GPS Receiver User Manual

9 SHIPPING and HANDLING
90 Copernicus GPS Receiver
Baking Procedure
If baking is necessary, Trimble recommends baking in a nitrogen purge oven.
Temperature: 125 °C
Duration: 24 Hours.
After Baking: Store in a nitrogen-purged cabinet or dry box to prevent
absorption of moisture.
C
WARNING – Do not bake the units within the tape and reel packaging.Repeated baking
processes will reduce the solderablity.
Soldering Paste
The Copernicus GPS module itself is not hermetically sealed, Trimble strongly
recommends using the “No Clean” soldering paste and process. The castellation
solder pad on this module is plated with silver plating. Use Type 3 or above soldering
paste to maximize the solder volume. An example is provided below.
Solder paste: Kester EM909
Alloy composition: Sn96.5Ag3Cu.5 (SAC305) 96.5% Tin/ 3%Silver/ 0.5%
Copper
Liquidus Temperature:221 °C
Stencil Thickness: 5 Mil (0.005")
Stencil opening requires 4-mil toe over paste in the X and Y directions.
Note – Consult solder paste manufacturer and the assembly process for the approved
procedures.
Solder Reflow
A hot air convection oven is strongly recommended for solder reflow. For the lead-
free solder reflow, we recommend using a nitrogen-purged oven to increase the solder
wetting. Reference IPC-610D for the lead free solder surface appearance.
C
WARNING – Follow the thermal reflow guidelines from the IPC-JEDEC J-STD-020C.
The size of this module is 916.9 mm3. According to J-STD-020C, the peak
component temperature during reflow is 245 +0 °C.