Toshiba Personal Computer TECRA M3 Maintenance Manual TOSHIBA CORPORATION File Number 960-507
Copyright © 2005 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein. Toshiba Personal Computer TECRA M3 Maintenance Manual First edition January 2005 Disclaimer The information presented in this manual has been reviewed and validated for accuracy.
Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer TECRA M3. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field. SAFETY PRECAUTIONS Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the TECRA M3 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Table of Contents Chapter 1 Hardware Overview 1.1 Features ...................................................................................................................... 1-1 1.2 System Unit Block Diagram ...................................................................................... 1-8 1.3 3.5-inch Floppy Disk Drive (USB External) ........................................................... 1-16 1.4 2.5-inch Hard Disk Drive.............................................................
2.13 Wireless LAN Troubleshooting............................................................................... 2-50 2.14 Sound Troubleshooting............................................................................................ 2-53 2.15 SD Card Slot Troubleshooting................................................................................. 2-56 2.16 Express Card Slot Troubleshooting .........................................................................
3.26 Wireless LAN Test Program (Intel-made Calexico2 a /g)....................................... 3-57 3.27 Wireless LAN Test Program (Intel-made Calexico2 b/g) ....................................... 3-62 3.28 Wireless LAN Test Program (Askey-made Atheros) .............................................. 3-66 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program .................................................. 3-70 3.30 Sound Test program...................................................................
4.25 Hinge........................................................................................................................ 4-80 4.26 Fluorescent Lamp..................................................................................................... 4-85 Appendices Appendix A Handling the LCD Module ........................................................................... A-1 Appendix B Board Layout ...........................................................................................
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Chapter 1 Hardware Overview
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1 Hardware Overview Chapter 1 Contents 1.1 Features.......................................................................................................................1-1 1.2 System Unit Block Diagram.......................................................................................1-8 1.3 3.5-inch Floppy Disk Drive (USB External)............................................................1-16 1.4 2.5-inch Hard Disk Drive .....................................................................
1 Hardware Overview Figures Figure 1-1 Front of the computer .....................................................................................1-6 Figure 1-2 System unit configuration...............................................................................1-7 Figure 1-3 System unit block diagram .............................................................................1-8 Figure 1-4 3.5-inch FDD (USB External) ......................................................................
1.1 Features 1 1 Hardware Overview Features 1.1 Features The Toshiba TECRA M3 Personal Computer uses extensive Large Scale Integration (LSI), and Complementary Metal-Oxide Semiconductor (CMOS) technology extensively to provide compact size, minimum weight, low power usage and high reliability. This computer incorporates the following features. Microprocessor The TECRA M3 computer is equipped with an Intel Dothan Processor.
1 Hardware Overview 1.1 Features USB FDD A 3.5-inch USB FDD accommodates 2HD (1.44MB) or 2DD (720KB) disks. Slim Select Bay An Optical drive, 2nd HDD or 2nd Battery can be installed in the Slim Select Bay. Optical Drive A CD-ROM drive, DVD-ROM drive, CD-RW/DVD-ROM drive, DVD±R/±RW drive or DVD super Multi drive can be installed in the Slim Select Bay. Display The PC comes in with one of the following two types: • 14.1” XGA-TFT color display, resolution 1,024×768 • 14.
1.1 Features 1 Hardware Overview Universal Serial Bus (USB2.0) Two USB ports are provided. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported. IEEE 1394 port The computer comes with one IEEE 1394 port. It enables high-speed data transfer directly from external devices such as digital video cameras. Parallel port The parallel port enables connection of parallel printer or other parallel devices.
1 Hardware Overview 1.1 Features Docking interface port The docking interface port enables connection of an optional Advanced Port Replicator III.
1.1 Features 1 Hardware Overview Video-out jack The video jack enables to transfer NTSC or PAL data to external devices connected with S-Video cable. Internal modem The computer contains a MDC, enabling data and fax communication. It supports ITU-T V.90 (V.92). The transfer rates are 56 Kbps for data reception, 33.6 Kbps for data transmission, and 14,400 bps for fax transmission. However, the actual speed depends on the line quality. The RJ11 modem jack is used to accommodate a telephone line.
1 Hardware Overview 1.1 Features The front of the computer is shown in figure 1-1.
1.1 Features 1 Hardware Overview The system unit configuration is shown in figure 1-2.
1 Hardware Overview 1.2 1.2 System Unit Block Diagram System Unit Block Diagram Figure 1-3 is a block diagram of the system unit.
1.2 System Unit Block Diagram 1 Hardware Overview The system unit is composed of the following major components: Processor • Intel Dothan Processor: 1.6BGHz/1.73GHz/1.86GHz/2.0AGHz/2.13GHz – Processor core speed: 1.6GHz/1.73GHz/1.86GHz/2.0GHz/2.13GHz – Processor bus speed: 533MHz – Integrated L1 cache memory: 32KB instruction cache and 32KB write-back data cache – Integrated L2 cache memory of 2MB – Integrated NDP – 478-pin Micro FC-PGA package Memory Two memory slots are provided.
1 Hardware Overview 1.2 System Unit Block Diagram Intel GMCH (North Bridge) • One Intel Alviso-PM is used. • Features: – Supports Dothan Processor System Bus – System Memory Interface – Memory Control: supports DDR333, DDR2-400/DDR2-533 2Gbmax. – Graphics I/F: x16 PCI Express Based Graphics I/F – DMI(Direct Media Interface) – 1,257-ball, 40.0×37.5×2.6mm, FC-BGA package Intel ICH6-M (South Bridge) • One Intel UICH6MA is used.
1.2 System Unit Block Diagram 1 Hardware Overview Firmware Hub (FWH) • One STMicro M50FW080N is used. Card controller (TI PCI7411ZHK) − PCI I/F − CardBus / Ultra media Controller (1 socket) − SD/MMC, Memory Stick, XD Card Controller − 1394 Controller (2 ports) − 288-ball, 16×16×1.4mm, BGA Package VGA Controller One NVIDIA MEP43L chip is used. The video controller incorporates graphics accelerator and video accelerator.
1 Hardware Overview 1.2 System Unit Block Diagram EC/KBC (Embedded Controller/Keyboard Controller) • One Mitsubishi M306KA micon chip functions as both EC and KBC.
1.2 System Unit Block Diagram 1 Hardware Overview Clock Generator • One ICS 954204BGFT is used. • This device generates the system clock. Modem Controller • One Askey made MDC is used. • This controller has the following functions: – One RJ11 port – Digital line protection support – Ring wake up support – Analog audio support – AC97 interface – The following communication codes are supported Data: V.90 (56K bps) data communication control V.92 (56K bps) data communication control V.34 (33.
1 Hardware Overview 1.2 System Unit Block Diagram Internal LAN Controller • One internal chip (Marvell made 88E8053 or 88E8036) is used. • This controller has the following functions: – 10/100M-Ethernet (88E8036) – Gigabit-Ethernet chip (88E8053) – WOL support – Magic Packet support – LED support Wireless LAN • One Mini PCI card for wireless LAN with Type III card bus controller. Super I/O • One LPC47N217 chip is used.
1.2 System Unit Block Diagram 1 Hardware Overview Other major chips • Clock Generator: One 954204BGFTCG chip is used.
1 Hardware Overview 1.3 1.3 3.5-inch Floppy Disk Drive (USB External) 3.5-inch Floppy Disk Drive (USB External) The 3.5-inch FDD is a thin, high-performance reliable drive that supports 720KB (formatted) 2DD and 1.44MB (formatted) 2HD disks. The FDD is shown in figure 1-4. The specifications for the FDD are listed in Table 1-1. Figure 1-4 3.5-inch FDD (USB External) Table 1-1 3.
1.4 2.5-inch Hard Disk Drive 1.4 1 Hardware Overview 2.5-inch Hard Disk Drive The removable HDD is a random access non-volatile storage device. It has a non-removable 2.5-inch magnetic disk and mini-Winchester type magnetic heads. The computer supports a 40GB, 60GB, 80GB or 100GB. The HDD is shown in figure 1-5. Specifications are listed in Table 1-2. Figure 1-5 2.5-inch HDD Table 1-2 2.
1 Hardware Overview 1.4 2.5-inch Hard Disk Drive Table 1-2 2.5-inch HDD specifications (2/7) Specifications Items TOSHIBA HDD2193VZKO* HITACHI GST G8BC0001N410 TOSHIBA HDD2193VZE02 69.85 9.5 100 97 max. 69.85±0.25 9.5±0.2 100.2±0.25 102 max. 69.85 9.5 100 97 max.
1.4 2.5-inch Hard Disk Drive 1 Hardware Overview Table 1-2 2.5-inch HDD specifications (4/7) Specifications Items Outline dimensions TOSHIBA HDD2194VZKO* TOSHIBA HDD2194VZE02 HITACHI GST G8BC0001N610 69.85 9.5 69.85 9.5 100 69.85±0.25 9.5±0.2 100.2±0.25 95 102 max. Width (mm) Height (mm) Depth (mm) Weight (g) 100±0.25 102 max. Storage size (formatted) 60GB 60GB 60GB Speed (RPM) 5,400 5,400 5,400 258-394 202.9-373.
1 Hardware Overview 1.4 2.5-inch Hard Disk Drive Table 1-2 2.5-inch HDD specifications (6/7) Specifications Items TOSHIBA HDD2191VZKO* TOSHIBA HDD2191VZE02 HITACHI GST G8BC0001NA10 69.85 9.5 100 95 69.85 9.5 100.2 102 max. 69.85 9.5 100.2 102 max. Storage size (formatted) 80GB 80GB 100GB Speed (RPM) 5,400 5,400 5,400 154.3-298.0 154.3-298.
1.5 CD-ROM Drive 1.5 1 Hardware Overview CD-ROM Drive The CD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CDs. They provide high-performance, 24-speed plays on a maximum (reads 3,600 KB per second). The CD-ROM drive is shown in figure 1-6. Specifications are listed in Table 1-3. Figure 1-6 CD-ROM drive Table 1-3 CD-ROM drive specifications Item TEAC G8CC00005410 ATAPI Burst (Mbytes/s) 33.
1 Hardware Overview 1.6 1.6 DVD-ROM Drive DVD-ROM Drive The DVD-ROM drive accommodates either 12cm (4.72-inch) or 8cm (3.15-inch) DVDs. This drive plays DVDs at maximum 8-speed and reads CDs at maximum 24-speed. The specifications for the DVD-ROM drive are described in table 1-4. Table 1-4 DVD-ROM drive specifications (1/3) Item ATAPI Burst (Mbytes/s) Access time (ms) Average Random Access Rotation speed (rpm) TSST G8CC0000R410 DVD-ROM mode 33.3 (U-DMA Transfer mode 2) 110 (Typ.
1.6 DVD-ROM Drive 1 Hardware Overview Table 1-4 DVD-ROM drive specifications (3/3) TSST SD-C2712 Item DVD-ROM mode ATAPI Burst (Mbytes/s) 33.3 (U-DMA Transfer mode 2) Access time (ms) Average Random Access 110 Rotation speed (rpm) 110 4,670Max Data Buffer Capacity (Kbytes) Supported Format CD-ROM mode 5,100Max 256 DVD-ROM (DVD-5, DVD-9, DVD-10, DVD-18), DVD-R (Ver.1.0, Ver.2.1), DVD-RW (Ver. 1.0, Ver. 1.1), DVD+R, DVD+RW, DVD-RAM Ver. 2.
1 Hardware Overview 1.7 1.7 CD-RW/DVD-ROM Drive CD-RW/DVD-ROM Drive The CD-RW/DVD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CDs, CD-R/RW and DVDs. It is a high-performance drive that reads CD-ROM at maximum 24-speed, DVD-ROM at maximum 8-speed and writes CD-R at maximum 24-speed, CD-RW at maximum 4-speed. The specifications are listed in Table 1-5.
1.7 CD-RW/DVD-ROM Drive 1 Hardware Overview Table 1-5 CD-RW/DVD-ROM drive specifications (2/2) Specifications Item TEAC G8CC0001Y411 ATAPI Burst (Mbytes/s) Average access time (msec) 33.
1 Hardware Overview 1.8 1.8 DVD±R/±RW Drive DVD±R/±RW Drive This full size DVD±R/±RW drive module lets you record data to rewritable CD/DVDs as well as run either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD/DVD without using an adaptor. It is a high-performance drive. It reads CD-ROM and CD-R/RW at maximum 24-speed, DVD at maximum 8-speed, DVD-R/-RW and DVD+R/+RW at maximum 8-speed. It writes CD-R/-RW at maximum 24-speed, DVD-R/+R at maximum 8-speed and DVDRW/+RW at 4-speed.
1.9 DVD±R/±RW/-RAM (DVD-Super Multi) Drive 1.9 1 Hardware Overview DVD±R/±RW/-RAM (DVD-Super Multi) Drive This drive is a combination of DVD-ROM and DVD±R/±RW/-RAM Drive. It is full-size and runs either 12cm (4.72-inch) or 8cm (3.15-inch) DVD/CDs without an adaptor. It reads DVDs at maximum 8-speed and CDs at maximum 24-speed. It also writes CD-R at maximum 16-speed, CD-RW at maximum 8-speed, DVD-R at maximum 4-speed, DVD-RW at maximum 2-speed, DVD+R at maximum 2.4-speed, DVD +RW at maximum 2.
1 Hardware Overview 1.9 DVD±R/±RW/-RAM (DVD-Super Multi) Drive Table 1-7 DVD Super Multi drive specifications (2/2) Item ATAPI Burst (Mbytes/s) MATUSHITA G8CC00021410 33.3 (Ultra DMA mode 2) 16.6 (PIO Mode 4, Multi word DMA mode 2) Average access time (ms) DVD-ROM CD-ROM 180 150 Data Buffer Capacity (MB) 2 Supported Format CD: CD-DA, CD-ROM, CD-ROM XA, Photo CD, CD-Extra (CD+), CD-TEXT DVD:DVD-R, DVD-RW(Ver. 1.1) DVD-Video, DVD+R, DVD-RW, DVD-RAM(2.6GB/4.
1.10 Keyboard 1 Hardware Overview 1.10 Keyboard The keyboard is mounted 85(US)/86(UK) keys that consist of character key and control key, and in conformity with JIS. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-7 is a view of the keyboard. See Appendix E about a layout of the keyboard.
1 Hardware Overview 1.11 TFT Color Display 1.11 TFT Color Display The TFT color display consists of 14.1-inch XGA/SXGA+ LCD module and FL inverter board. 1.11.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 262,144 colors with 1,024 x 768 or 1,400 x 1,050 resolution. The nVIDIA MEP43L can control both internal and external XGA- or SXGA+- support displays simultaneously.
1.11 TFT Color Display 1 Hardware Overview Table 1-8 LCD module specifications (3/4) Specifications Item 14.1-inch XGA+ TFT (G33C00025110) Number of Dots 1,024 (W) x 768 (H) Dot spacing (mm) 0.279 (H) x 0.279 (V) Display range (mm) 228 (H) x 299 (V) Table 1-8 LCD module specifications (4/4) Item Specifications 14.1-inch SXGA+ TFT (G33C00022110) Number of Dots 1,400 (W) x 1,050 (H) Dot spacing (mm) 0.204 (H) x 0.204 (V) Display range (mm) 285.6 (H) x 214.
1 Hardware Overview 1.11.2 1.11 TFT Color Display FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module FL. Table 1-9 lists the FL inverter board specifications. Table 1-9 FL inverter board specifications Item Specifications G71C00011121 Input Output 1-32 G71C00011110 Voltage (V) DC 5 Power (W) 7 Voltage (V) 750 Current (mA) 6.
1.12 Power Supply 1 Hardware Overview 1.12 Power Supply The power supply supplies many different voltages to the system board and performs the following functions: 1. Checks power input to determine: • • Whether the AC adaptor is connected to the computer. Whether the battery pack is installed and supplying power. 2.
1 Hardware Overview 1.12 Power Supply Table 1-10 Power supply output rating Name Voltage (V) PPV 0.748-1.308 PTV 1.05 CPU, MCH, ICH6-M 1R5-P1V 1.5 CPU, MCH, ICH6-M, Express Card 1R8-B1V 1.8 MCH, DDR2-SDRAM 2R5-P2V 2.5 MCH, CH6-M MR0R9-B0V 0.9 MCH, DDR2-SDRAM 0R9-P0V 0.9 DDR2-SDRAM 1R5-S1V 1.5 ICH4-M P3V 3.3 Clock Generator, Thermal Sensor, SDRAM(SPD), ICH6M, SATA Bridge, PC CARD Cont., Mini-PCI, TPM, Express Card, FWH, AD1981B, Super I/O, EC/KBC FIR, GPU, LCD E3V 3.
1.13 Batteries 1 Hardware Overview 1.13 Batteries The computer has three types of batteries as follows: Main battery pack RTC battery Secondary battery pack (optional slim select bay module) The battery specifications are listed in Table 1-11. Table 1-11 Battery specifications Battery name Material Output voltage Main battery Lithium-Ion 10.8 V 2nd battery Lithium-Ion 10.8 V 3,600 mAh NiMH 2.4 V 16 mAh RTC battery 1.13.
1 Hardware Overview 1.13.2 1.13 Batteries Battery Charging Control Battery charging is controlled by a power supply microprocessor. The microprocessor controls whether the charge is on or off and detects a full charge when the AC adaptor and battery are attached to the computer. The system charges the battery. Battery Charge When the AC adaptor is attached, there are two types of charge: When the system is powered off and when the system is powered on.
1.13 Batteries 1.13.3 1 Hardware Overview RTC battery The RTC battery provides power to keep the current date, time and other setup information in memory while the computer is turned off. Table 1-13 lists the charging time and data preservation period of the RTC battery.
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Chapter 2 Troubleshooting Procedures
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2 Troubleshooting Procedures Chapter 2 Contents 2.1 Troubleshooting..........................................................................................................2-1 2.2 Troubleshooting Flowchart ........................................................................................2-2 2.3 Power Supply Troubleshooting ..................................................................................2-6 2.4 2.5 2.6 2.7 Procedure 1 Icons in the LCD Check..............................
2 Troubleshooting Procedures 2.8 2.9 2.10 2.11 2.12 2.13 2.14 2.15 2.16 2-iv Display Troubleshooting ..........................................................................................2-40 Procedure 1 External Monitor Check.............................................................2-40 Procedure 2 Diagnostic Test Program Execution Check ...............................2-40 Procedure 3 Connector Check and Cable Check ...........................................
2 Troubleshooting Procedures Figures Figure 2-1 Troubleshooting flowchart ..................................................................................2-3 Figure 2-2 A set of tool for debug port test.........................................................................2-19 Tables Table 2-1 Battery icon..........................................................................................................2-6 Table 2-2 DC IN icon......................................................................
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2.1 Troubleshooting 2 Troubleshooting Procedures 2 2.1 Troubleshooting Chapter 2 describes how to determine if a Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. The FRUs covered are: 1. 2. 3. 4. 5. Power Supply System Board USB Floppy Disk Drive Hard Disk Drive Keyboard/Touch pad 6. 7. 8. 9. 10. Display Optical Drive Modem LAN Bluetooth 11. 12. 13. 14.
2 Troubleshooting Procedures 2.2 2.2 Troubleshooting Flowchart Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which FRU malfunctions. Before going through the flowchart steps, check the following: Ask the user if a password is registered and, if it is, ask him or her to enter the password. Make sure that Toshiba Windows® XP is installed on the hard disk. Non-Toshiba operating systems can cause the computer malfunction.
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2 Troubleshooting Procedures 2.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures If the diagnostics program cannot detect an error, the problem may be intermittent. The Running Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error, then perform the appropriate troubleshooting procedures as follows: 1.
2 Troubleshooting Procedures 2.3 2.3 Power Supply Troubleshooting Power Supply Troubleshooting The power supply controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2.3 Power Supply Troubleshooting Procedure 2 2 Troubleshooting Procedures Error Code Check If the power supply microprocessor detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Table 2-3 Error code Error code 1*h Where Error occurs Adaptor AC Adaptor is not connected. (AC Adaptor, DS) Error code begins with : 0x10 Error code ends with 2*h 1st battery : 0x1F The 1st Battery is not connected.
2 Troubleshooting Procedures Check 1 2.3 Power Supply Troubleshooting Compare the patterns in the hexadecimal error code to the tables below. DC IN Error code Meaning 10h AC Adaptor output voltage is over 16.5V. 11h Common Dock voltage is over 16.5V. 12h Current from the DC power supply is over 7.00A. 13h Current from the DC power supply is over 0.5A when there is no load. 14h Current sensing IC is not normal. 1st Battery Error code Meaning 20h Overvoltage is detected.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures S3V output (P60) Error code Meaning 40h S3V voltage is 2.81V or less when the computer is powered on/off. 45h S3V voltage is 2.81V or less when the computer is booting up. (CV support) 1R5-C1V output (P61) Error code Meaning 50h 1R5-C1V voltage is over 1. 80V when the computer is powered on/off. 51h 1R5-C1V voltage is 1.275V or less when the computer is powered on. 52h 1R5-C1V voltage is 1.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting E5V output (P64:CH0) Error code Meaning 80h E5V voltage is over 6.00V when the computer is powered on/off. 81h E5V voltage is 4.50V or less when the computer is powered on. 82h E5V voltage is 4.50V or less when the computer is booting up. 83h E5V voltage is 4.50V or more when the computer is powered off. 84h E5V voltage is 4.50V or less when the computer is suspended.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures E3V output (P64:CH1) Error code Meaning C0h E3V voltage is over 3.96V when the computer is powered on/off. C1h E3V voltage is 2.81V or less when the computer is powered on. C2h E3V voltage is 2.81V or less when the computer is booting up. C3h E3V voltage is 2.81V or more when the computer is powered off. C4h E3V voltage is 2.81V or less when the computer is suspended.
2 Troubleshooting Procedures Check 2 2.3 Power Supply Troubleshooting In the case of error code 10h or 12h: Make sure the AC adaptor cord and AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet. If the cables are connected correctly, go to the following step: Connect a new AC adaptor and/or AC power cord, if necessary. If the error still exists, go to Procedure 5. Check 3 In the case of error code 2Xh: Make sure the battery pack is correctly installed in the computer.
2.3 Power Supply Troubleshooting Procedure 3 2 Troubleshooting Procedures Connection Check The power supply wiring diagram is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Disconnect the AC power cord from the wall outlet. Check the power cable for breaks. If the power cord is damaged, connect a new AC power cord. If there is no damage, go to Check 2.
2 Troubleshooting Procedures Procedure 4 2.3 Power Supply Troubleshooting Charge Check The power supply may not charge the battery pack. Perform the following procedures: 1. Reinstall the battery pack. 2. Attach the AC adaptor and turn on the power. If you cannot turn on the power, go to Procedure 5. 3. Run the Diagnostic test, go to System test and execute subtest 06 (Quick charge) described in Chapter 3. 4. When charge is complete, the diagnostics test displays the result code.
2.3 Power Supply Troubleshooting Procedure 5 2 Troubleshooting Procedures Replacement Check The system board processor module may be disconnected or damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures. Check the connection between the AC adaptor and system board and connection. After checking the connections, perform the following Check 1: Check 1 Replace the AC adaptor with a new one. If the AC adaptor is still not functioning properly, perform Check 2.
2 Troubleshooting Procedures 2.4 2.4 System Board Troubleshooting System Board Troubleshooting This section describes how to determine if the system board and CPU are defective or not functioning properly. Start with Procedure 1 and continue with the other procedures as instructed.
2.4 System Board Troubleshooting Procedure 1 2 Troubleshooting Procedures Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it. If an error message is shown on the display, perform Check 1. If there is no error message, go to Procedure 2. If Toshiba MS-DOS or Windows XP is properly loaded, go to Procedure 3.
2 Troubleshooting Procedures Check 2 2.4 System Board Troubleshooting The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (22) or (23) appears, go to Procedure 4. If the error message (18) appears, go to the Keyboard Troubleshooting Procedures in Section 2.7. If the error message (19) or (20) appears, go to the HDD Troubleshooting Procedures in Section 2.6.
2.4 System Board Troubleshooting Procedure 2 2 Troubleshooting Procedures Debug Port Check Check the D port status by a debug port test. The tool for debug port test is shown below. Figure 2-2 A set of tool for debug port test The test procedures are follows: 1. Connect the debug test cable to the connector CN3400 of the system board. For disassembling to connect the test cable, refer to Chapter 4. 2. Connect the debug port test cable and RS-232C cross cable to the test board. 3.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Debug port LED boot mode status (1/7) LED Status Item Start Contents/Message Clearance of software reset bit Permission of A20 line Initialization for special register and Intel chip set PIT CH0 initialization (for HOLD_ON) BIOS rewrite flag initialization Checksum check (FEF00000hFEFF7FFFh) Transition to protected mode Boot block checksum (HLT when checksum error occurred.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Debug port LED boot mode status (3/7) LED Status 01h Item Check of DRAM type and size Contents/Message (Reading DRAM size at Warm Boot) (DRAM check at Cold Boot)) 11h 02h Check of DRAM size (HLT when the DRAM type is 0.) SM-RAM stack area test (HLT when the stack area can not be used.) Permission of Cache (L1 cache only) CMOS access test (at Cold Boot) (HLT when an error is detected.
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2 Troubleshooting Procedures 2.
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2 Troubleshooting Procedures 2.
2.4 System Board Troubleshooting Procedure 3 2 Troubleshooting Procedures Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. Refer to Chapter 3, Tests and Diagnostics, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test 6. Async test 7. Hard Disk test 8. Real Timer test 9. NDP test 10. Expansion test 11. CD-ROM/DVD-ROM test 12. Wireless LAN test 13. Sound test 14.
2 Troubleshooting Procedures Procedure 4 2.4 System Board Troubleshooting Replacement Check The system board connectors may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform Check 1. Check 1 Visually check for the following: a) Cracked or broken connector housing b) Damaged connector pins If their connectors are in good condition, but there is still a problem, go to Check 2. Check 2 2-28 The system board may be damaged.
2.5 USB FDD Troubleshooting 2.5 2 Troubleshooting Procedures USB FDD Troubleshooting This section describes how to determine if the USB FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.5 USB FDD Troubleshooting Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Floppy disk drive test error codes and their status names are listed in Table 2-6. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled.
2.5 USB FDD Troubleshooting Procedure 3 2 Troubleshooting Procedures Connector Check and Replacement Check The USB FDD is connected to the System Board. Check 1 When using the USB port, make sure the USB FDD cable is firmly connected to CN4600 (USB port 0) or CN4601 (USB port 3) on the SN board and the SN cable is firmly connected to CN9501 on the system board and CN9511 on the SN board. If any of the connections are loose, reconnect firmly and repeat Procedure 2.
2 Troubleshooting Procedures 2.6 HDD Troubleshooting 2 2.6 HDD Troubleshooting This section describes how to determine if the HDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.6 HDD Troubleshooting Procedure 2 2 Troubleshooting Procedures Partition Check Insert the Toshiba MS-DOS system disk and restart the computer with U key holding down. Perform the following checks: Check 1 Type C: and press Enter. If you cannot change to drive C, go to Check 2. If you can change to drive C, go to Check 3. Check 2 Type FDISK and press Enter. Choose Display Partition Information from the FDISK menu. If drive C is listed, go to Check 3.
2 Troubleshooting Procedures Procedure 3 2.6 HDD Troubleshooting Format Check The computer’s HDD is formatted using the low level format program and the MS-DOS FORMAT program. To format the HDD, start with Check 1 below and perform the other steps as required. Check 1 Format the HDD and transfer system files using FORMAT C:/S/U. If the following message appears on the display, the HDD is formatted.
2.6 HDD Troubleshooting Procedure 4 2 Troubleshooting Procedures Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. Replace the HDD with a new one following the instructions in Chapter 4, Replacement Procedures.
2 Troubleshooting Procedures Procedure 5 2.6 HDD Troubleshooting Connector Check and Replacement Check The HDD may be disconnected, or the HDD or the system board may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: Check 1 Make sure the HDD is firmly connected to CN1800 on the system board. If any of the connections are loose, reconnect firmly and repeat Procedure 1. If there is still an error, go to Check 2.
2.7 Keyboard and Touch pad Troubleshooting 2.7 2 Troubleshooting Procedures Keyboard and Touch pad Troubleshooting To determine if the computer’s keyboard or touch pad is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test in the Diagnostic Program.
2 Troubleshooting Procedures Procedure 2 2.7 Keyboard and Touch pad Troubleshooting Connector and Replacement Check The keyboard, touch pad or sensor/switch board may be disconnected or damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: 1. If the keyboard or AccuPoint malfunctions, start with Check 1. 2. If the touch pad malfunctions, start with Check 3. 3.
2.7 Keyboard and Touch pad Troubleshooting 2 Troubleshooting Procedures Check 4 The touch pad or the touch pad cable may be damaged. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still exists, perform Check 7. Check 5 Make sure the sensor/switch cable is firmly connected to the connector CN9600 on the system board and to connector PJ9610 on the sensor/switch board. If the connection is loose, reconnect firmly and repeat Procedure 1.
2 Troubleshooting Procedures 2.8 2.8 Display Troubleshooting Display Troubleshooting This section describes how to determine if the computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: External Monitor Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector Check and Cable Check Procedure 4: Replacement Check Procedure 1 External Monitor Check Connect an external monitor and tun on the computer.
2.8 Display Troubleshooting 2 Troubleshooting Procedures If the connection is loose, reconnect firmly and restart the computer. If there is still an error, go to Procedure 4. Procedure 4 Replacement Check The FL, FL inverter board, LCD module, and system board are connected to display circuits. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: 1.
2 Troubleshooting Procedures 2.9 2.9 Optical Drive Troubleshooting Optical Drive Troubleshooting This section describes how to determine if the optical drive (CD-ROM,DVD-ROM, CDRW/DVD-ROM, DVD±R/±RW or DVD Super Multi drive) in the Slim Select Bay is functioning properly. Perform the steps below starting with Procedure 1 and continue with the other procedures as required.
2.9 Optical Drive Troubleshooting Procedure 2 2 Troubleshooting Procedures Connector Check and Replacement Check The optical drive (CD-ROM, DVD-ROM, CD-RW/DVD-ROM, DVD±R/±RW or DVD Super Multi drive) is connected to the system board. The connectors may be disconnected from the system board or may be damaged.
2 Troubleshooting Procedures 2.10 Modem Troubleshooting 2.10 Modem Troubleshooting This section describes how to determine if the computer's modem is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.10 Modem Troubleshooting Procedure 2 2 Troubleshooting Procedures Connector Check and Replacement Check The Modem is installed as a MDC (Modem Daughter Card). If the modem malfunctions, there may be a bad connection between the MDC and the system board. Or the MDC, system board or their connectors might be damaged.
2 Troubleshooting Procedures 2.11 LAN Troubleshooting 2.11 LAN Troubleshooting This section describes how to determine if the computer's LAN is functioning properly. Perform the steps below starting with Procedure 1 and continue with the other procedures as required.
2.12 Bluetooth Troubleshooting 2 Troubleshooting Procedures 2.12 Bluetooth Troubleshooting This section describes how to determine if the computer's Bluetooth is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.12 Bluetooth Troubleshooting Connection Check The Bluetooth function wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the Bluetooth module is firmly connected to CN4400 on the sound board. If the connector is disconnected, connect it firmly and perform Procedure 1.
2.12 Bluetooth Troubleshooting Procedure 3 2 Troubleshooting Procedures Replacement Check The Bluetooth antenna, Bluetooth module, sound board and system board are connected to the circuits. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 The Bluetooth module may be defective or damaged.
2 Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting 2.13 Wireless LAN Troubleshooting This section describes how to determine if the computer's Wireless LAN is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.13 Wireless LAN Troubleshooting Procedure 2 2 Troubleshooting Procedures Antenna Connection Check The wireless LAN wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless LAN board is firmly connected to CN2200 on the system board. If the connector is disconnected, connect it firmly and perform Procedure 1.
2 Troubleshooting Procedures Procedure 3 2.13 Wireless LAN Troubleshooting Replacement Check The wireless LAN antenna, wireless LAN board and the system board are connected to the circuits. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 The wireless LAN board may be defective or damaged.
2.14 Sound Troubleshooting 2 Troubleshooting Procedures 2.14 Sound Troubleshooting This section describes how to determine if the computer's sound functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.14 Sound Troubleshooting Connector Check The sound function-wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: 1. If the stereo speakers do not work correctly, perform Check 1. 2. If the headphone does not work correctly, perform Check 2. 3. If the microphones do not work correctly, perform Check 3.
2.14 Sound Troubleshooting Procedure 3 2 Troubleshooting Procedures Replacement Check Check 1 If the stereo speakers do not sound properly, the right or left speaker may be defective or damaged. Replace it with a new one. If the stereo speakers still do not work properly, go to Check 4. Check 2 If the headphone does not sound properly, the headphone jack may be defective or damaged. Replace it with a new one. If the sound function still does not work properly, go to Check 4.
2 Troubleshooting Procedures 2.15 SD Card Slot Troubleshooting 2.15 SD Card Slot Troubleshooting This section describes how to determine if the computer's SD card functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Check on Windows XP Procedure 2: Connector Check and Replacement Check Procedure 1 Check on Windows XP Insert an SD card into the slot.
2.16 PCI ExpressCard Slot Troubleshooting 2 Troubleshooting Procedures 2.16 PCI ExpressCard Slot Troubleshooting This section describes how to check PCI ExpressCard slot by inspecting a card with PCI Express interface and a card with USB 2.0 interface. 1. Gigabit Ether ExpressCard 2. USB2.0 5in1 ExpressCard 1. Gigabit Ether ExpressCard (1) Insert the Gigabit Ether ExpressCard into the ExpressCard slot. (2) On Windows, open System Property → Hardware → Device Manager window.
2 Troubleshooting Procedures 2-58 2.
Chapter 3 Tests and Diagnostics
3 Tests and Diagnostics 3 3-ii TECRA M3 Maintenance Manual (960-507)
3 Tests and Diagnostics Chapter 3 3.1 3.2 Contents The Diagnostic Test ................................................................................................... 3-1 3.1.1 Diagnostics menu ................................................................................. 3-1 3.1.2 H/W (Hardware) initial information setting tool.................................. 3-3 3.1.3 Heatrun test program............................................................................
3 Tests and Diagnostics 3.21 3.22 3.23 3.24 3.25 Head Cleaning.......................................................................................................... 3-46 3.21.1 Function Description .......................................................................... 3-46 3.21.2 Operations .......................................................................................... 3-46 Log Utilities .............................................................................................
3 Tests and Diagnostics Tables Table 3-1 Subtest names .................................................................................................... 3-12 Table 3-2 Error codes and error status names .................................................................... 3-35 Table 3-3 Hard disk controller status register contents...................................................... 3-38 Table 3-4 Error register contents...................................................................................
3 Tests and Diagnostics 3-vi TECRA M3 Maintenance Manual (960-507)
3.1 The Diagnostic Test 3 Tests and Diagnostics 3 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
3 Tests and Diagnostics 3.1 The Diagnostic Test NDP TEST EXPANSION TEST CD-ROM/DVD-ROM TEST Other tests are: Wireless LAN TEST (Wireless LAN TEST disk) LAN/Modem/Bluetooth/IEEE1394 TEST (LAN/Modem/Bluetooth/IEEE1394 TEST disk) Sound TEST (Sound TEST disk) You will need the following equipment to perform some of the Diagnostic test programs.
3.1 The Diagnostic Test 3 Tests and Diagnostics 3.1.2 H/W (Hardware) initial information setting tool The H/W initial information setting tool consists of the following programs. Initial configuration Region write System configuration display E2PROM test (MAC/GUID/DMI) You will need the following equipment to perform some of the programs. The Diagnostics Disk (Main T&D) 3.1.3 Heatrun test program The heatrun test starts automatically after the selection.
3 Tests and Diagnostics 3.2 3.2 Executing the Diagnostic Test Executing the Diagnostic Test To start the DIAGNOSTIC PROGRAM, follow these steps: 1. Insert the Diagnostics disk in the floppy disk drive. 2. Insert the Diagnostics disk in the USB floppy disk drive and turn on the computer while pressing U key. Then, press Enter and the following menu appears. Microsoft Windows XX Startup Menu --------------------------------------------------------1. Repair Main (T&D) 2. Repair initial config set 3.
3.2 Executing the Diagnostic Test Note: 3 Tests and Diagnostics To exit the DIAGNOSTIC TEST MENU, press the Esc key. If a test program is in progress, press Ctrl + Break to exit the test program. If a test program is in progress, press Ctrl + C to stop the test program. Set the highlight bar to 1, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Select the option you want to execute and press Enter. When you select 1- SYSTEM TEST, the following message will appear: SYSTEM TEST NAME SUB-TEST PASS COUNT WRITE DATA ADDRESS : : : : XXXXXX xxxxxxx DIAGNOSTIC TEST VX.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Selecting YES of ERROR STOP stops the test program when an error is found and displays the operation guide on the right side of the display screen as shown below: ERROR STATUS NAME [[ HALT OPERATION ]] 1: Test end 2: Continue 3: Retry These three selections have the following functions respectively: 1. Terminates the test program and exits to the subtest menu. 2. Continues the test. 3. Restarts the test from the error.
3 Tests and Diagnostics 3.3 3.3 Setting of the hardware configuration Setting of the hardware configuration To execute this program, select 2-Repair initial config set in the startup menu, press Enter and follow the directions on the screen. The H/W initial information setting tool consists of four subtests. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Initial configuration This subtest executes the following items and shows their contents in the display.
3.3 Setting of the hardware configuration • • • • 3 Tests and Diagnostics Setting of the HWSC Setting of the UUID Display of the DMI information (including UUID) Setting of DVD region code (Yes/No) After completion of the above settings, H/W configuration & DMI information are appeared in order. Check the contents and press Enter. Subtest 02 Region write This subtest executes the setting of the region code for DVD drive based on the destination of the machine.
3 Tests and Diagnostics Subtest 08 3.3 Setting of the hardware configuration System configuration display This subtest displays the information of the system configuration. When the following message appears, confirm the contents and press Enter. Press [Enter] key For more details on the system configuration information, refer to “3.25 System configuration”. Subtest 09 E2PROM test (MAC/GUID/DMI) It checks whether the MAC address, GUID of IEEE1394 and DMI information are written.
3.4 Heatrun Test 3.4 3 Tests and Diagnostics Heatrun Test To execute this program, select 3-Repair heatrun in the startup menu, press Enter. After selecting this test, the same subtests as 3.23 Running Test are executed successively. For more details on the procedure and test content, refer to Running Test. When the heatrun test ends, following message appears in the display.
3 Tests and Diagnostics 3.5 3.5 Subtest Names Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No. 3-12 Test Name Subtest No.
3.5 Subtest Names 3 Tests and Diagnostics Table 3-1 Subtest names (2/2) No. 6 Test Name PRINTER [Not supported] Subtest No.
3 Tests and Diagnostics 3.6 3.6 System Test System Test To execute the System Test, select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM checksum This subtest executes a checksum test of the BIOS ROM (range: F0000h to FFFFFh, 64KB) on the System Board. Subtest 02 Fan ON/OFF This subtest turns on/off the fan motor by force with Fan ON/OFF commands.
3.6 System Test Subtest 05 3 Tests and Diagnostics DMI read This subtest displays the information in the Flash-ROM in the following format. *** DMI Data Display Ver X.XX *** Model Name Version Number Serial Number Model Number UUID Number : : : : : XXXXXXXXXXX XXXXXXXXXXXX XXXXXXXX XXXXXX-XXXXX XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX Press [Enter] to EXIT To exit this subtest and return to the SYSTEM test menu, press Enter.
3 Tests and Diagnostics 3.7 3.7 Memory Test Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Conventional memory This subtest writes a constant data to conventional memory (0 to 640 KB), then reads the new data and compares the result with the original data. Subtest 02 Note: Protected Mode The CONFIG.
3.8 Keyboard Test 3.8 3 Tests and Diagnostics Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed key code display When a key is pressed, the scan code, character code, and key top name are displayed on the screen in the format shown below.
3 Tests and Diagnostics 3.9 3.9 Display Test Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM read/write for VGA This subtest writes the constant data (AAh and 55h) to the video RAM. The data is read and compared to the original data.
3.9 Display Test Subtest 04 3 Tests and Diagnostics Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode 12] 13] 3] 111 112 114 115 117 118 640*480 640*480 800*600 800*600 1024*768 1024*768 64K] 16M] 64K] 16M] 64K] 16M] The display below appears on the screen when this subtest is executed.
3 Tests and Diagnostics Subtest 06 3.9 Display Test “H” pattern display This subtest displays a full screen of “H” patterns.
3.10 Floppy Disk Test 3 Tests and Diagnostics 3.10 Floppy Disk Test Caution: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD because the contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. 1. The following message will appear. Select the media mode and start track to be tested and press Enter.
3 Tests and Diagnostics 3.10 Floppy Disk Test Select the number of the subtest you want to execute and press Enter. The following message will appear during the floppy disk test. FLOPPY DISK IN PROGRESS XXXXXXX xxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] : test end [Ctrl]+[C] : key stop SUB-TEST : XX PASS COUNT : XXXXX ERROR COUNT : XXXXX WRITE DATA : XX READ DATA : XX ADDRESS : XXXXXX STATUS : XXX When the subtest 04 or 05 is selected, the following messages will appear on the screen.
3.11 Printer Test 3 Tests and Diagnostics 3.11 Printer Test To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Note: An IBM compatible printer must be connected to the system to execute this test. Also, printer port wraparound connector must be connected.
3 Tests and Diagnostics Subtest 02 3.11 Printer Test Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Note: Wraparound To execute this subtest, a printer wraparound connector must be connected to the computer’s printer port.
3.12 Async Test 3 Tests and Diagnostics 3.12 Async Test To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
3 Tests and Diagnostics 3.13 Hard Disk Test 3.13 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. Caution: The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 08 or 09 is executed. Before running the test, the customer should transfer the contents of the hard disk to floppy disk or another hard disk.
3.13 Hard Disk Test 3 Tests and Diagnostics 3. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest. HARD DISK TEST XXXXXXX SUB TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXX DIAGNOSTIC TEST VX.
3 Tests and Diagnostics Subtest 04 3.13 Hard Disk Test Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder and then reads the data while moving from cylinder to cylinder. (Tests the data interference in the neighbor track.
3.14 Real Timer Test 3 Tests and Diagnostics 3 3.14 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real time A new date and time can be input during this subtest. To execute the real time subtest, follow these steps: 1.
3 Tests and Diagnostics Subtest 03 Caution: 3.14 Real Timer Test Real time carry When this subtest is executed, the current date and time are erased.
3.15 NDP Test 3 Tests and Diagnostics 3.15 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen.
3 Tests and Diagnostics 3.16 Expansion Test 3.16 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wrap around Caution: Note: PCMCIA wraparound test is not supported for this model. To execute this subtest, the PC card wraparound connector is required.
3.16 Expansion Test Subtest 02 Note: 3 Tests and Diagnostics RGB monitor ID To execute this subtest, an external monitor with monitor ID function is required. Connect the external monitor to the PC for the test of ID acquisition. The judgment of acquisition is based on the panel data. In simultaneous display mode or internal display mode, in which the panel data is acquired, this subtest will fail. Therefore, make sure only the external display is selected when executing this subtest.
3 Tests and Diagnostics 3.17 CD-ROM/DVD-ROM Test 3.17 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM test, select 12 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Note: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1. For the subtest 04, use a CD-RW on the market.
3.18 Error Code and Error Status Names 3 Tests and Diagnostics 3.18 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the DIAGNOSTIC TEST.
3 Tests and Diagnostics 3.
3.
3 Tests and Diagnostics 3.19 Hard Disk Test Detail Status 3.19 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eight-digit number. The first four digits represent the hard disk controller (HDC) error status number and the last four digits are not used.
3.19 Hard Disk Test Detail Status 3 Tests and Diagnostics Table 3-4 Error register contents Bit Name Description 7 BBK (Bad block mark) “0” … Not used. “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error. “1” … Uncorrectable data error has been detected. 5 —— Not used. 4 IDN (Identification) “0” … Not used. “1” … There is no ID field in the requested sector. 3 —— Not used 2 ABT (Abort) “0” … Not used.
3 Tests and Diagnostics 3.20 3.20 ONLY ONE TEST ONLY ONE TEST 3.20.1 Program Description This program tests the unique functions of this model. 3.20.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter. The following menu appears in the display. ################################################################ ######## ONLY ONE TEST Menu (XXXXXXXXX) ######## ################################################################ * * * 1 ............ Pressed Key Display * * 2 ............
3.20 ONLY ONE TEST Subtest 01 3 Tests and Diagnostics Pressed key display When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed. Holding a key down enables the auto-repeat function that causes the key’s display character to blink. Press Del + Enter to end the test.
3 Tests and Diagnostics Subtest 02 3.20 ONLY ONE TEST Touch Pad This subtest checks the functions of the touch pad as shown below. A) Direction and parameter B) Switching function check. This test displays the response from the touch pad and touch pad switch. When moving your finger on the touch pad towards the upper left, the display changes according to the following illustration. If a touch pad switch is pressed, the displays appear on the right side one by one.
3.20 ONLY ONE TEST Subtest 03 3 Tests and Diagnostics GP Button This subtest checks moving of the Internet button. Press the Console button after the following message appears. Press [ Console ] button This subtest checks moving of the Presentation button. Press the Mail button after the following message appears. Press [ Presentation ] button If the test ends successfully, the display returns to the KEYBOARD TEST menu.
3 Tests and Diagnostics Subtest 05 Note: 3.20 ONLY ONE TEST USB When executing this subtest, USB test module and USB cable must be connected. This subtest checks if USB port works properly. The following menu appears in the display. ################################################################ ######## ONLY ONE TEST Menu (XXXXXXXXX) ####### ################################################################ * * * 0 ............ Port 0 * * 1 ............ Port 1 * * 9 ............
3.20 ONLY ONE TEST 3 Tests and Diagnostics This subtest checks if each LED lights properly. The following message appears in the display in order. Follow the instructions in the display to execute the test. [HDD Access LED test] Press any key and following message appears in the display. [Caps/Num/Overlay BT/W-LAN LED test] (1) Press [Caps Lock ] key ! ...Caps (on/off) (2) Press [Fn + F10 ] key ! ...Arrow (on/off) (3) Press [Fn + F11 ] key ! ...
3 Tests and Diagnostics 3.21 3.21 Head Cleaning Head Cleaning 3.21.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.21.2 Operations 1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS - FLOPPY DISK HEAD CLEANING : VX.XX Mount cleaning disk(s) on drive(s). Press any key when ready. 2.
3.22 Log Utilities 3.22 3 Tests and Diagnostics Log Utilities 3.22.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk, or output the data to a printer or the display. The error information is displayed in the following order: 1. Error count (CNT) 2. Test name, Subtest number (TS-No) 3. Pass count (PASS) 4. Error status (STS) 5. FDD/HDD or memory address (ADDR) 6. Write data (WD) 7.
3 Tests and Diagnostics 3.22 Log Utilities 3.22.2 Operations 1.
3.23 Running Test 3.23 3 Tests and Diagnostics Running Test 3.23.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02, 06) 3. Display test (subtest 01) 4. Real timer test (subtest 02) 5. HDD test (subtest 01) The system automatically detects the number of floppy disk drives connected to the computer for the FDD test. 3.23.2 Operations 1.
3 Tests and Diagnostics 3.24 3.24 Floppy Disk Drive Utilities Floppy Disk Drive Utilities 3.24.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT Note: This program is only for testing a floppy disk drive. It is different from the Toshiba MS-DOS FORMAT command.
3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3.24.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message. [ FDD UTILITIES ] 1 2 3 4 9 – - FORMAT COPY DUMP HDD-ID READ EXIT TO DIAGNOSTICS MENU 2. FORMAT program (a) Selecting FORMAT displays the following message. DIAGNOSTICS - FLOPPY DISK FORMAT : VX.XX Drive number select (1:A, 2:B) ? (b) Select a drive number to display the following message.
3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 3. COPY program (a) When COPY is selected, the following message appears. FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below. Insert source disk into drive A: Press any key when ready. (c) Remove the Diagnostics Disk from the FDD, insert the source disk and press any key. The following message will appear, indicating the program has started.
3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics 4. DUMP program (a) When DUMP is selected, the following message appears. DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If 2:HDD is selected, the display will go to step (h). If 1:FDD is selected, the following message will appear. Select drive number (1:A, 2:B) ? (c) Select a drive number and the following message will be displayed.
3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? 5. HDD ID READ program Selecting HDD ID displays the following HDD ID configuration. [HDD ID Read (VX.XX)] [Drive #1] Model No. = XXXXXXX Press Enter to return to the FDD UTILITIES MENU.
3.25 System Configuration 3 Tests and Diagnostics 3 3.25 System Configuration 3.25.1 Function Description Note: To display the system configuration, the write protect tab should be OFF position. If the tab is ON position, move the tab to OFF position and restart the test. Otherwise the correct information cannot be acquired. The System Configuration program contains the following configuration information for the computer: 1. Processor Type [Code/L2 cache] 2. Chip set [VRAM] 3.
3 Tests and Diagnostics 3.25 System Configuration 3.25.2 Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display. System Configuration Display : Ver X.
3.26 Wireless LAN Test Program (Intel-made Calexico2 a/g) 3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Intel-made Calexico2 a/g) This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade Calexico 802.11a/b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MS-DOS.
3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Intel-made Calexico2 a/g) If a defective is found during the test, NG message will appear in the display. Press any key and following message will appear in the display. ************************************************************ * * * SKU NG !! * * * * Other Card or Module not found * * * ************************************************************ Press any key and return to the test menu.
3.26 Wireless LAN Test Program (Intel-made Calexico2 a/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Defective wireless LAN card • Disappearance of MAC address data Checking the connection, execute the subtest again.
3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Intel-made Calexico2 a/g) When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Connection of wireless LAN antenna cable (Main/Aux) • Condition of wireless LAN communication (Interference/obstruction) • Defective wireless LAN card Checking the connection and condition, execute the subtest again.
3.26 Wireless LAN Test Program (Intel-made Calexico2 a/g) Subtest05 3 Tests and Diagnostics Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. For more details on procedure and contens of this subtest, refer to Subtest04 Communication test of 11a mode. Subtest06 All the tests of Calexico 11a/g Card This subtest checks SKU information, MAC address of Calexico 802.11a/b/g card, antenna connection and communication test of Calexico 802.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made Calexico2 b/g) 3.27 Wireless LAN Test Program (Intel-made Calexico2 b/g) This section describes how to perform the wireless LAN transmitting-receiving test. To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Finish the tests of the Main test program by selecting 99 - EXIT TO DIAGNOSTICS MENU in the DIAGNOSTIC TEST MENU. Then in the DIAGNOSTICS MENU, select 9 - EXIT TO MSDOS.
3.27 Wireless LAN Test Program (Intel-made Calexico2 b/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. • Bad connection of wireless LAN card • Using a wrong wireless LAN card (Using unspecified card) • Defective wireless LAN card Check the connection and execute the subtest again. Subtest 02 MAC Address Check This subtest displays the MAC address. When selecting this subtest, following message will appear in the display.
3 Tests and Diagnostics Subtest 03 Caution: 3.27 Wireless LAN Test Program (Intel-made Calexico2 b/g) Antenna check & communication test of 11b mode To execute subtest 03-05, use another computer (with Calexico wireless LAN card) that can communicate by the wireless LAN as a responder machine. Access points are also required. (Access point for 802.11b and 802.11g) Be sure to turn the wireless communication switch ON before executing wireless LAN communication test.
3.27 Wireless LAN Test Program (Intel-made Calexico2 b/g) 3 Tests and Diagnostics Check the connection and condition, and execute the subtest again. Subtest 04 Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. After finishing the test, OK message will appear in the display. Press any key to return to the test menu. When a defective is found during the test, NG message will appear in the display.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Askey-made Atheros) 3.28 Wireless LAN Test Program (Askey-made Atheros) This section describes how to perform the wireless LAN transmitting-receiving test (Askeymade Atheros b/g). Caution: To execute subtest 03-07, use another computer (with Atheros wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform those tests. Another wireless communication tool with 2.4GHz like Bluetooth is interfering with the test.
3.28 Wireless LAN Test Program (Askey-made Atheros) 3 Tests and Diagnostics 4. When the program disk 2 starts, following menu will appear in the display. To execute the subtest, press test number and Enter.
3 Tests and Diagnostics Subtest 02 3.28 Wireless LAN Test Program (Askey-made Atheros) MAC Address Check This subtest reads out the MAC address of the card installed and confirms if it is valid. When the MAC address is valid one, following message will appear in the display. ************************************************************* * * * MAC Address Check : OK !! * * * ************************************************************* Press any key to return to the test menu.
3.28 Wireless LAN Test Program (Askey-made Atheros) 3 Tests and Diagnostics Moreover, following typical cause is considered. • Bad connection of wireless LAN card • Bad connection of wireless LAN antenna cable (Main/Aux) • Environment for wireless LAN communication (Interference/ obstruction) • Defective wireless LAN card Check the connection and condition, and execute the subtest again.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the test program. Insert the test program disk for LAN/Modem/Bluetooth/IEEE1394 test in FDD and turn on the power. The following message will appear. Microsoft Windows XX Startup Menu ---------------------------------1. LAN 2. Modem 3. Bluetooth 4.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest 01 3 Tests and Diagnostics (i82562 + ICHx) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. The following message will appear.
3 Tests and Diagnostics Subtest 02 Note: 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program (GbE) Gigabit Ethernet (GbE) test is not supported for this model. This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. Select 2 to execute and press Enter. The following message will appear. Testing adapter...hit to abort. * External Loopback Test...PASSED Testing completed.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.2 3 Tests and Diagnostics Modem test For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Electric Manufacture Co.,Ltd)” for the tests. To execute Modem test, press 2 and Enter. Following message will appear. [Modem loopback test !] ICHx MDC Test Program with Modem Sound (Line Test) Version X.
3 Tests and Diagnostics 3.29.3 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Bluetooth test To execute this test, press 3 and press Enter. Note: Use another computer that can communicate by the Bluetooth as a reference machine to perform this test. Insert a floppy disk containing the test program into the target machine and turn on the target machine. The following Bluetooth test menu will appear.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Table 3-5 Error message Message Contents Invalid BD_ADDR (all 00) 0x000000000000 Invalid BD_ADDR (all FF) 0xFFFFFFFFFFFF Invalid BD_ADDR (bit0=1) bit40=1b Invalid BD_ADDR (bit1=1) bit41=1b Invalid BD_ADDR (define in the file) Defined BD_ADDR If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Table 3-6 Error code for Bluetooth test (BD_ADDR) (2/2) Error code 0x1b 0x1c 0x1d 0x1e 0x1f 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2a 0x2b 0x2c 0x2d 0x2e 0x2f Meaning SCO Offset Rejected. SCO Interval Rejected. SCO Air Mode Rejected. Invalid LMP Parameters. Unspecified Error. Unsupported LMP Parameter Value. Role Change Not Allowed. LMP Response Timeout. LMP Error Transaction Collision. LMP PDU Not Allowed.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program When the test begins, the machine displays BD_ADDR of the DUT. The progress bar appears when the preparation is completed. The following message is displayed. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics When the communication test has been completed without fail, the DUT machine displays BD_ADDR. If the connection with the tester is completed, the progress bar stops. The following message is shown. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program If the DUT machine has any problem or S of the DUT machine is pressed before connection to tester machine, the following message “INCOMPLETE” is displayed. ----------------------------------------------------------------------------Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.XX Copyright (C) by TOSHIBA Co.
3.
3 Tests and Diagnostics 3.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.4 3 Tests and Diagnostics IEEE1394 test To execute this test, press 4 and Enter. Note: Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test. The following menu will appear: ******************************************************************** ******** IEEE1394[XXXXX] Diagnostics program ************** ******************************************************************** * * * 1 ....
3.30 Sound Test program 3 3 Tests and Diagnostics Tests and Diagnostics 3.30 Sound Test program This section describes how to perform the Sound test. To execute the sound test, refer to the following description. Insert the test program disk for Sound test in the floppy disk drive and turn on the power.
3.30 Sound Test program 3 Tests and Diagnostics To return to the Sound test menu, press 9 and Enter. Then following message will appear in the display. *********************************** ******** May I Restart ? ******* *********************************** Press any key to continue… After pressing any key, the machine starts rebooting and sound test menu will appear in the display. Subtest 01 Microphone recording & play This subtest checks the function of the CODEC A/D, D/A converter.
3 Tests and Diagnostics Subtest 02 3.30 Sound Test program Sine Wave This subtest is executed by loading the COM file (ADSIN.COM). The program expands sine wave data table from 16KB to 64KB, and creates the play data. Then it transfers the data between the DMA and the CODEC to play the sine wave. (It sounds like a continuous beep). By using wave measurable devices such as an oscilloscope, the data can be measured as a sine wave.
3.30 Sound Test program 3 Tests and Diagnostics 3.30.3 CD Sound (Standard) test To execute the CD Sound (Standard) test, press 3 and Enter. Insert the test media (TOSHIBA TEST CD-ROM or ABEX TEST CD-ROM) or music CD on the market (if the test media can not be prepared). Following menu appears in the display. For details on use of test media, refer to 3.29.3.1 Test media (Toshiba-made test media). For details on use of audio CD on the market, refer to 3.29.3.2 Audio CD. 3.30.3.
3 Tests and Diagnostics Subtest 02 3.30 Sound Test program English Narration Selected this subtest, narration in English starts. For more details on the procedure, refer to the subtest01. Subtest 03 Caution: Test Tone A Before starting subtest03, be sure to set the sound at proper volume. This subtest plays sine wave while changing its table from 100Hz to 20Hz. The test returns to the CD Sound (Standard) menu after the test ends.
3.30 Sound Test program 3 Tests and Diagnostics 3.30.3.2 Audio CD Caution: This test is not supported in this model. Insert an audio CD and the following menu appears in the display. CD/DVD TEST IN PROGRESS XXXXXXXX SUB-TEST PASS COUNT WRITE DATA ADDRESS XX XXXXX XX XXXXXX : : : : xxxxxxx DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.31 SETUP 3.31 SETUP 3.31.1 Function Description This program displays the current system setup information as listed below: 1. Memory (a) Total 2. System Date/Time (a) Date (MM-DD-YYYY) (b) Time (HH:MM:SS) 3. Battery (a) Battery Save Mode 4. Password 5. HDD Password (a) (b) (c) (d) HDD HDD Password Mode User Password Master Password 6. Boot Priority (a) Boot Priority (b) HDD Priority (c) Network Boot Protocol 7.
3.31 SETUP 3 Tests and Diagnostics 10. I/O Ports (a) Serial (b) Parallel 11. Drives I/O (a) Built-in HDD (b) Select Bay 12. PCI Bus (a) PCI Bus 13. Security Controller (a) TPM (b) Clear TPM Owner 14. Peripheral (a) (b) (c) (d) Internal Pointing Device Ext keyboard “Fn” Parallel Port Mode Hard Disk Mode 15. Legacy Emulation (a) USB KB/Mouse Legacy Emulation (b) USB-FDD Legacy Emulation 16.
3 Tests and Diagnostics 3.31 SETUP 3.31.2 Accessing the SETUP Program While pressing ESC, turn on the power. Then press F1. The following display appears.
3.31 SETUP 3 Tests and Diagnostics NOTE: 1. The Network Boot Protocol is not displayed in Gigabit LAN models. 2. The item of Language During Boot up is only for TCL model. 3. The SECURITY CONTROLLER window is displayed when the SETUP is booted during IRT. Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press ↑ and ↓ to move between items in a column. Press Fn+↑ (PgUp) and Fn + ↓ (PgDn) to move between the two pages. 2.
3 Tests and Diagnostics 3.31 SETUP The Factory Preset Configuration When you access SETUP, the current configuration is displayed. 1. To show the factory preset configuration, press Home. 2. Press End and then press Y to accept the factory preset settings.
3.31 SETUP 3 Tests and Diagnostics SETUP Options The SETUP screen is divided into functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s memory. (a) Total This field displays the total amount of memory installed and is automatically calculated by the computer. You cannot change this value. 2. System Date/Time Use this option to set the computer’s system date/time.
3 Tests and Diagnostics 3.31 SETUP CPU Sleep Mode Use this option to enable or disable the CPU sleep function. Enabled Enables sleep mode. (Default) Disabled Disables sleep mode. LCD Brightness Use this option to set the level of LCD brightness. Super-Bright Full brightness for maximum visibility. Bright Full brightness for high visibility. Semi-Bright Less than full brightness for saving power.
3.31 SETUP 3 Tests and Diagnostics (b) HDD Password Mode This item registers HDD password and can be selected only for registering HDD password. To change HDD Password Mode when HDD password is registered, delete the registered HDD password first, and then register new password. User Only Sets only User HDD Password (Default) Master+User Sets Master HDD Password and User HDD Password (c) User Password This item sets User password. For details on setting user password, refer to the User’s Manual.
3 Tests and Diagnostics 3.31 SETUP NOTE: CD-ROM refers to also a DVD-ROM, CD-RW/DVD, DVD±R/±RW or DVD Super Multi drive. (b) HDD Priority This option enables to select the priority for the Built-in HDD, optional second HDD. Built-in HDD→Second HDD (Default) Second HDD→Built-in HDD (c) Network Boot Protocol Use this option to set the starting method via a network. PXE Sets to PXE protocol. (Default) RPL Sets to PRL protocol. 7. Display This group of options configures the computer’s display.
3.31 SETUP 3 Tests and Diagnostics (c) TV Type This option lets you make settings for television display. NTSC (Japan) TV in Japanese system NTSC (US) TV in the U.S. system (Default) PAL TV in Europe system 8. Others Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use. (a) CPU Cache Use this option to enable or disable the CPU cache. Enabled Enables the CPU cache. (Default) Disabled Disables the CPU cache.
3 Tests and Diagnostics 3.31 SETUP (c) Dynamic CPU Frequency mode Use this option to choose a setting from the followings. Dynamically Switchable Enables Intel SpeedStep technology. When the computer is in use, the CPU power consumption and clock speed are automatically switched when necessary. (Default) Always High Disables Intel SpeedStep technology and always runs the processor at its fastest speed.
3.31 SETUP 3 Tests and Diagnostics (f) Language During Bootup This option selects the language during bootup. This message appears only on the model for TCL(Canada). English The message is displayed in English. (Default) French The message is displayed in French. 9. Configuration This option displays the configuration method. (a) Device Config. The devices are initialized when the PNP OS loads. Setup by OS First, devices necessary for loading the OS will be initialized.
3 Tests and Diagnostics 3.31 SETUP 10. I/O ports This option controls settings for the parallel port. NOTE: Do not assign the same interrupt request level and I/O address to the serial port and PC card. (a) Serial Use this option to set the COM level for the serial port.
3.31 SETUP 3 Tests and Diagnostics When the “Parallel Port Mode” (see settings below) is set to ECP, the DMA channel can also be set to 1 or 3. The default is 3. LPT setting Interrupt level I/O address LPT 1 7 378H 3 (Parallel port default) LPT 2 5 278H 3 LPT 3 7 3BCH 3 Not Used DMA channel Disables the port When you select one of the above options, except for Not Used, a sub window similar to the one below appears to let you set the DMA.
3 Tests and Diagnostics 3.31 SETUP 13. Security controller TPM Disables the security controller called TPM (Trusted Platform Module). When the cursor is on the Enable (Disable) and the Space is pressed, message is displayed and the PC waits Y or N key input by the user. When Y is pressed, it is sets to Enable (Disable). After changing, the cursor could not be moved on the TPM tem. Clear TPM Owner This is not displayed when the TPM is set to Disabled.
3.31 SETUP 3 Tests and Diagnostics *If these selections are made, you cannot warm boot the system by pressing Ctrl + Alt + Del. Disabled Disables the feature. (Default) (c) Parallel Port Mode The options in this tab are ECP and Standard Bi-directional. ECP Sets the port mode to Extended Capabilities Port (ECP). For most printers, the port should be set to ECP. (Default) Std. Bi-Direct. This setting should be used with some other parallel devices.
3 Tests and Diagnostics 3.31 SETUP 16. PCI LAN This option enables/disables the Built-in LAN functions. (a) Built-in LAN 3-106 Enabled Enables Built-in LAN functions. (Default) Disabled Disables Built-in LAN functions.
Chapter 4 Replacement Procedures
4 Replacement Procedures 4-ii TECRA M3 Maintenance Manual (960-507)
4 Replacement Procedures Chapter 4 Contents 4.1 General....................................................................................................................... 4-1 4.2 Battery pack ............................................................................................................... 4-8 4.3 PC card / Express card ............................................................................................. 4-10 4.4 SD card.....................................................
4 Replacement Procedures 4.26 Fluorescent Lamp..................................................................................................... 4-85 4.26.1 Replacing the 14.1 inch XGA Samsung Fluorescent Lamp............... 4-86 4.26.2 Replacing the 14.1 inch XGA TMD Fluorescent Lamp .................... 4-96 4.26.3 Replacing the 14.1 inch SXGA+ Samsung Fluorescent Lamp ........ 4-108 Figures Figure 4-1 Removing the battery pack ...................................................................
4 Replacement Procedures Figure 4-26 Removing the display assembly (3)............................................................. 4-42 Figure 4-27 Removing the display assembly (4)............................................................. 4-43 Figure 4-28 Removing the sound board .......................................................................... 4-45 Figure 4-29 Removing the RTC battery ..........................................................................
4 Replacement Procedures Figure 4-58 to 4-68 Replacing Samsung fluorescent lamp (XGA)(1) to (11)........4-86 to 4-94 Figure 4-69 to 4-79 Replacing TMD fluorescent lamp (XGA) (1) to (11)...........4-97 to 4-107 Figure 4-80 to 4-85 Replacing Samsung fluorescent lamp (SXGA+) (1) to (6) ..............
4.1 General 4 4 Replacement Procedures Replacement Procedures 4.1 General This section explains how to disassemble the computer and replace Field Replaceable Units (FRUs). It may not be necessary to remove all the FRUs in order to replace one. The chart below is a guide to which FRUs need to be removed in order to remove others.
4 Replacement Procedures 4.1 General Safety Precautions Before you begin disassembly, read the following safety precautions and observe them carefully as you work. DANGER: 1) Always use the genuine battery that is authorized by Toshiba or compatible with the unit. Since other battery packs have different specifications, they may be incompatible with the unit, and may burst or explode. Never heat or disassemble the battery pack, as that could cause leakage of alkaline solution.
4.1 General 4 Replacement Procedures Before You Begin Look over the procedures in this section before you begin disassembling the computer. Familiarize yourself with the disassembly and reassembly steps. Begin each procedure by removing the AC adapter and the battery pack as instructed in this section: 1. Do not disassemble the computer unless it is operating abnormally. 2. Use only the correct and approved tools. 3.
4 Replacement Procedures 4.1 General Disassembly Procedures The computer has two basic types of cable connectors: • Pressure Plate Connectors • Coaxial Cable Connectors • Normal Pin Connectors To disconnect a Pressure Plate connector, lift up the tabs on either side of the connector’s plastic pressure plate and slide the cable out of the connector. To connect the cable to a Pressure Plate connector, make sure the pressure plate is fully lifted and slide the cable into the connector.
4.1 General 4 Replacement Procedures Tools and Equipment The use of Electrostatic Discharge (ESD) equipment is very important for your safety and the safety of those around you. Proper use of these devices will increase the success rate of your repairs and lower the cost for damaged or destroyed parts. The following equipment is necessary to disassemble and reassemble the computer: • One M2 point size 0 Phillips screwdriver • One M2.
4 Replacement Procedures 4.1 General Screw Tightening Torque When you fasten screws, be sure to follow the torque list below. CAUTION: Overtightening can damage components and screws; undertightening can result in electrical shorts or other damage if screws or components come loose. NOTE: Toshiba recommends that you use an electric screw driver for quick and easy operations. • M2 0.167 N·m (1.7 kgf·cm) • M2.5 0.294 N·m (3.0 kgf·cm) • M3 0.549 N·m (5.
4.1 General 4 Replacement Procedures Color of Screw Shaft To avoid mistakes on the screw length, screw shafts are colored as follows: Even number length screw: brown Odd number length screw: white Special length screw: blue Screws whose lengths are indicated to one or more decimal places such as 2.5 mm or 2.8 mm.
4 Replacement Procedures 4.2 4.2 Battery pack Battery pack Removing the Battery pack To remove the battery pack, follow the steps below and refer to Figure 4-1. CAUTION: When handling battery packs, be careful not to short circuit the terminals. Also do not drop, hit or apply impact, do not scratch, break, twist or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC cable and other external devices from the computer. 3. Turn the computer face down. 4.
4.2 Battery pack 4 Replacement Procedures Installing the Battery pack To install the battery pack, follow the steps below and refer to Figure 4-1. CAUTION: The battery pack is a lithium ion battery, which can explode if not properly replaced, used, handled or disposed of. For environmental reasons, collect the spent battery packs. Use only batteries recommended by Toshiba as replacements. NOTE: Check the battery's terminals visually. If they are dirty, wipe them clean with a dry cloth. 1.
4 Replacement Procedures 4.3 4.3 PC card / Express card PC card / Express card Removing the PC card / Express card To remove the PC card / Express card follow the steps below and refer to Figure 4-2. CAUTION: Before you remove the PC card / Express card, refer to the card's documentation and to your operating system documentation for proper procedures and precautions. 1. Turn the computer face up. 2. Press the eject button for the PC card / Express card you want to remove to extend the button. 3.
4.4 SD card 4.4 4 Replacement Procedures SD card Removing the SD card To remove the SD card, follow the steps below and refer to Figure 4-3. CAUTION: Before you remove the SD card, refer to the card's documentation and to your operating system documentation for proper procedures and precautions. 1. Push the SD card in (indicated as “1” in the figure below) and release it to pop the card out slightly. 2. Grasp the SD card and pull it out (indicated as “2” in the figure below).
4 Replacement Procedures 4.5 4.5 HDD HDD CAUTION: When handling the HDD, do not press the top surface as shown by the arrow. Hold it by the sides. Removing the HDD To remove the HDD, follow the steps below and refer to Figure 4-4 to 4-6. 1. Turn the computer upside down. 2. Remove the following screw securing the HDD cover. Remove the HDD cover by lifting it up. • M2.5×4B FLAT HEAD screw ×1 M2.
4.5 HDD 4 Replacement Procedures 3. Pull the tab of the HDD pack to remove it from the system board. Be careful not to damage the connector. Tab HDD pack Figure 4-5 Removing the HDD pack NOTE: The following steps describe how to disassemble the HDD pack, however, do not disassemble if the HDD is working properly. 4. Place the HDD pack on a flat surface, and remove the following screws. • M3×4Z FLAT HEAD screw ×4 5. Separate the HDD from the HDD bracket.
4 Replacement Procedures 4.5 HDD 6. Separate the Guide mold from the HDD. CAUTION: Do not apply pressure to the top or bottom of the HDD.
4.5 HDD 4 Replacement Procedures Installing the HDD To install the HDD, follow the steps below and refer to Figure 4-4 to 4-6. CAUTION: Do not hold the HDD by its top and bottom flat surfaces. It may damage the HDD. 1. Attach the Guide mold to the HDD 2. Seat the HDD in the HDD bracket and secure them with the following screws. • M3×4Z FLAT HEAD screw ×4 CAUTION: Do not apply pressure to the middle of the HDD pack. It may damage the HDD pack. Hold the HDD pack by its corners. 3.
4 Replacement Procedures 4.6 4.6 Slim select bay module Slim select bay module Removing the Slim select bay module To remove the slim select bay module, follow the steps below and refer to Figure 4-7 and 48. CAUTION: The slim select bay module can become hot with use. Be careful when removing the module. 1. Remove the following screw securing the latch and drive the removed screw into the screw hole. (The slim select bay is unlocked.) • M2.5×4B FLAT HEAD screw ×1 2.
4.6 Slim select bay module 4 Replacement Procedures 3. Remove the following screws securing the connector and plastic brace. • M2×8S BIND screw ×2 4. Remove the connector and plastic brace from the slim select bay module. 5. Remove the following screws securing the plastic frame.
4 Replacement Procedures 4.6 Slim select bay module Installing the Slim select bay module To install the slim select bay module, follow the steps below and refer to Figure 4-7 and 4-8. 1. Seat the plastic frame on the side of the slim select bay module, and secure it with the following screws. • M2×3S S-FLAT HEAD screw ×5 2. Install the connector and plastic brace and secure them with the following screws. • M2×8S BIND screw ×2 3.
4.7 Keyboard 4.7 4 Replacement Procedures Keyboard Removing the Keyboard To remove the keyboard, follow the steps below and refer to Figure 4-9 to 4-13. 1. Remove the following screw securing the keyboard holder. • M2.5×3S S-FLAT HEAD screw ×1 M2.
4 Replacement Procedures 4.7 Keyboard 2. Turn the computer face up and open the display panel. 3. Insert your fingers into the latches between the keyboard holder and the computer, and lift up the keyboard holder to unlatch and remove it. 4. Remove the following screws securing the keyboard. • M2.5×2.8B FLAT HEAD screw ×2 Keyboard holder M2.5×2.8B FLAT HEAD M2.5×2.
4.7 Keyboard 4 Replacement Procedures 5. Lift the upper side of the keyboard and turn it face down on the cover.
4 Replacement Procedures 4.7 Keyboard 6. Loosen the screw (with e-ring) securing the keyboard support plate and remove the keyboard support plate.
4.7 Keyboard 4 Replacement Procedures 7. Disconnect the keyboard cable from the connector CN3200 on the system board and remove the keyboard.
4 Replacement Procedures 4.7 Keyboard Installing the Keyboard To install the keyboard, follow the steps below and refer to Figure 4-9 to 4-13. 1. Place the keyboard face down on the cover. 2. Connect the keyboard cable to the connector CN3200 on the system board. 3. Insert the guides of the keyboard support plate first, then place the keyboard support plate on the keyboard cable. Secure the keyboard support plate with the screw (with e-ring). 4. Turn the keyboard face up and set it.
4.8 Memory module 4.8 4 Replacement Procedures Memory module Removing the Memory module To remove the memory module, make sure the computer is in boot mode and powered off, follow the steps below and refer to Figure 4-14. 1. Press the two latches outward and remove the memory module.
4 Replacement Procedures 4.8 Memory module Installing the Memory module To install the memory module, make sure that the computer is in boot mode and powered off, follow the steps below and refer to Figure 4-14. CAUTION: Do not install a memory module only in the upper slot for expansion. Use the lower slot A prior to the upper slot. Otherwise, the computer or the memory may be damaged. Do not touch the connectors on the memory module or on the computer.
4.9 Cover / Touch pad 4 4 Replacement Procedures Replacement Procedures 4.9 Cover / Touch pad Removing the Cover / Touch pad To remove the cover/touch pad, follow the steps below and refer to Figure 4-15 to 4-20. 1. Turn the computer face down and remove the following screws. • M2.5×4B FLAT HEAD screw ×1 (“4B” in the figure below) • M2.5×6B FLAT HEAD screw ×7 (“6” in the figure below) • M2.
4 Replacement Procedures 4.9 Cover / Touch pad 2. Turn the computer face up and open the display. 3. Remove the following screws. • M2.5×4B FLAT HEAD screw ×1 • M2.5×12B FLAT HEAD screw ×2 M2.5×12B FLAT HEAD M2.
4.9 Cover / Touch pad 4 Replacement Procedures 4. Disconnect the touch pad cable from the connector CN3201 on the system board.
4 Replacement Procedures 4.9 Cover / Touch pad 5. Remove the cover by lifting it up toward the front of the computer.
4.9 Cover / Touch pad 4 Replacement Procedures 6. Remove the following screws securing the touch pad and touch pad switch to the cover. (Remove one screw after peeling the insulator.) • M2.5×4B FLAT HEAD screw ×2 M2.
4 Replacement Procedures 4.9 Cover / Touch pad 7. Remove the touch pad and touch pad switch from the cover while unhooking the latches. Touch pad switch Touch pad Figure 4-20 Removing the touch pad and touch pad switch 8. Disconnect the touch pad cable from the connector on the touch pad.
4.9 Cover / Touch pad 4 Replacement Procedures Installing the Cover / Touch Pad To install the cover/touch pad, follow the steps below and refer to Figure 4-15 to 4-20. 1. Connect the touch pad cable to the connector on the touch pad. 2. Install the touch pad and touch pad switch on the cover while hooking the latches. 3. Turn the cover face down and secure the touch pad and touch pad switch to the cover with the following screws. • M2.5×4B FLAT HEAD screw ×2 4.
4 Replacement Procedures 4.10 Modem Daughter Card (MDC) 4.10 Modem Daughter Card (MDC) Removing the Modem Daughter Card To remove the modem daughter card, follow the steps below and refer to Figure 4-21. 1. Remove the following screws securing the modem daughter card. • M2×4Z BIND screw ×2 2. Lift up the modem daughter card to disconnect it from the connector CN3000 on the system board. 3. Disconnect the MDC cable from the connector on the modem daughter card.
4.10 Modem Daughter Card (MDC) 4 Replacement Procedures Installing the Modem Daughter Card To install the modem daughter card, follow the steps below and refer to Figure 4-21. 1. Connect the MDC cable to the connector on the modem daughter card. 2. Seat the modem daughter card and press carefully on the card to connect it to the connector CN3000 on the system board. Be careful not to damage the card and connector. 3. Secure the modem daughter card with the following screws.
4 Replacement Procedures 4.11 Wireless LAN board 4.11 Wireless LAN board Removing the Wireless LAN board To remove the wireless LAN board, make sure the computer is in boot mode and powered off, follow the steps below and refer to Figure 4-22. NOTE: The wireless LAN board is an option in some models. This computer supports three types of wireless LAN board (802.11a/g, 802.11b/g or 802.11a/b/g). CAUTION: Do not try to remove the wireless LAN board with the computer turned on.
4.11 Wireless LAN board 4 Replacement Procedures 2. Press the latches outward to release the wireless LAN board. 3. Disconnect the wireless LAN board from the connector on the system board. Be careful not to damage the connector. Installing the Wireless LAN board To install the wireless LAN board, make sure that the computer is in boot mode and powered off, follow the steps below and refer to Figure 4-22. CAUTION: Be sure to switch the computer off before installing the wireless LAN board.
4 Replacement Procedures 4.12 Bluetooth module 4.12 Bluetooth module Removing the Bluetooth module To remove the Bluetooth module, follow the steps below and refer to Figure 4-23. CAUTION: Do not try to remove the Bluetooth module with the computer turned on. You can damage the computer or Bluetooth module. Do not touch the connectors on the Bluetooth module on the computer. Debris on the connectors may cause Bluetooth access problems. 1. Remove the following screw to remove the Bluetooth module.
4.12 Bluetooth module 4 Replacement Procedures Installing the Bluetooth module To install the Bluetooth module, follow the steps below and refer to Figure 4-23. 1. Connect the flexible cable to the Bluetooth module. 2. Connect the Bluetooth cable (brown) to the Bluetooth module. 3. Secure the Bluetooth module with the following screw.
4 Replacement Procedures 4.13 Display assembly 4.13 Display assembly Removing the Display assembly To remove the display assembly, follow the steps below and refer to Figure 4-24 to 4-27. 1. Turn the computer face down, and remove the following screws. • M2.5×16B FLAT HEAD screw ×2 • M2.5×6B FLAT HEAD screw ×2 M2.5×16B FLAT HEAD M2.
4.13 Display assembly 4 Replacement Procedures 2. Turn the computer face up and open the display. 3. Remove the following screw and the LCD cable holder. • M2.5×6B FLAT HEAD screw ×1 4. Disconnect the LCD cable from the connector CN5500 on the system board. 5. Disconnect the power switch cable from the connector CN9600 on the system board. 6. Disconnect the RGB cable from the connector CN5621 on the system board. 7.
4 Replacement Procedures 4.13 Display assembly 11. Remove the following screws securing the display assembly. • M2.5×6B FLAT HEAD screw ×4 M2.5×6B FLAT HEAD M2.
4.13 Display assembly 4 Replacement Procedures 12. Remove the display assembly from the base assembly. Display assembly Figure 4-27 Removing the display assembly (4) NOTE: When removing the display assembly, be careful not to damage any cables.
4 Replacement Procedures 4.13 Display assembly Installing the Display assembly To install the display assembly, follow the steps below and refer to Figure 4-24 and 4-27. 1. Install the display assembly on the base assembly. NOTE: When installing the display assembly, be careful not to pinch or damage any cables. 2. Press along the edges of the display assembly to secure the latches. 3. Connect the microphone cable to the connector CN6001 on the sound board. 4.
4.14 Sound board 4 Replacement Procedures 4.14 Sound board Removing the Sound board To remove the sound board, follow the steps below and refer to Figure 4-28. 1. Disconnect the sound board flexible cable from the connector PJ9510 on the sound board and the connector CN9500 on the system board. 2. Peel off the glass tape on the sound board cable. 3. Remove the following screws fixing the HDD con holder. • M2.5×4B FLAT HEAD screw ×1 4.
4 Replacement Procedures 4.14 Sound board Installing the Sound board To install the sound board, follow the steps below and refer to Figure 4-28. 1. Install the sound board from the right side. 2. Connect the sound board cable to the connector CN9511 on the sound board and the connector CN9501 on the system board. 3. Set the sound board cable while lifting up the HDD con holder. 4. Fix the HDD con holder with the following screws. • M2.5×4B FLAT HEAD screw ×1 5.
4.15 RTC battery / HDD con holder 4 Replacement Procedures 4.15 RTC battery / HDD con holder WARNING: When replacing the RTC battery, be sure to use a genuine battery authorized by Toshiba. Installing the wrong battery could cause a battery explosion or other damage. If the RTC battery is found abnormal, it must not be installed. Replace it with a new battery, and dispose of the old one according to the local regulations.
4 Replacement Procedures 4.15 RTC battery / HDD con holder Removing the RTC battery / HDD con holder To remove the RTC battery / HDD con holder, follow the steps below and refer to Figure 4-29 and 4-30. 1. Disconnect the RTC battery cable from the connector CN9990 on the system board and remove the RTC battery from the slot.
4.15 RTC battery / HDD con holder 4 Replacement Procedures 2. Remove the HDD con holder. HDD con holder Figure 4-30 Removing the HDD con holder Installing the RTC battery / HDD con holder To install the RTC battery/HDD con holder, follow the steps below and refer to Figure 4-29 and 4-30. 1. Install the HDD con holder in position. 2. Install the RTC battery into the slot. 3. Connect the RTC battery cable to the connector CN9990 on the system board.
4 Replacement Procedures 4.16 LAN jack 4.16 LAN jack Removing the LAN jack To remove the LAN jack, follow the steps below and refer to Figure 4-31. 1. Peel off the glass tape on the LAN jack cable. 2. Disconnect the LAN jack cable from the connector CN4100 on the system board. 3. Remove the LAN jack from the slot. Glass tape LAN jack cable LAN jack CN4100 Figure 4-31 Removing the LAN jack Installing the LAN jack To install the LAN jack, follow the steps below and refer to Figure 4-31. 1.
4.17 RGB harness holder / RGB board / Modem jack 4 Replacement Procedures 4.17 RGB harness holder / RGB board / Modem jack Removing the RGB harness holder / RGB board / Modem jack To remove the RGB harness holder / RGB board / modem jack, follow the steps below and refer to Figure 4-32 to 4-34. 1. Remove the following screw securing the RGB harness holder. • M2.5×4B FLAT HEAD screw ×1 2. Take out the RGB harness holder while unhooking the front latches. M2.
4 Replacement Procedures 4.17 RGB harness holder / RGB board / Modem jack 3. Peel off the glass tape. 4. Take out the modem jack from the slot.
4.17 RGB harness holder / RGB board / Modem jack 4 Replacement Procedures 5. Remove the following screw. • M2.5×2.8B FLAT HEAD screw ×1 6. Remove the RGB board and disconnect the RGB harness from the connector CN5622 on the RGB board. M2.5×2.
4 Replacement Procedures 4.17 RGB harness holder / RGB board / Modem jack Installing the RGB harness holder / RGB board / Modem jack To install the RGB harness holder / RGB board / modem jack, follow the steps below and refer to Figure 4-32 to 4-34. 1. Connect the RGB harness to the connector CN5622 on the RGB board. 2. Install the RGB board while inserting the RGB connector to the slot. 3. Secure the RGB board with the following screw. • M2.5×2.8B FLAT HEAD screw ×1 4.
4.18 Fan 4 Replacement Procedures 4.18 Fan Removing the Fan To remove the fan, follow the steps below and refer to Figure 4-35. 1. Remove the following screws securing the fan. • M2.5×4B FLAT HEAD screw ×2 2. Peel off the glass tape and disconnect the fan cable from the connector CN8770 on the system board. 3. Remove the fan. Glass tape Fan cable M2.5×4B FLAT HEAD M2.
4 Replacement Procedures 4.18 Fan Installing the Fan To install the fan, follow the steps below and refer to Figure 4-35. 1. Place the fan. 2. Connect the fan cable to the connector CN8770 on the system board. 3. Secure the fan cable with the glass tape. 4. Secure the fan with the following screws. • 4-56 M2.
4.19 Cooling fin / CPU 4 Replacement Procedures 4.19 Cooling fin / CPU Removing the Cooling fin / CPU To remove the Cooling fin / CPU, follow the steps below and refer to Figure 4-36 to 4-38. CAUTION: 1) The CPU can become very hot during operation. Be sure to let it cool before starting repair work. 2) When you remove the CPU, wipe the grease off of the bottom of the fin and top of the CPU. Apply new grease when installing. 1.
4 Replacement Procedures 4.19 Cooling fin / CPU 3. Remove the cooling fin. CAUTION: Silicon grease is applied between the fin and the CPU. When removing the fin, be careful not to damage the CPU under the fin. Cooling fin CPU Figure4-37 Removing the cooling fin 4. Unlock the CPU by turning the cam on the CPU socket 180 degrees to the counterclockwise with a flat-blade screwdriver (in the order shown in the figure below). Cam Figure 4-38 Unlocking the CPU 5. Remove the CPU.
4.19 Cooling fin / CPU 4 Replacement Procedures Installing the Cooling fin / CPU To install the Cooling fin / CPU, follow the steps below and refer to Figure 36 to 4-40. 1. Make sure the cam is in the open position. 2. Seat the CPU in the CPU socket. Make sure the alignment is exact to avoid damaging pins on the CPU. CAUTION: Place the CPU in such direction as shown below. (Pay attention to the position of the triangle mark on the CPU.) 3.
4 Replacement Procedures 4.19 Cooling fin / CPU 4. Apply new grease on the CPU using a special syringe as shown in the following figure. Apply quarter of scale (0.25ml) of grease evenly on the CPU chip. When silicon grease is already applied to the CPU, wipe them off with a close in advance. CAUTION: When installing the CPU, apply new grease on the top of the CPU chip. When installing the fin, make sure the bottom of the fin covers the top of the CPU. Figure 4-40 Applying new grease 5.
4.20 System board / DC-IN jack 4 4 Replacement Procedures Replacement Procedures 4.20 System board / DC-IN jack Removing the System board / DC-IN jack To remove the system board / DC-IN jack, follow the steps below and refer to Figure 4-41. 1. Remove the following screw securing the system board. • M2.5×4B FLAT HEAD screw ×1 2. Lift up the system board and DC-IN jack. 3. Disconnect the DC-IN jack cable from the connector CN8800 on the system board. M2.
4 Replacement Procedures 4.21 Speaker 4.21 Speaker Removing the Speaker To remove the speaker, follow the steps below and refer to Figure 4-42. 1. Remove the following screws and the speaker holders and speakers (right and left). • M2.5×6B ×2 FLAT HEAD screw Speaker cable Insulator Acetate tape Insulator Insulator Speaker holder Speaker Speaker M2.5×6B FLAT HEAD M2.5×6B FLAT HEAD Speaker holder Figure 4-42 Removing the speakers 2.
4.21 Speaker 4 Replacement Procedures Installing the Speaker To install the speaker, follow the steps below and refer to Figure 4-42 and 4-43. 1. Install the speakers (right and left) to the slot. 2. Install the speaker holders (right and left) while inserting its tip to the slot and secure it with the following screws. • M2.5×6B FLAT HEAD screw ×2 3. Install the speaker cable to the slot while passing through the guide.
4 Replacement Procedures 4.22 Power switch board 4.22 Power switch board Removing the Power switch board To remove the power switch board, follow the steps below and refer to Figure 4-44 and 4-45. 1. Remove the power button holder while pushing three latches from the back.
4.22 Power switch board 4 Replacement Procedures 2. Remove the power switch board from the hole. 3. Disconnect the power switch cable from the connector PJ9610 on the power switch board. Power switch cable PJ9610 Power switch board Figure 4-45 Removing the power switch board Installing the Power switch board To install the power switch board, follow the steps below and refer to the Figure 4-44 and 445. 1. Connect the power switch cable to the connector PJ9610 on the power switch board. 2.
4 Replacement Procedures 4.23 LCD unit / FL inverter 4.23 LCD unit / FL inverter Removing the LCD unit / FL inverter To remove the LCD unit / FL inverter, follow the steps below and refer to Figure 4-46 to 4-51. 1. Remove the two mask seals and the following screws securing the LCD mask. • M2.5×6B FLAT HEAD screw ×2 Mask seal M2.5×6B FLAT HEAD Mask seal M2.
4.23 LCD unit / FL inverter 4 Replacement Procedures 2. Remove the LCD mask while releasing the latches.
4 Replacement Procedures 4.23 LCD unit / FL inverter 3. Remove the following screw securing the FL inverter. • M2×4Z ×1 S-FLAT HEAD screw 4. Peel the insulator. 5. Disconnect the FL cable under the insulator and the HV cable from the FL inverter. 6. Remove the FL inverter.
4.23 LCD unit / FL inverter 4 Replacement Procedures 7. Remove the four mask seals on both the sides of the LCD unit and the following screws securing the LCD unit.
4 Replacement Procedures 4.23 LCD unit / FL inverter 8. Carefully lift up the top of the LCD unit to access the LCD cable. NOTE: When lifting up the top of the LCD unit, hold the corners of the LCD unit. The top edge of LCD unit is sensitive area. 9. Remove the copper tape securing the LCD cable. 10. Disconnect the LCD cable and remove the LCD unit. CAUTION: When removing the LCD cable, be careful not to damage the connector.
4.23 LCD unit / FL inverter 4 Replacement Procedures 11. Remove the following screws and detach the two LCD supports from the LCD unit.
4 Replacement Procedures 4.23 LCD unit / FL inverter 12. Peel off the aluminum cover from the LCD unit.(only for the Samsung-made 14.1inch XGA LCD unit) CAUTION: Peel off the aluminum cover from the LCD unit. (only for Samsung-made 14.1-inch XGA LCD unit). Aluminum cover NOTE: 1) Be careful not to apply pressure to the ICs along the edge of LCD unit. The ICs are easily damaged. 2) For environmental reasons, do not throw away a malfunctioning LCD unit (or FL).
4.23 LCD unit / FL inverter 4 Replacement Procedures Installing the LCD unit / FL inverter To install the LCD unit / FL inverter, follow the steps below and refer to Figure 4-46 to 4-51. 1. Stick the aluminum cover on the LCD unit (only for the Samsung-made14.1-inch XGA LCD unit). CAUTION: When installing the LCD, be careful of the points in the following picture. Back of the right side of LCD Align the edge of the aluminum cover with the corner of LCD unit. Bend the aluminum cover at these lines.
4 Replacement Procedures 4.23 LCD unit / FL inverter Left side of LCD Bend the aluminum cover to the side. Top of the LCD. Bend the aluminum cover to the top of LCD.
4.23 LCD unit / FL inverter 4 Replacement Procedures When sticking the aluminum cover, do not cover the bar code. 2. Secure the two LCD supports to the LCD unit with the following screws. • M2×3C S-FLAT HEAD screw ×4 3. Lean the LCD unit against the lower side of the display cover.
4 Replacement Procedures 4.23 LCD unit / FL inverter 4. Connect the LCD cable to the connector on the back of the LCD unit. Stick the copper tape on the LCD cable. CAUTION: When sticking the copper tape, do not cover the aluminum cover. Align the bottom edge of copper tape with the edge of LCD harness. 5. Seat the LCD unit and secure it with the following screws. • M2×4Z S-FLAT HEAD screw ×4 6. Stick the four mask seals on the sides of the LCD unit. 7.
4.24 Microphone / Wireless LAN antenna / Bluetooth antenna 4 Replacement Procedures 4.24 Microphone / Wireless LAN antenna / Bluetooth antenna Removing the Microphone / Wireless LAN antenna / Bluetooth antenna To remove the microphone / wireless LAN antenna / Bluetooth antenna, follow the steps below and refer to Figure 4-52 and 4-53. 1. Remove the hinge cap (right). 2. Peel off the aluminum tape and five acetate tapes. 3. Take out the microphone from the slot while passing the cable from the hole.
4 Replacement Procedures 4.24 Microphone / Wireless LAN antenna / Bluetooth antenna 4. Remove the ten acetate tapes securing the wireless LAN antenna cables and Bluetooth antenna cable (for wireless LAN/Bluetooth models only). 5. Peel off the wireless LAN antennas and Bluetooth antenna from the display cover. 6. Remove these antennas from the guides and pull them from the hole of the display cover.
4.24 Microphone / Wireless LAN antenna / Bluetooth antenna 4 Replacement Procedures Installing the Microphone / Wireless LAN antenna / Bluetooth antenna To install the microphone / wireless LAN antenna / Bluetooth antenna, follow the steps below and refer to Figure 4-52 and 4-53. 1. Set the microphone into the slot while passing through the cable in place. 2. Stick the five acetate tapes. 3. Stick the wireless LAN antennas and Bluetooth antenna. 4.
4 Replacement Procedures 4.25 Hinge 4.25 Hinge Removing the Hinge To remove the hinge, follow the steps below and refer to Figure 4-54 to 4-57. 1. Remove the following screw and the LCD cable holder. • M2.5×4B FLAT HEAD screw ×1 LCD cable holder M2.
4.25 Hinge 4 Replacement Procedures 2. Remove the hinge cap (at the LCD cable side).
4 Replacement Procedures 4.25 Hinge 3. Remove the two mask seals and the following screws of the LCD cover. • M2.5×2.8B FLAT HEAD screw ×2 4. Remove the following screws securing the hinges on the LCD cover. • M2.5×5B FLAT HEAD screw ×2 M2.5×5B FLAT HEAD Mask seal M2.5×5B FLAT HEAD Hinge M2.5×2.8B FLAT HEAD Hinge Mask seal M2.5×2.
4.25 Hinge 4 Replacement Procedures 5. Remove the following screws securing the hinges at the back and remove the hinges while turning them. • M2.5×6 Tapping screw ×2 Hinge M2.5×6 Tapping Hinge LCD cable M2.5×6 Tapping Figure 4-57 Removing the hinge (2) 6. Pull out the LCD cable from the hole.
4 Replacement Procedures 4.25 Hinge Installing the Hinge To install the hinge, follow the steps below and refer to Figure 4-54 to 4-57. 1. Pass the LCD cable through the hole. 2. Set the both sides hinges and secure them with the following screws (on the back). • M2.5×6 Tapping screw ×2 3. Secure both the hinges with the following screws. • M2.5×5B FLAT HEAD screw ×2 4. Secure the following screws and stick the mask seals. • M2.5×2.8B FLAT HEAD screw ×2 5. Install the hinge cap. 6.
4.26 Fluorescent Lamp 4 Replacement Procedure 4 4.26 Fluorescent Lamp This system uses LCD modules from the following suppliers. The procedure for replacing the fluorescent lamp is different for each LCD module. Refer to the appropriate procedure. Type Part No. Supplier Section G33C0001P110 Samsung 4.26.1 G33C00025110 TMD 4.26.2 G33C00022110 Samsung 4.26.3 14.1-inch (XGA) 14.1-inch (SXGA+) NOTE: - When working with a LCD module, always use a flat, grounded table.
4 Replacement Procedure 4.26 Fluorescent Lamp 4.26.1 Replacing the 14.1-inch XGA Samsung Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module. Disassembling the 14.1-inch XGA Samsung Fluorescent Lamp To disassemble the 14.1-inch XGA Samsung fluorescent lamp, follow the steps below and refer to Figure 4-58 to 4-68. 1.
4.26 Fluorescent Lamp 4 Replacement Procedure 2. Remove the lamp-wire tape and aluminum tape.
4 Replacement Procedure 4.26 Fluorescent Lamp 3. Remove the two screws from the PCB.
4.26 Fluorescent Lamp 4 Replacement Procedure 4. Remove the four screws from the top chassis.
4 Replacement Procedure 4.26 Fluorescent Lamp 5. Separate the panel assembly from the backlight assembly. CAUTION: Handle with care not to damage the COF of S/D and G/D ICs.
4.26 Fluorescent Lamp 4 Replacement Procedure 6. Remove the two clips. 7. Remove the backlight assembly.
4 Replacement Procedure 4.26 Fluorescent Lamp 8. Remove the two screws fixing the back cover of the fluorescent lamp.
4.26 Fluorescent Lamp 4 Replacement Procedure 9. Remove the grounding wire of the fluorescent lamp from the frame.
4 Replacement Procedure 4.26 Fluorescent Lamp 10. Remove the fluorescent lamp from the frame.
4.26 Fluorescent Lamp 4 Replacement Procedure Assembling the 14.1-inch XGA Samsung Fluorescent Lamp To assemble the 14.1-inch XGA Samsung fluorescent lamp, follow the steps below and refer to Figure 4-58 to 4-68. 1. Set the fluorescent lamp on the flame in place. 2. Connect the grounding wire of the fluorescent lamp to the frame. 3. Fix the back cover of the fluorescent lamp with the two screws. 4. Install the backlight assembly. 5. Install the two clips. 6.
4 Replacement Procedure 4.26 Fluorescent Lamp 4.26.2 Replacing the 14.1-inch XGA TMD Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module. Disassembling the 14.1-inch XGA TMD Fluorescent Lamp To disassemble the 14.1-inch XGA TMD fluorescent lamp, follow the steps below and refer to Figure 4-69 to 4-79. Peeling off the tapes and insulation sheets 1.
4.26 Fluorescent Lamp 4 Replacement Procedure CAUTION: (1) Be careful not to damage the TAB. (2) Leave the insulation sheet on the bezel to allow the reuse of the sheet.
4 Replacement Procedure 4.26 Fluorescent Lamp Removing the screws 1. Remove the lamp clip (Reuse it). 2. Spread out the insulation sheet without detaching it from the side of the bezel, as shown in Figure 4-70. 3. In the order (1) and (2) shown in Figure 4-70, remove the screws from the left- and right-hand sides of the module. CAUTION: (1) To unfasten the screws, use an insert bit of point size 0 for Philips screwdrivers. (2) Leave the insulation sheet on the bezel to allow the reuse of the sheet.
4.26 Fluorescent Lamp 4 Replacement Procedure Removing the bezel 1. Turn the LCD module face up with the insulation sheets on it. 2. Release the latches of the bezel and frame. (three points on upper side) CAUTION: Do not damage the TAB when releasing the latches on the upper area.
4 Replacement Procedure 4.26 Fluorescent Lamp Opening the PCB 1. Spread out the PCB horizontally, as shown in Figure 4-72. CAUTION: Be careful not to damage the TAB.
4.26 Fluorescent Lamp 4 Replacement Procedure Removing the PCB-assembly cell 1. Remove the PCB- assembly cell from the backlight unit, as shown in Figure 4-73. 2. Completely remove the double-sided tape remaining on the reverse side of the cell. CAUTION: (1) Remove the tape slowly not to break the cell. The cell and frame are glued by double-sided adhesive tape (as shown in Figure 4-73). (2) Be careful not to remove the light shielding tapes from the upper, left and right sides of the cell.
4 Replacement Procedure 4.26 Fluorescent Lamp Assembling Fluorescent lamp Checking the backlight 1. Check the following items according to Figure 4-74. The frame must not be overlaid with the prism sheet, etc. The frame must not be overlaid with the prism sheet, etc. The sheet must not be dislocated from the frame The sheet must not be dislocated from the frame The sheet must not be dislocated from the frame The frame must not be overlaid with the prism sheet, etc.
4.26 Fluorescent Lamp 4 Replacement Procedure Assembling PCB-assembly cell 1. Remove the release paper of the double-sided tape at the upper of the backlight unit. (See Figure 4-75) 2. Turn the backlight on. 3. Check that the backlight is free of dust, foreign objects, or damage. Perform this check also for the reverse side of the cell. Then install the PCB-assembly cell in the backlight unit.
4 Replacement Procedure 4.26 Fluorescent Lamp Folding down and temporary fixing of the TAB/PCB 1. Fold down the TAB (PCB) toward the reverse side of the backlight unit, as shown in Figure 4-76. CAUTION: Be careful not to damage the TAB.
4.26 Fluorescent Lamp 4 Replacement Procedure Setting the bezel 1. Start installing the bezel in the upward direction until it stops at the top left corner. CAUTION: (1) The GND-CU and lamp reflector on the left-hand side must not go beyond the edges of the bezel. (2) Be careful not to damage the cables and TAB. (3) The bezel latches must be engaged (there are three latches). The fold of lamp reflector must not go beyond the bezel’s edge. First, fit the bezel’s edge close to the lamp.
4 Replacement Procedure 4.26 Fluorescent Lamp Fasten screws of the PCB and bezel 1. Fasten four screws on the left. 2. Fasten four screws on the right. CAUTION: (1) Fasten the screws in the orders shown in Figure 4-78. No loose fastening is allowed. (2) The tightening torque must not exceed 0.147Ｎ･m (1.5kgf･cm) for all the eight screws. (3) For the Philips screwdrivers, use an insert bit of point size 0.
4.26 Fluorescent Lamp 4 Replacement Procedure Attaching the tapes and insulation sheet 1. Attach the PCB insulation sheet (one point). 2. Install the lamp clip. 3. Attach the tape for fixing the lamp clip (one point). 4. Attach the tape for fixing the FL cable (one point). CAUTION: When attaching tape and insulation sheet, be careful not to damage the TAB and lamp cable connections.
4 Replacement Procedure 4.26 Fluorescent Lamp 4.26.3 Replacing the 14.1-inch SXGA+ Samsung Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module. To replace the 14.1-inch SXGA+ Samsung fluorescent lamp, follow the steps below and refer to figures4-80 to 4-85. 1. Remove the PCB cover and CFO cover.
4.26 Fluorescent Lamp 4 Replacement Procedure 2. Remove the lamp-wire tape and Al tape. Lamp-wire tape Al tape Figure 4-81 Replacing Samsung fluorescent lamp (SXGA+) (2) 3. Remove the two screws from the PCB.
4 Replacement Procedure 4.26 Fluorescent Lamp 4. Remove the five screws from the top chassis. Upper right Upper left Bottom left Bottom right Figure 4-83 Replacing Samsung fluorescent lamp (SXGA+) (4) 5. Separate the top chassis from the mold frame.
4.26 Fluorescent Lamp 4 Replacement Procedure 6. Separate the panel assembly from the BLU. CAUTION: Handle with care not to damage COF of S/D and G/D ICs.
4 Replacement Procedure 4.26 Fluorescent Lamp Assembling the 14.1-inch SXGA+ Samsung Fluorescent lamp The assembly procedure of the 14.1-inch SXGA+ Samsung fluorescent lamp is the reverse of the above disassembly procedure.
Appendices
Appendices App-ii TECRA M3 Maintenance Manual (960-507)
Appendices Appendix Contents Appendix A Handling the LCD Module .......................................................................... A-1 Appendix B Board Layout .................................................................................................B-1 B.1 System Board (FAS2S*) Front View.....................................................................B-1 B.2 System Board (FAS2S*) Back View .....................................................................B-3 B.
Appendices C.22 CN9501 USB harness connector (8-pin).............................................................C-22 C.23 CN5621 RG board interface connector (20-pin).................................................C-23 C.24 CN9600 SW board interface connector (8-pin) ..................................................C-23 C.25 CN9510 System board interface connector (40-pin)...........................................C-24 C.26 CN4400 Bluetooth interface connector (20-pin)...........................
Appendices Figures Figure B-1 System board (FAS2S*) layout (front) ..........................................................B-1 Figure B-2 System board (FAS2S*) layout (back)...........................................................B-3 Figure B-3 Sound board (FAS2A*) layout (front/back) ..................................................B-5 Figure B-4 Switch board (FGTSW*) layout (front/back) ................................................B-7 Figure B-5 RGB board (FAS2G*) layout (front/back)....
Appendices Tables Table B-1 System board (FAS2S*) ICs and connectors (front) ........................................B-2 Table B-2 System board (FAS2S*) ICs and connectors (back) ........................................B-4 Table B-3 Sound board (FAS2A*) ICs and connectors (front/back) ................................B-6 Table B-4 Switch board (FGTSW*) connector (front)......................................................B-7 Table B-5 RGB board (FAS2G*) connectors (back) ..........................
Appendices Table C-24 SW board interface connector (8-pin) ............................................................C-23 Table C-25 System board interface connector (40-pin) ....................................................C-24 Table C-26 Bluetooth interface connector (20-pin) ..........................................................C-24 Table C-27 USB0 interface connector (4-pin)...................................................................C-25 Table C-28 USB3 interface connector (4-pin).......
Appendices App-viii TECRA M3 Maintenance Manual (960-507)
Appendix A Handling the LCD Module Appendix A Appendices P Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
Appendices Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4.
Appendix A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
Appendices Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage.
Appendix A Handling the LCD Module Appendices 9. Do not disassemble the LCD module. Disassembly can cause malfunctions. 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxime). These materials can release gas that can damage the panel’s polarization.
Appendices A-6 Appendix A Handling the LCD Module TECRA M3 Maintenance Manual (960-507)
Appendix B Board Layout Appendices Appendix B Board Layout B.
Appendices Appendix B Board Layout Table B-1 System board (FAS2S*) ICs and connectors (front) B-2 Mark Number Name (A) CN4100 Network interface connector (B) CN8810 Main Battery connector (C) CN3001 Modem connector (D) CN3000 MDC connector (E) CN5500 LCD interface connector (F) CN3401 Parallel port connector (G) CN8770 Fan connector (H) CN4200 IEEE1394 connector (I) CN2100 PC card interface connector (J) CN2200 Mini PCI interface connector (K) CN1800 HDD connector (L)
Appendix B Board Layout B.
Appendices Appendix B Board Layout Table B-2 System board (FAS2S*) ICs and connectors (back) B-4 Mark Number Name (A) CN2300 Docking interface connector (B) CN1801 Select-bay interface connector (C) IS2101 SD card interface connector (D) IC5000 MAP34 AGP (E) IC8972 PSC (F) IC3000 HWH (G) IC1200 ALVISO GMCH TECRA M3 Maintenance Manual (960-507)
Appendix B Board Layout B.
Appendices Appendix B Board Layout Table B-3 Sound board (FAS2A*) ICs and connectors (front/back) B-6 Mark Number Name (A) J6000 Headphone connector (B) J6002 External microphone connector (C) CN4600 USB port 0 connector (D) CN4601 USB port 3 connector (E) CN3202 Speaker connector (F) CN9511 USB harness connector (G) CN6001 Internal microphone connector (H) CN9510 System board I/F connector (I) CN4400 Bluetooth I/F connector (J) VR6000 Volume TECRA M3 Maintenance Manual
Appendix B Board Layout B.
Appendices B.
Appendix C Pin Assignments Appendices Appendix C Appendix C Pin Assignments System board C.1 IS1400 SO-DIMM0 connector (200-pin) Table C-1 SO-DIMM0 connector (200-pin) (1/3) Pin No. Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments Table C-1 SO-DIMM0 connector (200-pin) (2/3) Pin No. C-2 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices Table C-1 SO-DIMM0 connector (200-pin) (3/3) Pin No. Signal Name I/O Pin No.
Appendices C.2 Appendix C Pin Assignments IS1410 SO-DIMM1 connector (200-pin) Table C-2 SO-DIMM1 connector (200-pin) (1/3) Pin No. C-4 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices Table C-2 SO-DIMM1 connector (200-pin) (2/3) Pin No. Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments Table C-2 SO-DIMM1 connector (200-pin) (3/3) Pin No. C-6 Signal Name I/O Pin No.
Appendix C Pin Assignments C.3 Appendices CN1800 HDD interface connector (44-pin) Table C-3 HDD interface connector (44-pin) Pin No. Signal Name I/O Pin No.
Appendices C.4 Appendix C Pin Assignments CN1801 Select bay interface connector (72-pin) Table C-4 Select bay interface connector (72-pin) Pin No. C-8 Signal Name I/O Pin No.
Appendix C Pin Assignments C.5 Appendices CN2100 PC card interface connector (150-pin) Table C-5 PC card interface connector (150-pin) (1/3) Pin No. Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments Table C-5 PC card ard interface connector (150-pin) (2/3) Pin No. C-10 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices Table C-5 PC card interface connector (150-pin) (3/3) Pin No. C.6 Signal Name I/O Pin No. Signal Name I/O 145 ACAD01-EYP I/O 146 ACAD02-EYP I/O 147 ACAD00-EYP I/O 148 ACCD1-E3N I 149 GND - 150 GND - IS2101 SD card interface connector (12-pin) Table C-6 SD card interface connector (12-pin) Pin No. C.7 Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments Table C-7 Mini PCI interface connector (124-pin) (2/3) Pin No. C-12 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices Table C-7 Mini PCI interface connector (124-pin) (3/3) Pin No. Signal Name I/O Pin No.
Appendices C.8 Appendix C Pin Assignments CN2300 Docking interface connector (240-pin) Table C-8 Docking interface connector (240-pin) (1/4) Pin No. C-14 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices Table C-8 Docking interface connector (240-pin) (2/4) Pin No. Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments Table C-8 Docking interface connector (240-pin) (3/4) Pin No. C-16 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices Table C-8 Docking interface connector (240-pin) (4/4) Pin No. C.9 Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments C.10 CN3001 Modem connector (4-pin) Table C-10 Modem connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 MDMRNG-E3P I/O 2 MDMRNG-E3P I/O 3 MDMTIP-E3P I/O 4 MDMTIP-E3P NC I/O C.11 CN3200 Keyboard interface connector (34-pin) Table C-11 Keyboard interface connector (34-pin) Pin No. C-18 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices C.12 CN3201 PAD interface connector (8-pin) Table C-12 PAD interface connector (8-pin) Pin No. 1 3 5 7 Signal Name SP-P5V SPY-PXP GND IPDDAT-P5P I/O Pin No. O I/O 2 4 6 8 Signal Name SPX-PXP SP-GND IPDCLK-P5P P5V I/O O I/O - C.13 CN3401 Parallel interface connector (25-pin) Table C-13 Parallel interface connector (25-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments C.15 CN4200 IEEE 1394 interface connector (4-pin) Table C-15 IEEE 1394 interface connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 TPB0-P3N I/O 2 TPB0-P3P I/O 3 TPA0-P3N I/O 4 TPA0-P3P I/O C.16 CN5500 LCD interface connector (40-pin) Table C-16 LCD interface connector (40-pin) Pin No. C-20 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices C.17 CN8800 DC-IN connector (4-pin) Table C-17 DC-IN connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 ADPDC - 2 ADPDC - 3 GND - 4 GND - C.18 CN8810 1st Battery connector (10-pin) Table C-18 1st Battery connector (10-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 (PVBL1) - 2 BTMP1 I 3 (DCHG) - 4 M5V - 5 PSCL-S5P I/O 6 PSDA-S5P 7 GND - 8 DBT10V-S5N I 9 GND - 10 GND - I/O C.
Appendices Appendix C Pin Assignments C.21 CN9500 SN board interface connector (40-pin) Table C-21 SN board interface connector (40-pin) Pin No. Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices C.23 CN5621 RG board interface connector (20-pin) Table C-23 RG board interface connector (20-pin) Pin No. 1 3 5 7 9 11 13 15 17 19 Signal Name RED-PXP GREEN-PXP BLUE-PXP GND SVSYNC-P3P GND CRTSCL-P5P GND TVCHRO-PXP TVLUMA-PXP I/O Pin No. O O O O O O O 2 4 6 8 10 12 14 16 18 20 Signal Name GND GND GND GND SHSYNC-P3P GND CRTSDA-P5P PVON-S5P GND GND I/O O O I - C.
Appendices Appendix C Pin Assignments SN Board C.25 PJ9510 System board interface connector (40-pin) Table C-25 System board interface connector (40-pin) Pin No. 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 C.26 Signal Name SND-P5V SND-P5V ATBEEP-E3P SND-GND SND-GND SNDMUT-S3N GND P3V DINL-PXN DINR-PXN DOUTL-PXN DOUTR-PXN X97BCK-P3P M97IN1-P3P M97OT1-P3P PCBEEP-E3P WCHCLK-P3P GND BTRST-S3N USBP4-S3N I/O Pin No.
Appendix C Pin Assignments Appendices C.27 CN4600 USB0 interface connector (4-pin) Table C-27 USB0 interface connector (4-pin) Pin No. Signal Name 1 USBOPS-E5V 3 USB0-S3P I/O Pin No. Signal Name I 2 USBP0-S3N I/O 4 GND I/O I/O - C.28 CN4601 USB3 interface connector (4-pin) Table C-28 USB3 interface connector (4-pin) Pin No. Signal Name 1 USBOPS-E5V 3 USBP1-S3P I/O Pin No. Signal Name I 2 USBP3-S3N I/O 4 GND I/O I/O - C.
Appendices Appendix C Pin Assignments C.32 J6000 Headphone connector (6-pin) Table C-32 Headphone connector (6-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 A-GND - 2 HEADL-PXP O 3 HEADR-PXP O 4 A-GND - 5 (SPKEN-P5P) I 6 NC - C.33 CN9511 USB harness connector (8-pin) Table C-33 USB harness connector (8-pin) Pin No. 1 3 5 7 C-26 Signal Name GND USBP3-S3N USB0PS-E5V USBP0-S3N I/O Pin No.
Appendix C Pin Assignments Appendices RG Board C.34 CN5622 System board interface connector (20-pin) Table C-34 System board interface connector (20-pin) Pin No. 1 3 5 7 9 11 13 15 17 19 Signal Name TV-GND VGA-GND GND E5V CRTSCL-P5P GND SHSYNC-P3P BLUE-PXP GREEN-PXP RED-PXP I/O Pin No. I I I I I 2 4 6 8 10 12 14 16 18 20 Signal Name TVLUMA-PXP TVCHRO-PXP PVON-S5P E5V CRTSDA-P5P SVSYNC-P3P VGA-GND VGA-GND VGA-GND GND I/O I I O I I - C.
Appendices Appendix C Pin Assignments SW Board C.37 PJ9610 System board interface connector (8-pin) Table C-37 System board interface connector (8-pin) Pin No. C-28 Signal Name I/O Pin No.
Appendix D Keyboard Scan/Character Codes Appendices Appendix D Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) D-2 Cap No.
Appendix D Keyboard Scan/Character Codes Appendices Table D-1 Scan codes (set 1 and set 2) (3/4) Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap No. Keytop Code set 1 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 126 Pause *7 *7 *7 *7 *7 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Make Code set 2 Break Make Note Break Notes: 1. 2. 3. 4. 5. 6. 7. D-4 * * * * * * * Scan codes differ by mode.
Appendix D Keyboard Scan/Character Codes Appendices Table D-2 Scan codes with left Shift key Cap Key No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
Appendix D Keyboard Scan/Character Codes Appendices Table D-5 Scan codes in overlay mode Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-7 No.126 key scan code Key top Shift Code set 1 Code set 2 Make Make Pause Common * E1 1D 45 E1 Ctrl* E0 46 E0 C6 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E 14 F0 77 *: This key generates only make codes.
Appendix E Key Layout Appendices Appendix E Appendix E E.1 Key Layout United Kingdom (UK) Keyboard Figure E-1 UK keyboard E.
Appendices E-2 Appendix E Key Layout TECRA M3 Maintenance Manual (960-507)
Appendix F Wiring diagrams Appendices Appendix F Appendix F F.1 Wiring diagrams Parallel Port Wraparound Connector Figure F-1 Parallel port wraparound connector F.
Appendices F-2 Appendix F Wiring diagrams TECRA M3 Maintenance Manual (960-507)
Appendix G BIOS rewrite procedures Appendices Appendix G Appendix G BIOS rewrite procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk for the computer that has renewed BIOS data. Rewriting the BIOS 1. Set the system to boot mode. 2. Turn off the power to the computer. 3. Remove the external cable and PC card. 4.
Appendices Appendix G BIOS rewrite procedures G-2 TECRA M3 Maintenance Manual (960-507)
Appendix H EC/KBC rewrite procedures Appendices Appendix H Appendix H EC/KBC rewrite procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. Tools To rewrite the EC/KBC, you need the following tool: BIOS/EC/KBC rewriting disk for the computer Rewriting the EC/KBC NOTE: 1. Rewrite the EC/KBC only when instructed by a diagnostic disk release notice. 2. Connect the AC adaptor to the computer when you rewrite the EC/KBC. 3.
Appendices H-2 Appendix H EC/KBC rewrite procedures TECRA M3 Maintenance Manual (960-507)
Appendix I Reliability Appendices Appendix I Appendix I Reliability The following table shows MTBF (Mean Time Between Failures).
Appendices I-2 Appendix I Reliability TECRA M3 Maintenance Manual (960-507)
