Toshiba Personal Computer QOSMIO G20 Maintenance Manual TOSHIBA CORPORATION File Number 960-511 [CONFIDENTIAL]
Copyright © 2005 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein. Toshiba QOSMIO G20 Maintenance Manual First edition February 2005 Disclaimer The information presented in this manual has been reviewed and validated for accuracy.
Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer QOSMIO G20. NOTE: Each model of QOSMIO G20 has a different configuration. For each model’s configuration, refer to the parts list dedicated to it. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the QOSMIO G20 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Table of Contents Chapter 1 Hardware Overview 1.1 Features ...................................................................................................................... 1-1 1.2 System Block Diagram .............................................................................................. 1-5 1.3 2.5-inch Hard Disk Drive......................................................................................... 1-10 1.4 Optical Drive.........................................................
2.17 Bridge media Slot Troubleshooting ......................................................................... 2-67 2.18 PCI ExpressCard Slot Troubleshooting ................................................................... 2-68 Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ............................................................................
3.29 Wireless LAN Test Program (Askey-made)............................................................ 3-78 3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program .................................................. 3-82 3.31 Sound Test program................................................................................................. 3-96 3.32 SETUP ...................................................................................................................
4.27 PC card slot .............................................................................................................. 4-63 4.28 Bluetooth module..................................................................................................... 4-65 4.29 Volume sensor board ............................................................................................... 4-67 4.30 Touch sensor board .............................................................................................
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Chapter 1 Hardware Overview [CONFIDENTIAL]
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Chapter 1 Contents 1.1 Features ...................................................................................................................... 1-1 1.2 System Block Diagram .............................................................................................. 1-5 1.3 2.5-inch Hard Disk Drive......................................................................................... 1-10 1.4 Optical Drive....................................................................................
Figures Figure 1-1 Front of the computer and the system units configuration ............................ 1-4 Figure 1-2 System block diagram.................................................................................... 1-5 Figure 1-3 2.5-inch HDD............................................................................................... 1-10 Figure 1-4 DVD Super Muti drive (Double-Layer) ...................................................... 1-12 Figure 1-5 Keyboard........................
1 Hardware Overview 1 1.1 Features Features 1.1 Features The QOSMIO G20 series are high performance all-in-one PCs running a Pentium-M processor. The features are listed below. ❑ Microprocessor Microprocessor that is used will be different of the model. Intel ® Mobile Pentium ®-M Pentium-M 1.60GHz (Processor Number : 730) 1.73GHz (Processor Number : 740) 1.86GHz (Processor Number : 750) 2.00GHz (Processor Number : 760) 2.
1.1 Features 1 Hardware Overview ❑ Display LCD Built-in 17.0-inch, WXGA+ (1,440 x 900 dots) amorphous silicon TFT color display. Interface To external monitor via - RGB connector - S-video OUT connector - D-port OUT connector To internal monitor via - S-video IN connector - Monitor IN port ❑ Sound system Harman/Kardon-made stereo speaker is equipped. An internal microphone, external monaural microphone connector, stereo headphone connector is also equipped.
1 Hardware Overview 1.1 Features ❑ Remote controller A remote controller for easy operation from some distance. ❑ USB FDD USB FDD supports 720KB and 1.44MB. ❑ PC card slot The PC card slot (PCMCIA) accommodates one 5mm Type II card. (Based on PC Card Standard, supporting CardBus) ❑ ExpressCard slot The ExpressCard slot accommodates an ExpressCard. ❑ USB (Universal Serial Bus) Four USB ports are provided. The ports comply with the USB2.
1.1 Features 1 Hardware Overview Figure 1-1 shows the front of the computer and the system units configuration.
1 Hardware Overview 1.2 1.2 System Block Diagram System Block Diagram Figure 1-2 shows the system block diagram.
1.2 System Block Diagram 1 Hardware Overview The PC contains the following components. ❑ CPU Intel ® Mobile Pentium ®-M Pentium-M 1.60GHz (Processor Number ; 730) 1.73GHz (Processor Number ; 740) 1.86GHz (Processor Number ; 750) 2.00GHz (Processor Number ; 760) 2.13GHz (Processor Number ; 770) L1 cache : 64KB (32KB + 32KB) L2 cache : 2MB FSB : 533MHz Core voltage : 1.340~0.748V ❑ Memory Two memory slots capable of accepting DDR2-SDRAM 256MB, 512MB or 1024MB memory modules for a maximum of 2GB.
1 Hardware Overview 1.2 System Block Diagram ❑ Chipset This gate array has the following elements and functions. ¾ North Bridge (Intel 915PM ) - Support Dothan Processor System Bus - System Memory Interface - Memory Controller : DDR333/DDR2-400/DDR2-533, 2GB(max) - Graphics I/F : x16 PCI Express Based Graphics I/F - DMI (Direct Media Interface) - 1,257-ball 40.0mmx37.5mmx2.
1.2 System Block Diagram 1 Hardware Overview ❑ Super I/O (SMSC-made LPC47N217) Two serial ports (NS16C550 compatible) - One port is used as Debug port ❑ VGA controller nVIDIA NV43m - Built-in VRAM 64MB/128MB - PCI Express Interface - LCD Interface LVDS 2ch - Supports TV Encoder, S-Video ❑ Mini PCI Wireless LAN card 2.4GHz DSSS/OFDM, 5.0GHz OFDM wireless LAN card is equipped. Conformity with IEEE 802.11b/g or IEEE 802a/b/g. Transfer speed is maximum of 11Mbit/sec. Supports 128bit WEP.
1 Hardware Overview 1.2 System Block Diagram ❑ MODEM (Askey-made 1456VQL4 x 1) Supported by MDC. Uses secondary AC97 line. Data and FAX transmission is available. Supports ITU-TV.90. The transfer speed of data receiving is 56kbps, of data sending is 33.6kbps and of FAX is 14.4kbps. Actual speed depends on the quality of the line used. Connected to telephone line through RJ11 MODEM jack.
1.3 2.5-inch Hard Disk Drive 1.3 1 Hardware Overview 2.5-inch Hard Disk Drive A compact, high-capacity Serial-ATA HDD with a height of 9.5mm. Contains a 2.5-inch magnetic disk and magnetic heads. Figure 1-3 shows a view of the 2.5-inch HDD and Tables 1-1 and 1-2 list the specifications. Figure 1-3 2.5-inch HDD Table 1-1 2.5-inch HDD dimensions Standard value Parameter FUJITSU G8BC0001R610 FUJITSU G8BC0001R810 TOSHIBA HDD2D30BZK01 Width (mm) 70.0 - Outline Height (mm) 9.
1 Hardware Overview 1.3 2.5-inch Hard Disk Drive Table 1-2 2.5-inch HDD Specifications Specification Parameter Storage size (formatted) Speed (RPM) Positioning time FUJITSU G8BC0001R610 60GB 80GB 5,400 Minimum 1.5 ms Average 12 ms (read) Maximum Data transfer speed FUJITSU G8BC0001R610 To/From Media To/From Host Data Buffer size Power-on-to-ready (sec) 22 ms 53.9 MB/s (max) 1.
1.4 Optical Drive 1.4 1 Hardware Overview Optical Drive 1.4.1 DVD Super Multi Drive (supporting Double-Layer) The DVD Super Multi drive (supporting Double Layer) accommodates 12 cm (4.72-inch) CD/DVD-ROM, CD-R/RW, DVD±R/±RW and DVD-RAM. It is a high-performance drive that reads DVD-ROM at maximum 8-speed and CD-ROM at maximum 24-speed.
1 Hardware Overview 1.4 Optical Drive Table 1-4 DVD Super Multi drive (Double-Layer) specifications Drive Specification Parameter Data transfer speed Access time (ms) MATSUSHITA-KOTOBUKI (G8CC0002CZ10) Read(KB/s) DVD-ROM MAX 8X CAV CD-ROM MAX 24X CAV Write (Maximum) CD-R 24x (Zone CLV) CD-RW 4X (CLV) High Speed CD-RW 10X (CLV) Ultra Speed CD-RW 10X (CLV) DVD-R 8x (Zone CLV) DVD-RW 4x (Zone CLV) DVD+R 8x (Zone CLV) DVD+R Double Layer 2.4x (CLV) DVD+RW 4x (Zone CLV) DVD-RAM 5x (ZCLV) (4.
1.5 Keyboard 1.5 1 Hardware Overview Keyboard A keyboard which consists of 85(US)/86(UK) keys is mounted on the system unit. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-7 is a view of the keyboard. Figure 1-5 Keyboard See Appendix E for details of the keyboard layout.
1 Hardware Overview 1.6 1.6 TFT Color Display TFT Color Display The TFT color display is 17.1 inch and consists of LCD module and FL inverter board. 1.6.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 320,000 colors with 1,440 x 900 resolution. Figure 1-8 shows a view of the LCD module and Table 1-9 lists the specifications.
1.6 TFT Color Display 1 Hardware Overview 1.6.2 FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module FL. Table 1-10 lists the FL inverter board specifications.
1 Hardware Overview 1.7 1.7 Power Supply Power Supply The power supply supplies 28 different voltages to the system board. The power supply microcontroller has the following functions. 1. 2. 3. 4. 5. 6. 7. 8. Judges if the DC power supply (AC adapter) is connected to the computer. Detects DC output and circuit malfunctions. Controls the battery icon, and DC IN icon. Turns the battery charging system on and off and detects a fully charged battery. Turns the power supply on and off.
1.7 Power Supply 1 Hardware Overview Table 1-7 Power supply output rating (1/2) Power supply （Yes/No） Name Voltage [V] Power OFF (Suspend mode) Power OFF (Boot mode) No Battery Object PPV 1.308 0.748 No No No CPU PTV 1.05 No No No CPU, MCH, ICH6-M PGV 1.056 No No No GPU 1R5-P1V 1.5 No No No CPU, MCH, ICH6-M, Express card 1R8-B1V 1.8 Yes No No MCH, DDR2-SDRAM, GPU 2R5-P2V 2.5 No No No MCH, ICH6-M, GPU, SVP EX, LVDS MR0R9-B0V 0.
1 Hardware Overview 1.7 Power Supply Table 1-11 Power supply output rating (2/2) Power supply （Yes/No） Name Voltage [V] Power OFF (Suspend mode) Power OFF (Boot mode) No Battery Object MCV 5 Yes Yes No PSC R3V 2.0 -3.
1.8 Batteries 1.8 1 Hardware Overview Batteries The PC has the following two batteries. ❑ Main battery ❑ Real time clock (RTC) battery Table 1-12 lists the specifications for these two batteries. Table 1-8 Battery specifications Battery Name Battery Element Output Voltage Capacity Lithium ion 10.8V 4,400mAh Nickel hydrogen 2.4V 16mAh G71C0004H510 Main battery G71C0004H610 Real time clock (RTC) battery P71035009115 1.8.
1 Hardware Overview 1.8 Batteries 1.8.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and detects a full charge when the AC adaptor and battery are connected to the computer. ❑ Battery Charge When the AC adapter is connected, normal charging is used while the system is turned on and quick charge is used while the system is turned off. Refer to the following Table 1-13.
1.8 Batteries 1 Hardware Overview 1.8.3 RTC Battery The RTC battery provides the power supply to maintain the date, time, and other system information in memory. Table 1-15 lists the Time required for charges of RTC battery and data preservation time.
1 Hardware Overview 1.9 1.9 AC Adapter AC Adapter The AC adapter is used to charge the battery. Table 1-16 lists the AC adapter specifications. Table 1-12 AC adapter specifications Parameter Specification G71C0002R610 Power 120W (Peak 150W) Input voltage AC 100 to 240V Input frequency 50Hz/60Hz Input voltage 1.7A or less Output voltage DC 15V Output current 8.
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Chapter 2 Troubleshooting Procedures [CONFIDENTIAL]
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Chapter 2 Contents 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart........................................................................................ 2-3 2.3 Power Supply Troubleshooting.................................................................................. 2-7 2.4 2.5 2.6 2.7 2.8 Procedure 1 Power Status Check .........................................................
2.9 2.10 2.11 2.12 2.13 2.14 2.15 2.16 Display Troubleshooting.......................................................................................... 2-50 Procedure 1 External Monitor Check....................................................... 2-50 Procedure 2 Diagnostic Test Program Execution Check ......................... 2-50 Procedure 3 Connector and Cable Check................................................. 2-51 Procedure 4 Replacement Check .......................................
2.18 PCI ExpressCard Slot Troubleshooting ................................................................... 2-68 Procedure 1 Gigabit Ether ExpressCard .................................................. 2-68 Procedure 2 USB2.0 5in1 ExpressCard ................................................... 2-68 Figures Figure 2-1 Troubleshooting flowchart............................................................................. 2-4 Figure 2-2 A set of tool for debug port test ...............................
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2 Troubleshooting Procedures 2.1 Troubleshooting 2 2.1 Troubleshooting Chapter 2 describes how to determine which Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. (The “FRU” means the replaceable unit in the field.) The FRUs covered are: 1. 2. 3. 4. 5. 6. Power supply System Board USB FDD 2.5” HDD Keyboard Touch pad 7. 8. 9. 10. 11. 12. Display Optical Disk Drive Modem LAN Wireless LAN Bluetooth 13. 14. 15. 16.
2.1 Troubleshooting 2 Troubleshooting Procedures There are following two types of connections in the figure of board and module connection in and after 2.3 Power Supply Troubleshooting. (1) Cable connection is described in the figure as line. (2) Pin connection is described in the figure as arrow.
2 Troubleshooting Procedures 2.2 2.2 Troubleshooting Flowchart Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which troubleshooting procedures to execute. Before going through the flowchart steps, verify the following: Ask him or her to enter the password if a password is registered. Verify with the customer that Toshiba Windows is installed on the hard disk. NonWindows operating systems can cause the computer to malfunction.
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2 Troubleshooting Procedures 2.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures If the diagnostics program cannot detect an error, the problem may be intermittent. The Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error(s), then perform the appropriate troubleshooting procedures as follows: 1.
2 Troubleshooting Procedures 2.3 2.3 Power Supply Troubleshooting Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Table 2-2 DC IN icon DC IN icon Power supply status Lights blue DC power is being supplied from the AC adapter. Blinks orange Power supply malfunction*1 Doesn’t light Any condition other than those above. *1 When the power supply controller detects a malfunction, the DC IN icon blinks orange. It shows an error code. When the icon is blinking, perform the following procedure. 1. Remove the battery pack and the AC adapter. 2.
2 Troubleshooting Procedures Procedure 2 2.3 Power Supply Troubleshooting Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below. Start Off for 2 seconds Error code (8 bit) “1” On for one second “0” On for half second Interval between data bits Off for half second The error code begins with the least significant digit. Example: Error code 11h (Error codes are given in hexadecimal format.
2.3 Power Supply Troubleshooting Check 1 2 Troubleshooting Procedures Convert the DC IN icon blink pattern into the hexadecimal error code and compare it to the tables below. Then go to Check 2.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting 1st Battery Error code Meaning 20h Over voltage has been sensed. (Error code 20h is not supported.) 21h Main battery charge current is over 12.0A. 22h Main battery discharge current is over 0.5A when there is no load. 23h Main battery charge current is over 3.9A when AC adapter is not connected. 24h Abnormal current has been sensed. 25h Main battery charge current is over 0.3A when the charging is off.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures A-C3V output Error code Meaning 60h A-C3V voltage is over 3.96V when the computer is powered on/off. 61h A-C3V voltage is 2.81V or less when the computer is powered on. 62h A-C3V voltage is 2.81V or less when the computer is booting up. 63h A-C3V voltage is 2.81V or less while the computer is suspended. 64h A-C3V voltage is abnormal while the computer is shutdown. (CV support) 65h A-C3V voltage is 2.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting E3V output Error code Meaning A0h E3V voltage is over 3.96V when the computer is powered on/off. A1h E3V voltage is 2.81V or less when the computer is powered on. A2h E3V voltage is 2.81V or less when the computer is booting up. A3h E3V voltage is 2.81V or more when the computer is powered off. A4h E3V voltage is 2.81V or less when the computer is suspended. PPV output Error code Meaning B0h PPV voltage is over 1.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures 1R9-B1V output Error code Meaning E0h 1R9-B1V voltage is over 2.40V when the computer is powered on/off. E1h 1R9-B1V voltage is 1.53V or less when the computer is powered on. E2h 1R9-B1V voltage is 1.53V or less when the computer is booting up. E3h 1R9-B1V voltage is 1.53V or more when the computer is powered off. E4h 1R9-B1V voltage is 1.53V or less while the computer is suspended.
2 Troubleshooting Procedures Procedure 3 2.3 Power Supply Troubleshooting Connection Check The wiring diagram related to the power supply is shown below: DC-IN jack AC adapter Power code CN8020 CN8811 Battery signal harness Battery pack 10-pin CN9691 CN9690 Battery power harness CN8810 Any of the connectors may be disconnected. Perform Check 1. Check 1 Make sure the AC adapter and the AC power cord are firmly plugged into the DC IN jack and wall outlet.
2.3 Power Supply Troubleshooting Procedure 5 2 Troubleshooting Procedures Replacement Check The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4, Replacement Procedures. When AC adapter is connected; Check 1 AC adapter may be faulty. Replace the AC adapter with a new one. If the problem still occurs, perform Check 2.
2 Troubleshooting Procedures 2.4 2.4 System Board Troubleshooting System Board Troubleshooting This section describes how to determine if the system board is malfunctioning or not. Start with Procedure 1 and continue with the other procedures as instructed.
2.4 System Board Troubleshooting Procedure 1 2 Troubleshooting Procedures Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it. If an error message is shown on the display, perform Check 1. If there is no error message, go to Procedure 2. If MS-DOS or Windows OS is properly loaded, go to Procedure 4.
2 Troubleshooting Procedures Check 3 2.4 System Board Troubleshooting The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (23) or (24) is displayed, go to Procedure 4. If error message (18) is displayed, go to the Keyboard Troubleshooting Procedures. If error message (19), (20) or (21) is displayed, go to the HDD Troubleshooting Procedures.
2.4 System Board Troubleshooting Procedure 2 2 Troubleshooting Procedures Debugging Port Check Check the D port status by a debug port test. The tool for debug port test is shown below. Figure 2-2 A set of tool for debug port test The test procedures are follows: 1. Connect the debug port test cable to the connector CN3400 of the system board. For disassembling to connect the test cable, refer to Chapter 4. 2. Connect the debug port test cable and RS-232C cross-cable to the test board. 3.
2 Troubleshooting Procedures 2.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Debug port (Boot mode) error status (2/8) D port status F005h Inspection items Details Saving key scan code Setting TASK_1ms_TSC Controlling fan Initializing sound items (for BEEP) Enabling system speaker Releasing mute Making the volume max.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Debug port (Boot mode) error status (3/8) D port status F101h F102h Inspection items Details Checking DRAM type and size (at cold boot) When unsupported memory connected, beeps and halts. (When DRAM size = o, it halts.) Testing the stack area of SMRAM (When it can not be used, halts.) Configuring cache memory Permission of L1/L2 cache memory Checking the access of a CMOS (Only in Cold Boot) (When error detected, it halts.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Debug port (Boot mode) error status (4/8) D port status Inspection items Details Forwards the area of C0000h to EFFFFh to PCI (prohibition of DRAM) Sets resume error request Copying ROM/RAM of system BIOS F104h (When error occurred, it halts.
2 Troubleshooting Procedures 2.
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2 Troubleshooting Procedures 2.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Debug port (Suspend mode) error status (1/3) D port status Inspection items Details Suspend mode F130h When powering-off request from OS is required, waiting for the completion of dividing process because waiting in SUSPEND of Runtime returns the process to OS.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-5 Debug port (Suspend mode) error status (2/3) LED Status (F133h) Test item Contents Storing of PIT Starts sequence for storing display system.
2 Troubleshooting Procedures 2.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-6 Debug port (Resume mode) error status (1/4) LED Status Test item Contents Resume F100h Refer to IRT F101h Refer to IRT F102h Refer to IRT F103h Refer to IRT Clears flag for SMI control. Renewal of Resume counter F121h Checks the WakeUp factors.
2 Troubleshooting Procedures 2.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-6 Debug port (Resume mode) error status s (3/4) LED status F12Ah Test item Contents Waiting for completion of KBC initializing (not in ACPI mode) Waiting for completion of USB initializing Recovery of USB register Recovery of CPU register Resetting NDP interruption Recovery of system, status command and port Wakeup check Notifies the device change status to the high rank.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-6 Debug port (Resume mode) error status (4/4) LED status Test item F12Bh Checks if the power-off switch is pressed or not during resume processing Contents (Suspends if pressed) Executes HOTKEY F1 processing when booting in instant security F12Ch (Not in ACPI mode) Clears key buffer F12Dh (In ACPI mode) Clears IRT status F12Eh (In ACPI mode) Clears flag in Resume process Acquires Wake Up Vector address.
2.4 System Board Troubleshooting Procedure 3 2 Troubleshooting Procedures Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test 6. Printer test [It is not supported] 7. Async test [It is not supported] 8. Hard Disk test 9. Real Timer test 10.
2 Troubleshooting Procedures 2.5 USB FDD Troubleshooting 2 2.5 USB FDD Troubleshooting To check if the USB FDD is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: FDD Head Cleaning Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector Check and Replacement Check Procedure 1 FDD Head Cleaning Check FDD head cleaning is one option available in the Diagnostic Program.
2.5 USB FDD Troubleshooting Procedure 2 2 Troubleshooting Procedures Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled. Floppy disk drive test error codes and their status names are listed in Table 2-7.
2 Troubleshooting Procedures Procedure 3 2.5 USB FDD Troubleshooting Connector Check and Replacement Check USB FDD is connected to USB port on system board and US board. US board is also connected to system board by cable. The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks. USB FDD can be connected to the following 4 ports.
2.5 USB FDD Troubleshooting 2 Troubleshooting Procedures Check 2 USB FDD may be faulty. Replace it with a new one. If the problem still occurs, perform Check 3. Check 3 Connect USB FDD to each port embedded on system board and on SJ board. Then, check if it works properly. If it does not work properly when connected to CN4621/CN4620, perform Check 4. If it does not work properly when connected to CN4610 or all ports, perform Check 6. Check 4 USB harness may be faulty.
2 Troubleshooting Procedures 2.6 2.6 2.5” HDD Troubleshooting 2.5” HDD Troubleshooting To check if 2.5” HDD is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Partition Check Procedure 2: Message Check Procedure 3: Format Check Procedure 4: Diagnostic Test Program Execution Check Procedure 5: Connector Check and Replacement Check CAUTION: The contents of the hard disk will be erased when the 2.5” HDD troubleshooting procedures are executed.
2.6 2.5” HDD Troubleshooting Procedure 2 2 Troubleshooting Procedures Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen. Make sure no floppy disk is in the FDD. Turn on the computer and check the message on the screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with Check 1 below and perform the other checks as instructed.
2 Troubleshooting Procedures Procedure 3 2.6 2.5” HDD Troubleshooting Format Check The computer’s HDD is formatted using the MS-DOS FORMAT program or the physical format program of the test program. To format the HDD, start with Check 1 below and perform the other steps as required. Refer to the MS-DOS Manual for the operation of MS-DOS. For the format by the test program, refer to the Chapter 3. Check 1 Format an 2.5” HDD using MS-DOS FORMAT command. Type as FORMAT C:/S/U. If 2.
2.6 2.5” HDD Troubleshooting Procedure 4 2 Troubleshooting Procedures Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. The error codes and statuses are described in Table 2-8.
2 Troubleshooting Procedures Procedure 5 2.6 2.5” HDD Troubleshooting Connector Check and Replacement Check HDD(s) is/are connected to the connector(s) on the system board. The connection of HDD(s) and board may be defective. Otherwise, they may be faulty. Disassemble the computer following instructions in Chapter 4, Replacement Procedures and perform the following checks. Check 1 Make sure HDD(s) is/are firmly connected to the connector(s) on the system board.
2.7 Keyboard Troubleshooting 2.7 2 Troubleshooting Procedures Keyboard Troubleshooting To check if the computer’s keyboard is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test (DIAGNOSTIC TEST) and Pressed key display test (ONLY ONE TEST) in the Diagnostic Program.
2 Troubleshooting Procedures Procedure 2 2.7 Keyboard Troubleshooting Connector and Replacement Check The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure keyboard cable is firmly connected to system board. 34-pin Keyboard CN3200 If the connection is loose, reconnect firmly and repeat Procedure 1.
2.8 Touch pad Troubleshooting 2.8 2 Troubleshooting Procedures Touch pad Troubleshooting To check if the computer’s touch pad is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Touch pad test (ONLY ONE TEST) in the Diagnostic Program.
2 Troubleshooting Procedures Procedure 2 2.8 Touch pad Troubleshooting Connector and Replacement Check The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the cable is firmly connected to system board. Touch pad CN3201 If the connection is loose, reconnect firmly and repeat Procedure 1.
2.9 Display Troubleshooting 2.9 2 Troubleshooting Procedures Display Troubleshooting To check if the computer’s display is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: External Monitor Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector and Cable Check Procedure 4: Replacement Check Procedure 1 External Monitor Check Connect an external monitor to the computer’s external monitor port, then boot the computer.
2 Troubleshooting Procedures Procedure 3 2.9 Display Troubleshooting Connector and Cable Check LCD Module is connected to system board by an LCD/FL cable. FL inverter board is also connected to system board by an LCD/FL cable. In addition, fluorescent lamp is connected to FL inverter board by HV cable. Their cables may be disconnected from system board or FL inverter board. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures.
2.9 Display Troubleshooting Procedure 4 2 Troubleshooting Procedures Replacement Check Fluorescent lamp, FL inverter, LCD module, HV cable and LCD/FL cable are connected to display circuits. Any of these components may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: If fluorescent lamp does not light, perform Check 1.
2 Troubleshooting Procedures 2.10 Optical Disk Drive Troubleshooting 2.10 Optical Disk Drive Troubleshooting To check if optical disk drive is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the CD-ROM/DVD-ROM Test in the Diagnostic Program.
2.10 Optical Disk Drive Troubleshooting 2 Troubleshooting Procedures Check 4 ODD flexible cable may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem still occurs, perform Check 5. Check 5 System board may be faulty. Replace it with new one following the instructions in Chapter 4.
2 Troubleshooting Procedures 2.11 Modem Troubleshooting 2.11 Modem Troubleshooting To check if modem is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute Modem test in the LAN/Modem/Bluetooth/IEEE1394 test program.
2.11 Modem Troubleshooting 2 Troubleshooting Procedures Check 2 Modem cable may be faulty. Replace it with a new one. If the problem still occurs, perform Check 3. Check 3 MDC may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem still occurs, perform Check 4. Check 4 SD board may be faulty. Replace it with a new one following the instructions in Chapter 4. If the problem still occurs, perform Check 5.
2 Troubleshooting Procedures 2.12 LAN Troubleshooting 2.12 LAN Troubleshooting To check if the computer’s LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute LAN test in the LAN/Modem/Bluettoth/IEEE1394 test program.
2.13 Wireless LAN Troubleshooting 2 Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting To check if the computer's Wireless LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting-Receiving Check Procedure 2: Antennas' Connection Check Procedure 3: Replacement Check Procedure 1 Transmitting-Receiving Check Before starting the test, make sure the wireless communication switch is set in the ON position.
2 Troubleshooting Procedures Procedure 2 2.13 Wireless LAN Troubleshooting Antennas' Connection Check The wireless LAN function-wiring diagram is shown below: Wireless LAN antenna cables Wireless LAN antenna (black) Wireless LAN antenna (white) AUX 124-pin CN2200 MAIN Any of the connections may be defective.
2.13 Wireless LAN Troubleshooting Procedure 3 2 Troubleshooting Procedures Replacement Check Wireless LAN card, wireless LAN antenna or system board may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 Wireless LAN antenna may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 2.
2 Troubleshooting Procedures 2.14 Bluetooth Troubleshooting 2.14 Bluetooth Troubleshooting To check if the Bluetooth is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting-Receiving Check Procedure 2: Antennas' Connection Check Procedure 3: Replacement Check Procedure 1 Transmitting-Receiving Check Before starting the test, make sure the wireless communication switch is set in the ON position.
2.14 Bluetooth Troubleshooting 2 Troubleshooting Procedures Procedure 2 Antennas' Connection Check The Bluetooth function-wiring diagram is shown below: bluetooth antenna cable Bluetooth antenna Bluetooth flexible cable CN4400 Any of the connections may be defective. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure that the wireless communication switch is “On”.
2 Troubleshooting Procedures 2.14 Bluetooth Troubleshooting Procedure 3 Replacement Check Bluetooth module, Bluetooth antenna or system board may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 Bluetooth antenna may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 2.
2.15 Sound Troubleshooting 2 Troubleshooting Procedures 2.15 Sound Troubleshooting To check if the sound function is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Sound test in Sound Test program disk.
2 Troubleshooting Procedures Procedure 3 2.15 Sound Troubleshooting Replacement Check If external microphone does not work properly, perform check 1. If headphone does not work properly, perform check 2. If internal microphone does not work properly, perform check 3. If speaker (L) does not work properly, perform check 4. If speaker (R) does not work properly, perform check 4. Check 1 External microphone may be faulty. Replace it with a new one following the steps in Chapter 4.
2.16 TV tuner Troubleshooting 2 Troubleshooting Procedures 2.16 TV tuner Troubleshooting To check if TV tuner is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Connector Check and Replacement Check Procedure 1 Connector Check and Replacement Check The connection of cables, boards and module may be defective. Otherwise, they may be faulty.
2 Troubleshooting Procedures 2.17 Bridge media Slot Troubleshooting 2.17 Bridge media Slot Troubleshooting This section describes how to determine if the computer's Bridge media functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Check on Windows OS Procedure 2: Connector Check and Replacement Check Procedure 1 Check on Windows XP Insert a Bridge media card into the slot.
2.18 PCI ExpressCard Slot Troubleshooting 2 Troubleshooting Procedures 2.18 PCI ExpressCard Slot Troubleshooting This section describes how to check PCI ExpressCard slot by inspecting a card with PCI Express interface and a card with USB 2.0 interface. 1. Gigabit Ether ExpressCard 2. USB2.0 5in1 ExpressCard 1. Gigabit Ether ExpressCard (1) Insert the Gigabit Ether ExpressCard into the ExpressCard slot. (2) On Windows, open System Property → Hardware → Device Manager window.
Chapter 3 Tests and Diagnostics [CONFIDENTIAL]
3 Tests and Diagnostics 3 3-ii [CONFIDENTIAL] QOSMIO G20 Maintenance Manual (960-511)
3 Tests and Diagnostics Chapter 3 3.1 3.2 3.3 Contents The Diagnostic Test ................................................................................................... 3-1 3.1.1 Diagnostics menu ................................................................................. 3-1 3.1.2 H/W (Hardware) initial information setting tool.................................. 3-3 3.1.3 Heatrun test program............................................................................
3 Tests and Diagnostics 3.21 3.22 3.23 3.24 3.25 3.26 ONLY ONE TEST................................................................................................... 3-48 3.21.1 Program Description .......................................................................... 3-48 3.21.2 Operations .......................................................................................... 3-48 Head Cleaning................................................................................................
3 Tests and Diagnostics 3.32 SETUP ................................................................................................................... 3-102 3.32.1 Function Description ........................................................................ 3-102 3.32.2 Accessing the SETUP Program........................................................
3 Tests and Diagnostics Tables Table 3-1 Subtest names .................................................................................................... 3-20 Table 3-2 Error codes and error status names .................................................................... 3-43 Table 3-3 Hard disk controller status register contents...................................................... 3-46 Table 3-4 Error register contents...................................................................................
3 Tests and Diagnostics 3.1 The Diagnostic Test 3 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
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3 Tests and Diagnostics 3.1 The Diagnostic Test 3.1.2 H/W (Hardware) initial information setting tool The H/W initial information setting tool consists of the following programs. Initial configuration Region write System configuration display E2PROM test (MAC/GUID/DMI) You will need the following equipment to perform some of the programs. The Diagnostics Disk (Main T&D) A LAN wraparound connector (E2PROM test) 3.1.
3.2 Executing the Diagnostic Test 3.2 3 Tests and Diagnostics Executing the Diagnostic Test To start the DIAGNOSTIC PROGRAM, follow these steps: 1. Insert the Diagnostics disk in the floppy disk drive. 2. Release the lock of the power switch and turn on the computer with pressing the F12. Select the FDD in the display for selecting booting unit. Then, press Enter and the following menu appears. Microsoft Windows XX Startup Menu --------------------------------------------------------1.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test NOTE: To exit the DIAGNOSTIC TEST MENU, press the Esc key. If a test program is in progress, press Ctrl + Break to exit the test program. If a test program is in progress, press Ctrl + C to stop the test program. Set the highlight bar to 1, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Select the option you want to execute and press Enter. When you select 1- SYSTEM TEST, the following message will appear: SYSTEM TEST NAME SUB-TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXXXXX xxxxxxx DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Use the up and down arrow keys to move the cursor to “ERROR STOP”. Use the right and left arrow keys to move the cursor to the desired option and press Enter.
3.3 Check of the RAID configuration 3.3 3 Tests and Diagnostics Check of the RAID configuration Following screen is displayed for checking the RAID configuration and specifying a failed drive. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status Capacity LD0 RAID-1 DEGRADE xxGB Write cache : Enable Degrade Bootup : Yes MBR Protection : Disable S.M.A.R.
3 Tests and Diagnostics 3.3 Check of the RAID configuration Logical Drive Information: Displays logical drive number, RAID level, RAID status, contents and setting. Physical Drive Information: Displays port number, logical drive number belonged, status and disk information. RAID level: Displays RAID level configured. NON: Means that RAID is not configured. Confirming the logical drive information can check if a drive exists and check models of the drive. RAID-0: There are 1RAID-0 and 2RAID-0 (striping).
3.3 Check of the RAID configuration 3 Tests and Diagnostics 3.3.2 Check of the screen display Contents of the screen displayed are shown below. 3.3.2.1 RAID-1 When the “RAID-1” is displayed in the configured by two drives. shown below, it is judged that the RAID is TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved.
3 Tests and Diagnostics 3.3 Check of the RAID configuration < RAID: not OPTIMAL > The RAID is not configured by two drives in the following display, because there are two LDs (LD0 and LD1). TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status LD0 RAID-0 OPTIMAL Capacity xxGB Write cache : Enable Degrade Bootup : Yes MBR Protection : Disable S.M.A.R.
3.3 Check of the RAID configuration 3 Tests and Diagnostics 3.3.3 Specification of the failed HDD Check the RAID configuration condition from the failed drive. shown below and specify a TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level Status LD0 RAID-1 DEGRADE Capacity xxGB Write cache : Enable Degrade Bootup : Yes MBR Protection : Disable S.M.A.R.
3 Tests and Diagnostics 3.3 Check of the RAID configuration 3.3.3.2 RAID : not OPTIMAL ABSENT or OFFLINE is displayed When the “ABSENT” or “OFFLINE” is displayed as shown below, the drive is removed by the RAID console and installed again. When the drive is unlocked, “ABSENT” is displayed. When the drive is locked, “OFFLINE” is displayed. Repair is not needed in this case. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved.
3.3 Check of the RAID configuration 3 Tests and Diagnostics NO DRIVE for one drive is displayed When “NO DORIVE” is displayed and the HDD is connected to the port, follow the procedures below to check the HDD failure. (1) Install a new HDD. When “NO DORIVE” is still displayed, It is judged that the MB or cable fails. (2) When a new HDD is recognized, It is judged that the HDD removed is failed. Specify the reason by using the Independent Utility. TOSHIBA RAID / RAID Information Display Rev xx.xx.
3 Tests and Diagnostics 3.3 Check of the RAID configuration FAIL for one drive is displayed One drive in the “RAID-1”is failed and degraded. This may look like failure by wrong operation. Specify the reason by using Independent Utility. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION. All Rights Reserved. Level LD0 RAID-1 Status Capacity DEGRADE xxGB Write cache : Enable Degrade Bootup : Yes MBR Protection : Disable S.M.A.R.
3.4 Setting of the hardware configuration 3.4 3 Tests and Diagnostics Setting of the hardware configuration To execute this program, select 2-Repair initial config test in the startup menu, press Enter and follow the directions on the screen. The H/W initial information setting tool consists of four subtests. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Initial configuration This subtest executes the following items and shows their contents in the display.
3 Tests and Diagnostics 3.4 Setting of the hardware configuration Setting of the HWSC Setting of the UUID Display of the DMI information (including UUID) Setting of DVD region code (Yes/No) After completion of the above settings, H/W configuration & DMI information are appeared in order. Check the contents and press Enter. Subtest 02 Region write This subtest executes the setting of the region code for DVD drive based on the destination of the machine.
3.4 Setting of the hardware configuration Subtest 08 3 Tests and Diagnostics System configuration display This subtest displays the information of the system configuration. Confirm the contents and press Enter. For more details on the system configuration information, refer to 3.26 "System configuration". Subtest 09 E2PROM test (MAC/GUID/DMI) It checks whether the MAC address, GUID of IEEE1394 and DMI information are written.
3 Tests and Diagnostics 3.5 3.5 Heatrun Test Heatrun Test To execute this program, select 3-Repair heatrun in the startup menu, press Enter. After selecting this test, the same subtests as 3.23 RUNNING TEST is executed successively. For more details on the procedure and test content, refer to RUNNING TEST. When the heatrun test ends, following message appears in the display.
3.6 Subtest Names 3.6 3 Tests and Diagnostics Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No. 3-20 Test Name Subtest No.
3 Tests and Diagnostics 3.6 Subtest Names Table 3-1 Subtest names (2/2) No. Test Name Subtest No.
3.7 System Test 3.7 3 Tests and Diagnostics System Test To execute the System Test select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM Checksum This subtest executes a checksum test of the BIOS ROM (range: F0000h to FFFFFh, 64KB) on the System Board. Subtest 02 Fan ON/OFF This subtest turns on/off the fan motor by force with Fan ON/OFF commands.
3 Tests and Diagnostics 3.7 System Test This subtest checks the status for the quick charge. Subtest 05 DMI read This subtest displays the information in the Flash-ROM in the following format. *** DMI Data Display Ver X.XX *** Model Name Version Number Serial Number Model Number UUID Number : : : : : XXXXXXXXXXX XXXXXXXXXXXX XXXXXXXX XXXXXX-XXXXX XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX Press [Enter] to EXIT To exit this subtest and return to the SYSTEM test menu, press Enter.
3.8 Memory Test 3.8 3 Tests and Diagnostics Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Conventional memory This subtest writes a constant data to conventional memory (0 to 640 KB), then reads the new data and compares the result with the original data. Subtest 02 Protected Mode NOTE: The CONFIG.
3 Tests and Diagnostics 3.9 3.9 Keyboard Test Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed key code display When a key is pressed, the scan code, character code, and key top name are displayed on the screen in the format shown below.
3.10 Display Test 3 Tests and Diagnostics 3.10 Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM read/write for VGA This subtest writes the constant data (AAh and 55h) to the video RAM. The data is read and compared to the original data.
3 Tests and Diagnostics Subtest 04 3.10 Display Test Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode 12] 13] 3] 111 112 114 115 117 118 640*480 640*480 800*600 800*600 1024*768 1024*768 64K] 16M] 64K] 16M] 64K] 16M] The display below appears on the screen when this subtest is executed.
3.10 Display Test Subtest 06 3 Tests and Diagnostics “H” Pattern Display This subtest displays a full screen of “H” patterns.
3 Tests and Diagnostics 3.11 Floppy Disk Test 3.11 Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. The contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen.
3.11 Floppy Disk Test 3 Tests and Diagnostics Select the number of the subtest you want to execute and press Enter. The following message will appear during the floppy disk test. FLOPPY DISK SUB-TEST PASS COUNT WRITE DATA ADDRESS IN PROGRESS : : : : XX XXXXX XX XXXXXX XXXXXXX xxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] : test end [Ctrl]+[C] : key stop ERROR COUNT READ DATA STATUS : XXXXX : XX : XXX When the subtest 04 or 05 is selected, the following messages will appear on the screen.
3 Tests and Diagnostics 3.12 Printer Test 3.12 Printer Test CAUTION: Printer Test is not supported for this model. To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The following messages will appear after selecting the Printer Test from the DIAGNOSTIC TEST MENU. Answer each of the questions with an appropriate response to execute the test. NOTE: An IBM compatible printer must be connected to the system to execute this test.
3.12 Printer Test Subtest 02 3 Tests and Diagnostics Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wraparound NOTE: To execute this subtest, a printer wraparound connector must be connected to the computer’s printer port.
3 Tests and Diagnostics 3.13 Async Test 3.13 Async Test CAUTION: Async Test is not supported for this model. To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
3.14 Hard Disk Test 3 Tests and Diagnostics 3.14 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. CAUTION: The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 08,or 09 is executed. Before running the test, the customer should transfer the contents of the hard disk to floppy disk or another hard disk. If the customer has not or cannot perform the back-up, create back-up disks as described below.
3 Tests and Diagnostics 3.14 Hard Disk Test 4. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest. HARD DISK TEST XXXXXXX SUB TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXX DIAGNOSTIC TEST VX.
3.14 Hard Disk Test Subtest 04 3 Tests and Diagnostics Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder.
3 Tests and Diagnostics 3.15 Real Timer Test 3 3.15 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real time A new date and time can be input during this subtest. To execute the real time subtest, follow these steps: 1.
3.15 Real Timer Test Subtest 03 3 Tests and Diagnostics Real time carry CAUTION: When this subtest is executed, the current date and time are erased.
3 Tests and Diagnostics 3.16 NDP Test 3.16 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen.
3.17 Expansion Test 3 Tests and Diagnostics 3.17 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wraparound CAUTION: PCMCIA wraparound test is not supported for this model. NOTE: To execute this subtest, the PC card wraparound connector is required.
3 Tests and Diagnostics Subtest 02 3.17 Expansion Test RGB monitor ID NOTE: To execute this subtest, RGB monitor ID wraparound connector is required. The wiring diagram of the connector is described in Appendix F. Connect a wraparound connector to CRT monitor for the test of ID acquisition. This subtest is executed by using VESA command.
3.18 CD-ROM/DVD-ROM Test 3 Tests and Diagnostics 3.18 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM test, select 13 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1. For the subtest 04, use a CD-RW on the market.
3 Tests and Diagnostics 3.19 Error Code and Error Status Names 3.19 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test.
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3 Tests and Diagnostics 3.
3.20 Hard Disk Test Detail Status 3 Tests and Diagnostics 3.20 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eightdigit number. The first four digits represent the hard disk controller (HDC) error status number and the last four digits are not used.
3 Tests and Diagnostics 3.20 Hard Disk Test Detail Status Tables 3-4 Error register contents Bit Name Description 7 BBK (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error. “1” … Uncorrectable data error has been detected. 5 —— Not used 4 IDN (Identification) “0” … Not used “1” … There is no ID field in the requested sector.
3.21 ONLY ONE TEST 3.21 3 Tests and Diagnostics ONLY ONE TEST 3.21.1 Program Description This program tests the unique functions of this model. 3.21.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter. The following menu appears in the display. ################################################################# ######## ONLY ONE TEST Menu (XXXXXXXXX) ####### ################################################################# * * * 1 ............ Pressed Key Display * * 2 ............
3 Tests and Diagnostics Subtest 01 3.21 ONLY ONE TEST Pressed key display When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed. Holding a key down enables the auto-repeat function that causes the key’s display character to blink. Press Del + Enter to end the test.
3.21 ONLY ONE TEST Subtest 02 3 Tests and Diagnostics Touch Pad This subtest checks the functions of the touch pad as shown below. A) Direction and parameter B) Switching function check. This test displays the response from the touch pad and touch pad switch. When moving your finger on the touch pad towards the upper left, the display changes according to the following illustration. If a touch pad switch is pressed, the displays appear on the right side one by one.
3 Tests and Diagnostics Subtest 03 3.21 ONLY ONE TEST Touch sensor button This subtest checks if the touch sensor buttons (11 buttons) work properly. The following message appears in the display. 0 1 2 3 4 5 6 7 8 9 10 * * * * * * * * * * * Press button [0] Touch the first touch sensor button from the left. The name of touch sensor button in the message is described as number (0-10) from the left side. (Refer to the following picture.
3.21 ONLY ONE TEST Subtest 04 3 Tests and Diagnostics Kill Switch This subtest checks if the Wireless communication switch works properly. If the test is started with the switch ON, following message appears in the display. Kill switch is set to a start position (OFF) Slide the switch to OFF position. Then, following message appears in the display. KILL SWITCH ON !! Slide the switch to ON position. Then, following message appears in the display.
3 Tests and Diagnostics 3.21 ONLY ONE TEST OK message appears in the display if the test ends without a defective. NG message appears in the display if a defective is found during the test. Confirm the connection of cable, then execute the test again. Press 9 and return to ONLY ONE TESST menu. Subtest 06 Touch Pad (Scroll Button) This subtest checks if the scroll button of touch pad works properly. The following message appears in the display. ****** Scroll button TEST (VX.
3.21 ONLY ONE TEST 3 Tests and Diagnostics Confirm each LED lights properly. (1) Press [Caps Lock ] key ! ...Caps (on/off) (2) Press [Fn + F10 ] key ! ...Arrow (on/off) (3) Press [Fn + F11 ] key ! ...Num (on/off) (4) Slide [BT/W-LAN switch L&R]! (on/off) Press Enter and following message appears in the display. Check [PowerSW-LED]= Green Check if the Power Switch LED lights in the following order. (Green -> Orange -> Blue -> OFF) Press any key and following message appears in the display.
3 Tests and Diagnostics Subtest 09 3.21 ONLY ONE TEST Acceleration sensor This subtest detects and corrects the each axis (X, Y, Z). NOTE: Make sure that this subtest is executed on the following condition: 1. Flat desk with vertical plane to get the stability of machine. 2. Prevent the machine from shake or shock. Set the machine against the vertical plane with the Front upward Vertical plane Flat desk The figure below shows the name and position of each side.
3.21 ONLY ONE TEST 3 Tests and Diagnostics When this subtest is selected, the following message appears in the display. The heaven surface establishes in the upper direction Press [Enter] key NOTE: Be sure to execute the test with the display panel opened. Set the machine on the flat desk. Then press Enter to detect the data on this setting of machine. The following message appears in the display.
3 Tests and Diagnostics 3.21 ONLY ONE TEST When a defective is found during the each check above, the following message appears in the display. The test is halted at the point when the defective is found. ** Setting ERROR! ** Press [Enter] key Press Enter and return to the Only One Test menu. Then execute the test again.
3.22 Head Cleaning 3.22 3 Tests and Diagnostics Head Cleaning 3.22.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.22.2 Operations 1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS - FLOPPY DISK HEAD CLEANING : VX.XX Mount cleaning disk(s) on drive(s). Press any key when ready. 2.
3 Tests and Diagnostics 3.23 3.23 Log Utilities Log Utilities 3.23.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or output the data to a printer. The error information is displayed in the following order: 1. Error count (CNT) 2. Test name, Subtest number (TS-No) 3. Pass count (PASS) 4. Error status (STS) 5. FDD/HDD or memory address (ADDR) 6. Write data (WD) 7.
3.23 Log Utilities 3 Tests and Diagnostics 3.23.2 Operations 1. Select 5 and press Enter in the DIAGNOSTIC MENU, logs error information into RAM or onto a floppy disk.
3 Tests and Diagnostics 3.24 3.24 Running Test Running Test 3.24.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02, 06) 3. Display test (subtest 01) 4. Real timer test (subtest 02) 5. HDD test (subtests 01) The system automatically detects the number of floppy disk drives connected to the computer for the FDD test. 3.24.2 Operations 1.
3.25 Floppy Disk Drive Utilities 3.25 3 Tests and Diagnostics Floppy Disk Drive Utilities 3.25.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE: This program is only for testing a floppy disk drive. The option is different from the Toshiba MS-DOS FORMAT command.
3 Tests and Diagnostics 3.25 Floppy Disk Drive Utilities 3.25.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 2 3 4 9 – - FORMAT COPY DUMP HDD-ID READ EXIT TO DIAGNOSTICS MENU 2. FORMAT program (a) Selecting FORMAT displays the following message: DIAGNOSTICS - FLOPPY DISK FORMAT : VX.
3.25 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below: Insert source disk into drive A: Press any key when ready. (c) Remove the Diagnostics Disk from the FDD, insert the source disk and press any key. The following message will appear, indicating the program has started.
3 Tests and Diagnostics 3.25 Floppy Disk Drive Utilities 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If 2:HDD is selected, the display will go to step (h). If 1:FDD is selected, the following message will appear: Select drive number (1:A, 2:B) ? (c) Select a drive number and the following message will be displayed.
3.25 Floppy Disk Drive Utilities 3 Tests and Diagnostics (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? 5. HDD ID READ program Selecting HDD ID displays the following HDD ID configuration: [HDD ID Read (VX.XX)] [Drive #1] Model No.
3 Tests and Diagnostics 3.26 System Configuration 3 3.26 System Configuration 3.26.1 Function Description The System Configuration program contains the following configuration information for the computer: 1. Processor Type [Code/L2 cache] 2. Chip set [VRAM] 3. BIOS ROM version [1st ID, 2nd ID] 4. Boot ROM version 5. EC total version 6. PS Microprocessor version 7. SVP parameter version [Panel/Manufacture code/Product code] 8. Micro code revision [Processor number] 9.
3.26 System Configuration 3 Tests and Diagnostics 3.26.2 Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display. System Configuration Display: Ver X.XX [Machine Name???] * * * * * * * * * * * * * * * - Processor Type - Chip set - BIOS ROM Version - BOOT ROM Version - EC Total Version - PS Micon Version - SVP Par.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made b/g) 3.27 Wireless LAN Test Program (Intel-made b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade Calexico 802.11b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS.
3.27 Wireless LAN Test Program (Intel-made b/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Using a wrong wireless LAN card (Using unspecified card) • Defective wireless LAN card Checking the connection, execute the subtest again. Subtest02 MAC Address Check This subtest displays the MAC address. Selecting this subtest, following message will appear in the display.
3 Tests and Diagnostics Subtest03 3.27 Wireless LAN Test Program (Intel-made b/g) Antenna check & communication test of 11b mode Caution: To execute subtest 03-05, use another computer (with Calexico wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform those tests. Access points are also required. (Access point for 802.11b and 802.11g) Be sure to turn the wireless communication switch ON before executing wireless LAN communication test.
3.27 Wireless LAN Test Program (Intel-made b/g) Subtest04 3 Tests and Diagnostics Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. After finishing the test, OK message will appear in the display. Press any key and return to the test menu. When a defective is found during the test, NG message will appear in the display. Press any key and following message will appear in the display.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Intel-made a/b/g) 3.28 Wireless LAN Test Program (Intel-made a/b/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade Calexico 802.11a/b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS.
3.28 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics If a defective is found during the test, NG message will appear in the display. Press any key and following message will appear in the display. ************************************************************* * * * SKU NG !! * * * * Other Card or Module not found * * * ************************************************************* Press any key and return to the test menu.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Intel-made a/b/g) When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Defective wireless LAN card • Disappearance of MAC address data Checking the connection, execute the subtest again.
3.28 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Connection of wireless LAN antenna cable (Main/Aux) • Condition of wireless LAN communication (Interference/obstruction) • Defective wireless LAN card Checking the connection and condition, execute the subtest again.
3 Tests and Diagnostics Subtest05 3.28 Wireless LAN Test Program (Intel-made a/b/g) Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. For more details on procedure and contens of this subtest, refer to Subtest04 Communication test of 11a mode. Subtest06 All the tests of Calexico 11a/b/g Card This subtest checks SKU information, MAC address of Calexico 802.11a/b/g card, antenna connection and communication test of Calexico 802.
3.29 Wireless LAN Test Program (Askey-made) 3 Tests and Diagnostics 3.29 Wireless LAN Test Program (Askey-made) This section describes how to perform the wireless LAN transmitting-receiving test (Askeymade Atheros b/g, a/b/g). Caution: To execute subtest 03-07, use another computer (with Atheros wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform those tests. Another wireless communication tool with 2.4GHz like Bluetooth is interfering with the test.
3 Tests and Diagnostics 3.
3.29 Wireless LAN Test Program (Askey-made) Subtest02 3 Tests and Diagnostics MAC Address Check This subtest displays the MAC address. Selecting this subtest, following message will appear in the display. ************************************************************* * * * MAC Address Check : OK !! * * * ************************************************************* Press any key and return to the test menu. When a defective is detected in the test, following typical cause is considered.
3 Tests and Diagnostics 3.29 Wireless LAN Test Program (Askey-made) When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Connection of wireless LAN antenna cable (Main/Aux) • Condition of wireless LAN communication (Interference/obstruction) • Defective wireless LAN card Checking the connection and condition, execute the subtest again.
3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics 3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the test program. Insert the test program disk for LAN/Modem/Bluetooth/IEEE1394 test in FDD and turn on the power. The following message will appear: Microsoft Windows XX Startup Menu ---------------------------------1. LAN 2. Modem 3. Bluetooth 4.
3 Tests and Diagnostics Subtest01 3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program (i82562 + ICHx) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip.
3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest02 3 Tests and Diagnostics (GbE) CAUTION: Gigabit Ethernet test is not supported for this model. This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. Select 2 to execute and press Enter. The following message will appear: Testing adaptor...hit to abort. * External Loopback Test...PASSED Testing completed.
3 Tests and Diagnostics 3.30.2 3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program Modem test For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Denki Seisakusyo)” for the tests. To execute Modem test, press 2 and Enter. Following message will appear: [Modem loopback test !] ICHx MDC Test Program with Modem Sound (Line Test) Version X.
3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.30.3 3 Tests and Diagnostics Bluetooth test CAUTION: Bluetooth test is not supported for this model. To execute this test, input 3 and press Enter. Note: Use another computer that can communicate by the Bluetooth as a reference machine to perform this test. Insert a floppy disk containing the test program into the target machine and turn on the target machine.
3 Tests and Diagnostics Subtest01 3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program BD_ADDR check This subtest checks the BD_ADDR functions. When the Bluetooth test menu is displayed, press 1 to select the test and press Enter. The following message will appear: ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If the target machine has any problem, it displays Error CODE. The following message is displayed. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-6 Error code for Bluetooth test (BD_ADDR) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection. Hardware Failure.
3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Table 3-6 Error code for Bluetooth test (BD_ADDR) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
3 Tests and Diagnostics 3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program When the Bluetooth test menu is displayed, press T to select the test and press Enter in the test machine. The following message will appear: ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If the target machine has any problem, the following message “INCOMPLETE” is displayed with the Error Code. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection.
3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
3 Tests and Diagnostics 3.30.4 3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program IEEE1394 test To execute this test, input 4 and press Enter. NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test. The following menu will appear: ******************************************************************** ******** IEEE1394[XXXXX] Diagnostics program ************** ******************************************************************** * * * 1 ....
3.31 Sound Test program 3 3 Tests and Diagnostics Tests and Diagnostics 3.31 Sound Test program This section describes how to perform the Sound test. To execute the sound test, refer to the following description. Insert the test program disk for Sound test in the floppy disk drive and turn on the power.
3 Tests and Diagnostics 3.31 Sound Test program To return to the Sound test menu, Press 9 and Enter. Then following message will appear in the display. *********************************** ******** May I Restart ? ******* *********************************** Press any key to continue… After pressing any key, the machine starts rebooting and sound test menu will appear in the display. Subtest01 Microphone recording & play This subtest checks the function of the CODEC A/D, D/A converter.
3.31 Sound Test program Subtest02 3 Tests and Diagnostics Sine Wave This subtest is executed by loading the COM file (ADSIN.COM). The program expands sine wave data table from 16KB to 64KB, and creates the play data. Then it transfers the data between the DMA and the CODEC to play the sine wave. (It sounds like a continuous beep). By using wave measurable devices such as an oscilloscope, the data can be measured as a sine wave.
3 Tests and Diagnostics 3.31 Sound Test program 3.31.3 CD Sound (Standard) test To execute the CD Sound (Standard) test, press 3 and Enter. Insert the test media (TOSHIBA TEST CD-ROM or ABEX TEST CD-ROM) or music CD on the market (if the test media can not be prepared). Following menu appears in the display. For details on use of test media, refer to (1) Test media (Toshiba-made test media). For details on use of audio CD on the market, refer to (2) Audio CD.
3.31 Sound Test program Subtest02 3 Tests and Diagnostics English Narration Selected this subtest, narration in English starts. For more details on the procedure, refer to the subtest01. Subtest03 Test Tone A Caution: Before starting subtest03, be sure to set the sound at proper volume. This subtest plays sine wave while changing its table from 100Hz to 20Hz. Return to the CD Sound (Standard) menu after the test ends.
3 Tests and Diagnostics 3.31 Sound Test program (2) Audio CD Insert an audio CD and the following menu appears in the display. CD/DVD TEST IN PROGRESS XXXXXXXX SUB-TEST PASS COUNT WRITE DATA ADDRESS XX XXXXX XX XXXXXX : : : : xxxxxxx DIAGNOSTIC TEST VX.
3.32 SETUP 3 Tests and Diagnostics 3.32 SETUP 3.32.1 Function Description This program displays the current system setup information as listed below: 1. Memory 2. System Date/Time 3. Battery (a) Battery Save Mode (b) PCI Express Link ASPM 4. Password 5. HDD Password (a) (b) (c) (d) HDD HDD Password Mode User Password Master Password 5. Boot Priority (a) Boot Priority (b) HDD Priority (c) Network Boot Protocol 6.
3 Tests and Diagnostics 3.32 SETUP 10. Display (a) Power On Display (b) LCD Display Stretch (c) TV Type 11. Peripheral (a) Internal Pointing Device 12. Legacy Emulation (a) USB KB/Mouse Legacy Emulation (b) USB-FDD Legacy Emulation 13. PCI LAN 14.
3.32 SETUP 3 Tests and Diagnostics 3.32.
3 Tests and Diagnostics QOSMIO G20 Maintenance Manual (960-511) 3.
3.32 SETUP 3 Tests and Diagnostics Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press ↑ and ↓ to move between items in a column. Press Fn+↑ (PgUp) and Fn + ↓ (PgDn) to move between the two pages. 2. Press either the Space bar or Back Space to change the value. Accepting Changes and Exiting the SETUP Window 1. Press End to accept the changes you made.
3 Tests and Diagnostics 3.32 SETUP SETUP Options The SETUP screen is divided into 14 functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s memory. This field displays the total amount of memory installed and is automatically calculated by the computer. You cannot change this value. 2. System Date/Time Sets the date and time. System Date Sets date. System Time Sets time. 3.
3.32 SETUP 3 Tests and Diagnostics NOTE: Display of the LCD Brightness will be changed in the condition below: (*1) Operating the battery (*2) Using the AC adapter User Setting Use this option to set the battery save parameters on the sub-window, BATTERY SAVE OPTIONS. Battery Save Options Processing Speed This feature changes the CPU processing speed. High CPU operates at 1.60/1.73/1.87/2.00/2.13GHz(Pentium-M), (Default in Full Power Mode) Low CPU operates at half processing speed.
3 Tests and Diagnostics 3.32 SETUP Battery optimized If the CPU becomes too hot, the processing speed is lowered. If the temperature is still too high, the fan turns on. When the CPU temperature falls to a normal range, the fan is turned off and the processing speed is increased. NOTE: Too hot condition may cause defect on the CPU. When the hot condition continues, the power is automatically turned off in resume mode.
3.32 SETUP 3 Tests and Diagnostics 5. Boot Priority (a) Boot Priority Use this option to set the priority for booting of the computer and the priority for the HDD for booting. FDD→HDD→CD-ROM→LAN: The computer looks for bootable files in the following order: FDD, HDD, CDROM (*1) and LAN HDD→CD-ROM→LAN→FDD: The computer looks for bootable files in the following order: HDD, CD-ROM, LAN and FDD. FDD→CD-ROM→LAN→HDD: The computer looks for bootable files in the following order: FDD, CD-ROM, LAN and HDD.
3 Tests and Diagnostics 3.32 SETUP 6. Others Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use. (a) CPU Cache Use this option to enable or disable the CPU cache. Enabled Enables the CPU cache. (Default) Disabled Disables the CPU cache. (b) Level 2 Cache Use this option to enable or disable the level 2 cache. When "CPU Cache" is set to "Disabled", this option cannot be changed. Enabled Enables the level 2 cache.
3.32 SETUP 3 Tests and Diagnostics (e) Auto Power On This option displays setting for Auto Power On. Disabled Indicates auto power on is not set. Enabled Indicates auto power on is set. When “Enabled” is selected, the following sub-window appears. OPTIONS Alarm Time Alarm Date Option = 00:00:00 = Disabled Set the parameters for the Auto Power On (automatic power on) function in the “OPTIONS” window. To set the time, use Space or BackSpace.
3 Tests and Diagnostics 3.32 SETUP (g) Sound Logo This option enables or disables sound logo function. Enabled Enables the sound logo function. (Default) Disabled Disables the sound logo function (h) Front Operation Panel This option enables or disables front operation panel. Enabled Enables the front operation panel. (Default) Disabled Disables the front operation panel When “Enabled” is selected, the following sub-window appears. OPTIONS Beep Volume LED Mode Off = Medium = Mode 2 Always off.
3.32 SETUP 3 Tests and Diagnostics 7. Configuration This option lets you set the device configuration. All Devices BIOS sets all devices. Setup by OS Initializes devices, which is needed to load an operating system. Operating system initializes other devices. NOTE: (1) When using installed OS, selecting “Setup by OS” is recommended. (2) When executing test programs, be sure to select “ALL Device”. And after the test end, select “Setup by OS”. 8.
3 Tests and Diagnostics 3.32 SETUP NOTE: When starting the computer in Standby or Hibernation, the last configuration is remembered. If data does not appear on the display you are using after starting in Standby or Hibernation, pressing Fn+F5. Pressing Fn+F5 changes the display setting as follows in order: the internal LCD, the external display, both the internal LCD and the external display.
3.32 SETUP 3 Tests and Diagnostics 12. LEGACY EMULATION (a) USB KB/Mouse Legacy Emulation This option sets the Legacy support condition of the USB keyboard and the USB mouse. Enabled Enables LEGACY support. (Default) USB keyboard/USB mouse are available without the driver. Disabled Disables LEGACY support (b) USB-FDD Legacy Emulation This option sets the Legacy support condition of the USB floppy disk drive. When a computer is FDD built-in model, this option is not displayed.
3 Tests and Diagnostics 3.32 SETUP (b) Create State This option sets the RAID configuration level. NOTE: Be careful that all data of the hard disk is deleted when setting of the RAID configuration is changed in the BIOS setup. Therefore, recommend that the user password or the supervisor password is registered to prevent the setting of the RAID configuration is not changed by the third party.
3.
Chapter 4 Replacement Procedures [CONFIDENTIAL]
4 Replacement Procedures 4 4-ii [CONFIDENTIAL] QOSMIO G20 Maintenance Manual (960-511)
4 Replacement Procedures Chapter 4 4.1 Contents Overview.................................................................................................................... 4-1 Safety Precautions................................................................................................ 4-2 Before You Begin ................................................................................................ 4-3 Disassembly Procedure..........................................................................
4 Replacement Procedures 4.17 Battery board / RTC battery..................................................................................... 4-46 4.17.1 Battery board......................................................................................... 4-46 4.17.2 RTC battery........................................................................................... 4-48 4.18 Wireless LAN card .................................................................................................. 4-49 4.
4 Replacement Procedures Figures Figure 4-1 Removing the battery pack................................................................................. 4-8 Figure 4-2 Removing an ExpressCard or PC card............................................................. 4-11 Figure 4-3 Removing a bridge media ................................................................................ 4-12 Figure 4-4 Removing a HDD-1 assembly .........................................................................
4 Replacement Procedures Figure 4-30 Removing the TV tuner module....................................................................... 4-50 Figure 4-31 Removing the CPU fan .................................................................................... 4-52 Figure 4-32 Removing the CPU fin ..................................................................................... 4-53 Figure 4-33 Removing the CPU ..........................................................................................
4 Replacement Procedures 4.1 Overview 4 4.1 Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual. In all cases when removing an FRU, the battery pack must also be removed.
4.1 Overview 4 Replacement Procedures Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. DANGER: 1. In the case of the battery, always use authentic parts or equivalent parts approved by Toshiba. Other batteries may have different specifications that are incompatible with the computer and may result in fire or explosion.
4 Replacement Procedures 4.1 Overview Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2.1 Battery Pack”. 1. Do not disassemble the computer unless it is operating abnormally. 2. Use the designated tools. 3. Ensure that the environment for working on and storing parts does not contain any of the following.
4.1 Overview 4 Replacement Procedures Disassembly Procedure Three main types of cable connector are used. • Pressure plate connector • Spring connector • Normal pin connector When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cable out from the connector. When reconnecting a cable to a pressure plate connector, lift up the pressure plate to a suitable height and insert the cable into the connector.
4 Replacement Procedures 4.1 Overview Assembly Procedure After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. ¾ Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems. ¾ Check that all cables and connectors are securely connected.
4.1 Overview 4 Replacement Procedures Screw Tightening Torque Use the following torque when tightening screws. CAUTION: Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage. NOTE: To tighten screws quickly and accurately, an electric screwdriver is recommended. M2 (2mm) 0.167 N·m (1.7 kgf·cm) M2.5 (2.5mm) 0.294 N·m(3.0 kgf·cm) M3.0 (3mm) 0.549 N･m (5.
4 Replacement Procedures 4.1 Overview Screw Notation To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body. Format: Screw shape + Screw length (mm) Screw shape B: Bind screw F: Thin head screw S: Super thin head screw T: Tapping screw U: Other screws (Unique screws: pan head, stud, etc.
4.2 Battery pack 4.2 4 Replacement Procedures Battery pack Removing the battery pack The following describes the procedure for removing the battery pack (See Figure 4-1). CAUTION: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC adapter and all external devices from the computer. 3. Turn the computer upside down. 4.
4 Replacement Procedures 4.2 Battery pack Installing the battery pack The following describes the procedure for installing the battery pack (See Figure 4-1). CAUTION: There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly. Dispose always the used battery pack in accordance with the laws and ordinances of your local authority. Use only the batteries approved by Toshiba.
4.3 ExpressCard & PC card / Bridge media 4.3 4 Replacement Procedures ExpressCard & PC card / Bridge media 4.3.1 ExpressCard & PC card Removing an ExpressCard & PC card The following describes the procedure for removing an ExpressCard & PC card (See Figure 4-2). CAUTION: Insert or remove an Express card & PC card in accordance with any instructions in their manual or the manuals of the computer system you are using. 1. Push the eject button. It will pop out when you release it.
4 Replacement Procedures 4.3 ExpressCard & PC card / Bridge media [PC Card (Lower slot)] Eject button PC card Figure 4-2 Removing an ExpressCard or PC card Installing an ExpressCard & PC card The following describes the procedure for inserting an ExpressCard & PC card (See Figure 4-2). 1. Make sure the eject button does not stick out. 2. Insert an ExpressCard or PC card and press it until it is securely connected.
4.3 ExpressCard & PC card / Bridge media 4 Replacement Procedures 4.3.2 Bridge media (SD Card/Memory Stick/xDPicture Card/MultiMedia card) Removing a Bridge media The following describes the procedure for removing a Bridge Media (See Figure 4-3). CAUTION: Insert or remove a Bridge Media in accordance with any instructions in the each Bridge Media manual or the manuals of the computer system you are using. 1. Push a Bridge media. It will pop out partly when you release, so pull out the card.
4 Replacement Procedures 4.4 4.4 HDD HDD Removing a HDD The following describes the procedure for removing a HDD (See Figure 4-4 to 4-6). CAUTION: Take care not to press on the top or bottom of a HDD. Pressure may cause data loss or damage to the device. 1. Turn the computer upside down. 2. Turn the screw (with e-ring) securing an HDD-1 slot cover and remove an HDD-1 slot cover. 3. Remove the following screw securing the HDD-1 assembly. M2.5x6.0B FLAT BIND screw x１ 4.
4.4 HDD 5. 4 Replacement Procedures (If an HDD-2 is installed) Turn the screw (with e-ring) securing an HDD-2 slot cover and remove an HDD-2 slot cover. 6. Remove the following screw securing the HDD-2 assembly. M2.5x6.0B FLAT BIND screw x１ 7. Disconnect the HDD-2 assembly from the connector CN1860 on the system board by sliding it toward the arrow pointed. HDD-2 slot cover Screw (with e-ring) HDD-2 slot assembly M2.5x6.
4 Replacement Procedures 4.4 HDD 8. Remove the following screws securing the HDD holder and remove the HDD holder from HDD. M3.0x4.0Z FLAT BIND screw x4 M3.0x4.0Z FLAT BIND M3.0x4.
4.4 HDD 4 Replacement Procedures Installing a HDD The following describes the procedure for installing a HDD (See Figure 4-4 to 4-6). 1. Install an HDD to the HDD holder and secure it with the following screws. M3.0x4.0Z FLAT BIND screw x4 NOTE: Although they are 3mm head screws, screw torque must be set in 0.294 N·m (3.0Kgf·cm) for four screws securing the HDD holder. 2.
4 Replacement Procedures 4.5 4.5 MDC MDC Removing a MDC The following describes the procedure for removing a MDC (See Figure 4-7). 1. Turning up the insulator, remove the following screws securing a MDC. M2.0x4.0C BIND screw x2 2. Pull a MDC straight up and disconnect the MDC from the connector CN3000 on the SD board. 3. Disconnect the RJ11 harness from the MDC. M2.0x4.
4.5 MDC 4 Replacement Procedures Installing a MDC The following describes the procedure for installing a MDC (See Figure 4-7). 1. Connect the RJ11 harness to the connector of the MDC. 2. Install a MDC and connect it to the connector CN3000 on the SD board. 3. Secure the MDC with the following screws. M2.0x4.
4 Replacement Procedures 4.6 4.6 Memory module Memory module CAUTION: The power of the computer must be turned off when you remove a memory module. Removing a memory module with the power on risks damaging the module or the computer itself. Do not touch memory module terminals. Any dirt on the terminals may cause memory access problems. Never press hard or bend a memory module. Removing a memory module To remove a memory module, confirm that the computer is in boot mode.
4.6 Memory module 4 Replacement Procedures Installing a memory module To install a memory module, confirm that the computer is in boot mode. Then perform the following procedure (See Figure 4-8). 1. Insert a memory module into the connector of the computer slantwise (terminal side first) and press it to connect firmly. CAUTION: Be sure to install a memory module to slot A (CN1400). The computer does not boot when slot A is vacant.
4 Replacement Procedures 4.7 4.7 Keyboard Keyboard Removing the keyboard The following describes the procedure for removing the keyboard (See Figure 4-9 and 4-10). CAUTION: As the keytop may fall out, when handling the keyboard always hold it by the frame and do not touch the keytop. 1. Open the display. 2. Insert your finger into the slot between the keyboard brace and the computer. Then, lift up the keyboard brace to unlatch and remove it. 3.
4.7 Keyboard 4 Replacement Procedures 5. Lift the upper side of the keyboard and turn it face down on the palm rest. 6. Remove the following screws securing the keyboard support plate and remove the keyboard support plate. M2.5x8.0B FLAT BIND screw x2 7. Disconnect the keyboard cable from the connector CN3200 on the system board. 8. Remove the keyboard. M2.5x8.
4 Replacement Procedures 4.7 Keyboard Installing the keyboard The following describes the procedure for installing the keyboard (See Figure 4-9 to 4-10). 1. Turn the keyboard upside down and place it on the palm rest as its face down. Connect the keyboard cable to the connector CN3200 on the system board. 2. Install the keyboard support plate and secure it with the following screws. M2.5x8.0B FLAT BIND screw x2 3. Turn the keyboard face up and put it on the computer.
4.8 Bottom cover assembly 4.8 4 Replacement Procedures Bottom cover assembly Removing the bottom cover assembly The following describes the procedure for removing the bottom cover assembly (See Figure 4-11 to 4-14). 1. Remove the following screw securing LCD harness cover and remove the LCD harness cover. M2.5x4.0B FLAT BIND screw x1 2. Disconnect the LCD harness from the connector CN5000 on the system board. 3. Disconnect the RJ45 harness from the connector CN4100 on the system board. 4.
4 Replacement Procedures 4.8 Bottom cover assembly 9. Turn over the computer upside down. 10. Disconnect the speaker cable (L) from the connector CN6002 under the insulator of HDD-2 slot. 11. Disconnect the AV-IN harness from the connector CN5660 in the memory module slot. AV-IN harness CN5660 CN6002 Speaker cable (R) Figure 4-12 Disconnecting the cables 12. Remove the following screws securing the bottom cover assembly. M2.0x4.
4.8 Bottom cover assembly 4 Replacement Procedures “8” “4” or “LH” “8” “16” “8” “16” “8” “16” “16” “6” “8” “16” “8” “6” “8” “8” “8” “6” “16” Figure 4-13 Removing the screws from bottom cover assembly 13. Pulling out the RJ45 harness from the slot, remove the bottom cover assembly.
4 Replacement Procedures 4.8 Bottom cover assembly Installing the bottom cover assembly The following describes the procedure for installing the bottom cover assembly (See Figure 4-11 to 4-14). 1. Passing through the RJ45 harness into the slot, install the bottom cover assembly. CAUTION: Be careful not to catch the harnesses and cables between bottom cover assembly and cover assembly, and in addition, confirm that each harness and cable is set in the right position. 2.
4.8 Bottom cover assembly 4 Replacement Procedures 12. Connect the LCD harness to the connector CN5000 on the system board. 13. Install the LCD harness cover and secure it with the following screw. M2.5x4.
4 Replacement Procedures 4.9 LAN jack 4 4.9 LAN jack Removing the LAN jack The following describes the procedure for removing the LAN jack (See Figure 4-15). 1. Pull up and remove the LAN jack from the bottom cover assembly. LAN jack Figure 4-15 Removing the LAN jack Installing the LAN jack The following describes the procedure for installing the LAN jack (See Figure 4-15). 1. Install the LAN jack by sliding it to the slot of bottom cover assembly.
4.10 Speaker (L) & Modem jack 4 Replacement Procedures 4.10 Speaker (L) & Modem jack Removing the speaker (L) & Modem jack The following describes the procedure for removing the speaker (L) & modem jack (See Figure 4-16). 1. Releasing the AV-IN harness from the guide of bottom cover assembly, disconnect the AV-IN harness from the connector CN9614 on the AV-IN board. 2. Releasing the wound speaker (L) cable from the guide of bottom cover assembly, remove the speaker (L) from the slot. 3.
4 Replacement Procedures 4.10 Speaker (L) & Modem jack Installing the speaker (L) & Modem jack The following describes the procedure for installing speaker (L) & modem jack (See Figure 4-16). 1. Install the modem jack to the bottom cover assembly. 2. Wind the speaker (L) cable to the guide of bottom cove assembly and install the speaker (L) in the slot. 3. Connect the AV-IN harness to the connector CN9614 on the AV-IN board and arrange the harness along the guides.
4.11 AV-IN board 4 Replacement Procedures 4.11 AV-IN board Removing the AV-IN board The following describes the procedure for removing the AV-IN board (See Figure 4-17). 1. Remove the following screw securing the AV-IN board. M2.5x4.0B FLAT BIND screw x1 2. Remove AV-IN board from the bottom cover assembly. M2.5x4.0B FLAT BIND AV-IN board Figure 4-17 Removing the AV-IN board Installing the AV-IN board The following describes the procedure for installing the AV-IN board (See Figure 4-17). 1.
4 Replacement Procedures 4.12 Battery latch assembly 4.12 Battery latch assembly Removing the battery latch assembly The following describes the procedure for removing the battery latch assembly (See Figure 4-18 and 4-19). 1. Remove the following screws securing the battery latch assembly. M2.5x4.0B S-THIN FLAT BIND screw x1 2. Remove the battery latch assembly from the bottom cover assembly. Battery latch assembly M2.0x4.
4.12 Battery latch assembly 4 Replacement Procedures 3. Remove the battery lock from the battery assembly. 4. Releasing the tab, disassembling the battery latch slider from battery latch base. Battery latch slider Spring Battery latch base Battery lock Figure 4-19 Removing the battery lock and battery latch slider Installing the battery latch assembly The following describes the procedure for installing the battery latch assembly (See Figure 418 and 4-19). 1.
4 Replacement Procedures 4.13 Optical disk drive 4.13 Optical disk drive CAUTION: Do not perform 4.13.2 “Ejecting the optical disk” except for the emergency ejection of optical disk inside ODD. 4.13.1 Replacing the optical disk drive Removing the optical disk drive The following describes the procedure for removing the optical disk drive (See Figure 4-20 and 4-21). 1. Remove the following screw securing the ODD assembly. M2.5x4.0B FLAT BIND screw x1 2.
4.13 Optical disk drive 4 Replacement Procedures 4. Remove the following screw securing the ODD side bracket and remove the ODD side bracket. M2.0x3.0C S-THIN FLAT BIND screw x1 5. Remove the following screws securing the ODD rear bracket and ODD relay board. M2.0x4.0B S-THIN FLAT BIND screw x2 6. Remove the ODD relay board and ODD rear bracket from the optical disk drive. ODD relay board ODD side bracket ODD rear bracket M2.0x3.0C S-THIN FLAT BIND M2.0x4.
4 Replacement Procedures 4.13 Optical disk drive 4.13.2 Ejecting the optical disk CAUTION: The following procedure is emergency cope only when the optical disk inside ODD can not be ejected because of some failure. Disassembling the ODD assembly The following describes the procedure for ejecting the optical disk from the optical disk drive (See Figure 4-22). 1. Remove the following screws securing the ODD cover. M1.8x2.0C S-THIN FLAT BIND screw x4 2.
4.13 Optical disk drive 4 Replacement Procedures Assembling the ODD assembly The following describes the procedure for assembling the ODD assembly from the optical disk drive (See Figure 4-22). 1. Install the ODD cover to the ODD base assembly by sliding the hook into the slot of ODD base assembly. 2. Secure the ODD cover with the following screws. M1.8x2.
4 Replacement Procedures 4.14 SJ board / Internal Microphone 4.14 SJ board / Internal Microphone 4.14.1 SJ board Removing the SJ board The following describes the procedure for removing the SJ board (See Figure 4-23). 1. Disconnect the sound jack flat cable from the connector CN9520 on the SD board. 2. Disconnect the internal microphone cable from the connector CN6000 on the SJ board. 3. Remove the following screw and pull out the SJ board from the cover assembly by extracting jacks from the jack holes.
4.14 SJ board / Internal Microphone 4 Replacement Procedures Installing the SJ board The following describes the procedure for installing the SJ board (See Figure 4-23). 1. Connect the sound jack flat cable to the connector CN9530 and the USB harness to the connector CN4622 on the SJ board. 2. Install the SJ board to the cover assembly by sliding jacks into the jack holes of cover assembly and secure it with the following screw. M2.5x4.0B FLAT BIND screw x1 3.
4 Replacement Procedures 4.14 SJ board / Internal Microphone 4.14.2 Internal Microphone Removing the Internal microphone The following describes the procedure for removing the internal microphone (See Figure 424). 1. Remove the following screw securing the internal microphone and remove the internal microphone assembly. M2.5x4.0B FLAT BIND screw x1 2. Pull out the internal microphone from the mic holder. Mic holder M2.5x4.
4.15 Sound board 4.15 4 Replacement Procedures Sound board Removing the sound board The following describes the procedure for removing the sound board (See Figure 4-25). 1. Disconnect the Sound harness from the connector CN9510 on the SD board. 2. Disconnect the Power SW harness from the connector CN9521 on the SD board. 3. Turning up the insulator, remove the following screws securing the SD board and remove the SD board from the cover assembly. M2.5x3.
4 Replacement Procedures 4.15 Sound board Installing the sound board The following describes the procedure for installing the sound board (See Figure 4-25). 1. Install the sound board and secure it with the following screws. M2.5x3.0S FLAT BIND screw x3 2. Connect the Power SW harness to the connector CN9521 on the SD board. 3. Connect the Sound harness to the connector CN9510 on the SD board.
4.16 Power SW board 4.16 4 Replacement Procedures Power SW board Removing the Power SW board The following describes the procedure for removing the Power SW board (See Figure 4-26). 1. Remove the following screw securing the power SW board and pull up the Power SW board from the cover assembly. M2.5x4.0B FLAT BIND screw x1 2. Disconnect the Power SW harness from the connector CN9622 on the Power SW board. Power SW board M2.5x4.
4 Replacement Procedures 4.16 Power SW board Installing the Power SW board The following describes the procedure for installing the Power SW board (See Figure 4-26). 1. Connect the Power SW harness to the connector CN9622 on the Power SW board. 2. Install the Power SW board to the cover assembly and secure it with the following screw. M2.5x4.
4.17 Battery board / RTC battery 4 Replacement Procedures 4.17 Battery board / RTC battery 4.17.1 Battery board Removing the Battery board The following describes the procedure for removing the Battery board (See Figure 4-27). 1. Disconnect the RTC battery cable from the connector CN9990 on the battery board. 2. Remove the following screws securing the battery board. M2.5x4.0B FLAT BIND screw x2 3.
4 Replacement Procedures 4.17 Battery board / RTC battery Installing the battery board The following describes the procedure for installing the battery board (See Figure 4-27). 1. Connect the battery power harness to the connector CN9690 and the battery signal harness to the connector CN9691 on the battery board. 2. Install the battery board to the cover assembly and secure it with the following screws. M2.5x4.0B FLAT BIND screw x2 3.
4.17 Battery board / RTC battery 4 Replacement Procedures 4.17.2 RTC battery Removing the RTC battery The following describes the procedure for removing the RTC battery (See Figure 4-28). 1. Turning up the insulator, pull out the RTC battery from the insulator. RTC battery Insulator Figure 4-28 Removing the RTC battery Installing the RTC battery The following describes the procedure for installing the RTC battery (See Figure 4-28). 1. Turning up the insulator, set the RTC battery into the insulator.
4 Replacement Procedures 4.18 Wireless LAN card 4.18 Wireless LAN card Removing the wireless LAN card The following describes the procedure for removing the wireless LAN card (See Figure 4-29). 1. Disconnect the wireless LAN antenna cables (MAIN & AUX) from the connector on the wireless LAN card. 2. Open the left and right latches and remove a wireless LAN card from the connector CN 2200 of mini PCI slot.
4.19 TV tuner module 4.19 4 Replacement Procedures TV tuner module Removing the TV tuner module The following describes the procedure for removing the TV tuner module (See Figure 4-30). 1. Disconnect the TV antenna harness from the connector PJ601 on the TV tuner module. 2. Disconnect the TV tuner harness from the connector PJ621 on the TV tuner module and CN5661 on the system board. 3. Remove the following screws securing the TV tuner module. M2.0x4.0C BIND screw x2 4.
4 Replacement Procedures 4.19 TV tuner module Installing the TV tuner module The following describes the procedure for installing the TV tuner module (See Figure 4-30). 1. Insert the TV tuner module into the connector CN2220 of the mini PCI slot slantwise and press it to connect firmly. 2. Secure the TV tuner module with the following screws. M2.0x4.0C BIND screw x2 3. Connect the TV tuner harness to the connector PJ621 on the TV tuner module and CN5661 on the system board. 4.
4.20 CPU fan 4.20 4 Replacement Procedures CPU fan Removing the CPU fan The following describes the procedure for removing the CPU fan (See Figure 4-31). 1. Disconnect the CPU fan cable from the connector CN8770 on the system board. 2. Remove the following screws securing the CPU fan and remove the CPU fan. M2.5x4.0B FLAT BIND screw x2 Hook M2.5x4.
4 Replacement Procedures 4.21 CPU fin & CPU 4.21 CPU fin & CPU Removing the CPU fin & CPU The following describes the procedure for removing the CPU fin & CPU (See Figure 4-32 and 4-33). 1. Remove the following screws securing the CPU holder. M2.0x4.0C BIND screw x3 NOTE: When removing the CPU holder, be sure to remove the screws in the reverse order of the number marked on the holder. 2. Remove the CPU holder and CPU fin. CPU holder M2.0x4.0C BIND M2.0x4.
4.21 CPU fin & CPU 4 Replacement Procedures 3. Unlock the CPU by rotating the cam on the CPU socket 180 degrees to the counterclockwise with a flat-blade screwdriver. 4. Remove the CPU. Cam Figure 4-33 Removing the CPU Installing the CPU fin & CPU The following describes the procedure for installing the CPU fin & CPU (See Figure 4-32 to 4-34). 1. Check that the mark of cam is in the unlocking position. 2. Attach the CPU to the correct position in the CPU socket. 3.
4 Replacement Procedures 4.21 CPU fin & CPU NOTE: Apply the silicon grease enough to cover the chip surface using the special applicator. Figure 4-34 Applying silicon grease 5. Install the CPU fin and CPU holder and secure them with the following screws. M2.0x4.0C BIND screw x3 NOTE: When securing the CPU holder, be sure to secure the screws in the order of the number marked on the holder.
4.22 VGA fan & VGA fin 4 Replacement Procedures 4.22 VGA fan & VGA fin Removing the VGA fan & VGA fin The following describes the procedure for removing the VGA fan & VGA fin (See Figure 435). 1. Peeling off the glass tape, disconnect the VGA fan cable from the connector CN8780 on the system board. 2. Remove the following screws securing the VGA fan and remove the VGA fan. M2.5x4.0B FLAT BIND screw x2 3. Remove the following screws securing the VGA fin and remove the VGA fin. M2.0x3.
4 Replacement Procedures 4.22 VGA fan & VGA fin Installing the VGA fan & VGA fin The following describes the procedure for installing the VGA fan & VGA fin (See Figure 435). 1. Install the VGA fin. NOTE: For details on applying the silicon grease, refer to “Installing the CPU”. 2. Secure the VGA fin with the following screws. M2.0x3.0S S-THIN FLAT BIND screw x2 3. Install the VGA fan and secure it with the following screws. M2.5x4.0B FLAT BIND screw x2 4.
4.23 GMCH heat sink 4 Replacement Procedures 4.23 GMCH heat sink Removing the GMCH heat sink The following describes the procedure for removing the GMCH heat sink (See Figure 4-36). 1. Remove the following screws securing the GMCH heat sink. M2.0x3.0S S-THIN FLAT BIND screw x2 2. Remove the GMCH heat sink. M2.0x3.
4 Replacement Procedures 4.24 Speaker (R) 4.24 Speaker (R) Removing the speaker (R) The following describes the procedure for removing the speaker (R) (See Figure 4-37). 1. Pull out the DC-IN jack from the guide of cover assembly. 2. Draw the speaker (R) from the slot of cover assembly. 3. Disconnect the speaker (R) cable from the connector CN6003 on the system board.
4.25 TV antenna board 4 Replacement Procedures 4.25 TV antenna board Removing the TV antenna board The following describes the procedure for removing the TV antenna board (See Figure 4-38). 1. Remove the following screw securing the TV antenna board. M2.5x4.0B FLAT BIND screw x1 2. Slightly pulling up the TV antenna board, disconnect the TV antenna harness from the connector CN9611 on the TV antenna board. M2.5x4.
4 Replacement Procedures 4.26 System board 4.26 System board CAUTION: 1. When handling the system board, always hold by the edges. Do not touch the printed circuit face. 2. If replacing with a new system board, execute the subtest01 Initial configuration in section 3.3 “Setting of the hardware configuration”. Also update with the latest BIOS and EC/KBC as described in Appendix G and in Appendix H.
4.26 System board 4 Replacement Procedures Installing the system board The following describes the procedure for installing the system board (See Figure 4-39). 1. Connect the USB harness to the connector CN4611. 2. Connect the ODD flat cable to the connector CN1810. 3. Connect the SD board flat cable to the connector CN9500. 4. Connect the battery signal harness to the connector CN8811. 5. Connect the battery power harness to the connector CN8020. 6. Install the system board to the cover assembly.
4 Replacement Procedures 4.27 PC card slot 4.27 PC card slot Removing the PC card slot The following describes the procedure for removing the PC card slot (See Figure 4-40). 1. Remove the following screws securing the PC card slot. M2.0x3.0B S-THIN FLAT BIND screw x2 M2.0x8.0B BIND screw x2 2. Pull up the PC card slot straight and remove it from the connector CN2110 on the system board. PC card slot CN2110 M2.0x3.0B S-THIN FLAT BIND Figure 4-40 QOSMIO G20 Maintenance Manual (960-511) M2.0x8.
4.27 PC card slot 4 Replacement Procedures Installing the PC card slot The following describes the procedure for installing the PC card slot (See Figure 4-40). 1. Insert the terminal of the PC card slot into the connector CN2110 on the system board. 2. Secure the PC card slot with the following screws. 4-64 M2.0x3.0B S-THIN FLAT BIND screw x2 M2.0x8.
4 Replacement Procedures 4.28 Bluetooth module 4 4.28 Bluetooth module Removing the bluetooth module The following describes the procedure for removing the bluetooth module (See Figure 4-41). 1. Turning up the insulator, disconnect the bluetooth antenna cable from the connector on the bluetooth module. 2. Disconnect the bluetooth flat cable from the connector on the bluetooth module. 3. Remove the following screw securing the bluetooth module and remove the bluetooth module. M2.0x3.
4.28 Bluetooth module 4 Replacement Procedures Installing the bluetooth module The following describes the procedure for installing the bluetooth module (See Figure 4-41). 1. Install the bluetooth module and secure it with the following screw. M2.0x3.0C S-THIN FLAT BIND screw x1 2. Connect the bluetooth flat cable to the connector on the bluetooth module. 3. Connect the bluetooth antenna cable from the connector on the bluetooth module. 4. Cover the bluetooth module slot with the insulator.
4 Replacement Procedures 4.29 Volume sensor board 4.29 Volume sensor board Removing the volume sensor board The following describes the procedure for removing the volume sensor board (See Figure 442). 1. Remove the following screws securing the volume sensor holder and remove the volume sensor holder. M2.5x2.8B FLAT BIND screw x2 2. Draw the volume harness from the guide of cover assembly and remove the volume sensor board from the cover assembly. M2.5x2.
4.30 Touch sensor board 4.30 4 Replacement Procedures Touch sensor board Removing the touch sensor board The following describes the procedure for removing touch sensor (See Figure 4-43). 1. Disconnect the touch sensor flat cable from the connector on the touch sensor board. 2. Peeling off the insulator, remove the following screws securing the touch sensor plate and remove the touch sensor plate. M2.5x4.0B FLAT BIND screw x9 3. Pull up and remove the touch sensor board from the cover assembly.
4 Replacement Procedures 4.30 Touch sensor board Installing the touch sensor board The following describes the procedure for installing touch sensor (See Figure 4-43). 1. Peel off the double-sided tape from the touch sensor board and stick the touch sensor board to the cover assembly. CAUTION: When sticking the touch sensor board, check the followings. 1. The touch sensor board once removed from the computer is not reusable. When installing the touch sensor board, be sure to use a new one. 2.
4.31 Touch pad 4.31 4 Replacement Procedures Touch pad Removing the touch pad The following describes the procedure for removing the touch pad (See Figure 4-44). 1. Peel off the glass tape and disconnect the touch pad flat cable from the connector on the touch pad. 2. Remove the following screws securing the touch pad plate. M2.0x4.0C BIND screw x3 3. Turning up the insulator, remove the touch pad plate. 4. Peel off and remove the touch pad from the cover assembly. M2.0x4.
4 Replacement Procedures 4.31 Touch pad Installing the touch pad The following describes the procedure for installing the touch pad (See Figure 4-44). 1. Peel off the separator covering on the sensor portion of a new touch pad. NOTE: Do not reuse the touch pad so that it can not be used after peeling off from the computer. Be sure to stick a new touch pad. When installing the touch pad, be careful not to get the bubbles under the touch pad. 2. Stick and install the touch pad on the cover assembly. 3.
4.32 Latch assembly 4.32 4 Replacement Procedures Latch assembly Removing the latch assembly The following describes the procedure for removing the latch assembly (See Figure 4-45). 1. Remove the following screws securing the latch assembly. M2.5x4.0B FLAT BIND screw x2 2. Pull up and remove the latch assembly. 3. Releasing hooks of latch assembly, disassemble the latch slider and spring. M2.5x4.
4 Replacement Procedures 4.32 Latch assembly Installing the latch assembly The following describes the procedure for installing the latch assembly (See Figure 4-45). 1. Assembling the spring and latch slider, fit the hooks of latch slider into the latch assembly. 2. Install the latch assembly to the cover assembly and secure it with the following screws. M2.5x4.
4.33 LCD unit / FL inverter 4 Replacement Procedures 4.33 LCD unit / FL inverter CAUTION: When replacing a LCD, it is required that SVP parameter is set. Update with the latest EC/KBC as described in Appendix H “EC/KBC Rewrite Procedures”. Removing the LCD unit / FL inverter The following describes the procedure for removing the LCD unit and FL inverter (See Figure 4-46 to 4-49). 1. Removing the mask seal and mask pad, remove the following screws securing the LCD mask. M2.5x8.
4 Replacement Procedures 4.33 LCD unit / FL inverter 3. Remove the following screw securing the FL inverter. M2.0x4.0C BIND screw x1 4. Peel off the insulator adhered to the FL inverter. 5. Disconnect the LCD harnesses from the connectors CN1 and CN2 on the FL inverter. 6. Disconnect the HV harnesses from the connectors CN3 and CN4 on the FL inverter. 7. Remove the FL inverter from the display assembly. CN2 CN1 FL inverter M2.0x4.
4.33 LCD unit / FL inverter 4 Replacement Procedures 8. Remove the following screws securing the LCD unit. M2.0x4.0C BIND screw x4 9. With the bottom edge of the LCD unit on the display cover, lift only the top edge of the LCD unit. After peeling off the copper tape, disconnect the LCD harness from the connector on the back of the LCD. 10. Remove the LCD unit. Copper tape LCD harness M2.0x4.
4 Replacement Procedures 4.33 LCD unit / FL inverter 11. Remove the following screws securing the LCD support and remove the LCD supports from the LCD unit. M2.0x3.0C S-THIN FLAT BIND screw x4 M2.0x3.0C SUPER THIN HEAD LCD support M2.0x3.
4.33 LCD unit / FL inverter 4 Replacement Procedures Installing the LCD unit/FL Inverter The following describes the procedure for installing the LCD unit and FL inverter (See Figure 4-46 to 4-49). 1. Install the LCD support to the LCD and secure them with the following screws. M2.0x3.0C S-THIN FLAT BIND screw x4 2. Stand the LCD unit on the display cover and connect the LCD harness to the connector on the back of LCD. 3. Stick the copper tape on the connector of LCD harness. 4.
4 Replacement Procedures 4.34 4.34 LCD harness LCD harness Removing the LCD harness The following describes the procedure for removing LCD harness (See Figure 4-50 to 4-52). 1. Remove the following screw securing the LCD harness holder (cover assembly side) and remove the LCD harness holder from the cover assembly. M2.5x4.0B FLAT BIND screw x1 2. Remove the following screw securing the hinge cap (L) and remove the hinge rear cap (L) from the display assembly. M2.0x4.0B FLAT BIND screw x1 M2.
4.34 LCD harness 4 Replacement Procedures 3. Remove the hinge front cap (L) from the display assembly. 4. Remove the following screw securing the LCD harness holder (display rear cover side) and remove the LCD harness holder from the display rear cover. M2.5x4.0B FLAT BIND screw x1 M2.5x4.0B FLAT BIND Hinge front cap (L) LCD harness holder Figure 4-51 Removing the LCD harness holder 5. Remove the LCD harness from the slot of display assembly.
4 Replacement Procedures 4.34 LCD harness Installing the LCD harness The following describes the procedure for installing the LCD harness (See Figure 4-50 and 452). 1. Arrange the LCD harness by putting the harness through the slot of display assembly. 2. Install the LCD harness holder (display rear cover side) to the display rear cover and secure it with the following screw. M2.5x4.0B FLAT BIND screw x1 3.
4.35 Wireless antennas 4.35 4 Replacement Procedures Wireless antennas Removing the wireless antennas The following describes the procedure for removing the wireless antennas (See Figure 4-53 and 4-54). 1. Remove the following screw securing the hinge cap (R) and remove the hinge rear cap (R) from the display assembly. M2.0x4.0B FLAT BIND screw x1 M2.0x4.
4 Replacement Procedures 4.35 Wireless antennas 2. Remove the hinge front cap (R) from the display assembly. 3. Peel off the acetate tapes fixing the wireless antenna cables. 4. Peeling off the wireless LAN antennas and bluetooth antenna from the display rear cover, remove the wireless antennas from the display assembly.
4.35 Wireless antennas 4 Replacement Procedures Installing the wireless antennas The following describes the procedure for installing the wireless antennas (See Figure 4-53 and 4-54). 1. Stick the wireless LAN antennas and bluetooth antenna on the display rear cover. 2. Arrange the wireless LAN antenna cables and bluetooth antenna cable on the display rear cover and fix them with acetate tapes. 3.
4 Replacement Procedures 4.36 4.36 Display latch hook Display latch hook Removing the display latch hook The following describes the procedure for removing the display latch hook (See Figure 4-55). 1. Remove the following screws securing the display latch hook. M2.5x6.0C PSP TIGHT screw x2 2. Pull up and remove the display latch hook from the display rear cover. M2.5x6.
4.37 Display rear cover 4.37 4 Replacement Procedures Display rear cover Removing the display rear cover The following describes the procedure for removing the display rear cover (See Figure 4-56). 1. Remove the following screws securing the display rear cover. M2.5x4.0B 2. FLAT BIND screw x4 Remove the display rear cover from the cover assembly. M2.5x4.0B FLAT BIND Display rear cover M2.5x4.
4 Replacement Procedures 4.38 4.38 Hinge Hinge Removing the hinge The following describes the procedure for removing the hinge (See Figure 4-57). 1. Remove the following screws securing the hinge (L) and remove the hinge (L). M2.5x6.0C 2. PSP TIGHT screw x2 Remove the following screws securing the hinge (R) and remove the hinge (R). M2.5x6.0B FLAT BIND screw M2.5x6.0B FLAT BIND x2 Hinge (R) M2.5x6.
4.38 Hinge 4 Replacement Procedures Installing the hinge The following describes the procedure for installing the hinge (See Figure 4-57). 1. Install the hinge (R) to the cover assembly and secure it with the following screws. M2.5x6.0B FLAT BIND screw x2 2. Install the hinge (L) to the cover assembly and secure it with the following screws. M2.5x6.
Appendices [CONFIDENTIAL]
App-ii [CONFIDENTIAL] QOSMIO G20 Maintenance Manual (960-511)
Appendix Contents Appendix A Handling the LCD Module......................................................................... A-1 Appendix B Board Layout............................................................................................... B-1 B.1 System Board Front View............................................................................. B-1 B.2 System Board Back View ............................................................................. B-3 B.3 BT Board........................
C.13 IS2101 MEDIA BRIDGE I/F connector (42-pin) ................................... C-13 C.14 CN2200 Wireless LAN card I/F connector (124-pin) ............................... C-14 C.15 CN2220 WW Tuner I/F connector (124-pin) ............................................ C-16 C.16 CN4100 Network I/F connector (14-pin) .................................................. C-18 C.17 CN4200 1394 I/F connector (4-pin) .......................................................... C-18 C.
C.41 CN9614 System board I/F connector (10-pin)........................................... C-32 C.42 J9612 C.43 CN9613 S-video IN I/F connector (4-pin)................................................. C-32 Composite-in connector (5-pin) .................................................. C-32 Antenna jack board (FNN2A*) C.44 J9610 TV antenna connector (4-pin) ..................................................... C-33 C.45 CN9611 Coaxial connector (4-pin)............................................
Appendix F Wiring Diagrams..........................................................................................F-1 F.1 RGB Monitor ID Wraparound Connector ..................................................... F-1 F.2 LAN loopbak Connector................................................................................ F-1 Appendix G BIOS Rewrite Procedures .......................................................................... G-1 Appendix H EC/KBC Rewrite Procedures .............................
Figures Figure B-1 System board layout (front) .......................................................................... B-1 Figure B-2 System board layout (back) .......................................................................... B-3 Figure B-3 BT board layout ............................................................................................ B-5 Figure B-4 SD board layout ............................................................................................
Tables Table B-1 System board ICs and connectors (front)...................................................... B-2 Table B-2 System board ICs and connectors (back)...................................................... B-4 Table B-3 BT board connectors .................................................................................... B-5 Table B-4 SD board connectors ..................................................................................... B-6 Table B-5 SJ board connectors ............
Table C-21 D-video I/F connector (14-pin)................................................................... C-20 Table C-22 Speaker (Right) connector (2-pin) .............................................................. C-21 Table C-23 Volume I/F connector (3-pin) ..................................................................... C-21 Table C-24 Touch sensor I/F connector (10-pin)........................................................... C-21 Table C-25 Debug port (4-pin) ....................
Sound jack board (FNN2J*) Table C-46 System board I/F connector (8-pin) ............................................................ C-34 Table C-47 USB I/F connector Port 4 (4-pin)................................................................ C-34 Table C-48 USB I/F connector Port 6 (4-pin)................................................................ C-34 Table C-49 Internal microphone connector (2-pin) .......................................................
Table J-7 Items set in View Drive Info. ........................................................................J-23 Table J-8 Function of option and key ............................................................................J-24 Table J-9 Content of Drive Log display ........................................................................J-26 Table J-10 Content of View Drive Log menu .................................................................
Appendix A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4. If water or other liquid is left on the panel’s surface for a long period, it can change the screen’s tint or stain it.
Appendix A Handling the LCD Module 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
Appendix A Handling the LCD Module 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxide). These materials can release gas that can damage the panel’s polarization.
Appendix A Handling the LCD Module A-6 [CONFIDENTIAL] QOSMIO G20 Maintenance Manual (960-511)
Appendix B Appendix B Board Layout B.
B.
Appendix B Board Layout B.2 B.
B.
Appendix B Board Layout B.3 B.
B.4 SD board B.
Appendix B Board Layout QOSMIO G20 Maintenance Manual (960-511) B.
B.5 SJ board B.
Appendix B Board Layout B.6 B.
B.7 Power SW board B.
Appendix B Board Layout B.8 B.
B.9 TV antenna board B.
Appendix B Board Layout QOSMIO G20 Maintenance Manual (960-511) B.
Appendix C Appendix C Pin Assignment System Board (FNN2S*) C.1 CN1410 Memory Connector 0 (200-pin) Table C-1 Memory connector 0 (200-pin) (1/3) PIN No. Signal name I/O PIN No.
C.1 CN1410 Memory Connector 0 (200-pin) Appendix C Pin Assignment Table C-1 Memory connector 0 (200-pin) (2/3) PIN No. C-2 Signal name I/O PIN No. Signal name I/O 64 BDQ25-B1P I/O 63 BDQ28-B1P 65 GND - 66 GND 67 BDM3-B1P I 68 BDQS3-B1N I/O 69 N.C. - 70 BDQS3-B1P I/O 71 GND - 72 GND 73 BDQ26-B1P I/O 74 BDQ29-B1P I/O 75 BDQ27-B1P I/O 76 BDQ31-B1P I/O 77 GND - 78 GND - 79 MCKE2-B1P I 80 MCKE3-B1P I 81 1R8-B1V I 82 1R8-B1V I 83 N.C. - 84 N.
Appendix C Pin Assignment C.1 CN1410 Memory Connector 0 (200-pin) Table C-1 Memory connector 0 (200-pin) (3/3) PIN No. Signal name I/O PIN No.
C.2 CN1400 Memory connector 1 (200-pin) C.2 Appendix C Pin Assignment CN1400 Memory connector 1 (200-pin) Table C-2 Memory connector 1 (200-pin) (1/3) PIN No. C-4 Signal name I/O PIN No.
Appendix C Pin Assignment C.2 CN1400 Memory connector 1 (200-pin) Table C-2 Memory connector 1 (200-pin) (2/3) PIN No. Signal name I/O PIN No. Signal name I/O 64 ADQ28-B1P I/O 63 ADQ25-B1P 65 GND - 66 GND 67 BDM3-B1P I 68 ADQS3-B1N I/O 69 N.C. - 70 ADQS3-B1P I/O 71 GND - 72 GND 73 ADQ27-B1P I/O 74 ADQ30-B1P I/O 75 ADQ26-B1P I/O 76 ADQ31-B1P I/O 77 GND - 78 GND - 79 MCKE0-B1P I 80 MCKE1-B1P I 81 1R8-B1V I 82 1R8-B1V I 83 N.C. - 84 N.
C.2 CN1400 Memory connector 1 (200-pin) Appendix C Pin Assignment Table C-2 Memory connector 1 (200-pin) (3/3) PIN No. C-6 Signal name I/O PIN No.
Appendix C Pin Assignment C.3 C.3 CN1850 1st HDD I/F connector (22-pin) CN1850 1st HDD I/F connector (22-pin) Table C-3 1st HDD I/F connector (22-pin) PIN No. C.4 Signal name I/O PIN No. Signal name I/O S1 GND - S2 SATAT0-P3P I S3 SATAT0-P3N I S4 GND - S5 SATAR0-P3N I S6 SATAR0-P3P I S7 GND - P1 P3V I P2 P3V I P3 P3V I P4 GND - P5 GND - P6 GND - P7 P5V I P8 P5V I P9 P5V I P10 GND - P11 GND - P12 GND - P13 N.C. - P14 N.C. - P15 N.C.
C.5 CN2100 PC card I/F connector (150-pin) C.5 Appendix C Pin Assignment CN2100 PC card I/F connector (150-pin) Table C-5 PC card I/F connector (150-pin) (1/3) PIN No. C-8 Signal name I/O PIN No. Signal name I/O - 2 GND I/O 4 USBP3-S3P I/O 1 GND 3 USBP3-S3N 5 GND - 6 CPUSB-E3N O 7 N.C (Reserve) - 8 N.C (Reserve) - 9 GND - 10 N.
Appendix C Pin Assignment C.5 CN2100 PC card I/F connector (150-pin) Table C-5 PC card I/F connector (150-pin) (2/3) PIN No. Signal name I/O PIN No. Signal name I/O 61 N.C - 62 N.C - 63 N.C - 64 N.C - 65 N.C - 66 N.C - 67 GND - 68 N.C - 69 N.C - 70 N.C - 71 N.C - 72 N.C - 73 N.
C.5 CN2100 PC card I/F connector (150-pin) Appendix C Pin Assignment Table C-5 PC card I/F connector (150-pin) (3/3) PIN No. C-10 Signal name I/O PIN No.
Appendix C Pin Assignment C.6 C.6 CN3200 Keyboard I/F connector (34-pin) CN3200 Keyboard I/F connector (34-pin) Table C-6 Keyboard I/F connector (34-pin) PIN No. C.7 Signal name I/O PIN No.
C.8 CN8770 CPU FAN connector (3-pin) C.8 Appendix C Pin Assignment CN8770 CPU FAN connector (3-pin) Table C-8 CPU FAN connector (3-pin) PIN No. C.9 Signal name I/O PIN No. 2 1 FAN VCC - 3 FANG0-P3P I Signal name GND I/O - CN8780 VGA FAN connector (3-pin) Table C-9 VGA FAN connector (3-pin) PIN No. Signal name I/O PIN No. 2 1 FAN VCC - 3 FANG1-P3P I Signal name GND I/O - C.10 CN4610 USB I/F connector Port 0/Port 2 (8-pin) Table C-10 USB I/F connector Port 0/Port 2 (8-pin) PIN No.
Appendix C Pin Assignment C.12 CN8800 DC IN connector (4-pin) C.12 CN8800 DC IN connector (4-pin) Table C-12 DC IN connector (4-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 PVL POWER O 2 PVL POWER O 3 GND - 4 GND - C.13 IS2101 MEDIA BRIDGE I/F connector (42-pin) Table C-13 MEDIA BRIDGE I/F connector (42-pin) PIN No. Signal name I/O PIN No.
C.14 CN2200 Wireless LAN card I/F connector (124-pin) Appendix C Pin Assignment C.14 CN2200 Wireless LAN card I/F connector (124-pin) Table C-14 Wireless LAN card I/F connector (124-pin) (1/2) PIN No. C-14 Signal name I/O PIN No. Signal name I/O 1 N.C. - 2 N.C. - 3 N.C. - 4 N.C. - 5 N.C. - 6 N.C. - 7 N.C. - 8 N.C. - 9 N.C. - 10 N.C. - 11 N.C. - 12 N.C. - 13 WLON-S3N I 14 N.C. - 15 GND - 16 N.C.
Appendix C Pin Assignment C.14 CN2200 Wireless LAN card I/F connector (124-pin) Table C-14 Wireless LAN card connector (124-pin) (2/2) PIN No. Signal name I/O PIN No.
C.15 CN2220 WW Tuner I/F connector (124-pin) Appendix C Pin Assignment C.15 CN2220 WW Tuner I/F connector (124-pin) Table C-15 WW Tuner I/F connector (124-pin) (1/2) PIN No. C-16 Signal name I/O PIN No. Signal name I/O 1 N.C. - 2 N.C. - 3 N.C. - 4 N.C. - 5 N.C. - 6 N.C. - 7 N.C. - 8 N.C. - 9 GND - 10 GND - 11 N.C. - 12 N.C. - 13 N.C. - 14 N.C. - 15 GND - 16 N.C. - 17 N.C. - 18 T-P5V I 19 P3V - 20 PIRQD-P3N 21 N.C. - 22 N.C.
Appendix C Pin Assignment C.15 CN2220 WW Tuner I/F connector (124-pin) Table C-15 WW Tuner I/F connector (124-pin) (2/2) PIN No. Signal name I/O PIN No.
C.16 CN4100 Network I/F connector (14-pin) Appendix C Pin Assignment C.16 CN4100 Network I/F connector (14-pin) Table C-16 Network I/F connector (14-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 GND - 2 GND - 3 GND - 4 GND - 5 TDP-P3P I 6 TDN-P3N I 7 RDP-P3P I 8 RDN-P3N I/O 9 N.C. - 10 N.C. - 11 P3V I 12 P3V I 13 LNK-P3N I/O 14 ACT-P3N I/O C.17 CN4200 1394 I/F connector (4-pin) Table C-17 1394 I/F connector (4-pin) PIN No.
Appendix C Pin Assignment C.18 CN5000 LCD I/F connector (41-pin) C.18 CN5000 LCD I/F connector (41-pin) Table C-18 LCD I/F connector (41-pin) PIN No. Signal name I/O PIN No.
C.19 CN5080 CRT I/F connector (15-pin) Appendix C Pin Assignment C.19 CN5080 CRT I/F connector (15-pin) Table C-19 CRT I/F connector (15-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 NVARED-PXP I 2 NVAGRN-PXP I 3 NVABLU-PXP I 4 N.C - 5 GND - 6 GND - 7 GND - 8 GND - 9 DDC-P5V I 10 GND - 11 N.C - 12 NVASDA-P5P I/O 13 (AHSYNC-P3P) I/O 14 (AVSYNC-P3P) I/O 15 NVASCL-P5P I/O C.
Appendix C Pin Assignment C.22 CN6003 Speaker (Right) connector (2-pin) C.22 CN6003 Speaker (Right) connector (2-pin) Table C-22 Speaker (Right) connector (2-pin) PIN No. 1 Signal name SPOTR-PXN I/O PIN No. O 2 Signal name SPOTR-PXP I/O I/O C.23 CN3330 Volume I/F connector (3-pin) Table C-23 Volume I/F connector (3-pin) PIN No. Signal name I/O PIN No. 1 ROTENA-S3N O 2 3 ROTENB-S3N O Signal name GND I/O - C.
C.26 CN4400 Bluetooth I/F connector (20-pin) Appendix C Pin Assignment C.26 CN4400 Bluetooth I/F connector (20-pin) Table C-26 Bluetooth I/F connector (20-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 GND - 2 N.C. - 3 BTMDL-P3N O 4 N.C. - 5 N.C. - 6 N.C. - 7 N.C. - 8 BTRST-S3N I 9 N.C. - 10 N.C. - 11 GND - 12 N.C. - 13 GND - 14 WCHCLK-P3P O 15 N.C. - 16 USBP1-S3P I/O 17 USBP1-S3N I/O 18 WCHDAT-P3P I 19 N.C. - 20 BT-P3V I C.
Appendix C Pin Assignment C.29 CN8020 Battery (Power) I/F connector (6-pin) C.29 CN8020 Battery (Power) I/F connector (6-pin) Table C-29 Battery (Power) I/F connector (6-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 GND - 2 GND - 3 GND - 4 PVBH1 O 5 PVBH1 O 6 PVBH1 O C.30 CN8811 Battery (Signal) I/F connector (15-pin) Table C-30 Battery (Signal) I/F connector (15-pin) PIN No. Signal name I/O PIN No.
C.31 CN1810 ODD relay board (FNN2D*) I/F connector (50-pin) Assignment Appendix C Pin C.31 CN1810 ODD relay board (FNN2D*) I/F connector (50-pin) Table C-31 PIN No. C-24 ODD relay board (FNN2D*) I/F connector (50-pin) Signal name I/O PIN No.
Appendix C Pin Assignment pin) C.32 CN9500 Sound board (FNN2N*) I/F connector (57- C.32 CN9500 Sound board (FNN2N*) I/F connector (57-pin) Table C-32 Sound board (FNN2N*) I/F connector (57-pin) PIN No. Signal name I/O PIN No.
C.33 CN5660 AV-IN board (FNN2V*) I/F connector (10-pin) Assignment Appendix C Pin C.33 CN5660 AV-IN board (FNN2V*) I/F connector (10-pin) Table C-33 AV-IN board (FNN2V*) I/F connector (10-pin) PIN No. C-26 Signal name I/O PIN No.
Appendix C Pin Assignment C.34 CN1820 CD-ROM I/F connector (50-pin) ODD relay board (FNN2D*) C.34 CN1820 CD-ROM I/F connector (50-pin) Table C-34 CD-ROM I/F connector (50-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 AUDL-PXP I 2 AUDR-PXP I 3 AUD-GND - 4 N.C.
C.35 CN9680 System board I/F connector (50-pin) Appendix C Pin Assignment C.35 CN9680 System board I/F connector (50-pin) Table C-35 System board I/F connector (50-pin) PIN No. C-28 Signal name I/O PIN No.
Appendix C Pin Assignment C.36 CN3000 MDC I/F connector (30-pin) Sound board (FNN2N*) C.36 CN3000 MDC I/F connector (30-pin) Table C-36 MDC I/F connector (30-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 N.C - 2 GND - 3 GND - 4 N.C - 5 N.C - 6 N.C - 7 N.C - 8 GND - 9 N.C - 10 N.C - 11 N.C - 12 N.C - 13 N.C - 14 N.C - 15 GND - 16 E3V I 17 E3V I 18 N.C - 19 GND - 20 GND - 21 N.C - 22 M97SY2-P3P O 23 M97OT2-P3P I 24 N.
C.38 CN9510 System board I/F connector (57-pin) Appendix C Pin Assignment C.38 CN9510 System board I/F connector (57-pin) Table C-38 System board I/F connector (57-pin) PIN No. C-30 Signal name I/O PIN No.
Appendix C Pin Assignment C.39 CN9520 Sound jack board I/F connector (20-pin) C.39 CN9520 Sound jack board I/F connector (20-pin) Table C-39 Sound jack board I/F connector (20-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 GND - 2 GND - 3 BTSWON-S3P I 4 S3V I 5 N.C.
C.41 CN9614 System board I/F connector (10-pin) Appendix C Pin Assignment AV-IN board (FNN2V*) C.41 CN9614 System board I/F connector (10-pin) Table C-41 System board I/F connector (10-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 SND-P5V O 2 (LINR-PXP) I/O 3 A-GND - 4 (LINL-PXP) I/O 5 TV-GND - 6 COMPIN-PXP I/O 7 TV-GND - 8 CROMIN-PXP I/O 9 TV-GND - 10 LUMAIN-PXP I/O C.42 J9612 Composite-in connector (5-pin) Table C-42 Composite-in connector (5-pin) PIN No.
Appendix C Pin Assignment C.44 J9610 TV antenna connector (4-pin) Antenna jack board (FNN2A*) C.44 J9610 TV antenna connector (4-pin) Table C-44 TV antenna connector (4-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 (CN9611-3) I/O 2 (CN9611-1) I/O 3 (CN9611-2) I/O 4 (CN9611-4) I/O C.45 CN9611 Coaxial connector (4-pin) Table C-45 Coaxial connector (4-pin) PIN No. Signal name I/O PIN No.
C.46 CN4622 System board I/F connector (8-pin) Appendix C Pin Assignment Sound jack board (FNN2J*) C.46 CN4622 System board I/F connector (8-pin) Table C-46 System board I/F connector (8-pin) PIN No. Signal name I/O PIN No. Signal name I/O - 2 (CN4620-3) I/O 1 GND 3 (CN4620-2) I/O 4 (CN4620-1) I/O 5 (CN4620-1) I/O 6 (CN4621-3) I/O 7 (CN4622-3) I/O 8 GND - C.47 CN4620 USB I/F connector Port 4 (4-pin) Table C-47 USB I/F connector Port 4 (4-pin) PIN No.
Appendix C Pin Assignment C.50 J6001 External microphone I/F connector (6-pin) C.50 J6001 External microphone I/F connector (6-pin) Table C-50 External microphone I/F connector (6-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 A-GND - 2 (MICIN-PXP) O 3 (BIAS) O 4 N.C. - 5 N.C. - 6 (VREF1-P2V) O C.51 DS6000 Headphone/SPDIF connector (10-pin) Table C-51 Headphone/SPDIF connector (10-pin) PIN No. Signal name I/O PIN No.
C.53 CN9690 System board (Power) I/F connector (6-pin) Appendix C Pin Assignment Battery board (FNN2B*) C.53 CN9690 System board (Power) I/F connector (6-pin) Table C-53 System board (Power) I/F connector (6-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 PVBL1-BAT I/O 2 PVBL1-BAT I/O 3 PVBL1-BAT I/O 4 BATGND1 I/O 5 BATGND1 I/O 6 BATGND1 I/O C.54 CN9691 System board (Signal) I/F connector (15-pin) Table C-54 System board (Signal) I/F connector (15-pin) PIN No.
Appendix C Pin Assignment C.56 CN9990 RTC battery connector (3-pin) C.56 CN9990 RTC battery connector (3-pin) Table C-56 PIN No. Signal name RTC battery connector (3-pin) I/O PIN No. 2 1 (CN9691-7) O 3 GND - QOSMIO G20 Maintenance Manual (960-511) Signal name N.
C.57 CN9622 Sound board (FNN2N*) I/F connector (4-pin) Appendix C Pin Assignment Power switch board (FNN2P*) C.57 CN9622 Sound board (FNN2N*) I/F connector (4-pin) Table C-57 Sound board (FNN2N*) I/F connector (4-pin) PIN No. C-38 Signal name I/O PIN No.
Appendix. D Appendix D Display Codes D.1 Display Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap No.
D.1 Display Codes Appendix. D Display codes Table D-1 Scan codes (set 1 and set 2) (2/4) D-2 Cap No.
Appendix. D Display codes D.1 Display Codes Table D-1 Scan codes (set 1 and set 2) (3/4) Cap No.
D.1 Display Codes Appendix. D Display codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap No. Keytop Code set 1 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 126 Pause *7 *7 *7 *7 *7 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Make Code set 2 Break Make Note Break Notes: 1. 2. 3. 4. 5. 6. 7. D-4 * * * * * * * Scan codes differ by mode.
Appendix. D Display codes D.1 Display Codes Table D-2 Scan codes with left Shift key Cap Key Code set 1 No.
D.1 Display Codes Appendix. D Display codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
Appendix. D Display codes D.1 Display Codes Table D-5 Scan codes in overlay mode Cap No.
D.1 Display Codes Appendix. D Display codes Table D-7 No.126 key scan code Key top Pause Shift Code set 1 Code set 2 Make Make Common* E1 1D 45 E1 Ctrl* E0 C6 E0 46 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E 14 F0 77 *: This key generates only make codes.
Appendix E Key Layout Appendix E E.1 Key Layout United States (US) Keyboard Figure E-1 US Keyboard layout E.
E.
Appendix F Appendix F F.1 Wiring Diagrams RGB Monitor ID Wraparound connector (1) RED RED (2) GREEN GREEN (2) (3) BLUE BLUE (3) (4) NC NC (4) (5) GND GND (5) (6) GND GND (6) (7) GND GND (7) (8) GND GND (8) (9) 5V 5V (9) (10) GND GND (10) (11) NC NC (11) (12) SDA SDA (12) (13) HSYNC HSYNC (13) (14) VSYNC (15) SDL VSYNC (14) SCL (1) (15) Figure F-1 RGB Monitor ID Wraparound connector (15PIN to 15PIN) F.
F.
Appendix G Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk Rewriting the BIOS 1. Set the system to boot mode. 2. Turn off the power to the computer. 3. Remove the external cables and cards. 4. Connect an external FDD and insert the BIOS rewriting disk into the external FDD. 5. Turn on the power while holding down the tilde character key.
Appendix G BIOS Rewrite Procedures G-2 [CONFIDENTIAL] QOSMIO G20 Maintenance Manual (960-511)
Appendix H Appendix H EC/KBC Rewrite Procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. It is necessary to rewrite the EC/KBC system program when the following changes are made. 1. Replacing of system board 2. Replacing of LCD Tools To rewrite the EC/KBC, you need the following tool: EC/KBC rewriting disk for the computer Rewriting the EC/KBC NOTE: 1. Rewrite the EC/KBS only when instructed by a diagnostic disk release notice. 2.
Appendix H EC/KBC Rewrite Procedures 4. Connect an external FDD and insert the EC/KBC rewriting disk into the external FDD. 5. Turn on the power while holding down the Tab key. (Keep holding down the key until a message appears on the screen.) The EC/KBC rewriting starts. 6. When the EC/KBC rewrite is completed, the system is automatically turned off.
Appendix I Reliability Appendix I Reliability The following table shows MTBF (Mean Time Between Failures) in maximum configuration. Table I-1 MTBF Component System QOSMIO G20 Maintenance Manual (960-511) Time (hours) 6704.
Appendix I Reliability I-2 [CONFIDENTIAL] QOSMIO G20 Maintenance Manual (960-511)
Appendix J Appendix J Maintenance of TOSHIBA RAID J.1 Outline of Maintenance (Repair) of TOSHIBA RAID Follow the below procedures to repair TOSHIBA RAID Reception Is the RAID configured by two HDD? No Yes Identify the failed HDD (*2) Is it needed to specify the cause? No Yes Analysis by Drive Log (*3) Perform the HDD Troubleshooting Procedure in Section 2.6. Treatment Figure J-1 Flowchart of repairing TOSHIBA RAID *1: Refer to “Check of RAID configuration” in Section 3.2 in Chapter 3.
J.2Analysis and handling by Drive Log Appendix J Maintenance of TOSHIBA RAID J.2 Analysis and handling by Drive Log Follow the below procedures to analyze. Boot the independent utility and check the Physical Drive status. (1) Which port of HDD failed? Port 1 Port 0 (2) If necessary, analyze the Drive Log and identify the cause of failure. Replace the second HDD with new (good) one. Replace the built-in HDD with the second HDD removed.
Appendix J Maintenance of TOSHIBA RAID J.2.1 J.2Analysis and handling by Drive Log How to identify the cause of failure (1) When “Fail” or “NODRIVE” is displayed According to “Operation of Independent utility”, boot the independent utility to display the Drive Log. To identify the failure cause of Port 0, analyze the Drive Log of [REDUNDANT] side of Port 1. To identify the failure cause of Port 1, analyze the Drive Log of [REDUNDANT] side of Port 0. Analyze this log. 1.
J.2Analysis and handling by Drive Log Appendix J Maintenance of TOSHIBA RAID 2. Analyze the detailed date of the message of right before of “xxx Error (IN)”, “xxx Error (OUT)” (for example, “DMA Error (IN)”, “DMA Error (OUT)”) right before the log of “Fail this drive” message and identify the cause.
Appendix J Maintenance of TOSHIBA RAID J.2Analysis and handling by Drive Log Command：Indicates Command code caused an error.
J.
Appendix J Maintenance of TOSHIBA RAID J.2Analysis and handling by Drive Log (2) Check if it is caused by an operation miss or is a failure. To check if the cause of failure of Port1 is an operation miss or not, analyze the Drive Log of Port0. 1. In [REDUNDANT] of Port-0, find a log of “Fail this drive” message by [PgUp] and [PgDn] key. 2. If no message of “Fail this drive” message, it is judged that the second HDD is removed without the operation of removal by TOSHIBA RAID console and installed again.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID J.3 Operation of Independent utility J.3.1 Outline of Independent utility This is a utility to display Drive Log of TOSHIBA RAID. (1) Drive Log TOSHIBA RAID can store about 7,000 logs of Drive Log. TOSHIBA RAID make Drive Log redundant and store it. The drive has own log and other drive’s log. In TOSHIBA RAID, the log of own drive is called “Own Log” and the redundant log of other drive’s drive is called “Redundant Log”.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility J.3.2 How to operate the Independent Utility (1) Booting PC Connected the USB FDD to the PC to be repaired. Insert the FD storing the program of the Independent Utility in the FDD and boot the PC from the FD. The following display appears. In the Independent Utility, the cursor is moved by with [↑] key and [↓] key. Press [Enter] key to execute the option selected. Press [Esc] key to return to the previous menu.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID (2) Display of Logical/Physical Drive Logical Drive The status of RAID array is displayed in Logical Drive by array. The displayed items are follows. Table J-2 Displayed item in Logical Drive Explanation Status (Status of array) Displays the status of array. The contents are follows. -OPTIMAL：The array works normally. -DEGRADE：The array is degraded. -CRITICAL：The array is failed. It can not be used.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility Physical Drive In Physical Drive, the condition of RAID array is displayed by array. The following items are displayed. Table J-3 Items displayed in Physical Drive Explanation Port Displays the port number of Serial ATA connected to the drive. Assign Displays the array number and drive number of array that the drive is incorporated. The display format is LD [Array number] [Drive number].
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID (3) Explanation of Main Menu The Independent Utility has following Main Menu. Table J-4 Item of Main Menu displayed Explanation Create Array Builds RAID array. Start Rebuild Rebuilds RAID-1. While the rebuild is suspended, the message of “Resume Rebuild” is displayed. Check Media Checks if any error in drives configuring array. This is available for the RAID-1 in the “Optimal” condition.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility The tree of Independent Menu is as follows.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID Create Array This section explains how to select option and build array. The [Create Array] option can be selected only when there is a drive not assigned. To build array, follow the procedure below. 1. Put the cursor on [Create Array] in [Main Menu] and press [Enter] key. 2. Select RAID level. Put the cursor on [RAID-1] or [RAID-0] and press [Enter] key. 3.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility 6. Put the cursor on the “DONE” and press [Enter] key. Pressing “OK” in [Confirmation] store the change. CAUTION: When the array is initialized, the data of drive is lost. Start Rebuild Selecting of this option starts rebuilding. [Start Rebuild] is displayed only in the RAID1tion of with “OFFLINE” drive that has same or more size of capacity as the array in the condition of “Optimal” or “Degraded.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID 3. When [Rebuild Range] menu is displayed, the range to be rebuilt is designated. When [Effective] is selected, rebuild limit becomes valid and it rebuilds up to the rebuild limit. When [Whole] is selected, it rebuilds maximum capacity of array. The [Rebuild Range] menu is not displayed when the rebuild limit is not set or the rebuild limit is the same as the maximum capacity of array.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility 8. When completing the rebuild, press “OK” to return to the main menu of Independent Setup Utility. Resume Rebuild During being suspended,[Resume Rebuild] is displayed in [Main Menu]. To start rebuilding suspended, follow the procedure below. 1. Put the cursor to the [Resume Rebuild] in the main menu of Indent Utility and press [Enter] key. 2. When [Rebuild Range] menu is displayed, the range to be rebuilt is designated.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID 6. When completing the rebuild, press “OK” to return to the main menu of Independent Setup Utility. 7. When “Rebuild Limit” is set and [Rebuild Range] is set to [Whole], only [Finish] is can be selected after exceeding the Rebuild Limit. When [Finish] is selected and “OK” is selected in [Confirmation], the rebuilding is completed at the time. When OS is booted after exceeding the Rebuild Limit, the rebuild is completed.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility Check Media This option can check if there is an error in the HDD of array. The Check Media can be done only in RAID-1. To execute Check Media, follow the procedure below. 1. Put the cursor to the [Check Media] in [Main Menu] and press [Enter] key. 2. When [Check Range] is displayed, designate the range to be checked.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID Modify Array This option changes the setting of array. Change Parameter Select [Change Parameter] in [Modify Array] menu. The following items can be set. Table J-6 Item of array Option J-20 Explanation Write Cache Displays the setting of drive write cache. “Enable (use)” or “Disable (not use)” is displayed. The default is “Enable (use)”. Degrade Bootup Displays if boot OS or not when the array is degraded.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility Change RAID Level To change RAID level, select [Modify Array] menu. When changing RAID-1 (Mirroring) to RAID-0 (Striping), refer “Changing RAID-1 to RAID-0”. When changing RAID-0 to RAID-1, refer “Changing RAID-0 to RAID-1”. Changing RAID-1 to RAID-0 working by one drive When changing RAID-1 array working by two drives to RAID-0 working by one drive, follow the procedure below. 1. Select [Modify Array] in [Main Menu]. 2.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID Delete Array Selects [Delete Array] of Setup Utility and delete array. Put the cursor on the array you want to delete and press [Enter] key. When [Confirmation] is displayed, select “OK” to store the setting.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility Physical Drive Select [Physical Drive] in Setup Utility to set physical drive. View Drive Info. Select this option in [Physical Drive] to display information of physical drive. Select the drive that you want to display in [Physical Drive] at the lower of display and press [Enter] key.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID View Drive Log Select this option in [Physical Drive] menu and select the drive that you want to display the log. At the beginning, the latest log is displayed. The 7,168 logs from the latest is recorded in detail. For the older log, only ID is recorded. The options and functions of key in [View Drive Log] are as follows.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility Execute the following procedures to see the drive log in the independent utility. 1. Put on the cursor on [Physical Drive] in [Main Menu] and press [Enter] key. 2. Put on the cursor on [View Drive Log] and press [Enter] key. 3. Select drive that you want to display the log in [Physical Drive] at the lower of display with a cursor key and press [Enter] key. 4. The drive log is displayed.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID The following is displayed. Table J-9 Content of Drive Log display No. J-26 Option Explanation 1 Port Displays the port number of log displayed. 2 Own/Redundant Displays if the displayed log is a log of own port (Own) or a copy of other port log (Redundant). 3 Time Displays the time when the log is recorded in six digits. The format is [Year Month Day Hour Minute Second]. 4 ID Displays identification ID of log.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility [View Drive Log] menu is as follows Table J-10 Content of View Drive Log menu Option Explanation Change Port Changes the display of the own log and redundant log. At the beginning, the Port-0’s own log and the redundant log are displayed. Go to Event When this option selected, it moves to the log with designated number. The key function in [View Drive Log] key is as follows.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID Exit When this option is selected, the utility is finished. When [Confirmation] is displayed, select “OK”.
