes the procedure of removing a PC card (See Figure 4-2-1). CAUTION: Insert or remove a PC card according to the instructions of PC card manual or the manuals of the computer system you are using. 1. Push the eject button twice, It will pop out PCMCIA Card when you release it. 2. Grasp one of PC card and remove it. NOTE: If a PC card is not inserted all the way, the eject button may not pop out.
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Replacement Procedures Install a PC card The following describes the procedure of inserting a PC card (See Figure 4-2-2). 1. Make sure the eject button does not stick out. 2. Insert a PC card and press it until it is securely connected.
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Replacement Procedures 4.4 HDD Remove a HDD The following describes the procedure for removing a HDD (See Figure 4-3 to 4-4). CAUTION: Take care not to press on the top or bottom of a HDD. Pressure may cause data loss or damage to the device. 1. Turn the computer upside down. 2. Remove the following screws securing a HDD slot cover and remove a HDD slot cover. • M2.5×4.0B FLAT BIND screw x2 3. Remove the following screws securing the HDD assembly. • M2.5×4.0B FLAT BIND screw x4 4.
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Replacement Procedures CAUTION: When a HDD is installed, they are installed in the position as the following figure. M2.5×4.
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Replacement Procedures 5. Remove the following screws securing the HDD holder, HDD adapt and remove the HDD holder and HDD adapt.. • M2.5×4.0B FLAT BIND screw x4 • M2.5×4.0B FLAT BIND screw x2 M2.5×4.0B HDD adapt M2.5×4.
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Replacement Procedures Install a HDD The following describes the procedure of installing a HDD (See Figure 4-3 to 4-4). 1. Install a HDD to the HDD Adapt and secure it with the following screws. • M2.5×4.0B FLAT BIND screw x2 2. Install a HDD to the HDD holder and secure it with the following screws. • M2.5×4.0B FLAT BIND screw x4 NOTE: Although they are 3mm head screws, screw torque must be set in 2.5kg-cm for four screws securing the HDD holder. 3.
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Replacement Procedures 4.5 Wireless LAN card Remove a Wireless LAN card The following describes the procedure of removing a Wireless LAN card (See Figure 4-5). 1. Remove the following screw of wireless cover securing wireless LAN card cover and remove it. And remove screw of wireless board • 2.5.0 x 4.0B BIND screw x3 2. Disconnect the wireless LAN antenna cable from the connectors on a wireless LAN card. 3.
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Replacement Procedures Install a Wireless LAN card The following describes the procedure of installing a Wireless LAN card (See Figure 4-5). 1. Insert a wireless LAN card terminal slantwise into the connector, press it and lock the screws. 2. Connect the wireless LAN antenna cables to the terminals on a wireless LAN card. 3. Install the wireless LAN card cover and secure it with the following screws.
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Replacement Procedures 4.6 Memory module CAUTION: The power of the computer must be turned off when you remove a memory module. Do not touch memory module terminals. Any dirt on the terminals may cause memory access problems. Never press hard or bend a memory module. Remove a memory module To remove a memory module, confirm that the computer is not in boot mode. Then perform the following procedure (See Figure4-6 and 4-7). 1. Loose the screws which secure the memory slot cover. • 2.5 x 4.
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Replacement Procedures Memory Module Cover Figure 4-6 Remove memory slot cover Satellite M300 and Satellite Pro M300 Maintenance Manual (960-Q08) 4-20
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Replacement Procedures Figure 4-7 Remove a memory module Satellite M300 and Satellite Pro M300 Maintenance Manual (960-Q08) 4-21
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Replacement Procedures Install a memory module To install a memory module, confirm that the computer is not in boot mode. Then perform the following procedures (See Figure 4-7 and 4-8). CAUTION: The power must be turned off when you insert a memory module. Never press hard or bend a memory module. 1. Insert a memory module into the connector slantwise (terminal side first) and press it to connector firmly. 2. Install the memory slot cover and secure it with the screw. 3.
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Replacement Procedures 4.7 Keyboard Remove the keyboard The following describes the procedure of removing the keyboard (See Figure 4-9 to 4-11). CAUTION: As the keycap may fall out, when handling the keyboard always hold it by the frame and do not touch the keycap. 1. Turn the computer upside down 2. Remove the Battery 3. Loose the screw securing KB Holder. • M2.0x3.0B Flat BIND screws x2 4. Upside down the computer. 5. Open the display. 6. Remove KB holder.
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Replacement Procedures M2.0x3.0B 2 screws Figure 4-9 Remove screws for KB Holder M2.0x3.
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Replacement Procedures Figure 4-11 Remove the KB Satellite M300 and Satellite Pro M300 Maintenance Manual (960-Q08) 4-25
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Replacement Procedures Install the keyboard The following describes the procedure for installing the keyboard (See Figure 4-8 to 4-9). 1. Turn the keyboard upside down and place it on the palm rest as its face down. Connect the keyboard flexible cable to the connector on the system board. 2. Secure the KB with the following screw • M2.5×3.0B BIND screw x2 3. Install the KB Holder 4. Turn the computer upside down 5. Secure the KB Holder with the following screw • M2.0x3.0B Flat BIND screws x2 6.
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Replacement Procedures 4.8 Optical disk drive NOTE: Do not apply excessive force to the top of an optical disk drive. Do not touch the shaded portion of the figure below, when the drive is removed or installed. Remove an optical disk drive The following describes the procedure of removing an optical disk drive (See Figure 4-12 to 4-15). 1. Remove the following screw of wireless cover securing Memory Module Cover and remove it. • 2.5 x 4.0B BIND screw x3 2.
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Replacement Procedures Optical disk drive BKT Screw Figure 4-13 Remove optical disk drive BKT screw Optical disk drive BKT PUSH Figure 4-14 Push optical disk drive Module out Satellite M300 and Satellite Pro M300 Maintenance Manual (960-Q08) 4-28
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Replacement Procedures ODD bracket 3 Screws Figure 4-15 Disassemble the side bracket Install an optical disk drive The following describes the procedure of installing an optical disk drive (See Figure 4-12 and 4-13). 1. Attach the ODD bracket to an optical disk drive and secure it with the following screws. • M2.0×3.0 Flat BIND screw x3 2. Insert an optical disk drive assembly into the slot and connect it to the connector CN26 on the system board. 3. Secure the ODD drive with the following screw. • M2.
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Replacement Procedures 4 4.9 Top assembly Remove the top assembly The following describes the procedure of removing the cover assembly (See Figure 4-16 to 4-17). 1. Turn over the computer. 2. Remove the following screws securing the cover assembly from the back and bottom of computer. • M2.0×6.0 BIND screw Back x5 • M2.5×10 BIND screw Back x6 • M2.5×4.0 BIND screw Back x2 • M2.0×3.
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Replacement Procedures 3. Remove the following screws(front) 4. Disconnect the touch pad flat cable/Fingerprint cable/Bluetooth Cable/Power board FFC/MMB Board FFC/Function Lens FFC from the connector on the system board. Remove Remove Figure 4-17 Disconnect the Cable 5. Remove the top assembly from the base assembly.
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Replacement Procedures Install the top assembly The following describes the procedure for installing the cover assembly (See Figure 4-19 to 4-21). 1. Install the top assembly to the base assembly. NOTE: Be careful not to catch the cables between cover assembly and base assembly. 2. Connect the touch pad flat cable to the connector on the system board. 3. Secure the cover assembly with the following screws from the top of computer. • M2.0×6.0 BIND screw Back x9 4.
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Replacement Procedures 4.10 Display assembly Remove the display assembly The following describes the procedure for removing the display assembly (See Figure 4-18 to 4-22). 1. Close the display and turn the computer upside down. 2. Open the MINIPCI Door and remove the wireless LAN screws and antenna connector. Wireless LAN antenna connector Figure 4-18 Remove the Wireless LAN antenna connector 3. Open the display and removing the k/b holder and keyboard. (please refer figure 49,figure4-10, figure4-11).
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Replacement Procedures 4. Disassembly TOP ASSY M2.0 X 3 big head 3 screws M2.5 X 10 3 screws M2.5 X 10 3 screws M2.5 X 4 2 screws M2.0 X 6.
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Replacement Procedures M2.0 X 6.0 4Screws M2.0 X 6.0 3Screws M2.0 X 6.0 2Screws Figure 4-19-1 Remove the screws (from top side) 5. Disconnect the touch pad flat cable/Fingerprint cable/Bluetooth Cable/Power board FFC/MMB Board FFC/Function Lens FFC from the connector on the system board. 6. Remove TOP ASSY 7.
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Replacement Procedures Figure 4-20 Remove the Wireless Antenna and LCD cable 8. Open the display to 100 degree, and remove the hinge screw. ‧ M2.5×5.0 BIND screw x2 (Locktight) Wireless LAN antenna cable ..
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Replacement Procedures 9. Pull out the pole of hinge from the hole of hinge assembly, remove the display assembly from the base assembly. Display assembly Base assembly .
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Replacement Procedures Install the display assembly The following describes the procedure for installing the display assembly (See Figure 4-13 to 4-17). 1. Insert the pole of hinge to the hole of hinge assembly, set the display assembly on the base assembly. 2. Secure the hinges with the following screws secure the display mask with the following screws and stick the mask seal on them. • M2.5×5.0B BIND screw x2 NOTE: Be sure to apply the lock tight to the screws instructed in the figure above. 3.
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Replacement Procedures 4.11 Touch pad Remove the touch pad The following describes the procedure of removing the touch pad (See Figure 4-22). 1. Peel off the glass tape and disconnect the touch pad flat cable, finger print cable from the connector on the touch pad. 2. Remove the following screws securing the touch pad plate and touch pad board. • M2.0×3.0 Flat screw • M2.0×3.0 BIND screw x4 x4 M2.0×3.0 4screws M2.0×3.
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Replacement Procedures 3. Remove the touch pad board and touch pad plate. 4. Peel off and remove the touch pad from the cover assembly.
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Replacement Procedures Install the touch pad The following describes the procedure for installing the touch pad (See Figure 4-22). 1. Peel off the separator covering on the sensor portion of a new touch pad. NOTE: Do not reuse the touch pad so that it can not be used after peeling off from the computer. Be sure to stick a new touch pad. When sticking the touch pad, be careful not to get the bubbles under the touch pad. 2. Stick and install the touch pad on the cover assembly. 3.
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Replacement Procedures 4.12 LAN Board The following describes the procedure of removing the LAN board (See Figure 4-24). Remove LAN board 1. Remove the modern cable and Lan FPC 2. Loose below screw and pull out lan board z M2.0x4.0 FLAT BIND screw x1 M2.0x4.0 1screw LAN FPC Figure 4-25 Remove the LAN board Installe the LAN Board 1. Put LAN board in correct location and fix below screw z M2.0x4.0 BIND screw x1 2. Connect the modern cable and Lan FPC.
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Replacement Procedures 4.13 System board CAUTION: 1. when handling the system board, always hold by the edges. Do not touch the printed circuit face. 2. If replacing with a new system board, execute the subtest01 Initial configuration in section 3.3 “Setting of the hardware configuration”. Also update with the latest BIOS as described in Appendix G “BIOS Rewrite Procedures” and with the latest EC/KBC as described in Appendix H “EC/KBC Rewrite Procedures”.
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Replacement Procedures 5. Remove the following screws securing the ODD FPC. • M2.0×4.0 BIND screw x3 6. Remove the following screws securing the system board and remove the system board. (See Figure 4-26) • M2.0×4.0 BIND screw x4 M2.0×4.0 4 screws ODD FPC M2.0×4.
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Replacement Procedures Install the system board The following describes the procedure for installing the system board (See Figure 4-26). 1. Secure the system board with the following screws. • M2.0×4.0 BIND screw x4 2. Connect the LAN FPC to the LAN Board. 3. Connect the speaker cable the system board. 4.
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Replacement Procedures 4.14 CPU Remove the CPU heat sink The following describes the procedure of removing the CPU heat sink (See Figure 4-27). 1. Disconnect the Heat sink cable from the connector on the system board 2. Remove the following screws securing the heat sink holder along 1 to 6. • M2.0×3.0 Special Spring screw x3 NOTE: When removing the heat sink holder, be sure to remove the screws in the reverse order of the number marked on the holder. 3. Remove the CPU heat sink. M2.0×3.
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Replacement Procedures 4. Unlock the CPU by rotating the cam on the CPU socket 120 degrees to the counterclockwise with a flat-blade screwdriver. 5. Remove the CPU. Figure 4-28 Remove the CPU Install the CPU The following describes the procedure for installing the CPU (See Figure 4-27 to 4-28). 1. Check that the mark of cam is in the unlocking position. 2. Attach the CPU to the correct position in the CPU socket. 3.
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Replacement Procedures NOTE: Apply the silicon grease enough to cover the chip surface using the special applicator. Thermal pad is fixed for each one, no need special applicator. Figure 4-29 Apply silicon grease 6. Install the CPU heat sink and heat sink holder and secure them with the following screws along 1 to 6. • M2.0 X 3 Special Spring screw x3 7.
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Replacement Procedures 4.15 LCD unit / FL inverter CAUTION: When replacing a LCD, it is required that SVP parameter is set. Update with the latest EC/KBC as described in Appendix H “EC/KBC Rewrite Procedures”. Remove the LCD unit / FL inverter The following describes the procedure of removing the LCD unit and FL inverter (See Figure 4-30 to 4-33) Remove Screw rubber cover X4 1. Remove the following screws securing the display mask M2.5×5.0 BIND screw X4 2.
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Replacement Procedures M2.5×5.0 4 screws Figure 4-30 Remove the display mask 3. Pull out one insulator and peel off the other one adhered to the FL inverter. 4. Disconnect the LCD harnesses from the connectors CN1 on the FL inverter. 5. Disconnect the HV harnesses from the connectors CN2 on the FL inverter. 6. Remove the FL inverter while peeling off the double-sided tape.
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Replacement Procedures CN1 Insulator CN2 LCD harness FL inverter Double-sided tape HV harness Figure 4-31 Remove the FL inverter Satellite M300 and Satellite Pro M300 Maintenance Manual (960-Q08) 51
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Replacement Procedures 7. Remove the following screws securing the LCD unit. • M2.5x5.0 BINK HEAD screw x2 8. With the bottom edge of the LCD unit on the display cover, lift only the top edge of the LCD unit. After peeling off the CONDUTIVE tape, disconnect the LCD harness from the connector on the back of the LCD. 9. Remove the LCD unit. M2.5×5.
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Replacement Procedures 10. Remove the following screws securing the LCD support (LCD unit side) and remove the LCD supports from the LCD unit. • M2.0x2.
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Replacement Procedures Install the LCD unit/FL Inverter The following describes the procedure for installing the LCD unit and FL inverter (See Figure 4-31 to 4-34). 1. Install the LCD supports (LCD unit side) to the LCD and secure them with the following screws. • M2.0×2.5 BINK screw x4 2. Stand the LCD unit on the display cover and connect the LCD harness to the connector on the back of LCD. 3. Stick the conductive tape on the connector of LCD harness. 4. Secure the LCD unit with the following screws.
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Replacement Procedures 4.16 Application for Thermal Pad on North Bridge, VGA and VRAM I. For Satellite M300, Satellite Pro M300, Satellite L310, Satellite Pro L310, EQUIUM M300, SATEGO M300 (Intel without VGA board) , use Thermal Pad FSL-BS75 on North Bridge 1.Thermal Pad FSL-BS75 2. one Syringe contains 12mmX14mmX0.
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Replacement Procedures Figure 4-35 Thermal Pad on North bridge(Intel with VGA board) TSB P/N Raw material Classification A000026960 JXTE1028010 VGA THERMAL PAD A000026970 JXTE1027010 V-RAM THERMAL PAD Description THERMAL PAD VGA TE1(JXTE1028,R3A) THERMAL PAD V-RAM TE1(JXTE1027,R3A) Figure 4-36 Thermal Pad on VGA and V-RAM NOTE: When applying for thermal pad on North Bridge, VGA, V-RAM, Thermal pad is fixed for each one, no need special applicator Satellite M300 and Satellite Pro M300 Maintenance Man
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Handling the LCD Module Appendix A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
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Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4. If water or other liquid is left on the panel’s surface for a long period, it can change the screen’s tint or stain it.
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Handling the LCD Module 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
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Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
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Handling the LCD Module 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxide). These materials can release gas that can damage the panel’s polarization.
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Board Layout Appendix B Appendix B Board Layout B.
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Board Layout Figure B-1-2 System board layout (Back) Satellite M300 and Satellite Pro M300 Maintenance Manual(960-Q08) B-2
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Board Layout Table B-1 System board ICs and connectors (01) (02) (03) (04) (05) (06) (07) (08) (09) (10) (11) (12) (13) (14) (15) (16) (17) (18) (19) (20) (21) (22) (23) (24) (25) (26) (27) (28) (29) (30) (31) (32) (33) (34) (35) (36) (37) (38) (39) Location CN1 CN5 CN4 CN2 CN3 CN7 U2 CN6 CN8 U5 U33 CN10 CN11 CN12 CN13 CN14 U13 LED2 LED1 CN16 U16 CN15 U12 U9 U1 CN34 CN27 CN23 CN26 U17 CN29 CN32 CN33 CN38 CN37 VR1 U39 U36 U38 Function M/B to LED type panel connector M/B to CCFL type panel connector M/B t
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Board Layout (40) (41) (42) (43) (44) (45) (46) (47) (48) (49) (50) (51) (52) (53) (54) (55) (56) (57) (58) U42 SW2 U37 LED3 CN36 CN35 CN30 CN28 CN25 CN24 CN21 CN19 CN20 PJ1 U26 CN22 U29 CN18 CN31 CIR controller IR-IRM-V538-TR1 Kill SW South Bridge ICH8 W-LAN&BT LED ODD connector Internal MINI card slot Internal speaker connector RTC battery connector DDR SO-DIMM(200P) slot DDR SO-DIMM(200P) slot Battery cable connector HDD connector Modem module connector AC cable connector CPU socket FAN connector Nort
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Board Layout B.
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Board Layout Figure B-2-2-1 Function Button board layout Lowcost (Front) Figure B-2-2-2 Function Button board layout Lowcost (Back) Table B-2-2 Function Button board connectors (01) (02) (03) (04) (05) (06) (07) Location SW1 SW2 SW3 SW4 SW5 SW6 CN1 Function Music Silence Button Media Player Button Music Play / Pause Button Music Stop Button Music Backward Music Forward MMB board (Lowcost) to M/B connector (no mount Satellite M300 and Satellite Pro M300 Maintenance Manual(
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Board Layout connector, only with Hotbar) Satellite M300 and Satellite Pro M300 Maintenance Manual(960-Q08) B-7
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Board Layout B.
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Board Layout B.
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Board Layout Figure B-4-2 Touch pad board layout (Back) Table B-4-2 Touch pad board connectors (Back) (07) (08) Location CN1 CN3 (09) CN2 Function Touch Pad board to M/B connector for Module use Touch Pad board to Touch Pad Module connector Touch Pad board to M/B connector for Fingerprint board use Satellite M300 and Satellite Pro M300 Maintenance Manual(960-Q08) B-10
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Board Layout B.
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Board Layout Figure B-5-2 LAN board 10/100 RJ11 layout (Back) Table B-5-2 LAN board 10/100 RJ11 layout (Back) (04) (05) (06) (07) (08) (09) Location CN3 CN5 CN4 U4 U3 U2 Function USB connector RJ11 connector RJ45 connector LAN transformer IC LAN EEPROM IC LAN board USB power switch Satellite M300 and Satellite Pro M300 Maintenance Manual(960-Q08) B-12
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Board Layout B.
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Board Layout Figure B-6-2 LAN board Giga FM layout (Back) Table B-6-2 LAN board Giga FM layout (Back) (04) (05) (06) (07) (08) (09) Location CN2 CN3 CN4 U5 U4 U3 Function USB connector FM RF connector RJ45 connector LAN transformer IC LAN Flash IC LAN board USB power switch Satellite M300 and Satellite Pro M300 Maintenance Manual(960-Q08) B-14
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Board Layout B.
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Board Layout Figure B-7-2 Fingerprint board layout (Back) Table B-7-2 Fingerprint board layout (Back) Location (02) CN2 (03) U2 (04) CN3 (05) (06) U5 U3 Function Fingerprint board to Touch Pad Board connector (Upper) Fingerprint Sensor ESD protect IC Fingerprint board to Touch Pad Board connector (Lower) Fingerprint Flash IC Fingerprint current limited IC Satellite M300 and Satellite Pro M300 Maintenance Manual(960-Q08) B-16
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Board Layout B.
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Board Layout B.
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Board Layout Figure B-9-2 LED board layout (Back) Table B-9-2 LED board layout (Back) Location (06) CN1 Function LED board to M/B connector (no mount connector, only with Hotbar) Satellite M300 and Satellite Pro M300 Maintenance Manual(960-Q08) B-19
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Pin Assignment Appendix C Pin Assignment CN1 LED Panel Connector P/N：DFHS40FS736 PIN No. CONN SMD HOUSING 40P 2R FS(P0.5,H2.6) Signal name I/O PIN No.
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Pin Assignment 37 LCDVCC --- 38 LCDVCC --- 39 +3V --- 40 CCD_POWER --- 41 GND --- 42 GND --- 43 GND --- 44 GND --- 45 NC --- 46 NC --- CN2 Mainstream Function board connector P/N：DFFC06FR013 CONN SMD FFC 6P 1R FR(P1.0,H2.02) PIN No. Signal name I/O PIN No.
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Pin Assignment CN4 Power Board connector P/N：DFFC04FR012 CONN SMD FFC 4P 1R FR(P1.0,H1.5) PIN No. Signal name I/O PIN No. Signal name I/O 1 GND --- 2 PWRLED# I 3 NBSWON# I 4 +5VPCU --- CN5 CCFL type panel connector P/N：DFHS30FSB28 CONN SMD HOUSING 30P 2R FS (P1.0,H3.9) PIN No. Signal name I/O PIN No.
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Pin Assignment 27 USBP3-_LCD --- 28 LCD_TXLOUT2+ I/O 29 GND I/O 30 LCD_TXLOUT2- I/O 31 GND --- 32 GND --- CN6 LAN Board connector P/N:DFFC32FR003 PIN No. CONN SMD FPC 32P 1R FR(P0.5,H2.13) Signal name I/O PIN No.
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Pin Assignment 31 FM_DET I 32 GND --- CN7 External Keyboard connector P/N:DFFC34FR003 CONN SMD FFC 34P,1R,FR(P0.8,H2.0) PIN No. Signal name I/O PIN No.
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Pin Assignment CN8 External MINI card slot connector P/N:DFFC14FR009 PIN No. CONN SMD FFC 14P 1R FR(P1.0,H1.5) Signal name I/O PIN No. Signal name I/O 1 PLTRST# --- 2 NC --- 3 GND --- 4 CLK_PCIE_MINI4# I 5 CLK_PCIE_MINI4 I 6 GND --- 7 PCIE_RXN4 I 8 PCIE_RXP4 I 9 GND --- 10 PCIE_TXN4 O 11 PCIE_TXP4 O 12 GND --- 13 +1.5V --- 14 +3V --- CN10 Bluetooth module connector P/N: DFHD10MR008 CONN SMD HEADER 10P 1R MR(P1.25,H1.9) PIN No. Signal name I/O PIN No.
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Pin Assignment CN11 Touch pad board connector P/N:DFFC06FR019 PIN No. CONN SMD FFC 6P 1R FR(P0.5,H2.0) Signal name I/O PIN No. Signal name I/O 1 +5V_TP --- 2 TPDATA I/O 3 TPCLK I/O 4 TP_LED_ON I 5 GND --- 6 GND --- CN12 Touch pad with Fingerprint board connector P/N:DFHD04MRA75 PIN No. CONN SMD HEADER 4P 1R MR(P1.25,H1.95) Signal name I/O PIN No.
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Pin Assignment 7 BATLED0# 9 11 I 8 PWRLED# I SUSLED_EC I 10 IDE_LED# --- TP_XD_LED I 12 ACIN --- CN14 Ferica module connector P/N: DFFC06FR003 CONN SMD FPC 6P 1R FR(P0.5,H1.5) PIN No. Signal name I/O PIN No. Signal name I/O 1 +5V_Felica --- 2 USBP4- I/O 3 USBP4+ I/O 4 GND --- 5 NC --- 6 Test point --- CN15 New Card connector P/N:DFHD26MR074 CONN SMD HEADER 26P 1R MR (P1.0,H5.4) PIN No. Signal name I/O PIN No.
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Pin Assignment 19 CLK_PCIE_NEW I 20 GND --- 21 PCIE_RXN1 I 22 PCIE_RXP1 I 23 GND --- 24 PCIE_TXN1 O 25 PCIE_TXP1 O 26 GND --- 27 GND --- 28 GND --- 29 GND --- 30 GND --- CN16 Card Bus connector P/N:DFHD68MR710 CONN SMD HEADER 68P 2R MR(P0.635,H5.5) PIN No. Signal name I/O PIN No.
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Pin Assignment 27 A_CAD24 I/O 28 A_CAD25 I/O 29 A_CAD26 I/O 30 A_CAD27 I/O 31 A_CAD29 I/O 32 A_CRSVD/D2 I/O 33 A_CCLKRUN# I 34 GND --- 35 GND --- 36 A_CCD1# I/O 37 A_CAD2 I/O 38 A_CAD4 I/O 39 A_CAD6 I/O 40 A_CRSVD/D14 I/O 41 A_CAD8 I/O 42 A_CAD10 I/O 43 A_CVS1# O 44 A_CAD13 I/O 45 A_CAD15 I/O 46 A_CAD16 I/O 47 A_CRSVD/A18 I/O 48 A_CBLOCK# I 49 A_CSTOP# O 50 A_CDEVSEL# I 51 AVCC --- 52 AVPP --- 53 A_CTRDY# O 54 A_CFRAME# I 55
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Pin Assignment PIN No. Signal name I/O PIN No. Signal name I/O 1 CRT_R1 I 2 CRT_G1 I 3 CRT_B1 I 4 NC --- 5 GND --- 6 GND --- 7 GND --- 8 GND --- 9 5V_CRT2 --- 10 GND --- 11 CRT_SENSE# O 12 CRTDDAT I 13 CRTHSYNC I 14 CRTVSYNC I 15 CRTDCLK I 16 GND --- 17 GND --- CN19 HDD connector P/N:DFHS22FR056 PIN No. CONN DIP HOUSING 22P 1R FR(P1.27,H12.15) Signal name I/O PIN No.
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Pin Assignment 19 GND --- 20 NC --- 21 NC --- 22 NC --- 23 GND --- 24 GND --- CN20 Modem module connector P/N:DFHS12FS002 CONN SMD HOUSING 12P 2R FS(P0.8,H8.35) PIN No. Signal name I/O PIN No. Signal name I/O 1 NC --- 2 NC --- 3 NC --- 4 NC --- 5 NC --- 6 NC --- 7 DIB_P I 8 NC --- 9 DIB_N I 10 NC --- 11 NC --- 12 NC --- CN21 Battery cable Connector P/N: DFHD14MS014 CONN SMD HEADER 14P 2R MS(P1.5,H19.5) PIN No. Signal name I/O PIN No.
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Pin Assignment 13 MBAT+ --- 14 MBAT+ --- CN22 FAN connector P/N:DFWF03MS000 CONN SMD WAFER,3P,1R,MS(P1.25,H4.7) PIN No. Signal name I/O 1 TH_FAN_POWER --- 3 +3V/ FANSIG PIN No. 2 Signal name GND I/O --- --- CN23 HDMI connector P/N:DFHD19MR011 CONN SMD HDMI 19P 2R MR(P1.0,H6.53) PIN No. Signal name I/O PIN No.
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Pin Assignment 19 HDMI_HP --- 20 GND --- 21 GND --- 22 GND --- 23 GND --- CN24 DDR2 SO-DIMM(200P) slot P/N:DGMK0000040 IC SOCKET DDR2 SO-DIMM(200P,H10.5,RVS) PIN No. Signal name I/O PIN No.
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Pin Assignment 29 M_B_DQS#1 I/O 30 M_CLK_DDR3 31 M_B_DQS1 I/O 32 M_CLK_DDR#3 I 33 GND --- 34 GND --- 35 M_B_DQ11 I/O 36 M_B_DQ14 I/O 37 M_B_DQ10 I/O 38 M_B_DQ15 I/O 39 GND --- 40 GND --- 41 GND --- 42 GND --- 43 M_B_DQ20 I/O 44 M_B_DQ16 I/O 45 M_B_DQ17 I/O 46 M_B_DQ21 I/O 47 GND --- 48 GND --- 49 M_B_DQS#2 I/O 50 PM_EXTTS#1 O 51 M_B_DQS2 I/O 52 M_B_DM2 I 53 GND --- 54 GND --- 55 M_B_DQ22 I/O 56 M_B_DQ18 I/O 57 M_B_DQ23 I/O
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Pin Assignment 75 M_B_DQ27 I/O 76 M_B_DQ31 I/O 77 GND --- 78 GND --- 79 M_CKE3 I 80 M_CKE4 I 81 +1.8VSUS --- 82 +1.8VSUS --- 83 NC --- 84 NC --- 85 M_B_BS#2 I 86 M_B_A14 --- 87 +1.8VSUS --- 88 +1.8VSUS --- 89 M_B_A12 I/O 90 M_B_A11 I/O 91 M_B_A9 I/O 92 M_B_A7 I/O 93 M_B_A8 I/O 94 M_B_A6 I/O 95 +1.8VSUS --- 96 +1.8VSUS --- 97 M_B_A5 I/O 98 M_B_A4 I/O 99 M_B_A3 I/O 100 M_B_A2 I/O 101 M_B_A1 I/O 102 M_B_A0 I/O 103 +1.
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Pin Assignment 121 GND --- 122 GND --- 123 M_B_DQ37 I/O 124 M_B_DQ32 I/O 125 M_B_DQ38 I/O 126 M_B_DQ36 I/O 127 GND --- 128 GND --- 129 M_B_DQS#4 I/O 130 M_B_DM4 I 131 M_B_DQS4 I/O 132 GND --- 133 GND --- 134 M_B_DQ39 I/O 135 M_B_DQ34 I/O 136 M_B_DQ33 I/O 137 M_B_DQ35 I/O 138 GND --- 139 GND --- 140 M_B_DQ44 I/O 141 M_B_DQ40 I/O 142 M_B_DQ45 I/O 143 M_B_DQ41 I/O 144 GND --- 145 GND --- 146 M_B_DQS#5 I/O 147 M_B_DM5 I 148 M_B_D
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Pin Assignment 167 M_B_DQS#6 I/O 168 GND --- 169 M_B_DQS6 I/O 170 M_B_DM6 I 171 GND --- 172 GND --- 173 M_B_DQ51 I/O 174 M_B_DQ55 I/O 175 M_B_DQ54 I/O 176 M_B_DQ50 I/O 177 GND --- 178 GND --- 179 M_B_DQ56 I/O 180 M_B_DQ60 I/O 181 M_B_DQ57 I/O 182 M_B_DQ61 I/O 183 GND --- 184 GND --- 185 M_B_DM7 I 186 M_B_DQS#7 I/O 187 GND --- 188 M_B_DQS7 I/O 189 M_B_DQ59 I/O 190 GND --- 191 M_B_DQ62 I/O 192 M_B_DQ63 I/O 193 GND --- 194 M_B_D
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Pin Assignment 3 GND --- 4 M_A_DQ4 I/O 5 M_A_DQ6 I/O 6 M_A_DQ0 I/O 7 M_A_DQ5 I/O 8 GND --- 9 GND --- 10 M_A_DM0 I 11 M_A_DQS#0 I/O 12 GND --- 13 M_A_DQS0 I/O 14 M_A_DQ7 I/O 15 GND --- 16 M_A_DQ1 I/O 17 M_A_DQ2 I/O 18 GND --- 19 M_A_DQ3 I/O 20 M_A_DQ13 I/O 21 GND --- 22 M_A_DQ12 I/O 23 M_A_DQ9 I/O 24 GND --- 25 M_A_DQ8 I/O 26 M_A_DM1 I 27 GND --- 28 GND --- 29 M_A_DQS#1 I/O 30 M_CLK_DDR0 I 31 M_A_DQS1 I/O 32 M_CLK_DDR#0
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Pin Assignment 49 M_A_DQS#2 I/O 50 PM_EXTTS#0 O 51 M_A_DQS2 I/O 52 M_A_DM2 I 53 GND --- 54 GND --- 55 M_A_DQ23 I/O 56 M_A_DQ18 I/O 57 M_A_DQ19 I/O 58 M_A_DQ22 I/O 59 GND --- 60 GND --- 61 M_A_DQ28 I/O 62 M_A_DQ29 I/O 63 M_A_DQ25 I/O 64 M_A_DQ24 I/O 65 GND --- 66 GND --- 67 M_A_DM3 I 68 M_A_DQS#3 I/O 69 NC --- 70 M_A_DQS3 I/O 71 GND --- 72 GND --- 73 M_A_DQ26 I/O 74 M_A_DQ30 I/O 75 M_A_DQ27 I/O 76 M_A_DQ31 I/O 77 GND ---
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Pin Assignment 95 +1.8VSUS --- 96 +1.8VSUS --- 97 M_A_A5 I/O 98 M_A_A4 I/O 99 M_A_A3 I/O 100 M_A_A2 I/O 101 M_A_A1 I/O 102 M_A_A0 I/O 103 +1.8VSUS --- 104 +1.8VSUS --- 105 M_A_A10 I/O 106 M_A_BS1 I 107 M_A_BS0 I 108 M_A_RAS# I 109 M_A_WE# I 110 M_CS#0 I 111 +1.8VSUS --- 112 +1.8VSUS --- 113 M_A_CAS# I 114 M_ODT0 I 115 M_CS#1 I 116 M_A_A13 I/O 117 +1.8VSUS --- 118 +1.
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Pin Assignment 141 M_A_DQ40 I/O 142 M_A_DQ45 I/O 143 M_A_DQ41 I/O 144 GND --- 145 GND --- 146 M_A_DQS#5 I/O 147 M_A_DM5 I 148 M_A_DQS5 I/O 149 GND --- 150 GND --- 151 M_A_DQ42 I/O 152 M_A_DQ43 I/O 153 M_A_DQ46 I/O 154 M_A_DQ47 I/O 155 GND --- 156 GND --- 157 M_A_DQ53 I/O 158 M_A_DQ48 I/O 159 M_A_DQ49 I/O 160 M_A_DQ52 I/O 161 GND --- 162 GND --- 163 NC --- 164 M_CLK_DDR1 I 165 GND --- 166 M_CLK_DDR#1 I 167 M_A_DQS#6 I/O 168 GND
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Pin Assignment 187 GND --- 188 M_A_DQS7 I/O 189 M_A_DQ62 I/O 190 GND --- 191 M_A_DQ63 I/O 192 M_A_DQ58 I/O 193 GND --- 194 M_A_DQ59 I/O 195 CGDAT_SMB I/O 196 GND --- 197 CGCLK_SMB I/O 198 GND --- 199 +3V --- 200 GND --- CN26 USB connector P/N:DFHS04FRB11 CONN DIP USB HOUSING 4P 1R FR(H7.6) PIN No. Signal name I/O PIN No.
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Pin Assignment 11 CLK_PCIE_MINI3# I 12 NC --- 13 CLK_PCIE_MINI3 I 14 NC --- 15 GND --- 16 NC --- 17 NC --- 18 GND --- 19 NC --- 20 NC --- 21 GND --- 22 PLTRST# I 23 PCIE_RXN2 I 24 NC --- 25 PCIE_RXP2 I 26 GND --- 27 GND --- 28 +1.
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Pin Assignment PIN No. 1 Signal name I/O PIN No. VCCRTC_4 --- 2 Signal name GND I/O --- CN29 USB connector P/N: DFHS04FRB11 CONN DIP USB HOUSING 4P 1R FR(H7.6) PIN No. Signal name I/O PIN No. Signal name I/O 1 GND --- 2 BUSBP6+ I/O 3 BUSBP6- I/O 4 USBPWR --- CN30 Internal speaker connector P/N:DFWF04MS002 PIN No. CONN SMD WAFER,4P,1R,MS(P1.25,H4.7) Signal name I/O PIN No.
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Pin Assignment 7 PEG_RXN14 I 8 PEG_TXN14 O 9 PEG_RXP14 I 10 PEG_TXP14 O 11 GND --- 12 GND --- 13 PEG_RXN13 I 14 PEG_TXN13 O 15 PEG_RXP13 I 16 PEG_TXP13 O 17 GND --- 18 GND --- 19 PEG_RXN12 I 20 PEG_TXN12 O 21 PEG_RXP12 I 22 PEG_TXP12 O 23 GND --- 24 GND --- 25 PEG_RXN11 I 26 PEG_TXN11 O 27 PEG_RXP11 I 28 PEG_TXP11 O 29 GND --- 30 GND --- 31 PEG_RXN10 I 32 PEG_TXN10 O 33 PEG_RXP10 I 34 PEG_TXP10 O 35 GND --- 36 GND ---
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Pin Assignment 53 GND --- 54 GND --- 55 PEG_RXN6 I 56 PEG_TXN6 O 57 PEG_RXP6 I 58 PEG_TXP6 O 59 GND --- 60 GND --- 61 PEG_RXN5 I 62 PEG_TXN5 O 63 PEG_RXP5 I 64 PEG_TXP5 O 65 GND --- 66 GND --- 67 PEG_RXN4 I 68 PEG_TXN4 O 69 PEG_RXP4 I 70 PEG_TXP4 O 71 GND --- 72 GND --- 73 PEG_RXN3 I 74 PEG_TXN3 O 75 PEG_RXP3 I 76 PEG_TXP3 O 77 GND --- 78 GND --- 79 PEG_RXN2 I 80 PEG_TXN2 O 81 PEG_RXP2 I 82 PEG_TXP2 O 83 GND --- 84
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Pin Assignment 99 CLK_MXM I 100 EXT_CRT_DDCDAT I/O 101 GND --- 102 GND --- 103 GFXRST# I 104 EXT_HDMI_DDCCLK I/O 105 SYSFANON# O 106 EXT_HDMI_DDCDATA I/O 107 MAINON I 108 GND --- 109 GFXPG O 110 EXT_LVDS_PNLCLK I/O 111 3ND_MBDATA I/O 112 EXT_LVDS_PNLDAT I/O 113 3ND_MBCLK I/O 114 GND --- 115 EXT_LVDS_BLON O 116 EXT_VGA_RED O 117 EXT_DISP_ON O 118 GND --- 119 DVI_HPD I 120 EXT_VGA_GRN O 121 GND --- 122 GND --- 123 EXT_HSYNC O 124 EXT_V
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Pin Assignment 145 GND --- 146 EXT_LVDS_TXLCK# 147 NC --- 148 EXT_LVDS_TXLCK 149 NC --- 150 GND --- 151 GND --- 152 NC --- 153 GND --- 154 GND --- 155 GND --- 156 NC --- 157 GND --- 158 GND --- 159 GND --- 160 NC --- 161 NC --- 162 GND --- 163 +5V --- 164 EXT_HDMICLK- O 165 +5V --- 166 EXT_HDMICLK+ O 167 NC --- 168 GND --- 169 GND --- 170 EXT_HDMITX2N O 171 NC --- 172 EXT_HDMITX2P O 173 +3V --- 174 GND --- 175 +3V ---
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Pin Assignment 191 VIN --- 192 VIN --- 193 VIN --- 194 VIN --- 195 VIN --- 196 VIN --- 197 VIN --- 198 VIN --- 199 VIN --- 200 VIN --- CN32 1394 connector P/N:DFHS04FR109 PIN No. CONN DIP 1394 4P FR(P0.8,H6.6) Signal name I/O PIN No. Signal name I/O 1 L1394_TPB0- O 2 L1394_TPB0+ O 3 L1394_TPA0- O 4 L1394_TPA0+ O 5 GND --- 6 GND --- 7 GND --- 8 GND --- CN33 External MIC jack connector P/N:DFTJ06FR102 CONN DIP PHONE JACK 6P 1R FR(H6.6)BLACK PIN No.
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Pin Assignment CN34 Internal MINI card slot P/N:DFHS52FR011 CONN SMD HOUSING 52P 2R FR(P0.8,H7.5) VGA P/N:DFHS52FR010 CONN SMD HOUSING 52P 2R FR(P0.8,H5.6) UMA PIN No. Signal name I/O PIN No. Signal name I/O 1 NC --- 2 +3V 3 NC --- 4 GND 5 NC --- 6 +1.
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Pin Assignment 35 GND --- 36 Test point --- 37 NC --- 38 Test point --- 39 NC --- 40 GND --- 41 NC --- 42 NC --- 43 NC --- 44 NC --- 45 PCLK__debug I 46 NC --- 47 PLTRST#_debug I 48 +1.5V --- 49 LDRQ#1__debug O 50 GND --- 51 SERIRQ_debug O 52 +3V --- CN35 Internal MINI card slot P/N:DFHS52FR016 PIN No. CONN DIP HOUSING 52P 2R FR(P0.8,H6.5) Signal name I/O PIN No.
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Pin Assignment 15 GND --- 16 NC 17 NC --- 18 GND 19 NC --- 20 RF_EN_WLAN I 21 GND --- 22 PLTRST# I 23 PCIE_RXN6 I 24 +3V_S5 --- 25 PCIE_RXP6 I 26 GND --- 27 GND --- 28 +1.
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Pin Assignment PIN No. Signal name I/O PIN No.
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Pin Assignment 45 GND --- 46 GND --- 47 GND --- 48 GND --- 49 NC --- 50 NC --- 51 GND --- 52 GND --- CN37 Card Reader connector P/N:DFHD42MS005 PIN No. CONN SMD HEADER 42P 1R MS(P0.76,H5.6) Signal name I/O PIN No.
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Pin Assignment 29 GND --- 30 MS_D0/XD_D2_C I/O 31 SD_D0 I/O 32 MS_BS/XD_D3_C I/O 33 XD_D4 I/O 34 SD_D1 I/O 35 XD_D5 I/O 36 XD_D6 I/O 37 MS_D1/XD_D7_C I/O 38 VCC_XD --- 39 SD_CD# I/O 40 GND --- 41 SM_WPI#/SD_WP I 42 GND --- 43 GND --- 44 --- CN38 HP/SPDIF jack connector P/N:DFTJ05FR015 PIN No. CONN DIP PHONE JACK 5P 1R FR(H6.6)BLACK Signal name I/O PIN No.
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Display codes Appendix. D Appendix D Display Codes D.1 Display Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap No.
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Display codes Satellite M300 and Satellite Pro M300 Maintenance Manual (960-Q08) D-2
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Display codes Table D-1 Scan codes (set 1 and set 2) (2/4) Cap No.
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Display codes Table D-1 Scan codes (set 1 and set 2) (3/4) Cap No.
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Display codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap No. Keytop Code set 1 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 126 Pause *7 *7 *7 *7 *7 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Make Code set 2 Break Make Note Break Notes: 1. 2. 3. 4. 5. 6. 7. * * * * * * * Scan codes differ by mode. Scan codes differ by overlay function.
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Display codes Table D-2 Scan codes with left Shift key Cap Key Code set 1 No.
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Display codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
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Display codes Table D-5 Scan codes in overlay mode Cap No. Code set 1 Keytop Code set 2 Make Break Make Break 09 8 (8) 48 C8 75 F0 75 10 9 (9) 49 C9 7D F0 7D 11 0 (*) 37 B7 7C F0 7C 23 U (4) 4B CB 6B F0 6B 24 I (5) 4C CC 73 F0 73 25 O (6) 4D CD 74 F0 74 26 P (–) 4A CA 7B F0 7B 37 J (1) 4F CF 69 F0 69 38 K (2) 50 D0 72 F0 72 39 L (3) 51 D1 7A F0 7A 40 ; (+) 4E CE 79 F0 79 52 M (0) 52 D2 70 F0 70 54 . (.
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Display codes Table D-7 No.126 key scan code Key top Pause Shift Code set 1 Code set 2 Make Make Common* E1 1D 45 E1 Ctrl* E0 C6 E0 46 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E *: This key generates only make codes.
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Appendix E Keyboard Layout 1. United Status (US) Keyboard Figure US keyboard (L300mm x W131.3mm) 2. Traditional Chinese (CH) Keyboard Figure CH keyboard (L300mm x W131.
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3. Thai (TI) Keyboard Figure TI keyboard (L300mm x W131.3mm) 4. Korean (KO) Keyboard Figure KO keyboard (L300mm x W131.
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5. United Kingdom (UK) Keyboard Figure UK keyboard (L300mm x W131.3mm) 6. US International (UI) Keyboard Figure UI keyboard (L300mm x W131.
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7. Hebrew (HB) Keyboard Figure HB keyboard (L300mm x W131.3mm) 8. Danish (DM) Keyboard Figure DM keyboard (L300mm x W131.
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9. Swiss (SW) Keyboard Figure SW keyboard (L300mm x W131.3mm) 10. Arabic (ARE) Keyboard Figure ARE keyboard (L300mm x W131.
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11. Czech (CZ) Keyboard Figure CZ keyboard (L300mm x W131.3mm) 12. Russian (RU) Keyboard Figure RU keyboard (L300mm x W131.
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13. Portuguese (PO) Keyboard Figure PO keyboard (L300mm x W131.3mm) 14. Slovakian (SL) Keyboard Figure SL keyboard (L300mm x W131.
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15. Italian (IT) Keyboard Figure IT keyboard (L300mm x W131.3mm) 16. French (FR) Keyboard Figure FR keyboard (L300mm x W131.
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17. German (GR) Keyboard Figure GR keyboard (L300mm x W131.3mm) 18. Greek (GK) Keyboard Figure GK keyboard (L300mm x W131.
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19. Canada French (CF) Keyboard Figure CF keyboard (L300mm x W131.3mm) 20. Hungarian (HG) Keyboard Figure HG keyboard (L300mm x W131.
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21. Spanish (SP) Keyboard Figure SP keyboard (L300mm x W131.3mm) 22. Turkish (TR) Keyboard Figure TR keyboard (L300mm x W131.
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23. Turkish F (TF-F) Keyboard Figure TF-F keyboard (L300mm x W131.3mm) 24. Swedish (SD) Keyboard Figure SD keyboard (L300mm x W131.
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25. Belgian (BE) Keyboard Figure BE keyboard (L300mm x W131.3mm) 26. Yugoslavian (YU) Keyboard Figure YU keyboard (L300mm x W131.
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27. Norwegian (NW) Keyboard Figure NW keyboard (L300mm x W131.3mm) 28. Scandinavian (ND) Keyboard Figure ND keyboard (L300mm x W131.
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29. Canadian Multinational (AC) Keyboard Figure AC keyboard (L300mm x W131.3mm) 30. Canadian Bilingual (CB) Keyboard Figure CB keyboard (L300mm x W131.
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31. Japanese (JP) Keyboard Figure JP keyboard (L300mm x W131.
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Appendix F Appendix F F.1 Wiring Diagrams RGB Monitor ID Wraparound connector (1) RED RED (2) GREEN GREEN (2) (3) BLUE BLUE (3) (4) NC NC (4) (5) GND GND (5) (6) GND GND (6) (7) GND GND (7) (8) GND GND (8) (9) 5V 5V (9) (10) GND GND (10) (11) NC NC (11) (12) SDA SDA (12) (13) HSYNC HSYNC (13) (14) VSYNC (15) SDL VSYNC (14) SCL (1) (15) Figure F-1 RGB Monitor ID Wraparound connector (15PIN to 15PIN) F.
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Appendix G Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk USB doggle Rewriting the BIOS 1. Turn off the power to the computer. 2. Remove the external cables and cards. 3. Connect an external FDD and insert the BIOS rewriting disk into the external FDD. 4. Connect the USB doggle special for BIOS rewrite 5. Turn on the power 6.
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Appendix H Appendix H EC/KBC Rewrite Procedures Same as BIOS rewrite Procedures, please refer appendix G Satellite M300 and Satellite Pro M300 Maintenance Manual(960-Q08) H-1
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Appendix I Reliability Appendix I Reliability The following table shows MTBF (Mean Time Between Failures) in maximum configuration. Table I-1 MTBF Component System Time (hours) 4138.