Toshiba Personal Computer Qosmio X500 Maintenance Manual TOSHIBA CORPORATION File Number 960-Q08 Qosmio X500 Maintenance Manual (960-Q08)
Copyright © 2009 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein. Toshiba Personal Computer Qosmio X500 Maintenance Manual First edition Aug. 2009 Disclaimer The information presented in this manual has been reviewed and validated for accuracy.
Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer Qosmio X500 Series. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field. SAFETY PRECAUTIONS Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the Qosmio X500 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Table of Contents Chapter 1 Contents 1.1 Features ..........................................................................................................................1 1.2 System Block Diagram ..................................................................................................5 1.3 2.5-inch Hard Disk Drive...............................................................................................8 1.4 Optical Drive..............................................................
Chapter 2 Troubleshooting Procedures 2.1 Troubleshooting ............................................................................................................ 1 2.2 Troubleshooting Flowchart........................................................................................... 3 2.3 Power Supply Troubleshooting..................................................................................... 7 Procedure 1 Power Status Check ...............................................................
2.9 Display Troubleshooting..............................................................................................28 Procedure 1 External Monitor Check...................................................................28 Procedure 2 Diagnostic Test Program Execution Check .....................................28 Procedure 3 Connector and Cable Check ............................................................29 Procedure 4 Replacement Check ............................................................
Chapter 3 Diagnostic Programs 3.1 Tests and Diagnostics Software Overview .............. 3-Error! Bookmark not defined. 3.2 Executing the Diagnostic Test ................................. 3-Error! Bookmark not defined. 3.3 Subtest names........................................................... 3-Error! Bookmark not defined. 3.4 System Test.............................................................. 3-Error! Bookmark not defined. 3.5 Memory Test....................................................
Chapter 4 4.1 Replacement Procedures Overview.................................................................................................................... 4-1 Safety Precautions................................................................................................ 4-2 Before You Begin ................................................................................................ 4-3 Disassembly Procedure......................................................................................
4.21 Web Camera module................................................................................................ 4-62 4.22 Speaker Box ............................................................................................................. 4-64 4.23 Application for thermal pad and grease on CPU, North Bridge, and VGA Board………………………………………………………………………….........
Appendices Appendix A Handling the LCD Module ........................................................................... A-1 Appendix B Board Layout .................................................................................................B-1 Appendix C Pin Assignments.............................................................................................C-1 Appendix D Keyboard Scan/Character Codes ..................................................................
Qosmio X500 Maintenance Manual (960-Q08)
Chapter 1 Hardware Overview Qosmio X500 Maintenance Manual (960-Q08)
Chapter 1 1 Hardware Overview Hardware Overview Chapter 1 Contents 1.1 Features ..........................................................................................................................1 1.2 System Block Diagram ..................................................................................................5 1.3 2.5-inch Hard Disk Drive...............................................................................................8 1.4 Optical Drive.............................
Hardware Overview Chapter 1 Figures Figure 1-1-1 Front of the computer.........................................................................................4 Figure 1-2-1 System block diagram for AMD platform .........................................................5 Figure 1-3-1 2.5-inch HDD Disk Drive ..................................................................................8 Figure 1-4-1 DVD Super Muti drive.....................................................................................
Chapter 1 Hardware Overview Features 1.1 Features The Qosmio X500 features are listed below. Microprocessor Microprocessor that is used will be different by the model. It supports processors as follows Intel® Core(TM) i7-720QM processor 1.6GHZ,1.73GHz Additional processor may be introduced Memory Two DDR3 SO-DIMM (1066MHz specification compliant) used and be up to 4GB which can be upgraded through Memory Module Slot.
Chapter 1 Hardware Overview Keyboard module has104/105/109 keys. It supports Windows keys and application keys. New Dummy card slot The new card slot (dummy card) accommodates express card. Optical devices A DVD Super Multi drive is equipped. Battery The RTC battery is equipped inside the computer. The main battery is a detachable lithium ion battery. 12 cell Li-Ion 10.8v USB (Universal Serial Bus) 4 USB ports are provided. The ports comply with the USB2.
Chapter 1 Hardware Overview Bridge media slot XD/MS/MS pro/SD/MMC are supported Bluetooth Some computers in this series offer Bluetooth wireless communication functionality. This module is Version 2.1+EDR. Security Kensington Lock, Fingerprint –Enhanced Lock is also equipped.
Chapter 1 Hardware Overview 1. Web Camera LED* 3. Built-in microphone* 5. Speaker 7. Fingerprint Sensor* 9. Display Screen 11. Power Button* 13. CD/ DVD Button* 15. Volume Down Button* 17. Play/Pause Button* 2. Web Camera* 4. Wireless LAN/Wireless WAN Antennas (Not shown) 6. Touch Pad 8. Touch Pad Control Buttons 10. Speaker 12. Internet Button* 14. Previous Button* 16. Mute Button* 18. Next Button* 19.
Chapter 1 Hardware Overview 1.2 System Block Diagram Figure 1-2-1 shows the system block diagram.
Chapter 1 Hardware Overview The PC contains the following components. CPU Intel® Core(TM) i7-720QM processor 1.6GHz, 1.73GHz Memory DDR3-1066MHz 1GB, 2GB or 4GB memory modules 200-pin SO-DIMM 1.
Chapter 1 Hardware Overview Other main system chips • Clock Generator • EC/KBC –[W/CIR(Winbond WPCE775CA0DG)] –[WO/CIR(Winbond WPCE775LA0DG)] • HD Audio (CONEXANT CX20583-10Z) • Card Reader controller (O2 OZ888GS0LN) • 10/100 LAN controller (Atheros AR8132M) • Giga LAN controller (Atheros AR8131M) Mini Card Wireless LAN (BTO) DSSS/OFDM LAN card is equipped. Conformity with IEEE 802.11b/g, IEEE 802.11 a/g/n or IEEE 802.11a/b/g.. MODEM (Conexant x 1) Supported by on board Modem + DAA daughter card.
Chapter 1 Hardware Overview 1.3 2.5-inch Hard Disk Drive A compact, high-capacity HDD with a height of 9.5mm. Contains a 2.5-inch magnetic disk and magnetic heads. Figure 1-3-1 shows a view of the 2.5-inch HDD and Tables 1-3-2 and 1-3-3 list the specifications. Figure 1-3-1 2.5-inch HDD Table 1-3-2 2.5-inch HDD dimensions Standard value TOSHIBA MK1655G SX Parameter TOSHIBA MK2555G SX Width (mm) Outline dimens ions TOSHIBA MK3255GS X TOSHIBA MK3263G SX TOSHIB A MK5055 GSX 69.85 +/- 0.
Chapter 1 Hardware Overview Parameter Outlin e dimen sions Standard value HITACHI HITACHI HITACHI HITACHI HITACHI HTS545016B9A 300 HTS545025B9 A300 HTS545032 B9A300 HTS545040 B9A300 HTS545050B9A 300 Width (mm) 69.85 +/- 0.25 Height (mm) 9.5 Depth (mm) 100.2 +/- 0.25 Weight (g) 95 (max.) 95 (max.) Table 1-3-3 102 (max.) 102 (max.) 2.
Chapter 1 Hardware Overview Specification Parameter FUJITSU MJA2160BH FUJITSU MJA2250BH FUJITSU MJA2320BH FUJITSU MJA2400BH Storage size (formatted) 160GB 250GB 320GB 400GB Speed (RPM) FUJITSU MJA2500BH 500GB 5,400 Data transfer Rate - To/From Media - T0/From Host 363~952 typical 3Gbps (150MB/s) bus transfer rate (MB/s) 3Gbps(150MB/s) 12.0ms/14.0ms Average random seek time (read) (ms) Power-on-to-ready (sec) 4.0(typ9.
Chapter 1 Hardware Overview 1.4 Optical Drive (HD DVD-ROM & CD-R/RW Drive) The DVD Super Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD/DVD-ROM, CD-R/RW, DVD±R/±RW and DVD-RAM. It is a high-performance drive that reads DVD-ROM at maximum 8-speed and CD at maximum 24-speed. Write speed of DVD±R/±RW and DVD-RAM is different depending on the drive. The DVD Super Multi drive is shown in Figure 1-4-1.
Chapter 1 Hardware Overview Table 1-4-2 DVD Super Multi drive outline dimensions Parameter Maker Standard value HLDS (GT20N-ATAK7N7 ) HLDS (GT20F-ATAK7N7) Outline Width (mm) 128 dimensions Height (mm) 12.7 Depth (mm) 127 Mass (g) 168 Parameter Maker Standard value Panasonic (UJ240/J890ADTJR-A) Panasonic (UJ141/UJ890EDTJR-A) Outline Width (mm) 128 dimensions Height (mm) 12.
Chapter 1 Hardware Overview Table 1-4-3 HLDS DVD Super Multi drive specifications HLDS Drive Specification Parameter GT20N-ATAK7N7 GT20F-ATAK7N7 No support Support Label Flash Function Read DVD-R DVD-R DL DVD-RW DVD-RAM Write 2x CLV, 4x ZCLV, 8x CAV 2x CLV, 4x ZCLV 1x, 2x CLV, 4x, 6x ZCLV 2x, 3x ZCLV, 5x PCAV(Ver.2.2) (16x Media: Not support) DVD+R 2.4x CLV, 4x ZCLV, 8x CAV DVD+R DL 2.4x CLV, 4x ZCLV DVD+RW .4x, 3.3x CLV, 4x ZCLV, 8x ZCLV (8x Speed disc: 3.
Chapter 1 Hardware Overview Table 1-4-4 Panasonic DVD Super Multi drive specifications Panasonic Drive Specification Parameter UJ240/UJ890ADTJR-A UJ141/UJ890EDTJR-A No support Support Label Flash Function Read Data transfer speed Access time (ms) (Random) Write DVD-ROM :Max 8X CAV CD-ROM :Max 24X CAV CD-R :Max24X CAV CD-RW :4X CLV High Speed CD-RW :10XCLV Ultra Speed CD-RW :Max 16X Zone CLV DVD-R :Max.8X CAV DVD-R DL :Max.4X Zone CLV DVD-RW :Max.6X Zone CLV DVD+R :Max.8X CAV DVD+R DL :Max.
Chapter 1 Hardware Overview Table 1-4-5 TSST DVD Super Multi drive specifications Qosmio X500 Maintenance Manual (960-Q08) 15
Chapter 1 Hardware Overview 1.5 Keyboard The Qosmio X500 keyboard has two different kinds of placement, one is for US style and the other is for UK style.
Chapter 1 Hardware Overview 1.6 TFT Color Display The Qosmio X500 Ganel use CCFL to control backlight. 1.6.1 LCD Module with CCFL Backlight Figure 1-6-1 shows a view of the LCD module and Table 1-6-2 lists the specifications.
Chapter 1 Hardware Overview Table 1-6-2 LCD module specifications Specifications(WXGA+) Item Number of Pixel Dot spacing (mm) Display Colors Samsung Samsung LTN184KT02-T01 LTN184HT04-T01 1680 x 945 1920 x 1080 0.243 (H)× 0.243 (V) 0.213 (H)× 0.
Chapter 1 Hardware Overview 1.6.2 CCFL Inverter Board Table 1-10 lists the FL inverter board specifications. Table 1-6-3 FL inverter board specifications Specifications Item Input SUMIDA TWS-449-341 Ampower T18I107.00 TDK TBD573NR Voltage (V) 8~21 8~21 8~21 Power (W) 7.5W 7.5W 7.5W 612~945 612~945 612~945 Voltage (Vrms) Output Current (f=55KHz)(mArms) Qosmio X500 Maintenance Manual (960-Q08) 2.3±0.4 ~ 6.5±0.
Chapter 1 Hardware Overview 1.7 Power Rails Table 1-7-1 lists the power rail output specifications. Table 1-7-1 Power supply output rating Power supply （Yes/No） Name Voltage [V] Power OFF Suspend mode Power OFF Boot mode No Main Battery (with RTC Battery) +5VPCU 5 Yes Yes No +5V 5 No No No +3VPCU 3.3 Yes Yes No +3V_S5 3.3 Yes No No +3VSUS 3.3 Yes No No +3V 3.3 No No No +1.8VSUS 1.8 Yes No No +SMDDR_VTERM 1.8 Yes No No +SMDDR_VREF 1.8 Yes No No +1.8V 1.
Chapter 1 Hardware Overview 1.8 Batteries The PC has the following two batteries. Main battery Real time clock (RTC) battery Table 1-8-1 lists the specifications for these two batteries. Table 1-8-1 Battery specifications 1.8.1 Main Battery The main battery is the primary power supply for the computer when the AC adapter is not connected.
Chapter 1 Hardware Overview 1.8.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and detects a full charge when the AC adaptor and battery are connected to the computer. Battery Charge When the AC adapter is connected, normal charging is used while the system is turned on and quick charge is used while the system is turned off. Refer to the following Table 1-13.
Chapter 1 Hardware Overview Table 1-8-3 Data retaining time * If USB Seep and Charge function is enabled, the computer’s battery will discharge during hibernation or when the computer is turned off.
Chapter 1 Hardware Overview 1.8.3 RTC Battery The RTC battery provides the power supply to maintain the date, time, and other system information in memory. Table 1-8-4 lists the Time required for charges of RTC battery and data preservation time.
Chapter 1 Hardware Overview 1.9 AC Adapter Table 1-9-1 lists the AC adapter specifications.
Chapter 2 Troubleshooting Procedures 2-1 Qosmio X500 Maintenance Manual (960-Q08)
Chapter 2 Contents 2.1 Troubleshooting .............................................................................................................1 2.2 Troubleshooting Flowchart............................................................................................3 2.3 Power Supply Troubleshooting......................................................................................7 2.4 2.5 2.6 2.7 2.8 2-2 Procedure 1 Power Status Check .................................................
2.9 2.10 2.11 2.12 2.13 2.14 2.15 2.16 Display Troubleshooting..............................................................................................28 Procedure 1 External Monitor Check...........................................................28 Procedure 2 Diagnostic Test Program Execution Check .............................28 Procedure 3 Connector and Cable Check.....................................................29 Procedure 4 Replacement Check ...................................
2 Troubleshooting Procedures 2 2.1 Troubleshooting Chapter 2 describes how to determine which Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. The FRUs covered are: 1. Power supply 6. Touch pad 11. Wireless LAN 2. System Board 7. Display 12. Sound 3. USB FDD 8. Optical Disk Drive 13, Finger Print Board 4. 2.5” HDD 9. Modem 14, Bluetooth 5. Keyboard 10. LAN The Test Program operations are described in Chapter 3.
2 Troubleshooting Procedures There are following two types of connections in the figure of board and module connection in and after 2.3 Power Supply Troubleshooting. (1) Cable connection is described in the figure as line. (2) Pin connection is described in the figure as arrow.
2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart Use the flowchart in Figure 2-1-1 as a guide for determining which troubleshooting procedures to execute. Before going through the flowchart steps, verify the following: Ask customer to enter the password if a password is registered. Verify with the customer that Toshiba Windows is installed on the hard disk. NonWindows operating systems can cause the computer to malfunction. Make sure all optional equipment is removed from the computer.
2 Troubleshooting Procedures Figure 2-1-1 Troubleshooting flowchart (1/2) Qosmio X500 Maintenance Manual (960-Q08) 4
2 Troubleshooting Procedures Figure 2-1-2 Troubleshooting flowchart (2/2) If the diagnostics program cannot detect an error, the problem may be intermittent. The Test program should be executed several times to isolate the problem.
2 Troubleshooting Procedures function to confirm which diagnostic test detected an error(s), and then perform the appropriate troubleshooting procedures as follows: 1. If an error is detected on the system test, memory test, display test, CD-ROM/DVDROM test, expansion test, real timer test, sound test or Modem/LAN/Bluetooth /IEEE1394 test, perform the System Board Troubleshooting Procedures in Section 2.4. 2.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2 Troubleshooting Procedures Table 2-2 DC IN icon DC IN icon Power supply status Lights red DC power is being supplied from the AC adapter. Blinks orange Power supply malfunction*1 Doesn’t light Any condition other than those above. *1 When the power supply controller detects a malfunction, the DC IN icon blinks orange. When the icon is blinking, perform the following procedure. 1. Remove the battery pack and the AC adapter. 2. Re-attach the battery pack and the AC adapter.
2 Troubleshooting Procedures Procedure 2 Connection Check The wiring diagram related to the power supply is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Make sure the AC adapter and the AC power cord is firmly plugged into the DC IN connector PCN3 and wall outlet. If these cables are connected firmly, go to Check 2. Check 2 Replace the AC adapter and the AC power cord with new ones. Check 3 If the DC IN icon does not light, go to Procedure 4.
2 Troubleshooting Procedures adjust it in the right temperature. If the battery pack is still not charged, go to Check 5. Check 5 Replace the battery pack with a new one. If the battery pack is still not charged, go to Procedure 4.
2 Troubleshooting Procedures Procedure 4 Replacement Check The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4, Replacement Procedures. When AC adapter is connected; Check 1 AC adapter may be faulty. Replace the AC adapter with a new one. If the problem still occurs, perform Check 2. Check 2 System board may be faulty.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting This section describes how to determine if the system board is malfunctioning or not. Start with Procedure 1 and continue with the other procedures as instructed.
2 Troubleshooting Procedures Procedure 1 Message Check When the power is turned on, the system performs the Power On Self Test (POST) installed in the BIOS ROM. The POST tests each IC on the system board and initializes it. If an error message is shown on the display, perform Check 1. If there is no error message, go to Procedure 2. If Free-DOS or Windows is properly loaded, go to Procedure 3.
2 Troubleshooting Procedures Procedure 2 Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test 6. VGA test 7. VGA Memory test 8. Hard Disk test 9. CPU Temperature test 10. Main Battery test 11. BIOS test 12. CD-ROM/DVD-ROM test 13.
2 Troubleshooting Procedures 2.5 USB FDD Troubleshooting To check if the USB FDD is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: FDD Head Cleaning Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector Check and Replacement Check Procedure 1 FDD Head Cleaning Check FDD head cleaning is one option available in the Diagnostic Program. After connecting USB FDD, insert the Diagnostics Disk in the floppy disk drive.
2 Troubleshooting Procedures Procedure 2 Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled. Floppy disk drive test error codes and their status names are listed in Table 2-7.
2 Troubleshooting Procedures Procedure 3 Connector Check and Replacement Check USB FDD is connected to USB port on system board and US board. US board is also connected to system board by cable. The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks. USB FDD can be connected to the following 4 ports on system board.
2 Troubleshooting Procedures Check 2 USB FDD may be faulty. Replace it with a new one. If the problem still occurs, perform Check 3. Check 3 Connect USB FDD to each port embedded on system board. If it does not work properly, perform Check 4. Check 4 System board may be faulty. Replace it with a new one following the steps in Chapter 4, Replacement Procedures.
2 Troubleshooting Procedures 2.6 2.5” HDD Troubleshooting To check if 2.5” HDD is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Partition Check Procedure 2: Message Check Procedure 3: Format Check Procedure 4: Diagnostic Test Program Execution Check Procedure 5: Connector Check and Replacement Check CAUTION: The contents of the hard disk will be erased when the 2.5” HDD troubleshooting procedures are executed.
2 Troubleshooting Procedures Procedure 2 Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen. Make sure no floppy disk is in the FDD. Turn on the computer and check the message on the screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with Check 1 below and perform the other checks as instructed.
2 Troubleshooting Procedures Procedure 3 Format Check The computer’s HDD is formatted using the Free-DOS FORMAT program or the physical format program of the test program. To format the HDD, start with Check 1 below and perform the other steps as required. Refer to the Free-DOS Manual for the operation of Free-DOS. For the format by the test program, refer to the Chapter 3. Check 1 Format an 2.5” HDD using Free-DOS FORMAT command. Type as FORMAT C:/S/U. If 2.5” HDD can not be formatted, perform Check 2.
2 Troubleshooting Procedures Procedure 4 Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. The error codes and statuses are described in Table 2-8.
2 Troubleshooting Procedures Procedure 5 Connector Check and Replacement Check HDD(s) is/are connected to the connector(s) on the system board. The connection of HDD(s) and board may be defective. Otherwise, they may be faulty. Disassemble the computer following instructions in Chapter 4, Replacement Procedures and perform the following checks. Check 1 Make sure HDD(s) is/are firmly connected to the connector(s) on the system board.
2 Troubleshooting Procedures 2.7 Keyboard Troubleshooting To check if the computer’s keyboard is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test (DIAGNOSTIC TEST) and Pressed key display test in the Diagnostic Program.
2 Troubleshooting Procedures Procedure 2 Connector and Replacement Check The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure keyboard cable is firmly connected to system board. If the connection is loose, reconnect firmly and repeat Procedure 1. If the problem still occurs, go to Check 2. Check 2 Keyboard may be faulty.
2 Troubleshooting Procedures 2.8 Touch pad Troubleshooting To check if the computer’s touch pad is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Touch pad test in the Diagnostic Program. Refer to Chapter 3, Tests and Diagnostics, for more information on how to perform the test program.
2 Troubleshooting Procedures Procedure 2 Connector and Replacement Check The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the cable is firmly connected to system board. If the connection is loose, reconnect firmly and repeat Procedure 1. If the problem still occurs, go to Check 2. Check 2 Touch Pad or the cable may be faulty.
Troubleshooting Procedures 2.9 Display Troubleshooting To check if the computer’s display is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: External Monitor Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector and Cable Check Procedure 4: Replacement Check Procedure 1 External Monitor Check Connect an external monitor to the computer’s external monitor port, and then boot the computer.
Troubleshooting Procedures Procedure 3 Connector and Cable Check LCD Module is connected to system board by an LCD/FL cable. FL inverter board is also connected to system board by an LCD/FL cable. And, fluorescent lamp is connected to FL inverter board by HV cable. Their cables may be disconnected from system board or FL inverter board. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures. If the connection is loose, reconnect firmly and restart the computer.
Troubleshooting Procedures Procedure 4 Replacement Check Fluorescent lamp, FL inverter, LCD module, HV cable and LCD/FL cable are connected to display circuits. Any of these components may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: If LED backlight does not light, perform Check 1. If characters or graphics on the internal display are not displayed clearly, perform Check 3.
Troubleshooting Procedures 2.10 Optical Disk Drive Troubleshooting To check if optical disk drive is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the CD-ROM/DVD-ROM Test in the Diagnostic Program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
Troubleshooting Procedures 2.11 Modem Troubleshooting To check if modem is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute Modem test in the LAN/Modem/Bluetooth/IEEE1394 test program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
Troubleshooting Procedures Check 2 Modem cable may be faulty. Replace it with a new one. If the problem still occurs, perform Check 3. Check 3 MDC may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem still occurs, perform Check 4. Check 4 Cable between MDC and system board may be faulty. Replace it with a new one following the instructions in Chapter 4. If the problem still occurs, perform Check 5. Check 5 System board may be faulty.
Troubleshooting Procedures 2.12 LAN Troubleshooting To check if the computer’s LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute LAN test in the LAN/Modem test program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting To check if the computer's Wireless LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed.
Troubleshooting Procedures Procedure 2 Antennas' Connection Check The wireless LAN function-wiring diagram is shown below: Any of the connections may be defective. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless communication is Enabled in BIOS setup If the Wireless communication is "Disabled", change it to "Enabled". If the problem still occurs, perform Check 2.
Troubleshooting Procedures Procedure 3 Replacement Check Wireless LAN card, wireless LAN antenna or system board may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 Wireless LAN antenna may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 2. Check 2 Wireless LAN card may be faulty.
Troubleshooting Procedures 2.14 Sound Troubleshooting To check if the sound function is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Connector Check Procedure 2: Procedure 1 Replacement Check Connector Check The connection of sound system is shown in the following figure. As the connection may be defective, disassemble the PC and check each connection. If the problem still occurs, go to Procedure 2.
Troubleshooting Procedures Procedure 2 Replacement Check If External microphone/Headphone does not work properly, perform check 1. If Internal microphone /Speaker does not work properly, perform check 2. If HP out does not work properly, perform check 3. If Volume control does not work properly, perform check 4. Check 1 External microphone/Headphone may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem still occurs, perform Check 5.
Troubleshooting Procedures 2.15 Fingerprint Troubleshooting To check if the computer’s Fingerprint is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute Fingerprint test in the test program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program. If any error is detected, perform Procedure 2.
Troubleshooting Procedures 2.16 Bluetooth Troubleshooting To check if the computer’s Bluetooth is malfunctioning or not, follow the troubleshooting procedure below as instructed. Procedure 1: Connector Check and Replacement Check Procedure 1 Connector Check and Replacement Check The Bluetooth module is connected to system board. If Bluetooth malfunctions, its connection is defective or Bluetooth cable and system board may be faulty.
Test Program for Field.
Test Program for Field. Chapter 3 Contents 3.1 Tests and Diagnostics Software Overview ............................................................ 3-3 3.2 Executing the Diagnostic Test ............................................................................... 3-4 3.3 Subtest names......................................................................................................... 3-8 3.4 System Test ..................................................................................................
Test Program for Field. 3.1 Tests and Diagnostics Software Overview This chapter explains how to use the Tests and Diagnostics Software for the Satellite P500 and Satellite Pro P500 computer systems. NOTES: Before starting the Tests and Diagnostics software: 1. Check all cables for loose connections. 2. Exit any application and close Windows.
Test Program for Field. 3.2 Executing the Diagnostic Test DOS is required to run the Diagnostics Program. To start the programs follow these steps: 1. Create a DOS bootable disk and copy all the files from the Tests and Diagnostics software to the disk. 2. Insert the boot disk into the computer’s floppy disk drive and turn on the computer. NOTES: If error message display “Sorry. This Model Type Not Match This Machine”: Please Check : 1. You test disk is match this model , ex.
Test Program for Field. The following menu displays: TOSHIBA Satellite(Pro) P500 Diagnostics Version V1.10 ESC ::Select item :Escape [ DIAGNOSTICS MENU ] 01. 02. 03. 04. 05. 01. 01. 06. 02. 99. 03. 04. 05. 06. 07. DIAGNOSTIC TEST RUNNING TEST DMI INFORMATION [ DIAGNOSTIC TEST MENU ] LOG UTILITIES SYSTEM CONFIGURATION SYSTEM TEST TEST 08. CACHE MEMORY TEST SYSTEM OPTION MEMORY TEST 09. HIGH RESOLUTION DISPLAY TEST EXIT KEYBOARD TEST 10. MULTIMEDIA TEST DISPLAY TEST 11. MEMORY2 TEST FLOPPY DISK TEST 88.
Test Program for Field. 4. Select the subtest you want to execute and press Enter. The following menu displays: TOSHIBA Satellite(Pro) P500 Diagnostics Version V1.10 ESC : :Select item :Escape [ DIAGNOSTICS MENU ] [ SYSTEM TEST ] 01. DIAGNOSTIC TEST 02. RUNNING TEST 01. FAN ON/OFF 03. DMI INFORMATION 01. FAN ON/OFF 02.TEST Battery [ DIAGNOSTIC MENU Test ] 04. LOG UTILITIES 03. CPU Temperature 05. SYSTEM CONFIGURATION DIAGNOSTIC TEST MENU 01. SYSTEM 01.OPTION SYSTEM TEST TEST 9. 99.
Test Program for Field. NOTES: The Item2 and 3 of Test Parameter are not used by some tests. Go To Test Move the highlight bar to Go To Test and press Enter to start executing the test. Test Loop Select NO to return the screen to the subtest menu after the test is complete. Select YES to set the test to run continuously until it is halted by the user. Error Stop Select NO to keep the test running even if an error is found.
Test Program for Field. 3.3 Subtest names Table 3-1 lists the subtest names for each test program in the Diagnostic Test menu. Table 3-1 Subtest Names(1/3) No. 01 02 03 04 8 Test Name SYSTEM TEST MEMORY TEST KEYBOARD TEST DISPLAY TEST No.
Test Program for Field. Table 3-1 Subtest Names(2/3) No. 05 06 07 08 09 Test Name No.
Test Program for Field. Table 3-1 Subtest Names(3/3) No. 10 11 Test Name MULTIMEDIA TEST MEMORY2 No. Subtest Name 01 Sequential Read Test 02 Random Read Test 03 Read Specified Address Test 04 1 point W/R/C Test 01 All one/zero Test 02 Walking 1/Walking 0 Test(Left) 03 Walking 1/Walking 0 Test(Right) 04 Walking 1/Walking 0 Test(Left /Right) *This test cannot support.
Test Program for Field. 3.4 System Test To execute the System Test select 01 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The System Test contains three subtests. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 FAN ON/OFF Checking Select 1,2,3 to control FAN on/off , 1=Fan on , 2=Fan off , 3=Exit . [BOIFAN2.EXE] Program Version : 1.
Test Program for Field. Subtest 03 CPU Temperature This will display CPU Temperature for check , press [ESC] to exit . [CPU_TEMP.EXE] Program Version : 1.3 03-09-2009 CPU Temperature : XX GPU Temperature : XX NOTES: If no external Graphics , GPU not report temperature . Subtest 04 3D HDD Protection Test (90d) 1. For Field inspection T&D. This program judges by sampling five kinds of data shown below. No Item 1 Access platform. 2 Test Fixture 12 Contents An access platform is leveling.
Test Program for Field. 3 Test1 The display of a test program and the set method of PC are shown below. Display of a Test Program The portion which PC and Test-Fixture contact is green. Set method of PC Z Upper X Judgment If all data is less than ranges, it will be OK.
Test Program for Field. 4 Test2 The display of a test program and the set method of PC are shown below. Display of a Test Program Set method of PC Rear Upper Judgment If all data is less than ranges, it will be OK.
Test Program for Field. 5 Test3 The display of a test program and the set method of PC are shown below. Display of a Test Program Set method of PC Right Upper Judgment If all data is less than ranges, it will be OK.
Test Program for Field. 6 Test4 The display of a test program and the set method of PC are shown below. Display of a Test Program Set method of PC Front Upper Judgment If all data is less than ranges, it will be OK.
Test Program for Field. 7 Test5 The display of a test program and the set method of PC are shown below. Display of a Test Program Set method of PC Left Upper 8 Inspection 9 Setting Calibration data Judgment If all data is less than ranges, it will be OK. Judgment If all data is less than ranges, it will be OK. When an inspection result is O.K., calibration at HPC. 2. Test Result A test result is displayed when a test is completed. A display of result is O.K. or NG.
Test Program for Field. 3.5 Memory Test To execute the Memory Test select 02 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Memory Test contains five subtests that test the computer’s memory. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: If NO is selected for Test Loop on the Test Parameter menu, the Test Status screen displays while the test is executing. When the test is complete the Memory Test menu displays.
Test Program for Field. 5. Address pattern test “16 bit write and 16 bit read” of address pattern data is executed and the new data is compared with the original data. Test data = 0000H, 0004H, 0008H, 000CH,...8000H, 8004H, through FFECH Subtest 02 Protected Mode This subtest first writes data patterns and address data from 1 to 32 MB, then reads the new data and compares the result with the original data patterns. Addresses are displayed in 64KB increments during the test. . Test Process: 1.
Test Program for Field. with the original data patterns. Addresses are displayed in 64KB increments during the test. Test Process: 1. Byte Enable Test One bit write/ 8 bit read” is executed and the new data is compared with the original data. Test data = CCAA5533H, 80000000H 2. Byte Enable Test “One bit write/16 bit read” is executed and the new data is compared with the original data. Test data = CCAA5533H, 80000000H 3.
Test Program for Field. Test Process: 1. Checks the memory size to determine the maximum size of installed memory. 2. Tests memory addresses 0 to the maximum installed. 3. Writes, reads, and compares test data after a memory refresh cycle (16ms or more). NOTE: There may be a short delay between write and read operations, depending on the memory size. Subtest 05 Stress Test This subtest writes the following 16KB data patterns to the Write/Read Buffer in conventional memory.
Test Program for Field. 3.6 Keyboard Test To execute the Keyboard Test select 03 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Keyboard Test contains five subtests that test the computer’s keyboard and mouse actions. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: The Test Loop and Error Stop parameters are not enabled for the Keyboard test.
Test Program for Field. Subtest 04 Hot Key Display [9 Key] This subtest is used for the 9 hot key and functions the same as Subtest 1. ECO MUTE MUSIC PLAY BACK NEXT VOL- VOL+ WLAN Subtest 05 Hot Key Display [1 Key] This subtest is used for the 1 hot key and functions the same as Subtest 1. WLAN Subtest 06 PS/2 Mouse (Pointing) This subtest checks the function of mouse as shown below.
Test Program for Field.
Test Program for Field. 3.7 Display Test To execute the Display Test select 04 from the Diagnostic Test Menu, press Enter and follow the directions displayed on the screen. The Display Test contains twelve subtests that test the display in various modes. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Character Attributes This subtest displays character attributes and color attributes. The character attributes are: normal, intensified, reverse, and blinking.
Test Program for Field. Press Enter if NO was selected for Test Loop on the Test Parameter Menu. Press Ctrl + break if YES was selected for Test Loop on the Test Parameter Menu. Subtest 02 Character Set This subtest displays the character codes 00H - FFH, using Mode 01H (40*25). The screen below displays when this subtest is executed.
Test Program for Field. Subtest 03 80 * 25 Character Display This subtest uses 80*25 video resolution to display character codes 20H 7EH using Mode 03H (80*25). The data displayed is shifted 1 byte to the left for each line as shown below. 80*25 CHARACTER DISPLAY 01234567890123456789012345678901234567890123456789012345678901234567890123456789 !”#$%&’()*=,.-/0123456789:;?@ABCDEFGHIJKLMNOPQRSTUVWXYZ[\]^_’abcdefghIjklmno !”#$%&’()*=,.
Test Program for Field. Subtest 04 320 * 200 Character Display This subtest uses 320*200 video resolution to display green, red and yellow followed by cyan, magenta, and white. The screen below shows the displays when this subtest is executed.
Test Program for Field. 320*200 GRAPHICS DISPLAY BLACK : [ D ] D GRAY BLUE L BLUE GREEN L GREEN CYAN L CYAN RED L RED MAGENTA L MAGENTA BROWN YELLOW WHITE I WHITE Press [Enter] KEY Press ENTER to display 64 gradations of red, green, blue and white on the screen 320*200 GRAPHICS DISPLAY : [ 13 ] 64 gradations of red are displayed. 64 gradations of green are displayed. 64 gradations of blue are displayed. 64 gradations of white are displayed.
Test Program for Field. Subtest 05 640 * 200 Character Display This subtest uses 640*200 video resolution to display three windows, each window drives a different set of dots: even dots, odd dots and all dots. The screen below displays when this subtest is executed.
Test Program for Field. Subtest 06 640 * 480 Character Display This subtest uses 640*350 video resolution to display 16 colors: black, blue, green, cyan, red, magenta, brown, white, dark gray, light blue, light green, light cyan, light red, light magenta, yellow, and intensified white. The screen below displays when this subtest is executed.
Test Program for Field. 640*480 GRAPHICS DISPLAY : [12 ] BLACK DARK GRAY BLUE LIGHT GREEN LIGHT GREEN CYAN LIGHT CYAN RED LIGHT RED MAGENTA LIGHT MAGENTA BROWN YELLOW WHITE INTENSIFIED WHITE BLUE Press [Enter] KEY To exit this subtest and return to the Display Test menu: Press Enter if NO was selected for Test Loop on the Test Parameter Menu. Press Ctrl + break if YES was selected for Test Loop on the Test Parameter Menu.
Test Program for Field. Subtest 07 Display Page This subtest displays video pages zero through seven. DISPLAY PAGE 0 000000000000000000000000000000000000000000000000000000000000000 0............................................................0 0............................................................0 0............................................................0 0............................................................0 0............................................................0 0..............
Test Program for Field. Subtest 08 "H" Pattern Display This subtest displays a full screen of "H" patterns.
Test Program for Field. Subtest 10 Color Graphics Display This subtest displays three colors, cyan, white and yellow on the screen as shown below. 640 * 480 GRAPHICS DISPLAY CYAN WHITE YELLOW To exit this subtest and return to the Display Test menu: Press Enter if NO was selected for Test Loop on the Test Parameter Menu. Press Ctrl + break if YES was selected for Test Loop on the Test Parameter Menu.
Test Program for Field. Subtest 11 Color Attributes Display This subtest displays 16 colors: black, blue, green, cyan, red, magenta, brown, white, dark gray, light blue, light green, light cyan, light red, light magenta, yellow, and intensified white. The screen below displays when this subtest is executed.
Test Program for Field. NOTE: The following screen does not display correctly. It will be amended in the next version. Press [Enter] Key Press Enter to execute the VRAM mapping test which displays a vertical line at four dot intervals using Mode 12. Press [Enter] Key Press Enter to display VRAM mapping test using the all dots Mode.
Test Program for Field. Press [Enter] Key To exit this subtest and return to the Display Test menu: Press Enter if NO was selected for Test Loop on the Test Parameter Menu. Press Ctrl + break if YES was selected for Test Loop on the Test Parameter Menu.
Test Program for Field. Subtest 12 Color Tiling This subtest displays black, gray, white, and 3 gradations of red, green, and blue as shown in the following display. Black Red Green Blue Gray Red Gradation Green Gradation Blue Gradation White Red Gradation Green Gradation Blue Gradation To exit this subtest and return to the Display Test menu: Press Enter if NO was selected for Test Loop on the Test Parameter Menu. Press Ctrl + break if YES was selected for Test Loop on the Test Parameter Menu.
Test Program for Field. 3.8 Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the diagnostics disk and insert the work disk into the FDD. The contents of the floppy disk will be erased. To execute the Floppy Disk Test select 05 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Floppy Disk Test contains five subtests that test the FDD. Move the highlight bar to the subtest you want to execute and press Enter.
Test Program for Field. Subtest 04 Write Specified Address NOTE: The first two digits of the ADDRESS indicate which track is being tested, the next two digits indicates the head, and the last two digits indicate the sector. This subtest allows you to verify the errors from Subtest 02. It writes specified data to a specified track and head. Use the Log Utilities (see Section 3.21) to specify the track number and head number where the error(s) occurred during Subtest 02.
Test Program for Field. 3.9 Hard Disk Test To execute the Hard Disk Test select 06 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Hard Disk Test contains eight subtests that test the functions of the hard disk drive. Move the highlight bar to the subtest you want to execute and press Enter. NOTES: The contents of the hard disk will be erased when subtest 02, 03, 04, 05, 07 or 08 is executed.
Test Program for Field. Subtest 04 Cross Talk and Peak Shift This subtest writes eight of the most likely to fail data patterns (shown below) to a cylinder on the HDD, then reads the data while moving from cylinder to cylinder. Data Pattern B5ADADH 4A5252H EB6DB6H 149249H 63B63BH 9C49C4H 2DB6DBH D24924H Subtest 05 Write Specified Address NOTE: This subtest is designed to run with the Test Loop set to NO. This subtest is a debug tool and the operator should enter the Test Parameters each time. .
Test Program for Field. Subtest 07 Sequential Write This subtest writes specified data to all cylinders on the HDD. The following message displays on the screen to enter the test data. TEST DATA Subtest 08 ????(=37b3H) W-R-C Specified Address This subtest writes specified data to a specified sector count, then reads and compares the result. The following message displays on the screen to enter the test data, sector count.
Test Program for Field. 3.10 Real Time Clock Test To execute the Real Time Clock Test select 07 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Real Time Clock Test contains three subtests that test the computer’s real time functions. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real Time This subtest allows you to change the date and time. To execute the Real Time Subtest, follow these steps: 1.
Test Program for Field. Subtest 02 Backup Memory This subtest writes 50 bytes of test data (FFH, AAH, 55H, and 00H) to the CMOS 14th address, then reads the new data and compares it to the original data. Subtest 03 Real Time Carry CAUTION: When this subtest is executed, the current date and time are reset. This subtest checks the clock’s carry function.
Test Program for Field. 3.11 Cache Memory Test To execute the Cache Memory Test select 08 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Cache Memory Test contains eight subtests that test the computer's cache memory. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: If NO is selected for Test Loop on the Test Parameter menu, the screen will remain blank while the subtest is executing.
Test Program for Field. Subtest 04 Bit Shift Pattern Test This subtest reads the contents of cache memory and saves it into RAM. The subtest then writes the bit shift data patterns (1 bit shifted every 4 bytes), reads the new data and compares the result with the original data. The original cache memory content is then restored to the cache memory. Subtest 05 Write Disturb Test (We can’t support this time) This subtest reads the contents of cache memory and saves it into RAM.
Test Program for Field. 3.12 High Resolution Display Test To execute the High Resolution Display Test select 09 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The High Resolution Display Test contains six subtests that test the computer's high resolution video display. Move the highlight bar to the subtest you want to execute and press Enter.
Test Program for Field. Subtest 02 640*480 Mode Display This subtest uses 640*480 video resolution to display a high resolution white frame, 256 letter types (8*16 pixels) and 64 gradations of white, red, green, and blue as shown below.
Test Program for Field. Subtest 03 800 * 600 Mode Display This subtest uses 800*600 video resolution to display a high resolution white frame, 256 letter types (8*16 pixels) and 256 gradations of white, red, green, and blue as shown below.
Test Program for Field. Subtest 04 1024* 768 Mode Display This subtest uses 1024*768 video resolution to display a high resolution white frame, 256 letter types (8*16 pixels) and 64 gradations of white, red, green, and blue as shown below.
Test Program for Field. Subtest 05 “H” Pattern Display This subtest uses the 1024*768 Mode to display a high resolution white frame, “H” letters (8*16 pixels fonts), at 128 letters by 48 lines.
Test Program for Field. Subtest 06 Focus Test ( “E” Pattern) This subtest sets the 1024*768 Mode and displays “E” patterns (18*18 dot fonts), at 56 letters *42 lines surrounded by a high resolution white frame. To exit this subtest and return to the High Resolution Display Test menu: Press Enter if NO was selected for Test Loop on the Test Parameter Menu. Press Ctrl + break if YES was selected for Test Loop on the Test Parameter Menu.
Test Program for Field. 3.13 Multimedia Test To execute the Multimedia Test select 10 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Multimedia Test contains four subtests that test the computer's multimedia functions. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: Use the Toshiba Backup CD-ROM for Subtests 01, 02, and 03. Because CDROM driver issue , the Multimedia function can’t test , this is limitation .
Test Program for Field. 3.14 MEMORY2 Test To execute the Expansion Test select 11 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The MEMORY2 Test contains four subtests that test the computer's. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: If NO is selected for Test Loop on the Test Parameter menu, the Test Status screen displays while the test is executing. When the test is complete the Memory Test menu displays.
Test Program for Field. Tee test method is the same as Subtest2. However, the data to be used differs.
Test Program for Field. 3.15 Error Codes and Error Status Names The following table lists the error codes and error status names for the Diagnostic Tests.
Test Program for Field.
Test Program for Field. 3.16 Running Test NOTES: 1. You may add or delete subtests using the Running Test Edit Item function, see Section 3.20. 2. Do not forget to insert a work disk in the FDD. If a work disk is not inserted an error will be generated during the Floppy Disk Test. 3. If the test completes successfully an “PASS” sign with blue letters displays on the screen. 4. If the test fails or is interrupted before completion an “FAIL” sign with red letters displays on the screen. 5.
Test Program for Field. 3.17 DMI INFOEMATION Select 03 from the Diagnostics Menu and press Enter to Check or Write DMI Information Data: 3.17.1 Check DMI Information The Check DMI Configuration program contains the following configuration information for the computer: NOTE: Please set the media of DVD before starting a test. AHCI cannot control under the DOS System information (Type 1) 1. Manufacture : TOSHIBA 2. Product Name : Satellite XXXXXX 3. Version :(TOSHIBA Part Number) 4.
Test Program for Field. b. Wireless LAN ID ( 001E4CXXXXXX ) c. AC Adapter Select [1]65W [2]75W [3]90W [4]120W Select 1 ~ c to keyin new data , select 0 to exit program , program will compare input data length with the max length , if over will retry keyin Note : Please Check New DMI Information After System Restart !! V3.2 1. **** Manufacture Name ( TOSHIBA ) - (32) 2. **** Product Name ( Satellite XXXXXX ) - (32) 3. **** Part Number ( PSP50X-XXXXXX ) - (26) 4. **** Serial Number ( 12345678W ) - (32) 5.
Test Program for Field. 3.18 Log Utilities This function logs error information generated while a test is in progress and stores the results in RAM (Maximum error log : 500 times). This function can store data on a floppy disk. If the power switch is turned off, the error information will be lost. Error information is displayed in the following order: 1. 2. 3. 4. 5. 6. 7. 8.
Test Program for Field. 2. Error information displayed on the screen can be manipulated with the following number keys: The 1 key scrolls the display to the next page. The 2 key scrolls the display to the previous page. The 3 key returns to the Diagnostics Menu. The 4 key erases all error log information in RAM. The 5 key reads the log information from a floppy disk. The 6 key writes the log information to a floppy disk. The 7 key save the log information to a floppy disk.
Test Program for Field. 3.19 System Configuration Select 05 from the Diagnostics Menu and press Enter to display the following system configuration: SYSTEM CONFIGURATION : * * * * - * * * * * - BIOS VER = VX.XX KBC VER = XXXX MAC ADDRESS : XXXXXXXXXXXX 0 ASYNC ADAPTER 1 HDD DRIVE(S):XXXXXXXXXXXXXXXXXXXXXXXXXX FW Rev.:XXXXXXXX CUR LBA:XXXXXXXX ORG LBA:XXXXXXXX BATTERY TYPE:XXXXXXXXXX XXXMB MEMORY SIZE XXX CPU 1 Vedio Chip XXXXXXXXXXXXX 1 ODD DRIVE(S):XXXXXXXX FW Rev.
Test Program for Field. 3.20 Running Test Edit Item 3.20.1 Function Description Function description lets you add or delete the subtests used to execute the Running Test. The following screen displays after pressing the Tab key to edit an item in the Running Test. KEY OPERATION PgDn PgUp Home End Ins Del Enter Cursor Down Cursor Up Page Down Page Up Top of ITEM End of ITEM Insert ITEM Delete ITEM End 3.20.
Test Program for Field. 1. Enter a number or 0 for Loop Count and press Enter. Select a number from 1 to 65535 to define the number of times the Running Test executes. Select 0 to run the test continuously until halted by the user. 2. Select the NO or YES for Error Stop and press Enter. Select NO to keep the test running even if an error is found. Select YES to stop the test program when an error is found. NOTE: All errors which occur during execution of the Running Test are logged in the Log File. 3.
Test Program for Field. 3.21 Common Tests and Operation 3.21.1 How to operate a window To input parameters, or open a window use the following keys. key [Enter] key [Esc] key : to move a highlight bar : to select an item at the highlight bar : to close the current window and go back to the previous window 3.21.2 How to Stop the Test Program To stop a test: [Ctrl]+[Break] Press the Ctrl key and the Break key simultaneously. 3.21.
Test Program for Field. Pass Count Displays the number of times the test has been executed. Error Count Displays the number of errors which have occurred during the test. Write Data Displays only the test data that has failed to compare during the test while being written during the test. Read Data Displays test data that has failed to compare during the test while being read during the test. Test Address Displays the Test Address. (The format differs for each test.
Test Program for Field. 3.21.4 Test Stop Display If an error occurs during a Subtest and YES is selected for Error Stop, the following message displays: [HALT OPERATION] 1. Test end 2. Continue 3. Retry * Select 1, 2, or 3 The three selections have the following functions: 1: Terminates the test program and exits to the subtest menu. 2: Continues the test from the error. 3: Restarts the test from the beginning. Use the arrow keys to move the cursor to the desired option and press Enter. 3.21.
Replacement Procedures Chapter 4 Replacement Procedures Qosmio X500 Maintenance Manual (960-Q08) 4-i
Replacement Procedures Chapter 4 4.1 Contents Overview.................................................................................................................... 4-1 Safety Precautions ................................................................................................ 4-2 Before You Begin ................................................................................................ 4-3 Disassembly Procedure...........................................................................
Replacement Procedures 4.21 Web Camera module................................................................................................ 4-62 4.22 Speaker Box ............................................................................................................. 4-64 4.23 Application for thermal pad and grease on CPU, North Bridge, and VGA Board………………………………………………………………………….....4-67 Figures Figure 4-2-1 Remove the battery pack.................................................................
Replacement Procedures Figure 4-13-2 Remove the screws(from bottom side) ...................................................... 4-38 Figure 4-13-3 Remove the screws(from top side) ............................................................ 4-39 Figure 4-13-4 Remove the Wireless Antenna and LCD cable ......................................... 4-39 Figure 4-13-5 Remove the hinge screws ..........................................................................
Replacement Procedures 4 2 4.1 Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual. In all cases when removing an FRU, the battery pack must also be removed.
Replacement Procedures Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. DANGER: 1. In the case of the battery, always use authentic parts or equivalent parts approved by Toshiba. Other batteries may have different specifications that are incompatible with the computer and may result in fire or explosion. Due to the risk of alkali fluid leaks, never attempt to heat or disassemble the battery.
Replacement Procedures Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2 Battery Pack”. 1. Do not disassemble the computer unless it is operating abnormally. 2. Use the designated tools. 3. Ensure that the environment for working on and storing parts does not contain any of the following.
Replacement Procedures Disassembly Procedure Three main types of cable connector are used. Pressure plate connector Spring connector Normal pin connector When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cable out from the connector. When reconnecting a cable to a pressure plate connector, lift up the pressure plate to a suitable height and insert the cable into the connector.
Replacement Procedures Assembly Procedure After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems.
Replacement Procedures Screw Tightening Torque Use the following torque when tightening screws. CAUTION: Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage. NOTE: To tighten screws quickly and accurately, an electric screwdriver is recommended. M2 (2mm) 0.167 N·m (1.7 kgf·cm) M2.5 (2.5mm) 0.245 N·m(2.5 kgf·cm) M2.5 (2.5mm) 0.392 N·m(4.0 kgf·cm) for Hinge support M3.0 (3mm) 0.245 N･m (2.
Replacement Procedures Screw Notation To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths are indicated on the computer body. Format: Screw shape + Screw length (mm) Screw shape B: Bind screw F: Thin head screw S: Super thin head screw T: Tapping screw U: Other screws (Unique screws: pan head, stud, etc.
Replacement Procedures 4.2 Battery pack Removing the battery pack The following describes the procedure for removing the battery pack (See Figure 4-2-1). CAUTION: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC adapter and all external devices from the computer. 3. Turn the computer upside down. 4.
Replacement Procedures NOTE: Dispose of the used battery pack in accordance with the laws and ordinances of your local authority. Installing the battery pack The following describes the procedure for installing the battery pack (See Figure 4-2-2). CAUTION: There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly. Dispose always the used battery pack in accordance with the laws and ordinances of your local authority.
Replacement Procedures 4.3 PC card Removing a PC card The following describes the procedure for removing a PC card (See Figure 4-3-1). CAUTION: Insert or remove a PC card in accordance with any instructions in a PC card manual or the manuals of the computer system you are using. 1. Push the PC card. It will pop out PCMCIA Card when you release it. And NEW Card same as PC card. Then press the card once more to eject a card. 2. Grasp one of PC card and remove it.
Replacement Procedures 1. Make sure the PC card does not stick out. 2. Insert a PC card and press it until it is securely connected.
Replacement Procedures 4.4 SSD/HDD (Main HDD) Removing a SSD/MAIN HDD-H9.5mm / HDD-H12.5mm The following describes the procedure for removing the SSD/main HDD (See Figure 4-4-1 to 4-4-3). CAUTION: Take care not to press on the top or bottom of a SSD/HDD. Pressure may cause data loss or damage to the device. 1. Turn the computer upside down. 2. Remove the following screws securing a SSD/HDD slot cover and remove a SSD/HDD slot cover. M2.54.0B FLAT BIND screw x2 3.
Replacement Procedures CAUTION: When a SSD/HDD is installed, they are installed in the position as the following figure.
Replacement Procedures 5. Remove the following screws securing the SSD/HDD holder and remove the SSD/ HDD holder. M3.03.
Replacement Procedures Installing SSD/MAIN HDD-H9.5mm / HDD-H12.5 mm The following describes the procedure for installing the main HDD. 1. Install a SSD/HDD to the SSD/HDD holder and secure it with the following screws. M3.03.0B FLAT BIND screw x4 NOTE: Although they are 3mm head screws, screw torque must be set in 2.5kg-cm for four screws securing the HDD holder. 2. Insert the SSD/HDD assembly into the SSD/HDD slot and connect it carefully to the SSD/MAIN HDD on the system board. 3.
Replacement Procedures 4.5 Optical disk drive NOTE: Do not apply excessive force to the top of an optical disk drive. Do not touch the shaded portion of the figure below, when the drive is removed or installed. Removing an optical disk drive The following describes the procedure for removing an optical disk drive (See Figure 4-51and 4-5-2). 1. Remove MAIN HDD Slot cover and next remove the following screws securing an optical disk drive. M2.53.0B FLAT BIND screw x1 2.
Replacement Procedures Figure 4-5-2 Disassemble the side bracket Installing an optical disk drive The following describes the procedure for installing an optical disk drive. 1. Attach the ODD bracket to an optical disk drive and secure it with the following screws. M2.03.0 Flat BIND screw x2 2. Insert an optical disk drive assembly into the slot and connect it to the connector CN26 on the system board. 3. Secure the ODD drive with the following screw. M2.5X5.
Replacement Procedures 4.6 Slot in Optical disk drive NOTE: Do not apply excessive force to the top of an optical disk drive. Do not touch the shaded portion of the figure below, when the drive is removed or installed. Removing an optical disk drive The following describes the procedure for removing an optical disk drive (See Figure 4-6-1 to 4-6-3). 1. Remove the screws securing Motherboard. M2.56.5B FLAT BIND screw x3 2. Remove the Motherboard and thermal fan. 3.
Replacement Procedures Figure 4-6-1 Remove an optical disk drive Figure 4-6-2 Disconnect the Slot in ODD from Motherboard Qosmio X500 Maintenance Manual (960-Q08) 4-19
Replacement Procedures Figure 4-6-3 Disassemble the bracket from slot in ODD Installing an optical disk drive The following describes the procedure for installing an optical disk drive. 1. Attach the ODD bracket to an optical disk drive and secure it with the following screws. M2.02.0 Flat BIND screw x4 2. Insert an optical disk drive assembly into the slot and connect it to the connector CN26 on the system board and secure it with the following screws. M2.03.0B FLAT BIND screw x2 3.
Replacement Procedures 4.7 HDD (SECOND HDD) Removing second HDD-H9.5mm / HDD-H12.5mm The following describes the procedure for removing the second HDD (See Figure 4-7-1 to 47-3). CAUTION: Take care not to press on the top or bottom of a HDD. Pressure may cause data loss or damage to the device. 1. Turn the computer upside down. 2. Remove the following screws securing a HDD slot cover and remove a HDD slot cover. M2.54.0B FLAT BIND screw x2 3. Remove the following screws securing the HDD assembly.
Replacement Procedures CAUTION: When a HDD is installed, they are installed in the position as the following figure.
Replacement Procedures 5. Remove the following screws securing the HDD holder and remove the HDD holder. M3.03.
Replacement Procedures Installing Second HDD-H9.5mm / HDD-H12.5mm The following describes the procedure for installing a HDD. 1. Install a HDD to the HDD holder and secure it with the following screws. M3.03.5F FLAT BIND screw x4 NOTE: Although they are 3mm head screws, screw torque must be set in 2.5kg-cm for four screws securing the HDD holder. 2. Insert the HDD assembly into the HDD slot and connect it carefully to the MAIN HDD on the system board. 3.
Replacement Procedures 4.8 Memory module CAUTION: The power of the computer must be turned off when you remove a memory module. Remove a memory module with the power on risks damaging the module or the computer itself. Do not touch memory module terminals. Any dirt on the terminals may cause memory access problems. Never press hard or bend a memory module. Removing a memory module To remove a memory module, confirm that the computer is in boot mode.
Replacement Procedures Figure 4-8-1 Remove memory slot cover Figure 4-8-2 Remove a memory module Qosmio X500 Maintenance Manual (960-Q08) 4-26
Replacement Procedures Installing a memory module To install a memory module, confirm that the computer is in boot mode. Then perform the following procedure (See Figure 4-8-3). 1. Insert a memory module into the connector of the computer slantwise (terminal side first) and press it to connect firmly. CAUTION: The power must be turned off when you insert a memory module. Inserting a memory module with the power on might damage the module or the computer itself. Never press hard or bend a memory module. 2.
Replacement Procedures 4.9 Keyboard Removing the keyboard The following describes the procedure for removing the keyboard (See Figure 4-9-1). CAUTION: As the keycap may fall out, when handling the keyboard always hold it by the frame and do not touch the keycap. 1. Upside down the computer. 2. Open the display. 3. Remove KBD holder. Insert your finger into the slot between the KBD holder and the keyboard. Then, lift up the keyboard cover to remove it. 4. Loose the screw securing KBD Holder. M2.5x3.
Replacement Procedures Figure 4-9-1 Remove screws for KB Holder Qosmio X500 Maintenance Manual (960-Q08) 4-29
Replacement Procedures Installing the keyboard The following describes the procedure for installing the keyboard. 1. Turn the keyboard upside down and place it on the palm rest as its face down. Connect the keyboard flexible cable to the connector on the system board. 2. Slide and set the speaker cover assembly and secure it with the following screw. M2.53.0B FLAT BIND screw x4 3. Install the keyboard brace by pressing it from the topside.
Replacement Procedures 4.10 Wireless LAN card Removing a Wireless LAN card The following describes the procedure for removing a Wireless LAN card (See Figure 4-10-1 to 4-10-2). 1. Remove the following screw of wireless cover securing wireless LAN card cover and remove it. And remove screw of wireless board M2.5. x 3.0B BIND screw x2 2. Disconnect the wireless LAN antenna cable from the connectors on a wireless LAN card 3.
Replacement Procedures Figure 4-10-2 Remove a wireless LAN card Qosmio X500 Maintenance Manual (960-Q08) 4-32
Replacement Procedures Installing a Wireless LAN card The following describes the procedure for installing a Wireless LAN card. 1. Insert a wireless LAN card terminals slantwise into the connector on the computer and press a wireless LAN card and lock the secure screws. M2.5. x 3.0B BIND screw x2 2. Connect the wireless LAN antenna cable to the terminals on a wireless LAN card. 3.
Replacement Procedures 4.11 Bluetooth module Remove a Bluetooth module The following describes the procedure for removing a Bluetooth module(see Figure4-11-1) 1. Disconnect the Bluetooth cable from motherboard side 2. Remove the following screw from TOP case and remove the Bluetooth bracket 2.5.0 x 3.0B BIND screw x1 3. Remove the Bluetooth module Figure 4-11-1 Remove a Bluetooth module Installing a Bluetooth module The following describes the procedure for installing a Bluetooth module. 1.
Replacement Procedures 4.12 TV Tuner card Removing a TV Tuner card The following describes the procedure for removing a TV Tuner card (See Figure 4-12-1). 1. Remove the following screw of TOP cover securing and remove it. And remove screw of TV tuner card 2.5.0 x 3.0B BIND screw x2 2. Disconnect the TV antenna cable from the connectors on a TV tuner card 3. Open the left and right latches holding a TV tuner card and remove a TV tuner card from the connector on the system board.
Replacement Procedures Installing a TV Tuner card The following describes the procedure for installing a TV tuner card. 1. Insert a TV tuner card terminals slantwise into the connector on the computer and press a TV tuner card and lock the secure screws. 2. Connect the TV antenna cable to the terminals on a TV tuner card. 3. Put the TV antenna cable on the right location from the guide(see Figure 4-10-3) 4. Secure TV tuner card with the following screws 2.5.0 x 3.
Replacement Procedures 4 4.13 Display assembly Removing the display assembly The following describes the procedure for removing the display assembly (See Figure 4-13-1 to 4-13-5). 1. Close the display and turn the computer upside down. 2. Remove the battery pack (See Figure 4-2-1) 3. Remove the Main HDD door screws and open the MAIN HDD Door, remove Optical Drive Disk. M2.54.0 FLAT BIND screw x2 M2.53.0 FLAT BIND screw x1 Figure 4-13-1 Remove the screws (securing display assembly) 4.
Replacement Procedures M2.56.5 FLAT BIND screw x11 M2.58.0 FLAT BIND screw x6 M2.54.0 FLAT BIND screw x2 M2.5X3.0 FLAT BIND screw x1 M2.52.0 FLAT BIND screw x5 Figure 4-13-2 Remove the screws (from bottom side) 6. Disassemble KBD Holder and Keyboard screw (See Figure 4-9-1) M2.5x3.0 Flat BIND screws x4 7. Remove the screws from the top side and remove the cover. M2.5x6.5 Flat BIND screws x7 M2.5x3.
Replacement Procedures Figure 4-13-3 Remove the screws (from top side) 8. Disconnect the FFC and cables. 9. Disassembly TOP cover. 10. Pull out the wireless LAN antenna and LCD cables from the guide.
Replacement Procedures Opening the display to 135degree, and remove the hinge screw. ‧ M2.56.5 FLAT BIND screw x6 (Locktight) Figure 4-13-5 Remove the hinge screws 11. Pulling out the pole of hinge from the hole of hinge assembly, remove the display assembly from the base assembly. Installing display assembly The following describes the procedure for installing the display assembly. 1. Inserting the pole of hinge to the hole of hinge assembly, set the display assembly on the base assembly. 2.
Replacement Procedures 4. Arrange the wireless antenna cables along the guide (front) and secure them with guide. 5. Pass the cables to the back of computer through the slot. 6. Arrange the wireless LAN antenna along the guide and contact with the connector. 7. Install the LAN board and cover ASSY of the system, secure it with the screws M2.5x6.5 Flat BIND screws x7 8. Install the KBD Holder and Keyboard with screws M2.5x3.0 Flat BIND screws x4 9.
Replacement Procedures 4.14 Top Cover assembly Removing the Top cover assembly The following describes the procedure for removing the top cover assembly (See Figure 414-1 to 4-14-3). 1. Turn over the computer. 2. Remove the following screws securing the top cover assembly from the back and bottom of computer. M2.52.0 FLAT BIND screw Back x5 M2.56.5 FLAT BIND screw Back x11 M2.58.0 FLAT BIND screw Back x6 M2.54.0 FLAT BIND screw Back x2 M2.53.
Replacement Procedures 3. Remove the following screws securing the top cover assembly from the front of computer. Pull up and remove the top cover assembly from the base assembly. M2.5x6.5 Flat BIND screws x7 Figure 4-14-2 Remove the screws (front) and top cover assembly 4. Disconnect the touch pad flat cable/Fingerprint cable from the connector on the system board.
Replacement Procedures Figure 4-14-3 Disconnect the touch pad flat cable/Fingerprint cable Installing Top Cover assembly The following describes the procedure for installing the top cover assembly. 1. Install the top cover assembly to the base assembly. NOTE: Be careful not to catch the cables between top cover assembly and base assembly. 2. Connect the touch pad flat cable to the connector on the system board. 3. Secure the top cover assembly with following screws from the front of computer. M2.5x6.
Replacement Procedures 4.15 Touch pad Removing the touch pad The following describes the procedure for removing the touch pad (See Figure 4-15-1 to 415-3). 1. Peel off the glass tape and disconnect the touch pad flat cable, Fingerprint cable from the connector on the touch pad. 2. Remove the following screws securing the touch pad plate. M2.03.0B SUPER THIN HEAD screw x10 3. Remove the touch pad board and touch pad plate. 4. Peel off and remove the touch pad from the top cover assembly.
Replacement Procedures Figure 4-15-2 Loose the M2.
Replacement Procedures Installing the touch pad The following describes the procedure for installing the touch pad. 1. Peel off the separator covering on the sensor portion of a new touch pad. NOTE: Do not reuse the touch pad so that it can not be used after peeling off from the computer. Be sure to stick a new touch pad. When sticking the touch pad, be careful not to get the bubbles under the touch pad. 2. Stick and install the touch pad on the top cover assembly. 3.
Replacement Procedures 4.16 USB Board The following describes for removing the USB board (See Figure 4-16-1). Removing the USB Board 1. Pull out the USB cable, Audio cable, from USB board connector. 2. Loose the below screws and then incline pull out USB board. M2.5x6.5 FLAT BIND screw x2 Figure 4-16-1 Remove the USB board Installing the USB Board The following describes the procedure for installing the USB board. 1. Insert the USB board into base case and connect USB board cable, Modem cable 2.
Replacement Procedures 4.17 B CAS Board The following describes for removing the B CAS Board (See Figure 4-17-1). Removing the B CAS Board 1. Pull out the B CAS FFC from USB board connector. 2. Loose the below screws and then incline pull out B CAS board. M2.5x3 FLAT BIND screw x4 Figure 4-17-1 Remove the B CAS Board Installing the B CAS Board The following describes the procedure for installing the B CAS board. 1. Insert the B CAS board into base case and connect B CAS board FFC. 2.
Replacement Procedures 4.18 System Board CAUTION: 1. when handling the system board, always hold by the edges. Do not touch the printed circuit face. 2. if replacing with a new system board, execute the subtest01 Initial configuration in section 3.3 “Setting of the hardware configuration”. Also update with the latest BIOS Removing the System Board The following describes the procedure for removing the system board (See Figure 4-18-1 to 4-18-2). 1. Disconnect the power cable from the system board.
Replacement Procedures 2. Disconnect the speaker cable, LCD CABLE, WIRELESS ANTENNA, CRT cable, USB cable, FM CABLE, MDC CABLE, and TV-F ANTENNA from the connector on the system board. 3. Remove the following screws securing the fan and the system board and remove the system board. M2.56.5 screw x2 M2.56.
Replacement Procedures Removing RTC battery The following describes the procedure for removing the RTC battery unit (See Figure 4-18-3 to 4-18-4). 1. Pull the away the socket of RTC battery and use a clamp to hold RTC battery tightly. Figure 4-18-3 Pull away from the socket of RTC Battery 2. Rotate battery through the way then remove it.
Replacement Procedures Installing the System Board The following describes the procedure for installing the system board. 1. Secure the system board with the following screws. M2.56.5 screw x3 2. Secure the fan with the following screws. M2.56.5 screw x2 3. Connect the speaker cable, LCD CABLE, WIRELESS ANTENNA, CRT cable, USB cable, FM CABLE, MDC CABLE, and TV-F ANTENNA to the connector on the system board. 4.
Replacement Procedures 4.19 CPU Removing the CPU heat sink The following describes the procedure for removing the CPU heat sink (See Figure 4-19-1 to 4-19-2). 1. Disconnect the Heat sink cable from the connector on the system board 2. Remove the following screws securing the heat sink holder along 1 to 4. M22 SPRING screw x4 NOTE: When removing the heat sink holder, be sure to remove the screws in the reverse order of the number marked on the holder. 3. Remove the CPU heat sink.
Replacement Procedures 4. Unlock the CPU by rotating the cam on the CPU socket 120 degrees to the counterclockwise with a flat-blade screwdriver. 5. Remove the CPU. Figure 4-19-2 Remove the CPU Installing the CPU The following describes the procedure for installing the CPU (see Figure 4-19-3) 1. Check that the mark of cam is in the unlocking position. 2. Attach the CPU to the correct position in the CPU socket. 3. Fix the CPU by rotating the cam 120 degrees to the clockwise with a flat-blade screwdriver.
Replacement Procedures Figure 4-19-3 Apply silicon grease 6. Install the CPU heat sink and heat sink holder and secure them with the following screws along 1 to 4. M22 SPRING screw x4 7. Connect the Heat sink cable to the connector on the system board NOTE: When securing the heat sink holder, be sure to secure the screws in the order of the number marked on the holder.
Replacement Procedures 4.20 LCD unit / FL inverter CAUTION: When replacing a LCD, it is required that SVP parameter is set. Update with the latest EC/KBC as described in Appendix H “EC/KBC Rewrite Procedures”. Removing the LCD unit / FL inverter The following describes the procedure for removing the LCD unit and FL inverter (See Figure 4-20-1 to 4-20-4). Remove Screw MYLAR cover X8 1. Remove the following screws securing the display mask M2.56.5 screw X8 2.
Replacement Procedures 3. Pull out one insulator and peel off the other one adhered to the inverter. 4. Disconnect the LCD harnesses from the connectors CN1 on the inverter. 5. Disconnect the HV harnesses from the connectors CN2 on the inverter. 6. Remove the FL inverter while peeling off the double-sided tape.
Replacement Procedures 7. Remove the following screws securing the LCD unit. M2.5x4.0 screw x2 M2.5x5.0 screw x8 8. With the bottom edge of the LCD unit on the display cover, lift only the top edge of the LCD unit. After peeling off the CONDUTIVE tape, disconnect the LCD harness from the connector on the back of the LCD. 9. Remove the LCD unit.
Replacement Procedures 10. Remove the following screws securing the LCD support (LCD unit side) and remove the hinge from the LCD unit. M2.0x2.
Replacement Procedures Installing the LCD unit/FL Inverter The following describes the procedure for installing the LCD unit and FL inverter. Install the LCD supports (LCD unit side) and hinge to the LCD and secure them with the following screws. M2.02.5 BINK screw x8 1. Stand the LCD unit on the display cover and connect the LCD harness to the connector on the back of LCD. 2. Stick the conductive tape on the connector of LCD harness. 3. Secure the LCD unit with the following screws. M2.5x4.
Replacement Procedures 4.21 Web Camera module Removing Web Camera module The following describes the procedure for removing the Web Camera module. (See Figure 4-21-1 to 4-21-2). 1. Pull off the connector of Web Camera module. Figure 4-21-1 Remove the connector of Web Camera module 2. Peel off the glue of Web Camera module.
Replacement Procedures Figure 4-21-2 Peel off the glue of Web Camera module Installing Web Camera module The following describes the procedure for installing the Web Camera module. 1. Pull in the glue of Web Camera Module. 2. Connect the connector of Web Camera module.
Replacement Procedures 4.22 Speaker Box Removing Speaker Box The following describes the procedure for removing Speaker Box. (See Figure 4-22-1 to 4-22-3). 1. Remove the following screws securing Speaker Box. M2.52.0 screw x 4 Figure 4-22-1 Removing the securing screws at left side.
Replacement Procedures Figure 4-22-2 Removing the securing screws at right side. 2. Removing the Speaker Box. Figure 4-22-3 Removing the Speaker Box.
Replacement Procedures Installing Speaker Box The following describes the procedure for installing Speaker Box. 1. Installing the Speaker Box. 2. Securing Speaker Box of following screws. M2.52.
Replacement Procedures 4.23 Application for Thermal pad and grease on CPU, North Bridge, and VGA board (see Figure 4-22-1 to 4-22-3) I. For Silvis thermal pad on North Bridge and grease on CPU Figure 4-23-1 Intel &AMD Thermal pad on North Bridge RAW PN TSB PN JXTZ1024010 A000048640 XY0GFCM1000 A000018440 Vendor Description THERMAL PAD INT NB BS TZ1(JXTZ1024,3A) THERMAL GREASE GFC-M1 II. Use grease and Thermal pad on VGA 1. 0.15cc for one repair.
Replacement Procedures Figure 4-23-2 Apply silicon grease for North Bridge 2. Thermal pad and grease used on VGA thermal module.
Replacement Procedures RAW PN TSB PN JXTZ1027010 A000048650 JXTZ1026010 A000048660 XY0GFCM1000 A000018440 Vendor Description THERMAL PAD VGA V-RAM AD(JXTZ1027,3A) THERMAL PAD VGA CHOKE AD(JXTZ1026,3A) THERMAL GREASE GFC-M1 NOTE: Thermal pad is fixed for each one, no need special applicator and can re-use.
Appendix A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
Handling the LCD Module 3. If the panel’s surface gets fingerprint or dust, put on gloves and wipe it with static electricity cloth. If it is still dirty, drop some cleaning alcohol on the surface and wipe it again If the surface is much more fingerprint or dust, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. If dust still exists, please use ionic FAN which can avoid static electricity to deal with it. 4.
Handling the LCD Module 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
Handling the LCD Module 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxide). These materials can release gas that can damage the panel’s polarization.
Appendix B Appendix B Board Layout B.
Board Layout 42 41 29 30 40 39 25 43 38 8 31 32 35 34 33 Figure B-1-2 System board layout (Back) B-2 Qosmio X500 Maintenance Manual (960-Q08) 37
Board Layout Table B-1-1 System board ICs and connectors NUM Location Function (01) CN6 SPDIF CONN (02) CN10 Audio&USB CONN (03) CN11 LVDS CONN (04) CN2 CRT CONN (05) CN1 MDC CONN (06) CN16 KB CONN (07) CN14 FAN CONN (08) U50 (09) CN22 TMA CONN (10) CN48 BATT CONN (11) CN20 K/B LED power CONN (12) CN25 LED/B CONN (13) CN21 TP&FP/B CONN (14) CN31 BCAS CONN (15) CN29 Felica CONN (16) CN33 Cardreader CONN (17) CN32 New Card CONN (18) CN15 WiFi CONN (19)
Board Layout (23) CN13 Power/B CONN (24) U2 Audio IC (25) U13 Clock generator (26) U4 Embedded Controller IC (27) U9 LAN IC (28) U27 Card Reader /1394 (29) U35 CPU (30) U47 North Bridge (31) CN31 DDR CONN (32) CN32 2nd SATA HDD CONN (33) PCN1 DC IN CONN (34) CN46 Main SATA HDD CONN (35) CN47 SATA ODD CONN (37) CN44 1394 CONN (38) CN41 HDMI CONN (39) CN37 USB CONN (40) CN36 ESATA CONN (41) CN35 RJ45 CONN (42) PCN0 VGA Power CONN (43) CN39 VGA CONN B
Board Layout B.
Board Layout 01 02 Figure B-2-3 Touch Pad board layout (Back) Table B-2-2 Touch Pad board connectors NUM Location Function (01) CN3 TP Board to TP Module CONN (02) CN1 TP Board to M/B CONN B-6 Qosmio X500 Maintenance Manual (960-Q08)
Board Layout B.
Board Layout 01 02 Figure B-3-3 Finger Print Board layout (Back) Table B-3-4 Finger Print Board connectors Location Function (01) CN2 Finger Print Board to TP Board connector (02) CN3 Finger Print Board to TP Board connector B-8 Qosmio X500 Maintenance Manual (960-Q08)
Pin Assignment Appendix C Pin Assignment CN11 LCD Panel Connectors PIN No. Signal name I/O PIN No.
Pin Assignment CN24 MMB Connector PIN No. Signal name I/O PIN No. Signal name I/O 1 +3VPCU --- 2 +5VPCU --- 3 KEY_INT I 4 GND --- 5 3ND_MBDATA I/O 6 3ND_MBCLK I/O CN20 Keyboard LED Connectors PIN No. Signal name I/O PIN No. Signal name I/O 1 +5V --- 2 BOARD_DI5 O 3 KB_LED_DET# --- 4 KB_LED I CN13 Power Board Connectors PIN No. Signal name I/O PIN No. Signal name I/O 1 +5VPCU I 2 NBSWON# I 3 PWRLED# I 4 GND --- CN16 Keyboard Connectors PIN No.
Pin Assignment 7 MY2 O 8 MY1 O 9 MY0 O 10 MY4 O 11 MY3 O 12 MY5 O 13 MY14 O 14 MY6 O 15 MY7_K O 16 MY3_K O 17 MY7 O 18 MY9 O 19 MY10 O 20 MY11 O 21 MY12 O 22 MY15 O 23 MX7 O 24 MX2 O 25 MX3 O 26 MX4 O 27 MX0 O 28 MX5 O 29 MX6 O 30 MX1 O 31 K_LED_P O 32 CAPSLED O 33 FN_F10 O 34 NUMLED O CN21 Touchpad & Fingerprint Connectors PIN No. Signal name I/O PIN No.
Pin Assignment PIN No. Signal name I/O PIN No. Signal name I/O 1 +5V_Felica --- 2 USBP4- I/O 3 USBP4+ I/O 4 GND --- 5 NC --- 6 NC --- CN10 Audio&USB Board Connectors PIN No. Signal name I/O PIN No.
Pin Assignment 1 GND --- 2 USBP9- I 3 USBP9+ I 4 CPUSB# I/O 5 --- --- 6 --- --- 7 NEW SMCLK I 8 NEW SMDATA I/O 9 +NEW_1.5V I 10 +NEW_1.5V I 11 PCIE_WAKE# I 12 +NEW_3VAUX O 13 PERST# I/O 14 +NEW_3V I 15 +NEW_3V I 16 NEW_CLKREQ# O 17 CPPE#_ I/O 18 CLK_PCIE_NEW# I 19 CLK_PCIE_NEW I 20 GND --- 21 PCIE_RXP2 O 22 PCIE_RXP2 O 23 GND --- 24 PCIE_TXN2 I 25 PCIE_TXN2 I 26 GND --- CN27 Blue Tooth Connectors PIN No.
Pin Assignment PIN No. 1 Signal name RTC_NO2 I/O PIN No. I 2 Signal name GND I/O --- CN2 CRT Connectors PIN No. Signal name I/O PIN No. Signal name I/O 1 +5V --- 2 NC 3 GND --- 4 CRT_R1 --- 5 GND --- 6 CRT_G1 --- 7 GND --- 8 CRT_B1 --- 9 GND --- 10 CRTHSYNC --- 11 CRTVSYNC --- 12 GND --- 13 CRTDCLK --- 14 CRTTDDAT --- 15 GND --- CN14 FAN Connectors PIN No. Signal name I/O 1 TH_FAN_POWER1 --- 3 FANSIG1 O PIN No.
Pin Assignment 1 MBAT+ --- 2 MBAT+ --- 3 ID O 4 B/I --- 5 TEMP_MBAT O 6 MBDATA I/O 7 MBCLK I/O 8 GND --- 9 GND --- 10 GND --- 11 GND --- 12 GND --- 13 GND --- CN15 MINI PCI-E Card WLAN Connectors PIN No. Signal name I/O PIN No. Signal name I/O 1 WLAN_WAKE# O 2 +3V --- 3 WCS_DATR --- 4 GND --- 5 WCS_CLKR --- 6 +1.
Pin Assignment 31 PCIE_TXN0 I 32 WL_SMDATA I/O 33 PCIE_TXP0 I 34 GND --- 35 GND --- 36 USBP3-_B I/O 37 GND --- 38 USBP3+_B I/O 39 NC --- 40 NC --- 41 NC --- 42 NC --- 43 GND --- 44 LED_WLAN# --- 45 CL_CLK1_MIN --- 46 LED_WPAN# --- 47 CL DATA1 MIN --- 48 +1.5V --- 49 CL_RST#1_MIN --- 50 GND --- 51 SERIRQ_WLAN O 52 +3V --- CN26 TV Connectors PIN No. Signal name I/O PIN No.
Pin Assignment 7 NC I/O 8 NC --- 9 GND --- 10 NC I 11 NC I/O 12 NC --- 13 NC I/O 14 NC I/O 15 GND --- 16 BCIO-P5P I/O 17 BCRST-P3N I/O 18 IVDET-P3P --- 19 BCPWON-P3P I/O 20 NC I/O 21 GND --- 22 RESET# I/O 23 NC I/O 24 +3.3V --- 25 NC I/O 26 GND I 27 GND --- 28 NC --- 29 GND I/O 30 USB D+ I 31 NC I/O 32 USB D- I 33 NC --- 34 GND --- 35 GND I/O 36 USB D- I/O 37 GND I/O 38 USB D+ I/O 39 +3.
Pin Assignment PI N No. Signal name I/O PIN No. Signal name I/O 1 +0.
Pin Assignment 51 M_B_DQS2 I/O 52 M_B_DM2 I 53 GND --- 54 GND --- 55 M_B_DQ23 I/O 56 M_B_DQ18 I/O 57 M_B_DQ22 I/O 58 M_B_DQ19 I/O 59 GND --- 60 GND --- 61 M_B_DQ28 I/O 62 M_B_DQ24 I/O 63 M_B_DQ25 I/O 64 M_B_DQ29 I/O 65 GND --- 66 GND --- 67 M_B_DM3 I 68 M_B_DQS#3 I/O 69 NC --- 70 M_B_DQS3 I/O 71 GND --- 72 GND --- 73 M_B_DQ30 I/O 74 M_B_DQ26 I/O 75 M_B_DQ31 I/O 76 M_B_DQ27 I/O 77 GND --- 78 GND --- 79 M_CKE3 I 80 M_CKE4
Pin Assignment 103 +1.8VSUS --- 105 M_B_A10 I/O 106 M_B_BS#1 I 107 M_B_BS#0 I 108 M_B_RAS# I 109 M_B_WE# I 110 M_CS#2 I 111 +1.8VSUS --- 112 +1.8VSUS 113 M_B_CAS# I 114 M_ODT2 115 M_CS#3 I 116 M_B_A13 I/O 117 +1.8VSUS --- 118 +1.
Pin Assignment 155 GND --- 156 GND --- 157 M_B_DQ52 I/O 158 M_B_DQ53 I/O 159 M_B_DQ49 I/O 160 M_B_DQ48 I/O 161 GND --- 162 GND --- 163 NC --- 164 M_CLK_DDR4 I 165 GND --- 166 M_CLK_DDR#4 I 167 M_B_DQS#6 I/O 168 GND --- 169 M_B_DQS6 I/O 170 M_B_DM6 I 171 GND --- 172 GND --- 173 M_B_DQ55 I/O 174 M_B_DQ51 I/O 175 M_B_DQ50 I/O 176 M_B_DQ54 I/O 177 GND --- 178 GND --- 179 M_B_DQ56 I/O 180 M_B_DQ60 I/O 181 M_B_DQ57 I/O M_B_DQ61 I/O
Pin Assignment PIN No. Signal name I/O PIN No. Signal name I/ O 1 HDMITX2P_ C --- 2 GND --- 3 HDMITX2N_ C --- 4 HDMITX1P_ C --- 5 GND --- 6 HDMITX1N_ C --- 7 HDMITX0P_ C --- 8 GND --- 9 HDMITXON_ C I/O 10 HDMICLK+C --- 11 GND --- 12 HDMICLK-C --- 13 CEC --- 14 --- --- 15 HDMI DDCCLK C I/O 16 HAMI DDCDATA C --- 17 GND --- 18 DDC5V --- 19 HDMI HP --- 20 GND --- 21 GND --- 22 GND --- 23 GND --- CN47 ODD Connectors PIN No.
Pin Assignment CN39 VGA Connectors PIN No. Signal name PIN No.
Pin Assignment 60 GND 59 GND 62 PEG_TXN5 61 PEG_RXN5 64 PEG_TXP5 63 PEG_RXP5 66 GND 65 GND 68 PEG_TXN4 67 PEG_RXN4 70 PEG_TXP4 69 PEG_RXP4 72 GND 71 GND 74 PEG_TXN3 73 PEG_RXN3 76 PEG_TXP3 75 PEG_RXP3 78 GND 77 GND 80 PEG_TXN2 79 PEG_RXN2 82 PEG_TXP2 81 PEG_RXP2 84 GND 83 GND 86 PEG_TXN1 85 PEG_RXN1 88 PEG_TXP1 87 PEG_RXP1 90 GND 89 GND 92 PEG_TXN0 91 PEG_RXN0 94 PEG_TXP0 93 PEG_RXP0 96 GND 95 GND 98 100 EXT_CRT_DDCCL K EXT_CRT_DDCD AT 102 GND 104 106 EXT_HDMI_DDCC L
Pin Assignment AT 114 GND 113 VGA_MBCLK 116 EXT_VGA_RED 115 EXT_LVDS_BLON 118 GND 117 EXT_DISP_ON 120 EXT_VGA_GRN 119 DP_HPD 122 GND 121 GND 124 EXT_VGA_BLU 123 EXT_HSYNC 126 GND 125 EXT_VSYNC 128 130 EXT_LVDS_TXL# 2 EXT_LVDS_TXL2 132 GND 134 136 EXT_LVDS_TXL# 1 EXT_LVDS_TXL1 138 GND 140 142 EXT_LVDS_TXL# 0 EXT_LVDS_TXL0 144 GND 146 148 150 EXT_LVDS_TXLC K# EXT_LVDS_TXLC K GND 127 129 GND EXT_LVDS_TXU# 2 131 EXT_LVDS_TXU2 133 135 GND EXT_LVDS_TXU# 1 137 EXT_LVDS_TXU1 139 141 GND E
Pin Assignment 158 5V 157 X 160 5V 159 3V 162 X 161 3V 164 X 163 3V 166 DP_CAD 165 3V 168 CEC 167 3V 170 GND 169 X 172 EXT_DPTX3N 171 X 174 EXT_DPTX3P 173 DVI_HPD 176 GND 175 GND 178 EXT_DPTX2N 177 EXT_HDMICLK- 180 EXT_DPTX2P 179 EXT_HDMICLK+ 182 GND 181 GND 184 EXT_DPTX1N 183 EXT_HDMITX2N 186 EXT_DPTX1P 185 EXT_HDMITX2P 188 GND 187 GND 190 EXT_DPTX0N 189 EXT_HDMITX1N 192 EXT_DPTX0P 191 EXT_HDMITX1P 194 GND 193 GND 196 DP_AUX1P 195 EXT_HDMITX0N 198 DP_AUX1N 197 EXT_H
Pin Assignment 9 LAN _ VCC4 --- 10 LAN _ LINKLED# --- 11 LAN _ ACTLED --- 12 LAN _ GND --- CN37 USB Connectors PIN No. Signal name I/O PIN No. Signal name I/O 1 GND --- 2 BUSBP6+ --- 3 BUSBP6- --- 4 USBPWR2 --- 5 GND --- 6 GND --- 7 GND --- 8 GND --- CN32 2nd SATA HDD Connectors PIN No. Signal name I/O PIN No. Signal name I/O 1 GND --- 2 SATA_TXP1 O 3 SATA_TXN1 O 4 GND --- 5 SATA_RXN1 I 6 SATA_RXP1 I 7 GND --- 8 +3.3VSATA --- 9 +3.
Pin Assignment CN33 5 in 1 Card Reader Connectors PIN No. Signal name I/O PIN No.
Pin Assignment CN46 SATA HDD Connectors PIN No. Signal name I/O PIN No. Signal name I/O 1 GND --- 2 SATA_TXP0 O 3 SATA_TXN0 O 4 GND --- 5 SATA_RXN0 I 6 SATA_RXP0 I 7 GND --- 8 +3.3VSATA --- 9 +3.3VSATA --- 10 +3.3VSATA --- 11 GND --- 12 GND --- 13 GND --- 14 +5V --- 15 +5V --- 16 +5V --- 17 GND --- 18 --- --- 19 GND --- 20 --- --- 21 --- --- 22 --- --- 23 GND --- 24 GND --- CN22 TMA Connectors PIN No. Signal name I/O PIN No.
Pin Assignment 11 TMPSPR-GND 12 TMPSPR-SXP 13 CLKDWN# 14 ALERT 15 PLTRST# 16 CLKREQ# 17 NC 18 NC 19 +3V_TMA_VDD 20 +3V_TMA_VDD 21 NC 22 NC 23 NC 24 GND 25 GND 26 GND 27 GND 28 GND 29 GND 29 GND 31 GND 30 GND CN17 Mini Card Connectors PIN No. Signal name I/O PIN No. Signal name I/O 1 WAKE# O 2 +3V --- 3 BT_DATA --- 4 GND --- 5 BT_CHCLK --- 6 +1.
Pin Assignment 23 PCIE_RXN5 O 24 +3V_S5 --- 25 PCIE_RXP5 O 26 GND --- 27 GND --- 28 +1.5V --- 29 GND --- 30 MINI3_SMCLK I/O 31 PCIE_TXN5 I 32 MINI3_SMDATA I/O 33 PCIE_TXP5 I 34 GND --- 35 GND --- 36 USBD- I/O 37 GND --- 38 USBD+ I/O 39 --- --- 40 NC --- 41 --- --- 42 --- --- 43 GND --- 44 --- --- 45 C_LINK_CLK --- 46 --- --- 47 C_LINK_DAT --- 48 +1.
Pin Assignment CN6 SPDIF Connectors PIN No. Signal name I/O PIN No.
Display codes Appendix. D Appendix D Display Codes D.1 Display Codes Table D-1-1 Scan codes (set 1 and set 2) (1/4) Cap No.
Display codes Table D-1-2 Scan codes (set 1 and set 2) (2/4) Cap No.
Display codes Table D-1-3 Scan codes (set 1 and set 2) (3/4) Cap No.
Display codes Table D-1-4 Scan codes (set 1 and set 2) (4/4) Cap No. Keytop Code set 1 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 126 Pause *7 *7 *7 *7 *7 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Make Code set 2 Break Make Notes: 1. 2. 3. 4. 5. 6. 7. * * * * * * * Scan codes differ by mode. Scan codes differ by overlay function.
Display codes Table D-1-5 Scan codes with left Shift key Cap Key Code set 1 No.
Display codes Table D-1-6 Scan codes in Numlock mode Cap Key Code set 1 No.
Display codes Table D-1-8 Scan codes in overlay mode Cap No. Code set 1 Keytop Code set 2 Make Break Make Break 09 8 (8) 48 C8 75 F0 75 10 9 (9) 49 C9 7D F0 7D 11 0 (*) 37 B7 7C F0 7C 23 U (4) 4B CB 6B F0 6B 24 I (5) 4C CC 73 F0 73 25 O (6) 4D CD 74 F0 74 26 P (–) 4A CA 7B F0 7B 37 J (1) 4F CF 69 F0 69 38 K (2) 50 D0 72 F0 72 39 L (3) 51 D1 7A F0 7A 40 ; (+) 4E CE 79 F0 79 52 M (0) 52 D2 70 F0 70 54 .
Display codes Table D-1-10 No.126 key scan code Key top Pause Shift Code set 1 Code set 2 Make Make Common* E1 1D 45 E1 Ctrl* E0 C6 E0 46 9D *: This key generates only make codes.
Appendix E Key Layout 1. United Status (US) Keyboard Figure US keyboard 2.
3. United Kingdom (UK) Keyboard Figure UK keyboard 3.
Appendix F Appendix F F.1 Wiring Diagrams RGB Monitor ID Wraparound connector (1) RED RED (2) GREEN GREEN (2) (3) BLUE BLUE (3) (4) NC NC (4) (5) GND GND (5) (6) GND GND (6) (7) GND GND (7) (8) GND GND (8) (9) 5V 5V (9) (10) GND GND (10) (11) NC NC (11) (12) SDA SDA (12) (13) HSYNC HSYNC (13) (14) VSYNC (15) SDL VSYNC (14) SCL (1) (15) Figure F-1-1 RGB Monitor ID Wraparound connector (15PIN to 15PIN) F.
Wiring Diagrams Qosmio X500 Maintenance Manual (960-Q08) F-2
