PCIe 2242 M.2 SSD MTE452T Datasheet Products Product Description TS512GMTE452T M.2 2242, PCIe Gen3x2, B+M Key, 3D TLC, PE: 3K TS256GMTE452T TS128GMTE452T Datasheet version 1.4 No.70, Xingzhong Rd., Neihu Dist.,Taipei City 114, Taiwan, R.O.C. Tel:+886-2-2792-8000 Fax:+886-2-2792-1614 www.transcend-info.com Copyright© Transcend Information, Inc. All Rights Reserved.
Revision History Revision No. History Released Date Editor by 1.0 First version (WD BICS4) 2020/01/03 TSD 1.1 Power Consumption / Vibration Format Updated 2020/01/17 TSD 1.2 Add Corner Bond process information Vibration Format Updated 2020/03/03 TSD 1.3 Add 2.6 Recommended Measurement Point Revise 5.2.5 PS(Power shield) description Remove Hardware purge function 2020/08/18 TSD 2020/09/15 TSD Revise Active Power Consumption from 2.81W to 3.0W 1.4 Revise Idle Power Consumption from 0.
Transcend MTE452T Features Part Name Capacity TS512GMTE452T 512GB TS256GMTE452T 256GB TS128GMTE452T 128GB FEATURES PCI Express Gen3 x 2, NVMe 3D TLC NAND Flash M.2 PCIe 2242 B+M Key DDR3 DRAM cache Global wear-leveling function Enhance Bad block management Power shield function LDPC ECC (Error correction code) functionality NVM command support Advanced Garbage Collection Internal RAID Engine Supports S.M.A.R.T.
Table of Content 1 Introduction……………………………………..………..………….…..……………….…………………………………..4 1.1General Feature Information……………………………………………………………….……………….4 1.2 Product List…………………………………………..………………………………………………..……………5 1.3 Ordering Information…………………..………………..…………………………………………….………6 2 Product Specifications…………………………………………………….……………..………………………………..7 2.1 Interface and Compliance……………………………………………………………………….…….……7 2.2 Drive Capacity…………………………………..………………………………………………………….…..…7 2.
1. Introduction 1.1 General Feature Information Hardware Feature - PCI Express Gen3 x 2, NVMe - Controller SM2263EN - 3D TLC NAND Flash - Temperature operation from 0°C to 70°C - M.
1.3 Ordering Information TSXXXGMTE452T 1 2 3 4 1 – Transcend 2 – SSD Density 3 – G: Gigabyte; T: Terabyte 4 – M.
2. Product Specifications 2.1 Interface and Compliance - Compatible with PCI Express specification Rev. 3.1 Compatible with NVM Express specification Rev. 1.3 PCI Express Gen3 x 2 Lanes NVM command support RoHS Compliance CE, FCC and BSMI Compliance 2.2 Drive Capacity [Table 1] User Capacity and Addressable Sectors User-Addressable Sectors 128GB 256GB 512GB 250,069,680 500,118,192 1,000,215,216 Byte per Sector 2.
2.4 Supply Voltage [Table 4] Supply Voltage Item Requirements 3.3V±5% Allowable voltage Allowable noise / ripple 100 mV p-p or less 2.5 System Power Consumption [Table 5] Power Consumption Read / Write Active Write (Max.) Active Read (Max.) 1) 1) Idle 128GB 256GB 512GB 2.5W 3.0W 3.0W 2.4W 2.7W 2.8W 0.6W 0.6W 0.6W Note: 1) The power consumption is measured under SSD operation at maximum performance. The value is affected by system operation performance and workload. 2.
2.7 System Reliability [Table 7] Telcordia SR332 issue 4 MTBF Specifications Parameter 128GB 256GB MTBF 512GB 3,000,000 hours Note: 1) The calculation is based on 25°C. [Table 8] UBER Specifications Parameter 128GB 256GB 512GB 10-15 UBER Note: 1) Uncorrectable Bit Error Rate (UBER) is a metric for the rate of occurrence of data errors, equal to the number of data errors per bits read as specified in the JESD218 document of JEDEC standard.
[Table 11] Data Retention Specifications Parameter 128GB 256GB Data Retention 512GB 1 year Note: 1) Data retention was measured by assuming that SSD reaches the maximum rated endurance at 30°C under power-off state. 2) The data retention is defined in JESD218 Requirements for standard classes of SSDs. [Table 12] Power On to Ready Parameter 128GB 256GB Setup time 9.41 s 512GB 1) Note: 1) Tested by using Drive Master and power on to ready with proper shutdown condition.
3. Mechanical Specification The figure below illustrates the Transcend M.2 Type 2242-D2-B-M Solid State Drive. [Table 15] Physical Dimensions and Weight Model Height (mm) 128GB/256GB/512GB Max 3.58 11 Width (mm) 22.00±0.15 Length (mm) 42.00±0.
4. Pin Assignments 4.1 Pin Assignments [Table 16] Pin Assignments Pin No. Pin Name Pin No. Pin Name Pin No. Pin Name Pin No. Pin Name 01 GND 02 3.3V 39 GND 40 NC 03 GND 04 3.
5. Block Diagram and Function Explanations 5.1 Block Diagram 5.2 Function Explanations 5.2.1 Global Wear Leveling Function Global wear leveling ensures that every block has an even erase count. This helps to extend the life expectancy of an SSD. There are three main processes in global wear leveling: (1) Record the block erase count and save this in the wear-leveling table. (2) Find the static-block and save this in the wear-leveling pointer.
5.2.4 StaticDataRefresh Technology Normally, ECC engine corrections are taken place without affecting the host normal operations. As time passes by, the number of error bits accumulated in the read transaction exceeds the correcting capability of the ECC engine, resulting in corrupted data being sent to the host.
through the host. The encryption key is also stored on the device (commonly AES is utilized). (1) Features boot authentication: When the user starts the device, the shadow MBR will conduct a pre-boot identification; where the user is cleared, the normal boot process will begin and connections to the devices are to be made. (2) Sector specific permissions: The device manager may create a logical block address (LBA) range and assign different permissions for each LBA range.
6 Technology Term Explanations 6.1 TBW Terabytes Written (TBW) directly measures how much you can write cumulatively into the drive over its lifetime. Essentially, it just includes the multiplication conducted above in the measurement itself. For example, if your drive is rated for 365 TBW, that means you can write 365 TB into it before a replacement is required. If its warranty period is 5 years, that works out to 365 TB ÷ (5 years × 365 days/year) = 200 GB of writes per day.
7 Installation Requirements 7.1 Card Insertion Angles insertion is allowable and preferred; the intention is to minimize the insertion/extraction force. Minimum of angle of insertion is 5° Minimum two step insertion is desirable; the intention is to minimize the insertion/extraction force.
8 Command Descriptions 8.1 Support Admin Command Register The Admin command set is the commands that are submitted to the Admin Submission Queues. The detailed specifications are described in NVM Express specification document.
8.2 SMART / Health Log Page [Table 18] SMART Data information BYTE Description Default Value Critical Warning 0 Bits Description 07:05 Reserved 04 If set to‘1’, then the volatile memory backup device has failed. This field is only valid if the controller has a volatile memory backup solution. 03 If set to‘1’, then the media has been placed in read only mode.
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