Toshiba Personal Computer Satellite L20 Series Maintenance Manual TOSHIBA CORPORATION File Number 960-Q01
Chapter-0 Copyright © 2003 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein. Toshiba Personal Computer Satellite L20 Series Maintenance Manual First edition October 2005 Disclaimer The information presented in this manual has been reviewed and validated for accuracy.
Chapter-0 Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer Satellite L20 Series. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field. SAFETY PRECAUTIONS Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.
Chapter-0 The manual is divided into the following parts: Chapter 1 Hardware Overview describes the Satellite L20 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
Chapter-0 Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Chapter-0 Table of Contents Chapter 1 Hardware Overview 1.1 Features ..........................................................................................................................1 1.2 System Block Diagram ..................................................................................................6 1.3 2.5-inch Hard Disk Drive.............................................................................................11 1.4 Optical Drive...........................................
Chapter-0 2.5 2.6 2.7 2.8 Procedure 1 Message Check ....................................................................... 48 Procedure 2 Debugging Port Check............................................................ 50 Procedure 3 Diagnostic Test Program Execution Check ............................ 56 Procedure 4 Replacement Check ................................................................ 56 USB FDD Troubleshooting ......................................................................
Chapter-0 2.9 2.10 2.11 2.12 2.13 2.14 Display Troubleshooting..............................................................................................70 Procedure 1 External Monitor Check...........................................................70 Procedure 2 Diagnostic Test Program Execution Check .............................70 Procedure 3 Connector and Cable Check ....................................................71 Procedure 4 Replacement Check ....................................
Chapter-0 3.9 Hard Disk Test .......................................................................................................... 115 3.10 Real Time Clock Test ............................................................................................... 118 3.11 Cache Memory Test.................................................................................................. 120 3.12 High Resolution Display Test................................................................................
Chapter-0 Chapter 4 4.1 Replacement Procedures Overview....................................................................................................................144 Safety Precautions................................................................................................145 Before You Begin ................................................................................................146 Disassembly Procedure..............................................................................
Chapter-0 Appendices Appendix A Handling the LCD Module ........................................................................... A-1 Appendix B Board Layout ................................................................................................ B-1 Appendix C Pin Assignments............................................................................................ C-1 Appendix D Keyboard Scan/Character Codes ..................................................................
Chapter-0 12 Satellite L20 Maintenance Manual (960-Q01)
Chapter 1 Hardware Overview Satellite L20 Maintenance Manual(960-Q01) 1-i
1 1-ii Hardware Overview Satellite L20 Maintenance Manual(960-Q01)
Chapter 1 Contents 1.1 Features ..........................................................................................................................1 1.2 System Block Diagram ..................................................................................................6 1.3 2.5-inch Hard Disk Drive.............................................................................................11 1.4 Optical Drive.................................................................................
Figures Figure 1-1 Front of the computer and the system units configuration ................................5 Figure 1-2 System block diagram........................................................................................6 Figure 1-3 2.5-inch HDD...................................................................................................11 Figure 1-4 DVD-ROM & CD-R/RW drive .......................................................................15 Figure 1-5 DVD Super Muti drive.......
Chapter 1 Hardware Overview Features 1.1 Features The Satellite L20 (ATI Platform ) series are 2 spindle PCs running a Intel ® Celeron®-M processor. The features are listed below. θ Microprocessor Microprocessor that is used will be different of the model. it supports Celeron-M as follows Intel ® Celeron ®-M 350 (1.30GHz) 360 (1.40GHz) 370 (1.50GHz) 380 (1.60GHz) L1 cache : 64KB (32KB + 32KB) L2 cache : 1MB Front side Bus : 400MHz θ Memory Two DDRII 533 SO-DIMM slots.
Chatper 1 Hardware Overview USB FDD supports 720KB and 1.44MB.
Chapter 1 Hardware Overview θ Display LCD Built-in 15.0-inch, XGA (1024 x 768 dots), 262,144 colors, amorphous silicon TFT color display. CRT Supported via a RGB connector. TV-out S-VIDEO OUT port supported. θ Keyboard An-easy-to-use 84(US)/85(Euro)-key keyboard provides a numeric keypad overlay for fast numeric data entry . The keyboard also includes two keys that have special functions in Microsoft® Windows® XP. It supports software that uses a 101- or 102key enhanced keyboard.
Chatper 1 Hardware Overview θ Optical devices A DVD-ROM & CD-R/RW drive or DVD Super Multi drive is equipped. θ Battery The RTC battery is equipped inside the computer. The main battery is a detachable lithium ion battery (4,300mAh:Li-Ion, 8cell). θ USB (Universal Serial Bus) Three USB ports are provided. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported.
Chapter 1 Hardware Overview Figure 1-1 (ATI Platform ))Front of the computer and the system units configuration Satellite L20 Maintenance Manual(960-Q01) 5
Chatper 1 Hardware Overview 1.2 System Block Diagram Figure 1-2 a/b shows the system block diagram.
Chapter 1 Hardware Overview The PC contains the following components. θ CPU θ it supports Celeron-M CPU as follows Intel ® Celeron ®-M 350 (1.30GHz) 360 (1.40GHz) 370 (1.50GHz) 380 (1.6GHz) L1 cache : 64KB (32KB + 32KB) L2 cache : 1MB FSB : 400MHz Core voltage : 1.26V θ Memory Two memory slots capable of accepting DDRII-SDRAM 256MB, 512MB or 1GB memory modules for a maximum of 2GB. • • • 200-pin SO-DIMM 1.
Chatper 1 Hardware Overview • South Bridge − ATI SB400 for Celeron-M Platform − − − − − − − − − − − − − PCI slot IDE controller SATA controller DMA controller USB host interface USB 2.0 host controller Interrupt controller SM Bus interface ACPI Power management Low Pin count (LPC) interface Real time clock AC’97 Rev. 2.3 interface 564-pin 31mmx31mm BGA Package θ PC card controller (PCI1510, Texas Instrument-made) − PCI Interface (PCI Rev. 2.
Chapter 1 Hardware Overview θ VGA controller • Intel VGA − VRAM 32MB/64MB − LVDS − Or ATI − VRAM 32MB/64MB/128MB − LVDS θ Other main system chips • • • • • Clock Generator (ICS made ICS ) for ATI Platform EC/KBC (NS97551 x 1) AC97-CODEC (Conexant 20468-51 x1) Audio AMP (Maxim 9750x1) θ Mini PCI Wireless LAN card (BTO) 2.4GHz DSSS/OFDM LAN card is equipped. Conformity with IEEE 802.11b/g . Transfer speed is maximum of 54Mbit/sec. Supports 128bit WEP. θ LAN (Realtek RT8100CL x 1) Controls LAN.
Chatper 1 Hardware Overview θ MODEM (Conexant 20493-21x 1) Supported by on board Modem + DAA daughter card. Data and FAX transmission is available. Supports ITU-TV.90. The transfer speed of data receiving is 56kbps, of data sending is 33.6kbps and of FAX is 14.4kbps. Actual speed depends on the quality of the line used. Connected to telephone line through RJ11 MODEM jack.
Chapter 1 Hardware Overview 1.3 2.5-inch Hard Disk Drive A compact, high-capacity HDD with a height of 9.5mm. Contains a 2.5-inch magnetic disk and magnetic heads. Figure 1-3 shows a view of the 2.5-inch HDD and Tables 1-1 and 1-2 list the specifications. Figure 1-3 2.5-inch HDD Table 1-1 2.5-inch HDD dimensions Toshiba 40G 4200rpm PLUTO MK4025GAS Standard value Parameter Fujitsu MHV2100AT Fujitsu MHV2080AT Fujitsu MHV2060AT Width (mm) 70.0 Outline Height (mm) 9.5 dimensions Depth (mm) 100.
Chatper 1 Hardware Overview Toshiba MK1031GAS Toshiba MK8025GAS Toshiba MK6025GAS Width (mm) 69.85 Outline Height (mm) 9.5 dimensions Depth (mm) 100.0 99 (max.) Weight (g) Toshiba MK4025GAS 95(max) Standard value Parameter Toshiba MK1032GAX Toshiba MK8026GAX Toshiba MK6026GAX Width (mm) 70.0 Outline Height (mm) 9.5 dimensions Depth (mm) 100.0 Weight (g) 12 101 (max.
Chapter 1 Hardware Overview Table 1-2 2.5-inch HDD Specifications Specification Parameter Storage size (formatted) Fujitsu Fujitsu Fujitsu Fujitsu MHV2100AT MHV2080AT MHV2060AT MHV2040AT 100GB 80GB 60GB 40GB Speed (RPM) 4,200 Data transfer speed (Mbits/s) 350 Interface transfer rate (MB/s) 100 (Ultra DMA Mode) Average random seek time (read) (ms) 12(typ.) Average random seek time (write) (ms) - Power-on-to-ready (sec) 3.5 (typ.
Chatper 1 Hardware Overview Specification Parameter Storage size (formatted) Toshiba MK1031GAS Toshiba MK8025GAS Toshiba MK6025GAS Toshiba MK4025GAS 100GB 80GB 60GB 40GB 202-308 175-342 Speed (RPM) Data transfer speed (Mbits/s) 4,200 170-373 Interface transfer rate (MB/s) 175-342 100 (Ultra DMA Mode) Average random seek time (read) (ms) 12 Average random seek time (write) (ms) - Power-on-to-ready (sec) 4 (typical)/10 sec (Max) Specification Parameter Storage size (formatted) Toshiba
Chapter 1 Hardware Overview 1.4 Optical Drive 1.4.1 DVD-ROM & CD-R/RW Drive The DVD-ROM & CD-R/RW drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15inch) CD/DVD-ROM and CD-R/RW. It is a high-performance drive that reads DVD at maximum 8-speed and CD at maximum 24-speed. The DVD-ROM & CD-R/RW drive is shown in Figure 1-4. The dimensions and specifications of the DVD-ROM & CD-R/RW drive are described in Table 1-3, Table 1-4.
Chatper 1 Hardware Overview Table 1-4 DVD-ROM & CD-R/RW drive specifications (1/3) Drive Specification Parameter MATSUSHITA (UJDA770TT-A) Read (KB/s) Data transfer speed Access time (ms) (Random) Write CD-ROM MAX 24X CAV (MAX 3600 kB/s) CD-R 4X , 8X (CLV), 16XZCLV, MAX. 24X(CAV) CD-RW 4X (CLV) High Speed CD-RW 4X, 8x, 10X (CLV) Ultra Speed CD-RW 8x,10X(CLV), MAX. 24X (CAV) ATAPI interface (MB/s) 16.6 MB/s :PIO mode4 16.6 MB/s :Multi word mode2 33.
Chapter 1 Hardware Overview Table 1-4 DVD-ROM & CD-R/RW drive specifications (2/3) Drive Specification Parameter HLDS (GCC-4244N.ATAKN0) Read (KB/s) Data transfer speed Write ATAPI interface (MB/s) DVD-ROM Single Layer3.3x -8x (CAV):Approx. 4,710 r/min Dual Layer3.3x -8x (CAV): Approx. 5,180 r/min DVD-Video 1.7x -4x (CAV): Approx. 2,600r/min DVD-R 3.95GB1.7x -4x (CAV): Approx. 2,600 r/min 4.7GB1.7x -4x (CAV): Approx. 2,360 r/min DVD-RW 4.7GB 1.7x -4x (CAV): Approx. 2,360 r/min DVD-RAM 2.
Chatper 1 Hardware Overview Access time (ms) (Random) CD-ROM 110ms (typ.) DVD-ROM 120ms (typ.
Chapter 1 Hardware Overview Table 1-4 DVD-ROM & CD-R/RW drive specifications (3/3) Drive Specification Parameter TSST (TS-L462C/TOHJ,I.) Read (KB/s) Data transfer speed Write ATAPI interface (MB/s) Access time (ms) (Random) CD-ROM Max. 24X (3,600 KB/sec) CAV 24X CD-RW Max. 24X (3,600 KB/sec) CAV 24X DVD-Single Max 8X (10,800 KB/sec) DVD-Dual Max 6 (10,800 KB/sec) CD-R Max. 24X (3,600 KB/sec) P-CAV 24X/20X/16X CLV 0X/8X/4X CD-RW Max. 4X (600 KB/sec) CLV 4X HS CD-RW Max.
Chatper 1 Hardware Overview 1.4.2 DVD Super Multi Drive The DVD Super Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD/DVD-ROM, CD-R/RW, DVD±R/±RW and DVD-RAM. It is a high-performance drive that reads DVD-ROM at maximum 8-speed and CD at maximum 24-speed. Write speed of DVD±R/±RW and DVD-RAM is different depending on the drive. The DVD Super Multi drive is shown in Figure 1-5. The dimensions and specifications of the DVD Super Multi drive are described in Table 1-5, Table 1-6.
Chapter 1 Hardware Overview Table 1-6 DVD Super Multi drive specifications (1/4) Drive Specification Parameter MATSUSHITA (UJ-841BTQ-A) Read(KB/s) Data transfer speed Write ATAPI interface (MB/s) Access time (ms) DVD-ROM MAX 8X CAV (MAX 10800 kB/s) CD-ROM MAX 24X CAV (MAX 3600 kB/s) CD-R 4X , 8X (CLV) , MAX. 12x, 16x, 24X (ZCLV) CD-RW 4X (CLV) HS-RW 4X, 8X, 10X (CLV) US-RW 8x, 10X (CLV) DVD-R 1X, 2X (CLV), MAX.4x, 6x, 8X (ZCLV) DVD-R for General DVD-R DL 2X (CLV) DVD-RW 1X, 2X (CLV), MAX.
Chatper 1 Hardware Overview Table 1-7 DVD Super Multi drive specifications (2/4) Drive Specification Parameter HLDS (GSA-4082N.ATAKN0) Read(KB/s) Data transfer speed Write ATAPI interface (MB/s) Access time (ms) DVD-R DVD-R DVD-RW DVD-RAM DVD+R DVD+R DVD+RW CD-R CD-RW 2x CLV, 4x ZCLV, 8x CAV DL2x CLV 1x, 2x CLV, 4x ZCLV 2x, 3x ZCLV, 5x PCAV(Ver.2.2) 2.4x CLV, 4x ZCLV, 8x PCAV DL2.4x CLV 2.
Chapter 1 Hardware Overview Table 1-8 DVD Super Multi drive specifications (3/4) Drive Specification Parameter Pioneer(DVR-K16TBA) Read(KB/s) Data transfer speed Write ATAPI interface (MB/s) Access time (ms) 8X CAV at DVD-ROM (Single Layer),DVD-R/ RW and +R / RW 6X CAV at DVD-ROM (DualLayer), DVD-R DL and +R DL 5X Zone CLV at DVD-RAM 24XCAV at CD-ROM andCD-R/ RW 8X Zone CLV at DVD-R / +R and +RW 6X Zone CLV at DVD-RW 5X Zone CLV at DVD-RAM 4X Zone CLV at DVD-R DL (Dual Layer) and +R DL (Double Laye
Chatper 1 Hardware Overview Table 1-9 DVD Super Multi drive specifications (4/4) Drive Specification Parameter TEAC (DV-W28EA) Read(KB/s) Data transfer speed Write ATAPI interface (MB/s) Access time (ms) CD-R 10-24X (ZCLV),10X(CLV),4X(CLV) CD-RW 10X(CLV) DVD-R 2-8X (ZCLV),2X(CLV),1X ( CLV) DVD-RW 2-4X (ZCLV), 2X(CLV),1X ( CLV) DVD-RAM 35X (ZCLV),2.4X(CLV) DVD+R 2.4-8X ( ZCLV),2.4X( CLV) DVD+R( Double layer) 2.4( CLV ) DVD+RW 2.4-4X ( ZCLV ),2.4X ( CLV ) SFF-8020,SFF-8090 Ver.
Chapter 1 Hardware Overview Satellite L20 Maintenance Manual(960-Q01) 25
Chatper 1 Hardware Overview 1.5 Keyboard A keyboard which consists of 84(US)/85(Euro) keys is mounted on the system unit. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-6 is a view of the keyboard. Figure 1-6 Keyboard See Appendix E for details of the keyboard layout.
Chapter 1 Hardware Overview 1.6 TFT Color Display The TFT color display is 15.0 inch and consists of LCD module and FL inverter board. 1.6.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 262,144 colors with 1,024 x 768 resolution. Figure 1-8 shows a view of the LCD module and Table 1-9 lists the specifications.
Chatper 1 Hardware Overview 28 Satellite L20 Maintenance Manual (960-Q01)
Chapter 1 Hardware Overview 1.6.2 FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module FL. Table 1-10 lists the FL inverter board specifications. Table 1-8 FL inverter board specifications Specifications Item Input Voltage (V) PI FL9030 SUMIDA IV002 8 ~ 20 7.
Chatper 1 Hardware Overview 1.7 Power Supply The power supply supplies 23 different voltages to the system board. The power supply microcontroller has the following functions. 1. 2. 3. 4. 5. 6. 7. 8. Judges if the DC power supply (AC adapter) is connected to the computer. Detects DC output and circuit malfunctions. Controls the battery icon, and DC IN icon. Turns the battery charging system on and off and detects a fully charged battery. Turns the power supply on and off.
Chapter 1 Hardware Overview Voltage [V] Power OFF Suspend mode Power OFF Boot mode No Battery Object VCC_CORE 1.484 0.748 No No No CPU VTT 1.05 No No No CPU, 915GM, ICH4-M +1.8V 1.8 No No No CPU, 915GM,ICH4-M +1.5V 1.2 No No No 915GM,ICH4-M +0.9V 0.9 Yes No No DDR2-SDRAM +1.8VSUS 1.8 Yes No No RC410MB, DDR2-SDRAM +1.5V_S5 1.
Chatper 1 Hardware Overview 1.8 Batteries The PC has the following two batteries. θ Main battery θ Real time clock (RTC) battery Table 1-12 lists the specifications for these two batteries. Table 1-10 Battery specifications Battery Name Battery Element Output Voltage Panasonic CGR-B/8B9BE 4,300mAh 8 Cells 14.4V Sanyo 4200-4400mAh 8 cell Main battery Panasonic Capacity Lithium ion CGR-B/438 14.4V 2,150-2250mAh 14.
Chapter 1 Hardware Overview 1.8.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and detects a full charge when the AC adaptor and battery are connected to the computer. θ Battery Charge When the AC adapter is connected, normal charging is used while the system is turned on and quick charge is used while the system is turned off. Refer to the following Table 1-11.
Chatper 1 Hardware Overview 1.8.3 RTC Battery The RTC battery provides the power supply to maintain the date, time, and other system information in memory. Table 1-13 lists the Time required for charges of RTC battery and data preservation time.
Chapter 1 Hardware Overview 1.9 AC Adapter The AC adapter is used to charge the battery. Table 1-14 lists the AC adapter specifications. Table 1-14 AC adapter specifications Parameter Specification DELTA SADP-65KB BFG Power 65W Input voltage AC 100V/240V Input frequency 50Hz/60Hz Input current ≦ 1.5A ≦ 1.8A Output voltage DC 19V Output current 3.
2 Troubleshooting 2 Chapter 2 Troubleshooting 2-i EQUIUM M40/M45/Satellite M40/M45 Maintenance Manual
2 Troubleshooting Chapter 2 Contents 2.1 Outline.................................................................................................................... 2-1 2.2 Basic Flowchart...................................................................................................... 2-2 2.3 Power Supply ......................................................................................................... 2-6 Procedure 1 Power Icon Check......................................................
2 Troubleshooting Procedure 2 Connector Check and Replacement Check................................ 2-21 2.11 IEEE 1394 Test(Optional).................................................................................... 2-22 Procedure 1Test Program Check ................................................................... 2-22 Procedure 2Connector Check ........................................................................ 2-22 2.12 Cooling Module.........................................................
2 Troubleshooting Figures Figure 2-1 Basic flowchart(1/2)....................................................................................... 2-3 Tables Table 2-1 2-iv HDD error code and status...........................................................................
2.1 Outline 2.1 2 Troubleshooting Outline This chapter describes the fault diagnosis procedures for field replaceable units (FRUs) in the computer. The FRUs covered here are as follows: 1. System board 2. 2.5-inch HDD 4. Display 5. ODD drive 7. Speaker 8. IEEE 1394 3. Keyboard 6. LAN 9. Cooling module See Chapter 4 for the procedures to replace FRUs and Chapter 3 for the procedures to use test programs The following tools are required to perform the diagnostic procedures: 1.
2 Troubleshooting 2.2 2.2 Basic Flowchart Basic Flowchart The basic flowchart in Figure 2-1 serves as a guide for identifying a possibly faulty FRU. Before going through the diagnostic flowchart steps, verify the following: Ask the user if a password has been registered and, if so, ask him or her to enter the password. If the user has forgotten the system password, use a jump wire to make a short circuit on M/B PAD2 , then turn the computer power on.
2.2 Basic Flowchart 2 Troubleshooting Star t Connect the AC Adapter No Follow the power supply diagnostic procedure in Section 2.3 DC IN LED on ?? Yes No Follow the power supply diagnostic procedure in Section 2.3 BATTERY LED on ?? Yes Turn the power on. Yes Any error message displayed ?? Follow the system board diagnostic procedure in Section 2.4 No No Message "In Touch with Tomorrow Toshiba" displayed Follow the display diagnostic procedure in Section 2.
2 Troubleshooting 2.2 Basic Flowchart 1 No Keyboard works well ?? Follow the keyboard diagnostic procedure in Section 2.6 Insert Bootable CD into ODD No Diagnostic Program Loaded ?? Follow the ODD diagnostic procedure in Section 2.8 Yes Perform each test with the diagnostic program.
2.2 Basic Flowchart 2 Troubleshooting If the diagnostic program cannot detect an error, the error may be intermittent. Run the continuous test program repeatedly to isolate the problem. Check the log utilities function to confirm which diagnostic test detected the error, then perform the appropriate troubleshooting procedures as follows: 1.
2 Troubleshooting 2.3 2.3 Power Supply Power Supply The power supply in the computer controls many functions and components. To check if the power supply is defective or malfunctioning, follow the troubleshooting procedures below as instructed.
2.3 Power Supply 2 Troubleshooting DC IN LED DC IN LED Power supply status On in Blue or Green DC power being supplied (from the AC adapter) Off Battery damage and can’t charge during DC-in. Off Else If the DC IN LED off, follow the steps below: 1. Remove the battery pack and the AC adapter to shut off power supply to the computer. 2. Attach the battery and AC adapter back again. If the LED still off, follow the steps below: Check 1 Make sure the DC IN LED goes on in Blue.
2 Troubleshooting 2.3 Power Supply Procedure 2 Connection Check Power is supplied to the system board as illustrated below: System board AC adaptor AC power cord AC adaptor cord Battery pack Follow the steps below to check whether each connector has been connected correctly: Check 1 Make sure the AC adaptor and AC power cord have been firmly plugged into the DC IN 19V socket and wall outlet, respectively. When they have been connected correctly, perform Check 2.
2.4 System Board 2.4 2 Troubleshooting System Board To check if the system board is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Message Check Procedure 2 Test Program Check Procedure 3 Replacement Check Procedure 1 Message Check When the power is turned on, the system performs the self-diagnostic Power On Self Test (POST) embedded in the BIOS ROM. The POST tests and initializes each IC on the system board.
2 Troubleshooting 2.4 System Board Procedure 2 Test Program Check The maintenance test program contains several programs for diagnosing the system board and CPU. Execute the following test programs using the procedures described in Chapter 3. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Hard Disk test 6. Mouse test 7. ODD test 8. Sound test 9. LAN test If an error is detected during these tests, go to Procedure 3.
2.5 2.5-inch HDD 2.5 2.5-inch HDD 2 Troubleshooting To check if the 2.5-inch HDD is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Message Check Procedure 2 Partition Check Procedure 3 Format Check Procedure 4 Test Program Check Procedure 5 Connector Check and Replacement Check CAUTION: The contents of the 2.5-inch HDD will be erased when the HDD 2.5-inch HDD diagnostic test or formatting is executed.
2 Troubleshooting 2.5 2.5-inch HDD create a DOS partition on drive C. Then restart the computer.. If the problem persists, go to Procedure 3. Check 3 If drive C is listed as active in the FDISK menu, perform Check 4. If drive C is not listed as active, return to the FDISK menu and choose the option to set the active partition for drive C. Then restart the computer. If the problem persists, perform Check 4. Check 4 Enter DIR C: and press the Enter key.
2.5 2.5-inch HDD 2 Troubleshooting Procedure 4 Test Program Check Run the HDD test program stored on the maintenance test program disk for all test items. See Chapter 3 for details on how to use the test program. If an error is detected during the HDD test, an error code and status will be displayed. The error codes and their status names are listed in Table 2-1. If an error code is not generated and the problem still exists, go to Procedure 5.
2 Troubleshooting 2.5 2.5-inch HDD Procedure 5 Connector Check and Replacement Check The HDD or system board may be faulty. Disassemble the computer following the steps described in Chapter 4 and perform the following checks: Check 1 Make sure the following connectors have been firmly connected to the HDD, system board and CPU. HDD System board CPU If any connector is loose or off, reconnect it firmly and return to Procedure 1. If there is still an error, perform Check 2.
2.6 Keyboard 2.6 2 Troubleshooting Keyboard To check if the computer’s keyboard is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Test Program Check Procedure 2 Connector Check and Replacement Check Procedure 1 Test Program Check Execute the Keyboard test available as part of the maintenance test program. See Chapter 3 for information on how to perform the test. If an error is detected in the test, go to Procedure 2.
2 Troubleshooting 2.7 2.7 Display Display To check if the computer’s display is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 External Monitor Check Procedure 2 Test Program Check Procedure 3 Connector Check and Replacement Check Procedure 1 External Monitor Check Connect an external monitor to the computer's external monitor port, then boot the computer. The computer automatically detects the external monitor even if resume mode is enabled.
2.7 Display Check 3 Check 4 Check 5 2 Troubleshooting The FL may be faulty. Replace it with a new one and return to Procedure 3. If there is still an error, perform Check 4. The FL inverter board may be faulty. Replace it with a new one and return to Procedure 3. If there is still an error, perform Check 5. Make sure the LCD/FL cable has been firmly connected to the system board and LCD module.
2 Troubleshooting 2.8 2.8 ODD Driver ODD (Optical Disk Drive) To check if the internal ODD drive is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 ODD Cleaning Check Procedure 2 Test Program Check Procedure 3 Connector Check and Replacement Check Procedure 1 ODD Cleaning Check 1. Turn off the power to the computer. 2. Open the ODD tray by inserting a slender object such as a straightened paper clip into the eject hole.
2.8 ODD Drive Check 3 Check 4 Check 5 Check 6 2 Troubleshooting The ODD drive may be faulty. Replace the ODD drive with a new one following the steps in Chapter 4. If the ODD drive is still not functioning properly, perform Check 4. The system board may be faulty. Replace it with new one following the instructions in Chapter 4. If the ODD drive is still not functioning properly, perform Check 5. The memory may be defective.
2 Troubleshooting 2.9 2.9 LAN LAN To check if the computer’s LAN is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Test Program Check Procedure 2 Connector Check and Replacement Check Procedure 1 Test Program Check Execute the LAN check program available as part of the maintenance test program. This program will check the LAN. Insert the Bootable CD into the CD. Turn on the computer and run the check program.
2.10 Audio Test 2 Troubleshooting 2.10 Audio Test To check if the computer’s Speaker is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Test Program Check Procedure 2 Connector Check and Replacement Check Procedure 1 Test Program Check Execute the Audio test available as part of the maintenance test program. See Chapter 3 for information on how to perform the test. If an error is detected in the test, go to Procedure 2.
2 Troubleshooting 2.11 IEEE 1394 Test 2.11 IEEE 1394 Test(Optional) To check if the computer’s IEEE 1394 is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Test Program Check Procedure 2 Connector Check Procedure 1 Test Program Check Execute the IEEE 1394 test program available as part of the maintenance test program. This program checks the IEEE 1394. Insert the Bootable CD into the CD. Turn on the computer and run the test.
2.12 Cooling Module 2 Troubleshooting 2.12 Cooling Module To check if the computer’s cooling module is defective or malfunctioning, follow the troubleshooting procedures below as instructed. Procedure 1 Test Program Check Procedure 2 Connector Check and Replacement Check Procedure 1 Test Program Check Execute the Fan On/Off test program available as part of the maintenance test program. This test program checks the cooling module.
2 Troubleshooting 2-24 2.
Test Program for Field.
Test Program for Field. Chapter 3 Contents 3.1 Tests and Diagnostics Software Overview ............................................................. 82 3.2 Executing the Diagnostic Test ................................................................................ 83 3.3 Subtest names.......................................................................................................... 87 3.4 System Test...................................................................................................
Test Program for Field. 3.1 Tests and Diagnostics Software Overview This chapter explains how to use the Tests and Diagnostics Software for the Satellite L20/L25 and Satellite Pro L20/L25 computer systems. NOTES: Before starting the Tests and Diagnostics software: 1. Check all cables for loose connections. 2. Exit any application and close Windows.
Test Program for Field. 3.2 Executing the Diagnostic Test MS-DOS is required to run the Diagnostics Program. To start the programs follow these steps: 1. Create a DOS bootable disk and copy all the files from the Tests and Diagnostics software to the disk. 2. Insert the boot disk into the computer’s floppy disk drive and turn on the computer. The following screen displays: TOSHIBA Satellite(Pro) L20/L25 Diagnostics Version v1.00 (C) Copyright QUANTA Corp.
Test Program for Field. The following menu displays: TOSHIBA Satellite(Pro) L20/L25 Diagnostics Version V1.00 (C) Copyright QUANTA Corp. 2005- ESC ::Select item :Escape [ DIAGNOSTICS MENU ] 01. 02. 03. 04. 05. 01. 06. 02. 99. 03. 04. 05. 06. 07. DIAGNOSTIC TEST RUNNING TEST DMI INFORMATION [ DIAGNOSTIC TEST MENU ] LOG UTILITIES SYSTEM TEST CONFIGURATION 08. CACHE MEMORY TEST SYSTEM OPTION MEMORY TEST 09. HIGH RESOLUTION DISPLAY TEST EXIT KEYBOARD TEST 10. MULTIMEDIA TEST DISPLAY TEST 11.
Test Program for Field. Refer to Sections 3.4 through 3.14 for detailed descriptions of Diagnostics Tests 1 through 11. Item 88 sets the floppy disk drive and hard disk drive error retry count. Item 99 exits the submenu of the Diagnostic Test and returns to the Diagnostics Menu. 4. Select the subtest you want to execute and press Enter. The following menu displays: TOSHIBA Satellite(Pro) L20/L25 Diagnostics Version V1.00 (C) Copyright QUANTA Corp.
Test Program for Field. TOSHIBA Satellite(Pro) L20/L25 Diagnostics Version V1.00 (C) Copyright QUANTA Corp. 2005- ESC : :Select item :Escape [ DIAGNOSTICS MENU ] [ SYSTEM TEST ] [ TEST PARAMETER ] 01. DIAGNOSTIC TEST 01. 01. FAN FAN ON/OFF 01. Go 01.TEST Go To To Test Test02. Battery Test 02. RUNNING 02. Test Loop : YESTemperature 03. DISK UTILITIES 03. CPU [ DIAGNOSTIC TEST MENU ] 03. Error Stop : NO 04. LOG UTILITIES 99. Exit to DIAGNOSTIC TEST MENU 05. SYSTEM CONFIGURATION 01. TEST 09.
Test Program for Field. 3.3 Subtest names Table 3-1 lists the subtest names for each test program in the Diagnostic Test menu. Table 3-1 Subtest Names(1/3) No. 01 02 03 04 Test Name SYSTEM TEST MEMORY TEST KEYBOARD TEST DISPLAY TEST Satellite L20 Maintenance Manual(960-Q01) No.
Test Program for Field. Table 3-1 Subtest Names(2/3) No. 05 06 07 08 09 88 Test Name FLOPPY DISK TEST No.
Test Program for Field. Table 3-1 Subtest Names(3/3) No. 10 11 Test Name MULTIMEDIA TEST MEMORY2 No. Subtest Name 01 Sequential Read Test 02 Random Read Test 03 Read Specified Address Test 04 1 point W/R/C Test 01 All one/zero 02 Walking 1/Walking 0(Left) 03 Walking 1/Walking 0(Right) 04 Walking 1/Walking 0(Left /Right) *This test cannot support.
Test Program for Field. 3.4 System Test To execute the System Test select 01 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The System Test contains two subtests. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 FAN ON/OFF Checking Select 1,2,3 to control FAN on/off , 1=Fan on , 2=Fan off , 3=Exit . [EW5FAN.EXE] Program Version : 1.
Test Program for Field. Subtest 03 CPU Temperature This will display CPU Temperature for check , press [ESC] to exit .
Test Program for Field. 3.5 Memory Test To execute the Memory Test select 02 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Memory Test contains five subtests that test the computer’s memory. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: If NO is selected for Test Loop on the Test Parameter menu, the Test Status screen displays while the test is executing. When the test is complete the Memory Test menu displays.
Test Program for Field. 5. Address pattern test “16 bit write and 16 bit read” of address pattern data is executed and the new data is compared with the original data. Test data = 0000H, 0004H, 0008H, 000CH,...8000H, 8004H, through FFECH Subtest 02 Protected Mode This subtest first writes data patterns and address data from 1 to 32 MB, then reads the new data and compares the result with the original data patterns. Addresses are displayed in 64KB increments during the test. . Test Process: 1.
Test Program for Field. Test Process: 1. Checks the memory size to determine the maximum size of installed memory. 2. Tests memory addresses 0 to the maximum installed. 3. Writes, reads, and compares test data after a memory refresh cycle (16ms or more). NOTE: There may be a short delay between write and read operations, depending on the memory size. Subtest 05 Stress Test This subtest writes the following 16KB data patterns to the Write/Read Buffer in conventional memory.
Test Program for Field. 3.6 Keyboard Test To execute the Keyboard Test select 03 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Keyboard Test contains seven subtests that test the computer’s keyboard and mouse actions. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: The Test Loop and Error Stop parameters are not enabled for the Keyboard test.
Test Program for Field. Subtest 04 Hot Key Display [4 Key] This subtest is used for the 4 hot key and functions the same as Subtest 1. Subtest 05 Hot Key Display [5 Key] This subtest is used for the 5 hot key and functions the same as Subtest 1. Subtest 06 Keyboard LED The LED display for Num Lock, Caps Lock, and Scroll Lock (in that order) will flash repeatedly. Confirm this visually. The following screen displays while this test executes.
Test Program for Field.
Test Program for Field. 3.7 Display Test To execute the Display Test select 04 from the Diagnostic Test Menu, press Enter and follow the directions displayed on the screen. The Display Test contains twelve subtests that test the display in various modes. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Character Attributes This subtest displays character attributes and color attributes. The character attributes are: normal, intensified, reverse, and blinking.
Test Program for Field. Press Enter if NO was selected for Test Loop on the Test Parameter Menu. Press Ctrl + break if YES was selected for Test Loop on the Test Parameter Menu. Subtest 02 Character Set This subtest displays the character codes 00H - FFH, using Mode 01H (40*25). The screen below displays when this subtest is executed.
Test Program for Field. Subtest 03 80 * 25 Character Display This subtest uses 80*25 video resolution to display character codes 20H 7EH using Mode 03H (80*25). The data displayed is shifted 1 byte to the left for each line as shown below. 80*25 CHARACTER DISPLAY 01234567890123456789012345678901234567890123456789012345678901234567890123456789 !”#$%&’()*=,.-/0123456789:;Ù?@ABCDEFGHIJKLMNOPQRSTUVWXYZ[\]^_’abcdefghIjklmno !”#$%&’()*=,.
Test Program for Field. Subtest 04 320 * 200 Character Display This subtest uses 320*200 video resolution to display green, red and yellow followed by cyan, magenta, and white. The screen below shows the displays when this subtest is executed.
Test Program for Field. 320*200 GRAPHICS DISPLAY : [ D ] BLACK D GRAY BLUE L BLUE GREEN L GREEN CYAN L CYAN RED L RED MAGENTA L MAGENTA BROWN YELLOW WHITE I WHITE Press [Enter] KEY Press ENTER to display 64 gradations of red, green, blue and white on the screen 320*200 GRAPHICS DISPLAY : [ 13 ] 64 gradations of red are displayed. 64 gradations of green are displayed. 64 gradations of blue are displayed. 64 gradations of white are displayed.
Test Program for Field. Subtest 05 640 * 200 Character Display This subtest uses 640*200 video resolution to display three windows, each window drives a different set of dots: even dots, odd dots and all dots. The screen below displays when this subtest is executed.
Test Program for Field. Subtest 06 640 * 480 Character Display This subtest uses 640*350 video resolution to display 16 colors: black, blue, green, cyan, red, magenta, brown, white, dark gray, light blue, light green, light cyan, light red, light magenta, yellow, and intensified white. The screen below displays when this subtest is executed.
Test Program for Field. 640*480 GRAPHICS DISPLAY : [12 ] BLACK DARK GRAY BLUE LIGHT GREEN LIGHT GREEN CYAN LIGHT CYAN RED LIGHT RED MAGENTA LIGHT MAGENTA BROWN YELLOW WHITE INTENSIFIED WHITE BLUE Press [Enter] KEY To exit this subtest and return to the Display Test menu: Press Enter if NO was selected for Test Loop on the Test Parameter Menu. Press Ctrl + break if YES was selected for Test Loop on the Test Parameter Menu.
Test Program for Field. Subtest 07 Display Page This subtest displays video pages zero through seven. DISPLAY PAGE 0 000000000000000000000000000000000000000000000000000000000000000 0.............................................................0 0.............................................................0 0.............................................................0 0.............................................................0 0.............................................................0 0.........
Test Program for Field. Subtest 08 "H" Pattern Display This subtest displays a full screen of "H" patterns.
Test Program for Field. Subtest 10 Color Graphics Display This subtest displays three colors, cyan, white and yellow on the screen as shown below. 640 * 480 GRAPHICS DISPLAY CYAN WHITE YELLOW To exit this subtest and return to the Display Test menu: Press Enter if NO was selected for Test Loop on the Test Parameter Menu. Press Ctrl + break if YES was selected for Test Loop on the Test Parameter Menu.
Test Program for Field. Subtest 11 Color Attributes Display This subtest displays 16 colors: black, blue, green, cyan, red, magenta, brown, white, dark gray, light blue, light green, light cyan, light red, light magenta, yellow, and intensified white. The screen below displays when this subtest is executed.
Test Program for Field. NOTE: The following screen does not display correctly. It will be amended in the next version. Press [Enter] Key Press Enter to execute the VRAM mapping test which displays a vertical line at four dot intervals using Mode 12. Press [Enter] Key Press Enter to display VRAM mapping test using the all dots Mode.
Test Program for Field. Press [Enter] Key To exit this subtest and return to the Display Test menu: Press Enter if NO was selected for Test Loop on the Test Parameter Menu. Press Ctrl + break if YES was selected for Test Loop on the Test Parameter Menu.
Test Program for Field. Subtest 12 Color Tiling This subtest displays black, gray, white, and 3 gradations of red, green, and blue as shown in the following display. Black Red Green Blue Gray Red Gradation Green Gradation Blue Gradation White Red Gradation Green Gradation Blue Gradation To exit this subtest and return to the Display Test menu: Press Enter if NO was selected for Test Loop on the Test Parameter Menu. Press Ctrl + break if YES was selected for Test Loop on the Test Parameter Menu.
Test Program for Field. 3.8 Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the diagnostics disk and insert the work disk into the FDD. The contents of the floppy disk will be erased. To execute the Floppy Disk Test select 05 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Floppy Disk Test contains five subtests that test the FDD. Move the highlight bar to the subtest you want to execute and press Enter.
Test Program for Field. Subtest 04 Write Specified Address NOTE: The first two digits of the ADDRESS indicate which track is being tested, the next two digits indicates the head, and the last two digits indicate the sector. This subtest allows you to verify the errors from Subtest 02. It writes specified data to a specified track and head. Use the Log Utilities (see Section 3.21) to specify the track number and head number where the error(s) occurred during Subtest 02.
Test Program for Field. 3.9 Hard Disk Test To execute the Hard Disk Test select 06 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Hard Disk Test contains eight subtests that test the functions of the hard disk drive. Move the highlight bar to the subtest you want to execute and press Enter. NOTES: The contents of the hard disk will be erased when subtest 02, 03, 04, 05, 07 or 08 is executed.
Test Program for Field. Subtest 04 Cross Talk and Peak Shift This subtest writes eight of the most likely to fail data patterns (shown below) to a cylinder on the HDD, then reads the data while moving from cylinder to cylinder. Data Pattern B5ADADH 4A5252H EB6DB6H 149249H 63B63BH 9C49C4H 2DB6DBH D24924H Subtest 05 Write Specified Address NOTE: This subtest is designed to run with the Test Loop set to NO. This subtest is a debug tool and the operator should enter the Test Parameters each time. .
Test Program for Field. Subtest 07 Sequential Write This subtest writes specified data to all cylinders on the HDD. The following message displays on the screen to enter the test data. TEST DATA Subtest 08 ????(=37b3H) W-R-C Specified Address This subtest writes specified data to a specified sector count, then reads and compares the result. The following message displays on the screen to enter the test data, sector count.
Test Program for Field. 3.10 Real Time Clock Test To execute the Real Time Clock Test select 07 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Real Time Clock Test contains three subtests that test the computer’s real time functions. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real Time This subtest allows you to change the date and time. To execute the Real Time Subtest, follow these steps: 1.
Test Program for Field. Subtest 02 Backup Memory This subtest writes 50 bytes of test data (FFH, AAH, 55H, and 00H) to the CMOS 14th address, then reads the new data and compares it to the original data. Subtest 03 Real Time Carry CAUTION: When this subtest is executed, the current date and time are reset. This subtest checks the clock’s carry function.
Test Program for Field. 3.11 Cache Memory Test To execute the Cache Memory Test select 08 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Cache Memory Test contains eight subtests that test the computer's cache memory. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: If NO is selected for Test Loop on the Test Parameter menu, the screen will remain blank while the subtest is executing.
Test Program for Field. Subtest 04 Bit Shift Pattern Test This subtest reads the contents of cache memory and saves it into RAM. The subtest then writes the bit shift data patterns (1 bit shifted every 4 bytes), reads the new data and compares the result with the original data. The original cache memory content is then restored to the cache memory. Subtest 05 Write Disturb Test (We can’t support this time) This subtest reads the contents of cache memory and saves it into RAM.
Test Program for Field. 3.12 High Resolution Display Test To execute the High Resolution Display Test select 09 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The High Resolution Display Test contains six subtests that test the computer's high resolution video display. Move the highlight bar to the subtest you want to execute and press Enter.
Test Program for Field. Subtest 02 640*480 Mode Display This subtest uses 640*480 video resolution to display a high resolution white frame, 256 letter types (8*16 pixels) and 64 gradations of white, red, green, and blue as shown below.
Test Program for Field. Subtest 03 800 * 600 Mode Display This subtest uses 800*600 video resolution to display a high resolution white frame, 256 letter types (8*16 pixels) and 256 gradations of white, red, green, and blue as shown below.
Test Program for Field. Subtest 04 1024* 768 Mode Display This subtest uses 1024*768 video resolution to display a high resolution white frame, 256 letter types (8*16 pixels) and 64 gradations of white, red, green, and blue as shown below.
Test Program for Field. Subtest 05 “H” Pattern Display This subtest uses the 1024*768 Mode to display a high resolution white frame, “H” letters (8*16 pixels fonts), at 128 letters by 48 lines.
Test Program for Field. Subtest 06 Focus Test ( “E” Pattern) This subtest sets the 1024*768 Mode and displays “E” patterns (18*18 dot fonts), at 56 letters *42 lines surrounded by a high resolution white frame. To exit this subtest and return to the High Resolution Display Test menu: Press Enter if NO was selected for Test Loop on the Test Parameter Menu. Press Ctrl + break if YES was selected for Test Loop on the Test Parameter Menu.
Test Program for Field. 3.13 Multimedia Test To execute the Multimedia Test select 10 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The Multimedia Test contains four subtests that test the computer's multimedia functions. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: Use the Toshiba Backup CD-ROM for Subtests 01, 02, and 03.
Test Program for Field. 3.14 MEMORY2 Test To execute the Expansion Test select 11 from the Diagnostic Test Menu, press Enter and follow the directions on the screen. The MEMORY2 Test contains four subtests that test the computer's. Move the highlight bar to the subtest you want to execute and press Enter. NOTE: If NO is selected for Test Loop on the Test Parameter menu, the Test Status screen displays while the test is executing. When the test is complete the Memory Test menu displays.
Test Program for Field. Tee test method is the same as Subtest2. However, the data to be used differs.
Test Program for Field. 3.15 Error Codes and Error Status Names The following table lists the error codes and error status names for the Diagnostic Tests.
Test Program for Field.
Test Program for Field. 3.16 Running Test NOTES: 1. You may add or delete subtests using the Running Test Edit Item function, see Section 3.20. 2. Do not forget to insert a work disk in the FDD. If a work disk is not inserted an error will be generated during the Floppy Disk Test. 3. If the test completes successfully an “PASS” sign with blue letters displays on the screen. 4. If the test fails or is interrupted before completion an “FAIL” sign with red letters displays on the screen. 5.
Test Program for Field. 3.17 DMI INFOEMATION Select 03 from the Diagnostics Menu and press Enter to Check or Write DMI Information Data: 3.17.1 Check DMI Information The Check DMI Configuration program contains the following configuration information for the computer: NOTE: Please set the media of DVD before starting a test. System information (Type 1) 1. Manufacture : TOSHIBA 2. Product Name : Satellite XXXXXX 3. Version :(TOSHIBA Part Number) 4. Serial Number : Serial Number 5.
Test Program for Field. Note : Please Check New DMI Information After System Restart !! 1. **** Manufacture Name ( TOSHIBA ) - (15) 2. **** Product Name ( Satellite XXXXXX ) - (31) 3. **** Part Number ( PSL20X-XXXXXX ) - (15) 4. **** Serial Number ( 12345678W ) - (9) 5. **** OEM String ( PSL20X-XXXXX,SXXXXXXXXXX ) - (31) 6. **** Exit Please Select (1 ~ 5) To Modify DMI String : Current Data of EEPROM : Toshiba 1.
Test Program for Field. 3.18 Log Utilities This function logs error information generated while a test is in progress and stores the results in RAM (Maximum error log : 500 times). This function can store data on a floppy disk. If the power switch is turned off, the error information will be lost. Error information is displayed in the following order: 1. 2. 3. 4. 5. 6. 7. 8.
Test Program for Field. 2. Error information displayed on the screen can be manipulated with the following number keys: The 1 key scrolls the display to the next page. The 2 key scrolls the display to the previous page. The 3 key returns to the Diagnostics Menu. The 4 key erases all error log information in RAM. The 5 key reads the log information from a floppy disk. The 6 key writes the log information to a floppy disk. The 7 key save the log information to a floppy disk.
Test Program for Field. 3.19 System Configuration Select 05 from the Diagnostics Menu and press Enter to display the following system configuration: SYSTEM CONFIGURATION : * * * * - * * * * * - BIOS VER = VX.XX KBC VER = XXXX MAC ADDRESS : XXXXXXXXXXXX 0 ASYNC ADAPTER 1 HDD DRIVE(S):XXXXXXXXXXXXXXXXXXXXXXXXXX FW Rev.:XXXXXXXX CUR LBA:XXXXXXXX ORG LBA:XXXXXXXX BATTERY TYPE:XXXXXXXXXX XXXMB MEMORY SIZE XXX CPU 1 Vedio Chip XXXXXXXXXXXXX 1 ODD DRIVE(S):XXXXXXXX FW Rev.
Test Program for Field. 3.20 Running Test Edit Item 3.20.1 Function Description Function description lets you add or delete the subtests used to execute the Running Test. The following screen displays after pressing the Tab key to edit an item in the Running Test. KEY OPERATION Ð Ï PgDn PgUp Home End Ins Del Enter Cursor Down Cursor Up Page Down Page Up Top of ITEM End of ITEM Insert ITEM Delete ITEM End 3.20.
Test Program for Field. 1. Enter a number or 0 for Loop Count and press Enter. Select a number from 1 to 65535 to define the number of times the Running Test executes. Select 0 to run the test continuously until halted by the user. 2. Select the NO or YES for Error Stop and press Enter. Select NO to keep the test running even if an error is found. Select YES to stop the test program when an error is found. NOTE: All errors which occur during execution of the Running Test are logged in the Log File. 3.
Test Program for Field. 3.21 Common Tests and Operation 3.21.1 How to operate a window To input parameters, or open a window use the following keys. key [Enter] key [Esc] key : to move a highlight bar : to select an item at the highlight bar : to close the current window and go back to the previous window 3.21.2 How to Stop the Test Program To stop a test: [Ctrl]+[Break] Press the Ctrl key and the Break key simultaneously. 3.21.
Test Program for Field. 142 Pass Count Displays the number of times the test has been executed. Error Count Displays the number of errors which have occurred during the test. Write Data Displays only the test data that has failed to compare during the test while being written during the test. Read Data Displays test data that has failed to compare during the test while being read during the test. Test Address Displays the Test Address. (The format differs for each test.
Test Program for Field. 3.21.4 Test Stop Display If an error occurs during a Subtest and YES is selected for Error Stop, the following message displays: [HALT OPERATION] 1. Test end 2. Continue 3. Retry * Select 1, 2, or 3 The three selections have the following functions: 1: Terminates the test program and exits to the subtest menu. 2: Continues the test from the error. 3: Restarts the test from the beginning. Use the arrow keys to move the cursor to the desired option and press Enter. 3.21.
Chapter 4 Replacement Procedures Satellite L20 Maintenance Manual(960-Q01) 4-i
Replacement Procedures 4 4-ii Satellite L20 Maintenance Manual(960-Q01)
Replacement Procedures Chapter 4 4.1 Contents Overview....................................................................................................................144 Safety Precautions ................................................................................................145 Before You Begin ................................................................................................146 Disassembly Procedure..............................................................................
Replacement Procedures Figures Figure 4-1 Removing the battery pack.................................................................................152 Figure 4-2 Removing a PC card...........................................................................................154 Figure 4-3 Removing the HDD assembly............................................................................157 Figure 4-4 Removing a HDD..............................................................................................
Replacement Procedures 4 2 4.1 Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual. In all cases when removing an FRU, the battery pack must also be removed.
Replacement Procedures Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. DANGER: 1. In the case of the battery, always use authentic parts or equivalent parts approved by Toshiba. Other batteries may have different specifications that are incompatible with the computer and may result in fire or explosion. Due to the risk of alkali fluid leaks, never attempt to heat or disassemble the battery.
Replacement Procedures Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2.1 Battery Pack”. 1. Do not disassemble the computer unless it is operating abnormally. 2. Use the designated tools. 3. Ensure that the environment for working on and storing parts does not contain any of the following.
Replacement Procedures Disassembly Procedure Three main types of cable connector are used. • Pressure plate connector • Spring connector • Normal pin connector When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cable out from the connector. When reconnecting a cable to a pressure plate connector, lift up the pressure plate to a suitable height and insert the cable into the connector.
Replacement Procedures Assembly Procedure After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. • Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems. • Check that all cables and connectors are securely connected.
Replacement Procedures Screw Tightening Torque Use the following torque when tightening screws. CAUTION: Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage. NOTE: To tighten screws quickly and accurately, an electric screwdriver is recommended. • M2 (2mm) 0.167 N·m (1.7 kgf·cm) • M2.5 (2.5mm) 0.245 N·m(2.5 kgf·cm) • M2.5 (2.5mm) 0.392 N·m(4.0 kgf·cm) for Hinge support • M3.0 (3mm) 0.245 N･m (2.
Replacement Procedures Screw Notation To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body. Format: Screw shape + Screw length (mm) Screw shape B: Bind screw F: Thin head screw S: Super thin head screw T: Tapping screw U: Other screws (Unique screws: pan head, stud, etc.
Replacement Procedures 4.2 Battery pack Removing the battery pack The following describes the procedure for removing the battery pack (See Figure 4-1). CAUTION: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC adapter and all external devices from the computer. 3. Turn the computer upside down. 4.
Replacement Procedures Figure 4-1 Removing the battery pack NOTE: Dispose of the used battery pack in accordance with the laws and ordinances of your local authority. Installing the battery pack The following describes the procedure for installing the battery pack (See Figure 4-1). CAUTION: There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly.
Replacement Procedures 2. Disconnect the AC adapter and all external devices from the computer. 3. Attach the battery cover to the battery pack. 4. Insert the battery pack 5.
Replacement Procedures 4.3 PC card Removing a PC card The following describes the procedure for removing a PC card (See Figure 4-2). CAUTION: Insert or remove a PC card in accordance with any instructions in a PC card manual or the manuals of the computer system you are using. 1. Push the eject button. It will pop out when you release it. Then press the eject button once more to eject a PC card. 2. Grasp a PC card and remove it.
Replacement Procedures 2. Insert a PC card and press it until it is securely connected.
Replacement Procedures 4.4 HDD Removing a HDD The following describes the procedure for removing a HDD (See Figure 4-4 to 4-5). CAUTION: Take care not to press on the top or bottom of a HDD. Pressure may cause data loss or damage to the device. 1. Turn the computer upside down. 2. Remove the following screws securing a HDD slot cover and remove a HDD slot cover. • M2.5×4.0B FLAT BIND screw x2 3. Remove the following screws securing the HDD assembly. • M2.5×4.0B FLAT BIND screw x１ 4.
Replacement Procedures CAUTION: When a HDD is installed, they are installed in the position as the following figure. M2.5x4.
Replacement Procedures 5. Remove the following screws securing the HDD holder and remove the HDD holder. • M3.0×4.0B FLAT BIND screw x4 HDD HDD holder M3.0x3.5.
Replacement Procedures Installing a HDD The following describes the procedure for installing a HDD (See Figure 4-4 to 4-5). 1. Install a HDD to the HDD holder and secure it with the following screws. • M3.0×3.5F FLAT BIND screw x4 NOTE: Although they are 3mm head screws, screw torque must be set in 2.5kg-cm for four screws securing the HDD holder. 2. Insert the HDD assembly into the HDD slot and connect it carefully to the CN18 on the system board. 3. Secure the HDD assembly with the following screw.
Replacement Procedures 4.5 Wireless LAN card Removing a Wireless LAN card The following describes the procedure for removing a Wireless LAN card (See Figure 4-6). 1. Remove the following screw of wireless cover securing wireless LAN card cover and remove it. • 2.5.0 x 4.0B BIND screw x2 2. Disconnect the wireless LAN antenna cable Main (Black cable) and AUX (White cable) from the connectors on a wireless LAN card. 3.
Replacement Procedures Installing a Wireless LAN card The following describes the procedure for installing a Wireless LAN card (See Figure 4-7). 1. Insert a wireless LAN card terminals slantwise into the connector CN27 on the computer and press a wireless LAN card until it is securely in place. 2. Connect the wireless LAN antenna cables (black and white) to the terminals on a wireless LAN card. 3. Install the wireless LAN card cover and secure it with the following screw.
Replacement Procedures 4.6 Memory module CAUTION: The power of the computer must be turned off when you remove a memory module. Removing a memory module with the power on risks damaging the module or the computer itself. Do not touch memory module terminals. Any dirt on the terminals may cause memory access problems. Never press hard or bend a memory module. Removing a memory module To remove a memory module, confirm that the computer is in boot mode.
Replacement Procedures Figure 4-6 Removing a memory module Satellite L20 Maintenance Manual(960-Q01) 163
Replacement Procedures Installing a memory module To install a memory module, confirm that the computer is in boot mode. Then perform the following procedure (See Figure 4-8). 1. Insert a memory module into the connector of the computer slantwise (terminal side first) and press it to connect firmly. CAUTION: The power must be turned off when you insert a memory module. Inserting a memory module with the power on might damage the module or the computer itself. Never press hard or bend a memory module. 2.
Replacement Procedures 4.7 Keyboard Removing the keyboard The following describes the procedure for removing the keyboard (See Figure 4-9 to 4-11). CAUTION: As the keycap may fall out, when handling the keyboard always hold it by the frame and do not touch the keycap. 1. Turn the computer upside down 2. Loose the screw securing KBD cover. M2.0x3.0B Flat BIND screws x2 3. Loose the screw securing keyboard. M2.5x6.0B Flat BIND screws X2 4. Upside down the computer. 5. Open the display. 6.
Replacement Procedures M2.5x6.0 M2,0X3.
Replacement Procedures KBD cover Keyboard Figure 4-8 Removing the keyboard/KBD cover Satellite L20 Maintenance Manual(960-Q01) 167
Replacement Procedures Installing the keyboard The following describes the procedure for installing the keyboard (See Figure 4-9 to 4-110). 1. Turn the keyboard upside down and place it on the palm rest as its face down. Connect the keyboard flexible cable to the connector CN3200 on the system board. 2. Install the keyboard support plate and secure it with the following screws. • M2.5×8.0B FLAT BIND screw x2 3. Turn the keyboard face up and put it on the computer.
Replacement Procedures 4.8 LED Board Removing the LED Board The following describes the procedure for removing the LED board (See Figure 4-12). 1. Remove the following screw securing the switch membrane. • M2.5×3.0B FLAT BIND screw x2 2. Push up the LED board to the arrow direction and remove it. LED Board M2.5x3.
Replacement Procedures Installing the LED Board The following describes the procedure for installing the switch membrane (See Figure 4-12). 1. Press LED board in the computer. 2. Secure the LED board with the following screw. • 170 M2.5×3.
Replacement Procedures 4.9 Optical disk drive NOTE: Do not apply excessive force to the top of an optical disk drive. Do not touch the shaded portion of the figure below, when the drive is removed or installed. Removing an optical disk drive The following describes the procedure for removing an optical disk drive (See Figure 4-13 and 4-14). 1. Turn over the computer and remove the following screws securing an optical disk drive. • M2.5×6.0B FLAT BIND screw x1 2. Upside down the computer. 3.
Replacement Procedures Optical disk drive M2.5 x 6.0B FLAT BIND M2.5 x 6.
Replacement Procedures ODD bracket M2.0×3.0 Figure 4-11 Disassembling the ODD bracket Installing an optical disk drive The following describes the procedure for installing an optical disk drive (See Figure 4-13 and 4-14). 1. Attach the ODD bracket to an optical disk drive and secure it with the following screws. • M2.0×3.0 Flat BIND screw x3 2. Insert an optical disk drive assembly into the slot and connect it to the connector CN25 on the system board. 3. Secure the ODD drive with the following screw.
Replacement Procedures • 174 M2.5×6.
Replacement Procedures 4 4.10 Display assembly Removing the display assembly The following describes the procedure for removing the display assembly (See Figure 4-15 to 4-20). 1. Close the display and turn the computer upside down . 2. Remove the following screws from the k/b cover of the computer. • M2.0×3.0 FLAT BIND screw x2 (Locktight) • M2.5×6.0 FLAT BIND screw x2 (Locktight) M2.5x6.0 FLAT BIND (Locktight) M2.0x3.
Replacement Procedures 3. Open the MINIPCI Door and remove the wireless LAN antenna connector . Figure 4-13 Removing the MINIPCI door and connetor (back) 4. Open the display and removing the k/b cover and keyboard .
Replacement Procedures Figure 4-17 Removing the cables (back) 5. Pull out the wireless LAN antenna cables from the guide Wireless LAN antenna cable Figure 4-14 Removing the antenna cables (back) 6. Opening the display to 180 degree, and remove the hinge screw . ‧ M2.3×6.
Replacement Procedures M2.5x6.0 FLAT BIND (Locktight) M2.5x6.0 FLAT BIND (Locktight) . .
Replacement Procedures 7. Remove the LCD harness from the connector on the system board and Pulling out the pole of hinge from the hole of hinge assembly, remove the display assembly from the base assembly. .
Replacement Procedures Installing the display assembly The following describes the procedure for installing the display assembly (See Figure 4-15 to 4-20). 1. Inserting the pole of hinge to the hole of hinge assembly, set the display assembly on the base assembly. 2. Secure the hinges with the following screws , Secure the display mask with the following screws and stick the mask seal on them. • M2.5×6.
Replacement Procedures 4.11 Cover assembly Removing the cover assembly The following describes the procedure for removing the cover assembly (See Figure 4-21 to 4-24). 1. Turn over the computer. 2. Remove the following screws securing the cover assembly from the back and bottom of computer. • M2.5×6.0B FLAT BIND screw x18 • M2.5×2.
Replacement Procedures Figure 4-17 Removing the screws (back) 3. Disconnect the touch pad flat cable from the connector on the system board. 4. Removing the screw from power board and remove the power board . M2.5×3.
Replacement Procedures Power board M2.5x3.
Replacement Procedures 5. Pull up and remove the cover assembly from the base assembly.
Replacement Procedures Installing the cover assembly The following describes the procedure for installing the cover assembly (See Figure 4-21 to 4-24). 1. Install the cover assembly to the base assembly. NOTE: Be careful not to catch the cables between cover assembly and base assembly. 2. Connect the touch pad flat cable to the connector on the system board. 3. Secure the cover assembly with the following screws from the back and bottom of computer. • M2.5×2.0B FLAT BIND screw x3 • M2.5×6.
Replacement Procedures 4.12 Touch pad Removing the touch pad The following describes the procedure for removing the touch pad (See Figure 4-31). 1. Peel off the glass tape and disconnect the touch pad flat cable from the connector on the touch pad and peel the al foil . 2. Remove the following screws securing the touch pad plate. • M2.5×3.0B SUPER THIN HEAD screw x5 3. Turning up the insulator, remove the touch pad plate. 4. Peel off and remove the touch pad from the cover assembly. M2.5x3.
Replacement Procedures Installing the touch pad The following describes the procedure for installing the touch pad (See Figure 4-31). 1. Peel off the separator covering on the sensor portion of a new touch pad. NOTE: Do not reuse the touch pad so that it can not be used after peeling off from the computer. Be sure to stick a new touch pad. When stickimg the touch pad, be careful not to get the bubbles under the touch pad. 2. Stick and install the touch pad on the cover assembly. 3.
Replacement Procedures 4 4.20 System board CAUTION: 1. When handling the system board, always hold by the edges. Do not touch the printed circuit face. 2. If replacing with a new system board, execute the subtest01 Initial configuration in section 3.3 “Setting of the hardware configuration”. Also update with the latest BIOS as described in Appendix G “BIOS Rewrite Procedures” and with the latest EC/KBC as described in Appendix H “EC/KBC Rewrite Procedures”.
Replacement Procedures Installing the system board The following describes the procedure for installing the system board (See Figure 4-41). 1. Secure the system board with the following screws. • M2.5×4.0 BIND screw x2 2. Connect the speaker cable to the connector CN 11 on the system board.
Replacement Procedures 4.21 CPU Removing the CPU The following describes the procedure for removing the CPU heat sink (See Figure 4-44). 1. Disconnect the Heat sink cable from the connector CN15 on the system board 2. Remove the following screws securing the heat sink holder along 1 to 7. • M2.5×4.0 BIND screw x7 NOTE: When removing the heat sink holder, be sure to remove the screws in the reverse order of the number marked on the holder. 3. Remove the CPU heat sink .
Replacement Procedures 4. Unlock the CPU by rotating the cam on the CPU socket 120 degrees to the counterclockwise with a flat-blade screwdriver. 5. Remove the CPU. Figure 4-23 Removing the CPU Installing the CPU&VGA heat sink The following describes the procedure for installing the CPU (See Figure 4-44to 4-46). 1. Check that the mark of cam is in the unlocking position. 2. Attach the CPU to the correct position in the CPU socket. 3.
Replacement Procedures NOTE: Apply the silicon grease enough to cover the chip surface using the special applicator. Figure 4-24 Applying silicon grease 5. Install the CPU&VGA heat sink and heat sink holder and secure them with the following screws along 1 to 7. M2.5×4.0 BIND screw x7 6.
Replacement Procedures LCD unit / FL inverter CAUTION: When replacing a LCD, it is required that SVP parameter is set. Update with the latest EC/KBC as described in Appendix H “EC/KBC Rewrite Procedures”. Removing the LCD unit / FL inverter The following describes the procedure for removing the LCD unit and FL inverter (See Figure 4-52 to 4-55). 1. Remove Screw rubber cover X4 2. Remove the following screws securing the display mask M2.5×6.0 BIND screw X4 3.
Replacement Procedures 4. Pull out one insulator and peel off the other one adhered to the FL inverter. 5. Disconnect the LCD harnesses from the connectors CN1 on the FL inverter. 6. Disconnect the HV harnesses from the connectors CN2 on the FL inverter. 7. Remove the FL inverter while peeling off the double-sided tape.
Replacement Procedures 8. Remove the following screws securing the LCD unit. • M2.5x4.0 BINK HEAD screw x6 9. With the bottom edge of the LCD unit on the display cover, lift only the top edge of the LCD unit. After peeling off the CONDUTIVE tape, disconnect the LCD harness from the connector on the back of the LCD. 10. Remove the LCD unit. M2.5x4.0 BINK HEAD LCD unit CONDUTIVE tape M2.5X4.
Replacement Procedures 11. Remove the following screws securing the LCD support (LCD unit side) and remove the LCD supports from the LCD unit. • M2.0x3.0 BINK screw x8 LCD support LCD support M2.0x3.0 BINK M2.0x3.
Replacement Procedures Installing the LCD unit/FL Inverter The following describes the procedure for installing the LCD unit and FL inverter (See Figure 4-52 to 4-55). 1. Install the LCD supports (LCD unit side) to the LCD and secure them with the following screws. • M2.0×3.0 BINK screw x8 2. Stand the LCD unit on the display cover and connect the LCD harness to the connector on the back of LCD. 3. Stick the conductive tape on the connector of LCD harness. 4.
Appendices Satellite L20 Maintenance Manual(960-Q01) App-i
App-ii Satellite L20 Maintenance Manual(960-Q01)
Appendix Contents Appendix A Handling the LCD Module......................................................................... A-1 Appendix B Board Layout............................................................................................... B-1 B.1 System Board Front View............................................................................. B-1 B.2 System Board Back View ............................................................................. B-3 B.3 LED Board ......................
C.19 J2 Memory connector 1 (200-PIN) ............................................................ C-13 C.20 CN19 USB I/F connector (4-PIN) .............................................................. C-16 C.21 CN20 External MIC Connector (8-PIN).................................................... C-16 C.22 CN21 Headphone OUT Connector (8-PIN) .............................................. C-16 C.23 CN22 ODD I/F Connector (50-PIN).......................................................... C-17 C.
E 18 Turkish (TR) Keyboard ................................................................................E-9 E 19 Japanese (JP) Keyboard..............................................................................E-10 E 20 Swiss-German(SL) Keyboard ......................................................................
Appendix F Wiring Diagrams..........................................................................................F-1 F.1 RGB Monitor ID Wraparound Connector .................................................... F-1 F.2 LAN Loopbak Connector ..............................................................................F-1 Appendix G BIOS Rewrite Procedures .......................................................................... G-1 Appendix H EC/KBC Rewrite Procedures ................................
Appendix A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4. If water or other liquid is left on the panel’s surface for a long period, it can change the screen’s tint or stain it.
Handling the LCD Module 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
Handling the LCD Module 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxide). These materials can release gas that can damage the panel’s polarization.
Handling the LCD Module A-6 Satellite L20 Maintenance Manual(960-Q01)
Appendix B Appendix B Board Layout B.
Board Layout Table B-1 System board ICs and connectors (front) B-2 Mark Number Name (a) CN1 LED Board Connector (b) CN2 LCD I/F Connector (c) CN3 Keyboard I/F Connector (d) CN4 Touch Pad Connector (e) CN6 EC Debug Port Connector (reserved) (f) CN7 System Speaker Connector (g) CN5 PC Card Connector Satellite L10 Maintenance Manual(960-Q01)
Board Layout B.
Board Layout Table B-2 System board ICs and connectors (back) B-4 Mark Number Name (a) CN10 DC Power Jack (b) CN8 S-VIDEO OUT connector (c) CN11 USB Connector (d) CN2 Phone Signal Connector (e) CN9 RJ11 + RJ45 Connector (f) CN13 CRT Connector (g) CN14 System Battery Connector (h) CN15 CPU Fan Connector (i) CN18 USB Connector (j) U18 CPU Socket (k) CN19 USB Connector (l) CN20 External MIC Connector (m) CN21 Headphone Out Connector (n) CN24 Modem Board Connector
Board Layout B.
Board Layout B.
Board Layout (b) (a) Table B-5 Touch pad board connectors Mark Number Name (a) CN1 Lift key (b) CN2 Right key Satellite L10 Maintenance Manual(960-Q01) B-7
Appendix C Appendix C Pin Assignment System Board C.1 CN9 RJ11+RJ45 Connector (18-PIN) Table C-11 RJ11+RJ45 connector (18-PIN) PIN No. C.2 Signal name I/O PIN No. Signal name I/O 1 100MBPS# O 2 N.C. - 3 RJ45_MX3- I 4 RJ45_MX3+ I 5 RJ45_MX1- I 6 RJ45_MX2- O 7 RJ45_MX2+ O 8 RJ45_MX1+ I 9 RJ45_MX0- O 10 RJ45_MX0+ O 11 N.C.
Pin Assignment C.3 CN1 LED Board Connector (14-PIN) Table C-3 LED Board connector (14-PIN) PIN No. C-2 Signal name I/O PIN No. Signal name I/O 1 GND - 2 GND - 3 GND - 4 GND - 5 BT4# I 6 NBSWON# I 7 BT3# I 8 NUMLED O 9 BT2# I 10 CAPSLED O 11 BT1# I 12 IDE_LED O 13 N.C.
Pin Assignment C.4 CN2 LCD I/F Connector (40-PIN) Table C-43 LCD I/F connector (40-PIN) PIN No. Signal name I/O PIN No.
Pin Assignment C.5 CN3 Keyboard I/F Connector (25-PIN) Table C-5 Keyboard I/F connector (25-PIN) PIN No. C.6 Signal name I/O PIN No. Signal name I/O 1 MX7 O 2 MX6 O 3 MX5 O 4 MY0 O 5 MY1 O 6 MY2 O 7 MX4 O 8 MY3 O 9 MY4 O 10 MY5 O 11 MY6 O 12 MY7 O 13 MY8 O 14 MX3 O 15 MY9 O 16 MX2 O 17 MX1 O 18 MY10 O 19 MY11 O 20 MX0 O 21 MY12 O 22 MY13 O 23 MY14 O 24 MY15 O 25 N.C.
Pin Assignment C.7 CN5 PC Card I/F Connector (68-PIN) Table C-7 PC Card I/F connector (68-PIN) (1/2) PIN No. Signal name I/O PIN No.
Pin Assignment Table C-7 PC card I/F connector (68-PIN) (2/2) PIN No. C.8 Signal name I/O PIN No. Signal name I/O 61 A_CC/BE3# I/O 62 A_CAUDIO O 63 A_CSTSCHG I/O 64 A_CAD28 I/O - 65 A_CAD30 I/O 66 A_CAD31 I/O - 67 A_CCD2# I/O 68 GND - CN23 RTC Battery Connector (2-PIN) Table C-8 RTC battery connector (2-PIN) PIN No. 1 C.9 Signal name 3VRTC I/O PIN No. O 2 Signal name GND I/O - CN7 System Speaker Connector (4-PIN) Table C-9 System Speaker connector (4-PIN) PIN No.
Pin Assignment C.11 CN10 DC IN Connector (4-PIN) Table C-4 DC IN connector (4-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 VA I 2 GND - 3 GND - 4 GND - C.12 CN11 USB I/F Connector (4-PIN) Table C-5 USB I/F connector (4-PIN) PIN No. Signal name 1 USB5POWER 3 BUSBP3+ I/O PIN No. Signal name - 2 BUSBP3- I/O 4 GND I/O I/O - C.13 CN13 CRT I/F Connector (15-PIN) Table C-13 CRT I/F connector (15-PIN) PIN No. Signal name I/O PIN No.
Pin Assignment C.14 CN14 System Battery Connector (5-PIN) Table C-64 USB I/F connector (4-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 GND - 2 MBDATA I/O 3 MBCLK O 4 TEMP_MBAT O 5 MBAT+ - C.15 CN15 CPU Fan Connector (3-PIN) Table C-75 CPU FAN connector (3-PIN) PIN No. C-8 Signal name I/O PIN No.
Pin Assignment C.16 CN16 HDD I/F Connector (44-PIN) Table C-16 HDD I/F connector (44-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 N.C. - 2 GND - 3 +5V - 4 +5V - 5 GND - 6 HDLED# O 7 PDCS3# I 8 PDCS1# I 9 PDA2 I 10 PDA0 I 11 PDIAG I 12 PDA1 I 13 N.C. - 14 IRQ14 I 15 GND - 16 PDDACK# I 17 PSEL I 18 PHDRDY I 19 GND - 20 PDIOR# I 21 GND - 22 PDIOW# I 23 GND - 24 PDDREQ I 25 N.C.
Pin Assignment C.18 J1 Memory Connector 0 (200-PIN) Table C-18 Memory connector 0 (200-PIN) (1/3) PIN No. C-10 Signal name I/O PIN No.
Pin Assignment Table C-18 Memory connector 0 (200-PIN) (2/3) PIN No. Signal name I/O PIN No. Signal name I/O I/O 64 MDQ16 I/O - 66 GND I/O 68 M_DQS#2 I/O I/O 63 MDQ21 65 GND 67 M_DM2 69 NC - 70 M_DQS2 71 GND - 72 GND 73 MDQ18 I/O 74 MDQ19 I/O 75 MDQ23 I/O 76 MDQ22 I/O 77 GND - 78 GND 79 M_CKE0 I 80 M_CKE1 81 +1.8VSUS - 82 +1.8VSUS - 83 N.C. - 84 N.C - 85 MA17 I 86 MA14 I 87 +1.8VSUS - 88 +1.
Pin Assignment Table C-18 Memory connector 0 (200-PIN) (3/3) PIN No. C-12 Signal name I/O PIN No.
Pin Assignment C.19 J2 Memory connector 1 (200-PIN) Table C-19 Memory connector 1 (200-PIN) (1/3) PIN No. Signal name I/O PIN No.
Pin Assignment Table C-19 Memory connector 1 (200-PIN) (2/3) PIN No. C-14 Signal name I/O PIN No. Signal name I/O I/O 64 MDQ16 I/O - 66 GND I/O 68 M_DQS#2 I/O I/O 63 MDQ21 65 GND 67 M_DM2 69 NC - 70 M_DQS2 71 GND - 72 GND 73 MDQ18 I/O 74 MDQ19 I/O 75 MDQ23 I/O 76 MDQ22 I/O 77 GND - 78 GND 79 M_CKE0 I 80 M_CKE1 81 +1.8VSUS - 82 +1.8VSUS - 83 N.C. - 84 N.C - 85 MA17 I 86 MA14 I 87 +1.8VSUS - 88 +1.
Pin Assignment able C-19 Memory connector 1 (200-PIN) (3/3) PIN No. Signal name I/O PIN No.
Pin Assignment C.20 CN19 USB I/F connector (4-PIN) Table C-20 USB I/F connector (4-PIN) PIN No. Signal name I/O PIN No. Signal name 1 USB2POWER I 2 BUSBP0- 3 BUSBP0+ I/O 4 GND I/O I/O - C.21 CN20 External MIC Connector (8-PIN) Table C-21 External MIC connector (8-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 AUDGND - 2 SYS_MIC_1 I 3 MBIAS O 4 AUDGND - 5 AUDGND - 6 N.C. - 7 AUDGND - 8 AUDGND - C.
Pin Assignment C.23 CN22 ODD I/F Connector (50-PIN) Table C-23 ODD I/F connector (50-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 N.C. - 2 N.C. - 3 N.C.
Pin Assignment C.24 CN24 Modem Board connector (10-PIN) Table C-24 Modem Board connector (10-PIN) PIN No. C-18 Signal name I/O PIN No. Signal name I/O 1 PWRCLKN1 O 2 GND - 3 PWRCLKP1 O 4 GND - 5 N.C.
Pin Assignment C.25 CN25 MINI-PCI connector (124-PIN) Table C-25 MINI-PCI connector (124-PIN) (1/2) PIN No. Signal name I/O PIN No. Signal name I/O 1 N.C. - 2 N.C. - 3 N.C. - 4 N.C. - 5 N.C. - 6 N.C. - 7 N.C. - 8 N.C. - 9 N.C. - 10 N.C. - 11 N.C. - 12 N.C. - 13 RF_EN I 14 N.C. - 15 N.C. - 16 N.C. - 17 INTC# I 18 +5V - 19 +3V - 20 INTB# O 21 N.C. - 22 N.C.
Pin Assignment Table C-25 MINI-PCI connector (124-PIN) (2/2) PIN No. C-20 Signal name I/O PIN No.
Pin Assignment LED Board C.26 CN1 LED Board connector (14-PIN) Table C-26 LED Board connector (14-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 GND - 2 GND - 3 GND - 4 GND - 5 BT4# I 6 NBSWON# I 7 BT3# I 8 NUMLED O 9 BT2# I 10 CAPSLED O 11 BT1# I 12 IDE_LED O 13 N.C. - 14 N.C.
Pin Assignment Modem Board C.27 CN1 Modem Signal connector (10-PIN) Table C-27 Modem Signal connector (10-PIN) PIN No. Signal name I/O PIN No. Signal name I/O 1 PWRCLKN O 2 GND - 3 PWRCLKP O 4 GND - 5 N.C. - 6 GND - 7 DIB_DATAP I/O 8 GND - 9 DIB_DATAN I/O 10 GND - C.28 MJ2 Phone Signal connector (2-PIN) Table C-28 Phone Signal connector (2-PIN) PIN No. 1 C-22 Signal name RING_1 I/O PIN No.
Appendix. D Appendix D Display Codes D.1 Display Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap No.
Display codes Table D-1 Scan codes (set 1 and set 2) (2/4) D-2 Cap No.
Display codes Table D-1 Scan codes (set 1 and set 2) (3/4) Cap No.
Display codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap No. Keytop Code set 1 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 126 Pause *7 *7 *7 *7 *7 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Make Code set 2 Break Make Note Break Notes: 1. 2. 3. 4. 5. 6. 7. D-4 * * * * * * * Scan codes differ by mode. Scan codes differ by overlay function.
Display codes Table D-2 Scan codes with left Shift key Cap Key Code set 1 No.
Display codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
Display codes Table D-5 Scan codes in overlay mode Cap No. Code set 1 Keytop Code set 2 Make Break Make Break 09 8 (8) 48 C8 75 F0 75 10 9 (9) 49 C9 7D F0 7D 11 0 (*) 37 B7 7C F0 7C 23 U (4) 4B CB 6B F0 6B 24 I (5) 4C CC 73 F0 73 25 O (6) 4D CD 74 F0 74 26 P (–) 4A CA 7B F0 7B 37 J (1) 4F CF 69 F0 69 38 K (2) 50 D0 72 F0 72 39 L (3) 51 D1 7A F0 7A 40 ; (+) 4E CE 79 F0 79 52 M (0) 52 D2 70 F0 70 54 . (.
Display codes Table D-7 No.126 key scan code Key top Pause Shift Code set 1 Code set 2 Make Make Common* E1 1D 45 E1 Ctrl* E0 C6 E0 46 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E 14 F0 77 *: This key generates only make codes.
Appendix E Key Layout Appendix E E.1 Keyboard Layout United States (US) Keyboard Figure E-1 US Keyboard layout E.
Keyboard Layout E.3 Arabia (AR) Keyboard Figure E-3 AR Keyboard layout E.
Keyboard Layout E.5 Appendices Czech (CZ) Keyboard FigureE-5 CZ Keyboard layout E.
Keyboard Layout E.7 Danish (DK) Keyboard Figure E-7 DK Keyboard layout E.
Keyboard Layout E.9 Appendices French (FR) Keyboard Figure E-9 FR Keyboard layout E.
Keyboard Layout E.11 Italian (IT) Keyboard Figure E-11 IT Keyboard layout E.
Keyboard Layout E.13 Appendices Norwegian (NO) Keyboard Figure E-13 NO Keyboard layout E.
Keyboard Layout E.15 Traditional Chinese (TC) Keyboard Figure E-15 TC Keyboard layout E.
Keyboard Layout E.17 Appendices Russian (RU) Keyboard Figure E-17 RU Keyboard layout E.
Keyboard Layout E.19 Japanese (JP) Keyboard Figure E-19 JP Keyboard layout E.
Appendix F Appendix F F.1 Wiring Diagrams RGB Monitor ID Wraparound connector (1) RED RED (2) GREEN GREEN (2) (3) BLUE BLUE (3) (4) NC NC (4) (5) GND GND (5) (6) GND GND (6) (7) GND GND (7) (8) GND GND (8) (9) 5V 5V (9) (10) GND GND (10) (11) NC NC (11) (12) SDA SDA (12) (13) HSYNC HSYNC (13) (14) VSYNC (15) SDL VSYNC (14) SCL (1) (15) Figure F-1 RGB Monitor ID Wraparound connector (15PIN to 15PIN) F.
Wiring Diagrams F-2 Satellite L20 Maintenance Manua(960-Q01)
Appendix G Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk USB doggle Rewriting the BIOS 1. Set the system to boot mode. 2. Turn off the power to the computer. 3. Remove the external cables and cards. 4. Connect an external FDD and insert the BIOS rewriting disk into the external FDD. 5. Connect the USB doggle special for BIOS rewrite 6.
Appendix H Appendix H EC/KBC Rewrite Procedures Same as BIOS rewrite Procedures, please refer appendix G Satellite L20 Maintenance Manual(960-Q01) H-1
