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Toshiba Personal Computer

QOSMIO G10

Maintenance Manual

TOSHIBA CORPORATION

File Number 960-497

Summary of content (392 pages)

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Toshiba Personal Computer QOSMIO G10 Maintenance Manual TOSHIBA CORPORATION File Number 960-497
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Copyright © 2004 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein. Toshiba QOSMIO G10 Maintenance Manual First edition September 2004 Disclaimer The information presented in this manual has been reviewed and validated for accuracy.
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Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer QOSMIO G10. NOTE: Each model of QOSMIO G10 has a different configuration. For each model’s configuration, refer to the parts list dedicated to it. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field.
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The manual is divided into the following parts: Chapter 1 Hardware Overview describes the QOSMIO G10 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
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Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
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Table of Contents Chapter 1 Hardware Overview 1.1 Features ...................................................................................................................... 1-1 1.2 System Block Diagram .............................................................................................. 1-5 1.3 2.5-inch Hard Disk Drive......................................................................................... 1-10 1.4 Optical Drive.........................................................
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Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ................................................................................... 3-4 3.3 Setting of the hardware configuration........................................................................ 3-8 3.4 Heatrun Test.......................................................................................
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Chapter 4 Replacement Procedures 4.1 Overview.................................................................................................................... 4-1 4.2 Battery pack ............................................................................................................... 4-8 4.3 PC card/Bridge media .............................................................................................. 4-10 4.4 HDD........................................................................
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Appendices Appendix A Handling the LCD Module ........................................................................ A-1 Appendix B Board Layout ............................................................................................. B-1 Appendix C Pin Assignment .......................................................................................... C-1 Appendix D Display Codes ............................................................................................
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x QOSMIO G10 Maintenance Manual (960-497)
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Chapter 1 Hardware Overview QOSMIO G10 Maintenance Manual (960-497) 1-i
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1 1-ii Hardware Overview QOSMIO G10 Maintenance Manual (960-497)
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Chapter 1 Contents 1.1 Features ...................................................................................................................... 1-1 1.2 System Block Diagram .............................................................................................. 1-5 1.3 2.5-inch Hard Disk Drive......................................................................................... 1-10 1.4 Optical Drive....................................................................................
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Figures Figure 1-1 Front of the computer and the system units configuration ............................ 1-4 Figure 1-2 System block diagram.................................................................................... 1-5 Figure 1-3 2.5-inch HDD............................................................................................... 1-10 Figure 1-4 DVD-ROM & CD-R/RW drive ................................................................... 1-15 Figure 1-5 DVD Super Muti drive...........
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1 Hardware Overview 1 1.1 Features Features 1.1 Features The QOSMIO G10 series are high performance all-in-one PCs running a Pentium-M processor. The features are listed below. ❑ Microprocessor Microprocessor that is used will be different of the model. Intel ® Mobile Pentium ®-M Pentium-M 1.50GHz (Processor Number ; 715) 1.60GHz (Processor Number ; 725) 1.70GHz (Processor Number ; 735) 1.80GHz (Processor Number ; 745) 2.00GHz (Processor Number ; 755) 2.
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1.1 Features 1 Hardware Overview ❑ Display LCD Built-in 17.0-inch, WXGA+ (1,440 x 900 dots), 320,000 colors, amorphous silicon TFT color display. CRT Supported via a RGB connector. TV-out S-VIDEO OUT port supported. D-VIDEO port supported. ❑ Monitor-IN port AV input terminal is supported (for composite cable). This port can be also used as LINE-IN port enables connection of a stereo device for audio input. ❑ TV-tuner (Mini PCI slot) This enables to watch TV and record it.
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1 Hardware Overview 1.1 Features ❑ Optical devices A DVD-ROM & CD-R/RW drive or DVD Super Multi drive is equipped. ❑ Battery The RTC battery is equipped inside the computer. The main battery is a detachable lithium ion battery (4,400mAh:Li-Ion, 6cell). ❑ USB (Universal Serial Bus) Four USB ports are provided. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported.
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1.1 Features 1 Hardware Overview Figure 1-1 shows the front of the computer and the system units configuration.
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1 Hardware Overview 1.2 1.2 System Block Diagram System Block Diagram Figure 1-2 shows the system block diagram.
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1.2 System Block Diagram 1 Hardware Overview The PC contains the following components. ❑ CPU Intel ® Mobile Pentium ®-M Pentium-M 1.50GHz (Processor Number ; 715) 1.60GHz (Processor Number ; 725) 1.70GHz (Processor Number ; 735) 1.80GHz (Processor Number ; 745) 2.00GHz (Processor Number ; 755) 2.10GHz (Processor Number ; 765) L1 cache : 64KB (32KB + 32KB) L2 cache : 2MB FSB : 400MHz Core voltage : 1.340~0.
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1 Hardware Overview 1.2 System Block Diagram ❑ Chipset This gate array has the following elements and functions. • North Bridge (Intel 855PM (MCH-M, B-step)) − − − − − • Pentium-M processor System Bus support DRAM Controller : DDR333/DDR266/DDR200 support AGP Interface (AGP R2.0, AGP x 4mode) Hub Link Interface 593-ball 37.5mmx37.5mm FC-BGA Package South Bridge (Intel 82801DBM (ICH4-M)) − − − − − − − − − − − − − − − PCI slot IDE controller DMA controller USB host interface USB 2.
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1.
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1 Hardware Overview 1.2 System Block Diagram ❑ MODEM (Askey-made 1456VQL4 x 1) Supported by MDC. Uses secondary AC97 line. Data and FAX transmission is available. Supports ITU-TV.90. The transfer speed of data receiving is 56kbps, of data sending is 33.6kbps and of FAX is 14.4kbps. Actual speed depends on the quality of the line used. Connected to telephone line through RJ11 MODEM jack.
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1.3 2.5-inch Hard Disk Drive 1.3 1 Hardware Overview 2.5-inch Hard Disk Drive A compact, high-capacity HDD with a height of 9.5mm. Contains a 2.5-inch magnetic disk and magnetic heads. Figure 1-3 shows a view of the 2.5-inch HDD and Tables 1-1 and 1-2 list the specifications. Figure 1-3 2.5-inch HDD Table 1-1 2.5-inch HDD dimensions Standard value Parameter TOSHIBA HDD2188B TOSHIBA HDD2189B Width (mm) 69.85 Outline Height (mm) 9.5 dimensions Depth (mm) 100.
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1 Hardware Overview 1.3 2.5-inch Hard Disk Drive Standard value Parameter HGST G8BC0000Z411 HGST G8BC0000Z611 Width (mm) 69.85±0.25 Outline Height (mm) 9.5±0.2 dimensions Depth (mm) 100.0±0.25 Weight (g) 95 (max) HGST G8BC0000Z811 99 (max) Standard value Parameter HGST G8BC0001N610 HGST G8BC0001N810 Width (mm) 69.85±0.25 Outline Height (mm) 9.5±0.2 dimensions Depth (mm) 100.2±0.
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1.3 2.5-inch Hard Disk Drive 1 Hardware Overview Table 1-2 2.5-inch HDD Specifications Specification Parameter Storage size (formatted) TOSHIBA HDD2190B TOSHIBA HDD2189B TOSHIBA HDD2188B TOSHIBA HDD2A02B 40GB 60GB 80GB 100GB Speed (RPM) 4,200 Data transfer speed (Mbits/s) 175.0-341.7 Interface transfer rate (MB/s) Storage density (Kbpi) 170.0-373.0 100 (Ultra DMA mode) 735 - 735 (MAX) 88.
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1 Hardware Overview 1.3 2.
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1.3 2.5-inch Hard Disk Drive 1 Hardware Overview Specification Parameter Storage size (formatted) FUJITSU G8BC00019410 FUJITSU G8BC00019610 FUJITSU G8BC00019810 FUJITSU G8BC0001HA10 40GB 60GB 80GB 100GB Speed (RPM) 5,400 Data transfer speed (Mbits/s) 443.
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1 Hardware Overview 1.4 1.4 Optical Drive Optical Drive 1.4.1 DVD-ROM & CD-R/RW Drive The DVD-ROM & CD-R/RW drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15inch) CD/DVD-ROM and CD-R/RW. It is a high-performance drive that reads DVD at maximum 8-speed and CD at maximum 24-speed. The DVD-ROM & CD-R/RW drive is shown in Figure 1-4. The dimensions and specifications of the DVD-ROM & CD-R/RW drive are described in Table 1-3, Table 1-4.
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1.4 Optical Drive 1 Hardware Overview Table 1-4 DVD-ROM & CD-R/RW drive specifications (1/2) Drive Specification Parameter Data transfer speed Access time (ms) MATSUSHITA (G8CC0001X610) Read (KB/s) DVD-ROM MAX 8X CAV (MAX 10800 KB/s) CD-ROM MAX 24X CAV (MAX 3600 KB/s) Write CD-R 4X,8X(CLV), 16x(PCAV), MAX24x(CAV) CD-RW 4X (CLV) High Speed CD-RW 4X,8x,10X (CLV) Ultra Speed CD-RW 10x(CLV), Max24x(CAV) ATAPI interface (MB/s) PIO mode16.6 MB/s PIO MODE4 supported DMA mode16.
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1 Hardware Overview 1.4 Optical Drive Table 1-4 DVD-ROM & CD-R/RW drive specifications (2/2) Drive Specification Parameter Data transfer speed Access time (ms) TEAC (G8CC0001Y610) Read (KB/s) DVD-ROM MAX 8X CAV (4,469 to 10,816KB/s) CD-ROM MAX 24X CAV (1,545 to 3,600KB/s) Write CD-R 4X,10X(CLV), 16x, MAX24x (CAV) CD-RW 4X (CLV) High Speed CD-RW 4X,10X (CLV), 10x (CAV) Ultra Speed CD-RW 24x (CAV) ATAPI interface (MB/s) PIO mode16.7 MB/s (PIO MODE4 supported) DMA mode 16.
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1.4 Optical Drive 1 Hardware Overview 1.4.2 DVD Super Multi Drive The DVD Super Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD/DVD-ROM, CD-R/RW, DVD±R/±RW and DVD-RAM. It is a high-performance drive that reads DVD-ROM at maximum 8-speed and CD at maximum 24-speed. Write speed of DVD±R/±RW and DVD-RAM is different depending on the drive. The DVD Super Multi drive is shown in Figure 1-5.
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1 Hardware Overview 1.4 Optical Drive Table 1-6 DVD Super Multi drive specifications (1/2) Drive Specification Parameter Data transfer speed Access time (ms) MATSUSHITA (G8CC00021610) Read(KB/s) DVD-ROM MAX 8X CAV CD-ROM MAX 24X CAV Write CD-R 24x (Zone CLV) CD-RW 4X (CLV) High Speed CD-RW 10X (CLV) Ultra Speed CD-RW 10X (CLV) DVD-R 8x (Zone CLV) DVD-RW 4x (Zone CLV) DVD+R 8x (Zone CLV) DVD+RW 4x (Zone CLV) DVD-RAM 3x (ZCLV) (4.7GB) ATAPI interface (MB/s) PIO mode 16.
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1.4 Optical Drive 1 Hardware Overview Table 1-6 DVD Super Multi drive specifications (2/2) Drive Specification Parameter Data transfer speed Access time (ms) MATSUSHITA (G8CC0001S610) Read(KB/s) DVD-ROM MAX 8X CAV CD-ROM MAX 24X CAV Write CD-R 16x (Zone CLV) CD-RW 4X (CLV) High Speed CD-RW 8X (CLV) DVD-R 4x (Zone CLV) DVD-RW 2x (CLV) DVD+R 2.4x (CLV) DVD+RW 2.4x (CLV) DVD-RAM 2x (ZCLV) (4.7GB) ATAPI interface (MB/s) PIO mode 16.6 MB/s (PIO MODE4 supported) DMA mode 16.
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1 Hardware Overview 1.4 Optical Drive 1.4.3 DVD Super Multi Drive (supporting Double-Layer) The DVD Super Multi drive (supporting Double Layer) accommodates either 12 cm (4.72inch) or 8 cm (3.15-inch) CD/DVD-ROM, CD-R/RW, DVD±R/±RW and DVD-RAM. It is a high-performance drive that reads DVD-ROM at maximum 8-speed and CD-ROM at maximum 24-speed.
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1.4 Optical Drive 1 Hardware Overview Table 1-8 DVD Super Multi drive (Double-Layer) specifications (1/2) Drive Specification Parameter Data transfer speed Access time (ms) MATSUSHITA (G8CC00021611) Read(KB/s) DVD-ROM MAX 8X CAV CD-ROM MAX 24X CAV Write CD-R 24x (Zone CLV) CD-RW 4X (CLV) High Speed CD-RW 10X (CLV) Ultra Speed CD-RW 10X (CLV) DVD-R 8x (Zone CLV) DVD-RW 4x (Zone CLV) DVD+R 8x (Zone CLV) DVD+R Double Layer 2.4x (CLV) DVD+RW 4x (Zone CLV) DVD-RAM 3x (ZCLV) (4.
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1 Hardware Overview 1.4 Optical Drive Table 1-8 DVD Super Multi drive (Double-Layer) specifications (2/2) Drive Specification Parameter Data transfer speed Access time (ms) TEAC (G8CC00024611) Read(KB/s) DVD-ROM MAX 8X CAV CD-ROM MAX 24X CAV Write CD-R 24x (Zone CLV) CD-RW 4X (CLV) High Speed CD-RW 10X (CLV) Ultra Speed CD-RW 10X (CLV) DVD-R 8x (Zone CLV) DVD-RW 4x (Zone CLV) DVD+R 8x (Zone CLV) DVD+R Double Layer 2.4x (CLV) DVD+RW 4x (Zone CLV) DVD-RAM 3x (Zone CLV) (4.
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1.5 Keyboard 1.5 1 Hardware Overview Keyboard A keyboard which consists of 85(US)/86(UK) keys is mounted on the system unit. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-7 is a view of the keyboard. Figure 1-7 Keyboard See Appendix E for details of the keyboard layout.
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1 Hardware Overview 1.6 1.6 TFT Color Display TFT Color Display The TFT color display is 17.0 inch and consists of LCD module and FL inverter board. 1.6.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 320,000 colors with 1,440 x 900 resolution. Figure 1-8 shows a view of the LCD module and Table 1-9 lists the specifications.
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1.6 TFT Color Display 1 Hardware Overview 1.6.2 FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module FL. Table 1-10 lists the FL inverter board specifications.
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1 Hardware Overview 1.7 1.7 Power Supply Power Supply The power supply supplies 28 different voltages to the system board. The power supply microcontroller has the following functions. 1. 2. 3. 4. 5. 6. 7. 8. Judges if the DC power supply (AC adapter) is connected to the computer. Detects DC output and circuit malfunctions. Controls the battery icon, and DC IN icon. Turns the battery charging system on and off and detects a fully charged battery. Turns the power supply on and off.
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1.7 Power Supply 1 Hardware Overview Table 1-11 Power supply output rating Power supply （Yes/No） Name Voltage [V] Power OFF Suspend mode Power OFF Boot mode No Battery Object PPV 1.484 0.748 No No No CPU PTV 1.05 No No No CPU, MCH, ICH4-M PGV 1.10 No No No GPU 1R8-P1V 1.8 No No No CPU, MCH, ICH4-M 1R2- P1V 1.2 No No No MCH 1R25-B1V 1.25 Yes No No DDR-SDRAM Termination 1R25-P1V 1.25 No No No SDRAM (GFX), Termination 1R5-P1V 1.
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1 Hardware Overview R3V 2.0 -3.6 1.
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1.8 Batteries 1.8 1 Hardware Overview Batteries The PC has the following two batteries. ❑ Main battery ❑ Real time clock (RTC) battery Table 1-12 lists the specifications for these two batteries. Table 1-12 Battery specifications Battery Name Battery Element Output Voltage Capacity Lithium ion 10.8V 4,400mAh Nickel hydrogen 2.4V 16mAh G71C0004H110 G71C0004H210 Main battery G71C0004H510 G71C0004H610 Real time clock (RTC) battery P71035009115 1.8.
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1 Hardware Overview 1.8 Batteries 1.8.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and detects a full charge when the AC adaptor and battery are connected to the computer. ❑ Battery Charge When the AC adapter is connected, normal charging is used while the system is turned on and quick charge is used while the system is turned off. Refer to the following Table 1-13.
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1.8 Batteries 1 Hardware Overview 1.8.3 RTC Battery The RTC battery provides the power supply to maintain the date, time, and other system information in memory. Table 1-15 lists the Time required for charges of RTC battery and data preservation time.
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1 Hardware Overview 1.9 1.9 AC Adapter AC Adapter The AC adapter is used to charge the battery. Table 1-16 lists the AC adapter specifications. Table 1-16 AC adapter specifications Parameter Specification G71C0002R610 Power 120W (Peak 150W) Input voltage AC 100 to 240V Input frequency 50Hz/60Hz Input voltage 1.7A or less Output voltage DC 15V Output current 8.
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Chapter 2 Troubleshooting Procedures QOSMIO G10 Maintenance Manual (960-497) 2-i
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2 2-ii QOSMIO G10 Maintenance Manual (960-497)
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Chapter 2 Contents 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart........................................................................................ 2-3 2.3 Power Supply Troubleshooting.................................................................................. 2-7 2.4 2.5 2.6 2.7 2.8 Procedure 1 Power Status Check .........................................................
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2.9 2.10 2.11 2.12 2.13 2.14 2.15 Display Troubleshooting.......................................................................................... 2-50 Procedure 1 External Monitor Check....................................................... 2-50 Procedure 2 Diagnostic Test Program Execution Check ......................... 2-50 Procedure 3 Connector and Cable Check................................................. 2-51 Procedure 4 Replacement Check .............................................
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Figures Figure 2-1 Troubleshooting flowchart............................................................................. 2-4 Figure 2-2 A set of tool for debug port test ................................................................... 2-20 Tables Table 2-1 Battery icon.................................................................................................... 2-7 Table 2-2 DC IN icon.....................................................................................................
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2-vi QOSMIO G10 Maintenance Manual (960-497)
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2 Troubleshooting Procedures 2.1 Troubleshooting 2 2.1 Troubleshooting Chapter 2 describes how to determine which Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. (The “FRU” means the replaceable unit in the field.) The FRUs covered are: 1. Power supply 6. Touch pad 11. Wireless LAN 2. System Board 7. Display 12. Sound 3. USB FDD 8. Optical Disk Drive 13. TV Tuner 4. 2.5” HDD 9. Modem 5. Keyboard 10. LAN The Test Program operations are described in Chapter 3.
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2.1 Troubleshooting 2 Troubleshooting Procedures There are following two types of connections in the figure of board and module connection in and after 2.3 Power Supply Troubleshooting. (1) Cable connection is described in the figure as line. (2) Pin connection is described in the figure as arrow.
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2 Troubleshooting Procedures 2.2 2.2 Troubleshooting Flowchart Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which troubleshooting procedures to execute. Before going through the flowchart steps, verify the following: Ask him or her to enter the password if a password is registered. Verify with the customer that Toshiba Windows is installed on the hard disk. NonWindows operating systems can cause the computer to malfunction.
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2 Troubleshooting Procedures 2.
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2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures If the diagnostics program cannot detect an error, the problem may be intermittent. The Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error(s), then perform the appropriate troubleshooting procedures as follows: 1.
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2 Troubleshooting Procedures 2.3 2.3 Power Supply Troubleshooting Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
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2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Table 2-2 DC IN icon DC IN icon Power supply status Lights green DC power is being supplied from the AC adapter. Blinks orange Power supply malfunction*1 Doesn’t light Any condition other than those above. *1 When the power supply controller detects a malfunction, the DC IN icon blinks orange. It shows an error code. When the icon is blinking, perform the following procedure. 1. Remove the battery pack and the AC adapter. 2.
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2 Troubleshooting Procedures Procedure 2 2.3 Power Supply Troubleshooting Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below. Start Off for 2 seconds Error code (8 bit) “1” On for one second “0” On for half second Interval between data bits Off for half second The error code begins with the least significant digit. Example: Error code 11h (Error codes are given in hexadecimal format.
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2.3 Power Supply Troubleshooting Check 1 2 Troubleshooting Procedures Convert the DC IN icon blink pattern into the hexadecimal error code and compare it to the tables below. Then go to Check 2.
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2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Main Battery Error code Meaning 20h Over voltage has been sensed. (Error code 20h is not supported.) 21h Main battery charge current is over 12.0A. 22h Main battery discharge current is over 0.5A when there is no load. 23h Main battery charge current is over 3.9A when AC adapter is not connected. 24h Abnormal current has been sensed. 25h Main battery charge current is over 0.3A when the charging is off.
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2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures 1R5-C1V output Error code Meaning 60h 1R5-C1V voltage is over 2.16V when the computer is powered on/off. 61h 1R5-C1V voltage is 1.275V or less when the computer is powered on. 62h 1R5-C1V voltage is 1.275V or less when the computer is booting up. 63h 1R5-C1V voltage is 1.275V or less while the computer is suspended. 64h 1R5-C1V voltage is abnormal while the computer is shutdown. (CV support) 65h 1R5-C1V voltage is 1.
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2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting E3V output Error code Meaning A0h E3V voltage is over 3.96V when the computer is powered on/off. A1h E3V voltage is 2.81V or less when the computer is powered on. A2h E3V voltage is 2.81V or less when the computer is booting up. A3h E3V voltage is 2.81V or more when the computer is powered off. A4h E3V voltage is 2.81V or less when the computer is suspended. 1R8-P1V output Error code Meaning B0h 2R5-P2V voltage is over 3.
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2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures 2R5-B2V output Error code Meaning E0h 2R5-B2V voltage is over 3.00V when the computer is powered on/off. E1h 2R5-B2V voltage is 2.125V or less when the computer is powered on. E2h 2R5-B2V voltage is 2.125V or less when the computer is booting up. E3h 2R5-B2V voltage is 2.125V or more when the computer is powered off. E4h 2R5-B2V voltage is 2.125V or less while the computer is suspended.
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2 Troubleshooting Procedures Procedure 3 2.3 Power Supply Troubleshooting Connection Check The wiring diagram related to the power supply is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Make sure the AC adapter and the AC power cord are firmly plugged into the DC IN socket (W8800) and wall outlet. If these cables are connected firmly, go to Check 2. Check 2 Replace the AC adapter and the AC power cord with new ones.
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2.3 Power Supply Troubleshooting Procedure 5 2 Troubleshooting Procedures Replacement Check The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4, Replacement Procedures. When AC adapter is connected ; Check 1 AC adapter may be faulty. Replace the AC adapter with a new one. If the problem still occurs, perform Check 2.
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2 Troubleshooting Procedures 2.4 2.4 System Board Troubleshooting System Board Troubleshooting This section describes how to determine if the system board is malfunctioning or not. Start with Procedure 1 and continue with the other procedures as instructed.
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2.4 System Board Troubleshooting Procedure 1 2 Troubleshooting Procedures Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it. If an error message is shown on the display, perform Check 1. If there is no error message, go to Procedure 2. If MS-DOS or Windows XP is properly loaded, go to Procedure 4.
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2 Troubleshooting Procedures Check 3 2.4 System Board Troubleshooting The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (24) or (25) is displayed, go to Procedure 4. If error message (18) is displayed, go to the Keyboard Troubleshooting Procedures. If error message (19), (20) or (21) is displayed, go to the 2.5” HDD Troubleshooting Procedures.
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2.4 System Board Troubleshooting Procedure 2 2 Troubleshooting Procedures Debugging Port Check Check the D port status by a debug port test. The tool for debug port test is shown below. Figure 2-2 A set of tool for debug port test The test procedures are follows: 1. Connect the debug port test cable to the connector CN3400 of the system board. For disassembling to connect the test cable, refer to Chapter 4. 2. Connect the debug port test cable and RS-232C cross-cable to the test board. 3.
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2 Troubleshooting Procedures 2.
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Debug port (Boot mode) error status (2/8) D port status F005h Inspection items Details Saving key scan code Setting TASK_1ms_TSC Controlling fan Initializing sound items (for BEEP) Enabling system speaker Releasing mute Making the volume max.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Debug port (Boot mode) error status (3/8) D port status F101h F102h Inspection items Details Checking DRAM type and size (at cold boot) When unsupported memory connected, beeps and halts. When DRAM size = o, halts. Testing the stack area of SMRAM When it can not be used, halts.
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2 Troubleshooting Procedures 2.
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2 Troubleshooting Procedures 2.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Debug port (Suspend mode) error status (1/3) D port status Inspection items F130h When powering-off request from OS is required, waiting for the completion of dividing process because waiting in SUSPEND of Runtime returns the process to OS. Details Forced execution of dividing (Permission of SMI for dividing) Waiting for completion of dividing F131h After prohibiting of all SMI, permits I/O trap(EHCI) and external SMI.
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-5 Debug port (Suspend mode) error status (2/3) LED Status (F133h) Test item Contents Storing CPU register Permission of system area, memory cache (to work at high-speed) Suspending of HDD Storing KBC,SCC and MOUSE Storing of PCI device Storing of PIT Starts sequence for storing display system.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Debug port (Suspend mode) error status (3/3) LED Status (F13Ah) Test item Contents Power LED control during suspending Isolates built-in LAN. Makes the power of sound off. F13Bh F13Ch Model-unique processing just before suspending Waiting for completion of dividing for suspending Stops dividing of extension command for power off.
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-6 Debug port (Resume mode) error status (1/4) LED Status Test item F100h Refer to IRT F101h Refer to IRT F102h Refer to IRT F103h Refer to IRT Contents Clears flag for SMI control. Renewal of Resume counter F121h Checks the WakeUp factors.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-6 Debug port (Resume mode) error status (2/4) LED Status Test item (F122h) Contents Initializing of sound Acquires the multi-box status.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-6 Debug port (Resume mode) error status (4/4) LED status Test item (12Ah) Contents Final decision of USB FDD information Post-process of PRE_BOOT_SETUP Clears PWRBTN_STS. Enables Power Button.
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2.4 System Board Troubleshooting Procedure 3 2 Troubleshooting Procedures Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test 6. Printer test [It is not supported] 7. Async test [It is not supported] 8. Hard Disk test 9. Real Timer test 10.
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2 Troubleshooting Procedures 2.5 USB FDD Troubleshooting 2 2.5 USB FDD Troubleshooting To check if the USB FDD is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: FDD Head Cleaning Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector Check and Replacement Check Procedure 1 FDD Head Cleaning Check FDD head cleaning is one option available in the Diagnostic Program.
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2.5 USB FDD Troubleshooting Procedure 2 2 Troubleshooting Procedures Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled. Floppy disk drive test error codes and their status names are listed in Table 2-7.
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2 Troubleshooting Procedures Procedure 3 2.5 USB FDD Troubleshooting Connector Check and Replacement Check USB FDD is connected to USB port on system board and US board. US board is also connected to system board by cable. The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks. USB FDD can be connected to the following 4 ports.
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2.5 USB FDD Troubleshooting 2 Troubleshooting Procedures Check 2 USB FDD may be faulty. Replace it with a new one. If the problem still occurs, perform Check 3. Check 3 Connect USB FDD to each port embedded on system board and on US board. Then, check whether it works properly. If it does not work properly when connected to CN4620, perform Check 4. If it does not work properly when connected to CN4610, CN4611, CN4612 or all ports, perform Check 5. Check 4 US board may be faulty.
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2 Troubleshooting Procedures 2.6 2.6 2.5” HDD Troubleshooting 2.5” HDD Troubleshooting To check if 2.5” HDD is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Partition Check Procedure 2: Message Check Procedure 3: Format Check Procedure 4: Diagnostic Test Program Execution Check Procedure 5: Connector Check and Replacement Check CAUTION: The contents of the hard disk will be erased when the 2.5” HDD troubleshooting procedures are executed.
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2.6 2.5” HDD Troubleshooting Procedure 2 2 Troubleshooting Procedures Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen. Make sure no floppy disk is in the FDD. Turn on the computer and check the message on the screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with Check 1 below and perform the other checks as instructed.
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2 Troubleshooting Procedures Procedure 3 2.6 2.5” HDD Troubleshooting Format Check The computer’s HDD is formatted using the MS-DOS FORMAT program or the physical format program of the test program. To format the HDD, start with Check 1 below and perform the other steps as required. Refer to the MS-DOS Manual for the operation of MS-DOS. For the format by the test program, refer to the Chapter 3. Check 1 Format an 2.5” HDD using MS-DOS FORMAT command. Type as FORMAT C:/S/U. If 2.
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2.6 2.5” HDD Troubleshooting Procedure 4 2 Troubleshooting Procedures Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. The error codes and statuses are described in Table 2-8.
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2 Troubleshooting Procedures Procedure 5 2.6 2.5” HDD Troubleshooting Connector Check and Replacement Check HDD(s) is/are connected to the connector(s) on the system board. The connection of HDD(s) and board may be defective. Otherwise, they may be faulty. Disassemble the computer following instructions in Chapter 4, Replacement Procedures and perform the following checks. Check 1 Make sure HDD(s) is/are firmly connected to the connector(s) on the system board.
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2.7 Keyboard Troubleshooting 2.7 2 Troubleshooting Procedures Keyboard Troubleshooting To check if the computer’s keyboard is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test (DIAGNOSTIC TEST) and Pressed key display test (ONLY ONE TEST) in the Diagnostic Program.
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2 Troubleshooting Procedures Procedure 2 2.7 Keyboard Troubleshooting Connector and Replacement Check The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure keyboard cable is firmly connected to system board. If the connection is loose, reconnect firmly and repeat Procedure 1. If the problem still occurs, go to Check 2.
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2.8 Touch pad Troubleshooting 2.8 2 Troubleshooting Procedures Touch pad Troubleshooting To check if the computer’s touch pad is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Touch pad test (ONLY ONE TEST) in the Diagnostic Program.
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2 Troubleshooting Procedures Procedure 2 2.8 Touch pad Troubleshooting Connector and Replacement Check The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the cable is firmly connected to system board. If the connection is loose, reconnect firmly and repeat Procedure 1. If the problem still occurs, go to Check 2.
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2.9 Display Troubleshooting 2.9 2 Troubleshooting Procedures Display Troubleshooting To check if the computer’s display is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: External Monitor Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector and Cable Check Procedure 4: Replacement Check Procedure 1 External Monitor Check Connect an external monitor to the computer’s external monitor port, then boot the computer.
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2 Troubleshooting Procedures Procedure 3 2.9 Display Troubleshooting Connector and Cable Check LCD Module is connected to system board by an LCD/FL cable. FL inverter board is also connected to system board by an LCD/FL cable. And, fluorescent lamp is connected to FL inverter board by HV cable. Their cables may be disconnected from system board or FL inverter board. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures.
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2.9 Display Troubleshooting Procedure 4 2 Troubleshooting Procedures Replacement Check Fluorescent lamp, FL inverter, LCD module, HV cable and LCD/FL cable are connected to display circuits. Any of these components may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: If fluorescent lamp does not light, perform Check 1.
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2 Troubleshooting Procedures 2.10 Optical Disk Drive Troubleshooting 2.10 Optical Disk Drive Troubleshooting To check if optical disk drive is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the CD-ROM/DVD-ROM Test in the Diagnostic Program.
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2.11 Modem Troubleshooting 2 Troubleshooting Procedures 2.11 Modem Troubleshooting To check if modem is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute Modem test in the LAN/Modem/Bluetooth/IEEE1394 test program.
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2 Troubleshooting Procedures 2.11 Modem Troubleshooting Check 2 Modem cable may be faulty. Replace it with a new one. If the problem still occurs, perform Check 3. Check 3 MDC may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem still occurs, perform Check 4. Check 4 SD board may be faulty. Replace it with a new one following the instructions in Chapter 4. If the problem still occurs, perform Check 5. Check 5 Cable between MDC and system board may be faulty.
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2.12 LAN Troubleshooting 2 Troubleshooting Procedures 2.12 LAN Troubleshooting To check if the computer’s LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute LAN test in the LAN/Modem/Bluettoth/IEEE1394 test program.
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2 Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting 2.13 Wireless LAN Troubleshooting To check if the computer's Wireless LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting-Receiving Check Procedure 2: Antennas' Connection Check Procedure 3: Replacement Check Procedure 1 Transmitting-Receiving Check Before starting the test, make sure the wireless communication switch is set in the ON position.
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2.13 Wireless LAN Troubleshooting Procedure 2 2 Troubleshooting Procedures Antennas' Connection Check The wireless LAN function-wiring diagram is shown below: Any of the connections may be defective. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless communication switch is “On”. If the switch is “Off”, turn it “On”. If the problem still occurs, perform Check 2.
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2 Troubleshooting Procedures Procedure 3 2.13 Wireless LAN Troubleshooting Replacement Check Wireless LAN card, wireless LAN antenna or system board may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 Wireless LAN antenna may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 2.
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2.14 Sound Troubleshooting 2 Troubleshooting Procedures 2.14 Sound Troubleshooting To check if the sound function is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Sound test in Sound Test program disk.
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2 Troubleshooting Procedures Procedure 3 2.14 Sound Troubleshooting Replacement Check If external microphone does not work properly, perform check 1. If headphone does not work properly, perform check 2. If internal microphone does not work properly, perform check 3. If speaker does not work properly, perform check 4. Check 1 External microphone may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem still occurs, perform Check 5.
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2.15 TV tuner Troubleshooting 2 Troubleshooting Procedures 2.15 TV tuner Troubleshooting To check if TV tuner is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Connector Check and Replacement Check Procedure 1 Connector Check and Replacement Check The connection of cables, boards and module may be defective. Otherwise, they may be faulty.
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Chapter 3 Tests and Diagnostics QOSMIO G10 Maintenance Manual (960-497) 3-i
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3-ii QOSMIO G10 Maintenance Manual (960-497)
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Chapter 3 Contents 3.1 3.2 The Diagnostic Test ................................................................................................... 3-1 3.1.1 Diagnostics menu ................................................................................. 3-1 3.1.2 H/W(hardware) initial information setting tool ................................... 3-2 3.1.3 Heatrun test program............................................................................ 3-3 Executing the Diagnostic Test ..............
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3.21.2 3.22 3.23 3.24 3.25 Operations .......................................................................................... 3-46 Log Utilities ............................................................................................................. 3-47 3.22.1 Function Description .......................................................................... 3-47 3.22.2 Operations .......................................................................................... 3-48 Running Test......
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Tables Table 3-1 Subtest names............................................................................................... 3-11 Table 3-2 Error codes and error status names .............................................................. 3-34 Table 3-3 Hard disk controller status register contents................................................ 3-37 Table 3-4 Error register contents.................................................................................. 3-38 Table 3-5 Error message......
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3-vi QOSMIO G10 Maintenance Manual (960-497)
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3 Tests and Diagnostics 3.1 The Diagnostic Test 3 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
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3.1 The Diagnostic Test 3 Tests and Diagnostics HARD DISK TEST REAL TIMER TEST NDP TEST EXPANSION TEST CD-ROM/DVD-ROM TEST Other tests are: Wireless LAN TEST (Wireless LAN TEST disk) LAN/Modem/Bluetooth/IEEE1394 TEST (LAN/Modem/Bluetooth/IEEE1394 TEST disk) Sound TEST (Sound TEST disk) You will need the following equipment to perform some of the Diagnostic test programs.
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3 Tests and Diagnostics 3.1 The Diagnostic Test 3.1.2 H/W (Hardware) initial information setting tool The H/W initial information setting tool consists of the following programs. Initial configuration Region write System configuration display E2PROM test (MAC/GUID/DMI) You will need the following equipment to perform some of the programs. The Diagnostics Disk (Main T&D) A LAN wraparound connector (E2PROM test) 3.1.
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3.2 Executing the Diagnostic Test 3.2 3 Tests and Diagnostics Executing the Diagnostic Test To start the DIAGNOSTIC PROGRAM, follow these steps: 1. Insert the Diagnostics disk in the floppy disk drive. 2. Release the lock of the power switch and turn on the computer with pressing the F12. Select the FDD in the display for selecting booting unit. Then, press Enter and the following menu appears. Microsoft Windows XX Startup Menu --------------------------------------------------------1.
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3 Tests and Diagnostics 3.2 Executing the Diagnostic Test NOTE: To exit the DIAGNOSTIC TEST MENU, press the Esc key. If a test program is in progress, press Ctrl + Break to exit the test program. If a test program is in progress, press Ctrl + C to stop the test program. Set the highlight bar to 1, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp.
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3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Select the option you want to execute and press Enter. When you select 1- SYSTEM TEST, the following message will appear: SYSTEM TEST NAME SUB-TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXXXXX xxxxxxx DIAGNOSTIC TEST VX.
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3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Use the up and down arrow keys to move the cursor to “ERROR STOP”. Use the right and left arrow keys to move the cursor to the desired option and press Enter.
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3.3 Setting of the hardware configuration 3.3 3 Tests and Diagnostics Setting of the hardware configuration To execute this program, select 2-Repair initial config test in the startup menu, press Enter and follow the directions on the screen. The H/W initial information setting tool consists of four subtests. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Initial configuration This subtest executes the following items and shows their contents in the display.
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3 Tests and Diagnostics 3.3 Setting of the hardware configuration Setting of the HWSC Setting of the UUID Display of the DMI information (including UUID) Setting of DVD region code (Yes/No) After completion of the above settings, H/W configuration & DMI information are appeared in order. Check the contents and press Enter. Subtest 02 Region write This subtest executes the setting of the region code for DVD drive based on the destination of the machine.
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3.4 Heatrun Test 3.4 3 Tests and Diagnostics Heatrun Test To execute this program, select 3-Repair heatrun in the startup menu, press Enter. After selecting this test, the same subtests as 3.23 RUNNING TEST is executed successively. For more details on the procedure and test content, refer to RUNNING TEST. When the heatrun test ends, following message appears in the display.
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3 Tests and Diagnostics 3.5 3.5 Subtest Names Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No. Test Name Subtest No.
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3.5 Subtest Names 3 Tests and Diagnostics Table 3-1 Subtest names (2/2) No. 3-12 Test Name Subtest No.
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3 Tests and Diagnostics 3.6 3.6 System Test System Test To execute the System Test select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM Checksum This subtest executes a checksum test of the BIOS ROM (range: F0000h to FFFFFh, 64KB) on the System Board. Subtest 02 Fan ON/OFF This subtest turns on/off the fan motor by force with Fan ON/OFF commands.
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3.6 System Test 3 Tests and Diagnostics This subtest checks the status for the quick charge. Subtest 05 DMI read This subtest displays the information in the Flash-ROM in the following format. *** DMI Data Display Ver X.XX *** Model Name Version Number Serial Number Model Number UUID Number : : : : : XXXXXXXXXXX XXXXXXXXXXXX XXXXXXXX XXXXXX-XXXXX XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX Press [Enter] to EXIT To exit this subtest and return to the SYSTEM test menu, press Enter.
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3 Tests and Diagnostics 3.7 3.7 Memory Test Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Conventional memory This subtest writes a constant data to conventional memory (0 to 640 KB), then reads the new data and compares the result with the original data. Subtest 02 Protected Mode NOTE: The CONFIG.
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3.8 Keyboard Test 3.8 3 Tests and Diagnostics Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed key code display When a key is pressed, the scan code, character code, and key top name are displayed on the screen in the format shown below.
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3 Tests and Diagnostics 3.9 3.9 Display Test Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM read/write for VGA This subtest writes the constant data (AAh and 55h) to the video RAM. The data is read and compared to the original data.
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3.9 Display Test Subtest 04 3 Tests and Diagnostics Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode 12] 13] 3] 111 112 114 115 117 118 640*480 640*480 800*600 800*600 1024*768 1024*768 64K] 16M] 64K] 16M] 64K] 16M] The display below appears on the screen when this subtest is executed.
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3 Tests and Diagnostics Subtest 06 3.9 Display Test “H” Pattern Display This subtest displays a full screen of “H” patterns.
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3.10 Floppy Disk Test 3 Tests and Diagnostics 3.10 Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. The contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen.
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3 Tests and Diagnostics 3.10 Floppy Disk Test Select the number of the subtest you want to execute and press Enter. The following message will appear during the floppy disk test. FLOPPY DISK SUB-TEST PASS COUNT WRITE DATA ADDRESS IN PROGRESS : : : : XX XXXXX XX XXXXXX XXXXXXX xxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] : test end [Ctrl]+[C] : key stop ERROR COUNT READ DATA STATUS : XXXXX : XX : XXX When the subtest 04 or 05 is selected, the following messages will appear on the screen.
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3.11 Printer Test 3 Tests and Diagnostics 3.11 Printer Test CAUTION: Printer Test is not supported for this model. To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The following messages will appear after selecting the Printer Test from the DIAGNOSTIC TEST MENU. Answer each of the questions with an appropriate response to execute the test. NOTE: An IBM compatible printer must be connected to the system to execute this test.
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3 Tests and Diagnostics Subtest 02 3.11 Printer Test Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wraparound NOTE: To execute this subtest, a printer wraparound connector must be connected to the computer’s printer port.
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3.12 Async Test 3 Tests and Diagnostics 3.12 Async Test CAUTION: Async Test is not supported for this model. To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
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3 Tests and Diagnostics 3.13 Hard Disk Test 3.13 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. CAUTION: The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 08,or 09 is executed. Before running the test, the customer should transfer the contents of the hard disk to floppy disk or another hard disk. If the customer has not or cannot perform the back-up, create back-up disks as described below.
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3.13 Hard Disk Test 3 Tests and Diagnostics 4. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest. HARD DISK TEST XXXXXXX SUB TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXX DIAGNOSTIC TEST VX.
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3 Tests and Diagnostics Subtest 04 3.13 Hard Disk Test Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder.
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3.14 Real Timer Test 3 Tests and Diagnostics 3 3.14 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real time A new date and time can be input during this subtest. To execute the real time subtest, follow these steps: 1.
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3 Tests and Diagnostics Subtest 03 3.14 Real Timer Test Real time carry CAUTION: When this subtest is executed, the current date and time are erased.
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3.15 NDP Test 3 Tests and Diagnostics 3.15 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen.
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3 Tests and Diagnostics 3.16 Expansion Test 3.16 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wraparound CAUTION: PCMCIA wraparound test is not supported for this model. NOTE: To execute this subtest, the PC card wraparound connector is required.
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3.16 Expansion Test Subtest 02 3 Tests and Diagnostics RGB monitor ID NOTE: To execute this subtest, RGB monitor ID wraparound connector is required. The wiring diagram of the connector is described in Appendix F. Connect a wraparound connector to CRT monitor for the test of ID acquisition. This subtest is executed by using VESA command.
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3 Tests and Diagnostics 3.17 CD-ROM/DVD-ROM Test 3.17 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM test, select 13 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1. For the subtest 04, use a CD-RW on the market.
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3.18 Error Code and Error Status Names 3 Tests and Diagnostics 3.18 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test.
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3 Tests and Diagnostics 3.
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3.
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3 Tests and Diagnostics 3.19 Hard Disk Test Detail Status 3.19 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eightdigit number. The first four digits represent the hard disk controller (HDC) error status number and the last four digits are not used.
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3.19 Hard Disk Test Detail Status 3 Tests and Diagnostics Table 3-4 Error register contents Bit Name Description 7 BBK (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error. “1” … Uncorrectable data error has been detected. 5 —— Not used 4 IDN (Identification) “0” … Not used “1” … There is no ID field in the requested sector.
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3 Tests and Diagnostics 3.20 3.20 ONLY ONE TEST ONLY ONE TEST 3.20.1 Program Description This program tests the unique functions of this model. 3.20.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter. The following menu appears in the display. ################################################################# ######## ONLY ONE TEST Menu (XXXXXXXXX) ####### ################################################################# * * * 1 ............ Pressed Key Display * * 2 ............
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3.20 ONLY ONE TEST Subtest 01 3 Tests and Diagnostics Pressed key display When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed. Holding a key down enables the auto-repeat function which causes the key’s display character to blink. Press Del + Enter to end the test.
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3 Tests and Diagnostics Subtest 02 3.20 ONLY ONE TEST Touch Pad This subtest checks the functions of the touch pad as shown below. A) Direction and parameter B) Switching function check. This test displays the response from the touch pad and touch pad switch. When moving your finger on the touch pad towards the upper left, the display changes according to the following illustration. If a touch pad switch is pressed, the displays appear on the right side one by one.
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3.20 ONLY ONE TEST Subtest 03 3 Tests and Diagnostics GP Button This subtest checks if the AV buttons (10 buttons) work properly. The following message appears in the display. Press button [0] Press first AV button from the left (the nearest AV button to power button). The name of AV buttons in the message is described as number (0-9) from the left side. (Refer to the following picture.
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3 Tests and Diagnostics 3.20 ONLY ONE TEST Slide the switch to OFF position. Then, following message appears in the display. KILL SWITCH ON !! Slide the switch to ON position. Then, following message appears in the display. KILL SWITCH OFF !! After Sliding the switch to OFF position, return to the ONLY ONE TEST menu automatically. Subtest 05 USB NOTE: When executing this subtest, USB test module and USB cable must be connected. This subtest checks if USB port works properly.
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3.20 ONLY ONE TEST Subtest 06 3 Tests and Diagnostics Touch Pad (Scroll Button) This subtest checks if the scroll button of touch pad works properly. The following message appears in the display. ****** Scroll button TEST (VX.XX) ****** Press Scroll button Up Button OFF Down Button OFF Press [ESC] key to EXIT Check the message changes OFF<->ON while pressing UP or DOWN button of scroll button. Press ESC and return to ONLY ONE TESST menu. Subtest 07 LED This subtest checks if each LED lights properly.
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3 Tests and Diagnostics 3.20 ONLY ONE TEST Press Enter and following message appears in the display. Check [PowerSW-LED]= Green Check if the Power Switch LED lights in the following order. (Green -> Orange -> Blue -> OFF) Press any key and following message appears in the display. Check [DC-IN]&[Power]&[Main Battery]LED= Green Check if the each LED lights in the same color as the message in the display (Message switches Green <-> Orange ). Press Enter and return to the ONLY ONE TEST menu.
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3.21 Head Cleaning 3.21 3 Tests and Diagnostics Head Cleaning 3.21.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.21.2 Operations 1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS - FLOPPY DISK HEAD CLEANING : VX.XX Mount cleaning disk(s) on drive(s). Press any key when ready. 2.
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3 Tests and Diagnostics 3.22 3.22 Log Utilities Log Utilities 3.22.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or output the data to a printer. The error information is displayed in the following order: 1. Error count (CNT) 2. Test name, Subtest number (TS-No) 3. Pass count (PASS) 4. Error status (STS) 5. FDD/HDD or memory address (ADDR) 6. Write data (WD) 7.
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3.22 Log Utilities 3 Tests and Diagnostics 3.22.2 Operations 1. Select 5 and press Enter in the DIAGNOSTIC MENU, logs error information into RAM or onto a floppy disk.
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3 Tests and Diagnostics 3.23 3.23 Running Test Running Test 3.23.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02, 06) 3. Display test (subtest 01) 4. Real timer test (subtest 02) 5. HDD test (subtests 01) The system automatically detects the number of floppy disk drives connected to the computer for the FDD test. 3.23.2 Operations 1.
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3.24 Floppy Disk Drive Utilities 3.24 3 Tests and Diagnostics Floppy Disk Drive Utilities 3.24.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE: This program is only for testing a floppy disk drive. The option is different from the Toshiba MS-DOS FORMAT command.
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3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 3.24.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 2 3 4 9 – - FORMAT COPY DUMP HDD-ID READ EXIT TO DIAGNOSTICS MENU 2. FORMAT program (a) Selecting FORMAT displays the following message: DIAGNOSTICS - FLOPPY DISK FORMAT : VX.
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3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below: Insert source disk into drive A: Press any key when ready. (c) Remove the Diagnostics Disk from the FDD, insert the source disk and press any key. The following message will appear, indicating the program has started.
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3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If 2:HDD is selected, the display will go to step (h). If 1:FDD is selected, the following message will appear: Select drive number (1:A, 2:B) ? (c) Select a drive number and the following message will be displayed.
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3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? 5. HDD ID READ program Selecting HDD ID displays the following HDD ID configuration: [HDD ID Read (VX.XX)] [Drive #1] Model No.
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3 Tests and Diagnostics 3.25 System Configuration 3 3.25 System Configuration 3.25.1 Function Description The System Configuration program contains the following configuration information for the computer: 1. Processor Type [Code/L2 cache] 2. Chip set [VRAM] 3. BIOS ROM version [1st ID, 2nd ID] 4. Boot ROM version 5. EC total version 6. PS Microprocessor version 7. SVP parameter version [Panel/Manufacture code/Product code] 8. Micro code revision [Processor number] 9.
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3.25 System Configuration 3 Tests and Diagnostics 3.25.2 Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display. System Configuration Display : Ver X.XX [Machine Name ???] * * * * * * * * * * * * * * * - Processor Type - Chip set - BIOS ROM Version - BOOT ROM Version - EC Total Version - PS Micon Version - SVP Par.
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3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Intel-made b/g) 3.26 Wireless LAN Test Program (Intel-made b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade Calexico 802.11b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS.
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3.26 Wireless LAN Test Program (Intel-made b/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Using a wrong wireless LAN card (Using unspecified card) • Defective wireless LAN card Checking the connection, execute the subtest again. Subtest02 MAC Address Check This subtest displays the MAC address. Selecting this subtest, following message will appear in the display.
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3 Tests and Diagnostics Subtest03 3.26 Wireless LAN Test Program (Intel-made b/g) Antenna check & communication test of 11b mode Caution: To execute subtest 03-05, use another computer (with Calexico wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform those tests. Access points are also required. (Access point for 802.11b and 802.11g) Be sure to turn the wireless communication switch ON before executing wireless LAN communication test.
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3.26 Wireless LAN Test Program (Intel-made b/g) Subtest04 3 Tests and Diagnostics Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. After finishing the test, OK message will appear in the display. Press any key and return to the test menu. When a defective is found during the test, NG message will appear in the display. Press any key and following message will appear in the display.
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3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g) 3.27 Wireless LAN Test Program (Intel-made a/b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade Calexico 802.11a/b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS.
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3.27 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics If a defective is found during the test, NG message will appear in the display. Press any key and following message will appear in the display. ************************************************************* * * * SKU NG !! * * * * Other Card or Module not found * * * ************************************************************* Press any key and return to the test menu.
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3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g) When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Defective wireless LAN card • Disappearance of MAC address data Checking the connection, execute the subtest again.
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3.27 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Connection of wireless LAN antenna cable (Main/Aux) • Condition of wireless LAN communication (Interference/obstruction) • Defective wireless LAN card Checking the connection and condition, execute the subtest again.
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3 Tests and Diagnostics Subtest05 3.27 Wireless LAN Test Program (Intel-made a/b/g) Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. For more details on procedure and contens of this subtest, refer to Subtest04 Communication test of 11a mode. Subtest06 All the tests of Calexico 11a/b/g Card This subtest checks SKU information, MAC address of Calexico 802.11a/b/g card, antenna connection and communication test of Calexico 802.
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3.28 Wireless LAN Test Program (Askey-made) 3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Askey-made) This section describes how to perform the wireless LAN transmitting-receiving test (Askeymade Atheros b/g, a/b/g). Caution: To execute subtest 03-07, use another computer (with Atheros wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform those tests. Another wireless communication tool with 2.4GHz like Bluetooth is interfering with the test.
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3 Tests and Diagnostics 3.
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3.28 Wireless LAN Test Program (Askey-made) Subtest02 3 Tests and Diagnostics MAC Address Check This subtest displays the MAC address. Selecting this subtest, following message will appear in the display. ************************************************************* * * * MAC Address Check : OK !! * * * ************************************************************* Press any key and return to the test menu. When a defective is detected in the test, following typical cause is considered.
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3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Askey-made) When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Connection of wireless LAN antenna cable (Main/Aux) • Condition of wireless LAN communication (Interference/obstruction) • Defective wireless LAN card Checking the connection and condition, execute the subtest again.
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3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the test program. Insert the test program disk for LAN/Modem/Bluetooth/IEEE1394 test in FDD and turn on the power. The following message will appear: Microsoft Windows XX Startup Menu ---------------------------------1. LAN 2. Modem 3. Bluetooth 4.
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3 Tests and Diagnostics Subtest01 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program (i82562 + ICHx) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip.
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3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest02 3 Tests and Diagnostics (GbE) CAUTION: Gigabit Ethernet test is not supported for this model. This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. Select 2 to execute and press Enter. The following message will appear: Testing adaptor...hit to abort. * External Loopback Test...PASSED Testing completed.
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3 Tests and Diagnostics 3.29.2 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Modem test For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Denki Seisakusyo)” for the tests. To execute Modem test, press 2 and Enter. Following message will appear: [Modem loopback test !] ICHx MDC Test Program with Modem Sound (Line Test) Version X.
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3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.3 3 Tests and Diagnostics Bluetooth test CAUTION: Bluetooth test is not supported for this model. To execute this test, input 3 and press Enter. Note: Use another computer that can communicate by the Bluetooth as a reference machine to perform this test. Insert a floppy disk containing the test program into the target machine and turn on the target machine.
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3 Tests and Diagnostics Subtest01 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program BD_ADDR check This subtest checks the BD_ADDR functions. When the Bluetooth test menu is displayed, press 1 to select the test and press Enter. The following message will appear: ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
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3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If the target machine has any problem, it displays Error CODE. The following message is displayed. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
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3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-6 Error code for Bluetooth test (BD_ADDR) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection. Hardware Failure.
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3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Table 3-6 Error code for Bluetooth test (BD_ADDR) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
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3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program When the Bluetooth test menu is displayed, press T to select the test and press Enter in the test machine. The following message will appear: ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
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3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If the target machine has any problem, the following message “INCOMPLETE” is displayed with the Error Code. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
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3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection.
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3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
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3 Tests and Diagnostics 3.29.4 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program IEEE1394 test To execute this test, input 4 and press Enter. NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test. The following menu will appear: ******************************************************************** ******** IEEE1394[XXXXX] Diagnostics program ************** ******************************************************************** * * * 1 ....
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3.30 Sound Test program 3 3 Tests and Diagnostics Tests and Diagnostics 3.30 Sound Test program This section describes how to perform the Sound test. To execute the sound test, refer to the following description. Insert the test program disk for Sound test in the floppy disk drive and turn on the power.
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3 Tests and Diagnostics 3.30 Sound Test program To return to the Sound test menu, Press 9 and Enter. Then following message will appear in the display. *********************************** ******** May I Restart ? ******* *********************************** Press any key to continue… After pressing any key, the machine starts rebooting and sound test menu will appear in the display. Subtest01 Microphone recording & play This subtest checks the function of the CODEC A/D, D/A converter.
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3.30 Sound Test program Subtest02 3 Tests and Diagnostics Sine Wave This subtest is executed by loading the COM file (ADSIN.COM). The program expands sine wave data table from 16KB to 64KB, and creates the play data. Then it transfers the data between the DMA and the CODEC to play the sine wave. (It sounds like a continuous beep). By using wave measurable devices such as an oscilloscope, the data can be measured as a sine wave.
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3 Tests and Diagnostics 3.30 Sound Test program 3.30.3 CD Sound (Standard) test To execute the CD Sound (Standard) test, press 3 and Enter. Insert the test media (TOSHIBA TEST CD-ROM or ABEX TEST CD-ROM) or music CD on the market (if the test media can not be prepared). Following menu appears in the display. For details on use of test media, refer to (1) Test media (Toshiba-made test media). For details on use of audio CD on the market, refer to (2) Audio CD.
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3.30 Sound Test program Subtest02 3 Tests and Diagnostics English Narration Selected this subtest, narration in English starts. For more details on the procedure, refer to the subtest01. Subtest03 Test Tone A Caution: Before starting subtest03, be sure to set the sound at proper volume. This subtest plays sine wave while changing its table from 100Hz to 20Hz. Return to the CD Sound (Standard) menu after the test ends.
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3 Tests and Diagnostics 3.30 Sound Test program (2) Audio CD Insert an audio CD and the following menu appears in the display. CD/DVD TEST IN PROGRESS XXXXXXXX SUB-TEST PASS COUNT WRITE DATA ADDRESS XX XXXXX XX XXXXXX : : : : xxxxxxx DIAGNOSTIC TEST VX.
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3.31 SETUP 3 Tests and Diagnostics 3.31 SETUP 3.31.1 Function Description This program displays the current system setup information as listed below: 1. Memory 2. System Date/Time 3. Battery 4. Password 5. Boot Priority (a) Boot Priority (b) HDD Priority (c) Network Boot Protocol 6. Others (a) (b) (c) (d) (e) (f) (g) CPU Cache Level 2 Cache Dynamic CPU Frequency Mode Auto Power On Start Up Logo Sound Logo Power Button Lamp 7. Configuration 8. Drives I/O (a) Built-in HDD (b) CD-ROM 9. PCI Bus 10.
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3 Tests and Diagnostics 3.31 SETUP 3.31.
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3.31 SETUP 3 Tests and Diagnostics Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press ↑ and ↓ to move between items in a column. Press Fn+↑ (PgUp) and Fn + ↓ (PgDn) to move between the two pages. 2. Press either the Space bar or Back Space to change the value. Accepting Changes and Exiting the SETUP Window 1. Press End to accept the changes you made.
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3 Tests and Diagnostics 3.31 SETUP SETUP Options The SETUP screen is divided into 13 functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s memory. This field displays the total amount of memory installed and is automatically calculated by the computer. You cannot change this value. 2. System Date/Time Sets the date and time. System Date Sets date. System Time Sets time. 3.
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3.31 SETUP 3 Tests and Diagnostics NOTE: Display of the LCD Brightness will be changed in the condition below: (*1) Operating the battery (*2) Using the AC adapter User Setting Use this option to set the battery save parameters on the sub-window, BATTERY SAVE OPTIONS. Battery Save Options Processing Speed This feature changes the CPU processing speed. High CPU operates at 1.50/1.60/1.70/1.80/2.00/2.10GHz(Pentium-M), (Default in Full Power Mode) Low CPU operates at half processing speed.
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3 Tests and Diagnostics 3.31 SETUP HDD Auto Off Use this option to set the duration of the HDD automatic power off function. xx Min. Automatically turns off the power to the hard disk drive if it is not used for the duration set. The duration xx can be set to 1, 3, 5, 10, 15, 20 or 30 minutes. LCD Brightness Use this option to set the level of LCD brightness. Super-Bright Full brightness for maximum visibility. Bright Full brightness for high visibility.
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3.31 SETUP 3 Tests and Diagnostics 4. Password This option sets or resets the user password for power on and instant security (Fn+F1). Registered The user password has been registered. Not registered The user password has not been registered. For details on setting the user password, refer to the User’s Manual. 5. Boot Priority (a) Boot Priority Use this option to set the priority for booting of the computer and the priority for the HDD for booting.
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3 Tests and Diagnostics 3.31 SETUP (b) HDD Boot Priority Use this option to set the booting priority from HDD. Built in HDD1→Built in HDD2 (Default) : Searching boot-command from Built in HDD1 Built in HDD2→Built in HDD1 : Searching boot-command from Built in HDD2 NOTE: When 2nd HDD is not installed, this option does not appear in the menu. If the boot command can not be detected from the prior HDD, booting target changes to other devices.
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3.31 SETUP 3 Tests and Diagnostics Dynamically Switchable Enables Pentium-M processor featuring Intel SpeedStep technology. (Default) Always High Disables Pentium-M processor featuring Intel SpeedStep technology and always runs the processor at its maximum speed. Always Low Disables Pentium-M processor featuring Intel SpeedStep technology and always runs the processor at its default speed. (d) Auto Power On This option displays setting for Auto Power On. Disabled Indicates auto power on is not set.
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3 Tests and Diagnostics 3.31 SETUP (e) Start Up Logo This option enables or disables an animation logo function. Animation Enables the animation logo function. (Default) Picture Disables the animation logo function (f) Sound Logo This option enables or disables sound logo function. Enabled Enables the sound logo function. (Default) Disabled Disables the sound logo function (g) Power Button Lamp This option sets the power button lamp. Off Always off. Mode 1 Sets to Mode1.
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3.31 SETUP 3 Tests and Diagnostics 7. Configuration This option lets you set the device configuration. All Devices BIOS sets all devices. Setup by OS Initializes devices, which is needed to load an operating system. Operating system initializes other devices. NOTE: (1) When using installed OS, selecting “Setup by OS” is recommended. (2) When executing test programs, be sure to select “ALL Device”. And after the test end, select “Setup by OS”. 8.
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3 Tests and Diagnostics 3.31 SETUP NOTE: When starting the computer in Standby or Hibernation, the last configuration is remembered. If data does not appear on the display you are using after starting in Standby or Hibernation, pressing Fn+F5. Pressing Fn+F5 changes the display setting as follows in order: the internal LCD, the external CRT, both the internal LCD and the external CRT and TV display. You cannot select TV display in HW Setup. To display on a TV screen, use Fn+F5.
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3.31 SETUP 3 Tests and Diagnostics (b) Hard Disk Mode Use this option to select the hard disk mode. Enhanced IDE (normal) Select this mode when the HDD is used for MS-DOS, Windows 95/98/2000/XP, or OS/2. (Default) Standard IDE Select this mode when using an OS which does not support the Enhanced IDE. When this mode is selected, up to 528MB is logically available and the rest of the capacity is not usable.
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Chapter 4 Replacement Procedures QOSMIO G10 Maintenance Manual (960-497) 4-i
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4 Replacement Procedures 4 4-ii QOSMIO G10 Maintenance Manual (960-497)
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4 Replacement Procedures Chapter 4 4.1 Contents Overview.................................................................................................................... 4-1 Safety Precautions................................................................................................ 4-2 Before You Begin ................................................................................................ 4-3 Disassembly Procedure..........................................................................
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4 Replacement Procedures 4.16 RTC battery / BT board ........................................................................................... 4-45 4.12.1 RTC battery........................................................................................... 4-50 4.12.2 BT board................................................................................................ 4-50 4.17 CPU fan...................................................................................................................
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4 Replacement Procedures Figures Figure 4-1 Removing the battery pack................................................................................. 4-8 Figure 4-2 Removing a PC card......................................................................................... 4-10 Figure 4-3 Removing a bridge media ................................................................................ 4-11 Figure 4-4 Removing the HDD assembly..........................................................................
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4 Replacement Procedures Figure 4-30 Removing a MDC ............................................................................................ 4-46 Figure 4-31 Removing the touch pad................................................................................... 4-47 Figure 4-32 Removing the hinge (cover assembly side) ..................................................... 4-49 Figure 4-33 Removing the RTC battery ..............................................................................
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4 Replacement Procedures 4.1 Overview 4 4.1 Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual. In all cases when removing an FRU, the battery pack must also be removed.
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4.1 Overview 4 Replacement Procedures Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. DANGER: 1. In the case of the battery, always use authentic parts or equivalent parts approved by Toshiba. Other batteries may have different specifications that are incompatible with the computer and may result in fire or explosion.
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4 Replacement Procedures 4.1 Overview Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2.1 Battery Pack”. 1. Do not disassemble the computer unless it is operating abnormally. 2. Use the designated tools. 3. Ensure that the environment for working on and storing parts does not contain any of the following.
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4.1 Overview 4 Replacement Procedures Disassembly Procedure Three main types of cable connector are used. • Pressure plate connector • Spring connector • Normal pin connector When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cable out from the connector. When reconnecting a cable to a pressure plate connector, lift up the pressure plate to a suitable height and insert the cable into the connector.
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4 Replacement Procedures 4.1 Overview Assembly Procedure After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. • Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems. • Check that all cables and connectors are securely connected.
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4.1 Overview 4 Replacement Procedures Screw Tightening Torque Use the following torque when tightening screws. CAUTION: Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage. NOTE: To tighten screws quickly and accurately, an electric screwdriver is recommended. • M2 (2mm) 0.167 N·m (1.7 kgf·cm) • M2.5 (2.5mm) 0.294 N·m(3.0 kgf·cm) • M3.0 (3mm) 0.549 N･m (5.
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4 Replacement Procedures 4.1 Overview Screw Notation To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body. Format: Screw shape + Screw length (mm) Screw shape B: Bind screw F: Thin head screw S: Super thin head screw T: Tapping screw U: Other screws (Unique screws: pan head, stud, etc.
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4.2 Battery pack 4.2 4 Replacement Procedures Battery pack Removing the battery pack The following describes the procedure for removing the battery pack (See Figure 4-1). CAUTION: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC adapter and all external devices from the computer. 3. Turn the computer upside down. 4.
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4 Replacement Procedures 4.2 Battery pack NOTE: Dispose of the used battery pack in accordance with the laws and ordinances of your local authority. Installing the battery pack The following describes the procedure for installing the battery pack (See Figure 4-1). CAUTION: There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly. Dispose always the used battery pack in accordance with the laws and ordinances of your local authority.
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4.3 PC card/Bridge media 4.3 4 Replacement Procedures PC card/Bridge media 4.3.1 PC card Removing a PC card The following describes the procedure for removing a PC card (See Figure 4-2). CAUTION: Insert or remove a PC card in accordance with any instructions in a PC card manual or the manuals of the computer system you are using. 1. Push the eject button. It will pop out when you release it. Then press the eject button once more to eject a PC card. 2. Grasp a PC card and remove it.
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4 Replacement Procedures 4.3 PC card/Bridge media 4.3.2 Bridge media (SD Card / Memory Stick / xDPicture Card) Removing a Bridge media The following describes the procedure for removing a Bridge Media (See Figure 4-3). CAUTION: Insert or remove a Bridge Media in accordance with any instructions in the each Bridge Media manual or the manuals of the computer system you are using. 1. Push a Bridge media. It will pop out partly when you release, so pull out the card.
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4.4 HDD 4.4 4 Replacement Procedures HDD Removing a HDD The following describes the procedure for removing a HDD (See Figure 4-4 to 4-6). CAUTION: Take care not to press on the top or bottom of a HDD. Pressure may cause data loss or damage to the device. 1. Turn the computer upside down. 2. Remove the following screws securing a HDD slot cover and remove a HDD slot cover. • M2.5×4.0B FLAT BIND screw x3 3. Remove the following screws securing the 1st HDD assembly. • M2.5×6.
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4 Replacement Procedures 5. 4.4 HDD (If a 2nd HDD is installed) Remove the following screw securing the 2nd HDD assembly. • M2.5×6.0B FLAT BIND screw x１ 6. Disconnect the 2nd HDD assembly from the connector CN1800 on the system board. M2.5x4.0B FLAT BIND HDD slot cover M2.5x6.0B FLAT BIND Figure 4-4 Removing the HDD assembly 7. Remove the short pin from the connector pin of the 2nd HDD.
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4.4 HDD 4 Replacement Procedures 8. Remove the following screws securing the HDD holder and remove the HDD holder. • M3.0×4.0Z FLAT BIND screw x4 M3.0x4.
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4 Replacement Procedures 4.4 HDD Installing a HDD The following describes the procedure for installing a HDD (See Figure 4-4 to 4-6). 1. Install a HDD to the HDD holder and secure it with the following screws. • M3.0×4.0Z FLAT BIND screw x4 NOTE: Although they are 3mm head screws, screw torque must be set in 0.294 N·m (3.0Kgf·cm) for four screws securing the HDD holder. 2. (If a 2nd HDD is installed) Attach a short pin to the connector pin of the 2nd HDD assembly. 3.
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4.5 Wireless LAN card 4.5 4 Replacement Procedures Wireless LAN card Removing a Wireless LAN card The following describes the procedure for removing a Wireless LAN card (See Figure 4-7). 1. Remove the following screw securing wireless LAN card cover and remove it. • B2.0 x 4.0Z BIND screw x1 LH STICK x1 or • B2.0 x 4.0B 2. Disconnect the wireless LAN antenna cable Main (white cable) and AUX (black cable) from the connectors on a wireless LAN card. 3.
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4 Replacement Procedures 4.5 Wireless LAN card Installing a Wireless LAN card The following describes the procedure for installing a Wireless LAN card (See Figure 4-7). 1. Insert a wireless LAN card terminals slantwise into the connector CN2200 on the computer and press a wireless LAN card until it is securely in place. 2. Connect the wireless LAN antenna cables (black and white) to the terminals on a wireless LAN card. 3. Install the wireless LAN card cover and secure it with the following screw. • B2.
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4.6 Memory module 4.6 4 Replacement Procedures Memory module CAUTION: The power of the computer must be turned off when you remove a memory module. Removing a memory module with the power on risks damaging the module or the computer itself. Do not touch memory module terminals. Any dirt on the terminals may cause memory access problems. Never press hard or bend a memory module. Removing a memory module To remove a memory module, confirm that the computer is in boot mode.
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4 Replacement Procedures 4.6 Memory module Installing a memory module To install a memory module, confirm that the computer is in boot mode. Then perform the following procedure (See Figure 4-8). 1. Insert a memory module into the connector of the computer slantwise (terminal side first) and press it to connect firmly. CAUTION: The power must be turned off when you insert a memory module. Inserting a memory module with the power on might damage the module or the computer itself.
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4.7 Keyboard 4.7 4 Replacement Procedures Keyboard Removing the keyboard The following describes the procedure for removing the keyboard (See Figure 4-9 to 4-11). CAUTION: As the keytop may fall out, when handling the keyboard always hold it by the frame and do not touch the keytop. 1. Open the display. 2. Insert your finger into the slot between the keyboard brace and the computer. Then, lift up the keyboard brace to unlatch and remove it. 3.
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4 Replacement Procedures 4.7 Keyboard 5. Remove the following screws securing the keyboard. • M2.5×2.8B FLAT BIND screw x2 6. Lift the upper side of the keyboard and turn it face down on the palm rest. M2.5x2.
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4.7 Keyboard 4 Replacement Procedures 7. Remove the following screws securing the keyboard support plate and remove the keyboard support plate. • M2.5×8.0B FLAT BIND screw x2 8. Disconnect the keyboard flexible cable from the connector CN3200 on the system board. 9. Remove the keyboard. M2.5x8.
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4 Replacement Procedures 4.7 Keyboard Installing the keyboard The following describes the procedure for installing the keyboard (See Figure 4-9 to 4-11). 1. Turn the keyboard upside down and place it on the palm rest as its face down. Connect the keyboard flexible cable to the connector CN3200 on the system board. 2. Install the keyboard support plate and secure it with the following screws. • M2.5×8.0B FLAT BIND screw x2 3. Turn the keyboard face up and put it on the computer.
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4.8 Switch membrane 4.8 4 Replacement Procedures Switch membrane Removing the switch membrane The following describes the procedure for removing the switch membrane (See Figure 4-12). 1. Turning up the insulator, disconnect the switch membrane from the connector CN9650 on the system board. 2. Remove the following screw securing the switch membrane. • M2.5×2.8B FLAT BIND screw x1 3. Slide the switch membrane to the arrow direction and remove it. CN9650 M2.5x2.
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4 Replacement Procedures 4.8 Switch membrane Installing the switch membrane The following describes the procedure for installing the switch membrane (See Figure 4-12). 1. Slide and set the switch membrane in the computer. 2. Turning up the insulator, connect the switch membrane to the connector CN9650 on the system board. 3. Secure the switch membrane with the following screw. • M2.5×2.
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4.9 Optical disk drive 4.9 4 Replacement Procedures Optical disk drive NOTE: Do not apply excessive force to the top of an optical disk drive. Do not touch the shaded portion of the figure below, when the drive is removed or installed. Removing an optical disk drive The following describes the procedure for removing an optical disk drive (See Figure 4-13 and 4-14). 1. Turn over the computer and remove the following screws securing an optical disk drive. • M2.5×4.0B FLAT BIND screw x2 2.
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4 Replacement Procedures 4.9 Optical disk drive 3. Remove the following screws securing the side bracket and remove it from an optical disk drive. • M2.0×3.0C SUPER THIN HEAD screw x2 • M2.0×3.2B Stepping screw x1 Side bracket Stepping screw M2.0×3.0C SUPER THIN HEAD Figure 4-14 Disassembling the side bracket Installing an optical disk drive The following describes the procedure for installing an optical disk drive (See Figure 4-13 and 4-14). 1.
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4.10 Display assembly 4 Replacement Procedures 4 4.10 Display assembly Removing the display assembly The following describes the procedure for removing the display assembly (See Figure 4-15 to 4-20). 1. Close the display and turn the computer upside down. 2. Remove the following screws from the bottom of the computer. • M2.5×8.0B FLAT BIND screw (Locktight) x2 M2.5x8.
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4 Replacement Procedures 4.10 Display assembly 3. Peeling off the insulator, pull out the wireless LAN antenna cables from the guide. 4. Pull out the bluetooth antenna cable from the bluetooth. 5. Pull out the bluetooth antenna cable from the guide. Insulator Wireless LAN antenna cable Guide Bluetooth antenna cable Figure 4-16 Removing the cables (back) 6. Turning over the computer and opening the display, peel off the insulators and pull out the wireless antenna cables from the slot.
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4.10 Display assembly 4 Replacement Procedures 7. Peel off the mask seals from the display mask and remove the following screws securing the display mask. • M2.5×6.0B FLAT BIND screw x2 8. Releasing latches of hinge caps, remove the hinge caps from both sides. 9. Remove the following screws securing the hinge. • M2.5×8.0B Hinge cap FLAT BIND screw (Locktight) x2 Hinge cap M2.5x8.0B FLATBIND (Locktight) M2.5x8.0B FLATBIND (Locktight) Mask seal Mask seal M2.5x6.0B FLAT BIND M2.5x6.
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4 Replacement Procedures 4.10 Display assembly 10. Remove the following screws securing the LCD harness holder. • M2.5×2.8B FLAT BIND screw x1 11. Remove the LCD harness holder. 12. Remove the LCD harness from the connector CN5600 on the system board. LCD harness holder M2.5x2.
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4.10 Display assembly 4 Replacement Procedures 13. Pulling out the pole of hinge from the hole of base assembly, remove the display assembly from the base assembly.
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4 Replacement Procedures 4.10 Display assembly Installing the display assembly The following describes the procedure for installing the display assembly (See Figure 4-15 to 4-20). 1. Inserting the pole of hinge to the hole of base assembly, set the display assembly on the base assembly. 2. Secure the hinges with the following screws. • M2.5×8.0B FLAT BIND screw (Locktight) x2 NOTE: Be sure to apply the locktight to the screws instructed in the figure above. 3.
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4.11 Cover assembly 4 Replacement Procedures 4.11 Cover assembly Removing the cover assembly The following describes the procedure for removing the cover assembly (See Figure 4-21 to 4-24). 1. Turn over the computer. 2. Remove the following screws securing the cover assembly from the back and bottom of computer. • M2.5×4.0B FLAT BIND screw x3 ("4" in the figure) • M2.5×6.0B FLAT BIND screw x3 ("6" in the figure) • M2.5×8.0B FLAT BIND screw x4 ("8" in the figure) • M2.5×16.
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4 Replacement Procedures 4.11 Cover assembly 3. Disconnect the VGA fan cable from the connector CN8780 in the memory slot.
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4.11 Cover assembly 4 Replacement Procedures 4. Turning over the computer, remove the following screws securing the cover assembly. • M2.5×8.0B FLAT BIND screw x3 5. Disconnect the SD board flat cable from the connector CN9500 on the system board. 6. Disconnect the touch pad flat cable from the connector CN3201 on the system board. 7. Turning up the insulator, disconnect the LE board flat cable from the connector CN9660 on the system board 8.
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4 Replacement Procedures 4.11 Cover assembly 9. Pull up and remove the cover assembly from the base assembly.
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4.11 Cover assembly 4 Replacement Procedures Installing the cover assembly The following describes the procedure for installing the cover assembly (See Figure 4-21 to 4-24). 1. Install the cover assembly to the base assembly. NOTE: Be careful not to catch the cables between cover assembly and base assembly. 2. Connect the MDC harness to the connector CN3021 on the system board. 3. Turning up the insulator, connect the LE board flat cable to the connector CN9660 on the system board. 4.
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4 Replacement Procedures 4.12 Bluetooth / LE board 4.12 Bluetooth / LE board 4.12.1 Bluetooth Removing a Bluetooth The following describes the procedure for removing a bluetooth (See Figure 4-25). 1. Remove the following screw securing a bluetooth module. • M2.0×4.0Z BIND screw x1 2. Disconnect the blutooth flat cable from a bluetooth module. 3. Remove a bluetooth module from the cover assembly. M2.0x4.
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4.12 Bluetooth / LE board 4 Replacement Procedures 4.12.2 LE board Removing the LE board The following describes the procedure for removing the LE board (See Figure 4-26). 1. Remove the following screws securing the LE board and remove the LE board from the cover assembly. • M2.5×4.0B FLAT BIND screw x2 2. Disconnect the LE board flat cable from the connector CN9670 on the LE board. 3. Disconnect the bluetooth flat cable from the connector CN4400 on the LE board. M2.5x4.
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4 Replacement Procedures 4.12 Bluetooth / LE board Installing the LE board The following describes the procedure for installing the LE board (See Figure 4-26). 1. Connect the bluetooth flat cable to the connector CN4400 on the LE board. 2. Connect the LE board flat cable to the connector CN9670 on the LE board. 3. Fitting the wireless communication switch to the lever, install the LE board to the cover assembly and secure it with the following screws. • M2.5×4.
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4.13 SD board / Microphone / MDC 4 Replacement Procedures 4.13 SD board / Microphone / MDC 4.13.1 SD board Removing the SD board The following describes the procedure for removing the SD board (See Figure 4-27 and 4-28). 1. Turn up the insulator and peel off the glass tape covering the MDC harness. 2. Pull out the MDC harness and its core from the guide of cover assembly. 3. Remove the following screws securing the MDC cover plate and remove the MDC cover plate. • M2.5×6.0B SUPER THIN HEAD screw M2.
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4 Replacement Procedures 4.13 SD board / Microphone / MDC 4. Remove the following screws securing the mic assembly and peel off the insulator fixing the SD board. • M2.0×4.0Z BIND screw x1 5. Pulling out the SD board flat cable from the slot of cover assembly, remove the SD board from the cover assembly with the mic assembly connected. 6. Turning over the SD board, disconnect the SD board flat cable from the connector CN9510 on the system board. M2.0x4.
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4.13 SD board / Microphone / MDC 4 Replacement Procedures Installing the SD board The following describes the procedure for installing the SD board (See Figure 4-27 and 4-28). 1. Connect the SD board flat cable to the connector CN9510 on the SD board. 2. Passing through the SD board flat cable to the slot of the cover assembly, fix it with the insulator in the front side. 3. Arrange the MDC harness along the guide of the cover assembly and fix it with glass tape. 4.
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4 Replacement Procedures 4.13 SD board / Microphone / MDC 4.13.2 Microphone Removing the microphone The following describes the procedure for removing the microphone (See Figure 4-29). 1. Disconnect the mic cable from the connector CN6000 on the SD board. 2. Pull out the microphone from the mic hold guide. Microphone Mic hold guide CN6000 Figure 4-29 Removing the microphone Installing the microphone The following describes the procedure for installing the microphone (See Figure 4-29). 1.
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4.13 SD board / Microphone / MDC 4 Replacement Procedures 4.13.3 MDC Removing a MDC The following describes the procedure for removing a MDC (See Figure 4-30). 1. Remove the following screws securing a MDC. • M2.0×4.0Z BIND screw x2 2. Pull up straight and remove a MDC from the connector CN3000 on the SD board. 3. Disconnect the MDC harness from a MDC. M2.0x4.
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4 Replacement Procedures 4.14 4.14 Touch pad Touch pad Removing the touch pad The following describes the procedure for removing the touch pad (See Figure 4-31). 1. Peel off the glass tape and disconnect the touch pad flat cable from the connector on the touch pad. 2. Remove the following screws securing the touch pad plate. • M2.5×3.0B SUPER THIN HEAD screw x3 3. Turning up the insulator, remove the touch pad plate. 4. Remove the following screws securing the touch pad. • M2.5×3.
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4.14 Touch pad 4 Replacement Procedures Installing the touch pad The following describes the procedure for installing the touch pad (See Figure 4-31). 1. Peel off the separator covering on the sensor portion of a new touch pad. NOTE: Do not reuse the touch pad so that it can not be used after peeling off from the computer. Be sure to stick a new touch pad. When stickimg the touch pad, be careful not to get the bubbles under the touch pad. 2. Stick and install the touch pad on the cover assembly. 3.
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4 Replacement Procedures 4.15 Hinge (cover assembly side) 4.15 Hinge (cover assembly side) Removing the Hinge The following describes the procedure for removing hinge (See Figure 4-32). 1. Remove the following screws securing the hinges (cover assembly side). • M2.5×6.0 PSP TIGHT screw x2 2. Turn up the insulator on the left hinge and remove the hinges from the cover assembly. M2.5x6.
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4.16 RTC battery / BT board 4.16 4 Replacement Procedures RTC battery / BT board 4.16.1 RTC battery Removing the RTC battery The following describes the procedure for removing the RTC battery (See Figure 4-33). 1. Peel off the glass tape and pull out the RTC battery from the battery connector cover. 2. Disconnect the RTC battery cable from the connector CN9990 on the system board.
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4 Replacement Procedures 4.16 RTC battery / BT board 4.16.2 BT board Removing the BT board The following describes the procedure for removing the BT board (See Figure 4-34). 1. Remove the following screw securing the battery connector cover and remove the battery connector cover. • M2.5×6.0B FLAT BIND screw x1 2. Disconnect the BT board flat cable from the connector CN9691 on the BT board and from the connector CN8021 on the system board. 3. Remove the following screw securing the BT board. • M2.5×6.
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4.16 RTC battery / BT board 4 Replacement Procedures Installing the BT board The following describes the procedure for installing the BT board (See Figure 4-34). 1. Connect the battery harness to the connector CN9690 on the BT board and to the connector CN8020 on the system board. 2. Install the BT board and secure it with the following screw. • M2.5×6.0B FLAT BIND screw x1 3. Connect the BT board flat cable to the connector CN9691 on the BT board and to the connector CN8021 on the system board. 4.
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4 Replacement Procedures 4.17 4.17 CPU fan CPU fan Removing the CPU fan The following describes the procedure for removing the CPU fan (See Figure 4-35). 1. Disconnect the CPU fan cable from the connector CN8770 on the system board. 2. Remove the following screws securing the CPU fan and remove the CPU fan. • M2.5×4.0B FLAT BIND screw M2.5x4.0B FLAT BIND x2 M2.5x4.
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4.18 US board 4 Replacement Procedures 4.18 US board Removing the US board The following describes the procedure for removing the US board (See Figure 4-36). 1. Disconnect the USB harness from the connector CN4621 on the US board. 2. Remove the following screw securing the US board and remove the US board. • M2.5×4.0B USB harness FLAT BIND screw CN4621 x1 M2.5x4.
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4 Replacement Procedures 4.19 Speaker (R) / TJ board 4.19 Speaker (R) / TJ board 4.19.1 Speaker (R) Removing the speaker (R) The following describes the procedure for removing the speaker (R) (See Figure 4-37 and 438). 1. Peeling off the glass tape from the harness holder. 2. Pull out the DC-IN jack from the slot and pull out the DC-IN cable from the guide of harness holder. 3. Remove the following screw securing the harness holder and remove the harness holder. • M2.5×4.
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4.19 Speaker (R) / TJ board 4 Replacement Procedures 4. Pull out the USB harness from the guide of base assembly. 5. Disconnect the TJ board cable from the connector CN9614 on the TJ board and pull it out from the guide of base assembly. 6. Disconnect the speaker (R) cable from the connector CN6003 on the system board and pull it out from the guide. 7. Pull up the speaker (R) straight and remove it.
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4 Replacement Procedures 4.19 Speaker (R) / TJ board Installing the speaker (R) The following describes the procedure for installing the speaker (R) (See Figure 4-37 to 439). 1. Install the speaker (R) to the slot of base assembly. 2. Arrange the speaker (R) cable along the guide and connect it to the connector CN6003 on the system board. NOTE: Be sure to arrange the speaker (R) cable in the following guide.
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4.19 Speaker (R) / TJ board 4 Replacement Procedures 3. Arranging the TJ board cable along the guide, connect it to the connector CN9614 on the TJ board. 4. Arrange the USB harness along the guide. TJ board cable USB harness Figure 4-39 Cable arrangement in guide 5. Install the harness holder and secure it with the following screw. • M2.5×4.0B FLAT BIND screw x1 NOTE: When installing the harness holder, be careful not to catch cables. 6.
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4 Replacement Procedures 4.19 Speaker (R) / TJ board 4.19.2 TJ board Removing the TJ board The following describes the procedure for removing the TJ board (See Figure 4-40). 1. Disconnect the TV antenna cable from the connector CN9611 on the TJ board and pull it out from the guide of base assembly. 2. Remove the following screws securing TJ board and remove the TJ board. • M2.5×4.0B FLAT BIND screw x2 M2.5x4.
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4.19 Speaker (R) / TJ board 4 Replacement Procedures Installing the TJ board The following describes the procedure for installing the TJ board (See Figure 4-40). 1. Install the TJ board and secure it with the following screws. • M2.5×4.0B FLAT BIND screw x2 2. Arranging the TV antenna cable along the guide, connect it to the connector CN9611 on the TJ board. NOTE: Be sure to arrange the TV antenna cable in the following guide.
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4 Replacement Procedures 4.20 System board 4 4.20 System board CAUTION: 1. When handling the system board, always hold by the edges. Do not touch the printed circuit face. 2. If replacing with a new system board, execute the subtest01 Initial configuration in section 3.3 “Setting of the hardware configuration”. Also update with the latest BIOS as described in Appendix G “BIOS Rewrite Procedures” and with the latest EC/KBC as described in Appendix H “EC/KBC Rewrite Procedures”.
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4.20 System board 4 Replacement Procedures Installing the system board The following describes the procedure for installing the system board (See Figure 4-41). 1. Fitting the PC card eject button, install the system board to the base assembly from the PC card side first. 2. Turning up the insulator (covering on 1 screw hole), secure the system board with the following screws. • M2.5×4.0B FLAT BIND screw x3 3. Connect the speaker (L) cable to the connector CN6002 on the system board.
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4 Replacement Procedures 4.21 VGA fan 4.21 VGA fan Removing the VGA fan The following describes the procedure for removing the VGA fan (See Figure 4-42). 1. Remove the following screws securing the VGA fan. • M2.5×4.0B FLAT BIND screw 2. Remove the VGA fan. x2 M2.5x4.0B FLAT BIND VGA fan Figure 4-42 Removing the VGA fan Installing the VGA fan The following describes the procedure for installing the VGA fan (See Figure 4-42). 1. Install the VGA fan to the base assembly. 2.
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4.22 Speaker (L) 4 Replacement Procedures 4.22 Speaker (L) Removing the speaker (L) The following describes the procedure for removing the speaker (L) (See Figure 4-43). 1. Peeling off the glass tape, pull out the speaker (L) cable from the guide of base assembly. 2. Pull up the speaker (L) straight and remove it from the slot.
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4 Replacement Procedures 4.23 CPU 4.23 CPU Removing the CPU The following describes the procedure for removing the CPU (See Figure 4-44 and 4-45). 1. Remove the following screws securing the heat sink holder. • M2.0×4.0Z BIND screw x3 NOTE: When removing the heat sink holder, be sure to remove the screws in the reverse order of the number marked on the holder. 2. Remove the heat sink holder and CPU heat sink. M2.0x4.
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4.23 CPU 4 Replacement Procedures 3. Unlock the CPU by rotating the cam on the CPU socket 180 degrees to the counterclockwise with a flat-blade screwdriver. 4. Remove the CPU. Cam Figure 4-45 Removing the CPU Installing the CPU The following describes the procedure for installing the CPU (See Figure 4-44 to 4-46). 1. Check that the mark of cam is in the unlocking position. 2. Attach the CPU to the correct position in the CPU socket. 3.
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4 Replacement Procedures 4.23 CPU NOTE: Apply the silicon grease enough to cover the chip surface using the special applicator. Figure 4-46 Applying silicon grease 5. Install the CPU heat sink and heat sink holder and secure them with the following screws. • M2.0×4.0Z BIND screw x3 NOTE: When securing the heat sink holder, be sure to secure the screws in the order of the number marked on the holder.
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4.24 VGA heat sink 4 Replacement Procedures 4.24 VGA heat sink Removing the VGA heat sink The following describes the procedure for removing the VGA heat sink (See Figure 4-47). 1. Remove the following screws securing the VGA heat sink. • M2.0×3.0C SUPER THIN HEAD screw x3 2. Pull up the VGA heat sink straight and remove it. M2.0x3.
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4 Replacement Procedures 4.25 TV tuner module 4.25 TV tuner module Removing the TV tuner module The following describes the procedure for removing the TV tuner module (See Figure 4-48 and 4-49). 1. Disconnect the USB harness from the connector CN4613 on the system board and pull it out from the harness guide. 2. Disconnect the TJ board cable from the connector CN5660 on the system board and pull it out from the harness guide. 3.
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4.25 TV tuner module 4 Replacement Procedures 6. Disconnect the TV antenna cable from the connector on the TV tuner module. 7. Disconnect the TV tuner harness from the connector on the TV tuner module. 8. Open the left and right latches holding the TV tuner module and remove the TV tuner module from the connector CN2220 on the system board.
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4 Replacement Procedures 4.25 TV tuner module Installing the TV tuner module The following describes the procedure for installing the TV tuner module (See Figure 4-48 to 4-50). 1. Insert the TV tuner module terminals slantwise into the connector CN2220 on the system board. 2. Connect the TV tuner harness to the connector on the TV tuner module. 3. Connect the TV antenna cable to the connector on the TV tuner module. 4. Install the harness guide and secure it with the following screws. • M2.0×6.
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4.26 PC card slot 4 Replacement Procedures 4.26 PC card slot Removing the PC card slot The following describes the procedure for removing the PC card slot (See Figure 4-51). 1. Remove the following screws securing the PC card slot. • M2.0×8.0Z BIND screw x2 • M2.0×3.0Z SUPER THIN HEAD screw x2 2. Pull up the PC card slot straight and remove it from the connector CN2100 on the system board. CN2100 PC card slot M2.0x3.0C SUPER THIN HEAD M2.0x8.
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4 Replacement Procedures 4.27 LCD unit / FL inverter 4.27 LCD unit / FL inverter CAUTION: When replacing a LCD, it is required that SVP parameter is set. Update with the latest EC/KBC as described in Appendix H “EC/KBC Rewrite Procedures”. Removing the LCD unit / FL inverter The following describes the procedure for removing the LCD unit and FL inverter (See Figure 4-52 to 4-55). 1.
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4.27 LCD unit / FL inverter 4 Replacement Procedures 2. Remove the following screw securing the FL inverter. • M2.0x5.0C SUPER THIN HEAD screw x1 3. Pull out one insulator and peel off the other one adhered to the FL inverter. 4. Disconnect the LCD harnesses from the connectors CN1 and CN2 on the FL inverter. 5. Disconnect the HV harnesses from the connectors CN3 and CN4 on the FL inverter. 6. Remove the FL inverter while peeling off the double-sided tape. CN2 CN3 Insulator CN1 M2.0x5.
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4 Replacement Procedures 4.27 LCD unit / FL inverter 7. Remove the following screws securing the LCD unit. • M2.0x5.0C SUPER THIN HEAD screw x6 8. With the bottom edge of the LCD unit on the display cover, lift only the top edge of the LCD unit. After peeling off the copper tape, disconnect the LCD harness from the connector on the back of the LCD. 9. Remove the LCD unit. M2.0x5.0C SUPER THIN HEAD LCD unit Copper tape M2.0x5.
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4.27 LCD unit / FL inverter 4 Replacement Procedures 10. Remove the following screws securing the LCD support (LCD unit side) and remove the LCD supports from the LCD unit. • M2.0x3.0C SUPER THIN HEAD screw LCD support x6 M2.0x3.0C SUPER THIN HEAD LCD support M2.0x3.0C SUPER THIN HEAD M2.0x3.
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4 Replacement Procedures 4.27 LCD unit / FL inverter Installing the LCD unit/FL Inverter The following describes the procedure for installing the LCD unit and FL inverter (See Figure 4-52 to 4-55). 1. Install the LCD supports (LCD unit side) to the LCD and secure them with the following screws. • M2.0×3.0C SUPER THIN HEAD screw x6 2. Stand the LCD unit on the display cover and connect the LCD harness to the connector on the back of LCD. 3. Stick the copper tape on the connector of LCD harness. 4.
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4.28 LCD harness 4.28 4 Replacement Procedures LCD harness Removing the LCD harness The following describes the procedure for removing LCD harness (See Figure 4-56). 1. Remove the LCD cushion from the LCD support. 2. Remove the following screws securing the LCD support (display cover side) and remove the LCD support. • M2.5×6.0 PSP TIGHT screw x2 3. Remove the following screw securing the LCD harness holder (display cover side) and remove the LCD harness holder. • M2.5×4.0B FLAT BIND screw x1 M2.
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4 Replacement Procedures 4.28 LCD harness Installing the LCD harness The following describes the procedure for installing the LCD harness (See Figure 4-56). 1. Arrange the LCD harness along the guide. 2. Install the LCD harness holder (display cover side) and secure it with the following screw. • M2.5×4.0B FLAT BIND screw x1 3. Install the LCD support (display cover side) and secure it with the following screws. • M2.5×6.0 PSP TIGHT screw x2 4. Install the LCD cushion on the LCD support.
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4.29 Wireless antennas 4.29 4 Replacement Procedures Wireless antennas Removing the wireless antennas The following describes the procedure for removing the wireless antennas (See Figure 4-57 and 4-58). 1. Remove the following screws securing the hinge (display cover side). • M2.5×6.0 PSP TIGHT screw x6 M2.5x6.0 PSP TIGHT M2.5x6.
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4 Replacement Procedures 4.29 Wireless antennas 2. Peel off the acetate tape fixing the wireless antenna cables. 3. Pull out the wireless antenna cables from the guide and peel off the wireless LAN antennas and bluetooth antenna from the display cover.
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4.29 Wireless antennas 4 Replacement Procedures Installing the wireless antennas The following describes the procedure for installing the wireless antennas (See Figure 4-57 and 4-58). 1. Stick the wireless LAN antennas and bluetooth antenna on the display cover. NOTE: When sticking the wireless antennas, be sure to stick them along the guide line. Guide line 2. Arrange the wireless LAN antenna cables and bluetooth antenna cable along the guide of display cover, and secure them with acetate tapes. 3.
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Appendices QOSMIO G10 Maintenance Manual (960-497) App-i
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App-ii QOSMIO G10 Maintenance Manual (960-497)
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Appendix Contents Appendix A Handling the LCD Module......................................................................... A-1 Appendix B Board Layout............................................................................................... B-1 B.1 System Board Front View............................................................................. B-1 B.2 System Board Back View ............................................................................. B-3 B.3 BT Board........................
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C.16 IS2101 MEDIA BRIDGE I/F connector (42-PIN)................................. C-16 C.17 CN2200 Wireless LAN card I/F connector (124-PIN) ............................. C-17 C.18 CN2220 WW Tuner I/F connector (124-PIN) .......................................... C-19 C.19 J4100 C.20 CN4200 1394 I/F connector (4-PIN) ........................................................ C-21 C.21 CN5600 LCD I/F connector (41-PIN) ...................................................... C-22 C.
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TV jack board C.43 J9610 TV antenna connector (4-PIN) ................................................... C-34 C.44 CN9611 Coaxial connector (4-PIN) .......................................................... C-34 C.45 J9612 C.46 CN9613 S-Video IN I/F connector (4-PIN)............................................... C-34 C.47 CN9614 System board I/F connector (20-PIN) ......................................... C-35 Monitor-IN I/F connector (5-PIN)..............................................
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Appendix F Wiring Diagrams..........................................................................................F-1 F.1 RGB Monitor ID Wraparound Connector (15PIN to 15PIN)........................ F-1 F.2 LAN Loopbak Connector ..............................................................................F-1 Appendix G BIOS Rewrite Procedures .......................................................................... G-1 Appendix H EC/KBC Rewrite Procedures ............................................
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Figures Figure B-1 System board layout (front) .......................................................................... B-1 Figure B-2 System board layout (back) .......................................................................... B-3 Figure B-3 BT board layout ............................................................................................ B-5 Figure B-4 SD board layout ............................................................................................
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Table C-7 Keyboard I/F connector (34-PIN).............................................................. C-13 Table C-8 Pad I/F connector (4-PIN).......................................................................... C-13 Table C-9 RTC battery connector (3-PIN) ................................................................. C-14 Table C-10 CPU FAN connector (3-PIN)..................................................................... C-14 Table C-11 VGA FAN connector (3-PIN).....................
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Table C-39 Sound board I/F Connector (21-pin)........................................................... C-30 Table C-40 System board I/F connector (57-PIN)......................................................... C-31 Table C-41 Bluetooth I/F connector (20-PIN)............................................................... C-32 Table C-42 System board I/F connector (30-PIN)......................................................... C-33 Table C-43 TV antenna connector (4-PIN)........................
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Appendix A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
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Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4. If water or other liquid is left on the panel’s surface for a long period, it can change the screen’s tint or stain it.
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Appendix A Handling the LCD Module 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
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Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
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Appendix A Handling the LCD Module 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxide). These materials can release gas that can damage the panel’s polarization.
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Appendix A Handling the LCD Module A-6 QOSMIO G10 Maintenance Manual (960-497)
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Appendix B Appendix B Board Layout B.
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B.
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Appendix B Board Layout B.2 B.
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B.
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Appendix B Board Layout B.3 B.
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B.4 SD board B.
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Appendix B Board Layout B.5 B.
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B.6 TJ board B.
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Appendix B Board Layout B.
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B.7 LE board B.
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Appendix C Appendix C Pin Assignment System Board (FNMSY*) C.1 CN1400 Memory Connector 0 (200-PIN) Table C-1 Memory connector 0 (200-PIN) (1/3) PIN No. Signal name I/O PIN No.
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C.1 CN1400 Memory Connector 0 (200-PIN) Appendix C Pin Assignment Table C-1 Memory connector 0 (200-PIN) (2/3) PIN No. C-2 Signal name I/O PIN No.
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Appendix C Pin Assignment C.1 CN1400 Memory Connector 0 (200-PIN) Table C-1 Memory connector 0 (200-PIN) (3/3) PIN No. Signal name I/O PIN No.
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C.2 CN1401 Memory connector 1 (200-PIN) C.2 Appendix C Pin Assignment CN1401 Memory connector 1 (200-PIN) Table C-2 Memory connector 1 (200-PIN) (1/3) PIN No. C-4 Signal name I/O PIN No.
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Appendix C Pin Assignment C.2 CN1401 Memory connector 1 (200-PIN) Table C-2 Memory connector 1 (200-PIN) (2/3) PIN No. Signal name I/O PIN No.
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C.2 CN1401 Memory connector 1 (200-PIN) Appendix C Pin Assignment Table C-2 Memory connector 1 (200-PIN) (3/3) PIN No. C-6 Signal name I/O PIN No.
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Appendix C Pin Assignment C.3 C.3 CN1880 1st HDD I/F connector (44-PIN) CN1880 1st HDD I/F connector (44-PIN) Table C-3 1st HDD I/F connector (44-PIN) PIN No. Signal name I/O PIN No.
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C.4 CN1800 2nd HDD I/F connector (44-PIN) C.4 Appendix C Pin Assignment CN1800 2nd HDD I/F connector (44-PIN) Table C-4 2nd HDD I/F connector (44-PIN) PIN No. C-8 Signal name I/O PIN No.
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Appendix C Pin Assignment C.5 C.5 CN1810 ODD I/F connector (50-PIN) CN1810 ODD I/F connector (50-PIN) Table C-5 ODD I/F connector (50-PIN) PIN No. Signal name I/O PIN No. 1 CDAUDL-PXP O 2 CDAUDRPXP O 3 CD-GND I 4 N.
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C.6 CN2100 PC card I/F connector (150-PIN) C.6 Appendix C Pin Assignment CN2100 PC card I/F connector (150-PIN) Table C-6 PC card I/F connector (150-PIN) (1/3) PIN No. C-10 Signal name I/O PIN No. Signal name I/O 1 GND - 2 GND - 3 N.C (CPUD-) - 4 N.C (USBD+) - 5 GND - 6 N.C (CPUSB#) - 7 N.C (Reserve) - 8 N.C (Reserve) - 9 GND - 10 N.C (Reserve) - 11 N.C (SMBCLK) - 12 N.C (SMBDAT) - 13 N.C (CRD1R5-P1V) - 14 N.C (CRD1R5-P1V) - 15 N.C (CRD1R5-P1V) - 16 N.
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Appendix C Pin Assignment C.6 CN2100 PC card I/F connector (150-PIN) Table C-6 PC card I/F connector (150-PIN) (2/3) PIN No. Signal name I/O PIN No. Signal name I/O 61 N.C - 62 N.C - 63 N.C - 64 N.C - 65 N.C - 66 N.C - 67 GND - 68 N.C - 69 N.C - 70 N.C - 71 N.C - 72 N.C - 73 N.C - 74 GND - 75 N.
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C.6 CN2100 PC card I/F connector (150-PIN) Appendix C Pin Assignment Table C-6 PC card I/F connector (150-PIN) (3/3) PIN No. C-12 Signal name I/O PIN No.
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Appendix C Pin Assignment C.7 C.7 CN3200 Keyboard I/F connector (34-PIN) CN3200 Keyboard I/F connector (34-PIN) Table C-7 Keyboard I/F connector (34-PIN) PIN No. C.8 Signal name I/O PIN No.
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C.9 CN9990 RTC battery connector (3-PIN) C.9 Appendix C Pin Assignment CN9990 RTC battery connector (3-PIN) Table C-9 RTC battery connector (3-PIN) PIN No. Signal name I/O PIN No. 2 1 R3V O 3 GND - Signal name N.C I/O - C.10 CN8770 CPU FAN connector (3-PIN) Table C-10 CPU FAN connector (3-PIN) PIN No. Signal name I/O PIN No. 2 1 FAN VCC - 3 FANG-P3P I Signal name GND I/O - C.11 CN8780 VGA FAN connector (3-PIN) Table C-11 VGA FAN connector (3-PIN) PIN No. Signal name I/O PIN No.
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Appendix C Pin Assignment C.13 CN4611 USB I/F connector Port 4 (4-PIN) C.13 CN4611 USB I/F connector Port 4 (4-PIN) Table C-13 USB I/F connector Port4 (4-PIN) PIN No. Signal name 1 USB1PS-E5V 3 USBP4-S3P I/O PIN No. Signal name I 2 USBP4-S3N I/O 4 GND I/O I/O - C.14 CN4612 USB I/F connector Port 0 (4-PIN) Table C-14 USB I/F connector Port0 (4-PIN) PIN No. Signal name 1 USB0PS-E5V 3 USBP0-S3P I/O PIN No. Signal name I 2 USBP0-S3N I/O 4 GND I/O I/O - C.
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C.16 IS2101 MEDIA BRIDGE I/F connector (42-PIN) Appendix C Pin Assignment C.16 IS2101 MEDIA BRIDGE I/F connector (42-PIN) Table C-16 MEDIA BRIDGE I/F connector (42-PIN) PIN No. C-16 Signal name I/O PIN No.
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Appendix C Pin Assignment C.17 CN2200 Wireless LAN card I/F connector (124-PIN) C.17 CN2200 Wireless LAN card I/F connector (124-PIN) Table C-17 Wireless LAN card I/F connector (124-PIN) (1/2) PIN No. Signal name I/O PIN No. Signal name I/O 1 N.C. - 2 N.C. - 3 N.C. - 4 N.C. - 5 N.C. - 6 N.C. - 7 N.C. - 8 N.C. - 9 N.C. - 10 N.C. - 11 N.C. - 12 N.C. - 13 WLON-S5N I 14 N.C. - 15 GND - 16 N.C.
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C.17 CN2200 Wireless LAN card I/F connector (124-PIN) Appendix C Pin Assignment Table C-17 Wireless LAN card connector (124-PIN) (2/2) PIN No. C-18 Signal name I/O PIN No.
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Appendix C Pin Assignment C.18 CN2220 WW Tuner I/F connector (124-PIN) C.18 CN2220 WW Tuner I/F connector (124-PIN) Table C-18 WW Tuner I/F connector (124-PIN) (1/2) PIN No. Signal name I/O PIN No. Signal name I/O 1 N.C. - 2 N.C. - 3 N.C. - 4 N.C. - 5 N.C. - 6 N.C. - 7 N.C. - 8 N.C. - 9 GND - 10 GND - 11 N.C. - 12 N.C. - 13 N.C. - 14 N.C. - 15 GND - 16 N.C. - 17 N.C. - 18 T-P5V - 19 P3V - 20 PIRQD-P3N O 21 N.C. - 22 N.C.
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C.18 CN2220 WW Tuner I/F connector (124-PIN) Appendix C Pin Assignment Table C-18 WW Tuner I/F connector (124-PIN) (2/2) PIN No. C-20 Signal name I/O PIN No.
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Appendix C Pin Assignment C.19 J4100 Network I/F connector (12-PIN) C.19 J4100 Network I/F connector (12-PIN) Table C-19 Network I/F connector (12-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 TDP-P3P I 2 TDN-P3N I 3 RDP-P3P I 4 GND - 5 GND - 6 RDN-P3N 7 GND - 8 GND 9 P3V - 10 LNK-P3N I/O 11 P3V - 12 ACT-P3N I/O I/O - C.20 CN4200 1394 I/F connector (4-PIN) Table C-20 1394 I/F connector (4-PIN) PIN No. Signal name I/O PIN No.
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C.21 CN5600 LCD I/F connector (41-PIN) Appendix C Pin Assignment C.21 CN5600 LCD I/F connector (41-PIN) Table C-21 LCD I/F connector (41-PIN) PIN No. C-22 Signal name I/O PIN No.
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Appendix C Pin Assignment C.22 CN5080 CRT I/F connector (15-PIN) C.22 CN5080 CRT I/F connector (15-PIN) Table C-22 CRT I/F connector (15-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 CRTRED-PXP I 2 CRTGRN-PXP I 3 CRTBLU-PXP I 4 N.C - 5 GND - 6 GND - 7 GND - 8 GND - 9 DDC-P5V - 10 GND - 11 N.C - 12 NVDSDA-P5P I/O 13 (AHSYNC-P3P) I/O 14 (AVSYNC-P3P) I/O 15 NVDSCL-P5P I/O C.
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C.25 CN5800 SVP Host I/F connector (2-PIN) Appendix C Pin Assignment C.25 CN5800 SVP Host I/F connector (2-PIN) Table C-25 SVP Host I/F connector (2-PIN) PIN No. 1 Signal name SVSCL-P3P C.26 CN9650 I/O PIN No. I/O 2 Signal name SVSDA-P3P I/O I/O SWITCH I/F connector (20-PIN) Table C-26 SWITCH I/F connector (20-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 N.
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Appendix C Pin Assignment C.28 CN6003 Speaker (Right) connector (2-PIN) C.28 CN6003 Speaker (Right) connector (2-PIN) Table C-28 Speaker (Right) connector (2-PIN) PIN No. 1 Signal name SPOTR-PXN I/O PIN No. O 2 Signal name SPOTR-PXP I/O I/O C.29 CN3400 Debug port (4-PIN) Table C-29 Debug port connector (4-PIN) PIN No. Signal name I/O PIN No.
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C.30 CN9500 Sound board I/F connector (57-PIN) Appendix C Pin Assignment C.30 CN9500 Sound board I/F connector (57-PIN) Table C-30 Sound board I/F connector (57-PIN) PIN No. C-26 Signal name I/O PIN No.
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Appendix C Pin Assignment C.31 CN5660 TJ board I/F connector (20-PIN) C.31 CN5660 TJ board I/F connector (20-PIN) Table C-31 TJ board I/F connector (20-PIN) PIN No. Signal name I/O PIN No.
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C.34 CN4613 US board I/F connector (6-PIN) Appendix C Pin Assignment C.34 CN4613 US board I/F connector (6-PIN) Table C-34 US board I/F connector (6-PIN) PIN No. Signal name 1 USB0PS-E5V 3 USBP3-S3N 5 GND C.35 CN9660 I/O PIN No. Signal name I 2 USB0PS-E5V I/O 4 USBP3-S3P - 6 GND I/O I I/O - LE board I/F connector (30-PIN) Table C-35 LE board I/F connector (30-PIN) PIN No. C-28 Signal name I/O PIN No.
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Appendix C Pin Assignment C.36 CN3000 MDC I/F connector (30-PIN) Sound board (FNMSD*) C.36 CN3000 MDC I/F connector (30-PIN) Table C-36 MDC I/F connector (30-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 N.C - 2 GND - 3 GND - 4 N.C - 5 N.C - 6 N.C - 7 N.C - 8 GND - 9 N.C - 10 N.C - 11 N.C - 12 N.C - 13 N.C - 14 N.C - 15 GND - 16 E3V - 17 E3V - 18 N.C - 19 GND - 20 GND - 21 N.C - 22 M97SY2-P3P I 23 M97OT2-P3P I 24 N.
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C.38 CN6000 Internal microphone connector (2-PIN) Appendix C Pin Assignment C.38 CN6000 Internal microphone connector (2-PIN) Table C-38 Internal microphone I/F connector (6-PIN) PIN No. 1 Signal name (VREF1-P2V) I/O PIN No. I/O 2 Signal name A-GND I/O - C.39 DS6000 Headphone/SPDIF connector (10-PIN) Table C-39 Headphone/SPDIF connector (10-PIN) PIN No. C-30 Signal name I/O PIN No. Signal name I/O 1 SPKEN-P4P O 2 HEADL-PXP O 3 HEADR-PXP O 4 A-GND - 5 SPDJIN-P3N O 6 N.
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Appendix C Pin Assignment C.40 CN9510 System board I/F connector (57-PIN) C.40 CN9510 System board I/F connector (57-PIN) Table C-40 System board I/F connector (57-PIN) PIN No. Signal name I/O PIN No.
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C.41 CN4400 Bluetooth I/F connector (20-PIN) Appendix C Pin Assignment LED board (FNMLE*) C.41 CN4400 Bluetooth I/F connector (20-PIN) Table C-41 Bluetooth I/F connector (20-PIN) PIN No. C-32 Signal name I/O PIN No. Signal name I/O 1 GND - 2 N.C. - 3 BTMDL-P3N O 4 N.C. - 5 N.C. - 6 N.C. - 7 N.C. - 8 BTRST-S3N I 9 N.C. - 10 N.C. - 11 GND - 12 N.C. - 13 GND - 14 WCHCLK-P3P I 15 N.C. - 16 USBP5-S3P 17 USBP5-S3N I/O 18 WCHDAT-P3P I 19 N.C.
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Appendix C Pin Assignment C.42 CN9670 System board I/F connector (30-PIN) C.42 CN9670 System board I/F connector (30-PIN) Table C-42 System board I/F connector (30-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 GND - 2 WCHDAT-P3P O 3 WCHCLK-P3P O 4 GND - 5 BTRST-S3N I/O 6 N.C.
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C.43 J9610 TV antenna connector (4-PIN) Appendix C Pin Assignment TV jack board (FNMTJ*) C.43 J9610 TV antenna connector (4-PIN) Table C-43 TV antenna connector (4-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 (PJ9611-3) I/O 2 (PJ9611-1) I/O 3 (PJ9611-2) I/O 4 (PJ9611-4) I/O C.44 CN9611 Coaxial connector (4-PIN) Table C-44 Coaxial connector (4-PIN) PIN No. Signal name I/O PIN No.
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Appendix C Pin Assignment C.47 CN9614 System board I/F connector (20-PIN) C.47 CN9614 System board I/F connector (20-PIN) Table C-47 System board I/F connector (20-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 2 TV-GND (FMTRDR-PXP) - 4 VREF1-P2V 6 TV-GND (FMTRDL-PXP) - 8 TV-GND (LUMAIN-PXP) - 10 LUMAIN-PXP 1 LINR-PXP 3 TV-GND 5 LINL-PXP 7 TV-GND (COMPIN-PXP) 9 COMPIN-PXP 11 TV-GND - 12 TV-GND (CROMIN-PXP) 13 N.C. (SVSCL-P3P) - 14 CROMIN-PXP 15 N.C.
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C.48 CN4620 USB I/F connector (4-PIN) Appendix C Pin Assignment USB board (FNMUS*) C.48 CN4620 USB I/F connector (4-PIN) Table C-48 USB I/F connector (4-PIN) PIN No. Signal name I/O PIN No. Signal name 1 USBPSC-E5V I/O 2 USBPC-S3N 3 USBPC-S3P I/O 4 GND I/O I/O - C.49 CN4621 System board I/F connector (6-PIN) Table C-49 System board I/F connector (6-PIN) PIN No. C-36 Signal name I/O PIN No.
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Appendix C Pin Assignment C.50 CN8810 Battery I/F connector (10-PIN) Battery board (FNMBT*) C.50 CN8810 Battery I/F connector (10-PIN) Table C-50 Battery I/F connector (10-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 PVBL1-BAT I/O 2 BTMP1 I/O 3 BATDCHG1 I/O 4 M5V 5 PSCL-S5P I/O 6 PSDA-S5P I/O 7 (VSS) I/O 8 DVT10V-S5N I/O 9 BATVSS1 I/O 10 BATGND1 I/O - C.
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C.
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Appendix. D Appendix D Display Codes D.1 Display Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap No.
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D.1 Display Codes Appendix. D Display codes Table D-1 Scan codes (set 1 and set 2) (2/4) D-2 Cap No.
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Appendix. D Display codes D.1 Display Codes Table D-1 Scan codes (set 1 and set 2) (3/4) Cap No.
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D.1 Display Codes Appendix. D Display codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap No. Keytop Code set 1 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 126 Pause *7 *7 *7 *7 *7 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Make Code set 2 Break Make Note Break Notes: 1. 2. 3. 4. 5. 6. 7. D-4 * * * * * * * Scan codes differ by mode.
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Appendix. D Display codes D.1 Display Codes Table D-2 Scan codes with left Shift key Cap Key Code set 1 No.
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D.1 Display Codes Appendix. D Display codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
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Appendix. D Display codes D.1 Display Codes Table D-5 Scan codes in overlay mode Cap No.
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D.1 Display Codes Appendix. D Display codes Table D-7 No.126 key scan code Key top Pause Shift Code set 1 Code set 2 Make Make Common* E1 1D 45 E1 Ctrl* E0 C6 E0 46 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E 14 F0 77 *: This key generates only make codes.
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Appendix E Key Layout Appendix E E.1 Key Layout United States (US) Keyboard Figure E-1 US Keyboard layout E.
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E.
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Appendix F Appendix F F.1 Wiring Diagrams RGB Monitor ID Wraparound connector (1) RED RED (2) GREEN GREEN (2) (3) BLUE BLUE (3) (4) NC NC (4) (5) GND GND (5) (6) GND GND (6) (7) GND GND (7) (8) GND GND (8) (9) 5V 5V (9) (10) GND GND (10) (11) NC NC (11) (12) SDA SDA (12) (13) HSYNC HSYNC (13) (14) VSYNC (15) SDL VSYNC (14) SCL (1) (15) Figure F-1 RGB Monitor ID Wraparound connector (15PIN to 15PIN) F.
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F.
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Appendix G Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk Rewriting the BIOS 1. Set the system to boot mode. 2. Turn off the power to the computer. 3. Remove the external cables and cards. 4. Connect an external FDD and insert the BIOS rewriting disk into the external FDD. 5. Turn on the power while holding down the tilde character key.
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Appendix G BIOS Rewrite Procedures G-2 QOSMIO G10 Maintenance Manual (960-497)
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Appendix H Appendix H EC/KBC Rewrite Procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. It is necessary to rewrite the EC/KBC system program when the following changes are made. • Replacing of system board • Replacing of LCD Tools To rewrite the EC/KBC, you need the following tool: EC/KBC rewriting disk for the computer Rewriting the EC/KBC NOTE: 1. Rewrite the EC/KBS only when instructed by a diagnostic disk release notice. 2.
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Appendix H EC/KBC Rewrite Procedures 4. Connect an external FDD and insert the EC/KBC rewriting disk into the external FDD. 5. Turn on the power while holding down the Tab key. (Keep holding down the key until a message appears on the screen.) The EC/KBC rewriting starts. 6. When the EC/KBC rewrite is completed, the system is automatically turned off.
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Appendix I Reliability Appendix I Reliability The following table shows MTBF (Mean Time Between Failures) in maximum configuration. Table I-1 MTBF Component System QOSMIO G10 Maintenance Manual (960-497) Time (hours) 6678.
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Appendix I Reliability I-2 QOSMIO G10 Maintenance Manual (960-497)