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[CONFIDENTIAL]

Toshiba Personal Computer

TECRA M11/Satellite Pro S500M Series

Maintenance Manual

First edition April 2010

TOSHIBA CORPORATION

File Number 960-813

Summary of content (477 pages)

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Toshiba Personal Computer TECRA M11/Satellite Pro S500M Series Maintenance Manual First edition April 2010 TOSHIBA CORPORATION File Number 960-813 [CONFIDENTIAL]
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Copyright © 2010 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein. Toshiba Personal Computer TECRA M11/Satellite Pro S500M Series Maintenance Manual First edition April 2010 Disclaimer The information presented in this manual has been reviewed and validated for accuracy.
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Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer TECRA M11/Satellite Pro S500M Series The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field. SAFETY PRECAUTIONS Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.
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The manual is divided into the following parts: Chapter 1 Hardware Overview describes the Qosmio F60 Series system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
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Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
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Table of Contents Chapter 1 Hardware Overview 1.1 Features ...................................................................................................................... 1-5 1.2 System Unit Block Diagram .................................................................................... 1-12 1.3 3.5-inch Floppy Disk Drive (USB External) ........................................................... 1-20 1.4 2.5-inch Hard Disk Drive..............................................................
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Chapter 2 Troubleshooting Procedures 2.1 Troubleshooting ......................................................................................................... 2-6 2.2 Troubleshooting Flowchart........................................................................................ 2-8 2.3 Power Supply Troubleshooting................................................................................ 2-13 2.4 System Board Troubleshooting................................................................
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Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test ................................................................................................... 3-7 3.2 Executing the Diagnostic Test ................................................................................. 3-10 3.3 Setting of the hardware configuration ..................................................................... 3-15 3.4 Heatrun Test.........................................................................................
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3.33 . Starting TOSHIBA Test & Diagnostic .................................................................. 3-96 3.34 . Windows PE T&D ................................................................................................. 3-98 3.35 DOS T&D .............................................................................................................. 3-144 3.36 Maintenance (WinPE&FreeDos) Test Program Supplementary Information ....... 3-172 3.
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Appendices Appendix A Handling the LCD Module ........................................................................... A-1 Appendix B Board Layout ................................................................................................ B-1 Appendix C Pin Assignments............................................................................................ C-1 Appendix D Keyboard Scan/Character Codes ..................................................................
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1 Hardware Overview Chapter 1 Hardware Overview TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 1-1
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1 Hardware Overview 1-2 TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL]
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1 Hardware Overview Chapter 1 Contents Chapter 1 Hardware Overview......................................................................................... 1 1.1 Features ......................................................................................................................... 5 1.2 System Unit Block Diagram ....................................................................................... 12 1.3 3.5-inch Floppy Disk Drive (USB External) ..........................................
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1 Hardware Overview Figures Figure 1-1 Front of the computer........................................................................................... 10 Figure 1-2 System unit configurations................................................................................... 11 Figure 1-3 System unit block diagram (case of 10, 10c model） ......................................... 12 Figure 1-4 System unit block diagram (case of 10GC model) .............................................. 13 Figure 1-5 3.
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1 Hardware Overview 1.1 Features The Toshiba TECRA M11/Satellite Pro S500M Series Personal Computer uses extensive Large Scale Integration (LSI), and Complementary Metal-Oxide Semiconductor (CMOS) technology extensively to provide compact size, minimum weight, low power usage and high reliability. This computer incorporates the following features. There some models and options. Refer to the Parts List for the configuration of each model and options.
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1 Hardware Overview  Chipset Toshiba TECRA M11/Satellite Pro S500M Series computer is Equipped with Intel Ibex peak-M QM57 or HM55.  VGA Controller The PC comes in with one of the following two types:  The internal graphics controller in Intel Processor (Core i*) is used..  nVIDIA NVS 2100M is used.  HDD The computer has a 2.5-inch SATA HDD. The following capacities are available.  160/250/320/500 GB  USB FDD A 3.5-inch USB FDD accommodates 2HD (1.44MB) or 2DD (720KB) disks.
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1 Hardware Overview  TOSHIBA Dual Pointing Device The TOSHIBA Dual Pointing Device consists of Touch Pad and AccuPoint. The touch pad and control buttons enable control of the on-screen pointer and scrolling of windows. The pointer control stick and AccuPoint enables convenient control of the cursor.  Batteries The computer has two batteries: a rechargeable Lithium-Ion main battery pack and RTC battery (that backs up the Real Time Clock and CMOS memory.  Universal Serial Bus (USB2.
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1 Hardware Overview  SmartCard Slot This slot can accommodate a single Smart Card device. Some models are equipped with a Smart Card slot.  Fingerprint sensor(Some models) The computer is equipped with a fingerprint sensor and fingerprint authentication utility. They enable only person who has registered his/her fingerprint to use the computer.  Docking interface port The docking interface port enables connection of an optional Express Port Replicator.
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1 Hardware Overview  Internal LAN The computer has built-in support for Ethernet LAN (10 megabits per second, 10BASET), Fast Ethernet LAN (100 megabits per second, 100BASE-TX) and Gigabit Ethernet LAN (1000 megabits per second, 1000BASE-T).  Wireless LAN Some computers in this series are equipped with a Wireless LAN module that is compatible with other LAN systems based on Direct Sequence Spread Spectrum/Orthogonal Frequency Division Multiplexing radio technology that complies with the IEEE 802.
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1 Hardware Overview Figure 1-1 Front of the computer 1-10 TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL]
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1 Hardware Overview The system unit configuration is shown in figure 1-2 Figure 1-2 System unit configurations TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 1-11
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1 Hardware Overview 1.2 System Unit Block Diagram Figure 1-4 and 1-5 is a block diagram of the system unit.
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1 Hardware Overview Figure 1-4 System unit block diagram (case of 10GC model) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 1-13
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1 Hardware Overview The system unit is composed of the following major components:  Microprocessor The Toshiba TECRA M11/Satellite Pro S500M Series computer is equipped with an Intel® Processor. The PC comes in with one of the following speeds: Intel® Arrandale Processor (Arrandale) Core Frequency (GHz) System Bus Frequency (MHz) L2 Cache Size (Mbytes) 2.66GHz Core i7-620M 1066 4 2.4GHz Core i5-520M 1066 3 2.26GHz Core i5-430M 1066 3 2.
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1 Hardware Overview  Chipset Toshiba TECRA M11/Satellite Pro S500M Series computer is Equipped with Intel Ibex peak-M QM57 or HM55. Intel PCH (Processor Control HUB) North Bridge:Intel MontaraGM+  Banias Processor System Bus support  DRAM control : DDR333/DDR266 support and 2GBmax  Hub Link interface  593-ball 37.5x37.5 mm FC-BGA package  South Bridge:Intel ICH4-M  Hub Link interface  PCI Rev2.
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1 Hardware Overview  CardBus / PC card controller (Yenta2 Ver.2.2)  SD card controller (SDHC Ver.1.2)  A SD IO card controller (Ver.1.0)  SmartMedia Controller (SMHC Ver.01/SMIL1.0) (it is not used in Spa)  SIO (UART) controller (MS Debug Port Specification ver.1.
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1 Hardware Overview  Modem Controller  One MDC is used.  Product made from Askey MDC1.5 (Azalia)  This controller has the following functions: One RJ11 port V.92 (V.90) 56K Modem/FAX Ring Wakeup support  Wireless LAN  One PCI Express Mini Card slot1 802.11 a/b/g/n Intel 802.11(a/b/g/n)13ch-PP 2x2 MOW-HMC Atheros 802.11 a/b/g/n Atheros 802.11(a/b/g/n) 13ch-HB92 MOW-HMC Atheros 802.11 b/g/n Atheros 802.
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1 Hardware Overview  Bridge Media Controller slot  Card slotｘ１  SD, mini SD (w/ adapter),Micro SD (w/adapter),xD, MMC,Memory Stick,Memory Stick Pro,Memory Stick Duo (w/ adapter),  Memory Stick Pro Duo (w/ adapter),Memory Stick Micro (w/ adapter)  SD Token KEY, SD boot correspondence  SD IO is No-supporting.
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1 Hardware Overview  Other chips  Clock generator： ICS9LVRS394CKLFT (Made by Integrated Device Technology)  EC/KBC： MEC1609-PZP(REVISION.D) (Made by standard micro system)  GPIO Expander： ECE1088-DZK (Made by standard micro system)  PSC: TMP86FS49BUG (made by Toshiba)  TPM: SLB9635 TT 1.
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1 Hardware Overview 1.3 3.5-inch Floppy Disk Drive (USB External) The 3.5-inch FDD is a thin, high-performance reliable drive that supports 720KB (formatted) 2DD and 1.44MB (formatted) 2HD disks. The FDD is shown in figure 1-4. The specifications for the FDD are listed in Table 1-1. Figure 1-5 3.5-inch FDD (USB External) Table 1-1 3.5-inch FDD specifications Items Data transfer rate FDD part USB Disk rotation speed Track density 1-20 TEAC FD-05PUB-337 (G8AC0000B320) 720KB mode 1.
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1 Hardware Overview 1.4 2.5-inch Hard Disk Drive The removable HDD is a random access non-volatile storage device. It has a non-removable 2.5-inch magnetic disk and mini-Winchester type magnetic heads. The computer supports a 160GB, 250GB or 320GB. The HDD is shown in figure 1-5. Specifications are listed in Table 1-2. Figure 1-6 2.5-inch HDD Table 1-2 2.
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1 Hardware Overview Table 1-3 2.5-inch HDD specifications Specifications Items Outline Dimensio ns TSDC G8BC0006T161 TSDC G8BC0006T251 TSDC G8BC0006T321 Width (mm) Height (mm) 100.0 Depth (mm) Weight (g) 69.85 Storage size (formatted) TSDC G8BC0006T501 9.
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1 Hardware Overview 1.5 Optical Drive (ODD) 1.5.1 DVD-ROM Drive The DVD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) DVD-ROM. The specifications of the DVD-ROM are described in Table 1-3. Table 1-4 DVD-ROM drive specifications Item Specifications TEAC DV-28S-WTA4 (G8CC0004QZ20) Outline dimensions Width (mm) 128 (excluding projections) Height (mm) 12.7(excluding projections) Depth (mm) 129.
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1 Hardware Overview 1.5.2 DVD-Super Multi Drive The DVD Super Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CDROM, DVD-ROM, CD-R, CD-RW, DVD-R, DVD+R, DVD-RW, DVD+RW, DVD-RAM, DVD-R DL and DVD+R DL. The specifications are listed in Table 1-5.
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1 Hardware Overview Table 1-5 DVD Super Multi drive outline dimensions 項目 Outline dimensions 仕様 TEAC Panasonic HLDS DV-W28S-VTA G8CC0004LZ20 UJ890ADTJ6-A G8CC0004MZ20 GT20N-ATAK7N1 G8CC0004RZ20 Width (mm) 128 (excluding projections) Height (mm) 12.
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1 Hardware Overview 1.6 Keyboard The keyboard is mounted 85(US)/87(UK) keys that consist of character key and control key, and in conformity with JIS. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-7 is a view of the keyboard. See Appendix E about a layout of the keyboard.
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1 Hardware Overview 1.7 TFT Color Display The TFT color display consists of 14.0-inch HD /HD+ LCD module. 1.7.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 16M colors with 1,366 x 768 or 1,600 x 900 resolutions. Figure 1-8 shows a view of the LCD module and Table 1-6 lists the specifications.
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1 Hardware Overview Table 1-6 LCD module specifications Specifications 15.6”HD(1366x768) Non-CSV Item Samsung LTN140AT07601G33C0005Y110 LG LP140WH1TLB1G33C0005Z110 Number of Dots 1,366 (W) x 768 (H) Dot spacing (mm) 0.252(H)x0.252(V) Display range (mm) 359.3(H)x209.5(V)x5.5(D:Max) Specifications 15.6”HD+(1600x900) Non-CSV Item Number of Dots Dot spacing (mm) Display range (mm) 1-28 LG LP140WD1-TLD2 G33C00061110 1,600 (W) x 900 (H) 0.2151(H)×0.2151(V) 359.3(W) × 209.5(H) × 5.
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1 Hardware Overview 1.8 Power Supply The power supply supplies many different voltages to the system board and performs the following functions: 1. Judges that the DC power supply (AC adapter) is connected to the computer. 2. Detects DC output and circuit malfunctions. 3. Controls the battery icon, and DC IN icon. 4. Turns the battery charging system on and off and detects a fully charged battery. 5. Turns the power supply on and off. 6. Provides more accurate detection of a low battery. 7.
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1 Hardware Overview Table 1-7 Power supply output rating Powe r line name P ACPI state M state S3 S3 S3 S4/S5 S4/S5 S4/S5 M3 Moff Moff M3 Moff Moff Wakeup - WOL No WOL - WOL No WOL G3 Voltag e [V] Name * PPV × × × × × × × Processor * IGD-PGV × × × × × × × 0.75 0R75P1V PGV × × × × × × × Processor (Int-GFX only) Memory × × × × × × × GPU PTV × × × × × × × Processor PCH × × × × × × × PCH 1.
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1 Hardware Overview R 3 R3V ○ ○ ○ ○ TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) ○ ○ [CONFIDENTIAL] ○ RTC 1-31
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1 Hardware Overview 1.9 Batteries The computer has three types of batteries as follows:  Main battery pack  RTC battery The battery specifications are listed in Table 1-9. Table 1-8 Battery specifications Battery name Material Output voltage G71C000AG310 battery Main battery G71C000AG110 Capacity 48Wh, 6 cell Lithium-Ion 10.8 V 55Wh, 6 cell G71C000AH310 G71C000AH110 RTC battery 1.9.1 GDM710000041 NiMH 2.
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1 Hardware Overview 1.9.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The microprocessor controls whether the charge is on or off and detects a full charge when the AC adaptor and battery are attached to the computer. The system charges the battery. Battery Charge When the AC adaptor is attached, there are two types of charge: When the system is powered off and when the system is powered on. Table 1-10 lists the charging time required for charges.
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1 Hardware Overview  Data preservation time When turning off the power in being charged fully, the preservation time is as following Table 1-11. Table 1-10 Data preservation time Condition Standby About 3 days Battery(48Wh, 6 cell) Shutdown About 35 days Battery(48Wh, 6 cell) Standby About 3 days 55Wh, 6 cell) Shutdown 1.9.
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1 Hardware Overview 1.10 AC Adapter The AC adapter is also used to charge the battery. Table 1-13 lists the AC adapter specifications. Table 1-12 AC adapter specifications Parameter Specification G71C000A5210 (2-pin) Power Input voltage Input frequency Input current 75W (Peak 90W) 100V/240V 50Hz to 60Hz 1.
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Troubleshooting Procedures Chapter 2 Troubleshooting Procedures TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 2-1
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Troubleshooting Procedures 2 2-2 [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Troubleshooting Procedures Chapter 2 2 Contents 2-2 2.1 Troubleshooting ......................................................................................................2-6 2.2 Troubleshooting Flowchart.....................................................................................2-8 2.3 Power Supply Troubleshooting.............................................................................2-13 2.4 2.5 2.6 2.7 2.8 2.3.1 Procedure 1 Power Status Check .............................
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Troubleshooting Procedures 2.9 Display Troubleshooting.......................................................................................2-42 2.10 Optical Disk Drive Troubleshooting.....................................................................2-44 2.11 2.12 2.13 2.10.1 Procedure 1 Diagnostic Test Program Execution Check....................2-44 2.10.2 Procedure 2 Connector Check and Replacement Check.....................2-44 Modem Troubleshooting.........................................
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Troubleshooting Procedures Figures Figure 2-1 Troubleshooting flowchart (1/2)..........................................................................2-9 Tables Table 2-1 Battery icon .........................................................................................................2-13 Table 2-2 DC IN icon ..........................................................................................................2-14 Table 2-3 Error code...............................................................
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Troubleshooting Procedures 2.1 Troubleshooting Chapter 2 describes how to determine which Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. (The “FRU” means the replaceable unit in the field.) The FRUs covered are: 1. Power supply 2. System Board 3. USB FDD 4. 2.5” HDD 5. Keyboard 6. Touch pad 7. Display 8. 9. 10. 11. 12. 13. 14. Optical Disk Drive Modem LAN Wireless LAN Bluetooth Sound Bridge Media slot 15. PCI ExpressCard slot 16. Fingerprint Sensor 17.
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Troubleshooting Procedures There are following two types of connections in the figure of board and module connection in and after 2.3 Power Supply Troubleshooting. (1) Cable connection is described in the figure as line. (2) Pin connection is described in the figure as arrow.
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Troubleshooting Procedures 2.2 Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which troubleshooting procedures to execute. Before going through the flowchart steps, verify the following:  Ask him or her to enter the password if a password is registered.  Verify with the customer that Toshiba Windows is installed on the hard disk. NonWindows operating systems can cause the computer to malfunction.  Make sure all optional equipment is removed from the computer.
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Troubleshooting Procedures Figure 2-1 Troubleshooting flowchart (1/2) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 2-9
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Troubleshooting Procedures Figure 2-1 Troubleshooting flowchart (2/2) 2-10 [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Troubleshooting Procedures If the diagnostics program cannot detect an error, the problem may be intermittent. The Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error(s), then perform the appropriate troubleshooting procedures as follows: 1.
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Troubleshooting Procedures 15. If a malfunction is detected on the fingerprint sensor, perform the Fingerprint Sensor Troubleshooting Procedures in Section 2.18. 16. If a malfunction is detected on the Web camera, perform the Web camera Troubleshooting Procedures in Section 2.19.
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Troubleshooting Procedures 2.3 Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed. The procedures described in this section are: Procedure 1: Power Status Check Procedure 2: Error Code Check Procedure 3: Connection Check Procedure 4: Charging Check Procedure 5: Replacement Check 2.3.
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Troubleshooting Procedures Table 2-2 DC IN icon DC IN icon Power supply status Lights blue DC power is being supplied from the AC adapter. Blinks orange Power supply malfunction*1 Doesn’t light Any condition other than those above. *1 When the power supply controller detects a malfunction, the DC IN icon blinks orange. It shows an error code. When the icon is blinking, perform the following procedure. 1. Remove the battery pack and the AC adapter. 2.
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Troubleshooting Procedures 2.3.2 Procedure 2 Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below.  Start Off for 2 seconds  Error code (8 bit) “1” On for one second “0” On for half second Interval between data bits Off for half second The error code begins with the least significant digit. Example: Error code 11h (Error codes are given in hexadecimal format.
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Troubleshooting Procedures Check 1 Convert the DC IN icon blink pattern into the hexadecimal error code and compare it to the tables below. Then go to Check 2.
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Troubleshooting Procedures  Main Battery Error code Meaning 22h Main battery discharge current is over 0.5A. 23h Main battery charge current is over 4.3A. 24h The compensation value of [0A] is not within the limits from design data (± 400mA). 25h Main battery charge current is over 0.3A when the charging is off. 26h Unusual voltage occurred during Main battery charge.  2nd Battery Error code Meaning 32h Second battery discharge current is over 0.5A.
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Troubleshooting Procedures  E3V output Error code Meaning 60h E3V voltage is over 3.96V. 61h E3V voltage is under 2.81V when the computer is powered on. 62h E3V voltage is under 2.81V when the computer is booting up. 64h E3V voltage is under 2.81V when EV power is maintained.  IGD-PGV output Error code Meaning 70h IGD-PGV voltage is over 1.80V. 71h IGD-PGV voltage is under 0V when the computer is powered on. 72h IGD-PGV voltage is under 0V when the computer is booting up.
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Troubleshooting Procedures  1R05-E1V output Error code Meaning A0h 1R05-E1V voltage is over 1.26V. A1h 1R05-E1V voltage is under 0.89V when the computer is powered on. A2h 1R05-E1V voltage is under 0.89V when the computer is booting up. A4h 1R05-E1V voltage is under 1.26V when EV power is maintained.  IGD-PGV output Error code Meaning B0h PTV voltage is over 1.80V. B1h PTV voltage is under 0V when the computer is powered on. B2h PTV voltage is under 0V when the computer is booting up.
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Troubleshooting Procedures Check 2 In the case of error code 10h or 12h:  Make sure the AC adapter and AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet. If the cables are connected firmly, go to the following step.  Connect a new AC adapter and AC power cord. If the problem still occurs, go to Procedure 5. Check 3 In the case of error code 21h:  Go to Procedure 3. Check 4 For any other errors, go to Procedure 5. 2.3.
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Troubleshooting Procedures 2.3.4 Procedure 4 Charging Check Check if the power supply controller charges the battery pack properly. Perform the following procedures: Check 1 Make sure the AC adapter is firmly plugged into the DC IN jack. Check 2 Make sure the battery pack is properly installed. If it is properly installed, go to Check 3. Check 3 The battery pack may be completely discharged. Wait a few minutes to charge the battery pack while connecting the battery pack and the AC adapter.
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Troubleshooting Procedures 2.4 System Board Troubleshooting This section describes how to determine if the system board is malfunctioning or not. Start with Procedure 1 and continue with the other procedures as instructed.
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Troubleshooting Procedures 2.4.1 Procedure 1 Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it.  If an error message is shown on the display, perform Check 1.  If there is no error message, go to Procedure 2.  If MS-DOS or Windows OS is properly loaded, go to Procedure 4.
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Troubleshooting Procedures If any other error message displays, perform Check 3. Check 3 The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (23) or (24) is displayed, go to Procedure 4. If error message (18) is displayed, go to the Keyboard Troubleshooting Procedures. If error message (19), (20) or (21) is displayed, go to the HDD Troubleshooting Procedures.
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Troubleshooting Procedures 2.4.2 Procedure 2 Debugging Port Check Check the D port status by a debug port test. The tool for debug port test is shown below. Figure 2-1 A set of tool for debug port test 1. Not a Serial Port model should connect a debug port test cable to connector CN3110 of a system board. 2. Connect the RS-232C Cross-cable to the PC that displays the test results. 4. Boot the computer in MS-DOS mode. 5. Execute GETDPORT.COM in the text menu in CPU REAL mode.
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Troubleshooting Procedures Table 2-4 Debug port error status (1/2) pending System BIOS Boot block processing Debug Code BIOS processing outline CPU setup Initialization of PCH ,Super I/O F000 F001 F002 F003 F004 F005 F006 F007 F008 F009 F00A F00B F00C Boot Block processing start Target Device IC No.
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Troubleshooting Procedures Table 2-4 Debug port error status (2/2) System BIOS IRT processing Debug Code F100 BIOS processing outline IRT section start Target Device CPU F101 Creation of SETUP information BIOSROM RAM F102 F103 PCI Express initialization PCH Express initialization PCH PCH F104 SMRAM Express initialization PCH RAM F105 End of SMRAM initialization PCH RAM EC Evart initialization USB Legacy initialization Device Lock main processing start Device Lock device processing start End
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Troubleshooting Procedures F116 S3 shift start RAM F117 S4 shift start RAM F118 S5 shift start RAM USB electric supply setting start Completion of a USB electric supply setting PCH EC PCH EC F11B Shutdown processing RAM F11C Completion of Shutdown processing RAM F11D S3 return service start BIOSROM RAM F1FF End of S3 return processing. Shifts to OS. RAM F119 F11A CN1400, CN1410 (RAM Conn.) CN1400, CN1410 (RAM Conn.) CN1400, CN1410 (RAM Conn.
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Troubleshooting Procedures 2.4.3 Procedure 3 Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test 6. Printer test [It is not supported] 7. Async test 8. Hard Disk test 9. Real Timer test 10. NDP test 11. Expansion test 12. CD-ROM/DVD-ROM test 13.
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Troubleshooting Procedures 2.5 USB FDD Troubleshooting To check if the USB FDD is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: FDD Head Cleaning Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector Check and Replacement Check 2.5.1 Procedure 1 FDD Head Cleaning Check FDD head cleaning is one option available in the Diagnostic Program. After connecting USB FDD, insert the Diagnostics Disk in the floppy disk drive.
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Troubleshooting Procedures 2.5.2 Procedure 2 Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled. Floppy disk drive test error codes and their status names are listed in Table 2-7.
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Troubleshooting Procedures 2.5.3 Procedure 3 Connector Check and Replacement Check USB FDD is connected to USB port on system board or USB/Sound board. The connection of the cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks. USB FDD can be connected to the following 3 ports. (System board x 1 ports, USB/RGB board x 1 port and USB board x 1 port (or Modem/USB board).
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Troubleshooting Procedures NOTE: When checking the connection, be sure to check it with care for the followings. 1. Cable can not be disconnected from the connector. 2. Cable is connected straight to the connector. 3. Cable is connected all the way seated in the connector. 4. Cable or connector can not be broken. Check 2 Connect USB FDD to other USB port and check if it works properly. If it does not work properly, perform Check 3 Check 3 USB FDD may be faulty. Replace it with a new one.
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Troubleshooting Procedures 2.6 2.5” HDD Troubleshooting To check if the 2.5” HDD is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Partition Check Procedure 2: Message Check Procedure 3: Format Check Procedure 4: Diagnostic Test Program Execution Check Procedure 5: Connector Check and Replacement Check CAUTION: The contents of the hard disk will be erased when the 2.5”HDD troubleshooting procedures are executed.
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Troubleshooting Procedures 2.6.2 Procedure 2 Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen. Make sure no floppy disk is in the FDD. Turn on the computer and check the message on the screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with Check 1 below and perform the other checks as instructed.
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Troubleshooting Procedures 2.6.3 Procedure 3 Format Check The computer’s HDD is formatted using the DOS FORMAT program or the physical format program of the test program. To format the HDD, start with Check 1 below and perform the other steps as required. Refer to the DOS Manual for the operation of DOS. For the format by the test program, refer to the Chapter 3. Check 1 Format the 2.5” HDD using DOS FORMAT command. Type as FORMAT C: /S/U. If the 2.5” HDD can not be formatted, perform Check 2.
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Troubleshooting Procedures 2.6.4 Procedure 4 Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. The error codes and statuses are described in Table 2-8.
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Troubleshooting Procedures 2.6.5 Procedure 5 Connector Check and Replacement Check The SATA HDD may be disconnected, or the SATA HDD or system board may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: Check 1 Make sure the SATA HDD is firmly connected to CN1900 on the system board. If any of the connections are loose, reconnect firmly and repeat Procedure 1. If there is still an error, go to Check 2.
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Troubleshooting Procedures 2.7 Keyboard Troubleshooting To check if the computer’s keyboard is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check 2.7.1 Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test (DIAGNOSTIC TEST) and Pressed key display test (ONLY ONE TEST) in the Diagnostic Program.
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Troubleshooting Procedures 2.8 Touch pad or Dual point Troubleshooting To check if the computer’s touch pad is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check 2.8.1 Procedure 1 Diagnostic Test Program Execution Check Execute the Touch pad test (ONLY ONE TEST) in the Diagnostic Program.
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Troubleshooting Procedures 2.8.2 Procedure 2 Connector Check and Replacement Check The connection of the cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the cables are firmly connected to the button board and system board. If the connection is loose, reconnect firmly and repeat Procedure 1. If the problem still occurs, go to Check 2.
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Troubleshooting Procedures 2.9 Display Troubleshooting This section describes how to determine if the computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Cable Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check The Display Test program is stored on the computer’s Diagnostics disk.
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Troubleshooting Procedures Procedure 3 Replacement Check The LCD module and system board are connected to display circuits. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures. Check 1 Replace the LCD cable with a new one following the instructions in Chapter 4, Replacement Procedures and test the display again. If the problem still exists, perform Check 2.
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Troubleshooting Procedures 2.10 Optical Disk Drive Troubleshooting To check if optical disk drive is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check 2.10.1 Procedure 1 Diagnostic Test Program Execution Check Execute the CD-ROM/DVD-ROM Test in the Diagnostic Program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
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Troubleshooting Procedures Check 2 The SATA ODD may be damaged. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still exists, perform Check 3. Check 3 System board may be faulty. Replace it with new one following the instructions in Chapter 4, Replacement Procedure.
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Troubleshooting Procedures 2.11 Modem Troubleshooting To check if modem is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check 2.11.1 Procedure 1 Diagnostic Test Program Execution Check Execute Modem test in the LAN/Modem/Bluetooth/IEEE1394 test program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
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Troubleshooting Procedures Check 2 Modem cable may be faulty. Replace it with a new one. If the problem still occurs, perform Check 3. Check 3 MDC may be faulty. Replace it with a new one following the steps in Chapter 4, Replacement Procedure. If the problem still occurs, perform Check 3 Check 4 Modem/USB board or the cable may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 5.
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Troubleshooting Procedures 2.12 LAN Troubleshooting To check if the computer’s LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check 2.12.1 Procedure 1 Diagnostic Test Program Execution Check Execute LAN test in the LAN/Modem/Bluettoth/IEEE1394 test program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
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Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting To check if the computer’s Wireless LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting-Receiving Check Procedure 2: Antennas’ Connection Check Procedure 3: Replacement Check 2.13.1 Procedure 1 Transmitting-Receiving Check Before starting the test, make sure the wireless communication switch is set in the ON position.
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Troubleshooting Procedures 2.13.2 Procedure 2 Antennas' Connection Check The wireless LAN function-wiring diagram is shown below: Any of the connections may be defective. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless communication switch is “On”. If the switch is “Off”, turn it “On”. If the problem still occurs, perform Check 2.
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Troubleshooting Procedures 2.13.3 Procedure 3 Replacement Check Wireless LAN card, wireless LAN antenna or system board may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 Wireless LAN antenna may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 2. Check 2 Wireless LAN card may be faulty.
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Troubleshooting Procedures 2.14 Bluetooth Troubleshooting To check if the Bluetooth is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connection Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Make sure the wireless switch on the left side of the computer is turned “On”. If it is not, slide the switch toward the back of the computer to turn it on.
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Troubleshooting Procedures Check 2 The Bluetooth module may be damaged. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures and check the operation. If the problem still exists, perform Check 3. Check 3 The Bluetooth cable may be damaged. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still exists, perform Check 4. Check 4 The system board may be damaged.
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Troubleshooting Procedures 2.15 Sound Troubleshooting To check if the sound function is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check Procedure 3: Replacement Check 2.15.1 Procedure 1 Diagnostic Test Program Execution Check Execute the Sound test in Sound Test program disk. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
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Troubleshooting Procedures 2.15.3 Procedure 3 Replacement Check  If headphone does not work properly, perform check 1.  If external microphone does not work properly, perform check 2.  If internal microphone does not work properly, perform check 3.  If Speaker Right does not work properly, perform check 4.  If Speaker Left does not work properly, perform check 5. Check 1 Headphone may be faulty. Replace it with a new one following the steps in Chapter 4, Replacement Procedures.
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Troubleshooting Procedures 2.16 Bridge media Slot Troubleshooting This section describes how to determine if the computer's Bridge media functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Check on Windows OS Procedure 2: Connector Check and Replacement Check 2.16.
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Troubleshooting Procedures 2.17 PCI ExpressCard Slot Troubleshooting This section describes how to check PCI ExpressCard slot by inspecting a card with PCI Express interface and a card with USB 2.0 interface. 1. Gigabit Ether ExpressCard 2. USB2.0 5in1 ExpressCard 1. Gigabit Ether ExpressCard (1) Insert the Gigabit Ether ExpressCard into the ExpressCard slot. (2) On Windows, open System Property → Hardware → Device Manager window.
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Troubleshooting Procedures 2.18 Fingerprint sensor Troubleshooting CAUTION: To delete the account for confirming the fingerprint operation, it is necessary to log on by the account with the management authority. If the password has been set to log on, ask the Log-ON password to the user. To check if the Fingerprint sensor works correctly or not, follow the troubleshooting procedures below as instructed. When failed in Procedure 1 to Procedure 3, execute Procedure 4.
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Troubleshooting Procedures Procedure 1 Setting Windows Log-ON password 1. Open [User Account] from [Control Panel]. 2. Click [User Account]. 3. Click the icon of the account (user’s name) that you want to set the password. 4. Click “Create Account”. 5. Type a password in “Type a new password”. 6. Press Tab key. 7. Type the password again. 8. Click “Create Password” button. 9. When “Do you want to make your files and folders private” appears in [Computer administrator], click [Yes, Make Private].
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Troubleshooting Procedures 7. When the Store to Sensor screen is displayed, check Store fingerprint to Sensor. Click Finish to complete fingerprint registration. Procedure 3 Authentication of fingerprint 1. Turn on the computer to start up Windows. 2. In the Windows logon window, put lightly the first joint of your finger registered and slide your finger sideways. When authenticated, [Success] is displayed in the fingerprint authentication display. When not authenticated well, warning message appears.
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Troubleshooting Procedures Procedure 4 Connector Check and Replacement Check The connection of the cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the cables are firmly connected to the Finger/pad board and system board. If the connection is loose, reconnect firmly and repeat Procedure 1. If the problem still occurs, go to Check 2.
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Troubleshooting Procedures 2.19 Web camera Troubleshooting To check if the computer’s web camera is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Check on Windows OS Procedure 2: Connector Check and Replacement Check 2.19.1 Procedure 1 Check on Windows OS Use the software, Camera Assistant Software, which is originally prepared in the computer to check if the web camera can record/replay still images and moving images (including sound) without problems.
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Troubleshooting Procedures Check 2 If web camera does not work properly(the image from a web camera cannot be displayed. ), web camera may be faulty. Replace it with a new one following the steps in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 3 Check 3 System board may be faulty. Replace it with a new one following the step in Chapter 4 Replacement Procedures.
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Troubleshooting Procedures 2-64 [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Tests and Diagnostics Chapter 3 Tests and Diagnostics TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 3-1
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Tests and Diagnostics 3 3-2 [CONFIDENTIAL]) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Tests and Diagnostics Chapter 3 Contents 3 3-2 3.1 The Diagnostic Test ................................................................................................... 3-7 3.2 3.1.1 Diagnostics menu ................................................................................. 3-7 3.1.2 H/W (Hardware) initial information setting tool.................................. 3-8 3.1.3 Heatrun test program............................................................................
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Tests and Diagnostics 3.21.2 3.22 3.23 3.24 3.25 Operations .......................................................................................... 3-57 Log Utilities ............................................................................................................. 3-58 3.22.1 Function Description .......................................................................... 3-58 3.22.2 Operations ..........................................................................................
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Tests and Diagnostics 3.35 3.36 3.34.2 Starting T&D...................................................................................... 3-99 3.34.3 System Information Menu................................................................ 3-100 3.34.4 Test Menu......................................................................................... 3-104 3.34.5 System Utility Menu ........................................................................ 3-111 3.34.6 Details of Each Test Function .
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Tests and Diagnostics Tables Table 3-1 Subtest names (1/2) ............................................................................................ 3-18 Table 3-2 Error codes and error status names (1/3)............................................................ 3-41 Table 3-3 Hard disk controller status register contents ...................................................... 3-44 Table 3-4 HDC Error register contents...............................................................................
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Tests and Diagnostics 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
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Tests and Diagnostics      REAL TIMER TEST NDP TEST EXPANSION TEST CD-ROM/DVD-ROM TEST ERROR RETRY COUNT SET [FDD & HDD] Other tests are:  Wireless LAN TEST (Wireless LAN TEST disk)  LAN/Modem/Bluetooth/IEEE1394 TEST (LAN/Modem/Bluetooth/IEEE1394 TEST disk)  Sound TEST (Sound TEST disk) You will need the following equipment to perform some of the Diagnostic test programs.
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Tests and Diagnostics  The Diagnostics Disk (Main T&D) 3.1.3 Heatrun test program The heatrun test starts automatically after the selection. You will need the following equipment to perform this program.
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Tests and Diagnostics 3.2 Executing the Diagnostic Test To start the Repair test program, follow these steps: 1. Insert the Repair test program disk in the USB floppy disk drive or Optical disk drive. 2. Turn on the computer while pressing U key. The following menu appears. NOTE: The following menu is an example when Repair test program is performed from the floppy disk. The Repair test program menu starts. Repair test program V*.** 1. DMI Entry utirity 2. Repair Heatrun (T&D) 3.
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Tests and Diagnostics 3.2.1 Diagnostics menu (T&D) Set the highlight bar to 3, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp. 20XX DIAGNOSTICS MENU : 1 2 3 4 5 6 7 8 9 – - DIAGNOSTIC TEST ONLY ONE TEST HEAD CLEANING LOG UTILITIES RUNNING TEST FDD UTILITIES SYSTEM CONFIGURATION EXIT TO MS-DOS NOTE: To exit the DIAGNOSTIC TEST MENU, press the Esc key.
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Tests and Diagnostics Set the highlight bar to 1, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp.
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Tests and Diagnostics Select the option you want to execute and press Enter. When you select 1SYSTEM TEST, the following message will appear: SYSTEM TEST NAME SUB-TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXXXXX xxxxxxx DIAGNOSTIC TEST VX.
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Tests and Diagnostics Use the up and down arrow keys to move the cursor to “ERROR STOP”. Use the right and left arrow keys to move the cursor to the desired option and press Enter. Selecting YES of ERROR STOP stops the test program when an error is found and displays the operation guide on the right side of the display screen as shown below: ERROR STATUS NAME [[ HALT OPERATION ]] 1: Test end 2: Continue 3: Retry These three selections have the following functions respectively: 1.
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Tests and Diagnostics 3.3 Setting of the hardware configuration To execute this program, input 1 in the startup menu. Then press Enter to select the (2)Initial config set. The H/W initial information setting tool consists of four subtests. Input the number you want to execute and press Enter. NOTE: Connect USB FDD, when you perform the Repair test program from the CDROM. DMI information on the subtest 02 is written in floppy disk.
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Tests and Diagnostics 7. “Create DMIINFO TXT (Y/N)?” is displayed. Press Y, then the DMI information (text data) is written to the Floppy disk, etc. Setting of the HWSC Setting of the UUID Display of the DMI information (including UUID) After completion of the above settings, H/W configuration & DMI information are appeared in order. Check the contents and press Enter.
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Tests and Diagnostics 3.4 Heatrun Test To execute this program, press 2, Repair Heatrun and press Enter in the startup menu, press Enter. After selecting this test, the same subtests as 3.23 RUNNING TEST is executed successively. For more details on the procedure and test content, refer to RUNNING TEST. When the heatrun test ends, following message appears in the display.
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Tests and Diagnostics 3.5 Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No. 3-18 Test Name Subtest No.
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Tests and Diagnostics Table 3-1 Subtest names (2/2) No. Test Name Subtest No.
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Tests and Diagnostics 3.6 System Test To execute the System Test select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM checksum This subtest executes a checksum test of the BIOS ROM (range: F0000h to FFFFFh, 64KB) on the System Board. Subtest 02 Fan ON/OFF This subtest turns on/off the fan motor by force with Fan ON/OFF commands. The following message will appear.
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Tests and Diagnostics If the CPU supports Gerserville (SpeedStep), this Subtest checks that the CPU operating clock speed can be changed. If the CPU does not support Gerserville (SpeedStep), the following message is displayed and the test is ended. This chip is not supported Subtest 04 Quick Charge This subtest checks the status for the quick charge. Subtest 05 DMI read This subtest displays the information in the Flash-ROM in the following format. *** DMI Data Display Ver X.
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Tests and Diagnostics To test the cache memory, a pass-through write-read comparison of ‘5Ah’ data is run repeatedly to the test area (‘7000’: ‘Program’ size to ‘7000’: ‘7FFF’ (32 KB)) to check the hit-miss ratio (on/off status) for CPU cache memory. One test takes 3 seconds. Number of misses  Number of hits  OK Number of misses  Number of hits  Fail Subtest 04 Stress Write/Read buffer (1 size = B30h) is prepared in the conventional memory.
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Tests and Diagnostics 3.7 Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed key code display When a key is pressed, the scan code, character code, and key top name are displayed on the screen in the format shown below.
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Tests and Diagnostics 3.8 Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM read/write for VGA This subtest writes the constant data (AAAAh and 5555h) to the video RAM. The data is read and compared to the original data.
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Tests and Diagnostics Subtest 04 Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode 12] 13] 3] 111 112 114 115 117 118 640*480 640*480 800*600 800*600 1024*768 1024*768 64K] 16M] 64K] 16M] 64K] 16M] The display below appears on the screen when this subtest is executed.
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Tests and Diagnostics Subtest 06 “H” Pattern Display This subtest displays a full screen of “H” patterns.
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Tests and Diagnostics 3.9 Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. The contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. 1. The following message will appear. Select the media mode and start track to be tested, then press Enter.
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Tests and Diagnostics Select the number of the subtest you want to execute and press Enter. The following message will appear during the floppy disk test. FLOPPY DISK SUB-TEST PASS COUNT WRITE DATA ADDRESS IN PROGRESS : : : : XX XXXXX XX XXXXXX XXXXXXX xxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] : test end [Ctrl]+[C] : key stop ERROR COUNT READ DATA STATUS : XXXXX : XX : XXX When the subtest 04 or 05 is selected, the following messages will appear on the screen.
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Tests and Diagnostics 3.10 Printer Test CAUTION: Printer Test is not supported for this model. To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. NOTE: An IBM compatible printer must be connected to the system to execute this test. Also, printer port wraparound connector must be connected.
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Tests and Diagnostics Subtest 02 Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wraparound NOTE: To execute this subtest, a printer wraparound connector must be connected to the computer’s printer port.
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Tests and Diagnostics 3.11 Async Test To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
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Tests and Diagnostics 3.12 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. CAUTION: The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 08 or 09 is executed. Before running the test, the customer should transfer the contents of the hard disk to floppy disk or another hard disk. If the customer has not or cannot perform the back-up, create back-up disks as described below.
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Tests and Diagnostics 4. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest. HARD DISK TEST XXXXXXX SUB TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXX DIAGNOSTIC TEST VX.
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Tests and Diagnostics Subtest 04 Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder.
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Tests and Diagnostics 3.14 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real time A new date and time can be input during this subtest. To execute the real time subtest, follow these steps: 1.
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Tests and Diagnostics Subtest 03 Real time carry CAUTION: When this subtest is executed, the current date and time are erased. This subtest checks the real time clock increments, making sure the date and time are displayed in the following format: Current date : Current time : 12-31-1999 23:59:58 The real time increments are automatically executed and the following is displayed: Current date : Current time : 01-01-2000 00:00:00 PRESS [Enter] KEY TO EXIT TEST To exit the test, press Enter.
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Tests and Diagnostics 3.15 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. CAUTION: Judge the existence of high-speed operation processor by 1bit of the composition byte. If exists, the bit is “1”. Test only when the high-speed operation processor exists.
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Tests and Diagnostics 3.16 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wraparound [It is not supported] CAUTION: PCMCIA wraparound test is not supported for this model. NOTE: To execute this subtest, the PC card wraparound connector is required.
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Tests and Diagnostics Subtest 02 RGB monitor ID NOTE: To execute this subtest, monitor supporting EDID (Extended Display Identification Data) is required. Connect a wraparound connector to CRT monitor for the test of ID acquisition. This subtest is executed by using VESA command. CAUTION: It becomes NG because the priority is given to the internal monitor in a simultaneous display mode.
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Tests and Diagnostics 3.17 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM test, select 12 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1. For the subtest 04, use a CD-RW on the market. Subtest 01 Sequential read This subtest is a sequential reading of one-block units (2K bytes) of all the logical addresses.
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Tests and Diagnostics 3.18 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test.
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Tests and Diagnostics Table 3-2 Error codes and error status names (2/3) Device name 3-42 Error code Error status name FDD 01 02 03 04 08 09 10 20 40 80 60 06 EE FDD - BAD COMMAND ERROR FDD - ADDRESS MARK NOT FOUND FDD - WRITE PROTECTED FDD - RECORD NOT FOUND FDD - DMA OVERRUN ERROR FDD - DMA BOUNDARY ERROR FDD - CRC ERROR FDD - FDC ERROR FDD - SEEK ERROR FDD - TIME OUT ERROR FDD - NOT DRIVE ERROR FDD - MEDIA REMOVED FDD - WRITE BUFFER ERROR Printer 01 08 10 20 40 80 PRT - TIME OUT PRT – FAULT PRT
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Tests and Diagnostics Table 3-2 Error codes and error status names (3/3) Device name Error code Error status name (HDD) CC E0 0A EE DA 12 HDD - WRITE FAULT HDD - STATUS ERROR HDD - BAD SECTOR HDD - ACCESS TIME ERROR HDD - NO HDD HDD - DMA CRC ERROR NDP 01 02 03 04 05 06 NDP - NO CO-PROCESSOR NDP - CONTROL WORD ERROR NDP - STATUS WORD ERROR NDP - BUS ERROR NDP - ADDITION ERROR NDP - MULTIPLAY ERROR EXPANSION C1 C3 C4 C5 C6 C7 C8 CB CC CE CF ADDRESS LINE ERROR CE#1 LINE ERROR CE#2 LINE ERROR DATA L
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Tests and Diagnostics 3.19 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eightdigit number. The first four digits represent the hard disk controller (HDC) error status number and the last four digits are not used.
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Tests and Diagnostics Table 3-4 HDC Error register contents Bit Name Description 7 BBK (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error. “1” … Uncorrectable data error has been detected. 5 —— Not used 4 IDN (Identification) “0” … Not used “1” … There is no ID field in the requested sector. 3 —— Not used 2 ABT (Abort) “0” … Not used “1” … Illegal command error or command abort.
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Tests and Diagnostics 3.20 ONLY ONE TEST 3.20.1 Program Description This program tests the unique functions of this model. 3.20.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter. The following menu appears in the display. ################################################################ ######## ONLY ONE TEST Menu (QOSMIO G20) ######## ################################################################ * * * 1 ............ Pressed Key Display (Main-key) * * 2 ............
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Tests and Diagnostics Subtest 01 Pressed Key Display (Main key) When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed. Holding a key down enables the auto-repeat function that causes the key’s display character to blink. Press Del + Enter to end the test.
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Tests and Diagnostics Subtest 02 Pressed Key Display (Ten key): Not used When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed. Holding a key down enables the auto-repeat function that causes the key’s display character to blink. Press Del + Enter (Ten key) to end the test.
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Tests and Diagnostics Subtest 03 Touch Pad This subtest checks the functions of the touch pad as shown below. A) Direction and parameter B) Switching function check. This test displays the response from the touch pad and touch pad switch. When moving your finger on the touch pad towards the upper left, the display changes according to the following illustration. If a touch pad switch is pressed, the displays appear on the right side one by one.
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Tests and Diagnostics Subtest 04 Wireless communication Switch This subtest checks if the Wireless communication switch works properly. If the test is started with the switch ON, following message appears in the display. Wireless communication Switch position (OFF) is set to a start Slide the switch to OFF position. Then, following message appears in the display. Wireless communication Switch ON !! Slide the switch to ON position. Then, following message appears in the display.
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Tests and Diagnostics NG message appears in the display if a defective is found during the test. Confirm the connection of cable, then execute the test again. Press 9 and return to ONLY ONE TESST menu. Subtest 06 LED This subtest checks if each LED lights properly. The following message appears in the display in order. Follow the instructions in the display to execute the test. [HDD Access LED test] Confirm the LED of HDD status blinks properly. Press any key and following message appears in the display.
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Tests and Diagnostics Subtest 07 Button This subtest checks the moving of the of the front operation panel button. Press the eco button after the following message appears. Step 1 X 1 2 * * *. Press Function button (Assist button ) OK message appears in the display if the test ends without an error. Press any key return to each Steps if NG! or Press any key message apprears. Press the Presentation button after the following message appears. Step2 X 1 2 * * *.
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Tests and Diagnostics Subtest 08 Acceleration sensor This subtest detects and corrects the each axis (X, Y, Z). NOTE: Make sure that this subtest is executed on the following condition: 1. Flat desk with vertical plane to get the stability of machine. 2. The vertical wall or plane is necessary. 3. Prevent the machine from shake or shock. Set the machine against the vertical plane with the Front upward Vertical plane Flat desk The figure below shows the name and position of each side.
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Tests and Diagnostics When this subtest is selected, the following message appears in the display. The heaven surface establishes in the upper direction Press [Enter] key NOTE: Be sure to execute the test with the display panel opened. Set the machine on the flat desk. Then press Enter to detect the data on this setting of machine. The following message appears in the display.
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Tests and Diagnostics Subtest 09 Docker Dock/Undock This subtest is executed with an Slim Port Replicator II. installed. Press Enter while pushing the eject button of the Slim Port Replicator II. the following message appears. Pushing Eject-SW, and press [Enter] Key Press Enter without pushing the eject button of the Slim Port Replicator II. after the following message appears. Release Eject-SW, and press [Enter] Key If the test ends successfully, the display returns to the ONLY ONE TEST menu.
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Tests and Diagnostics Subtest 0B Volume This subtest checks if Volume control dial works properly. Step1 The following message appears in the display. Volume button test Press Volume [ Down(-) ] Please press volume down button. Step2 The following message appears in the display. Volume button test Press Volume [ Up(+) ] Please press volume up button After checking Volume, return to the ONLY ONE TEST menu automatically.
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Tests and Diagnostics 3.21 Head Cleaning 3.21.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.21.2 Operations 1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS - FLOPPY DISK HEAD CLEANING : VX.XX Mount cleaning disk(s) on drive(s). Press any key when ready. 2.
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Tests and Diagnostics 3.22 Log Utilities 3.22.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or output the data to a printer. NOTE: Connect USB FDD, when you perform the DIAGNOSTIC PROGRAM from the DVD-ROM. The data is stored in floppy disk. The error information is displayed in the following order: 1. Error count (CNT) 2. Test name, Subtest number (TS-No) 3.
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Tests and Diagnostics 3.22.2 Operations Select 5 and press Enter in the DIAGNOSTIC MENU, logs error information into RAM or onto a floppy disk.
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Tests and Diagnostics 3.23 Running Test 3.23.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02) 3. Display test (subtest 01) 4. Real timer test (subtest 02) 5. HDD test (subtest 01) 6. FDD test (subtest 02) The system automatically detects the number of floppy disk drives connected to the computer for the FDD test. 3.23.2 Operations 1.
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Tests and Diagnostics TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 3-61
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Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 3.24.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE: This program is only for testing a floppy disk drive. The option is different from the Toshiba MS-DOS FORMAT command. This program can format a floppy disk in the following formats: (a) 2DD: Double-sided, double-density, double-track, 96/135 TPI, MFM mode, 512 bytes, 9 sectors/track.
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Tests and Diagnostics 3.24.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 2 3 4 9 – - FORMAT COPY DUMP HDD-ID READ EXIT TO DIAGNOSTICS MENU 2. FORMAT program (a) Selecting FORMAT displays the following message: DIAGNOSTICS - FLOPPY DISK FORMAT : VX.XX Drive number select (1:A, 2:B) ? (b) Select a drive number to display the following message: Type select (0:2DD, 3:2HD) ? (c) Select a media/drive type number and press Enter.
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Tests and Diagnostics 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below: Insert source disk into drive A: Press any key when ready. (c) Remove the Diagnostics Disk from the FDD, insert the source disk and press any key. The following message will appear, indicating the program has started.
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Tests and Diagnostics 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If 2:HDD is selected, the display will go to step (h). If 1:FDD is selected, the following message will appear: Select drive number (1:A, 2:B) ? (c) Select a drive number and the following message will be displayed.
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Tests and Diagnostics (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? HDD ID READ program Selecting HDD ID displays the following HDD ID configuration: [HDD ID Read (VX.XX)] [Drive #1] Model No. = XXXXXXX [Drive #2] = XXXXXXX NOTE: Only when a 2nd HDD is installed, [Drive #2] message appears in the display.
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Tests and Diagnostics 3.25 System Configuration 3.25.1 Function Description The System Configuration program contains the following configuration information for the computer: 1. Processor Type [Code/L2 cache] 2. Chip set [VRAM] 3. BIOS ROM version [1st ID, 2nd ID] 4. Boot ROM version 5. EC/KBC version 6. PS Microprocessor version 7. SVP parameter version [Panel/Manufacture code/Product code] 8. Micro code revision [Processor number] 9. Total Memory Size [Conventional memory] 10. Battery code 11. HWSC 12.
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Tests and Diagnostics 3.25.2 Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display. System Configuration Display: Ver X.XX [Machine Name???] * * * * * * * * * * * * * * * * * * * - Processor Type = XXXXXX-XXXXXMHz Code = XX L2 Cache = XXXXXKB Chip set = XXXXXX VGA Chip = XXXXXX BIOS ROM Version = VX.XX 1st ID = XXH, 2nd ID = XXH BOOT ROM Version = VX.XX EC/KBC Version = VX.XX PS Micon Version = VX.XX SVP Par. Version = VX.
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Tests and Diagnostics 3.26 Wireless LAN Test Program (Atheros) Since there is no test program for Atheros-made wireless LAN cards, check the wireless LAN card type of the computer and the antenna connection by using Windows programs. Check of the wireless LAN card type 1. Slide the wireless communication switch to “ON” position. 2. Check the card type according to the following procedure: Click [Start] -> [All Programs] -> [TOSHIBA] -> [Utilities] -> [PC Diagnostic Tool]. Check the “Network”.
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Tests and Diagnostics Check of the antenna connection 1. Confirm that the icon for wireless LAN appears at the lower right of the screen under the circumstances the wireless LAN communication is available. (It is no problem if a cross is shown on the icon.) 2. Double-click the icon. If the computer finds any AP (Access Point), the antenna marks like as follows will appear. It shows the antenna cables are surely connected to the wireless LAN card. 3.
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Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g/n Setting up of REF PC) For the test of Intel-made wireless LAN cards, configure the test environment as shown below with the following equipment. ・ AP （which can operate on Windows XP and is corresponding to access point 11a, 11b and 11g） NOTE: Set the SSID of AP as follows. (Note that upper case and lower case characters are recognized as different characters.
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Tests and Diagnostics Open “My Computer” window and click “My Network places” on the left column. Click “View network connections” on the left column. The “Network Connections” window appears. Double-click “Local Area Connection”.
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Tests and Diagnostics Click “Install…” button on the “Local Area Connection Properties” window. Local Area Connection Properties window Select “Protocol” on the “Select Network Component Type” window and click “Add…” button. Select Network Component Type window Click “Have Disk…” button on the “Select Network Protocol” window.
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Tests and Diagnostics When “Install From Disk” window appears, click “Browse…” and specify the created “Clx_Res” folder. Then Click “OK”. (For the test, “PACKET.INF” file is used.) Install From Disk window The “Select Network Protocol” window appears again. In the “Network Protocol”, “DDK PACKET Protocol” will appear. Then click “OK” to start the installation. Select Network Protocol window When the installation is completed, “Local Area Connection Properties” will appear.
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Tests and Diagnostics After the completion of REF PC setup, restart the WINDOWS. Then perform the Responder test program for Windows (WTWINSVR.EXE) in the Clx_Res folder. ・WTWINSVR.EXE Function : Transmitting/receiving of data to/from DUT via AP OS available : Windows XP only How to start : Double-click WTWINSVR icon. How to start 1. Double-click wtwinsvr icon. The following screen will appear. Startup screen of wtwinsvr program 2.
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Tests and Diagnostics 3.28 Wireless LAN Test Program on DUT PC (Intel-made) 3.28.1 Wireless LAN Test Program (Intel-made : Shirley Peak) on DUT PC This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade 802.11 a/b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Insert the Diagnostics disk for wireless LAN test into the Floppy Disk Drive. Turn on the power while pressing U. The following menu appears in the display.
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Tests and Diagnostics To execute the subtest, input the subtest number and press Enter. Subtest01 Communication test of 11a mode for 5100/5150 module (Two antenna type) This subtest execute transmitting/receiving test in 802.11a mode using the main antenna. If a defective is not found during the test, OK message will appear in the display. Press any key and return to the test menu. If a defective is found during the test, NG message will appear in the display.
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Tests and Diagnostics Subtest03 Communication test of 11g mode for 5100/5150 module (Two antenna type) This subtest execute transmitting/receiving test in 802.11g mode using the main antenna. If a defective is not found during the test, OK message will appear in the display. Press any key and return to the test menu. If a defective is found during the test, NG message will appear in the display.
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Tests and Diagnostics Subtest06 Communication test of 11b mode for 5100/5150 module (Three antenna type) This subtest execute transmitting/receiving test in 802.11b mode using the main antenna. If a defective is not found during the test, OK message will appear in the display. Press any key and return to the test menu. If a defective is found during the test, NG message will appear in the display.
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Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the test program. Insert the test program disk for LAN/Modem/Bluetooth/IEEE1394 test in FDD and turn on the power. The following message will appear: Microsoft Windows XX Startup Menu ---------------------------------1. LAN 2. Modem 3. Bluetooth 4. IEEE1394 Enter a choice: Press the number you want to test and press Enter.
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Tests and Diagnostics Subtest01 (i82562 + ICHx) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip.
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Tests and Diagnostics Subtest02 (GbE) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. Select 2 to execute and press Enter. The following message will appear: Testing adaptor...hit to abort. * External Loopback Test...PASSED Testing completed. * * Loopback Test Complete * * * 1000Base Auto-negotiation TxRx Test * * CE Test Complete NOTE: The menu displayed by your computer may be slightly different from the one shown above.
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Tests and Diagnostics 3.29.2 Modem test For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Denki Seisakusyo)” for the tests. ################################################################## ###### AC97' Modem Controller Diagnostics program ####### ################################################################## * * * 1 ............ (ICHx) * * * * 2 ............
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Tests and Diagnostics 3.29.3 Bluetooth test Preparation ・ For the test of Bluetooth function, use the Windows program installed on the target computer (computer to be tested). A responder device (device for transmitting/receiving data) is also needed. (A mobile phone with the Bluetooth function is also available.) ・ A Bluetooth card should be installed on the target computer. Install the Bluetooth function by clicking [All Programs] -> [TOSHIBA] -> [Bluetooth] -> [Bluetooth Settings]. Test procedure 1.
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Tests and Diagnostics 5. Select “Diagnostics” tab and click “Run”. 6. Check the “Log” to confirm the test result. BT address of test computer BT address of responder device 7. When the BT (Bluetooth) address of the responder device appears, the Bluetooth card and antenna connection are OK.
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Tests and Diagnostics 3.29.4 IEEE1394 test (Not Used) To execute this test, input 4 and press Enter. Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test. NOTE: The following menu will appear: ******************************************************************** ******** IEEE1394[XXXXX] Diagnostics program ************** ******************************************************************** * * * 1 .... Transmit & Receive test * * * * 2 ....
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Tests and Diagnostics 3.30 Sound Test program Sound TEST disk cannot be used in Satellite Pro S300, TECRA A10/S10/P10. Therefore, please test the sound on Windows OS. 1) Play a music file. 2) click TOSHIBA-> utility -> "PC diagnostic tool." to test the sound Please check operation of speakers by one of methods.
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Tests and Diagnostics 3.31 SETUP 3.31.
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Tests and Diagnostics Power Management menu Wake-up on LAN Wake-up on LAN on Battery Wake on Keyboard Critical Battery Wake-up Dynamic CPU Frequency Mode Core Multi-Processing Intel Turbo boosts eSATA SATA Interface setting BIOS Power Management Advanced menu Execute-Disable Bit Capability Virtualization Technology Trusted Execution Technology Beep Sound USB Sleep and Charge USB KB/Mouse Legacy Emulation USB-FDD Legacy Emulation USB Memory BIOS Support Type Change Boot Order System Configuration Exit men
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Tests and Diagnostics 3.31.2 Accessing the SETUP Program Turn on the power SW. then press F2. The following display appears.
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Tests and Diagnostics Security menu screen Power Management menu screen TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 3-91
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Tests and Diagnostics Advanced menu screen Exit menu screen 3-92 [CONFIDENTIAL]) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Tests and Diagnostics Moving Within the SETUP Menu and Changing Values 1. Press  and  to move between the two columns. Press  and  to move between items in a column. 2. Press either the [Enter]Key to change the value. Accepting Changes and Exiting the SETUP Window 1. Press [F10] key to accept the changes you made. 2. To make other changes, press N. Repeat the steps above. 3. To accept the changes, press Y. NOTE: You can press Esc to quit at any time without saving changes.
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Tests and Diagnostics How to change setup Options Since a help is displayed on the right-hand side of each menu screen, it is referred to.
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Tests and Diagnostics 3.32 Maintenance (WinPE&FreeDos) Test Program Operation 3.32.1 . Outline This document explains how to operate T&D that is released through TOSHIBA Test & Diagnostic CD. 3.32.2 Outline of Specification The TOSHIBA Test & Diagnostic CD already released includes WindowsPE T&D (hereafter, referred as WinPE T&D) and Freedos T&D (hereafter, referred as Fdos T&D) and either of the T&D programs can be activated by multiboot support. 3.32.2.
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Tests and Diagnostics 3.33 . Starting TOSHIBA Test & Diagnostic 3.33.1 Starting from CD 1. Load the TOSHIBA Test & Diagnostic Discs into the optical disc drive and turn off the computer's power. 2. While holding down F12 key on the keyboard, turn on your computer - when the logo screen appears, release the F12 key. 3. Use the left and right cursors key to select the CD-ROM icon from the menu. 4. If T&D starts from the TOSHIBA Test & Diagnostic CD, the following screen is displayed.
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Tests and Diagnostics NOTE: After [winpe] is selected, the following message is displayed on the screen. At this time, ”Press any key to boot from CD or DVD..” is displayed, but only [ENTER] key is valid. P ress the Enter key again on this screen. If the Enter key is pressed, WindowsPE will start. The key different from an Enter key is pressed. Or a press of no keys will start Windows of built-in HDD.
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Tests and Diagnostics 3.34 . Windows PE T&D 3.34.1 Equipment Configuration for Test The following table indicates equipment configuration necessary for conduction of the tests items shown below using WinPE T&D. Test Item Equipment required Remarks USB USB flash memory Free space : More than 12MB (When you start WinPE T&D from a USB memory, use 512MB or more of USB memory.) ODD Media containing test data The test data is included in a bootable CD. File name: CDDTEST0.
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Tests and Diagnostics 3.34.2 Starting T&D 3.34.2.1 Automatic Start When WindowsPE starts up from the TOSHIBA Test & Diagnostic CD or the USB memory, WinPE T&D starts automatically. After the startup of the OS, unless CD volume name is WINTDCD or USB volume name is WINTDUSB, WinPE T&D does not start automatically. Note: If the system starts up from the TOSHIBA Test & Diagnostic CD, WinPE T&D in the USB memory starts when the USB memory created in section 3-5-2 is connected. 3.34.2.
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Tests and Diagnostics 3.34.3 System Information Menu If you set the TOSHIBA Test & Diagnostic CD to the ODD drive and run WinPE T&D, the following test selection screen is displayed. (For further details, refer to Chapter 2.) Hereinafter, System Information will be described in detail. There are three menus of System Information, Diagnostics, and System Utility as a menu. 3.34.3.
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Tests and Diagnostics 3.34.3.2 Details of the system information displayed on an information tree The details of the system information item displayed on each information tree are shown below. ● BIOS The following items display DMI and BIOS information of the PC. Item Description Manufacturer Displays Manufacturer of the PC Product Name Displays Product Name of the PC Part Number Displays Part Number of the PC. Serial Number Displays Serial Number of the PC. UUID Displays UUID of the PC.
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Tests and Diagnostics ● MEMORY The following item displays memory information of the PC. Item Physical Memory Description Displays the capacity (GB) of the physical memory on the PC ● NETWORK The following items displays network card information of the PC. If more than one network card is connected, the information of up to 4 network cards are displayed. Item Description Network0 - 3 Displays the name of the LAN card connected to the PC. MAC Address0 - 3 Displays MAC address of the LAN card.
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Tests and Diagnostics ● ODD The following item displays ODD information of the PC. If more than one ODD is connected, the information of up to 4 ODDs are displayed. Item ODD0 - 3 Description Displays the name and the media type of the ODD connected to the PC. Media type is information of the media used, such as CD-ROM, DVD-RW and etc. ● Drive The following item displays Drive information of the PC. If more than one ODD is connected, the information of up to 4 ODDs are displayed.
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Tests and Diagnostics 3.34.4 Test Menu This section explains the Diagnostics screen. 3.34.4.1 Explanation of each item ▼ [Multitask] check box Checking this box activates each test as multi-task. ▼ [CPU Stress] check box Checking this box applies any stress to the CPU during the test. Restriction: If the test is conducted, uncheck Multitask in the Simple mode before the test because of too much stress to be applied to the CPU. Also, USB and TIMER of TEST Item cannot be supported.
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Tests and Diagnostics ▼ Testing time Updates the testing time and displays it in real time during the execution of the test. ▼ Test setting and Result This will be explained in section 3-4-2. 3.34.4.2 Test setting and Result ▼ TEST Item Checks the check box of the item to be tested. ▼ Mode Sets the test mode for each test item. ▼ Status The following table explains status information of each test item (test device).Status Description Status Description -- Ready for the test prior to the start of it.
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Tests and Diagnostics Status Description Device not connected Peripheral device necessary for the test is not connected. USB flash memory, FDD and others may be connected to the PC. Device has a problem Failure occurred in the device driver. This Device is disabled The device has been removed. This Device is currently stopped The device is in the STOPPED state. IP Address cannot be acquired The IP address is not able to be obtained. The LAN cable may not be connected.
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Tests and Diagnostics 3.34.4.3 Test Procedure This section describes operation procedure of WinPE T&D. 1) Select the test item to run from Test Item and check it. (If you put a check mark in the ALL Item Check check box, all test items are checked.) 2) Select the test mode of each test. (If you put a check mark in the ALL Detail Check check box, all tests are performed in the Detail mode.) 3) Set the number of LOOP CONT, Multitask and CPU Stress. 4) Click on the [START] button and the test starts.
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Tests and Diagnostics 3.34.4.4 Display of Test Result If the test ends successfully or the [STOP] button is clicked, the following Result screen is displayed. After confirming the result, click the [CLOSE] button to close the screen. After the display of the test result screen, the test result logs are saved to X drive. Note: WinPE is extracted on the RAM disk on drive X. Therefore, if the PC is shut down, the log files will be lost.
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Tests and Diagnostics 2) How to save log files The following is the procedure to save log files to an external media Test logs in the text format and HTML log files are saved to the external media. 2-1) Click the check box of the log file to save. If you click the [ALL Select] button, all the check boxes of the log files are checked. Also, if you click the [ALL Clear] button, all the checkmarks in the check boxes are cleared.
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Tests and Diagnostics 2-3) If a destination confirmation message is displayed, click the [OK] button. 2-4) If the log file is successfully saved to the destination, the following confirmation screen is displayed and click the [OK] button. 2-5) After saving the log files, click the [Close] button to close the Management screen.
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Tests and Diagnostics 3.34.5 System Utility Menu This section explains System Utility screen. 3.34.5.1 Explanation of Each Item ▼ Utility Item … A list of the utilities that this T&D supports ▼ Detail … Explanation of each utility is described. If you point to the utility which you wish to execute and click it, the utility starts.
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Tests and Diagnostics 3.34.5.2 USB Memory Creation Tool If the system is booted using the USB memory created in 3-5-2, the following screen is displayed. Press the arrow keys to operate on the multi-boot screen. Move the cursor to the desired item and press the Enter key. [WindowsPE T&D]: Starts up WindowsPE and then starts WinPE T&D. [FreeDOS] : Displays the following screen if FreeDOS is selected. Use the arrow keys to operate on the screen.
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Tests and Diagnostics This utility extracts the contents of TOSHIBA Test & Diagnostic to the specified USB memory to provide the environment which allows you to start the test from the USB memory and conduct it. If the utility is executed, the following screen is displayed. Note:If this tool is run, the content of the USB memory is cleared. Use the USB memory with 512MB or more. Operational Procedure 1) The device type checks the USB device. 2) Click the [START] button.
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Tests and Diagnostics 3.34.5.3 Display of SMART Information This utility lists the SMART information on the screen. Attribute and Worst values for each ID are also displayed. Since some HDDs do not have ID, these information are not displayed in that case. The following screen displays the SMART information of the first HDD. When two HDDs are connected and the current checkbox is changed to Disk2, the SMART information of the second HDD is displayed.
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Tests and Diagnostics Each ID and its details are listed in the following table. ID Attribute Name Description 1h Raw read error rate Read error rate Rate of errors which occur when the HDD reades data.
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Tests and Diagnostics C7h UltraDMA CRC error count Number of CRC errors occurred during data transference in the UltraDMA mode DFh Load/Unload retry count Number of reloads of more than a certain amount of times 3-116 [CONFIDENTIAL]) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Tests and Diagnostics 3.34.6 Details of Each Test Function 3.34.6.1 HDD Physical Test 1) Test content This test handles the HDDs to the PC as physical unit and conducts read test to the target HDD to check whether it works or not. Up to first four HDDs connected to the PC can be the target of the test. ■ Simple Mode This test mode performs a read test to all the data indicated by 1000 addresses picked out between the first address and the last address.
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Tests and Diagnostics ■ In the case of FAIL The Error Count on the test screen is zoomed in and (NG) is displayed in the Result field on the WinPE T&D screen. The detail of the error is printed to the log of WinPE T&D. Move details are as shown below. Message Explanation Remarks Read Hdd Create File Error.Address=XX Failed in opening of HDD driver. XX is LAB value. The HDD driver may not be normal or installed. Read Hdd Set File Pointer Error.Address=XX Failed in the HDD file pointer setting command.
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Tests and Diagnostics 3.34.6.2 HDD Logical Test 1) Test content This test first verifies that the files which exist on the drive recognized as the built-in HDD are read normally. During the verification operation, the status update is performed sequentially (display of file names in File Name) and when the verification reaches the last file, it is terminated. ■ Simple Mode This test mode performs the read test to the first 400 files on the drive.
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Tests and Diagnostics 3.34.6.3 Memory Test 1) Test content This test reserves free memory area in the main memory and performs Write, Read and Compare operation to the area to verify data validity. A test using burst transfer is also performed. ■ Simple Mode This test mode only executes Address Test and Stack High/Low test. ■Detail Mode This test mode also executes Address Test and Stack High/Low test as well as Bust Transfer test.
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Tests and Diagnostics 3) Result judgment ■In the case of PASS The PASS Count on the test screen is zoomed in and (OK) is displayed in the Result field on the WinPE T&D screen. ■In the case of FAIL The PASS Count on the test screen is zoomed in and (NG) is displayed in the Result field on the WinPE T&D screen. The detail of the error is printed to the log of WinPE T&D. More details are as shown below. Message Explanation Memory Compar Error ( Address Test) An error occurred during Address Test.
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Tests and Diagnostics 3.34.6.4 USB Test 1) Test content This test accesses a file on the disk in the USB device (USB Flash Memory) to verify the file validity. Create a file with the specified size in the USB device and delete the file after creating it. ■ Simple Mode This test mode creates a 4 MB file (Write), reads the file and compares it with the original file. ■ Detail Mode This test mode creates a 12 MB file (Write), reads the file and compares it with the original file.
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Tests and Diagnostics 3) Result judgment This test is regarded as 1PASS when every access to the files in all of the devices connected to the PC is successful. If an error occurs even in a device, the error count is incremented. ■ In the case of PASS The PASS Count on the test screen is zoomed in and (OK) is displayed in the Result field on the WinPE T&D screen. ■ In the case of FAIL The Error Count on the test screen is zoomed in and (NG) is displayed in the Result field on the WinPE T&D screen.
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Tests and Diagnostics 3.34.6.5 ODD Test 1) Test content This test reads the test data in the CD inserted on the CD drive (External CD driver is also possible) to verify the data integrity. During the verification operation, update of the read address is performed (displayed on the right side of the Addressing Data) and when the verification reaches the end of the data, it is terminated. ■Simple Mode This test mode reads 64MB data and compares it with the original data.
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Tests and Diagnostics ■ In the case of PASS The PASS Count on the test screen is zoomed in and (OK) is displayed in the Result field on the WinPE T&D screen. ■ In the case of FAIL The Error Count on the test screen is zoomed in and (NG) is displayed in the Result field on the WinPE T&D screen. The Addressing data of the data in which an error occurred is printed to the log of WinPE T&D.
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Tests and Diagnostics 3.34.6.6 WIRED LAN Test 1) Test content This test checks that normal communication can be performed with the built-in LAN card. To execute the test, it is necessary that Mac address for the LAN card should have been set and IP address should have been given to the machine. ■ Simple Mode transmit 32 packet sizes data via the LAN line and confirm that a response can be received normally.
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Tests and Diagnostics ■ In the case of FAIL The Error Count on the test screen is zoomed in and (NG) is displayed in the Result field on the WinPE T&D screen. The detail of the error is printed to the log of WinPE T&D. More details are as shown below. Message Explanation Remarks An IP address does not understand one. IP address cannot be obtained. This error occurs when IP is not assigned or the test is conducted with a LAN card.
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Tests and Diagnostics 3.34.6.7 CPU Test 1) Test content This test performs arithmetic operation test to the CPU to verify the CPU operation. The test processes ALU and FPU operations and allows you to check that the results are correct. ■Simple Mode / Detail Mode Conduct the same test in both Simple mode and Detail mode. The test content is to process the ALU and FPU operations and check that the results are correct. 2) Test screen ▼ Test detail:.The test details under execution are displayed.
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Tests and Diagnostics The detail of the error is printed to the log of WinPE T&D. More details are as shown below. Message Explanation The ALU test made an error. An error occurred duringprocessing of ALU. The FPU test made an error. An error occurred duringprocessing of FPU.
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Tests and Diagnostics 3.34.6.8 VIDEO Test 1) Test content This test displays red, green, blue, white and black colors, circles, line gradation, ASCII characters and H pattern full screen. ■ Simple Mode This test mode displays red, green, blue, white and black colors, circles, line gradation, ASCII characters and H pattern full screen.■Detail Mode This test mode performs display of test items in the Simple mode as well as random drawing of circles, squares and lines.
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Tests and Diagnostics 3.34.6.9 FDD Test 1) Test content This test accesses a file on a floppy disk and verifies that the access can be made correctly. Create a file with the specified size on a floppy disk and delete the file after creating it Perform the test after inserting a floppy disk to the drive. ■ Simple Mode This test mode creates a 128 KB file (Write), reads the file and compares it with the original file.
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Tests and Diagnostics Message Explanation Remarks Space Size Error. Code(xx) There is no sufficient free space for the file with the specified size. xx indicates error code. This message also appears when no floppy disk is in the floppy disk drive. Open File Error. Code(xx) Failed in opening the file. zx indicates file code. Write File Error. Code(xx). Failed in writing to the file. zx indicates file code Note: The test causes error if the floppy disk is write-protected.
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Tests and Diagnostics 3.34.6.10 IEEE1394 Test 1) Test content This test accesses a file in the IEEE1394 device and verifies that the access can be made correctly. Create a file with the specified size in the IEEE1394 device and delete the file after creating it ■ Simple Mode This test mode creates a 4 MB file (Write), reads the file and compares it with the original file. ■ Detail Mode This test mode creates a 12 MB file (Write), reads the file and compares it with the original file.
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Tests and Diagnostics the WinPE T&D screen. The detail of the error is printed to the log of WinPE T&D. More details are as shown below. Message Explanation File Access Error.xx: Failed the file access xx indicates drive name. Space size Error.Code(xx:) There is no sufficient free space for the file with the specified size. xx indicates drive name.
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Tests and Diagnostics 3.34.6.11 TIMER Test 1) Test content Execute the test after adjusting the internal time and verify the accuracy of the timer after it passes the year 2000. ■ Simple Mode / Detail Mode Simple Mode tests at intervals of order 5 seconds. Detail Mode tests at intervals of order 10 seconds. The test content is to verify that there is no difference between the calculated estimated time and really taken time.
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Tests and Diagnostics 3) Result judgment Both of PASS and FAIL are not displayed anywhere on the TIMER screen. The result is reflected to the log on the WinPE T&D screen. ■ In the case of PASS The PASS Count display on the test screen is zoomed in and (OK) is displayed in the Result field on the WinPE T&D screen. ■ In the case of FAIL The Error Count on the test screen is zoomed in and (NG) is displayed in the Result field on the WinPE T&D screen.
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Tests and Diagnostics 3.34.6.12 KEYBOARD Test 1) Test content The keyboard of PC is a test which judges whether it operates normally. ■Simple Mode / Detail Mode The same operation is carried out whichever it chooses. 2) Test screen The arrangement of a keyboard is displayed on the display of PC.
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Tests and Diagnostics 1) If the press of a key is recognized correctly, the object key on a display will be eliminated. 2) When redoing a keyboard test, the "Refresh" button arranged at the screen lower left is pressed. Next, it returns to the state immediately after starting. Note: The check of the "FN" key should press "FN" and "F3" simultaneously. It does not react, even if it presses only the "FN" key.
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Tests and Diagnostics The keyboard which can be tested is two kinds, "US Keyboard A4 Mode" and "US Keyboard A4 Mode+10Key Mode." When you test a keyboard with a ten key, choose "US Keyboard A4 Mode+10Key Mode" by the combo box of the keyboard layout upper left stage.
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Tests and Diagnostics 3) Result judgment It is normal, if a keyboard test is done and all the keyboard layouts are eliminated. Press the "Pass" button with the judgment button at the upper right of a keyboard layout. Press the "Fail" button, when abnormal. In addition, a warning message will be displayed, if the "Pass" key is pressed before all the keys are pressed. The thing in which the operator made the mistake is told. OK: Although the keyboard test is not ended, it is considered as success.
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Tests and Diagnostics 3.34.6.13 Mouse Test 1) Test content The Mouse of PC is a test which judges whether it operates normally. ■Simple Mode / Detail Mode The same operation is carried out whichever it chooses. 2) Test screen If a mouse test start is carried out, the above-mentioned screen will be displayed.
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Tests and Diagnostics 1) There is a test item to 1-9 of a mouse test screen. If applicable mouse operation is performed, a test item will disappear. Moreover, it is simultaneously displayed on the corresponding section of a right-hand side mouse illustration by coloring. 2) Press the "Refresh" button at the lower left of a screen to redo a mouse test. It returns to the initial screen of a test. 3) The cursor position is expressed in the lower part of a screen as X coordinates and Y coordinates.
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Tests and Diagnostics 3) Result judgment When all the test items of a mouse test disappear and it is normal, Please push the "Pass" button of a mouse test screen. Press the "Fail" button, when abnormal. A warning message is displayed, when the "Pass" button is pressed before the mouse test items 1-9 were all completed. The thing in which the operator made the mistake is told. OK: Although the keyboard test is not ended, it is considered as success. Cancel: It returns to a keyboard test screen.
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Tests and Diagnostics 3.35 DOS T&D 3.35.1 Configuration of Test Equipment The configuration of test equipment required for executing FreeDOS T&D is as follows: Note: Start the machine after connecting the FDD. If the FDD is connected to the machine after FreeDOS T&D started, it does not recognize the FDD. 3.35.1.
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Tests and Diagnostics HDD ： Hard disk drive KB ： Keyboard FDD ： Floppy disk drive 3.35.1.
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Tests and Diagnostics 3.35.1.3 Test program list The following table lists test items included in each test. Test name Test No. Sub No.
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Tests and Diagnostics 3.35.2 How to start T&D 3.35.2.1 Diagnostics main menu Set the TOSHIBA Test & Diagnostic CD to the ODD drive and turn the power of the system on. If you select Freedos on the BOOT selection screen then the test program is loaded and the following test selection screen is displayed. (Refer to section 4.2.2 for details.) Use the Up or Down cursor key to select your desired item and press the [Enter] key.
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Tests and Diagnostics 3.35.2.2 Diagnostics test menu If you select [1] in the main menu, the following test screen is displayed. Use the Up or Down cursor key to select your desired test item and press the [Enter] key. [1] - [9]: Select the subtest menu described in section 4-2-3. [88］: Specifies the number of error retries. {0 - 255} [99]: Redisplays the main menu screen in section 4-2-1 (Pressing [Esc] is also considered valid.
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Tests and Diagnostics 2) HARD DISK TEST The following message will appear. Select the Hard Disk DRIVE to be tested, then press Enter. ［1］：Drive 1 ［2］：Drive 2 ［3］：Drive 3 ［4］：Drive 4 ［0］：Drives 1 to 4 This message is used to select the error dump operation when a data compare error is detected. Select 1 or 2. [1]: The dumped data is not displayed on the screen even if a data compare error occurs.(Only pressing the [Enter] key is also considered valid.
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Tests and Diagnostics 3.35.2.3 Sub test menu If you select any test item from “DIAGNOSTICS TEST MENU”, the following sub menu is displayed. Use the Up or Down cursor key to select your desired item and press the [Enter] key. When you select any subtest item, you are taken to the test mode described in the detail of each test function in section 4-6.
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Tests and Diagnostics 3.35.3 Test Operating Procedure If you select any test item from the subtest menu and execute it, you are required to set the test mode. Set the test mode according to the following procedure. Use the Up and Down cursor keys to select an option for TEST LOOP and ERROR SOPT.
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Tests and Diagnostics ［［ HALT OPERATION ］］１：Test end …The test ended. Select a subtest. ２：Continue …The next step will be executed. ３：Retry …The error step will be retried. 3) Discontinuing a test If you press the [Ctrl] + [Alt] + [Break] keys during a test, the test is discontinued and the screen returns to the subtest menu described in section 3-31-4.2.3.
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Tests and Diagnostics 3.35.4 Error Code Status If an error occurs during any test, one of the following error codes is displayed.
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Tests and Diagnostics HDD 3-154 04 FDD - RECORD NOT FOUND 08 09 10 20 40 80 60 06 EE FDD - DMA OVERRUN ERROR FDD - DMA BOUNDARY ERROR FDD - CRC ERROR FDD - FDC ERROR FDD - SEEK ERROR FDD - TIME OUT ERROR FDD - NOT DRIVE ERROR FDD - MEDIA REMOVED FDD - WRITE BUFFER ERROR 05 07 09 0B BB 08 01 02 04 10 20 40 80 11 AA CC E0 0A EE DA 12 HDD - HDC NOT RESET ERROR HDD - DRIVE NOT INITIALIZE HDD - DMA BOUNDARY ERROR HDD - BAD TRACK ERROR HDD - UNDEFINED ERROR HDD - OVERRUN ERROR (DRQ ON) HDD - BAD COMMAND E
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Tests and Diagnostics 3.35.5 Task Function This T&D has three tasks, each of which has the following function. 3.35.5.1 Log Utilities（Task #5） This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or USB memory . The operation guide is displayed at the bottom of the screen and the error status names are displayed on the right side of the screen.
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Tests and Diagnostics 3.35.5.2 Running Test（Task #6） This test is a continuous test to be applied to the devices capable of unattended operation. The name of test device and the number of subtest being tested are displayed on the screen during a test. The following table indicates the test items. Test Name 3-156 Sub test No.
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Tests and Diagnostics 3.35.5.3 FD & HD Utilities（Task #7） Run the utility on the floppy disk. If you select task No. [7], the following FDD utility selection menu is displayed. Use the Up and Down cursor keys to select your desired item and press the [Enter] key. If you press the [Esc] key or select [9], the screen returns to the main menu described in section 4.2.1. 1) DUMP This program displays the contents of the floppy disk and the designated sectors of the hard disk on the display.
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Tests and Diagnostics 3.35.6 Detail of Each Test Function 3.35.6.1 System Test 1) DMI data read This subtest displays the information in the Flash-ROM in the following format Model Name ： XXXXXXXX Version Number ： XXXXXXXX Serial Number ： XXXXXXXX Model Number ： XXXXXXXX PCN/BND Number ： XXXXXXXX UUID Number ： XXXXXXXXXXXXXXX 3.35.6.
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Tests and Diagnostics Test data = CCAA5533H, 8000000H Step 2: Byte Enable Test Write the data byte by byte to the initial address of the data in 64KB units and the initial data + 4, then read double words of the written data and compare the result with the original data.
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Tests and Diagnostics With regard to the test memory content, save the data to the test memory before the test and restore it to the former address after the test.
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Tests and Diagnostics : JMP + Read and Compare Step 7: JMP＋Write (Address pattern 2) 1/4.
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Tests and Diagnostics 3.35.6.3 Keyboard Test 1) Pressed key code display When a key is pressed, the scan code, character code, and key top name are displayed on the screen in the format shown below. The 88 key (compatible with the 106 key) is not tested because this key operating in overseas mode uses the different character code table (Not for Japan model).
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Tests and Diagnostics 3.35.6.4 Display test Move the highlight bar to the subtest you want to execute and press Enter. 1) VRAM Read / Write for VGA This subtest writes the constant data (AAAAh and 5555h) to the video RAM. The data is read and compared to the original data. 2) Gradation for VGA This subtest displays four colors: red, green, blue and white from left to right across the screen from black to maximum brightness.
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Tests and Diagnostics 3.35.6.5 Floppy Disk Test This subtest tests floppy disks. 1) Sequential read This subtest performs a Cyclic Redundancy Check (CRC) that continuously reads all the tracks (track: 0 to 39/0 to 79) on a floppy disk. 2) Sequential read / write This subtest continuously writes data pattern B5ADADh to all the tracks (track: 0 to 39/0 to 79) on a floppy disk. The data is then read and compared to the original data.
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Tests and Diagnostics ［ FDC Status ］ 0 FDC Status 1 = 2 3 XX XX XX 4 5 6 XX XX XX 0 ： Result Status 0 1 ： Result Status 1 2 ： Result Status 2 3 ： Cylinder Address 4 ： Head Address 5 ： Sector Address 6 ： Number of Bytes / Sector ［ Result Status 0 ］ 7 6 5 4 3 2 1 0 IC1 IC0 SE EC NR HD US1 US0 IC1／IC0 ： Interrupt Code bits 00＝normal，01＝abnormal，10＝invalid CMD 11＝abnormal（FDD ready） SE ： Seek end EC ： Equipment check (track 0 is detected) NR ： Not ready HD ： Head address US1／US0 ： Uni
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Tests and Diagnostics ［ Result Status 1 ］ 7 6 EN 5 4 DE OR 3 2 1 0 ND NW MR EN ： End of Cylinder DE ： Data error OR ： Over run (DMAC) ND ： No data NW ： Not writable MA ： Missing address mark ［ Result Status 2 ］ 7 6 5 4 3 2 1 0 CM DD NC SH SN BC MD CM ： Control mark DD ： Data error (data field) NC ： No cylinder SH ： Scan equal hit SN ： Scan not satisfied BC ： Bad cylinder MD ： Missing address mark (data field) 3-166 [CONFIDENTIAL]) TECRA M11/Satellite Pro S500M Series Maintenan
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Tests and Diagnostics 3.35.6.6 Hard Disk Test 1) Sequential read This subtest performs a forward read operation (0 to Maximum) by 63 sectors. 2) Address uniqueness This subtest writes unique address data to each sector of the HDD track-by-track. The data written to each sector is then read and compared with the original data. There are three ways the HDD can be read.
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Tests and Diagnostics 5) Partial read This subtest reads 1GB data that is in minimum, middle and maximum address of the HDD area. 6) Write specified address This subtest writes specified data to a specified cylinder and head on the HDD. 7) Read specified address This subtest reads data, which has been written to a specified cylinder and head on the HDD. 8) Sequential write This subtest writes specified 2-byte data to all of the cylinders on the HDD.
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Tests and Diagnostics [HDC Status] : P – 1F7h Bit Name Function 7 BSY（busy） 0: HDC is ready. 1: HDC is busy. 6 DRY（drive ready） 0: HDD does not accept the command. 1: HDD is ready. 5 DWF（write fault） 0: Write is successful 1: Write error 4 DSC（seek complete） 0: Seek error 1: Seek normal termination 3 DRQ（data request） 0: No data transfer request 1: Data transfer being requested.
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Tests and Diagnostics [Error register] Ｐ – 1F1h Bit Name Function 7 BBK（BadBlockMark） 0: Not used 1: Defective block mark detection.
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Tests and Diagnostics 3.35.6.7 Real timer test 1) Real time This subtest sets and displays the calendar or clock function. 2) Backup memory This subtest writes the data for 1bit ON (01, 02, 04…80h) and 1bit OFF (FE, FB, FB…7Fh) and AAh, 55h to 114 bytes of addresses from 0E to 7Fh, reads the written data and compares the result with the original data. 3) Real time carry Set the constant value as below and check carry of the timer. Month Date Year 12 - 31 - 2008 Hour Min. Sec.
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Tests and Diagnostics 3.36 Maintenance (WinPE&FreeDos) Test Program Supplementary Information 3.36.1 Details of HTML Log File This section provides details of the HTML log file stored in the storage. 3.36.1.
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Tests and Diagnostics Physical Memory Capacity (MB) of memory which is installed in PC NetWork0 Name of LAN card. Only the first LAN card is displayed on the screen.
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Tests and Diagnostics 3.36.1.3 Test Result The following table lists the test results. If an error occurs during a test, the line of the test on the screen is displayed in red color. Item Name Description Test Name Name of test Test Information Brief explanation of each test Pass Count Number of passes of a test Error Count Number of errors of a test Simple Mode Displays the result of the test performed in the Simple mode ● indicates that the test is OK.
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Tests and Diagnostics 3.37 Maintenance (WinPE&FreeDos) Test Program Supplementary Information 3.37.1 Outline Describes notices and restrictions on using this program 3.37.2 Notices and Restrictions (Win PE T&D) 1) CPU Stress When the CPU stress checkbox is checked, it is recommended that this test be conducted in the Simple mode. If CPU stress is applied in the TIMER Test and the USB Test in the test items, an error occurs.
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Tests and Diagnostics 6) Boot Media If the system is booted from the CD when both the CD and the USB memory that contain WinPE T&D are connected to the PC, T&D in the USB memory starts up. Also, when a bootable CD is not inserted in the CD drive when the system is booted from the USB memory, the ODD test fails with an error because the ODD test file is only contained in this CD. However, this error should be solved by inserting the bootable CD.
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Chapter 4 Replacement Procedures [CONFIDENTIAL]
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4 Replacement Procedures 4-ii [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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4 Replacement Procedures Chapter 4 Contents 4.1 Overview.................................................................................................................... 4-1 4.2 Battery pack ............................................................................................................. 4-11 4.3 ExperssCard/Bridge media/Smart card.................................................................... 4-13 4.3.1 ExperssCard ...............................................................
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4 Replacement Procedures Figures Figure 4-1 Removing the battery pack .......................................................................... 4-11 Figure 4-2 Removing the ExpressCard.......................................................................... 4-13 Figure 4-3 Removing the Bridge media ........................................................................ 4-14 Figure 4-4 Removing the smart card .............................................................................
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4 Replacement Procedures Figure 4-31 Removing the Bluetooth module ................................................................. 4-55 Figure 4-32 Removing the smart card slot ...................................................................... 4-57 Figure 4-33 Removing the jack/3G/Express board (1).................................................... 4-59 Figure 4-34 Removing the jack/3G/Express board (2)....................................................
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4 Replacement Procedures 4-vi [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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4.1 Overview 4 4 Replacement Procedures Replacement Procedures 4.1 Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual.
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4 Replacement Procedures 4.1 Overview Please prepare required parts in advance, when replacing the following items. ITEM COVER ASSY ITEM LCD COVER ASSY Parts List ITEM No 60,60-A 14 Parts List ITEM No 61 15 24 25 PART NAME Quantity COVER ASSY TOUCH PAD 1 1 PART NAME Quantity LCD COVER ASSY HD CAMERA MODULE W-LAN ANTENNA WITH CABLE W-LAN ANTENNA WITH CABLE 1 1 1 1 Parts which can not be reused are (1) Touch pad, (2) Camera module and (3) Wireless LAN antenna/3G antenna.
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4.1 Overview 4 Replacement Procedures The main parts in this manual are indicated in the part list by the following names.
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4 Replacement Procedures 4.1 Overview Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. DANGER: 1) Always use the genuine battery that is authorized by Toshiba or compatible with the unit. Since other battery packs have different specifications, they may be incompatible with the unit, and may burst or explode.
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4.1 Overview 4 Replacement Procedures Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2. Battery Pack”. 1. Do not disassemble the computer unless it is operating abnormally. 2. Use the designated tools. 3. Ensure that the environment for working on and storing parts does not contain any of the following.
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4 Replacement Procedures 4.1 Overview Disassembly Procedure Four main types of cable connector are used. • Pressure plate connector • Spring connector • Back flip connector • Normal pin connector For pressure plate connectors, slide the pressure plate holding tags on both sides of the plastic pressure plate on the connector and pull the cable out from the connector.
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4.1 Overview 4 Replacement Procedures Assembly Procedures After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. • Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems. • Check that all cables and connectors are securely connected.
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4 Replacement Procedures 4.1 Overview Screw Tightening Torque When you fasten screws, be sure to follow the torque list below. CAUTION: Overtightening can damage components and screws; undertightening can result in electrical shorts or other damage if screws or components come loose. NOTE: Toshiba recommends that you use an electric screw driver for quick and easy operations. • M2 • M2.5 (2.5mm) 0.294 N·m (3.0 kgf·cm) • M3 0.294 N·m (3.0 kgf·cm) (When, securing the HDD and HDD holder. See p.
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4.1 Overview 4 Replacement Procedures Grip Color Some screws have a colored grip area to help you determine the length of the screw.
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4 Replacement Procedures 4.1 Overview Screw Notation To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body. Format: Screw type + Screw length (mm) Screw shape B: Bind screw F: Flat head screw S: Super thin head screw T: Tapping screw U: Other screws (Unique screws: pan head, stud, etc.) Example: B6 ...
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4.2 Battery pack 4.2 4 Replacement Procedures Battery pack Removing the Battery pack To remove the battery pack, follow the steps below and refer to Figure 4-1. CAUTION: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC adapter and other external devices from the computer. 3. Turn the computer face down. 4.
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4 Replacement Procedures 4.2 Battery pack Installing the Battery pack To install the battery pack, follow the steps below and refer to Figure 4-1. CAUTION: There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly. Dispose always the used battery pack in accordance with the laws and ordinances of your local authority. Use only the batteries approved by Toshiba. NOTE: Check the battery’s terminals visually.
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4.3 ExperssCard/Bridge media/Smart card 4.3 4 Replacement Procedures ExperssCard/Bridge media/Smart card 4.3.1 ExpressCard Removing the ExpressCard To remove the ExpressCard, follow the steps below and refer to Figure 4-2. CAUTION: Insert or remove an ExpressCard in accordance with any instructions in the ExpressCard manual or the manuals of the computer system you are using. 1. Push the ExpressCard. It will pop out partly when you release, so pull out the card.
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4 Replacement Procedures 4.3 ExperssCard/Bridge media/Smart card 4.3.2 Bridge media (SD/SDHC memory card, miniSD/microSD Card, Memory Stick (PRO/PRO Duo), xD-PictureCard and MultiMediaCard) Removing the Bridge media To remove the Bridge media, follow the steps below and refer to Figure 4-3. CAUTION: Insert or remove a Bridge media in accordance with any instructions in each Bridge Media manual or the manuals of the computer system you are using. 1. Push the Bridge media.
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4.3 ExperssCard/Bridge media/Smart card 4 Replacement Procedures 4.3.3 Smart Card Removing the Smart Card To remove the Smart Card, follow the steps below and refer to Figure 4-4. CAUTION: Insert or remove a Smart Card in accordance with any instructions in the Smart Card manual or the manuals of the computer system you are using. 1. Grasp the Smart Card and remove it.
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4 Replacement Procedures 4.4 4.4 Memory module Memory module Removing the Memory module To remove the memory module, confirm that the computer is shut down. Then follow the steps below and refer to Figure 4-5 and 4-6. CAUTION: When removing the memory module, make sure the computer is powered off. Removing a memory module with the power on might damage the module or the computer itself. Do not touch the connectors on the memory module or on the computer.
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4.4 Memory module 4 Replacement Procedures 4. Open the left and right latches outside and remove the memory module(s).
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4 Replacement Procedures 4.4 Memory module Installing the Memory module To install the memory module, confirm that the computer is shut down. Then follow the steps below and refer to Figure 4-5 and 4-6. CAUTION: When installing the memory module, make sure the computer is powered off. Inserting a memory module with the power on might damage the module or the computer itself. Never press hard or bend a memory module. 1.
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4.5 Fin cover 4.5 4 Replacement Procedures Fin cover NOTE: When repairing the PC, turn up the plastic film and clean the cooling fin with a vacuum cleaner or other cleaning tool. Plastic film Do not use cotton sticks and tweezers to remove dusts. It may cause the cooling module problem or dusts stuffed. Removing the Fin cover To remove the fin cover, follow the steps below and refer to Figure 4-7. 1.
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4 Replacement Procedures 4.5 Fin cover Installing the Fin cover To install the fin cover, follow the steps below and refer to Figure 4-7. 1. Set the fin cover into the slot and slide it to engage the hook.
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4.6 SIM card 4.6 4 Replacement Procedures SIM card Removing the SIM card To remove the SIM card, follow the steps below and refer to Figure 4-8 to 4-10. 1. Loosen the screw fixing the SIM card cover. 2. Remove the SIM card cover.
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4 Replacement Procedures 4.6 SIM card 3. Slide the SIM card release latch in the direction as shown in the figure below. 4. Turn up the SIM card holder in the direction as shown in the figure below. SIM card holder SIM card release latch Figure 4-9 Removing the SIM card (1) 5. Remove the SIM card from the SIM card holder.
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4.6 SIM card 4 Replacement Procedures Installing the SIM card To install the SIM card, follow the steps below and refer to Figure 4-8 to 4-10. 1. Set the SIM card into the SIM card holder. 2. Lay the SIM card holder down and lock the SIM card release latch while sliding it in the opposite direction as shown in the figure 4-9. 3. Set the SIM card cover and secure it with the screw.
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4 Replacement Procedures 4.7 4.7 HDD HDD Removing the HDD To remove the HDD, follow the steps below and refer to Figure 4-11 to 4-13. CAUTION: Take care not to press on the top or bottom of a HDD. Pressure may cause the data loss or damage to the device. 1. Remove the following screw securing the HDD cover. • M2.5×5B FLAT HEAD screw ×1 2. Insert your finger into the slot and lift the HDD cover to remove. M2.
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4.7 HDD 4 Replacement Procedures 3. Remove the HDD assembly from the slot and disconnect it from the connector on the system board.
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4 Replacement Procedures 4.7 HDD 4. Remove the following screws and separate the HDD and HDD holder. • M3.0×4C FLAT HEAD screw ×4 HDD M3.0×4C FLAT HEAD M3.0×4C FLAT HEAD HDD Holder M3.
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4.7 HDD 4 Replacement Procedures Installing the HDD To install the HDD, follow the steps below and refer to Figure 4-11 to 4-13. 1. Set the HDD to the HDD Holder and secure them with the following screws. • M3.0×4C FLAT HEAD screw ×4 NOTE: When replacing the HDD holder with a new one, stick the HDD cushion to the HDD holder in place. HDD holder HDD cushion 2. Connect the HDD assembly to the connector on the system board. Lay the HDD assembly down into the slot. 3.
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4 Replacement Procedures 4.8 4.8 Keyboard Keyboard Removing the Keyboard To remove the keyboard, follow the steps below and refer to Figure 4-14 to 4-16. CAUTION: As the keytop may fall out, when handling the keyboard always hold it by the frame and do not touch the keytop. 1. Turn the computer face up. 2. Open the display and make it flat. 3. Insert your fingers into the slit on both sides and remove the KB holder.
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4.8 Keyboard 4 Replacement Procedures 4. Remove the following screws securing the keyboard. • M2.0×3C BIND screw ×2 Latch M2.0×3C BIND M2.
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4 Replacement Procedures 4.8 Keyboard 5. Lift the top edge of the keyboard while releasing the latches and turn the keyboard face down on the palm rest. 6. Disconnect the keyboard flexible cable from the connector CN3230 on the system board and remove the keyboard.
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4.8 Keyboard 4 Replacement Procedures Installing the Keyboard To install the keyboard, follow the steps below and refer to Figure 4-14 to 4-16. 1. Place the keyboard face down on the palm rest and connect the keyboard flexible cable to the connector CN3230 on the system board. 2. Turn the keyboard face up and set it in place. Extra portion of the keyboard cable must be put under the cover assembly. 3. Secure the keyboard with the following screws. • M2.0×3C BIND screw ×2 4.
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4 Replacement Procedures 4.9 4.9 Optical disk drive (DVD-ROM/DVD-Super Multi drive) Optical disk drive (DVD-ROM/DVD-Super Multi drive) Removing the Optical disk drive To remove the optical disk drive, follow the steps below and refer to Figure 4-17 to 4-19. CAUTION: When the optical disk inside the optical disk drive can not be ejected because of some failure, open the disc tray by inserting a slender object (about 15 mm) such as a straightened paper clip into the eject hole near the eject button.
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4.9 Optical disk drive (DVD-ROM/DVD-Super Multi drive) 4 Replacement Procedures 1. Close the display and turn over the computer. 2. Remove the following screw securing the optical disk drive assembly. • M2.5×5B FLAT HEAD screw ×1 M2.
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4 Replacement Procedures 4.9 Optical disk drive (DVD-ROM/DVD-Super Multi drive) 3. Turn the computer face up and open the display. 4. Remove the optical disk drive assembly from the slot while pushing it in the direction as shown in the figure below.
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4.9 Optical disk drive (DVD-ROM/DVD-Super Multi drive) 4 Replacement Procedures 5. Remove the following screws and ODD rear bracket from the optical disk drive. • M2.0×3C BIND screw ×2 ODD rear bracket Optical disk drive M2.
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4 Replacement Procedures 4.9 Optical disk drive (DVD-ROM/DVD-Super Multi drive) Installing the Optical disk drive To install the Optical disk drive, follow the steps below and refer to Figure 4-17 to 4-19. NOTE: When installing a new optical disk drive, set the ODD bezel to the optical disk drive while securing the latches. Optical disk drive ODD bezel 1. Set the ODD rear bracket to the optical disk drive and secure them with the following screws. • M2.0×3C BIND screw ×2 2.
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4.10 SW board 4 Replacement Procedures 4.10 SW board Removing the SW board To remove the SW board, follow the steps below and refer to Figure 4-20. 1. Turn up the insulator (LCD CONN INSULATOR) and disconnect the SW board FFC from the connector CN9500 on the system board. 2. Push down the hook and slide the SW board in the direction as shown in the figure below to remove it.
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4 Replacement Procedures 4.10 SW board Installing the SW board To install the SW board, follow the steps below and refer to Figure 4-20. 1. Slide the SW board into the guide to set it. 2. Turn up the insulator (LCD CONN INSULATOR) and connect the SW board FFC to the connector CN9500 on the system board. NOTE: Arrange the SW board FFC under the guide.
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4.11 Wireless LAN card 4 Replacement Procedures 4.11 Wireless LAN card Removing the Wireless LAN card To remove the wireless LAN card, follow the steps below and refer to Figure 4-21. 1. Disconnect the wireless LAN antenna cables from the wireless LAN card (white cable from “A” or “1”, black cable from “B” or “2” and gray cable from “C” or “3”) using an antenna coaxial cable disconnector. 2. Remove the following screws securing the wireless LAN card. • M2.0×3C BIND screw ×2 3.
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4 Replacement Procedures 4.11 Wireless LAN card Installing the Wireless LAN card To install the wireless LAN card, follow the steps below and refer to Figure 4-21. 1. Insert the wireless LAN card to the connector on the system board slantwise. 2. Push down the wireless LAN card and secure it with the following screws. • M2.0×3C BIND screw ×2 3.
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4.12 Cover assembly and Base assembly 4 4 Replacement Procedures Replacement Procedures 4.12 Cover assembly and Base assembly Removing the Cover assembly and Base assembly To remove the cover assembly and base assembly, follow the steps below and refer to Figure 4-22 to 4-26. 1. Close the display and turn over the computer. 2. Disconnect the 3G antenna cables and 3G power harness from the connectors on the jack/3G/Express board.
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4 Replacement Procedures 4.12 Cover assembly and Base assembly 3. Remove the following screws. • M2.5×8B FLAT HEAD screw ×11 (“8” in the figure below) • M2.5×12B FLAT HEAD screw ×1 (“12” in the figure below) • M2.
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4.12 Cover assembly and Base assembly 4 Replacement Procedures 4. Turn over the computer and open the display. 5. Turn up the insulator (LCD CONN INSULATOR) and disconnect the LCD harness from the connector CN5300 on the system board. 6. Disconnect the FS board FFC and camera harness from the connector CN9550 and CN9540 on the system board.
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4 Replacement Procedures 4.12 Cover assembly and Base assembly 7. Remove the following screws. • M2.5×8B FLAT HEAD screw ×5 • M2.5×12B FLAT HEAD screw ×3 M2.5x12B FLAT HEAD M2.5x8B FLAT HEAD M2.5x8B FLAT HEAD M2.5x12B FLAT HEAD M2.
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4.12 Cover assembly and Base assembly 4 Replacement Procedures 8. Separate the cover assembly and base assembly while releasing the latches. Cover assembly Base assembly Figure 4-26 Removing the cover assembly and base assembly (5) CAUTION: When separating the cover assembly and base assembly, lift the cover assembly up right above. Otherwise, the computer may be damaged.
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4 Replacement Procedures 4.12 Cover assembly and Base assembly Installing the Cover assembly and Base assembly To install the cover assembly and base assembly, follow the steps below and refer to Figure 4-22 to 4-26. 1. Place the cover assembly on the base assembly and secure them with the following screws. • M2.5×8B FLAT HEAD screw ×5 • M2.5×12B FLAT HEAD screw ×3 2. Turn up the insulator (LCD CONN INSULATOR) and connect the LCD harness to the connector CN5300 on the system board.
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4.12 Cover assembly and Base assembly 4 Replacement Procedures 4. Turn over the computer and secure the cover assembly and base assembly with the following screws. • M2.5×8B FLAT HEAD screw ×11 (“8” in the Figure 4-23) • M2.5×12B FLAT HEAD screw ×1 (“12” in the Figure 4-23) • M2.5×5B FLAT HEAD screw ×1 (“5” in the Figure 4-23) 5. Connect the 3G antenna cables and 3G power harness to the connectors on the jack/3G/Express board.
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4 Replacement Procedures 4.13 MDC/USB board 4.13 MDC/USB board Removing the MDC/USB board To remove the MDC/USB board, follow the steps below and refer to Figure 4-27 to 4-29. MDC model 1. Take out the RJ11 harness from the slot of the base assembly. 2. Remove the following screws securing the MDC/USB board. • M2.5×6C Tapping screw ×2 3. Disconnect the modem/USB harness from the connector CN9770 on the MDC/USB board and connector CN9570 on the system board. 4.
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4.13 MDC/USB board 4 Replacement Procedures M2.
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4 Replacement Procedures 4.13 MDC/USB board 6. Remove the following screws and disconnect the MDC module from the connector CN3010 on the MDC/USB board. • M2.0×3C BIND screw ×2 M2.
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4.13 MDC/USB board 4 Replacement Procedures USB model 1. Remove the following screw securing the USB board. • M2.5×6C Tapping screw ×1 2. Peel off the acetate tape. 3. Disconnect the USB harness from the connector CN9770 on the USB board and connector CN9570 on the system board. M2.
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4 Replacement Procedures 4.13 MDC/USB board Installing the MDC/USB board To install the MDC/USB board, follow the steps below and refer to Figure 4-27 to 4-29. MDC model 1. Connect the MDC module to the connector CN3010 on the MDC/USB board. 2. Secure the MDC module with the following screws. • M2.0×3C BIND screw ×2 3. Connect the RJ11 harness to the connector on the MDC/USB board. 4. Connect the modem/USB harness to the connector CN9770 on the MDC/USB board and connector CN9570 on the system board.
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4.14 RTC battery 4 Replacement Procedures 4.14 RTC battery CAUTION: Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the laws and ordinances of your local authority. Removing the RTC battery To remove the RTC battery, follow the steps below and refer to Figure 4-30. 1. Peel off the acetate tape. 2. Disconnect the RTC battery harness from the connector CN9300 on the system board. 3. Open the insulator (RTC BATT INSULATOR) and take out the RTC battery.
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4 Replacement Procedures 4.14 RTC battery Installing the RTC battery To install the RTC battery, follow the steps below and refer to Figure 4-30. 1. Open the insulator (RTC BATT INSULATOR) and set the RTC battery in place. 2. Close the insulator (RTC BATT INSULATOR) to fix the RTC battery. 3. Connect the RTC battery harness to the connector CN9300 on the system board. 4. Stick the acetate tape in place.
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4.15 Bluetooth module 4 Replacement Procedures 4.15 Bluetooth module Removing the Bluetooth module To remove the Bluetooth module, follow the steps below and refer to Figure 4-31. 1. Disconnect the Bluetooth harness from the connector CN4440 on the system board. 2. Open the latches and remove the Bluetooth module from the guides. 3. Disconnect the Bluetooth harness from the connector on the Bluetooth module.
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4 Replacement Procedures 4.15 Bluetooth module Installing the Bluetooth module To install the Bluetooth module, follow the steps below and refer to Figure 4-31. 1. Connect the Bluetooth harness to the connector on the Bluetooth module. 2. Set the Bluetooth module under the guides and engage the latches. 3. Connect the Bluetooth harness to the connector CN4440 on the system board.
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4.16 Smart card slot 4 Replacement Procedures 4.16 Smart card slot Removing the Smart card slot To remove the smart card slot, follow the steps below and refer to Figure 4-32. 1. Disconnect the smart card FPC from the connector CN2170 on the system board. 2. Lift up the hook of the smart card slot in the direction as shown in the figure below to remove the smart card slot from the guides.
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4 Replacement Procedures 4.16 Smart card slot Installing the Smart card slot To install the smart card slot, follow the steps below and refer to Figure 4-32. 1. Slide the smart card slot under the guides until the hook is engaged. 2. Connect the smart card FPC to the connector CN2170 on the system board.
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4.17 Jack/3G/Express board/Microphone/3G card 4 Replacement Procedures 4.17 Jack/3G/Express board/Microphone/3G card Removing the Jack/3G/Express board/Microphone/3G card To remove the jack/3G/Express board/Microphone/3G card, follow the steps below and refer to Figure 4-33 to 4-35. 1. Disconnect the jack/3G/Express board FPC from the connector CN9530 on the system board. 2. Disconnect the speaker harness from the connector CN6150 on the jack/3G/Express board. 3.
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4 Replacement Procedures 4.17 Jack/3G/Express board/Microphone/3G card 4. Take out the microphone from the slot of the base assembly. 5. Remove the jack/3G/Express board (with the microphone). 6. Disconnect the jack/3G/Express board FPC from the connector CN9630 on the jack/3G/Express board. 7. Disconnect the microphone harness from the connector CN6070 on the jack/3G/Express board.
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4.17 Jack/3G/Express board/Microphone/3G card 4 Replacement Procedures 8. Turn over the jack/3G/Express board. 9. Remove the following screws securing the 3G card. • M2.0×3C BIND screw ×2 10. Disconnect the 3G card from the connector on the jack/3G/Express board. M2.
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4 Replacement Procedures 4.17 Jack/3G/Express board/Microphone/3G card Installing the Jack/3G/Express board/Microphone/3G card To install the jack/3G/Express board/microphone/3G card, follow the steps below and refer to Figure 4-33 to 4-35. 1. Insert the 3G card to the connector on the jack/3G/Express board slantwise. 2. Push down the 3G card and secure it with the following screws. • M2.0×3C BIND screw ×2 3. Connect the microphone harness to the connector CN6070 on the jack/3G/Express board. 4.
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4.17 Jack/3G/Express board/Microphone/3G card 4 Replacement Procedures 9. Secure the jack/3G/Express board with the following screw. • M2.
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4 Replacement Procedures 4.18 RGB/USB board 4.18 RGB/USB board Removing the RGB/USB board To remove the RGB/USB board, follow the steps below and refer to Figure 4-36 and 4-37. 1. Disconnect the RGB harness from the connector CN9611 on the RGB/USB board. 2. Remove the following screw securing the RGB/USB board. • M2.5×6C Tapping screw ×1 M2.
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4.18 RGB/USB board 4 Replacement Procedures 3. Take out the DC-IN harness from the slot of the base assembly. 4. Take out the RGB/USB board from the slot of the base assembly. (USB harness is still connected to the back of the RGB/USB board.) 5. Disconnect the USB harness from the connector CN9610 on the RGB/USB board.
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4 Replacement Procedures 4.18 RGB/USB board Installing the RGB/USB board To install the RGB/USB board, follow the steps below and refer to Figure 4-36 and 4-37. 1. Connect the USB harness to the connector CN9610 on the RGB/USB board and arrange the harness in place. 2. Set the RGB/USB board to the slot of the base assembly. 3. Set the DC-IN harness to the slot of the base assembly. 4. Secure the RGB/USB board with the following screw. • M2.5×6C Tapping screw ×1 5.
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4.19 System board 4 Replacement Procedures 4.19 System board CAUTION: When replacing with a new system board, the following procedures must be executed. (1) Before replacing the system board, execute subtest02 “DMI ggginformation save” in 3.3 Setting of the hardware configuration of gggChapter 3 Test program in order to save the DMI information from gggsystem board to floppy disk.
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4 Replacement Procedures 4.19 System board Removing the System board To remove the system board, follow the steps below and refer to Figure 4-38 and 4-39. 1. Take out the RJ45 harness from the slot of the base assembly. 2. Peel off the insulator (SQUARE INSULATOR). 3. Remove the following screws securing the system board. • M2.5×6C Tapping screw ×2 4. Remove the system board from the base assembly. CAUTION: When removing the system board, lift up the right side of the system board first. M2.
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4.19 System board 4 Replacement Procedures 5. Disconnect the RGB harness from the connector CN9511 on the system board. 6. Turn up the insulator (HNS HOLD RJ INSULATOR) and disconnect the RJ45 harness from the connector CN4050 on the system board. 7. Peel off the insulators (SQUARE INSULATOR) and disconnect the USB harness from the connector CN9510 on system board. NOTE: Do not reuse the removed SQUARE INSULATOR. Be sure to use a new SQUARE INSULATOR. 8.
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4 Replacement Procedures 4.19 System board Installing the System board To install the system board, follow the steps below and refer to Figure 4-38 and 4-39. 1. Connect the 3G power harness to the connector CN9531 on the back of the system board. 2. Connect the USB harness to the connector CN9510 on system board. 3. Arrange the USB harness on the DC fan and stick new insulators (SQUARE INSULATOR) in place. NOTE: Stick new SQUARE INSULATORS as shown in the figure below.
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4.19 System board 4 Replacement Procedures 4. Turn up the insulator (HNS HOLD RJ INSULATOR) and connect the RJ45 harness to the connector CN4050 on the system board. NOTE: When replacing a system board with a new one, stick the HNS HOLD RJ INSULATOR in place. 5. Connect the RGB harness to the connector CN9511 on the system board. 6. Turn over the system board.
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4 Replacement Procedures 4.19 System board 7. Set the system board into the base assembly in place and secure them with the following screws. • M2.5×6C Tapping screw ×2 NOTE: When installing the system board to the base assembly, do not pinch the harnesses. After instilling the system board, make sure that the WL SW knob moves properly. Set the system board as shown in the figure below. 8. Stick the insulator (SQUARE INSULATOR) in place. 9.
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4.20 CPU/Fin/DC fan 4 Replacement Procedures 4.20 CPU/Fin/DC fan Removing the CPU/Fin/DC fan To remove the CPU/fin/DC fan, follow the steps below and refer to Figure 4-40 to 4-42. 1. Disconnect the fan harness from the connector CN3380 on the system board. 2. Remove the following screws and fin (with the DC fan). • M2.0×4B BIND screw ×8 NOTE: When removing the fin, be sure to remove the screws in the reverse order of the number marked on the fin. 3.
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4 Replacement Procedures 4.20 CPU/Fin/DC fan M2.0x4B BIND M2.0x4B BIND M2.
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4.20 CPU/Fin/DC fan 4 Replacement Procedures 4. Remove the fan hood. 5. Remove the following screws and separate the DC fan and fin. • M2.0×3C BIND screw ×2 M2.
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4 Replacement Procedures 4.20 CPU/Fin/DC fan 6. Unlock the CPU by turning the cam counterclockwise on the CPU socket by 180 degrees with a flat-blade screwdriver. 7. Remove the CPU. Cam CPU Figure 4-42 Removing the CPU CAUTION: When removing the CPU, lift it up right above. Otherwise, pins of the CPU may be damaged.
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4.20 CPU/Fin/DC fan 4 Replacement Procedures Installing the CPU/fin/DC fan To install the CPU/fin/DC fan, follow the steps below and refer to Figure 4-40 to 4-44. 1. Make sure that the cam of the CPU socket is in the unlock (OPEN) position. 2. Set the CPU to the correct position in the CPU socket. Make sure the position of the CPU (triangle mark) is correct to avoid damaging pins on the CPU. NOTE: When replacing the CPU with a new one, stick the insulator (SQUARE INSULATOR) to the CPU in place. 3.
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4 Replacement Procedures 4.20 CPU/Fin/DC fan 4. When silicon grease is already applied to the CPU, wipe them off with a cloth in advance. 5. Apply new grease (Shin-Etsu Chemical Co. X-23-7921-5) on the CPU using a special syringe as shown in the following figure. Apply quarter of scale (0.25ml) of grease evenly on the CPU chip. Grease CPU Figure 4-44 Applying new grease 6. If there are already cool sheets on the VGA, ICs or fin remove the cool sheet. Stick new cool sheets on the system board in place.
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4.20 CPU/Fin/DC fan 4 Replacement Procedures 10. Set the fin (with the DC fan) in place and secure it with the following screws. • M2.0×4B BIND screw ×8 NOTE: When securing the fin, be sure to secure the screws in the order of the number marked on the fin. In models without a VGA, make sure that the gum sheet VGA is set on the system board in place. 11. Connect the fan harness to the connector CN3380 on the system board.
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4 Replacement Procedures 4.21 Speaker 4.21 Speaker Removing the Speaker To remove the speaker, follow the steps below and refer to Figure 4-45. 1. Peel off the acetate tapes. 2. Remove the speakers (left and right) from the speaker slots and the speaker harness from the guides.
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4.21 Speaker 4 Replacement Procedures Installing the Speaker To install the speaker, follow the steps below and refer to Figure 4-45. 1. Set the speakers (left and right) into the speaker slots. NOTE: Set the speakers into the speaker slots in correct direction. 2. Arrange the speaker harness into the guides. 3. Stick the acetate tapes in place.
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4 Replacement Procedures 4.21 Speaker NOTE: When replacing a base assembly with a new one, set the following parts as shown in the figure below. LED lens 2P (Stick the BLIND2P INSULATOR on the LED lens 2P.
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4.
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4 Replacement Procedures 4 4.22 Touch pad/Fingerprint sensor board Replacement Procedures 4.22 Touch pad/Fingerprint sensor board Removing the Touch pad/Fingerprint sensor board To remove the touch pad/fingerprint sensor board, follow the steps below and refer to Figure 4-46 to 4-50. 1. Peel off the acetate tapes. 2. Disconnect the FS board FFC and touch pad button FFC from the connectors CN3240 and CN9650 on the fingerprint sensor board. 3.
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4.22 Touch pad/Fingerprint sensor board 4 Replacement Procedures 4. Turn up the insulator (TPAD LOW INSULATOR) and remove the following screws. • M2.0×3C S-THIN HEAD screw ×4 5. Remove the touch pad plate (with the fingerprint sensor board). M2.0x3C S-THIN HEAD M2.
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4 Replacement Procedures 4.22 Touch pad/Fingerprint sensor board 6. Remove the following screws and separate the fingerprint sensor board and touch pad plate. • M2.0×3C S-THIN HEAD screw ×2 M2.0x3C S-THIN HEAD Fingerprint sensor board M2.
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4.22 Touch pad/Fingerprint sensor board 4 Replacement Procedures 7. Remove the following screws and pad button. • M2.0×3C S-THIN HEAD screw ×2 M2.
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4 Replacement Procedures 4.22 Touch pad/Fingerprint sensor board 8. Peel off the touch pad. NOTE: Do not reuse the removed touch pad. Be sure to use a new touch pad. Touch pad Figure 4-50 Removing the touch pad (4) Please prepare required parts in advance, when replacing the following item.
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4.22 Touch pad/Fingerprint sensor board 4 Replacement Procedures Installing the Touch pad/Fingerprint sensor board To install the touch pad/fingerprint sensor board, follow the steps below and refer to Figure 4-46 to 4-50. 1. Stick a new touch pad in place. 2. Set the pad button on the touch pad and secure it with the following screws. • M2.0×3C S-THIN HEAD screw ×2 3. Set the fingerprint sensor board to the touch pad plate and secure them with the following screws. • M2.
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4 Replacement Procedures 4.22 Touch pad/Fingerprint sensor board 4. Set the touch pad plate (with the fingerprint sensor board) in place. NOTE: When replacing the touch pad plate with a new one, stick the insulator (TPAD LOW INSULATOR) to the touch pad plate in place. TPAD LOW INSULATOR 5. Connect the dual button FFC to the connector on the touch pad. 6. Connect the FS board FFC and touch pad button FFC to the connector CN3240 and CN9650 on the fingerprint sensor board. 7.
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4.23 LCD unit 4 Replacement Procedures 4.23 LCD unit Removing the LCD unit To remove the LCD unit, follow the steps below and refer to Figure 4-51 to 4-57. 1. Peel off the insulators (SQUARE INSULATOR and HNS 3G INSULATOR). NOTE: Do not reuse the removed SQUARE INSULATOR. Be sure to use a new SQUARE INSULATOR. 2. Release the 3G antenna cables from the guides and take them out from the hole of the cover assembly.
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4 Replacement Procedures 4.23 LCD unit 3. Turn over the cover assembly and open the display. 4. Release the LCD harness, camera harness, wireless LAN antenna cables and 3G antenna cables from the guides.
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4.23 LCD unit 4 Replacement Procedures 5. Remove the following screws and separate the LCD assembly and cover assembly. • M2.5×5B ×4 FLAT HEAD screw M2.5x5B FLAT HEAD LCD assembly M2.
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4 Replacement Procedures 4.23 LCD unit 6. Peel off the LCD mask cushions and remove the following screws. • M2.5×5B FLAT HEAD screw ×2 7. Make the brake hinge R flat and remove the LCD mask while releasing the latches. NOTE: Release the latches from the outside of the LCD mask. Release the latches in the order of the number on the Figure 4-54. LCD mask M2.5x5B FLAT HEAD LCD mask cushion Brake hinge R LCD mask cushion M2.
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4.23 LCD unit 4 Replacement Procedures 8. Peel off the acetate tape. 9. Release the harnesses. 10. Turn the brake hinge 90 degrees. 11. Remove the following screws and stand the LCD unit. Be careful that the LCD harness is connected to the connector on the back of the LCD unit. • M2.5×5B FLAT HEAD screw LCD unit ×4 M2.5x5B FLAT HEAD Acetate tape Brake hinge R M2.5x5B FLAT HEAD M2.
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4 Replacement Procedures 4.23 LCD unit 12. Peel the pull tape, and disconnect the LCD harness from the connector on the LCD unit.
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4.23 LCD unit 4 Replacement Procedures 13. Remove the following screws and separate the LCD unit and Brake hinges. • M2.0×3C BIND screw ×4 Brake hinge R M2.0x3C BIND Brake hinge L LCD unit M2.
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4 Replacement Procedures 4.23 LCD unit Installing the LCD unit To install the LCD unit, follow the steps below and refer to Figure 4-51 to 4-57. 1. Set the brake hinges to the LCD unit and secure them with the following screws. • M2.0×3C BIND screw ×4 NOTE: When replacing the brake hinge R with a new one, stick the hinge cover to the brake hinge R in place. 2. Connect the LCD harness to the connector on the LCD unit and secure it with the pull tape. 3. Turn the brake hinge R 90 degrees. 4.
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4.23 LCD unit 4 Replacement Procedures 5. Arrange the harness under the guides of the LCD cover. NOTE: Arrange the LCD harness as shown in the figure below.
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4 Replacement Procedures 4.23 LCD unit 6. Stick the acetate tape in place. NOTE: Stick the acetate tape as shown in the figure below.
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4.23 LCD unit 4 Replacement Procedures 7. Make the brake hinge R flat. 8. Set the LCD mask to the LCD assembly while engaging the latches. NOTE: When setting the LCD mask, be careful not to pinch the harnesses. Do not pinch the harnesses. Do not pinch the harnesses. 9. Secure the LCD mask with the following screws. • M2.5×5B FLAT HEAD screw ×2 10. Stick the LCD mask cushions in place. NOTE: When replacing the LCD mask with a new one, stick the camera panel in place. 11.
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4 Replacement Procedures 4.23 LCD unit 12. Arrange the LCD harness, camera harness, wireless LAN antenna cables and 3G antenna cables to the guides of the cover assembly. NOTE: Arrange the harnesses as shown in the figure below.
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4.23 LCD unit 4 Replacement Procedures 13. Close the display and turn over the cover assembly. 14. Pass the 3G antenna cables through the hole of the cover assembly. 15. Arrange the 3G antenna cables under the guides. 16. Stick the insulators (SQUARE INSULATOR and HNS 3G INSULATOR) in place.
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4 Replacement Procedures 4.24 Camera module/Wireless LAN antenna/3G antenna 4.24 Camera module/Wireless LAN antenna/3G antenna Removing the Camera module/Wireless LAN antenna/3G antenna To remove the camera module/wireless LAN antenna/3G antenna, follow the steps below and refer to Figure 4-58 and 4-59. 1. Disconnect the camera harness from the connector on the camera module. 2. Remove the camera module from the slot of the LCD cover.
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4.24 Camera module/Wireless LAN antenna/3G antenna 4 Replacement Procedures 3. Peel off the wireless LAN antennas, 3G antennas and camera harness from the LCD cover. NOTE: Do not reuse the removed wireless LAN antennas and 3G antennas. Be sure to use new wireless LAN antenna or 3G antenna.
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4 Replacement Procedures 4.24 Camera module/Wireless LAN antenna/3G antenna Installing the Camera module/Wireless LAN antenna/3G antenna To install the camera module/wireless LAN antenna/3G antenna, follow the steps below and refer to Figure 4-58 and 4-59. 1. Stick new wireless LAN antennas in place. 2. Arrange the wireless LAN antenna cables in place. 3. Stick new 3G antennas in place. 4. Arrange the 3G antenna cables in place.
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4.24 Camera module/Wireless LAN antenna/3G antenna 4 Replacement Procedures 5. Peel off a protection sheet from a new camera module. CAUTION: Peel off the protection sheet with care of the followings: 6. Stick the camera cushion and square cushion on the LCD mask. NOTE: Stick the camera cushion and square cushion as shown in the figure below. 7. Connect the camera harness to the connector on the camera module and set the camera module to the slot of the LCD cover. 8. Arrange the camera harness in place.
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4 Replacement Procedures 4.
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4.
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4 Replacement Procedures 4.
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Appendices [CONFIDENTIAL]
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Appendices App-ii [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (XXX-XXX)
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Appendices Appendix Contents Appendix A Handling the LCD Module ...........................................................................A-1 Appendix B Board Layout .................................................................................................B-1 B.1 System board (FGQSY*/FGWSY*) Front View...................................................B-1 B.2 System board (FGQSY*/FGWSY*) Back View ...................................................B-3 B.
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Appendices C.18 CN5690 Displayport interface connector (20-pin) .............................................C-17 C.19 IS2140 MEDIA BRIDGE interface connector (45-pin) .....................................C-18 C.20 CN9300 RTCVCC interface connector (3-pin) ..................................................C-19 C.21 CN9500 P-SW interface connector (8-pin).........................................................C-19 C.22 CN9530 FGQJK*/FGWJK* board interface connector (40-pin) .......................
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Appendices C.40 IS2520 EXPRESS CARD interface connector (40-pin).....................................C-33 C.41 CN6150 Speaker interface connector (4-pin) .....................................................C-34 C.42 CN6070 Int-Mic interface connector (2-pin)......................................................C-34 C.43 J6051 Microphone connector (6-pin) .................................................................C-34 C.44 J6310 Headphone connector (6-pin)....................................
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Appendices Figures Figure B-1 System board (FGQSY*/FGWSY* layout (front).............................................B-1 Figure B-2 System board (FGQFS*/FGWSY*) layout (back) ...........................................B-3 Figure B-3 USB/RGB board (FGQRG */ FGWRG * layout (front/back) ...........................B-5 Figure B-4 Finger/Touch Pad Button board (FGQFS*/FGWFS*) layout (front/back) ......B-6 Figure B-5 USB board (FGQUS*/ FGWUS* layout (front/back) ......................................
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Appendices Table C-11 CN9510 USB relay interface connector (6-pin).............................................C-14 Table C-12 CN4440 Bluetooth interface connector (7-pin).............................................C-14 Table C-13 CN5300 LCD interface connector (40-pin) ..................................................C-15 Table C-14 CN3380 FAN interface connector (4-pin).....................................................C-16 Table C-15 CN8800 DC-IN connector (4-pin) ...................................
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Appendices Table C-35 CN4630 USB interface connector (4-pin)......................................................C-28 Table C-36 CN3010 MDC module interface connector (12-pin) ....................................C-29 JACK/3G/Express board (FGQJK*/FGWJK*) Table C-37 CN9630 System board interface connector (76-pin)......................................C-30 Table C-38 CN2610 PCI-E Mini(3G) CARD interface connector (52-pin) ....................C-32 Table C-39 IS2620 SIM board interface connector (7-pin) .....
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Appendix A Handling the LCD Module Appendices Appendix A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
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Appendices Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4.
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Appendix A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
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Appendices Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
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Appendix A Handling the LCD Module Appendices 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxide). These materials can release gas that can damage the panel’s polarization.
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Appendices A-6 Appendix A Handling the LCD Module [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813 )
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Appendix B Board Layout Appendices Appendix B Board Layout B.
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Appendices Appendix B Board Layout Table B-1 System board (FGQSY*/FGWSY*) connectors and ICs (front) Number B-2 Name CN2170 Smart Card interface connector CN2600 PCI-E MINI CARD interface connector CN3110 It is debugging port for development only CN3230 KB interface connector CN4440 Bluetooth interface connector CN5300 LCD interface connector CN9540 WebCam interface connector CN9300 RTCVCC interface connector CN9500 P-SW interface connector CN9530 FGQJK*/ FGWJK* board interface conne
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Appendix B Board Layout B.
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Appendices Appendix B Board Layout Table B-2 System board (FGQSY*/FGWSY*) connectors and ICs (back) Number B-4 Name CN1400 Memory A connector CN1410 Memory B connector CN1900 SATA HDD interface connector CN1950 SATA ODD interface connector CN1970 eSATA/USB interface connector CN2300 DOCKING interface connector CN4050 LAN interface connector CN3380 FAN interface connector CN5690 Displayport interface connector CN8800 DC-IN interface connector CN8810 Battery connector CN9510 USB re
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Appendix B Board Layout Appendices B.
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Appendices B.
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Appendix B Board Layout B.
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Appendices B.
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Appendix B Board Layout B.
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Appendices Appendix B Board Layout Table B-7 JACK/3G/Express board (FGQJK*/ FGWJK*) connector (front/back) Number B-10 Name CN2610 3G card interface connector (Not used) CN9631 Speaker interface connector CN6070 Int-Mic interface connector IS2620 SIM board interface connector(Not used) IS2520 EXPRESSCARD interface connector J6051 Microphone connector J6310 Headphone connector CN9630 System board interface connector [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (
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Appendix C Pin Assignments Appendices Appendix C Pin Assignments System board (FGQSY*/FGWSY*) C.1 CN1400 Memory A connector(200-pin) Table C- 1 Memory A connector (200-pin) (1/3) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments Table C-1 Memory A connector (200-pin) (2/3) Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices Table C-1 Memory A connector (200-pin) (3/3) Pin No. Signal Name Pin No.
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Appendices C.2 Appendix C Pin Assignments CN1410 Memory B connector (200-pin) Table C- 2 Memory B connector (200-pin) (1/3) Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices Table C-2 Memory B connector (200-pin) (2/3) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments Table C-2 Memory B connector (200-pin) (3/3) Pin No. Signal Name Pin No.
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Appendix C Pin Assignments C.3 Appendices CN1900 SATA HDD interface connector (20-pin) Table C- 3 SATA HDD interface connector (20-pin) C.4 Pin No. Signal Name Pin No. Signal Name S1 GND S2 ZSTTHD-P1P S3 ZSTTHD-P1N S4 GND S5 ZSTRHD-P1N S6 ZSTRHD-P1P S7 GND P1 NC P2 NC P3 NC P4 GND P5 GND P6 GND P7 P5V P8 P5V P9 P5V P10 GND P11 GND(W1900) P12 GND P13 NC P14 NC P15 NC C.
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Appendices C.5 Appendix C Pin Assignments CN1970 eSATA/USB interface connector (20-pin) Table C- 5 eSATA/USB interface connector (20-pin) C.6 Pin No. Signal Name Pin No. Signal Name P1 USB1PS-E5V P2 ZUSBC8-E3N P3 ZUSBC8-E3P P4 GND P5 GND P6 ZSTTES-P1P P7 ZSTTES-P1N P8 GND P9 ZSTRES-P1N P10 ZSTRES-P1P P11 GND 1T GND 2T GND 3T GND 4T GND CN2170 Smart Card interface connector (10-pin) Table C- 6 Smart Card interface connector (10-pin) Pin No. Signal Name Pin No.
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Appendix C Pin Assignments C.7 Appendices CN2300 DOCKING interface connector (140-pin) Table C- 7 DOCKING interface connector (140-pin) (1/3) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments Table C-7 DOCKING interface connector (140-pin) (2/3) Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices Table C-7 DOCKING interface connector (140-pin) (3/3) Pin No. Signal Name Pin No.
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Appendices C.8 Appendix C Pin Assignments CN2600 PCI-E Mini CARD interface connector (52-pin) Table C- 8 PCI-E Mini CARD interface connector (52-pin) Pin No. Signal Name Pin No.
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Appendix C Pin Assignments C.9 Appendices CN3230 Keyboard interface connector (34-pin) Table C- 9 Keyboard interface connector (34-pin) Pin No. Signal Name Pin No.
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Appendices C.11 Appendix C Pin Assignments CN9510 USB relay interface connector (6-pin) Table C- 11 USB relay interface connector (6-pin) Pin No. Signal Name Pin No. Signal Name 1 3 USB0PS-E5V ZUSBP2-E3P 2 4 USB0PS-E5V ZUSBP2-E3P 5 GND 6 GND 1T GND 2T GND C.12 CN4440 Bluetooth interface connector (7-pin) Table C- 12 Bluetooth2 interface connector (7-pin) Pin No. Signal Name Pin No.
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Appendix C Pin Assignments C.13 Appendices CN5300 LCD interface connector (40-pin) Table C- 13 LCD interface connector (40-pin) Pin No. Signal Name Pin No.
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Appendices C.14 Appendix C Pin Assignments CN3380 FAN interface connector (4-pin) Table C- 14 FAN interface connector (4-pin) Pin No. Signal Name Pin No. Signal Name 1 P5V 2 3 GND GND 4 FANG0-P3P FPWM0-S3P 2T GND 1T C.15 CN8800 DC-IN connector (4-pin) Table C- 15 DC-IN connector (4-pin) Pin No. Signal Name Pin No.
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Appendix C Pin Assignments C.16 Appendices CN8810 Battery connector (10-pin) Table C- 16 Battery connector (10-pin) Pin No. Signal Name Pin No. Signal Name 1 Q8811-1pin 2 3 4 5 Q8811-4pin PSCL-S5P BTMP1 M5V 6 PSDA-S5P 7 GND 8 DBT1OV-S5N 9 GND 10 GND C.17 CN9540 WebCam interface connector (6-pin) Table C- 17 WebCam interface connector (6-pin) Pin No. Signal Name P5V Pin No. 1 2 Signal Name ZUSBCM-E3N 3 ZUSBCM-E3P 4 GND 5 GND 6 CAMDET-P3N C.
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Appendices C.19 Appendix C Pin Assignments IS2140 MEDIA BRIDGE interface connector (45-pin) Table C- 19 MEDIA BRIDGE interface connector (45-pin) Pin No. Signal Name Pin No.
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Appendix C Pin Assignments C.20 Appendices CN9300 RTCVCC interface connector (3-pin) Table C- 20 RTCVCC interface connector (3-pin) Pin No. Signal Name Pin No. Signal Name 1 R3V 2 NC 3 GND 1T GND 2T GND C.21 CN9500 P-SW interface connector (8-pin) Table C- 21 P-SW interface connector connector (8-pin) Pin No. Signal Name Pin No.
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Appendices C.22 pin) Appendix C Pin Assignments CN9530 FGQJK*/FGWJK* board interface connector (40Table C- 22 FGQJK*/FGWJK* board interface connector (40-pin) Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices 71 ZETCRD-P1P 72 GND 73 GND 74 ATBEEP-P3P 75 SNDMUT-S3N 76 GND 1T GND 2T GND TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] C-21
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Appendices C.23 pin) Appendix C Pin Assignments CN9550 FGQFS*/ FGWFS* board interface connector (14Table C- 23 FGQFS*/ FGWFS* board interface connector (14-pin) Pin No. Signal Name Pin No. Signal Name 1 2 3 GND SPY-PXP 4 SP-GND SPX-PXP 5 SP-P5V 6 P5V 7 IPDCLK-P5P 8 IPDDAT-P5P 9 GND 10 ZUSBFS-E3P 11 ZUSBFS-E3N 12 GND 13 FGSPON-S3N 14 P3V 1T GND 2T GND C.
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Appendix C Pin Assignments Appendices C.25 CN9570 FGQUS*/FGWUS*/FGVMD* board interface connector (20-pin) Table C- 25 FGQUS*/FGWUS*/FGVMD* board interface connector (20-pin) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments USB/RGB board (FGQRG*/ FGWRG*) C.26 CN9611 System board interface connector (20-pin) Table C- 26 System board interface connector (20-pin) Pin No. Signal Name Pin No. Signal Name 1 2 P5V 3 P5V P5V 4 NVASDA-P5P 5 NVASCL-P5P 6 GND 7 GND 8 GND 9 GND 10 MVSYNC-P3P 11 GND 12 MHSYNC-P3P 13 GND 14 GND 15 NVABLU-PXP 16 GND 17 NVAGRN-PXP 18 GND 19 NVARED-PXP 20 GND 1T GND 2T GND 3T GND 4T GND C.
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Appendix C Pin Assignments C.29 Appendices CN5320 RGB interface connector (15-pin) Table C- 29 RGB interface connector (15-pin) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments Finger/Touch Pad Button board (FHGQS*/FGWFS*) C.30 CN3240 Touch Pad interface connector (12-pin) Table C- 30 Dual point interface connector (12-pin) Pin No. Signal Name Pin No. Signal Name 1 GND 2 TPBTNL-P5N 3 TPBTNR-P5N 4 NC 5 SP-P5V 6 SPX-PXP 7 SPY-PXP 8 SP-GND 9 GND 10 IPDCLK-P5P 11 IPDDAT-P5P 12 P5V 1T GND 2T GND C.31 CN9650 System board interface connector (14-pin) Table C- 31 System board interface connector (14-pin) Pin No.
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Appendix C Pin Assignments Appendices USB board (FGQUS*/FGWUS*) C.32 CN9670 System board interface connector (10-pin) Table C- 32 System board interface connector (10-pin) Pin No. Signal Name Pin No. Signal Name 1 GND 2 GND 3 GND 4 ZUSBP1-E3N 5 ZUSBP1-E3P 6 USB0PS-E5V 7 USB0PS-E5V C.33 - CN4620 USB interface connector (4-pin) Table C- 33 USB interface connector (4-pin) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments Modem/USB board (FGQUS*/FGWUS*) C.34 CN9770 System board interface connector (20-pin) Table C- 34 System board interface connector (20-pin) Pin No. Signal Name Pin No. Signal Name 1 GND 2 GND 3 ZUSBP1-E3N 4 GND 5 6 NC 7 ZUSBP1-E3P USB0PS-E5V 8 USB0PS-E5V 9 NC 10 GND 11 AZSDO1-E3P 12 AZSYC1-E3P 13 GND 14 MZSDI1-E3P 15 AZRST1-E3N 16 GND 17 XAZBC1-E3P 18 GND 19 E3V 20 E3V 1T GND 2T GND C.
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Appendix C Pin Assignments C.36 Appendices CN3010 MDC module interface connector (12-pin) Table C- 36 MDC interface connector (12-pin) Pin No. Signal Name Pin No.
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Appendices Appendix C Pin Assignments JACK/3G/Express board (FGQJK*/FGWJK*) C.37 CN9630 System board interface connector (76-pin) Table C- 37 System board interface connector (-pin) Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices 71 ZUSB3G-E3N 72 GND 73 GND 74 TMP3G-SXP 75 TMP3G-GND 76 GND 1T GND 2T GND TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] C-31
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Appendices C.38 Appendix C Pin Assignments CN2610 PCI-E Mini(3G) CARD interface connector (52-pin) Table C- 38 PCI-E Mini(3G) CARD interface connector (52-pin) Pin No. Signal Name Pin No.
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Appendix C Pin Assignments C.39 Appendices IS2620 SIM board interface connector (7-pin) Table C- 39 SIM board interface connector (10-pin) Pin No. Signal Name Pin No. Signal Name 1 UIMPWR-E3V 2 UIRSTL-E3P 3 UICLKL-E3P 4 - 5 GND 6 NC 7 UIDATL-E3P C.40 IS2520 EXPRESS CARD interface connector (40-pin) Table C- 40 EXPRESS CARD interface connector (26-pin) Pin No. Signal Name Pin No.
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Appendices C.41 Appendix C Pin Assignments CN6150 Speaker interface connector (4-pin) Table C- 41 Speaker interface connector (4-pin) Pin No. Signal Name Pin No. Signal Name 1 SPOTL-PXN SPOTR-PXP 2 SPOTL-PXP SPOTR-PXN 3 C.42 4 CN6070 Int-Mic interface connector (2-pin) Table C- 42 Int-Mic interface connector (2-pin) Pin No. Signal Name Pin No. Signal Name 1 IMICIN-PXP 2 GND C.43 J6051 Microphone connector (6-pin) Table C- 43 Microphone connector (6-pin) Pin No. Signal Name Pin No.
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Appendix D Keyboard Scan/Character Codes Appendices Appendix. D Appendix D Keyboard Scan/Character Codes D.1 Scan Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap No.
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Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) D-2 Cap No.
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Appendix D Keyboard Scan/Character Codes Appendices Table D-1 Scan codes (set 1 and set 2) (3/4) Cap No.
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Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap No. Keytop Code set 1 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 126 Pause *7 *7 *7 *7 *7 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Make Code set 2 Break Make Note Break Notes: 1. 2. 3. 4. 5. 6. 7. D-4 * * * * * * * Scan codes differ by mode.
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Appendix D Keyboard Scan/Character Codes Appendices Table D-2 Scan codes with left Shift key Cap Key Code set 1 No.
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Appendices Appendix D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
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Appendix D Keyboard Scan/Character Codes Appendices Table D-5 Scan codes in overlay mode Cap No.
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Appendices Appendix D Keyboard Scan/Character Codes Table D-7 No.126 key scan code Key top Pause Shift Code set 1 Code set 2 Make Make Common* E1 1D 45 E1 Ctrl* E0 C6 E0 46 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E 14 F0 *: This key generates only make codes.
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Appendix E Key Layout Appendices 4 Appendix E E.1 Key Layout United Kingdom (UK) Keyboard Figure E-1 UK keyboard E.
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Appendices E-2 Appendix E Key Layout [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Appendix F Wiring diagrams Appendices 4 Appendix F F.1 Wiring diagrams RGB Monitor Loopback Connector Figure F-1 RGB Monitor Loopback Connector F.
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Appendices F-2 813 ) Appendix F Wiring diagrams [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-
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Appendix G BIOS rewrite procedures Appendices Appendix G Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool:  BIOS/EC/KBC rewriting disk Rewriting the BIOS 1. Set the system to boot mode. 2. Turn off the power to the computer. 3. Remove the external cables and cards. 4. Set the USB Flash Memory containing BIOS rewriting data.. 5.
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Appendices G-2 Appendix G BIOS rewrite procedures [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813 )
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Appendix H EC/KBC rewrite procedures Appendices Appendix H Appendix H EC/KBC Rewrite Procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. It is necessary to rewrite the EC/KBC system program when the following changes are made. 1. Replacing of system board 2. Replacing of LCD Tools To rewrite the EC/KBC, you need the following tool:  EC/KBC rewriting disk for the computer Rewriting the EC/KBC NOTE: 1.
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Appendices H-2 Appendix H EC/KBC rewrite procedures [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Appendix I Reliability Appendix I Appendices Reliability Appendix I Reliability The following table shows MTBF (Mean Time Between Failures) in maximum configuration. Table I-1 MTBF Time (hours) 10C 5422.6h 10GC 5392.
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Appendices I-2 Appendix I Reliability [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)