Toshiba Personal Computer TECRA S3 TECRA S4 Maintenance Manual TOSHIBA CORPORATION File Number 960-532 [CONFIDENTIAL]
Copyright © 2005 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein. Toshiba Personal Computer TECRA S3 Maintenance Manual First edition August 2005 Disclaimer The information presented in this manual has been reviewed and validated for accuracy.
Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer TECRA S3. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field. SAFETY PRECAUTIONS Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the TECRA S3 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Table of Contents Chapter 1 Hardware Overview 1.1 Features ...................................................................................................................... 1-1 1.2 2.5-inch Hard Disk Drive......................................................................................... 1-11 1.3 Keyboard.................................................................................................................. 1-13 1.4 Optical Drive.................................................
Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ................................................................................... 3-4 3.3 Check of the RAID configuration.............................................................................. 3-9 3.4 Setting of the hardware configuration .............................................................
Chapter 4 Replacement Procedures 4.1 General....................................................................................................................... 4-1 4.2 Battery pack ............................................................................................................... 4-8 4.3 PC card..................................................................................................................... 4-10 4.4 SD card.........................................................
Appendices Appendix A Handling the LCD Module ........................................................................... A-1 Appendix B Board Layout ................................................................................................ B-1 Appendix C Pin Assignments............................................................................................ C-1 Appendix D Keyboard Scan/Character Codes ..................................................................
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Chapter 1 Hardware Overview [CONFIDENTIAL]
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1 Hardware Overview Chapter 1 Contents 1.1 Features.......................................................................................................................1-1 1.2 2.5-inch Hard Disk Drive .........................................................................................1-11 1.3 Keyboard ..................................................................................................................1-13 1.4 Optical Drive .......................................................
1 Hardware Overview Figures Figure 1-1 Front of the computer .....................................................................................1-5 Figure 1-2 System unit configuration...............................................................................1-6 Figure 1-3 System unit block diagram .............................................................................1-7 Figure 1-4 2.5-inch HDD ..............................................................................................
1.1 Features 1 1 Hardware Overview Features 1.1 Features The Toshiba TECRA S3 Personal Computer uses extensive Large Scale Integration (LSI), and Complementary Metal-Oxide Semiconductor (CMOS) technology extensively to provide compact size, minimum weight, low power usage and high reliability. This computer incorporates the following features and benefits: Microprocessor The PC comes in with one of the followings: • Intel Mobile Pentium-M Processor 1.73GHz/1.86GHz/2.0AGHz (0.748-1.356V)/2.13GHz (0.
1 Hardware Overview 1.1 Features Display LCD The PC comes in with one of the following two types: • 15.0” XGA-TFT color display, resolution 1,024×768, 16M colors • 15.0” SXGA+-TFT color display, resolution 1,400×1,050, 16M colors External monitor Supported via a RGB connector. Slim Select Bay A DVD-ROM & CD-R/RW drive, DVD Super Multi drive (DVD±R/±RW/-RAM) or 2nd HDD can be installed in the Slim Select Bay.
1.1 Features 1 Hardware Overview Toshiba Assist button When this button is pressed during power-on, the PC is connected to “Toshiba Assist”. When this button is pressed during power-off, the PC is turned on and connected to “Toshiba Assist”. Toshiba Presentation button This button switches the display between internal display, external display, simultaneous display and multi-monitor display. Internal modem The internal modem is equipped as a modem daughter card (MDC).
1 Hardware Overview 1.1 Features Fingerprint sensor The computer is equipped with a fingerprint sensor and fingerprint authentication utility. They enable only person who has registered his/her fingerprint to use the computer.
1.1 Features 1 Hardware Overview The front of the computer is shown in figure 1-1.
1 Hardware Overview 1.1 Features The system unit configuration is shown in figure 1-2.
1.1 Features 1 Hardware Overview Figure 1-3 is a block diagram of the system unit.
1 Hardware Overview 1.1 Features The system unit is composed of the following major components: Processor • Intel Mobile Pentium-M Processor – Processor core speed: 1.73GHz/1.86GHz/2.0AGHz/2.13GHz/2.26GHz – Processor bus speed: 533MHz – Integrated L1 cache memory: 32KB instruction cache and 32KB write-back data cache – Integrated L2 cache memory: 2MB – Integrated NDP Memory Two memory slots are provided. Expansion up to 2GB (2,048MB) is available.
1.1 Features • 1 Hardware Overview South Bridge (Intel ICH6) – – – – – – – – – – – – – – – – – – DMI (Direct Media Interface) PCI Express 2 Interface (4ports) PCI Bus Rev2.3 Interface (7 PCI REQ/GNT Pairs) Integrated Serial ATA Host Controller (2ports, 150MB/S) Integrated IDE Controller (Ultra ATA 100/66/33) AC'97 2.3 Interface USB 1.1/2.0 Controller 8 Ports (EHCI: Enhanced Host Controller) Internal LAN Controller (WfM 2.0 and IEEE 802.3) Power Management Controller (ACPI 2.0) SMBus2.
1 Hardware Overview 1.1 Features Internal LAN Controller (Marvell maid) Controls LAN and supports Gigabit Ethernet. Gigabit is connected to PCI-Express. Sound Controller Azallia and CODEC (STAC9200) are used.
1.2 2.5-inch Hard Disk Drive 1.2 1 Hardware Overview 2.5-inch Hard Disk Drive The HDD is a random access non-volatile storage device. The computer supports a 40GB, 60GB, 80GB and 100GB HDD. The HDD is shown in figure 1-4. Specifications are listed in Table 1-1. Figure 1-4 2.5-inch HDD Table 1-1 2.5-inch HDD specifications (1/2) Specifications Items Outline dimensions FUJITSU G8BC00028410 FUJITSU G8BC00028610 FUJITSU G8BC00028810 Width (mm) 70 Height (mm) 9.
1 Hardware Overview 1.2 2.5-inch Hard Disk Drive Table 1-1 2.5-inch HDD specifications (2/2) Items Outline dimensions Specifications TOSHIBA TOSHIBA TOSHIBA TOSHIBA HDD2D34BZK01 HDD2D33BZK01 HDD2D32BZK01 HDD2D30BZK01 Width (mm) 69.85 Height (mm) 9.5 Depth (mm) Weight (g) Storage size (formatted) 100 98 max. 40GB 102 max. 60GB 80GB Speed (RPM) 5,400 Data transfer rate (Mb/s) Data buffer size (kb) 218-429 236.1-456.
1.3 Keyboard 1.3 1 Hardware Overview Keyboard The keyboard is mounted 85(US)/86(UK) keys that consist of character key and control key. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-5 is a view of the keyboard. See Appendix E about a layout of the keyboard.
1 Hardware Overview 1.4 1.4 Optical Drive Optical Drive 1.4.1 DVD-ROM & CD-R/RW Drive The DVD-ROM & CD-R/RW drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15inch) CDs, CD-R/RW and DVDs. It is a high-performance drive that writes CD-R at maximum 24-speed and CD-RW at maximum 24-speed (Ultra Speed CD-RW) and reads DVD-ROM at maximum 8-speed and CD-ROM at maximum 24-speed. DVD-ROM & CD-R/RW drive specifications are listed in Table 1-2.
1.4 Optical Drive 1 Hardware Overview 1.4.2 DVD Super Multi (DVD±R/±RW/-RAM) Drive The DVD Super Multi drive is capable of driving either 12cm (4.72-inch) or 8cm (3.15-inch) DVD and CD without using an adaptor. This drive reads DVD-ROM at maximum 8-speed, reads CD-ROM at maximum 24-speed, writes CD-R at maximum 24-speed, writes CD-RW at maximum 10-speed, writes DVD-R at maximum 4-speed, writes DVD-RW at maximum 2speed, writes DVD+R at maximum 4-speed, writes DVD+R DL at maximum 2.
1 Hardware Overview 1.5 1.5 TFT Color Display TFT Color Display The TFT color display consists of 15.0-inch XGA/SXGA+ LCD module and FL inverter board. 1.5.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 16M colors with 1,024 x 768 or 1,400x 1,050 resolution. The NVIDIA-made NV43 can control both internal and external XGA/SXGA+ support displays simultaneously.
1.5 TFT Color Display 1 Hardware Overview Table 1-4 LCD module specifications (2/2) Specifications (15.0-inch SXGA+ TFT) Item LG Philips G33C0001X210 Number of Dots 1.5.2 1,400(W) x 1,050 (H) Dot spacing (mm) 0.2175 (H) x 0.2175 (V) Display range (mm) 304.5 (W) x 228.38 (H) FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module FL. Table 1-5 lists the FL inverter board specifications.
1 Hardware Overview 1.6 1.6 Power Supply Power Supply The power supply supplies many different voltages to the system board and performs the following functions: 1. Judges that the DC power supply (AC adapter) is connected to the computer. 2. Detects DC output and circuit malfunctions. 3. Controls the battery icon, and DC IN icon. 4. Turns the battery charging system on and off and detects a fully charged battery. 5. Turns the power supply on and off. 6.
1.6 Power Supply 1 Hardware Overview Table 1-6 Power supply output rating Name Voltage (V) PPV 1.404-0.748 PTV 1.05 CPU, MCH, ICH6-M PGV 1.056 GPU 1R5-P1V 1.5 CPU, MCH, ICH6-M, Express Card 1R8-B1V 1.8 MCH, DDR2-SDRAM VG1R8-P1V 1.8 GPU 2R5-P2V 2.5 MCH, ICH6-M MR0R9-B0V 0.9 MCH, DDR2-SDRAM 0R9-P0V 0.9 DDR2-SDRAM 3.3 Clock Generator, Thermal Sensor, SDRAM(SPD), ICH6M,Super I/O, GPU, Mini-PCI, TPM, LCD, Express Card, FWH, FIR, STAC9200, HDD (SATA), Finger Print Sensor 3.
1 Hardware Overview 1.7 1.7 Batteries Batteries The computer has two types of batteries as follows: Main battery pack RTC battery The battery specifications are listed in Table 1-7. Table 1-7 Battery specifications Battery name Main battery RTC battery 1.7.1 G71C0003W510 G71C0003W610 G71C0004G510 G71C0004G610 GDM710000041 Material Output voltage Capacity 8,800 mAh Lithium-Ion 10.8 V 4,700 mAh NiMH 2.
1.7 Batteries 1 Hardware Overview RTC battery The RTC battery provides power to keep the current date, time and other setup information in memory while the computer is turned off. Table 1-9 lists the charging time and data preservation period of the RTC battery.
1 Hardware Overview 1.8 1.8 AC Adapter AC Adapter The AC adapter is used to charge the battery. Table 1-10 lists the AC adapter specifications. Table 1-10 AC adapter specifications Specification Parameter G71C00043310 (two-pins) Voltage 75W (Peak 90W) Input voltage Input frequency Input power 1-22 G71C00049410 (three-pins) 100V/240V 47Hz to 63Hz 1.5A or less (100V) 1.
Chapter 2 Troubleshooting Procedures [CONFIDENTIAL]
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2 Troubleshooting Procedures Chapter 2 Contents 2.1 Troubleshooting..........................................................................................................2-1 2.2 Troubleshooting Flowchart ........................................................................................2-2 2.3 Power Supply Troubleshooting ..................................................................................2-6 2.4 2.5 2.6 2.7 Procedure 1 Icons in the LCD Check..............................
2 Troubleshooting Procedures 2.8 2.9 2.10 2.11 2.12 2.13 2.14 2.15 2.16 2-iv Display Troubleshooting ..........................................................................................2-48 Procedure 1 Diagnostic Test Program Execution Check ...............................2-48 Procedure 2 Connector Check and Cable Check ...........................................2-48 Procedure 3 Replacement Check....................................................................
2 Troubleshooting Procedures 2.17 Fingerprint sensor.....................................................................................................2-64 Procedure 1 Setting Windows Log-ON password .........................................2-65 Procedure 2 Registration of fingerprint..........................................................2-65 Procedure 3 Authentication of fingerprint .....................................................2-69 Procedure 4 Connector Check and Replacement Check....
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2.1 Troubleshooting 2 Troubleshooting Procedures 2 2.1 Troubleshooting Chapter 2 describes how to determine if a Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. The FRUs covered are: 1. 2. 3. 4. 5. Power Supply System Board USB Floppy Disk Drive Hard Disk Drive Keyboard/Touch pad 6. 7. 8. 9. 10. Display Optical Drive Modem LAN Sound 11. 12. 13. 14. 15.
2 Troubleshooting Procedures 2.2 2.2 Troubleshooting Flowchart Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which FRU malfunctions. Before going through the flowchart steps, check the following: Ask the user if a password is registered and if it is, ask him or her to enter the password. Make sure that Toshiba Windows® XP/ Windows® 2000 is installed on the hard disk. Non-Toshiba operating systems can cause the computer malfunction.
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2 Troubleshooting Procedures 2.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures If the diagnostics program cannot detect an error, the problem may be intermittent. The Running Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error, then perform the appropriate troubleshooting procedures as follows: 1.
2 Troubleshooting Procedures 2.3 2.3 Power Supply Troubleshooting Power Supply Troubleshooting The power supply controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Table 2-2 DC IN icon DC IN icon Power supply status Lights green DC power is being supplied from the AC adapter. Blinks orange There is a problem with the power supply.*1 Doesn’t light Any condition other than those above. *1 When the power supply controller detects a malfunction, the DC IN LED blinks orange and an error code is displayed. If the icon blinks, execute the followings: 1.
2 Troubleshooting Procedures Procedure 2 2.3 Power Supply Troubleshooting Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below. Start Off for 2 seconds Error code (8 bit) “1” “0” Interval between data bits On for one second On for half second Off for half second The error code begins with LSB (Least Significant bit). Example: Error code 11h (Error codes are given in hexadecimal format.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures DC IN Error code Meaning 10h AC Adaptor output voltage is over 16.5V. 11h Common Dock voltage is over 16.5V. 12h Current from the DC power supply is over 7.00A. 13h Current from the DC power supply is over 0.5A when there is no load. 14h Current sensing IC is not normal. 1st Battery Error code Meaning 22h Main battery discharge current is over 0.5A. 23h Main battery charge current is over 3.9A when the battery is charged.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting E5V output Error code Meaning 50h E5V voltage is over 6.00V when the computer is powered on/off. 51h E5V voltage is under 4.50V when the computer is powered on. 52h E5V voltage is under 4.50V when the computer is booting up. 53h E5V voltage is over 4.50V when the computer is powered off. 54h E5V voltage is under 4.50V when the EV power supply is maintained. E3V output Error code Meaning 60h E3V voltage is over 3.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures PPV output Error code Meaning 90h PPV voltage is over 1.80V when the computer is powered on/off. 91h PPV voltage is under 0.56V when the computer is powered on. 92h PPV voltage is under 0.56V when the computer is booting up. 93h PPV voltage is over 0.56V when the computer is powered off. PTV output (CH0) Error code Meaning A0h PTV voltage is over 1.26V when the computer is powered on/off. A1h PTV voltage is under 0.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting VG1R8-P1V output Error code Meaning D0h VG1R8-P1V voltage is over 2.16V when the computer is powered on/off. D1h VG1R8-P1V voltage is under 0.89V when the computer is powered on. D2h VG1R8-P1V voltage is under 0.89V when the computer is booting up. D3h VG1R8-P1V voltage is over 0.89V when the computer is powered off. PTV output (CH1) Error code Meaning E0h PTV voltage is over 1.26V when the computer is powered on/off.
2.3 Power Supply Troubleshooting Procedure 3 2 Troubleshooting Procedures Connection Check The power supply wiring diagram is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Disconnect the AC power cord from the wall outlet. Check the power cable for breaks. If the power cord is damaged, connect a new AC power cord. If there is no damage, go to Check 2. Check 2 Connect a new AC adaptor or AC power cord. • If the DC IN icon does not light, go to Procedure 5.
2 Troubleshooting Procedures Procedure 5 2.3 Power Supply Troubleshooting Replacement Check The system board processor module may be disconnected or damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures. Check the connection between the AC adaptor and system board. After checking the connections, perform the following Check 1: Check 1 Replace the AC adaptor with a new one. If the AC adaptor is still not functioning properly, perform Check 2.
2.4 System Board Troubleshooting 2.4 2 Troubleshooting Procedures System Board Troubleshooting This section describes how to determine if the system board and CPU are defective or not functioning properly. Start with Procedure 1 and continue with the other procedures as instructed.
2 Troubleshooting Procedures Procedure 1 2.4 System Board Troubleshooting Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it. If an error message is shown on the display, perform Check 1. If there is no error message, go to Procedure 2. If Toshiba MS-DOS or Windows XP is properly loaded, go to Procedure 4.
2.4 System Board Troubleshooting Check 3 2 Troubleshooting Procedures The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (22) or (23) is displayed, go to Procedure 4. If error message (18) is displayed, go to the Keyboard/Touch pad Troubleshooting Procedures in Section 2.7. If error message (19), (20) or (21) is displayed, go to the 2.5” HDD Troubleshooting Procedures in Section 2.6.
2 Troubleshooting Procedures Procedure 2 2.4 System Board Troubleshooting Printer Port LED Check on Boot Mode The printer port LED displays the IRT status and test status by turning lights on and off as an eight-digit binary value for boot mode. Figure 2-2 shows the printer port LED. Figure 2-2 Printer port LED board Figure 2-3 shows the function of the printer port LED board.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures To use the printer port LED, follow the steps below: 1. Turn on the computer’s power and set it to boot mode. 2. Turn off the computer’s power. 3. Plug the printer port LED into the parallel port. 4. While holding down the space bar, turn on the computer’s power. 5. Read the LED status from left to right. 6. Convert the status from binary to hexadecimal notation. 7. If the final LED status is FFh (normal status), go to Procedure 4.
2 Troubleshooting Procedures 2.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Printer port LED boot mode status (3/9) LED Status 00h Test item Message Prohibition of cache Permission of L1/L2 cache in FlashROM area Initialization of H/W (before DRAM recognition) Initialization of MCH Initialization of ICH.D30.Func0 Initialization of ICH.D31.Func0 Initialization of ICH.D31.Func1/2 Initialization of USB Controller Initialization of ICH.D31.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Printer port LED boot mode status (5/9) LED Status Test item (06h) Contents Battery discharging current control (1CmA). Dividing procedures for time measuring by IRT Setting for clock generator Check of CMOS default setting Default is set, when there are Bad Battery and Bad CheckSum (ROM, CMOS).
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2 Troubleshooting Procedures 2.
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2 Troubleshooting Procedures 2.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Check 1 If error code 1Eh or 20h is displayed, go to the following Sections: Section 2.6 “2.5” HDD Troubleshooting” Check 2 If the final status of the LED are the followings, perform Procedure 4.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Printer port LED suspend mode error status (1/3) LED Status Test item Contents Sets the parallel port to D0 state. (For models supporting PRT port) 36h When powering-off request from OS is required, waiting for the completion of dividing process because waiting in SUSPEND of Runtime returns the process to OS.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-5 Printer port LED suspend mode error status (2/3) LED Status 39h Test item Resume error check in suspend mode.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Printer port LED suspend mode error status (3/3) LED Status 40h Test item Contents Prohibition of PCI arbiter Setting of Wakeup event Power-off of PC card Re-setting backup current Forced off of fan Checks whether off-process for resume is needed Power LED control during suspending Isolates built-in LAN. Makes the power of sound off. Makes the power of Dock off.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-6 Printer port LED resume mode error status (1/4) LED Status Test item 00h Refer to IRT printer LED error status. 01h Refer to IRT printer LED error status. 02h Refer to IRT printer LED error status. 03h Refer to IRT printer LED error status. Contents Clears flag for SMI control. 27h(not used) Renewal of Resume counter 26h Checks the WakeUp factors.
2 Troubleshooting Procedures 2.
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2.4 System Board Troubleshooting Procedure 4 2 Troubleshooting Procedures Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. Refer to Chapter 3, Tests and Diagnostics, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test 6. ASYNC test 7. Hard Disk test 8. Real Timer test 9. NDP test 10. Expansion test 11. CD-ROM/DVD-ROM test 12. Wireless LAN test 13.
2 Troubleshooting Procedures 2.5 2.5 USB FDD Troubleshooting USB FDD Troubleshooting This section describes how to determine if the USB FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.5 USB FDD Troubleshooting Procedure 2 2 Troubleshooting Procedures Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Floppy disk drive test error codes and their status names are listed in Table 2-7. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled.
2 Troubleshooting Procedures Procedure 3 2.5 USB FDD Troubleshooting Connector Check and Replacement Check The USB FDD is connected to the US board or SR board via the USB port. Check 1 Make sure the USB FDD cable is firmly connected to the connector CN4620/CN4621 on the US board or CN4630 on the SR board. The USB FDD can be connected to any of three USB ports. (Two ports are installed on the UA board and one is on the USB board.
2.6 HDD Troubleshooting 2 2.6 2 Troubleshooting Procedures HDD Troubleshooting This section describes how to determine if the HDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.6 HDD Troubleshooting Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen. Make sure of no floppy disk in the FDD. Turn on the computer and check the message on the screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with Check 1 below and perform the other checks as instructed.
2.6 HDD Troubleshooting Procedure 3 2 Troubleshooting Procedures Format Check The computer’s 2.5” HDD is formatted using the MS-DOS FORMAT program or the physical format program of the test program. To format the 2.5” HDD, start with Check 1 below and perform the other steps as required. Refer to the MS-DOS Manual for the operation of MS-DOS. For the format by the test program, refer to the Chapter 3. Check 1 Format the 2.5” HDD using MS-DOS FORMAT command. Type as FORMAT C:/S/U. If the 2.
2 Troubleshooting Procedures Procedure 4 2.6 HDD Troubleshooting Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. Replace the HDD with a new one following the instructions in Chapter 4, Replacement Procedures.
2.6 HDD Troubleshooting Procedure 5 2 Troubleshooting Procedures Connector Check and Replacement Check The HDD may be disconnected, or the HDD or the system board may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: Check 1 Make sure the HDD is firmly connected to CN1850 on the system board. If the connection is loose, reconnect firmly and repeat Procedure 1. If there is still an error, go to Check 2.
2 Troubleshooting Procedures 2.7 2.7 Keyboard/Touch pad Troubleshooting Keyboard/Touch pad Troubleshooting To determine if the computer’s keyboard or touch pad is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test in the Diagnostic Program.
2.7 Keyboard/Touch pad Troubleshooting Check 3 2 Troubleshooting Procedures Make sure the touch pad cable is securely connected to the touch pad and connector CN3201 on the system board. If the connection is loose, reconnect firmly and repeat Procedure 1. If there is still an error, go to Check 4. Check 4 The touch pad cable may be damaged. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still exists, perform Check 5.
2 Troubleshooting Procedures 2.8 2.8 Display Troubleshooting Display Troubleshooting This section describes how to determine if the computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Cable Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check The Display Test program is stored on the computer’s Diagnostics disk.
2.8 Display Troubleshooting Procedure 3 2 Troubleshooting Procedures Replacement Check Units related to display are a FL inverter board, Display module, System board, LCD/FL cable and display ON/OFF sensor. Any of the components may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, then perform the following checks: (1) If the FL does not light, perform Check 1.
2 Troubleshooting Procedures 2.9 2.9 Optical drive Troubleshooting Optical drive Troubleshooting This section describes how to determine if the optical drive in the Slim Select Bay is functioning properly. Perform the steps below starting with Procedure 1 and continue with the other procedures as required.
2.10 Modem Troubleshooting 2 Troubleshooting Procedures 2.10 Modem Troubleshooting This section describes how to determine if the computer’s modem is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.10 Modem Troubleshooting Connector Check and Replacement Check The Modem is installed as a Modem Daughter Card (MDC). If the modem malfunctions, there may be a bad connection between the MDC and the system board or their connectors might be damaged.
2.11 LAN Troubleshooting 2 Troubleshooting Procedures 2.11 LAN Troubleshooting This section describes how to determine if the computer’s LAN is functioning properly. Perform the steps below starting with Procedure 1 and continue with the other procedures as required.
2 Troubleshooting Procedures 2.12 Sound Troubleshooting 2.12 Sound Troubleshooting This section describes how to determine if the computer’s sound functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Sound test program.
2.12 Sound Troubleshooting Procedure 2 2 Troubleshooting Procedures Connector Check The sound function-wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: 1. If the stereo speaker or internal microphone does not work correctly, perform Check 1. 2. If the external microphone or headphone does not work correctly, perform Check 2.
2 Troubleshooting Procedures Procedure 3 2.12 Sound Troubleshooting Replacement Check Check 1 If the stereo speaker or internal microphone does not sound properly, the stereo speaker or internal microphone may be defective or damaged. Replace it with a new one. If the stereo speaker or internal microphone still does not work properly, go to Check 3. Check 2 If the external microphone or headphone does not sound properly, go to Check 3. Check 3 The system board may be defective or damaged.
2.13 SD Card Slot Troubleshooting 2 Troubleshooting Procedures 2.13 SD Card Slot Troubleshooting This section describes how to determine if the computer’s SD card functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Check on Windows XP Procedure 2: Connector Check and Replacement Check Procedure 1 Check on Windows XP Insert a SD card into the slot.
2 Troubleshooting Procedures 2.14 Wireless LAN Troubleshooting 2.14 Wireless LAN Troubleshooting This section describes how to determine if the computer’s Wireless LAN is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.14 Wireless LAN Troubleshooting Procedure 2 2 Troubleshooting Procedures Antenna Connection Check The wireless LAN wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless LAN card is firmly connected to CN2200 on the system board. If the connector is disconnected, connect it firmly and perform Procedure 1.
2 Troubleshooting Procedures 2.15 Bluetooth Troubleshooting 2.15 Bluetooth Troubleshooting To check if the Bluetooth is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting-Receiving Check Procedure 2: Antenna Connection Check Procedure 3: Replacement Check Procedure 1 Transmitting-Receiving Check Before starting the test, make sure the wireless communication switch is set in the “ON” position.
2.15 Bluetooth Troubleshooting Procedure 2 2 Troubleshooting Procedures Antenna Connection Check The Bluetooth function-wiring diagram is shown below: Any of the connections may be defective. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure that the wireless communication switch is “On”. If the switch is “Off”, turn it “On”. If the problem still occurs, perform Check 2.
2 Troubleshooting Procedures Procedure 3 2.15 Bluetooth Troubleshooting Replacement Check Bluetooth module, Bluetooth antenna or system board may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 The Bluetooth antenna may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 2.
2.16 PCI ExpressCard slot 2 Troubleshooting Procedures 2.16 PCI ExpressCard slot This section describes how to check PCI ExpressCard slot by inspecting a card with PCI Express interface and a card with USB 2.0 interface. 1. Gigabit Ether ExpressCard 2. USB2.0 5in1 ExpressCard 1. Gigabit Ether ExpressCard (1) Insert the Gigabit Ether ExpressCard into the ExpressCard slot. (2) On Windows, open System Property → Hardware → Device Manager window.
2 Troubleshooting Procedures 2.17 Fingerprint sensor 2.17 Fingerprint sensor CAUTION: To delete the account for confirming the fingerprint operation, it is necessary to log on by the account with the management authority. If the password has been set to log on, ask the Log-ON password to the user. To check if the Fingerprint sensor work correctly or not, follow the troubleshooting procedures below as instructed. When failed in Procedure 1 to Procedure 3, execute Procedure 4.
2.17 Fingerprint sensor Procedure 1 2 Troubleshooting Procedures Setting Windows Log-ON password 1. Open [User Account] from [Control Panel]. 2. Select “Create a new account” in [User Account]. 3. Input the name of Account (e.g. “TOSHIBA”) in [Name the new account] and click [NEXT] button. 4. Click “Create Account” button in the (default) condition that the “Computer administrator” is selected in [Pick an account type]. 5. Select the icon of Account (e.g.
2 Troubleshooting Procedures 2.17 Fingerprint sensor 3. Input the name of Account (e.g. “TOSHIBA”), which has been inputted in item 3 in Procedure 1, in the box at the right of [User Name:] on the [Verify Username and Password]. In addition, input the password, which has been inputted in item 7 in Procedure 1, in the box at the right of name (e.g. “password”) of [Password]. Click [Next] button. 4.
2.17 Fingerprint sensor 2 Troubleshooting Procedures 5. After displaying [Capture Fingerprint], scan the fingerprint of your right index finger on the finger sensor. When it successes the number at the center of display of display changes to “2”, then scan again. When it successes the number changes to “3”, again scan (total three times). 6. After displaying [Verify Fingerprint], scan the fingerprint of your right index finger on the finger sensor again.
2 Troubleshooting Procedures 2.17 Fingerprint sensor 8. When [Audio and Taskbar Settings] is displayed, click [Next]. 9. When [Congratulations] is displayed, click [Done]. 10. When [OmniPass-Logon New User?] is displayed, click [Yes].
2.17 Fingerprint sensor 2 Troubleshooting Procedures 11. Close all applications and power off the computer. Procedure 3 Authentication of fingerprint 1. Turn on the computer and start up the Windows. 2. In the Windows Log-ON window, scan the fingerprint of your right index finger. Make sure that scanned fingerprint is displayed on the frame of [Logon Authentication] in red and you can not log on. 3. In the Windows Log-ON window, scan the fingerprint of your right index finger.
2 Troubleshooting Procedures 2.17 Fingerprint sensor 4. After starting Windows, Make sure that the name of Account (e.g. “TOSHIBA”), which has been inputted in item 3 in Procedure 1 at the top of [Start]. 5. Open [User Accounts] from [Control Panel]. Select [Delete an Account] in [Change an Account] and delete the account registered for fingerprint authentication.
Chapter 3 Tests and Diagnostics [CONFIDENTIAL]
3 Tests and Diagnostics 3 3-ii [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
3 Tests and Diagnostics Chapter 3 3.1 3.2 3.3 Contents The Diagnostic Test ................................................................................................... 3-1 3.1.1 Diagnostics menu ................................................................................. 3-1 3.1.2 H/W (Hardware) initial information setting tool.................................. 3-3 3.1.3 Heatrun test program............................................................................
3 Tests and Diagnostics 3.21 3.22 3.23 3.24 3.25 3.26 ONLY ONE TEST................................................................................................... 3-49 3.21.1 Program Description .......................................................................... 3-49 3.21.2 Operations .......................................................................................... 3-49 Head Cleaning...............................................................................................
3 Tests and Diagnostics 3.31 SETUP ................................................................................................................... 3-100 3.31.1 Function Description ........................................................................ 3-100 3.31.2 Accessing the SETUP Program........................................................ 3-102 Tables Table 3-1 Subtest names ....................................................................................................
3 Tests and Diagnostics 3-vi [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
3.1 The Diagnostic Test 3 3.1 3 Tests and Diagnostics The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
3 Tests and Diagnostics 3.1 The Diagnostic Test HARD DISK TEST REAL TIMER TEST NDP TEST EXPANSION TEST CD-ROM/DVD-ROM TEST Other tests are: Wireless LAN TEST (Wireless LAN TEST disk) LAN/Modem/Bluetooth/IEEE1394 TEST (LAN/Modem/Bluetooth/IEEE1394 TEST disk) Sound TEST (Sound TEST disk) You will need the following equipment to perform some of the Diagnostic test programs.
3.1 The Diagnostic Test 3 Tests and Diagnostics 3.1.2 H/W (Hardware) initial information setting tool The H/W initial information setting tool consists of the following programs. Initial configuration DMI information save DMI information recovery System configuration display E2PROM test (MAC/GUID/DMI) You will need the following equipment to perform some of the programs. The Diagnostics Disk (Main T&D) 3.1.3 Heatrun test program The heatrun test starts automatically after the selection.
3 Tests and Diagnostics 3.2 3.2 Executing the Diagnostic Test Executing the Diagnostic Test To start the DIAGNOSTIC PROGRAM, follow these steps: 1. Insert the Diagnostics disk in the USB floppy disk drive. 2. Turn on the computer with pressing the F12. Select the FDD in the display for selecting booting unit. Then, press Enter and the following menu appears. Microsoft Windows XX Startup Menu --------------------------------------------------------1. Repair Main (T&D) 2. Repair initial config set 3.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 3.2.1 Diagnostics menu (T&D) To execute this program, select 1- Repair Main (T&D) in the startup menu, press Enter. The following menu appears. TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Set the highlight bar to 1, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Select the option you want to execute and press Enter. When you select 1-SYSTEM TEST, the following message will appear: SYSTEM TEST NAME SUB-TEST PASS COUNT WRITE DATA ADDRESS : : : : XXXXXX XX XXXXX XX XXXXXX xxxxxxx DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Selecting YES of ERROR STOP stops the test program when an error is found and displays the operation guide on the right side of the display screen as shown below: ERROR STATUS NAME [[ HALT OPERATION ]] 1: Test end 2: Continue 3: Retry These three selections have the following functions respectively: 1. Terminates the test program and exits to the subtest menu. 2. Continues the test. 3. Restarts the test from the error.
3.3 Check of the RAID configuration 3.3 3 Tests and Diagnostics Check of the RAID configuration Following screen is displayed for checking the RAID configuration and specifying a failed drive. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status LD0 RAID-1 Capacity DEGRADE xxGB Write cache : Enable MBR Protection : Disable S.M.A.R.
3 Tests and Diagnostics 3.3 Check of the RAID configuration Logical Drive Information: Displays logical drive number, RAID level, RAID status, contents and setting. Physical Drive Information: Displays port number, logical drive number belonged, status and disk information. RAID level: Displays RAID level configured. NON: Means that RAID is not configured. Confirming the logical drive information can check if a drive exists and check models of the drive. RAID-0: There are 1RAID-0 and 2RAID-0 (striping).
3.3 Check of the RAID configuration 3 Tests and Diagnostics 3.3.2 Check of the screen display Contents of the screen displayed are shown below. 3.3.2.1 RAID-1 When the “RAID-1” is displayed in the configured by two drives. shown below, it is judged that the RAID is TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level LD0 RAID-1 Port Status DEGRADE Capacity xxGB Write cache : Enable MBR Protection : Disable S.M.A.R.
3 Tests and Diagnostics 3.3 Check of the RAID configuration TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status LD0 RAID-0 OPTIMAL Capacity xxGB Write cache : Enable MBR Protection : Disable S.M.A.R.T : Enable LD1 RAID-0 OPTIMAL xxGB Write cache : Enable MBR Protection : Disable S.M.A.R.
3.3 Check of the RAID configuration 3 Tests and Diagnostics TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level LD0 RAID-1 Port 0 1 Status Capacity DEGRADE xxGB Write cache : Enable MBR Protection : Disable S.M.A.R.T : Enable Assgn Status LD0-0 ONLINE LD0-1 FAILED Size xxGB xxGB Model FUJITSU------------FUJITSU------------- Rev xxxxxxx xxxxxxx < RAID : not OPTIMAL > 3.3.3.
3 Tests and Diagnostics 3.3 Check of the RAID configuration 3.3.3.2 RAID : not OPTIMAL ABSENT or OFFLINE is displayed When the “ABSENT” or “OFFLINE” is displayed as shown below, the drive is removed by the RAID console and installed again. When the drive is unlocked, “ABSENT” is displayed. When the drive is locked, “OFFLINE” is displayed. Repair is not needed in this case. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved.
3.3 Check of the RAID configuration 3 Tests and Diagnostics NO DRIVE for one drive is displayed When “NO DORIVE” is displayed and the HDD is connected to the port, follow the procedures below to check the HDD failure. When the HDD is not connected to the port, removing of the drive causes the failure. It is not necessary to repair. (1) Install a new HDD. When “NO DORIVE” is still displayed, It is judged that the MB or cable fails.
3 Tests and Diagnostics 3.3 Check of the RAID configuration FAIL for one drive is displayed One drive in the “RAID-1”is failed and degraded. This may look like failure by wrong operation. Specify the reason by using Independent Utility. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status LD0 RAID-1 Capacity DEGRADE xxGB Write cache : Enable MBR Protection : Disable S.M.A.R.
3.4 Setting of the hardware configuration 3.4 3 Tests and Diagnostics Setting of the hardware configuration To execute this program, select 2-Repair initial config set in the startup menu, press Enter and follow the directions on the screen. The H/W initial information setting tool consists of six subtests. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Initial configuration This subtest executes the following items and shows their contents in the display.
3 Tests and Diagnostics • • • 3.4 Setting of the hardware configuration Setting of the HWSC Setting of the UUID Display of the DMI information (including UUID) After completion of the above settings, H/W configuration & DMI information are appeared in order. Check the contents and press Enter. Subtest 03 DMI information save NOTE: Before replacing the system board, be sure to execute this subtest and save the DMI information to the floppy disk.
3.4 Setting of the hardware configuration Subtest 08 3 Tests and Diagnostics System configuration display This subtest displays the information of the system configuration. When the following message appears, confirm the contents and press Enter. Press [Enter] key For more details on the system configuration information, refer to “3.26 System configuration”. Subtest 09 E2PROM test (MAC/GUID/DMI) It checks whether the MAC address, GUID of IEEE1394 and DMI information are written.
3 Tests and Diagnostics 3.5 3.5 Heatrun Test Heatrun Test To execute this program, select 3-Repair heatrun in the startup menu, press Enter. When selecting the option you want to execute, the message shown below will appear and 01-ROM Checksum of the SYSTEM test will be executed. SYSTEM TEST NAME SUB-TEST PASS COUNT WRITE DATA ADDRESS : : : : XXXXXX XX XXXXX XX XXXXXX xxxxxxx DIAGNOSTIC TEST VX.
3.6 Subtest Names 3.6 3 Tests and Diagnostics Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No. Test Name Subtest No.
3 Tests and Diagnostics 3.6 Subtest Names Table 3-1 Subtest names (2/2) No. 3-22 Test Name Subtest No.
3.7 System Test 3.7 3 Tests and Diagnostics System Test To execute the System Test, select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM checksum This subtest executes a checksum test of the BIOS ROM (range: F0000h to FFFFFh, 64KB) on the System Board. Subtest 02 Fan ON/OFF This subtest turns on/off the fan motor by force with Fan ON/OFF commands.
3 Tests and Diagnostics Subtest 03 3.7 System Test Geyserville If the CPU supports Gerserville (SpeedStep), this Subtest checks that the CPU operating clock speed can be changed. Subtest 04 Quick charge This subtest checks the status for the quick charge. Subtest 05 DMI read This subtest displays the information in the Flash-ROM in the following format. *** DMI Data Display Ver X.
3.8 Memory Test 3.8 3 Tests and Diagnostics Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Conventional memory This subtest writes a constant data to conventional memory (0 to 640 KB), then reads the new data and compares the result with the original data. Subtest 02 Protected mode NOTE: The CONFIG.
3 Tests and Diagnostics 3.9 3.9 Keyboard Test Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed key code display When a key is pressed, the scan code, character code, and key top name are displayed on the screen in the format shown below.
3.10 Display Test 3 Tests and Diagnostics 3.10 Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM read/write for VGA This subtest writes the constant data (AAh and 55h) to the video RAM. The data is read and compared to the original data.
3 Tests and Diagnostics Subtest 04 3.10 Display Test Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode 12] 13] 3 ] 111 112 114 115 117 118 640*480 640*480 800*600 800*600 1024*768 1024*768 64K] 16M] 64K] 16M] 64K] 16M] The display below appears on the screen when this subtest is executed.
3.10 Display Test Subtest 06 3 Tests and Diagnostics “H” Pattern Display This subtest displays a full screen of “H” patterns.
3 Tests and Diagnostics 3.11 Floppy Disk Test 3.11 Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD because the contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. 1. The following message will appear. Select the media mode and start track to be tested and press Enter.
3.11 Floppy Disk Test 3 Tests and Diagnostics Select the number of the subtest you want to execute and press Enter. The following message will appear during the floppy disk test. FLOPPY DISK SUB-TEST PASS COUNT WRITE DATA ADDRESS IN PROGRESS : : : : XX XXXXX XX XXXXXX XXXXXXX xxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] : test end [Ctrl]+[C] : key stop ERROR COUNT READ DATA STATUS : XXXXX : XX : XXX When the subtest 04 or 05 is selected, the following messages will appear on the screen.
3 Tests and Diagnostics 3.12 Printer Test 3.12 Printer Test To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. NOTE: An IBM compatible printer must be connected to the system to execute this test. Also, printer port wraparound connector must be connected.
3.12 Printer Test Subtest 02 3 Tests and Diagnostics Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wraparound NOTE: To execute this subtest, a printer wraparound connector must be connected to the computer’s printer port.
3 Tests and Diagnostics 3.13 Async Test 3.13 Async Test To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
3.14 Hard Disk Test 3 Tests and Diagnostics 3.14 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. CAUTION: The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 08 or 09 is executed. Before running the test, the customer should transfer the contents of the hard disk to floppy disk or another hard disk. If the customer has not or cannot perform the back-up, create back-up disks as described below.
3 Tests and Diagnostics 3.14 Hard Disk Test 4. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press [Enter]. The following message will appear during each subtest. HARD DISK TEST XXXXXXX SUB TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXX DIAGNOSTIC TEST VX.
3.14 Hard Disk Test Subtest 04 3 Tests and Diagnostics Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder and then reads the data while moving from cylinder to cylinder. (Tests the data interference in the neighbor track.
3 Tests and Diagnostics 3.15 Real Timer Test 3 3.15 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real time A new date and time can be input during this subtest. To execute the real time subtest, follow these steps: 1.
3.15 Real Timer Test Subtest 03 3 Tests and Diagnostics Real time carry CAUTION: When this subtest is executed, the current date and time are erased.
3 Tests and Diagnostics 3.16 NDP Test 3.16 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen.
3.17 Expansion Test 3 Tests and Diagnostics 3.17 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wraparound [not supported] CAUTION: PCMCIA wraparound test is not supported for this model. NOTE: To execute this subtest, the PC card wraparound connector is required.
3 Tests and Diagnostics Subtest 02 3.17 Expansion Test RGB monitor ID NOTE: To execute this subtest, monitor supporting EDID is required. Connect the external monitor supporting EDID to the PC for the test of ID acquisition. This test is executed by VESA command. .
3.18 CD-ROM/DVD-ROM Test 3 Tests and Diagnostics 3.18 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM test, select 12 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1. For the subtest 04, use a CD-RW on the market.
3 Tests and Diagnostics 3.19 Error Code and Error Status Names 3.19 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test.
3.
3 Tests and Diagnostics 3.
3.20 Hard Disk Test Detail Status 3 Tests and Diagnostics 3.20 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eightdigit number. The first four digits represent the Hard Disk Controller (HDC) error status number and the last four digits are not used.
3 Tests and Diagnostics 3.20 Hard Disk Test Detail Status Table 3-4 Error register contents Bit Name Description 7 BBK (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error. “1” … Uncorrectable data error has been detected. 5 —— Not used 4 IDN (Identification) “0” … Not used “1” … There is no ID field in the requested sector.
3.21 ONLY ONE TEST 3.21 3 Tests and Diagnostics ONLY ONE TEST 3.21.1 Program Description This program tests the unique functions of this model. 3.21.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter. The following menu appears in the display. ################################################################ ######## ONLY ONE TEST Menu (XXXXXXXXX) ######## ################################################################ * * * 1 ............ Pressed Key Display * * 2 ............
3 Tests and Diagnostics Subtest 01 3.21 ONLY ONE TEST Pressed Key Display When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed. Holding a key down enables the auto-repeat function that causes the key’s display character to blink. Press Del + Enter to end the test. NOTE: The screen displayed on your computer may be slightly different from the one shown above.
3.21 ONLY ONE TEST Subtest 02 3 Tests and Diagnostics Touch Pad This subtest checks the functions of the touch pad as shown below. A) Direction and parameter B) Switching function check This test displays the response from the touch pad and touch pad switch. When moving your finger on the touch pad towards the upper left, the display changes according to the following illustration. If a touch pad switch is pressed, the displays appear on the right side one by one.
3 Tests and Diagnostics Subtest 03 3.21 ONLY ONE TEST GP Button This subtest checks moving of the front operation panel button. Press the Toshiba Presentation button after the following message appears. Press [Assist] button Power switch Assist Presentation Press the Toshiba Assist button after the following message appears. Press [Presentation] button If the test ends successfully, the display returns to the ONLY ONE TEST menu.
3.21 ONLY ONE TEST Subtest 05 3 Tests and Diagnostics USB NOTE: When executing this subtest, USB test module and USB cable must be connected. This subtest checks if USB port works properly. The following menu appears in the display. ################################################################ ######## ONLY ONE TEST Menu (XXXXXXXXX) ####### ################################################################ * * * 0 ............ Port 0 * * 1 ............ Port 1 * * 2 ............ Port 2 * * 9 ............
3 Tests and Diagnostics Subtest 06 3.21 ONLY ONE TEST Docker Dock/Undock This subtest is executed with Common Dock 3 installed. Press Enter while pushing the eject button of the Common Dock 3 after the following message appears. Slide Eject-SW, and press [Enter] Key Press Enter without pushing the eject button of the Common Dock 3 after the following message appears. Release Eject-SW, and press [Enter] Key If the test ends successfully, the display returns to the ONLY ONE TEST menu.
3.21 ONLY ONE TEST Subtest 07 3 Tests and Diagnostics LED This subtest checks if each LED lights properly. The following message appears in the display in order. Follow the instructions in the display to execute the test. [HDD Access LED test] Press any key and following message appears in the display. [Caps/Num/Overlay BT/W-LAN LED test] (1) Press [Caps Lock ] key ! ...Caps (on/off) (2) Press [Fn + F10 ] key ! ...Arrow (on/off) (3) Press [Fn + F11 ] key ! ...
3 Tests and Diagnostics Subtest 08 3.21 ONLY ONE TEST PC-Card Device Lock This subtest checks the device lock function. This test needs a PC card, not a PC wraparound card. Before this test, inset a PC card. Turn on the computer and select 8 from the only one test menu. When it passes the test, following message appears. Device Lock TEST OK When a PC card is not inserted or a PC wraparound card is inserted, following message appears.
3.21 ONLY ONE TEST Subtest 0A 3 Tests and Diagnostics Acceleration sensor This subtest detects and corrects the each axis (X, Y, Z). NOTE: Make sure that this subtest is executed on the following condition: 1. Flat desk with vertical plane to get the stability of machine. 2. Prevent the machine from shake or shock. Set the machine against the vertical plane with the Front upward Vertical plane Flat desk The figure below shows the name and position of each side.
3 Tests and Diagnostics 3.21 ONLY ONE TEST When this subtest is selected, the following message appears in the display. The heaven surface establishes in the upper direction Press [Enter] key NOTE: Be sure to execute the test with the display panel opened. Set the machine on the flat desk. Then press Enter to detect the data on this setting of machine. The following message appears in the display.
3.22 Head Cleaning 3.22 3 Tests and Diagnostics Head Cleaning 3.22.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.22.2 Operations 1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS - FLOPPY DISK HEAD CLEANING : VX.XX Mount cleaning disk(s) on drive(s). Press any key when ready. 2.
3 Tests and Diagnostics 3.23 3.23 Log Utilities Log Utilities 3.23.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk, or output the data to a printer or the display. The error information is displayed in the following order: 1. Error count (CNT) 2. Test name, Subtest number (TS-No) 3. Pass count (PASS) 4. Error status (STS) 5. FDD/HDD or memory address (ADDR) 6. Write data (WD) 7.
3.23 Log Utilities 3 Tests and Diagnostics 3.23.2 Operations 1.
3 Tests and Diagnostics 3.24 3.24 Running Test Running Test 3.24.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02, 06) 3. Display test (subtest 01) 4. Real timer test (subtest 02) 5. HDD test (subtest 01) The system automatically detects the number of floppy disk drives connected to the computer for the FDD test. 3.24.2 Operations 1.
3.25 Floppy Disk Drive Utilities 3.25 3 Tests and Diagnostics Floppy Disk Drive Utilities 3.25.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE: This program is only for testing a floppy disk drive. It is different from the Toshiba MS-DOS FORMAT command.
3 Tests and Diagnostics 3.25 Floppy Disk Drive Utilities 3.25.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message. [ FDD UTILITIES ] 1 2 3 4 9 – - FORMAT COPY DUMP HDD-ID READ EXIT TO DIAGNOSTICS MENU 2. FORMAT program (a) Selecting FORMAT displays the following message. DIAGNOSTICS - FLOPPY DISK FORMAT : VX.XX Drive number select (1:A, 2:B) ? (b) Select a drive number to display the following message.
3.25 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3. COPY program (a) When COPY is selected, the following message appears. FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below. Insert source disk into drive A: Press any key when ready. (c) Remove the Diagnostics Disk from the FDD, insert the source disk and press any key. The following message will appear, indicating the program has started.
3 Tests and Diagnostics 3.25 Floppy Disk Drive Utilities 4. DUMP program (a) When DUMP is selected, the following message appears. DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If 2:HDD is selected, the display will go to step (h). If 1:FDD is selected, the following message will appear. Select drive number (1:A, 2:B) ? (c) Select a drive number and the following message will be displayed.
3.25 Floppy Disk Drive Utilities 3 Tests and Diagnostics (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? 5. HDD ID READ program Selecting HDD ID displays the following HDD ID configuration. [HDD ID Read (VX.XX)] [Drive #X] Model No. = XXXXXXX Press [Enter] key Press Enter to return to the FDD UTILITIES MENU.
3 Tests and Diagnostics 3.26 System Configuration 3 3.26 System Configuration 3.26.1 Function Description NOTE: To display the system configuration, the write protect tab should be OFF position. If the tab is ON position, move the tab to OFF position and restart the test. Otherwise the correct information cannot be acquired. The System Configuration program contains the following configuration information for the computer: 1. Processor Type [Code/L2 cache] 2. Chip set [VRAM] 3.
3.26 System Configuration 3 Tests and Diagnostics 3.26.2 Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display. System Configuration Display : Ver X.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made b/g) 3.27 Wireless LAN Test Program (Intel-made b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade Calexico 802.11b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS.
3.27 Wireless LAN Test Program (Intel-made b/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. • Bad connection of wireless LAN card • Using a wrong wireless LAN card (Using unspecified card) • Defective wireless LAN card Check the connection and execute the subtest again. Subtest02 MAC Address Check This subtest displays the MAC address. When selecting this subtest, following message will appear in the display.
3 Tests and Diagnostics Subtest03 3.27 Wireless LAN Test Program (Intel-made b/g) Antenna Check & communication test of 11b mode CAUTION: To execute subtest 03-05, use another computer (with Calexico wireless LAN card) that can communicate by the wireless LAN as a responder machine. Access points are also required. (Access point for 802.11b and 802.11g) Be sure to turn the wireless communication switch ON before executing wireless LAN communication test. (The wireless communication LED lights orange.
3.27 Wireless LAN Test Program (Intel-made b/g) Subtest04 3 Tests and Diagnostics Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. After finishing the test, OK message will appear in the display. Press any key to return to the test menu. When a defective is found during the test, NG message will appear in the display. Press any key and following message will appear in the display.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Intel-made a/g) 3.28 Wireless LAN Test Program (Intel-made a/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade Calexico 802.11a/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS.
3.28 Wireless LAN Test Program (Intel-made a/g) 3 Tests and Diagnostics If a defective is found during the test, NG message will appear in the display. Press any key and following message will appear in the display. ************************************************************ * * * SKU NG !! * * * * Other Card or Module not found * * * ************************************************************ Press any key and return to the test menu.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Intel-made a/g) When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Defective wireless LAN card • Disappearance of MAC address data Checking the connection, execute the subtest again.
3.28 Wireless LAN Test Program (Intel-made a/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Connection of wireless LAN antenna cable (Main/Aux) • Condition of wireless LAN communication (Interference/obstruction) • Defective wireless LAN card Checking the connection and condition, execute the subtest again.
3 Tests and Diagnostics Subtest05 3.28 Wireless LAN Test Program (Intel-made a/g) Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. For more details on procedure and contens of this subtest, refer to Subtest04 Communication test of 11a mode. Subtest06 All the tests of Calexico 11a/b/g Card This subtest checks SKU information, MAC address of Calexico 802.11a/b/g card, antenna connection and communication test of Calexico 802.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the test program. Insert the test program disk for LAN/Modem/Bluetooth/IEEE1394 test in FDD and turn on the power. The following message will appear. Microsoft Windows XX Startup Menu ---------------------------------1. LAN 2. Modem 3. Bluetooth 4.
3 Tests and Diagnostics Subtest01 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program (i82562 + ICHx) NOTE: i82562 + ICHx test is not supported for this model. This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. The following message will appear.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest02 3 Tests and Diagnostics (GbE) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. Select 2 to execute and press Enter. The following message will appear. Testing adapter...hit to abort. * External Loopback Test...PASSED Testing completed.
3 Tests and Diagnostics 3.29.2 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Modem test For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Electric Manufacture Co.Ltd)” for the tests. To execute Modem test, press 2 and Enter. Following message will appear. [Modem loopback test !] ICHx MDC Test Program with Modem Sound (Line Test) Version X.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.3 3 Tests and Diagnostics Bluetooth test To execute this test, input 3 and press Enter. NOTE: Use another computer that can communicate by the Bluetooth as a reference machine to perform this test. Insert a floppy disk containing the test program into the target machine and turn on the target machine. The following Bluetooth test menu will appear.
3 Tests and Diagnostics Subtest01 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program BD_ADDR check This subtest checks the BD_ADDR functions. When the Bluetooth test menu is displayed, press 1 to select the test and press Enter. The following message will appear: ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If the target machine has any problem, it displays Error message. The following message is displayed. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-6 Error code for Bluetooth test (BD_ADDR) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection. Hardware Failure.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Table 3-6 Error code for Bluetooth test (BD_ADDR) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program When the test begins, the machine displays BD_ADDR of the DUT. The progress bar appears when the preparation is completed. The following message is displayed. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics When the communication test has been completed without fail, the DUT machine displays BD_ADDR. If the connection with the tester is completed, the progress bar stops. The following message is shown. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program If any problem is detected during the test, the massage FAIL is displayed on the tester machine with the error code as shown below. The error code begins with the least significant digit.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Table 3-8 Common error code Error code 0x30 0x31 0x32 0x33 0x34 0x35 0x36 0x37 0x38 0x39 0x3a 0x3b 0x3c 0x3d 0x3e 0x3f 0x40 0x41 0x42 0x43 0x44 0x45 0x46 0x47 0x48 0x49 0x4a 0x4b 0x4c 0x4d 0x4e 0x4f Meaning BT Control Status should be “Disable”, but it is “Enable”. BT Control Status should be “Enable”, but it is “Disable”. Power Status should be “OFF”, but it is “ON”. Power Status should be “ON”, but it is “OFF”.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.4 3 Tests and Diagnostics IEEE1394 test To execute this test, input 4 and press Enter. NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test. The following menu will appear: ******************************************************************** ******** IEEE1394[XXXXX] Diagnostics program ************** ******************************************************************** * * * 1 ....
3 Tests and Diagnostics 3 3.30 Sound Test program Tests and Diagnostics 3.30 Sound Test program This section describes how to perform the Sound test. To execute the sound test, refer to the following description. Insert the test program disk for Sound test in the floppy disk drive and turn on the power.
3.30 Sound Test program 3 Tests and Diagnostics *********************************** ******** May I Restart ? ******* *********************************** Press any key to continue… After pressing any key, the machine starts rebooting and sound test menu will appear in the display. Subtest01 (Microphone recording & play) This subtest checks the function of the CODEC A/D, D/A converter. When this subtest is selected, the following message will appear.
3 Tests and Diagnostics Subtest02 3.30 Sound Test program (Sine Wave) This subtest is executed by loading the COM file (ADSIN.COM). The program expands sine wave data table from 16KB to 64KB, and creates the play data. Then it transfers the data between the DMA and the CODEC to play the sine wave. (It sounds like a continuous beep.) By using wave measurable devices such as an oscilloscope, the data can be measured as a sine wave.
3.30 Sound Test program 3 Tests and Diagnostics 3.30.3 CD Sound (Standard) test To execute the CD Sound (Standard) test, press 3 and Enter. Insert the test media (TOSHIBA TEST CD-ROM or ABEX TEST CD-ROM) or music CD on the market (if the test media can not be prepared). Following menu appears in the display. For details on use of test media, refer to 3.30.3.1 Test media (Toshiba-made test media). For details on use of audio CD on the market, refer to 3.30.3.2 Audio CD. 3.30.3.
3 Tests and Diagnostics Subtest03 3.30 Sound Test program Test Tone A CAUTION: Before starting subtest03, be sure to set the sound at proper volume. This subtest plays sine wave while changing its table from 100Hz to 20Hz. The test returns to the CD Sound (Standard) menu after the test ends. Subtest 04 Test Tone B This subtest plays sine wave while changing its table from 400Hz to 3KHz and also changing the channel from left speaker to right speaker.
3.30 Sound Test program 3 Tests and Diagnostics 3.30.3.2 Audio CD Insert an audio CD and the following menu appears in the display. CD/DVD TEST IN PROGRESS XXXXXXXX SUB-TEST PASS COUNT WRITE DATA ADDRESS XX XXXXX XX XXXXXX : : : : xxxxxxx DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.31 SETUP 3.31 SETUP 3.31.1 Function Description This program displays the current system setup information as listed below: 1. Memory (a) Total 2. System Date/Time (a) Date (MM-DD-YYYY) (b) Time (HH:MM:SS) 3. Battery (a) Battery Save Mode (b) PCI Express Link ASPM 4. Password 5. HDD Password (a) (b) (c) (d) HDD HDD Password Mode User Password Master Password 6. Boot Priority (a) Boot Priority (b) HDD Priority 7.
3.31 SETUP 3 Tests and Diagnostics 10. I/O Ports (a) Serial (b) Parallel 11. Drives I/O (a) Built-in HDD (b) Select Bay 12. PCI Bus 13. Security Controller (a) TPM (b) Clear TPM Owner 14. Peripheral (a) Internal Pointing Device (b) Ext keyboard “Fn” (c) Parallel Port Mode 15. Legacy Emulation (a) USB KB/Mouse Legacy Emulation (b) USB-FDD Legacy Emulation (c) USB Memory BIOS Support Type 16. PCI LAN 17.
3 Tests and Diagnostics 3.31 SETUP 3.31.2 Accessing the SETUP Program Select 0-SETUP in the Main Menu and press Enter key. The following display appears.
3.
3 Tests and Diagnostics 3.31 SETUP Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press ↑ and ↓ to move between items in a column. Press Fn+↑ (PgUp) and Fn + ↓ (PgDn) to move between the two pages. 2. Press either the Space bar or Back Space to change the value. Accepting Changes and Exiting the SETUP Window 1. Press End to accept the changes you made.
3.31 SETUP 3 Tests and Diagnostics SETUP Options The SETUP screen is divided into functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s memory. (a) Total This field displays the total amount of memory installed and is automatically calculated by the computer. You cannot change this value. 2. System Date/Time Sets the date and time. Date Sets date. Time Sets time. 3.
3 Tests and Diagnostics User Setting 3.31 SETUP Use this option to set the battery save parameters on the sub-window, BATTERY SAVE OPTIONS. Processing Speed This feature changes the CPU processing speed. High CPU operates at high speed. (Default in Full Power Mode) Low CPU operates at low speed. (Default in Low Power Mode) CPU Sleep Mode Use this option to enable or disable the CPU sleep function. Enabled Enables sleep mode. (Default) Disabled Disables sleep mode.
3.31 SETUP 3 Tests and Diagnostics Cooling Method If the CPU becomes too hot, the fan turns on or the processing speed is lowered automatically. When the CPU temperature falls to a normal range, the fan turns off. Maximum performance If the CPU becomes too hot, the fan turns on automatically in a high speed to cool down the CPU. Gives priority to the decrease of noise. Performance If the CPU becomes too hot, the fan turns on automatically.
3 Tests and Diagnostics 3.31 SETUP 5. HDD Password This option registers, resets or changes the HDD password. (a) HDD Hard disk for setting the password. When the second HDD is mounted, “Second HDD” can be selected. Built-in HDD The password is set to Built-in HDD. (This cannot be changed, when the second HDD is not mounted.) Second HDD The password is set to Second HDD. (b) HDD Password Mode This item registers HDD password and can be selected only for registering HDD password.
3.31 SETUP 3 Tests and Diagnostics 6. Boot Priority This tab sets the priority for booting the computer and the priority for the built-in HDD or optional secondary HDD. (a) Boot Priority HDD→FDD→CD-ROM→LAN FDD→HDD→CD-ROM→LAN HDD→CD-ROM→LAN→FDD The computer looks for bootable files in the following order: HDD, FDD, CDROM and LAN. (Default) The computer looks for bootable files in the following order: FDD, HDD, CDROM and LAN.
3 Tests and Diagnostics 3.31 SETUP (b) HDD Priority This option enables to select the priority for the Built-in HDD, optional second HDD or PC card. Built-in HDD → Second HDD→USB The priority is set as Built-in HDD → Second HDD→USB. (Default) Second HDD → Built-in HDD→USB The priority is set as Second HDD → Built-in HDD→USB. Built-in HDD → USB → Second HDD The priority is set as Built-in HDD → USB → Second HDD. Second HDD → USB → Built-in HDD The priority is set as Second HDD → USB → Built-in HDD.
3.31 SETUP 3 Tests and Diagnostics (c) TV Type This option allows you to select the type of TV. NTSC (Japan) TV in Japanese system. NTSC (US) TV in the U.S. system. (Default) PAL TV in Europe and China system. 8. Others Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use. (a) Dynamic CPU Frequency Mode Use this option to choose a setting from the followings. Dynamically Switchable Enables Intel SpeedStep technology.
3 Tests and Diagnostics 3.31 SETUP (c) Auto Power On The Auto Power On has two functions. The result of setting in the subwindow (OPTIONS) is indicated as follows. Disabled Indicated when “Alarm time” set to “Disabled and “Wakeup on LAN” set to “Disabled”. Enabled Indicated when “Alarm time” set to “xx:xx:xx” or “Wakeup on LAN” set to “Enabled”.
3.31 SETUP 3 Tests and Diagnostics (e) Language During Bootup This option selects the language during bootup. This message appears only on the model for TCL(Canada). English The message is displayed in English. (Default) French The message is displayed in French. 9. Configuration This option displays the configuration method. (a) Device Config. The devices are initialized when the PNP OS loads. Setup by OS Initializes devices necessary for loading the OS. The OS will initialize other devices.
3 Tests and Diagnostics 3.31 SETUP 10. I/O ports This option controls settings for serial/parallel port. NOTE: Do not assign the same interrupt request level and I/O address to the serial port and PC card. (a) Serial Use this option to set the COM level for the serial port. Not used Does not assign the serial port. COM1 Assign the serial port specified. (Default) COM2 to COM4 Assign the serial port specified.
3.31 SETUP 3 Tests and Diagnostics 13. Security controller (a) TPM Disables the security controller called TPM (Trusted Platform Module). When the cursor is on the Enable (Disable) and the Space is pressed, message is displayed and the PC waits Y or N key input by the user. When Y is pressed, it is sets to Enable (Disable). After changing, the cursor could not be moved on the TPM tem. This option can be changed after rebooting. Disabled Disables the TPM. (Default) Enabled Enables the TPM.
3 Tests and Diagnostics 3.31 SETUP When “Enabled” is selected, the following sub-window appears. KEYBOARD = Left Ctrl + Left Alt Use this option to set a key combination on an external keyboard to emulate the Fn key on the computer’s internal keyboard. Setting a Fn key equivalent will enable you to use “Hotkeys” by pressing the set combination in place of the Fn key.
3.31 SETUP 3 Tests and Diagnostics (c) USB-FDD Legacy Emulation. This option sets the type of the USB memory as a startup device. HDD Sets the type of the USB memory to be equivalent to the HDD (Default). Disabled Sets the type of the USB memory to be equivalent to the FDD. 16. PCI LAN This option enables/disables the Built-in LAN functions. (a) Built-in LAN Enabled Enables Built-in LAN functions. (Default) Disabled Disables Built-in LAN functions. 17.
3 Tests and Diagnostics 3.31 SETUP (c) Execute Creation This option is displayed, only when the setting is changed in the “Create State”. Set the cursor bar to “Execute Creation” and press Space or Back Space. The following message will appear: Warning: If you change RAID array, you need to install OSagain. Are you sure? All data on the HDD(s) will be destroyed. Do you really want to do this? If “Yes”, please type the key string which is written in manual.
Chapter 4 Replacement Procedures [CONFIDENTIAL]
4 Replacement Procedures 4-ii [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
4 Replacement Procedures Chapter 4 Contents 4.1 General....................................................................................................................... 4-1 4.2 Battery pack ............................................................................................................... 4-8 4.3 PC card..................................................................................................................... 4-10 4.4 SD card.............................................
4 Replacement Procedures 4.30 Fluorescent Lamp..................................................................................................... 4-75 4.30.1 Replacing the 15.0-inch XGA LG Philips Fluorescent Lamp ........... 4-76 4.30.2 Replacing the 15.0-inch XGA Sharp Fluorescent Lamp.................... 4-85 4.30.3 Replacing the 15.0-inch XGA Samsung Fluorescent Lamp ............ 4-106 4.30.4 Replacing the 15.0-inch SXGA+ LG Philips Fluorescent Lamp .....
4 Replacement Procedures Figure 4-25 Removing the USB board ............................................................................ 4-39 Figure 4-26 Removing the internal microphone.............................................................. 4-41 Figure 4-27 Removing the SR board/DC-IN jack ........................................................... 4-43 Figure 4-28 Connecting the SR/USB cable .....................................................................
4 Replacement Procedures Figure 4-57 to 4-64 Replacing LG.Philips fluorescent lamp (XGA) (1) to (8) ......4-77 to 4-84 Figure 4-65 to 4-87 Replacing Sharp fluorescent lamp (XGA) (1) to (23) ..........4-85 to 4-105 Figure 4-88 to 4-91 Replacing Samsung fluorescent lamp (XGA) (1) to (4) ..............4-106 to 4-109 Figure 4-92 to 4-99 Replacing LG.Philips fluorescent lamp (SXGA+) (1) to (8) ..............
4.1 General 4 4 Replacement Procedures Replacement Procedures 4.1 General This section explains how to disassemble the computer and replace Field Replaceable Units (FRUs). It may not be necessary to remove all the FRUs in order to replace one. The chart below is a guide to which FRUs need to be removed in order to remove others.
4 Replacement Procedures 4.1 General Safety Precautions Before you begin disassembly, read the following safety precautions and observe them carefully as you work. DANGER: 1) Always use the genuine battery that is authorized by Toshiba or compatible with the unit. Since other battery packs have different specifications, they may be incompatible with the unit, and may burst or explode. Never heat or disassemble the battery pack, as that could cause leakage of alkaline solution.
4.1 General 4 Replacement Procedures Before You Begin Look over the procedures in this section before you begin disassembling the computer. Familiarize yourself with the disassembly and reassembly steps. Begin each procedure by removing the AC adapter and the battery pack as instructed in this section: 1. Do not disassemble the computer unless it is operating abnormally. 2. Use only the correct and approved tools. 3.
4 Replacement Procedures 4.1 General Disassembly Procedures The computer has four basic types of cable connectors: • Pressure Plate connector • Spring connector • Coaxial connector • Normal Pin connector To disconnect a Pressure Plate connector, lift up the tabs on either side of the connector’s plastic pressure plate and slide the cable out of the connector. To connect the cable to a Pressure Plate connector, make sure the pressure plate is fully lifted and slide the cable into the connector.
4.1 General 4 Replacement Procedures Assembly Procedures After you have disassembled the computer and fixed or repaired the problem that was causing the computer to operate abnormally, you will need to reassemble the computer. Install all the removed FRUs following the steps described in the corresponding sections in this chapter. While assembling the computer, remember the following general points: • Take your time, making sure you follow the instructions closely.
4 Replacement Procedures 4.1 General Screw Tightening Torque When you fasten screws, be sure to follow the torque list below. CAUTION: Overtightening can damage components and screws; undertightening can result in electrical shorts or other damage if screws or components come loose. NOTE: Toshiba recommends that you use an electric screw driver for quick and easy operations. • M2 0.167 N·m (1.7 kgf·cm) • M2.5 0.294 N·m (3.0 kgf·cm) • M3 0.549 N·m (5.
4.1 General 4 Replacement Procedures Marking of Screws on the Computer Body To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body. Color/Material of screws Symbol Black B Silver S Zinc Z Other screws (Unique screws, STUD, etc.
4 Replacement Procedures 4.2 4.2 Battery pack Battery pack Removing the Battery pack To remove the battery pack, follow the steps below and refer to Figure 4-1. CAUTION: When handling battery packs, be careful not to short circuit the terminals. Also do not drop, hit or apply impact; do not scratch, break, twist or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC adapter and other external devices from the computer. 3. Turn the computer face down. 4.
4.2 Battery pack 4 Replacement Procedures Installing the Battery pack To install the battery pack, follow the steps below and refer to Figure 4-1. CAUTION: The battery pack is a lithium ion battery, which can explode if not properly replaced, used, handled or disposed of. For environmental reasons, collect the spent battery packs. Use only batteries recommended by Toshiba as replacements. NOTE: Check the battery’s terminals visually. If they are dirty, wipe them clean with a dry cloth. 1.
4 Replacement Procedures 4.3 4.3 PC card PC card Removing the PC card To remove the PC card, follow the steps below and refer to Figure 4-2. CAUTION: Before you remove a PC card, refer to the card’s documentation and to your operating system documentation for proper procedures and precautions. 1. Turn the computer face up. 2. Press the PC card eject button to extend it. 3. Press the extended eject button to pop the PC card out slightly. 4. Grasp the PC card and pull it out.
4.4 SD card 4.4 4 Replacement Procedures SD card Removing the SD card To remove the SD card, follow the steps below and refer to Figure 4-3. CAUTION: Before you remove the SD card, refer to the card’s documentation and to your operating system documentation for proper procedures and precautions. 1. Push in the SD card (indicated as “1” in the figure below) and release it to pop the card out slightly. 2. Grasp the SD card and pull it out (indicated as “2” in the figure below).
4 Replacement Procedures 4.5 4.5 Memory module Memory module Removing the Memory module To remove the memory module, make sure the computer is in boot mode and powered off, follow the steps below and refer to Figure 4-4. CAUTION: The power must be turned off when you remove/insert the memory module. Removing/inserting a memory module with the power on might damage the module or the computer itself. Never press hard or bend the memory module. 1. Turn over the computer. 2.
4.5 Memory module 4 Replacement Procedures Installing the Memory module To install the memory module, make sure the computer is in boot mode and powered off, follow the steps below and refer to Figure 4-4. CAUTION: Do not touch the connectors on the memory module or on the computer. Dust and stains on the connectors may cause memory access problems. 1. Insert the memory module into the connector slantwise (terminal side first) and press it to connect firmly.
4 Replacement Procedures 4.6 4.6 HDD HDD CAUTION: When handling the HDD, do not press the top surface as shown by the arrow. Hold it by the sides. Removing the HDD To remove the HDD, follow the steps below and refer to Figure 4-5 and 4-6. 1. Loosen the screw (with e-ring) fixing the HDD cover and slide your finger under the HDD cover and lift it up to remove. 2. Hold the tub to raise the HDD assembly straight and pull out the HDD assembly from the connector of the HDD cable.
4.6 HDD 4 Replacement Procedures NOTE: The following steps describe how to disassemble the HDD assembly; however, do not disassemble if the HDD is working properly. 3. Place the HDD assembly on a flat surface, and remove the following screws. • M3×4S FLAT HEAD screw ×4 4. Separate the HDD and the HDD bracket. CAUTION: Do not apply pressure to the top or bottom of the HDD.
4 Replacement Procedures 4.6 HDD Installing the HDD To install the HDD, follow the steps below and refer to Figure 4-5 and 4-6. CAUTION: Do not hold the HDD by its top and bottom flat surfaces. It may damage the HDD. 1. Seat the HDD in the HDD bracket and secure them with the following screws. • M3×4S FLAT HEAD screw ×4 CAUTION: Do not apply pressure to the middle of the HDD pack. It may damage the HDD assembly. Hold the HDD assembly by its corners. 2.
4.7 Wireless LAN card 4.7 4 Replacement Procedures Wireless LAN card Removing the Wireless LAN card To remove the wireless LAN card, make sure the computer is in boot mode and powered off, follow the steps below and refer to Figure 4-7. CAUTION: Do not try to remove the wireless LAN card with the computer turned on. The computer or the wireless LAN card can be damaged. Do not touch the connectors on the wireless LAN card on the computer.
4 Replacement Procedures 4.7 Wireless LAN card Installing the Wireless LAN card To install the wireless LAN card, make sure the computer is in boot mode and powered off, follow the steps below and refer to Figure 4-7. CAUTION: Be sure to switch the computer off before installing the wireless LAN card. Otherwise, the computer or the wireless LAN card may be damaged. 1. Insert the wireless LAN card into the connector of the slot slantwise and press it to connect firmly.
4.8 Slim select bay module 4.8 4 Replacement Procedures Slim select bay module Removing the Slim select bay module To remove the slim select bay module, follow the steps below and refer to Figure 4-8 and 49. The explanation and figure shown below are the optical drive removing/installing. As for other module, the procedure is same. CAUTION: Do not put fingers in the slim select bay module. It may cause injury. 1.
4 Replacement Procedures 4.8 Slim select bay module 3. Remove the following screws, connector cover and connector from the optical drive assembly. • M2×6S BIND screw ×2 4. Remove the following screw and connector cover from the optical drive assembly. • M2×3S S-FLAT HEAD screw ×1 5. Remove the following screws and connector cover holder from the optical drive assembly.
4.8 Slim select bay module 4 Replacement Procedures Installing the Slim select bay module To install the slim select bay module, follow the steps below and refer to Figure 4-8 and 4-9. 1. Install the connector cover holder to the optical drive assembly and secure it with the following screws. • M2×6S BIND screw ×1 • M2×22S BIND screw ×1 2. Install the connector cover to the optical drive assembly and secure it with the following screw. • M2×3S S-FLAT HEAD screw ×1 3.
4 Replacement Procedures 4.9 4.9 Keyboard Keyboard Removing the Keyboard To remove the keyboard, follow the steps below and refer to Figure 4-10 to 4-13. 1. Turn the computer face up. 2. Open the display and make it flat. 3. Insert your finger into the latches of the both sides and lift up the speaker cover to remove. 4. Remove the following screws. • M2.5×4B FLAT HEAD screw ×2 M2.5×4B FLAT HEAD M2.
4.9 Keyboard 4 Replacement Procedures 5. Lift the upper side of the keyboard while releasing three latches and turn it face down on the palm rest. Keyboard Figure 4-11 Turning over the keyboard 6. Remove the following screw. • M2.5×4B FLAT HEAD screw ×1 7. Peel off the adhered portion (adhered to the CPU holder) of the keyboard support plate and slide it to the direction indicated in the figure below to remove. M2.
4 Replacement Procedures 4.9 Keyboard 8. Disconnect the keyboard cable from the connector CN3200 on the system board and remove the keyboard. Keyboard cable CN3200 Keyboard Figure 4-13 Removing the keyboard Installing the Keyboard To install the keyboard, follow the steps below and refer to Figure 4-10 to 4-13. 1. Place the keyboard face down on the palm rest. 2. Connect the keyboard cable to the connector CN3200 on the system board. 3.
4.10 Touch pad 4 Replacement Procedures 4.10 Touch pad Removing the Touch pad To remove the touch pad, follow the steps below and refer to Figure 4-14 and 4-15. 1. Disconnect the touch pad cable from the connector CN3201 on the system board. 2. Remove the touch pad assembly while releasing the latches.
4 Replacement Procedures 4.10 Touch pad 3. Peel off the glass tape and disconnect the touch pad cable from the connector on the touch pad. 4. Remove the following screws and touch pad. • M2.5×4B FLAT HEAD screw ×2 M2.5×4B FLAT HEAD Glass tape M2.5×4B FLAT HEAD Touch pad cable Touch pad Figure 4-15 Removing the touch pad Installing the Touch pad To install the touch pad, follow the steps below and refer to Figure 4-14 and 4-15. 1. Install the touch pad and secure it with the following screws.
4.11 Bluetooth module 4 Replacement Procedures 4.11 Bluetooth module Removing the Bluetooth module To remove the Bluetooth module, follow the steps below and refer to Figure 4-16. 1. Disconnect the Bluetooth antenna cable from the connector on the Bluetooth module. 2. Disconnect the Bluetooth cable from the connector CN4400 on the system board. 3. Remove the Bluetooth module from the slot and disconnect the Bluetooth cable from the connector on the Bluetooth module.
4 Replacement Procedures 4.11 Bluetooth module Installing the Bluetooth module To install the Bluetooth module, follow the steps below and refer to Figure 4-16. 1. Connect the Bluetooth cable to the connector on the Bluetooth module and set the Bluetooth module to the slot in place. 2. Connect the Bluetooth cable to the connector CN4400 on the system board. 3. Connect the Bluetooth antenna cable to the connector on the Bluetooth module.
4.12 Switch membrane 4 Replacement Procedures 4.12 Switch membrane Removing the Switch membrane To remove the switch membrane, follow the steps below and refer to Figure 4-17. 1. Remove the following screw and lift up the upper part of the right side of the switch cover to remove. • M2.5×4B FLAT HEAD x1 2. Peel off the insulator and disconnect the switch cable from the connector CN3260 on the system board. 3. Remove the following screw and slide the switch membrane to the right to remove. • M2.
4 Replacement Procedures 4.12 Switch membrane Installing the Switch membrane To install the switch membrane, follow the steps below and refer to Figure 4-17. 1. Install the switch membrane in place and secure it with the following screw. • M2.5×4B FLAT HEAD screw x1 2. Connect the switch cable to the connector CN3260 on the system board. 3. Slide the switch cover to the below to install and secure it with the following screw. • 4-30 M2.
4.13 Display assembly 4 4 Replacement Procedures Replacement Procedures 4.13 Display assembly Removing the Display assembly To remove the display assembly, follow the steps below and refer to Figure 4-18 to 4-20. 1. Peel off the insulator and disconnect the finger print sensor cable from the connector CN9700 on the system board. 2. Disconnect the speaker cable from the connector CN6170 on the system board. 3.
4 Replacement Procedures 4.13 Display assembly 5. Turn the computer face down and remove the following screws. • M2.5×16B FLAT HEAD screw ×8 (“16” in the figure below) • M2.5×8B FLAT HEAD screw ×7 (“8” in the figure below) • M2.
4.13 Display assembly 4 Replacement Procedures 6. Turn the computer face up and open the display. 7. Lift the display assembly up to remove while releasing the latches.
4 Replacement Procedures 4.13 Display assembly Installing the Display assembly To install the display assembly, follow the steps below and refer to Figure 4-18 to 4-20. 1. Place the display assembly to the base assembly while engaging the latches. 2. Secure the display assembly (front) with the following screws. • M2.5×8B FLAT HEAD screw ×1 • M2×6S BIND screw ×1 3. Turn up the black tape and connect the LCD cable to the connector CN5500 on the system board. 4.
4.14 RTC battery 4 Replacement Procedures 4.14 RTC battery Removing the RTC battery To remove the RTC battery, follow the steps below and refer to Figure 4-21. 1. Disconnect the RTC battery cable from the connector CN9990 on the system board. 2. Turn up the battery holder and remove the RTC battery from the holder. RTC battery RTC battery cable CN9990 Figure 4-21 Removing the RTC battery Installing the RTC battery To install the RTC battery, follow the steps below and refer to Figure 4-21. 1.
4 Replacement Procedures 4.15 Modem Daughter Card (MDC) 4.15 Modem Daughter Card (MDC) Removing the Modem Daughter Card To remove the modem daughter card, follow the steps below and refer to Figure 4-22 and 423. 1. Remove the following screws securing the modem daughter card. • M2×4B BIND screw ×2 2. Lift up the modem daughter card to disconnect it from the connector CN3010 on the system board. 3. Disconnect the modem cable from the connector on the modem daughter card.
4.15 Modem Daughter Card (MDC) 4 Replacement Procedures 4. Turn up the insulator and remove the modem jack from the slot. 5. Peel off the glass tape and turn up the insulator (cable holder). 6. Disconnect the modem cable from the connector CN3011 on the system board.
4 Replacement Procedures 4.15 Modem Daughter Card (MDC) Installing the Modem Daughter Card (MDC) To install the modem daughter card, follow the steps below and refer to Figure 4-22 to 4-24. 1. Turn up the insulator (cable holder) and connect the modem cable to the connector CN3011 on the system board. Stick the glass tape on the cable. 2. Turn up the insulator and install the modem jack to the slot.
4.16 USB board 4 Replacement Procedures 4.16 USB board Removing the USB board To remove the USB board, follow the steps below and refer to Figure 4-25. 1. Remove the following screw and lift up the USB board to the left above. • M2.5×6S Tapping screw ×1 2. Disconnect the USB cable from the connector CN4622 on the USB board. 3. Disconnect the USB cable from the connector CN4610 on the system board and take it out. M2.
4 Replacement Procedures 4.16 USB board Installing the USB board To install the USB board, follow the steps below and refer to Figure 4-25. 1. Connect the USB cable to the connector CN4610 on the system board. 2. Connect the USB cable to the connector CN4622 on the USB board. 3. Install the USB board in place and secure it with the following screw. • 4-40 M2.
4.17 Internal microphone 4 Replacement Procedures 4.17 Internal microphone Removing the Internal microphone To remove the internal microphone, follow the steps below and refer to Figure 4-26. 1. Remove the following screws and front panel. • M2.5×6S Tapping screw ×2 2. Disconnect the microphone cable from the connector CN6050 on the system board. 3. Take out the internal microphone from the slot of the front panel. M2.5×6S Tapping Microphone Front panel Microphone cable M2.
4 Replacement Procedures 4.17 Internal microphone Installing the Internal microphone To install the internal microphone, follow the steps below and refer to Figure 4-26. 1. Install the internal microphone to the slot of the front panel. (Pass the hole of the microphone rubber through the guide.) 2. Connect the microphone cable to the connector CN6050 on the system board. 3. Install the front panel in place and secure it with the following screws. • 4-42 M2.
4.18 SR board/DC-IN jack 4 Replacement Procedures 4.18 SR board/DC-IN jack Removing the SR board/DC-IN jack To remove the SR board/DC-IN jack, follow the steps below and refer to Figure 4-27. 1. Remove the following screw and take out the SR board from the slot. • M2.5×6S Tapping screw ×1 2. Disconnect the SR/USB cable from the connector CN9510 on the SR board. 3. Remove the following screw and serial harness holder. • M2.5×6S Tapping screw ×1 4.
4 Replacement Procedures 4.18 SR board/DC-IN jack Installing the SR board/DC-IN jack To install the SR board/DC-IN jack, follow the steps below and refer to Figure 4-27 and 428. 1. Connect the DC-IN jack cable to the connector CN8800 on the system board (Pass the cable under the guide) and install the DC-IN jack to the slot. 2. Connect the SR/USB cable to the connectors CN3421 and CN4611 on the system board. 3. Install the serial harness holder and secure it with the following screw. • M2.
4.19 Fan 4 Replacement Procedures 4.19 Fan Removing the Fan To remove the fan, follow the steps below and refer to Figure 4-29. 1. Peel off the glass tape. 2. Disconnect the fan cable from the connector CN8770 on the system board. 3. Remove the following screws and fan. • M2.5×4B FLAT HEAD screw ×2 Fan cable Glass Tape M2.5×4B FLAT HEAD M2.
4 Replacement Procedures 4.19 Fan Installing the Fan To install the Fan, follow the steps below and refer to Figure 4-29. 1. Install the fan and secure it with the following screws. • M2.5×4B FLAT HEAD screw ×2 2. Connect the fan cable to the connector CN8770 on the system board. 3. Stick the glass tape in place. CAUTION: When sticking the glass tape, do not let the tape over the CPU heat sink.
4.20 CPU 4 Replacement Procedures 4.20 CPU Removing the CPU To remove the CPU, follow the steps below and refer to Figure 4-30 and 4-31. 1. Remove the following screws securing the CPU holder, in the reverse order of the number marked on the holder. • M2×4B BIND screw ×3 2. Remove the CPU holder and CPU heat sink.
4 Replacement Procedures 4.20 CPU 3. Unlock the CPU by rotating the cam on the CPU socket 90 degrees to the counterclockwise with a flat-blade screwdriver (in the order shown in the figure below). 4. Remove the CPU.
4.20 CPU 4 Replacement Procedures Installing the CPU To install the CPU, follow the steps below and refer to Figure 4-30 to 4-32. 1. Check that the triangle on the cam is in the unlocking position. 2. Install the CPU to the correct position in the CPU socket. 3. Fix the CPU by rotating the cam 90 degrees to the clockwise with a flat-blade screwdriver. 4. If there is already silicon grease on the CPU, clean it with a cloth.
4 Replacement Procedures 4.21 GFX board 4.21 GFX board Removing the GFX board To remove the GFX board, follow the steps below and refer to Figure 4-33 and 4-34. 1. Remove the following screws securing the GPU heat sink, in the reverse order of the number marked on the heat sink.
4.21 GFX board 4 Replacement Procedures 2. Remove the following screws and disconnect the GFX board from the connector CN5900 on the system board. • M2×4B S-FLAT HEAD screw ×2 GFX board M2×4B S-FLAT HEAD CN5900 M2×4B S-FLAT HEAD Figure 4-34 Removing the GFX board Installing the GFX board To install the GFX board, follow the steps below and refer to Figure 4-33 and 4-34. 1. Insert the GFX board into the connector CN5900 on the system board slantwise and press it to connect firmly. 2.
4 Replacement Procedures 4.22 System board 4.22 System board Removing the System board To remove the system board, follow the steps below and refer to Figure 4-35 to 4-39. 1. Remove the following screw and HDD cable holder. • M2.5×6S Tapping screw ×1 2. Take out the HDD cable of the HDD connector side from the slot. M2.
4.22 System board 4 Replacement Procedures 3. Remove the following screw and system board. • M2.5×6S Tapping screw ×1 M2.5×6S Tapping System board Figure 4-36 Removing the modem jack 4. Peel off the insulator and disconnect the HDD cable from the connector CN1850 on the back of the system board.
4 Replacement Procedures 4.22 System board 5. Remove the following screws and PC card slot from the back of the system board. • M2×8B S-FLAT HEAD screw ×2 • M2×3S S-FLAT HEAD screw ×2 PC card slot M2×8B S-FLAT HEAD M2×3S S-FLAT HEAD Figure 4-38 Removing the PC card slot 6. Remove the following screws and north bridge IC heat sink from the back of the system board.
4.22 System board 4 Replacement Procedures Installing the System board To install the system board, follow the steps below and refer to Figure 4-35 to 4-39. 1. Install the north bridge IC heat sink in place (back of the system board) and secure it with the following screws. • M2×4S S-FLAT HEAD screw ×2 2. Install the PC card slot in place (back of the system board) and secure it with the following screws. • M2×8B S-FLAT HEAD screw ×2 • M2×3S S-FLAT HEAD screw ×2 3.
4 Replacement Procedures 4.23 FP board 4.23 FP board Removing the FP board To remove the FP board, follow the steps below and refer to Figure 4-40. 1. Peel off the glass tape (back of the middle assembly). 2. Remove the following screws and FP board. • M2×3S S-FLAT HEAD screw ×2 3. Disconnect the FP cable from the connector CN950 on the FP board.
4.23 FP board 4 Replacement Procedures Installing the FP board To install the FP board, follow the steps below and refer to Figure 4-40. 1. Connect the FP cable to the connector CN950 on the FP board. 2. Install the FP board in place and secure it with the following screws. • M2×3S S-FLAT HEAD screw ×2 3. Stick the glass tape on the FP cable.
4 Replacement Procedures 4 4.24 LCD unit/FL inverter Replacement Procedures 4.24 LCD unit/FL inverter Removing the LCD unit/FL inverter To remove the LCD unit/FL inverter, follow the steps below and refer to Figure 4-41 to 4-47. 1. Peel off two mask rubbers and two mask seals and remove the following screws securing the display mask. • M2.5×4B FLAT HEAD screw ×2 • M2×4B S-FLAT HEAD screw ×2 2. Remove the display mask while releasing the latches. Mask rubber Mask seal M2×4B S-FLAT HEAD M2.
4.24 LCD unit/FL inverter 4 Replacement Procedures 3. Peel off one insulator from the FL inverter and take out the other one under the LCD unit. 4. Remove the following screw securing the FL inverter. • M2×4B S-FLAT HEAD screw ×1 5. Disconnect two cables from the FL inverter and remove the FL inverter from the slot.
4 Replacement Procedures 4.24 LCD unit/FL inverter 6. Remove the following screws securing the LCD unit.
4.24 LCD unit/FL inverter 4 Replacement Procedures 7. Carefully lift up the top of the LCD unit to access the LCD cable. NOTE: When lifting up the top of the LCD unit, hold the corners of the LCD unit. The top edge of the LCD unit is sensitive area. 8. Remove the glass tape securing the LCD cable. 9. Disconnect the LCD cable and remove the LCD unit. CAUTION: When removing the LCD cable, be careful not to damage the connector.
4 Replacement Procedures 4.24 LCD unit/FL inverter 10. Remove the following screws and detach two LCD brackets from the LCD unit. • M2×3S S-FLAT HEAD screw ×8 M2×3S S-FLAT HEAD LCD bracket M2×3S S-FLAT HEAD LCD unit LCD bracket Figure 4-45 Removing the LCD bracket 11. Peel off the insulator from the back of the middle cover.
4.24 LCD unit/FL inverter 4 Replacement Procedures 12. Peel off two insulators (front of the middle assembly). 13. Remove the following screw and LCD cable holder A. • M2.5×4S Tapping screw ×1 14. Remove the following screw and LCD cable holder B. • M2.5×6S Tapping screw ×1 15. Take out the LCD cable from the hole of the middle assembly. M2.5×4S Tapping LCD cable M2.
4 Replacement Procedures 4.24 LCD unit/FL inverter Installing the LCD unit/FL inverter To install the LCD unit/FL inverter, follow the steps below and refer to Figure 4-41 to 4-47. 1. Pass the LCD cable through the hole of the middle frame and set it in place. 2. Install the LCD cable holder B to the slot and secure it with the following screw. • M2.5×6S Tapping screw ×1 3. Install the LCD cable holder A to the slot and secure it with the following screw. • M2.5×4S Tapping screw ×1 4.
4.25 Cover latch 4 Replacement Procedures 4.25 Cover latch Removing the Cover latch To remove the cover latch, follow the steps below and refer to Figure 4-48. 1. Remove the cover cap. 2. Remove the cover latch to the direction in the figure below. Be careful not lose the spring Spring Cover latch Cover cap Figure 4-48 Removing the cover latch Installing the Cover latch To install the cover latch, follow the steps below and refer to Figure 4-48. 1. Install the cover latch in place. 2.
4 Replacement Procedures 4.26 Wireless LAN antenna/Bluetooth antenna 4.26 Wireless LAN antenna/Bluetooth antenna Removing the Wireless LAN antenna/Bluetooth antenna To remove the wireless LAN antenna/Bluetooth antenna, follow the steps below and refer to Figure 4-49 and 4-50. 1. Peel off one acetate tape and four insulators from the back of the middle assembly. 2. Tale out the wireless LAN antenna cables from the hole of the middle frame.
4.26 Wireless LAN antenna/Bluetooth antenna 4 Replacement Procedures 3. Peel off eight acetate tapes and one insulator. 4. Peel off the wireless LAN antennas and Bluetooth antenna from the top cover and take them out.
4 Replacement Procedures 4.27 Hinge 4.27 Hinge Removing the Hinge To remove the hinge, follow the steps below and refer to Figure 4-51 to 4-53. 1. Remove the following screws and separate the display cover and middle frame. • M2×4B • M2.5×6S Tapping screw BIND screw ×4 ×2 Display cover M2×4B BIND M2×4B BIND M2×4B BIND M2.5×6S Tapping M2×4B BIND M2.
4.27 Hinge 4 Replacement Procedures 2. Remove the following screw and SPG GND VGA fin. • M2×3S S-FLAT HEAD screw ×1 3. Remove the following screws and take out the right hinge from the hole of the middle frame by moving it to the left. • M2.5×6S ×2 Tapping screw M2.5×6S Tapping M2×3S S-FLAT HEAD SPG GND VGA fin Hinge (right) M2.
4 Replacement Procedures 4.27 Hinge 4. Remove the following screw and take out the left hinge from the hole of the middle frame by moving it to the right. • M2.5×6S Tapping screw ×1 M2.
4.27 Hinge 4 Replacement Procedures Installing the Hinge To install the hinge, follow the steps below and refer to Figure 4-51 to 4-53. 1. Install the left hinge and secure it with the following screw. • M2.5×6S Tapping screw ×1 2. Install the right hinge and secure it with the following screws. • M2.5×6S Tapping screw ×2 3. Install the SPG GND VGA fin and secure it with the following screw. • M2×3S S-FLAT HEAD screw ×1 4.
4 Replacement Procedures 4.28 Speaker 4.28 Speaker Removing the Speaker To remove the speaker, follow the steps below and refer to Figure 4-54. 1. Peel off four insulators. 2. Remove the left and right speakers from the slots. Speaker Insulator Speaker Figure 4-54 Removing the speaker Installing the Speaker To install the speaker, follow the steps below and refer to Figure 4-54. 1. Install the speakers (right and left) to the each slot. 2. Seat the speaker cables in place and stick four insulators.
4.29 Battery slider 4 Replacement Procedures 4.29 Battery slider Removing the Battery slider To remove the battery slider, follow the steps below and refer to Figure 4-55 and 4-56. 1. Release the latches of the battery slider A and remove the slider cap from the bottom of the computer. 2. Take out the battery slider A from the base cover.
4 Replacement Procedures 4.29 Battery slider 3. Release the latches of the battery slider B and remove the slider cap from the bottom of the computer. 4. Take out the battery slider B from the base cover. Spring Battery slider B Slider cap Figure 4-56 Removing the battery slider B Installing the Battery slider To install the Battery slider, follow the steps below and refer to Figure 4-55 and 4-56. 1. Install the spring to the battery slider B and set them to the base assembly. 2.
4.30 Fluorescent Lamp 4 Replacement Procedure 4 4.30 Fluorescent Lamp This system uses LCD modules from the following suppliers. The procedure for replacing the fluorescent lamp is different for each LCD module. Refer to the appropriate procedure. Type 15.0-inch (XGA) 15.0-inch (SXGA+) Part No. Supplier Section G33C00030110 LG Philips 4.30.1 G33C0002Y110 SHARP 4.30.2 G33C0002W110 Samsung 4.30.3 G33C0001X210 LG Philips 4.30.
4 Replacement Procedure 4.30 Fluorescent Lamp 4.30.1 Replacing the 15.0-inch XGA LG Philips Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module. Disassembling the 15.0-inch XGA LG Philips Fluorescent Lamp To disassemble the 15.0-inch XGA LG Philips fluorescent lamp, follow the steps below and refer to Figure 4-57 to 4-64.
4.30 Fluorescent Lamp 4 Replacement Procedure Figure 4-57 Replacing LG.
4 Replacement Procedure 4.30 Fluorescent Lamp Disassembly of Top Case 1. Disassembly of Top Case. CAUTION: Pressure or stress should not be given on Source TCP and Gate COF. Figure 4-58 Replacing LG.
4.30 Fluorescent Lamp 4 Replacement Procedure Disassembly of Source PCB 1. Disassembly of Source PCB. CAUTION: Pressure or stress should not be given on PCB and TCP. Figure 4-59 Replacing LG.
4 Replacement Procedure 4.30 Fluorescent Lamp Disassembly of Board Ass’y, Tape Adhesive, Light guide, Cover Ass’y Bottom (L) 1. Disassembly of Board Ass’y. CAUTION: This process should be made in Clean room with no scratch nor particle on Polarizer and B/L Ass’y. 2. Disassembly of Tape Adhesive used for Sheets fixing (4 Points). 3. Disassembly of Sheets and Light guide. CAUTION: No penetration of foreign body is indispensable with no scratch on the surface of each Sheet. 4.
4.30 Fluorescent Lamp 4 Replacement Procedure Assembly of Cover Ass’y Bottom (L), Sheets, Light guide, Tape Adhesive and Board Ass’y. 1. Assembly of Cover Ass’y Bottom and Screw (2 Point). CAUTION: Maximum value of torque with Screw should be below 2.0kgf.cm. 2. Assembly of Light Guide and Sheets. (Reflector Sheet fixing with one Double Tape, Diffuser Sheet fixing with one Double Tape.) CAUTION: No penetration of foreign body is indispensable with no scratch on the surface of each Sheet and Light guide.
4 Replacement Procedure 4.30 Fluorescent Lamp Assembly of Source PCB 1. Assembly of Source PCB. CAUTION: Stress should not be given on TCP. Figure 4-62 Replacing LG.
4.30 Fluorescent Lamp 4 Replacement Procedure Assembly of Top Case 1. Assembly of Top Case. CAUTION: Pressure should not be given on Source TCP and Gate COF. Figure 4-63 Replacing LG.
4 Replacement Procedure 4.30 Fluorescent Lamp Assembly of outside Tape and Cover shield 1. Assembly of Cover shield (S). CAUTION: Pressure or stress should not be given on Source PCB. Usage of gloves with anti-electric discharge coating is recommended. To eliminate possible damage on circuits occurred by ESC. 2. Assembly of Cover shield (G). CAUTION: Pressure or stress should not be given on Gate TCP. 3. Assembly of Tape Adhesive used for Top case fixing.
4.30 Fluorescent Lamp 4 Replacement Procedure 4.30.2 Replacing the 15.0-inch XGA Sharp Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module. Removing the 15.0-inch XGA Sharp fluorescent lamp To remove the 15.0-inch XGA Sharp Fluorescent Lamp, follow the steps below and refer to Figures 4-65 to 4-74. 1.
4 Replacement Procedure 4.30 Fluorescent Lamp 2. Remove the four screws (E) on the both sides. (E) (E) Screw loosening torque: 1.2kg.
4.30 Fluorescent Lamp 4 Replacement Procedure 3. Turn the LCD module face up and remove the bezel (F). (F) (3) Release the hook of the bezel. Be careful not to stick the protection cover G on the TCP. (2) Release two latches of the lump cover. (1) Release two latches of the P-chassis.
4 Replacement Procedure 4.30 Fluorescent Lamp 4. Turn the LCD module face down and remove the screw (E) fixing the board. Then open the bent portion of the TCP of the board and remove the backlight. (E) Screw loosening torque: 1.2kg.cm Figure 4-68 Replacing Sharp fluorescent lamp (XGA) (4) Do not hold the edge. Do not hold the edge.
4.30 Fluorescent Lamp 4 Replacement Procedure 5. Turn the LCD module face up and remove the LCD panel (G) from the backlight unit (H). CAUTION: Wear finger sacks or gloves during the work not to soil or scratch the LCD panel or backlight unit.
4 Replacement Procedure 4.30 Fluorescent Lamp 6. Peel off four fixing tapes (P). CAUTION: Keep the removed fixing tapes (P) to reuse.
4.30 Fluorescent Lamp 4 Replacement Procedure 7. Remove the lens sheet (M), diffusion sheet (N) and light guide plate (O). CAUTION: Be careful not to scratch or soil the removed sheets and light guide to reuse them. Do not remove the reflection sheet under the light guide.
4 Replacement Procedure 4.30 Fluorescent Lamp 8. Turn the back light unit (G) face down and remove two screws (I), lump cover (J), metal fitting A (K) and metal fitting B (L). CAUTION: Be careful not to scratch or soil the back light unit.
4.30 Fluorescent Lamp 4 Replacement Procedure 9. Remove the lamp unit (Q) from the P-chassis. CAUTION: When removing the lamp unit, be careful not to break the lamp, or bend the reflection sheet.
4 Replacement Procedure 4.30 Fluorescent Lamp Assembling the 15.0-inch XGA Sharp fluorescent lamp To assemble the 15.0-inch Sharp XGA fluorescent lamp, follow the steps below and refer to figures 4-75 to 4-87. 1. Install a new lamp unit (Q) on the P-chassis. CAUTION: When install the lamp unit (Q), be careful not to bend or damage the reflection sheet.
4.30 Fluorescent Lamp 4 Replacement Procedure Install the lamp unit without floating. Install the reflection sheet as it is placed inside the reflector. Install the lead wire into this groove.
4 Replacement Procedure 4.30 Fluorescent Lamp 2. Install the metal fitting A (K), metal fitting B (L) and lump cover (J) on the backlight unit and secure the two screws (I). An order of installing is: (K), (L), and (J). (L) (K) (J) (I) Screw tightening torque: 1.0kg•cm (I) Figure 4-77 Replacing Sharp fluorescent lamp (XGA) (13) 3. Install the light guide plate (O) on the backlight unit. Insert the thick side of the light guiding plate in the lamp unit.
4.30 Fluorescent Lamp 4 Replacement Procedure 4. Place the diffusion sheet (N) and lens sheet (M) on the backlight unit with light guide plate. An order of the sheets placing is: (N) and (M). (M) (N) Make sure there is no dust or scratch. Do not make any sheet over the edge of P-chassis. Do not make any sheet over the edge of P-chassis.
4 Replacement Procedure 4.30 Fluorescent Lamp 5. Stick four fixing tapes (P).
4.30 Fluorescent Lamp 4 Replacement Procedure 6. Place the LCD panel (H) on the backlight unit (G). CAUTION: Make sure there is no dust between the LCD panel and backlight unit. If any dust is found, remove it with crepe tape or others, which has no remaining of paste. (H) Guide rib Guide rib Guide rib Guide rib (G) Make sure the LCD panel is installed in the guide rib surely.
4 Replacement Procedure 4.30 Fluorescent Lamp 7. Bend the TCP attaching to the source board and secure the screw (E). Do not hold the edge. Do not hold the edge.
4.30 Fluorescent Lamp 4 Replacement Procedure (E) Screw tightening torque: 1.2kg.
4 Replacement Procedure 4.30 Fluorescent Lamp 8. Install the bezel (F) on the lamp cover and hook four latches on the lamp cover and two latches on the P-chassis. (F) Be careful not to stick the protection cover G on the TCP (1) Hitch the hook of the bezel on the rib of the P-chassis. (2) Lean the bezel on the lamp cover without interference with the TCP.
4.30 Fluorescent Lamp 4 Replacement Procedure Make sure of mating of the bezel and the rib of the P-chassis. Make sure of mating of the bezel and the latch of the P-chassis. Make sure of mating of the bezel and the latch of the P-chassis.
4 Replacement Procedure 4.30 Fluorescent Lamp 9. Secure the four screws (E) on the both sides. (E) (E) Screw tightening torque: 1.2kg.
4.30 Fluorescent Lamp 4 Replacement Procedure 10. Stick the protection cover G (B), protection cover SC (A) and two fixing tapes (C) and (D). (A) Fit the cover according to the outline of the screw. 0 to 1 0 to 1 (B) (C) (D) 0 to 1 mm Do not make the tape over the top of the module. The tape MUST NOT appear on the display. Stick the tape according to the outline of the LCD module. Make sure the tape does not appear on the side of the module.
4 Replacement Procedure 4.30 Fluorescent Lamp 4.30.3 Replacing the 15.0-inch XGA Samsung Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module. Disassembling the 15.0-inch XGA Samsung Fluorescent Lamp To disassemble the 15.0-inch XGA Samsung fluorescent lamp, follow the steps below and refer to Figure 4-88 to 4-91. 1. Remove the PCB.
4.30 Fluorescent Lamp 4 Replacement Procedure 2. Remove the white tapes, lamp-wire tape and aluminum tape.
4 Replacement Procedure 4.30 Fluorescent Lamp 3. Separate the Top Chassis from the Mold frame.
4.30 Fluorescent Lamp 4 Replacement Procedure 4. Separate the Panel assembly from the BLU CAUTION: Handle with care not to damage the COF of S/D and G/D ICs.
4 Replacement Procedure 4.30 Fluorescent Lamp Assembling the 15.0-inch XGA Samsung Fluorescent Lamp To assemble the 15.0-inch XGA Samsung fluorescent lamp, follow the steps below and refer to Figure 4-88 to 4-91. Assembling is the opposite order of the disassembling.
4.30 Fluorescent Lamp 4 Replacement Procedure 4.30.4 Replacing the 15.0-inch SXGA+ LG Philips Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module. Disassembling the 15.0-inch SXGA+ LG Philips Fluorescent Lamp To disassemble the 15.0-inch SXGA+ LG Philips fluorescent lamp, follow the steps below and refer to Figure 4-92 to 4-95.
4 Replacement Procedure 4.
4.30 Fluorescent Lamp 4 Replacement Procedure Disassembly of Top Case 1. Disassembly of Top Case. CAUTION: Pressure or stress should not be given on Source COF and Gate COF.
4 Replacement Procedure 4.30 Fluorescent Lamp Disassembly of Source PCB 1. Disassembly of Source PCB. CAUTION: Pressure or stress should not be given on PCB and COF.
4.30 Fluorescent Lamp 4 Replacement Procedure Disassembly of Board Ass’y, Tape Adhesive, Light guide, Cover Ass’y Bottom (L) 1. Disassembly of Board Ass’y. CAUTION: This process should be made in Clean room with no scratch nor particle on Polarizer and B/L Ass’y. 2. Disassembly of Tape Adhesive used for Sheets fixing (4 Points). 3. Disassembly of Sheets and Light guide. CAUTION: No penetration of foreign body is indispensable with no scratch on the surface of each Sheet. 4.
4 Replacement Procedure 4.
4.30 Fluorescent Lamp 4 Replacement Procedure Assembling the 15.0-inch SXGA+ LG Philips Fluorescent Lamp To assemble the 15.0-inch SXGA+ LG Philips fluorescent lamp, follow the steps below and refer to Figure 4-96 to 4-99. Assembly of Cover Ass’y Bottom (L), Sheets, Light guide, Tape Adhesive and Board Ass’y 1. Assembly of Cover Ass’y Bottom and Screw (2 Point). CAUTION: Maximum value of torque with Screw should be below 2.0kgf.cm. 2. Assembly of Light Guide and Sheets.
4 Replacement Procedure 4.
4.30 Fluorescent Lamp 4 Replacement Procedure Assembly of Source PCB 1. Assembly of Source PCB. CAUTION: Stress should not be given on COF.
4 Replacement Procedure 4.30 Fluorescent Lamp Assembly of Top Case 1. Assembly of Top Case. CAUTION: Pressure should not be given on Source COF and Gate COF.
4.30 Fluorescent Lamp 4 Replacement Procedure Assembly of outside Tape and Cover shield 1. Assembly of Cover shield (S). CAUTION: Pressure or stress should not be given on Source PCB. Usage of gloves with anti-electric discharge coating is recommended. To eliminate possible damage on circuits occurred by ESC. 2. Assembly of Cover shield (G). CAUTION: Pressure or stress should not be given on Gate COF. 3. Assembly of Tape Adhesive used for Top case fixing.
4 Replacement Procedure 4-122 [CONFIDENTIAL] 4.
Appendices [CONFIDENTIAL]
Appendices App-ii [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Appendices Appendix Contents Appendix A Handling the LCD Module .......................................................................... A-1 Appendix B Board Layout .................................................................................................B-1 B.1 System Board (FDRSY*) Front View ...................................................................B-1 B.2 System Board (FDRSY*) Back View ....................................................................B-3 B.
Appendices C.22 CN5620 RGB connector (15-pin) .......................................................................C-23 C.23 CN5501 S-VIDEO connector (4-pin) .................................................................C-23 C.24 CN5900 GFX board interface connector (230-pin) ............................................C-24 C.25 CN6050 Internal microphone connector (2-pin).................................................C-28 C.26 J6051 External microphone connector (5-pin)....................
Appendices F.6 RS232C direct-connection cable (9-pin to 25-pin) ................................................ F-3 Appendix G BIOS rewrite Procedures ............................................................................ G-1 Appendix H EC/KBC rewrite Procedures....................................................................... H-1 Appendix I Reliability .........................................................................................................
Appendices Tables Table B-1 System board (FDRSY*) ICs and connectors (front).......................................B-2 Table B-2 System board (FDRSY*) ICs and connectors (back).......................................B-4 Table B-3 US board (FDRUS*) connectors .....................................................................B-5 Table B-4 SR board (FDRSR*) connectors ......................................................................B-6 Table B-5 FS board (FDRFS*) connectors ....................
Appendices Table C-25 Internal microphone connector (2-pin) ........................................................C-28 Table C-26 External microphone connector (5-pin).......................................................C-28 Table C-27 Speaker connector (4-pin)............................................................................C-28 Table C-28 Headphone connector (5-pin) ......................................................................C-28 Table C-29 DC-IN connector (4-pin) .......
Appendices Table J-5 Item of parameter set .......................................................................................J-14 Table J-6 Item of array ....................................................................................................J-20 Table J-7 Items set in View Drive Info. ..........................................................................J-23 Table J-8 Explanation of option and Function of key .....................................................
Appendix A Handling the LCD Module Appendix A Appendices P Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
Appendices Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4.
Appendix A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
Appendices Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage.
Appendix A Handling the LCD Module Appendices 9. Do not disassemble the LCD module. Disassembly can cause malfunctions. 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxime). These materials can release gas that can damage the panel’s polarization.
Appendices A-6 Appendix A Handling the LCD Module [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Appendix B Board Layout Appendices Appendix B Board Layout B.
Appendices Appendix B Board Layout Table B-1 System board (FDRSY*) ICs and connectors (front) B-2 Mark Number Name (A) J6310 Headphone connector (B) J6051 External microphone connector (C) CN4200 IEEE1394 connector (D) CN6050 Internal microphone connector (E) CN9990 RTC battery connector (F) CN3010 MDC I/F connector (G) IC1600 ICH6-M (H) CN9700 FS Board I/F connector (I) CN4610 US Board I/F connector (J) CN4611 SR Board I/F connector (K) CN4400 Bluetooth I/F connector
Appendix B Board Layout B.
Appendices Appendix B Board Layout Table B-2 System board (FDRSY*) ICs and connectors (back) B-4 Mark Number Name (A) CN2300 Docking I/F connector (B) CN1850 (C) CN2200 Wireless LAN card I/F connector (D) IC2000 PC card controller (E) IS2101 SD card connector (F) CN1400 DIMM1 connector (G) CN1410 DIMM0 connector [CONFIDENTIAL] SATA HDD I/F connector TECRA S3 Maintenance Manual (960-532)
Appendix B Board Layout B.
Appendices B.
Appendix B Board Layout B.
Appendices B-8 Appendix B Board Layout [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Appendix C Pin Assignments Appendices Appendix C Appendix C Pin Assignments System board C.1 CN1410 SO-DIMM0 connector (200-pin) Table C-1 SO-DIMM0 connector (200-pin) (1/3) Pin No. Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments Table C-1 SO-DIMM0 connector (200-pin) (2/3) Pin No. C-2 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices Table C-1 SO-DIMM0 connector (200-pin) (3/3) Pin No. Signal Name I/O Pin No.
Appendices C.2 Appendix C Pin Assignments CN1400 SO-DIMM1 connector (200-pin) Table C-2 SO-DIMM1 connector (200-pin) (1/3) Pin No. C-4 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices Table C-2 SO-DIMM1 connector (200-pin) (2/3) Pin No. Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments Table C-2 SO-DIMM1 connector (200-pin) (3/3) Pin No. C-6 Signal Name I/O Pin No.
Appendix C Pin Assignments C.3 Appendices CN1850 SATA interface connector (11-pin) Table C-3 SATA interface connector (11-pin) Pin No. C.4 Signal Name I/O Pin No. Signal Name I/O 1 SATAT0-P3P O 2 SATAT0-P3N O 3 GND - 4 SATAR0-P3N I 5 SATAR0-P3P I 6 GND - 7 P3V - 8 GND - 9 P5V - 10 GND - 11 GND - 1T GND - 2T GND - 3T GND - 4T GND - CN1810 Select bay interface connector (72-pin) Table C-4 Select bay interface connector (72-pin) (1/2) Pin No. I/O Pin No.
Appendices Appendix C Pin Assignments Table C-4 Select bay interface connector (72-pin) (2/2) Pin No. C-8 Signal Name I/O Pin No.
Appendix C Pin Assignments C.5 Appendices CN2100 PC card interface connector (150-pin) Table C-5 PC card interface connector (150-pin) (1/3) Pin No. Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments Table C-5 PC card ard interface connector (150-pin) (2/3) Pin No. C-10 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices Table C-5 PC card interface connector (150-pin) (3/3) Pin No. C.6 Signal Name I/O Pin No. Signal Name I/O 145 ACAD01-EYP I/O 146 ACAD02-EYP I/O 147 ACAD00-EYP I/O 148 ACCD1-E3N I 149 GND - 150 GND - 1T GND - 2T GND - IS2101 SD card interface connector (12-pin) Table C-6 SD card interface connector (12-pin) Pin No. Signal Name I/O Pin No.
Appendices C.7 Appendix C Pin Assignments CN2200 Mini PCI interface connector (124-pin) Table C-7 Mini PCI interface connector (124-pin) (1/2) Pin No. C-12 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices Table C-7 Mini PCI interface connector (124-pin) (2/2) Pin No. Signal Name I/O Pin No.
Appendices C.8 Appendix C Pin Assignments CN2300 Docking interface connector (240-pin) Table C-8 Docking interface connector (240-pin) (1/4) Pin No. C-14 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices Table C-8 Docking interface connector (240-pin) (2/4) Pin No. Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments Table C-8 Docking interface connector (240-pin) (3/4) Pin No. C-16 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices Table C-8 Docking interface connector (240-pin) (4/4) Pin No. C.9 Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments C.11 CN3200 Keyboard interface connector (34-pin) Table C-11 Keyboard interface connector (34-pin) Pin No. Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices C.13 CN3260 SW board interface connector (13-pin) Table C-13 SW board interface connector (13-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O I NC GPBTNA-S3N - 1 3 GPBTNB-S3W NC - 2 4 5 NC - 6 NC - 7 PWRSW-S3N I 8 NC - 9 NC - 10 GND - 11 NC - 12 NC - 13 PNLOFF-S3N I 1T GND - 2T GND - I C.14 CN3421 SR board interface connector (12-pin) Table C-14 SR board interface connector (12-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments C.15 CN3401 Parallel port interface connector (25-pin) Table C-15 Parallel port interface connector (25-pin) Pin No. Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices C.18 CN4400 Bluetooth interface connector (20-pin) Table C-18 Bluetooth interface connector (20-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 GND - 2 NC - 3 BTMDL-P3N I 4 NC - 5 NC - 6 NC - 7 NC - 8 BTRST-S3N O 9 NC - 10 NC - 11 GND - 12 NC - 13 (GND) - 14 WCHCLK-P3P O 15 NC - 16 USBP4-E3P I/O 17 USBP4-E3N I/O 18 NC - 19 NC - 20 BT-P3V - C.
Appendices Appendix C Pin Assignments C.21 CN5500 LCD interface connector (40-pin) Table C-21 LCD interface connector (40-pin) Pin No. C-22 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices C.22 CN5620 RGB connector (15-pin) Table C-22 RGB connector (15-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 SYSRED-PXP O 2 SYSGRN-PXP O 3 SYSBLU-PXP O 4 NC - 5 GND - 6 GND - 7 GND - 8 GND - 9 DDC-P5V - 10 GND - 11 NC - 12 CRTSDA-P5P I/O 13 SHSYNC-P5P O 14 SVSYNC-P5P O 15 CRTSCL-P5P I/O 1T GND 2T GND - - C.23 CN5501 S-VIDEO connector (4-pin) Table C-23 S-VIDEO connector (4-pin) Pin No.
Appendices C.24 Appendix C Pin Assignments CN5900 GFX board interface connector (230-pin) Table C-24 GFX board interface connector (230-pin) (1/4) PIN No. C-24 Signal name I/O PIN No. Signal name I/O 1 PVT-EFV - 2 1R5-P1V - 3 PVT-EFV - 4 1R5-P1V - 5 PVT-EFV - 6 1R5-P1V - 7 PVT-EFV - 8 1R5-P1V - 9 PVT-EFV - 10 1R5-P1V - 11 PVT-EFV - 12 1R5-P1V - 13 PVT-EFV - 14 (L1INE1-PXP) - 15 PVT-EFV - 16 GND - 17 N.C.
Appendix C Pin Assignments Appendices Table C-24 GFX board interface connector (230-pin) (2/4) PIN No. Signal name I/O PIN No.
Appendices Appendix C Pin Assignments Table C-24 GFX board interface connector (230-pin) (3/4) PIN No. C-26 Signal name I/O PIN No.
Appendix C Pin Assignments Appendices Table C-24 GFX board interface connector (230-pin) (4/4) PIN No. Signal name I/O PIN No.
Appendices Appendix C Pin Assignments C.25 CN6050 Internal microphone connector (2-pin) Table C-25 Internal microphone connector (2-pin) Pin No. 1 Signal Name MICIN I/O Pin No. I 2 Signal Name A-GND I/O - C.26 J6051 External microphone connector (5-pin) Table C-26 External microphone connector (5-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 A-GND - 2 MICIN I 3 VREF1 - 4 (MICIN) I 5 NC - C.
Appendix C Pin Assignments Appendices C.30 CN8020 Main Battery connector (10-pin) Table C-30 Main Battery connector (10-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 PVBL1 - 2 BTMP1 I 3 (DCHG) - 4 M5V - 5 PSCL-S5P I/O 6 PSDA-S5P I/O 7 GND - 8 DBT10V-S5N O 9 GND - 10 GND - C.31 CN9990 RTC Battery connector (3-pin) Table C-31 RTC Battery connector (3-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments FDRSR Board C.34 CN9510 System board interface connector (20-pin) Table C-34 System board interface connector (20-pin) Pin No. 1 3 5 7 9 11 13 15 17 19 1T Signal Name USB1PS-E5V USB1PS-E5V GND NC NC DCD1:110 SD1:O10 GND RTS1:110 RT1:110 GND I/O Pin No. I I/O I O O I - 2 4 6 8 10 12 14 16 18 20 2T Signal Name USB1PS-E5V USBP6-E3P E5V NC GND RD1:010 DTR1:110 DSR1:110 CTS1:110 GND GND I/O I I/O I O I I - C.
Appendix C Pin Assignments Appendices FDRFS Board C.37 CN950 System board interface connector (8-pin) Table C-37 System board interface connector (8-pin) Pin No. 1 3 5 7 1T Signal Name NC P3V GND USBFS-E3P GND TECRA S3 Maintenance Manual (960-532) I/O Pin No.
Appendices Appendix C Pin Assignments FDRVG Board C.38 CN5901 System board interface connector (230-pin) Table C-38 System board interface connector (230-pin)(1/4) PIN No. C-32 Signal name I/O PIN No. Signal name I/O 1 PVT-EFV - 2 1R5-P1V - 3 PVT-EFV - 4 1R5-P1V - 5 PVT-EFV - 6 1R5-P1V - 7 PVT-EFV - 8 1R5-P1V - 9 PVT-EFV - 10 1R5-P1V - 11 PVT-EFV - 12 1R5-P1V - 13 PVT-EFV - 14 (L1INE1-PXP) - 15 PVT-EFV - 16 GND - 17 N.C.
Appendix C Pin Assignments Appendices Table C-38 System board interface connector (230-pin)(2/4) PIN No. Signal name I/O PIN No.
Appendices Appendix C Pin Assignments Table C-38 System board interface connector (230-pin) (3/4) PIN No. C-34 Signal name I/O PIN No.
Appendix C Pin Assignments Appendices Table C-38 System board interface connector (230-pin) (4/4) PIN No. Signal name I/O PIN No.
Appendices Appendix C Pin Assignments FDRUS Board C.39 CN4622 System board interface connector (12-pin) Table C-39 System board interface connector (12-pin) Pin No. 1 3 5 7 9 11 Signal Name GND D- (Port 3) USB Power D- (Port 4) GND NC I/O Pin No. I/O I/O - 2 4 6 8 10 12 Signal Name GND D+ (Port 3) USB Power D+ (Port 4) GND NC I/O I/O I/O - C.40 CN4620 USB Port 3 connector (4-pin) Table C-40 USB Port 3 connector (4-pin) Pin No. 1 3 1T 3T Signal Name USB Power D+ GND NC I/O Pin No.
Appendix D Keyboard Scan/Character Codes Appendices Appendix D Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) D-2 Cap No.
Appendix D Keyboard Scan/Character Codes Appendices Table D-1 Scan codes (set 1 and set 2) (3/4) Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap No. Keytop Code set 1 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 126 Pause *7 *7 *7 *7 *7 *8 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F *1 204 App E0 5D E0 DD E0 2F E0 F0 2F *1 Make Code set 2 Break Make Note Break Notes: *1: Scan codes differ by mode.
Appendix D Keyboard Scan/Character Codes Appendices Table D-2 Scan codes with left Shift key Cap Key No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
Appendix D Keyboard Scan/Character Codes Appendices Table D-5 Scan codes in overlay mode Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-7 No.126 key scan code Key top Shift Code set 1 Code set 2 Make Make Pause Common * E1 1D 45 E1 Ctrl* E0 46 E0 C6 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E 14 F0 77 *: This key generates only make codes.
Appendix E Key Layout Appendices Appendix E Appendix E E.1 Key Layout United Kingdom (UK) Keyboard Figure E-1 UK keyboard E.
Appendices E-2 Appendix E Key Layout [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Appendix F Wiring diagrams Appendices Appendix F Appendix F F.1 Wiring diagrams LAN Loopback Connector Figure F-1 LAN loopback connector F.
Appendices F.3 Appendix F Wiring diagrams RS232C Loopback Connector Figure F-3 RS232C loopback connector F.
Appendix F Wiring diagrams F.5 Appendices RS232C direct-connection cable (9-pin to 9-pin) Figure F-5 RS232C direct-connection cable (9-pin to 9-pin) F.
Appendices F-4 Appendix F Wiring diagrams [CONFIDENTIAL]] TECRA S3 Maintenance Manual (960-532)
Appendix G BIOS rewrite procedures Appendices Appendix G Appendix G BIOS rewrite procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk for the computer that has renewed BIOS data. Rewriting the BIOS 1. Set the system to boot mode. 2. Turn off the power to the computer. 3. Remove the external cable and PC card. 4.
Appendices G-2 Appendix G BIOS rewrite procedures [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Appendix H EC/KBC rewrite procedures Appendices Appendix H Appendix H EC/KBC rewrite procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. Tools To rewrite the EC/KBC, you need the following tool: BIOS/EC/KBC rewriting disk for the computer Rewriting the EC/KBC 1. Set the system to boot mode. 2. Turn off the power to the computer. 3. Remove the external cable and PC Card. 4.
Appendices H-2 Appendix H EC/KBC rewrite procedures [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Appendix I Reliability Appendices Appendix I Appendix I Reliability The following table shows MTBF (Mean Time Between Failures).
Appendices I-2 Appendix I Reliability [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Appendix J Maintenance of TOSHIBA RAID Appendices Appendix J Appendix J J.1 Maintenance of TOSHIBA RAID Outline of Maintenance (Repair) of TOSHIBA RAID Follow the below procedures to repair TOSHIBA RAID. Reception Is the RAID configured by two HDD? (*1) No Yes Identify the failed HDD (*2) Is it needed to specify the cause? No Yes Perform the HDD Troubleshooting Procedure in Section 2.6.
Appendices J.2 Appendix J Maintenance of TOSHIBA RAID Analysis and handling by Drive Log Follow the below procedures to analyze. Boot the independent utility and check the Physical Drive status. Port 1 (1) Which port of HDD failed? Port 0 (2) If necessary, analyze the Drive Log and identify the cause of failure. Replace the second HDD with new (good) one. (3) Does operation miss cause it? No Yes (4) Change the status of the failed HDD to “OFFLINE”.
Appendix J Maintenance of TOSHIBA RAID J.2.1 Appendices How to identify the cause of failure (1) When “Fail” or “NODRIVE” is displayed. According to “Operation of Independent utility”, boot the independent utility to display the Drive Log. To identify the failure cause of Port 0, analyze the Drive Log of [REDUNDANT] side of Port 1. To identify the failure cause of Port 1, analyze the Drive Log of [REDUNDANT] side of Port 0. Analyze this log. 1.
Appendices Appendix J Maintenance of TOSHIBA RAID 2. Analyze the detailed data of the message of right before of “xxx Error (IN)”, “xxx Error (OUT)” (for example, “DMA Error (IN)”, “DMA Error (OUT)”) right before the log of “Fail this drive” message and identify the cause.
Appendix J Maintenance of TOSHIBA RAID Appendices Command Indicates Command code caused an error. The following list indicates the command.
Appendices Appendix J Maintenance of TOSHIBA RAID Table J-1 List of Command (2/2) LBA (Logical Block Address): First sector address caused an error. Sector Count: Number of sectors transmitted from the address indicated by LBA. STATUS: Status of command. The lowest bit becomes “1”, when an error occurs. Error: Content of error. It indicates that an error occurs when the object bit is “1”. Bit7:ICRC Indicates that a CRC error occurs on the transmission bus (SATA) between Host and HDD.
Appendix J Maintenance of TOSHIBA RAID Appendices (2) Check if it is caused by an operation miss or is a failure. To check if the cause of failure of Port1 is an operation miss or not, analyze the Drive Log of Port0. 1. In [REDUNDANT] of Port-0, find a log of “Fail this drive” message by PgUp and PgDn key. 2. If no message of “Fail this drive” message, it is judged that the second HDD is removed without the operation of removal by TOSHIBA RAID console and installed again.
Appendices Appendix J Maintenance of TOSHIBA RAID J.3 Operation of Independent Utility J.3.1 Outline of Independent Utility This is a utility to display Drive Log of TOSHIBA RAID. (1)Drive Log TOSHIBA RAID can store about 7,000 logs of Drive Log. TOSHIBA RAID make Drive Log redundant and store it. The drive has own log and other drive’s log. In TOSHIBA RAID, the log of own drive is called “Own Log” and the redundant log of other drive’s drive is called “Redundant Log”.
Appendix J Maintenance of TOSHIBA RAID J.3.2 Appendices How to operate the Independent Utility (1)Booting PC Connected the USB FDD to the PC to be repaired. Insert the FD storing the program of the Independent Utility in the FDD and boot the PC from the FD. The following display appears. In the Independent Utility, the cursor is moved by with ↑ key and ↓ key. Press Enter key to execute the option selected. Press Esc key to return to the previous menu. Pressing F1 key displays Help.
Appendices Appendix J Maintenance of TOSHIBA RAID (2) Display of Logical/Physical Drive Logical Drive The status of RAID array is displayed in Logical Drive by array. The displayed items are follows. Table J-2 Displayed item in Logical Drive Explanation Status (Status of array) Displays the status of array. The contents are follows. -OPTIMAL The array works normally. -DEGRADE The array is degraded. -CRITICAL The array is failed. It can not be used. RAID Level Displays the RAID level.
Appendix J Maintenance of TOSHIBA RAID Appendices Physical Drive In Physical Drive, the condition of RAID array is displayed by array. The following items are displayed. Table J-3 Items displayed in Physical Drive Explanation Port Displays the port number of Serial ATA connected to the drive. Assign Displays the array number and drive number of array that the drive is incorporated. The display format is LD [Array number] [Drive number]. For example, [LD0-1] means the disk drive 1 of Array 0.
Appendices Appendix J Maintenance of TOSHIBA RAID (3) Explanation of Main Menu The Independent Utility has following Main Menu. Table J-4 Item of Main Menu displayed Explanation Create Array Builds RAID array. Start Rebuild Rebuilds RAID-1. While the rebuild is suspended, the message of “Resume Rebuild” is displayed. Check Media Checks if any error in drives configuring array. This is available for the RAID-1 in the “Optimal” condition. Modify Array Changes the setting of array.
Appendix J Maintenance of TOSHIBA RAID Appendices The tree of Independent Menu is as follows.
Appendices Appendix J Maintenance of TOSHIBA RAID Create Array This section explains how to select option and build array. The [Create Array] option can be selected only when there is a drive not assigned. To build array, follow the procedure below. 1. Put the cursor on [Create Array] in [Main Menu] and press Enter key. 2. Select RAID level. Put the cursor on [RAID-1] or [RAID-0] and press Enter key. 3.
Appendix J Maintenance of TOSHIBA RAID Appendices 6. Put the cursor on the “DONE” and press Enter key. Pressing “OK” in [Confirmation] store the change. CAUTION: When the array is initialized, the data of drive is lost. Start Rebuild Selecting of this option starts rebuilding. [Start Rebuild] is displayed only in the RAID1 condition of with “OFFLINE” drive that has same or more size of capacity as the array in the condition of “Optimal” or “Degraded”.
Appendices Appendix J Maintenance of TOSHIBA RAID 3. When [Rebuild Range] menu is displayed, the range to be rebuilt is designated. When [Effective] is selected, rebuild limit becomes valid and it rebuilds up to the rebuild limit. When [Whole] is selected, it rebuilds maximum capacity of array. The [Rebuild Range] menu is not displayed when the rebuild limit is not set or the rebuild limit is the same as the maximum capacity of array. Normally designation of [Effective] is adequate. 4.
Appendix J Maintenance of TOSHIBA RAID Appendices 8. When completing the rebuild, press “OK” to return to the main menu of Independent Setup Utility. Resume Rebuild During being suspended,[Resume Rebuild] is displayed in [Main Menu]. To start rebuilding suspended, follow the procedure below. 1. Put the cursor to the [Resume Rebuild] in the main menu of Indent Utility and press Enter key. 2. When [Rebuild Range] menu is displayed, the range to be rebuilt is designated.
Appendices Appendix J Maintenance of TOSHIBA RAID 6. When completing the rebuild, press “OK” to return to the main menu of Independent Setup Utility. 7. When “Rebuild Limit” is set and [Rebuild Range] is set to [Whole], only [Finish] is can be selected after exceeding the Rebuild Limit. When [Finish] is selected and “OK” is selected in [Confirmation], the rebuilding is completed at the time. When OS is booted after exceeding the Rebuild Limit, the rebuild is completed.
Appendix J Maintenance of TOSHIBA RAID Appendices Check Media This option can check if there is an error in the HDD of array. The Check Media can be done only in RAID-1. To execute Check Media, follow the procedure below. 1. Put the cursor to the [Check Media] in [Main Menu] and press Enter key. 2. When [Check Range] is displayed, designate the range to be checked. When [Effective] is limited, it makes the rebuild limit effective and execute [Check Media] up to the rebuild limit.
Appendices Appendix J Maintenance of TOSHIBA RAID Modify Array This option changes the setting of array. Change Parameter Select [Change Parameter] in [Modify Array] menu. The following items can be set. Table J-6 Item of array Option J-20 Explanation Write Cache Displays the setting of drive write cache. “Enable (use)” or “Disable (not use)” is displayed. The default is “Enable (use)”. Degrade Bootup Displays if boot OS or not when the array is degraded.
Appendix J Maintenance of TOSHIBA RAID Appendices Change RAID Level To change RAID level, select [Modify Array] menu. When changing RAID-1 (Mirroring) to RAID-0 (Striping), refer “Changing RAID-1 to RAID-0”. When changing RAID-0 to RAID-1, refer “Changing RAID-0 to RAID-1”. Changing RAID-1 to RAID-0 working by one drive When changing RAID-1 array working by two drives to RAID-0 working by one drive, follow the procedure below. 1. Select [Modify Array] in [Main Menu]. 2.
Appendices Appendix J Maintenance of TOSHIBA RAID Delete Array Selects [Delete Array] of Setup Utility and delete array. Put the cursor on the array you want to delete and press Enter key. When [Confirmation] is displayed, select “OK” to store the setting.
Appendix J Maintenance of TOSHIBA RAID Appendices Physical Drive Select [Physical Drive] in Setup Utility to set physical drive. View Drive Info. Select this option in [Physical Drive] to display information of physical drive. Select the drive that you want to display in [Physical Drive] at the lower of display and press [Enter] key. In the server with fault lamp (lamp displaying disk condition), the fault lamp of corresponded drive blinks while [Drive Information] display appears.
Appendices Appendix J Maintenance of TOSHIBA RAID View Drive Log Select this option in [Physical Drive] menu and select the drive that you want to display the log. At the beginning, the latest log is displayed. The 7,168 logs from the latest are recorded in detail. For the older log, only ID is recorded. The options and functions of key in [View Drive Log] are as follows.
Appendix J Maintenance of TOSHIBA RAID Appendices Execute the following procedures to see the drive log in the Independent Utility. 1. Put on the cursor on [Physical Drive] in [Main Menu] and press Enter key. 2. Put on the cursor on [View Drive Log] and press Enter key. 3. Select drive that you want to display the log in [Physical Drive] at the lower of display with a cursor key and press Enter key. 4. The drive log is displayed. Press PageUp or PageDown key to scroll the drive log upward or downward. 5.
Appendices Appendix J Maintenance of TOSHIBA RAID The following is displayed. Table J-9 Content of Drive Log display No. J-26 Option Explanation 1 Port Displays the port number of log displayed. 2 Own/Redundant Displays if the displayed log is a log of own port (Own) or a copy of other port log (Redundant). 3 Time Displays the time when the log is recorded in six digits. The format is [Year Month Day Hour Minute Second]. 4 ID Displays identification ID of log.
Appendix J Maintenance of TOSHIBA RAID Appendices [View Drive Log] menu is as follows Table J-10 Content of View Drive Log menu Option Explanation Change Port Changes the display of the own log and redundant log. At the beginning, the Port-0’s own log and the redundant log are displayed. Go to Event When this option selected, it moves to the log with designated number. The key function in [View Drive Log] key is as follows.
Appendices Appendix J Maintenance of TOSHIBA RAID Exit When this option is selected, the utility is finished. When [Confirmation] is displayed, select “OK”.
