Toshiba Personal Computer PORTEGE M400 Maintenance Manual TOSHIBA CORPORATION File Number 960-541 [CONFIDENTIAL]
Copyright © 2006 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed, with respect to the use of the information contained herein. Toshiba PORTEGE M400 Maintenance Manual First edition January 2006 Disclaimer This manual has been validated and reviewed for accuracy.
Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer PORTEGE M400, referred to as PORTEGE M400 in this manual. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field. SAFETY PRECAUTIONS Four types of messages are used in this manual to bring important information to your attention.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the Satellite R10 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Table of Contents Chapter 1 Hardware Overview 1.1 Features ...................................................................................................................... 1-1 1.2 2.5-inch Hard Disk Drive......................................................................................... 1-11 1.3 Optical Drive............................................................................................................ 1-14 1.4 Keyboard.......................................................
2.17 Wireless LAN Troubleshooting............................................................................... 2-54 2.18 Fingerprint sensor Troubleshooting......................................................................... 2-56 Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test .................................................................................................. 3-1 3.2 Executing the Diagnostic Test ..........................................................................
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program ................................................. 3-76 3.30 Sound Test Program................................................................................................ 3-90 3.31 SETUP .................................................................................................................... 3-96 Chapter 4 Replacement Procedures 4.1 Overview..................................................................................................
4.28 Switch board (NW board)....................................................................................... 4-76 4.29 LCD latch assembly................................................................................................ 4-77 4.30 Hinge assembly....................................................................................................... 4-78 4.31 Fluorescent Lamp....................................................................................................
x [CONFIDENTIAL] PORTEGE M400 Maintenance Manual (960-541)
Chapter 1 Hardware Overview [CONFIDENTIAL]
1 Hardware Overview 1 1-ii Hardware Overview [CONFIDENTIAL] PORTEGE M400 Maintenance Manual (960-541)
1 Hardware Overview Chapter 1 Contents 1.1 Features ...................................................................................................................... 1-1 1.2 2.5-inch Hard Disk Drive......................................................................................... 1-11 1.3 Optical Drive............................................................................................................ 1-14 1.3.1 DVD-ROM & CD-R/RW Drive ............................................
1 Hardware Overview Figures Figure 1-1 Front of the computer..................................................................................... 1-5 Figure 1-2 System units configuration ............................................................................ 1-6 Figure 1-3 System block diagram.................................................................................... 1-7 Figure 1-4 2.5-inch HDD.............................................................................................
1.1 Features 1 1 Hardware Overview Features 1.1 Features The PORTEGE M400 is an ultra thin and lightweight tablet PC realizing cable-less environment on a table by wireless function with an Intel® CoreTM Duo or Intel® CoreTM Solo processor realizing high performance. There some models and options. Refer to the Parts List for the configuration of each model and options. Microprocessor The PORTEGE M400 computer is equipped with an Intel® CoreTM Duo Processor or Intel® CoreTM Solo Processor.
1 Hardware Overview 1.1 Features Selectable Bay Supports hot-swap with DVD-ROM & CD-R/RW drive, DVD Super Multi drive and 2nd HDD. USB FDD A 3.5 inch USB FDD supports 720KB/1.44MB formats. Display The display swivels automatically 0/90/180/270 degrees by display driver. LCD and External monitor can be displayed at the same time. LCD : Built-in 12.1 inch, 16M colors, XGA (1,024×768dots)/ SXGA+ (1,400×1,050 dots), thin type low temperature poly-silicon TFT color display.
1.1 Features 1 Hardware Overview USB (Universal Serial Bus) Three USB ports are usable. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported. PC card slot The PC card slot (PCMCIA) accommodates one 5mm Type II card. (Based on PC Card Standard, supporting CardBus) Bridge media slot This supports one SD memory card/ SDIO card/Memory stick (PRO)/xD picture card slot.
1 Hardware Overview 1.1 Features Wireless LAN Wireless LAN Card can be equipped with PCI Express mini-card slot. Based on IEEE802.11a/b/g with 2.45GHz/5.0GHz Dual-band antenna. i.LINK (IEEE1394) This port enables high-speed data transfer directly from external devices such as digital video cameras. Docking port TOSHIBA Express Port Replicator can be connected through docking port on the bottom. Bluetooth The computer is equipped with Bluetooth (V2.
1.1 Features 1 Hardware Overview Figure 1-1 shows the front of the computer and Figure 1-2 shows the system units configuration.
1 Hardware Overview 1.
1.1 Features 1 Hardware Overview Figure 1-3 shows the system block diagram.
1 Hardware Overview 1.1 Features The PC contains the following components. CPU • Intel® CoreTM Solo Processor 1.66GHz (Processor Number : T1300) • Intel® CoreTM Duo Processor 1.66GHz (Processor Number : T2300) 1.83GHz (Processor Number : T2400) 2.00GHz (Processor Number : T2500) 2.16GHz (Processor Number : T2600) – Core voltage FSB L1 cache L2 cache Support Package : 0.5V to 1.
1.1 Features 1 Hardware Overview PCI chipset This gate array incorporates the following elements and functions. Intel 945GM (North Bridge) - Yonah Processor System Bus Support System Memory Interface : supports DDR2-400/DDR2-533/DDR2-667 4GBmax. Internal Graphics Controller : Inter Generation 3.5 Integrated GFX Core (250MHz) DMI (Direct Media Interface) ICH Support 1,466-ball, 37.5×37.5×2.
1 Hardware Overview 1.1 Features GPU controller (Internal graphic controller) • • • VRAM : External DDR SDRAM MAX=224MB, Default=16MB PCI Express interface LCD I/F LVDS 2ch Batteries The main battery is a detachable lithium-ion battery (10.8V, 4700mAh, 6cell), the secondary battery (Provided with some models or option) is a detachable lithium-ion battery (10.8V, 4000mAh, 6cell) and the RTC battery is a nickel hydrogen battery (2.4V-16mAh). Modem controller Supported by MDC.
1.2 2.5-inch Hard Disk Drive 1.2 1 Hardware Overview 2.5-inch Hard Disk Drive A compact, high-capacity SATA HDD with a height of 9.5mm contains a 2.5-inch magnetic disk and magnetic heads. Figure 1-4 shows a view of the 2.5-inch HDD and Tables 1-1 list the specifications. Figure 1-4 2.5-inch HDD Table 1-1 2.5-inch HDD Specification (1/3) Specifications Items Outline dimensions FUJITSU G8BC00028610 FUJITSU G8BC00028810 Width (mm) 70 Height (mm) 9.5 Depth (mm) Weight (g) 100 101 max.
1 Hardware Overview 1.2 2.5-inch Hard Disk Drive Table 1-1 2.5-inch HDD Specifications (2/3) Items Outline dimensions Specifications TOSHIBA TOSHIBA TOSHIBA TOSHIBA HDD2D34BZK01 HDD2D33BZK01 HDD2D32BZK01 HDD2D30BZK01 Width (mm) 69.85 Height (mm) 9.5 Depth (mm) Weight (g) 100 Storage size (formatted) 98 max. 40GB 102 max. 60GB 80GB Speed (RPM) 5,400 Data transfer rate (Mb/s) Data buffer size (KB) 218-429 236.1-456.
1.2 2.5-inch Hard Disk Drive 1 Hardware Overview Table 1-1 2.5-inch HDD Specifications (3/3) Specifications Items Outline dimensions TOSHIBA TOSHIBA HDD2D35BZK01 HDD2D31BZK01 Width (mm) 69.85 Height (mm) 9.5 Depth (mm) Weight (g) 100 Storage size (formatted) Speed (RPM) 98 max. 102 max. 60GB 120GB 5,400 Data transfer rate (Mb/s) Data buffer size (KB) Average seek time Read (ms) Motor startup time (s) Items 244.7-474.7 8,192 12 3.5 typ.
1 Hardware Overview 1.3 1.3 Optical Drive Optical Drive 1.3.1 DVD-ROM & CD-R/RW Drive The DVD-ROM & CD-R/RW drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15inch) CD-ROM, DVD-ROM and CD-R/RW. The DVD-ROM & CD-R/RW drive is shown in Figure 1-5. The dimensions and specifications of the DVD-ROM & CD-R/RW drive are described in Table 1-2, Table 1-3.
1.3 Optical Drive 1 Hardware Overview Table 1-3 DVD-ROM & CD-R/RW drive specifications Item Specifications MATSUSHITA G8CC00025A20 Data transfer speed (Read) DVD-ROM CD-ROM Max. 8x CAV Max. 24x CAV Data transfer speed (Write) CD-R CD-RW High Speed CD-RW Ultra Speed CD-RW Max. 24x CAV Max. 4x CLV Max. 10x CLV Max. 24x CAV ATAPI Burst (MB/s) PIO Mode DMA Mode Ultra DMA Mode 16.6 (PIO MODE4) 16.6 (Multi Word Mode2) 33.
1 Hardware Overview 1.3 Optical Drive 1.3.2 DVD Super Multi Drive The DVD Super Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD/DVD-ROM, CD-R/RW, DVD±R/±RW and DVD-RAM. The DVD Super Multi drive is shown in Figure 1-6. The dimensions and specifications of the DVD Super Multi drive are described in Table 1-4, Table 1-5.
1.3 Optical Drive 1 Hardware Overview Table 1-5 DVD Super Multi drive specifications Item Specifications MATSUSHITA G8CC00026A23 Data transfer speed (Read) DVD-ROM CD-ROM Max. 8x CAV Max. 24x CAV Data transfer speed (Write) CD-R CD-RW High Speed CD-RW Ultra Speed CD-RW DVD-R DVD-RW DVD+R DVD+RW DVD-RAM Max. 24x ZCLV Max. 4x CLV Max. 10x CLV Max. 10x CLV Max. 2x CLV Max. 2x CLV Max. 2.4x CLV Max. 2.4x CLV Max. 2x ZCLV (4.7GB) ATAPI Burst (MB/s) PIO Mode DMA Mode Ultra DMA Mode 16.6 (PIO MODE4) 16.
1 Hardware Overview 1.3 Optical Drive 1.3.3 DVD Super Multi drive (Double-layer) The DVD Super Multi drive (Double-layer) accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD/DVD-ROM, CD-R/RW, DVD±R/±RW, DVD-RAM and DVD+R (Doublelayer). The DVD Super Multi drive (Double-layer) is shown in Figure 1-7. The dimensions and specifications of the DVD Super Multi drive (Double-layer) are described in Table 1-6, Table 1-7.
1.3 Optical Drive 1 Hardware Overview Table 1-7 DVD Super Multi drive (Double-layer) specifications Drive Specification Parameter MATSUSHITA G8CC00030120 Data transfer speed Access time (ms) Read (max.) DVD-ROM 8x(CAV) CD-ROM 24x(CAV) Write (max.) CD-R 24x (ZCLV) CD-RW 4x(CLV) High Speed CD-RW 10x(CLV) Ultra Speed CD-RW 16x(CLV) DVD-R 8x(ZCLV) DVD-R Double Layer 2x(CLV) DVD-RW 4x(ZCLV) DVD+R 8x(ZCLV) DVD+R Double Layer 2.4x(CLV) DVD+RW 4x(ZCLV) DVD-RAM 2-3x(ZCLV) (4.
1 Hardware Overview 1.4 1.4 Keyboard Keyboard The keyboard is mounted 84(US)/85(UK) keys that consist of character key and control key, and in conformity with ASCII. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure1-8 is a view of the keyboard. See Appendix E about a layout of the keyboard.
1.5 TFT Color Display 1.5 1 Hardware Overview TFT Color Display The TFT color display consists of a LCD module and FL inverter board. 1.5.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display images and characters of 16M colors with 1,400×1,050(SXGA+)/ 1,024×768(XGA) resolution. Figure 1-9 shows a view of the LCD module and Table 1-8 lists the specifications. Figure 1-9 LCD module Table 1-8 LCD module specifications (12.
1 Hardware Overview 1.5 TFT Color Display 1.5.2 FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module FL. Table 1-9 lists the FL inverter board specifications. Table 1-9 FL inverter board specifications Item Specifications G71C00011111 Input Output Voltage (V) 5 (DC) Power (W) 7 Voltage (V) 750 (r.m.s) Power Current (mA) 1-22 [CONFIDENTIAL] 5W / 7VA 6.00 (r.m.
1.6 Power Supply 1.6 1 Hardware Overview Power Supply The power supply supplies different voltages to the system board. The power supply microcontroller has the following functions. 1. Judges that the DC power supply (AC adapter) is connected to the computer. 2. Detects DC output and circuit malfunctions. 3. Controls the battery icon, and DC IN icon. 4. Turns the battery charging system on and off and detects a fully charged battery. 5. Turns the power supply on and off. 6.
1 Hardware Overview 1.6 Power Supply Table 1-10 lists the power supply output specifications. Table 1-10 Power supply output specifications Power supply（Yes/No） Name Voltage [V] Power OFF (Suspend mode) Power OFF (Boot mode) No battery PPV 0.5 -1.3 No No No CPU PTV 1.05 No No No CPU, GMCH, ICH7-M 1R5-P1V 1.5 No No No CPU, GMCH, ICH7-M, PCI-e Mini Card 1R8-B1V 1.8 Yes No No GMCH, DDR2-SDRAM 2R5-P2V 2.5 No No No GMCH, ICH7-M LAN2R5-E2V 2.
1.7 Batteries 1.7 1 Hardware Overview Batteries The PC has the following three batteries. Main battery Secondary battery (Provided with some models or option) Real time clock (RTC) battery Table 1-11 lists the specifications for these two batteries. Table 1-11 Battery specifications Battery Name Main battery G71C0004S510 Battery Element Output Voltage Capacity Lithium ion (6 cell) 10.8 V 4,700mAh Lithium ion (6 cell) 10.8 V 4,000mAh Nickel hydrogen 2.
1 Hardware Overview 1.7 Batteries 1.7.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and detects a full charge when the AC adapter and battery are connected to the computer. Quick Battery Charge When the AC adapter is connected, normal charging is used while the system is turned on and quick charge is used while the system is turned off or in standby mode. Table 1-12 lists the main battery charging time.
1.7 Batteries 1 Hardware Overview 1.7.3 RTC Battery The RTC battery provides the power supply to maintain the date, time, and other system information in memory. Table 1-14 lists the battery charging time and data preservation times.
1 Hardware Overview 1.8 1.8 AC Adapter AC Adapter The AC adapter is also used to charge the battery. Table 1-15 lists the AC adapter specifications. Table 1-15 AC adapter specifications Parameter Specification G71C00043310 (2-pin) Power 75W (Peak 90W) Input voltage Input frequency Input current 1-28 G71C00049410/G71C00049510 (3-pin) 100V/240V 50Hz to 60Hz 1.
Chapter 2 Troubleshooting [CONFIDENTIAL]
2 Troubleshooting 2 2-ii [CONFIDENTIAL] PORTEGE M400 Maintenance Manual (960-541)
2 Troubleshooting Chapter 2 Contents 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart........................................................................................ 2-2 2.3 Power Supply Troubleshooting.................................................................................. 2-6 2.4 2.5 2.6 2.7 Procedure 1 Power Supply Icon Check.......................................
2 Troubleshooting 2.8 2.9 2.10 2.11 2.12 2.13 2.14 2.15 2-iv Display Troubleshooting.......................................................................................... 2-41 Procedure 1 External Monitor Check....................................................... 2-41 Procedure 2 Diagnostic Test Program Execution Check ......................... 2-41 Procedure 3 Connector and Cable Check................................................. 2-42 Procedure 4 Replacement Check ...............
2 Troubleshooting 2.16 2.17 2.18 Tablet Pen Troubleshooting..................................................................................... 2-52 Procedure 1 Check on Windows XP Tablet PC Edition .......................... 2-52 Procedure 2 Tablet pen replacement Check............................................. 2-52 Procedure 3 Connector Check and Replacement Check.......................... 2-53 Wireless LAN Troubleshooting......................................................................
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2.1 Troubleshooting 2 Troubleshooting 2 2.1 Troubleshooting Chapter 2 describes how to determine which Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. (The “FRU” means the replaceable unit in the field.) The FRUs covered are: 1. Power supply 2. System board 3. 3.5” USB FDD 4. 2.5” HDD 5. Keyboard 6. Display 7. Touch pad 8. Optical drive 9. Modem 10. Bluetooth 11. LAN 12. Sound 13. Bridge media slot 14. Tablet pen 15. Wireless LAN 16.
2 Troubleshooting 2.2 2.2 Troubleshooting Flowchart Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which FRU malfunctions. Before going through the flowchart steps, check the following: Make sure that Toshiba Windows® XP Tablet PC Edition is installed on the hard disk. Other operating systems can cause the computer malfunction. Make sure all optional equipment is removed from the computer.
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2 Troubleshooting 2.
2.2 Troubleshooting Flowchart 2 Troubleshooting If the diagnostics program cannot detect an error, the problem may occur intermittently. The Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error(s), and perform the appropriate troubleshooting procedures as follows: 1.
2 Troubleshooting 2.3 2.3 Power Supply Troubleshooting Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2.3 Power Supply Troubleshooting Procedure 1 2 Troubleshooting Power Supply Icon Check The following two icons indicate the power supply status: Battery icon DC IN icon The power supply controller uses the power supply status with the Battery icon and the DC IN icon as listed in the tables below. Table 2-1 Battery icon Battery icon Power supply status Lights orange Battery is charged and the external DC is input. It has no relation with ON/OFF of the system power.
2 Troubleshooting 2.3 Power Supply Troubleshooting When icons are blinking, perform the following procedure. 1. Remove the battery pack and the AC adapter and cut off the power supply to the computer by force. 2. Re-attach the battery pack and the AC adapter. If icons are still blinking after the operation above, check the followings: Check 1 If the DC IN icon blinks orange, go to Procedure 2. Check 2 If the DC IN icon does not light, go to Procedure 3.
2.3 Power Supply Troubleshooting Procedure 2 2 Troubleshooting Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below. Start Error code (8 bit) “1” “0” Interval between data bits The error code begins with LSB (Least Significant bit) Example: Error code 11h (Error codes are given in hexadecimal format.
2 Troubleshooting 2.3 Power Supply Troubleshooting DC power supply (AC adapter) Error code Meaning 10h AC Adapter output voltage is over 16.5V. 11h TOSHIBA Express Port Replicator output voltage is over 16.5V. 12h Current from the DC power supply is over 7.0A. 13h Current from the DC power supply is over 0.5A in no load. 14h Abnormal current of 0[A] correction has been sensed. First Battery Error code Meaning 22h Main battery discharge current is over 0.5A in no load.
2.3 Power Supply Troubleshooting 2 Troubleshooting E5V output (P61) Error code Meaning 50h E5V voltage is over 6.00V. 51h E5V voltage is 4.50V or less when the computer is powered on. 52h E5V voltage is 4.50V or less at booting up. 54h E5V voltage is 4.50V or less when EV power is maintained and “OUTV1 power = EV power” is specified. E3V output (P62) Error code Meaning 60h E3V voltage is over 3.96V. 61h E3V voltage is 2.81V or less when the computer is powered on.
2 Troubleshooting 2.3 Power Supply Troubleshooting PPV output (P65_CH0) Error code Meaning 90h PPV voltage is over 1.80V. 91h PPV voltage is 0.32V or less when the computer is powered on. 92h PPV voltage is 0.32V or less at booting up. PTV output (P66_CH0) Error code Meaning A0h PTV voltage is over 1.32V. A1h PTV voltage is 0.85V or less when the computer is powered on. A2h PTV voltage is 0.85V or less at booting up.
2.3 Power Supply Troubleshooting 2 Troubleshooting PPV output (P65_CH1) Error code Meaning D0h PPV voltage is over 1.80V. D1h PPV voltage is 0.32V or less when the computer is powered on. D2h PPV voltage is 0.32V or less at booting up. PTV output (P66_CH1) Error code Meaning E0h PTV voltage is over 1.32V. E1h PTV voltage is 0.85V or less when the computer is powered on. E2h PTV voltage is 0.85V or less at booting up. Check 3 In the case of error code 10h or 12h, go to Procedure 3.
2 Troubleshooting Procedure 3 2.3 Power Supply Troubleshooting Connection Check The wiring diagram related to the power supply is shown below: Any of the connectors may be disconnected. Perform starting from Check 1. Check 1 Make sure the AC adapter and the AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet. If these cables are connected correctly, go to Check 2. Check 2 Replace the AC adapter and the AC power cord with new ones.
2.3 Power Supply Troubleshooting Procedure 5 2 Troubleshooting Replacement Check The power is supplied to the System board by the AC adapter. If either the AC adapter or the System board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4. Check 1 Replace the AC adapter with a new one. If power is not supplied properly to the PC, perform Check 2. Check 2 Replace the System board with a new one.
2 Troubleshooting 2.4 2.4 System board Troubleshooting System board Troubleshooting This section describes how to determine if the System board is defective. Start with Procedure 1 and continue with the other procedures as instructed.
2.4 System board Troubleshooting Procedure 1 2 Troubleshooting Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the System board and initializes it. If an error message is shown on the display, perform Check 1. If there is no error message, go to Procedure 2. If MS-DOS or Windows XP Tablet PC Edition is properly loaded, go to Procedure 4.
2 Troubleshooting Check 3 2.4 System board Troubleshooting The IRT checks the System board. When the IRT detects an error, the system stops or an error message appears. If error message (18) is displayed, go to the Keyboard Troubleshooting Procedures in Section 2.7. If error message (19), (20) or (21) is displayed, go to the 2.5” HDD Troubleshooting Procedures in Section 2.6. If error message (22) is displayed, go to the USB 3.5” FDD Troubleshooting Procedures in Section 2.5.
2.4 System board Troubleshooting Procedure 2 2 Troubleshooting Debug Port (D port) Check on Boot Mode Check the D port status by a debug port test. The tool for debug port test is shown below. Figure 2-2 A set of tool for debug port test The test procedures are follows; 1. Connect the debug port test cable to the connector CN3400 of the System board. For disassembling the PC to connect the test cable, refer to Chapter 4. 2. Connect the debug port test cable and RS-232C cross-cable to the test board. 3.
2 Troubleshooting 2.4 System board Troubleshooting 5. Execute GETDPORT.COM in the text menu in CPU REAL mode. (Insert the FD for starting D port into FDD and input “FD starting drive:>dport”.) The D port status is displayed in the following form; 6. When the D port status is FFFFh (normal status), go to Procedure 3. 7. When the D port status falls into any status in Table 2-3, execute Check 1.
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2 Troubleshooting 2.
2.4 System board Troubleshooting 2 Troubleshooting Table 2-3 Debug port (Boot mode) error status (3/10) D port status (F100h) Inspection items Initialization of H/W (before DRAM recognition) Details Initialization of MCHM Initialization of ICH7M.D30.Func0 Initialization of ICH6M.D31.Func0 Initialization of ICH6M.D31.Func1/2 Initialization of USB controller Initialization of ICH7M.D31.
2 Troubleshooting 2.
2.4 System board Troubleshooting 2 Troubleshooting Table 2-3 Debug port (Boot mode) error status (5/10) D port status F106h Inspection items Initialization of devices which need initialization before PCI bus initialization Details PIT test (at Cold boot only) and initialization Setting of test pattern to channel 0 of PIT#0 Check whether the set test pattern can be read.
2 Troubleshooting 2.
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2 Troubleshooting 2.4 System board Troubleshooting Table 2-3 Debug port (Boot mode) error status (8/10) D port status Inspection items Details F11Ah INIT_DMAC (boot mode) Initialization of DMAC F11Bh CHECK_SIO (for models supporting SIO) Check of Serial port existence F11Dh Diagnostic Test In Models supporting Diagnostic Mode, it is enabled.
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2 Troubleshooting 2.4 System board Troubleshooting Table 2-3 Debug port (Boot mode) error status (10/10) D port status Inspection items F122h Start of BIOS security check F123h End of BIOS security check F124h Clear of IRT status, renewal of check sum of Runtime side FFFFh End Details When error occurred, holts at D port=F166h Check 1 If the D port is status F11Eh or F120h is displayed, go to “HDD Trouble shooting Procedure in Section 2.6.
2.4 System board Troubleshooting Procedure 3 2 Troubleshooting Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the System board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test 6. Printer test 7. ASYNC test 8. Hard Disk test 9. Real Timer test 10. NDP test 11. Expansion test 12. CD-ROM/DVD-ROM test 13.
2 Troubleshooting 2.5 USB 3.5” FDD Troubleshooting 2 2.5 USB 3.5” FDD Troubleshooting This section describes how to determine if the USB 3.5” FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.5 USB 3.5” FDD Troubleshooting Procedure 2 2 Troubleshooting Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled. Floppy disk drive test error codes and their status names are listed in Table 2-4.
2 Troubleshooting Procedure 3 2.5 USB 3.5” FDD Troubleshooting Connector Check and Replacement Check The USB FDD connector may be disconnected from the connector on the System board. Check visually that the connector is connected firmly. Check 1 Make sure the USB FDD cable is firmly connected to the CN4610 (port 6), CN4611 (port 4) or CN4612 (port 0) of the System board. If the connection is loose, reconnect firmly and repeat Procedure 2. If there is still an error, go to Check 2.
2.6 2.5” HDD Troubleshooting 2.6 2 Troubleshooting 2.5” HDD Troubleshooting This section describes how to determine if the 2.5” HDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Partition Check Procedure 2: Message Check Procedure 3: Format Check Procedure 4: Diagnostic Test Program Execution Check Procedure 5: Connector Check and Replacement Check CAUTION: The contents of the 2.
2 Troubleshooting Procedure 2 2.6 2.5” HDD Troubleshooting Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen. Make sure of no floppy disk in the FDD. Turn on the computer and check the message on the screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with Check 1 below and perform the other checks as instructed.
2.6 2.5” HDD Troubleshooting Procedure 3 2 Troubleshooting Format Check The computer’s 2.5” HDD is formatted using the MS-DOS FORMAT program or the physical format program of the test program. To format the 2.5” HDD, start with Check 1 below and perform the other steps as required. Refer to the MS-DOS Manual for the operation of MS-DOS. For the format by the test program, refer to the Chapter 3. Check 1 Format the 2.5” HDD using MS-DOS FORMAT command. Type as FORMAT C:/S/U. If the 2.
2 Troubleshooting Procedure 4 2.6 2.5” HDD Troubleshooting Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. The error codes and statuses are described in Table 2-5.
2.6 2.5” HDD Troubleshooting Procedure 5 2 Troubleshooting Connector Check and Replacement Check The HDD is connected to the System board with a HDD cable. The connecting portions may be loose. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks to check the connecting portions: Check 1 Make sure the HDD cable is firmly connected to the connector CN1850 of the System board and HDD.
2 Troubleshooting 2.7 2.7 Keyboard Troubleshooting Keyboard Troubleshooting To determine if the computer’s keyboard is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test in the Diagnostic Program.
2.8 Display Troubleshooting 2.8 2 Troubleshooting Display Troubleshooting This section describes how to determine if the computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed.
2 Troubleshooting Procedure 3 2.8 Display Troubleshooting Connector and Cable Check The LCD module is connected to the System board through the LCD/FL cable. Also, the FL inverter is connected the System board through the LCD/FL cable. The cable may be firmly disconnected the board or damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures. If the connection is loose, reconnect the cable firmly and repeat Procedure 2.
2.9 Touch pad Troubleshooting 2.9 2 Troubleshooting Touch pad Troubleshooting To determine whether the Touch pad is faulty or not, perform the following procedures: Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Cable Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the test for Touch pad in ONLY ONE test in the Diagnostic Program.
2 Troubleshooting 2.10 Selectable bay (optical drive) Troubleshooting 2.10 Selectable bay (optical drive) Troubleshooting The Selectable bay can be installed in this model and the Selectable bay optical drive is installed as standard. Here explains the troubleshooting for the optical drive. To check if the optical drive is defective or not, follow the troubleshooting procedures below as instructed.
2.11 Modem Troubleshooting 2 Troubleshooting 2.11 Modem Troubleshooting To check if the modem is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Modem test program available as part of the maintenance test program. This program checks the modem.
2 Troubleshooting 2.12 Bluetooth Troubleshooting 2.12 Bluetooth Troubleshooting This section describes how to determine if the Bluetooth in the computer is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.12 Bluetooth Troubleshooting Procedure 2 2 Troubleshooting Connection Check The Bluetooth functional wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the Bluetooth cable is firmly connected to connector on the Bluetooth module CN4400 on the System board. If the connector is disconnected, connect it firmly and perform Procedure 1.
2 Troubleshooting Procedure 3 2.12 Bluetooth Troubleshooting Replacement Check The Bluetooth antenna, Bluetooth module, CN board and System board are connected to the circuits. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 The Bluetooth cables may be defective or damaged. Replace the cable with a new one following the steps in Chapter 4, Replacement Procedures.
2.13 LAN Troubleshooting 2 Troubleshooting 2.13 LAN Troubleshooting To check if the computer’s LAN is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check To check the LAN function, execute the Sound/LAN/Modem test program subtest 04 (LAN test). See Chapter 3 for information on how to perform the test.
2 Troubleshooting 2.14 Sound Troubleshooting 2.14 Sound Troubleshooting To check if the sound function is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Sound test program available as part of the maintenance test program. See Chapter 3 for information on how to perform the test.
2.15 Bridge media Slot Troubleshooting 2 Troubleshooting 2.15 Bridge media Slot Troubleshooting To check if the Bridge media slot is good or no good, follow the troubleshooting procedures below as instructed. Procedure 1: Check on Windows XP Tablet PC Edition Procedure 2: Connector Check and Replacement Check Procedure 1 Check on Windows XP Tablet PC Edition Insert a Bridge media into the slot.
2 Troubleshooting 2.16 Tablet Pen Troubleshooting 2.16 Tablet Pen Troubleshooting To check if the Tablet Pen is defective or not, follow the troubleshooting procedures below as instructed. CAUTION: Use the Tablet Pen supplied to this model.
2.16 Tablet Pen Troubleshooting Procedure 3 2 Troubleshooting Connector Check and Replacement Check The Digitizer and LCD are connected to the System board as below. Check 1 The Digitizer may be disconnected. Make sure the Digitizer is connected to the CN9540 on the System board. If there is still an error, go to Check 2. Check 2 The Digitizer or the System board may be defective. Replace it with a new one following the steps in Chapter 4. Then check the tablet pen is working properly.
2 Troubleshooting 2.17 Wireless LAN Troubleshooting 2.17 Wireless LAN Troubleshooting To check if the Wireless LAN is defective or not, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting/Receiving Check Procedure 2: Check of Antenna connection Procedure 3: Replacement Check Procedure 1 Transmitting/Receiving Check Make sure the wireless communication switch on the computer is turned ON. If it is not, turn ON.
2.17 Wireless LAN Troubleshooting Procedure 2 2 Troubleshooting Check of Antenna connection The wireless LAN functional wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, and perform the following checks: Check 1 The wireless LAN card and the System board may be disconnected. Make sure the wireless LAN card is firmly connected to the CN2600 of the System board.
2 Troubleshooting 2.18 Fingerprint sensor Troubleshooting 2.18 Fingerprint sensor Troubleshooting CAUTION: To delete the account for confirming the fingerprint operation, it is necessary to log on by the account with the management authority. If the password has been set to log on, ask the Log-ON password to the user. To check if the Fingerprint sensor work correctly or not, follow the troubleshooting procedures below as instructed. When failed in Procedure 1 to Procedure 3, execute Procedure 4.
2.18 Fingerprint sensor Troubleshooting Procedure 1 2 Troubleshooting Setting Windows Log-ON password 1. Open [User Account] from [Control Panel]. 2. Select “Create a new account” in [User Account]. 3. Input the name of Account (e.g. “TOSHIBA”) in [Name the new account] and click [NEXT] button. 4. Click “Create Account” button in the (default) condition that the “Computer administrator” is selected in [Pick an account type]. 5. Select the icon of Account (e.g.
2 Troubleshooting 2.18 Fingerprint sensor Troubleshooting 3. In the box of [Enter your password] on [User's Password] display, input the password (e.g. password) which has been input in item 7 of Procedure1. Click [Next]. 4. After displaying [Enrollment Hints], check off in the box of [Run interactive tutorial] (when proceeding without seeing Tutorial). The display of “if you want really skip or not the Tutorial” appears, and then click [Skip Tutorial].
2.18 Fingerprint sensor Troubleshooting 2 Troubleshooting 5. After displaying [User’s Fingerprint], click the box of thumb of right hand. A small window of “Swipe finger” appears, then swipe three times. 6. The display becomes as follows when the fingerprint is registered correctly. Click [Next].
2 Troubleshooting 2.18 Fingerprint sensor Troubleshooting 7. After displaying [User Enrollment] dialog, you are asked if you want to register one more finger. Click [No] when you do not want to register one more. 8. When [Advanced Security] is displayed, click [Next]. 9. When [Finish] is displayed, click [Finish].
2.18 Fingerprint sensor Troubleshooting 2 Troubleshooting 10. The display of “Protector Suite - QL Edition” appears in [Fingerprint Software] window, click [Close]. Procedure 3 Authentication of fingerprint 1. Turn on the computer. Windows starts up. 2. In the Windows Log-ON window, scan the fingerprint of registered finger. Make sure that a green check mark is displayed in the box (It means you have logged on).
2 Troubleshooting 2.18 Fingerprint sensor Troubleshooting 3. After starting Windows, make sure that the name of Account (e.g. “TOSHIBA”), which has been inputted in item 3 in Procedure 1 at the top of [Start]. Procedure 4 Connector Check and Replacement Check The connector CN9560 on the NF board is connected to the connector CN9540 on the system board. Check 1 Check the NF cable is firmly connected to the connector CN9560 on the NF board and connector CN9540 on the system board.
2.18 Fingerprint sensor Troubleshooting 2 Troubleshooting Check 3 The NF board may be faulty. Replace it with a new one. If the problem persists, perform Check 4. Check 4 The system board may be faulty. Replace it with a new one.
2 Troubleshooting 2-64 2.
Chapter 3 Tests and Diagnostics [CONFIDENTIAL]
3 Tests and Diagnostics 3-ii [CONFIDENTIAL] PORTEGE M400 Maintenance Manual (960-541)
3 Tests and Diagnostics Chapter 3 Contents 3.1 3.2 3.3 The Diagnostic Test ................................................................................................... 3-1 3.1.1 Diagnostics menu ................................................................................. 3-1 3.1.2 H/W (Hardware) initial information setting tool.................................. 3-3 3.1.3 Heatrun test program............................................................................
3 Tests and Diagnostics 3.22 3.23 3.24 3.25 3.26 3.21.1 Program Description .......................................................................... 3-48 3.21.2 Operations .......................................................................................... 3-48 Head Cleaning.......................................................................................................... 3-56 3.22.1 Function Description ..........................................................................
3 Tests and Diagnostics 3.31 SETUP ..................................................................................................................... 3-96 3.31.1 Function Description .......................................................................... 3-96 3.31.2 Accessing the SETUP Program..........................................................
3 Tests and Diagnostics Figures Figure 3-1 Name and positions of each side.................................................................. 3-53 Tables Table 3-1 Subtest names............................................................................................... 3-20 Table 3-2 Error codes and error status names .............................................................. 3-43 Table 3-3 HDC status register contents........................................................................
3.1 The Diagnostic Test 3 Tests and Diagnostics 3 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
3 Tests and Diagnostics 3.1 The Diagnostic Test REAL TIMER TEST NDP TEST EXPANSION TEST CD-ROM/DVD-ROM TEST Other tests are: Wireless LAN TEST (Wireless LAN test disk) LAN/Modem/Bluetooth/IEEE1394 TEST (LAN/Modem/Bluetooth/IEEE1394 test disk) Sound TEST (Sound test disk) You will need the following equipment to perform some of the Diagnostic test programs.
3.1 The Diagnostic Test 3 Tests and Diagnostics 3.1.2 H/W (Hardware) initial information setting tool The H/W initial information setting tool consists of the following programs. Initial configuration DMI information save DMI information recovery System configuration display E2PROM test (MAC/GUID/DMI) You will need the following equipment to perform some of the programs. The Diagnostics Disk (Main T&D) 3.1.3 Heatrun test program The heatrun test starts automatically after the selection.
3 Tests and Diagnostics 3.2 3.2 Executing the Diagnostic Test Executing the Diagnostic Test To start the DIAGNOSTIC PROGRAM, follow these steps: 1. Insert the Diagnostics disk in the USB floppy disk drive. 2. Turn on the computer with pressing the F12. Select the FDD in the display for selecting booting unit. Then, press Enter and the following menu appears. Microsoft Windows XX Startup Menu --------------------------------------------------------1. Repair Main (T&D) 2. Repair initial config set 3.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 3.2.1 Diagnostics menu (T&D) After pressing 1 and Enter in the startup menu, the following menu appears. TOSHIBA personal computer Common DIAGNOSTICS Version X.XX (c) copyright TOSHIBA Corp. 20XX DIAGNOSTICS MENU : 1 2 3 4 5 6 7 8 9 – - DIAGNOSTIC TEST ONLY ONE TEST HEAD CLEANING LOG UTILITIES RUNNING TEST FDD UTILITIES SYSTEM CONFIGURATION EXIT TO MS-DOS NOTE: To exit the DIAGNOSTIC TEST MENU, press the Esc key.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Functions 1 through 12 are the Diagnostic Tests. Function 88 sets the floppy disk drive and hard disk drive error retry count (0-255). To exit the submenu of the Diagnostic Test and returns to the Diagnostics Menu, set the highlight bar to function 99 and press Enter. Select the option you want to execute and press Enter.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Use the up and down arrow keys to move the cursor to “ERROR STOP”. Use the right and left arrow keys to move the cursor to the desired option and press Enter.
3 Tests and Diagnostics 3.3 3.3 Check of the RAID configuration Check of the RAID configuration Following screen is displayed for checking the RAID configuration and specifying a failed drive. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status Capacity LD0 RAID-1 DEGRADE xxGB Write cache : Enable Degrade Bootup : Yes MBR Protection : Disable S.M.A.R.
3.3 Check of the RAID configuration 3 Tests and Diagnostics Logical Drive Information: Displays logical drive number, RAID level, RAID status, contents and setting. Physical Drive Information: Displays port number, logical drive number belonged, status and disk information. RAID level: Displays RAID level configured. NON: Means that RAID is not configured. Confirming the logical drive information can check if a drive exists and check models of the drive. RAID-0: There are 1RAID-0 and 2RAID-0 (striping).
3 Tests and Diagnostics 3.3 Check of the RAID configuration 3.3.2 Check of the screen display Contents of the screen displayed are shown below. 3.3.2.1 RAID-1 When the “RAID-1” is displayed in the is configured by two drives. shown below, it is judged that the RAID TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved.
3.3 Check of the RAID configuration 3 Tests and Diagnostics The RAID is not configured by two drives in the following display, because there are two LDs (LD0 and LD1). TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status LD0 RAID-0 OPTIMAL Write cache Degrade Bootup MBR Protection S.M.A.R.T LD1 RAID-0 OPTIMAL Write cache Degrade Bootup MBR Protection S.M.A.R.T Port Assign Status 0 LD0-0 ONLINE 1 LD0-0 ONLINE < RAID: RAID-0 > 3.3.
3 Tests and Diagnostics 3.3 Check of the RAID configuration 3.3.3 Identifying the failed HDD Check the RAID configuration condition from the failed drive. shown below and specify a TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status LD0 RAID-1 DEGRADE Capacity xxGB Write cache : Enable Degrade Bootup : Yes MBR Protection : Disable S.M.A.R.
3.3 Check of the RAID configuration 3 Tests and Diagnostics 3.3.3.2 RAID : not OPTIMAL ABSENT or OFFLINE is displayed When the “ABSENT” or “OFFLINE” is displayed as shown below, the drive is removed by the RAID console and installed again. When the drive is unlocked, “ABSENT” is displayed. When the drive is locked, “OFFLINE” is displayed. Repair is not needed in this case. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved.
3 Tests and Diagnostics 3.3 Check of the RAID configuration NO DRIVE for one drive is displayed When “NO DORIVE” is displayed and the HDD is connected to the port, follow the procedures below to check the HDD failure. (1) Install a new HDD. When “NO DORIVE” is still displayed, it is judged that the MB or cable fails. (2) When a new HDD is recognized, it is judged that the HDD removed is failed. Specify the reason by using the Independent Utility. TOSHIBA RAID / RAID Information Display Rev xx.xx.
3.3 Check of the RAID configuration 3 Tests and Diagnostics FAIL for one drive is displayed One drive in the “RAID-1”is failed and degraded. This may look like failure by wrong operation. Specify the reason by using Independent Utility. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level LD0 RAID-1 Status Capacity DEGRADE xxGB Write cache : Enable Degrade Bootup : Yes MBR Protection : Disable S.M.A.R.
3 Tests and Diagnostics 3.4 3.4 Setting of the hardware configuration Setting of the hardware configuration To execute this program, select 2-Repair initial config set in the startup menu, press Enter and follow the directions on the screen. The H/W initial information setting tool consists of four subtests. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Initial configuration This subtest executes the following items and shows their contents in the display.
3.4 Setting of the hardware configuration 3 Tests and Diagnostics Setting of the HWSC Setting of the UUID Display of the DMI information (including UUID) Setting of DVD region code (Yes/No) After completion of the above settings, H/W configuration & DMI information are appeared in order. Check the contents and press Enter. Following message appears in the display. Press any key, then return to the H/W initial information setting tool menu.
3 Tests and Diagnostics Subtest 08 3.4 Setting of the hardware configuration System configuration display This subtest displays the information of the system configuration. Confirm the contents and press Enter. For more details on the system configuration information, refer to 3.26 “System configuration”. Subtest 09 E2PROM test (MAC/GUID/DMI) It checks whether the MAC address, GUID of IEEE1394 and DMI information are written.
3.5 Heatrun Test 3.5 3 Tests and Diagnostics Heatrun Test To execute this program, select 3-Repair heatrun in the startup menu, press Enter. After selecting the test, the same subtests as 3.24 RUNNING TEST are executed successively. For more details on the procedure and test content, refer to RUNNING TEST. When the heatrun test ends, following message appears in the display.
3 Tests and Diagnostics 3.6 3.6 Subtest Names Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No. 3-20 Test Name Subtest No.
3.6 Subtest Names 3 Tests and Diagnostics Table 3-1 Subtest names (2/2) No. 6 Test Name PRINTER [not supported] 7 ASYNC [not supported] Subtest No.
3 Tests and Diagnostics 3.7 3.7 System Test System Test To execute the System Test select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM checksum This subtest executes a checksum test of the BIOS ROM (range: F0000h to FFFFFh, 64KB) on the System board. Subtest 02 Fan ON/OFF This subtest turns on/off the fan motor by force with Fan ON/OFF commands.
3.7 System Test 3 Tests and Diagnostics This subtest checks the status for the quick charge. Subtest 05 DMI read This subtest displays the information in the Flash-ROM in the following format. *** DMI Data Display Ver X.XX *** Model Name Version Number Serial Number Model Number UUID Number : : : : : XXXXXXXXXXX XXXXXXXXXXXX XXXXXXXX XXXXXX-XXXXX XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX Press [Enter] to EXIT To exit this subtest and return to the SYSTEM test menu, press Enter.
3 Tests and Diagnostics 3.8 3.8 Memory Test Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Conventional memory This subtest writes a constant data to conventional memory (0 to 640 KB), then reads the new data and compares the result with the original data. Subtest 02 Protected mode NOTE: The CONFIG.
3.9 Keyboard Test 3.9 3 Tests and Diagnostics Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed key code display When a key is pressed, the scan code, character code, and key top name are displayed on the screen in the format shown below.
3 Tests and Diagnostics 3.10 Display Test 3.10 Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM read/write for VGA This subtest writes the constant data (AAh and 55h) to the video RAM. The data is read and compared to the original data.
3.10 Display Test Subtest 04 3 Tests and Diagnostics Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode 12] 13] 3] 111 112 114 115 117 118 640*480 640*480 800*600 800*600 1024*768 1024*768 64K] 16M] 64K] 16M] 64K] 16M] The display below appears on the screen when this subtest is executed.
3 Tests and Diagnostics Subtest 06 3.10 Display Test “H” pattern display This subtest displays a full screen of “H” patterns.
3.11 Floppy Disk Test 3 Tests and Diagnostics 3.11 Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. The contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. 1. The following message will appear. Select the media mode and start track to be tested, then press Enter.
3 Tests and Diagnostics 3.11 Floppy Disk Test Select the number of the subtest you want to execute and press Enter. The following message will appear during the floppy disk test. FLOPPY DISK SUB-TEST PASS COUNT WRITE DATA ADDRESS IN PROGRESS : : : : XX XXXXX XX XXXXXX xxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] : test end [Ctrl]+[C] : key stop XXXXXXX ERROR COUNT READ DATA STATUS : XXXXX : XX : XXX When the subtest 04 or 05 is selected, the following messages will appear on the screen.
3.12 Printer Test 3 Tests and Diagnostics 3.12 Printer Test CAUTION: Printer Test is not supported for this model. To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. NOTE: An IBM compatible printer must be connected to the system to execute this test. Also, printer port wraparound connector must be connected.
3 Tests and Diagnostics Subtest 02 3.12 Printer Test Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wraparound NOTE: To execute this subtest, a printer wraparound connector must be connected to the computer’s printer port.
3.13 Async Test 3 Tests and Diagnostics 3.13 Async Test CAUTION: Async Test is not supported for this model. To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
3 Tests and Diagnostics 3.14 Hard Disk Test 3.14 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. CAUTION: 1. When executing subtest02, 03, 04, 06, 08 and 09, the message [The hard disk will be destroyed.] will be displayed. The contents of the hard disk will be erased when these tests are executed.
3.14 Hard Disk Test 3 Tests and Diagnostics 4. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest. HARD DISK TEST XXXXXXX SUB TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXX DIAGNOSTIC TEST VX.
3 Tests and Diagnostics Subtest 04 3.14 Hard Disk Test Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder.
3.15 Real Timer Test 3 Tests and Diagnostics 3 3.15 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real time A new date and time can be input during this subtest. To execute the real time subtest, follow these steps: 1.
3 Tests and Diagnostics Subtest 03 3.15 Real Timer Test Real time carry CAUTION: When this subtest is executed, the current date and time are erased. This subtest checks the real time clock increments.
3.16 NDP Test 3 Tests and Diagnostics 3.16 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen.
3 Tests and Diagnostics 3.17 Expansion Test 3.17 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wraparound CAUTION: PCMCIA wraparound test is not supported for this model. NOTE: To execute this subtest, the PC card wraparound connector is required.
3.17 Expansion Test Subtest 02 3 Tests and Diagnostics RGB monitor ID NOTE: To execute this subtest, an external monitor with monitor ID function is required. Connect the external monitor to the PC for the test of ID acquisition. The judgment of acquisition is based on the panel data. In simultaneous display mode or internal display mode, in which the panel data is acquired, this subtest will fail. Therefore, make sure only the external display is selected when executing this subtest.
3 Tests and Diagnostics 3.18 CD-ROM/DVD-ROM Test 3.18 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM test, select 12 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1. For the subtest 04, use a CD-RW media on the market.
3.19 Error Code and Error Status Names 3 Tests and Diagnostics 3.19 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test.
3 Tests and Diagnostics 3.
3.
3 Tests and Diagnostics 3.20 Hard Disk Test Detail Status 3.20 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eightdigit number. The first four digits represent the hard disk controller (HDC) error status number and the last four digits are not used.
3.20 Hard Disk Test Detail Status 3 Tests and Diagnostics Table 3-4 Error register contents Bit Name Description 7 BBK (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error. “1” … Uncorrectable data error has been detected. 5 —— Not used 4 IDN (Identification) “0” … Not used “1” … There is no ID field in the requested sector.
3 Tests and Diagnostics 3.21 3.21 Only One Test Only One Test 3.21.1 Program Description This program tests the unique functions of this model. 3.21.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter. The following menu appears in the display.
3.21 Only One Test Subtest 01 3 Tests and Diagnostics Pressed Key Display When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed. Holding a key down enables the auto-repeat function which causes the key’s display character to blink. Press Del + Enter to end the test.
3 Tests and Diagnostics Subtest 02 3.21 Only One Test Touch Pad/IPS This subtest checks the functions of the pointing stick as shown below. A) Touch Pad/IPS stick pressure sensing direction and parameter. B) Touch Pad/IPS switch function check. This test reports the pointing stick motion response from the IPS and IPS switch. When the stick is pressed towards the upper left, the display changes according to the following illustration.
3.21 Only One Test Subtest 03 3 Tests and Diagnostics Kill Switch This subtest checks if the Wireless communication switch works properly. If the test is started with the switch ON, the following message appears in the display. Kill switch is set to a start position (OFF) Slide the switch to OFF position. Then, the following message appears in the display. KILL SWITCH ON !! Slide the switch to ON position. Then, the following message appears in the display.
3 Tests and Diagnostics 3.21 Only One Test NG message appears in the display if an error is found during the test. Confirm the connection of cable, and then execute the test again. Press 9 and Enter to return to Only One Test menu. Subtest 05 LED This subtest checks if each LED lights properly. The following message appears in the display in order. Follow the instructions in the display to execute the test. [HDD Access LED test] Confirm the LED of HDD status blinks properly.
3.21 Only One Test Subtest 06 3 Tests and Diagnostics Acceleration sensor This subtest detects and corrects the each axis (X, Y, Z). NOTE: Make sure that this subtest is executed on the following condition: 1. Flat desk with vertical plane to get the stability of machine. 2. Prevent the machine from shake or shock. Set the machine against the vertical plane with the Front upward Vertical plane Flat desk The figure below shows the name and position of each side.
3 Tests and Diagnostics 3.21 Only One Test When this subtest is selected, the following message appears in the display. The revision data has written in Exit to [Enter] / Continue to [Space] key Then press Space to continue the test. The following message appears in the display. The heaven surface establishes in the upper direction Press [Enter] key NOTE: Be sure to execute the test with the display panel opened. Set the machine on the flat desk.
3.21 Only One Test 3 Tests and Diagnostics ** Setting OK! ** Press [Enter] key When a defective is found during the each check above, the following message appears in the display. The test is halted at the point when the defective is found. ** Setting ERROR! ** Press [Enter] key Press Enter and return to the Only One Test menu. Then execute the test again. Subtest 07 Button This subtest checks if the buttons in the following figure work properly.
3 Tests and Diagnostics 3.22 3.22 Head Cleaning Head Cleaning 3.22.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.22.2 Operations 1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS - FLOPPY DISK HEAD CLEANING : VX.XX Mount cleaning disk(s) on drive(s). Press any key when ready. 2.
3.23 Log Utilities 3.23 3 Tests and Diagnostics Log Utilities 3.23.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk, or output the data to a printer or the display. The error information is displayed in the following order: 1. Error count (CNT) 2. Test name, Subtest number (TS-No) 3. Pass count (PASS) 4. Error status (STS) 5. FDD/HDD or memory address (ADDR) 6. Write data (WD) 7.
3 Tests and Diagnostics 3.23 Log Utilities 3.23.2 Operations 1.
3.24 Running Test 3.24 3 Tests and Diagnostics Running Test 3.24.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02, 06) 3. Display test (subtest 01) 4. Real timer test (subtest 02) 5. HDD test (subtests 01) The system automatically detects the number of floppy disk drives connected to the computer for the FDD test. 3.24.2 Operations 1.
3 Tests and Diagnostics 3.25 3.25 Floppy Disk Drive Utilities Floppy Disk Drive Utilities 3.25.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE: This program is only for testing a floppy disk drive. It is different from the Toshiba MS-DOS FORMAT command.
3.25 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3.25.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 2 3 4 9 – - FORMAT COPY DUMP HDD-ID READ EXIT TO DIAGNOSTICS MENU 2. FORMAT program (a) Selecting FORMAT displays the following message: DIAGNOSTICS - FLOPPY DISK FORMAT : VX.
3 Tests and Diagnostics 3.25 Floppy Disk Drive Utilities 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below: Insert source disk into drive A: Press any key when ready. (c) Remove the Diagnostics Disk from the FDD, insert the source disk and press any key. The following message will appear, indicating the program has started.
3.25 Floppy Disk Drive Utilities 3 Tests and Diagnostics 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If 2:HDD is selected, the display will go to step (h). If 1:FDD is selected, the following message will appear: Select drive number (1:A, 2:B) ? (c) Select a drive number and the following message will be displayed.
3 Tests and Diagnostics 3.25 Floppy Disk Drive Utilities (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? 5. HDD ID READ program Selecting HDD ID displays the following HDD ID configuration: [HDD ID Read (VX.XX)] [Drive #1] [Drive #2] Model No. = = XXXXXXX YYYYYYY Press Enter to return to the FDD UTILITIES MENU.
3.26 System Configuration 3 Tests and Diagnostics 3 3.26 System Configuration 3.26.1 Function Description The System Configuration program contains the following configuration information for the computer: 1. Processor Type [Code/L2 cache] 2. Chip set [VRAM] 3. BIOS ROM version [1st ID, 2nd ID] 4. Boot ROM version 5. EC Total version 6. PS Microprocessor version 7. SVP parameter version [Panel/Manufacture code/Product code] 8. Microcode revision [Processor number] 9.
3 Tests and Diagnostics 3.26 System Configuration 3.26.2 Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display. System Configuration Display : Ver X.XX [Machine Name ???] * * * * * * * * * * * * * * * * * - * Processor Type = XXXXXX-XXXXXMHz Code = XX L2 Cache = XXXXXKB Chip set = XXXXXX VRAM = XXXXXXMB BIOS ROM Version = VX.XX 1st ID = XXH, 2nd ID = XXH BOOT ROM Version = VX.XX EC Total Version = VX.XX PS Micom Version = VX.
3.27 Wireless LAN Test Program (Intel-made b/g) 3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade Calexico 802.11b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made b/g) When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Using a wrong wireless LAN card (Using unspecified card) • Defective wireless LAN card Checking the connection, execute the subtest again. Subtest02 MAC Address Check This subtest displays the MAC address. Selecting this subtest, following message will appear in the display.
3.27 Wireless LAN Test Program (Intel-made b/g) Subtest03 3 Tests and Diagnostics Antenna check & communication test of 11b mode CAUTION: 1. To execute subtest 03-05, use another computer (with Calexico wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform those tests. Access points are also required. (Access point for 802.11b and 802.11g) 2. Be sure to turn the wireless communication switch ON before executing wireless LAN communication test.
3 Tests and Diagnostics Subtest04 3.27 Wireless LAN Test Program (Intel-made b/g) Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. After finishing the test, OK message will appear in the display. Press any key and return to the test menu. When a defective is found during the test, NG message will appear in the display. Press any key and following message will appear in the display.
3.28 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Intel-made a/b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade Calexico 802.11a/b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Intel-made a/b/g) If a defective is found during the test, NG message will appear in the display. Press any key and following message will appear in the display. ************************************************************* * * * SKU NG !! * * * * Other Card or Module not found * * * ************************************************************* Press any key and return to the test menu.
3.28 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Defective wireless LAN card • Disappearance of MAC address data Checking the connection, execute the subtest again. Subtest03 Antenna check & communication test of 11b mode CAUTION: 1.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Intel-made a/b/g) When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Connection of wireless LAN antenna cable (Main/Aux) • Condition of wireless LAN communication (Interference/obstruction) • Defective wireless LAN card Checking the connection and condition, execute the subtest again.
3.28 Wireless LAN Test Program (Intel-made a/b/g) Subtest05 3 Tests and Diagnostics Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. For more details on procedure and contents of this subtest, refer to Subtest04 Communication test of 11a mode. Subtest06 All the tests of Calexico 11a/ g Card This subtest checks SKU information, MAC address of Calexico 802.11a/b/g card, antenna connection and communication test of Calexico 802.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the test program. Insert the test program disk for LAN/Modem/Bluetooth/IEEE1394 test in FDD and turn on the power. The following message will appear: Microsoft Windows XX Startup Menu ---------------------------------1. LAN 2. Modem 3. Bluetooth 4.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest01 3 Tests and Diagnostics (i82562 + ICHx) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip.
3 Tests and Diagnostics Subtest02 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program (GbE) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. Select 2 to execute and press Enter. The following message will appear: Testing adapter...hit to abort. * External Loopback Test...PASSED Testing completed.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.2 3 Tests and Diagnostics Modem test For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Denki Seisakusyo)” for the tests. To execute Modem test, press 2 and Enter. Following message will appear: [Modem loopback test !] ICHx MDC Test Program with Modem Sound (Line Test) Version X.
3 Tests and Diagnostics 3.29.3 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Bluetooth test To execute this test, input 3 and press Enter. NOTE: Use another computer that can communicate by the Bluetooth as a reference machine to perform this test. Insert a floppy disk containing the test program into the target machine and turn on the target machine.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest01 3 Tests and Diagnostics BD_ADDR check This subtest checks the BD_ADDR functions. When the Bluetooth test menu is displayed, press 1 to select the test and press Enter. The following message will appear: ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program If the target machine has any problem, it displays Error CODE. The following message is displayed. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-6 Error code for Bluetooth test (BD_ADDR) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection. Hardware Failure.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Table 3-6 Error code for Bluetooth test (BD_ADDR) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics When the Bluetooth test menu is displayed, press T to select the test and press Enter in the test machine. The following message will appear: ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program If the target machine has any problem, the following message “INCOMPLETE” is displayed with the Error Code. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.4 3 Tests and Diagnostics IEEE1394 test To execute this test, input 4 and press Enter. NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test. The following menu will appear: ******************************************************************** ******** IEEE1394[XXXXX] Diagnostics program ************** ******************************************************************** * * * 1 ....
3 Tests and Diagnostics 3 3.30 Sound Test program Tests and Diagnostics 3.30 Sound Test program This section describes how to perform the Sound test. To execute the sound test, refer to the following description. Insert the test program disk for Sound test in the floppy disk drive and turn on the power.
3.30 Sound Test program 3 Tests and Diagnostics To return to the Sound test menu, Press 9 and Enter. Then following message will appear in the display. *********************************** ******** May I Restart ? ******* *********************************** Press any key to continue… After pressing any key, the machine starts rebooting and sound test menu will appear in the display. Subtest01 Microphone recording & play This subtest checks the function of the CODEC A/D, D/A converter.
3 Tests and Diagnostics Subtest02 3.30 Sound Test program Sine Wave This subtest is executed by loading the COM file (ADSIN.COM). The program expands sine wave data table from 16KB to 64KB, and creates the play data. Then it transfers the data between the DMA and the CODEC to play the sine wave. (It sounds like a continuous beep). By using wave measurable devices such as an oscilloscope, the data can be measured as a sine wave.
3.30 Sound Test program 3 Tests and Diagnostics 3.30.3 CD Sound (Standard) To execute the CD Sound (Standard) test, press 3 and Enter. Insert the test media (TOSHIBA TEST CD-ROM or ABEX TEST CD-ROM) or music CD on the market (if the test media can not be prepared). Following menu appears in the display. For details on use of test media, refer to (1) Test media (Toshiba-made test media). For details on use of audio CD on the market, refer to (2) Audio CD.
3 Tests and Diagnostics Subtest02 3.30 Sound Test program English Narration Selected this subtest, narration in English starts. For more details on the procedure, refer to the subtest01. Subtest03 Test Tone A CAUTION: Before starting subtest03, be sure to set the sound at proper volume. This subtest plays sine wave while changing its table from 100Hz to 20Hz. Return to the CD Sound (Standard) menu after the test ends.
3.30 Sound Test program 3 Tests and Diagnostics (2) Audio CD Insert an audio CD and the following menu appears in the display. CD/DVD TEST IN PROGRESS XXXXXXXX SUB-TEST PASS COUNT WRITE DATA ADDRESS XX XXXXX XX XXXXXX : : : : xxxxxxx DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.31 SETUP 3.31 SETUP 3.31.1 Function Description This program displays the current system setup information as listed below: 1. Memory 2. System Date/Time 3. Battery (a) Battery Save Mode (b) PCI Express Link ASPM (c) Enhanced C-States 4. Password 5. HDD Password (a) (b) (c) (d) HDD HDD Password Mode User Password Master Password 6. Boot Priority (a) Boot Priority (b) HDD Priority 7.
3.31 SETUP 3 Tests and Diagnostics 12. Display (a) Power On Display (b) LCD Display Stretch 13. Peripheral (a) Internal Pointing Device 14. LEGACY EMULATION (a) USB KB/Mouse Legacy Emulation (b) USB-FDD Legacy Emulation (c) USB Memory BIOS Support Type 15. PCI LAN 16.
3 Tests and Diagnostics 3.31 SETUP 3.31.
3.
3 Tests and Diagnostics 3.31 SETUP Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press ↑ and ↓ to move between items in a column. Press Fn+↑ (PgUp) and Fn + ↓ (PgDn) to move between the two pages. 2. Press either the Space bar or Back Space to change the value. Accepting Changes and Exiting the SETUP Window 1. Press End to accept the changes you made.
3.31 SETUP 3 Tests and Diagnostics SETUP Options The SETUP screen is divided into 16 functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s memory. This field displays the total amount of memory installed and is automatically calculated by the computer. You cannot change this value. 2. System Date/Time Sets the date and time. System Date Sets date. System Time Sets time. 3.
3 Tests and Diagnostics 3.31 SETUP NOTE: Display of the LCD Brightness will be changed in the condition below: (*1) Operating the battery (*2) Using the AC adapter User Setting Use this option to set the battery save parameters on the sub-window, BATTERY SAVE OPTIONS. Battery Save Options Processing Speed This feature changes the CPU processing speed. High CPU operates at 1.66/1.83/2.00/2.16GHz (Default in Full Power Mode) Low CPU operates at half processing speed.
3.31 SETUP 3 Tests and Diagnostics Cooling Method Maximum Performance If the CPU becomes too hot, the fan turns on automatically in a high speed to cool down the CPU. Performance If the CPU becomes too hot, the fan turns on automatically. When the CPU temperature falls to a normal range, the fan turns off. Battery optimized If the CPU becomes too hot, the processing speed is lowered. If the temperature is still too high, the fan turns on.
3 Tests and Diagnostics 3.31 SETUP 4. Password This option sets or resets the user password for power on. Registered The user password has been registered. Not registered The user password has not been registered. For details on setting the user password, refer to the User’s Manual. 5. HDD Password This option registers, resets or changes the HDD password. (a) HDD Hard disk for setting the password. Built-in HDD The password is set to Built-in HDD.
3.31 SETUP 3 Tests and Diagnostics 6. Boot Priority (a) Boot Priority This option sets the priority for booting the computer. Select from the following settings. FDD→HDD→CD-ROM→LAN: The computer looks for bootable files in the following order: FDD, HDD, CDROM (*1) and LAN HDD→CD-ROM→LAN→FDD: The computer looks for bootable files in the following order: HDD, CD-ROM, LAN and FDD. The computer looks for bootable files in the following order: FDD, CD-ROM, LAN and HDD.
3 Tests and Diagnostics 3.31 SETUP Second HDD →USB → Built-in HDD : The priority is set as Second HDD → USB → Built-in HDD. USB → Built-in HDD → Second HDD : The priority is set as USB → Built-in HDD → Second HDD. USB → Second HDD → Built-in HDD : The priority is set as USB → Second HDD → Built-in HDD. NOTE: If the boot command can not be detected from the prior HDD, booting target changes to other devices. Some modules may not be displayed. 7.
3.31 SETUP 3 Tests and Diagnostics (c) EXECUTE-Disable Bit Capability Selects the function to reports whether the CPU Execute-Disable Bit is available or not to OS. The Execute-Disable Bit Capability is a function that strengthens the security to protect PC from the buffer overflow attack by a computer virus and an illegal access. Available Make the Execute-Disable Bit Capability usable. (Available) Not Available Disables the Execute-Disable Bit Capability.
3 Tests and Diagnostics 3.31 SETUP The Wake-up on LAN is a function to turn on the power automatically by the call from the administrator. It can be set to “Enabled” only when “Built-in LAN” is set to “Enabled”. To activate this function, use the AC adapter. NOTE: 1. Do not remove the AC adapter and battery pack at the same time when you use this feature. If you do so, data saved by the resume function will be lost. You must also reset this option. 2.
3.31 SETUP 3 Tests and Diagnostics 8. Configuration This option lets you set the device configuration. All Devices BIOS sets all devices. Setup by OS Initializes devices, which is needed to load an operating system. Operating system initializes other devices. NOTE: 1. When using installed OS, selecting “Setup by OS” is recommended. 2. When executing test programs, be sure to select “ALL Devices”. 9.
3 Tests and Diagnostics 3.31 SETUP When Y, E, S and Enter keys are pressed, the data is disposed. After changing, the display of TPM item is changed to Disabled and this item becomes not displayed and the cursor could not be moved on the TPM item. 12. Display This group of options configures the computer’s display. (a) Power On Display This option is used to select the display when booting up. Auto-Selected Selects an external monitor if one is connected. Otherwise it selects the internal LCD.
3.31 SETUP 3 Tests and Diagnostics 13. Peripheral Use this option to select the peripheral’s mode. (a) Internal Pointing Device This option enables or disables the touch pad Enabled Enables the touch pad. (Default) Disabled Disables the touch pad. 14. LEGACY EMULATION (a) USB KB/Mouse Legacy Emulation This option sets the Legacy support condition of the USB keyboard and the USB mouse. Enabled Enables LEGACY support. (Default) USB keyboard/USB mouse are available without the driver.
3 Tests and Diagnostics 3.31 SETUP 15. PCI LAN This option sets the Enable / Disable of the built-in LAN functions. Enabled Enables built-in LAN functions. (Default) Disabled Disables built-in LAN functions. 16. RAID ARRAY Use this option to select the peripheral’s mode. This option sets the RAID configuration. (a) Current State This option indicates the current hard disk condition. Content set in “Create State” is displayed, when booting BIOS setup next time.
3.31 SETUP 3 Tests and Diagnostics destroyed. Do you really want to do this? If “Yes”, please type the key string which is written in manual. Input 1234 (press 1, 2, 3, 4 key) and press Enter. The change of the RAID configuration will be reflected.
3 Tests and Diagnostics 3-114 [CONFIDENTIAL] 3.
Chapter 4 Replacement Procedures [CONFIDENTIAL]
4 Replacement Procedures 4 4-ii [CONFIDENTIAL] PORTEGE M400 Maintenance Manual (960-541)
4 Replacement Procedures Chapter 4 4.1 Contents Overview................................................................................................................... 4-1 Safety Precautions ............................................................................................... 4-2 Before You Begin ............................................................................................... 4-3 Disassembly Procedure............................................................................
4 Replacement Procedures 4.21 HDD cable............................................................................................................... 4-57 4.22 Sensor board............................................................................................................ 4-58 4.23 Speaker.................................................................................................................... 4-59 4.24 Hinge spacer..................................................................
4 Replacement Procedures Figures Figure 4-1 Removing the battery pack................................................................................. 4-8 Figure 4-2 Removing the PC card ..................................................................................... 4-10 Figure 4-3 Removing the Bridge media............................................................................. 4-11 Figure 4-4 Removing the touch pen case...........................................................................
4 Replacement Procedures Figure 4-30 Removing the microphone/front panel........................................................... 4-47 Figure 4-31 Removing the fan ........................................................................................... 4-49 Figure 4-32 Removing the heat sink.................................................................................. 4-51 Figure 4-33 Removing the CPU ........................................................................................
4.1 Overview 4 4 Replacement Procedures Replacement Procedures 4.1 Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual.
4 Replacement Procedures 4.1 Overview Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. DANGER: 1) Always use the genuine battery that is authorized by Toshiba or compatible with the unit. Since other battery packs have different specifications, they may be incompatible with the unit, and may burst or explode.
4.1 Overview 4 Replacement Procedures Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2. Battery Pack”. Do not disassemble the computer unless it is operating abnormally. Use the designated tools. Ensure that the environment for working on and storing parts does not contain any of the following.
4 Replacement Procedures 4.1 Overview Disassembly Procedure Four main types of cable connector are used. • Pressure plate connector • Spring connector • Back flip connector • Normal pin connector When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cable out from the connector.
4.1 Overview 4 Replacement Procedures Assembly Procedure After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. • Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems. • Check that all cables and connectors are securely connected.
4 Replacement Procedures 4.1 Overview Screw Tightening Torque Use the following torque when tightening screws. CAUTION: Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage. NOTE: To tighten screws quickly and accurately, an electric screwdriver is recommended. • M2 (2mm) 0.167 N•m (1.7 kgf •cm) • M2.5 (2.5mm) 0.294 N•m(3.0 kgf•cm) • M3 (3mm) 0.549 N•m(5.
4.1 Overview 4 Replacement Procedures Grip Color Some screws have a colored grip area to help you determine the length of the screw. Even numbered length screws: Brown Odd numbered length screws: White Special length screw: Blue “Special length screw” means screws whose length is indicated in an integral number to the first decimal places such as 2.5 mm, 2.6 mm and so on.
4 Replacement Procedures 4.2 4.2 Battery pack Battery pack Removing the battery pack The following describes the procedure for removing the battery pack. (See Figure 4-1.) CAUTION: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC adapter and all other external devices from the computer. 3. Turn the computer upside down. 4.
4.2 Battery pack 4 Replacement Procedures Installing the battery pack The following describes the procedure for installing the battery pack. (See Figure 4-1.) CAUTION: There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly. Dispose always the used batteries pack in accordance with the laws and ordinances of your local authority. Use only the batteries approved by Toshiba.
4 Replacement Procedures 4.3 4.3 PC card/Bridge media PC card/Bridge media 4.3.1 PC card Removing the PC card The following describes the procedure for removing the PC card. (See Figure 4-2.) CAUTION: Insert or remove the PC card in accordance with any instructions in the PC card manual or the manuals of the computer system you are using. 1. Turn the computer upside down. 2. Push the ejection button. It will pop out. Then press the eject button once more to eject the PC card. 3.
4.3 PC card/Bridge media 4 Replacement Procedures 4.3.2 Bridge media Removing the Bridge media (SD Card/Memory Stick (Pro)/xD Picture Card) The following describes the procedure for removing the Bridge media. (See Figure 4-3.) CAUTION: Insert or remove the Bridge media in accordance with any instructions in the Bridge media manual or the manuals of the computer system you are using. 1. Push the Bridge media. It will pop out partly, so pull out the card.
4 Replacement Procedures 4.4 4.4 Touch pen case Touch pen case Removing the Touch pen case The following describes the procedure for removing the touch pen case. (See Figure 4-4.) 1. Push lightly the point shown by the arrow using an object with a thin tip. 2. Slide the touch pen case as shown in the following figure and remove it.
4.5 HDD 4.5 4 Replacement Procedures HDD Removing the HDD The following describes the procedure for removing the HDD. (See Figure 4-5 to 4-7.) CAUTION: Take care not to press on the top or bottom of the HDD. Pressure may cause data loss or damage to the device. 1. Turn the computer upside down. 2. Loosen two screws (with e-ring) fixing the HDD slot cover and remove the HDD slot cover.
4 Replacement Procedures 4.5 HDD 3. Hold the tab to raise the HDD assembly straight and pull out the HDD assembly from the connector of the HDD cable. NOTE: When removing the HDD assembly, be careful not to tear the tab. If the tab is torn, replace the HDD holder with a new one.
4.5 HDD 4 Replacement Procedures 4. Place the HDD assembly on a flat surface and remove the following screws fixing the HDD holder. • M3.0×4.0S ×4 FLAT HEAD screw 5. Detach the HDD holder and HDD. HDD holder (HDD frame and tab) M3.0x4.0S FLAT HEAD M3.0x4.0S FLAT HEAD M3.0x4.
4 Replacement Procedures 4.5 HDD Installing the HDD The following describes the procedure for installing the HDD. (See Figure 4-5 to 4-7.) CAUTION: Do not hold the HDD by its top and bottom flat surfaces. It may damage the HDD. 1. Seat the HDD in the HDD holder and secure them with the following screws. • M3.0×4.0S FLAT HEAD screw ×4 CAUTION: Do not apply pressure to the middle of the HDD assembly. It may damage the HDD assembly. Hold the HDD assembly by its corners. 2.
4.6 Slim select bay module 4.6 4 Replacement Procedures Slim select bay module Removing the slim select bay module The following describes the procedure for removing the slim select bay module. (See Figure 4-8 and 4-9.) The explanation and figure shown below are the optical drive removing/installing. CAUTION: Do not put fingers in the slim select bay module. It may cause injury. 1. Remove the following screw securing the latch and drive the removed screw into the screw hole.
4 Replacement Procedures 4.6 Slim select bay module 2. Remove the following screws, connector cover and connector from the optical drive assembly. • M2.0×6.0S ×2 BIND screw 3. Remove the following screw and connector base from the optical drive assembly. • M2.0×3.0S S-THIN HEAD screw ×1 4. Remove the following screws and ODD side assembly from the optical drive assembly • M2.0×6.0S BIND screw ×1 • M2.0×22.0S BIND screw ×1 Connector base Connector M2.0×6.0S BIND M2.0×22.0S BIND M2.0×3.
4.6 Slim select bay module 4 Replacement Procedures Installing the slim select bay module The following describes the procedure for installing the slim select bay module. (See Figure 4-8 and 4-9.) 1. Install the ODD side assembly to the optical drive assembly and secure it with the following screws. • M2.0×6.0S BIND screw ×1 • M2.0×22.0S BIND screw ×1 2. Install the connector base to the optical drive assembly and secure it with the following screw. • M2.0×3.0S S-THIN HEAD screw ×1 3.
4 Replacement Procedures 4.7 4.7 Keyboard Keyboard Removing the keyboard The following describes the procedure for removing the keyboard. (See Figure 4-10 to 4-13.) 1. Turn the computer face up. 2. Open the display and make it flat. 3. Insert your fingers into the slot on both sides and lift up the keyboard holder to remove.
4.7 Keyboard 4 Replacement Procedures 4. Remove the following screws securing the keyboard. • M2.0×3.0S BIND screw ×2 5. Lift the top edge of the keyboard while releasing two latches and turn it face down on the palm rest. Latch M2.0x3.0S BIND M2.0x3.
4 Replacement Procedures 4.7 Keyboard 6. Remove the following screw and keyboard cover. • M2.5×3.0S S-THIN HEAD screw ×1 M2.5x3.0S S-THIN HEAD Keyboard cover Figure 4-12 Removing the keyboard cover 7. Disconnect the keyboard flexible cable from the connector CN3230 on the system board and remove the keyboard.
4.7 Keyboard 4 Replacement Procedures Installing the keyboard The following describes the procedure for installing the keyboard. (See Figure 4-10 to 4-13.) 1. Place the keyboard face down on the palm rest. 2. Connect the keyboard flexible cable to the connector CN3230 on the system board. 3. Install the keyboard cover and secure it with the following screw. (Insert the guide of the keyboard cover first) • M2.5×3.
4 Replacement Procedures 4.8 4.8 Memory module Memory module CAUTION: The power must be turned off when you remove the memory module. Removing the memory module with the power on risks damaging the module or the computer itself. Do not touch the memory module terminals. Any dirt on the terminals may cause memory access problems. Never press hard or bend the memory module. Removing the memory module To remove the memory module(s), make sure the computer is in boot mode and powered off.
4.8 Memory module 4 Replacement Procedures 2. Open the left and right latches and remove the memory module(s).
4 Replacement Procedures 4.8 Memory module Installing the memory module To install the memory module(s), make sure the computer is in boot mode and powered off. Then perform the following procedure. (See Figure 4-14 and 4-15.) 1. Insert the memory module(s) into the connector slantwise (terminal side first) and press it to connect firmly. CAUTION: The power must be turned off when you insert the memory module. Inserting the memory module with the power on risks damaging the module or the computer itself.
4.9 Bluetooth module 4.9 4 Replacement Procedures Bluetooth module Removing the Bluetooth module To remove the Bluetooth module, follow the steps below. (See Figure 4-16.) CAUTION: Do not try to remove the Bluetooth module with the computer turned on. You can damage the computer or Bluetooth module. Do not touch the connectors on the Bluetooth module on the computer. Debris on the connectors may cause Bluetooth access problems. 1. Peel off the insulator and spacer. 2.
4 Replacement Procedures 4.9 Bluetooth module Installing the Bluetooth module To install the Bluetooth module, follow the steps below. (See Figure 4-16.) 1. Connect the Bluetooth cable to the connector on the Bluetooth module. 2. Connect the Bluetooth cable to the connector CN4400 on the system board and set the Bluetooth module to the slot in place. 3. Connect the Bluetooth antenna cable to the connector on the Bluetooth module. 4. Stick the spacer in place referring Figure 4-16. 5. Stick the glass tape.
4.10 Wireless LAN card 4 Replacement Procedures 4.10 Wireless LAN card Removing the Wireless LAN card To remove the Wireless LAN card, follow the steps below. (See Figure 4-17.) CAUTION: Do not try to remove the wireless LAN card with the computer turned on. The computer or the wireless LAN card can be damaged. Do not touch the connectors on the wireless LAN card on the computer. Debris on the connectors may cause the wireless LAN card access problems. 1. Peel off the insulator. 2.
4 Replacement Procedures 4.10 Wireless LAN card Installing the Wireless LAN card To install the Wireless LAN card, follow the steps below. (See Figure 4-17.) CAUTION: Be sure to switch the computer off before installing the wireless LAN card. Otherwise, the computer or the wireless LAN card may be damaged. 1. Insert the wireless LAN card to the connector slantwise and press it to connect firmly. 2.
4.11 Touch pad 4 Replacement Procedures 4.11 Touch pad Removing the Touch pad The following describes the procedure for removing the touch pad. (See Figure 4-18 to 4-21.) 1. Turn over the computer and remove the following screw. • M2.5×10.0B ×1 FLAT HEAD screw M2.5×10.
4 Replacement Procedures 4.11 Touch pad 2. Turn the computer face up and open the display. 3. Remove the touch pad cover while releasing the latches.
4.11 Touch pad 4 Replacement Procedures 4. Disconnect the touch pad cable from the connector CN3240 on the system board. 5. Remove the following screws fixing the touch pad assembly. • M2.0×3.0S S-THIN HEAD screw ×2 6. Remove the touch pad assembly while peeling the adhered portion. M2.0×3.0S S-THIN HEAD M2.0×3.
4 Replacement Procedures 4.11 Touch pad 7. Peel off the glass tape and disconnect the touch pad cable from the connector on the touch pad.
4.11 Touch pad 4 Replacement Procedures Installing the Touch pad The following describes the procedure for installing the touch pad. (See Figure 4-18 to 4-21.) 1. Connect the touch pad cable to the connector on the touch pad and stick the glass tape. 2. Install the touch pad assembly to the slot and secure it with the following screws. • M2.0×3.0S S-THIN HEAD screw ×2 3. Connect the touch pad cable to the connector CN3240 on the system board. 4. Install the touch pad cover while engaging latches. 5.
4 Replacement Procedures 4.12 Top cover assembly 4.12 Top cover assembly Removing the top cover assembly The following describes the procedure for removing the top cover assembly. (See Figure 422 and 4-26.) 1. Close the display and turn over the computer. 2. Remove the following screws. • M2.5×10.0B FLAT HEAD screw ×2 (“10” in the figure below) • M2.5×6.
4.12 Top cover assembly 4 Replacement Procedures 3. Turn the computer face up. 4. Open the display and make it flat. 5. Remove the following screws. • M2.0×4.0B BIND screw ×2 M2.0×4.
4 Replacement Procedures 4.12 Top cover assembly 6. Disconnect the speaker cable, NP board cable, LCD cable and digitizer cable from the connector CN6170, CN9500, CN5500, and CN9540 on the system board.
4.12 Top cover assembly 4 Replacement Procedures 7. Remove the following screw. • M2.5×10.0B FLAT HEAD screw ×1 8. Remove the hinge rear cover. 9. Turn the display 90 degrees and remove the following screws. • M2.5×6.0B FLAT HEAD screw ×2 M2.5×10.0B FLAT HEAD M2.5×6.
4 Replacement Procedures 4.12 Top cover assembly 10. Lift up the top cover assembly from the base assembly.
4.12 Top cover assembly 4 Replacement Procedures Installing the top cover assembly The following describes the procedure for installing the top cover assembly. (See Figure 4-22 and 4-26.) 1. Install the top cover assembly to the base assembly. 2. Turn the display 90 degrees. 3. Secure the following screws. • M2.5×6.0B FLAT HEAD screw ×2 4. Turn the display 90 degrees. (The display is returned to the former position.) 5. Install the hinge rear cover. 6. Secure the following screw. • M2.5×10.
4 Replacement Procedures 4 4.13 System board/RTC battery Replacement Procedures 4.13 System board/RTC battery Removing the System board/RTC battery The following describes the procedure for removing the system board/RTC battery. (See Figure 4-27.) 1. Remove the following screws securing the system board. • M2.5×6.0B ×3 FLAT HEAD screw 2. Turn up the insulator and remove the RTC battery from the slot. 3. Remove the system board (with the RTC battery). 4.
4.13 System board/RTC battery 4 Replacement Procedures Installing the system board/RTC battery The following describes the procedure for installing the system board/RTC battery. (See Figure 4-27.) 1. Connect the RTC battery cable to the connector CN9300 on the system board. 2. Install the system board to the base assembly and secure it with the following screws. • M2.5×6.0B FLAT HEAD screw ×3 NOTE: Make sure the system board is on the front panel.
4 Replacement Procedures 4.13 System board/RTC battery 3. Install the RTC battery to the slot and wrap it with the insulator. CAUTION: When installing new system board, stick new keyboard supports on the system board.
4.14 Cover latch 4 Replacement Procedures 4.14 Cover latch Removing the Cover latch The following describes the procedure for removing the cover latch. (See Figure 4-28.) 1. Remove the cover cap on the bottom while releasing latches. 2. Peel off the insulator on the cover latch. 3. Remove the cover latch to the direction in the figure below. Be careful not lose the spring.
4 Replacement Procedures 4.15 Battery lock assembly/Pen holder assembly 4.15 Battery lock assembly/Pen holder assembly Removing the Battery lock assembly/Pen holder assembly The following describes the procedure for removing the battery lock assembly/pen holder assembly. (See Figure 4-29.) 1. Remove the pen holder assembly from the slot. 2. Remove the battery lock assembly from the slot.
4.16 Microphone/Front panel 4 Replacement Procedures 4.16 Microphone/Front panel Removing the Microphone/Front panel The following describes the procedure for removing the microphone/front panel. (See Figure 4-30.) 1. Peel off the insulator and glass tape. 2. Disconnect two microphone cables (left and right) from the connector CN6060 and CN6061 on the system board. 3. Remove the front panel from the base assembly. 4.
4 Replacement Procedures 4.16 Microphone/Front panel Installing the Microphone/Front panel The following describes the procedure for installing the microphone/front panel. (See Figure 4-30.) 1. Install the microphones (left and right) to the front panel. 2. Install the microphone hold plates (left and right) to the front panel. 3. Install the front panel to the system board in place. 4. Connect two microphone cables (left and right) to the connector CN6060 and CN6061 on the system board. 5.
4.17 Fan 4 Replacement Procedures 4.17 Fan Removing the Fan The following describes the procedure for removing the fan. (See Figure 4-31.) 1. Turn over the system board. 2. Peel off the glass tape and disconnect the fan cable from the connector CN8781 on the system board. 3. Turn the system board face up. 4. Remove the following screws and fan. • M2.5×4.0B FLAT HEAD screw ×2 M2.5x4.
4 Replacement Procedures 4.17 Fan Installing the Fan The following describes the procedure for installing the fan. (See Figure 4-31.) 1. Install the fan and secure it with the following screws. • M2.5×4.0B FLAT HEAD screw ×2 2. Turn over the system board. 3. Connect the fan cable to the connector CN8781 on the system board and stick the glass tape.
4.18 Heat sink/CPU 4 Replacement Procedures 4.18 Heat sink/CPU Removing the Heat sink/CPU The following describes the procedure for removing the heat sink/CPU. (See Figure 4-32 and 4-33.) 1. Turn over the system board. 2. Remove the following screws securing the CPU hold plate in the reverse order of the numbers marked on the CPU hold plate and remove the CPU hold plate. • M2.0×4.0B BIND screw ×3 CAUTION: Remove the screws in the order of mark “3”, “2” and “1” on the CPU holder. M2.0x4.0B BIND M2.0x4.
4 Replacement Procedures 4.18 Heat sink/CPU 3. Remove the heat sink on the CPU. CAUTION: When removing the heat sink, be careful not to damage the CPU under the fin. 4. Unlock the CPU by rotating counterclockwise the cam on the CPU socket by 90 degrees with a flat-blade driver. Figure 4-33 Replacing the CPU 4. Remove the CPU. CAUTION: When removing the CPU, lift it up right above. Otherwise, pins of CPU may be damaged.
4.18 Heat sink/CPU 4 Replacement Procedures Installing the Heat sink/CPU The following describes the procedure for installing the heat sink/CPU. (See Figure 4-32 to 4-34.) 1. Make sure that the cam of the CPU socket is in the unlock (OPEN) position. 2. Install the CPU on the CPU socket and check the CPU is installed on the correct position. 3. Lock the CPU by rotating clockwise the cam on the CPU socket by 90 degrees with a flat-blade driver. 4.
4 Replacement Procedures 4.19 MDC 4.19 MDC Removing the MDC The following describes the procedure for removing the MDC. (See Figure 4-35 and 4-36.) 1. Remove the following screws securing the MDC. • M2.0×4.0B ×2 BIND screw 2. Remove the MDC from the connector CN3010 on the system board. 3. Disconnect the MDC cable from the connector on the MDC. M2.0x4.0B BIND M2.0x4.
4.19 MDC 4 Replacement Procedures 4. Turn up two points of insulator and disconnect the MDC cable from the connector CN4100 on the system board. MDC cable Insulator CN4100 Figure 4-36 Removing the modem cable Installing the MDC The following describes the procedure for installing the MDC. (See Figure 4-35 and 4-36.) 1. Connect the MDC cable to the connector CN4100 on the system board and wrap it with insulator. 2. Connect the MDC cable to the connector on the MDC. 3.
4 Replacement Procedures 4.20 GPU heat sink 4.20 GPU heat sink Removing the GPU heat sink The following describes the procedure for removing the GPU heat sink. (See Figure 4-37.) 1. Remove the following screws and GPU heat sink. • M2.0×3.0S S-THIN HEAD screw ×2 M2.0x3.0S S-THIN HEAD GPU heat sink Figure 4-37 Removing the GPU heat sink Installing the GPU heat sink The following describes the procedure for installing the GPU heat sink. (See Figure 4-37.) 1.
4.21 HDD cable 4 Replacement Procedures 4.21 HDD cable Removing the HDD cable The following describes the procedure for removing the HDD cable. (See Figure 4-38.) 1. Peel off the insulator and disconnect the HDD cable from the connector CN1850 on the system board. 2. Remove the HDD cable from the slot. Insulator HDD cable CN1850 Figure 4-38 Removing the HDD cable Installing the HDD cable The following describes the procedure for installing the HDD cable. (See Figure 4-38.) 1.
4 Replacement Procedures 4.22 Sensor board 4.22 Sensor board Removing the Sensor board The following describes the procedure for removing the sensor board. (See Figure 4-39.) 1. Remove the sensor board from the slot. 2. Disconnect the sensor cable from the connector on the sensor board. Sensor board Sensor cable Figure 4-39 Removing the sensor board Installing the Sensor board The following describes the procedure for installing the sensor board. (See Figure 4-39.) 1.
4.23 Speaker 4 Replacement Procedures 4.23 Speaker Removing the speaker The following describes the procedure for removing the speaker. (See Figure 4-40 and 4-41.) 1. Peel off the insulator and remove the harness box cover. 2. Remove the following screws. • M2.5×6.0B FLAT HEAD screw ×2 3. Peel off two insulators and one acetate tape. M2.5x6.
4 Replacement Procedures 4.23 Speaker 4. Remove the speaker covers while releasing latches. 5. Peel off the insulator and two acetate tapes and take the speakers out of the speaker slots. Speaker cover Acetate tape Speaker cover Speaker Speaker Insulator Figure 4-41 Removing the speaker 6. Remove the middle frame.
4.23 Speaker 4 Replacement Procedures Installing the speaker The following describes the procedure for installing the speaker. (See Figure 4-40 and 4-41.) 1. Install the middle frame to the top cover. 2. Install the speaker to the slot on both sides. 3. Install the speaker covers to the slot on both sides while hooking the latches. 4. Arrange the speaker cable in place. 5. Stick two insulators and three acetate tapes in place. 6. Secure the following screws to fix the middle frame and top cover. • M2.
4 Replacement Procedures 4.24 Hinge spacer 4.24 Hinge spacer Removing the hinge spacer The following describes the procedure for removing the hinge spacer. (See Figure 4-42.) 1. Remove the following screws and hinge spacer. • M2.5×6.0B FLAT HEAD screw ×2 M2.5x6.0B FLAT HEAD Hinge spacer Figure 4-42 Removing the hinge spacer Installing the hinge spacer The following describes the procedure for installing the hinge spacer. (See Figure 4-42.) 1.
4.25 LCD unit/FL inverter 4 Replacement Procedures 4.25 LCD unit/FL inverter Removing the LCD unit/FL inverter The following describes the procedure for removing the LCD unit/FL inverter. (See Figure 443 to 4-46.) NOTE: When replacing the LCD unit, do not give the hinge portion a strong press. It may cause the breakage of the hinge assembly. Also, Use a stand or something under the LCD part to keep the LCD part level while replacing it. 1. Turn the display 180 degree and close the display.
4 Replacement Procedures 4.25 LCD unit/FL inverter 4. Peel off one insulator from the FL inverter and take out the other one under the LCD unit. 5. Remove the FL inverter from the slot while peeling the adhered portion. 6. Disconnect two cables from the connector of the FL inverter.
4.25 LCD unit/FL inverter 4 Replacement Procedures 7. Remove the following screws securing the LCD unit. • M2.0×4.0B BIND screw ×4 8. Raise the top edge of the LCD unit on the display cover. NOTE: When putting the LCD unit on the display cover, lay a mat or something under the LCD unit to protect the computer and the LCD from a scratch or breakage. M2.0x4.0B BIND M2.0x4.
4 Replacement Procedures 4.25 LCD unit/FL inverter 9. Peeling off two glass tapes and disconnect the LCD cable and digitizer cable from the connectors on the back of the LCD unit. CAUTION: When removing the cables, be careful not to damage the connectors. 10. Remove the LCD unit from the display cover.
4.25 LCD unit/FL inverter 4 Replacement Procedures Installing the LCD unit/FL inverter The following describes the procedure for installing the LCD unit/FL inverter. (See Figure 443 to 4-46.) 1. Stand the LCD unit on the display cover and connect the digitizer cable and LCD cable on the back of the LCD unit. 2. Stick two glass tapes on each connector. 3. Install the LCD unit to the display cover and secure it with the following screws. • M2.0×4.0B ×4 BIND screw 4. Stick the FL inverter to the slot.
4 Replacement Procedures 4.26 Digitizer 4.26 Digitizer CAUTION: Read following instructions before handling the Digitizer. Do not carry the LCD module by holding the FL cable in one’s hand because it may result to cut the FL cable, and cause display function failure or lighting failure. Be careful to use the bezel guide. There is a portion where the bezel is sticking out because of the digitizer guide. Do not press and rub the portion with bare hands or it may result cut your finger.
4.26 Digitizer 4 Replacement Procedures Do not make any scratches on the B/L and TAB by the edge of the digitizer when installing the digitizer because it may result to break the TAB or make scratches on the B/L and cause display function failure. Do not pull up the PCB hardly when installing the digitizer because it may result to give stress on the TAB or PCB and cause the display function failure. Make sure that three latches fit the digitizer securely.
4 Replacement Procedures 4.26 Digitizer Do not turn up the digitizer because it may result to give stress on the TAB or PCB and cause the display function failure. Do not put any instrument on the LCD module because it may result to make scratch on the cell, polarization sheet or B/L and break the TAB and may cause the display function failure.
4.26 Digitizer 4 Replacement Procedures Do not hold, press and rub the TAB because it may result to break the TAB and cause the display function failure. Make sure to put the LCD module on the flat place. If the LCD module is put on the uneven place, it may result to break the TAB, make scratch on the B/L or polarization sheet and cause the display function failure.
4 Replacement Procedures 4-72 [CONFIDENTIAL] 4.
4.26 Digitizer 4 Replacement Procedures Removing the Digitizer The following describes the procedure for removing the digitizer. (See Figure 4-47.) 1. Remove the following screws securing the digitizer. • M2.0×4.0B BIND screw ×2 2. Peel off two glass tapes. 3. Slide out the digitizer toward the arrow pointing. Glass tape M2.0x4.0B BIND M2.0x4.
4 Replacement Procedures 4.26 Digitizer Installing the digitizer The following describes the procedure for installing the digitizer. (See Figure 4-47.) 1. Slide the digitizer into the back pocket of the LCD. CAUTION: When replacing the digitizer, fit the digitizer into the back of the LCD toward the arrow pointing. 2. Stick two glass tapes. 3. Secure the digitizer with the following screws. • M2.0×4.
4.27 Fingerprint sensor board (NF board) 4 Replacement Procedures 4.27 Fingerprint sensor board (NF board) Removing the Fingerprint sensor board (NF board) The following describes the procedure for removing the fingerprint sensor board (NF board). (See Figure 4-48.) 1. Remove the following screw and fingerprint sensor board. • M2.5×4.0B FLAT HEAD screw ×1 2. Disconnect the fingerprint sensor cable from the connector CN9560 on the finger print sensor board. M2.5x4.
4 Replacement Procedures 4.28 Switch board (NW board) 4.28 Switch board (NW board) Removing the Switch board (NW board) The following describes the procedure for removing the switch board (NW board). (See Figure 4-49.) 1. Remove the following screw securing the switch board and pull up the switch board. • M2.5×4.0B FLAT HEAD screw ×1 2. Disconnect the switch cable from the connector CN9550 on the switch board. M2.5x4.
4.29 LCD latch assembly 4 Replacement Procedures 4.29 LCD latch assembly Removing the LCD latch assembly The following describes the procedure for removing the LCD latch assembly. (See Figure 450.) 1. Remove the LCD latch assembly from the slot as shown in the following figure. LCD latch assembly Figure 4-50 Removing the LCD latch assembly Installing the LCD latch assembly The following describes the procedure for installing the LCD latch assembly. (See Figure 450.) 1.
4 Replacement Procedures 4.30 Hinge assembly 4.30 Hinge assembly Removing the Hinge assembly The following describes the procedure for removing the hinge assembly. (See Figure 4-51 and 4-52.) 1. Remove the following screw and Harness holder. • M2.5×6.0B FLAT HEAD screw ×1 2. Remove the following screws and LCD harness earth spring. • M2.5×6.0B FLAT HEAD screw ×1 3. Remove the following screw, antenna cover S and antenna cover T from the slot. • M2.0×6.0S S-THIN HEAD screw ×1 M2.5×6.
4.30 Hinge assembly 4 Replacement Procedures 4. Peel off four acetate tapes and remove the wireless LAN antennas and Bluetooth antenna. 5. Remove the following screw and hinge assembly by lifting it up. • M2.5×6.0B FLAT HEAD screw ×1 Acetate tape Acetate tape Bluetooth antenna Wireless LAN antenna Figure 4-52 Removing the hinge assembly (2) Installing the Hinge assembly The following describes the procedure for installing the hinge assembly. (See Figure 4-51 and 4-52.) 1.
4 Replacement Procedure 4.31 Fluorescent lamp 4 4.31 Fluorescent lamp This system uses LCD modules from the following suppliers. The procedure for replacing the fluorescent lamp is different for each LCD module. Refer to the appropriate procedure. Type Part No. Supplier Section 12.1-inch (XGA) G33C00037110 TMD 4.31.1 12.1-inch (SXGA+) G33C00019210 TMD 4.31.1 NOTE: - When working with a LCD module, always use a flat, grounded table.
4.31 Fluorescent lamp 4 Replacement Procedure 4.31.1 Replacing the 12.1 Inch TMD Fluorescent lamp The procedures for replacing Fluorescent of lamp of G33C00037110 and of G33C00019210 are the same. The following describes the procedure for replacing the fluorescent lamp (See Figure 4-53 to 4-64). Disassembling Fluorescent lamp Peeling off the tapes and insulation sheets 1. Turn the back of module up and place it on a flat surface that is free of foreign objects.
4 Replacement Procedure 4.31 Fluorescent lamp Figure 4-53 Replacing 12.
4.31 Fluorescent lamp 4 Replacement Procedure Removing the screws 1. Remove the bezel tape 2 and bezel tape 1. 2. Spread the insulation sheet. Figure 4-54 Replacing 12.
4 Replacement Procedure 4.31 Fluorescent lamp 3. Remove one screw. CAUTION: To unfasten the screws, use an insert bit of point size 0 for Philips screwdrivers. Figure 4-55 Replacing 12.
4.31 Fluorescent lamp 4 Replacement Procedure Removing the bezel 1. Without removing the insulation tape, turn the face of module up. 2. Release the four latches of the bezel and frame (two positions on each side). With holding up the bezel from the lower side (FL lamp side), release the three latches on the top to remove the bezel from the cell. (The bezel is reused.) CAUTION: 1. Do not damage the latches and FPC. 2. When removing the bezel, be careful not to deform the bezel.
4 Replacement Procedure 4.31 Fluorescent lamp Opening the PCB 1. Spread out the PCB horizontally. CAUTION: Be careful not to damage the FPC. Figure 4-57 Replacing 12.
4.31 Fluorescent lamp 4 Replacement Procedure Removing the cell with PCB 1. Remove the cell with PCB from the backlight unit as shown bellow. 2. Completely remove the double-sided tape remaining on the reverse side of the cell. CAUTION: 1. A portion of the upper side of cell is adhered to the frame with the double-sided tape. Remove the cell gently, taking care not to damage it. 2. Do not remove the ray-shield tape on the upper, lower, right and left of face and back of cell. 3.
4 Replacement Procedure 4.31 Fluorescent lamp Assembling Fluorescent lamp Check of the backlight replaced 1. Check the following items. Figure 4-59 Replacing 12.
4.31 Fluorescent lamp 4 Replacement Procedure Assembling the cell with PCB 1. Remove the separator from the double-sided tape on the backlight unit. 2. Turn the backlight on. 3. Check that the backlight is free of dust, foreign objects, or damage. Perform this check also for the reverse side of the cell. Then install the cell with PCB in the backlight unit. CAUTION: 1. Align the top left corner of the cell with the corresponding corner of the backlight unit. 2. Be careful not to damage the TAB.
4 Replacement Procedure 4.31 Fluorescent lamp Folding the FPC/PCB 1. Fold down the FPC (PCB) toward the reverse side of the backlight unit. CAUTION: Be careful not to damage the TAB. Figure 4-61 Replacing 12.
4.31 Fluorescent lamp 4 Replacement Procedure Setting the bezel 1. Fit the bezel into the frame from the TAB side. ((1) in the bellow figure) 2. Set two latches on the side. ((2) in the bellow figure) 3. Set the latches on the bottom side. ((3) in the bellow figure) CAUTION: Be careful not to damage the cell, FPC and B/L. Figure 4-62 Replacing 12.
4 Replacement Procedure 4.31 Fluorescent lamp Fasten screws of the PCB and bezel 1. Fasten four screws. ((1) in the bellow figure) CAUTION: 1. The tightening torque must be 0.147Ｎ m (1.5kgf･cm) for all the screws. 2. Use an insert bit of point size 0 for the Philips screwdrivers. Figure 4-63 Replacing 12.
4.31 Fluorescent lamp 4 Replacement Procedure Attaching the tapes and insulation sheet 1. Attach the double-sided tape of insulation sheet (1). 2. Attach one bezel tape (2). 2. Attach two bezel tapes (3). CAUTION: When attaching tape and insulation sheet, be careful not to damage the PCB, cell and B/L. Figure 4-64 Replacing 12.
4 Replacement Procedure 4-94 [CONFIDENTIAL] 4.
Appendices [CONFIDENTIAL]
Appendices App-ii [CONFIDENTIAL] PORTEGE M400 Maintenance Manual (960-541)
Appendices Appendix Contents Appendix A Handling the LCD Module......................................................................... A-1 Appendix B Board Layout................................................................................................B-1 B.1 System board Front View ..............................................................................B-1 B.2 System board Back View...............................................................................B-3 B.
Appendices C.18 CN4611 USB connector (Port 4) (4-pin) ................................................... C-18 C.19 CN4612 USB connector (Port 0) (6-pin) ................................................... C-18 C.20 CN5500 LCD connector (40-pin) .............................................................. C-19 C.21 CN5080 RGB connector (15-pin).............................................................. C-19 C.22 CN6060 Internal microphone (left) connector (2-pin)..............................
Appendices Appendix D Keyboard Scan/Character Codes .............................................................. D-1 Appendix E Key Layout ...................................................................................................E-1 Appendix F Wiring Diagrams..........................................................................................F-1 Appendix G BIOS Rewrite Procedures ..........................................................................
Appendices Figures Figure B-1 System board layout (front) ...........................................................................B-1 Figure B-2 System board layout (back) ...........................................................................B-3 Figure B-3 NP board layout .............................................................................................B-5 Figure B-4 NW board layout............................................................................................
Appendices Table C-3 Select bay I/F connector (72-pin) ................................................................. C-7 Table C-4 SATA I/F connector (10-pin)........................................................................ C-8 Table C-5 PC card I/F connector (70-pin) ..................................................................... C-8 Table C-6 Bridge Media I/F connector (42-pin)..........................................................
Appendices NF board (FAPNF*) Table C-34 System board I/F connector (6-pin) ............................................................ C-24 NP board (FAPNP*) Table C-35 System board I/F connector (3-pin) ............................................................ C-25 NW board (FAPNW*) Table C-36 System board I/F connector (15-pin) .......................................................... C-26 Table D-1 Scan codes (set 1 and set 2) .................................................................
Appendix A Handling the LCD Module Appendices Appendix A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
Appendices Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4.
Appendix A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
Appendices Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
Appendix A Handling the LCD Module Appendices 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxime). These materials can release gas that can damage the panel’s polarization.
Appendices A-6 Appendix A Handling the LCD Module [CONFIDENTIAL] PORTEGE M400 Maintenance Manual (960-541)
Appendix B Board Layout Appendices Appendix B Appendix B Board Layout B.
Appendices Appendix B Board Layout Table B-1 System board ICs and connectors (front) Number B-2 Part’s name IS2101 Bridge media connector CN1400 Memory connector (A) CN1410 Memory connector (B) CN2600 Wireless LAN I/F connector CN9500 NP board I/F connector CN4400 Bluetooth module I/F connector CN6170 Speaker connector CN9540 Digitizer I/F connector CN5500 LCD I/F connector CN3230 Keyboard connector CN3240 Touch pad connector IC2000 Card controller CN2110 PC card I/F connector
Appendix B Board Layout B.
Appendices Appendix B Board Layout Table B-2 System board ICs and connectors (back) B-4 Number Name CN8800 DC-IN jack CN4612 USB port 0 CN5080 RGB connector CN1810 ODD connector CN8810 Battery connector IC1200 AlvisioPM CN2300 Port replicator I/F connector CN3010 MDC connector VR6240 Sound volume J6310 Headphone jack J6070 External microphone jack CN4100 Modem relay connector CN4200 1394 connector CN4611 USB port 4 CN4610 USB port 6 CN1850 HDD I/F connector CN8781 Fan
Appendix B Board Layout B.
Appendices B.
Appendix B Board Layout B.
Appendices B-8 Appendix B Board Layout [CONFIDENTIAL] PORTEGE M400 Maintenance Manual (960-541)
Appendix. C Pin Assignment Appendix. C Appendices Pin Assignment Appendix C Pin Assignment System board (FAPNS*) C.1 CN1410 Memory B connector (200-pin) Table C-1 Memory B connector (200-pin) (1/3) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment Table C-1 Memory B connector (200-pin)(2/3) Pin No. C-2 Signal Name I/O Pin No. Signal Name I/O 58 BDQ20-B1P - 60 GND I/O 57 BDQ22-B1P I/O 59 GND 61 BDQ30-B1P I/O 62 BDQ24-B1P I/O 63 BDQ28-B1P I/O 64 BDQ25-B1P I/O 65 GND - 66 GND 67 BDM3-B1P I 68 BDQS3-B1N I/O 69 N.C.
Appendix. C Pin Assignment Appendices Table C-1 Memory B connector (200-pin) (3/3) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment C.2 CN1400 Memory A connector (200-pin) Table C-2 Memory A connector (200-pin)(1/3) C-4 Pin No. Signal Name I/O Pin No.
Appendix. C Pin Assignment Appendices Table C-2 Memory A connector (200-pin)(2/3) Pin No. Signal Name I/O Pin No. Signal Name I/O I/O 69 N.C. - 70 ADQS3-B1P 71 GND - 72 GND 73 ADQ27-B1P I/O 74 ADQ30-B1P I/O 75 ADQ26-B1P I/O 76 ADQ31-B1P I/O 77 GND - 78 GND - 79 MCKE0-B1P I 80 MCKE1-B1P I 81 1R8-B1V I 82 1R8-B1V I 83 N.C. - 84 N.C - 85 ABS2-B1P I 86 N.
Appendices Appendix. C Pin Assignment Table C-2 Memory A connector (200-pin )(3/3) Pin No. C-6 Signal Name I/O Pin No.
Appendix. C Pin Assignment Appendices C.3 CN1810 Select bay I/F connector (72-pin) Table C-3 Select bay I/F connector (72-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment C.4 CN1850 SATA I/F connector (10-pin) Table C-4 SATA I/F connector (10-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 ZSATT0-P3P O 2 ZSATT0-P3N O 3 GND - 4 ZSATR0-P3N I 5 ZSATR0-P3P I 6 GND - 7 P3V - 8 GND - 9 P5V - 10 GND - 1T GND - 2T GND - 3T GND - 4T GND - C.5 CN2110 PC card I/F connector (70-pin) Table C-5 PC card I/F connector (70-pin)) (1/2) Pin No. C-8 Signal Name I/O Pin No.
Appendix. C Pin Assignment Appendices Table C-5 PC card I/F connector (70-pin) (2/2) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment C.6 IS2101 Bridge Media I/F connector (42-pin) Table C-6 Bridge Media I/F connector (42-pin) Pin No. C-10 Signal Name I/O Pin No.
Appendix. C Pin Assignment Appendices C.7 CN2300 Docking I/F connector (140-pin) Table C-7 Docking I/F connector (140-pin) (1/2) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment Table C-7 Docking I/F connector (140-pin) (2/2) Pin No. C-12 Signal Name I/O Pin No.
Appendix. C Pin Assignment Appendices C.8 CN2600 PCI-Express mini card (WLAN) I/F connector (52-pin) Table C-8 PCI-Express mini card (WLAN) I/F connector (52-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment C.9 CN2610 PCI-Express mini card (3G) I/F connector (52-pin) Table C-9 PCI-Express mini card (3G) I/F connector (52-pin) C-14 Pin No. Signal Name I/O Pin No.
Appendix. C Pin Assignment Appendices C.10 CN3010 MDC I/F connector (12-pin) Table C-10 MDC I/F connector (12-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O - 2 NC - I/O 4 NC - 1 GND 3 ACZOT1-P3P 5 GND - 6 E3V - 7 ACZSY1-P3P O 8 GND - 9 ACZIN1-E3P I/O 10 GND - 11 ACZRS1-E3N O 12 XAZBC1-P3P O 1T GND - 2T GND - 3T GND - 4T GND - 5T GND - 6T GND - C.11 CN3230 Keyboard connector (34-pin) Table C-11 Keyboard connector (34-pin) Pin No.
Appendices Appendix. C Pin Assignment C.12 CN3240 PAD connector (8-pin) Table C-12 PAD connector (8-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 GND - 2 GND - 3 GND - 4 NC - 5 IPDCLK-P5P I/O 6 IPDDAT-P5P 7 P5V - 8 P5V I/O - C.13 CN3400 Debugging connector (4-pin) Table C-13 Debugging connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 P3V - 2 DBGRX-P3P O 3 DBGTX-P3P I 4 GND - C.
Appendix. C Pin Assignment Appendices C.15 CN4200 IEEE1394 connector (4-pin) Table C-15 IEEE1394 connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 ZTPB0-P3N I/O 2 ZTPB0-P3P I/O 3 ZTPA0-P3N I/O 4 ZTPA0-P3P I/O 1T GND - 2T GND - 3T GND - 4T GND - C.16 CN4400 Bluetooth connector (20-pin) Table C-16 Bluetooth connector (20-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment C.18 CN4611 USB connector (Port 4) (4-pin) Table C-18 USB connector (Port 4) (4-pin) Pin No. Signal Name I/O Pin No. Signal Name 1 USB1PS-E5V - 2 ZUSBP4-E3N 3 ZUSBP4-E3P I/O 4 GND I/O I/O - C.19 CN4612 USB connector (Port 0) (6-pin) Table C-19 USB connector (Port 0) (6-pin) Pin No. C-18 Signal Name I/O Pin No.
Appendix. C Pin Assignment Appendices C.20 CN5500 LCD connector (40-pin) Table C-20 LCD connector (40-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment C.22 CN6060 Internal microphone (left) connector (2-pin) Table C-22 Internal microphone (left) connector (2-pin) Pin No. 1 Signal Name (IMICL-PXP) I/O Pin No. O 2 Signal Name A-GND I/O - C.23 CN6061 Internal microphone (right) connector (2-pin) Table C-23 Internal microphone (right) connector (2-pin) Pin No. 1 Signal Name (IMICR-PXP) I/O Pin No. Signal Name I/O O 2 A-GND - C.
Appendix. C Pin Assignment Appendices C.26 J6310 Headphone connector (6-pin) Table C-26 Headphone connector (6-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 (A-GND) - 2 HEADL-PXP O 3 HEADR-PXP O 4 (A4R7-P4V) - 5 A-GND - 6 N.C. - C.27 CN8800 DC-IN connector (4-pin) Table C-27 DC-IN connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 PVDC I 2 (GND) - 3 PVDC I 4 (GND) - C.
Appendices Appendix. C Pin Assignment C.30 CN8781 Fan connector (4-pin) Table C-30 Fan connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 P5V - 2 FANG-P3P I 3 GND - 4 (FPWM-S3P) O C.31 CN9500 PN board I/F connector (3-pin) Table C-31 PN board I/F connector (3-pin) Pin No. Signal Name I/O Pin No. 2 1 PNLOFF-S3N I 3 GND - Signal Name TPLOFF-S3V I/O I C.32 CN9520 NU board I/F connector (10-pin) Table C-32 NU board I/F connector (10-pin) Pin No.
Appendix. C Pin Assignment Appendices C.33 CN9540 Digitizer switch I/F connector (41-pin) Table C-33 Digitizer switch I/F connector (41-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment NF board (FAPNF*) C.34 CN9560 System board I/F connector (6-pin) Table C-34 System board I/F connector (6-pin) Pin No. I/O Pin No.
Appendix. C Pin Assignment Appendices NP board (FAPNP*) C.35 CN9510 System board I/F connector (3-pin) Table C-35 System board I/F connector (3-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix. C Pin Assignment NW board (FAPNW*) C.36 CN9550 System board I/F connector (15-pin) Table C-36 System board I/F connector (15-pin) Pin No. C-26 Signal Name I/O Pin No.
Appendix D Keyboard Scan/Character Codes Appendix D Appendices Keyboard Scan/Character Codes Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap Code set 1 Note Code set 2 No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) Cap D-2 Code set 1 Code set 2 Note No.
Appendix D Keyboard Scan/Character Codes Appendices Table D-1 Scan codes (set 1 and set 2) (3/4) Cap Code set 1 Code set 2 Note No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap Code set 1 Code set 2 Note No. Keytop 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F *1 204 App E0 5D E0 DD E0 2F E0 F0 2F *1 Make Break Make Break Notes: 1. 2. 3. 4. 5. 6. D-4 * * * * * * Scan codes differ by mode. Scan codes differ by overlay function.
Appendix D Keyboard Scan/Character Codes Appendices Table D-2 Scan codes with left Shift key Cap Key Code set 1 Code set 2 No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
Appendix D Keyboard Scan/Character Codes Appendices Table D-5 Scan codes in overlay mode Cap No.
Appendices D-8 Appendix D Keyboard Scan/Character Codes [CONFIDENTIAL] PORTEGE M400 Maintenance Manual (960-541)
Appendix. E Key Layout Appendix.
Appendices Appendix.
Appendix F Wiring Diagrams Appendices Appendix F Appendix F Wiring Diagrams F.1 RGB Monitor Wraparound connector Figure F-1 RGB Monitor Wraparound connector F.
Appendices F-2 Appendix F Wiring Diagrams [CONFIDENTIAL] PORTEGE M400 Maintenance Manual (960-541)
Appendix G BIOS Rewrite Procedures Appendices Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS rewriting disk for the computer that has renewed BIOS data. Rewriting the BIOS Note: 1. Connect the AC adaptor to the computer when you rewrite the BIOS. 2. Do not turn off the power while you are rewriting the BIOS.
Appendices G-2 Appendix G BIOS Rewrite Procedures [CONFIDENTIAL] PORTEGE M400 Maintenance Manual (960-541)
Appendix H EC/KBC Rewrite Procedures Appendices Appendix H Appendix H EC/KBC Rewrite Procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. Tools To rewrite the EC/KBC, you need the following tool: EC/KBC rewriting disk for the computer Rewriting the EC/KBC NOTE: 1. Rewrite the EC/KBC only when instructed by a diagnostic disk release notice. 2. Be sure to connect both battery and AC adapter to the computer when you rewrite the EC/KBC. 3.
Appendices H-2 Appendix H EC/KBC Rewrite Procedures [CONFIDENTIAL] PORTEGE M400 Maintenance Manual (960-541)
Appendix I Reliability Appendices Appendix I Appendix I Reliability The following table shows MTBF (Mean Time between Failures).
Appendices I-2 Appendix I Reliability [CONFIDENTIAL] PORTEGE M400 Maintenance Manual (960-541)
Appendix J Maintenance of TOSHIBA RAID Appendices Appendix J Appendix J Maintenance of TOSHIBA RAID J.1 Outline of Maintenance (Repair) of TOSHIBA RAID Follow the below procedures to repair TOSHIBA RAID Reception Is the RAID configured by two HDD?(*1) No Yes Identify the failed HDD (*2) Is it needed to specify the cause? No Yes Perform the HDD Troubleshooting Procedure in Section 2.6.
Appendices Appendix J Maintenance of TOSHIBA RAI J.2 Analysis and handling by Drive Log Follow the below procedures to analyze. Boot the independent utility and check the Physical Drive status. (1) Which port of HDD failed? Port 1 Port 0 (3) Does operation miss cause it? (2) If necessary, analyze the Drive Log and identify the cause of failure. Replace the second HDD with new (good) one. No Yes (4) Change the status of the failed HDD to “OFFLINE”.
Appendix J Maintenance of TOSHIBA RAID Appendices How to identify the cause of failure (1) When “Fail” or “NODRIVE” is displayed. According to “Operation of Independent utility”, boot the independent utility to display the Drive Log. To identify the failure cause of Port 0, analyze the Drive Log of [REDUNDANT] side of Port 1. To identify the failure cause of Port 1, analyze the Drive Log of [REDUNDANT] side of Port 0. Analyze this log. 1.
Appendices Appendix J Maintenance of TOSHIBA RAI 2. Analyze the detailed date of the message of right before of “xxx Error (IN)”, “xxx Error (OUT)” (for example, “DMA Error (IN)”, “DMA Error (OUT)”) right before the log of “Fail this drive” message and identify the cause.
Appendix J Maintenance of TOSHIBA RAID Appendices Command：Indicates Command code caused an error.
Appendices Appendix J Maintenance of TOSHIBA RAI Table J-1 List of Command (2/2) Protocol DM DM DMO PO ND ND ND ND ND ND ND ND PI ND ND ND PO ND PI ND ND PO PO ND PO ND PO ND ND Command READ DMA WRITE DMA WRITE DMA QUEUED CFA WRITE MULTIPLE W/OUT ERASE CHECK MEDIA CARD TYPE GET MEDIA STATUS MEDIA LOCK MEDIA UNLOCK STANDBY IMMEDIATE IDLE IMMEDIATE STANDBY IDLE READ BUFFER CHECK POWER MODE SLEEP FLUSH CACHE WRITE BUFFER FLUSH CACHE EXT IDENTIFY DEVICE MEDIA EJECT SET FEATURES SECURITY SET PASSWORD SECUR
Appendix J Maintenance of TOSHIBA RAID Appendices (2) Check if it is caused by an operation miss or is a failure. To check if the cause of failure of Port1 is an operation miss or not, analyze the Drive Log of Port0. 1. In [REDUNDANT] of Port-0, find a log of “Fail this drive” message by PgUp and PgDn key. 2. If no message of “Fail this drive” message, it is judged that the second HDD is removed without the operation of removal by TOSHIBA RAID console and installed again.
Appendices Appendix J Maintenance of TOSHIBA RAI J.3 Operation of Independent utility J.3.1 Outline of Independent utility This is a utility to display Drive Log of TOSHIBA RAID. (1) Drive Log TOSHIBA RAID can store about 7,000 logs of Drive Log. TOSHIBA RAID make Drive Log redundant and store it. The drive has own log and other drive’s log. In TOSHIBA RAID, the log of own drive is called “Own Log” and the redundant log of other drive’s drive is called “Redundant Log”.
Appendix J Maintenance of TOSHIBA RAID Appendices J.3.2 How to operate the Independent Utility (1) Booting PC Connected the USB FDD to the PC to be repaired. Insert the FD storing the program of the Independent Utility in the FDD and boot the PC from the FD. The following display appears. In the Independent Utility, the cursor is moved by with ↑ key and ↓ key. Press Enter key to execute the option selected. Press Esc key to return to the previous menu. Pressing F1 key displays Help.
Appendices Appendix J Maintenance of TOSHIBA RAI (2) Display of Logical/Physical Drive Logical Drive The status of RAID array is displayed in Logical Drive by array. The displayed items are follows. Table J-2 Displayed item in Logical Drive Explanation Status (Status of array) Displays the status of array. The contents are follows. -OPTIMAL：The array works normally. -DEGRADE：The array is degraded. -CRITICAL：The array is failed. It can not be used. RAID Level Displays the RAID level.
Appendix J Maintenance of TOSHIBA RAID Appendices Physical Drive In Physical Drive, the condition of RAID array is displayed by array. The following items are displayed. Table J-3 Items displayed in Physical Drive Explanation Port Displays the port number of Serial ATA connected to the drive. Assign Displays the array number and drive number of array that the drive is incorporated. The display format is LD [Array number] [Drive number]. For example, [LD0-1] means the disk drive 1 of Array 0.
Appendices Appendix J Maintenance of TOSHIBA RAI (3) Explanation of Main Menu The Independent Utility has following Main Menu. Table J-4 Item of Main Menu displayed Explanation Create Array Builds RAID array. Start Rebuild Rebuilds RAID-1. While the rebuild is suspended, the message of “Resume Rebuild” is displayed. Check Media Checks if any error in drives configuring array. This is available for the RAID-1 in the “Optimal” condition. Modify Array Changes the setting of array.
Appendix J Maintenance of TOSHIBA RAID Appendices The tree of Independent Menu is as follows.
Appendices Appendix J Maintenance of TOSHIBA RAI Create Array This section explains how to select option and build array. The [Create Array] option can be selected only when there is a drive not assigned. To build array, follow the procedure below. 1. Put the cursor on [Create Array] in [Main Menu] and press Enter key. 2. Select RAID level. Put the cursor on [RAID-1] or [RAID-0] and press Enter key. 3.
Appendix J Maintenance of TOSHIBA RAID Appendices 6. Put the cursor on the “DONE” and press Enter key. Pressing “OK” in [Confirmation] store the change. CAUTION: When the array is initialized, the data of drive is lost. Start Rebuild Selecting of this option starts rebuilding. [Start Rebuild] is displayed only in the RAID1 condition of with “OFFLINE” drive that has same or more size of capacity as the array in the condition of “Optimal” or “Degraded”.
Appendices Appendix J Maintenance of TOSHIBA RAI 3. When [Rebuild Range] menu is displayed, the range to be rebuilt is designated. When [Effective] is selected, rebuild limit becomes valid and it rebuilds up to the rebuild limit. When [Whole] is selected, it rebuilds maximum capacity of array. The [Rebuild Range] menu is not displayed when the rebuild limit is not set or the rebuild limit is the same as the maximum capacity of array. Normally designation of [Effective] is adequate. 4.
Appendix J Maintenance of TOSHIBA RAID Appendices 8. When completing the rebuild, press “OK” to return to the main menu of Independent Setup Utility. Resume Rebuild During being suspended,[Resume Rebuild] is displayed in [Main Menu]. To start rebuilding suspended, follow the procedure below. 1. Put the cursor to the [Resume Rebuild] in the main menu of Indent Utility and press Enter key. 2. When [Rebuild Range] menu is displayed, the range to be rebuilt is designated.
Appendices Appendix J Maintenance of TOSHIBA RAI 6. When completing the rebuild, press “OK” to return to the main menu of Independent Setup Utility. 7. When “Rebuild Limit” is set and [Rebuild Range] is set to [Whole], only [Finish] is can be selected after exceeding the Rebuild Limit. When [Finish] is selected and “OK” is selected in [Confirmation], the rebuilding is completed at the time. When OS is booted after exceeding the Rebuild Limit, the rebuild is completed.
Appendix J Maintenance of TOSHIBA RAID Appendices Check Media This option can check if there is an error in the HDD of array. The Check Media can be done only in RAID-1. To execute Check Media, follow the procedure below. 1. Put the cursor to the [Check Media] in [Main Menu] and press Enter key. 2. When [Check Range] is displayed, designate the range to be checked. When [Effective] is limited, it makes the rebuild limit effective and execute [Check Media] up to the rebuild limit.
Appendices Appendix J Maintenance of TOSHIBA RAI Modify Array This option changes the setting of array. Change Parameter Select [Change Parameter] in [Modify Array] menu. The following items can be set. Table J-6 Item of array Option J-20 Explanation Write Cache Displays the setting of drive write cache. “Enable (use)” or “Disable (not use)” is displayed. The default is “Enable (use)”. Degrade Bootup Displays if boot OS or not when the array is degraded.
Appendix J Maintenance of TOSHIBA RAID Appendices Change RAID Level To change RAID level, select [Modify Array] menu. When changing RAID-1 (Mirroring) to RAID-0 (Striping), refer “Changing RAID-1 to RAID-0”. When changing RAID-0 to RAID-1, refer “Changing RAID-0 to RAID-1”. Changing RAID-1 to RAID-0 working by one drive When changing RAID-1 array working by two drives to RAID-0 working by one drive, follow the procedure below. 1. Select [Modify Array] in [Main Menu]. 2.
Appendices Appendix J Maintenance of TOSHIBA RAI Delete Array Selects [Delete Array] of Setup Utility and delete array. Put the cursor on the array you want to delete and press Enter key. When [Confirmation] is displayed, select “OK” to store the setting.
Appendix J Maintenance of TOSHIBA RAID Appendices Physical Drive Select [Physical Drive] in Setup Utility to set physical drive. View Drive Info. Select this option in [Physical Drive] to display information of physical drive. Select the drive that you want to display in [Physical Drive] at the lower of display and press Enter key. In the server with fault lamp (lamp displaying disk condition), the fault lamp of corresponded drive blinks while [Drive Information] display appears.
Appendices Appendix J Maintenance of TOSHIBA RAI View Drive Log Select this option in [Physical Drive] menu and select the drive that you want to display the log. At the beginning, the latest log is displayed. The 7,168 logs from the latest is recorded in detail. For the older log, only ID is recorded. The options and functions of key in [View Drive Log] are as follows. Table J-8 Function of option and key Option Explanation Change Port Changes log’s port displayed and port’s own log or redundant log.
Appendix J Maintenance of TOSHIBA RAID Appendices Execute the following procedures to see the drive log in the independent utility. 1. Put on the cursor on [Physical Drive] in [Main Menu] and press Enter key. 2. Put on the cursor on [View Drive Log] and press Enter key. 3. Select drive that you want to display the log in [Physical Drive] at the lower of display with a cursor key and press Enter key. 4. The drive log is displayed. Press PageUp or PageDown key to scroll the drive log upward or downward. 5.
Appendices Appendix J Maintenance of TOSHIBA RAI The following is displayed. Table J-9 Content of Drive Log display No. J-26 Option Explanation 1 Port Displays the port number of log displayed. 2 Own/Redundant Displays if the displayed log is a log of own port (Own) or a copy of other port log (Redundant). 3 Time Displays the time when the log is recorded in six digits. The format is [Year Month Day Hour Minute Second]. 4 ID Displays identification ID of log.
Appendix J Maintenance of TOSHIBA RAID Appendices [View Drive Log] menu is as follows Table J-10 Content of View Drive Log menu Option Explanation Change Port Changes the display of the own log and redundant log. At the beginning, the Port-0’s own log and the redundant log are displayed. Go to Event When this option selected, it moves to the log with designated number. The key function in [View Drive Log] key is as follows.
Appendices Appendix J Maintenance of TOSHIBA RAI Exit When this option is selected, the utility is finished. When [Confirmation] is displayed, select “OK”.
