TOSHIBA TOSHIBA NOTEBOOK Maintenance Manual (960-Q01) Satellite L10 [CONFIDENTIAL]
Contents: 1. 2. 3. 4. 1-ii Chapter 1 Chapter 2 Chapter 3 Chapter 4 Hardware Overview ........................... 1-1 Troubleshooting Procedures............... 2-1 Test Program for Field........................ 3-1 Replacement Procedures.....................
Chapter 1 Hardware Overview [CONFIDENTAIL]
1 1-ii Hardware Overview [CONFIDENTIAL] Satellite L10 Maintenance Manual(960-Q01)
Chapter 1 Contents 1.1 Features ...................................................................................................................... 1-1 1.2 System Block Diagram .............................................................................................. 1-5 1.3 2.5-inch Hard Disk Drive......................................................................................... 1-10 1.4 Optical Drive....................................................................................
Figures Figure 1-1 Front of the computer and the system units configuration ............................ 1-5 Figure 1-2 System block diagram.................................................................................... 1-6 Figure 1-3 2.5-inch HDD............................................................................................... 1-10 Figure 1-4 DVD-ROM & CD-R/RW drive ................................................................... 1-12 Figure 1-5 DVD Super Muti drive...........
Chapter 1 Hardware Overview 1 Features 1.1 Features The Satellite L10 series are 2 spindle PCs running a Intel ® Celeron®-M processor and Intel . Intel ® Mobile Pentium ®-M The features are listed below. Microprocessor Microprocessor that is used will be different of the model. If North Bridge is 852GM , it supports Celeron-M as follows Intel ® Celeron ®-M 350 (1.30GHz) 360 (1.40GHz) 370 (1.
Chapter 1 Hardware Overview Two DDR333 SO-DIMM slots. Memory modules can be installed to provide a maximum of 2GB. Memory modules are available in 256MB 512MB and 1GB sizes. VRAM Shared with System RAM. HDD Double (or single) 40GB, 60GB and 80GB internal drives. 2.5 inch x 9.5mm height. USB FDD (Option) USB FDD supports 720KB and 1.44MB.
Chapter 1 Hardware Overview Display LCD Built-in 15.0-inch, XGA (1024 x 768 dots), 262,144 colors, amorphous silicon TFT color display. CRT Supported via a RGB connector. TV-out S-VIDEO OUT port supported. Keyboard An-easy-to-use 84(US)/85(Euro)-key keyboard provides a numeric keypad overlay for fast numeric data entry . The keyboard also includes two keys that have special functions in Microsoft® Windows® XP. It supports software that uses a 101- or 102key enhanced keyboard.
Chapter 1 Hardware Overview Optical devices A DVD-ROM & CD-R/RW drive or DVD Super Multi drive is equipped. Battery The RTC battery is equipped inside the computer. The main battery is a detachable lithium ion battery (4,300mAh:Li-Ion, 8cell). USB (Universal Serial Bus) Three USB ports are provided. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported.
Chapter 1 Hardware Overview Figure 1-1 Front of the computer and the system units configuration Satellite L10 Maintenance Manual(960-Q01) [CONFIDENTIAL] 1-5
Chapter 1 Hardware Overview 1.2 System Block Diagram Figure 1-2 shows the system block diagram.
Chapter 1 Hardware Overview Figure 1-2 System block diagram for 852GM/855GME Platform Satellite L10 Maintenance Manual(960-Q01) [CONFIDENTIAL] 1-7
Chapter 1 Hardware Overview The PC contains the following components. CPU If the north bridge is 852GM , it supports Celeron-M CPU as follows Intel ® Celeron ®-M 350 (1.30GHz) 360 (1.40GHz) 370 (1.50GHz) L1 cache : 64KB (32KB + 32KB) L2 cache : 1MB FSB : 400MHz Core voltage : 1.26V If the North Bridge is 855GME , It supports Pentium-M CPU as follows Intel ® Mobile Pentium ®-M Pentium-M 1.60GHz (Processor Number ; 725) 1.70GHz (Processor Number ; 735) 1.80GHz (Processor Number ; 745) 2.
Chapter 1 Hardware Overview BIOS ROM (Flash memory) • 4Mbit (512K×8-bit chip) Chipset This gate array has the following elements and functions. • North Bridge (Intel 852GM (GMCH, B-step)) − − − − • Or North Bridge (Intel 855GME (GMCH, B-step)) − − − − • Celeron-M processor System Bus support DRAM Controller : DDR266/DDR200 support Hub Link Interface 732-ball 37.5mmx37.5mm Mirco FC-BGA Package Pentium-M processor System Bus support DRAM Controller : DDR333 support Hub Link Interface 732-ball 37.
Chapter 1 Hardware Overview VGA controller • Intel VGA − VRAM 16MB/32MB/64MB − LVDS Other main system chips • • • • • • Clock Generator (ICS-made ICS950810 x 1) EC/KBC (NS97551 x 1) AC97-CODEC (Conexant 20468-31 x1) Audio AMP (Maxim 9750x1) TV Encoder (Chrontel CH7011A) Mini PCI Wireless LAN card (BTO) 2.4GHz DSSS/OFDM LAN card is equipped. Conformity with IEEE 802.11b/g . Transfer speed is maximum of 54Mbit/sec. Supports 128bit WEP. LAN (Realtek RT8100CL x 1) Controls LAN.
Chapter 1 Hardware Overview 1.3 2.5-inch Hard Disk Drive A compact, high-capacity HDD with a height of 9.5mm. Contains a 2.5-inch magnetic disk and magnetic heads. Figure 1-3 shows a view of the 2.5-inch HDD and Tables 1-1 and 1-2 list the specifications. Figure 1-3 2.5-inch HDD Table 1-1 2.5-inch HDD dimensions Standard value Parameter TOSHIBA MK4025GAS TOSHIBA MK6025GAS Width (mm) 69.85 Outline Height (mm) 9.5 dimensions Depth (mm) 100.0 Weight (g) 94 (typ.) / 95 (max.
Chapter 1 Hardware Overview Table 1-2 2.5-inch HDD Specifications Specification Parameter TOSHIBA MK4025GAS TOSHIBA MK6025GAS 40GB 60GB Storage size (formatted) Speed (RPM) 4,200 Data transfer speed (Mbits/s) 175.0 ~ 341.7 Interface transfer rate (MB/s) 201.6 ~ 307.5 100 (Ultra DMA Mode) Storage density (Kbpi) 735 (max.) 658 (max.) 88.1 88.1 Track density (Ktpi) Average random seek time (read) (ms) 12 Average random seek time (write) (ms) - Power-on-to-ready (sec) 1-12 4 (typ.
Chapter 1 Hardware Overview 1.4 Optical Drive 1.4.1 DVD-ROM & CD-R/RW Drive The DVD-ROM & CD-R/RW drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15inch) CD/DVD-ROM and CD-R/RW. It is a high-performance drive that reads DVD at maximum 8-speed and CD at maximum 24-speed. The DVD-ROM & CD-R/RW drive is shown in Figure 1-4. The dimensions and specifications of the DVD-ROM & CD-R/RW drive are described in Table 1-3, Table 1-4.
Chapter 1 Hardware Overview Table 1-4 DVD-ROM & CD-R/RW drive specifications (1/2) Drive Specification Parameter MATSUSHITA (UJDA760TT-A) Data transfer speed Access time (ms) (Random) Read (KB/s) DVD-ROM MAX 8X CAV (MAX 10800 KB/s) DVD-R MAX 4X CAV (MAX 5400 KB/s) CD-ROM MAX 24X CAV (MAX 3600 KB/s) Write CD-R 4X,8X(CLV), 16X(PCAV), MAX24x(CAV) CD-RW 4X (CLV) High Speed CD-RW 4X,8X,10X (CLV) Ultra Speed CD-RW 10X(CLV), Max24X(CAV) ATAPI interface (MB/s) PIO Mode4 (MAX 16.
Chapter 1 Hardware Overview Table 1-4 DVD-ROM & CD-R/RW drive specifications (2/2) Drive Specification Parameter TOSHIBA (TS-L462A) Data transfer speed Access time (ms) (Random) Read (KB/s) CD-ROM,CD-RW MAX 24X CAV (MAX 3,600KB/s) DVD-ROM MAX 8X CAV (MAX 10800KB/s) DVD±R,DVD±RW MAX 6X (MAX 8100 KB/s) DVD-RAM MAX 4X CAV (MAX 5400KB/s) Write CD-R MAX 24X (P-CAV) CD-RW 4X (CLV) High Speed CD-RW 4X,10X (CLV) Ultra Speed CD-RW 24X (P-CAV) ATAPI interface (MB/s) PIO Mode4 (MAX 16.
Chapter 1 Hardware Overview 1.4.2 DVD Super Multi Drive The DVD Super Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD/DVD-ROM, CD-R/RW, DVD±R/±RW and DVD-RAM. It is a high-performance drive that reads DVD-ROM at maximum 8-speed and CD at maximum 24-speed. Write speed of DVD±R/±RW and DVD-RAM is different depending on the drive. The DVD Super Multi drive is shown in Figure 1-5. The dimensions and specifications of the DVD Super Multi drive are described in Table 1-5, Table 1-6.
Chapter 1 Hardware Overview Table 1-6 DVD Super Multi drive specifications (1/1) Drive Specification Parameter MATSUSHITA (UJ-830BTQ-A) Data transfer speed Access time (ms) Read(KB/s) DVD-ROM MAX 8X CAV CD-ROM MAX 24X CAV Write CD-R MAX 24X (Zone CLV) CD-RW 4X (CLV) High Speed CD-RW 10X (CLV) Ultra Speed CD-RW 10X (CLV) DVD-R MAX 8X (Zone CLV) DVD-RW MAX 4X (Zone CLV) DVD+R MAX 8X (Zone CLV) DVD+RW MAX 4X (Zone CLV) DVD-RAM 3X (ZCLV) (4.7GB) ATAPI interface (MB/s) PIO Mode4 (MAX 16.
Chapter 1 Hardware Overview 1.5 Keyboard A keyboard which consists of 84(US)/85(Euro) keys is mounted on the system unit. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-6 is a view of the keyboard. Figure 1-6 Keyboard See Appendix E for details of the keyboard layout.
Chapter 1 Hardware Overview 1.6 TFT Color Display The TFT color display is 15.0 inch and consists of LCD module and FL inverter board. 1.6.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 262,144 colors with 1,024 x 768 resolution. Figure 1-8 shows a view of the LCD module and Table 1-9 lists the specifications.
Chapter 1 Hardware Overview 1.6.2 FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module FL. Table 1-10 lists the FL inverter board specifications. Table 1-8 FL inverter board specifications Specifications Item Input PI FL9030 DELTA DAC-08N009 SUMIDA IV002 8 ~ 20 8 ~ 20 7.
Chapter 1 Hardware Overview 1.7 Power Supply The power supply supplies 23 different voltages to the system board. The power supply microcontroller has the following functions. 1. 2. 3. 4. 5. 6. 7. 8. Judges if the DC power supply (AC adapter) is connected to the computer. Detects DC output and circuit malfunctions. Controls the battery icon, and DC IN icon. Turns the battery charging system on and off and detects a fully charged battery. Turns the power supply on and off.
Chapter 1 Hardware Overview Table 1-9 Power supply output rating Power supply （Yes/No） Name Voltage [V] Power OFF Suspend mode Power OFF Boot mode No Battery Object VCC_CORE 1.484 0.748 No No No CPU VTT 1.05 No No No CPU, GMCH, ICH4-M +1.8V 1.8 No No No CPU 1.2VCCT 1.35 No No No GMCH SMDDR_VTE RM 1.25 Yes No No DDR-SDRAM Termination +1.5V 1.5 No No No GMCH, ICH4-M, TV Encoder 1.5V_S5 1.5 Yes Yes No ICH4-M 2.5VSUS 2.
Chapter 1 Hardware Overview 1.8 Batteries The PC has the following two batteries. Main battery Real time clock (RTC) battery Table 1-12 lists the specifications for these two batteries. Table 1-70 Battery specifications Battery Name Battery Element Panasonic CGR-B/8B9BE Main battery Capacity 14.4V 4,300mAh 14.8V 4,400mAh 3V 14mAh Lithium ion Simplo 916-4050 Real time clock (RTC) battery Output Voltage ML1220EI2 Nickel hydrogen 1.8.
Chapter 1 Hardware Overview 1.8.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and detects a full charge when the AC adaptor and battery are connected to the computer. Battery Charge When the AC adapter is connected, normal charging is used while the system is turned on and quick charge is used while the system is turned off. Refer to the following Table 1-11.
Chapter 1 Hardware Overview 1.8.3 RTC Battery The RTC battery provides the power supply to maintain the date, time, and other system information in memory. Table 1-13 lists the Time required for charges of RTC battery and data preservation time.
Chapter 1 Hardware Overview 1.9 AC Adapter The AC adapter is used to charge the battery. Table 1-14 lists the AC adapter specifications. Table 1-14 AC adapter specifications Parameter Specification DELTA SADP-65KB BFG Power 65W Input voltage AC 100V/240V Input frequency 50Hz/60Hz Input current 1-26 LITE-ON PA-1650-02QT ≦ 1.5A ≦ 1.8A Output voltage DC 19V Output current 3.
Chapter 2 Troubleshooting Procedures [CONFIDENTIAL]
2 2-ii [CONFIDENTIAL] Satellite L10 Maintenance Manual(960-Q01)
Chapter 2 Contents 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart........................................................................................ 2-3 2.3 Power Supply Troubleshooting.................................................................................. 2-7 2.4 2.5 2.6 2.7 2.8 Procedure 1 Power Status Check .........................................................
2.9 2.10 2.11 2.12 2.13 2.14 2-iv Display Troubleshooting.......................................................................................... 2-33 Procedure 1 External Monitor Check....................................................... 2-33 Procedure 2 Diagnostic Test Program Execution Check ......................... 2-33 Procedure 3 Connector and Cable Check................................................. 2-34 Procedure 4 Replacement Check .............................................
Chapter 2 Troubleshooting Procedures 2 2.1 Troubleshooting Chapter 2 describes how to determine which Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. (The “FRU” means the replaceable unit in the field.) The FRUs covered are: 1. Power supply 6. Touch pad 11. Wireless LAN 2. System Board 7. Display 12. Sound 3. USB FDD 8. Optical Disk Drive 4. 2.5” HDD 9. Modem 5. Keyboard 10. LAN The Test Program operations are described in Chapter 3.
Chapter 2 Troubleshooting Procedures There are following two types of connections in the figure of board and module connection in and after 2.3 Power Supply Troubleshooting. (1) Cable connection is described in the figure as line. (2) Pin connection is described in the figure as arrow.
Chapter 2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which troubleshooting procedures to execute. Before going through the flowchart steps, verify the following: Ask him or her to enter the password if a password is registered. Verify with the customer that Toshiba Windows is installed on the hard disk. NonWindows operating systems can cause the computer to malfunction.
Chapter 2 Troubleshooting Procedures Figure 2-1 Troubleshooting flowchart (1/2) 2-4 [CONFIDENTIAL] Satellite L10 Maintenance Manual (960-Q01)
Chapter 2 Troubleshooting Procedures Figure 2-1 Troubleshooting flowchart (2/2) Satellite L10 Maintenance Manual (960-Q01) [CONFIDENTIAL] 2-5
Chapter 2 Troubleshooting Procedures If the diagnostics program cannot detect an error, the problem may be intermittent. The Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error(s), then perform the appropriate troubleshooting procedures as follows: 1.
Chapter 2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
Chapter 2 Troubleshooting Procedures Table 2-2 DC IN icon DC IN icon Power supply status Lights green DC power is being supplied from the AC adapter. Doesn’t light Any condition other than those above. *1 When the power supply controller detects a malfunction, the DC IN icon blinks orange. It shows an error code. When the icon is blinking, perform the following procedure. 1. Remove the battery pack and the AC adapter. 2. Re-attach the battery pack and the AC adapter.
Chapter 2 Troubleshooting Procedures Procedure 2 Connection Check The wiring diagram related to the power supply is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Make sure the AC adapter and the AC power cord are firmly plugged into the DC IN socket (CN13) and wall outlet. If these cables are connected firmly, go to Check 2. Check 2 Replace the AC adapter and the AC power cord with new ones. • • Check 3 If the DC IN icon does not light, go to Procedure 4.
Chapter 2 Troubleshooting Procedures Procedure 4 Replacement Check The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4, Replacement Procedures. When AC adapter is connected ; Check 1 AC adapter may be faulty. Replace the AC adapter with a new one. If the problem still occurs, perform Check 2. Check 2 System board may be faulty.
Chapter 2 Troubleshooting Procedures 2.4 System Board Troubleshooting This section describes how to determine if the system board is malfunctioning or not. Start with Procedure 1 and continue with the other procedures as instructed.
Chapter 2 Troubleshooting Procedures Procedure 1 Message Check When the power is turned on, the system performs the Power On Self Test (POST) installed in the BIOS ROM. The POST tests each IC on the system board and initializes it. If an error message is shown on the display, perform Check 1. If there is no error message, go to Procedure 2. If MS-DOS or Windows XP is properly loaded, go to Procedure 4.
Chapter 2 Troubleshooting Procedures Check 3 The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (24) or (25) is displayed, go to Procedure 4. If error message (18) is displayed, go to the Keyboard Troubleshooting Procedures. If error message (19), (20) or (21) is displayed, go to the 2.5” HDD Troubleshooting Procedures.
Chapter 2 Troubleshooting Procedures Procedure 2 Debugging Port Check Check the MiniPCI Debug board. The tool for debug port test is shown below. Figure 2-2 A set of tool for debug port test The test procedures are follows: 1. Replace MiniPCI debug port with Wireless LAN card, check LED in the miniPCI debug board The following is a list of the Test Point codes written to port 80h at the start of each routine, the beep codes issued for terminal errors, and a description of the POST routine.
Chapter 2 Troubleshooting Procedures Code Beeps POST Routine Description 14h Initialize keyboard controller 16h 1-2-2-3 BIOS ROM checksum 17h Initialize cache before memory autosize 18h 8254 timer initialization 1Ah 8237 DMA controller initialization 1Ch Reset Programmable Interrupt Controller 20h 1-3-1-1 Test DRAM refresh 22h 1-3-1-3 Test 8742 Keyboard Controller 24h Set ES segment register to 4 GB 26h Enable A20 line 28h Autosize DRAM 29h Initialize POST Memory Manager 2Ah Clear 512 KB base RAM 2Ch 1-3-4
Chapter 2 Troubleshooting Procedures 66h Configure advanced cache registers 67h Initialize Multi Processor APIC 68h Enable external and CPU caches 69h Setup System Management Mode (SMM) area 6Ah Display external L2 cache size 6Bh Load custom defaults (optional) 6Ch Display shadow-area message 6Eh Display possible high address for UMB recovery 70h Display error messages 72h Check for configuration errors 76h Check for keyboard errors 7Ch Set up hardware interrupt vectors 7Eh Initialize coprocessor if presen
Chapter 2 Troubleshooting Procedures Code Beeps POST Routine Description AAh Scan for F2 key stroke ACh Enter SETUP AEh Clear Boot flag B0h Check for errors B2h POST done - prepare to boot operating system B4h 1 One short beep before boot B5h Terminate QuietBoot (optional) B6h Check password (optional) B9h Prepare Boot Bah Initialize DMI parameters BBh Initialize PnP Option ROMs BCh Clear parity checkers BDh Display MultiBoot menu BEh Clear screen (optional) BFh Check virus and backup reminders C0h Try to
Chapter 2 Troubleshooting Procedures Code Beeps For Boot Block in Flash ROM E0h Initialize the chipset E1h Initialize the bridge E2h Initialize the CPU E3h Initialize system timer E4h Initialize system I/O E5h Check force recovery boot E6h Checksum BIOS ROM E7h Go to BIOS E8h Set Huge Segment E9h Initialize Multi Processor EAh Initialize OEM special code EBh Initialize PIC and DMA ECh Initialize Memory type EDh Initialize Memory size EEh Shadow Boot Block EFh System memory test F0h Initialize interrupt vec
Chapter 2 Troubleshooting Procedures Procedure 3 Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test [It is not supported] 6. Printer test [It is not supported] 7. Async test [It is not supported] 8. Hard Disk test 9. Real Timer test 10.
Chapter 2 Troubleshooting Procedures 2.5 USB FDD Troubleshooting To check if the USB FDD is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: FDD Head Cleaning Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector Check and Replacement Check Procedure 1 FDD Head Cleaning Check FDD head cleaning is one option available in the Diagnostic Program. After connecting USB FDD, insert the Diagnostics Disk in the floppy disk drive.
Chapter 2 Troubleshooting Procedures Procedure 2 Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled. Floppy disk drive test error codes and their status names are listed in Table 2-7.
Chapter 2 Troubleshooting Procedures Procedure 3 Connector Check and Replacement Check USB FDD is connected to USB port on system board and US board. US board is also connected to system board by cable. The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks. USB FDD can be connected to the following 3 ports.
Chapter 2 Troubleshooting Procedures Check 2 USB FDD may be faulty. Replace it with a new one. If the problem still occurs, perform Check 3. Check 3 Connect USB FDD to each port embedded on system board . If it does not work properly when connected to CN14, CN19, CN22 or all ports, perform Check 4. Check 4 System board may be faulty. Replace it with a new one following the steps in Chapter 4, Replacement Procedures.
Chapter 2 Troubleshooting Procedures 2.6 2.5” HDD Troubleshooting To check if 2.5” HDD is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Partition Check Procedure 2: Message Check Procedure 3: Format Check Procedure 4: Diagnostic Test Program Execution Check Procedure 5: Connector Check and Replacement Check CAUTION: The contents of the hard disk will be erased when the 2.5” HDD troubleshooting procedures are executed.
Chapter 2 Troubleshooting Procedures Procedure 2 Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen. Make sure no floppy disk is in the FDD. Turn on the computer and check the message on the screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with Check 1 below and perform the other checks as instructed.
Chapter 2 Troubleshooting Procedures Procedure 3 Format Check The computer’s HDD is formatted using the MS-DOS FORMAT program or the physical format program of the test program. To format the HDD, start with Check 1 below and perform the other steps as required. Refer to the MS-DOS Manual for the operation of MS-DOS. For the format by the test program, refer to the Chapter 3. Check 1 Format an 2.5” HDD using MS-DOS FORMAT command. Type as FORMAT C:/S/U. If 2.5” HDD can not be formatted, perform Check 2.
Chapter 2 Troubleshooting Procedures Procedure 4 Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. The error codes and statuses are described in Table 2-8.
Chapter 2 Troubleshooting Procedures Procedure 5 Connector Check and Replacement Check HDD(s) is/are connected to the connector(s) on the system board. The connection of HDD(s) and board may be defective. Otherwise, they may be faulty. Disassemble the computer following instructions in Chapter 4, Replacement Procedures and perform the following checks. Check 1 Make sure HDD(s) is/are firmly connected to the connector(s) on the system board.
Chapter 2 Troubleshooting Procedures 2.5 2.7 Keyboard Troubleshooting To check if the computer’s keyboard is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test (DIAGNOSTIC TEST) and Pressed key display test (ONLY ONE TEST) in the Diagnostic Program.
Chapter 2 Troubleshooting Procedures Procedure 2 Connector and Replacement Check The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure keyboard cable is firmly connected to system board. If the connection is loose, reconnect firmly and repeat Procedure 1. If the problem still occurs, go to Check 2. Check 2 Keyboard may be faulty.
Chapter 2 Troubleshooting Procedures 2.8 Touch pad Troubleshooting To check if the computer’s touch pad is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Touch pad test (ONLY ONE TEST) in the Diagnostic Program. Refer to Chapter 3, Tests and Diagnostics, for more information on how to perform the test program.
Chapter 2 Troubleshooting Procedures Procedure 2 Connector and Replacement Check The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the cable is firmly connected to system board. If the connection is loose, reconnect firmly and repeat Procedure 1. If the problem still occurs, go to Check 2.
Chapter 2 Troubleshooting Procedures 2.9 Display Troubleshooting To check if the computer’s display is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: External Monitor Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector and Cable Check Procedure 4: Replacement Check Procedure 1 External Monitor Check Connect an external monitor to the computer’s external monitor port, then boot the computer.
Chapter 2Troubleshooting Procedures Procedure 3 Connector and Cable Check LCD Module is connected to system board by an LCD/FL cable. FL inverter board is also connected to system board by an LCD/FL cable. And, fluorescent lamp is connected to FL inverter board by HV cable. Their cables may be disconnected from system board or FL inverter board. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures.
Chapter 2 Troubleshooting Procedures Procedure 4 Replacement Check Fluorescent lamp, FL inverter, LCD module, HV cable and LCD/FL cable are connected to display circuits. Any of these components may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: If fluorescent lamp does not light, perform Check 1. If characters or graphics on the internal display are not displayed clearly, perform Check 4.
Chapter 2Troubleshooting Procedures 2.10 Optical Disk Drive Troubleshooting To check if optical disk drive is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the CD-ROM/DVD-ROM Test in the Diagnostic Program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
Chapter 2 Troubleshooting Procedures 2.11 Modem Troubleshooting To check if modem is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute Modem test in the LAN/Modem/Bluetooth/IEEE1394 test program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
Chapter 2Troubleshooting Procedures Check 2 Modem cable may be faulty. Replace it with a new one. If the problem still occurs, perform Check 3. Check 3 MDC may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem still occurs, perform Check 4. Check 4 Cable between MDC and system board may be faulty. Replace it with a new one following the instructions in Chapter 4. If the problem still occurs, perform Check 5. Check 6 System board may be faulty.
Chapter 2 Troubleshooting Procedures 2.12 LAN Troubleshooting To check if the computer’s LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute LAN test in the LAN/Modem test program. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
Chapter 2Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting To check if the computer's Wireless LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting-Receiving Check Procedure 2: Antennas' Connection Check Procedure 3: Replacement Check Procedure 1 Transmitting-Receiving Check Before starting the test, make sure the wireless communication switch is set in the ON position.
Chapter 2 Troubleshooting Procedures Procedure 2 Antennas' Connection Check The wireless LAN function-wiring diagram is shown below: Any of the connections may be defective. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless communication switch is “On”. If the switch is “Off”, turn it “On”. If the problem still occurs, perform Check 2.
Chapter 2Troubleshooting Procedures Procedure 3 Replacement Check Wireless LAN card, wireless LAN antenna or system board may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 Wireless LAN antenna may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 2. Check 2 Wireless LAN card may be faulty.
Chapter 2 Troubleshooting Procedures 2.14 Sound Troubleshooting To check if the sound function is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Sound test in Sound Test program disk. Refer to Chapter 3, Tests and Diagnostics for more information on how to perform the test program.
Chapter 2Troubleshooting Procedures Procedure 3 Replacement Check If external microphone does not work properly, perform check 1. If headphone does not work properly, perform check 2. If speaker does not work properly, perform check 4. Check 1 External microphone may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem still occurs, perform Check 5. Check 2 Headphone may be faulty. Replace it with a new one following the steps in Chapter 4.
Chapter 3 Test Program for Field [CONFIDENTAIL]
1 Hardware Overview Chapter 3 Contents 3.1 Tests and Diagnostics Software Overview ................................................................ 3-1 3.2 Executing the Diagnostic Test ................................................................................... 3-3 3.3 Subtest names............................................................................................................. 3-7 3.4 System Test.................................................................................
3.24 Common Tests and Operation ................................................................................. 3-76 3.24.1 How to operate a window ............................................................................. 3-76 3.24.2 How to Stop the Test Program...................................................................... 3-76 3.24.3 Test Status Screen ......................................................................................... 3-76 3.24.5 How to enter data .....................
Chapter3 Test Program for Field. 3. Tests and Diagnostics Software 3.1 Tests and Diagnostics Software Overview This chapter explains how to use the Tests and Diagnostics Software for the Satellite™ L10 and Satellite™ Pro L10 computer systems. NOTES: Before starting the Tests and Diagnostics software: 1. Check all cables for loose connections. 2. Exit any application and close Windows. NOTE: This manual follows the Diagnostic Test Menu order of the Satellite L10.
Chapter3 Test Program for Field. The following equipment is required to perform some of the diagnostic test programs: The Diagnostics Disk (all tests) A formatted working disk for the floppy disk drive test (all tests) A printer wraparound connector for the printer wraparound test (printer test) A CD test media (Toshiba Backup CD ROM and music CD for the CD-ROM test) Serial port wraparound connector The following sections detail the tests contained within the Diagnostic Test Menu.
Chapter3 Test Program for Field. 3.2 Executing the Diagnostic Test MS-DOS is required to run the Diagnostics Program. To start the program follow these steps: 1. Create a DOS bootable disk and copy all the files from the Tests and Diagnostics software to the disk. Label the new work disk the same as the original. 2. Insert the new work disk into the computer’s floppy disk drive and turn on the computer. The following screen displays: TOSHIBA Satellite L10 Diagnostics Version 0.
Chapter3 Test Program for Field. The following menu displays for the Satellite L10: TOSHIBA Satellite L10 Diagnostics Version 0.90 (C) Copyright Toshiba Corp. 2004 ESC : :Select item :Escape [ DIAGNOSTICS MENU ] 01. DIAGNOSTIC TEST 02. RUNNING TEST 03. DISK UTILITIES [ DIAGNOSTIC TEST MENU ] 04. LOG UTILITIES 05. SYSTEM SYSTEM TEST CONFIGURATION 10. CACHE MEMORY TEST 01. 06. 02. OPTION MEMORY TEST 11. HIGH RESOLUTION DISPLAY TEST 03.EXIT KEYBOARD TEST 12. MULTIMEDIA TEST 99. 04. DISPLAY TEST 13.
Chapter3 Test Program for Field. Refer to Sections 3.4 through 3.18 for detailed descriptions of Diagnostics Tests 1 through 14. Item 88 sets the floppy disk drive and hard disk drive error retry count. Item 99 exits the submenu of the Diagnostic Test and returns to the Diagnostics Menu. 4. Select the subtest you want to execute and press Enter. The following menu displays: TOSHIBA Satellite L10 Diagnostics Version 0.90 (C) Copyright Toshiba Corp.
Chapter3 Test Program for Field. TOSHIBA Satellite L10 Diagnostics Version 0.90 (C) Copyright Toshiba Corp. 2004 ESC : :Select item :Escape [ SYSTEM TEST ] [ DIAGNOSTICS MENU ] 01. 01. ROM ROM checksum checksum 01. DIAGNOSTIC TEST 02. RUNNING TEST 03. DISK UTILITIES ES DIAGNOSTIC TEST MENU ] 04. LOG UTILITI[ 05. SYSTEM CONFIGURATION 01. TEST 09. REAL TIME CLOCK TEST 06. SYSTEM OPTION 02. MEMORY TEST 10. NPX TEST 99.KEYBOARD EXIT TEST 03. 11. HIGH RESOLUTION DISPLAY TEST 04. DISPLAY TEST 12.
Chapter3 Test Program for Field. 3.3 Subtest names Table 3-1 lists the subtest names for each test program in the Diagnostic Test menu. Table 3-1 Subtest Names(1/3) No. 01 Test Name SYSTEM TEST No.
Chapter3 Test Program for Field. Table 3-1 Subtest Names(2/3) No. 05 06 07 08 09 3-8 Test Name No.
Chapter3 Test Program for Field. Table 3-1 Subtest Names(3/3) No. 10 11 12 14 15 Test Name CACHE MEMORY TEST No.
Chapter3 Test Program for Field. 3.4 System Test To execute the System Test select 01 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The System Test contains one subtest that tests the basic functionality of ROM, RAM, and the processor. This test, combined with all the other diagnostics tests, provides a complete overall system test. Move the highlight bar to the subtest you want to execute and press Enter.
Chapter3 Test Program for Field. 3.5 Memory Test To execute the Memory Test select 02 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Memory Test contains five subtests that test the computer’s memory. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: If NO is selected for Test Loop on the Test Parameter menu, the Test Status screen displays while the test is executing. When the test is complete the Memory Test menu displays.
Chapter3 Test Program for Field. 5. Address pattern test “16 bit write and 16 bit read” of address pattern data is executed and the new data is compared with the original data. Test data = 0000H, 0004H, 0008H, 000CH,...8000H, 8004H, through FFECH Subtest 02 Protected Mode This subtest first writes data patterns and address data from 1 to 32 MB, then reads the new data and compares the result with the original data patterns. Addresses are displayed in 64KB increments during the test. . Test Process: 1.
Chapter3 Test Program for Field. Test Process: 1. Checks the memory size to determine the maximum size of installed memory. 2. Tests memory addresses 0 to the maximum installed. 3. Writes, reads, and compares test data after a memory refresh cycle (16ms or more). NOTE: There may be a short delay between write and read operations, depending on the memory size. Subtest 05 Stress Test This subtest writes the following 16KB data patterns to the Write/Read Buffer in conventional memory.
Chapter3 Test Program for Field. 3.6 Keyboard Test To execute the Keyboard Test select 03 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Keyboard Test contains six subtests that test the computer’s keyboard and mouse actions. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: The Test Loop and Error Stop parameters are not enabled for the Keyboard test. The test of a keyboard test cannot be supported.
Chapter3 Test Program for Field. Subtest 04 Keyboard LED The LED display for Num Lock, Caps Lock, and Scroll Lock (in that order) will flash repeatedly. Confirm this visually. The following screen displays while this test executes. Keyboard LED “ON” CHECK ! Press ANY KEY If there is an error, a message displays as follows: ERROR STATUS : XX Actual Subtest 05 PS/2 Mouse (Pointing) This subtest checks the functions of the mouse as shown below.
Chapter3 Test Program for Field. Press mouse buttons 1 and 3 simultaneously.
Chapter3 Test Program for Field. 3.7 Display Test To execute the Display Test select 04 from the Diagnostic Test Menu, press Enter and follow the directions displayed on the screen. The Display Test contains thirteen subtests that test the display in various modes. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Character Attributes This subtest displays character attributes and color attributes.
Chapter3 Test Program for Field. Press Enter if NO was selected for Test Loop on the Test Parameter Menu. Press Ctrl + break if YES was selected for Test Loop on the Test Parameter Menu.
Chapter3 Test Program for Field. Subtest 02 Character Set This subtest displays the character codes 00H - FFH, using Mode 01H (40*25). The screen below displays when this subtest is executed. CHARACTER SET IN 40*25 Press [Enter] Key To exit this subtest and return to the Display Test menu: Press Enter if NO was selected for Test Loop on the Test Parameter Menu. Press Ctrl + break if YES was selected for Test Loop on the Test Parameter Menu.
Chapter3 Test Program for Field. Subtest 03 80 * 25 Character Display This subtest uses 80*25 video resolution to display character codes 20-H 7EH using Mode 03H (80*25). The data displayed is shifted 1 byte to the left for each line as shown below. 80*25 CHARACTER DISPLAY 01234567890123456789012345678901234567890123456789012345678901234567890123456789 !”#$%&’()*=,.-/0123456789:;Ù?@ABCDEFGHIJKLMNOPQRSTUVWXYZ[\]^_’abcdefghIjklmno !”#$%&’()*=,.
Chapter3 Test Program for Field. Subtest 04 320 * 200 Character Display This subtest uses 320*200 video resolution to display green, red and yellow followed by cyan, magenta, and white. The screen below shows the displays when this subtest is executed.
Chapter3 Test Program for Field. 320*200 GRAPHICS DISPLAY : [ D ] BLACK D GRAY BLUE L BLUE GREEN L GREEN CYAN L CYAN RED L RED MAGENTA L MAGENTA BROWN YELLOW WHITE I WHITE Press [Enter] KEY Press ENTER to display 64 gradations of red, green, blue and white on the screen 320*200 GRAPHICS DISPLAY : [ 13 ] 64 gradations of red are displayed. 64 gradations of green are displayed. 64 gradations of blue are displayed. 64 gradations of white are displayed.
Chapter3 Test Program for Field. Subtest 05 640 * 200 Character Display This subtest uses 640*200 video resolution to display three windows, each window drives a different set of dots: even dots, odd dots and all dots. The screen below displays when this subtest is executed.
Chapter3 Test Program for Field. Subtest 06 640 * 480 Character Display This subtest uses 640*350 video resolution to display 16 colors: black, blue, green, cyan, red, magenta, brown, white, dark gray, light blue, light green, light cyan, light red, light magenta, yellow, and intensified white. The screen below displays when this subtest is executed.
Chapter3 Test Program for Field. 640*480 GRAPHICS DISPLAY : [12 ] BLACK DARK GRAY BLUE LIGHT GREEN LIGHT GREEN CYAN LIGHT CYAN RED LIGHT RED MAGENTA LIGHT MAGENTA BROWN YELLOW WHITE INTENSIFIED WHITE BLUE Press [Enter] KEY To exit this subtest and return to the Display Test menu: Press Enter if NO was selected for Test Loop on the Test Parameter Menu. Press Ctrl + break if YES was selected for Test Loop on the Test Parameter Menu.
Chapter3 Test Program for Field. Subtest 07 Display Page This subtest displays video pages zero through seven. DISPLAY PAGE 0 000000000000000000000000000000000000000000000000000000000000000 0.............................................................0 0.............................................................0 0.............................................................0 0.............................................................0 0.............................................................
Chapter3 Test Program for Field. Subtest 08 "H" Pattern Display This subtest displays a full screen of "H" patterns.
Chapter3 Test Program for Field. Subtest 10 Color Graphics Display This subtest displays three colors, cyan, white and yellow on the screen as shown below. 640 * 480 GRAPHICS DISPLAY CYAN WHITE YELLOW To exit this subtest and return to the Display Test menu: Press Enter if NO was selected for Test Loop on the Test Parameter Menu. Press Ctrl + break if YES was selected for Test Loop on the Test Parameter Menu.
Chapter3 Test Program for Field. Subtest 11 Color Attributes Display This subtest displays 16 colors: black, blue, green, cyan, red, magenta, brown, white, dark gray, light blue, light green, light cyan, light red, light magenta, yellow, and intensified white. The screen below displays when this subtest is executed.
Chapter3 Test Program for Field. NOTE: The following screen does not display correctly. It will be amended in the next version. Press [Enter] Key Press Enter to execute the VRAM mapping test which displays a vertical line at four dot intervals using Mode 12. Press [Enter] Key Press Enter to display VRAM mapping test using the all dots Mode.
Chapter3 Test Program for Field. Press [Enter] Key To exit this subtest and return to the Display Test menu: Press Enter if NO was selected for Test Loop on the Test Parameter Menu. Press Ctrl + break if YES was selected for Test Loop on the Test Parameter Menu.
Chapter3 Test Program for Field. Subtest 12 Color Tiling This subtest displays black, gray, white, and 3 gradations of red, green, and blue as shown in the following display. Black Red Green Blue Gray Red Gradation Green Gradation Blue Gradation White Red Gradation Green Gradation Blue Gradation To exit this subtest and return to the Display Test menu: Press Enter if NO was selected for Test Loop on the Test Parameter Menu.
Chapter3 Test Program for Field. 3.8 Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the diagnostics disk and insert the work disk into the FDD. The contents of the floppy disk will be erased. To execute the Floppy Disk Test select 05 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Floppy Disk Test contains five subtests that test the FDD. Move the highlight bar to the subtest you want to execute and press Enter.
Chapter3 Test Program for Field. 4. Test Drive number Drive Number 1&2 1 2 (1: A DRIVE 2:B DRIVE) Select the drive number 1&2 , 1, or 2 to be tested and press Enter. 5. Media Type 360KB Media type 720KB 1.2MB 1.44MB Select the media type for the floppy disk to be tested and press Enter. 6. Test Start Track Number Test Start Track Number (00-79) ? Select the track where you want the test to start and press Enter. Pressing Enter without first specifying a track sets the start track to zero.
Chapter3 Test Program for Field. Subtest 04 Write Specified Address NOTE: The first two digits of the ADDRESS indicate which track is being tested, the next two digits indicates the head, and the last two digits indicate the sector. This subtest allows you to verify the errors from Subtest 02. It writes specified data to a specified track and head. Use the Log Utilities (see Section 3.21) to specify the track number and head number where the error(s) occurred during Subtest 02.
Chapter3 Test Program for Field. 3.9 Parallel Port Test To execute the Printer Test select 06 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Printer Test contains two subtests that test the output of the printer connected to the computer. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: An IBM-compatible printer must be connected to the system to execute this test.
Chapter3 Test Program for Field. Subtest 02 Wraparound NOTE: To execute this subtest, the parallel and serial ports must be enabled. NOTE: To execute this subtest, a printer wraparound connector must be connected to the computer’s printer port. The printer wraparound connector (34M741986G01) wiring diagram is shown below.
Chapter3 Test Program for Field. 2. Status line test This test is the same as the data line test . 3. ACK line test This test checks the acknowledge line using INT 0FH. NOTE: If NO is selected for Test Loop on the Test Parameter menu, the screen will remain blank while the test is executing. When the test is complete the Printer Test menu displays. If YES is selected for Test Loop on the Test Parameter menu, the screen will remain blank while the test is executing.
Chapter3 Test Program for Field. 3.10 Async Test To execute the Async Test select 07 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Async Test contains two subtests that test the asynchronous communication functions. Move the highlight bar to the subtest you want to execute and press Enter.
Chapter3 Test Program for Field. 4. Receive Data after confirmation of status. 5. Comparison of data transmitted/received. NOTE: If NO is selected for Test Loop on the Test Parameter menu, the Test Status screen displays while the test is executing. When the test is complete the Async Test menu displays. If YES is selected for Test Loop on the Test Parameter menu, the Test Status screen displays while the test is executing. Press Ctrl + break to return to the Async Test menu.
Chapter3 Test Program for Field. 3.11 Hard Disk Test To execute the Hard Disk Test select 08 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Hard Disk Test contains nine subtests that test the functions of the hard disk drive. Move the highlight bar to the subtest you want to execute and press Enter. NOTES: The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 08, or 09 is executed.
Chapter3 Test Program for Field. NOTE: If NO is selected for Test Loop, the Test Status screen displays while the test is executing. When the test is complete the Hard Disk Test menu displays. If YES is selected for Test Loop, the Test Status screen displays. Press Ctrl + break to return to the Hard Disk Test menu. 3. Error Stop Select YES to stop the test program when an error is found. Select NO to keep the test running even if an error is found. 4.
Chapter3 Test Program for Field. Subtest 02 Address Uniqueness This subtest writes unique address data to each sector of the HDD track-bytrack. The data written to each sector is then read and compared with the original data. There are three ways the HDD can be read: Subtest 03 • Forward sequential • Reverse sequential • Random Random Address Data This subtest writes random data to random addresses on the HDD. This data is then read and compared to the original data.
Chapter3 Test Program for Field. NOTE: This subtest is designed to run with the Test Loop set to NO. This subtest is a debug tool and the operator should enter the Test Parameters each time. This subtest allows you to verify the errors from Subtest 01. It reads specified data (Subtest 06) from a specified LBA. Use the Log Utilities (see Section 3.21) to specify the LBA number where the error(s) occurred during Subtest 01. The following message displays on the screen to enter the test sector count.
Chapter3 Test Program for Field. Subtest 08 W-R-C Specified Address This subtest writes specified data to a specified sector count, then reads and compares the result. The following message displays on the screen to enter the test data, sector count. TEST DATA ???(=37b3H) SECTOR COUNT ? Subtest 09 Unclip NOTE: This subtest is designed to run with the Test Loop set to NO. This subtest is a debug tool. This subtest sets the native address.
Chapter3 Test Program for Field. 3.12 Real Time Clock Test To execute the Real Time Clock Test select 09 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Real Time Clock Test contains three subtests that test the computer’s real time functions. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real Time This subtest allows you to change the date and time. To execute the Real Time Subtest, follow these steps: 1.
Chapter3 Test Program for Field. Subtest 02 Backup Memory This subtest writes 50 bytes of test data (FFH, AAH, 55H, and 00H) to the CMOS 14th address, then reads the new data and compares it to the original data. Subtest 03 Real Time Carry CAUTION: When this subtest is executed, the current date and time are reset. This subtest checks the clock’s carry function.
Chapter3 Test Program for Field. 3.13 Cache Memory Test To execute the Cache Memory Test select 10 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Cache Memory Test contains eight subtests that test the computer's cache memory. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: If NO is selected for Test Loop on the Test Parameter menu, the screen will remain blank while the subtest is executing.
Chapter3 Test Program for Field. Subtest 04 Bit Shift Pattern Test This subtest reads the contents of cache memory and saves it into RAM. The subtest then writes the bit shift data patterns (1 bit shifted every 4 bytes), reads the new data and compares the result with the original data. The original cache memory content is then restored to the cache memory. Subtest 05 Write Disturb Test This subtest reads the contents of cache memory and saves it into RAM.
Chapter3 Test Program for Field. 3.14 High Resolution Display Test To execute the High Resolution Display Test select 11 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The High Resolution Display Test contains eight subtests that test the computer's high resolution video display. Move the highlight bar to the subtest you want to execute and press Enter.
Chapter3 Test Program for Field. Subtest 02 640*480 Mode Display This subtest uses 640*480 video resolution to display a high resolution white frame, 256 letter types (8*16 pixels) and 64 gradations of white, red, green, and blue as shown below.
Chapter3 Test Program for Field. Subtest 03 800 * 600 Mode Display This subtest uses 800*600 video resolution to display a high resolution white frame, 256 letter types (8*16 pixels) and 256 gradations of white, red, green, and blue as shown below.
Chapter3 Test Program for Field. Subtest 04 1024* 768 Mode Display This subtest uses 1024*768 video resolution to display a high resolution white frame, 256 letter types (8*16 pixels) and 64 gradations of white, red, green, and blue as shown below.
Chapter3 Test Program for Field. Subtest 05 1280* 1024 Mode Display This subtest uses 1280*1024 video resolution to display a high resolution white frame, 256 letter types (8*16 pixels) and 64 gradations of white, red, green, and blue as shown below.
Chapter3 Test Program for Field. Subtest 06 1600* 1200 Mode Display This subtest uses 1600*1200 video resolution to display a high resolution white frame, 256 letter types (8*16 pixels) and 256 gradations of white, red, green, and blue as shown below.
Chapter3 Test Program for Field. Subtest 07 “H” Pattern Display This subtest uses the 1024*768 Mode to display a high resolution white frame, “H” letters (8*16 pixels fonts), at 128 letters by 48 lines.
Chapter3 Test Program for Field. Subtest 08 Focus Test ( “E” Pattern) This subtest sets the 1024*768 Mode and displays “E” patterns (18*18 dot fonts), at 56 letters *42 lines surrounded by a high resolution white frame. To exit this subtest and return to the High Resolution Display Test menu: Press Enter if NO was selected for Test Loop on the Test Parameter Menu. Press Ctrl + break if YES was selected for Test Loop on the Test Parameter Menu.
Chapter3 Test Program for Field. 3.15 Multimedia Test To execute the Multimedia Test select 12 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Multimedia Test contains four subtests that test the computer's multimedia functions. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: Use the Toshiba Backup CD-ROM for Subtests 01, 02, and 03.
Chapter3 Test Program for Field. Subtest 04 1 Point W/R/C (R/RW Media) NOTE: Use CD-R or CD-RW, the CD-ROM and DVD cannot be used for this subtest. This subtest writes specified data to a specified block count, then reads and compares the result.
Chapter3 Test Program for Field. 3.16 USB Test NOTE: This subtest used a test fixture. The test fixture was made by CATC. Please refer to the description of CATC for the details of a test. When you cannot prepare a test fixture, please check by Windows. To execute the USB Test select 13 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The USB Test contains five subtests. Subtest 01 Execute USB HPT test (DID:24x2) This subtest is used with Subtest 01 described above.
Chapter3 Test Program for Field. 3.17 MEMORY2 Test To execute the Expansion Test select 14 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The MEMORY2 Test contains four subtests that test the computer's. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: If NO is selected for Test Loop on the Test Parameter menu, the Test Status screen displays while the test is executing. When the test is complete the Memory Test menu displays.
Chapter3 Test Program for Field. Tee test method is the same as Subtest2. However, the data to be used differs.
Chapter3 Test Program for Field. 3.18 Error Codes and Error Status Names The following table lists the error codes and error status names for the Diagnostic Tests.
Chapter3 Test Program for Field.
Chapter3 Test Program for Field.
Chapter3 Test Program for Field.
Chapter3 Test Program for Field. 3.19 Running Test 3.19.1 Function Description This function automatically executes the following tests in sequence: 1. 2. 3. 4. 5. 6. System Test (Subtest 01) Memory Test (Subtest 01, 02, 03 and, 04)) Display Test (Subtest 01, 02, 03, 04, 05, 06,07 and, 08) Floppy Disk Test (Subtest 02) Hard Disk Test (Subtest 01 and 02) Real Time Clock Test (Subtest 02) The system automatically detects the number of FDDs connected to the computer for the Floppy Disk Test.
Chapter3 Test Program for Field. 2. Select 05 from the Diagnostics Menu and press Enter, the following message displays: Mount the work disk on the drive, then press [Enter] key. [Warning : The contents of the disk, will be destroyed.] 3. This program is executed according to the Count Loop number selected in the Running Test Edit Item, see Section 3.23. To terminate the program, press Ctrl + Break.
Chapter3 Test Program for Field. 3.20 CHECK DMI INFOEMATION Select 03 from the Diagnostics Menu and press Enter to display the following DMI Information Data: The Check DMI Configuration program contains the following configuration information for the computer: NOTE: Please set the media of DVD before starting a test. System information (Type 1) 1. Manufacture : TOSHIBA 2. Product Name : Satellite XXXXXX 3. Version :(TOSHIBA Part Number) 4. Serial Number : Serial Number 5.
Chapter3 Test Program for Field. 3.21 Log Utilities This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk, or output data to a printer. If the power switch is turned off, the error information will be lost. Error information is displayed in the following order: 1. 2. 3. 4. 5. 6. 7. 8. 9.
Chapter3 Test Program for Field. 2. Error information displayed on the screen can be manipulated with the following number keys: The 1 key scrolls the display to the next page. The 2 key scrolls the display to the previous page. The 3 key returns to the Diagnostics Menu. The 4 key erases all error log information in RAM. The 5 key outputs the error log information to a printer. The 6 key reads the log information from a floppy disk. The 7 key writes the log information to a floppy disk. 3.
Chapter3 Test Program for Field. 3.22 System Configuration 3.22.1 Function Description NOTE: This module will be enhanced in the next release. The System Configuration program contains the following configuration information for the computer: 2. BIOS ROM version 3. The main memory size 4. The number of floppy disk drives 5. The number of async ports 6. The number of hard disk drives 7. The number of printer ports 8. The expansion memory 9. The CPU 10. The LCD Type(Cannot support) 11.
Chapter3 Test Program for Field. 3.23 Running Test Edit Item 3.23.1 Function Description Function description lets you add or delete the subtests used to execute the Running Test. The following screen displays after pressing the Tab key to edit an item in the Running Test. KEY OPERATION Ð Ï PgDn PgUp Home End Ins Del Enter Cursor Down Cursor Up Page Down Page Up Top of ITEM End of ITEM Insert ITEM Delete ITEM End 3.23.
Chapter3 Test Program for Field. 1. Enter a number or 0 for Loop Count and press Enter. Select a number from 1 to 65534 to define the number of times the Running Test executes. Select 0 to run the test continuously until halted by the user. 2. Select the NO or YES for Error Stop and press Enter. Select NO to keep the test running even if an error is found. Select YES to stop the test program when an error is found.
Chapter3 Test Program for Field. 3.24 Common Tests and Operation 3.24.1 How to operate a window To input parameters, or open a window use the following keys. key [Enter] key [Esc] key : to move a highlight bar : to select an item at the highlight bar : to close the current window and go back to the previous window 3.24.2 How to Stop the Test Program To stop a test: [Ctrl]+[Break] Press the Ctrl key and the Break key simultaneously. 3.24.
Chapter3 Test Program for Field. Test Information Displays test information in the following format: aabbcdee aa = Test No. bb = Sub-test No. c = Drive No. d = Unit No. ee = Status Subtest No. Displays the Subtest number in the following format: ffgg ff = Subtest No. gg = Step Number (Will be blank if the test does not have a Step Number.) 3-76 Pass Count Displays the number of times the test has been executed. Error Count Displays the number of errors which have occurred during the test.
Chapter3 Test Program for Field. 3.24.4 Test Stop Display If an error occurs during a Subtest and YES is selected for Error Stop, the following message displays: [HALT OPERATION] 1. Test end 2. Continue 3. Retry * Select 1, 2, or 3 The three selections have the following functions: 1: Terminates the test program and exits to the subtest menu. 2: Continues the test from the error. 3: Restarts the test from the beginning. Use the arrow keys to move the cursor to the desired option and press Enter. 3.24.
Chapter3 Test Program for Field. 3.25 DMI Tool NOTE: When you write DMI data, please be sure to turn off PC. Otherwise, the correct DMI data cannot be displayed when you use DMIINF.EXE DMI Tool consists of two following programs. 1. DMI Data Write 2. DMI Data Read 3.25.1 DMI Data Write This program can be used when writing the following DMI data. Program name is QDMI.EXE (By Quanta) 1.PA Number 2.Product Name 3.Serial Number 4.PV Number 5.Manufacture Name The sample of input data is shown below.
Chapter3 Test Program for Field. The sample of text file is shown below. << DMI Information Display : V1.00 >> (c)Copyright TOSHIBA Corp.
Chapter 4 Replacement Procedures [CONFIDENTIAL]
Replacement Procedures 4 4-2 [CONFIDENTIAL] QOSMIO G10 Maintenance Manual (960-497)
Replacement Procedures Chapter 4 4.1 Contents Overview.................................................................................................................... 4-1 Safety Precautions ................................................................................................ 4-2 Before You Begin ................................................................................................ 4-3 Disassembly Procedure...........................................................................
Replacement Procedures Figures Figure 4-1 Removing the battery pack................................................................................. 4-8 Figure 4-2 Removing a PC card......................................................................................... 4-10 Figure 4-3 Removing a bridge media ................................................................................ 4-11 Figure 4-4 Removing the HDD assembly..........................................................................
Replacement Procedures Figure 4-30 Removing a MDC ............................................................................................ 4-46 Figure 4-31 Removing the touch pad................................................................................... 4-47 Figure 4-32 Removing the hinge (cover assembly side) ..................................................... 4-49 Figure 4-33 Removing the RTC battery ..............................................................................
Chapter 4 Replacement Procedures 4 2 4.1 Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual. In all cases when removing an FRU, the battery pack must also be removed.
Chapter 4 Replacement Procedures Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. DANGER: 1. In the case of the battery, always use authentic parts or equivalent parts approved by Toshiba. Other batteries may have different specifications that are incompatible with the computer and may result in fire or explosion.
Chapter 4 Replacement Procedures Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2.1 Battery Pack”. 1. Do not disassemble the computer unless it is operating abnormally. 2. Use the designated tools. 3. Ensure that the environment for working on and storing parts does not contain any of the following.
Chapter 4 Replacement Procedures Disassembly Procedure Three main types of cable connector are used. • Pressure plate connector • Spring connector • Normal pin connector When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cable out from the connector. When reconnecting a cable to a pressure plate connector, lift up the pressure plate to a suitable height and insert the cable into the connector.
Chapter 4 Replacement Procedures Assembly Procedure After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. • Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems. • Check that all cables and connectors are securely connected.
Chapter 4 Replacement Procedures Screw Tightening Torque Use the following torque when tightening screws. CAUTION: Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage. NOTE: To tighten screws quickly and accurately, an electric screwdriver is recommended. • M2 (2mm) 0.167 N·m (1.7 kgf·cm) • M2.5 (2.5mm) 0.245 N·m(2.5 kgf·cm) • M2.5 (2.5mm) 0.392 N·m(4.0 kgf·cm) for Hinge support • M3.0 (3mm) 0.
Chapter 4 Replacement Procedures Screw Notation To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body. Format: Screw shape + Screw length (mm) Screw shape B: Bind screw F: Thin head screw S: Super thin head screw T: Tapping screw U: Other screws (Unique screws: pan head, stud, etc.
Chapter 4 Replacement Procedures 4.2 Battery pack Removing the battery pack The following describes the procedure for removing the battery pack (See Figure 4-1). CAUTION: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC adapter and all external devices from the computer. 3. Turn the computer upside down. 4.
Chapter 4 Replacement Procedures Figure 4-1 Removing the battery pack NOTE: Dispose of the used battery pack in accordance with the laws and ordinances of your local authority. Installing the battery pack The following describes the procedure for installing the battery pack (See Figure 4-1). CAUTION: There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly.
Chapter 4 Replacement Procedures 2. Disconnect the AC adapter and all external devices from the computer. 3. Attach the battery cover to the battery pack. 4. Insert the battery pack 5.
Chapter 4 Replacement Procedures 4.3 PC card Removing a PC card The following describes the procedure for removing a PC card (See Figure 4-2). CAUTION: Insert or remove a PC card in accordance with any instructions in a PC card manual or the manuals of the computer system you are using. 1. Push the eject button. It will pop out when you release it. Then press the eject button once more to eject a PC card. 2. Grasp a PC card and remove it.
Chapter 4 Replacement Procedures 2. Insert a PC card and press it until it is securely connected.
Chapter 4 Replacement Procedures 4.4 HDD Removing a HDD The following describes the procedure for removing a HDD (See Figure 4-4 to 4-5). CAUTION: Take care not to press on the top or bottom of a HDD. Pressure may cause data loss or damage to the device. 1. Turn the computer upside down. 2. Remove the following screws securing a HDD slot cover and remove a HDD slot cover. • M2.5×4.0B FLAT BIND screw x2 3. Remove the following screws securing the HDD assembly. • M2.5×4.0B FLAT BIND screw x１ 4.
Chapter 4 Replacement Procedures CAUTION: When a HDD is installed, they are installed in the position as the following figure. M2.5x4.
Chapter 4 Replacement Procedures 5. Remove the following screws securing the HDD holder and remove the HDD holder. • M3.0×4.0B FLAT BIND screw x4 HDD HDD holder M3.0x3.5.
Chapter 4 Replacement Procedures Installing a HDD The following describes the procedure for installing a HDD (See Figure 4-4 to 4-5). 1. Install a HDD to the HDD holder and secure it with the following screws. • M3.0×3.5F FLAT BIND screw x4 NOTE: Although they are 3mm head screws, screw torque must be set in 2.5kg-cm for four screws securing the HDD holder. 2. Insert the HDD assembly into the HDD slot and connect it carefully to the CN18 on the system board. 3.
Chapter 4 Replacement Procedures 4.5 Wireless LAN card Removing a Wireless LAN card The following describes the procedure for removing a Wireless LAN card (See Figure 4-6). 1. Remove the following screw of wireless cover securing wireless LAN card cover and remove it. • 2.5.0 x 4.0B BIND screw x2 2. Disconnect the wireless LAN antenna cable Main (Black cable) and AUX (White cable) from the connectors on a wireless LAN card. 3.
Chapter 4 Replacement Procedures Installing a Wireless LAN card The following describes the procedure for installing a Wireless LAN card (See Figure 4-7). 1. Insert a wireless LAN card terminals slantwise into the connector CN27 on the computer and press a wireless LAN card until it is securely in place. 2. Connect the wireless LAN antenna cables (black and white) to the terminals on a wireless LAN card. 3. Install the wireless LAN card cover and secure it with the following screw.
Chapter 4 Replacement Procedures 4.6 Memory module CAUTION: The power of the computer must be turned off when you remove a memory module. Removing a memory module with the power on risks damaging the module or the computer itself. Do not touch memory module terminals. Any dirt on the terminals may cause memory access problems. Never press hard or bend a memory module. Removing a memory module To remove a memory module, confirm that the computer is in boot mode.
Chapter 4 Replacement Procedures Figure 4-4 Removing a memory module 4-20 [CONFIDENTIAL] Satellite L10 Maintenance Manual (960-Q01)
Chapter 4 Replacement Procedures Installing a memory module To install a memory module, confirm that the computer is in boot mode. Then perform the following procedure (See Figure 4-8). 1. Insert a memory module into the connector of the computer slantwise (terminal side first) and press it to connect firmly. CAUTION: The power must be turned off when you insert a memory module. Inserting a memory module with the power on might damage the module or the computer itself.
Chapter 4 Replacement Procedures 4.7 Keyboard Removing the keyboard The following describes the procedure for removing the keyboard (See Figure 4-9 to 4-11). CAUTION: As the keycap may fall out, when handling the keyboard always hold it by the frame and do not touch the keycap. 1. Turn the computer upside down 2. Loose the screw securing KBD cover. M2.0x3.0B Flat BIND screws x2 3. Loose the screw securing keyboard. M2.5x6.0B Flat BIND screws X2 4. Upside down the computer. 5. Open the display. 6.
Chapter 4 Replacement Procedures M2.5x6.0 M2,0X3.
Chapter 4 Replacement Procedures KBD cover Keyboard Figure 4-6 Removing the keyboard/KBD cover 4-24 [CONFIDENTIAL] Satellite L10 Maintenance Manual (960-Q01)
Chapter 4 Replacement Procedures Installing the keyboard The following describes the procedure for installing the keyboard (See Figure 4-9 to 4-110). 1. Turn the keyboard upside down and place it on the palm rest as its face down. Connect the keyboard flexible cable to the connector CN3200 on the system board. 2. Install the keyboard support plate and secure it with the following screws. • M2.5×8.0B FLAT BIND screw x2 3. Turn the keyboard face up and put it on the computer.
Chapter 4 Replacement Procedures 4.8 LED Board Removing the LED Board The following describes the procedure for removing the LED board (See Figure 4-12). 1. Remove the following screw securing the switch membrane. • M2.5×3.0B FLAT BIND screw x2 2. Push up the LED board to the arrow direction and remove it. LED Board M2.5x3.
Chapter 4 Replacement Procedures Installing the LED Board The following describes the procedure for installing the switch membrane (See Figure 4-12). 1. Press LED board in the computer. 2. Secure the LED board with the following screw. • M2.5×3.
Chapter 4 Replacement Procedures 4.9 Optical disk drive NOTE: Do not apply excessive force to the top of an optical disk drive. Do not touch the shaded portion of the figure below, when the drive is removed or installed. Removing an optical disk drive The following describes the procedure for removing an optical disk drive (See Figure 4-13 and 4-14). 1. Turn over the computer and remove the following screws securing an optical disk drive. • M2.5×6.0B FLAT BIND screw x1 2. Upside down the computer. 3.
Chapter 4 Replacement Procedures Optical disk drive M2.5 x 6.0B FLAT BIND M2.5 x 6.
Chapter 4 Replacement Procedures ODD bracket M2.0×3.0 Figure 4-9 Disassembling the ODD bracket Installing an optical disk drive The following describes the procedure for installing an optical disk drive (See Figure 4-13 and 4-14). 1. Attach the ODD bracket to an optical disk drive and secure it with the following screws. • M2.0×3.0 Flat BIND screw x3 2. Insert an optical disk drive assembly into the slot and connect it to the connector CN25 on the system board. 3.
Chapter 4 Replacement Procedures 5. screws.M2.5×6.
Chapter 4 Replacement Procedures 4.10 Display assembly Removing the display assembly The following describes the procedure for removing the display assembly (See Figure 4-15 to 4-20). 6. Close the display and turn the computer upside down . 7. Remove the following screws from the k/b cover of the computer. • M2.0×3.0 FLAT BIND screw x2 (Locktight) • M2.5×6.0 FLAT BIND screw x2 (Locktight) M2.5x6.0 FLAT BIND (Locktight) M2.0x3.
Chapter 4 Replacement Procedures 8. Open the MINIPCI Door and remove the wireless LAN antenna connector . Figure 4-16 Removing the MINIPCI door and connetor (back) 9. Open the display and removing the k/b cover and keyboard .
Chapter 4 Replacement Procedures 10. Pull out the wireless LAN antenna cables from the guide Wireless LAN antenna cable Figure 4-188 Removing the antenna cables (back) 11. Opening the display to 180 degree, and remove the hinge screw . ‧ M2.3×6.0 FLAT BIND screw x4 (Locktight) M2.5x6.0 FLAT BIND (Locktight) M2.5x6.0 FLAT BIND (Locktight) . 4-34 .
Chapter 4 Replacement Procedures Figure 4-199 Removing the hinge screw (back) [back] Satellite L10 Maintenance Manual (960-Q01) [CONFIDENTIAL] 4-35
Chapter 4 Replacement Procedures 12. Remove the LCD harness from the connector on the system board and Pulling out the pole of hinge from the hole of hinge assembly, remove the display assembly from the base assembly. .
Chapter 4 Replacement Procedures Installing the display assembly The following describes the procedure for installing the display assembly (See Figure 4-15 to 4-20). 13. Inserting the pole of hinge to the hole of hinge assembly, set the display assembly on the base assembly. 14. Secure the hinges with the following screws , Secure the display mask with the following screws and stick the mask seal on them. • M2.5×6.
Chapter 4 Replacement Procedures 4.11 Cover assembly Removing the cover assembly The following describes the procedure for removing the cover assembly (See Figure 4-21 to 4-24). 1. Turn over the computer. 2. Remove the following screws securing the cover assembly from the back and bottom of computer. • M2.5×6.0B FLAT BIND screw x18 • M2.5×2.
Chapter 4 Replacement Procedures Figure 4-212 Removing the screws (back) 3. Disconnect the touch pad flat cable from the connector on the system board. 4. Removing the screw from power board and remove the power board . M2.5×3.
Chapter 4 Replacement Procedures Power board M2.5x3.
Chapter 4 Replacement Procedures 5. Pull up and remove the cover assembly from the base assembly.
Chapter 4 Replacement Procedures Installing the cover assembly The following describes the procedure for installing the cover assembly (See Figure 4-21 to 4-24). 1. Install the cover assembly to the base assembly. NOTE: Be careful not to catch the cables between cover assembly and base assembly. 2. Connect the touch pad flat cable to the connector on the system board. 3. Secure the cover assembly with the following screws from the back and bottom of computer. 4-42 • M2.5×2.0B FLAT BIND screw x3 • M2.
Chapter 4 Replacement Procedures 4.12 Touch pad Removing the touch pad The following describes the procedure for removing the touch pad (See Figure 4-31). 1. Peel off the glass tape and disconnect the touch pad flat cable from the connector on the touch pad and peel the al foil . 2. Remove the following screws securing the touch pad plate. • M2.5×3.0B SUPER THIN HEAD screw x5 3. Turning up the insulator, remove the touch pad plate. 4. Peel off and remove the touch pad from the cover assembly. M2.5x3.
Chapter 4 Replacement Procedures 1. Peel off the separator covering on the sensor portion of a new touch pad. NOTE: Do not reuse the touch pad so that it can not be used after peeling off from the computer. Be sure to stick a new touch pad. When stickimg the touch pad, be careful not to get the bubbles under the touch pad. 2. Stick and install the touch pad on the cover assembly. 3. Install the touch pad plate and secure it with the following screws. • M2.5×3.0B SUPER THIN HEAD screw x5 4.
Chapter 4 Replacement Procedures 4.13 System board CAUTION: 1. When handling the system board, always hold by the edges. Do not touch the printed circuit face. 2. If replacing with a new system board, execute the subtest01 Initial configuration in section 3.3 “Setting of the hardware configuration”. Also update with the latest BIOS as described in Appendix G “BIOS Rewrite Procedures” and with the latest EC/KBC as described in Appendix H “EC/KBC Rewrite Procedures”.
Chapter 4 Replacement Procedures Installing the system board The following describes the procedure for installing the system board (See Figure 4-41). 1. Secure the system board with the following screws. • M2.5×4.0 BIND screw x2 2. Connect the speaker cable to the connector CN 11 on the system board.
Chapter 4 Replacement Procedures 4.14 CPU Removing the CPU The following describes the procedure for removing the CPU heat sink (See Figure 4-44 ). 1. Disconnect the Heat sink cable from the connector CN1 on the system board 2. Remove the following screws securing the heat sink holder. • M2.0×4.0 BIND screw x3 NOTE: When removing the heat sink holder, be sure to remove the screws in the reverse order of the number marked on the holder. 3. Remove the CPU heat sink . M2.0x4.
Chapter 4 Replacement Procedures 4. Unlock the CPU by rotating the cam on the CPU socket 120 degrees to the counterclockwise with a flat-blade screwdriver. 5. Remove the CPU. Figure 4-43 Removing the CPU Installing the CPU The following describes the procedure for installing the CPU (See Figure 4-44 to 4-46). 1. Check that the mark of cam is in the unlocking position. 2. Attach the CPU to the correct position in the CPU socket. 3.
Chapter 4 Replacement Procedures NOTE: Apply the silicon grease enough to cover the chip surface using the special applicator. Figure 4-44 Applying silicon grease 5. Install the CPU heat sink and secure them with the following screws. M2.0×4.0 BIND screw x3 6. Connect the Heat sink cable to the connector CN 1on the system board NOTE: When securing the heat sink holder, be sure to secure the screws in the order of the number marked on the holder.
Chapter 4 Replacement Procedures 4.15 VGA heat sink Removing the VGA heat sink The following describes the procedure for removing the VGA heat sink (See Figure 4-47). 1. Remove the following screws securing the VGA heat sink. • M2.0×3.0 BIND screw x2 2. Pull up the VGA heat sink straight and remove it. M2.0x3.0 BINK SCREW VGA Heat sink Figure 4-45 Removing the VGA heat sink Installing the VGA heat sink The following describes the procedure for installing the VGA heat sink (See Figure 4-47).
Chapter 4 Replacement Procedures 1. Install the VGA heat sink. NOTE: For details on applying the silicon grease, refer to Installing the CPU. 2. Secure the VGA heat sink with the following screws. • M2.0×3.
Chapter 4 Replacement Procedures 4.16 LCD unit / FL inverter CAUTION: When replacing a LCD, it is required that SVP parameter is set. Update with the latest EC/KBC as described in Appendix H “EC/KBC Rewrite Procedures”. Removing the LCD unit / FL inverter The following describes the procedure for removing the LCD unit and FL inverter (See Figure 4-52 to 4-55). 1. Remove Screw rubber cover X4 2. Remove the following screws securing the display mask M2.5×6.0 BIND screw X4 3.
Chapter 4 Replacement Procedures 4. Pull out one insulator and peel off the other one adhered to the FL inverter. 5. Disconnect the LCD harnesses from the connectors CN1 on the FL inverter. 6. Disconnect the HV harnesses from the connectors CN2 on the FL inverter. 7. Remove the FL inverter while peeling off the double-sided tape.
Chapter 4 Replacement Procedures 8. Remove the following screws securing the LCD unit. • M2.5x4.0 BINK HEAD screw x6 9. With the bottom edge of the LCD unit on the display cover, lift only the top edge of the LCD unit. After peeling off the CONDUTIVE tape, disconnect the LCD harness from the connector on the back of the LCD. 10. Remove the LCD unit. M2.5x4.0 BINK HEAD LCD unit CONDUTIVE tape M2.5X4.
Chapter 4 Replacement Procedures 11. Remove the following screws securing the LCD support (LCD unit side) and remove the LCD supports from the LCD unit. • M2.0x3.0 BINK screw x8 LCD support LCD support M2.0x3.0 BINK M2.0x3.
Chapter 4 Replacement Procedures Installing the LCD unit/FL Inverter The following describes the procedure for installing the LCD unit and FL inverter (See Figure 4-52 to 4-55). 1. Install the LCD supports (LCD unit side) to the LCD and secure them with the following screws. • M2.0×3.0 BINK screw x8 2. Stand the LCD unit on the display cover and connect the LCD harness to the connector on the back of LCD. 3. Stick the conductive tape on the connector of LCD harness. 4.
Appendices [CONFIDENTIAL]
App-ii [CONFIDENTIAL] Satellite L10 Maintenance Manual(960-Q01)
Appendix Contents Appendix A Handling the LCD Module......................................................................... A-1 Appendix B Board Layout............................................................................................... B-1 B.1 System Board Front View............................................................................. B-1 B.2 System Board Back View ............................................................................. B-3 B.3 LED Board ......................
C.20 CN22 USB I/F connector (4-PIN) .............................................................. C-16 C.21 CN23 External MIC Connector (8-PIN).................................................... C-16 C.22 CN24 Headphone OUT Connector (8-PIN) .............................................. C-16 C.23 CN25 ODD I/F Connector (50-PIN).......................................................... C-17 C.24 CN26 Modem Board connector (10-PIN).................................................. C-18 C.
E 19 Japanese (JP) Keyboard..............................................................................E-10 E 20 Swiss-German(SL) Keyboard ......................................................................E-10 Appendix F Wiring Diagrams..........................................................................................F-1 F.1 RGB Monitor ID Wraparound Connector .................................................... F-1 F.2 LAN Loopbak Connector ................................................
Appendix A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4. If water or other liquid is left on the panel’s surface for a long period, it can change the screen’s tint or stain it.
Handling the LCD Module 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
Handling the LCD Module 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxide). These materials can release gas that can damage the panel’s polarization.
Handling the LCD Module A-6 [CONFIDENTIAL] Satellite L10 Maintenance Manual(960-Q01)
Appendix B Appendix B Board Layout B.
Board Layout Table B-1 System board ICs and connectors (front) B-2 Mark Number Name (a) CN3 LED Board Connector (b) CN4 LCD I/F Connector (c) CN5 Keyboard I/F Connector (d) CN6 Touch Pad Connector (e) CN7 Internal USB Connector (reserved) (f) CN9 RTC Battery Connector (g) CN10 EC Debug Port Connector (reserved) (h) CN11 System Speaker Connector (i) CN8 PC Card Connector [CONFIDENTIAL] Satellite L10 Maintenance Manual(960-Q01)
Board Layout B.
Board Layout Table B-2 System board ICs and connectors (back) B-4 Mark Number Name (a) CN13 DC Power Jack (b) CN12 S-VIDEO OUT connector (c) CN14 USB Connector (d) CN2 Phone Signal Connector (e) CN1 RJ11 + RJ45 Connector (f) CN15 CRT Connector (g) CN16 System Battery Connector (h) CN17 CPU Fan Connector (i) CN19 USB Connector (j) U25 CPU Socket (k) CN22 USB Connector (l) CN23 External MIC Connector (m) CN24 Headphone Out Connector (n) CN26 Modem Board Connector
Board Layout B.
Board Layout B.
Appendix C Appendix C Pin Assignment System Board C.1 CN1 RJ11+RJ45 Connector (18-PIN) Table C-11 RJ11+RJ45 connector (18-PIN) PIN No. C.2 Signal name I/O PIN No. Signal name I/O 1 100MBPS# O 2 N.C. - 3 RJ45_MX3- I 4 RJ45_MX3+ I 5 RJ45_MX1- I 6 RJ45_MX2- O 7 RJ45_MX2+ O 8 RJ45_MX1+ I 9 RJ45_MX0- O 10 RJ45_MX0+ O 11 N.C.
Pin Assignment C.3 CN3 LED Board Connector (3-PIN) Table C-3 LED Board connector (14-PIN) PIN No. C-2 Signal name I/O PIN No. Signal name I/O 1 GND - 2 GND - 3 GND - 4 GND - 5 BT4# I 6 NBSWON# I 7 BT3# I 8 NUMLED O 9 BT2# I 10 CAPSLED O 11 BT1# I 12 IDE_LED O 13 N.C.
Pin Assignment C.4 CN4 LCD I/F Connector (40-PIN) Table C-43 LCD I/F connector (40-PIN) PIN No. Signal name I/O PIN No.
Pin Assignment C.5 CN5 Keyboard I/F Connector (25-PIN) Table C-5 Keyboard I/F connector (25-PIN) PIN No. C.6 Signal name I/O PIN No. Signal name I/O 1 MX7 O 2 MX6 O 3 MX5 O 4 MY0 O 5 MY1 O 6 MY2 O 7 MX4 O 8 MY3 O 9 MY4 O 10 MY5 O 11 MY6 O 12 MY7 O 13 MY8 O 14 MX3 O 15 MY9 O 16 MX2 O 17 MX1 O 18 MY10 O 19 MY11 O 20 MX0 O 21 MY12 O 22 MY13 O 23 MY14 O 24 MY15 O 25 N.C.
Pin Assignment C.7 CN8 PC Card I/F Connector (68-PIN) Table C-7 PC Card I/F connector (68-PIN) (1/2) PIN No. Signal name I/O PIN No.
Pin Assignment Table C-7 PC card I/F connector (68-PIN) (2/2) PIN No. C.8 Signal name I/O PIN No. Signal name I/O 61 A_CC/BE3# I/O 62 A_CAUDIO O 63 A_CSTSCHG I/O 64 A_CAD28 I/O - 65 A_CAD30 I/O 66 A_CAD31 I/O - 67 A_CCD2# I/O 68 GND - CN9 RTC Battery Connector (2-PIN) Table C-8 RTC battery connector (2-PIN) PIN No. 1 C.9 Signal name RTC_N02 I/O PIN No. O 2 Signal name GND I/O - CN11 System Speaker Connector (4-PIN) Table C-9 System Speaker connector (4-PIN) PIN No.
Pin Assignment C.11 CN13 DC IN Connector (4-PIN) Table C-4 DC IN connector (4-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 VA I 2 GND - 3 GND - 4 GND - C.12 CN14 USB I/F Connector (4-PIN) Table C-5 USB I/F connector (4-PIN) PIN No. Signal name 1 USB5POWER 3 BUSBP3+ I/O PIN No. Signal name - 2 BUSBP3- I/O 4 GND I/O I/O - C.13 CN15 CRT I/F Connector (15-PIN) Table C-13 CRT I/F connector (15-PIN) PIN No. Signal name I/O PIN No.
Pin Assignment C.14 CN16 System Battery Connector (5-PIN) Table C-64 USB I/F connector (4-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 GND - 2 MBDATA I/O 3 MBCLK O 4 TEMP_MBAT O 5 MBAT+ - C.15 CN17 CPU Fan Connector (3-PIN) Table C-75 CPU FAN connector (3-PIN) PIN No. C-8 Signal name I/O PIN No.
Pin Assignment C.16 CN18 HDD I/F Connector (44-PIN) Table C-16 HDD I/F connector (44-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 N.C. - 2 GND - 3 +5V - 4 +5V - 5 GND - 6 HDLED# O 7 PDCS3# I 8 PDCS1# I 9 PDA2 I 10 PDA0 I 11 PDIAG I 12 PDA1 I 13 N.C. - 14 IRQ14 I 15 GND - 16 PDDACK# I 17 PSEL I 18 PHDRDY I 19 GND - 20 PDIOR# I 21 GND - 22 PDIOW# I 23 GND - 24 PDDREQ I 25 N.C.
Pin Assignment C.18 CN20 Memory Connector 0 (200-PIN) Table C-18 Memory connector 0 (200-PIN) (1/3) PIN No. C-10 Signal name I/O PIN No. Signal name I/O 1 MVREF_DM - 2 MVREF_DM - 3 GND - 4 GND - 5 MD5 I/O 6 MD4 I/O 7 MD1 I/O 8 MD0 I/O 9 2.5VSUS - 10 2.5VSUS - 11 SM_DQS0 I/O 12 SDM0 - 13 MD7 I/O 14 MD3 I/O 15 GND - 16 GND - 17 MD2 I/O 18 MD6 I/O 19 MD13 I/O 20 MD12 I/O 21 2.5VSUS - 22 2.
Pin Assignment Table C-18 Memory connector 0 (200-PIN) (2/3) PIN No. Signal name I/O PIN No. Signal name I/O 63 GND - 64 GND - 65 MD31 I/O 66 MD26 I/O 67 MD27 I/O 68 MD30 I/O 69 2.5VSUS - 70 2.5VSUS 71 N.C. I/O 72 N.C. I/O 73 N.C. I/O 74 N.C. I/O 75 GND - 76 GND - 77 N.C. I/O 78 N.C. - 79 N.C. I/O 80 N.C. I/O 81 2.5VSUS - 82 2.5VSUS 83 N.C. I/O 84 N.C I/O 85 N.C - 86 N.C - 87 GND - 88 GND - 89 N.C. - 90 GND - 91 N.C.
Pin Assignment Table C-18 Memory connector 0 (200-PIN) (3/3) PIN No. C-12 Signal name I/O PIN No. Signal name I/O 135 MD38 I/O 136 MD34 I/O 137 GND - 138 GND - 139 MD35 I/O 140 MD39 I/O 141 MD44 I/O 142 MD45 I/O 143 2.5VSUS - 144 2.5VSUS 145 MD41 I/O 146 MD40 I/O 147 SM_DQS5 I/O 148 SDM5 - 149 GND - 150 GND - 151 MD42 I/O 152 MD46 I/O 153 MD47 I/O 154 MD43 I/O 155 2.5VSUS - 156 2.5VSUS - 157 2.
Pin Assignment C.19 CN21 Memory connector 1 (200-PIN) Table C-19 Memory connector 1 (200-PIN) (1/3) PIN No. Signal name I/O PIN No. Signal name I/O 1 MVREF_DM - 2 MVREF_DM - 3 GND - 4 GND - 5 MD5 I/O 6 MD4 I/O 7 MD1 I/O 8 MD0 I/O 9 2.5VSUS - 10 2.5VSUS - 11 SM_DQS0 I/O 12 SDM0 - 13 MD7 I/O 14 MD3 I/O 15 GND - 16 GND - 17 MD2 I/O 18 MD6 I/O 19 MD13 I/O 20 MD12 I/O 21 2.5VSUS - 22 2.
Pin Assignment Table C-19 Memory connector 1 (200-PIN) (2/3) PIN No. C-14 Signal name I/O PIN No. Signal name I/O 63 GND - 64 GND - 65 MD31 I/O 66 MD26 I/O 67 MD27 I/O 68 MD30 I/O 69 2.5VSUS - 70 2.5VSUS 71 N.C. I/O 72 N.C. I/O 73 N.C. I/O 74 N.C. I/O 75 GND - 76 GND - 77 N.C. I/O 78 N.C. - 79 N.C. I/O 80 N.C. I/O 81 2.5VSUS - 82 2.5VSUS 83 N.C. I/O 84 N.C I/O 85 N.C - 86 N.C - 87 GND - 88 GND - 89 N.C.
Pin Assignment Table C-19 Memory connector 1 (200-PIN) (3/3) PIN No. Signal name I/O PIN No. Signal name I/O 135 MD38 I/O 136 MD34 I/O 137 GND - 138 GND - 139 MD35 I/O 140 MD39 I/O 141 MD44 I/O 142 MD45 I/O 143 2.5VSUS - 144 2.5VSUS 145 MD41 I/O 146 MD40 I/O 147 SM_DQS5 I/O 148 SDM5 - 149 GND - 150 GND - 151 MD42 I/O 152 MD46 I/O 153 MD47 I/O 154 MD43 I/O 155 2.5VSUS - 156 2.5VSUS - 157 2.
Pin Assignment C.20 CN22 USB I/F connector (4-PIN) Table C-20 USB I/F connector (4-PIN) PIN No. Signal name I/O PIN No. Signal name 1 USB2POWER I 2 BUSBP0- 3 BUSBP0+ I/O 4 GND I/O I/O - C.21 CN23 External MIC Connector (8-PIN) Table C-21 External MIC connector (8-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 AUDGND - 2 SYS_MIC_1 I 3 MBIAS O 4 AUDGND - 5 AUDGND - 6 N.C. - 7 AUDGND - 8 AUDGND - C.
Pin Assignment C.23 CN25 ODD I/F Connector (50-PIN) Table C-23 ODD I/F connector (50-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 N.C. - 2 N.C. - 3 N.C.
Pin Assignment C.24 CN26 Modem Board connector (10-PIN) Table C-24 Modem Board connector (10-PIN) PIN No. C-18 Signal name I/O PIN No. Signal name I/O 1 PWRCLKN1 O 2 GND - 3 PWRCLKP1 O 4 GND - 5 N.C.
Pin Assignment C.25 CN27 MINI-PCI connector (124-PIN) Table C-25 MINI-PCI connector (124-PIN) (1/2) PIN No. Signal name I/O PIN No. Signal name I/O 1 N.C. - 2 N.C. - 3 N.C. - 4 N.C. - 5 N.C. - 6 N.C. - 7 N.C. - 8 N.C. - 9 N.C. - 10 N.C. - 11 N.C. - 12 N.C. - 13 RF_EN I 14 N.C. - 15 N.C. - 16 N.C. - 17 INTC# I 18 +5V - 19 +3V - 20 INTB# O 21 N.C. - 22 N.C.
Pin Assignment Table C-25 MINI-PCI connector (124-PIN) (2/2) PIN No. C-20 Signal name I/O PIN No.
Pin Assignment LED Board C.26 CN1 LED Board connector (14-PIN) Table C-26 LED Board connector (14-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 GND - 2 GND - 3 GND - 4 GND - 5 BT4# I 6 NBSWON# I 7 BT3# I 8 NUMLED O 9 BT2# I 10 CAPSLED O 11 BT1# I 12 IDE_LED O 13 N.C. - 14 N.C.
Pin Assignment Modem Board C.27 CN1 Modem Signal connector (10-PIN) Table C-27 Modem Signal connector (10-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 PWRCLKN O 2 GND - 3 PWRCLKP O 4 GND - 5 N.C. - 6 GND - 7 DIB_DATAP I/O 8 GND - 9 DIB_DATAN I/O 10 GND - C.28 MJ2 Phone Signal connector (2-PIN) Table C-28 Phone Signal connector (2-PIN) PIN No. 1 C-22 Signal name RING_1 I/O PIN No.
Appendix. D Appendix D Display Codes D.1 Display Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap No.
Display codes Table D-1 Scan codes (set 1 and set 2) (2/4) D-2 Cap No.
Display codes Table D-1 Scan codes (set 1 and set 2) (3/4) Cap No.
Display codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap No. Keytop Code set 1 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 126 Pause *7 *7 *7 *7 *7 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Make Code set 2 Break Make Note Break Notes: 1. 2. 3. 4. 5. 6. 7. D-4 * * * * * * * Scan codes differ by mode. Scan codes differ by overlay function.
Display codes Table D-2 Scan codes with left Shift key Cap Key Code set 1 No.
Display codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
Display codes Table D-5 Scan codes in overlay mode Cap No. Code set 1 Keytop Code set 2 Make Break Make Break 09 8 (8) 48 C8 75 F0 75 10 9 (9) 49 C9 7D F0 7D 11 0 (*) 37 B7 7C F0 7C 23 U (4) 4B CB 6B F0 6B 24 I (5) 4C CC 73 F0 73 25 O (6) 4D CD 74 F0 74 26 P (–) 4A CA 7B F0 7B 37 J (1) 4F CF 69 F0 69 38 K (2) 50 D0 72 F0 72 39 L (3) 51 D1 7A F0 7A 40 ; (+) 4E CE 79 F0 79 52 M (0) 52 D2 70 F0 70 54 . (.
Display codes Table D-7 No.126 key scan code Key top Pause Shift Code set 1 Code set 2 Make Make Common* E1 1D 45 E1 Ctrl* E0 C6 E0 46 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E 14 F0 77 *: This key generates only make codes.
Appendix E Key Layout Appendix E E.1 Keyboard Layout United States (US) Keyboard Figure E-1 US Keyboard layout E.
Keyboard Layout E.3 Arabia (AR) Keyboard Figure E-3 AR Keyboard layout E.
Keyboard Layout E.5 Appendices Czech (CZ) Keyboard FigureE-5 CZ Keyboard layout E.
Keyboard Layout E.7 Danish (DK) Keyboard Figure E-7 DK Keyboard layout E.
Keyboard Layout E.9 Appendices French (FR) Keyboard Figure E-9 FR Keyboard layout E.
Keyboard Layout E.11 Italian (IT) Keyboard Figure E-11 IT Keyboard layout E.
Keyboard Layout E.13 Appendices Norwegian (NO) Keyboard Figure E-13 NO Keyboard layout E.
Keyboard Layout E.15 Traditional Chinese (TC) Keyboard Figure E-15 TC Keyboard layout E.
Keyboard Layout E.17 Appendices Russian (RU) Keyboard Figure E-17 RU Keyboard layout E.
Keyboard Layout E.19 Japanese (JP) Keyboard Figure E-19 JP Keyboard layout E.
Appendix F Appendix F F.1 Wiring Diagrams RGB Monitor ID Wraparound connector (1) RED RED (2) GREEN GREEN (2) (3) BLUE BLUE (3) (4) NC NC (4) (5) GND GND (5) (6) GND GND (6) (7) GND GND (7) (8) GND GND (8) (9) 5V 5V (9) (10) GND GND (10) (11) NC NC (11) (12) SDA SDA (12) (13) HSYNC HSYNC (13) (14) VSYNC (15) SDL VSYNC (14) SCL (1) (15) Figure F-1 RGB Monitor ID Wraparound connector (15PIN to 15PIN) F.
Wiring Diagrams F-2 [CONFIDENTIAL] Satellite L10 Maintenance Manua(960-Q01)
Appendix G Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk USB doggle Rewriting the BIOS 1. Set the system to boot mode. 2. Turn off the power to the computer. 3. Remove the external cables and cards. 4. Connect an external FDD and insert the BIOS rewriting disk into the external FDD. 5. Connect the USB doggle special for BIOS rewrite 6.
Appendix H Appendix H EC/KBC Rewrite Procedures Same as BIOS rewrite Procedures, please refer appendix G Satellite L10 Maintenance Manual(960-Q01) [CONFIDENTIAL] H-1
