Toshiba Personal Computer TECRA M1 Maintenance Manual TOSHIBA CORPORATION File Number 960-436
Copyright © 2003 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein. Toshiba Personal Computer TECRA M1 Maintenance Manual First edition February 2003 Disclaimer The information presented in this manual has been reviewed and validated for accuracy.
Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer TECRA M1. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field. SAFETY PRECAUTIONS Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the TECRA M1 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
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Table of Contents Chapter 1 Hardware Overview 1.1 Features.......................................................................................................................1-1 1.2 System Unit Block Diagram..........................................................................................1-9 1.3 3.5-inch Floppy Disk Drive (USB External) ................................................................ 1-16 1.4 2.5-inch Hard Disk Drive ......................................................
2.12 LAN Troubleshooting................................................................................................ 2-49 2.13 Bluetooth Troubleshooting.......................................................................................... 2-50 2.14 Wireless LAN Troubleshooting .................................................................................. 2-54 2.15 Sound Troubleshooting............................................................................................... 2-58 2.
Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test...................................................................................................... 3-1 3.2 Executing the Diagnostic Test ....................................................................................... 3-3 3.3 Subtest Names............................................................................................................. 3-7 3.4 System Test ....................................................................
3.29 x SETUP ......................................................................................................................
Chapter 4 Replacement Procedures 4.1 General........................................................................................................................ 4-1 4.2 Battery Pack ................................................................................................................ 4-9 4.3 Optional PC Card...................................................................................................... 4-12 4.4 Optional SD Card....................................................
Appendices Appendix A Handling the LCD Module .............................................................................. A-1 Appendix B Board Layout...................................................................................................B-1 Appendix C Pin Assignments.............................................................................................. C-1 Appendix D Character Codes.............................................................................................
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Chapter 1 Hardware Overview
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1 Hardware Overview Chapter 1 Contents 1.1 Features ...................................................................................................................... 1-1 1.2 System Unit Block Diagram......................................................................................... 1-9 1.3 3.5-inch Floppy Disk Drive (USB External)................................................................ 1-16 1.4 2.5-inch Hard Disk Drive.............................................................
1 Hardware Overview Figures Figure 1-1 Front of the computer ...................................................................................... 1-7 Figure 1-2 System unit configuration.................................................................................. 1-8 Figure 1-3 System unit block diagram................................................................................ 1-9 Figure 1-4 3.5-inch FDD (USB External)......................................................................
1.1 Features 1 1 Hardware Overview Features 1.1 Features The Toshiba TECRA M1 Personal Computer uses extensive Large Scale Integration (LSI), and Complementary Metal-Oxide Semiconductor (CMOS) technology extensively to provide compact size, minimum weight, low power usage and high reliability. This computer incorporates the following features and benefits: The product configuration is BTO/CTO-compatible so that a system can be designed to suit a specific purpose.
1 Hardware Overview 1.1 Features q Built-in HDD The computer has a 2.5-inch HDD. The following capacities are available. • 30/40/50/60GB q USB FDD A 3.5-inch FDD accommodates 2HD (1.44MB) or 2DD (720KB) disks. The FDD is connected to an external USB port. q Slim Select Bay A CD-ROM, DVD-ROM, CD-RW/DVD-ROM or DVD Multi drive, 2nd HDD or 2nd Battery can be installed in the Slim Select Bay. In addition, a second HDD may be purchased as an option for use in the system.
1.1 Features 1 Hardware Overview q Display The display comes in the following three types: • 14.1” XGA-TFT color display, resolution 1,024×768, 16M colors • 14.1” SXGA+-TFT color display, resolution 1,400×1,050, 16M colors In addition, a video controller and an 32/64MB VRAM enables an external monitor to display 16M colors at a resolution of 1,024×768 pixels or 256 colors at a resolution of 1,400×1,050 pixels.
1 Hardware Overview 1.1 Features q External monitor port The port enables connection of an external monitor, which is recognized automatically by Video Electronics Standards Association (VESA) Display Data Channel (DDC) 2B compatible functions. q PS/2 mouse/keyboard port Either a PS/2 compatible keyboard or a PS/2 compatible mouse can be connected to the port. q PC card slot The PC card slot (PCMCIA) accommodates two 5mm Type II card or one Type III card.
1.1 Features 1 Hardware Overview q Infrared port The infrared port is compatible with Fast InfraRed (FIR) standards enabling cableless 4 Mbps, 1.152 Mbps, 115.2 kbps, 57.6 kbps, 38.4 kbps, 19.2 kbps or 9.6 kbps data transfer with Infrared Data Association (IrDA) 1.1 compatible external devices.
1 Hardware Overview 1.1 Features q Bluetooth (BTO) The computer is equipped with Bluetooth (V1.1) communications standards enable wireless connection between electronic devices such as computers and printers. q Mini PCI Card slot (1 slot, BTO) In some models built to order (BTO), a Mini PCI Card with wireless LAN functions is available.
1.1 Features 1 Hardware Overview The front of the computer is shown in figure 1-1.
1 Hardware Overview 1.1 Features The system unit configuration is shown in figure 1-2.
1.2 System Unit Block Diagram 1.2 1 Hardware Overview System Unit Block Diagram Figure 1-3 is a block diagram of the system unit. 1.3/1.4/1.5 /1.6GHz HDD 9.
1 Hardware Overview 1.2 System Unit Block Diagram The system unit is composed of the following major components: q Processor 1-10 • Intel Banias Processor 1.30GHz – Processor core speed: 1.30GHz (Performance Mode at 1.35V) and 1.20GHz (Battery Optimized Mode at 0.
1.2 System Unit Block Diagram 1 Hardware Overview – Integrated L2 cache memory: 1MB ECC protected cache data array, 8-way set associative – Integrated NDP q Memory Two BTO-compatible expansion memory slots are provided. Expansion up to 2GB (2,048MB) is available.
1 Hardware Overview – – – – – – 1.2 System Unit Block Diagram Deeper Sleep (C4) Support Suspend/Resume Control AC'97 2.2 Interface Internal RTC Internal LAN Controller (WfM2.0) 421-ball 31×31mm BGA Package q PC Card Controller Gate Array • • One YEBISU3S gate array is used. This gate array has the following functions and components. – PCI interface (PCI Revision2.2) – CardBus/PC Card controller (Yenta2 Version2.2) – SD memory card controller (SDHC Ver.1.2) – SD IO card controller (Ver.1.
1.2 System Unit Block Diagram 1 Hardware Overview – 32KB are reserved.
1 Hardware Overview 1.2 System Unit Block Diagram q VGA Controller One Trident XP4-MCM chip is used. The video controller incorporates graphics accelerator, video accelerator. • Internal VRAM, 32MB DDR 250MHz (64MB is also supported.) • Connected to AGP bus R2.
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1 Hardware Overview 1.2 System Unit Block Diagram q PSC (Power Supply Controller) • • One TMP87PM48U chip is used. This controller controls the power sources. q RS232 Driver • • One MAXIM3243 chip is used. This driver converts signals for interface with external equipment. q Clock Generator • • One ICS950810AG-T is used. This device generates the system clock. q Modem Controller • • 1-16 One built-in modem card with Xircom Lucent SCORPIO+CSP1037B is used.
1.2 System Unit Block Diagram 1 Hardware Overview q Internal LAN Controller • • • One MAC incorporated with ICH4-M and PHY (Kinnereth-R 182562EP or Kenai32N) are used for the internal chip, and are connected with RJ11/RJ45 combo connector. This controller has the following functions: Full Duplex support at 10 Mbps/100 Mbps – WOL support – Magic Packet Support q Wireless LAN • One Mini PCI card for LAN with TI card bus controller, TI 1410 is used. q Super I/O • • One LPC 47N227 chip is used.
1 Hardware Overview 1.3 1.3 3.5-inch Floppy Disk Drive (USB External) 3.5-inch Floppy Disk Drive (USB External) The 3.5-inch FDD is a thin, high-performance reliable drive that supports 720KB (formatted) 2DD, 1.2MB (formatted) and 1.44MB (formatted) 2HD disks. The FDD is shown in figure 1-4. The specifications for the FDD are listed in Table 1-1. Figure 1-4 3.5-inch FDD (USB External) Table 1-1 3.
1.4 2.5-inch Hard Disk Drive 1.4 1 Hardware Overview 2.5-inch Hard Disk Drive The removable HDD is a random access non-volatile storage device. It has a non-removable 2.5inch magnetic disk and mini-Winchester type magnetic heads. The computer supports a 30GB, 40GB, 50GB and 60GB HDD. The HDD is shown in figure 1-5. Specifications are listed in Table 1-2. Figure 1-5 2.5-inch HDD Table 1-2 2.
1 Hardware Overview 1.4 2.5-inch Hard Disk Drive Table 1-2 2.5-inch HDD specifications (2/3) Specifications Items HITACHI G8BC0000F310 HITACHI G8BC00009110 Storage size (formatted) 30GB 40GB Speed (RPM) 4,200 5,400 22.1 – 42.8 27.8 – 44.1 Data transfer speed (Mbits/s) Interface transfer rate (MB/s) 100 (MAX Ultra DMA mode) Storage desnity (Kbpi) 716 612 Track density (Ktpi) 70.0 63.0 Average random seek time (read) (ms) 13 Motor startup time (ms) 5 Table 1-2 2.
1.5 CD-ROM Drive 1.5 1 Hardware Overview CD-ROM Drive The CD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CDs. They provide high-performance, twenty-four-speed plays on a maximum (reads 3,600 KB per second). The CD-ROM drive is shown in figure 1-6. Specifications are listed in Table 1-3. Figure 1-6 CD-ROM drive Table 1-3 CD-ROM drive specifications TEAC specifications (G8CC00005410) 24 x mode (Max.) Item ATAPI Burst (Mbytes/s) 33.
1 Hardware Overview 1.6 1.6 DVD-ROM Drive DVD-ROM Drive The DVD-ROM drive accommodates either 12cm (4.72-inch) or 8cm (3.15-inch) DVDs. This drive plays DVDs at maximum 8-speed and reads CDs at maximum 24-speed. The DVD-ROM drive is shown in figure 1-7. Specifications for the DVD-ROM drive are described in table 1-4. Figure 1-7 DVD-ROM drive Table 1-4 DVD-ROM drive specifications (1/2) HITACHI ZA2441P03 Item DVD-ROM mode ATAPI Burst (Mbytes/s) Access time (ms) (Typ.
1.6 DVD-ROM Drive 1 Hardware Overview Table 1-4 DVD-ROM drive specifications (2/2) HITACHI G8CC00015410 Item DVD-ROM mode ATAPI Burst (Mbytes/s) 33.3 (U-DMA Transfer mode 2) Access time (ms) Average Random Access 110 (Typ.) Rotation speed (rpm) 85 (Typ.
1 Hardware Overview 1.7 1.7 CD-RW/DVD-ROM Drive CD-RW/DVD-ROM Drive The CD-RW/DVD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CDs, CD-R/RW and DVDs. It is a high-performance drive that reads CD-R at maximum 24-speed and reads DVD-ROM at maximum 8-speed. The CD-RW/DVD-ROM drive is shown in figure 1-8. Specifications are listed in Table 1-5.
1.7 CD-RW/DVD-ROM Drive 1 Hardware Overview Table 1-5 CD-RW/DVD-ROM drive specifications (2/3) Specifications Item Panasonic G8CC00010410 ATAPI Burst (Mbytes/s) Average access time (msec.) 16.6 (PIO Mode 4, DMA Mode 2) 33.3 (Ultra DMA Mode2) CD-ROM 130 DVD-ROM 180 Data Buffer Capacity 2MB Supported Formats CD: CD-DA, CD-ROM, CD-ROM XA, CD-R, CD-RW Photo CD, Video CD, CD-EXTRA (CD+), CD-TEXT DVD: DVD-Video, DVD-ROM, DVD-R (3.9GB, 4.7GB), DVD-RW, DVD-RAM (4.
1 Hardware Overview 1.8 1.8 DVD Multi Drive DVD Multi Drive The DVD Multi drive is capable of driving either 12cm (4.72-inch) or 8cm (3.15-inch) DVD and CD without using an adaptor. This drive plays DVDs at maximum 8-speed, reads CDs at maximum 24-speed, writes CD-R at maximum 8-speed, and writes CD-RW at maximum 4-speed. The DVD Multi drive is shown in figure 1-9. Specifications are listed in Table 1-6.
1.8 DVD Multi Drive 1 Hardware Overview Table 1-6 DVD Multi drive specifications (2/2) TEAC Item DVD-ROM mode ATAPI Burst (Mbytes/s) 33.3 (Ultra DMA mode 0 to 2) 16.
1 Hardware Overview 1.9 1.9 Keyboard Keyboard The keyboard is mounted 85(US)/86(UK) keys that consist of character key and control key, and in conformity with JIS. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-10 is a view of the keyboard. See Appendix E about a layout of the keyboard.
1.10 TFT Color Display 1 Hardware Overview 1.10 TFT Color Display The TFT color display consists of 14.1-inch XGA/SXGA+ LCD module and FL inverter board. 1.10.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 262,144 colors with 1,024 x 768 or 1,400 x 1,050 resolution. The Trident XP4MCM can control both internal and external XGA- or SXGA+- support displays simultaneously.
1 Hardware Overview 1.10 TFT Color Display Table 1-7 LCD module specifications (2/2) Specifications Item 14.1-inch SXGA+ TFT (VF2074P01) Number of Dots 1,400 (W) x 1,050 (H) Dot spacing (mm) 0.204 (H) x 0.204 (V) Display range (mm) 285.6 (H) x 214.2 (V) 1.10.2 FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module FL. Table 18 lists the FL inverter board specifications.
1.11 Power Supply 1 Hardware Overview 1.11 Power Supply The power supply supplies many different voltages to the system board and performs the following functions: 1. Checks power input to determine: • • Whether the AC adaptor is connected to the computer Whether the battery pack is installed and supplying power 2.
1 Hardware Overview 1.11 Power Supply Table 1-9 Power supply output rating Device Name DC Volta ge (V) Power supplied Yes/No Power off Suspen d Power off Boot mode No battery *1) PPV 0.748-1.468 No No No 1R2-P1V 1.2 No No No CPU, MCH-M, ICH4-M PTV 1.05 No No No LAN Cont (82540EP) LAN-E2V 2.5 Yes No No MCH-M, DDR MEM 2R5-B2V 2.5 Yes No No VGA (XP4) 2R5-P2V 2.5 No No No MCH-M, DDR MEM 1R25-B1V 1.25 Yes No No ICH4-M, 82540EP LAN-E3V 3.
1.11 Power Supply ICH4-M ICH4-M (RTC) 1 Hardware Overview 1R5-S1V 1.5 Yes Yes No R3V 3.3 Yes Yes Yes *1) Both Main battery and Sub Battery are empty, and only RTC Battery is charged. *2) CD-ROM or DVD-ROM drive Unit is attached.
1 Hardware Overview 1.12 Batteries 1.12 Batteries The computer has three types of batteries as follows: q Main battery pack q RTC battery q Secondary battery pack (Optional Slim Select Bay Module) The battery specifications are listed in Table 1-10. Table 1-10 Battery specifications Battery name Main battery 9 cell Material Output voltage Lithium-Ion 10.8 V 6 cell Capacity 6,600 mAh 4,400 mAh RTC battery Lithium-Ion 2.4 V 30 mAh Secondary battery pack Lithium-Ion 10.
1.12 Batteries 1.12.2 1 Hardware Overview Battery Charging Control Battery charging is controlled by a power supply microprocessor. The microprocessor controls whether the charge is on or off and detects a full charge when the AC adaptor and battery are attached to the computer. The system charges the battery using quick charge.
1 Hardware Overview 1.12.3 1.12 Batteries RTC battery The RTC battery provides power to keep the current date, time and other setup information in memory while the computer is turned off. Table 1-12 lists the charging time and data preservation period of the RTC battery.
Chapter 2 Troubleshooting Procedures
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2 Troubleshooting Procedures Chapter 2 Contents 2.1 Troubleshooting........................................................................................................... 2-1 2.2 Troubleshooting Flowchart........................................................................................... 2-2 2.3 Power Supply Troubleshooting..................................................................................... 2-6 2.4 2.5 2.6 2.7 2.8 Procedure 1 Icons in the LCD Check.................
2 Troubleshooting Procedures 2.9 2.10 2.11 2.12 Procedure 2 Connector and Cable Check ....................................................... 2-41 Procedure 3 Replacement Check .................................................................... 2-42 CD-ROM Drive Troubleshooting............................................................................... 2-43 Procedure 1 Diagnostic Test Program Execution Check...................................
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2 Troubleshooting Procedures Figures Figure 2-1 Troubleshooting flowchart..................................................................................... 2-3 Figure 2-2 Printer port LED................................................................................................. 2-19 Figure 2-3 Antenna Test cable ............................................................................................. 2-52 Figure 2-4 Antenna Test cable ...........................................................
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2.1 Troubleshooting 2 Troubleshooting Procedures 2 2.1 Troubleshooting Chapter 2 describes how to determine if a Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. The FRUs covered are: 1. 2. 3. 4. 5. System Board Floppy Disk Drive Hard Disk Drive Keyboard Display 6. CD-ROM Drive 7. DVD-ROM, CD-RW/DVD-ROM and DVD Multi Drive 8. Modem 9. 10. 11. 12. 13.
2 Troubleshooting Procedures 2.2 2.2 Troubleshooting Flowchart Troubleshooting Flowchart Use the flowchart in figure 2-1 as a guide for determining which troubleshooting procedures to execute. Before going through the flowchart steps, verify the following: q Ask the user if a password is registered and, if it is, ask him or her to enter the password.
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2 Troubleshooting Procedures 2.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures If the diagnostics program cannot detect an error, the problem may be intermittent. The Running Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error, then perform the appropriate troubleshooting procedures as follows: 1.
2 Troubleshooting Procedures 2.3 2.3 Power Supply Troubleshooting Power Supply Troubleshooting The power supply controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2.3 Power Supply Troubleshooting Procedure 2 2 Troubleshooting Procedures Error Code Check If the power supply microprocessor detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Error code 1*h Where Error occurs Adaptor AC Adaptor is not connected. (AC Adaptor, DS) Error code begins with : 0x10 Error code ends with 2*h The 1st battery : 0x1F The 1st Battery is not connected.
2 Troubleshooting Procedures Check 1 2.3 Power Supply Troubleshooting Compare the patterns in the hexadecimal error code to the tables below. q DC IN Error code Meaning 10h AC Adaptor output voltage is over 16.5V. 11h Common Dock voltage is over 16.5V. 12h Current from the DC power supply is over 6.05A. 13h Current from the DC power supply is over 0.5A when there is no load. 14h Current sensing IC is not normal.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures q S3V output Error code Meaning 40h S3V voltage is 3.14V or less when the computer is powered on/off. 45h S3V voltage is 3.14V or less when the computer is booting up. (CV support) q 1R5-C1V output Error code Meaning 50h 1R5-C1V voltage is over 1. 80V. 51h 1R5-C1V voltage is 1.275V or less when the computer is powered on. 52h 1R5-C1V voltage is 1.275V or less when the computer is booting up. 53h 1R5-C1V voltage is 1.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting q PGV output Error code Meaning 80h PGV voltage is over 1.92V when the computer is powered on/off. 81h PGV voltage is 0.68V or less when the computer is powered on. 82h PGV voltage is 0.68V or less when the computer is booting up. 83h PGV voltage is 0.68V or more when the computer is powered off. 84h PGV voltage is 0.68V or less when the computer is suspended. q E5V output Error code Meaning 90h E5V voltage is over 6.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures q PTV output Error code Meaning C0h PTV voltage is over 1.26V when the computer is powered on/off. C1h PTV voltage is 0.89V or less when the computer is powered on. C2h PTV voltage is 0.89V or less when the computer is booting up. C3h PTV voltage is 0.89V or more when the computer is powered off. C4h PTV voltage is 0.89V or less when the computer is suspended. q 1R25-P1V output Error code Meaning D0h 1R25-P1V voltage is over 1.
2 Troubleshooting Procedures Check 3 2.3 Power Supply Troubleshooting In the case of error code 2Xh: q Make sure the battery pack is correctly installed in the computer. If the battery pack is correctly installed, go to the following step: q Replace the battery pack with a new one. If the error still exists, go to Procedure 5. Check 4 2-12 For any other error, go to Procedure 5.
2.3 Power Supply Troubleshooting Procedure 3 2 Troubleshooting Procedures Connection Check The power supply wiring diagram is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Disconnect the AC power cord from the wall outlet. Check the power cable for breaks. If the power cord is damaged, connect a new AC power cord. If there is no damage, go to Check 2.
2 Troubleshooting Procedures Procedure 4 2.3 Power Supply Troubleshooting Charge Check The power supply may not charge the battery pack. Perform the following procedures: 1. Reinstall the battery pack. 2. Attach the AC adaptor and turn on the power. If you cannot turn on the power, go to Procedure 5. 3. Run the Diagnostic test, go to System test and execute subtest 06 (Quick charge) described in Chapter 3. 4. When charge is complete, the diagnostics test displays the result code.
2.3 Power Supply Troubleshooting Procedure 5 2 Troubleshooting Procedures Replacement Check The system board processor module may be disconnected or damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures. Check the connection between the AC adaptor and system board and connection. After checking the connections, perform the following Check 1: Check 1 Replace the AC adaptor with a new one. If the AC adaptor is still not functioning properly, perform Check 2.
2 Troubleshooting Procedures 2.4 2.5 FDD TroubleshootingSystem Board Troubleshooting System Board Troubleshooting This section describes how to determine if the system board and CPU are defective or not functioning properly. Start with Procedure 1 and continue with the other procedures as instructed.
2.4 System Board Troubleshooting Procedure 1 2 Troubleshooting Procedures Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it. q If an error message is shown on the display, perform Check 1. q If there is no error message, go to Procedure 2. q If Toshiba MS-DOS or Windows Me is properly loaded, go to Procedure 3.
2 Troubleshooting Procedures Check 2 2.5 FDD TroubleshootingSystem Board Troubleshooting The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (24) or (25) appears, go to Procedure 5. If the error message (18) appears, go to the Keyboard Troubleshooting Procedures in Section 2.7. If the error message (19) or (20) appears, go to the HDD Troubleshooting Procedures in Section 2.6.
2.4 System Board Troubleshooting Procedure 2 2 Troubleshooting Procedures Printer Port LED Check on Boot Mode The printer port LED displays the IRT (Initial Reliability Test) status and test status by turning lights on and off as an eight-digit binary value for boot mode. Figure 2-2 shows the printer port LED. Figure 2-2 Printer port LED To use the printer port LED, follow the steps below: 1. Plug the printer port LED into the parallel port of the Advanced Port Replicator 2001. 2.
2 Troubleshooting Procedures 2.5 FDD TroubleshootingSystem Board Troubleshooting Table 2-3 Printer port LED boot mode status (1/8) LED Status FFh Test item Start Message Register initialization for boot block Clearance of software reset bit Permission of A20 line Initialization for special register and Intel chip set B0H Flash ROM check PIT CH0 initialization (for HOLD_ON) BIOS rewrite flag initialization Checksum check Transition to protected mode Boot block checksum (HLT when check error occurred.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 Printer port LED boot mode status (2/8) LED Status B5H Test item Message Storing key scan code Setting of TASK_1ms_TSC Display initialization B6H FAN control Sound controller initialization (for beep) Enabling system speaker Disabling mute Setting volume to max Message display CEC/KBC UPDATE/DAMAGED, BIOS UPDATE/DAMAGED Key input Disabling USB Sound beep Waiting for key input Reading CHGBIOSA.EXE/CHGFIRMA.
2 Troubleshooting Procedures 2.5 FDD TroubleshootingSystem Board Troubleshooting Table 2-3 Printer port LED boot mode status (3/8) LED Status (02H) Test item Message Initialization of CMOS data (1) Setting of IRT status (Boot status and IRT busy flag, the remaining bit is 0.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 Printer port LED boot mode status (4/8) LED Status (05H) Test item (Initialization of a device which needs initialization before initialization of PCI bus) Message Test of PIT CH2 (Check whether the speaker gate is working properly.
2 Troubleshooting Procedures 2.
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2 Troubleshooting Procedures Procedure 3 2.5 FDD TroubleshootingSystem Board Troubleshooting Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. Refer to Chapter 3, Tests and Diagnostics, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test 6. Hard Disk test 7. Real Timer test 8. NDP test 9. Expansion test 10. Sound/Modem test 11. CD-ROM/DVD-ROM test 12. Bluetooth test 13.
2.4 System Board Troubleshooting Procedure 4 2 Troubleshooting Procedures Replacement Check The system board connectors may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform Check 1. Check 1 Visually check for the following: a) Cracked or broken connector housing b) Damaged connector pins If their connectors are in good condition, but there is still a problem, go to Check 2. Check 2 The system board may be damaged.
2 Troubleshooting Procedures 2.5 2.5 FDD TroubleshootingFDD Troubleshooting FDD Troubleshooting This section describes how to determine if the FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.5 FDD Troubleshooting Procedure 2 2 Troubleshooting Procedures Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Floppy disk drive test error codes and their status names are listed in Table 2-3. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled.
2 Troubleshooting Procedures Procedure 3 2.5 FDD Troubleshooting Connector Check and Replacement Check The USB 3.5- inch FDD is connected to the System Board. Check 1 When using the USB port 0 or 1, make sure the USB FDD cable is firmly connected to PJ2033 or PJ2034 on the system board. When using the USB port 2, make sure the USB FDD cable is connected to PJ3301, and the USB cable is firmly connected to PJ1004 on the system board and PJ3300 on the USB board.
2.6 HDD Troubleshooting 2 Troubleshooting Procedures 2 2.6 HDD Troubleshooting This section describes how to determine if the HDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.6 HDD Troubleshooting Partition Check Insert the Toshiba MS-DOS system disk and restart the computer with U key holding down. Perform the following checks: Check 1 Type C: and press Enter. If you cannot change to drive C, go to Check 2. If you can change to drive C, go to Check 3. Check 2 Type FDISK and press Enter. Choose Display Partition Information from the FDISK menu. If drive C is listed, go to Check 3.
2.6 HDD Troubleshooting Procedure 3 2 Troubleshooting Procedures Format Check The computer’s HDD is formatted using the low level format program and the MS-DOS FORMAT program. To format the HDD, start with Check 1 below and perform the other steps as required. Check 1 Format the HDD and transfer system files using FORMAT C:/S/U. If the following message appears on the display, the HDD is formatted.
2 Troubleshooting Procedures Procedure 4 2.6 HDD Troubleshooting Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. Replace the HDD with a new one following the instructions in Chapter 4, Replacement Procedures.
2.6 HDD Troubleshooting Procedure 5 2 Troubleshooting Procedures Connector Check and Replacement Check The HDD may be disconnected, or the HDD or the system board may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: Check 1 Make sure the HDD is firmly connected to PJ1509 on the system board. If any of the connections are loose, reconnect firmly and repeat Procedure 1. If there is still an error, go to Check 2.
2 Troubleshooting Procedures 2.7 2.7 Keyboard and Touch pad Troubleshooting Keyboard and Touch pad Troubleshooting To determine if the computer’s keyboard or touch pad is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test in the Diagnostic Program.
2.7 Keyboard and Touch pad Troubleshooting Procedure 2 2 Troubleshooting Procedures Connector and Replacement Check The keyboard, touch pad or sensor/switch board may be disconnected or damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: 1. If the keyboard or AccuPoint malfunctions, start with Check 1. 2. If the touch pad malfunctions, start with Check 3. 3.
2 Troubleshooting Procedures 2.7 Keyboard and Touch pad Troubleshooting Check 4 The touch pad or the touch pad cable may be damaged. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still exists, perform Check 7. Check 5 Make sure the cable of the Sensor/Switch board is firmly connected to PJ1000 on the system board, and the sensor/switch board cable is connected to PJ3200 on the sensor/switch board.
2.8 Display Troubleshooting 2.8 2 Troubleshooting Procedures Display Troubleshooting This section describes how to determine if the computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Cable Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check The Display Test program is stored on the computer’s Diagnostics disk.
2 Troubleshooting Procedures Procedure 3 2.8 Display Troubleshooting Replacement Check The FL, FL inverter board, LCD module, and system board are connected to display circuits. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: If the FL does not light, perform Check 1. If characters or graphics are not displayed clearly, perform Check 1.
2.9 CD-ROM Drive Troubleshooting 2.9 2 Troubleshooting Procedures CD-ROM Drive Troubleshooting This section describes how to determine if the computer’s internal CD-ROM drive is functioning properly. Perform the steps below starting with Procedure 1 and continue with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.9 CD-ROM Drive Troubleshooting Connector Check and Replacement Check The CD-ROM drive is connected to the system board. The connectors may be disconnected from the system board or may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the CD-ROM drive is firmly connected to PJ1511 on the system board.
2.10 DVD -ROM, CD-RW/DVD -ROM and DVD Multi Drive Troubleshooting 2 Troubleshooting Procedures 2.10 DVD-ROM, CD-RW/DVD-ROM and DVD Multi Drive Troubleshooting This section describes how to determine if the DVD-ROM, CD-RW/DVD-ROM or DVD Multi drive in the Slim Select Bay is functioning properly. Perform the steps below starting with Procedure 1 and continue with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.10 DVD -ROM, CD-RW/DVD-ROM and DVD Multi Drive Troubleshooting Connector Check and Replacement Check The DVD-ROM, CD-RW/DVD-ROM or DVD Multi drive is connected to the system board. The connectors may be disconnected from the system board or may be damaged.
2.11 Modem Troubleshooting 2 Troubleshooting Procedures 2.11 Modem Troubleshooting This section describes how to determine if the computer's modem is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check The Sound/Modem test program is stored in the Diagnostics Disk.
2 Troubleshooting Procedures Procedure 2 2.11 Modem Troubleshooting Connector Check and Replacement Check The Modem is installed as a modem daughter card (MDC). If the modem malfunctions, there may be a bad connection between the MDC and the system board. Or the MDC, system board or their connectors might be damaged.
2.12 LAN Troubleshooting 2 Troubleshooting Procedures 2.12 LAN Troubleshooting This section describes how to determine if the computer's LAN is functioning properly. Perform Procedure 1. Procedure 1: Connector Check and Replacement Check Procedure 1 Connector Check and Replacement Check An RJ45 jack with LAN cable is connected to the system board. If the LAN malfunctions, the system board might be damaged.
2 Troubleshooting Procedures 2.13 Bluetooth Troubleshooting 2.13 Bluetooth Troubleshooting This section describes how to determine if the computer's Bluetooth is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.13 Bluetooth Troubleshooting Procedure 2 2 Troubleshooting Procedures Antennas' Connection Check The Bluetooth function wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless communication switch on the side of the computer is set to “On”. If the switch is set to “Off”, turn it “On”.
2 Troubleshooting Procedures Procedure 3 Check 1 2.13 Bluetooth Troubleshooting Antenna Check Use an antenna test cable to check the antennas' connection. Follow the steps below: 1. Remove the Bluetooth slot cover and lift it off. Refer to Chapter 4, Replacement Procedures, for detailed steps of disassembling. 2. Disconnect the Bluetooth antenna cable connected to the Bluetooth module. 3. Connect the end of the antenna test cable to the multimeter. 4.
2.13 Bluetooth Troubleshooting Procedure 4 2 Troubleshooting Procedures Replacement Check Check 1 The Bluetooth module may be defective or damaged. Replace the Bluetooth module with a new one following the steps in Chapter 4, Replacement Procedures. If the Bluetooth is still not functioning properly, perform Check 2. Check 2 The system board may be defective or damaged. Replace the system board with a new one following the steps in Chapter 4, Replacement Procedures.
2 Troubleshooting Procedures 2.14 Wireless LAN Troubleshooting 2.14 Wireless LAN Troubleshooting This section describes how to determine if the computer's Wireless LAN is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.14 Wireless LAN Troubleshooting Procedure 2 2 Troubleshooting Procedures Antennas' Connection Check The wireless LAN wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless communication switch is “On”. If the switch is “Off”, turn it “On”. If the Bluetooth module is still not functioning properly, perform Check 2.
2 Troubleshooting Procedures Procedure 3 Check 1 2.14 Wireless LAN Troubleshooting Antenna Check Use an antenna test cable to check the antennas' connection. Follow the steps below: 1. Remove the wireless LAN slot cover and lift it off. Refer to Chapter 4, Replacement Procedures, for detailed steps of disassembling. 2. Disconnect the wireless LAN antenna cables connected to the wireless LAN board. 3. Connect the end of the antenna test cable to the multimeter. 4.
2.14 Wireless LAN Troubleshooting Procedure 4 2 Troubleshooting Procedures Replacement Check The wireless LAN board, and the system board are connected to the circuits. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures, for instruc tions on how to disassemble the computer and then perform the following checks: Check 1 The wireless LAN board may be defective or damaged. Replace the board with a new one following the steps in Chapter 4, Replacement Procedures.
2 Troubleshooting Procedures 2.15 Sound Troubleshooting 2.15 Sound Troubleshooting This section describes how to determine if the computer's sound functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.15 Sound Troubleshooting Procedure 2 2 Troubleshooting Procedures Connector Check The sound function wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: If the stereo speakers do not work correctly, perform Check 1. If the headphone do not work correctly, perform Check 2. If the microphone does not work correctly, perform Check 3.
2 Troubleshooting Procedures Procedure 3 2.15 Sound Troubleshooting Replacement Check Check 1 If the stereo speakers do not sound properly, the right or left speaker may be defective or damaged. Replace it with a new one. If the stereo speakers still do not work properly, go to Check 5. Check 2 If the headphone don't sound properly, the headphone jack may be defective or damaged. Replace it with a new one. If the sound function still does not work properly, go to Check 5.
2.16 SD Card Slot Troubleshooting 2 Troubleshooting Procedures 2.16 SD Card Slot Troubleshooting To check if the SD card/Smart Media slot is good or no good, follow the troubleshooting procedures below as instructed. Procedure 1: Check on Windows Procedure 2: Connector/Replacement Check Procedure 1 Check on Windows Insert an SD card into the slot. Check if the installed Windows recognizes automatically the SD card and the data in the SD card can be read.
2 Troubleshooting Procedures 2-62 2.
Chapter 3 Tests and Diagnostics
3 Tests and Diagnostics 3-ii TECRA M1 Maintenance Manual (960 -436)
3 Tests and Diagnostics Chapter 3 Contents 3.1 The Diagnostic Test...................................................................................................... 3-1 3.2 Executing the Diagnostic Test ....................................................................................... 3-3 3.3 Subtest Names............................................................................................................. 3-7 3.4 System Test ........................................................
3 Tests and Diagnostics 3.25.2 3.26 3.27 3.28 3.29 Operations ........................................................................................... 3-67 Running Test.............................................................................................................. 3-69 3.26.1 Function Description............................................................................. 3-69 3.26.2 Operations ........................................................................................
3.1 The Diagnostic Test 3 Tests and Diagnostics 3 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test program to test the functions of the computer’s hardware modules. The Diagnostic Test Program is stored on the Diagnostic Disk. The Diagnostic Test program consists of eight programs that are grouped into the Service Program Module (DIAGNOSTIC TEST MENU). NOTE: To start the diagnostics, follow these steps: 1. Check all cables for loose connections. 2.
3 Tests and Diagnostics q q q q 3.1 The Diagnostic Test WIRELESS LAN (Calexico) TEST SOUND/MODEM TEST IEEE1394 TEST BLUETOOTH TEST You will need the following equipment to perform some of the Diagnostic test programs.
3.2 Executing the Diagnostic Test 3.2 3 Tests and Diagnostics Executing the Diagnostic Test Toshiba MS-DOS is required to run the DIAGNOSTICS TEST PROGRAM. To start the DIAGNOSTIC TEST PROGRAM, follow these steps: 1. Insert the Diagnostics disk in the floppy disk drive and turn on the computer while pressing U. (The Diagnostics Disk contains the MS-DOS boot files.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test 2. To execute the DIAGNOSTIC TEST MENU from the DIAGNOSTICS MENU, set the highlight bar to 1, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA Personal Computer XXXX DIAGNOSTICS Version X.XX (c) Copyright TOSHIBA Corp.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 3. Select the option you want to execute and press Enter. When “1-SYSTEM TEST” is selected, the following message will appear: SYSTEM TEST SUB-TEST : PASS COUNT: WRITE DATA: ADDRESS : XXXXXXX XX XXXXX XX XXXXXX XXXX DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test 5. The following message will appear: ERROR STOP : YES/NO Then, use the left or right arrow keys to move the cursor to the desired option and press Enter. Selecting YES stops the test program when an error is found and displays the operation guide on the right side of the display screen as shown below: ERROR STATUS NAME [[ HALT OPERATION ]] 1: Test end 2: Continue 3: Retry These three selections have the following functions respectively: 1.
3.3 Subtest Names 3.3 3 Tests and Diagnostics Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/3) No. 1 2 3 4 5 6 Test Name SYSTEM MEMORY KEYBOARD DISPLAY FLOPPY DISK PRINTER Subtest No.
3 Tests and Diagnostics 3.3 Subtest Names Table 3-1 Subtest names (2/3) No. 7 8 9 ASYNC HARD DISK REAL TIMER Subtest No.
3.3 Subtest Names 3 Tests and Diagnostics 2 Responder test 3 ID check Table 3-1 Subtest names (3/3) No. - Test Name Bluetooth Subtest No.
3 Tests and Diagnostics 3.4 3.4 System Test System Test To execute the System Test select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM Checksum This subtest executes a checksum test of the BIOS ROM on the System Board. Subtest 04 Fan On/Off This subtest checks CPU fan operation using the on/off command. The following message will appear when this subtest is executed.
3.4 System Test 3 Tests and Diagnostics To exit this subtest and return to the SYSTEM TEST menu, press Enter.
3 Tests and Diagnostics Subtest 08 3.4 System Test DMI write The following messages appear in order. When this subtest is executed. Input each information. (If you do not replace the PCB, the DMI information should not be changed.) 1. “Enter Model Name ? ” is displayed. Input the computer’s model name and press Enter. (e.g. TECRA M1) 2. “Enter Version Number ? ” Input the computer’s version number and press Enter. (e.g. PS245UAAA13) 3.
3.4 System Test Subtest 09 3 Tests and Diagnostics CPU Temperature This subtest measures the CPU temperature to see if the cooling functions of the computer are effectively working. When the subtest starts, the following message appears on the display: CPU TEMP = XX deg C Throttling level = XXXXh The number of the CPU TEMP indicates the CPU temperature at the moment in decimal notation. For example, if the number is 57, the CPU temperature is 57 degrees.
3 Tests and Diagnostics 3.5 3.5 Memory Test Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Conventional memory This subtest writes constant data to conventional memory (0 to 640 KB), then reads the new data and compares the result with the original data. Subtest 02 Protected Mode NOTE: The CONFIG.
3.5 Memory Test Subtest 04 3 Tests and Diagnostics Cache Memory To test the cache memory, a pass-through write-read comparison of ‘5A’ data is run repeatedly to the test area (‘7000’:‘Program’ size to ‘7000’:‘7FFF’ (32 KB)) to check the hit-miss ratio (on/off status) for CPU cache memory. One test takes 3 seconds.
3 Tests and Diagnostics 3.6 3.6 Keyboard Test Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed Key Display NOTE: The Num Lock and the Overlay mode must be off to execute this subtest. When you execute this subtest, the keyboard layout is drawn on the display as shown below.
3.6 Keyboard Test Subtest 03 3 Tests and Diagnostics PS/2 Mouse Connect Check NOTE: To execute the PS/2 mouse connect check, a PS/2 mouse must be connected to the computer before the power is turned on. This subtest checks whether a PS/2 mouse is connected or not. If this test does not detect an error, it returns to the subtest menu. If this test detects an error, the following message appears.
3 Tests and Diagnostics 3.
3.6 Keyboard Test 3 Tests and Diagnostics To check only the USB mouse, follow the procedures below: Connect the USB mouse to the computer’s USB connector. Next, set up the computer’s hardware as follows: PERIPHERAL Internal Pointing Device = Simultaneous USB Legacy Emulation = Enabled Then, perform the Pointing Stick Diagnostic Test and make sure: • • The cursor moves in the direction that you move the USB mouse.
3 Tests and Diagnostics 3.7 3.7 Display Test Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The Display test contains seven subtests that test the display in various modes. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM Read/Write for VGA This subtest writes constant data AAh and 55h and address data to video RAM 8MB.
3.7 Display Test Subtest 04 3 Tests and Diagnostics Gradation & Mode test for VGA This subtest displays gradations for each mode. Execute the test, then press Enter to change the mode. The display below appears on the screen when this subtest is executed. Pressing Enter changes the size of the displayed image. Pressing Enter changes the size of the displayed image.
3 Tests and Diagnostics 3.7 Display Test Pressing Enter changes the size of the displayed image. Pressing Enter changes the size of the displayed image in the following order: Mode 111 Mode 112 Mode 114 Mode 115 Mode 117 640*480 640*480 800*600 800*600 1024*768 64K 16M 64K 16M 64K To exit this subtest and return to the DISPLAY TEST menu, press Ctrl + Break.
3.7 Display Test Subtest 05 3 Tests and Diagnostics All Dot On /Off for LCD This subtest displays an all-white screen (all dots on) for three seconds then an allblack screen (all dots off) for three seconds. Subtest 06 “H” Pattern Display This subtest displays a full screen of “H” patterns.
3 Tests and Diagnostics 3.8 3.8 Floppy Disk Test Floppy Disk Test NOTE: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. Otherwise, the contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter. 1. The following messages will appear. Specify the start track of the floppy disk drive to be tested. Test start track (Enter:0/dd:00-79)? 2.
3.8 Floppy Disk Test Subtest 01 3 Tests and Diagnostics Sequential read This subtest performs a Cyclic Redundancy Check (CRC) that continuously reads all the tracks (track: 0 to 39/0 to 79) on a floppy disk. The start track is specified at the start of the FDD test. Refer to 1. in this section. Subtest 02 Sequential read/write This subtest continuously writes data pattern B5ADADh to all the tracks (track: 0 to 39/0 to 79) on a floppy disk. The data is then read and compared to the original data.
3 Tests and Diagnostics 3.9 3.9 Printer Test Printer Test To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The Printer Test contains three subtests that test the output of the printer connected to the computer. The following messages will appear after selecting the Printer Test from the DIAGNOSTIC TEST MEN U. Answer each of the questions with an appropriate response to execute the test.
3.9 Printer Test Subtest 02 3 Tests and Diagnostics Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wrap around NOTE: To execute this subtest, a printer wraparound connector must be connected to the printer port in the Port Replicator.
3 Tests and Diagnostics 3.10 3.10 Async Test Async Test To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. The Async test contains two subtests that test the asynchronous communication functions. Move the highlight bar to the subtest you want to execute and press Enter.
3.10 Async Test 3 Tests and Diagnostics NOTE: To execute this subtest, two machines must be connected with an RS-232C direct cable. One machine should be set as “send”(subtest 02) and the other set as “receive” (subtest 03). The wiring diagram for the RS-232C direct cable is described in Appendix F. This subtest sends 20h through 7Eh data to the receive side, then receives the sent data and compares it to the original data.
3 Tests and Diagnostics 3.11 3.11 Hard Disk Test Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. The hard disk test contains ten subtests that test the hard disk drive functions. NOTE: To execute the subtest 02,03,04,06,09 or 10, the system requires you to enter password. The contents of the hard disk will be erased when the subtest 02, 03, 04, 06,09, or 10 is executed.
3.11 Hard Disk Test 3 Tests and Diagnostics 5. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest.
3 Tests and Diagnostics Subtest 04 3.11 Hard Disk Test Cross Talk & Peak Shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder.
3.12 Real Timer Test 3.12 3 Tests and Diagnostics Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The real timer test contains three Subtests that test the computer’s real timer functions. Move the highlight bar to the Subtest you want to execute and press Enter. Subtest 01 Real Time A new date and time can be input during this Subtest. To execute the real time subtest follow these steps: 1.
3 Tests and Diagnostics Subtest 03 3.12 Real Timer Test Real Time Carry CAUTION: When you execute this Subtest, the current date and time are erased. This Subtest checks the real time clock increments, making sure the date and time are displayed in the following format: Current date : 12-31-2001 Current time : 23:59:58 PRESS [Enter] KEY TO EXIT TEST Press Enter to exit.
3.13 NDP Test 3.13 3 Tests and Diagnostics NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. The NDP test contains one Subtest that tests the computer’s NDP functions. Subtest 01 NDP This test checks the following functions of the coprocessor: q Control word q Status word q Bus q Addition q Multiplication Press Ctrl + Break to exit.
3.14 Expansion Test 3 Tests and Diagnostics 3 3.14 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. The expansion test contains two subtests. NOTE: To execute this subtest, the PC card wraparound connector is required.
3 Tests and Diagnostics 3.14 Expansion Test For this test, the computer must be in CRT mode. Connect the CRT (an RGB monitor) with the external monitor port.
3.15 CD-ROM/DVD-ROM Test 3 Tests and Diagnostics 3.15 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM test, select 13 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. The CD-ROM/DVD-ROM test contains six Subtests that test the computer’s CD-ROM/DVD-ROM functions. NOTE: Make sure the CD-ROM driver (CDRNEW.COM) is installed and insert the test menu media CD (TOSHIBA CD-ROM TEST DISK (ZA1217P01/P000204190)).
3 Tests and Diagnostics 3.16 Wireless LAN Test (Agere) 3.16 Wireless LAN Test (Agere) This section describes how to perform the wireless LAN transmitting-receiving test with the test program. NOTE: Use another computer (with Agere wireless LAN card) that can communicate by the wireless LAN as a reference machine to perform this test.
3.16 Wireless LAN Test (Agere) Subtest 01 3 Tests and Diagnostics Transmit & Receive test This sub test checks transmit and receive functions. Transmit test Press 1 to select the test and press Enter in the target machine as a responder. The following message will appear: ############################################################### #### Wireless LAN sub system repair test VX.
3 Tests and Diagnostics 3.16 Wireless LAN Test (Agere) When the machine has passed the test, “OK” message will appear in the test machine. Then press Enter in the target machine; the “OK” message will appear also in the target machine. Press Enter to return to the main menu. Receive test In receive test reverse the procedures of the transmit test.
3.16 Wireless LAN Test (Agere) 3 Tests and Diagnostics Press 0 to select the test and press Enter in the target machine. The following message will appear: ############################################################## #### Wireless LAN sub system repair test VX.
3 Tests and Diagnostics Subtest 02 3.16 Wireless LAN Test (Agere) Mac Address test This subtest reads MAC Address. If there is no problem, the “OK” message will appear. Subtest 03 Wireless LAN (WEP64/128) test This subtest reads the WEP of the wireless LAN card installed in the target machine.
3.17 Wireless LAN Test (Atheros) 3 Tests and Diagnostics 3.17 Wireless LAN Test (Atheros) This section describes how to perform the wireless LAN transmitting-receiving test with the test program. NOTE: Use another computer (with Atheros wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform this test. In this test, the following items are tested: * Test PC [Initiator] side (1) SKU (destination code) check (2) Mac Address check (3) Communication test (802.
3 Tests and Diagnostics 3.17 Wireless LAN Test (Atheros) Setting the responder machine NOTE: Release the write-protection of the floppy disk for the test. Insert a floppy disk containing the test program into the FDD for the responder machine and turn on the responder machine. The Wireless LAN test menu will appear. ############################################################### #### Atheros WLAN sub system repair test VX.XX #### ############################################################### * * * 1 ....
3.17 Wireless LAN Test (Atheros) 3 Tests and Diagnostics -------------------------------------------- To proceed the test, press any key. When the tester machine has passed the test, "OK" message will appear in the tester machine. Press Enter to return to the main menu. When the tester machine has not passed the test, "NG" message will appear in the tester machine. Pressing Enter on the screen shows the following message. ************************************************************* * * * 8.
3 Tests and Diagnostics 3.18 Wireless LAN Test (Calexico) 3.18 Wireless LAN Test (Calexico) This section describes how to perform the wireless LAN transmitting-receiving test with the test program. NOTE: Use another computer (with Calexico wireless LAN card) that can communicate by the wireless LAN as a reference machine to perform this test. An access point is also required. In this test, the following items are tested.
3.19 Sound/Modem Test 3 Tests and Diagnostics 3.19 Sound/Modem Test This section describes how to perform the Sound/Modem test with the test program. CAUTION: The system is capable of producing high volume sound. When you use a headphone, be careful to set the volume low and adjust it as necessary. Using a headphone at full volume might damage your ears. Toshiba MS-DOS is required to run the DIAGNOSTICS TEST PROGRAM.
3 Tests and Diagnostics Subtest 01 3.19 Sound/Modem Test Microphoned recording & play This subtest checks the function of the CODEC A/D D/A converter. Both the microphone and headphone terminal can be checked at the same time. Before executing this subtest, connect an external microphone to the computer. If necessary, connect a headphone to the computer to check whether the headphone jack of the computer is working properly. When the subtest is selected, the following message appears. ....
3.19 Sound/Modem Test 3 Tests and Diagnostics To execute a subtest continuously, select the test number and press Enter. To exit the Sound/LAN/Modem test, remove the test program disk from the USB FDD and turn the computer off. Subtest 02 Sin Wave This subtest is executed by the load format of COM file (ADSIN.COM). The program expands sin wave data table to data in 16-64KB, and creates play data (It sounds like continuous beep).
3 Tests and Diagnostics Subtest 04 3.19 Sound/Modem Test Modem Test (a) Select 4 to execute and press Enter. The following message will appear: ICHX MDC Test Program with Modem Sound ( PCB Interface ) Version X.X * Scorpio Modem Initialize :OK * Digital Loopback Test :OK * Modem Sound Test :( Operator’s Check!! ) (b) After a few seconds, the following message will appear: ...Press Key ( Y = OK , N =NG ) If you hear the modem sound from the speakers, press Y. Otherwise, press N.
3.20 IEEE1394 Test Program 3 Tests and Diagnostics 3.20 IEEE1394 Test Program This section describes how to perform the IEEE1394 test with the test program. Toshiba MS-DOS is required to run the DIAGNOSTICS TEST PROGRAM. To start the DIAGNOSTIC TEST PROGRAM, follow these steps: (a) Insert the Diagnostics disk in the floppy disk drive and turn on the computer. (The Diagnostics Disk contains the MS-DOS boot files.
3 Tests and Diagnostics Subtest 01 3.20 IEEE1394 Test Program IEEE1394 test This program checks the data transporting between responder machine and target machine. NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test. Subtest 02 Responder tool This program initializes the machine responder. Subtest 03 ID Check This program checks the GUID.
3.21 Bluetooth Test 3 Tests and Diagnostics 3.21 Bluetooth Test This section describes how to perform the Bluetooth test program to check if the Bluetooth functions of computer are working properly. To start the Bluetooth test program, follow the steps below: NOTE: Use another computer that can communicate by the Bluetooth as a reference machine to perform this test. Insert a floppy disk containing the test program into the target machine and turn on the target machine.
3 Tests and Diagnostics Subtest 01 3.21 Bluetooth Test BD_ADDR check This subtest checks the BD_ADDR functions. When the Bluetooth test menu is displayed, press 1 to select the test and press Enter. The following message will appear: ---------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3.21 Bluetooth Test 3 Tests and Diagnostics If the target machine has any problem, it displays Error CODE. The following message is desplayed. ---------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.21 Bluetooth Test If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-2 Error code for Bluetooth test (BD_ADDR) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection. Hardware Failure. Page Timeout.
3.21 Bluetooth Test 3 Tests and Diagnostics Table 3-2 Error code for Bluetooth test (BD_ADDR) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collosion. LMP PDU Not Allowed. Not Exist Not Exis t Not Exist Not Exist Not Exist Not Exist Not Exist Not Exist Not Exist Not Exist Not Exist ** See the Specification of the Bluetooth System in detail.
3 Tests and Diagnostics 3.21 Bluetooth Test When the Bluetooth test menu is displayed, press T to select the test and press Enter in the test machine. The following message will appear: ---------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3.21 Bluetooth Test 3 Tests and Diagnostics A>_ If the target machine has any problem, the following message “INCOMPLETE” is displayed with the Error CODE. ---------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.21 Bluetooth Test If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-3 Error code for Bluetooth test (BD_ADDR of the DUT) (1/2) Error code 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f Meaning Unknown HCI Command. No Connection. Hardware Failure. Page Timeout.
3.21 Bluetooth Test 3 Tests and Diagnostics Table 3-3 Error code for Bluetooth test (BD_ADDR of the DUT) (2/2) Error code 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collosion. LMP PDU Not Allowed.
3 Tests and Diagnostics 3.22 Error Code and Error Status Names 3.22 Error Code and Error Status Names Table 3-4 lists the error codes and error status names for the Diagnostic Test.
3.
3 Tests and Diagnostics 3.
3.23 Hard Disk Test Detail Status 3 Tests and Diagnostics 3.23 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eight-digit number. The first four digits represent the hard disk controller (HDC) error status number and the last four digits are not used.
3 Tests and Diagnostics 3.23 Hard Disk Test Detail Status Table 3-6 Error register contents Bit Name 7 BBK1 (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error. “1” … Uncorrectable data error has been detected. 5 —— Not used 4 IDNF (Identification) “0” … Not used “1” … There was no ID field in the requested sector.
3.24 Head Cleaning 3 Tests and Diagnostics 3.24 Head Cleaning 3.24.1 Function Description This function cleans the heads in the USB FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.24.2 Operations 1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS - FLOPPY DISK HEAD CLEANING : VX.XX Mount cleaning disk(s) on drive(s). Press any key when ready. 2.
3 Tests and Diagnostics 3.25 Log Utilities 3.25 Log Utilities 3.25.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or output the data to a printer. If the power switch is turned off, the error information will be lost. The error information is displayed in the following order: 1. Error count (CNT) 2. Test name (TS-NAME) 3. Subtest number (TS-NAME) 4. Pass count (PASS) 5.
3.25 Log Utilities 3 Tests and Diagnostics 2. The error information displayed on the screen can be manipulated by the following number keys: 1 scrolls the display to the next page. 2 scrolls the display to the previous page. 3 returns to the Diagnostic Menu. 4 erases all error log information in RAM. 5 outputs the error log information to a printer. 6 reads the log information from a floppy disk. 7 writes the log information to a floppy disk. 3.
3 Tests and Diagnostics 3.26 Running Test 3.26 Running Test 3.26.1 Function Description This function automatically executes the following tests in sequence: 1. 2. 3. 4. 5. 6. 7. 8. 3.26.
3.26 Running Test 3 Tests and Diagnostics 4. Select No and press Enter. The following message will appear: Mount the work disk(s) on the drive(s), then press [Enter] key. [Warning : The contents of the disk(s), will be destroyed.] 5. This program is executed continuously. To terminate the program, press Ctrl +Break.
3 Tests and Diagnostics 3.27 Floppy Disk Drive Utilities 3.27 Floppy Disk Drive Utilities 3.27.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE: This program is only for testing a floppy disk drive. The option is different from the Toshiba MS-DOS FORMAT command. This program can format a 5.25-inch or 3.
3.27 Floppy Disk Drive Utilities 3.27.2 3 Tests and Diagnostics Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 2 3 4 9 - FORMAT COPY DUMP HDD ID READ EXIT TO DIAGNOSTICS MENU 2. FORMAT program (a) Selecting FORMAT displays the following message: DIAGNOSTICS - FLOPPY DISK FORMAT : VX.
3 Tests and Diagnostics 3.27 Floppy Disk Drive Utilities 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below: Insert source disk into drive A: Press any key when ready. (c) Remove the Diagnostics Disk from the FDD, insert the source disk and press any key. The following message will appear, indicating the program has started.
3.27 Floppy Disk Drive Utilities 3 Tests and Diagnostics 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) When FDD is selected, the following message appears. Select a format type number. When HDD is selected, the display will go to step (g). Select drive number (1:A, 2:B) ? (c) Select a drive number and the following message will be displayed.
3 Tests and Diagnostics 3.27 Floppy Disk Drive Utilities (k) The following message appears. Select 2 to return to the FDD UTILITIES menu. Another dump (1:Yes, 2:No) ? 5. HDD-ID READ Selecting HDD ID READ displays the following HDD ID configuration: [HDD ID Read (VX.XX)] ID code (h) No. of Cylinders Removable Cylinders No. of Heads Unformat Bytes/Track Unformat Bytes/Sector Sectors/Track Gap Length Sync. Bytes Reserved (h) Serial No. Controller Type (h) Sector Buffers ECC Bytes Firmware Rev. Model No.
3 Tests and Diagnostics 3.28 System Configuration 3 3.28 System Configuration 3.28.1 Function Description The System Configuration program contains the following configuration information for the computer: 1. Processor Type 2. VGA Controller 3. MS-DOS Version 4. BIOS ROM version (1st ID, 2nd ID) 5. Boot ROM version 6. KBC version 7. PS Microprocessor Version 8. Total Memory Size 9. Battery code 10. Sound System 11. The number of printer ports 12. The number of ASYNC ports 13.
3.28 System Configuration 3.28.2 3 Tests and Diagnostics Operations Selecting 8 from the DIAGNOSTIC MENU and pressing Enter displays the following system configuration: System Configuration Display : Ver X.XX [Machine Name XXXXXX] * *** * * * * * * *** * * * * * * * * - Processor Type VGA Controller MS-DOS Version BIOS ROM Version BOOT ROM Version KBC Version PS Micom Version Total Memory Size Battery Code Sound System X Printer Adapter X ASYNC Adapter = = = = = = = = = = XXXX XXXX VX.XX VX.
3 Tests and Diagnostics 3.29 SETUP 3.29.1 Function Description 3.29 SETUP This program displays the current system setup information as listed below: 1. Memory (a) Total 2. System Date/Time (a) Date (MM-DD-YYYY) (b) Time (HH:MM:SS) 3. Battery (a) Battery Save Mode 4. Password 5. Boot Priority (a) Boot Priority (b) HDD Priority 6. Display (a) Power On Display (b) TV Type 7.
3.29 SETUP 3 Tests and Diagnostics 10. Drives I/O (a) Built-in HDD (b) Select Bay 11. PCI Bus (a) PCI Bus 12. PC Card (a) Controller Mode 13. Peripheral (a) Internal Pointing Device (b) Ext keyboard “Fn” (c) Paralla Port Mode (d) Hard Disk Mode 14. Legacy Emulation (a) USB kayboard/Mouse Legacy Emulation (b) USB-FDD Legacy Emulation 15. PCI LAN (a) Built-in LAN 16.
3 Tests and Diagnostics 3.29.2 3.29 SETUP Accessing the SETUP Program Selecting 0 from the DIAGNOSTICS MENU and pressing Enter displays the TSETUP screen. The TSETUP screen is divided into two pages: SYSTEM SETUP (1/2) and SYSTEM SETUP (2/2). SYSTEM SETUP (1/2) ACPI BIOS version = X.
3.29 SETUP 3 Tests and Diagnostics NOTE: 1) Panel Power On/Off under OTHERS appears only when the Power-up Mode is in Resume mode. 2) USB FDD Legacy Emulation under LEGACY EMULATION appears only when Floppy Disk I/O is set to Disabled.
3 Tests and Diagnostics 3.29 SETUP Moving Within the SETUP Menu and Changing Values 1. Press ß and à to move between the two columns. Press PgDn and PgUp to move between the two pages. Press ↑ and ↓ to move between items in a column. 2. Press either the space bar to change the value. Accepting Changes and Exiting the SETUP Window 1. Press End to accept the changes you made. The following message is displayed: Are you sure? (Y/N) The changes you made will cause the system to reboot. 2.
3.29 SETUP 3 Tests and Diagnostics SETUP Options The SETUP screen is divided into functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s memory. (a) Total This field displays the total amount of memory installed and is automatically calculated by the computer. You cannot change this value. 2. System Date/Time Use this option to set the computer’s system date/time.
3 Tests and Diagnostics 3.29 SETUP Use this option to enable or disable the CPU sleep function. Enabled Enables sleep mode. (Default) Disabled Disables sleep mode. Display Auto Off Use this option to disable or set the duration of the display automatic power off function. This function causes the computer to turn the LCD panel’s illumination off if you make no entry for the set period of time. Disabled Disables display automatic power off. xx Min.
3.29 SETUP 3 Tests and Diagnostics Battery optimized TECRA M1 Maintenance Manual (960-436) Lowers the CPU processing speed first, then if necessary turns on the fan.
3 Tests and Diagnostics 3.29 SETUP 4. Password This option allows you to set or reset the user password for power on. Not Registered Change or remove the password. (Default) For details on setting the user password, refer to the User’s Manual. 5. Boot Priority This tab sets the priority for booting the computer and the priority for the built-in HDD or optional secondary HDD.
3.29 SETUP 3 Tests and Diagnostics Built-in HDD → Second HDD → PC Card (Default) Second HDD → Built-in HDD → PC Card Built-in HDD → PC Card → Second HDD Second HDD → PC Card → Built-in HDD PC Card → Built-in HDD → Second HDD PC Card → Second HDD → Built-in HDD 6. Display This group of options configures the computer’s display. (a) Power On Display This option is used to select the display when booting up. Auto-Selected Selects an external monitor if one is connected.
3 Tests and Diagnostics 3.29 SETUP (b) CPU Cache Use this option to enable or disable the CPU cache. Enabled Enables the CPU cache. (Default) Disabled Disables the CPU cache. When enabled is selected, a subwindow similar to the one below is displayed to select the cache write policy. The options for this setting are Write-back (default) and Write-through for CPU cache.
3.29 SETUP 3 Tests and Diagnostics Use this option to set a time and date for automatic power on and enable or disable the ring indicator feature. Ring Indicator appears only when the computer is in Resume mode. Alarm Date Option appears only when Alarm Time is enabled. OPTIONS Alarm Time Alarm Date Option Ring Indicator Wake-up on LAN = = = = 00:00:00 Disabled Disabled* Disabled** * only for Modem Model **only for LAN Model Alarm Time is set in the sequence of hours and minutes.
3 Tests and Diagnostics All Devices 3.29 SETUP All devices will be initialized. If you are using an OS that does not have PNP capacity, select “All Devices.” The Display shows the following message: Device Config.
3.29 SETUP 3 Tests and Diagnostics 9. I/O ports This option controls settings for the parallel port. NOTE: Do not assign the same interrupt request level and I/O address to the serial port and PC card. (a) Serial Use this option to set the COM level for the serial port.
3 Tests and Diagnostics 3.29 SETUP When the Printer Port Mode (see settings below) is set to ECP, the DMA channel can also be set to 1, 2 or 3. The default is 3. LPT setting Interrupt level I/O address LPT 1 7 378H 3 (Parallel port default) LPT 2 5 278H 3 LPT 3 7 3BCH 3 Not Used DMA channel Disables the port When you select one of the above options, except for Not Used, a subwindow similar to the one below appears to let you set the DMA.
3.29 SETUP 3 Tests and Diagnostics 11. PCI Bus This item displays the interrupt level for the Card Bus. It is for information only and cannot be changed. PCI BUS = IRQ11 12. PC Card This option sets the PC Card Controller mode. This option can be changed when “Device Config.” is set to “All Devices”. Auto-Selected Use this setting for all PC Cards when OS supports Plug&Play. (Default) PCIC Compatible Use this setting for PCIC compatible PC card.
3 Tests and Diagnostics 3.29 SETUP you to use “Hotkeys” by pressing the set combination in place of the Fn key. The following items can be selected for this option: Left Ctrl + Left Alt* Right Ctrl + Right Alt* Left Alt + Left Shift Right Alt + Right Shift Left Alt + Caps Lock *If these selections are made, you cannot warm boot the system by pressing Ctrl + Alt + Del. Disabled Disables the feature. (Default) (c) Parallel Port Mode The options in this tab are ECP and Standard Bi-directional.
3.29 SETUP 3 Tests and Diagnostics Disabled USB Legacy Support cannot be used. (b) USB-FDD Legacy Emulation. Use this option to enable or disable USB-FDD Legacy Emulation. Enabled USB Legacy Support can be used. (Default) Disabled USB Legacy Support cannot be used. 15. PCI LAN (Not used) This option enables/disables the Built-in LAN functions. (a) Built-in LAN Enabled Enables Built-in LAN functions. (Default) Disabled Disables Built-in LAN functions. 16.
3 Tests and Diagnostics 3-96 3.
Chapter 4 Replacement Procedures
4 Replacement Procedures 4-ii TECRA M1 Maintenance Manual (960-436)
4 Replacement Procedures Chapter 4 Contents 4.1 General........................................................................................................................ 4-1 4.2 Battery Pack ................................................................................................................ 4-9 4.3 Optional PC Card...................................................................................................... 4-12 4.4 Optional SD Card........................................
4 Replacement Procedures Figures Figure 4-1 Releasing the Battery pack ............................................................................. 4-10 Figure 4-2 Removing a PC card ...................................................................................... 4-12 Figure 4-3 Removing an SD card .................................................................................... 4-14 Figure 4-4 Removing the HDD cover ........................................................................
4 Replacement Procedures Figure 4-27 Removing the Display assembly (2)................................................................. 4-50 Figure 4-28 Removing the Display assembly (3)................................................................. 4-51 Figure 4-29 Removing the LED board............................................................................... 4-53 Figure 4-30 Removing the Sound board ............................................................................
4 Replacement Procedures Figure 4-57 Replacing TOSHIBA fluorescent lamp (XGA) (7) .......................................... 4-93 Figure 4-58 Replacing TOSHIBA fluorescent lamp (XGA) (8) .......................................... 4-94 Figure 4-59 Replacing TOSHIBA fluorescent lamp (XGA) (9) .......................................... 4-95 Figure 4-60 Replacing TOSHIBA fluorescent lamp (XGA) (10)........................................ 4-96 Figure 4-61 Replacing TOSHIBA fluorescent lamp (XGA) (11)..
4.1 General 4 4 Replacement Procedures Replacement Procedures 4.1 General This section explains how to disassemble the computer and replace Field Replaceable Units (FRUs). It may not be necessary to remove all the FRUs in order to replace one. The chart below is a guide to which FRUs need to be removed in order to remove others.
4 Replacement Procedures 4.1 General Safety Precautions Before you begin disassembly, read the following safety precautions and observe them carefully as you work. DANGER: 1) Always use the genuine battery that is authorized by Toshiba or compatible with the unit. Since other battery packs have different specifications, they may be incompatible with the unit, and may burst or explode. Never heat or disassemble the battery pack, as that could cause leakage of alkaline solution.
4.1 General 4 Replacement Procedures Before You Begin Look over the procedures in this section before you begin disassembling the computer. Familiarize yourself with the disassembly and reassembly steps. Begin each procedure by removing the AC adapter and the battery pack as instructed in this section: 1. Do not disassemble the computer unless it is operating abnormally. 2. Use only the correct and approved tools. 3.
4 Replacement Procedures 4.1 General Disassembly Procedures The computer has two basic types of cable connectors: • • • Pressure Plate Connectors Coaxial Cable Connectors Normal Pin Connectors To disconnect a Pressure Plate connector, lift up the tabs on either side of the connector’s plastic pressure plate and slide the cable out of the connector. To connect the cable to a Pressure Plate connector, make sure the pressure plate is fully lifted and slide the cable into the connector.
4.1 General 4 Replacement Procedures After installing an FRU in the computer, confirm that the FRU and the computer are functioning properly.
4 Replacement Procedures 4.1 General Tools and Equipment The use of Electrostatic Discharge (ESD) equipment is very important for your safety and the safety of those around you. Proper use of these devices will increase the success rate of your repairs and lower the cost for damaged or destroyed parts. The following equipment is necessary to disassemble and reassemble the computer: 4-6 • One M2 point size 0 Phillips screwdriver to remove and replace screws. • One 4 mm flat-blade screwdriver.
4.1 General 4 Replacement Procedures Screw Tightening Torque When you fasten screws, be sure to follow the torque list below. CAUTION: Overtightening can damage components and screws; undertightening can result in electrical shorts or other damage if screws or components come loose. NOTE: Toshiba recommends that you use an electric screw driver for quick and easy operations. • M2 0.17 N·m (1.7 kgf·cm) • M2.5 0.30 N·m (3.0 kgf·cm) • M3 0.57 N·m (5.
4 Replacement Procedures 4.1 General Color of Screw Shaft To avoid mistakes on the screw length, screw shafts are colored as follows: q Even number length screw: brown q Odd number length screw: white q Special length screw: blue Screws whose lengths are indicated to one or more decimal places such as 2.5 mm or 2.8 mm.
4.2 Battery Pack 4.2 4 Replacement Procedures Battery Pack Removing the Battery Pack To remove the battery pack, follow the steps below and refer to figure 4-1. CAUTION: When handling battery packs, be careful not to short circuit the terminals. Also do not drop, hit or apply impact; do not scratch, break, twist or bend the battery pack. 1. Turn off the computer. 2. Disconnect the AC cable and other external devices from the computer. 3. Turn the computer face down.
4 Replacement Procedures 4.2 Battery Pack 4. While sliding the battery latch, insert your finger into the slot, then pull the battery pack to the arrow direction in the figure below and lift it out. NOTE: For environmental reasons, do not throw away a spent battery pack. Collect the spent battery packs.
4.2 Battery Pack 4 Replacement Procedures Installing the Battery Pack To install the battery pack, follow the steps below and refer to figure 4-1. CAUTION: The battery pack is a lithium ion battery, which can explode if not properly replaced, used, handled or disposed of. For environmental reasons, collect the spent battery packs. Use only batteries recommended by Toshiba as replacements. NOTE: Check the battery's terminals visually. If they are dirty, wipe them clean with a dry cloth. 1.
4 Replacement Procedures 4.3 4.3 Optional PC Card Optional PC Card Removing an Optional PC Card To remove a PC card (option), follow the steps below and refer to figure 4-2. CAUTION: Before you remove a PC card, refer to the card's documentation and to your operating system documentation for proper procedures and precautions. 1. Turn the computer face up. 2. Press the eject button for the PC card you want to remove to extend the button. 3. Press the extended eject button to pop the PC card out slightly.
4.3 Optional PC Card 4 Replacement Procedures Installing an Optional PC Card To install a PC card, follow the steps below and refer to figure 4-2. 1. Insert a PC card. 2. Push it carefully to ensure a firm connection.
4 Replacement Procedures 4.4 4.4 Optional SD Card Optional SD Card Removing an Optional SD Card To remove an SD card (option), follow the steps below and refer to figure 4-3. CAUTION: Before you remove an SD card, refer to the card's documentation and to your operating system documentation for proper procedures and precautions. 1. Turn the computer face up. 2. Push the SD card in (indicated as “1” in the figure below) and release it to pop the card out slightly. 3.
4.4 Optional SD Card 4 Replacement Procedures 2. Push it carefully to ensure a firm connection.
4 Replacement Procedures 4.5 4.5 HDD HDD CAUTION: When handling the HDD, do not press the top surface as shown by the arrow. Hold it by the sides. HDD Removing the HDD To remove the HDD, follow the steps below and refer to figures 4-4 to 4-6. 1. Turn the computer upside down.
4.5 HDD 4 Replacement Procedures 2. Remove the following screw securing the HDD cover. Remove the HDD cover by lifting up. • M2.5×4 FLAT HEAD screw ×1 M2.
4 Replacement Procedures 4.5 HDD 3. Pull the guide of the HDD pack and remove HDD pack. Be careful not to damage the connector.
4.5 HDD 4 Replacement Procedures NOTE: The following steps describe how to disassemble the HDD pack; however, do not disassemble if the HDD is working properly. 5. Place the HDD pack on a flat surface, and remove the following screws. • M3×4 FLAT screw ×4 6. Remove the HDD bracket. CAUTION: Do not apply pressure to the top or bottom of the HDD.
4 Replacement Procedures 4.5 HDD Installing th e HDD To install the HDD, follow the steps below and refer to figures 4-4 to 4-6. CAUTION: Do not hold the HDD by its top and bottom flat surfaces. It may damage the HDD. 1. Seat the HDD in the bracket. 2. Secure the HDD to the HDD bracket with the following screws. • M3×4 FLAT screw ×4 CAUTION: Do not apply pressure to the middle of the HDD pack. It may damage the HDD pack. Hold the HDD pack by its corners. 3.
4.6 Slim Select Bay Module 4.6 4 Replacement Procedures Slim Select Bay Module Removing the Slim Select Bay Module To remove the slim select bay module, follow the steps below and refer to figures 4-7 and 4-8. CAUTION: The slim select bay module can become hot with use. Be careful when removing the module. 1. Remove the following screw securing the slim select bay module from the screw hole for lock, and tighten the removed screw in the screw hole for release. (The slim select bay is unlocked.) • M2.
4 Replacement Procedures 4.6 Slim Select Bay Module 2. While sliding the latch toward the arrow direction in the figure, slide the slim select bay module outward to disconnect it from PJ1511 on the system board. Screw hole for lock Latch M2.
4.6 Slim Select Bay Module 4 Replacement Procedures 3. Remove the following screws securing the connector and plastic brace. • M2×8 BIND screw ×2 4. Remove the connector and plastic brace from the slim select bay module. 5. Remove the following screws securing the plastic frame.
4 Replacement Procedures 4.6 Slim Select Bay Module Installing the Slim Select Bay Module To install the slim select bay module, follow the steps below and refer to figures 4-7 and 4-8. 1. Seat the plastic frame on the side of the slim select bay module, and secure it with the following screws. • ×5 M2×3 SUPER FLAT screw 2. Install the connector and plastic brace and secure them with the following screws. • M2×8 BIND screw ×2 3.
4.7 Modem Daughter Card 4.7 4 Replacement Procedures Modem Daughter Card Removing the Modem Daughter Card To remove the modem daughter card, follow the steps below and refer to figure 4-9 and 4-10. 1. Remove the following screw securing the modem daughter card cover. Insert your finger into the slot and remove the cover by lifting it up from the side of screw hole. • M2.5×4 FLAT HEAD screw Modem daughter card cover ×1 M2.
4 Replacement Procedures 4.7 Modem Daughter Card 2. Remove the following screws securing the modem daughter card. • M2×4 BIND screw ×2 3. Lift up the modem daughter card to disconnect it from PJ2017 on the sound board by pulling up the insulator. 4. Disconnect the modem cable from JP1 on the modem daughter card. NOTE: To remove the modem cable from the system board, refer to 4.22 System Board/RTC Battery/DC-IN jack.
4.7 Modem Daughter Card 4 Replacement Procedures Installing the Modem Daughter Card To install the modem daughter card, follow the steps below and refer to figures 4-9 and 4-10. NOTE: To install the modem cable to the system board, refer to 4.22 System Board/RTC Battery/DC-IN Jack. 1. Connect the modem cable to JP1 on the modem daughter card. 2. Seat the modem daughter card and press carefully on the card to connect it to PJ2017 on the sound board. Be careful not to damage the card or connector. 3.
4 Replacement Procedures 4.8 4.8 CPU CPU Removing the CPU To remove the CPU, follow the steps below and refer to figures 4-11 to 4-13. CAUTION: 1) The CPU can become very hot during operation. Be sure to let it cool before starting repair work. 2) When you remove the CPU, wipe the grease off of the bottom of the fin and top of the CPU. Apply new grease when installing. 1. Remove the following screws securing the CPU cover.
4.8 CPU 4 Replacement Procedures M2.5×16 FLAT HEAD screw A M2.5×4 FLAT HEAD screw CPU cover M2.5×4 FLAT HEAD screw Slot Figure 4-11 Removing the CPU cover 2. Remove the following screws securing the CPU holder. Lift the “2” side of the CPU holder first, then rotate the holder 90 degrees counterclockwise. Then lift the “1” side of the CPU holder and remove the holder. • M2×6 BIND screw ×4 3. Remove the fin. CAUTION: Silicon grease is applied between the fin and the CPU.
4 Replacement Procedures 4.
4.8 CPU 4 Replacement Procedures 4. Turn the cam to the unlock position with a flat-blade screwdriver to unlock the CPU. Figure 4-13 Unlocking the CPU 4. Lift up the CPU.
4 Replacement Procedures 4.8 CPU Installing the CPU To install the CPU, follow the steps below and refer to figures 4-11 to 4-14. 1. Make sure the cam is in the open position. 2. Seat the CPU in the CPU socket. Make sure the alignment is exact to avoid damaging pins on the CPU. 3. Press the interposer gently with your fingers and turn the cam on the CPU socket to the lock position with a flat-blade screwdriver to secure the CPU. 4.
4.8 CPU 4 Replacement Procedures 5. Install the fin. 6. Insert the “1” side of the CPU holder into the empty space, with rotated 90 degrees counterclockwise first. Then rotate it 90 degrees clockwise and fit the two holes of the CPU holder to the bosses on the fin. 7. Secure the CPU holder with the following screws. • M2×6 BIND screw ×4 8. Place the CPU cover and secure it with the following screws. • M2.5×4 FLAT HEAD screw ×3 • M2.
4 Replacement Procedures 4 4.9 Keyboard Replacement Procedures 4.9 Keyboard Removing the Keyboard To remove the keyboard, follow the steps below and refer to figures 4-15 to 4-17. 1. Turn the computer face up and open the display panel. 2. Insert your finger into the latches between the keyboard brace and the computer, and lift up the keyboard brace to unlatch and remove it.
4.9 Keyboard 4 Replacement Procedures 3. Remove the following screws securing the keyboard. • ×2 M2.5×2.8 FLAT HEAD screw 4. Remove the following screw securing the keyboard hold plate and remove the keyboard hold plate. • M2.5×2.8 FLAT HEAD screw M2.5×2.8 FLAT HEAD screw ×1 Keyboard hold plate M2.5×2.8 FLAT HEAD screw M2.5×2.8 FLAT HEAD screw Figure 4-16 Removing the Keyboard 5. Rotate out the keyboard and lay it on top of the palm rest.
4 Replacement Procedures 4.9 Keyboard 6. Remove the following screw securing the keyboard support plate and remove the keyboard support plate. • M2.5×6 FLAT HEAD screw ×1 M2.5×6 FLAT HEAD screw Keyboard support plate Tabs PJ123 Figure 4-17 Removing the Keyboard support plate 7. Disconnect the keyboard cable from PJ123 on the system board, and remove the keyboard.
4.9 Keyboard 4 Replacement Procedures Installing the Keyboard To install the keyboard, follow the steps below and refer to figures 4-15 to 4-17. 1. Place the keyboard face down on the palm rest. 2. Connect the keyboard cable to PJ123 on the system board. 3. Insert the tabs on the keyboard support plate first, then place the keyboard support plate on the keyboard cable. Secure the keyboard support plate with the following screw. • M2.5×6 ×1 FLAT HEAD screw 4.
4 Replacement Procedures 4.10 Memory Module 4.10 Memory Module Removing a Memory Module To remove a memory module, make sure the computer is in boot mode and powered off, follow the steps below and refer to figure 4-18. CAUTION: 1) Do not try to remove a memory module with the computer turned on. The computer or the memory might be damaged. 2) Do not touch the connectors on the memory module(s) or on the computer. Debris on the connectors may cause memory access problems. 1.
4.10 Memory Module 4 Replacement Procedures Installing a Memory Module To install a memory module, make sure that the computer is in boot mode and powered off, follow the steps below and refer to figure 4-18. CAUTION: 1) Do not install a memory module in slot B only. Use slot A prior to slot B. Otherwise, the computer or the memory may be damaged. 2) Do not touch the connectors on the memory module or on the computer. Debris on the connectors may cause memory access problems. 1.
4 Replacement Procedures 4.11 Sensor/Switch Board 4.11 Sensor/Switch Board Removing the Sensor/Switch Board To remove the sensor/switch board, make sure the computer is in boot mode and powered off, follow the steps below and refer to figure 4-19. 1. Remove the following screws securing the sensor/switch board. • M2.5×2.8 FLAT HEAD screw ×2 2. Remove the sensor/switch board by lifting it up. M2.5×2.
4.11 Sensor/Switch Board 4 Replacement Procedures 3. Disconnect the sensor/switch board SUMI card from PJ3200 on the back of the sensor/switch board. NOTE: For removing the sensor/switch board SUMI card from the system board, refer to 4.22 System Board/RTC Battery/DC -IN Jack. Installing the Sensor/Switch Board To install the sensor/switch board, make sure that the computer is in boot mode and powered off, follow the steps below and refer to figure 4-19.
4 Replacement Procedures 4.12 Touch Pad 4.12 Touch Pad Removing the Touch Pad To remove the touch pad, follow the steps below and refer to figures 4-20 to 4-22. 1. Turn the computer face down and remove the following nine screws securing the palm rest to the display assembly. • M2.5×4 FLAT HEAD screw ×2 (“4” in the figure below) • M2.5×6 FLAT HEAD screw ×3 (“6” in the figure below) • M2.5×10 FLAT HEAD screw ×2 (“10” in the figure below) • M2.
4.12 Touch Pad 4 Replacement Procedures 2. Disconnect the touch pad SUMI card from PJ2003 on the system board. 3. Remove the following screw securing the palm rest to the display assembly. Remove the palm rest by rotating it up toward the front of the computer. • M2.5×4 FLAT HEAD screw ×1 M2.
4 Replacement Procedures 4.12 Touch Pad 4. Remove the following screws securing the touch pad and touch pad switch to the palm rest. • M2.5×4 FLAT HEAD screw ×2 • M2.5×4 TAPPING screw ×2 5. Remove the touch pad and touch pad switch from the front of the palm rest. Touch pad switch Touch pad Touch pad SUMI card Palm rest M2.5×4 FLAT HEAD screw M2.5 ×4 TAPPING screw Figure 4-22 Removing the Touch pad and Touch pad switch 6. Disconnect the touch pad SUMI card from CN1 on the touch pad.
4.12 Touch Pad 4 Replacement Procedures Installing the Touch Pad To install the touch pad, follow the steps below and refer to figures 4-20 to 4-22. 1. Connect the touch pad SUMI card to CN1 on the touch pad. 2. Install the touch pad and touch pad switches on the palm rest and pass the touch pad SUMI card into the hole of the palm rest. Secure them with the following screws. • M2.5×4 FLAT HEAD screw ×2 • M2.5×4 TAPPING screw ×2 3.
4 Replacement Procedures 4.13 Wireless LAN Card 4.13 Wireless LAN Card Removing the Wireless LAN Card To remove the wireless LAN card, make sure the computer is in boot mode and powered off, follow the steps below and refer to figures 4-23 and 4-24. NOTE: The wireless LAN card is an option in some models. This computer supports two types of wireless LAN card (802.11/b or 802.11a/b combo). In this section, removing/installing a wireless LAN card for a/b combo model is described for example.
4.13 Wireless LAN Card 4 Replacement Procedures 2. Disconnect the wireless LAN antenna cables (black and white) from the wireless LAN card using an antenna coaxial cable disconnector. Wireless LAN antenna cable (white) Wireless LAN card Wireless LAN antenna cable (black) Latches Figure 4-24 Removing the Wireless LAN card 3. Press the latches outward to release the wireless LAN card. It will pop up to about a 45degree angle. 4. Disconnect the wireless LAN card from PJ2015 on the system board.
4 Replacement Procedures 4.13 Wireless LAN Card Installing the Wireless LAN Card To install the wireless LAN card, make sure that the computer is in boot mode and powered off, follow the steps below and refer to figures 4-23 and 4-24. CAUTION: Be sure to switch the computer off before removing the wireless LAN card. Otherwise, the computer or the wireless LAN card may be damaged. 1. Insert the wireless LAN card into the connector at an angle of 45 degrees. 2.
4.14 Bluetooth Module 4 Replacement Procedures 4.14 Bluetooth Module Removing the Bluetooth Module To remove the Bluetooth module, follow the steps below and refer to figure 4-25. CAUTION: Do not try to remove the Bluetooth module with the computer turned on. You can damage the computer or Bluetooth module. Do not touch the connectors on the Bluetooth module on the computer. Debris on the connectors may cause Bluetooth access problems. 1.
4 Replacement Procedures 4.14 Bluetooth Module M2×3 SUPER FLAT screw Bluetooth SUMI card PJ4900 Bluetooth module Bluetooth antenna cable Figure4-25 Removing the Bluetooth module Installing the Bluetooth Module To install the Bluetooth module, follow the steps below and refer to figure 4-25. 1. Connect the Bluetooth SUMI card to the connector on the Bluetooth module. 2. Connect the Bluetooth SUMI card to PJ4900 on the system board. 3. Place the Bluetooth module. 4.
4.15 Display Assembly 4 Replacement Procedures 4.15 Display Assembly Removing the Display Assembly To remove the display assembly, follow the steps below and refer to figures 4-26 to 4-28. 1. Turn the computer face down, and remove the following nine screws: • • ×3 (“4” in the figure below) ×6 (“16” in the figure below) M2.5×4 FLAT HEAD screw M2.
4 Replacement Procedures 4.15 Display Assembly 2. Turn the computer face up and open the display panel. 3. Remove the following screws securing the display assembly. • M2.5×6 FLAT HEAD screw ×2 • M2.5×4 FLAT HEAD screw ×1 4. Turn up the insulator covering the LCD cable and disconnect the LCD cable from PJ5500 on the system board. 5. Turn up the insulator covering the speaker cables and disconnect the two speaker cables from PJ2026 (R, red) and PJ2027 (L, blue) on the system board. 6.
4.15 Display Assembly 4 Replacement Procedures LCD cable Speaker cables PJ5500 M2.5×4 FLAT HEAD screw M2.
4 Replacement Procedures 4.15 Display Assembly 7. Remove the display assembly from the base assembly. Display assembly Base assembly Figure 4-28 Removing the Display assembly (2) NOTE: When removing the display assembly, be careful not to damage any cables.
4.15 Display Assembly 4 Replacement Procedures Installing the Display Assembly To install the display assembly, follow the steps below and refer to figures 4-26 and 4-28. 1. Install the display assembly on the base assembly. NOTE: When installing the display assembly, be careful not to pinch or damage any cables. 2. Press along the edges of the display assembly to secure the latches. 3. Connect the internal microphone cable to PJ3001 on the sound board and stick the glass tape on it. 4.
4 Replacement Procedures 4.16 LED Board 4.16 LED Board Removing the LED Board To remove the LED board, follow the steps below and refer to figure 4-29. 1. Remove the glass tape securing the LED board SUMI card and USB cable. 2. Disconnect the LED board SUMI card from PJ1101 on the system board. 3. Remove the following screws securing the LED board and remove the LED board. • M2.5×4 FLAT HEAD screw ×2 4. Disconnect the LED board SUMI card from PJ3100 on the LED board.
4.16 LED Board 4 Replacement Procedures Installing the LED Board To install the LED board, follow the steps below and refer to figure 4-29. 1. Connect the LED board SUMI card to PJ3100 on the LED board. 2. Place the LED board and secure it with the following screws. • M2.5×4 FLAT HEAD screws ×2 3. Connect the LED board SUMI card to PJ1101 on the system board. 4. Stick the glass tape to secure the LED board SUMI card and USB cable.
4 Replacement Procedures 4.17 Sound Board 4.17 Sound Board Removing the Sound Board To remove the sound board, follow the steps below and refer to figure 4-30. CAUTION: When the sound board is installed on the system board outside of the chassis, do not connect or disconnect a cable to the headphone or microphone jack repeatedly for check. Before checking the jacks, install the sound board on the system board, and secure them with one screw.
4.17 Sound Board 4 Replacement Procedures M2.
4 Replacement Procedures 4.17 Sound Board Installing the Sound Board To install the sound board, follow the steps below and refer to figure 4-30. 1. Install the sound board and press it to connect PJ3000 on the back of the sound board to PJ1100 on the system board. When installing the sound board, insert the two jacks and a volume controller into the hole of the chassis first. 2. Secure the sound board with the following screw. • 4-58 M2.
4.18 System Board/RTC Battery/DC-IN Jack 4 Replacement Procedures 4.18 System Board/RTC Battery/DC-IN Jack WARNING: When replacing the RTC battery, be sure to use genuine batteries or replacement batteries authorized by Toshiba. Installing the wrong battery could cause a battery explosion or other damage. If the RTC battery is found abnormal, it must not be installed. Replace it with a new battery, and dispose of the old one according to the local regulations.
4 Replacement Procedures 4.18 System Board/RTC Battery/DC-IN Jack Removing the System Board/RTC Battery/DC-IN Jack To remove the system board/RTC battery/DC-IN jack, follow the steps below and refer to figures 4-31 to 4-33. 1. Disconnect the sensor/switch board SUMI card from PJ1000 on the system board. 2. Disconnect the DC-IN cable from PJ8800 on the system board. 3. Disconnect the RTC battery cable from PJ1005 on the system board and remove the RTC battery. 4.
4.18 System Board/RTC Battery/DC-IN Jack 4 Replacement Procedures 6. Remove the following screws securing the system board. • M2.5×4 FLAT HEAD screw ×4 • M2.5×10 FLAT HEAD screw ×1 M2.5×4 FLAT HEAD screw M2.5×10 FLAT HEAD screw PJ1003 M2.5×4 FLAT HEAD screw System Board Modem cable Figure 4-32 Removing the System board/RTC Battery/DC -IN Jack (2) 7. Lift up the system board and remove it.
4 Replacement Procedures 4.18 System Board/RTC Battery/DC-IN Jack 9. Remove the DC-IN jack from the chassis.
4.18 System Board/RTC Battery/DC-IN Jack 4 Replacement Procedures Installing the System Board/RTC Battery/DC-IN Jack To install the system board/RTC battery/DC-IN jack, follow the steps below and refer to figures 431 to 4-33. 1. Install the DC-IN jack on the chassis. 2. Connect the modem cable to PJ1003 on the back of the system board and pass the cable under the insulator on the side of the CPU. 3. Install the system board. Pass the modem cable toward back through the hole for the CPU of the chassis.
4 Replacement Procedures 4 4.19 USB Board Replacement Procedures 4.19 USB Board Removing the USB Board To remove the USB board, follow the steps below and refer to figure 4-34. 1. Remove the following screw securing the USB board. • M2.5×4 FLAT HEAD screw ×1 2. Remove the USB cable from the two guides and remove the USB board by lifting it up directly. M2.
4.19 USB Board 4 Replacement Procedures Installing the USB Board To install the USB board, follow the steps below and refer to the figure 4-34. 1. Fit the USB cable to the two guides and install the USB board with its hole attached to the boss of the chassis. 2. Secure the USB board with the following screw. • M2.
4 Replacement Procedures 4.20 Fan 4.20 Fan Removing the Fan To remove the fan, follow the steps below and refer to figure 4-35. 1. Remove the following screws securing the fan. • M2.5×6 FLAT HEAD screw ×2 2. Remove the fan. M2.
4.20 Fan 4 Replacement Procedures Installing the Fan To install the fan, follow the steps below and refer to figure 4-35. 1. Place the fan. 2. Secure the fan with the following screws. • M2.
4 Replacement Procedures 4.21 Display Mask 4.21 Display Mask Removing the Display Mask To remove the display mask, follow the steps below and refer to figures 4-36 and 4-37. 1. Remove the two mask seals at the lower part of the display mask. 2. Remove the following screws securing the display mask. • M2.5×6 FLAT HEAD screw ×2 M2.
4.21 Display Mask 4 Replacement Procedures 3. Release the latches on the display mask and remove the display mask. Display mask Figure 4-37 Removing the Display mask (2) Installing the Display Mask To install the display mask, follow the steps below and refer to figures 4-36 and 4-37. 1. Install the display mask on the LCD module. 2. Fasten the latches of the display mask. 3. Secure the display mask with the following screws. • M2.
4 Replacement Procedures 4.21 Display Mask 4. Stick the two mask seals on the top of screws.
4.22 FL Inverter 4 Replacement Procedures 4.22 FL Inverter Removing the FL Inverter To remove the FL inverter, follow the steps below and refer to figure 4-38. 1. Remove the following screw securing the FL inverter. • M2×3 SUPER FLAT screw ×1 2. Disconnect the FL cable under the insulator from the FL inverter. 3. Disconnect the HV cable from the FL inverter. 4. Remove the FL inverter.
4 Replacement Procedures 4.22 FL Inverter Installing the FL Inverter To install the FL inverter, follow the steps below and refer to figure 4-38. 1. Connect the FL cable and the HV cable to the FL inverter. 2. Seat the FL inverter and stick the insulator on the FL inverter of the FL cable side. 3. Secure the FL inverter with the following screw.
4.23 LCD Module 4 Replacement Procedures 4.23 LCD Module NOTE: 1) Be careful not to apply pressure to the ICs along the edge of LCD module. The ICs are easily damaged. 2) For environmental reasons, do not throw away a malfunctioning LCD module (or FL). Please follow local ordinances or regulations for its disposal. Removing the LCD Module To remove the LCD Module, follow the steps below and refer to figures 4-39 and 4-40. 1. Remove the four mask seals on the sides of the LCD module. 2.
4 Replacement Procedures 4.23 LCD Module 5. Disconnect the LCD cable and remove the LCD module. CAUTION: When removing the LCD cable, be careful not to damage the connector.
4.23 LCD Module 4 Replacement Procedures 6. Remove the following screws securing the two metal braces to the LCD module.
4 Replacement Procedures 4.23 LCD Module Installing the LCD Module To install the LCD module, follow the steps below and refer to figures 4-39 and 4-40. 1. Secure the two metal braces to the LCD module with the following screws. • M2×3 SUPER FLAT screw ×4 2. Lean the LCD module against the lower side of the display cover. 3. Connect the LCD cable to the connector on the back of the LCD module. Stick the glass tape on the LCD cable. 4.
4 Replacement Procedures 4.24 Wireless LAN Antenna/Bluetooth Antenna/Disp lay Cover/Speaker 4.24 Wireless LAN Antenna/Bluetooth Antenna/Display Cover/Speaker Removing the Wireless LAN Antenna/Bluetooth Antenna/Display Cover/Speaker To remove the wireless LAN antenna/Bluetooth antenna/display cover/speaker, follow the steps below and refer to figures 4-41 to 4-49.
4.24 Wireless LAN Antenna/Bluetooth Antenna/Display Cover/Speaker 4 Replacement Procedures 2. Remove the following screws securing the cable holder and remove the cable holder. • M2.5×4 TAPPING screw ×2 M2.
4 Replacement Procedures 4.24 Wireless LAN Antenna/Bluetooth Antenna/Display Cover/Speaker 3. Remove the two acetate tapes securing the wireless LAN antenna cables, Bluetooth antenna cable (for wireless LAN/Bluetooth models only), and internal microphone cable. Remove these cables from the guides and pull them from the side of the display cover.
4.24 Wireless LAN Antenna/Bluetooth Antenna/Display Cover/Speaker 4 Replacement Procedures 4. Turn the display assembly face up and open the display cover. Remove the following screws securing the two hinges to the display cover. • M2.5×5 FLAT HEAD screw ×2 M2.5×5 FLAT HEAD screw Hinge Hinge Figure 4-44 Removing the Hinge (1) 5. Remove the display cover from the display assembly. Be careful not to pinch or damage the LCD cable. 6. Remove the internal microphone from the guide pin.
4 Replacement Procedures 4.24 Wireless LAN Antenna/Bluetooth Antenna/Display Cover/Speaker 7. (for Wireless LAN/Bluetooth models only) Remove four acetate tapes, then remove the wireless LAN antennas and Bluetooth antenna from the display cover.
4.24 Wireless LAN Antenna/Bluetooth Antenna/Display Cover/Speaker 4 Replacement Procedures 8. Remove the following screw securing the metal plate on the LCD cable and remove the metal plate. Remove the LCD cable from the display assembly. • M2.5×4 TAPPING screw ×1 M2.
4 Replacement Procedures 4.24 Wireless LAN Antenna/Bluetooth Antenna/Display Cover/Speaker 9. Lay the display assembly face down. Remove the acetate tape securing the left speaker cable. Release the cable from the guides.
4.24 Wireless LAN Antenna/Bluetooth Antenna/Display Cover/Speaker 4 Replacement Procedures 10. Remove the following screws securing the speakers and side covers. Remove the speakers and side covers. • M2.5×4 FLAT HEAD screw ×2 • M2.5×6 FLAT HEAD screw ×4 M2.5×4 FLAT HEAD screw M2.5×4 FLAT HEAD screw Speaker (right) Speaker (left) Side cover (right) Side cover (left) M2.5×6 FLAT HEAD screw M2.
4 Replacement Procedures 4.24 Wireless LAN Antenna/Bluetooth Antenna/Display Cover/Speaker 11. Remove the following screws securing the two hinges to the display cover and remove the hinges. • M2.5×6 FLAT HEAD screw ×2 M2.
4.24 Wireless LAN Antenna/Bluetooth Antenna/Display Cover/Speaker 4 Replacement Procedures Installing the Wireless LAN Antenna/Bluetooth Antenna/Display Cover/Speaker To install the wireless LAN antenna/Bluetooth antenna/display cover/speaker, follow the steps below and refer to figures 4-41 to 4-50. 1. Install the two hinges into the hole on the back of the display assembly and secure the hinges with the following screws. • M2.5×6 FLAT HEAD screw ×2 2. Install the side covers and speakers.
4 Replacement Procedures 4.24 Wireless LAN Antenna/Bluetooth Antenna/Display Cover/Speaker Three ribs for each antenna Main antenna Sub antenna Rib Rib Bluetooth antenna Figure 4-50 Installing the wireless LAN/Bluetooth antenna 6. Install the internal microphone with its hole attached to the guide pin of the back of the display cover. 7. Install the display cover to the display assembly. Pass the LCD cable through the hole from the front of the display assembly toward the bottom.
4.24 Wireless LAN Antenna/Bluetooth Antenna/Display Cover/Speaker 4 Replacement Procedures NOTE: The left speaker cable and acetate tape securing the left speaker cable are installed on the insulator depending on the type of the computer.
4.25 Fluorescent Lamp 4 Replacement Procedure 4 4.25 Fluorescent Lamp This system uses LCD modules from the following suppliers. The procedure for replacing the fluorescent lamp is different for each LCD module. Refer to the appropriate procedure. Type Part No. Supplier Section 14.1-inch (XGA) VF2092P03 TOSHIBA 4.25.1 14.1-inch (SXGA+) VF2074P01 Sharp 4.25.2 NOTE: - When working with an LCD module, always use a flat, grounded table.
4 Replacement Procedure 4.25 Fluorescent Lamp 4.25.1 Replacing the 14.1-inch XGA TOSHIBA Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module. Disassembling the 14.1-inch XGA TOSHIBA Fluorescent Lamp To disassemble the 14.1-inch XGA TOSHIBA fluorescent lamp, follow the steps below and refer to figures 4-51 to 4-55. 1.
4.
4 Replacement Procedure 4.25 Fluorescent Lamp 2. Removing screws 1) Spread out the insulation sheet without detaching from the side of bezel. 2) Remove the screws (left side, right side) in order as shown in the figure below. NOTE: Use a Philips screwdriver with type 0 bit to remove the screws.
4.25 Fluorescent Lamp 4 Replacement Procedure 3. Removing bezel 1) Turn the LCD module face up with the insulation sheets on it. 2) Release the latches of the bezel and frame. (five points on upper side, two points lower side) 3) Remove the double-sided adhesive tape on the bottom of the side of bezel, and remove the bezel. NOTE: 1) Be careful not to damage the TAB when releasing the upper latches.
4 Replacement Procedure 4-90 4.
4.25 Fluorescent Lamp 4 Replacement Procedure 4. Spreading out PCB 1) Spread out the X-PCB and Y-PCB horizontally in order. NOTE: Be careful not to damage the TAB. (1) Spread out the XPCB from the back. (2) Spread out the YPCB from the back.
4 Replacement Procedure 4.25 Fluorescent Lamp 5. Removing PCB-ASSY cell 1) Remove the PCB-ASSY cell from the backlight unit. 2) Remove the double-sided adhesive tape from the back of the cell. NOTE: 1) Remove the tape slowly not to break the cell. The cell and frame are glued by double-sided adhesive tape. 2) Be careful not to remove the light shielding tapes from the upper left and right sides of the cell. PCB-ASSY cell Remove the cell by peeling off the doublesided adhesive tape.
4.
4 Replacement Procedure 4.25 Fluorescent Lamp Assembling the 14.1-inch XGA TOSHIBA Fluorescent Lamp To assemble the 15.0-inch XGA TOSHIBA fluorescent lamp, follow the steps below and refer to figures 4-56 to 4-61. 1. Checking backlight 1) Check the following items shown in the figure below. Fixing tape for sheet Make sure the sheet does not come off the frame.
4.25 Fluorescent Lamp 4 Replacement Procedure 2. Assembling PCB-ASSY cell 1) Remove the release paper of the double-sided tape at the upper of the backlight unit. 2) Light up the backlight. 3) Make sure there is no dust, alien substance or scratch on the backlight. Then make sure there is nothing wrong with the back of cell, install the PCB-ASSY cell to the backlight unit. NOTE: 1) When installing the PCB-ASSY cell, fit it to the left bottom corner of the backlight unit.
4 Replacement Procedure 4.25 Fluorescent Lamp 3. Folding and temporary fixing of TAB/PCB 1) Fold the X-TAB (X-PCB) and Y-TAB (Y-PCB) to the back of backlight unit. 2) Hook the X-PCB on the three latches on the back of frame. NOTE: Be careful not to damage the TAB. (1) Fold the X-PCB to the back. (2) Fold the Y-PCB to the back. The PCB shall be hooked on the three latches of the frame. Insert the FPC into the connector. The PCB shall not be installed over the frame.
4.25 Fluorescent Lamp 4 Replacement Procedure 4. Setting bezel 1) Hook the bezel on the five latches of the frame from the upper side. NOTE: 1) Make sure the GND-CU on the left side and lamp reflector shall be inside the bezel. 2) Be careful not to damage the TAB. 3) Make sure the five latches of the upper side of bezel are hooked on. (1) Install the bezel from the TAB side. Be careful not to damage the TAB. Hook the bezel on the five latches.
4 Replacement Procedure 4.25 Fluorescent Lamp 5. Fixing PCBs and bezel with screws 1) Tighten the left side with the screws in order shown in the figure below. 2) Tighten the right side with the screws in order shown in the figure below. NOTE: 1) Tighten the screws in order. Make sure there is no floating of screw. 2) The screw tightening torque shall be 0.147mN•m (1.5kgf•cm). 3) Use a Philips screwdriver with type 0 bit. (1) Tighten the eight screws.
4.25 Fluorescent Lamp 4 Replacement Procedure 6. Sticking tapes and insulation sheets 1) Stick the Y-PCB insulation sheet and X-PCB insulation sheet in order. 2) Stick the two bezel tapes on the lower side (lamp side). 3) Stick the fixing tape for FL cable. NOTE: Be careful not to damage to the TAB or the pulling-out part of lamp cable when sticking the tapes and insulation sheets. Stick the X-PCB insulation sheet. Stick the Y-PCB insulation sheet. Stick the insulation sheet without any flexure.
4 Replacement Procedure 4.25 Fluorescent Lamp 4.25.2 Replacing the 14.1-inch SXGA+ Sharp Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module. Disassembling the 14.1-inch SXGA+ Sharp Fluorescent Lamp To disassemble the 14.1-inch SXGA+ Sharp fluorescent lamp, follow the steps below and refer to figures4-62 to 4-71. 1.
4.
4 Replacement Procedure 4.25 Fluorescent Lamp 2. Remove the four screws (E) on the sides. (E) Screw tightening torque: 0.1078N•m (1.
4.25 Fluorescent Lamp 4 Replacement Procedure 3. Turn the LCD module face up and release the two latches on the side of lamp.
4 Replacement Procedure 4.25 Fluorescent Lamp 4. Remove the bezel with having the U-shape side of bezel a supporting point, by lifting up the bezel from the side of lamp.
4.25 Fluorescent Lamp 4 Replacement Procedure 5. Turn the bezel face down, and remove the two screws (E) fixing the lamp cover (F) and remove the lamp cover. Then replace the lamp unit (G) with a new one. (E) (F) Lamp cover Screw tightening torque: 0.1078N• m (1.
4 Replacement Procedure 4.25 Fluorescent Lamp 6. Install the lamp cover (F) and secure it with the two screws (E). NOTE: Be careful not to make the lamp cover over the fitting pin. Around the pulling-out part of the lead wire, attach so that the P chassis is outside. (E) Screw tightening torque: 0.1176N•m (1.
4.25 Fluorescent Lamp 4 Replacement Procedure 7. Install the bezel. Make sure the bezel does not cover the guide rib. Hook the U-shape side of bezel first, then engage the two latches at the side of lamp.
4 Replacement Procedure 4.25 Fluorescent Lamp 8. Tighten the four screws (E) on the sides. Make sure the two latches are precisely mated. Screw tightening torque: 0.1176N•m (1.
4.25 Fluorescent Lamp 4 Replacement Procedure 9. Install the protection cover S (A), protection cover G (B), aluminum tape (C) and fixing tape for lead wire (D). Use new parts. • Stick the protection covers in the order of (B), (A) to the standard line for fitting pin. • Stick the aluminum tape (C) following the sticking standards. Long sides: Stick to the mark-off line of the lamp cover on the back of bezel. Short sides: Stick to the edge of lamp cover.
4 Replacement Procedure 4.25 Fluorescent Lamp 10. Perform appearance inspection after assembling the module. Check mating Check mating Check screw Check sticking Check sticking Check there is no scratch. Check screw Check there is no deformation.
4.25 Fluorescent Lamp 4 Replacement Procedure Assembling the 14.1-inch SXGA+ Sharp Fluorescent Lamp To assemble the 14.1-inch Sharp SXGA+ fluorescent lamp, follow the steps below and refer to figures 4-62 to 4-71.
Appendices
Appendices App-ii
Appendices Appendix Contents Appendix A Handling the LCD Module..............................................................................A-1 Appendix B Board Layout...................................................................................................B-1 B.1 System Board (FGFSY*) Front View...........................................................................1 B.2 System Board (FGFSY*) Back View ...........................................................................3 B.
Appendices C.19 PJ2033 USB 0 interface connector (4-pin)........................................................... C-20 C.20 PJ2034 USB 1 interface connector (4-pin)........................................................... C-20 C.21 PJ1004 USB baord interface connector (6-pin).................................................... C-20 C.22 PJ4900 Bluetooth interface connector (20-pin)..................................................... C-21 C.23 PJ1100 Sound board interface connector (30-pin) ..
Appendices F.2 Serial Port Wraparound Connector...........................................................................F-1 F.3 LAN Loopback Connector ......................................................................................F-2 Appendix G BIOS Rewrite Procedures ............................................................................. G-1 Appendix H EC/KBC Rewrite Procedures ........................................................................ H-1 Appendix I Reliability...........
Appendices Figures Figure B-1 System board (FGFSY*) layout (front).....................................................................1 Figure B-2 System board (FGFSY*) layout (back) ....................................................................3 Figure B-3 Sound board (FGFSD*) layout (front/back)..............................................................5 Figure B-4 LED board (FGFLE*) layout (front/back).................................................................
Appendices Tables Table B-1 System board (FGFSY*) ICs and connectors (front) .................................................2 Table B-2 System board (FGFSY*) ICs and connectors (back).................................................4 Table B-3 Sound board (FGFSD*) ICs and connectors (front/back) ..........................................5 Table B-4 LED board (FGFLE*) connectors (front)...................................................................
Appendices TableC-21 USB board interface connector (6-pin) .............................................................. C-20 TableC-22 Bluetooth interface connector (20-pin)............................................................... C-21 TableC-23 Sound board interface connector (30-pin).......................................................... C-21 TableC-24 IEEE1394 interface connector (4-pin)................................................................
Appendix A Handling the LCD Module Appendix A Appendices P Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2. For 14.
Appendices Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4.
Appendix A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
Appendices Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage.
Appendix A Handling the LCD Module Appendices 9. Do not disassemble the LCD module. Disassembly can cause malfunctions. 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxime). These materials can release gas that can damage the panel’s polarization.
Appendices A-6 Appendix A Handling the LCD Module TECRA M1 Maintenance Manual (960-436)
Appendix B Board Layout Appendix B B.
Appendices Appendix B Board Layout Table B-1 System board (F GFSY*) ICs and connectors (front) B-2 Mark Number Name (A) PJ4900 Bluetooth interface connector (B) PJ1005 RTC Battery connector (C) PJ1101 LED board connector (D) IC2000 EC/KBC (E) PJ123 Keyboard interface connector (F) PJ2003 Dual Point interface connector (G) PJ1004 USB 2 interface connector (H) IC1500 ICH4-M (I) PJ2035 SC board interface connector (J) PJ2015 Mini PCI interface connector (K) PJ1100 Sound b
Appendix B Board Layout B.
Appendices Appendix B Board Layout Table B-2 System board (F GFSY*) ICs and connectors (back) B-4 Mark Number Name (A) PJ5501 TV controller connector (B) PJ5523 CRT interface connector (C) PJ2019 Serial interface connector (D) PJ2007 Docking interface connector (E) PJ2020 Parallel interface connector (F) IS1000 CPU (G) PJ1003 Modem 2 interface connector (H) PJ4500 LAN interface connector (I) PJ651 IEEE1394 interface connector (J) PJ2033 USB 0 interface connector (K) PJ2
Appendix B Board Layout B.
Appendices (F) B-6 Appendix B Board Layout VR3000 Volume TECRA M1 Maintenance Manual (960-436)
Appendix B Board Layout B.
Appendices Appendix B Board Layout B.
Appendix B Board Layout B.
Apx.C Pin Assignments Appendices Appendix C Appendix C Pin Assignments System Board C.1 PJ1001 Memory 1 connector (200-pin) Table C-1 Memory 1 connector (200-pin) (1/3) Pin No. Signal Name I/O Pin No.
Appendices 61 Apx.C Pin Assignments SDQS3R-B2P I/O 62 GND - Table C-1 Memory 1 connector (200pin) (2/3) Pin No. C-2 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices 133 SDQS4R-B2P I/O 134 GND 135 SDQ39R-B2P I/O 136 SDQ33R-B2P 137 GND - 138 GND TECRA M1 Maintenance Manual (960-436) I/O - C-3
Appendices Apx.C Pin Assignments Table C-1 Memory 1 connector (200-pin) (3/3) Pin No. C-4 Signal Name I/O Pin No.
Appendix C Pin Assignments C.2 Appendices PJ1002 Memory 2 connector (200-pin) Table C-2 Memory 2 connector (200-pin) (1/3) Pin No. Signal Name I/O Pin No.
Appendices Apx.C Pin Assignments Table C-2 Memory 2 connector (200-pin) (2/3) Pin No. C-6 Signal Name I/O Pin No.
Appendix C Pin Assignments 135 SDQ39R-B2P 137 GND TECRA M1 Maintenance Manual (960-436) Appendices I/O 136 SDQ33R-B2P - 138 GND I/O - C-7
Appendices Apx.C Pin Assignments Table C-2 Memory 2 connector (200-pin) (3/3) Pin No. C-8 Signal Name I/O Pin No.
Appendix C Pin Assignments C.3 Appendices PJ1509 HDD interface connector (44-pin) Table C-3 HDD interface connector (44-pin) Pin No. Signal Name I/O Pin No.
Appendices C.4 Apx.C Pin Assignments PJ1511 Select Bay interface connector (72-pin) Table C-4 Select Bay interface connector (72-pin) Pin No. C-10 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices 69 GND - 70 GND - 71 GND - 72 PVBAT2 I C.5 PJ1512 PC-Card interface connector (150-pin) Table C-5 PC-Card interface connector (150-pin) (1/2) Pin No. Signal Name I/O Pin No.
Appendices C-12 Apx.
Appendix C Pin Assignments Appendices Table C-5 PC-Card interface connector (150-pin) (2/2) Pin No. Signal Name I/O Pin No.
Appendices Apx.C Pin Assignments 147 ACCLKR-BYN 149 GND C.6 I/O 148 ACCD2-B3N O - 150 GND - PJ1514 SD Card interface connector (12-pin) Table C-6 SD Card interface connector (12-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 2 SDCMD-B3P I/O I/O 1 SDAT3 -B3P 3 GND - 4 SD-P3V - 5 SDCLK -B3P I 6 GND - 7 SDAT0 -B3P I/O 8 SDAT1-B3P I/O 9 SDAT2 -B3P I/O 10 SDCD-B3N O 11 SDWP-B3P O 12 GND - C.
Appendix C Pin Assignments C.8 Appendices PJ2003 PAD interface connector (8-pin) Table C-8 PAD interface connector (8-pin) Pin No. Signal Name 1 P5V 3 IPDCLK -P5P 5 7 C.9 I/O Pin No. Signal Name I/O - 2 IPDDAT-P5P I/O 4 GND I/O - SP-GND - 6 SPY-PXP O SPX-PXP O 8 SP-P5V - PJ1101 LED board interface connector (14-pin) Table C-9 LED board interface connector (14-pin) Pin No. Signal Name I/O Pin No.
Appendices 3 C.12 Apx.C Pin Assignments NC - PJ2027 Speaker (Left) connector (2 -pin) Table C-12 Speaker (Left) connector (2-pin) Pin No. 1 C-16 Signal Name SPOTL-PXP I/O Pin No.
Appendix C Pin Assignments C.13 Appendices PJ2007 Docking interface connector (240-pin) Table C-13 Docking interface connector (240-pin) (1/4) Pin No. Signal Name I/O Pin No.
Appendices Apx.C Pin Assignments 69 DILSON-E3P O 70 NC 71 GND - 72 DDCSDA -P5P 73 GND - 74 GND I/O - Table C-13 Docking interface connector (240-pin) (2/4) Pin No. C-18 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices 141 DCD-PYP O 142 DSR-PYP O 143 TXD-PYN I 144 RING-BYP O 145 PE-P5P O 146 PDB07-P5P I/O 147 PDB06-P5P I/O 148 GND 149 GND - 150 PDB04-P5P I/O 151 PDB01-P5P I/O 152 PDB02-P5P I/O TECRA M1 Maintenance Manual (960-436) - C-19
Appendices Apx.C Pin Assignments Table C-13 Docking interface connector (240-pin) (3/4) Pin No. C-20 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices 225 GND - 226 NC - 227 NC - 228 NC - 229 GND - 230 NC - TECRA M1 Maintenance Manual (960-436) C-21
Appendices Apx.C Pin Assignments Table C-13 Docking interface connector (240-pin) (4/4) Pin No. Signal Name I/O Pin No. Signal Name I/O 231 NC - 232 NC - 233 GND - 234 ACT-E3N O 235 LINK-E3N O 236 DOCDT2-S3N O 237 Not Mount - 238 Not Mount - 239 BIDBP-EXP O 240 BIDBN-EXN O C.14 PJ2015 Mini PCI interface connector (124-pin) Table C-14 Mini PCI interface connector (124-pin) (1/2) Pin No. C-22 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices 51 AD21-P3P I/O 52 AD22-P3P I/O 53 AD19-P3P I/O 54 AD20-P3P I/O 55 GND - 56 PAR-P3P I/O Table C-14 Mini PCI interface connector (124-pin) (2/2) Pin No. Signal Name I/O Pin No.
Appendices 123 C-24 Apx.
Appendix C Pin Assignments C.15 Appendices PJ2017 MDC1 interface connector (30-pin) Table C-15 MDC1 interface connector (30-pin) Pin No. Signal Name I/O Pin No.
Appendices C.18 Apx.C Pin Assignments PJ2020 Parallel interface connector (25-pin) Table C-18 Parallel interface connector (25-pin) Pin No. Signal Name I/O Pin No.
Appendix C Pin Assignments 3 USBP4-E3N 5 GND C.22 Appendices I/O 4 USBP4-E3P - 6 GND I/O - PJ4900 Bluetooth interface connector (20-pin) Table C-22 Bluetooth interface connector (20-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 GND - 2 NC - 3 BTMDL-P3N O 4 NC - 5 NC - 6 NC - 7 NC - 8 BTRST-S3P I 9 NC - 10 NC - 11 GND - 12 NC - 13 BTIFOF-S3N O 14 NC - 15 NC - 16 USBP5-E3P 17 USBP5-E3N I/O 18 NC - 10 NC - 20 BT-P3V - C.
Appendices C.24 Apx.C Pin Assignments PJ651 IEEE 1394 interface connector Table C-24 IEEE 1394 interface connector Pin No. Signal Name I/O Pin No. Signal Name I/O 1 TPB0-P3N I/O 2 TPB0-P3P I/O 3 TPA0-P3N I/O 4 TPA0-P3P I/O C.25 PJ4500 LAN interface connector (14-pin) Table C-25 LAN interface connector (14-pin) Pin No. Signal Name I/O Pin No.
Appendix C Pin Assignments C.28 Appendices PJ1005 RTC Battery connector (2-pin) Table C-28 RTC Battery connector (2-pin) Pin No. 1 C.29 Signal Name ZS-PWCHKF I/O Pin No. - 2 Signal Name GND I/O - PJ8770 FAN interface connector (3-pin) Table C-29 FAN interface connector (3-pin) Pin No. Signal Name I/O Pin No. 2 1 P5V - 3 FANG-P3P O C.30 Signal Name GND I/O - PJ5500 LCD interface connector (41-pin) Table C-30 LCD interface connector (41-pin) Pin No. Signal Name I/O Pin No.
Appendices 41 C-30 Apx.
Appendix C Pin Assignments C.31 Appendices PJ5523 CRT interface connector (15-pin) Table C-31 CRT interface connector (15-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 RED-PXP O 2 GREEN-PXP O 3 BLUE-PXP O 4 NC - 5 GND - 6 GND - 7 GND - 8 GND - 9 P5V - 10 GND - 11 NC - 12 CRTSCL-P5P I/O 13 SHSYNC-P5P O 14 SVSYNC-P5P O 15 CRTSDA -P5P I/O C.32 PJ5501 TV connector (4-pin) Table C-32 TV connector (4-pin) Pin No. Signal Name I/O Pin No.
Appendices Apx.C Pin Assignments Sound Board C.33 PJ3000 System board interface connector (30-pin) Table C-33 System board interface connector (30-pin) Pin No. Signal Name I/O Pin No.
Appendix C Pin Assignments C.36 Appendices PJ3003 Headphone connector (6-pin) Table C-36 Headphone connector (6-pin) Pin No. Signal Name I/O Pin No.
Appendices Apx.C Pin Assignments LED Board C.37 PJ3100 System board interface connector (14-pin) Table C-37 System board interface connector (14-pin) Pin No. C-34 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices Sensor/Switch Board C.38 PJ3200 System board interface connector (10-pin) Table C-38 System board interface connector (10-pin) Pin No. Signal Name I/O Pin No.
Appendices Apx.C Pin Assignments USB Board C.39 PJ3300 System board interface connector (6-pin) Table C-39 System board interface connector (6-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 GND - 2 GND - 3 Not Mount - 4 Not Mount - 5 GND - 6 GND - C.40 PJ3301 USB port 2 connector (4-pin) Table C-40 USB port 2 connector (4-pin) Pin No. C-36 Signal Name I/O Pin No.
Appendix C Pin Assignments TECRA M1 Maintenance Manual (960-436) Appendices C-37
Appendix D Keyboard Scan/Character Codes Appendix D Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap Keytop No.
Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) Cap No.
Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (3/4) Cap No.
Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap Code set 1 Keytop No. Make Code se t 2 Break Make Note Break 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 126 Pause *7 *7 *7 *7 *7 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Notes: 1. 2. 3. 4. 5. 6. 7. D-4 * * * * * * * Scan codes differ by mode.
Appendix D Keyboard Scan/Character Codes Table D-2 Scan codes with left Shift key Cap Key No.
Appendix D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
Appendix D Keyboard Scan/Character Codes Table D-5 Scan codes in overlay mode Cap Code set 1 Keytop No.
Appendix D Keyboard Scan/Character Codes Table D-7 No.126 key scan code Key top Shift Code set 1 Code set 2 Make Make Pause Common* E1 1D 45 E1 Ctrl* E0 46 E0 C6 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E 14 F0 77 *: This key generates only make codes.
Appendix E Key Layout Appendices Appendix E Appendix E E.1 Key Layout United Kingdom (UK) Keyboard Figure E-1 UK keyboard E.
Appendices E-2 Appendix E Key Layout TECRA M1 Maintenance Manual (960-436)
Appendix F Wiring Diagrams Appendices Appendix F Appendix F F.1 Wiring Diagrams Parallel Port Wraparound Connector -SELECT -PINT Figure F-1 Parallel port wraparound connector F.
Appendices F.
Appendix G BIOS Rewrite Procedures Appendices Appendix G Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: q BIOS/EC/KBC rewriting disk for the computer that has renewed BIOS data. Rewriting the BIOS 1. Set the system to boot mode. 2. Turn off the power to the computer. 3. Remove the external cable and PC card. 4.
Appendices Appendix G BIOS Rewrite Procedures G-2 TECRA M1 Maintenance Manual (960-436)
Appendix H EC/KBC Rewrite Procedures Appendices Appendix H Appendix H EC/KBC Rewrite Procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. Tools To rewrite the EC/KBC, you need the following tool: q BIOS/EC/KBC rewriting disk for the computer Rewriting the EC/KBC NOTE: 1. Rewrite the EC/KBS only when instructed by a diagnostic disk release notice. 2. Connect the AC adaptor to the computer when you rewrite the EC/KBC. 3.
Appendices H-2 Appendix H EC/KBC Rewrite Procedures TECRA M1 Maintenance Manual (960-436)
Appendix I Reliability Appendices Appendix I Appendix I Reliability The following table shows MTBF (Mean Time Between Failures).
Appendices I-2 Appendix I Reliability TECRA M1 Maintenance Manual (960-436)
