Toshiba Personal Computer TECRA R10 Maintenance Manual First edition September 2008 TOSHIBA CORPORATION File Number 960-708 [CONFIDENTIAL]
Copyright © 2008 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein. Toshiba Personal Computer TECRA R10 Maintenance Manual First edition September 2008 Disclaimer The information presented in this manual has been reviewed and validated for accuracy.
Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer TECRA R10. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field. SAFETY PRECAUTIONS Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the TECRA R10 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service. Chapter 4 Replacement Procedures describes the removal and replacement of the FRUs.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Table of Contents Chapter 1 Hardware Overview 1.1 Features ...................................................................................................................... 1-1 1.1 Features ...................................................................................................................... 1-1 1.2 System Unit Block Diagram ...................................................................................... 1-8 1.3 3.5-inch Floppy Disk Drive (USB External) ..................
Chapter 2 Troubleshooting Procedures 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart........................................................................................ 2-3 2.3 Power Supply Troubleshooting.................................................................................. 2-8 2.4 System Board Troubleshooting...............................................................
Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ................................................................................... 3-4 3.3 Setting of the hardware configuration ....................................................................... 3-9 3.4 Heatrun Test.......................................................................................
3.32 SETUP ..................................................................................................................... 3-81 Chapter 4 Replacement Procedures 4.1 Overview.................................................................................................................... 4-1 4.2 Battery pack ............................................................................................................. 4-11 4.3 SIM card...........................................................
4.30 CAMERA MODULE/Antenna..............................................................................4-79 4.31 Hinge........................................... ............................................................................ 4-84 Appendices Appendix A Handling the LCD Module ........................................................................... A-1 Appendix B Board Layout ................................................................................................
Chapter 1 Hardware Overview [CONFIDENTIAL]
1 Hardware Overview 1-ii [CONFIDENTIAL] TECRA R10 Maintenance Manual (960-708)
1 Hardware Overview Chapter 1 Contents 1.1 Features.......................................................................................................................1-1 1.2 System Unit Block Diagram.......................................................................................1-8 1.3 3.5-inch Floppy Disk Drive (USB External)............................................................1-14 1.4 2.5-inch Hard Disk Drive .....................................................................
1 Hardware Overview Figures Figure 1-1 Front of the computer ....................................................................................1- 6 Figure 1-2 System unit configuration..............................................................................1- 7 Figure 1-3 System unit block diagram ............................................................................1- 9 Figure 1-4 3.5-inch FDD (USB External) .....................................................................
1.1 Features 1.1 1 Hardware Overview Features The Toshiba TECRA R10 Personal Computer uses extensive Large Scale Integration (LSI), and Complementary Metal-Oxide Semiconductor (CMOS) technology extensively to provide compact size, minimum weight, low power usage and high reliability. This computer incorporates the following features. There some models and options. Refer to the Parts List for the configuration of each model and options.
1 Hardware Overview 1.1 Features SSD Some models are equipped with a "Solid State Drive (SSD)" instead of a hard disk drive. • 64GB,128GB USB FDD A 3.5-inch USB FDD accommodates 2HD (1.44MB) or 2DD (720KB) disks. Optical Drive A DVD Super Multi drive (double layer) can be installed. Display The PC comes in with one of the following two types: • 14.1” WXGA-TFT color display, resolution 1,280×800 • 14.
1.1 Features 1 Hardware Overview Universal Serial Bus (USB2.0) Two USB ports are provided. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported. eSATA/USB combo One eSATA/USB combo port, which complies to. The USB 2.0 standard is provided. This port has eSATA (External Serial ATA) function. A power supply is always supplied to one USB ports on the left side of a computer.
1 Hardware Overview 1.1 Features Docking interface port The docking interface port enables connection of an optional Express Port Replicator. It provides additional features as follows: • RJ45 LAN jack • External monitor port • DC IN 15V jack • Security lock slot • Universal Serial Bus 2.
1.1 Features 1 Hardware Overview Web Camera Web Camera Web Camera is a device that allows you to record video or take photographs with your computer. Enables the transmission of video and use of video chat via the internet using specialized applications. The effective pixel count for this web camera is 0.3 million (maximum photograph size: 640x480 pixels). Some models are equipped with a Web Camera. 3G: PCI Express Mini Card slot 2.
1 Hardware Overview 1.1 Features The front of the computer is shown in figure 1-1.
1.1 Features 1 Hardware Overview The system unit configuration is shown in figure 1-2.
1 Hardware Overview 1.2 1.2 System Unit Block Diagram System Unit Block Diagram Figure 1-3 is a block diagram of the system unit.
1.2 System Unit Block Diagram 1 Hardware Overview The system unit is composed of the following major components: Microprocessor The Toshiba TECRA R10 computer is equipped with an Intel® CoreTM 2 Duo Processor. These processors incorporate a math co-processor, a 6MB L2 cache memory. The PC comes in with one of the following speeds: Intel® CoreTM 2 Duo Processor (Montevina Penryn) • SP9400(2.40GHz/) /SP9300(2.26GHz) These processors operate at 1066MHz bus clock (FSB).
1 Hardware Overview 1.2 System Unit Block Diagram • North Bridge Intel Cantiga GS Meorom Processor System Bus Supports PCI Express Based Graphics Interface System Memory supports :DDR2-667／DDR2-800, 4GB max. DMI(Direct Media Interface: x4/x2, ASPM L0s, L1 states support) Power management control (DPST 4.0) • South Bridge ICH9M-E(SFF) -PCI Local Bus Specification, Revision 2.
1.2 System Unit Block Diagram 1 Hardware Overview Card controller (R5C833) • - PCI Interface • - SD/MMC, Memory Stick, xD card Controller VGA Controller The PC comes in with one of the following two types: • The internal graphics controller in North Bridge is used. • nVIDIA NB9M-NE is used.
1 Hardware Overview 1.2 System Unit Block Diagram Wireless LAN • One PCI Express Mini Card slot1 802.11a/b/g/n: Intel Shirley Peak 802.11a/b/g: Intel Shirley Peak • Supports Wireless Communication SW Bluetooth • V2.1+EDR • USB interface connection • Built-in antenna EC/KBC (Embedded Controller/Keyboard Controller) • One Mitsubishi M306KAFCLPR micon chip functions as both EC and KBC. PSC (Power Supply Controller) • One TMP86FS49AUG chip is used.
1.2 System Unit Block Diagram 1 Hardware Overview Sensor • Thermal Sensor: One ADM1032ARMZ chip is used.
1 Hardware Overview 1.3 1.3 3.5-inch Floppy Disk Drive (USB External) 3.5-inch Floppy Disk Drive (USB External) The 3.5-inch FDD is a thin, high-performance reliable drive that supports 720KB (formatted) 2DD and 1.44MB (formatted) 2HD disks. The FDD is shown in figure 1-4. The specifications for the FDD are listed in Table 1-1. Figure 1-4 3.5-inch FDD (USB External) Table 1-1 3.5-inch FDD specifications TEAC FD-05PUB-337 (G8AC0000B320) Items Data transfer rate FDD part USB 720KB mode 1.
1.4 2.5-inch Hard Disk Drive 1.4 1 Hardware Overview 2.5-inch Hard Disk Drive The removable HDD is a random access non-volatile storage device. It has a non-removable 2.5-inch magnetic disk and mini-Winchester type magnetic heads. The computer supports an 80GB, 120GB, 160GB, 200GB, 250GB or 320GB. The HDD is shown in figure 1-5. Specifications are listed in Table 1-2. Figure 1-5 2.
1 Hardware Overview 1.4 2.5-inch Hard Disk Drive Table 1-2 2.5-inch HDD specifications Specifications FUJITSU Items G8BC0 0052 082 Outline Dimens ions Width (mm) Height (mm) Depth (mm) Weight (g) Storage size (formatted) Speed (RPM) G8BC0 0052 122 G8BC0 0052 162 G8BC0 0052 252 G8BC0 0052 322 G8BC00 05N 160 G8BC00 05N 200 G8BC0005N 320 100.0 9.5 70.
1.4 2.5-inch Hard Disk Drive 1 Hardware Overview Table 1-2 2.5-inch HDD specifications Specifications HGST Items G8BC0 005108 0 Outli ne Dime nsio ns G8BC00 051120 G8BC0 005116 0 G8BC0005 1250 Width (mm) Height (mm) Speed (RPM) Data transfer rate Disk-buffer to/from media(Mbps) Buffer-host data transfer (Ggit/sec) Data buffer size (KB) G8BC00 05F160 G8BC00 05F200 G8BC0 005F32 0 100.2±0.25 9.5±0.2 Depth (mm) Weight (g) Storage size (formatted) G8BC00 051320 69.85±0.
1 Hardware Overview 1.5 1.5 2.5-inch Solid State Drive (SSD) 2.5-inch Solid State Drive (SSD) Some models are equipped with a "Solid State Drive (SSD)" instead of a hard disk drive. The computer supports a 64GB and 128GB. The specifications of SSD are listed by the table 1-3. Table 1-3 1.
1.6 DVD-Super Multi Drive Optical Drive (ODD) 1.6 1 Hardware Overview DVD-Super Multi Drive Optical Drive (ODD) The DVD Super Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD-ROM, DVD-ROM, CD-R, CD-RW, DVD-R, DVD+R, DVD-RW, DVD+RW, DVDRAM. The specifications are listed in Table 1-4. Table 1-4 DVD Super Multi drive specifications Item Specifications MATSUSHITA G8CC0004D320 Outline dimensions Width (mm) 128 (excluding projections) Height (mm) 9.
1 Hardware Overview 1.7 1.7 Keyboard Keyboard The keyboard is mounted 85(US)/87(UK) keys that consist of character key and control key, and in conformity with JIS. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-6 is a view of the keyboard. See Appendix E about a layout of the keyboard.
1.8 TFT Color Display 1.8 1 Hardware Overview TFT Color Display The TFT color display consists of 14.1-inch WXGA/WXGA+ LCD module. 1.8.1 LCD Module The LCD module used for the TFT color display uses a white LED backlight as the light source and can display a maximum of 16M colors with 1,280 x 800 or 1,440×900 resolution. The Intel North Bridge (Cantiga GS) or nVIDIA NB9M-NE can control internal and external WXGA or WXGA+ support displays simultaneously.
1 Hardware Overview 1.9 1.9 Power Supply Power Supply The power supply supplies many different voltages to the system board and performs the following functions: 1. Judges that the DC power supply (AC adapter) is connected to the computer. 2. Detects DC output and circuit malfunctions. 3. Controls the battery icon, and DC IN icon. 4. Turns the battery charging system on and off and detects a fully charged battery. 5. Turns the power supply on and off. 6.
1.9 Power Supply 1 Hardware Overview Table 1-6 Power supply output rating (1/3) On/Off of a power supply system and a power supply system in each State is as follows.
1 Hardware Overview 1.9 Power Supply Table 1-6 Power supply output rating (2/3) The main power supply systems inside PC are as follows. PCB FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSD* FMWSD* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWPE* FMWPE* FMWPE* 1-24 Object Clock Gen. Clock Gen.
1.9 Power Supply 1 Hardware Overview FMWSY* FMWSY* FMWTP* FMWSD* FMWSY* FMWSY* FMWSY* SPI EC/KBC Touch Pad LED TPM TPM Accelerometer LAN-E3V S3V P5V M5V E3V P3V S3V FMWTP* FMWTP* FMWSY* FMWSY* FMWSY* FMWSY* FMWPE* FMWUS* FMWUS* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWSY* FMWUS* FMWUS* FMWUS* FMWUS* FMWUS* Finger Sensor. Finger.
1 Hardware Overview 1.9 Power Supply Table 1-6 Power supply output rating (3/3) Four sorts of power supplies with many use places are indicated for every power supply. Voltage [V] 1R5-P1V Power supply name System 1.5 P E3V 3.3 E Name System Object CPU, GMCH, ICH9M-E,Express Card PS, MiniCard Slot1, MiniCard Slot2 Express Card, Finger Sensor, ICH9M-E, LAN , TPM, MiniCard Slot1, MiniCard Slot2 System P3V P5V 1-26 Clock Gen. ,GMCH, Card Cont.
1.10 Batteries 1 Hardware Overview 1.10 Batteries The computer has three types of batteries as follows: Main battery pack RTC battery The battery specifications are listed in Table 1-7. Table 1-7 Battery specifications Battery name Material Output voltage Capacity battery G71C0009H110/210/310 Lithium-Ion 10.8 V 4,000 mAh battery G71C0009J110/210/310 Lithium-Ion 10.8 V 5,100 mAh G71C0006K110/210 Lithium-Ion 10.8 V 4,000 mAh GDM710000041 NiMH 2.
1 Hardware Overview 1.10.2 1.10 Batteries Battery Charging Control Battery charging is controlled by a power supply microprocessor. The microprocessor controls whether the charge is on or off and detects a full charge when the AC adaptor and battery are attached to the computer. The system charges the battery. Battery Charge When the AC adaptor is attached, there are two types of charge: When the system is powered off and when the system is powered on.
1.10 Batteries 1 Hardware Overview Data preservation time When turning off the power in being charged fully, the preservation time is as following Table 1-9. Table 1-9 Data preservation time Condition 1.10.
1 Hardware Overview 1.11 AC Adapter 1.11 AC Adapter The AC adapter is also used to charge the battery. Table 1-11 lists the AC adapter specifications. Table 1-11 AC adapter specifications Parameter Specification G71C0006Q310 (2-pin) Power 75W (Peak 90W) Input voltage 100V/240V Input frequency Input current 50Hz to 60Hz 1.
Chapter 2 Troubleshooting Procedures [CONFIDENTIAL]
Troubleshooting Procedures 2 2-ii [CONFIDENTIAL] TECRA R10 Maintenance Manual (960-708)
Troubleshooting Procedures Chapter 2 Contents 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart........................................................................................ 2-3 2.3 Power Supply Troubleshooting.................................................................................. 2-8 2.4 2.5 2.6 2.7 Procedure 1 Power Status Check ..................................
Troubleshooting Procedures 2.8 2.9 2.10 2.11 2.12 2.13 2.14 2.15 2-iv Touch pad Troubleshooting ..................................................................................... 2-38 Procedure 1 Diagnostic Test Program Execution Check ......................... 2-38 Procedure 2 Connector Check and Replacement Check.......................... 2-39 Membrane switch Troubleshooting .........................................................................
Troubleshooting Procedures 2.16 2.17 2.18 2.19 2.20 3G Troubleshooting ................................................................................................. 2-55 Procedure 1 Transmitting-Receiving Check ............................................ 2-55 Procedure 2 Antenna Connection Check ................................................. 2-56 Procedure 3 Replacement Check ............................................................. 2-57 SD Card Slot Troubleshooting...................
Troubleshooting Procedures 2-vi [CONFIDENTIAL] TECRA R10 Maintenance Manual (960-708)
2.1 Troubleshooting 2 Troubleshooting Procedures 2 2.1 Troubleshooting Chapter 2 describes how to determine which Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. (The “FRU” means the replaceable unit in the field.) The FRUs covered are: 1. 2. 3. 4. 5. 6. 7. Power supply System Board USB FDD HDD/SSD Keyboard Touch pad Membrane switch 8. Display 9. Optical Disk Drive 10. LAN 11. Wireless LAN 12. Bluetooth 13. Sound 14. 3G 15. SD Card Slot 16. Fingerprint Sensor 17.
2 Troubleshooting Procedures 2.1 Troubleshooting There are following two types of connections in the figure of board and module connection in and after 2.3 Power Supply Troubleshooting. (1) Cable connection is described in the figure as line. (2) Pin connection is described in the figure as arrow.
2.2 Troubleshooting Flowchart 2.2 2 Troubleshooting Procedures Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide for determining which troubleshooting procedures to execute. Before going through the flowchart steps, verify the following: Ask him or her to enter the password if a password is registered. Verify with the customer that Toshiba Windows is installed on the hard disk. NonWindows operating systems can cause the computer to malfunction.
2 Troubleshooting Procedures 2.
2.
2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart If the diagnostics program cannot detect an error, the problem may be intermittent. The Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error(s), then perform the appropriate troubleshooting procedures as follows: 1.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures 15. If a malfunction is detected on the fingerprint sensor, perform the Fingerprint Sensor Troubleshooting Procedures in Section 2.18. 16. If a malfunction is detected on the Web camerta, perform the Web camerta Troubleshooting Procedures in Section 2.19. 17. If a malfunction is detected on the Intel Turbo Memory, perform the Intel Turbo Memory Troubleshooting Procedures in Section 2.20.
2 Troubleshooting Procedures 2.3 2.3 Power Supply Troubleshooting Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Table 2-2 DC IN icon DC IN icon Power supply status Lights blue DC power is being supplied from the AC adapter. Blinks orange Power supply malfunction*1 Doesn’t light Any condition other than those above. *1 When the power supply controller detects a malfunction, the DC IN icon blinks orange. It shows an error code. When the icon is blinking, perform the following procedure. 1. Remove the battery pack and the AC adapter. 2.
2 Troubleshooting Procedures Procedure 2 2.3 Power Supply Troubleshooting Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below. Start Off for 2 seconds Error code (8 bit) “1” On for one second “0” On for half second Interval between data bits Off for half second The error code begins with the least significant digit. Example: Error code 11h (Error codes are given in hexadecimal format.
2.3 Power Supply Troubleshooting Check 1 2 Troubleshooting Procedures Convert the DC IN icon blink pattern into the hexadecimal error code and compare it to the tables below. Then go to Check 2.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Main Battery Error code Meaning 22h Main battery discharge current is over 0.5A. 23h Main battery charge current is over 4.3A. 24h The compensation value of [0A] is not within the limits from design data (± 15LSB). 25h Main battery charge current is over 0.3A when the charging is off. 2nd Battery Error code Meaning 32h Second battery discharge current is over 0.5A. 33h Second battery charge current is over 3.5A.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures E3V output Error code Meaning 60h E3V voltage is over 3.96V. 61h E3V voltage is under 2.81V when the computer is powered on. 62h E3V voltage is under 2.81V when the computer is booting up. 64h E3V voltage is under 2.81V when EV power is maintained. PPV output Error code Meaning 70h PPV voltage is over 1.56V. 71h PPV voltage is under 0.27V when the computer is powered on. 72h PPV voltage is under 0.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting PPV output Error code Meaning B0h PPV voltage is over 1.56V. B1h PPV voltage is under 0.27V when the computer is powered on. B2h PPV voltage is under 0.59V when the computer is booting up. PGV output Error code Meaning C0h PGV voltage is over 1.32V. C1h PGV voltage is under 0.765V when the computer is powered on. C2h PGV voltage is under 0.785V when the computer is booting up.
2.3 Power Supply Troubleshooting Check 2 2 Troubleshooting Procedures In the case of error code 10h or 12h: Make sure the AC adapter and AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet. If the cables are connected firmly, go to the following step. Connect a new AC adapter and AC power cord. If the problem still occurs, go to Procedure 5. Check 3 In the case of error code 21h: Go to Procedure 3. Check 4 For any other errors, go to Procedure 5.
2 Troubleshooting Procedures Procedure 3 2.3 Power Supply Troubleshooting Connection Check The wiring diagram related to the power supply is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Make sure the AC adapter and the AC power cord are firmly plugged into the DC IN jack and wall outlet. If these cables are connected firmly, go to Check 2. Check 2 Replace the AC adapter and the AC power cord with new ones.
2.3 Power Supply Troubleshooting Procedure 5 2 Troubleshooting Procedures Replacement Check The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4, Replacement Procedures. When AC adapter is connected: Check 1 AC adapter may be faulty. Replace the AC adapter with a new one. If the problem still occurs, perform Check 2.
2 Troubleshooting Procedures 2.4 2.4 System Board Troubleshooting System Board Troubleshooting This section describes how to determine if the system board is malfunctioning or not. Start with Procedure 1 and continue with the other procedures as instructed.
2.4 System Board Troubleshooting Procedure 1 2 Troubleshooting Procedures Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it. If an error message is shown on the display, perform Check 1. If there is no error message, go to Procedure 2. If MS-DOS or Windows OS is properly loaded, go to Procedure 4.
2 Troubleshooting Procedures Check 3 2.4 System Board Troubleshooting The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (23) or (24) is displayed, go to Procedure 4. If error message (18) is displayed, go to the Keyboard Troubleshooting Procedures. If error message (19), (20) or (21) is displayed, go to the HDD Troubleshooting Procedures.
2.4 System Board Troubleshooting Procedure 2 2 Troubleshooting Procedures Debugging Port Check (Boot Mode) Check the D port status by a serial port test. The tool for serial port test is shown below. Figure 2-2 Debug port (Boot mode) error status The test procedures are follows: 1. Connect the debug port test cable to the connector CN3490 of the system board. For disassembling to connect the test cable, refer to Chapter 4. 2. Connect the debug port test cable and RS-232C cross-cable to the test board.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting 6. When the D port status is FFFFh (normal status), go to Procedure 4. 7. When the D port status falls into any status in Table 2-4, execute Check 1.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Debug port error status (1/3) System BIOS SUSPEND processing Debug BIOS processing Code Suspend processing start F139 Preparation before suspend F13A processing CPU setup F13B It branches to Resume (F13C)/Boot (F141).
2 Troubleshooting Procedures 2.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-6 Debug port error status (3/8) Debug Code F131 BIOS processing Target Device IC No.
2 Troubleshooting Procedures Procedure 3 2.4 System Board Troubleshooting Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests. 1. System test 2. Memory test 3. Keyboard test 4. Display test 5. Floppy Disk test 6. Printer test [It is not supported] 7. Async test [It is not supported] 8. Hard Disk test 9. Real Timer test 10.
2.5 USB FDD Troubleshooting 2 Troubleshooting Procedures 3333 2.5 USB FDD Troubleshooting This section describes how to determine if the USB FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures Procedure 2 2.5 USB FDD Troubleshooting Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled. Floppy disk drive test error codes and their status names are listed in Table 2-7.
2.5 USB FDD Troubleshooting Procedure 3 2 Troubleshooting Procedures Connector Check The connection of USB port is shown in the following figure. Check 1 Check the connection of the USB FDD. If the USB FDD is still not functioning properly, perform Check 2. Check 2 As the connection may be defective, disassemble the computer and check each connection. If the problem still occurs, go to Procedure 4.
2 Troubleshooting Procedures Procedure 4 2.5 USB FDD Troubleshooting Replacement Check The USB FDD or USB FDD cable may be defective or damaged. Replace it with a new one. If the USB FDD is still not functioning properly, perform the following. If USB port 0 does not work properly, perform check 1. If USB port 5 does not work properly, perform check 3. If eSATA/USB port does not work properly, perform check 3. Check 1 SIM/Mini PCI Express board may be faulty.
2.6 HDD/SSD Troubleshooting 2.6 2 Troubleshooting Procedures HDD/SSD Troubleshooting To check if the HDD/SSD is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Partition Check Procedure 2: Message Check Procedure 3: Format Check Procedure 4: Diagnostic Test Program Execution Check Procedure 5: Connector Check and Replacement Check CAUTION: The contents of the hard disk will be erased when the HDD troubleshooting procedures are executed.
2 Troubleshooting Procedures Procedure 2 2.6 HDD/SSD Troubleshooting Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen. Make sure no floppy disk is in the FDD. Turn on the computer and check the message on the screen. When an OS starts from the 2.5” HDD, go to Procedure 3. Otherwise, start with Check 1 below and perform the other checks as instructed.
2.6 HDD/SSD Troubleshooting Procedure 3 2 Troubleshooting Procedures Format Check The computer’s HDD is formatted using the DOS FORMAT program or the physical format program of the test program. To format the HDD, start with Check 1 below and perform the other steps as required. Refer to the DOS Manual for the operation of DOS. For the format by the test program, refer to the Chapter 3. Check 1 Format the 2.5” HDD using DOS FORMAT command. Type as FORMAT C: /S/U. If the 2.
2 Troubleshooting Procedures Procedure 4 2.6 HDD/SSD Troubleshooting Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program. If an error is detected during the HDD test, an error code and status will be displayed. The error codes and statuses are described in Table 2-8.
2.6 HDD/SSD Troubleshooting Procedure 5 2 Troubleshooting Procedures Connector Check and Replacement Check The SATA HDD/SSD may be disconnected, or the 2.5 SATA HDD/SSD, SATA HDD FPC or system board may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: Check 1 Make sure the SATA HDD/SSD is firmly connected to CN1900 on the system board. If any of the connections are loose, reconnect firmly and repeat Procedure 1.
2 Troubleshooting Procedures 2.7 2.7 Keyboard Troubleshooting Keyboard Troubleshooting To check if the computer’s keyboard is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test (DIAGNOSTIC TEST) and Pressed key display test (ONLY ONE TEST) in the Diagnostic Program.
2.7 Keyboard Troubleshooting Procedure 2 2 Troubleshooting Procedures Connector Check and Replacement Check The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure keyboard cable is firmly connected to system board. If the connection is loose, reconnect firmly and repeat Procedure 1. If the problem still occurs, go to Check 2.
2 Troubleshooting Procedures 2.8 2.8 Touch pad Troubleshooting Touch pad Troubleshooting To check if the computer’s touch pad is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Touch pad test (ONLY ONE TEST) in the Diagnostic Program.
2.8 Touch pad Troubleshooting Procedure 2 2 Troubleshooting Procedures Connector Check and Replacement Check The connection of the cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the cables are firmly connected to the Finger/pad button board and system board. If the connection is loose, reconnect firmly and repeat Procedure 1.
2 Troubleshooting Procedures 2.9 2.9 Membrane switch Troubleshooting Membrane switch Troubleshooting To check if the computer’s Membrane switch is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the button Test (DIAGNOSTIC TEST) and Pressed key display test (ONLY ONE TEST) in the Diagnostic Program.
2.9 Membrane switch Troubleshooting Procedure 2 2 Troubleshooting Procedures Connector Check and Replacement Check The connection of cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure Membrane switch or cable is firmly connected to system board. If the connection is loose, reconnect firmly and repeat Procedure 1.
2 Troubleshooting Procedures 2.10 Display Troubleshooting 2.10 Display Troubleshooting This section describes how to determine if the computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Cable Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check The Display Test program is stored on the computer’s Diagnostics disk.
2.10 Display Troubleshooting Procedure 3 2 Troubleshooting Procedures Replacement Check The LCD module and system board are connected to display circuits. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures. Check 1 Replace the LCD cable with a new one following the instructions in Chapter 4, Replacement Procedures and test the display again. If the problem still exists, perform Check 2.
2 Troubleshooting Procedures 2.11 Optical Drive Troubleshooting 2.11 Optical Drive Troubleshooting This section describes how to determine if the optical drive (Super Multi drive) is functioning properly. Perform the steps below starting with Procedure 1 and continue with the other procedures as required.
2.11 Optical Drive Troubleshooting 2 Troubleshooting Procedures Procedure 2 Connector Check and Replacement Check The optical drive (DVD Super Multi drive) is connected to the system board. The connectors may be disconnected from the system board or may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: Check 1 The connection of Optical drive system is shown in the following figure.
2 Troubleshooting Procedures 2.12 LAN Troubleshooting 2.12 LAN Troubleshooting To check if the computer’s LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute LAN test in the LAN/Modem/Bluettoth/IEEE1394 test program.
2.13 Wireless LAN Troubleshooting 2 Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting To check if the computer’s Wireless LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting-Receiving Check Procedure 2: Antennas’ Connection Check Procedure 3: Replacement Check Procedure 1 Transmitting-Receiving Check Before starting the test, make sure the wireless communication switch is set in the ON position.
2 Troubleshooting Procedures Procedure 2 2.13 Wireless LAN Troubleshooting Antennas' Connection Check The wireless LAN function-wiring diagram is shown below: Any of the connections may be defective. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless communication switch is “On”. If the switch is “Off”, turn it “On”. If the problem still occurs, perform Check 2.
2.13 Wireless LAN Troubleshooting Procedure 3 2 Troubleshooting Procedures Replacement Check Wireless LAN card, wireless LAN antenna or system board may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 Wireless LAN antenna may be faulty. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 2.
2 Troubleshooting Procedures 2.14 Bluetooth Troubleshooting 2.14 Bluetooth Troubleshooting This section describes how to determine if the computer’s Bluetooth is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.14 Bluetooth Troubleshooting Procedure 2 2 Troubleshooting Procedures Connection Check The Bluetooth function wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the Bluetooth module is firmly connected to CN4400 on the system board. If the Bluetooth module FPC is disconnected, connect it firmly.
2 Troubleshooting Procedures Procedure 3 2.14 Bluetooth Troubleshooting Replacement Check The Bluetooth antenna, Bluetooth module, sound board and system board are connected to the circuits. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 The Bluetooth module may be defective or damaged.
2.15 Sound Troubleshooting 2 Troubleshooting Procedue 2.15 Sound Troubleshooting This section describes how to determine if the computer’s sound functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connecor Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check Execute the Sound test in Sound Test program disk.
2 Troubleshooting Procedures 2.15 Sound Troubleshooting As the connection may be defective, disassemble the computer and check each connection. If the problem still occurs, go to Procedure 3. Procedure 3 Replacement Check If headphone does not work properly, perform check 1. If external microphone does not work properly, perform check 2. If speaker does not work properly, perform check 3. If internal microphone does not work properly, perform check 4. Check 1 Headphone may be faulty.
2.16 3G Troubleshooting 2 Troubleshooting Procedue 2.16 3G Troubleshooting This section describes how to determine if the computer’s 3G is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Transmitting-Receiving Check Procedure 2: Antenna Connection Check Procedure 3: Replacement Check Procedure 1 Transmitting-Receiving Check Make sure the wireless switch on the left side of the computer is turned “On”.
2 Troubleshooting Procedures 2.16 3G Troubleshooting Procedure 2 Antenna Connection Check The 3G wiring diagram is shown below: Any of the connections may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the 3G antenna cables are firmly connected to the 3G card. If the 3G antenna cables are disconnected, connect them firmly and go to Procedure 1.
2.16 3G Troubleshooting 2 Troubleshooting Procedue Procedure 3 Replacement Check The 3G antenna, 3G card, SIM card, SIM/Mini PCI Express board and the system board are connected to the circuits. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures, for instructions how to disassemble the computer and then perform the following checks: Check 1 The 3G card, SIM card may be defective or damaged. Replace it with a new one following the steps in Chapter 4, Replacement Procedures.
2 Troubleshooting Procedures 2.17 SD card Slot Troubleshooting 2.17 SD card Slot Troubleshooting This section describes how to determine if the computer's Bridge media functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Check on Windows OS Procedure 2: Connector Check and Replacement Check Procedure 1 Check on Windows OS Insert a SD card into the slot.
2.18 Fingerprint sensor Troubleshooting 2 Troubleshooting Procedue 2.18 Fingerprint sensor Troubleshooting CAUTION: To delete the account for confirming the fingerprint operation, it is necessary to log on by the account with the management authority. If the password has been set to log on, ask the Log-ON password to the user. To check if the Fingerprint sensor works correctly or not, follow the troubleshooting procedures below as instructed. When failed in Procedure 1 to Procedure 3, execute Procedure 4.
2 Troubleshooting Procedures Procedure 1 2.18 Fingerprint sensor Troubleshooting Setting Windows Log-ON password 1. Open [User Account] from [Control Panel]. 2. Click [User Account]. 3. Click the icon of the account (user’s name) that you want to set the password. 4. Click “Create Account”. 5. Type a password in “Type a new password”. 6. Press Tab key. 7. Type the password again. 8. Click “Create Password” button. 9.
2.18 Fingerprint sensor Troubleshooting 2 Troubleshooting Procedue 7. When the Store to Sensor screen is displayed, check Store fingerprint to Sensor. Click Finish to complete fingerprint registration. Procedure 3 Authentication of fingerprint 1. Turn on the computer to start up Windows. 2. In the Windows logon window, put lightly the first joint of your finger registered and slide your finger sideways. When authenticated, [Success] is displayed in the fingerprint authentication display.
2 Troubleshooting Procedures Procedure 4 2.18 Fingerprint sensor Troubleshooting Connector Check and Replacement Check The connection of the cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the cables are firmly connected to the Finger/pad board and system board. If the connection is loose, reconnect firmly and repeat Procedure 1.
2.19 Web camera Troubleshooting 2 Troubleshooting Procedue 2.19 Web camera Troubleshooting To check if the computer’s web camera is malfunctioning or not, follow the troubleshooting procedures below as instructed.
2 Troubleshooting Procedures 2.19 Web camera Troubleshooting Check 2 The Web camera may be defective or damaged. Replace the drive with a new one. If there is still an error, go to Check 3. Check 3 System board may be faulty. Replace it with a new one following the step in Chapter 4 Replacement Procedures.
2.20 Intel Turbo Memory Troubleshooting U(Not Used)U 2 Troubleshooting Procedue 2.20 Intel Turbo Memory Troubleshooting (Not Used) To check if Intel Turbo Memory is malfunctioning or not, follow the troubleshooting procedures below as instructed.
2 Troubleshooting Procedures 2.20 Intel Turbo Memory Troubleshooting U(Not Used)U If any problems are found, perform the Procedure 2. Procedure 2 Connector Check and Replacement Check The connection of Intel Turbo Memory card may be faulty or the card may be defective. Disassemble the computer following the steps described in Chapter 4 and perform the following checks. Check 1 Check the following connection. To disassemble the computer for the check, follow the steps described in Chapter 4.
Chapter 3 Tests and Diagnostics [CONFIDENTIAL]
Tests and Diagnostics 3 3-ii [CONFIDENTIAL] TECRA R10 Maintenance Manual (960-708)
Tests and Diagnostics Chapter 3 3.1 3.2 Contents The Diagnostic Test ................................................................................................... 3-1 3.1.1 Diagnostics menu ................................................................................. 3-1 3.1.2 H/W (Hardware) initial information setting tool.................................. 3-2 3.1.3 Heatrun test program............................................................................
Tests and Diagnostics 3.20 3.21 3.22 3.23 3.24 3.25 ONLY ONE TEST................................................................................................... 3-40 3.21.1 Program Description .......................................................................... 3-40 3.21.2 Operations .......................................................................................... 3-40 Head Cleaning.................................................................................................
Tests and Diagnostics Tables Table 3-1 Subtest names .................................................................................................... 3-12 Table 3-2 Error codes and error status names .................................................................... 3-35 Table 3-3 Hard disk controller status register contents...................................................... 3-38 Table 3-4 HDC Error register contents ..............................................................................
Tests and Diagnostics 3-vi [CONFIDENTIAL] TECRA R10 Maintenance Manual (960-708)
3.1 The Diagnostic Test 3 Tests and Diagnostics 3 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
3 Tests and Diagnostics REAL TIMER TEST NDP TEST EXPANSION TEST CD-ROM/DVD-ROM TEST ERROR RETRY COUNT SET 3.1 The Diagnostic Test [FDD & HDD] Other tests are: Wireless LAN TEST (Wireless LAN TEST disk) LAN/Modem/Bluetooth/IEEE1394 TEST (LAN/Modem/Bluetooth/IEEE1394 TEST disk) Sound TEST (Sound TEST disk) You will need the following equipment to perform some of the Diagnostic test programs.
3.1 The Diagnostic Test 3 Tests and Diagnostics The Diagnostics Disk (Main T&D) 3.1.3 Heatrun test program The heatrun test starts automatically after the selection. You will need the following equipment to perform this program.
3 Tests and Diagnostics 3.2 3.2 Executing the Diagnostic Test Executing the Diagnostic Test To start the Repair test program, follow these steps: 1. Insert the Repair test program disk in the USB floppy disk drive or Optical disk drive. 2. Turn on the computer while pressing U key. The following menu appears. NOTE: The following menu is an example when Repair test program is performed from the floppy disk. Repair test program V*.** 1. DMI Entry utirity 2. Repair Heatrun (T&D) 3.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 3.2.1 Diagnostics menu (T&D) Set the highlight bar to 3, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Set the highlight bar to 1, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Select the option you want to execute and press Enter. When you select 1SYSTEM TEST, the following message will appear: SYSTEM TEST NAME SUB-TEST PASS COUNT WRITE DATA ADDRESS : : : : XXXXXX XX XXXXX XX XXXXXX xxxxxxx DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Use the up and down arrow keys to move the cursor to “ERROR STOP”. Use the right and left arrow keys to move the cursor to the desired option and press Enter.
3.3 Setting of the hardware configuration 3.3 3 Tests and Diagnostics Setting of the hardware configuration To execute this program, input 1 in the startup menu. Then press Enter to select the (2)Initial config set. The H/W initial information setting tool consists of four subtests. Input the number you want to execute and press Enter. NOTE: Connect USB FDD, when you perform the Repair test program from the CDROM. DMI information on the subtest 02 is written in floppy disk.
3 Tests and Diagnostics 3.3 Setting of the hardware configuration 7. “Create DMIINFO TXT (Y/N)?” is displayed. Press Y, then the DMI information (text data) is written to the Floppy disk, etc. Setting of the HWSC Setting of the UUID Display of the DMI information (including UUID) After completion of the above settings, H/W configuration & DMI information are appeared in order. Check the contents and press Enter.
3.4 Heatrun Test 3.4 3 Tests and Diagnostics Heatrun Test To execute this program, press 2, Repair Heatrun and press Enter in the startup menu, press Enter. After selecting this test, the same subtests as 3.23 RUNNING TEST is executed successively. For more details on the procedure and test content, refer to RUNNING TEST. When the heatrun test ends, following message appears in the display.
3 Tests and Diagnostics 3.5 3.5 Subtest Names Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No. 3-12 Test Name Subtest No.
3.5 Subtest Names 3 Tests and Diagnostics Table 3-1 Subtest names (2/2) No. Test Name Subtest No.
3 Tests and Diagnostics 3.6 3.6 System Test System Test To execute the System Test select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM checksum This subtest executes a checksum test of the BIOS ROM (range: F0000h to FFFFFh, 64KB) on the System Board. Subtest 02 Fan ON/OFF This subtest turns on/off the fan motor by force with Fan ON/OFF commands.
3.6 System Test 3 Tests and Diagnostics If the CPU supports Gerserville (SpeedStep), this Subtest checks that the CPU operating clock speed can be changed. If the CPU does not support Gerserville (SpeedStep), the following message is displayed and the test is ended. This chip is not supported Subtest 04 Quick Charge This subtest checks the status for the quick charge. Subtest 05 DMI read This subtest displays the information in the Flash-ROM in the following format. *** DMI Data Display Ver X.
3 Tests and Diagnostics 3.7 3.7 Memory Test Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Conventional memory This subtest writes a constant data to conventional memory (0 to 640 KB), then reads the new data and compares the result with the original data. Subtest 02 Protected Mode NOTE: The CONFIG.
3.8 Keyboard Test 3.8 3 Tests and Diagnostics Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed key code display When a key is pressed, the scan code, character code, and key top name are displayed on the screen in the format shown below.
3 Tests and Diagnostics 3.9 3.9 Display Test Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM read/write for VGA This subtest writes the constant data (AAAAh and 5555h) to the video RAM. The data is read and compared to the original data.
3.9 Display Test Subtest 04 3 Tests and Diagnostics Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode [Mode 12] 13] 3] 111 112 114 115 117 118 640*480 640*480 800*600 800*600 1024*768 1024*768 64K] 16M] 64K] 16M] 64K] 16M] The display below appears on the screen when this subtest is executed.
3 Tests and Diagnostics Subtest 06 3.9 Display Test “H” Pattern Display This subtest displays a full screen of “H” patterns.
3.10 Floppy Disk Test 3 Tests and Diagnostics 3.10 Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. The contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. 1. The following message will appear. Select the media mode and start track to be tested, then press Enter.
3 Tests and Diagnostics 3.10 Floppy Disk Test Select the number of the subtest you want to execute and press Enter. The following message will appear during the floppy disk test. FLOPPY DISK SUB-TEST PASS COUNT WRITE DATA ADDRESS IN PROGRESS : : : : XX XXXXX XX XXXXXX XXXXXXX xxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] : test end [Ctrl]+[C] : key stop ERROR COUNT READ DATA STATUS : XXXXX : XX : XXX When the subtest 04 or 05 is selected, the following messages will appear on the screen.
3.11 Printer Test 3 Tests and Diagnostics 3.11 Printer Test CAUTION: Printer Test is not supported for this model. To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. NOTE: An IBM compatible printer must be connected to the system to execute this test. Also, printer port wraparound connector must be connected.
3 Tests and Diagnostics Subtest 02 3.11 Printer Test Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wraparound NOTE: To execute this subtest, a printer wraparound connector must be connected to the computer’s printer port.
3.12 Async Test 3 Tests and Diagnostics 3.12 Async Test CAUTION: Printer Test is not supported for this model. To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
3 Tests and Diagnostics 3.13 Hard Disk Test 3.13 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. CAUTION: The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 08 or 09 is executed. Before running the test, the customer should transfer the contents of the hard disk to floppy disk or another hard disk. If the customer has not or cannot perform the back-up, create back-up disks as described below.
3.13 Hard Disk Test 3 Tests and Diagnostics 4. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest. HARD DISK TEST XXXXXXX SUB TEST PASS COUNT WRITE DATA ADDRESS : : : : XX XXXXX XX XXXXXX XXX DIAGNOSTIC TEST VX.
3 Tests and Diagnostics Subtest 04 3.13 Hard Disk Test Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder.
3.14 Real Timer Test 3 Tests and Diagnostics 3.14 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real time A new date and time can be input during this subtest. To execute the real time subtest, follow these steps: 1.
3 Tests and Diagnostics Subtest 03 3.14 Real Timer Test Real time carry CAUTION: When this subtest is executed, the current date and time are erased.
3.15 NDP Test 3 Tests and Diagnostics 3.15 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. CAUTION: Judge the existence of high-speed operation processor by 1bit of the composition byte. If exists, the bit is “1”. Test only when the high-speed operation processor exists.
3 Tests and Diagnostics 3.16 Expansion Test 3.16 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wraparound [It is not supported] CAUTION: PCMCIA wraparound test is not supported for this model. NOTE: To execute this subtest, the PC card wraparound connector is required.
3.16 Expansion Test Subtest 02 3 Tests and Diagnostics RGB monitor ID NOTE: To execute this subtest, monitor supporting EDID (Extended Display Identification Data) is required. Connect a wraparound connector to CRT monitor for the test of ID acquisition. This subtest is executed by using VESA command. CAUTION: It becomes NG because the priority is given to the internal monitor in a simultaneous display mode.
3 Tests and Diagnostics 3.17 CD-ROM/DVD-ROM Test 3.17 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM test, select 12 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1. Subtest 01 Sequential read This subtest is a sequential reading of one-block units (2K bytes) of all the logical addresses.
3.18 Error Code and Error Status Names 3 Tests and Diagnostics 3.18 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test.
3 Tests and Diagnostics 3.
3.
3 Tests and Diagnostics 3.19 Hard Disk Test Detail Status 3.19 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eight-digit number. The first four digits represent the hard disk controller (HDC) error status number and the last four digits are not used.
3.19 Hard Disk Test Detail Status 3 Tests and Diagnostics Tables 3-4 HDC Error register contents Bit Name Description 7 BBK (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error. “1” … Uncorrectable data error has been detected. 5 —— Not used 4 IDN (Identification) “0” … Not used “1” … There is no ID field in the requested sector.
3 Tests and Diagnostics 3.20 3.20 ONLY ONE TEST ONLY ONE TEST 3.20.1 Program Description This program tests the unique functions of this model. 3.20.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter. The following menu appears in the display. ################################################################ ######## ONLY ONE TEST Menu ######## ################################################################ * * * * 1 ............ Pressed Key Display * 2 ............ Touch pad * * 3 ....
3.20 ONLY ONE TEST Subtest 01 3 Tests and Diagnostics Pressed Key Display When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed. Holding a key down enables the auto-repeat function that causes the key’s display character to blink. Press Del + Enter to end the test.
3 Tests and Diagnostics Subtest 02 3.20 ONLY ONE TEST Touch Pad This subtest checks the functions of the touch pad as shown below. A) Direction and parameter B) Switching function check. This test displays the response from the touch pad and touch pad switch. When moving your finger on the touch pad towards the upper left, the display changes according to the following illustration. If a touch pad switch is pressed, the displays appear on the right side one by one.
3.20 ONLY ONE TEST Subtest 03 3 Tests and Diagnostics Wireless communication Switch This subtest checks if the Wireless communication switch works properly. If the test is started with the switch ON, following message appears in the display. Wireless communication Switch position (OFF) is set to a start Slide the switch to OFF position. Then, following message appears in the display. Wireless communication Switch ON !! Slide the switch to ON position. Then, following message appears in the display.
3 Tests and Diagnostics 3.20 ONLY ONE TEST Press 9 and Enter to return to ONLY ONE TEST menu. Subtest 05 LED This subtest checks if each LED lights properly. The following message appears in the display in order. Follow the instructions in the display to execute the test. [HDD Access LED test] Confirm the LED of HDD status blinks properly. Press any key and following message appears in the display. [Caps/Num/Overlay BT/W-LAN LED test] Confirm each LED lights properly. (1) Press [Caps Lock ] key ! ...
3.20 ONLY ONE TEST Subtest 06 3 Tests and Diagnostics Button This subtest checks the moving of the of the front operation panel button. Press the Toshiba Assist button and Back light On/Off button after the following message appears. Step 1 X 1 2 * * *. Press Function button (Toshiba Assist button) OK message appears in the display if the test ends without an error. Press any key return to each Steps if NG! or Press any key message apprears.
3 Tests and Diagnostics 3.20 ONLY ONE TEST The following message appears in the display. * < ------ Volume Down * -------- > Volume Up! Step5 Volume dial is turned to the right. OK message appears in the display if the test ends without an error. Press any key return to each Steps if NG! or Press any key message apprears * < ------ Volume Down * -------- > Volume Up! Step6 Volume dial is turned to the left. OK message appears in the display if the test ends without an error.
3.20 ONLY ONE TEST Subtest 7 3 Tests and Diagnostics Acceleration sensor This subtest detects and corrects the each axis (X, Y, Z). NOTE: Make sure that this subtest is executed on the following condition: 1. Flat desk with vertical plane to get the stability of machine. 2. The vertical wall or plane is necessary. 3. Prevent the machine from shake or shock.
3 Tests and Diagnostics 3.20 ONLY ONE TEST When this subtest is selected, the following message appears in the display. The heaven surface establishes in the upper direction Press [Enter] key NOTE: Be sure to execute the test with the display panel opened. Set the machine on the flat desk. Then press Enter to detect the data on this setting of machine. The following message appears in the display.
3.20 ONLY ONE TEST 3 Tests and Diagnostics Rev B Subtest 8 Docker Dock/Undock This subtest is executed with an Slim Port Replicator II. installed. Press Enter while pushing the eject button of the Slim Port Replicator II. the following message appears. Pushing Eject-SW, and press [Enter] Key Press Enter without pushing the eject button of the Slim Port Replicator II. after the following message appears.
3 Tests and Diagnostics Subtest A 3.20 ONLY ONE TEST E2PROM (Internal MAC) It checks whether the MAC address.. Subtest B Intel AMT It checks whether the Intel AMT corde versions information are written. Intel Kedron is required for an Intel AMT check. BIOS should be Intel AMT correspondence. Subtest C Intel Shirley Peak (MAC) The functional check of Shirley Peak and a MAC Address check are carried out. Subtest D SD Card (R5C833 Writh/Read) The functional check of SD Card.
3.21 Head Cleaning 3.21 3 Tests and Diagnostics Head Cleaning 3.21.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.21.2 Operations 1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS - FLOPPY DISK HEAD CLEANING : VX.XX Mount cleaning disk(s) on drive(s). Press any key when ready. 2.
3 Tests and Diagnostics 3.22 3.22 Log Utilities Log Utilities 3.22.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or output the data to a printer. NOTE: Connect USB FDD, when you perform the DIAGNOSTIC PROGRAM from the DVD-ROM. The data is stored in floppy disk. The error information is displayed in the following order: 1. Error count (CNT) 2.
3 Tests and Diagnostics 3.22 Log Utilities 3.22.2 Operations 1. Select 5 and press Enter in the DIAGNOSTIC MENU, logs error information into RAM or onto a floppy disk.
3.23 Running Test 3.23 3 Tests and Diagnostics Running Test 3.23.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02) 3. Display test (subtest 01) 4. Real timer test (subtest 02) 5. HDD test (subtest 01) 6. FDD test (subtest 02) The system automatically detects the number of floppy disk drives connected to the computer for the FDD test. 3.23.2 Operations 1.
3 Tests and Diagnostics 3.24 3.24 Floppy Disk Drive Utilities Floppy Disk Drive Utilities 3.24.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE: This program is only for testing a floppy disk drive. The option is different from the Toshiba MS-DOS FORMAT command.
3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3.24.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 2 3 4 9 – - FORMAT COPY DUMP HDD-ID READ EXIT TO DIAGNOSTICS MENU 2. FORMAT program (a) Selecting FORMAT displays the following message: DIAGNOSTICS - FLOPPY DISK FORMAT : VX.
3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below: Insert source disk into drive A: Press any key when ready. (c) Remove the Diagnostics Disk from the FDD, insert the source disk and press any key. The following message will appear, indicating the program has started.
3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If 2:HDD is selected, the display will go to step (h). If 1:FDD is selected, the following message will appear: Select drive number (1:A, 2:B) ? (c) Select a drive number and the following message will be displayed.
3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? 5. HDD ID READ program Selecting HDD ID displays the following HDD ID configuration: [HDD ID Read (VX.XX)] [Drive #1] Model No.
3 Tests and Diagnostics 3.25 System Configuration 3.25 System Configuration 3.25.1 Function Description The System Configuration program contains the following configuration information for the computer: 1. Processor Type [Code/L2 cache] 2. Chip set [VRAM] 3. BIOS ROM version [1st ID, 2nd ID] 4. Boot ROM version 5. EC/KBC version 6. PS Microprocessor version 7. SVP parameter version [Panel/Manufacture code/Product code] 8. Micro code revision [Processor number] 9.
3.25 System Configuration 3.25.2 3 Tests and Diagnostics Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display. System Configuration Display: Ver X.XX [Machine Name???] * * * * * * * * * * * * * * * * * * * - Processor Type = XXXXXX-XXXXXMHz Code = XX L2 Cache = XXXXXKB Chip set = XXXXXX VGA Chip = XXXXXX BIOS ROM Version = VX.XX 1st ID = XXH, 2nd ID = XXH BOOT ROM Version = VX.XX = VX.XX EC/KBC Version PS Micon Version = VX.
3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Atheros): UNot UsedU 3.26 Wireless LAN Test Program (Atheros): Not Used Since there is no test program for Atheros-made wireless LAN cards, check the wireless LAN card type of the computer and the antenna connection by using Windows programs. Check of the wireless LAN card type 1. Slide the wireless communication switch to “ON” position. 2.
3.26 Wireless LAN Test Program (Atheros): UNot UsedU 3 Tests and Diagnostics Check of the antenna connection 1. Confirm that the icon for wireless LAN appears at the lower right of the screen under the circumstances the wireless LAN communication is available. (It is no problem if a cross is shown on the icon.) 2. Double-click the icon. If the computer finds any AP (Access Point), the antenna marks like as follows will appear. It shows the antenna cables are surely connected to the wireless LAN card. 3.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g/n Setting up of REF PC) 3.27 Wireless LAN Test Program (Intel-made a/b/g/n Setting up of REF PC) For the test of Intel-made wireless LAN cards, configure the test environment as shown below with the following equipment. ・ AP （which can operate on Windows XP and is corresponding to access point 11a, 11b and 11g） NOTE: Set the SSID of AP as follows. (Note that upper case and lower case characters are recognized as different characters.
3.27 Wireless LAN Test Program (Intel-made a/b/g/n Setting up of REF PC) 3 Tests and Diagnostics Open “My Computer” window and click “My Network places” on the left column. • Click “View network connections” on the left column. • The “Network Connections” window appears. Double-click “Local Area Connection”.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g/n Setting up of REF PC) • Click “Install…” button on the “Local Area Connection Properties” window. Local Area Connection Properties window • Select “Protocol” on the “Select Network Component Type” window and click “Add…” button. Select Network Component Type window • Click “Have Disk…” button on the “Select Network Protocol” window.
3.27 Wireless LAN Test Program (Intel-made a/b/g/n Setting up of REF PC) 3 Tests and Diagnostics • When “Install From Disk” window appears, click “Browse…” and specify the created “Clx_Res” folder. Then Click “OK”. (For the test, “PACKET.INF” file is used.) Install From Disk window • The “Select Network Protocol” window appears again. In the “Network Protocol”, “DDK PACKET Protocol” will appear. Then click “OK” to start the installation.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g/n Setting up of REF PC) After the completion of REF PC setup, restart the WINDOWS. Then perform the Responder test program for Windows (WTWINSVR.EXE) in the Clx_Res folder. ・WTWINSVR.EXE Function : Transmitting/receiving of data to/from DUT via AP OS available : Windows XP only How to start : Double-click WTWINSVR icon. How to start 1. Double-click wtwinsvr icon. The following screen will appear. Startup screen of wtwinsvr program 2.
3.28 Wireless LAN Test Program on DUT PC (Intel-made) 3 Tests and Diagnostics 3.28 Wireless LAN Test Program on DUT PC (Intel-made) 3.28.1 Wireless LAN Test Program (Intel-made : Shirley Peak) on DUT PC This section describes how to perform the wireless LAN transmitting-receiving test (Intelmade 802.11 a/b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test. Insert the Diagnostics disk for wireless LAN test into the Floppy Disk Drive. Turn on the power while pressing U.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program on DUT PC (Intel-made) To execute the subtest, input the subtest number and press Enter. Subtest01 Communication test of 11a mode for 5100/5150 module (Two antenna type) This subtest execute transmitting/receiving test in 802.11a mode using the main antenna. If a defective is not found during the test, OK message will appear in the display. Press any key and return to the test menu.
3.28 Wireless LAN Test Program on DUT PC (Intel-made) Subtest03 3 Tests and Diagnostics Communication test of 11g mode for 5100/5150 module (Two antenna type) This subtest execute transmitting/receiving test in 802.11g mode using the main antenna. If a defective is not found during the test, OK message will appear in the display. Press any key and return to the test menu. If a defective is found during the test, NG message will appear in the display.
3 Tests and Diagnostics Subtest06 3.28 Wireless LAN Test Program on DUT PC (Intel-made) Communication test of 11b mode for 5100/5150 module (Three antenna type) This subtest execute transmitting/receiving test in 802.11b mode using the main antenna. If a defective is not found during the test, OK message will appear in the display. Press any key and return to the test menu. If a defective is found during the test, NG message will appear in the display.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the test program. Insert the test program disk for LAN/Modem/Bluetooth/IEEE1394 test in FDD and turn on the power. The following message will appear: Microsoft Windows XX Startup Menu ---------------------------------1. LAN 2. Modem 3. Bluetooth 4.
3 Tests and Diagnostics Subtest01 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program (i82562 + ICHx) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest02 3 Tests and Diagnostics (GbE) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. Select 2 to execute and press Enter. The following message will appear: Testing adaptor...hit to abort. * External Loopback Test...PASSED Testing completed.
3 Tests and Diagnostics 3.29.2 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program Modem test (Not Used) For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Denki Seisakusyo)” for the tests. ################################################################## ###### AC97' Modem Controller Diagnostics program ####### ################################################################## * * * * 1 ............
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.3 3 Tests and Diagnostics Bluetooth test Preparation ・ For the test of Bluetooth function, use the Windows program installed on the target computer (computer to be tested). A responder device (device for transmitting/receiving data) is also needed. (A mobile phone with the Bluetooth function is also available.) ・ A Bluetooth card should be installed on the target computer.
3 Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 5. Select “Diagnostics” tab and click “Run”. 6. Check the “Log” to confirm the test result. BT address of test computer BT address of responder device 7. When the BT (Bluetooth) address of the responder device appears, the Bluetooth card and antenna connection are OK.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.29.4 3 Tests and Diagnostics IEEE1394 test To execute this test, input 4 and press Enter. NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test. The following menu will appear: ******************************************************************** ******** IEEE1394[XXXXX] Diagnostics program ************** ******************************************************************** * * * 1 ....
3 Tests and Diagnostics 3.30 Sound Test program 3.30 Sound Test program Sound TEST disk cannot be used in TECRA R10. Therefore, please test the sound on Windows OS. 1) Play a music file. 2) click TOSHIBA-> utility -> "PC diagnostic tool." to test the sound Please check operation of speakers by one of methods. 3.31 3G Test program Therefore, please test the sound on Windows OS. All the programs included in EU870 test CD are install. A procedure should look at ToshibaTestTools_ReleaseNotes.txt.
3.32 SETUP 3 Tests and Diagnostics 3.32 SETUP 3.32.1 Function Description This program displays the current system setup information as listed below: 1. Memory 2. System Date/Time 4. Password (a) User Password (b) Supervisor Password 3. HDD Password (a) (b) (c) (d) HDD HDD Password Mode User Password Master Password 5. Boot Priority (a) Boot Priority (b) HDD Priority 6.
3 Tests and Diagnostics 3.32 SETUP 9. Drives I/O (a) Built-in HDD (b) ODD (c) eSATA (d) SATA Controller Mode 10. PCI Bus 11. Display (a) LCD Display Stretch 12. Peripheral (a) Internal Pointing Device (b) Web Camera 13. Legacy Emulation (a) USB KB/Mouse Legacy Emulation (b) USB-FDD Legacy Emulation (c) USB Memory BIOS Support Type 14. PCI LAN (a) Built-in LAN 15. Security Controller (a) TPM (b) Hide TPM (c) Clear TPM Owner 16.
3.32 SETUP 3 Tests and Diagnostics 3.32.2 Accessing the SETUP Program While pressing ESC, turn on the power. Then press F1. The following display appears.
3 Tests and Diagnostics 3-84 [CONFIDENTIAL] 3.
3.32 SETUP 3 Tests and Diagnostics Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press ↑ and ↓ to move between items in a column. Press Fn+↑ (PgUp) and Fn + ↓ (PgDn) to move between the two pages. 2. Press either the Space bar or Back Space to change the value. Accepting Changes and Exiting the SETUP Window 1. Press End to accept the changes you made.
3 Tests and Diagnostics 3.32 SETUP SETUP Options The SETUP screen is divided into 14 functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s memory. This field displays the total amount of memory installed and is automatically calculated by the computer. You cannot change this value. 2. System Date/Time Sets the date and time. System Date Sets date. System Time Sets time. 3.
3.32 SETUP 3 Tests and Diagnostics (b) HDD Password Mode This item registers HDD password and can be selected only for registering HDD password. To change HDD Password Mode when HDD password is registered, delete the registered HDD password first, and then register new password. User Only Sets only User HDD Password (Default) Master+User Sets Master HDD Password and User HDD Password (c) User Password This item sets User password. For details on setting user password, refer to the User’s Manual.
3 Tests and Diagnostics 3.32 SETUP NOTE: CD-ROM refers to a DVD Super Multi drive. (b) HDD Priority Use this option to set the booting priority from HDD or USB (USB Memory stick). Built-in HDD→ USB (Default) USB →Built-in HDD 6. Others Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use. (a) Core-Multi Processing The Core Multi-Processing sets the CPU operating mode.
3.32 SETUP 3 Tests and Diagnostics (c) Execute-Disable Bit Capability This option set the Execute-Disable Bit function of CPU to the operation system. Execute-Disable Bit gives higher security function preventing the PC from the computer viruses and buffer overflow problem on unauthorized access. Available Enable the Execute-Disable Bit function. Not Available Disable the Execute-Disable Bit function.
3 Tests and Diagnostics 3.32 SETUP (f) Auto Power On Use this option to set a time and date for automatic power on and enable or disable the ring indicator feature. Alarm Date Option appears only when Alarm Time is enabled. OPTIONS Alarm Time = Disabled Wake-up on LAN on Battery Critical Battery Wake-up = Disabled = Disabled = Enabled Set the parameters for the Auto Power On (automatic power on) function and the Wake-up on LAN in the “OPTIONS” window. To set the time, use Space or BackSpace.
3.32 SETUP 3 Tests and Diagnostics Critical Battery Wake-up Configures what action is taken when the remaining battery power is close to running out while the system is in Sleep Mode. This setting is only available when the Critical battery action in Windows is set to Hibernate (Default). To access it, Start -> Control Panel -> System and Maintenance -> Power Options -> Edit Plan Settings -> Change advanced power settings -> Battery. The operation of this function is dependent upon battery status.
3 Tests and Diagnostics 3.32 SETUP 7. Configuration This option lets you set the device configuration. NOTE: 1. All Devices BIOS sets all devices. Setup by OS Initializes devices, which is needed to load an operating system. Operating system initializes other devices. (Default) When using installed OS, selecting “Setup by OS” is recommended. 2. When executing test programs, be sure to select “ALL Device”. And after the test end, select “Setup by OS”. 8.
3.32 SETUP 3 Tests and Diagnostics Processing Speed This feature changes the CPU processing speed. High Low CPU operates at high speed. (Default in Full Power Mode) CPU operates at low speed. (Default in Low Power Mode) CPU Sleep Mode Use this option to enable or disable the CPU sleep function. Enabled Enables sleep mode. (Default) Disabled Disables sleep mode. LCD Brightness Use this option to set the level of LCD brightness. Super-Bright Full brightness for maximum visibility.
3 Tests and Diagnostics 3.32 SETUP (b) PCI Express Link ASPM This option set the power-saving function of PCI Express on the following conditions. Auto PCI Express devices are not used while battery operation. (Default) Disabled Disable the Power-saving function and drive with maximum performance. Enabled PCI Express devices are not used. (c) Enhanced C-States *Core2 model only This option set the power-saving function of Enhanced C-States on the following conditions.
3.32 SETUP 3 Tests and Diagnostics (d) SATA Controller Mode This feature sets the SATA Controller Mode. AHCI Sets AHCI which is the mode for VistaTM (default) Compatibility Sets the mode for legacy OS. Use this mode when the driver corresponding to AHCI is not used. 10. PCI Bus This option displays the interrupt level for the Card Bus in the computer. It is for information only and cannot be changed. PCI BUS = IRQ10, IRQ11 11. Display This group of options configures the computer’s display.
3 Tests and Diagnostics 3.32 SETUP (b) Web Camera This option enables or disables the Web Camera Enabled Enables the Web Camera (Default) Disabled Disables the Web Camera 13. LEGACY EMULATION (a) USB KB/Mouse Legacy Emulation This option sets the Legacy support condition of the USB keyboard and the USB mouse. Enabled Enables LEGACY support. (Default) USB keyboard/USB mouse are available without the driver.
3.32 SETUP 3 Tests and Diagnostics 15. Security Controller (a) TPM Disables the security controller called TPM (Trusted Platform Module). When the cursor is on the Enable (Disable) and the Space is pressed, message is displayed and the PC waits Y or N key input by the user. When Y is pressed, it is sets to Enable (Disable). After changing, the cursor could not be moved on the TPM tem. This option can be changed after rebooting. Disabled Disables the TPM. (Default) Enabled Enables the TPM.
3 Tests and Diagnostics 3-98 [CONFIDENTIAL] 3.
Chapter 4 Replacement Procedures [CONFIDENTIAL]
4 Replacement Procedures 4-ii [CONFIDENTIAL] TECRA R10 Maintenance Manual (960-708)
4 Replacement Procedures Chapter 4 Contents 4.1 General....................................................................................................................... 4-1 4.2 Battery pack ............................................................................................................. 4-11 4.3 SIM card .................................................................................................................. 4-13 4.4 ExpressCard ..........................................
4 Replacement Procedures Figures Figure 4-1 Removing the battery pack .......................................................................... 4-11 Figure 4-2 Removing the SIM card ............................................................................... 4-13 Figure 4-3 Removing the ExpressCard.......................................................................... 4-14 Figure 4-4 Removing the SD/SDHC memory card .......................................................
4 Replacement Procedures Figure 4-30 Removing the DC FAN (1).......................................................................... 4-53 Figure 4-31 Removing the DC FAN (2).......................................................................... 4-54 Figure 4-32 Removing the DC FAN (3).......................................................................... 4-55 Figure 4-33 Applying new grease ...................................................................................
4 Replacement Procedures 4-vi [CONFIDENTIAL] TECRA R10 Maintenance Manual (960-708)
4.1 Overview 4 4 Replacement Procedures Replacement Procedures 4.1 Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed. The numbers in the chart indicate the relevant section numbers in this manual.
4 Replacement Procedures 4.1 Overview This chart shows which unit(s) you need to remove in advance when you replace one unit. Example: When you want to replace “4.13 HDD/SSD”, you need to remove all FRUs down to the “4.2 Battery pack” to “4.11 BASE ASSY” must be removed.
4.1 Overview 4 Replacement Procedures Prepare required parts in advance, when replacing the following items. ITEM COVER ASSY ITEM LCD COVER ASSY ITEM Hinge Parts List ITEM No 50 39 03 63 50A 74 62 Parts List ITEM No 51 41 34 47 51A Parts List ITEM No 57/58 83 84 PART NAME Quantity COVER ASSY TOUCH PAD PCB ASSY FMWTP CUSHION TP SPILL TAPE D STICK TP INSULATOR LCD HNS UP INSULATOR SQUARE PART NAME 1 1 1 1 1 1 1 Quantity LCD COVER ASSY CAMERA MODULE ANTENNA 2.4/5.
4 Replacement Procedures 4.1 Overview The main parts in this manual are indicated in the part list by the following names.
4.1 Overview 4 Replacement Procedures Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. DANGER: 1) Always use the genuine battery that is authorized by Toshiba or compatible with the unit. Since other battery packs have different specifications, they may be incompatible with the unit, and may burst or explode.
4 Replacement Procedures 4.1 Overview Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2. Battery Pack”. 1. Do not disassemble the computer unless it is operating abnormally. 2. Use the designated tools. 3. Ensure that the environment for working on and storing parts does not contain any of the following.
4.1 Overview 4 Replacement Procedures Disassembly Procedures Four main types of cable connector are used. • Pressure plate connector • Spring connector • Back flip connector • Normal pin connector For pressure plate connectors, slide the pressure plate holding tags on both sides of the plastic pressure plate on the connector and pull the cable out from the connector.
4 Replacement Procedures 4.1 Overview Assembly Procedures After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. • Take your time and follow the instructions carefully. Hurrying the assembly work will only introduce new problems. • Check that all cables and connectors are securely connected.
4.1 Overview 4 Replacement Procedures Screw Tightening Torque When you fasten screws, be sure to follow the torque list below. CAUTION: Overtightening can damage components and screws; undertightening can result in electrical shorts or other damage if screws or components come loose. NOTE: Toshiba recommends that you use an electric screwdriver for quick and easy operations. • M2 (2mm) 0.167 N·m(1.7 kgf·cm) • M2.5 (2.5mm) 0.294 N·m(3.0 kgf·cm) • M3 (3mm) 0.549 N·m(5.
4 Replacement Procedures 4.1 Overview Grip Color Some screws have a colored grip area to help you determine the length of the screw.
4.2 Battery pack 4.2 4 Replacement Procedures Battery pack Removing the Battery pack To remove the battery pack, follow the steps below and refer to Figure 4-1. CAUTION: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack. 1. Turn off the power of the computer. 2. Disconnect the AC adapter and other external devices from the computer. 3. Turn the computer face down. 4.
4 Replacement Procedures 4.2 Battery pack Installing the Battery pack To install the battery pack, follow the steps below and refer to Figure 4-1. CAUTION: There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly. Dispose always the used battery pack in accordance with the laws and ordinances of your local authority. Use only the batteries approved by Toshiba. NOTE: Check the battery’s terminals visually.
4.3 SIM card 4.3 4 Replacement Procedures SIM card Removing the SIM card To remove the SIM card, follow the steps below and refer to Figure 4-2. CAUTION: Insert or remove an SIM card in accordance with any instructions in the SIM card manual or the manuals of the computer system you are using. 1. Slide the SIM card latch to release the card. 2. Push the SIM card and release it. It will pop out of the slot.
4 Replacement Procedures 4.4 4.4 ExpressCard ExpressCard Removing the ExpressCard To remove the ExpressCard, follow the steps below and refer to Figure 4-3 CAUTION: Insert or remove an ExpressCard in accordance with any instructions in the ExpressCard manual or the manuals of the computer system you are using. 1. Press the ExpressCard in order to eject the ExpressCard partially out of the computer. 2. Grasp the ExpressCard and pull it out.
4.5 SD/SDHC memory card 4.5 4 Replacement Procedures SD/SDHC memory card Removing the SD/SDHC memory card To remove the SD/SDHC memory card, follow the steps below and refer to Figure 4-4. CAUTION: Insert or remove a SD/SDHC memory card in accordance with any instructions in the SD/SDHC memory card manual or the manuals of the computer system you are using. 1. Press the SD/SDHC memory card and release it to pop the card out. 2. Grasp the SD/SDHC memory card and pull it out.
4 Replacement Procedures 4.6 4.6 Smart card Smart card Removing the Smart card To remove the Smart card, follow the steps below and refer to Figure 4-5. CAUTION: Insert or remove a Smart card in accordance with any instructions in the Smart card manual or the manuals of the computer system you are using. 1. Pull out the Smart card from the card slot. Smart card Figure 4-5 Removing the Smart card Installing the Smart card To install the Smart card, follow the steps below and refer to Figure 4-5. 1.
4.7 Memory module 4.7 4 Replacement Procedures Memory module Removing the Memory module To remove the memory module, make sure the computer is powered off, follow the steps below and refer to Figure 4-6 and 4-7. CAUTION: When removing the memory module, make sure the computer is powered off. Removing a memory module with the power on might damage the module or the computer itself. Do not touch the connectors on the memory module or on the computer.
4 Replacement Procedures 4.7 Memory module 2. Press two latches outward to release them (The memory module stands slantwise). 3. Remove the memory module from the memory module connector.
4.7 Memory module 4 Replacement Procedures Installing the Memory module To install the memory module, make sure that the computer is powered off, follow the steps below and refer to Figure 4-6 and 4-7. NOTE: The slot A is reserved for the first memory module. Use the slot B for expanded memory. If only one module is installed, use the slot A. 1. Insert the memory module into the memory module connector slantwise. NOTE: Align the notch of the Memory card to the guide of the memory module connector. 2.
4 Replacement Procedures 4.8 4.8 FIN COVER ASSY FIN COVER ASSY NOTE: When repairing the computer, clean the cooling fin with a vacuum cleaner. Do not use cotton sticks and tweezers to remove dusts. It may cause the cooling module problem or dusts stuffed. Removing the FIN COVER ASSY To remove the FIN COVER ASSY, follow the steps below and refer to Figure 4-8. 1. Loosen the screw securing the FIN COVER ASSY. 2. Insert your finger into the slit and remove the FIN COVER ASSY up.
4.9 Optical disk drive (DVD-Super Multi drive) 4.9 4 Replacement Procedures Optical disk drive (DVD-Super Multi drive) Removing the Optical disk drive To remove the Optical disk drive, follow the steps below and refer to Figure 4-9 to 4-10. CAUTION: When the optical disk inside the optical disk drive can not be ejected because of some failure, open the disc tray by inserting a slender object (about 15 mm) such as a straightened paper clip into the eject hole near the eject button. 1.
4 Replacement Procedures 4.9 Optical disk drive (DVD-Super Multi drive) 3. Remove the following screws and ODD REAR BRKT. • M2.0×2.7C STEP screw ×2 4. Remove the following screw and ODD SIDE BRKT. • S-THIN HEAD screw M2.0×3C ×1 Optical disk drive ODD SIDE BRKT ODD REAR BRKT M2.0x3C S-THIN HEAD M2.0x2.7C STEP Figure 4-10 Removing the Optical disk drive (2) Installing the Optical disk drive To install the Optical disk drive, follow the steps below and refer to Figure 4-9 to 4-10. 1.
4.10 Keyboard 4 Replacement Procedures 4.10 Keyboard Removing the Keyboard To remove the keyboard, follow the steps below and refer to Figure 4-11 to 4-12. CAUTION: As the keytop may fall out, when handling the keyboard always hold it by the frame and do not touch the keytop. 1. Turn over the computer and open the display. 2. Insert your fingers into the slit and remove KB HOLDER while releasing the latches. 3. Remove the following screws securing the keyboard. • M2.0×4B BIND screw ×2 4.
4 Replacement Procedures 4.10 Keyboard 5. Remove the following screw and slide the KB SUP PLT ASSY as shown below to remove. • M2.5×3C S-THIN screw ×1 6. Disconnect the keyboard flexible cable from the connector CN3230 on the system board and remove the keyboard. M2.
4.10 Keyboard 4 Replacement Procedures Installing the Keyboard To install the keyboard, follow the steps below and refer to Figure 4-11 to 4-12. 1. Set the keyboard on the palm rest of the COVER ASSY with the upside down. 2. Connect the keyboard flexible cable to the connector CN3230 on the system board and remove the keyboard. 3. Set the KB SUP PLT ASSY and secure it the following screw. • M2.5×3C S-THIN screw ×1 4. Turn the keyboard face up and set it in place. 5.
4 Replacement Procedures 4.11 BASE ASSY 4.11 BASE ASSY Removing the BASE ASSY To remove the BASE ASSY, follow the steps below and refer to Figure 4-13 to 4-15. 1. Remove the INSU LCD HNS UP from the COVER ASSY 2. Disconnect the LCD harness from the connector CN5000 on the system board. 3. Remove the following screws securing the COVER ASSY. • M2.5×6C FLAT HEAD screw ×2 M2.
4.11 BASE ASSY 4 Replacement Procedures 4. Turn the computer upside down. 5. Disconnect the ExpressCard slot FPC from the connector CN2520 on the system board.
4 Replacement Procedures 4.11 BASE ASSY 6. Remove the following screws securing the BASE ASSY. • M2.5×4C FLAT HEAD screw ×1 (Described as “A” in the figure) • M2.5×6C FLAT HEAD screw ×13 (No description) Portion A (A) BASE ASSY Figure 4-15 Removing the BASE ASSY (3) NOTE: The circled number shows the order to drive the screws. 7. Remove the BASE ASSY while lifting the LAN connector side first. NOTE: When removing the BASE ASSY, lift the LAN connector side up while pushing the Portion A.
4.11 BASE ASSY 4 Replacement Procedures Installing the BASE ASSY To install the BASE ASSY, follow the steps below and refer to Figure 4-13 to 4-15. 1. Set the BASE ASSY in place while setting the RGB connector side first. (See figure 415). 2. Secure the BASE ASSY with the following screws. • M2.5×6C FLAT HEAD screw ×13 (No description) • M2.5×4C FLAT HEAD screw ×1 (Described as “A” in the figure) CAUTION: Drive the fourteen screws in the order shown in the Figure 4-15. 3.
4 Replacement Procedures 4.12 ExpressCard slot/KILL SW HOL ASSY 4.12 ExpressCard slot/KILL SW HOL ASSY Removing the ExpressCard slot/KILL SW HOL ASSY NOTE: Before starting, make sure that a dummy card is removed. To remove the ExpressCard slot (EXPRESSCARD CONNECTOR WITH FPC) /KILL SW HOL ASSY, follow the steps below and refer to Figure 4-16 to 4-17. 1. Turn over the BASE ASSY. 2. Remove the following screws securing the ExpressCard slot. • M2.0×5B ×4 S-THIN HEAD screw 3.
4.12 ExpressCard slot/KILL SW HOL ASSY 4 Replacement Procedures 5. Remove the KILL SW HOL ASSY from the BASE ASSY while releasing the latches. Latch Hole KILL SW HOL ASSY Latch BASE ASSY Figure 4-17 Removing the KILL SW HOL ASSY Installing the ExpressCard slot/KILL SW HOL ASSY To install the ExpressCard slot (EXPRESSCARD CONNECTOR WITH FPC) /KILL SW HOL ASSY, follow the steps below and refer to Figure 4-16 to 4-17. 1. Push the KILL SW HOL ASSY into the hole until it is latched.
4 Replacement Procedures 4.13 HDD/SSD 4.13 HDD/SSD CAUTION: Take care not to press on the top or bottom of the HDD. Pressure may cause data loss or damage to the device. NOTE: The procedures for removing/installing the SSD are the same with HDD.
4.13 HDD/SSD 4 Replacement Procedures Removing the moving HDD/SSD To remove the HDD/SSD, follow the steps below and refer to Figure 4-18. 1. Disconnect the HDD/SSD FPC from the connector CN1900 on the system board. 2. Remove the HDD/SSD from the slot. 3. Disconnect the HDD/SSD FPC from the HDD/SSD connector. HDD/SSD FPC HDD/SSD CN1900 Figure 4-18 Removing the HDD/SSD Installing the HDD/SSD To install the HDD/SSD, follow the steps below and refer to Figure 4-18. 1.
4 Replacement Procedures 4.14 Wireless LAN card 4.14 Wireless LAN card CAUTION: Do not touch the connectors on the Wireless LAN card. Debris on the connectors may cause the wireless LAN card access problems. Removing the Wireless LAN card To remove the wireless LAN card, follow the steps below and refer to Figure 4-19. 1. Disconnect two Wireless LAN antenna cables from the wireless LAN card. 2. Remove the following screws securing wireless LAN card. • M2.0×4B S-THIN HEAD screw ×2 3.
4.14 Wireless LAN card 4 Replacement Procedures Installing the Wireless LAN card To install the Wireless LAN card, follow the steps below and refer to Figure 4-19. 1. Insert the Wireless LAN card to the connector CN2600 on the system board slantwise and press it to connect firmly. NOTE: Align the notch of the Wireless LAN card to the guide of the connector. 2. Secure the Wireless LAN card with the following screws. • M2.0×4B S-THIN HEAD screw ×2 3.
4 Replacement Procedures 4.15 RTC battery 4.15 RTC battery CAUTION: Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the laws and ordinances of your local authority. Removing the RTC battery To remove the RTC battery, follow the steps below and refer to Figure 4-20-1 to 4-20-2. 1. Disconnect the ODD FPC from connector CN1950 on the system board and remove the following screw to remove the ODD CONN HOLD BRKT from the BASE ASSY. • M2.
4.15 RTC battery 4 Replacement Procedures 5. Remove following screws to separate the ODD FPC from the ODD CONN HOLD BRKT. • M2.0×3.2 STEP screw ×2 ODD FPC M2.0x3.2 STEP ODD CONN HOLD BRKT Figure 4-20-2 Removing the RTC battery (2) Installing the RTC battery To install the RTC battery, follow the steps below and refer to Figure 4-20. 1. Set the RTC battery into the INSU RTC BATT and close of the cover portion of INSU RTC BATT. (The cover INSU RTC BATT is adhered with the double-sided tape.) 2.
4 Replacement Procedures 4.16 DC-IN HARNESS/RJ45 WIRE HARNESS 4.16 DC-IN HARNESS/RJ45 WIRE HARNESS Removing the DC-IN HARNESS/RJ45 WIRE HARNESS To remove the DC-IN HARNESS/RJ45 WIRE HARNESS, follow the steps below and refer to Figure 4-21 to 4-23. 1. Disconnect the DC-IN HARNESS from the connector CN8800 on the system board. 2. Remove the DC-IN HARNESS from the slot.
4.16 DC-IN HARNESS/RJ45 WIRE HARNESS 4 Replacement Procedures 3. Remove the acetate tape. 4. Disconnect the CAMERA HARNESS from the connector CN9540 on the system board and two 3G antenna cables from the terminals on the 3G card. 5. Disconnect the RJ45 WIRE HARNESS from the connector CN4100 on the system board. 6. Take the harness of RJ45 WIRE HARNESS, CAMERA HARNESS, the 3G antenna cables and wireless LAN antenna cables out of the guides on the HARNESS HOLDER R.
4 Replacement Procedures 4.16 DC-IN HARNESS/RJ45 WIRE HARNESS 7. Remove the following screws and remove the HARNESS HOLDER R from the slot while releasing three latches (pulling two latches and pushing one inside as shown in the figure). • M2.5×6C ×1 FLAT HEAD screw 8. Remove the RJ45 WIRE HARNESS from the HARNESS HOLDER R. RJ45 WIRE HARNESS HARNESS HOLDER R M2.
4.16 DC-IN HARNESS/RJ45 WIRE HARNESS 4 Replacement Procedures Installing the DC-IN HARNESS/RJ45 WIRE HARNESS To install the DC-IN HARNESS/RJ45 WIRE HARNESS, follow the steps below and refer to Figure 4-21 to 4-23. 1. Set the RJ45 WIRE HARNESS into the HARNESS HOLDER R. 2. Set the HARNESS HOLDER R in the slot in place and secure it with following screws. • M2.5×6C FLAT HEAD screw ×1 3.
4 Replacement Procedures 4.17 3G card/SIM board 4.17 3G card/SIM board CAUTION: Do not touch the connectors on the 3G card. Debris on the connectors may cause the 3G card access problems. Removing the 3G card/SIM board To remove the 3G card/SIM board, follow the steps below and refer to Figure 4-24 to 4-25. 1. Remove the following screws and the 3G card from the connector CN2610 on the SIM board. • M2.0×4B S-THIN HEAD screw ×2 M2.
4.17 3G card/SIM board 4 Replacement Procedures 2. Remove the following screws and the SIM board from the connector CN9580 on the system board. • M2.5×4C FLAT HEAD screw ×2 3. Remove the SIM board FPC from the connector CN9880 on the SIM board. M2.
4 Replacement Procedures 4.17 3G card/SIM board Installing the 3G card/SIM board To install the 3G card/SIM board, follow the steps below and refer to Figure 4-24 to 4-25. 1. Connect the SIM board FPC to the connector CN9880 on the SIM board. 2. Secure SIM board with the following screws. • M2.5×4C FLAT HEAD screw ×2 3. Connect the SIM board FPC to the connector CN9580 on the system board. 4. Insert the 3G card slantwise into the connector CN2610 on the SIM card.
4.18 Bluetooth module 4 Replacement Procedures 4.18 Bluetooth module Removing the Bluetooth module To remove the Bluetooth module, follow the steps below and refer to Figure 4-26. 1. Lift the hook of BT HOLDER up and slide it to remove. 2. Remove the Bluetooth module from the COVER ASSY. 3. Disconnect the BT HARNESS carefully from the connector of Bluetooth module.
4 Replacement Procedures 4.18 Bluetooth module Installing the Bluetooth module To install the Bluetooth module, follow the steps below and refer to Figure 4-26. 1. Connect the BT HARNESS to the connector on the Bluetooth module. 2. Set the Bluetooth module on the COVER ASSY while inserting the hole into the guide. 3. Slide the BT HOLDER under the four guides until the hook is latched. CAUTION: When connecting the BT HARNESS to Bluetooth module, insert it carefully not to damage the Bluetooth module.
4.19 Smart card slot 4 Replacement Procedure 4.19 Smart card slot Removing the Smart card slot To remove the Smart card slot, follow the steps below and refer to Figure 4-27. 1. Peel the INSU FPC SC on the TPAD PLT ASSY. 2. Disconnect the FPC of Smart card slot from the connector CN2170 on the system board. 3. Lift the hook of Smart card slot and slide it to the left to remove.
4 Replacement Procedure 4.19 Smart card slot Installing the Smart card slot To install the Smart media slot, follow the steps below and refer to Figure 4-27. 1. Insert the Smart card slot under the guides until the hook is latched. 2. Pass the FPC of Smart card slot under the Bluetooth module harness and fix it with INSU FPC SC. 3. Connect FPC of Smart card slot to the connector CN2170 on the system board.
4.20 SD board 4 Replacement Procedure 4.20 SD board Removing the SD board To remove the SD board, follow the steps below and refer to Figure 4-28. 1. Disconnect the SD BOARD FPC from the connector CN9530 on the system board. 2. Remove the following screws and SD board. • M2.5×4C FLAT HEAD ×2 3. Disconnect SD BOARD FPC from the SD board. M2.
4 Replacement Procedure 4.20 SD board Installing the SD board To install the SD board, follow the steps below and refer to Figure 4-28. 1. Connect the SD BOARD FPC to the SD board 2. Secure the SD board with the following screws. • M2.5×4C FLAT HEAD ×2 3. Connect SD BOARD FPC to the connector CN9530 on the system board.
4.21 RGB HARNESS 4 Replacement Procedure 4.21 RGB HARNESS Removing the RGB HARNESS To remove the RGB HARNESS, follow the steps below and refer to Figure 4-29. 1. Remove the following screws to remove the RGB HARNESS from the slot. • #4-40×5C UNIFIED screw ×2 2. Peel the INSU RGB HNS fixing the RGB HARNESS to the DC-FAN. 3. Disconnect the RGB HARNESS from the connector CN9510 on the system board.
4 Replacement Procedure 4.21 RGB HARNESS Installing the RGB HARNESS To install the RGB HARNESS, follow the steps below and refer to Figure 4-29. 1. Set the RGB HARNESS in the slot in place and secure it with the following screws. • #4-40×5C UNIFIED screw ×2 2. Connect the RGB HARNESS to the connector CN9510 on the system board. 3. Fix the RGB HARNESS to the DC FAN with the INSU RGB HNS.
4.22 DC FAN 4 Replacement Procedure 4.22 DC FAN CAUTION: Do not apply pressure to the DC FAN. Removing the DC FAN To remove the DC FAN, follow the steps below and refer to Figure 4-30 to 4-32. 1. Remove the following screws to remove H SINK PLT and screws fixing the VGA PLATE HOLDER (only for external graphics chip model). • M1.6×4C OTHER screw ×4 • M1.
4 Replacement Procedure 4.22 DC FAN M1.6x4C OTHER H SINK PLT M1.
4.22 DC FAN 4 Replacement Procedure 4. Turn over the DC FAN assembly and peel off the INSU FIN UP. 5. Remove the following screws and separate the DC FAN and FIN. • M2.5×4C FLAT HEAD screw ×2 INSU FIN UP M2.
4 Replacement Procedure 4.22 DC FAN Installing the DC FAN To install the DC FAN, follow the steps below and refer to Figure 4-30 to 4-33. 1. Secure the DC FAN to the FIN with the following screws. • M2.5×4C ×2 FLAT HEAD screw 2. Stick the INSU FIN UP on the DC FAN and FIN. CAUTION: When the removed INSU FIN UP is deformed or broken. Use a new one. 3. Turn over the DC FAN assembly. 4. When silicon grease is already applied to the CPU or FIN, wipe them off with a cloth in advance. 5.
4.22 DC FAN 4 Replacement Procedure 8. Secure the H SINK PLT and VGA PLATE HOLDER (only for external graphics chip model) with the following screws. • M1.6×4C OTHER screw ×4 • M1.6×4C OTHER screw ×2 (for external Graphics chip) NOTE: When securing the H SINK PLT and VGA PLATE HOLDER, be sure to secure the screws in the order of the number marked on the plate. 9. Set the DC FAN assembly in place and connect the DC FAN harness to the connector CN8771 on the system board. 10.
4 Replacement Procedure 4.23 Sound/USB board and MIC HARNESS 4.23 Sound/USB board and MIC HARNESS Removing the Sound/USB board and MIC HARNESS (Internal microphone) To remove the Sound/USB board and MIC HARNESS, follow the steps below and refer to Figure 4-34. 1. Remove the following screw securing the Sound/USB board. • M2.0×4B BIND screw ×1 2. Disconnect the SOUND/USB HARNESS from the connector CN9520 on the system board. 3.
4.23 Sound/USB board and MIC HARNESS 4 Replacement Procedure Installing the Sound/USB board and MIC HARNESS (Internal microphone) To install the Sound/USB board and MIC HARNESS, follow the steps below and refer to Figure 4-34. 1. Set the MIC HARNESS to the slot in place. 2. Set the Sound/USB board in place and secure it with the following screw. • M2.0×4B BIND screw ×1 3. Connect the SOUND/USB HARNESS, speaker harness and MIC HARNESS to the connector CN9820, CN6180 and CN6050 on the Sound/USB board.
4 Replacement Procedure 4.24 System board 4.24 System board Removing the System board To remove the system board, follow the steps below and refer to Figure 4-35. 1. Disconnect the SW board FFC and Touch pad FFC from the connector CN9500 and CN9550 on the system board. 2. Peel the INSU ODD UPPER to release the Bluetooth module harness. 3. Remove the following screws securing the system board. • M2.5×4C FLAT HEAD ×3 4. Remove the system board. 5.
4.24 System board 4 Replacement Procedure Installing the System board To install the system board, follow the steps below and refer to Figure 4-35. NOTE: When replacing with a new system board, stick INSU LCD CONN on the system board as shown below. INSU LCD CONN CN 5000 1. Connect the Bluetooth module harness to the connector CN4440 on the system board. 2. Turn over the system board and set in place. 3. Secure the system board with the following screws. • M2.5×4C FLAT HEAD ×3 4.
4 Replacement Procedure 4.25 SPEAKER ASSY 4.25 SPEAKER ASSY Removing the SPEAKER ASSY To remove the SPEAKER ASSY, follow the steps below and refer to Figure 4-36 to 4-37. 1. Slide the HARNESS HOLDER L in the direction as shown below to remove it. NOTE: There are four latches. They are released by sliding the HARNESS HOLDER L in the direction as shown below.
4.25 SPEAKER ASSY 4 Replacement Procedure 2. Peel off three acetate tapes fixing the harness of SPEAKER ASSY. 3. Remove the right and left SPEAKER PLTs while releasing latches. 4. Take out the SPEAKER ASSY from the right and left slots.
4 Replacement Procedure 4.25 SPEAKER ASSY Installing the Speaker To install the speaker, follow the steps below and refer to Figure 4-36 to 4-37. 1. Set the right and left speaker of SPEAKER ASSY into the slots. CAUTION: When setting the SPEAKER ASSY, do not crush the cushion. 2. Set the SPEAKER PLTs on the right and left speakers of SPEAKER ASSY. 3. Arrange the harness of SPEAKER ASSY in place and stick acetate tapes in place to fix the speaker harness. 4.
4.26 LCD COVER ASSY 4 Replacement Procedure 4.26 LCD COVER ASSY Removing the LCD COVER ASSY To remove the LCD COVER ASSY, follow the steps below and refer to Figure 4-38. 1. Open the LCD COVER ASSY at angle of 90 degree to the COVER ASSY. 2. Set the COVER ASSY on a flat desk as shown below. 3. Remove the following screws fixing the BH L ASSY and BH R ASSY (right and left hinges). (The GND SPG FIN is secured together with the BH L ASSY) • M2.5×6C TAPPING Screw × 2 (1 each) 4.
4 Replacement Procedure 4.26 LCD COVER ASSY Installing the LCD COVER ASSY To install the LCD COVER ASSY, follow the steps below and refer to Figure 4-38. 1. Place the COVER ASSY on the flat desk. 2. Set the LCD COVER ASSY on the COVER ASSY in place. 3. Secure the GND SPG FIN, BH L ASSY and BH R ASSY to the COVER ASSY with the following screws. • 4-66 M2.
4.27 MEMBRANE SW 4 Replacement Procedure 4.27 MEMBRANE SW Removing the MEMBRANE SW To remove the MEMBRANE SW, follow the steps below and refer to Figure 4-39 to 4-41. 1. Peel off the INSU BTN COV HLD. 2. Remove the BUTTON COV ASSY.
4 Replacement Procedure 4.27 MEMBRANE SW 3. Turn over the COVER ASSY. 4. Lift up the hook of MEMB HOLD ASSY and slide the MEMB HOLD ASSY as shown below to remove it.
4.27 MEMBRANE SW 4 Replacement Procedure 5. Remove the INSU SQUARE (on the back). 6. Turn over the COVER ASSY. 7. Press down the hook of COVER ASSY and slide the MEMBRANE SW as shown below to remove it. MEMBRANE SW INSU SQUARE Hook Figure 4-41 Removing the MEMBRANE SW (3) Installing the MEMBRANE SW To install the MEMBRANE SW, follow the steps below and refer to Figure 4-39 to 4-41. 1. Set the MEMBRANE SW in the slot in place and slide it until the hook is latched. 2. Turn over the COVER ASSY. 3.
4 Replacement Procedure 4.28 TOUCH PAD/Fingerprint sensor board 4.28 TOUCH PAD/Fingerprint sensor board CAUTION: Do not reuse the removed the TOUCH PAD, TP SPILL CUSHION, Fingerprint sensor board and D STICK TAPE TP. When replacing the TP SPILL CUSHION, Fingerprint sensor board and TOUCH PAD, remove the double-sided tape left on the Fingerprint sensor board and COVER ASSY in advance.
4.28 TOUCH PAD/Fingerprint sensor board 4 Replacement Procedure 4. Peel off the TOUCH PAD. TOUCH PAD Figure 4-43 Removing the TOUCH PAD/Fingerprint sensor board (2) 5. Turn over the COVER ASSY. 6. Remove TP BTN COV ASSY while releasing latches.
4 Replacement Procedure 4.28 TOUCH PAD/Fingerprint sensor board 7. Remove the following screws and peel off the Fingerprint sensor board. • M2.0×4C S-THIN HEAD ×2 8. Remove the TP SPILL CUSHION from the Fingerprint sensor board. 9. Remove the D STICK TAPE TP. M2.
4.28 TOUCH PAD/Fingerprint sensor board 4 Replacement Procedure Install the TOUCH PAD /Fingerprint sensor board To install the TOUCH PAD /Fingerprint sensor board, follow the steps below and refer to Figure 4-42 to 4-45. 1. Stick a new TP SPILL CUSHION on a new Fingerprint sensor board in place. 2. Stick a new D STICK TAPE TP in place. 3. Stick the Fingerprint sensor board in place on the COVER ASSY and secure it with the following screws. • M2.0×4C S-THIN HEAD ×2 4.
4 Replacement Procedure 4.29 LCD unit 4.29 LCD unit Removing the LCD unit To remove the LCD unit, follow the steps below and refer to Figure 4-46 to 4-50. 1. Peel off four LCD CUSHIONs and two MASK SEALs (black) from the LCD MASK ASSY. 2. Peel off two MASK SEALs (silver) from the LCD COV CAP L and LCD COV CAP R. 3. Remove the following screws securing the LCD COV CAP L and LCD COV CAP R. • M2.0×8C OTHER screw ×2 (1 each) 4. Remove the following screws secure the LCD MASK ASSY.
4.29 LCD unit 4 Replacement Procedure 5. Remove the LCD COV CAP L and LCD COV CAP R while releasing latches. LCD COV CAP R LCD COV CAP L Figure 4-47 Removing the LCD unit (2) 6. Remove the LCD MASK ASSY from the LCD COVER ASSY while releasing the latches.
4 Replacement Procedure 4.29 LCD unit 7. Remove the LCD unit from the LCD COVER ASSY. LCD unit LCD COVER ASSY Figure 4-49 Removing the LCD unit (4) 8. Peel off the INSU HNS CONN. 9. Disconnect the LCD harness from the connector on the LCD unit.
4.29 LCD unit 4 Replacement Procedure Installing the LCD unit To install the LCD unit, follow the steps below and refer to Figure 4-46 to 4-50. 1. Connect the LCD harness to the connector of the LCD unit. 2. Stick a new INSU HNS CONN on the LCD connector and LCD HARNESS (connector). CAUTION: Stick a new LCD HNS CONN as shown below. LCD connector 3. Install the LCD unit to the LCD COVER ASSY in place. CAUTION: Arrange the LCD harness, CAMERA HARNESS and antenna cables as shown below.
4 Replacement Procedure 4.29 LCD unit 4. Set the LCD COV CAP L and LCD COV CAP R while engaging the latches. CAUTION: Make sure that harnesses are not pinched. 5. Secure the LCD COV CAP L and LCD COV CAP R with the following screws. • M2.0×8C OTHER screw ×2 (1 each) 6. Stick two MASK SEALs (silver) on the LCD COV CAP L and LCD COV CAP R. 7. Set the LCD MASK ASSY on the LCD COVER ASSY and secure it with following crews. • M2.5×4C FLAT HEAD screw ×6 (upper ×4, bottom 2 ) 8.
4.30 CAMERA MODULE/Antenna 4 Replacement Procedure 4.30 CAMERA MODULE/Antenna Removing the CAMERA MODULE/Antenna To remove the CAMERA MODULE/Antenna, follow the steps below and refer to Figure 451 to 4-52. 1. Peel the INSU ANT HOLD S fixing the CAMERA HARNESS. (only for CAMERA model) 2. Peel off the CAMERA MODULE from the LCD COVER ASSY. 3. Disconnect the CAMERA HARNESS from the CAMERA MODULE.
4 Replacement Procedure 4.30 CAMERA MODULE/Antenna 4. Peel off the INSU ANT HOLD Ss fixing the CAMERA HARNESS/antennas. 5. Peel off the wireless LAN antennas and 3G antennas from the LCD COVER ASSY. Wireless LAN antenna (white) AL TAPE CAMERA HARNESS/ Antenna cable Wireless LAN antenna (black) 3G antenna (red) 3G antenna INSU ANT HOLD S (blue) INSU ANT HOLD S LCD COVER ASSY Figure 4-52 Removing the CAMERA MODULE/Antenna (2) NOTE: 4-80 The AL TAPE is only for 3G MODELs.
4.30 CAMERA MODULE/Antenna 4 Replacement Procedure Installing the CAMERA MODULE/Antenna To install the CAMERA MODULE/antennas, follow the steps below and refer to Figure 4-51 to 4-53. CAUTION: Do not reuse the removed CAMERA MODULE/antennas and INSU ANT HOLD Ss. Use new ones. 1. Stick new INSU ANT HOLD Ss on the LCD COVER ASSY aligning to the guide lines (dotted lines) as shown below.
4 Replacement Procedure 4.30 CAMERA MODULE/Antenna 2. Stick new wireless LAN antennas, 3G antennas and CAMERA MODULE on the LCD COVER ASSY in place. CAUTION: Stick new wireless LAN antennas, 3G antennas and CAMERA MODULE on the LCD COVER ASSY as shown below. Do not put them on ribs or cushions. Arrange the cables carefully.
4.30 CAMERA MODULE/Antenna 4 Replacement Procedure 3. Connect the CAMERA HARNESS to the CAMERA MODULE. 4. FIX the CAMERA HARNESS with the INSU ANT HOLD S. 5. Arrange the CAMERA HARNESS, 3G antenna cables and wireless LAN antenna cables in place. 6. Fix the CAMERA HARNESS, 3G antenna cables and wireless LAN antenna cables with the INSU ANT HOLD Ss. CAUTION: Arrange the wireless LAN antenna cables, 3G antenna cables and CAMERA HARNESS as shown in the figure below.
4 Replacement Procedure 4.31 Hinge 4.31 Hinge Removing the Hinge (BH L ASSY/BH R ASSY) To remove the hinges, follow the steps below and refer to Figure 4-54. 1. Remove the following screws securing the hinges. • M2.5×4B S-THIN HEAD ×4 (2 each) 2. Remove the hinges (BH L ASSY/BH R ASSY) from the LCD COVER ASSY. BH R ASSY LCD COVER ASSY M2.
4.31 Hinge 4 Replacement Procedure Installing the Hinge To install the hinge, follow the steps below and refer to Figure 4-54. CAUTION: Before setting the hinge, apply LOCTITE 425 to the bosses shown in the figure below. 1. Set the hinges (BH L ASSY/BH R ASSY) on the LCD COVER ASSY in place and secure them with the following screws. • M2.5×4B S-THIN HEAD ×4 (2 each) CAUTION: When replacing to new hinges, stick new SQUARE CUSHIONs (L1,M1) to the hinges in the places as shown below.
4 Replacement Procedure 4-86 [CONFIDENTIAL] 4.
Appendices [CONFIDENTIAL]
Appendices App-ii [CONFIDENTIAL] TECRA R10 Maintenance Manual (960-708)
Appendices Appendix Contents Appendix A Handling the LCD Module ...........................................................................A-1 Appendix B Board Layout .................................................................................................B-1 B.1 System board (FMWSY *) Front View ..................................................................B-1 B.2 System board (FMWSY *) Back View...................................................................B-3 B.
Appendices C.17 CN9500 Switch interface connector (13-pin) .....................................................C-17 C.18 CN9510 RGB unit interface connector (14-pin).................................................C-17 C.19 CN9520 FMWUS* board interface connector (40-pin) .....................................C-18 C.20 CN9530 EMWSD* board interface connector (40-pin) .....................................C-19 C.21 CN9540 WebCam interface connector (6-pin) ...........................................
Appendices Appendix D Keyboard Scan/Character Codes ................................................................D-1 Appendix E Key Layout.....................................................................................................E-1 E.1 United Kingdom (UK) Keyboard .......................................................................... E-1 E.2 United States (US) Keyboard................................................................................. E-1 Appendix F Wiring Diagrams .....
Appendices Figures Figure B-1 System board (FMWSY*) layout (front)......................................................B-1 Figure B-2 System board (FMWSY*) layout (back) ......................................................B-3 Figure B-3 Sound/USB board (FMWUS*) layout (front/back) .....................................B-5 Figure B-4 SD board (FMWSD*) layout (front/back) ...................................................B-6 Figure B-5 Touch PAD board (FMWTP*) layout (front/back) ................
Appendices System board Table C-1 Memory connector 1 (200-pin) ........................................................................C-1 Table C-2 Memory connector 2 (200-pin) ........................................................................C-4 Table C-3 SATA HDD interface connector (20-pin).........................................................C-7 Table C-4 SATA ODD interface connector (20-pin).........................................................
Appendices SD board Table C-31 System board interface connector (40-pin) ....................................................C-25 Table C-32 SD Card interface connector (12-pin) ............................................................C-26 Touch PAD board Table C-33 Dual Point interface connector (12-pin).........................................................C-27 Table C-34 System board interface connector (10-pin) ....................................................
Appendix A Handling the LCD Module Appendices Appendix A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1. When installing the LCD module in the LCD cover, be sure to seat it so that it is properly aligned and maximum visibility of the display is maintained. 2.
Appendices Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent. Apply the agent to a cloth and then wipe the panel’s surface. Do not apply cleanser directly to the panel. 4.
Appendix A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge. Be sure to wear a wrist or ankle ground when handling the module.
Appendices Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9. Do not disassemble the LCD module. Disassembly can cause malfunctions.
Appendix A Handling the LCD Module Appendices 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxide). These materials can release gas that can damage the panel’s polarization.
Appendices A-6 Appendix A Handling the LCD Module [CONFIDENTIAL ] TECRA R10 Maintenance Manual (960-708)
Appendix B Board Layout Appendices Appendix B Board Layout B.
Appendices Appendix B Board Layout Table B-1 System board(FMWSY*) connectors and ICs (front) Number B-2 Name CN3230 Keyboard I/F connector CN3490 It is debugging port for development only CN4440 Bluetooth I/F connector CN5000 LCD I/F connector [CONFIDENTIAL] TECRA R10 Maintenance Manual (960-623)
Appendix B Board Layout B.
Appendices Appendix B Board Layout Table B-2 System board (FMWSY*) connectors and ICs (back) Number B-4 Name CN1400 Memory connector 1 CN1410 Memory connector 2 CN1900 SATA HDD I/F connector CN1950 SATA ODD I/F connector CN2170 Smart Card I/F Connector CN2300 Docking I/F connector CN2520 EXPRESSCARD I/F connector CN2600 PCI-E MINI CARD I/F connector CN4100 LAN I/F connector CN8771 FAN I/F connector CN8800 DC-IN connector CN8810 Battery connector CN9300 RTC battery connector CN
Appendix B Board Layout B.
Appendices B.
Appendix B Board Layout B.
Appendices B.
Appendix B Board Layout B.
Appendices B.
Appendix C Pin Assignments Appendices Appendix C Pin Assignments System board (FMWSY＊) C.1 CN1400 Memory connector 1 (200-pin) Table C-1 Memory connector 1 (200-pin) (1/3) Pin No. Signal Name Pin No.
Appendices Appendix C Pin Assignments Table C-1 Memory connector 2 (200-pin) (2/3) C-2 Pin No. Signal Name Pin No.
Appendix C Pin Assignments Appendices Table C-1 Memory connector 2 (200-pin) (3/3) Pin No. Signal Name Pin No.
Appendices C.2 Appendix C Pin Assignments CN1410 Memory connector 2 (200-pin) Table C-2 Memory connector 2 (200-pin) (1/3) C-4 Pin No. Signal Name Pin No.
Appendix C Pin Assignments Appendices Table C-1 Memory connector 2 (200-pin) (2/3) Pin No. Signal Name Pin No.
Appendices Appendix C Pin Assignments Table C-1 Memory connector 2 (200-pin) (3/3) Pin No. C-6 Signal Name Pin No.
Appendix C Pin Assignments C.3 Appendices CN1900 SATA HDD interface connector (20-pin) Table C-3 SATA HDD interface connector (20-pin) Pin No. Signal Name Pin No.
Appendices C.4 Appendix C Pin Assignments CN1950 SATA ODD interface connector (20-pin) Table C-4 SATA ODD interface connector (20-pin) C.5 Pin No. Signal Name Pin No.
Appendix C Pin Assignments C.6 Appendices CN2300 Docking interface connector (140-pin) Table C-6 Docking interface connector (140-pin) (1/3) Pin No. Signal Name Pin No.
Appendices Appendix C Pin Assignments Table C-6 Docking interface connector (140-pin) (2/3) C-10 Pin No. Signal Name Pin No.
Appendix C Pin Assignments Appendices Table C-6 Docking interface connector (140-pin) (3/3) Pin No. Signal Name Pin No.
Appendices C.7 Appendix C Pin Assignments CN2520 Expresscard interface connector (40-pin) Table C-7 Expresscard interface connector (40-pin) C-12 Pin No. Signal Name Pin No.
Appendix C Pin Assignments Appendices C.8 CN2600 PCI-E MINI CARD interface connector (52-pin) Table C-8 PCI-E MINI CARD interface connector (52-pin) Pin No. Signal Name Pin No.
Appendices C.9 Appendix C Pin Assignments CN3230 Keyboard interface connector (25-pin) Table C-9 Keyboard interface connector (25-pin) Pin No. Signal Name Pin No.
Appendix C Pin Assignments C.11 Appendices CN4400 Bluetooth interface connector (10-pin) Table C-11 Bluetooth interface connector (10-pin) Pin No. Signal Name Pin No. Signal Name 1 3 5 7 9 GND P3V BTRST-S3N WCHCLK-P3P ZUSBBT-E3P 2 4 6 8 10 GND WCHDAT-P3P BTMDL-P3N ZUSBBT-E3N GND C.12 CN5000 LCD interface connector (40-pin) Table C-12 LCD interface connector (40-pin) Pin No. Signal Name Pin No.
Appendices C.13 Appendix C Pin Assignments CN8771 FAN interface connector (4-pin) Table C-13 FAN interface connector (4-pin) Pin No. Signal Name Pin No. Signal Name 1 E5V 2 FANG0-E3P 3 GND 4 FPWM0-S3P 1T GND 2T GND C.14 CN8800 DC-IN connector (4-pin) Table C-14 DC-IN connector (4-pin) Pin No. Signal Name Pin No. Signal Name 1 ADPDC 2 ADPDC 3 GND 4 GND C.15 CN8810 Battery connector (10-pin) Table C-15 Battery connector (10-pin) C-16 Pin No. Signal Name Pin No.
Appendix C Pin Assignments C.16 Appendices CN9300 RTC battery connector (3-pin) Table C-16 RTC battery connector (3-pin) Pin No. Signal Name Pin No. Signal Name 1 ZS_PWCHKF 2 NC 3 GND 1T GND 2T GND C.17 CN9500 Switch interface connector (13-pin) Table C-17 Switch interface connector (13-pin) Pin No. Signal Name Pin No. Signal Name 1 GPBTNB-S3N 2 NC 3 NC 4 GPBTNA-S3N 5 NC 6 NC 7 PWRSW-S3N 8 NC 9 NC 10 GND 11 NC 12 S3V 13 PNLOFF-S3N 1T GND 2T GND C.
Appendices C.19 Appendix C Pin Assignments CN9520 FMWUS* board interface connector (40-pin) Table C-19 FMWUS* board interface connector (40-pin) C-18 Pin No. Signal Name Pin No.
Appendix C Pin Assignments C.20 Appendices CN9530 FMWSD* board interface connector (40-pin) Table C-20 FMWSD* board interface connector (40-pin) Pin No. Signal Name Pin No.
Appendices Appendix C Pin Assignments C.21 CN9540 WebCam interface connector (6-pin) Table C-21 WebCam interface connector (6-pin) Pin No. Signal Name Pin No. Signal Name 1 P5V 2 ZUSBCM-E3N 3 ZUSBCM-E3P 4 GND 5 GND 6 CAMDET-P3N 1T GND 2T GND C.22 CN9550 FMWTP* board interface connector (10-pin) Table C-22 FMWTP* board interface connector (10-pin) C-20 Pin No. Signal Name Pin No.
Appendix C Pin Assignments Appendices C.23 CN9580 FMWPE* board interface connector (50-pin) Table C-23 FMWPE* board interface connector (50-pin) Pin No. Signal Name Pin No.
Appendices Appendix C Pin Assignments Sound/USB board (FMWUS*) C.24 CN1970 eSATA/USB interface connector (11-pin) Table C-24 eSATA/USB interface connector (11-pin) Pin No. Signal Name Pin No. Signal Name P1 USB1PS-E5V P2 ZUSBES-E3N P3 ZUSBES-E3P P4 GND P5 GND P6 ZSTTES-P1P P7 ZSTTES-P1N P8 GND P9 ZSTRES-P1N P10 ZSTRES-P1P P11 GND 1T GND 2T GND 3T GND 4T GND C.25 CN4610 USB(Port5) interface connector (4-pin) Table C-25 USB(Port5) interface connector (4-pin) Pin No.
Appendix C Pin Assignments Appendices C.27 CN6180 Speaker interface connector (4-pin) Table C-27 Speaker interface connector (4-pin) Pin No. Signal Name Pin No. Signal Name 1 SPOTL-PXN 2 SPOTL-PXP 3 SPOTR-PXP 4 SPOTR-PXN 1T GND 2T GND C.28 CN9820 System board interface connector (40-pin) Table C-28 System board interface connector (40-pin) Pin No. Signal Name Pin No.
Appendices Appendix C Pin Assignments C.29 J6051 Microphone interface connector (6-pin) Table C-29 Microphone interface connector (6-pin) Pin No. Signal Name Pin No. Signal Name 1 GND 2 EMICIN-PXP 3 EMICB-P2V 4 GND 5 DETCTA-P4N 6 EMICB-P2V C.30 J6310 Head Phone interface connector (6-pin) Table C-30 Head Phone interface connector (6-pin) C-24 Pin No. Signal Name Pin No.
Appendix C Pin Assignments Appendices SD board (FMWSD*) C.31 CN9630 System board interface connector (40-pin) Table C-31 System board interface connector (40-pin) Pin No. Signal Name Pin No.
Appendices Appendix C Pin Assignments C.32 IS2150 SD Card interface connector (12-pin) Table C-32 SD Card interface connector (12-pin) C-26 Pin No. Signal Name Pin No.
Appendix C Pin Assignments Appendices Touch PAD board (FMWTP*) C.33 CN3240 Dual Point interface connector (12-pin) Table C-33 Dual Point interface connector (12-pin) Pin No. Signal Name Pin No. Signal Name 1 GND 2 TPBTNR-P5N 3 TPBTNR-P5N 4 NC 5 NC 6 NC 7 NC 8 NC 9 GND 10 IPDCLK-P5P 11 IPDDAT-P5P 12 P5V 1T GND 2T GND C.34 CN9650 System board interface connector (10-pin) Table C-34 System board interface connector (10-pin) Pin No. Signal Name Pin No.
Appendices Appendix C Pin Assignments SIM/Mini PCI Express board (FMWPE*) C.35 CN2610 PCI-E Mini interface connector (52-pin) Table C-35 PCI-E Mini interface connector (52-pin) C-28 Pin No. Signal Name Pin No.
Appendix C Pin Assignments Appendices C.36 CN4611 USB(Port0) interface connector (4-pin) Table C-36 USB(Port0) interface connector (4-pin) Pin No. Signal Name Pin No.
Appendices Appendix C Pin Assignments C.37 CN9880 System board interface connector (50-pin) Table C-37 System board interface connector (50-pin) C-30 Pin No. Signal Name Pin No.
Appendix C Pin Assignments Appendices C.38 IS2620 SIM Card interface connector (12-pin) Table C-38 SIM Card interface connector (12-pin) Pin No. Signal Name Pin No.
Appendices Appendix C Pin Assignments SATA HDD board (FMWHF*) C.39 CN1910 HDD interface connector (22-pin) Table C-39 HDD interface connector (22-pin) Pin No. Signal Name Pin No. Signal Name S1 GND S2 ZSTTHD-P1P S3 ZSTTHD-P1N S4 GND S5 ZSTRHD-P1N S6 ZSTRHD-P1P S7 GND P1 NC P2 NC P3 NC P4 GND P5 GND P6 GND P7 P5V P8 P5V P9 P5V P10 GND P11 GND P12 GND P13 NC P14 NC P15 NC 1T GND 2T GND C.
Appendix C Pin Assignments Appendices SATA ODD FPC (FMWOF*) C.41 CN1960 SATA ODD interface connector (13-pin) Table C-41 SATA ODD interface connector (13-pin) Pin No. Signal Name Pin No. Signal Name S1 GND S2 ZSTTOD-P1P S3 ZSTTOD-P1N S4 GND S5 ZSTROD-P1N S6 ZSTROD-P1P S7 GND P1 NC P2 P5V P3 P5V P4 NC P5 GND P6 GND 1T GND 2T GND C.42 CN1961 System board interface connector (20-pin) Table C-42 System board interface connector (20-pin) Pin No. Signal Name Pin No.
Appendices C-34 Appendix C Pin Assignments [CONFIDENTIAL] TECRA R10 Maintenance Manual (960-708)
Appendix D Keyboard Scan/Character Codes Appendices Appendix. D Appendix D Keyboard Scan/Character Codes D.1 Scan Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) D-2 Cap No.
Appendix D Keyboard Scan/Character Codes Appendices Table D-1 Scan codes (set 1 and set 2) (3/4) Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Cap No. Keytop Code set 1 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *3 124 PrintSc *6 *6 *6 *6 *6 126 Pause *7 *7 *7 *7 *7 202 Fn — — — — *4 203 Win E0 5B E0 DB E0 1F E0 F0 1F 204 App E0 5D E0 DD E0 2F E0 F0 2F Make Code set 2 Break Make Note Break Notes: 1. 2. 3. 4. 5. 6. 7. D-4 * * * * * * * Scan codes differ by mode.
Appendix D Keyboard Scan/Character Codes Appendices Table D-2 Scan codes with left Shift key Cap Key Code set 1 No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Cap Key Code set 1 No.
Appendix D Keyboard Scan/Character Codes Appendices Table D-5 Scan codes in overlay mode Cap No.
Appendices Appendix D Keyboard Scan/Character Codes Table D-7 No.126 key scan code Key top Pause Shift Code set 1 Code set 2 Make Make Common* E1 1D 45 E1 Ctrl* E0 C6 E0 46 9D C5 E1 14 77 E1 F0 E0 7E E0 F0 7E 14 F0 77 *: This key generates only make codes.
Appendix E Key Layout Appendices 4 Appendix E E.1 Key Layout United Kingdom (UK) Keyboard Figure E-1 UK keyboard E.
Appendices E.3 Appendix E Key Layout Thai Keyboard Figure E-3 Thai keyboard E.
Appendix F Wiring diagrams Appendices F Appendix F F.1 Wiring diagrams RGB Monitor Loopback Connector Figure F-1 RGB Monitor Loopback Connector F.
Appendices F-2 Appendix F Wiring diagrams [CONFIDENTIAL] TECRA R10 Maintenance Manual (960-708))
Appendix G BIOS rewrite procedures Appendices Appendix G Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk Rewriting the BIOS 1. Set the system to boot mode. 2. Turn off the power to the computer. 3. Remove the external cables and cards. 4. Connect an external FDD and insert the BIOS rewriting disk into the external FDD. 5.
Appendices G-2 Appendix G BIOS rewrite procedures [CONFIDENTIAL] TECRA R10 Maintenance Manual (960-708)
Appendix H EC/KBC rewrite procedures Appendices Appendix H Appendix H EC/KBC Rewrite Procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. It is necessary to rewrite the EC/KBC system program when the following changes are made. 1. Replacing of system board 2. Replacing of LCD Tools To rewrite the EC/KBC, you need the following tool: EC/KBC rewriting disk for the computer Rewriting the EC/KBC NOTE: 1.
Appendices H-2 Appendix H EC/KBC rewrite procedures [CONFIDENTIAL] TECRA R10 Maintenance Manual (960-708)
Appendix I Reliability Appendix I Appendices Reliability Appendix I Reliability The following table shows MTBF (Mean Time Between Failures) in maximum configuration.
Appendices I-2 Appendix I Reliability [CONFIDENTIAL] TECRA R10 Maintenance Manual (960-708)
