Toshiba Personal Computer TECRA M9 Maintenance Manual TOSHIBA CORPORATION File Number 960-631 [CONFIDENTIAL]
Copyright © 2007 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein. Toshiba Personal Computer TECRA M9Maintenance Manual First edition April 2007 Disclaimer The information presented in this manual has been reviewed and validated for accuracy.
Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer TECRA M9. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field. SAFETY PRECAUTIONS Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the TECRA M9 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Table of Contents Chapter 1 Hardware Overview 1.1 Features ...................................................................................................................... 1-1 1.2 System Unit Block Diagram ...................................................................................... 1-8 1.3 3.5-inch Floppy Disk Drive (USB External) ........................................................... 1-14 1.4 2.5-inch Hard Disk Drive.............................................................
Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ................................................................................... 3-4 3.3 Setting of the hardware configuration ....................................................................... 3-9 3.4 Heatrun Test.......................................................................................
Chapter 4 Replacement Procedures 4.1 Overview................................................................................................................... 4-1 4.2 Battery pack .............................................................................................................. 4-8 4.3 PC card/SD card...................................................................................................... 4-10 4.4 Memory module B ...........................................................
Appendices Appendix A Handling the LCD Module ........................................................................... A-1 Appendix B Board Layout ................................................................................................ B-1 Appendix C Pin Assignments............................................................................................ C-1 Appendix D Keyboard Scan/Character Codes ..................................................................
x [CONFIDENTIAL] TECRA M9 Maintenance Manual (960-631)
Chapter 1 Hardware Overview [CONFIDENTIAL]
1 Hardware Overview 1-ii [CONFIDENTIAL] TECRA M9 Maintenance Manual (960-631)
1 Hardware Overview Chapter 1 Contents 1.1 Features.......................................................................................................................1-1 1.2 System Unit Block Diagram.......................................................................................1-8 1.3 3.5-inch Floppy Disk Drive (USB External)............................................................1-14 1.4 2.5-inch Hard Disk Drive .....................................................................
1 Hardware Overview Figures Figure 1-1 Front of the computer ....................................................................................1- 6 Figure 1-2 System unit configuration..............................................................................1- 7 Figure 1-3 System unit block diagram ............................................................................1- 8 Figure 1-4 3.5-inch FDD (USB External) .....................................................................
1.1 Features 1.1 1 Hardware Overview Features The Toshiba TECRA M9 Personal Computer uses extensive Large Scale Integration (LSI), and Complementary Metal-Oxide Semiconductor (CMOS) technology extensively to provide compact size, minimum weight, low power usage and high reliability. This computer incorporates the following features. There some models and options. Refer to the Parts List for the configuration of each model and options.
1 Hardware Overview 1.1 Features USB FDD A 3.5-inch USB FDD accommodates 2HD (1.44MB) or 2DD (720KB) disks. Slim Bay An Optical drive, 2nd HDD can be installed in the Slim Bay. Optical Drive A CD-ROM drive, DVD Super Multi drive can be installed in the Slim Bay. Display The PC comes in with one of the following two types: • 14.1” WXGA-TFT color display, resolution 1,280×800 • 14.
1.1 Features 1 Hardware Overview Universal Serial Bus (USB2.0) Three USB ports are provided. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported. IEEE 1394 port The computer comes with one IEEE 1394 port. It enables high-speed data transfer directly from external devices such as digital video cameras.
1 Hardware Overview 1.1 Features Docking interface port The docking interface port enables connection of an optional Express Port Replicator. It provides additional features as follows: • RJ45 LAN jack • External monitor port • DC IN 15V jack • Security lock slot • Universal Serial Bus 2.
1.1 Features 1 Hardware Overview Internal modem The computer contains a MDC, enabling data and fax communication. It supports ITU-T V.90 (V.92). The transfer rates are 56 Kbps for data reception, 33.6 Kbps for data transmission, and 14,400 bps for fax transmission. However, the actual speed depends on the line quality. The RJ11 modem jack is used to accommodate a telephone line. Both of V.90 and V.92 are supported only in USA, Canada and Australia. Only V.90 is available in other regions.
1 Hardware Overview 1.1 Features The front of the computer is shown in figure 1-1.
1.1 Features 1 Hardware Overview The system unit configuration is shown in figure 1-2.
1 Hardware Overview 1.2 1.2 System Unit Block Diagram System Unit Block Diagram Figure 1-3 is a block diagram of the system unit.
1.2 System Unit Block Diagram 1 Hardware Overview The system unit is composed of the following major components: Processor • Intel® CoreTM 2 Duo Processor • Core speed: • 2.40GHz (T7700) /2.20GHz (T7500) / 2.00GHz (T7300) In the case of Processor which built in 4MB L2 cache memory • 1.80GHz (T7100) In the case of Processor which built in 2MB L2 cache memory ( ): Processor Number – Processor bus speed: 800MHz – Core voltage: 0.50V to 1.
1 Hardware Overview 1.2 System Unit Block Diagram Intel Crestline-GM (North Bridge) • Features: – Meorom Processor System Bus Supports – PCI Express Based Graphics Interface – System Memory supports :DDR2-533／DDR2-667, 4GB max. – DMI(Direct Media Interface) – Power management control (ACPI2.0 conformity) Intel ICH8M (South Bridge) • Features: – DMI(Direct Media Interface) – PCI Express Interface – PCI Bus I/F Rev2.
1.2 System Unit Block Diagram 1 Hardware Overview Cardbus controller (TI PCI8412ZHK) − PCI Interface(PCI Rev.2.2) − SD IO Controller(Ver.1.1) − CardBus / Ultra media Controller (Yenta Ver.2.2:1 socket) − SD/MMC(SDHC Ver. 1.2 revised edition) , Memory Stick, Memory Stick pro, XD Card Controller − 1394 Controller − 16 x16x1.4mm BGA Package − VGA Graphics interface in North Bridge (Intel Crestline-GM) is used.
1 Hardware Overview 1.2 System Unit Block Diagram PSC (Power Supply Controller) • One TMP86FS49AUG chip is used. • This controller controls the power sources. Clock Generator • IDT 9LPR501PGLFT is used. • This device generates the system clock. Modem Controller • One MDC is used. • This controller has the following functions: – One RJ11 port – Azalia MDC1.5 – V.92 (V.90) 56K Modem/FAX – Ring wake up support Internal LAN Controller • Intel made only GigaBit Ether is used.
1.2 System Unit Block Diagram 1 Hardware Overview Wireless LAN • One PCI-Ex MiniCard • Intel Kedron a/b/g or a/b/g/n • Supports Wireless Communication SW • Supports W-LAN via PCMCIA (Euro : GSM/GPRS) Super I/O • SMSC LPC47N217-JV chip is used. • This gate array has the following features: – Serial Port Controller – GPIO Controller Bluetooth • V2.0+EDR • USB interface connection Sensor • Thermal Sensor: One ADM1032ARMZ chip is used. • LCD Sensor: One NRS-701-1015T chip is used.
1 Hardware Overview 1.3 1.3 3.5-inch Floppy Disk Drive (USB External) 3.5-inch Floppy Disk Drive (USB External) The 3.5-inch FDD is a thin, high-performance reliable drive that supports 720KB (formatted) 2DD and 1.44MB (formatted) 2HD disks. The FDD is shown in figure 1-4. The specifications for the FDD are listed in Table 1-1. Figure 1-4 3.5-inch FDD (USB External) Table 1-1 3.5-inch FDD specifications TEAC FD-05PUB-337 (G8AC0000B320) Items Data transfer rate FDD part USB 720KB mode 1.
1.4 2.5-inch Hard Disk Drive 1.4 1 Hardware Overview 2.5-inch Hard Disk Drive The removable HDD is a random access non-volatile storage device. It has a non-removable 2.5-inch magnetic disk and mini-Winchester type magnetic heads. The computer supports a 80GB, 120GB or 160GB. The HDD is shown in figure 1-5. Specifications are listed in Table 1-2. Figure 1-5 2.5-inch HDD Table 1-2 2.
1 Hardware Overview 1.5 1.5 DVD-Super Multi Drive DVD-Super Multi Drive This drive is a combination of DVD-ROM and DVD±R/±RW/-RAM Drive. It is full-size and runs either 12cm (4.72-inch) or 8cm (3.15-inch) DVD/CDs without an adaptor. It reads DVDs at maximum 8-speed and CDs at maximum 24-speed. It also writes CD-R at maximum 24-speed, CD-RW at maximum 16-speed, DVD-R at maximum 8-speed, DVDRW at maximum 6-speed, DVD+R at maximum 8-speed, DVD +RW at maximum 8-speed and DVD-RAM at maximu5 speed.
1.6 Keyboard 1.6 1 Hardware Overview Keyboard The keyboard is mounted 85(US)/87(UK) keys that consist of character key and control key, and in conformity with JIS. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-6 is a view of the keyboard. See Appendix E about a layout of the keyboard.
1 Hardware Overview 1.7 1.7 TFT Color Display TFT Color Display The TFT color display consists of 14.1-inch WXGA/WXGA+ LCD module and FL inverter board. 1.7.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 16M colors with 1,280 x 800 or 1,440 x 900 resolution. The Intel Crestline-GM can control internal and external WXGA or WXGA+ support displays simultaneously.
1.7 TFT Color Display 1 Hardware Overview Table 1-4 LCD module specifications (3/3) Item Number of Dots Dot spacing (mm) Display range (mm) TECRA M9 Maintenance Manual (960-631) Specifications 14.1-inch WXGA+ TFT (G33C00043110) 1,440 (W) x 900 (H) 0.2109 (H) x 0.2109 (V) 303.
1 Hardware Overview 1.7.2 1.7 TFT Color Display FL Inverter Board The FL inverter board supplies a high frequency current to illuminate the LCD module. Table 1-5 lists the FL inverter board specifications. Table 1-5 FL inverter board specifications Item Specifications G71C0006A110 Input Output 1-20 Voltage (V) DC 5 Power (W) 7 Voltage (V) 750 Current (mA) 5.
1.8 Power Supply 1.8 1 Hardware Overview Power Supply The power supply supplies many different voltages to the system board and performs the following functions: 1. Judges that the DC power supply (AC adapter) is connected to the computer. 2. Detects DC output and circuit malfunctions. 3. Controls the battery icon, and DC IN icon. 4. Turns the battery charging system on and off and detects a fully charged battery. 5. Turns the power supply on and off. 6.
1 Hardware Overview 1.8 Power Supply Table 1-6 Power supply output rating (1/4) Use Voltage (V) Name CK-EYV Clock Gen 3.3 M-E3V P3V CPU 1.05 1R05-P1V 1.5 1R05-P1V 0.55-1.325 (G)MCH Memory ICH8M(-E) 1-22 PPV 1.05 1R05M-E1V 1.05 1R05-P1V 1.25 1R25M-E1V 1.25 1R25-P1V 1.5 1R5-P1V 1.8 1R8-B1V 1.05 IGD-PGV 3.3 P3V 0.9 0R9-B0V 1.8 1R8-B1V 1.05 1R05-P1V 1.25 1R25-P1V 1.5 1R5-P1V 3.3 E3V 3.3 LAN-E3V 3.3 P3V 2-3.
1.8 Power Supply 1 Hardware Overview Table 1-6 Power supply output rating (2/4) Use Voltage (V) ODD Name 3.3 P3V 5 P5V 3.3 SB-P3V 5 SB-P5V 3.3 P3V 5 P5V 3.3 P3V 3.3 MCVCCA-PYV 5 MCVPPA-PYV 5 P5V 3.3 P3V SD Card 3.3 FM-P3V SD Card PS 3.3 P3V 1.5 CRD1R5-P1V 3.3 CRD-E3V 3.3 CRD-P3V 1.5 1R5-P1V 3.3 E3V 3.3 P3V 1.5 1R5-P1V 3.3 E3V 3.3 P3V HDD Card Cont.
1 Hardware Overview 1.8 Power Supply Table 1-6 Power supply output rating (3/4) Use Voltage (V) SIM Card 3.3 UIMPWR-E3V 1.5 1R5-P1V 3.3 P3V SPI 3.3 LAN-E3V MDC 3.3 E3V EC/KBC 3.3 S3V Touch Pad 5 SP-P5V LED 5 M5V 3.3 E3V 3.3 P3V 3.3 S3V 3.3 FS-E3V 5 FS-E5V Robson TPM Accelerometer Finger Sens. Finger Sens PS. 3.3 E3V Super I/O 3.3 P3V RS232C Driver 3.3 P3V 1.05 LN1R0- E1V 1.8 LN1R8- E1V 3.3 LNP -E3V LAN PS 3.3 E3V Bluetooth 3.
1.8 Power Supply 1 Hardware Overview Table 1-6 Power supply output rating (4/4) Use GPU VRAM LCD Voltage (V) Name 1.2 1R2-P1V 1.8 1R8-P1V 3.3 P3V 1.0-1.1 PGV 1.8 5 3.3 1R8-P1V FL-P5V PNL-P3V 5 P5V 3.3 P3V 2.5 2R5-P2V 4.7 A4R7-P4V 5 SND-P5V 4.7 A4R7-P4V 3.3 P3V Headphone AMP 3.
1 Hardware Overview 1.9 1.9 Batteries Batteries The computer has three types of batteries as follows: Main battery pack RTC battery The battery specifications are listed in Table 1-7. Table 1-7 Battery specifications Battery name Main battery Material Capacity battery G71C00083110/210 Lithium-Ion 10.8 V 4,000 mAh battery G71C00084110/210 Lithium-Ion 10.8 V 5,100 mAh Lithium-Ion 10.8 V Lithium-Ion 10.8 V NiMH 2.
1.9 Batteries 1.9.2 1 Hardware Overview Battery Charging Control Battery charging is controlled by a power supply microprocessor. The microprocessor controls whether the charge is on or off and detects a full charge when the AC adaptor and battery are attached to the computer. The system charges the battery. Battery Charge When the AC adaptor is attached, there are two types of charge: When the system is powered off and when the system is powered on.
1 Hardware Overview 1.9.3 1.9 Batteries RTC battery The RTC battery provides power to keep the current date, time and other setup information in memory while the computer is turned off. Table 1-9 lists the charging time and data preservation period of the RTC battery.
1.10 AC Adapter 1 Hardware Overview 1.10 AC Adapter The AC adapter is also used to charge the battery. Table 1-10 lists the AC adapter specifications. Table 1-10 AC adapter specifications Parameter Specification G71C0006Q210 (2-pin) Power Input voltage Input frequency Input current B Output voltage Output current TECRA M9 Maintenance Manual (960-631) G71C0006R210 (3-pin) 75W (Peak 90W) 100V/240V 50Hz to 60Hz 1.
1 Hardware Overview 1-30 1.
Chapter 2 Troubleshooting Procedures [CONFIDENTIAL]
2 Troubleshooting Procedures 2-ii [CONFIDENTIAL] TECRA M9 Maintenance Manual (960-631)
2 Troubleshooting Procedures Chapter 2 Contents 2.1 Troubleshooting..........................................................................................................2-1 2.2 Troubleshooting Flowchart ........................................................................................2-2 2.3 Power Supply Troubleshooting ..................................................................................2-6 2.4 2.5 2.6 2.7 Procedure 1 Icons in the LCD Check..............................
2 Troubleshooting Procedures 2.8 2.9 2.10 2.11 2.12 2.13 2.14 2.15 2-iv Display Troubleshooting ..........................................................................................2-42 Procedure 1 External Monitor Check.............................................................2-42 Procedure 2 Diagnostic Test Program Execution Check ...............................2-42 Procedure 3 Connector Check and Cable Check ...........................................
2 Troubleshooting Procedures 2.16 Fingerprint sensor Troubleshooting .........................................................................2-59 Procedure 1 Setting Windows Log-ON password .........................................2-60 Procedure 2 Registration of fingerprint..........................................................2-60 Procedure 3 Authentication of fingerprint .....................................................2-67 Procedure 4 Connector Check and Replacement Check................
2 Troubleshooting Procedures Figures Figure 2-1 Troubleshooting flowchart ..................................................................................2-3 Figure 2-2 Printer port LED board ......................................................................................2-19 Figure 2-3 Function of Printer port LED.............................................................................2-19 Tables Table 2-1 Battery icon............................................................................
2.1 Troubleshooting 2 Troubleshooting Procedures 2 2.1 Troubleshooting Chapter 2 describes how to determine if a Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. The FRUs covered are: 1. 2. 3. 4. 5. Power Supply System Board USB Floppy Disk Drive Hard Disk Drive Keyboard/Dual point 6. 7. 8. 9. 10. Display Optical Drive Modem LAN Bluetooth 11. 12. 13. 14. .
2 Troubleshooting Procedures 2.2 2.2 Troubleshooting Flowchart Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which FRU malfunctions. Before going through the flowchart steps, check the following: Ask the user if a password is registered and, if it is, ask him or her to enter the password. Make sure that Toshiba Windows is installed on the hard disk. Non-Toshiba operating systems can cause the computer malfunction.
2.
2 Troubleshooting Procedures 2.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures If the diagnostics program cannot detect an error, the problem may be intermittent. The Running Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error, then perform the appropriate troubleshooting procedures as follows: 1.
2 Troubleshooting Procedures 2.3 2.3 Power Supply Troubleshooting Power Supply Troubleshooting The power supply controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2.3 Power Supply Troubleshooting Procedure 2 2 Troubleshooting Procedures Error Code Check If the power supply microprocessor detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit.
2 Troubleshooting Procedures Check 1 2.3 Power Supply Troubleshooting Compare the patterns in the hexadecimal error code to the tables below. AC Adaptor Error code Meaning 10h AC Adaptor output voltage is over 16.5V. 11h Express Port Replicator voltage is over 16.5V. 12h Current from the DC power supply is over 7.00A. 13h Current from the DC power supply is over 0.5A when there is no load. 14h Correction value of 0[A] is out of designed value.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures 1R5-C1V output (P62) Error code Meaning 60h 1R5-C1V voltage is over 2.15V when the computer is powered on/off. 61h 1R5-C1V voltage is 1.275V or less when the computer is powered on. 62h 1R5-C1V voltage is 1.275V or less when the computer is booting up 63h 1R5-C1V voltage is 1.275V or less when the computer is suspended. 64h 1R5-C1V voltage is not Normal when the CV support is in Shutdown(s) state. 65h 1R5-C1V voltage is 1.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting 1R9-B1V output (P66:MUX- CH0) Error code Meaning A0h 1R9-B1V voltage is over 2.40V when the computer is powered on/off. A1h 1R9-B1V voltage is 1.53V or less when the computer is powered on. A2h 1R9-B1V voltage is 1.53V or less when the computer is booting up A3h 1R9-B1V voltage is 1.53 or more when the computer is powered off. A4h 1R9-B1V voltage is 1.53V or less when the computer is suspended.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures 1R9-B1V output (P66:MUX- CH1) Error code Meaning E0h 1R9-B1V voltage is over 2.40V when the computer is powered on/off. E1h 1R9-B1V voltage is 1.53V or less when the computer is powered on. E2h 1R9-B1V voltage is 1.53V or less when the computer is booting up E3h 1R9-B1V voltage is 1.53 or more when the computer is powered off. E4h 1R9-B1V voltage is 1.53V or less when the computer is suspended.
2 Troubleshooting Procedures Check 2 2.3 Power Supply Troubleshooting In the case of error code 10h or 12h: Make sure the AC adaptor cord and AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet. If the cables are connected correctly, go to the following step: Connect a new AC adaptor and/or AC power cord, if necessary. If the error still exists, go to Procedure 5. Check 3 In the case of error code 2Xh: Make sure the battery pack is correctly installed in the computer.
2.3 Power Supply Troubleshooting Procedure 3 2 Troubleshooting Procedures Connection Check The power supply wiring diagram is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Disconnect the AC power cord from the wall outlet. Check the power cable for breaks. If the power cord is damaged, connect a new AC power cord. If there is no damage, go to Check 2.
2 Troubleshooting Procedures Procedure 4 2.3 Power Supply Troubleshooting Charge Check The power supply may not charge the battery pack. Perform the following procedures: 1. Reinstall the battery pack. 2. Attach the AC adaptor and turn on the power. If you cannot turn on the power, go to Procedure 5. 3. Run the Diagnostic test, go to System test and execute subtest 04 (Quick charge) described in Chapter 3. 4. When charge is complete, the diagnostics test displays the result code.
2.3 Power Supply Troubleshooting Procedure 5 2 Troubleshooting Procedures Replacement Check The system board processor module may be disconnected or damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures. Check the connection between the AC adaptor and system board and connection. After checking the connections, perform the following Check 1: Check 1 Replace the AC adaptor with a new one. If the AC adaptor is still not functioning properly, perform Check 2.
2 Troubleshooting Procedures 2.4 2.4 System Board Troubleshooting System Board Troubleshooting This section describes how to determine if the system board and CPU are defective or not functioning properly. Start with Procedure 1 and continue with the other procedures as instructed.
2.4 System Board Troubleshooting Procedure 1 2 Troubleshooting Procedures Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it. If an error message is shown on the display, perform Check 1. If there is no error message, go to Procedure 2. If DOS or Windows is properly loaded, go to Procedure 3.
2 Troubleshooting Procedures Check 2 2.4 System Board Troubleshooting The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (22) or (23) appears, go to Procedure 4. If the error message (18) appears, go to the Keyboard Troubleshooting Procedures in Section 2.7. If the error message (19), (20) or (21) appears, go to the HDD Troubleshooting Procedures in Section 2.6.
2.4 System Board Troubleshooting Procedure 2 2 Troubleshooting Procedures Serial Port Check (Boot Mode) Check the D port status by a serial port test. The tool for serial port test is shown below. Figure 2-2 A set of tool for serial port test The test procedures are follows: 1. Connect the RS-232C cross-cable to the connector CN34200 of the system board.. 2. Connect the RS-232C Cross-cable to the PC that displays the test results. 4. Boot the compute1r in DOS mode. 5. Execute GETDPORT.
2 Troubleshooting Procedures 2.
2.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Serial port (Boot mode) error status (3/9) D port Status F100h Test item Message Renewal of a microcode （Only support model） Prohibition of cache Permission of L1/L2 cache in FlashROM area Initialization of H/W (before DRAM recognition) Initialization of MCH Initialization of ICH6M D30.Func0 Initialization of ICH6M.D31.Func0 Initialization of ICH6M.D31.Func1/2 Initialization of USB Controller Initialization of ICH6M.D31.
2.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Serial port (Boot mode) error status (5/9) D port Status Test item (F106h) Contents Check of parameter block A Permission of SMI except auto-off function Control of excess of rated input power Battery discharging current control (1CmA).
2.
2 Troubleshooting Procedures 2.
2.
2 Troubleshooting Procedures 2.
2.4 System Board Troubleshooting Procedure 3 2 Troubleshooting Procedures Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. Refer to Chapter 3, Tests and Diagnostics, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test 6. Async test 7. Hard Disk test 8. Real Timer test 9. NDP test 10. Expansion test 11. CD-ROM/DVD-ROM test 12. Wireless LAN test 13. Sound test 14.
2 Troubleshooting Procedures Procedure 4 2.4 System Board Troubleshooting Replacement Check The system board connectors may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform Check 1. Check 1 Visually check for the following: a) Cracked or broken connector housing b) Damaged connector pins If their connectors are in good condition, but there is still a problem, go to Check 2. Check 2 2-30 The system board may be damaged.
2.5 USB FDD Troubleshooting 2.5 2 Troubleshooting Procedures USB FDD Troubleshooting This section describes how to determine if the USB FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.5 USB FDD Troubleshooting Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Floppy disk drive test error codes and their status names are listed in Table 2-6. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled.
2.5 USB FDD Troubleshooting Procedure 3 2 Troubleshooting Procedures Connector Check and Replacement Check The USB FDD is connected to the System Board. Check 1 When using the USB port, make sure the USB FDD cable is firmly connected to CN4612 , CN4611 or CN4610 on the System board. If any of the connections are loose, reconnect firmly and repeat Procedure 2. If any of the connections is damaged, or there is still an error, go to Check 2.
2 Troubleshooting Procedures 2.6 HDD Troubleshooting 2 2.6 HDD Troubleshooting This section describes how to determine if the HDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.6 HDD Troubleshooting Procedure 2 2 Troubleshooting Procedures Partition Check Insert the Toshiba MS-DOS system disk and restart the computer with U key holding down. Perform the following checks: Check 1 Type C: and press Enter. If you cannot change to drive C, go to Check 2. If you can change to drive C, go to Check 3. Check 2 Type FDISK and press Enter. Choose Display Partition Information from the FDISK menu. If drive C is listed, go to Check 3.
2 Troubleshooting Procedures Procedure 3 2.6 HDD Troubleshooting Format Check The computer’s HDD is formatted using the low level format program and the MS-DOS FORMAT program. To format the HDD, start with Check 1 below and perform the other steps as required. Check 1 Format the HDD and transfer system files using FORMAT C:/S/U. If the following message appears on the display, the HDD is formatted.
2.6 HDD Troubleshooting Procedure 4 2 Troubleshooting Procedures Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. Replace the HDD with a new one following the instructions in Chapter 4, Replacement Procedures.
2 Troubleshooting Procedures Procedure 5 2.6 HDD Troubleshooting Connector Check and Replacement Check The HDD may be disconnected, or the HDD or the system board may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: Check 1 Make sure the HDD is firmly connected to CN19000 on the system board. If any of the connections are loose, reconnect firmly and repeat Procedure 1. If there is still an error, go to Check 2.
2.7 Keyboard and Dual point Troubleshooting 2.7 2 Troubleshooting Procedures Keyboard and Dual point Troubleshooting To determine if the computer’s keyboard or touch pad is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed.
2 Troubleshooting Procedures Procedure 2 2.7 Keyboard and Dual point Troubleshooting Connector Check and Replacement Check The keyboard, Dual point or sensor/switch board may be disconnected or damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: 1. If the keyboard or AccuPoint malfunctions, start with Check 1. 2. If the Dual point malfunctions, start with Check 3. 3.
2.7 Keyboard and Dual point Troubleshooting Check 5 2 Troubleshooting Procedures The system board may be damaged. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures.
2 Troubleshooting Procedures 2.8 2.8 Display Troubleshooting Display Troubleshooting This section describes how to determine if the computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: External Monitor Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector Check and Cable Check Procedure 4: Replacement Check Procedure 1 External Monitor Check Connect an external monitor and tun on the computer.
2.8 Display Troubleshooting 2 Troubleshooting Procedures If the connection is loose, reconnect firmly and restart the computer. If there is still an error, go to Procedure 4. Procedure 4 Replacement Check The FL, FL inverter board, LCD module, and system board are connected to display circuits. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: 1.
2 Troubleshooting Procedures 2.9 2.9 Optical Drive Troubleshooting Optical Drive Troubleshooting This section describes how to determine if the optical drive (Super Multi drive) in the Slim Select Bay is functioning properly. Perform the steps below starting with Procedure 1 and continue with the other procedures as required.
2.9 Optical Drive Troubleshooting Procedure 2 2 Troubleshooting Procedures Connector Check and Replacement Check The optical drive (Super Multi drive) is connected to the system board. The connectors may be disconnected from the system board or may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: Check 1 Make sure the drive to test is firmly connected to CN1820 on the system board.
2 Troubleshooting Procedures 2.10 Modem Troubleshooting 2.10 Modem Troubleshooting This section describes how to determine if the computer’s modem is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.10 Modem Troubleshooting Procedure 2 2 Troubleshooting Procedures Connector Check and Replacement Check The Modem is installed as a MDC (Modem Daughter Card). If the modem malfunctions, there may be a bad connection between the MDC and the system board. Or the MDC, system board or their connectors might be damaged.
2 Troubleshooting Procedures 2.11 LAN Troubleshooting 2.11 LAN Troubleshooting This section describes how to determine if the computer’s LAN is functioning properly. Perform the steps below starting with Procedure 1 and continue with the other procedures as required.
2.12 Bluetooth Troubleshooting 2 Troubleshooting Procedures 2.12 Bluetooth Troubleshooting This section describes how to determine if the computer’s Bluetooth is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.12 Bluetooth Troubleshooting Connection Check The Bluetooth function wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the Bluetooth module is firmly connected to CN4400 on the sound board. If the connector is disconnected, connect it firmly.
2.12 Bluetooth Troubleshooting Procedure 3 2 Troubleshooting Procedures Replacement Check The Bluetooth antenna, Bluetooth module, sound board and system board are connected to the circuits. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 The Bluetooth module may be defective or damaged.
2 Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting 2.13 Wireless LAN Troubleshooting This section describes how to determine if the computer’s Wireless LAN is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.13 Wireless LAN Troubleshooting Procedure 2 2 Troubleshooting Procedures Antenna Connection Check The wireless LAN wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless LAN board is firmly connected to CN2600 on the system board. If the connector is disconnected, connect it firmly.
2 Troubleshooting Procedures Procedure 3 2.13 Wireless LAN Troubleshooting Replacement Check The wireless LAN antenna, wireless LAN board and the system board are connected to the circuits. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 The wireless LAN board may be defective or damaged.
2.14 Sound Troubleshooting 2 Troubleshooting Procedures 2.14 Sound Troubleshooting This section describes how to determine if the computer’s sound functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.14 Sound Troubleshooting Connector Check The sound function-wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: 1. If the speakers do not work correctly, perform Check 1. 2. If the headphone does not work correctly, perform Check 2. 3. If the external microphones do not work correctly, perform Check 3. 4.
2.14 Sound Troubleshooting Procedure 3 2 Troubleshooting Procedures Replacement Check Check 1 If the speakers do not sound properly, the speaker may be defective or damaged. Replace it with a new one. If the speakers still do not work properly, go to Check 3. Check 2 If the Built in microphone do not sound properly, the Built in microphone may be defective or damaged. Replace it with a new one. If the Built in microphone still do not work properly, go to Check 3.
2 Troubleshooting Procedures 2.15 SD Card Slot Troubleshooting This section describes how to determine if the computer’s SD card functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Check on Windows Procedure 2: Connector Check and Replacement Check Procedure 1 Check on Windows Insert an SD card into the slot.
2.16 Fingerprint sensor Troubleshooting 2 Troubleshooting Procedures 2.16 Fingerprint sensor Troubleshooting CAUTION: To delete the account for confirming the fingerprint operation, it is necessary to log on by the account with the management authority. If the password has been set to log on, ask the Log-ON password to the user. To check if the Fingerprint sensor works correctly or not, follow the troubleshooting procedures below as instructed.
2 Troubleshooting Procedures Procedure 1 Setting Windows Log-ON password 1. Open [User Account] from [Control Panel]. 2. Click [User Account]. 3. Click the icon of the account (user’s name) that you want to set the password. 4. Click “Create Account”. 5. Type a password in “Type a new password”. 6. Press Tab key. 7. Type the password again. 8. Click “Create Password” button. 9. When “Do you want to make your files and folders private” appears in [Computer administrator], click [Yes, Make Private].
2.16 Fingerprint sensor Troubleshooting 2 Troubleshooting Procedures [User's Passport] appears in “Enter your password”. Click [Next]. When the finger print has been enrolled, [User’s Password] appears. Slide your finger enrolled or type the password. Click [Next]. 5. Type the Windows logon password in “Enter your password” and click [Next]. [User’s Password] appears.
2 Troubleshooting Procedures 6. Confirm that the box of [Run interactive tutorial] is checked (when proceeding wit seeing Tutorial) and click [Next]. 7. Watch the Video carefully, click [Next].
2.16 Fingerprint sensor Troubleshooting 2 Troubleshooting Procedures 8. Put lightly your finger on the fingerprint sensor at the right side of the touchpad panel and slide your finger sideways Slide your finger four times. Four boxes are filled with fingerprints. At this time, when you click the [Replay video], you can watch the video that you have watched in Procedure 6.
2 Troubleshooting Procedures When you have failed in any time of four times reading and want to practice again, click [Try again]. When you have fully succeeded in four times of reading, the message of “Fully succeeded” appears. 9. Click [Next]. The display of [User’s Fingers] 10. Click the box you want to enroll.
2.16 Fingerprint sensor Troubleshooting 2 Troubleshooting Procedures Put lightly the first joint of your finger you want to enroll on the fingerprint sensor and slide your finger sideways. Enroll your finger three times. Every time your finger has been successfully enrolled, one box is checked. When your finger has been successfully enrolled three times, the message of “Succeeded” appears.
2 Troubleshooting Procedures 13. Type a backup password two times in the following display. (This password is different from the password of Windows logon.) 14. Click [Next]. The [Finish] display appears. 15. Click [Finish], “Welcome” display appears.
2.16 Fingerprint sensor Troubleshooting Procedure 3 2 Troubleshooting Procedures Authentication of fingerprint 1. Turn on the computer to start up Windows. 2. In the Windows logon window, put lightly the first joint of your finger registered and slide your finger sideways. When authenticated, [Success] is displayed in the fingerprint authentication display. When not authenticated well, warning message appears.
2 Troubleshooting Procedures Procedure 4 Connector Check and Replacement Check The Fingerprint sensor cable is connected to the connector CN9650 on the Fingerprint sensor board and connector CN9550 on the system board. Check 1 Check the Fingerprint sensor cable is firmly connected to the connector CN9650 on the Fingerprint sensor board and connector CN9550 on the system board. If not, connect it firmly. If the Fingerprint sensor is still not functioning properly, perform Check 2.
Chapter 3 Tests and Diagnostics [CONFIDENTIAL]
3 Tests and Diagnostics 3 3-ii [CONFIDENTIAL] TECRA M9 Maintenance Manual (960-631)
3 Tests and Diagnostics Chapter 3 3.1 3.2 Contents The Diagnostic Test ................................................................................................... 3-1 3.1.1 Diagnostics menu ................................................................................. 3-1 3.1.2 H/W (Hardware) initial information setting tool.................................. 3-3 3.1.3 Heatrun test program............................................................................
3 Tests and Diagnostics 3.21 3.22 3.23 3.24 3.25 Head Cleaning.......................................................................................................... 3-48 3.21.1 Function Description .......................................................................... 3-48 3.21.2 Operations .......................................................................................... 3-48 Log Utilities .............................................................................................
3 Tests and Diagnostics 3.30 SETUP ..................................................................................................................... 3-86 3. 30.1 Function Description .......................................................................... 3-86 3. 30.2 Accessing the SETUP Program.......................................................... 3-88 Tables Table 3-1 Subtest names ....................................................................................................
3 Tests and Diagnostics 3-vi [CONFIDENTIAL] TECRA M9 Maintenance Manual (960-631)
3.1 The Diagnostic Test 3 Tests and Diagnostics 3 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
3 Tests and Diagnostics NDP TEST EXPANSION TEST CD-ROM/DVD-ROM TEST ERROR RETRY COUNT SET 3.1 The Diagnostic Test [FDD & HDD] Other tests are: Wireless LAN TEST (Wireless LAN TEST disk) LAN/Modem/Bluetooth/IEEE1394 TEST (LAN/Modem/Bluetooth/IEEE1394 TEST disk) Sound TEST (Sound TEST disk) You will need the following equipment to perform some of the Diagnostic test programs.
3.1 The Diagnostic Test 3 Tests and Diagnostics 3.1.2 H/W (Hardware) initial information setting tool The H/W initial information setting tool consists of the following programs. Initial configuration DMI information save DMI information recovery System configuration display E2PROM test (MAC/GUID/DMI) You will need the following equipment to perform some of the programs. The Diagnostics Disk (Main T&D) 3.1.3 Heatrun test program The heatrun test starts automatically after the selection.
3 Tests and Diagnostics 3.2 3.2 Executing the Diagnostic Test Executing the Diagnostic Test To start the DIAGNOSTIC PROGRAM, follow these steps: 1. Insert the Diagnostics disk in the USB floppy disk drive. 2. Turn on the computer while pressing U key. The following menu appears. TOSHIBA Diagnostics Startup menu 1 Repair Main 2 Repair Initial config set 3 Repair Heatrun Enter a chose… To start the Diagnostics menu (T&D), press 1, Repair Main and press Enter.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 3.2.1 Diagnostics menu (T&D) To execute this program, press 1 Repair Main and press Enter in the startup menu, press Enter. The following menu appears. TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Set the highlight bar to 1, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Select the option you want to execute and press Enter. When you select 1- SYSTEM TEST, the following message will appear: SYSTEM TEST NAME SUB-TEST PASS COUNT WRITE DATA ADDRESS : : : : XXXXXX xxxxxxx DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Selecting YES of ERROR STOP stops the test program when an error is found and displays the operation guide on the right side of the display screen as shown below: ERROR STATUS NAME [[ HALT OPERATION ]] 1: Test end 2: Continue 3: Retry These three selections have the following functions respectively: 1. Terminates the test program and exits to the subtest menu. 2. Continues the test. 3. Restarts the test from the error.
3.3 Setting of the hardware configuration 3.3 3 Tests and Diagnostics Setting of the hardware configuration To execute this program, 2, Repair Initial config set and press Enter in the startup menu, press Enter and follow the directions on the screen. The H/W initial information setting tool consists of four subtests. Move the highlight bar to the subtest you want to execute and press Enter.
3 Tests and Diagnostics 7. 3.3 Setting of the hardware configuration “Create DMIINFO TXT (Y/N) ?” is displayed. Press Y, then the DMI information (text data) is written to the Floppy disk, etc. • • • Setting of the HWSC Setting of the UUID Display of the DMI information (including UUID) After completion of the above settings, H/W configuration & DMI information are appeared in order. Check the contents and press Enter.
3.4 Heatrun Test 3.4 3 Tests and Diagnostics Heatrun Test To execute this program, press 3, Repair Heatrun and press Enter in the startup menu, press Enter. After selecting this test, the same subtests as 3.23 Running Test are executed successively. For more details on the procedure and test content, refer to Running Test. When the heatrun test ends normally, following message appears in the display.
3 Tests and Diagnostics 3.5 3.5 Subtest Names Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No. 3-12 Test Name Subtest No.
3.5 Subtest Names 3 Tests and Diagnostics Table 3-1 Subtest names (2/2) No. 6 Test Name PRINTER ［It is not supported ］ Subtest No.
3 Tests and Diagnostics 3.6 3.6 System Test System Test To execute the System Test, select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM checksum This subtest executes a checksum test of the BIOS ROM (range: F0000h to FFFFFh, 64KB) on the System Board. Subtest 02 Fan ON/OFF The following message will appear.
3.6 System Test Subtest 04 3 Tests and Diagnostics Quick charge This subtest checks the status for the quick charge. Subtest 05 DMI read This subtest displays the information in the Flash-ROM in the following format. *** DMI Data Display Ver X.
3 Tests and Diagnostics 3.7 3.7 Memory Test Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Conventional memory This subtest writes a constant data to conventional memory (0 to 640 KB), then reads the new data and compares the result with the original data. Subtest 02 Protected Mode NOTE: The CONFIG.
3.8 Keyboard Test 3.8 3 Tests and Diagnostics Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed key code display When a key is pressed, the scan code, character code, and key top name are displayed on the screen in the format shown below.
3 Tests and Diagnostics 3.9 3.9 Display Test Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM read/write for VGA This subtest writes the constant data (AAh and 55h) to the video RAM. The data is read and compared to the original data.
3.9 Display Test Subtest 04 3 Tests and Diagnostics Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode 12] 13] 3] 111 112 114 115 117 118 640*480 640*480 800*600 800*600 1024*768 1024*768 64K] 16M] 64K] 16M] 64K] 16M] The display below appears on the screen when this subtest is executed.
3 Tests and Diagnostics Subtest 06 3.9 Display Test “H” pattern display This subtest displays a full screen of “H” patterns.
3.10 Floppy Disk Test 3 Tests and Diagnostics 3.10 Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD because the contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. 1. The following message will appear. Select the media mode and start track to be tested and press Enter.
3 Tests and Diagnostics 3.10 Floppy Disk Test Select the number of the subtest you want to execute and press Enter. The following message will appear during the floppy disk test. FLOPPY DISK SUB-TEST PASS COUNT WRITE DATA ADDRESS IN PROGRESS : : : : XXXXXXX xxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] : test end [Ctrl]+[C] : key stop XX XXXXX ERROR COUNT XX READ DATA XXXXXX STATUS : XXXXX : XX : XXX When the subtest 04 or 05 is selected, the following messages will appear on the screen.
3.11 Printer Test 3 Tests and Diagnostics 3.11 Printer Test NOTE: Printer Test is not supported for this model. To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. NOTE: An IBM compatible printer must be connected to the system to execute this test. Also, printer port wraparound connector must be connected.
3 Tests and Diagnostics Subtest 02 3.11 Printer Test Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wraparound NOTE: To execute this subtest, a printer wraparound connector must be connected to the computer’s printer port.
3.12 Async Test 3 Tests and Diagnostics 3.12 Async Test To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
3 Tests and Diagnostics 3.13 Hard Disk Test 3.13 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. CAUTION: The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 08 or 09 is executed. Before running the test, the customer should transfer the contents of the hard disk to floppy disk or another hard disk.
3.13 Hard Disk Test 3 Tests and Diagnostics 3. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest. HARD DISK TEST XXXXXXX SUB TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXX DIAGNOSTIC TEST VX.
3 Tests and Diagnostics Subtest 04 3.13 Hard Disk Test Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder and then reads the data while moving from cylinder to cylinder. (Tests the data interference in the neighbor track.
3.14 Real Timer Test 3 Tests and Diagnostics 3 3.14 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real time A new date and time can be input during this subtest. To execute the real time subtest, follow these steps: 1.
3 Tests and Diagnostics Subtest 03 CAUTION: 3.14 Real Timer Test Real time carry When this subtest is executed, the current date and time are erased.
3.15 NDP Test 3 Tests and Diagnostics 3.15 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen.
3 Tests and Diagnostics 3.16 Expansion Test 3.16 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wrap around [ It is not supported ] CAUTION: PCMCIA wraparound test is not supported for this model. NOTE: To execute this subtest, the PC card wraparound connector is required.
3.16 Expansion Test Subtest 02 3 Tests and Diagnostics RGB monitor ID NOTE: To execute this subtest, an external monitor with monitor ID function is required. Connect the external monitor to the PC for the test of ID acquisition. The judgment of acquisition is based on the panel data. In simultaneous display mode or internal display mode, in which the panel data is acquired, this subtest will fail. Therefore, make sure only the external display is selected when executing this subtest.
3 Tests and Diagnostics 3.17 CD-ROM/DVD-ROM Test 3.17 CD-ROM/DVD-ROM Test NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1. For the subtest 04, use a CD-RW on the market. Subtest 01 Sequential read This subtest is a sequential reading of one-block units (2K bytes) of all the logical addresses. Subtest 02 Read specified address This subtest reads one-block data from a specified address.
3.18 Error Code and Error Status Names 3 Tests and Diagnostics 3.18 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the DIAGNOSTIC TEST.
3 Tests and Diagnostics 3.
3.
3 Tests and Diagnostics 3.19 Hard Disk Test Detail Status 3.19 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eightdigit number. The first four digits represent the hard disk controller (HDC) error status number and the last four digits are not used.
3.19 Hard Disk Test Detail Status 3 Tests and Diagnostics Table 3-4 Error register contents Bit Name Description 7 BBK (Bad block mark) “0” … Not used. “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error. “1” … Uncorrectable data error has been detected. 5 —— Not used. 4 IDN (Identification) “0” … Not used. “1” … There is no ID field in the requested sector. 3 —— Not used 2 ABT (Abort) “0” … Not used.
3 Tests and Diagnostics 3.20 3.20 ONLY ONE TEST ONLY ONE TEST 3.20.1 Program Description This program tests the unique functions of this model. 3.20.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter. The following menu appears in the display. ################################################################# ######## ONLY ONE TEST Menu (XXXXXXXXX) ######## ################################################################# * * * 1 ............ Pressed Key Display * * 2 ............
3.20 ONLY ONE TEST Subtest 1 3 Tests and Diagnostics Pressed key display When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed. Holding a key down enables the auto-repeat function that causes the key’s display character to blink. Press Del + Enter to end the test. NOTE: The actual display may be different from the above image, according to the model.
3 Tests and Diagnostics Subtest 2 3.20 ONLY ONE TEST Touch Pad This subtest checks the functions of the touch pad as shown below. A) Direction and parameter B) Switching function check. This test displays the response from the touch pad and touch pad switch. When moving your finger on the touch pad towards the upper left, the display changes according to the following illustration. If a touch pad switch is pressed, the displays appear on the right side one by one.
3.
3 Tests and Diagnostics Subtest 3 3.20 ONLY ONE TEST Wireless communication switch This subtest checks if the Wireless communication switch works properly. If the test is started with the switch ON, following message appears in the display. Wireless communication switch is set to a start position (OFF) Slide the switch to OFF position. Then, following message appears in the display. Wireless communication switch ON !! Slide the switch to ON position. Then, following message appears in the display.
3.20 ONLY ONE TEST Subtest 5 3 Tests and Diagnostics LED This subtest checks if each LED lights properly. The following message appears in the display in order. Follow the instructions in the display to execute the test. [HDD Access LED test] Press any key and following message appears in the display. [Caps/Num/Overlay BT/W-LAN LED test] (1) Press [Caps Lock ] key ! ...Caps (on/off) (2) Press [Fn + F10 ] key ! ...Arrow (on/off) (3) Press [Fn + F11 ] key ! ...
3 Tests and Diagnostics 3.20 ONLY ONE TEST Press the Toshiba Presentation button after the following message appears. Step2 X 1 2 * * *. Press Function button (Presentation button) OK message appears in the display if the test ends without an error. Press any key return to each Steps if NG! or Press any key message apprears. If the test ends successfully, the display returns to the ONLY ONE TEST menu. Subtest 7 Acceleration sensor This subtest detects and corrects the each axis (X, Y, Z).
3.20 ONLY ONE TEST 3 Tests and Diagnostics Top (heaven surface) Back Left side Right side Front When this subtest is selected, the following message appears in the display. The heaven surface establishes in the upper direction Press [Enter] key NOTE: Be sure to execute the test with the display panel opened. Set the machine on the flat desk. Then press Enter to detect the data on this setting of machine. The following message appears in the display.
3 Tests and Diagnostics 3.20 ONLY ONE TEST When there is no defective during the all checks above, the following message appears in the display. Then press Enter and return to the Only One Test menu. ** Setting OK! ** Press [Enter] key When any trouble in the above setting is found, the following message appears and the test halts. Then press Enter and return to the Only One Test menu.
3.21 Head Cleaning 3.21 3 Tests and Diagnostics Head Cleaning 3.21.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.21.2 Operations 1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS - FLOPPY DISK HEAD CLEANING : VX.XX Mount cleaning disk(s) on drive(s). Press any key when ready. 2.
3 Tests and Diagnostics 3.22 3.22 Log Utilities Log Utilities 3.22.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk, or output the data to a printer or the display. The error information is displayed in the following order: 1. Error count (CNT) 2. Test name, Subtest number (TS-No) 3. Pass count (PASS) 4. Error status (STS) 5. FDD/HDD or memory address (ADDR) 6. Write data (WD) 7.
3.22 Log Utilities 3 Tests and Diagnostics 3.22.2 Operations 1.
3 Tests and Diagnostics 3.23 3.23 Running Test Running Test 3.23.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02) 3. Display test (subtest 01) 4. Real timer test (subtest 02) 5. HDD test (subtest 01) 6. FDD test (subtest 02) The system automatically detects the number of floppy disk drives connected to the computer for the FDD test. 3.23.
3.24 Floppy Disk Drive Utilities 3.24 3 Tests and Diagnostics Floppy Disk Drive Utilities 3.24.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE: This program is only for testing a floppy disk drive. It is different from the Toshiba DOS FORMAT command.
3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 3.24.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message. [ FDD UTILITIES ] 1 2 3 4 9 – - FORMAT COPY DUMP HDD-ID READ EXIT TO DIAGNOSTICS MENU 2. FORMAT program (a) Selecting FORMAT displays the following message. DIAGNOSTICS - FLOPPY DISK FORMAT : VX.XX Drive number select (1:A, 2:B) ? (b) Select a drive number to display the following message.
3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3. COPY program (a) When COPY is selected, the following message appears. FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below. Insert source disk into drive A: Press any key when ready. (c) Remove the Diagnostics Disk from the FDD, insert the source disk and press any key. The following message will appear, indicating the program has started.
3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 4. DUMP program (a) When DUMP is selected, the following message appears. DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If 2:HDD is selected, the display will go to step (h). If 1:FDD is selected, the following message will appear. Select drive number (1:A, 2:B) ? (c) Select a drive number and the following message will be displayed.
3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? 5. HDD ID READ program Selecting HDD ID displays the following HDD ID configuration. [HDD ID Read (VX.XX)] [Drive #1] Model No. = XXXXXXX Press [Enter] key Press Enter to return to the FDD UTILITIES MENU.
3 Tests and Diagnostics 3.25 System Configuration 3 3.25 System Configuration 3.25.1 Function Description NOTE: To display the system configuration, the write protect tab should be OFF position. If the tab is ON position, move the tab to OFF position and restart the test. Otherwise the correct information cannot be acquired. The System Configuration program contains the following configuration information for the computer: 1. Processor Type [Code/L2 cache] 2. Chip set [VRAM] 3.
3 Tests and Diagnostics 3.25.2 Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display. System Configuration Display : Ver X.XX [Machine Name ???] * * * * * * * * * * * * * * * * * * * - Processor Type = XXXXXX-XXXXXMHz Code = XX L2 Cache = XXXXXKB Chip set = XXXXXX VGA Chip = Intel Corp BIOS ROM Version = VX.XX 1st ID = XXH, 2nd ID = XXH BOOT ROM Version = VX.XX EC Total Version = VX.XX PS Micon Version = VX.XX SVP Par. Version = VX.
3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Intel-made b/g, a/b/g Setting up of REF PC) 3.26 Wireless LAN Test Program (Intel-made b/g, a/b/g Setting up of REF PC) For the test of Intel-made wireless LAN cards, configure the test environment as shown below with the following equipment. AP （which can operate on Windows XP and is corresponding to access point 11a, 11b and 11g） ・ NOTE: Set the SSID of AP as follows.
3.26 Wireless LAN Test Program (Intel-made b/g, a/b/g Setting up of REF PC) 3 Tests and Diagnostics 2. Open “My Computer” window and click “My Network places” on the left column. 3. Click “View network connections” on the left column. 4. The “Network Connections” window appears. Double-click “Local Area Connection”.
3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Intel-made b/g, a/b/g Setting up of REF PC) 5. Click “Install…” button on the “Local Area Connection Properties” window. Local Area Connection Properties window 6. Select “Protocol” on the “Select Network Component Type” window and click “Add…” button. Select Network Component Type window 7. Click “Have Disk…” button on the “Select Network Protocol” window.
3.26 Wireless LAN Test Program (Intel-made b/g, a/b/g Setting up of REF PC) 3 Tests and Diagnostics 8. When “Install From Disk” window appears, click “Browse…” and specify the created “Clx_Res” folder. Then Click “OK”. (For the test, “PACKET.INF” file is used.) Install From Disk window 9. The “Select Network Protocol” window appears again. In the “Network Protocol”, “DDK PACKET Protocol” will appear. Then click “OK” to start the installation. Select Network Protocol window 10.
3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Intel-made b/g, a/b/g Setting up of REF PC) After the completion of REF PC setup, restart the WINDOWS. Then perform the Responder test program for Windows (WTWINSVR.EXE) in the Clx_Res folder. ・WTWINSVR.EXE Function : Transmitting/receiving of data to/from DUT via AP OS available : Windows XP only How to start : Double-click WTWINSVR icon. How to start 1. Double-click wtwinsvr icon. The following screen will appear.
3.27 Wireless LAN Test Program on DUT PC(Intel-made) 3 Tests and Diagnostics 3.27 Wireless LAN Test Program on DUT PC(Intel-made) 3.27.1 Wireless LAN Test Program (Intel-made :Golan) on DUT PC This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade 802.11 b/g or 802.11 a/b/g Golan). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Insert the Diagnostics disk for wireless LAN test into the Floppy Disk Drive.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program on DUT PC(Intel-made) Press any key and return to the test menu. If a defective is found during the test, NG message will appear in the display. Press any key and return to the test menu. When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Using a wrong wireless LAN card (Using unspecified card) • Defective wireless LAN card Checking the connection, execute the subtest again.
3.27 Wireless LAN Test Program on DUT PC(Intel-made) Subtest03 3 Tests and Diagnostics Antenna check & communication test of 11b mode This subtest execute transmitting/receiving test in 802.11b mode using the main antenna first. If a defective is not found during the test, transmitting/receiving test in 802.11b mode using the AUX antenna is automatically executed. If a defective is not found during the test, OK message will appear in the display. Press any key and return to the test menu.
3 Tests and Diagnostics Subtest05 3.27 Wireless LAN Test Program on DUT PC(Intel-made) Communication test of 11g mode This subtest execute transmitting/receiving test in 802.11g mode using the main antenna. If a defective is not found during the test, OK message will appear in the display. Press any key and return to the test menu. If a defective is found during the test, NG message will appear in the display.
3.27 Wireless LAN Test Program on DUT PC(Intel-made) 3 Tests and Diagnostics 3.27.2 Wireless LAN Test Program (Intel-made:Kedron) on DUT PC This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade 802.11 a/b/g or 802.11 a/b/g/n: kedron). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Insert the Diagnostics disk for wireless LAN test into the Floppy Disk Drive. Turn on the power while pressing U.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program on DUT PC(Intel-made) Press any key and return to the test menu. When a defective is detected in the test, following typical cause is considered. • Connection of wireless LAN card • Using a wrong wireless LAN card (Using unspecified card) • Defective wireless LAN card Checking the connection, execute the subtest again. Subtest02 MAC Address Check This subtest displays the MAC address.
3.27 Wireless LAN Test Program on DUT PC(Intel-made) 3 Tests and Diagnostics This subtest execute transmitting/receiving test in 802.11a mode using the main antenna. If a defective is not found during the test, OK message will appear in the display. Press any key and return to the test menu. If a defective is found during the test, NG message will appear in the display.
3 Tests and Diagnostics Subtest05 3.27 Wireless LAN Test Program on DUT PC(Intel-made) Communication test of 11g mode This subtest execute transmitting/receiving test in 802.11g mode using the main antenna. If a defective is not found during the test, OK message will appear in the display. Press any key and return to the test menu. If a defective is found during the test, NG message will appear in the display.
3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics 3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the test program. Insert the test program disk for LAN/Modem/Bluetooth/IEEE1394 test in FDD and turn on the power. The following message will appear: Microsoft Windows XX Startup Menu ---------------------------------1. LAN 2. Modem 3. Bluetooth 4.
3 Tests and Diagnostics Subtest01 3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program (i82562 + ICHx) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip.
3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest02 3 Tests and Diagnostics (GbE) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. Select 2 to execute and press Enter. The following message will appear: Testing adaptor...hit to abort. * External Loopback Test...PASSED Testing completed.
3 Tests and Diagnostics 3.28.2 3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program Modem test For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Denki Seisakusyo)” for the tests. NOTE: Modem test is not supported for this model.
3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.28.3 3 Tests and Diagnostics Bluetooth test Preparation ・ For the test of Bluetooth function, use the Windows program installed on the target computer (computer to be tested). A responder device (device for transmitting/receiving data) is also needed. (A mobile phone with the Bluetooth function is also available.) ・ A Bluetooth card should be installed on the target computer.
3 Tests and Diagnostics 3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program 5. Select “Diagnostics” tab and click “Run”. 6. Check the “Log” to confirm the test result. BT address of test computer BT address of responder device 7. When the BT (Bluetooth) address of the responder device appears, the Bluetooth card and antenna connection are OK.
3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.28.4 3 Tests and Diagnostics IEEE1394 test To execute this test, press 4 and Enter. NOTE: IEEE1394 test is not supported for this model. NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test.
3 Tests and Diagnostics 3.29 Sound Test program 3.29 Sound Test program This section describes how to perform the Sound test. To execute the sound test, refer to the following description. Prepare a HDD and format it on DOS. Copy all files in the floppy disk in which the Sound test program is stored to the HDD. Reboot the computer from the HDD.
3.29 Sound Test program 3 Tests and Diagnostics To return to the Sound test menu, press 9 and Enter. Then following message will appear in the display. *********************************** ******** May I Restart ? ******* *********************************** Press any key to continue… After pressing any key, the machine starts rebooting and sound test menu will appear in the display. Subtest 01 Microphone recording & play This subtest checks the function of the CODEC A/D, D/A converter.
3 Tests and Diagnostics Subtest 02 3.29 Sound Test program Sine wave This subtest is executed by loading the COM file (ADSIN.COM). The program expands sine wave data table from 16KB to 64KB, and creates the play data. Then it transfers the data between the DMA and the CODEC to play the sine wave. (It sounds like a continuous beep). By using wave measurable devices such as an oscilloscope, the data can be measured as a sine wave.
3.29 Sound Test program 3 Tests and Diagnostics 3.29.3 CD Sound (Standard) test To execute the CD Sound (Standard) test, press 3 and Enter. Insert the test media (TOSHIBA TEST CD-ROM or ABEX TEST CD-ROM) or music CD on the market (if the test media can not be prepared). Following menu appears in the display. For details on use of test media, refer to 3.29.3.1 Test media (Toshiba-made test media). For details on use of audio CD on the market, refer to 3.29.3.2 Audio CD. 3.29.3.
3 Tests and Diagnostics Subtest 02 3.29 Sound Test program English Narration Selected this subtest, narration in English starts. For more details on the procedure, refer to the subtest01. Subtest 03 Test Tone A CAUTION: Before starting subtest03, be sure to set the sound at proper volume. This subtest plays sine wave while changing its table from 100Hz to 20Hz. The test returns to the CD Sound (Standard) menu after the test ends.
3.29 Sound Test program 3 Tests and Diagnostics 3.29.3.2 Audio CD Insert an audio CD and the following menu appears in the display. CD/DVD TEST IN PROGRESS XXXXXXXX SUB-TEST PASS COUNT WRITE DATA ADDRESS XX XXXXX XX XXXXXX : : : : xxxxxxx DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.30 SETUP 3.30 SETUP 3.30.1 Function Description This program displays the current system setup information as listed below: 1. Memory (a) Total 2. System Date/Time (a) Date (MM-DD-YYYY) (b) Time (HH:MM:SS) 4. Password (a) User Password (b) Supervisor Password 5. HDD Password (a) (b) (c) (d) HDD HDD Password Mode User Password Master Password 6. Boot Priority (a) Boot Priority (b) HDD Priority 7.
3.30 SETUP 3 Tests and Diagnostics 8. Configuration (a) Device Config. 9. Battery (a) Battery Save Mode (b) PCI Express Link ASPM (c) Enhanced C-States 10. I/O ports (a) Serial 11. Drives I/O (a) Built-in HDD (b) Select Bay 12. PCI Bus (a) PCI Bus 13. Display (a) Power On Display 14. Peripheral (a) Internal Pointing Device 15. Legacy Emulation (a) USB KB/Mouse Legacy Emulation (b) USB-FDD Legacy Emulation (c) USB Memory BIOS Support Type 16. PCI LAN (a) Built-in LAN 17.
3 Tests and Diagnostics 3.30 SETUP 3.30.2 Accessing the SETUP Program Turn on the power while pressing ESC, the following menu appears. Check system. Then press [F1] key. Then press F1. The following display appears.
3.30 SETUP 3 Tests and Diagnostics Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press ↑ and ↓ to move between items in a column. Press Fn+↑ (PgUp) and Fn + ↓ (PgDn) to move between the two pages. 2. Press either the Space bar or Back Space to change the value. Accepting Changes and Exiting the SETUP Window 1. Press End to accept the changes you made.
3 Tests and Diagnostics 3.30 SETUP NOTE: You can press Esc to quit at any time without saving changes. SETUP asks you to confirm that you do not want to save your changes. When SETUP is displayed at the next time, the current configuration appears.
3.30 SETUP 3 Tests and Diagnostics The Factory Preset Configuration When you access SETUP, the current configuration is displayed. 1. To show the factory preset configuration, press Home. 2. Press End and then press Y to accept the factory preset settings.
3 Tests and Diagnostics 3.30 SETUP SETUP Options The SETUP screen is divided into functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s memory. (a) Total This field displays the total amount of memory installed and is automatically calculated by the computer. You cannot change this value. 2. System Date/Time Use this option to set the computer’s system date/time.
3.30 SETUP 3 Tests and Diagnostics 4. HDD Password This option sets HDD password. HDD password is a security function to protect the built-in HDD. (a) HDD This item selects the hard disk to set HDD password. Built-in HDD Sets HDD password for the built-in HDD (b) HDD Password Mode This item registers HDD password and can be selected only for registering HDD password. To change HDD Password Mode when HDD password is registered, delete the registered HDD password first, and then register new password.
3 Tests and Diagnostics 3.30 SETUP 5. Boot Priority This tab sets the priority for booting the computer and the priority for the built-in HDD or optional secondary HDD. (a) Boot Priority HDD→FDD→CD-ROM→LAN: FDD→HDD→CD-ROM→LAN: HDD→CD-ROM→LAN→FDD: The computer looks for bootable files in the following order: HDD, FDD, CDROM and LAN. (Default) The computer looks for bootable files in the following order: FDD, HDD, CDROM and LAN.
3.30 SETUP 3 Tests and Diagnostics Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use. (a) Core-Multi Processing NOTE: This is not displayed in PCs with a single core CPU. The Core Multi-Processing sets the CPU operating mode. Enabled Enables Core Multi-Processing functions. (Default) Disabled Disables Core Multi - Processing functions.
3 Tests and Diagnostics 3.30 SETUP Use this option to set a time and date for automatic power on and enable or disable the ring indicator feature. Alarm Date Option appears only when Alarm Time is enabled. OPTIONS Alarm Time = Disabled Wake-up on LAN on Battery Critical Battery Wake-up = Disabled = Disabled = Enabled Set the parameters for the Auto Power On (automatic power on) function and the Wake-up on LAN in the “OPTIONS” window. To set the time, use Space or BackSpace.
3.30 SETUP 3 Tests and Diagnostics Critical Battery Wake-up Configures what action is taken when the remaining battery power is close to running out while the system is in Sleep Mode. This setting is only available when the Critical battery action within Power Options in Windows is set to Hibernate. (Default) The operation of this function is dependent upon battery status. Note: The Critical Battery Wake-up only operates with Windows Vista™.
3 Tests and Diagnostics 3.30 SETUP 8. Configuration This option displays the configuration method. (a) Device Config. The devices are initialized when the PNP OS loads. Setup by OS Initializes devices, which is needed to load an operating system. Operating system initializes other devices. (Default) All Devices All devices will be initialized. If you are using an OS that does not have PNP capacity, select “All Devices.” The Display shows the following message: Device Config. = All Devices 9.
3.30 SETUP 3 Tests and Diagnostics NOTE: The brightness is when a AC adaptor is connected. When powered by a battery it is displayed as follows. Battery Save Mode = Full power : LCD Bright ness = Bright. Battery Save Mode = Low power: LCD Bright ness = Semi-Bright. (a) Battery Save Mode When “User Setting” is selected, the sub-window, BATTERY SAVE OPTION is displayed. The following set of options can be selected in the submenu. Processing Speed This feature changes the CPU processing speed.
3 Tests and Diagnostics 3.30 SETUP Battery optimized If the CPU becomes too hot, the processing speed is lowered. If the temperature is still too high, the fan turns on. When the CPU temperature falls to a normal range, the fan is turned off and the processing speed is increased. Cooling optimized If the CPU becomes too hot, the fan turns on. automatically in a high speed to cool down the CPU. Gives priority to the decrease of temperature at the bottom of the PC.
3.30 SETUP 3 Tests and Diagnostics 10. .I/O ports This option controls settings for the parallel port. NOTE: Do not assign the same interrupt request level and I/O address to the serial port and PC card. (a) Serial Use this option to set the COM level for the serial port.
3 Tests and Diagnostics 3.30 SETUP 12. PCI Bus This item displays the interrupt level for the Card Bus. It is for information only and cannot be changed. PCI BUS = IRQ10, IRQ11 13. Display This group of options configures the computer’s display. (a) Power On Display This option is used to select the display when booting up. Auto-Selected Selects an external monitor if one is connected. Otherwise it selects the internal LCD.
3.30 SETUP 3 Tests and Diagnostics 15. Legacy Emulation. (a) USB KB/Mouse Legacy Emulation. Use this option to enable or disable USB KB/Mouse Legacy Emulation. If your operating system does not support USB, you can still use a USB mouse and keyboard by setting the USB KB/Mouse Legacy Emulation item to Enabled. Enabled USB Legacy Support can be used. (Default) Disabled USB Legacy Support cannot be used. (b) USB-FDD Legacy Emulation. Use this option to enable or disable USB-FDD Legacy Emulation.
3 Tests and Diagnostics 3.30 SETUP 17. Security controller (a) TPM Disables the security controller called TPM (Trusted Platform Module). When the cursor is on the Enable (Disable) and the Space is pressed, message is displayed and the PC waits Y or N key input by the user. When Y is pressed, it is sets to Enable (Disable). After changing, the cursor could not be moved on the TPM tem. This option can be changed after rebooting. Disabled Disables the TPM. (Default) Enabled Enables the TPM.
Chapter 4 Replacement Procedures [CONFIDENTIAL]
4 Replacement Procedures 4 4-ii [CONFIDENTIAL] TECRA M9 Maintenance Manual (960-631)
4 Replacement Procedures Chapter 4 Contents 4.1 Overview................................................................................................................... 4-1 4.2 Battery pack .............................................................................................................. 4-8 4.3 PC card/SD card...................................................................................................... 4-10 4.4 Memory module B ...............................................
4 Replacement Procedures Figures Figure 4-1 Removing the battery pack............................................................................... 4-8 Figure 4-2 Removing the PC card ................................................................................... 4-10 Figure 4-3 Removing the SD card ................................................................................... 4-11 Figure 4-4 Removing the memory slot cover ..................................................................
4 Replacement Procedures Figure 4-32 Removing the HDD cable/DC-IN jack .......................................................... 4-48 Figure 4-33 Removing the MDC ....................................................................................... 4-49 Figure 4-34 Removing the North bridge heat sink ............................................................ 4-50 Figure 4-35 Removing the CPU heat sink (with a fan) ..................................................... 4-51 Figure 4-36 Removing the fan .
4 Replacement Procedures 4-vi [CONFIDENTIAL] TECRA M9 Maintenance Manual (960-631)
4.1 Overview 4 4 Replacement Procedures Replacement Procedures 4.1 Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual.
4 Replacement Procedures 4.1 Overview Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. DANGER: 1) Always use the genuine battery that is authorized by Toshiba or compatible with the unit. Since other battery packs have different specifications, they may be incompatible with the unit, and may burst or explode.
4.1 Overview 4 Replacement Procedures Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2. Battery Pack”. Do not disassemble the computer unless it is operating abnormally. Use the designated tools. Ensure that the environment for working on and storing parts does not contain any of the following.
4 Replacement Procedures 4.1 Overview Disassembly Procedure Four main types of cable connector are used. • Pressure plate connector • Spring connector • Back flip connector • Normal pin connector For pressure plate connectors, slide the pressure plate holding tags on both sides of the plastic pressure plate on the connector and pull the cable out from the connector.
4.1 Overview 4 Replacement Procedures Assembly Procedure After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. • Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems. • Check that all cables and connectors are securely connected.
4 Replacement Procedures 4.1 Overview Screw Tightening Torque Use the following torque when tightening screws. CAUTION: Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall out) causing a short circuit or other damage. NOTE: To tighten screws quickly and accurately, an electric screwdriver is recommended. • M2 (2mm) 0.167 N•m (1.7 kgf •cm) • M2.5 (2.5mm) 0.294 N•m (3.0 kgf•cm) • M3 (3mm) 0.549 N•m (5.
4.1 Overview 4 Replacement Procedures Grip Color Some screws have a colored grip area to help you determine the length of the screw. Even numbered length screws: Brown Odd numbered length screws: White Special length screw: Blue “Special length screw” means screws whose length is indicated in an integral number to the first decimal places such as 2.5 mm, 2.6 mm and so on.
4 Replacement Procedures 4.2 4.2 Battery pack Battery pack Removing the battery pack The following describes the procedure for removing the battery pack. (See Figure 4-1.) CAUTION: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC adapter and all other external devices from the computer. 3. Turn the computer upside down. 4.
4.2 Battery pack 4 Replacement Procedures Installing the battery pack The following describes the procedure for installing the battery pack. (See Figure 4-1.) CAUTION: There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly. Dispose always the used batteries pack in accordance with the laws and ordinances of your local authority. Use only the batteries approved by Toshiba.
4 Replacement Procedures 4.3 4.3 PC card/SD card PC card/SD card 4.3.1 PC Card Removing the PC card The following describes the procedure for removing the PC card. (See Figure 4-2.) NOTE: Insert or remove the PC card in accordance with any instructions in the PC card manual or the manuals of this computer. 1. Turn the computer upside down. 2. Push the eject button. It will pop out. Then press the eject button again to eject the PC card. 3. Grasp the PC card and remove it. 4.
4.3 PC card/SD card 4 Replacement Procedures 4.3.2 SD card Removing the SD card The following describes the procedure for removing the SD card. (See Figure 4-3.) NOTE: Insert or remove the SD card in accordance with any instructions in the SD card manual or the manuals of the computer system you are using. 1. Push the SD card. It will pop out partly, so pull out the card. SD card Figure 4-3 Removing the SD card Installing the SD card The following describes the procedure for installing the SD card.
4 Replacement Procedures 4.4 4.4 Memory module B Memory module B CAUTION: The power must be turned off when you remove the memory module. Removing the memory module with the power on risks damaging the module or the computer itself. Do not touch the memory module terminals. Any dirt on the terminals may cause memory access problems. Never press hard or bend the memory module. Removing the memory module B To remove the memory module B, make sure the computer is in boot mode and powered off.
4.4 Memory module B 4 Replacement Procedures 2. Open the left and right latches outside and remove the memory module B. Latch Latch Memory module B Figure 4-5 Removing the memory module B Installing the memory module B To install the memory module B, make sure the computer is in boot mode and powered off. Then perform the following procedure. (See Figure 4-4 and 4-5.) 1. Insert the memory module B into the connector slantwise (the terminal side first) and press it to connect firmly.
4 Replacement Procedures 4.5 4.5 HDD HDD Removing the HDD The following describes the procedure for removing the HDD. (See Figure 4-6 to 4-8.) CAUTION: Take care not to press on the top or bottom of the HDD. Pressure may cause data loss or damage to the HDD. 1. Remove the following screws and HDD slot cover. • M2.5×16B FLAT HEAD screw ×1 • M2.5×8B FLAT HEAD screw ×1 M2.5×16B FLAT HEAD HDD slot cover M2.
4.5 HDD 4 Replacement Procedures 2. Raise the HDD assembly with holding the tab from the slot and pull out the HDD assembly from the connector of the HDD cable.
4 Replacement Procedures 4.5 HDD 3. Place the HDD assembly on a flat surface and remove the following screws fixing the HDD holder. • M3×4C ×4 FLAT HEAD screw 4. Separate the HDD holder and HDD.
4.5 HDD 4 Replacement Procedures Installing the HDD The following describes the procedure for installing the HDD. (See Figure 4-6 to 4-8.) CAUTION: Do not hold the HDD by its top and bottom face. It may damage the HDD. 1. Seat the HDD in the HDD holder and secure them with the following screws. • M3×4C FLAT HEAD screw ×4 CAUTION: Do not apply pressure to the middle of the HDD assembly. It may damage the HDD assembly. Hold the HDD assembly by its corners. 2.
4 Replacement Procedures 4.6 4.6 Slim select bay module Slim select bay module Removing the slim select bay module The following describes the procedure for removing the slim select bay module. (See Figure 4-9 and 4-10.) The explanation and figure shown below are the optical disk drive removing/installing. CAUTION: Do not put fingers in the slot for the slim select bay module. It may cause injury. 1. Remove the following screw securing the latch and drive the removed screw into the screw hole.
4.6 Slim select bay module 4 Replacement Procedures 3. Remove the following screws, connector cover and connector from the optical drive assembly. • M2×6C BIND screw ×2 4. Remove the following screw and connector base from the optical drive assembly. • M2×2.8C S-THIN HEAD screw ×1 5. Remove the following screws and ODD side assembly from the optical drive assembly • M2×6C BIND screw ×1 • M2×22C BIND screw ×1 Connector base Connector M2×6C BIND M2×22C BIND M2×2.
4 Replacement Procedures 4.6 Slim select bay module Installing the slim select bay module The following describes the procedure for installing the slim select bay module. (See Figure 4-9 and 4-10.) 1. Install the ODD side assembly to the optical drive assembly and secure it with the following screws. • M2×6C BIND screw ×1 • M2×22C BIND screw ×1 2. Install the connector base to the optical drive assembly and secure it with the following screw. • M2×2.8C S-THIN HEAD screw ×1 3.
4.7 Keyboard holder 4.7 4 Replacement Procedures Keyboard holder Removing the Keyboard holder The following describes the procedure for removing the keyboard holder. (See Figure 4-11.) 1. Open the display and make it flat. 2. Insert your fingers into the slots on both sides and remove the keyboard holder. Slot Keyboard holder Slot Figure 4-11 Removing the keyboard holder Installing the Keyboard holder The following describes the procedure for installing the keyboard holder. (See Figure 4-11.) 1.
4 Replacement Procedures 4.8 4.8 Switch board Switch board Removing the Switch board The following describes the procedure for removing the switch board. (See Figure 4-12.) 1. Disconnect the switch cable from the connector on the switch board. 2. Push the hook down and remove the switch board from the slot while sliding it as shown in the figure below.
4.9 Bluetooth module 4.9 4 Replacement Procedures Bluetooth module Removing the Bluetooth module The following describes the procedure for removing the Bluetooth module. (See Figure 413.) 1. Disconnect the Bluetooth cable and Bluetooth antenna cable from the connector on the Bluetooth module. 2. Push the latch and remove the Bluetooth module from the slot.
4 Replacement Procedures 4.10 Keyboard/Memory module A 4.10 Keyboard/Memory module A Removing the keyboard/memory module A The following describes the procedure for removing the keyboard/memory module A. (See Figure 4-14 to 4-17.) 1. Remove the following screws and turn the keyboard face down on the palm rest. • M2.5×4B FLAT HEAD screw ×2 M2.5×4B FLAT HEAD M2.
4.10 Keyboard/Memory module A 4 Replacement Procedures 2. Remove the following screws and memory slot cover. • M2.5×8B FLAT HEAD screw ×2 M2.5×8B FLAT HEAD M2.
4 Replacement Procedures 4.10 Keyboard/Memory module A CAUTION: The power must be turned off when you remove the memory module. Removing the memory module with the power on risks damaging the module or the computer itself. Do not touch the memory module terminals. Any dirt on the terminals may cause memory access problems. Never press hard or bend the memory module. 3. Open the left and right latches outside and remove the memory module A.
4.10 Keyboard/Memory module A 4 Replacement Procedures 4. Disconnect the keyboard cable from the connector CN3230 on the system board and remove the keyboard.
4 Replacement Procedures 4.10 Keyboard/Memory module A Installing the keyboard/Memory module A The following describes the procedure for installing the keyboard/memory module A. (See Figure 4-14 to 4-17.) 1. Place the keyboard face down on the palm rest. 2. Connect the keyboard cable to the connector CN3230 on the system board. CAUTION: Extra portion of the keyboard cable must be put under the palm rest. 3.
4.11 Fan holder 4 Replacement Procedures 4.11 Fan holder NOTE: When repairing the PC, be sure to clean the fan holder and cooling fin with a vacuum cleaner and cotton sticks, and remove dusts with tweezers. Removing the fan holder The following describes the procedure for removing the fan holder. (See Figure 4-18.) 1. Peel off the insulator that prevents a waterdrop from entering the computer and remove the fan holder from the slot.
4 Replacement Procedures 4.12 Wireless LAN card 4.12 Wireless LAN card Removing the Wireless LAN card The following describes the procedure for removing the wireless LAN card. (See Figure 4-19 and 4-20.) CAUTION: Do not try to remove the wireless LAN card with the computer turned on. It may cause damages to the computer or the wireless LAN card. Do not touch the connectors on the wireless LAN card on the computer. Debris on the connectors may cause the wireless LAN card access problems. 1.
4.12 Wireless LAN card 4 Replacement Procedures 5. Pull out the wireless LAN antenna cables (black, white and gray) from the hole of the cover assembly.
4 Replacement Procedures 4.12 Wireless LAN card Installing the Wireless LAN card The following describes the procedure for installing the wireless LAN card. (See Figure 4-19 and 4-20.) CAUTION: Be sure to switch the computer off before installing the wireless LAN card. Otherwise, the computer or the wireless LAN card may be damaged. 1. Arrange the wireless LAN antenna cables (black, white and gray) through the hole of the cover assembly. 2.
4.13 Touch pad 4 Replacement Procedures 4.13 Touch pad Removing the Touch pad The following describes the procedure for removing the touch pad. (See Figure 4-21 to 4-23.) 1. Lift the tip portions up first and remove the touch pad cover while releasing latches.
4 Replacement Procedures 4.13 Touch pad 2. Disconnect the touch pad cable from the connector CN3240 on the system board and remove the touch pad from the slot. (The touch pad is adhered by the double-sided tape to the slot.) Touch pad cable Touch pad CN3240 Figure 4-22 Removing the touch pad 3. Peel off the glass tape and disconnect the touch pad cable from the connector on the touch pad.
4.13 Touch pad 4 Replacement Procedures Installing the Touch pad The following describes the procedure for installing the touch pad. (See Figure 4-21 to 4-23.) 1. Connect the touch pad cable to the connector on the touch pad. 2. Stick the glass tape in place. NOTE: When installing a new touch pad, reuse the double-sided tape and insulator and stick them in place. If the adhesive strength of the double-sided tape and insulator on the touch pad is weak, replace it (them) with a new one. 3.
4 Replacement Procedures 4.14 Cover assembly and Base assembly 4.14 Cover assembly and Base assembly Removing the cover assembly and base assembly The following describes the procedure for removing the cover assembly and base assembly. (See Figure 4-24 and 4-25.) 1. Close the display and turn over the computer. 2. Remove the following screws. • M2.5×8B FLAT HEAD screw ×3 (“8” in the figure below) • M2.
4.14 Cover assembly and Base assembly 4 Replacement Procedures 3. Turn over the computer and open the display. 4. Disconnect the LCD cable, speaker cable, switch cable and finger print sensor cable from the connector CN5000, CN6170, CN9500 and CN9550 on the system board. 5. Remove the following screws. • M2×4B BIND screw ×1 • M2.5×8B FLAT HEAD screw ×1 6. Separate the cover assembly and base assembly. M2.
4 Replacement Procedures 4.14 Cover assembly and Base assembly Installing the Cover assembly and Base assembly The following describes the procedure for installing the cover assembly and base assembly. (See Figure 4-24 and 4-25.) 1. Install the cover assembly on the base assembly. 2. Connect the LCD cable, speaker cable, switch cable and finger print sensor cable to the connector CN5000, CN6170, CN9500 and CN9550 on the system board. 3.
4.15 Fingerprint sensor board 4 4 Replacement Procedures Replacement Procedures 4.15 Fingerprint sensor board Removing the Fingerprint sensor board The following describes the procedure for removing the fingerprint sensor board. (See Figure 4-26 and 4-27.) 1. Push the hook down and remove the fingerprint sensor board hold plate while sliding it in the direction of the arrow in the figure below. 2. Peel off the glass tape.
4 Replacement Procedures 4.15 Fingerprint sensor board 3. Remove the fingerprint sensor board fixed with the double-sided tape and peel off the double-sided tape that prevents a waterdrop from entering the computer. 4. Disconnect the fingerprint sensor cable from the connector on the fingerprint sensor board.
4.15 Fingerprint sensor board 4 Replacement Procedures Installing the Fingerprint sensor board The following describes the procedure for installing the fingerprint sensor board. (See Figure 4-26 and 4-27.) 1. Connect the fingerprint sensor cable to the connector on the fingerprint sensor board. 2. Stick a new double-sided tape in place and install the fingerprint sensor board. NOTE: Do not reuse the removed double-sided tape. 3.
4 Replacement Procedures 4.16 RTC battery 4.16 RTC battery Removing the RTC battery The following describes the procedure for removing the RTC battery. (See Figure 4-28.) 1. Disconnect the RTC battery cable from the connector CN9300 on the system board. 2. Peel off the glass tape and remove the RTC battery from the slot. Glass tape RTC battery RTC battery cable CN9300 Figure 4-28 Removing the RTC battery Installing the RTC battery The following describes the procedure for installing the RTC battery.
4.17 Microphone 4 Replacement Procedures 4.17 Microphone Removing the Microphone The following describes the procedure for removing the microphone. (See Figure 4-29.) 1. Peel off the glass tape and disconnect the microphone cable from the connector CN6050 on the system board. 2. Remove the microphone from the slot. Glass tape Microphone cable Microphone CN6050 Figure 4-29 Removing the microphone Installing the Microphone The following describes the procedure for installing the microphone.
4 Replacement Procedures 4.18 System board 4.18 System board Removing the System board The following describes the procedure for removing the system board. (See Figure 4-30.) 1. Disconnect the Bluetooth cable from the connector CN4400 on the system board. 2. Peel off the insulator and take out the modem jack, DC-IN jack and HDD cable from the slot. 3. Remove the modem cable holder from the slot. (The modem cable holder is adhered by the double-sided tape to the slot.) 4.
4.18 System board 4 Replacement Procedures CAUTION: Do not hold the portions (shown in the figure below) of the system board. It may damage the system board.
4 Replacement Procedures 4.18 System board Installing the system board The following describes the procedure for installing the system board and LCD cover assembly. (See Figure 4-30.) 1. Install the system board on the base assembly. 2. Install the modem cable holder to the slot. NOTE: When installing a new modem cable holder, reuse the double-sided tape and stick it in place. If the adhesive strength of the double-sided tape on the modem cable holder is weak, replace it with a new one. 3.
4.19 Base latch 4 Replacement Procedures 4.19 Base latch Removing the base latch The following describes the procedure for removing the base latch. (See Figure 4-31.) 1. Remove the base caps on the bottom while releasing latches. 2. Remove the base latches. Be careful not lose the springs.
4 Replacement Procedures 4.20 HDD cable/DC-IN jack 4.20 HDD cable/DC-IN jack Removing the HDD cable/DC-IN jack The following describes the procedure for removing the HDD cable/DC-IN jack. (See Figure 4-32.) 1. Peel off the insulator and disconnect the HDD cable from the connector CN1900 on the system board. 2. Disconnect the DC-IN jack cable from the connector CN8800 on the system board.
4.21 MDC 4 Replacement Procedures 4.21 MDC Removing the MDC The following describes the procedure for removing the MDC. (See Figure 4-33.) 1. Remove the following screws securing the MDC. • M2×4B BIND screw ×2 2. Remove the MDC from the connector CN3010 on the system board. 3. Disconnect the MDC cable from the connector on the MDC. M2x4B BIND MDC cable CN3010 MDC Figure 4-33 Removing the MDC Installing the MDC The following describes the procedure for installing the MDC. (See Figure 4-33.) 1.
4 Replacement Procedures 4.22 North bridge heat sink/CPU heat sink/Fan/CPU 4.22 North bridge heat sink/CPU heat sink/Fan/CPU Removing the North bridge heat sink/CPU heat sink/Fan/CPU The following describes the procedure for removing the North bridge heat sink/CPU heat sink/fan/CPU. (See Figure 4-34 to 4-37.) 1. Remove the following screws in the reverse order of the numbers marked on the North bridge hold plate and North bridge hold plate. • M2×4B BIND screw ×2 2.
4.22 North bridge heat sink/CPU heat sink/Fan/CPU 4 Replacement Procedures 3. Remove the following screws in the reverse order of the number marked on the CPU hold plate. • M2×4B ×3 BIND screw 4. Remove the CPU hold plate and metal plates. 5. Disconnect the fan cable from the connector CN8771 on the system board. 6. Remove the CPU heat sink (with a fan).
4 Replacement Procedures 4.22 North bridge heat sink/CPU heat sink/Fan/CPU 7. Remove the fan holder. 8. Remove the following screws and separate the CPU heat sink and fan. (Fan cable is secured to the fan by the insulator.) • M2.5×3B FLAT HEAD screw ×2 CPU heat sink M2.5×3B FLAT HEAD Fan holder Fan Figure 4-36 Removing the fan 9. Unlock the CPU by rotating counterclockwise the cam on the CPU socket by 90 degrees with a flat-blade driver. Cam Figure 4-37 Removing the CPU 10. Remove the CPU.
4.22 North bridge heat sink/CPU heat sink/Fan/CPU 4 Replacement Procedures Installing the North bridge heat sink/CPU heat sink/Fan/CPU The following describes the procedure for installing the North bridge heat sink/CPU heat sink/fan/CPU. (See Figure 4-34 to 4-39.) 1. Make sure that the cam of the CPU socket is in the unlock (OPEN) position. 2. Install the CPU on the CPU socket and check the CPU is installed on the correct position. 3.
4 Replacement Procedures 4.22 North bridge heat sink/CPU heat sink/Fan/CPU 4. Apply new grease on the CPU and North bridge using a special syringe as shown in the following figure. Apply quarter of scale (0.25ml) of grease evenly on the CPU chip and North bridge chip. When silicon grease is already applied to the CPU, wipe them off with a cloth in advance. Figure 4-39 Applying new grease 5. Stick the insulator to the fan in place to secure the fan cable to the fan. 6.
4.23 LCD unit/FL inverter 4 Replacement Procedures 4.23 LCD unit/FL inverter Removing the LCD unit/FL inverter The following describes the procedure for removing the LCD unit/FL inverter. (See Figure 440 to 4-44.) 1. Peel off the mask seals (6 points) and remove the following screws securing the LCD unit. • M2.5×6B FLAT HEAD screw ×2 2. Remove the keyboard cover while releasing latches. (In the case of removing the LCD unit before removing the keyboard.) 3.
4 Replacement Procedures 4.23 LCD unit/FL inverter 4. Put the soft cloth on the keyboard and lay the LCD unit down as shown in the figure below.
4.23 LCD unit/FL inverter 4 Replacement Procedures 5. Peel off the insulator (with double-sided tape) on the FL inverter. 6. Disconnect the FL cables from both sides of the FL inverter. 7. Remove the FL inverter from the slot.
4 Replacement Procedures 4.23 LCD unit/FL inverter 8. Remove two glass tapes securing the LCD cable and disconnect the LCD cable from the connector on the LCD unit. Glass tape LCD cable Figure 4-43 Removing the LCD cable 9. Remove the following screws and LCD unit.
4.23 LCD unit/FL inverter 4 Replacement Procedures Installing the LCD unit/FL inverter The following describes the procedure for installing the LCD unit/FL inverter. (See Figure 440 to 4-44.) 1. Install the LCD unit to the display cover and secure it with the following screws. • M2×3C S-THIN HEAD screw ×4 2. Connect the LCD cable to the connector on the back of the LCD unit. Stick two glass tapes in place. 3. Connect two FL cables to a new FL inverter and install the FL inverter in place.
4 Replacement Procedures 4.24 LCD cable 4.24 LCD cable Removing the LCD cable The following describes the procedure for removing the LCD cable. (See Figure 4-44 and 445.) 1. Close the hinges and turn over the cover assembly and peel off the acetate tape fixing the LCD cable. When closing the hinges, be careful not to push the upper portion of them. 2. Turn over the cover assembly and open the display 3.
4.25 Wireless LAN antenna/Bluetooth antenna 4 Replacement Procedures 4.25 Wireless LAN antenna/Bluetooth antenna Removing the Wireless LAN antenna/Bluetooth antenna The following describes the procedure for removing the wireless LAN antenna/Bluetooth antenna (See Figure 4-46.) 1. Peel off the acetate tapes securing the wireless LAN antenna cables and Bluetooth antenna cable. 2. Remove the wireless LAN antennas and Bluetooth antenna from the slot of the display rear cover.
4 Replacement Procedures 4.26 Hinge 4.26 Hinge Removing the Hinge The following describes the procedure for removing the hinge. (Figure 4-47 and 4-48.) 1. Push the LCD mask down. CAUTION: Do not push the top of the LCD mask. It may break the LCD mask. 2. Remove the following screws. • M2.5×4B FLAT HEAD screw ×4 3. Stand the hinges up with the LCD mask and remove the LCD mask. M2.5×4B FLAT HEAD LCD mask M2.
4.26 Hinge 4 Replacement Procedures 4. Turn over the cover assembly and remove the following screws and metal plate. • M2.5×6C Tapping screw ×1 • M2×4B S-THIN HEAD screw ×1 5. Slide the left hinge inside and remove it through the hole. 6. Remove the following screw and right hinge. • M2.5×6C Tapping screw ×1 7. Slide the right hinge inside and remove it through the hole. M2.5×6C Tapping Hinge (right) M2×4B S-THIN HEAD Metal plate M2.
4 Replacement Procedures 4.26 Hinge Installing the Hinge The following describes the procedure for installing the hinge. (Figure 4-47 and 4-48.) 1. Pass the right hinge through the hole and secure it with the following screw. • M2.5×6C Tapping screw ×1 2. Pass the left hinge through the hole. 3. Secure the left hinge and metal plate with the following screws. • M2.5×6C Tapping screw ×1 • M2×4B S-THIN HEAD screw ×1 4. Set the LCD mask to the hinges and secure it with the following screws. • M2.
4.27 Speaker 4 Replacement Procedures 4.27 Speaker Removing the Speaker The following describes the procedure for removing the speaker. (Figure 4-49.) 1. Peel the plastic tape and pass the connector of the speaker cable through the hole of the cover assembly. 2. Remove the speakers (left and right) from the slot.
4 Replacement Procedures 4.27 Speaker Installing the Speaker The following describes the procedure for installing the speaker. (Figure 4-49 to 4-51.) 1. Install the speakers (left and right) to the slots (left and right) after installing the hinges. 2. Pass the connector of the speaker cable through the hole.
4.27 Speaker 4 Replacement Procedures 3. Arrange the speaker cable on the slot of the cover assembly. Speaker cable Figure 4-51 Arranging the speaker cable 4. Turn over the cover assembly and stick the plastic tape.
4 Replacement Procedures 4 4.28 Fluorescent Lamp Replacement Procedures 4.28 Fluorescent Lamp This system uses LCD modules from the following suppliers. The procedure for replacing the fluorescent lamp is different for each LCD module. Refer to the appropriate procedure. Type Part No. Supplier Section 14.1-inch (WXGA) G33C00041110 LG Philips 4.28.1 G33C0003X110 SAMSUNG 4.28.2 G33C00043110 LG Philips 4.28.3 14.
4.28 Fluorescent Lamp 4 Replacement Procedures 4.28.1 Replacing the 14.1-inch WXGA LG Philips Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module. To replace the 14.1-inch WXGA LG Philips fluorescent lamp, follow the steps below and refer to Figure 4-52 to 4-59. Disassembly of outside tape / Cover shield 1.
4 Replacement Procedures 4.28 Fluorescent Lamp Disassembly of Top Case 1. Disassembly of Top Case. CAUTION: Pressure or stress should not be given on PCB and COF. Figure 4-53 Replacing LG.
4.28 Fluorescent Lamp 4 Replacement Procedures Disassembly of Source PCB 1. Disassembly of Source PCB. CAUTION: Pressure or stress should not be given on PCB and COF. Figure 4-54 Replacing LG.
4 Replacement Procedures 4.28 Fluorescent Lamp Disassembly of Board Ass’y, Tape Adhesive, Sheets, Light guide, Cover Ass’y Bottom (L) 1. Disassembly of Board Ass’y. CAUTION: This process should be made in Clean room with no scratch nor particle on Polarizer and B/L Ass’y. 2. Disassembly of Tape Adhesive used for Sheets fixing (4 Points). 3. Disassembly of Sheets and Light guide. CAUTION: No penetration of foreign body is indispensable with no scratch on the surface of each Sheet. 4.
4.28 Fluorescent Lamp 4 Replacement Procedures Assembly of Cover Ass’y Bottom (L), Sheets, Light guide, Tape Adhesive and Board Ass’y 1. Detach a release paper from Double Tape at the Cover Ass’y Bottom (L). 2. Assembly of Cover Ass’y Bottom (L) and Screw (2Point). CAUTION: Maximum value of torque with Screw should be below 2.5kgf.cm. 3. Assembly of Light Guide and Sheets. CAUTION: No penetration of foreign body is indispensable with no scratch on the surface of each Sheet and Light guide. 4.
4 Replacement Procedures 4.28 Fluorescent Lamp Assembly of Source PCB 1. Assembly of Source PCB. CAUTION: Stress should not be given on COF. Figure 4-57 Replacing LG.
4.28 Fluorescent Lamp 4 Replacement Procedures Assembly of Top Case 1. Assembly of Top Case. CAUTION: Pressure should not be given on PCB and COF. Figure 4-58 Replacing LG.
4 Replacement Procedures 4.28 Fluorescent Lamp Assembly of outside Tape and Cover shield 1. Assembly of Cover shield (S). CAUTION: Pressure or stress should not be given on Source PCB. Usage of gloves with anti-electric discharge coating is recommended. To eliminate possible damage on circuits occurred by ESC. 2. Assembly of Cover shield (G). CAUTION: Pressure or stress should not be given on Gate COF. 3. Assembly of Tape Adhesive used for Top case fixing.
4.28 Fluorescent Lamp 4 Replacement Procedures 4.28.2 Replacing the 14.1-inch WXGA Samsung Fluorescent Lamp To replace the 14.1-inch WXGA Samsung fluorescent lamp, follow the steps below and refer to figures 4-60 to 4-63. Removing the fluorescent lamp 1. Remove the PCB cover. CAUTION: Handle with care not to damage COF of S/D ICs.
4 Replacement Procedures 4.28 Fluorescent Lamp 2. Remove the side tapes and Al tape. Side tape (right) Side tape (left) Bottom Al tape Lamp-wire tape Figure 4-61 Replacing Samsung fluorescent lamp (WXGA) (2) 3. Separate the top chassis from the molded frame. CAUTION: Separate in the order of bottom hook and side hook (left and right).
4.28 Fluorescent Lamp 4 Replacement Procedures 4. Separate the panel assembly from backlight unit. CAUTION: Handle with care not to damage COF of S/D.
4 Replacement Procedures 4.28 Fluorescent Lamp Assembling the fluorescent lamp The assembly procedure of the 15.4-inch Samsung fluorescent lamp is the reverse of the above disassembly procedure. Refer to figures 4-60 to 4-63. 1. Install the panel assembly on the backlight unit. 2. Install the top chassis on the molded frame. 3. Stick the side tapes and Al tape. 4. Stick the PCB cover.
4.28 Fluorescent Lamp 4 Replacement Procedures 4.28.3 Replacing the 14.1-inch WXGA+ LG Philips Fluorescent Lamp CAUTION: When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module. To replace the 14.1-inch WXGA+ LG Philips fluorescent lamp, follow the steps below and refer to Figure 4-64 to 4-71. Disassembly of outside tape / Cover shield 1.
4 Replacement Procedures 4.28 Fluorescent Lamp Disassembly of Top Case 1. Disassembly of Top Case. CAUTION: Pressure or stress should not be given on PCB and COF. Figure 4-65 Replacing LG.
4.28 Fluorescent Lamp 4 Replacement Procedures Disassembly of Source PCB 1. Disassembly of Source PCB. CAUTION: Pressure or stress should not be given on PCB and COF. Figure 4-66 Replacing LG.
4 Replacement Procedures 4.28 Fluorescent Lamp Disassembly of Board Ass’y, Tape Adhesive, Sheets, Light guide, Cover Ass’y Bottom (L) 1. Disassembly of Board Ass’y. CAUTION: This process should be made in Clean room with no scratch nor particle on Polarizer and B/L Ass’y. 2. Disassembly of Tape Adhesive used for Sheets fixing (4 Points). 3. Disassembly of Sheets and Light guide. CAUTION: No penetration of foreign body is indispensable with no scratch on the surface of each Sheets. 4.
4.28 Fluorescent Lamp 4 Replacement Procedures Assembly of Cover Ass’y Bottom (L), Sheets, Light guide, Tape Adhesive and Board Ass’y 1. Detach a release paper from Double Tape at the Cover Ass’y Bottom (L). 2. Assembly of Cover Ass’y Bottom (L) and Screw (2 Points). CAUTION: Maximum value of torque with Screw should be below 2.5kgf.cm. 3. Assembly of Light Guide and Sheets. CAUTION: No penetration of foreign body is indispensable with no scratch on the surface of each Sheet and Light guide. 4.
4 Replacement Procedures 4.28 Fluorescent Lamp Assembly of Source PCB 1. Assembly of Source PCB. CAUTION: Stress should not be given on COF. Figure 4-69 Replacing LG.
4.28 Fluorescent Lamp 4 Replacement Procedures Assembly of Top Case 1. Assembly of Top Case. CAUTION: Pressure should not be given on PCB and COF. Figure 4-70 Replacing LG.
4 Replacement Procedures 4.28 Fluorescent Lamp Assembly of Source PCB 1. Assembly of Source PCB & Cover shield(S). CAUTION: Pressure or stress should not be given on Source COF & Source PCB. Usage of gloves with anti-electric discharge coating is recommended. To eliminate possible damage on circuits occurred by ESC. 2. Assembly of Cover shield (G). CAUTION: Pressure or stress should not be given on Gate COF. 3. Assembly of Tape Adhesive used for Top case fixing. 4.
Appendices [CONFIDENTIAL]
Appendices App-ii [CONFIDENTIAL] TECRA M9 Maintenance Manual (960-631)
Appendices Appendix Contents Appendix A Handling the LCD Module ...........................................................................A-1 Appendix B Board Layout .................................................................................................B-1 B.1 System Board (FNPSY*) Front View....................................................................B-1 B.2 System Board (FNPSY *) Back View ...................................................................B-3 B.
Appendices C.22 CN8810 Main Battery connector (10-pin)..........................................................C-20 C.23 CN9300 RTC Battery connector (3-pin).............................................................C-21 C.24 CN8771 FAN interface connector (4-pin) ..........................................................C-21 C.25 CN6050 Internal microphone connector (2-pin) ................................................C-21 C.26 J6051 External microphone connector (6-pin) ....................
Appendices Figures Figure B-1 System board (FNPSY*) layout (front) .........................................................B-1 Figure B-2 System board (FNPSY*) layout (back) .........................................................B-3 Figure B-3 SwitchBoard (FNPSW*) layout (front/back) ................................................B-5 Figure B-4 Fingerprint sensor Board (FNPFS*) layout (front/back)...............................B-6 Figure E-1 UK keyboard.........................................
Appendices Table C-11 Dual Point interface connector (8-pin)...........................................................C-16 Table C-12 Switch board interface connector (8-pin).......................................................C-16 Table C-13 LAN interface connector (12-pin)..................................................................C-16 Table C-14 IEEE 1394 interface connector (4-pin) ..........................................................C-17 Table C-15 Bluetooth interface connector (20-pin) .
Appendices Table I-1 MTBF ................................................................................................................
Appendices App-viii [CONFIDENTIAL] TECRA M9 Maintenance Manual (960-631)
Appendix A Handling the LCD Module Appendix A Appendices P Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
Appendices Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4.
Appendix A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
Appendices Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage.
Appendix A Handling the LCD Module Appendices 9. Do not disassemble the LCD module. Disassembly can cause malfunctions. 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxime). These materials can release gas that can damage the panel’s polarization.
Appendices A-6 Appendix A Handling the LCD Module [CONFIDENTIAL] TECRA M9 Maintenance Manual (960-631)
Appendix B Board Layout Appendices Appendix B Board Layout B.
Appendices Appendix B Board Layout Table B-1 System board (FNPSY*) ICs and connectors (front) Number B-2 Name CN1400 SO-DIMM0 connector IC1600 Intel ICH8M (South Bridge) CN2110 PC card interface connector CN2600 Mini PCI Express interface connector (Wireless LAN) CN2610 Mini PCI Express interface connector (3G: not used) CN2650 Mini PCI Express interface connector (Robson: not used) CN3230 Keyboard interface connector CN3240 Dual Point interface connector CN4400 Bluetooth interface conn
Appendix B Board Layout B.
Appendices Appendix B Board Layout Table B-2 System board FNPSY*) connectors (back) Number IS1050 CPU socket IC1200 Intel Crestline-GM (North Bridge) CN1410 SO-DIMM1 connector CN1820 Select bay interface connector CN1900 HDD(SATA) interface connector IS2150 SD card interface connector CN2300 Docking interface connector CN3010 MDC interface connector CN3420 Serial connector J4100 B-4 Name LAN interface connector CN4230 IEEE 1394 interface connector CN4610 USB port 6 connector CN461
Appendix B Board Layout B.
Appendices B.
Appendix C Pin Assignments Appendices Appendix C Appendix C Pin Assignments System board C.1 CN1400 SO-DIMM0 connector (200-pin) Table C-1 SO-DIMM0 connector (200-pin) (1/3) Pin No. Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments Table C-1 SO-DIMM0 connector (200-pin) (2/3) Pin No. C-2 Signal Name I/O Pin No. Signal Name I/O 64 ADQ24-B1P I/O 63 ADQ29-B1P I/O 65 GND - 66 GND 67 ADM3-B1P I 68 ADQS3-B1N I/O 69 N.C. - 70 ADQS3-B1P I/O 71 GND - 72 GND 73 ADQ30-B1P I/O 74 ADQ31-B1P I/O 75 ADQ27-B1P I/O 76 ADQ26-B1P I/O 77 GND - 78 GND - 79 MCKE0-B1P I 80 MCKE1-B1P I 81 1R8-B1V I 82 1R8-B1V I 83 N.C. - 84 N.
Appendix C Pin Assignments Appendices Table C-1 SO-DIMM0 connector (200-pin) (3/3) Pin No. Signal Name I/O Pin No.
Appendices C.2 Appendix C Pin Assignments CN1410 SO-DIMM1 connector (200-pin) Table C-2 SO-DIMM1 connector (200-pin) (1/3) Pin No. C-4 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices Table C-2 SO-DIMM1 connector (200-pin) (2/3) Pin No. Signal Name I/O Pin No. Signal Name I/O 64 BDQ28-B1P I/O 63 BDQ29-B1P 65 GND - 66 GND 67 BDM3-B1P I 68 BDQS3-B1N I/O 69 N.C. - 70 BDQS3-B1P I/O 71 GND - 72 GND 73 BDQ31-B1P I/O 74 BDQ27-B1P I/O 75 BDQ30-B1P I/O 76 BDQ26-B1P I/O 77 GND - 78 GND - 79 MCKE3-B1P I 80 MCKE4-B1P I 81 1R8-B1V I 82 1R8-B1V I 83 N.C. - 84 N.
Appendices Appendix C Pin Assignments Table C-2 SO-DIMM1 connector (200-pin) (3/3) Pin No. C-6 Signal Name I/O Pin No.
Appendix C Pin Assignments C.3 Appendices CN1820 Select bay interface connector (72-pin) Table C-3 Select bay interface connector (72-pin) Pin No. Signal Name I/O Pin No.
Appendices C.4 Appendix C Pin Assignments CN1900 SATA interface connector (11-pin) Table C-4 SATA interface connector (11-pin) Pin No. C-8 Signal Name I/O Pin No.
Appendix C Pin Assignments C.5 Appendices CN2110 PC card interface connector (70-pin) Table C-5 PC card interface connector (70-pin) Pin No. Signal Name I/O Pin No.
Appendices C.6 Appendix C Pin Assignments IS2150 SD card interface connector (12-pin) Table C-6 SD card interface connector (12-pin) Pin No. C-10 Signal Name 1 MSDAT3-E3P 3 GND I/O Pin No.
Appendix C Pin Assignments C.7 Appendices CN2300 Docking interface connector (133-pin) Table C-7 Docking interface connector (133-pin) (1/3) Pin No. Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments Table C-7 Docking interface connector (133-pin) (2/3) Pin No. C-12 Signal Name 69 ZBIDCN-EXN 71 DCOUT 73 I/O Pin No.
Appendix C Pin Assignments Appendices Table C-7 Docking interface connector (133-pin) (3/3) Pin No. Signal Name I/O Pin No.
Appendices C.8 Appendix C Pin Assignments CN2600 Mini PCI Express interface connector (52-pin) Table C-8 Mini PCI Express interface connector (52-pin) Pin No. C-14 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices C-9 CN3010 MDC interface connector (12-pin) Table C-9 MDC interface connector (12-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O - 2 NC - I/O 4 NC - - 6 E3V I 8 GND - 10 GND - 12 XAZBC1-P3P I 1 GND 3 AZSDO1-P3P 5 GND 7 AZSYC1-P3P 9 (IC3010-1) 11 AZRST1-E3N 1T GND - 2T GND - 3T GND - 4T GND - 5T GND - 6T GND - I/O C.
Appendices Appendix C Pin Assignments C.11 CN3240 Dual Point interface connector (8-pin) Table C-11 Dual Point interface connector (8-pin) Pin No. 1 3 5 7 Signal Name SP-P5V SPY-PXP GND IPDDAT-P5P I/O Pin No. O I/O 2 4 6 8 Signal Name SPX-PXP SP-GND IPDCLK-P5P P5V I/O O I/O I C.12 CN9500 Switch board interface connector (8-pin) Table C-12 Switch board interface connector (8-pin) Pin No. Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices C.14 CN4230 IEEE 1394 interface connector (4-pin) Table C-14 IEEE 1394 interface connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 ZTPB0-P3N I/O 2 ZTPB0-P3P I/O 3 ZTPA0-P3N I/O 4 ZTPA0-P3P I/O 1T GND - 2T GND - 3T GND - 4T GND - C.15 CN4400 Bluetooth interface connector (20-pin) Table C-15 Bluetooth interface connector (20-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments C.17 CN4611 USB port 4 connector (4-pin) Table C-17 USB port 4 connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 USBOPS-E5V O 2 ZUSBP4-E3N 3 ZUSBP4-E3P I/O 4 GND - 2T GND - 1T GND - 3T GND - I/O - C.18 CN4612 USB port 0 connector (4-pin) Table C-18 USB port 0 connector (4-pin) Pin No. C-18 Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices C.19 CN5000 LCD interface connector (40-pin) Table C-19 LCD interface connector (40-pin) Pin No. Signal Name I/O Pin No.
Appendices Appendix C Pin Assignments C.20 CN5080 RGB connector (15-pin) Table C-20 RGB connector (15-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 MRED-PXP O 2 MGREEN-PXP O 3 MBLUE-PXP O 4 NC - 5 GND - 6 GND - 7 GND - 8 GND - 9 DDC-P5V - 10 GND - 11 NC - 12 CRTSDA-P5P I/O 13 MHSYNC-P3P O 14 MVSYNC-P3P O 15 CRTSCL-P5P I/O 1T GND 2T GND - - C.21 CN8800 DC-IN connector (4-pin) Table C-21 DC-IN connector (4-pin) Pin No.
Appendix C Pin Assignments Appendices C.23 CN9300 RTC Battery connector (3-pin) Table C-23 RTC Battery connector (3-pin) Pin No. Signal Name I/O Pin No. 2 1 (R3V) - 3 GND - 1T GND - 2T Signal Name I/O NC - GND - C.24 CN8771 FAN interface connector (4-pin) Table C-24 FAN interface connector (4-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 P5V - 2 FANGO-P3P I 3 GND - 4 FPWMO-S3P O C.
Appendices Appendix C Pin Assignments C.28 J6310 Headphone connector (6-pin) Table C-28 Headphone connector (6-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 A-GND - 2 HEADL-PXP O 3 HEADR-PXP O 4 DETCTA-P4N O 5 A-GND - 6 NC - C.29 CN3420 Serial connector (9-pin) Table C-29 Serial connector (9-pin) Pin No. 1 3 5 7 9 1T Signal Name DCD-PYP TXD-PYN GND RTS-PYP RING-PYP GND I/O Pin No.
Appendix C Pin Assignments Appendices Switch Board C.31 CN9510 System board interface connector (8-pin) Table C-31 System board interface connector (8-pin) Pin No. 1 3 5 7 1T Signal Name GND S3V GPBTNB-S3N GND GND I/O Pin No. I I - 2 4 6 8 2T Signal Name DBGDET-P3N PNLOFF-S3N GPBTNA-S3N PWRSW-S3N GND I/O I I I I - Fingerprint sensor Board C.32 CN9650 System board interface connector (6-pin) Table C-32 System board interface connector (6-pin) Pin No.
Appendices C-24 Appendix C Pin Assignments [CONFIDENTIAL] TECRA M9 Maintenance Manual (960-631)
Appendix D Keyboard Scan/Character Codes Appendices Appendix D Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) D-2 Cap No.
Appendix D Keyboard Scan/Character Codes Appendices Table D-1 Scan codes (set 1 and set 2) (3/4) Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap No. Keytop Code set 1 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc Refer to table 2-25 126 Pause Refer to table 2-25 202 Fn 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Make Code set 2 Break Make Note Break *5 Notes: 1. 2. 3. 4. 5. D-4 * * * * * Scan codes differ by overlay function.
Appendix D Keyboard Scan/Character Codes Appendices Table D-2 Scan codes with left Shift key Cap Key No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
Appendix D Keyboard Scan/Character Codes Appendices Table D-5 Scan codes in overlay mode Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-7 No.126 key scan code Key top Shift Code set 1 Code set 2 Make Make Pause Common * E1 1D 45 E1 Ctrl* E0 46 E0 C6 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E 14 F0 77 *: This key generates only make codes.
Appendix E Key Layout Appendices Appendix E Appendix E E.1 Key Layout United Kingdom (UK) Keyboard Figure E-1 UK keyboard E.
Appendices E-2 Appendix E Key Layout [CONFIDENTIAL] TECRA M9 Maintenance Manual (960-631)
Appendix F Wiring diagrams Appendices Appendix F Appendix F F.1 Wiring diagrams RGB Monitor Loopback Connector Figure F-1 RGB Monitor Loopback Connector F.
Appendices F.3 Appendix F Wiring diagrams RS-232C direct connection cable (9-pin to 9-pin) Figure F-3 RS-232C direct connection cable (9-pin to 9-pin) F.
Appendix F Wiring diagrams F.
Appendices F-4 Appendix F Wiring diagrams [CONFIDENTIAL] TECRA M9 Maintenance Manual (960-631)
Appendix G BIOS rewrite procedures Appendices Appendix G Appendix G BIOS rewrite procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk for the computer that has renewed BIOS data. Rewriting the BIOS 1. Set the system to boot mode. 2. Turn off the power to the computer. 3. Remove the external cable and PC card. 4.
Appendices G-2 Appendix G BIOS rewrite procedures [CONFIDENTIAL] TECRA M9 Maintenance Manual (960-631)
Appendix H EC/KBC rewrite procedures Appendices Appendix H Appendix H EC/KBC rewrite procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. Tools To rewrite the EC/KBC, you need the following tool: EC/KBC rewriting disk for the computer Rewriting the EC/KBC NOTE: 1. Rewrite the EC/KBC only when instructed by a diagnostic disk release notice. 2. Connect the AC adaptor to the computer when you rewrite the EC/KBC. 3.
Appendices H-2 Appendix H EC/KBC rewrite procedures [CONFIDENTIAL] TECRA M9 Maintenance Manual (960-631)
Appendix I Reliability Appendices Appendix I Appendix I Reliability The following table shows MTBF (Mean Time Between Failures).
Appendices I-2 Appendix I Reliability [CONFIDENTIAL] TECRA M9 Maintenance Manual (960-631)
